Substrate thickness measurement device, substrate bonding system, and substrate thickness measurement method

Abstract

To provide a substrate thickness measurement device, a substrate bonding system, and a substrate thickness measurement method capable of accurately measuring the thickness of a substrate.SOLUTION: In a pre-alignment unit PU, a deviation correction actuator 1300 corrects positional deviation of a substrate W relative to a stage 1100. A thickness calculation unit 1912 calculates the thickness of the substrate W along a circumferential direction on the basis of a measurement result obtained by measuring a distance to an upper surface Wa of the substrate W by a first light source head 1710 and a measurement result obtained by measuring a distance to a lower surface Wb of the substrate W by a second light source head 1720 while the substrate W rotates. The thickness calculation unit 1912 calculates the thickness of the substrate W along a transport direction A on the basis of the measurement result obtained by measuring the distance to the upper surface Wa of the substrate W by the first light source head 1710 and the measurement result obtained by measuring the distance to the lower surface Wb of the substrate W by the second light source head 1720 while the substrate W is being transported in the transport direction A.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to a substrate thickness measuring device, a substrate bonding system, and a substrate thickness measuring method. [Background technology]

[0002] Conventionally, there is known a bonding apparatus that bonds a first substrate and a second substrate disposed opposite to the first substrate. As such an apparatus, for example, a substrate bonding apparatus that includes a first member that holds the first substrate, a second member that holds the second substrate, and a moving actuator that moves the second member is known (for example, see Patent Document 1).

[0003] Patent Document 1 describes a bonding device that includes an upper chuck that adsorbs an upper wafer, a lower chuck that adsorbs a lower wafer, and a lower chuck moving unit that moves the lower chuck. In the bonding device described in Patent Document 1, the alignment mark of the upper wafer is imaged by the lower imaging unit, and the alignment mark of the lower wafer is imaged by the upper imaging unit. Then, the horizontal position of the lower chuck is adjusted based on the two image data, so that the alignment mark of the upper wafer and the alignment mark of the lower wafer are overlapped. In this way, the upper wafer and the lower wafer are aligned. Then, the lower chuck is moved upward to bond the upper wafer and the lower wafer. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2020-53685 A Summary of the Invention [Problem to be solved by the invention]

[0005] In a substrate bonding device, since fine electrodes formed on the surfaces of two substrates are electrically connected to each other, it is necessary to align the two substrates with high accuracy. In recent years, with the miniaturization of wiring patterns, an alignment accuracy of several hundred to several tens of nanometers is required.

[0006] Here, when two substrates are bonded together, the two substrates are aligned in the horizontal direction, and then one substrate is moved vertically relative to the other substrate to bond the two substrates together. However, the vertical movement reduces the horizontal positional accuracy of the two substrates. To improve this, it is possible to shorten the vertical movement distance after aligning the two substrates. In this case, the vertical movement distance after aligning the two substrates needs to be, for example, several μm to several tens of μm. In other words, the distance between the two substrates when aligning them needs to be, for example, several μm to several tens of μm.

[0007] Usually, when two substrates are brought closer to each other, for example, the second member is brought closer to the first member so that the distance between the first member holding one substrate and the second member holding the other substrate is equal to the sum of the target distance between the two substrates and the thickness of the two substrates. However, the thickness of the substrate varies between substrates and also varies within a single substrate. Therefore, when the two substrates are brought closer to each other so that the distance between the substrates is from several μm to several tens of μm, the two substrates may come into contact with each other due to the variation in the thickness of the substrates. To avoid this, it is necessary to measure the thickness of the substrate with high accuracy.

[0008] The present invention has been made in consideration of the above-mentioned problems, and its object is to provide a substrate thickness measurement device, a substrate bonding system, and a substrate thickness measurement method capable of measuring the thickness of a substrate with high accuracy. [Means for solving the problem]

[0009] A substrate thickness measuring device according to a first aspect of the present invention includes a stage, a detection sensor, a deviation calculation unit, a deviation correction actuator, a rotation actuator, a first distance measurement sensor, a second distance measurement sensor, and a thickness calculation unit. The stage holds a substrate horizontally. The detection sensor detects a position of the substrate held on the stage. The deviation calculation unit calculates a position deviation amount of the substrate with respect to the stage based on a detection result of the detection sensor. The deviation correction actuator corrects the position deviation of the substrate with respect to the stage. The rotation actuator rotates the stage in a state in which the substrate is held. The first distance measurement sensor is disposed above the substrate held on the stage, and measures a distance to an upper surface of the substrate. The second distance measurement sensor is disposed below the substrate held on the stage, and measures a distance to a lower surface of the substrate. The thickness calculation unit calculates a thickness of the substrate based on a measurement result of the first distance measurement sensor and a measurement result of the second distance measurement sensor. The misalignment correction actuator corrects the misalignment of the substrate relative to the stage by moving one of the substrate and the stage in a horizontal direction relative to the other of the substrate and the stage based on the calculation result of the misalignment calculation unit. The thickness calculation unit calculates the thickness of the substrate along the circumferential direction based on the measurement result of the first distance measuring sensor measuring the distance to the top surface of the substrate and the measurement result of the second distance measuring sensor measuring the distance to the bottom surface of the substrate while the rotation actuator rotates the stage holding the substrate whose misalignment has been corrected. The thickness calculation unit calculates the thickness of the substrate along the transport direction based on the measurement result of the first distance measuring sensor measuring the distance to the top surface of the substrate and the measurement result of the second distance measuring sensor measuring the distance to the bottom surface of the substrate while the transport actuator transports the substrate whose misalignment has been corrected in a transport direction that is horizontal to the stage.

[0010] In one embodiment, the transport actuator transports the substrate in the transport direction such that the first distance measuring sensor and the second distance measuring sensor measure the distance along a straight line passing through a center of the substrate. The thickness calculation unit calculates the thickness of the substrate along the transport direction based on a measurement result of the first distance measuring sensor measuring the distance to the upper surface of the substrate along a straight line passing through the center of the substrate and a measurement result of the second distance measuring sensor measuring the distance to the lower surface of the substrate along a straight line passing through the center of the substrate while the transport actuator transports the substrate in the transport direction.

[0011] In one embodiment, the misalignment correction actuator includes a holder, a holder movement actuator, and a horizontal movement actuator. The holder transfers the substrate between the stage by moving up and down relative to the stage. The holder movement actuator moves the holder up and down relative to the stage. The horizontal movement actuator moves one of the holder and the stage horizontally relative to the other of the holder and the stage. In a state in which the holder holds the substrate by the holder movement actuator moving the holder upward relative to the stage, the horizontal movement actuator corrects the positional misalignment of the substrate relative to the stage by moving one of the holder and the stage horizontally relative to the other of the holder and the stage based on the calculation result of the misalignment calculation unit.

[0012] In one embodiment, the substrate thickness measuring device further includes a housing that houses the first distance measuring sensor and the second distance measuring sensor and to which the first distance measuring sensor and the second distance measuring sensor are fixed.

[0013] In one embodiment, the transport actuator is disposed outside the housing, and the housing has a window through which a transport arm of the transport actuator passes.

[0014] In one embodiment, the first distance measuring sensor includes a first optical head that emits a first outgoing light toward an upper surface of the substrate, and the second distance measuring sensor includes a second optical head that emits a second outgoing light toward a lower surface of the substrate.

[0015] In one embodiment, the optical axis of the second outgoing light emitted from the second optical head is coaxial with the optical axis of the first outgoing light emitted from the first optical head.

[0016] In one embodiment, the first optical head has a first light-emitting element that emits the first emitted light and a first light-receiving element that receives light of the first emitted light emitted from the first light-emitting element that is reflected by an upper surface of the substrate, and the second optical head has a second light-emitting element that emits the second emitted light and a second light-receiving element that receives light of the second emitted light emitted from the second light-emitting element that is reflected by a lower surface of the substrate.

[0017] A substrate bonding system according to a second aspect of the present invention includes the above-mentioned substrate thickness measuring device, and a substrate bonding device that bonds a first substrate and a second substrate whose thicknesses have been measured by the substrate thickness measuring device.

[0018] In one embodiment, the substrate bonding apparatus includes a first substrate holder, a second substrate holder, a substrate holder actuator, and an acquisition unit. The first substrate holder holds the first substrate horizontally. The second substrate holder holds the second substrate horizontally. The substrate holder actuator moves one of the first substrate holder and the second substrate holder in a vertical direction relative to the other of the first substrate holder and the second substrate holder. The acquisition unit acquires a calculation result of the thickness calculation unit of the substrate thickness measuring apparatus. The substrate holder actuator moves one of the first substrate holder and the second substrate holder relative to the other of the first substrate holder and the second substrate holder so that the distance between the first substrate and the second substrate is within a predetermined range based on the calculation result of the thickness calculation unit.

[0019] A substrate thickness measuring method according to a third aspect of the present invention includes the steps of: detecting a position of a substrate held horizontally on a stage; calculating an amount of positional misalignment of the substrate relative to the stage based on a detection result of the position of the substrate; correcting the positional misalignment of the substrate relative to the stage by moving one of the substrate and the stage in a horizontal direction relative to the other of the substrate and the stage based on the calculation result of the amount of positional misalignment; calculating a thickness of the substrate along a circumferential direction based on a measurement result, in which a first distance measuring sensor measures a distance to an upper surface of the substrate, and a measurement result, in which a second distance measuring sensor measures a distance to a lower surface of the substrate, while the stage holding the substrate whose positional misalignment has been corrected rotates; and calculating a thickness of the substrate along a transport direction based on a measurement result, in which the first distance measuring sensor measures a distance to the upper surface of the substrate, and a measurement result, in which the second distance measuring sensor measures a distance to the lower surface of the substrate, while the substrate whose positional misalignment has been corrected is transported in a transport direction that is horizontal to the stage. Effect of the Invention

[0020] According to the present invention, it is possible to provide a substrate thickness measuring device, a substrate bonding system, and a substrate thickness measuring method that are capable of measuring the thickness of a substrate with high accuracy. [Brief description of the drawings]

[0021] [Figure 1] 1 is a plan view showing a schematic configuration of a substrate bonding system according to an embodiment of the present invention. [Diagram 2] FIG. 1 is a block diagram showing a configuration of a substrate bonding system. [Diagram 3] 2 is a cross-sectional view that illustrates a schematic diagram of a transport unit, a transport robot, a pre-alignment unit, and a bonding unit. FIG. [Figure 4] FIG. 2 is a perspective view showing a structure of a pre-alignment unit. [Diagram 5] FIG. 4 is a perspective view showing the structure of a holder moving actuator. [Figure 6] FIG. 2 is a block diagram showing a configuration of a pre-alignment unit. [Figure 7] 5A and 5B are schematic diagrams for explaining a method of detecting the position of a substrate by a detection sensor. [Figure 8] FIG. 2 is a plan view showing the structure of a substrate. [Figure 9] 1A and 1B are schematic diagrams for explaining a method for measuring the thickness of a substrate using a distance measuring device. [Figure 10] 5A and 5B are schematic diagrams for explaining a method for measuring the distance to a substrate in a circumferential direction by a distance measuring device. [Figure 11] 5A and 5B are schematic diagrams for explaining a method for measuring the distance to a substrate along the transport direction by a distance measuring device. [Figure 12] 10 is a flowchart showing an example of the operation of a pre-alignment unit and a transport unit. [Figure 13] 11A and 11B are schematic diagrams for explaining an example of the operation of the pre-alignment unit and the transport unit. [Figure 14] 11A and 11B are schematic diagrams for explaining an example of the operation of the pre-alignment unit and the transport unit. [Figure 15] 11A and 11B are schematic diagrams for explaining an example of the operation of the pre-alignment unit and the transport unit. [Figure 16] 11A and 11B are schematic diagrams for explaining an example of the operation of the pre-alignment unit and the transport unit. [Figure 17] 11A and 11B are schematic diagrams for explaining an example of the operation of the pre-alignment unit and the transport unit. [Figure 18] 11A and 11B are schematic diagrams for explaining an example of the operation of the pre-alignment unit and the transport unit. [Figure 19] 11A and 11B are schematic diagrams for explaining an example of the operation of the pre-alignment unit and the transport unit. [Figure 20] 11A and 11B are schematic diagrams for explaining an example of the operation of the pre-alignment unit and the transport unit. [Figure 21]11A and 11B are schematic diagrams for explaining an example of the operation of the pre-alignment unit and the transport unit. [Figure 22] 11A and 11B are schematic diagrams for explaining an example of the operation of the pre-alignment unit and the transport unit. [Figure 23] 11A and 11B are schematic diagrams for explaining an example of the operation of the pre-alignment unit and the transport unit. [Figure 24] FIG. 2 is a perspective view showing a schematic structure of a joint unit. [Diagram 25] 13 is a schematic diagram showing the structure around the second substrate holder of the bonding unit as viewed from the X direction. FIG. [Figure 26] 13 is a schematic diagram showing the structure around the second substrate holder of the bonding unit as viewed from the Y direction. FIG. [Figure 27] 1 is a schematic diagram showing the structure around the support base from below. FIG. [Figure 28] FIG. 2 is a perspective view showing a structure of the joint unit from below. [Figure 29] 10 is a flowchart showing a method for bonding a joint unit. [Diagram 30] FIG. 2 is a side view that illustrates a schematic state in which a first substrate and a second substrate are disposed opposite each other. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] Hereinafter, an embodiment of a substrate bonding system equipped with a substrate thickness measuring device according to the present invention will be described with reference to the drawings. In the drawings, the same or corresponding parts are given the same reference symbols and will not be described repeatedly. In this specification, in order to facilitate understanding of the invention, an X-axis, a Y-axis, and a Z-axis that are orthogonal to each other may be described. In this embodiment, the X-axis and the Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction.

[0023] A substrate bonding system 1 according to the present embodiment will be described with reference to Figures 1 to 30. First, an overall configuration of the substrate bonding system 1 will be described with reference to Figure 1. Figure 1 is a plan view showing a schematic configuration of the substrate bonding system 1 according to one embodiment of the present invention.

[0024] 1, the substrate bonding system 1 stacks and bonds a first substrate W1 and a second substrate W2 together. In this embodiment, the substrate bonding system 1 performs, for example, an activation process, a cleaning process, and a bonding process on the first substrate W1 and the second substrate W2.

[0025] The first substrate W1 and the second substrate W2 include, for example, a semiconductor substrate. The first substrate W1 and the second substrate W2 include, for example, a semiconductor wafer. The first substrate W1 and the second substrate W2 are, for example, substantially disk-shaped.

[0026] The first substrate W1 has a plurality of (e.g., several tens to several hundreds) first semiconductor chips (not shown). Each of the first semiconductor chips constitutes an integrated circuit such as a CPU and / or a DRAM. Each of the first semiconductor chips has, for example, a semiconductor element layer (not shown) in which a plurality of semiconductor elements such as transistors are formed, and a plurality of electrodes (not shown). The electrodes are formed of a metal material such as copper, gold, or aluminum. In this embodiment, the electrodes are formed of, for example, copper.

[0027] The second substrate W2 has a plurality (e.g., several tens to several hundreds) of second semiconductor chips (not shown). Each second semiconductor chip constitutes an integrated circuit such as a CPU and / or DRAM. Each second semiconductor chip has, for example, a semiconductor element layer (not shown) in which a plurality of semiconductor elements such as transistors are formed, and a plurality of electrodes (not shown). The electrodes are formed of a metal material such as copper, gold, or aluminum. In this embodiment, the electrodes are formed of, for example, copper.

[0028] The electrodes of the first substrate W1 and the electrodes of the second substrate W2 are joined and electrically connected. Specifically, the number of electrodes of the first substrate W1 is the same as the number of electrodes of the second substrate W2. The electrodes of the second substrate W2 are disposed at positions corresponding to the electrodes of the first substrate W1.

[0029] The electrodes of the first substrate W1 and the second substrate W2 are formed as, for example, bumps and / or electrode pads. From the viewpoint of ease of bonding, it is preferable that at least one of the electrodes of the first substrate W1 and the electrodes of the second substrate W2 is formed as a bump. In this embodiment, both the electrodes of the first substrate W1 and the electrodes of the second substrate W2 are formed as bumps.

[0030] The substrate bonding system 1 includes a transfer path CP, a first load port LP1, a second load port LP2, a third load port LP3, an activation unit AU, a cleaning unit CU, a pre-alignment unit PU, a transfer unit TU, a bonding unit JU, a center robot CR, a transfer robot TR, and a control device 90. The pre-alignment unit PU is an example of a "substrate thickness measuring device" of the present invention. The bonding unit JU is an example of a "substrate bonding apparatus" of the present invention. The transfer robot TR is an example of a "transport actuator" of the present invention.

[0031] The first substrate W1 and the second substrate W2 are transported along the transport path CP. The transport path CP has, for example, a linear shape. The center robot CR, the first load port LP1, the second load port LP2, the third load port LP3, the activation unit AU, the cleaning unit CU, the pre-alignment unit PU, the transport unit TU, and the bonding unit JU are disposed to face the transport path CP.

[0032] The center robot CR holds and transports the first substrate W1 and the second substrate W2. The center robot CR moves inside the transport path CP. The center robot CR transports the first substrate W1 and the second substrate W2 between the first load port LP1, the second load port LP2, the third load port LP3, the activation unit AU, the cleaning unit CU, and the transport unit TU.

[0033] The first load port LP1 accommodates a plurality of (e.g., 25) first substrates W1. Specifically, the plurality of first substrates W1 are accommodated in a stacked state in a FOUP (also called a carriage) (not shown). The FOUP accommodating the first substrates W1 is accommodated in the first load port LP1.

[0034] The second load port LP2 accommodates a plurality of (e.g., 25) second substrates W2. Specifically, the plurality of second substrates W2 are accommodated in a stacked state in a FOUP (not shown). The FOUP accommodating the second substrates W2 is accommodated in the second load port LP2.

[0035] The third load port LP3 accommodates a plurality of (e.g., 25) laminated substrates WL. Specifically, the plurality of laminated substrates WL are accommodated in a stacked state in a FOUP (not shown). The FOUP accommodating the laminated substrates WL is accommodated in the third load port LP3.

[0036] The laminated substrate WL is a substrate in which a first substrate W1 and a second substrate W2 are laminated and bonded together. In this embodiment, the laminated substrate WL is formed by laminating and bonding the first substrate W1 and the second substrate W2.

[0037] The activation unit AU activates the surfaces of the first substrate W1 and the second substrate W2. The activation unit AU activates at least the surfaces of the electrodes of the first substrate W1 and the second substrate W2. Specifically, the activation unit AU performs a plasma treatment on the first substrate W1 and the second substrate W2. The type of gas used in the plasma treatment is not particularly limited, but is, for example, oxygen or nitrogen.

[0038] The activation unit AU has, for example, a high-frequency power supply and a pair of electrodes to which a high-frequency voltage is applied. By applying a high-frequency voltage between the pair of electrodes, the processing gas is turned into plasma. For example, when oxygen gas is used as the processing gas, the oxygen gas is turned into plasma and becomes oxygen ions. When the oxygen ions are irradiated onto the surface of the first substrate W1 or the second substrate W2, dangling bonds (unbonded hands) are generated on the surface of the electrodes. In other words, the surface of the electrodes is activated.

[0039] The cleaning unit CU cleans the first substrate W1 and the second substrate W2. The cleaning unit CU supplies a cleaning liquid to the first substrate W1 and the second substrate W2. Specifically, the cleaning unit CU has a cleaning nozzle (not shown) that ejects the cleaning liquid. Examples of the cleaning liquid include deionized water (DIW), carbonated water, electrolytic ionized water, ozone water, ammonia water, hydrochloric acid water with a diluted concentration (for example, about 10 ppm to 100 ppm), and reduced water (hydrogen water). In this embodiment, the cleaning liquid is pure water such as DIW.

[0040] The electrodes of the first substrate W1 and the second substrate W2 are cleaned by the cleaning unit CU, whereby hydroxyl groups are formed on the surfaces of the electrodes.

[0041] The transfer unit TU is disposed so as to face the transfer path CP, the pre-alignment unit PU, and the joining unit JU. The transfer unit TU accommodates a transfer robot TR.

[0042] The transport robot TR holds and transports the first substrate W1 and the second substrate W2. The transport robot TR delivers the first substrate W1 and the second substrate W2 between the center robot CR, the pre-alignment unit PU, and the joining unit JU. The transport robot TR is fixed to the floor of the transport unit TU and does not move within the transport unit TU. For this reason, the transport accuracy of the transport robot TR is higher than that of the center robot CR, which moves within the transport path CP.

[0043] The pre-alignment unit PU aligns the first substrate W1 and the second substrate W2 one by one. In this embodiment, the pre-alignment unit PU aligns the first substrate W1 and the second substrate W2 one by one before alignment in the joining unit JU. Note that alignment by the pre-alignment unit PU may be referred to as pre-alignment.

[0044] In this embodiment, the pre-alignment unit PU also functions as a thickness measuring device that measures the thicknesses of the first substrate W1 and the second substrate W2. The detailed structure of the pre-alignment unit PU will be described later.

[0045] The joining unit JU joins the first substrate W1 and the second substrate W2. Specifically, the joining unit JU performs highly accurate alignment on the pre-aligned first substrate W1 and second substrate W2 transported from the pre-alignment unit PU. Thereafter, the joining unit JU joins the electrodes of the first substrate W1 and the electrodes of the second substrate W2. A detailed structure of the joining unit JU will be described later.

[0046] Fig. 2 is a block diagram showing a configuration of the substrate bonding system 1. As shown in Fig. 2, a control device 90 controls various operations of the substrate bonding system 1. The control device 90 includes a control unit 91 and a storage unit 93. The control unit 91 has a processor. The control unit 91 has, for example, a central processing unit (CPU). Alternatively, the control unit 91 may have a general-purpose computer.

[0047] The storage unit 93 stores data and computer programs. The data defines, for example, the processing content and processing procedure for joining.

[0048] The storage unit 93 includes a main storage device and an auxiliary storage device. The main storage device is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and / or a hard disk drive. The storage unit 93 may include a removable medium. The control unit 91 executes a computer program stored in the storage unit 93 to perform a joining operation.

[0049] The control unit 91 controls the center robot CR, the activation unit AU, the cleaning unit CU, the transport robot TR, the pre-alignment unit PU, and the bonding unit JU. Specifically, the control unit 91 controls the center robot CR, the activation unit AU, the cleaning unit CU, the transport robot TR, the pre-alignment unit PU, and the bonding unit JU by transmitting control signals to the center robot CR, the activation unit AU, the cleaning unit CU, the transport robot TR, the pre-alignment unit PU, and the bonding unit JU.

[0050] More specifically, the control unit 91 controls the center robot CR to transfer the substrate W by the center robot CR. The substrate W includes a first substrate W1 and a second substrate W2. In the following description, when it is not necessary to distinguish between the first substrate W1 and the second substrate W2, the first substrate W1 or the second substrate W2 may be referred to as the substrate W. The center robot CR receives, for example, an unprocessed substrate W and carries the substrate W into the activation unit AU. The center robot CR also receives the substrate W that has been subjected to the activation process from the activation unit AU and transports it to the cleaning unit CU. The center robot CR also receives the substrate W that has been subjected to the cleaning process from the cleaning unit CU and transports it to the bonding unit JU.

[0051] The control unit 91 controls the activation unit AU to control the plasma processing on the substrate W. For example, the control unit 91 controls the output voltage and processing time of the activation unit AU.

[0052] The control unit 91 controls the cleaning unit CU to control the cleaning process for the substrate W. For example, the control unit 91 opens or closes a valve (not shown) of the cleaning unit CU to supply a cleaning liquid to the substrate W or stop the supply of the cleaning liquid.

[0053] The control unit 91 controls the transport robot TR to transfer the substrate W by the transport robot TR. For example, the transport robot TR receives the substrate W from the center robot CR and passes the substrate W to the pre-alignment unit PU. The transport robot TR also receives the substrate W from the pre-alignment unit PU and passes the substrate W to the joining unit JU. The transport robot TR also receives the laminated substrate WL from the joining unit JU and passes the laminated substrate WL to the center robot CR.

[0054] The control unit 91 controls the pre-alignment unit PU. Specifically, the control unit 91 controls the pre-alignment unit PU to pre-align the substrate W. In addition, the control unit 91 controls the pre-alignment unit PU to measure the thickness of the pre-aligned substrate W.

[0055] The control unit 91 controls the joining unit JU. Specifically, the control unit 91 controls the joining unit JU to bond the first substrate W1 and the second substrate W2 together.

[0056] Next, the transport unit TU, the transport robot TR, the pre-alignment unit PU, and the joining unit JU will be described with reference to Fig. 3. Fig. 3 is a cross-sectional view that shows a schematic view of the transport unit TU, the transport robot TR, the pre-alignment unit PU, and the joining unit JU.

[0057] 3, the transport unit TU has a transport housing 3010 and a blower unit 3020. The transport housing 3010 is composed of a plurality of (four in this example) side walls 3011, a floor 3012, and a ceiling 3013. The transport housing 3010 separates the inside and outside of the transport unit TU.

[0058] The sidewall 3011 has a sidewall 3011a disposed adjacent to the pre-alignment unit PU and a sidewall 3011b disposed adjacent to the joining unit JU. An opening window 3011c is formed in the sidewall 3011a, penetrating the sidewall 3011a in the thickness direction. An opening window 3011d is formed in the sidewall 3011b, penetrating the sidewall 3011b in the thickness direction. The opening windows 3011c and 3011d are formed to a size that allows the substrate W to pass through.

[0059] The blower unit 3020 is disposed on or above the transport housing 3010. For example, the blower unit 3020 is disposed on the ceiling 3013 of the transport housing 3010. The blower unit 3020 sends air into the transport housing 3010. The blower unit 3020 includes, for example, a fan filter unit (FFU). A downflow is formed in the transport housing 3010 by the blower unit 3020 and an exhaust device (not shown).

[0060] A transport robot TR is disposed in the transport housing 3010. The transport robot TR is fixed to a floor 3012 of the transport housing 3010. The transport robot TR has a transport arm 3510 and a transport drive unit 3520. The transport arm 3510 has an upper surface 3510a that supports the lower surface of the substrate W. The transport arm 3510 supports the substrate W and transports the substrate W in the horizontal direction.

[0061] The transport drive unit 3520 moves the transport arm 3510 in the horizontal direction. The transport drive unit 3520 moves the transport arm 3510 linearly in the horizontal direction. In this embodiment, the transport drive unit 3520 rotates the transport arm 3510 about a central axis (not shown) extending in the vertical direction. The transport drive unit 3520 has, for example, a stepping motor and a rack and pinion that converts the rotational drive of the stepping motor into linear drive in the horizontal direction.

[0062] The transport arm 3510 is formed to a size that allows it to pass through the opening windows 3011c and 3011d. The transport arm 3510 transfers the substrate W to and from the pre-alignment unit PU through the opening window 3011c. The transport arm 3510 also transfers the substrate W to and from the bonding unit JU through the opening window 3011d.

[0063] Although not shown, an opening window through which the substrate W can pass is also formed in the side wall 3011 facing the transport path CP, and the transport arm 3510 transfers the substrate W between the center robot CR and the side wall 3011 facing the transport path CP.

[0064] The pre-alignment unit PU has an alignment housing 1010 and a blower unit 1020. The alignment housing 1010 is an example of the "housing" of the present invention. The alignment housing 1010 has a plurality of side walls 1011 (four in this example), a floor 1012, and a ceiling 1013. The alignment housing 1010 separates the inside and outside of the pre-alignment unit PU.

[0065] The side wall 1011 has a side wall 1011a disposed adjacent to the transport unit TU. The side wall 1011a has an opening window 1011c formed therein, penetrating the side wall 1011a in the thickness direction. The opening window 1011c is an example of the "window" in the present invention. The opening window 1011c is formed to a size that allows the substrate W to pass through.

[0066] The side wall 1011a and the side wall 3011a may be provided separately, or may be a single side wall. In other words, the pre-alignment unit PU and the transport unit TU may share a single side wall. In the following description, for simplicity, an example will be described in which the side wall 1011a of the pre-alignment unit PU is shared as the side wall 3011a of the transport unit TU.

[0067] The blower unit 1020 is disposed on or above the alignment housing 1010. For example, the blower unit 1020 is disposed on the ceiling 1013 of the alignment housing 1010. The blower unit 1020 sends air into the alignment housing 1010. The blower unit 1020 includes, for example, a fan filter unit. A downflow is formed in the alignment housing 1010 by the blower unit 1020 and an exhaust device (not shown).

[0068] An alignment device 1001 is disposed in an alignment housing 1010. The alignment device 1001 is fixed to a floor 1012 of the alignment housing 1010. The alignment device 1001 delivers and receives a substrate W to and from a transfer robot TR.

[0069] The junction unit JU has a junction housing 4010 and a blower unit 4020. The junction housing 4010 has a plurality of (four here) side walls 4011, a floor 4012, and a ceiling 4013. The junction housing 4010 separates the inside and outside of the junction unit JU.

[0070] The side wall 4011 has a side wall 4011a disposed adjacent to the transport unit TU. The side wall 4011a has an opening window 4011c formed therein, penetrating the side wall 4011a in the thickness direction. The opening window 4011c is formed to a size that allows the substrate W to pass through.

[0071] The side wall 4011a and the side wall 3011a may be provided separately, or may be a single side wall. That is, the joining unit JU and the transport unit TU may share a single side wall. In the following description, for simplicity, an example will be described in which the side wall 4011a of the joining unit JU is shared as the side wall 3011a of the transport unit TU.

[0072] The blower unit 4020 is disposed on or above the joined housing 4010. For example, the blower unit 4020 is disposed on the ceiling 4013 of the joined housing 4010. The blower unit 4020 sends air into the joined housing 4010. The blower unit 4020 includes, for example, a fan filter unit. A downflow is formed in the joined housing 4010 by the blower unit 4020 and an exhaust device (not shown).

[0073] Next, a detailed structure of the pre-alignment unit PU will be described with reference to Fig. 4. Fig. 4 is a perspective view showing the structure of the pre-alignment unit PU.

[0074] As shown in Fig. 4, the pre-alignment unit PU includes an alignment device 1001 and an alignment housing 1010. The alignment device 1001 includes a stage 1100, a rotation actuator 1200, a misalignment correction actuator 1300, a detection sensor 1600, a distance measurement device 1700, and a control device 1900 (see Fig. 6). The stage 1100, the rotation actuator 1200, the misalignment correction actuator 1300, the detection sensor 1600, the distance measurement device 1700, and the control device 1900 are housed in the alignment housing 1010. The detection sensor 1600 is an example of the "detection sensor" of the present invention.

[0075] The alignment housing 1010 further includes a plurality of (here, four) housing frames 1030. The housing frames 1030 are, for example, metal frames having an L-shape in cross section. The housing frames 1030 are, for example, arranged at the four corners of the pre-alignment unit PU so as to extend in the vertical direction. Specifically, the housing frames 1030 are arranged at the boundaries between adjacent side walls 1011, and the side walls 1011 are fixed thereto. A housing frame (not shown) extending in the horizontal direction may be further provided so as to connect the housing frames 1030 extending in the vertical direction. In FIG. 4, for ease of understanding, the ceiling 1013 of the alignment housing 1010 and some of the side walls 1011 are indicated by two-dot chain lines.

[0076] The stage 1100 holds the substrate W horizontally. In this embodiment, the stage 1100 has a support plate 1110 and a plurality of support pins 1120. The support plate 1110 is made of, for example, sheet metal. The support plate 1110 is arranged horizontally. The shape of the support plate 1110 is not particularly limited, but is, for example, rectangular.

[0077] A plurality of (here, four) support pins 1120 are attached to the four corners of the support plate 1110. The support pins 1120 are fixed to the support plate 1110 so as to protrude upward from the support plate 1110. The tips (upper ends) of the support pins 1120 support the lower surface of the substrate W. Note that the support pins 1120 may adsorb the lower surface of the substrate W, but in this embodiment, they do not adsorb the lower surface of the substrate W.

[0078] Moreover, the stage 1100 has an outer shape smaller than the substrate W. Specifically, when the stage 1100 holds the substrate W, the entire stage 1100 is disposed radially inward from the periphery of the substrate W in a plan view. In this embodiment, the stage 1100 does not move in the up and down direction. In other words, the height position of the stage 1100 is constant.

[0079] The rotary actuator 1200 rotatably supports the stage 1100. Specifically, the rotary actuator 1200 has a rotary shaft 1210, a main body 1220, and a motor 1230. The rotary shaft 1210 is disposed so that a rotation axis L1210 extends in the vertical direction. The rotation axis L1210 of the rotary actuator 1200 coincides with the central axis (not shown) of the stage 1100.

[0080] The upper end of the rotating shaft 1210 is fixed to the lower surface of the stage 1100. The lower end of the rotating shaft 1210 is inserted into the main body 1220.

[0081] The main body 1220 has, for example, a substantially rectangular parallelepiped shape. A motor 1230 is attached to the side surface of the main body 1220 in the Y direction.

[0082] The motor 1230 is not particularly limited, but may be, for example, a stepping motor. The motor 1230 is disposed such that a rotation axis (not shown) extends, for example, in the horizontal direction (here, the Y direction).

[0083] A transmission member (not shown) that transmits the driving force of the motor 1230 to the rotating shaft 1210 is provided inside the main body 1220. In this embodiment, the transmission member converts the rotational driving force of the motor 1230 about a rotation axis line extending in the horizontal direction into a rotational driving force about a rotation axis line L1210 extending in the vertical direction. The transmission member has, for example, a helical gear or a bevel gear.

[0084] When the motor 1230 of the rotary actuator 1200 is driven (rotated), the rotational driving force of the motor 1230 is transmitted to the rotary shaft 1210 via a transmission member (not shown). As a result, the rotary shaft 1210 rotates about a rotation axis L1210 extending in the vertical direction, and the stage 1100 rotates about the rotation axis L1210. Therefore, the substrate W held by the stage 1100 also rotates about the rotation axis L1210.

[0085] The misalignment correction actuator 1300 corrects the positional misalignment of the substrate W relative to the stage 1100. In this embodiment, the misalignment correction actuator 1300 corrects the horizontal positional misalignment of the center of the substrate W relative to the center of the stage 1100.

[0086] Specifically, the misalignment correction actuator 1300 has a holder 1310, a holder movement actuator 1330, a first horizontal movement actuator 1400, and a second horizontal movement actuator 1500. The first horizontal movement actuator 1400 and the second horizontal movement actuator 1500 are examples of the "horizontal movement actuator" of the present invention.

[0087] The holder 1310 holds the substrate W horizontally. The holder 1310 is capable of transferring the substrate W to and from the stage 1100. The holder 1310 has a support ring 1311 and a plurality of support pins 1312. The support ring 1311 is made of, for example, sheet metal. The support ring 1311 is disposed horizontally. The shape of the support ring 1311 is not particularly limited, but is, for example, annular.

[0088] A plurality of (eight here) support pins 1312 are attached to the support ring 1311, two at a time, at angular intervals of approximately 90 degrees around a central axis (not shown) of the support ring 1311. The support pins 1312 are fixed to the support ring 1311 so as to protrude upward from the support ring 1311. The tips (upper ends) of the support pins 1312 support the lower surface of the substrate W. Although the support pins 1312 may adsorb the lower surface of the substrate W, they do not adsorb the lower surface of the substrate W in this embodiment.

[0089] The support ring 1311 has an outer circumferential edge 1311a and an inner circumferential edge 1311b. The outer circumferential edge 1311a forms the outer shape of the support ring 1311. The inner circumferential edge 1311b forms a through hole 1311c of the support ring 1311.

[0090] The through hole 1311c of the support ring 1311 is formed to a size that allows the support plate 1110 to pass through. Specifically, the entire support plate 1110 is disposed radially inward from the inner peripheral edge 1311b of the support ring 1311 in a plan view.

[0091] Moreover, the holder 1310 has an outer shape smaller than the substrate W. Specifically, when the holder 1310 holds the substrate W, the entire holder 1310 is disposed radially inward from the periphery of the substrate W in a plan view. In other words, when the holder 1310 holds the substrate W, an outer circumferential edge 1311a of the support ring 1311 is disposed radially inward from the periphery of the substrate W in a plan view.

[0092] The holder movement actuator 1330 supports the holder 1310 and moves the holder 1310 in the vertical direction relative to the stage 1100. For ease of understanding, only a portion of the holder movement actuator 1330 is illustrated in Fig. 4. The structure of the holder movement actuator 1330 will be described later.

[0093] The first horizontal movement actuator 1400 moves the holder 1310, for example, in the Y direction. In this embodiment, the first horizontal movement actuator 1400 moves the rotation actuator 1200 in the Y direction, thereby moving the holder 1310 in the Y direction. Specifically, the first horizontal movement actuator 1400 has a main body 1410, a motor 1420, and a moving stage 1430.

[0094] The main body 1410 has, for example, a substantially rectangular parallelepiped shape. The main body 1410 has an elongated shape extending in the Y direction. A motor 1420 is attached to an end surface of the main body 1410 in the Y direction. The motor 1420 is not particularly limited, but includes, for example, a stepping motor. The motor 1420 is disposed such that a rotation axis (not shown) extends in the Y direction.

[0095] A recess 1411 into which a part of the movable stage 1430 is inserted is formed on a side surface of the main body 1410 in the X direction. The recess 1411 extends in the Y direction. A transmission member (not shown) that transmits the driving force of the motor 1420 to the movable stage 1430 is provided inside the main body 1410. In this embodiment, the transmission member converts the rotational driving force of the motor 1420 about a rotation axis extending in the Y direction into a driving force along the Y direction. For example, the transmission member has a worm gear, and the movable stage 1430 has rack teeth that engage with the worm gear.

[0096] The moving stage 1430 is made of, for example, metal. The moving stage 1430 has, for example, a U-shape in cross section. The lower part of the moving stage 1430 is inserted into the recess 1411. The moving stage 1430 extends upward from the recess 1411 and protrudes above the upper surface of the main body 1410. The rotation actuator 1200 is placed and fixed on the upper end part of the moving stage 1430.

[0097] When the motor 1420 is driven (rotated), the rotational driving force of the motor 1420 is transmitted to the movable stage 1430 via a transmission member (not shown). As a result, the movable stage 1430 moves in the Y direction along the recess 1411, and the rotation actuator 1200 fixed to the movable stage 1430 moves in the Y direction. As a result, the stage 1100 fixed to the rotation actuator 1200 moves in the Y direction.

[0098] The second horizontal movement actuator 1500 is fixed to the floor 1012. The second horizontal movement actuator 1500 moves the holder 1310, for example, in the X direction. In this embodiment, the second horizontal movement actuator 1500 moves the first horizontal movement actuator 1400 and the rotation actuator 1200 in the X direction, thereby moving the holder 1310 in the X direction. Specifically, the second horizontal movement actuator 1500 has a main body 1510, a motor 1520, and a moving stage 1530.

[0099] The main body 1510 has, for example, a substantially rectangular parallelepiped shape. The main body 1510 has an elongated shape extending in the X direction. A motor 1520 is attached to an end surface of the main body 1510 in the X direction. The motor 1520 is not particularly limited, but includes, for example, a stepping motor. The motor 1520 is disposed such that a rotation axis (not shown) extends in the X direction.

[0100] A recess 1511 into which a part of the movable stage 1530 is inserted is formed on a side surface of the main body 1510 in the Y direction. The recess 1511 extends in the X direction. A transmission member (not shown) that transmits the driving force of the motor 1520 to the movable stage 1530 is provided inside the main body 1510. In this embodiment, the transmission member converts the rotational driving force of the motor 1520 about a rotation axis extending in the X direction into a driving force along the X direction. For example, the transmission member has a worm gear, and the movable stage 1530 has rack teeth that engage with the worm gear.

[0101] The moving stage 1530 is made of, for example, metal. The moving stage 1530 has, for example, a U-shape in cross section. The lower part of the moving stage 1530 is inserted into the recess 1511. The moving stage 1530 extends upward from the recess 1511 and protrudes above the upper surface of the main body 1510. The main body 1410 of the first horizontal movement actuator 1400 is placed and fixed on the upper end part of the moving stage 1530.

[0102] When the motor 1520 is driven (rotated), the rotational driving force of the motor 1520 is transmitted to the moving stage 1530 via a transmission member (not shown). As a result, the moving stage 1530 moves in the X direction along the recess 1511, and the first horizontal movement actuator 1400 fixed to the moving stage 1530 moves in the X direction. Therefore, the rotation actuator 1200 fixed to the first horizontal movement actuator 1400 moves in the X direction, and the stage 1100 fixed to the rotation actuator 1200 moves in the X direction.

[0103] The method of correcting the positional deviation of the substrate W with respect to the stage 1100 by the deviation correction actuator 1300 will be described later.

[0104] The detection sensor 1600 detects the position of the substrate W held on the stage 1100. Specifically, the detection sensor 1600 has a light emitting head 1610, a light receiving head 1620, and a support frame 1630.

[0105] The support frame 1630 is, for example, a metal frame having an L-shape in cross section. The support frame 1630 is disposed radially outward from the support ring 1311. The support frame 1630 is fixed to the floor 1012 so as to extend in the up-down direction.

[0106] A light-emitting head 1610 is fixed to the upper part of the support frame 1630, and a light-receiving head 1620 is fixed to the lower part of the support frame 1630. The light-emitting head 1610 is located above the edge of the substrate W, and the light-receiving head 1620 is located below the edge of the substrate W.

[0107] The light emitting head 1610 emits a strip of light having a predetermined width (for example, a width of 5 mm or more and 20 mm or less) downward. The light emitting head 1610 is disposed at a position where a part of the strip of light irradiates the upper surface of the substrate W and the remainder of the strip of light passes along the side of the substrate W.

[0108] The light receiving head 1620 receives the light that is emitted from the light emitting head 1610 and passes through the side of the substrate W.

[0109] A method for detecting the position of the substrate W using the detection sensor 1600 will be described later.

[0110] The distance measurement device 1700 measures the distance to the substrate W held by the stage 1100. Specifically, the distance measurement device 1700 has a first optical head 1710, a second optical head 1720, and a fixing member 1730. The first optical head 1710 is an example of a "first distance measurement sensor" in the present invention. The second optical head 1720 is an example of a "second distance measurement sensor" in the present invention.

[0111] The fixing member 1730 is made of, for example, sheet metal. The fixing member 1730 holds, for example, the first optical head 1710 in a predetermined position. Note that the distance measurement device 1700 may further include a fixing member that holds the second optical head 1720 in a predetermined position.

[0112] In this embodiment, the fixing member 1730 has a first plate 1731 and a second plate 1732. The first plate 1731 extends in the Y direction and is fixed across two housing frames 1030 adjacent to the transport unit TU. The second plate 1732 is fixed to the first plate 1731 so as to extend from the center of the first plate 1731 in the Y direction toward the center of the alignment housing 1010. The first optical head 1710 is fixed to the lower surface of the tip of the second plate 1732.

[0113] The first optical head 1710 is positioned above the substrate W held on the stage 1100. The first optical head 1710 emits a first emitted light toward the upper surface of the substrate W. The first optical head 1710 also measures the distance to the upper surface of the substrate W held on the stage 1100 by receiving a part of the emitted first emitted light that is reflected by the upper surface of the substrate W.

[0114] The second optical head 1720 is positioned below the substrate W held on the stage 1100. The second optical head 1720 emits a second emitted light toward the lower surface of the substrate W. The second optical head 1720 also measures the distance to the lower surface of the substrate W held on the stage 1100 by receiving light that is reflected by the lower surface of the substrate W out of the emitted second emitted light.

[0115] A method for measuring the thickness of the substrate W using the distance measuring device 1700 will be described later.

[0116] Furthermore, in this embodiment, all of the movable or operable components (here, the stage 1100, the rotation actuator 1200, and the misalignment correction actuator 1300) are located below the substrate W. This makes it possible to prevent particles generated due to the movement or operation of the components from adhering to the substrate W.

[0117] Next, the holder movement actuator 1330 will be described with reference to Fig. 5. Fig. 5 is a perspective view showing the structure of the holder movement actuator 1330. As shown in Fig. 5, the holder movement actuator 1330 has a support frame 1331, a fixed piece 1332, and a drive unit 1333.

[0118] The support frame 1331 is, for example, a metal frame having an L-shape in cross section. The support frame 1331 has, for example, two frames 1331a and 1331b, and is formed in a U-shape in plan view. The two frames 1331a and 1331b are arranged to extend in the horizontal direction, for example. The two frames 1331a extend in the Y direction and are arranged parallel to each other and spaced apart from each other in the X direction. The frame 1331b extends in the X direction and connects the ends of the two frames 1331a to each other.

[0119] The support frame 1331 is fixed to the lower surface of the support ring 1311 and supports the support ring 1311 from below. This makes it possible to prevent the support ring 1311 from bending due to its own weight and / or the weight of the substrate W.

[0120] The fixed piece 1332 is, for example, a metal plate extending in the vertical direction. The upper end of the fixed piece 1332 is fixed to the frame 1331b. The lower end of the fixed piece 1332 is inserted into the drive unit 1333.

[0121] The driving unit 1333 has, for example, a stepping motor and a rack and pinion. The driving unit 1333 moves the fixed piece 1332 in the vertical direction. When the driving unit 1333 moves the fixed piece 1332 in the vertical direction, the support frame 1331 fixed to the fixed piece 1332 moves in the vertical direction. As a result, the holder 1310 fixed to the support frame 1331 moves in the vertical direction.

[0122] Next, the pre-alignment unit PU will be further described with reference to Fig. 6. Fig. 6 is a block diagram showing the configuration of the pre-alignment unit PU.

[0123] As shown in FIG. 6, the first optical head 1710 of the distance measurement device 1700 has a first light emitting element 1711 that emits a first emitted light, and a first light receiving element 1712 that receives light reflected by the upper surface of the substrate W from the first light emitting element 1711. The first light emitting element 1711 is, for example, a semiconductor element, although it is not particularly limited thereto. In this embodiment, the first light emitting element 1711 is, for example, a semiconductor laser. The first light receiving element 1712 is, for example, a semiconductor element, although it is not particularly limited thereto. In this embodiment, the first light receiving element 1712 is, for example, a photodiode. In this way, the first optical head 1710 has a first light-emitting element 1711 that emits a first emitted light, and a first light-receiving element 1712 that receives the light of the first emitted light emitted from the first light-emitting element 1711 that is reflected by the upper surface of the substrate W, thereby making it possible to easily measure the distance to the upper surface of the substrate W held on the stage 1100.

[0124] The second optical head 1720 of the distance measuring device 1700 has a second light emitting element 1721 that emits the second emitted light, and a second light receiving element 1722 that receives the light reflected by the lower surface of the substrate W from the second light emitting element 1721. The second light emitting element 1721 is not particularly limited, but is, for example, a semiconductor element. In this embodiment, the second light emitting element 1721 is, for example, a semiconductor laser. The second light receiving element 1722 is not particularly limited, but is, for example, a semiconductor element. In this embodiment, the second light receiving element 1722 is, for example, a photodiode. In this way, the second optical head 1720 has the second light emitting element 1721 that emits the second emitted light, and the second light receiving element 1722 that receives the light reflected by the lower surface of the substrate W from the second light emitting element 1721, so that the distance to the lower surface of the substrate W held on the stage 1100 can be easily measured.

[0125] The controller 1900 controls various operations of the pre-alignment unit PU. The controller 1900 causes the pre-alignment unit PU to correct positional deviation of the substrate W with respect to the stage 1100. In addition, the controller 1900 causes the pre-alignment unit PU to measure the thickness of the substrate W.

[0126] The control device 1900 includes a control unit 1910 and a storage unit 1920. The control unit 1910 has a processor. The control unit 1910 has, for example, a central processing unit (CPU). Alternatively, the control unit 1910 may have a general-purpose computer.

[0127] In this embodiment, the control unit 1910 has a misalignment calculation unit 1911 and a thickness calculation unit 1912. The misalignment calculation unit 1911 calculates the amount of positional misalignment of the substrate W relative to the stage 1100 based on the detection result of the detection sensor 1600. The control unit 1910 corrects the position of the substrate W relative to the stage 1100 by the misalignment correction actuator 1300 based on the calculated amount of positional misalignment.

[0128] The thickness calculation unit 1912 calculates the thickness of the substrate W based on the measurement results of the first optical head 1710 and the measurement results of the second optical head 1720. Specifically, since the distance between the first optical head 1710 and the second optical head 1720 is constant, the thickness calculation unit 1912 calculates the thickness of the substrate W by subtracting the measurement result of the first optical head 1710 (the distance from the first optical head 1710 to the upper surface of the substrate W) and the measurement result of the second optical head 1720 (the distance from the second optical head 1720 to the lower surface of the substrate W) from the distance between the first optical head 1710 and the second optical head 1720.

[0129] The storage unit 1920 stores data and computer programs. The data specifies, for example, the processing content and processing procedure for correcting positional deviation. The data also specifies, for example, the processing content and processing procedure for measuring the thickness of the substrate W.

[0130] The storage unit 1920 includes a main storage device and an auxiliary storage device. The main storage device is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and / or a hard disk drive. The storage unit 1920 may include a removable medium. The control unit 1910 executes a computer program stored in the storage unit 1920 to perform a position misalignment correction operation and a substrate W thickness measurement operation.

[0131] Next, a method for detecting the position of the substrate W by the detection sensor 1600 will be described with reference to Fig. 7 and Fig. 8. Fig. 7 is a schematic diagram for explaining a method for detecting the position of the substrate W by the detection sensor 1600. Fig. 8 is a plan view showing the structure of the substrate W. Note that in Fig. 7 and Figs. 17 and 21 described later, the band-like light emitted from the light emitting head 1610 is hatched for ease of understanding.

[0132] 7, the light emitting head 1610 is disposed above the edge of the substrate W so that the belt-shaped light extends in the radial direction of the substrate W. As a result, as described above, part of the belt-shaped light irradiates the upper surface of the substrate W, and the remainder of the belt-shaped light passes through the side of the substrate W.

[0133] Here, when the substrate W is misaligned with respect to the stage 1100, the central axis (not shown) of the stage 1100 coincides with the rotation axis L1210 of the rotary actuator 1200, and therefore the central axis LW of the substrate W does not coincide with the rotation axis L1210 of the rotary actuator 1200. Therefore, when the stage 1100 is rotated around the rotation axis L1210 of the rotary actuator 1200, the central axis LW of the substrate W rotates around the rotation axis L1210. That is, the substrate W rotates eccentrically. At this time, the amount of light (band-shaped light) that is blocked by the substrate W among the light (band-shaped light) emitted from the light emitting head 1610 changes in synchronization with the rotation period of the substrate W. In other words, the amount of light received by the light receiving head 1620 changes in synchronization with the rotation period of the substrate W. This allows the displacement calculation unit 1911 to calculate the amount of positional displacement of the substrate W relative to the stage 1100 based on the amount of change in the amount of light received by the light-receiving head 1620.

[0134] 8, a notch WN is formed on the periphery of the substrate W. The notch WN is a V-shaped cutout. When the substrate W rotates around the rotation axis L1210, the amount of light blocked by the substrate W changes suddenly when the notch WN passes between the light emitting head 1610 and the light receiving head 1620. Specifically, when the notch WN passes between the light emitting head 1610 and the light receiving head 1620, the amount of light blocked by the substrate W suddenly decreases and then suddenly increases. Therefore, the deviation calculation unit 1911 can detect the timing when the notch WN passes between the light emitting head 1610 and the light receiving head 1620. Therefore, the deviation calculation unit 1911 can calculate the rotation angle position of the substrate W.

[0135] Next, a method for measuring the thickness of the substrate W using the distance measurement device 1700 will be described with reference to Fig. 9 to Fig. 11. Fig. 9 is a schematic diagram for explaining the method for measuring the thickness of the substrate W using the distance measurement device 1700. Fig. 10 is a schematic diagram for explaining a method for measuring the distance to the substrate W in the circumferential direction by the distance measurement device 1700. Fig. 11 is a schematic diagram for explaining a method for measuring the distance to the substrate W along the transport direction A by the distance measurement device 1700.

[0136] 9, the first optical head 1710 is located above the substrate W held on the stage 1100. In other words, the first optical head 1710 is disposed to face the upper surface Wa of the substrate W held on the stage 1100. The first optical head 1710 is disposed such that the optical axis L1710 of the first emission light emitted from the first optical head 1710 is located a predetermined distance (e.g., 1 mm or more and 10 mm or less) radially inward from the periphery of the upper surface Wa of the substrate W. Hereinafter, the optical axis L1710 of the first emission light emitted from the first optical head 1710 may be referred to as the optical axis L1710 of the first optical head 1710.

[0137] The second optical head 1720 is located below the substrate W held by the stage 1100. In other words, the second optical head 1720 is disposed to face the lower surface Wb of the substrate W held by the stage 1100. The second optical head 1720 is disposed such that the optical axis L1720 of the second emission light emitted from the second optical head 1720 is located a predetermined distance (e.g., 1 mm or more and 10 mm or less) radially inward from the periphery of the lower surface Wb of the substrate W. Hereinafter, the optical axis L1720 of the second emission light emitted from the second optical head 1720 may be referred to as the optical axis L1720 of the second optical head 1720.

[0138] In this embodiment, the optical axis L1720 of the second emitted light emitted from the second optical head 1720 is positioned on the same axis as the optical axis L1710 of the first emitted light emitted from the first optical head 1710. Therefore, the first optical head 1710 and the second optical head 1720 can simultaneously measure the distance to the upper surface Wa and the distance to the lower surface Wb at the same position of the substrate W.

[0139] In this embodiment, when the distance measurement device 1700 measures the distance to the substrate W, the distance measurement device 1700 measures the distance to the substrate W in a state where the positional deviation of the substrate W with respect to the stage 1100 is corrected. In other words, the distance measurement device 1700 measures the distance to the substrate W in a state where the central axis LW of the substrate W coincides with the rotation axis L1210 of the rotation actuator 1200.

[0140] 10, in a state in which the positional deviation of the substrate W relative to the stage 1100 is corrected, the first emitted light emitted from the first optical head 1710 irradiates a position radially inward a predetermined distance (for example, 1 mm or more and 10 mm or less) from the periphery of the upper surface Wa of the substrate W. In FIG. 10, for ease of understanding, the irradiation position P1710 by the first optical head 1710 is indicated by a small circle.

[0141] In this embodiment, when the distance to the substrate W is measured in the circumferential direction by the distance measuring device 1700, the stage 1100 is rotated around the rotation axis L1210 of the rotary actuator 1200. As a result, the substrate W rotates around the rotation axis L1210 of the rotary actuator 1200. At this time, since the central axis LW of the substrate W coincides with the rotation axis L1210, the irradiation position P1710 of the first optical head 1710 moves circumferentially at a position radially inward by a predetermined distance from the periphery of the upper surface Wa of the substrate W. In FIG. 10, the locus P1710a of the irradiation position P1710 is shown by a thick line. Note that, as with the first optical head 1710, the irradiation position of the second optical head 1720 also moves circumferentially at a position radially inward by a predetermined distance from the periphery of the lower surface Wb of the substrate W.

[0142] Also, in this embodiment, while the rotary actuator 1200 rotates the stage 1100 holding the substrate W, the first optical head 1710 measures the distance to the upper surface Wa of the substrate W, and the second optical head 1720 measures the distance to the lower surface Wb of the substrate W.

[0143] Then, while the rotary actuator 1200 rotates the stage 1100 holding the substrate W, the thickness calculation unit 1912 calculates the thickness of the substrate W in the circumferential direction based on the measurement result obtained by the first optical head 1710 measuring the distance to the upper surface Wa of the substrate W and the measurement result obtained by the second optical head 1720 measuring the distance to the lower surface Wb of the substrate W.

[0144] 11, in this embodiment, the distance measurement device 1700 measures the distance to the substrate W while the transport robot TR transports the substrate W in a transport direction A that is horizontal to the stage 1100. Specifically, as described below, after the distance measurement device 1700 measures the distance to the substrate W in the circumferential direction, the transport arm 3510 of the transport robot TR holds the substrate W and transports the substrate W in the transport direction A relative to the stage 1100 in order to transport the substrate W to the joining unit JU. As a result, the irradiation position P1710 of the first optical head 1710 moves linearly so as to pass through the center (here, the center) of the upper surface Wa of the substrate W. In other words, the irradiation position P1710 moves on the center line of the substrate W. In FIG. 11, the trajectory P1710b of the irradiation position P1710 is indicated by a thick line. As with the first optical head 1710, the irradiation position of the second optical head 1720 moves linearly so as to pass through the central portion of the lower surface Wb of the substrate W (here, the center).

[0145] While the transport robot TR transports the substrate W in the transport direction A relative to the stage 1100, the first optical head 1710 measures the distance to the upper surface Wa of the substrate W, and the second optical head 1720 measures the distance to the lower surface Wb of the substrate W.

[0146] Then, while the transport robot TR transports the stage 1100 holding the substrate W in the transport direction A relative to the stage 1100, the thickness calculation unit 1912 calculates the thickness of the substrate W along the transport direction A based on the measurement result obtained by the first optical head 1710 measuring the distance to the upper surface Wa of the substrate W and the measurement result obtained by the second optical head 1720 measuring the distance to the lower surface Wb of the substrate W.

[0147] As described above with reference to FIGS. 1 to 11, in this embodiment, the misalignment correction actuator 1300 corrects the positional misalignment of the substrate W relative to the stage 1100 based on the calculation result of the misalignment calculation unit 1911. The thickness calculation unit 1912 calculates the thickness of the substrate W along the circumferential direction based on the measurement result of the first optical head 1710 measuring the distance to the upper surface Wa of the substrate W and the measurement result of the second optical head 1720 measuring the distance to the lower surface Wb of the substrate W while the rotary actuator 1200 rotates the stage 1100 holding the substrate W whose positional misalignment has been corrected. In addition, while the transport robot TR transports the substrate W whose positional misalignment has been corrected in the transport direction A that is horizontal to the stage 1100, the thickness calculation unit 1912 calculates the thickness of the substrate W along the transport direction A based on the measurement result of the first optical head 1710 measuring the distance to the upper surface Wa of the substrate W and the measurement result of the second optical head 1720 measuring the distance to the lower surface Wb of the substrate W. Therefore, the thickness of the substrate W is calculated based on the measurement results obtained by the first optical head 1710 and the second optical head 1720 measuring the distance to the substrate W while correcting the positional misalignment of the substrate W relative to the stage 1100, so that the thickness of the substrate W can be measured with high accuracy.

[0148] Furthermore, by using the first optical head 1710 and the second optical head 1720 to measure the distance from above and below the substrate W, the thickness of the substrate W can be measured with high accuracy even if the substrate W is warped.

[0149] Furthermore, the first optical head 1710 and the second optical head 1720 measure the distance to the substrate W while the rotary actuator 1200 rotates the substrate W. Therefore, unlike when the first optical head 1710 and the second optical head 1720 are moved in the circumferential direction to measure the distance to the substrate W, or when the substrate W is translated in the horizontal direction, it is not necessary to secure a space for the first optical head 1710 and the second optical head 1720 to move or a space for the substrate W to move. This makes it possible to prevent the pre-alignment unit PU from becoming large.

[0150] Furthermore, the thickness calculation unit 1912 calculates the thickness of the substrate W along the circumferential direction and also calculates the thickness of the substrate W along the transport direction A. Therefore, the thickness of the substrate W can be measured with higher accuracy than when the thickness of the substrate W is calculated only along the circumferential direction or when the thickness of the substrate W is calculated only along the transport direction A.

[0151] As described above, while the transport robot TR transports the substrate W in the transport direction A, the thickness calculation unit 1912 calculates the thickness of the substrate W along the transport direction A based on the measurement result obtained by the first optical head 1710 measuring the distance to the upper surface Wa of the substrate W along a straight line passing through the center of the substrate W and the measurement result obtained by the second optical head 1720 measuring the distance to the lower surface Wb of the substrate W along a straight line passing through the center of the substrate W. Therefore, since the thickness of the substrate W can be calculated along a straight line passing through the center of the substrate W, the thickness of the substrate W can be easily measured with high accuracy.

[0152] Furthermore, as described above, in a state in which the holder 1310 holds the substrate W, the first horizontal movement actuator 1400 and the second horizontal movement actuator 1500 move the holder 1310 in the horizontal direction relative to the stage 1100 based on the calculation result of the deviation calculation unit 1911, thereby correcting the positional deviation of the substrate W relative to the stage 1100. Therefore, the positional deviation of the substrate W relative to the stage 1100 can be easily corrected.

[0153] As described above, the pre-alignment unit PU has the alignment housing 1010 to which the first optical head 1710 and the second optical head 1720 are fixed. Therefore, unlike a case in which a moving mechanism for moving the first optical head 1710 and the second optical head 1720 is provided, it is possible to prevent particles from being generated due to the driving of the moving mechanism.

[0154] As described above, the transport robot TR is disposed outside the alignment housing 1010. Therefore, compared to a case where the transport robot TR is disposed inside the alignment housing 1010, it is possible to prevent particles generated due to the driving of the transport robot TR from contaminating the inside of the alignment housing 1010.

[0155] Furthermore, as described above, the first optical head 1710 emits the first emitted light toward the upper surface Wa of the substrate W, and the second optical head 1720 emits the second emitted light toward the lower surface Wb of the substrate W. Therefore, the first optical head 1710 can easily measure the distance to the upper surface Wa of the substrate W, and the second optical head 1720 can easily measure the distance to the lower surface Wb of the substrate W.

[0156] Next, an example of the operation flow of the pre-alignment unit PU and the transport unit TU according to this embodiment will be described with reference to Figs. 12 to 23. Fig. 12 is a flowchart showing an example of the operation of the pre-alignment unit PU and the transport unit TU. Figs. 13 to 23 are schematic diagrams for explaining an example of the operation of the pre-alignment unit PU and the transport unit TU. Note that in Figs. 13 to 23, the number of support pins 1120 of the stage 1100 and the number of support pins 1312 of the holder 1310 are reduced in order to simplify the drawings.

[0157] In this embodiment, the operation of the pre-alignment unit PU and the transport unit TU includes steps S1 to S19. Steps S1, S3, S16, and S18 are executed by a control unit (not shown) of the transport unit TU. Steps S2, S4 to S15, S17, and S19 are executed by a control unit 1910 of the pre-alignment unit PU. Step S5 is an example of the "process of detecting the position of the substrate" of the present invention. Step S6 is an example of the "process of calculating the positional deviation of the substrate" of the present invention. Steps S7 to S11 are an example of the "process of correcting the positional deviation of the substrate" of the present invention. Step S13 is an example of the "process of calculating the thickness of the substrate along the circumferential direction" of the present invention. Step S19 is an example of the "process of calculating the thickness of the substrate along the transport direction" of the present invention.

[0158] As shown in Fig. 12, in step S1, the substrate W is loaded into the pre-alignment unit PU. Specifically, after receiving the substrate W from the center robot CR, the transport robot TR loads the substrate W into the pre-alignment unit PU. At this time, as shown in Fig. 13, the transport robot TR inserts the transport arm 3510 holding the substrate W into the pre-alignment unit PU through the opening window 1011c in the side wall 1011a. As a result, the substrate W held by the transport arm 3510 is positioned above the stage 1100 and the holder 1310.

[0159] Next, in step S2, the holder 1310 is raised to the raised position. Specifically, as shown in FIG. 14, the holder movement actuator 1330 raises the holder 1310 from the lowered position to the raised position. The lowered position is the height position of the holder 1310 shown in FIG. 13, and is a height position where the support pins 1312 of the holder 1310 are lower than the support pins 1120 of the stage 1100. The raised position is the height position shown in FIG. 14, and is a height position where the support pins 1312 of the holder 1310 are higher than the support pins 1120 of the stage 1100. In addition, the raised position is a height position where the support pins 1312 of the holder 1310 protrude upward from the upper surface 3510a of the transport arm 3510.

[0160] In step S2, the holder 1310 is raised to the raised position, so that the support pins 1312 of the holder 1310 protrude above the upper surface 3510a of the transport arm 3510. As a result, the substrate W is supported by the holder 1310 and separated from the transport arm 3510. In other words, the substrate W is transferred from the transport arm 3510 to the holder 1310.

[0161] Next, in step S3, the transport arm 3510 is retreated. Specifically, the transport driver 3520 of the transport robot TR retreats the transport arm 3510 into the transport unit TU through the opening window 1011c in the side wall 1011a (see FIG. 15).

[0162] Next, in step S4, the holder 1310 is lowered to the lowered position. Specifically, as shown in FIG. 16, the holder movement actuator 1330 lowers the holder 1310 from the upper position to the lowered position. As a result, the substrate W is lowered from a position above the stage 1100. As the holder 1310 is lowered to the lowered position in step S4, the support pins 1312 of the holder 1310 move lower than the support pins 1120 of the stage 1100, and the lower surface Wb of the substrate W comes into contact with the support pins 1120 of the stage 1100. As a result, the substrate W is supported by the support pins 1120, and the lower surface Wb of the substrate W is separated from the support pins 1312 of the holder 1310. That is, the substrate W is transferred from the holder 1310 to the stage 1100.

[0163] In addition, in the state in which the substrate W is transferred from the holder 1310 to the stage 1100 in step S4, the central axis LW of the substrate W does not coincide with the rotation axis L1210 of the rotation actuator 1200 and the central axis (not shown) of the stage 1100. In other words, the center of the substrate W is misaligned with respect to the center of the stage 1100.

[0164] Next, in step S5, the detection sensor 1600 detects the position of the substrate W held by the stage 1100. Specifically, as shown in FIG. 17, the rotary actuator 1200 rotates the stage 1100 about the rotation axis L1210. As a result, the substrate W rotates about the rotation axis L1210. In step S5, the stage 1100 is rotated in a state in which the stage 1100 is disposed at the reference position. Hereinafter, an axis on which the central axis (not shown) of the stage 1100 and the rotation axis L1210 of the rotary actuator 1200 coincide when the stage 1100 is disposed at the reference position is referred to as a reference axis LB. The positions of the reference position and the reference axis LB coincide with the central position of the alignment housing 1010 in a plan view, for example, and do not move. The rotation speed of the stage 1100 and the substrate W is not particularly limited, but is, for example, 60 rpm (rotations per minute) or less in order to ensure the detection accuracy by the detection sensor 1600.

[0165] While the substrate W is being rotated, the detection sensor 1600 detects the position of the substrate W. Specifically, as described above, the light emitting head 1610 emits a band-shaped light toward the peripheral edge of the substrate W, and the light receiving head 1620 receives the light (band-shaped light) emitted from the light emitting head 1610 that has passed through the side of the substrate W. The detection sensor 1600 transmits a signal indicating the amount of received light to the control unit 1910.

[0166] Next, in step S6, the displacement calculation unit 1911 of the control unit 1910 calculates the amount of positional displacement of the substrate W relative to the stage 1100 based on the detection result of the detection sensor 1600. In this embodiment, the amount of positional displacement of the substrate W relative to the central axis (not shown) of the stage 1100 and the rotation axis L1210 of the rotation actuator 1200 is calculated.

[0167] Furthermore, in this embodiment, the misalignment calculation unit 1911 detects the timing at which the notch WN of the substrate W passes between the light emitting head 1610 and the light receiving head 1620, based on the detection result of the detection sensor 1600. Thereafter, the misalignment calculation unit 1911 calculates the rotational angle position of the substrate W relative to the stage 1100. The rotational angle position is the position of the substrate W in the rotational direction of the stage 1100 relative to the stage 1100.

[0168] Next, in step S7, the stage 1100 is moved in the horizontal direction. Specifically, as shown in Fig. 18, the first horizontal movement actuator 1400 and the second horizontal movement actuator 1500 move the stage 1100 and the substrate W in the horizontal direction so that the central axis LW of the substrate W coincides with the reference axis LB based on the positional misalignment amount calculated by the misalignment calculation unit 1911. Note that in step S7, in a state in which the central axis LW of the substrate W coincides with the reference axis LB, the rotation axis L1210 of the rotation actuator 1200 is positioned at a position deviated from the reference axis LB.

[0169] Next, in step S8, the holder 1310 is raised to the raised position. Specifically, as shown in Fig. 19, the holder movement actuator 1330 raises the holder 1310 from the lowered position to the raised position. As the holder 1310 is raised to the raised position, the support pins 1312 of the holder 1310 protrude upward beyond the support pins 1120 of the stage 1100. As a result, the substrate W is supported by the holder 1310 and separated from the support pins 1120 of the stage 1100. In other words, the substrate W is transferred from the stage 1100 to the holder 1310.

[0170] Next, in step S9, the stage 1100 is moved in the horizontal direction. Specifically, as shown in Fig. 20, the first horizontal movement actuator 1400 and the second horizontal movement actuator 1500 move the stage 1100 in the horizontal direction by the same distance in the opposite direction to that in step S7. As a result, the central axis (not shown) of the stage 1100 and the rotation axis L1210 of the rotation actuator 1200 coincide with the central axis LW of the substrate W and the reference axis LB.

[0171] Next, in step S10, the stage 1100 is rotated. Specifically, the rotation actuator 1200 rotates the stage 1100 based on the rotation angle position of the substrate W relative to the stage 1100 calculated by the displacement calculation unit 1911. As a result, the substrate W is placed at a predetermined rotation angle position relative to the stage 1100. In other words, the notch WN of the substrate W is positioned directly above a specific position on the stage 1100.

[0172] Next, in step S11, the holder 1310 is lowered to the lowered position. Specifically, as shown in Fig. 16, the holder movement actuator 1330 lowers the holder 1310 from the raised position to the lowered position in the same manner as in step S4. As a result, the substrate W is transferred from the holder 1310 to the stage 1100.

[0173] In addition, in the state where the substrate W is transferred from the holder 1310 to the stage 1100 in step S11, unlike step S4, the central axis LW of the substrate W approximately coincides with the rotation axis L1210 of the rotation actuator 1200, the central axis (not shown) of the stage 1100, and the reference axis LB. The positional deviation of the central axis LW of the substrate W from the rotation axis L1210 of the rotation actuator 1200, the central axis (not shown) of the stage 1100, and the reference axis LB is, for example, 0.1 mm or less.

[0174] Next, in step S12, the distance from the distance measurement device 1700 to the substrate W is measured in the circumferential direction. Specifically, as shown in Fig. 21, the rotation actuator 1200 rotates the stage 1100 about the rotation axis L1210 and the reference axis LB. This causes the substrate W to rotate about the central axis LW, the rotation axis L1210, and the reference axis LB.

[0175] Then, while the substrate W is being rotated, the distance measuring device 1700 measures the distance to the substrate W in the circumferential direction. Specifically, the first optical head 1710 emits a first emitted light toward the upper surface Wa of the substrate W, and receives the light of the first emitted light reflected by the upper surface Wa of the substrate W with the first light receiving element 1712. In this way, the first optical head 1710 measures the distance to the upper surface Wa of the substrate W held on the stage 1100. The second optical head 1720 emits a second emitted light toward the lower surface Wb of the substrate W, and receives the light of the second emitted light reflected by the lower surface Wb of the substrate W with the second light receiving element 1722. In this way, the second optical head 1720 measures the distance to the lower surface Wb of the substrate W held on the stage 1100. The distance measuring device 1700 transmits a signal indicating the measured distance to the control unit 1910. In FIG. 21, the first outgoing light and the second outgoing light are hatched for ease of understanding.

[0176] Furthermore, in this embodiment, in step S12, similarly to step S5, while the substrate W is being rotated, the detection sensor 1600 detects the position of the substrate W. The detection sensor 1600 transmits a signal indicating the amount of received light to the control unit 1910.

[0177] Next, in step S13, the thickness calculation unit 1912 of the control unit 1910 calculates the thickness of the substrate W along the circumferential direction based on the measurement result of the distance measurement device 1700. In this embodiment, the detection sensor 1600 detects the position of the notch WN of the substrate W simultaneously with the measurement by the distance measurement device 1700, so the thickness calculation unit 1912 calculates the thickness of the substrate W based on the detection result of the detection sensor 1600 while associating the thickness of the substrate W with the position in the circumferential direction of the substrate W.

[0178] Next, in step S14, the position of the notch WN of the substrate W is adjusted. Specifically, the rotary actuator 1200 rotates the stage 1100 and the substrate W by a predetermined angle based on the detection result of the detection sensor 1600. At this time, the rotary actuator 1200 rotates the stage 1100 and the substrate W so that the notch WN of the substrate W is located at a predetermined position. In this embodiment, the rotary actuator 1200 rotates the stage 1100 so that the notch WN is located on a straight line that is parallel to the X direction and passes through the reference axis line LB. Here, the rotary actuator 1200 rotates the stage 1100 and the substrate W so that the notch WN is located on a straight line that is parallel to the X direction and passes through the reference axis line LB, and at a position close to the transport unit TU.

[0179] Next, in step S15, the holder 1310 is raised to the raised position. Specifically, as shown in Fig. 19, the holder movement actuator 1330 raises the holder 1310 from the lowered position to the raised position. As the holder 1310 is raised to the raised position, the support pins 1312 of the holder 1310 protrude upward beyond the support pins 1120 of the stage 1100. As a result, the substrate W is supported by the holder 1310 and separated from the support pins 1120 of the stage 1100. That is, the substrate W is transferred from the stage 1100 to the holder 1310.

[0180] Next, in step S16, the transport arm 3510 of the transport robot TR is inserted into the pre-alignment unit PU. Specifically, as shown in Fig. 22, the transport robot TR inserts the transport arm 3510 into the pre-alignment unit PU through the opening window 1011c of the side wall 1011a. As a result, the transport arm 3510 is positioned between the holder 1310 and the substrate W.

[0181] Next, in step S17, the holder 1310 is lowered to the lowered position. Specifically, as shown in FIG. 23, the holder movement actuator 1330 lowers the holder 1310 from the upper position to the lowered position. As a result, the substrate W is lowered from a position above the transport arm 3510. As the holder 1310 is lowered to the lowered position, the support pins 1312 of the holder 1310 move below the upper surface 3510a of the transport arm 3510. As a result, the lower surface Wb of the substrate W comes into contact with the upper surface 3510a of the transport arm 3510, and the substrate W is supported by the transport arm 3510. Then, the lower surface Wb of the substrate W is separated from the support pins 1312 of the holder 1310. That is, the substrate W is transferred from the holder 1310 to the transport arm 3510.

[0182] Next, in step S18, the substrate W is unloaded from the pre-alignment unit PU, and the distance from the distance measurement device 1700 to the substrate W is measured along the transport direction A. Specifically, the transport drive unit 3520 of the transport robot TR accommodates the transport arm 3510 holding the substrate W into the transport unit TU through the opening window 1011c of the side wall 1011a. That is, the transport robot TR transports the substrate W in the transport direction A (see FIG. 11) and accommodates it in the transport unit TU. As a result, the substrate W is unloaded from the pre-alignment unit PU to the transport unit TU. At this time, as described with reference to FIG. 11, the distance measurement device 1700 measures the distance to the substrate W while the transport robot TR transports the substrate W in the transport direction A relative to the stage 1100. As a result, the distance measurement device 1700 measures the distance to the substrate W along a straight line (center line) passing through the center of the substrate W.

[0183] Next, in step S19, the thickness calculation unit 1912 of the control unit 1910 calculates the thickness of the substrate W along the transport direction A based on the measurement result of the distance measurement device 1700. Then, the control unit 1910 transmits the calculation result in step S13 and the calculation result in step S19 to the control unit 91.

[0184] In this manner, the pre-alignment operation of the substrate W using the pre-alignment unit PU and the thickness measurement operation of the substrate W are completed.

[0185] Next, the joining unit JU of this embodiment will be described with reference to Fig. 24 to Fig. 30. Fig. 24 is a perspective view that shows a schematic structure of the joining unit JU. As shown in Fig. 24, the joining unit JU includes a base 2, a first substrate holder 10, a second substrate holder 20, a first moving actuator 100, and a second moving actuator 200. The first moving actuator 100 is an example of a "substrate holder actuator" in the present invention.

[0186] The base 2 supports the first substrate holder 10, the second substrate holder 20, the first movement actuator 100, the second movement actuator 200, etc. The base 2 is made of a material that is not easily deformed by the weight and heat of the first movement actuator 100, the second movement actuator 200, etc. The base 2 is made of, for example, stone material. This makes it possible to increase the straightness and flatness of the base 2. In addition, a vibration isolation table (not shown) is arranged below the base 2. This makes it possible to suppress the transmission of vibration from the floor 4012 (see FIG. 3) to the first substrate holder 10, the second substrate holder 20, the first movement actuator 100, the second movement actuator 200, etc. The vibration isolation table is not particularly limited, but may be, for example, an active vibration isolation table. The active vibration isolation table has, for example, a sensor that detects vibration and an actuator that suppresses the transmission of vibration.

[0187] In this embodiment, the first substrate holder 10 holds the back surface of the first substrate W1 (the surface opposite to the surface to be bonded to the second substrate W2). In this embodiment, the first substrate holder 10 turns the first substrate W1 upside down and moves the first substrate W1 up and down, as described below.

[0188] The first substrate holder 10 has a first stage 11 and a first holding part 12 fixed to the first stage 11. The first stage 11 has one surface 11a to which the first holding part 12 is attached. The first stage 11 is, for example, a plate having a rectangular parallelepiped shape. The first stage 11 is formed, for example, from ceramic or metal having a small linear expansion coefficient.

[0189] The first holding part 12 holds the back surface of the first substrate W1. The holding method by the first holding part 12 is not particularly limited, but may be, for example, a vacuum type. That is, the first holding part 12 adsorbs the back surface of the first substrate W1. The holding method by the first holding part 12 may be a clamping type that clamps the end of the first substrate W1. However, in order to prevent the first holding part 12 from contacting the second substrate holder 20 and / or the second substrate W2 when bonding the first substrate W1 and the second substrate W2, the holding method by the first holding part 12 is preferably a vacuum type. The first holding part 12 is, for example, a plate having a cylindrical shape or a disk shape. The first holding part 12 is, for example, formed of ceramic or metal having a small linear expansion coefficient.

[0190] In this embodiment, the second substrate holder 20 holds the back surface of the second substrate W2 (the surface opposite to the surface to be bonded to the first substrate W1). In this embodiment, the second substrate holder 20 moves the second substrate W2 in the horizontal direction along the upper surface of the base 2, as described later. In addition, the second substrate holder 20 rotates the second substrate W2 in the circumferential direction, as described later.

[0191] The second substrate holder 20 has a second stage 21 and a second holding part 22 fixed to the second stage 21. The second stage 21 holds the second holding part 22. The second stage 21 is, for example, a plate having a rectangular parallelepiped shape. The second stage 21 is formed of, for example, ceramic or metal having a small linear expansion coefficient.

[0192] The second holding part 22 holds the back surface of the second substrate W2. The holding method by the second holding part 22 is not particularly limited, but may be, for example, a vacuum type. That is, the second holding part 22 adsorbs the back surface of the second substrate W2. The holding method by the second holding part 22 may be a clamping type that clamps the end of the second substrate W2. However, in order to prevent the second holding part 22 from contacting the first substrate holder 10 and / or the first substrate W1 when bonding the second substrate W2 and the second substrate W2 together, it is preferable that the holding method by the second holding part 22 is a vacuum type. The second holding part 22 is, for example, a plate having a cylindrical shape or a disk shape. The second holding part 22 is, for example, formed of ceramic or metal having a small linear expansion coefficient.

[0193] Moreover, the second holding portion 22 is configured to be rotatable in the circumferential direction. Specifically, the second holding portion 22 is configured to be rotatable around the center of the second holding portion 22. In other words, the second holding portion 22 rotates the second substrate W2 in the circumferential direction. Moreover, the second holding portion 22 rotates the second substrate W2 within a horizontal plane.

[0194] The first movement actuator 100 moves the first substrate holder 10. In this embodiment, the first movement actuator 100 turns the first substrate holder 10 upside down and moves the first substrate holder 10 upside down. This causes the first substrate W1 to be turned upside down and moved upside down.

[0195] Specifically, the first movement actuator 100 has an inversion actuator 110, an elevation actuator 120, and a first gantry 130. In Fig. 24, the first gantry 130 is depicted by a two-dot chain line.

[0196] The inversion actuator 110 inverts the first substrate holder 10 upside down. The inversion actuator 110 has a rotating shaft 111 fixed to the first substrate holder 10, and a first rotation drive unit (not shown) that rotates the rotating shaft 111. The rotating shaft 111 may be configured as one shaft that passes through the first substrate holder 10, or may be configured as a pair of shafts that are arranged to sandwich the first substrate holder 10. The first rotation drive unit has, for example, a stepping motor. The first substrate holder 10 is inverted upside down by the first rotation drive unit rotating the rotating shaft 111 by 180 degrees.

[0197] In this embodiment, the joining unit JU includes an angle detection sensor 150. The angle detection sensor 150 detects the angle of the first substrate holder 10 relative to the second substrate holder 20. The angle detection sensor 150 includes, for example, three or more distance measurement sensors 151. The distance measurement sensor 151 is attached, for example, to one surface 11a of the first substrate holder 10, and measures the distance to the second substrate holder 20. The first substrate holder 10 can be arranged parallel to the second substrate holder 20 by rotating the rotating shaft 111 based on the detection result of the distance measurement sensor 151. This allows the first substrate W1 to be arranged parallel to the second substrate W2. Note that the distance measurement sensor 151 may be attached to the second substrate holder 20 and measure the distance to the first substrate holder 10. The angle detection sensor 150 may include a sensor or device other than the distance measurement sensor 151 as long as it can detect the angle of the first substrate holder 10 relative to the second substrate holder 20.

[0198] The lifting actuator 120 moves the first substrate holder 10 up and down. The lifting actuator 120 has a pair of support members 121 and a pair of lifting mechanisms 122. The support members 121 support the inversion actuator 110. The support members 121 rotatably support the rotating shaft 111 of the inversion actuator 110. In addition, the lifting actuator 120 moves the first substrate holder 10 in the up and down direction based on the detection result of the distance measuring sensor 151, thereby keeping the distance between the first substrate W1 and the second substrate W2 within a predetermined range.

[0199] The lifting mechanism 122 has a plurality of movers 122a and a plurality of rails (not shown). The movers 122a are fixed to the support member 121. Two movers 122a are fixed to one support member 121. The movers 122a move along the rails. The movers 122a have, for example, a coil. The movers 122a also have an encoder that detects the distance moved along the rails (not shown). Note that not all of the movers 122a need to have a coil and an encoder, and one or more of the movers 122a may have a coil and an encoder.

[0200] A rail (not shown) is fixed to the first gantry 130 so as to extend in the vertical direction. The rail has a plurality of magnets. The magnets are arranged so that the north poles and south poles are alternately arranged along the vertical direction. By passing a current through the coil of the mover 122a, the mover 122a moves along the rail. By the mover 122a moving up and down along the rail, the first substrate holder 10 moves up and down.

[0201] The second movement actuator 200 moves the second substrate holder 20. In this embodiment, the second movement actuator 200 moves the second substrate holder 20 in the horizontal direction along the upper surface of the base 2. Also, in this embodiment, the second movement actuator 200 rotates the second holding portion 22 of the second substrate holder 20 in the circumferential direction. In other words, the second movement actuator 200 rotates the second holding portion 22 of the second substrate holder 20 within a horizontal plane.

[0202] Specifically, the second movement actuator 200 has a parallel movement unit 210 and a second rotation drive unit 230 (see FIG. 25). The parallel movement unit 210 translates the second substrate holder 20 along the upper surface of the base 2. The parallel movement unit 210 has a movement unit 211 that moves the second substrate holder 20 in the X direction, a movement unit 212 that moves the second substrate holder 20 in the Y direction, and a support base 213 arranged between the movement unit 211 and the movement unit 212.

[0203] 25 is a schematic diagram showing the structure around the second substrate holder 20 of the joining unit JU from the X direction. As shown in FIGS. 24 and 25, the moving part 211 is disposed on a support base 213. The moving part 211 has a linear motor 2111 and a linear guide 2112. In this embodiment, the moving part 211 has a pair of linear motors 2111 and a pair of linear guides 2112.

[0204] The pair of linear motors 2111 are disposed on the outer sides in the Y direction of the second stage 21 of the second substrate holder 20. The pair of linear motors 2111 are disposed at a predetermined distance from each other in the Y direction.

[0205] Each linear motor 2111 has a mover 2111a and a rail 2111b. The mover 2111a is fixed to a side surface of the second stage 21. The mover 2111a moves along the rail 2111b. The mover 2111a has, for example, a coil. The mover 2111a also has an encoder that detects the distance moved along the rail 2111b. Note that both of the pair of movers 2111a do not necessarily have a coil and an encoder, and one of the movers 2111a may have a coil and an encoder.

[0206] The rail 2111b is fixed to the support base 213 so as to extend in the X direction. The rail 2111b has a plurality of magnets. The plurality of magnets are arranged so that the north poles and south poles are alternately arranged along the X direction. By passing a current through the coil of the mover 2111a, the mover 2111a moves along the rail 2111b. By the mover 2111a moving along the rail 2111b, the second substrate holder 20 moves in the X direction.

[0207] The pair of linear guides 2112 are disposed between the second stage 21 of the second substrate holder 20 and the support base 213. The pair of linear guides 2112 are disposed at a predetermined distance in the Y direction. The pair of linear guides 2112 are disposed along the pair of linear motors 2111, respectively.

[0208] Each linear guide 2112 has a mover 2112a and a rail 2112b. The mover 2112a is fixed to the lower surface of the second stage 21 (the surface facing the support base 213). The mover 2112a moves along the rail 2112b. The mover 2112a has, for example, a U-shaped cross section and sandwiches the rail 2112b from both sides in the Y direction. The rail 2112b is fixed to the support base 213 so as to extend in the X direction. The linear guide 2112 moves the second substrate holder 20 linearly with high accuracy.

[0209] 26 is a schematic diagram showing the structure around the second substrate holder 20 of the joining unit JU from the Y direction. As shown in FIGS. 24 and 26, the moving part 212 is disposed on the base 2. The moving part 212 has a linear motor 2121 and a linear guide 2122. In this embodiment, the moving part 212 has a pair of linear motors 2121 and a pair of linear guides 2122.

[0210] The pair of linear motors 2121 are disposed between the support stand 213 and the base 2. The pair of linear motors 2121 are disposed at a predetermined distance from each other in the X direction.

[0211] Each linear motor 2121 has a mover 2121a and a rail 2121b. The mover 2121a is fixed to the lower surface (the surface facing the base 2) of the support stand 213. The mover 2121a moves along the rail 2121b. The mover 2121a has, for example, a coil. The mover 2121a also has an encoder that detects the distance moved along the rail 2121b. Note that both of the pair of movers 2121a do not necessarily have a coil and an encoder, and one of the movers 2121a may have a coil and an encoder.

[0212] The rail 2121b is fixed to the base 2 so as to extend in the Y direction. The rail 2121b has a plurality of magnets. The plurality of magnets are arranged so that the north poles and south poles are alternately arranged along the Y direction. By passing a current through the coil of the mover 2121a, the mover 2121a moves along the rail 2121b. By the mover 2121a moving along the rail 2121b, the support base 213 and the second substrate holder 20 move in the Y direction.

[0213] The pair of linear guides 2122 are disposed between the support stand 213 and the base 2. The pair of linear guides 2122 are disposed at a predetermined distance in the X direction. The pair of linear guides 2122 are disposed along the pair of linear motors 2121, respectively.

[0214] Each linear guide 2122 has a mover 2122a and a rail 2122b. The mover 2122a is fixed to the lower surface (the surface facing the base 2) of the support table 213. The mover 2122a moves along the rail 2122b. The mover 2122a has, for example, a U-shaped cross section and sandwiches the rail 2122b from both sides in the X direction. The rail 2122b is fixed to the base 2 so as to extend in the Y direction. The linear guide 2122 moves the support table 213 and the second substrate holder 20 linearly with high accuracy.

[0215] The second rotary drive unit 230 is attached to the lower part of the second holding part 22 of the second substrate holder 20. The second rotary drive unit 230 rotates the second holding part 22 in the circumferential direction. That is, the second rotary drive unit 230 rotates the second substrate W2 in the circumferential direction within a horizontal plane. The second rotary drive unit 230 includes, for example, a motor. In this embodiment, the second rotary drive unit 230 includes a direct drive motor. This allows the rotation angle of the second substrate W2 to be controlled with high precision.

[0216] Fig. 27 is a schematic diagram showing the structure around the support stand 213 from below. As shown in Fig. 25 and Fig. 27, the joining unit JU includes a detection actuator 300. The detection actuator 300 detects the movement of one of the first substrate holder 10 and the second substrate holder 20 in the XY plane. In this embodiment, the detection actuator 300 detects the movement of the second substrate holder 20 in the XY plane.

[0217] Specifically, the detection actuator 300 has, for example, a two-dimensional scale 301 (hereinafter, referred to as 2D scale 301) and a detection sensor 302. The 2D scale 301 is attached to the lower surface of the second stage 21 of the second substrate holder 20. The 2D scale 301 has a rectangular shape extending in the X and Y directions. The 2D scale 301 is, for example, a reflective diffraction grating scale. The 2D scale 301 is configured such that the grating interval changes along the X and Y directions.

[0218] An opening 213a is provided in the support base 213. The opening 213a is located below the 2D scale 301. In addition, the opening 213a has an opening larger than the 2D scale 301.

[0219] The detection sensor 302 is attached to the upper surface of the base 2. The detection sensor 302 protrudes upward from the opening 213a of the support base 213. The detection sensor 302 may be located below the support base 213. The detection sensor 302 emits laser light toward the 2D scale 301 and receives light reflected by the 2D scale 301. As the second substrate holder 20 moves, the light reception signal of the detection sensor 302 changes. This allows the amount of movement of the second substrate holder 20 in the X and Y directions to be detected.

[0220] Returning to Fig. 24, the joining unit JU will be further described. As shown in Fig. 24, the joining unit JU includes a first substrate detection sensor 310 and a first reference mask 410. The first substrate detection sensor 310 detects the first substrate W1. Specifically, the first substrate W1 has one or more alignment marks. The first substrate detection sensor 310 detects the alignment marks of the first substrate W1.

[0221] The first substrate detection sensor 310 is fixed to the second stage 21. The first substrate detection sensor 310 includes, for example, a camera. The first substrate detection sensor 310 includes an imaging element. For example, the imaging element is a CCD image sensor or a CMOS image sensor. The first substrate detection sensor 310 transmits captured imaging data to the control device 90. The imaging data includes image data. In this embodiment, the first substrate detection sensor 310 has a camera 311. Note that the first substrate detection sensor 310 may have multiple cameras with different magnifications, similar to the second substrate detection actuator 320 described later.

[0222] Furthermore, the first substrate detection sensor 310 detects the first reference mask 410. Specifically, the first reference mask 410 has an alignment mark. The first substrate detection sensor 310 detects the alignment mark of the first reference mask 410. Note that the first substrate detection sensor 310 detects the first reference mask 410 in a state in which one surface 11a of the first stage 11 faces downward.

[0223] The first reference mask 410 is fixed to the first stage 11. The first reference mask 410 has a mark member 411 on which an alignment mark is formed, and a pair of supports 412 that support the mark member 411.

[0224] The mark member 411 has an alignment mark formed with high precision. For example, the alignment mark is formed by performing etching or the like on the mark member 411. The mark member 411 is formed of, for example, a material having a small linear expansion coefficient. The mark member 411 may also be formed of, for example, a material having translucency. In this embodiment, the mark member 411 is formed of, for example, glass that transmits visible light.

[0225] Here, the first substrate detection sensor 310 detects the alignment marks of the first substrate W1 and the alignment marks of the first reference mask 410, thereby detecting the relative positions of the alignment marks of the first substrate W1 with respect to the alignment marks of the first reference mask 410. Specifically, the first substrate detection sensor 310 is moved in the horizontal direction with one surface 11a of the first stage 11 facing downward, thereby detecting the alignment marks of the first substrate W1 and the alignment marks of the first reference mask 410. At this time, the detection actuator 300 detects the direction and distance that the first substrate detection sensor 310 and the second substrate holder 20 have moved from when the alignment marks of the first substrate W1 are detected by the first substrate detection sensor 310 until when the alignment marks of the first reference mask 410 are detected. This allows the relative positions of the alignment marks of the first substrate W1 with respect to the alignment marks of the first reference mask 410 to be detected.

[0226] The joining unit JU includes a second substrate detection actuator 320 and a second reference mask 420. The second substrate detection actuator 320 detects the second substrate W2. Specifically, the second substrate W2 has one or more alignment marks. The second substrate detection actuator 320 detects the alignment marks of the second substrate W2.

[0227] The joining unit JU includes a second gantry 350, and the second substrate detection actuator 320 is fixed to the second gantry 350. In FIG. 24, a part of the second gantry 350 is depicted by a two-dot chain line. The second substrate detection actuator 320 includes, for example, a camera. The second substrate detection actuator 320 includes an imaging element. For example, the imaging element is a CCD image sensor or a CMOS image sensor. The second substrate detection actuator 320 transmits the captured imaging data to the control device 90. The imaging data includes image data.

[0228] In this embodiment, the second substrate detection actuator 320 has a camera 321 and a camera 322 with different magnifications. The camera 321 is a relatively low-magnification camera. The camera 322 is a relatively high-magnification camera. The camera 322 has a higher magnification than the camera 321. The camera 321 has a relatively large angle of view, so it is easy to detect the alignment marks of the second substrate W2. On the other hand, the camera 322 has a relatively small angle of view and high magnification, so it has high accuracy in detecting the alignment marks.

[0229] When detecting the alignment mark of the second substrate W2 by the second substrate detection actuator 320, the alignment mark is detected by the camera 321, and then the alignment mark is detected by the camera 322. For this reason, an operation of moving the second substrate detection actuator 320 (camera 321 and camera 322) is required between the detection by the camera 321 and the detection by the camera 322. However, for the sake of simplicity, hereinafter, both the detection by the camera 321 and the detection by the camera 322 will be described as detection by the second substrate detection actuator 320. Also, the operation of moving the second substrate detection actuator 320 between the detection by the camera 321 and the detection by the camera 322 will be omitted.

[0230] Moreover, the second substrate detection actuator 320 detects the second reference mask 420. Specifically, the second reference mask 420 has an alignment mark. The second substrate detection actuator 320 detects the alignment mark of the second reference mask 420.

[0231] The second reference mask 420 is fixed to the second stage 21. The second reference mask 420 has a mark member 421 on which an alignment mark is formed, and supports 422 that support the mark member 421.

[0232] The mark member 421 has an alignment mark formed with high accuracy. For example, the alignment mark is formed by performing etching or the like on the mark member 421. The mark member 421 is formed of, for example, a material having a small linear expansion coefficient. Also, the mark member 421 may be formed of, for example, a material having translucency. In this embodiment, the mark member 421 is formed of, for example, glass that transmits visible light. Note that the mark member 421 may be formed of a material that does not transmit visible light.

[0233] Here, the second substrate detection actuator 320 detects the alignment marks of the second substrate W2 and the alignment marks of the second reference mask 420, thereby detecting the relative positions of the alignment marks of the second substrate W2 with respect to the alignment marks of the second reference mask 420. Specifically, the second substrate holder 20 and the second substrate W2 are moved in the horizontal direction to detect the alignment marks of the second substrate W2 and the alignment marks of the second reference mask 420. At this time, the detection actuator 300 detects the direction and distance that the second substrate holder 20 and the second substrate W2 have moved from the detection of the alignment marks of the second substrate W2 by the second substrate detection actuator 320 until the detection of the alignment marks of the second reference mask 420. This makes it possible to detect the relative positions of the alignment marks of the second substrate W2 with respect to the alignment marks of the second reference mask 420.

[0234] Fig. 28 is a perspective view showing a schematic structure of the joint unit JU from below. As shown in Fig. 28, the joint unit JU includes an imaging section 50. In this embodiment, the imaging section 50 transmits captured imaging data to the control device 90.

[0235] In this embodiment, the imaging unit 50 is fixed to the first substrate holder 10. In addition, in this embodiment, the imaging unit 50 images the first reference mask 410 and the second reference mask 420. Specifically, the imaging unit 50 images the alignment marks of the first reference mask 410 and the alignment marks of the second reference mask 420. In this embodiment, the imaging unit 50 simultaneously images the alignment marks of the first reference mask 410 and the alignment marks of the second reference mask 420. That is, the imaging unit 50 images the alignment marks of the first reference mask 410 and the alignment marks of the second reference mask 420 within one screen.

[0236] In this embodiment, the imaging unit 50 is attached to the first stage 11. The imaging unit 50 may be attached to, for example, one surface 11a (see FIG. 24) of the first stage 11. The imaging unit 50 may also be attached to the first stage 11 so as to penetrate the first stage 11. In this embodiment, the imaging unit 50 is attached to the first stage 11 so as to penetrate the first stage 11 in the thickness direction.

[0237] When the first substrate W1 held by the first substrate holder 10 and the second substrate W2 held by the second substrate holder 20 are bonded together, the first reference mask 410 and the second reference mask 420 are arranged to face each other in the vertical direction. At this time, the alignment marks of the first reference mask 410 and the alignment marks of the second reference mask 420 are arranged to face each other in the vertical direction. However, in the XY plane, the positions of the alignment marks of the first reference mask 410 and the alignment marks of the second reference mask 420 may or may not completely match. The alignment marks of the first reference mask 410 and the alignment marks of the second reference mask 420 may be arranged at positions where they are simultaneously imaged by the imaging unit 50.

[0238] The control unit 91 (see FIG. 1) controls the joining unit JU. Specifically, the control unit 91 controls the first movement actuator 100 and the second movement actuator 200.

[0239] The control unit 91, for example, controls the first movement actuator 100 to upside down the first substrate W1 that has been handed over from the transport robot TR to the first substrate holder 10 and is held by the first substrate holder 10. The control unit 91, for example, controls the first movement actuator 100 to move the inverted first substrate W1 downward, and bond the first substrate W1 and the second substrate W2 together.

[0240] The control unit 91 calculates the relative position of the alignment mark of the first substrate W1 with respect to the alignment mark of the first reference mask 410, for example, based on the detection results of the detection actuator 300 and the first substrate detection sensor 310. The control unit 91 also calculates the relative position of the alignment mark of the second substrate W2 with respect to the alignment mark of the second reference mask 420, for example, based on the detection results of the detection actuator 300 and the second substrate detection actuator 320. The control unit 91 also calculates the relative positional relationship between the alignment mark of the first reference mask 410 and the alignment mark of the second reference mask 420, for example, based on the detection results of the imaging unit 50. Therefore, the control unit 91 can calculate the relative positional relationship between the alignment mark of the first substrate W1 and the alignment mark of the second substrate W2, for example, based on the detection results of the detection actuator 300, the first substrate detection sensor 310, the second substrate detection actuator 320, and the imaging unit 50.

[0241] For example, calculating the relative position between the first reference mask 410 and the second reference mask 420, calculating the relative position between the first substrate holder 10 and the second substrate holder 20, and calculating the relative position between the first substrate W1 and the second substrate W2 are substantially the same as calculating the relative position of the second reference mask 420 with respect to the imaging section 50.

[0242] The control unit 91 acquires the calculation result of the thickness calculation unit 1912 of the pre-alignment unit PU. The control unit 91 is an example of the "acquisition unit" in the present invention.

[0243] The control unit 91 generates mapping data for the first substrate W1 and mapping data for the second substrate W2 based on the thicknesses of the first substrate W1 and the second substrate W2 calculated by the pre-alignment unit PU. The mapping data indicates thickness information of the substrate W in each region when the substrate W is partitioned into a plurality of regions in a grid shape. In this embodiment, the control unit 91 generates mapping data for the entire region of the substrate W by predicting the thickness of a portion of the substrate W (regions not calculated) based on the calculation result of the thickness of the substrate W along the circumferential direction and the calculation result of the thickness of the substrate W along the transport direction A.

[0244] In this embodiment, the control unit 91 controls the lifting actuator 120 to move the first substrate holder 10 relative to the second substrate holder 20 so that the distance between the first substrate W1 and the second substrate W2 falls within a predetermined range, based on the calculation result of the thickness calculation unit 1912. Therefore, the first substrate holder 10 can be moved relative to the second substrate holder 20 based on the thickness of the substrate W measured with high accuracy, and therefore the distance between the first substrate W1 and the second substrate W2 can be easily brought into the predetermined range.

[0245] Next, with reference to Fig. 29 and Fig. 30, a bonding method of the bonding unit JU of this embodiment will be described. Fig. 29 is a flowchart showing the bonding method of the bonding unit JU. Fig. 30 is a side view that shows a state in which the first substrate W1 and the second substrate W2 are arranged opposite each other. Note that in Fig. 30, the amount of change in thickness of the substrate W is shown extremely large for ease of understanding. In this embodiment, the bonding method of the bonding unit JU includes steps S101 to S111.

[0246] As shown in FIG. 29, in step S101, the control unit 91 carries the first substrate W1 transferred from the pre-alignment unit PU to the transport robot TR into the joining unit JU. Specifically, the control unit 91 controls the transport robot TR to carry the first substrate W1 into the joining unit JU through the opening window 4011c (see FIG. 3). At this time, the transport robot TR transports the first substrate W1 with the surface of the first substrate W1 to be bonded to the second substrate W2 (hereinafter, sometimes referred to as the bonding surface) facing upward. Then, the transport robot TR passes the first substrate W1 to the first substrate holder 10. At this time, the transport robot TR may directly pass the first substrate W1 to the first substrate holder 10, or may pass the first substrate W1 to the first substrate holder 10 via another device such as an adsorption chuck pin. The first substrate W1 is held by the first substrate holder 10 with the bonding surface facing upward.

[0247] Next, in step S102, the control unit 91 carries the second substrate W2 transferred from the pre-alignment unit PU to the transport robot TR into the joining unit JU. Specifically, the control unit 91 controls the transport robot TR to carry the second substrate W2 into the joining unit JU through the opening window 4011c (see FIG. 3). At this time, the transport robot TR transports the second substrate W2 with the surface of the second substrate W2 to be bonded to the first substrate W1 (hereinafter, sometimes referred to as the bonding surface) facing upward. Then, the transport robot TR passes the second substrate W2 to the second substrate holder 20. At this time, the transport robot TR may directly pass the second substrate W2 to the second substrate holder 20, or may pass the second substrate W2 to the second substrate holder 20 via another device such as an adsorption chuck pin. The second substrate W2 is held by the second substrate holder 20 with the bonding surface facing upward.

[0248] Next, in step S103, the control unit 91 turns the first substrate W1 upside down. Specifically, the control unit 91 controls the first moving actuator 100 to turn the first substrate holder 10 upside down. As a result, the bonding surface of the first substrate W1 faces downward.

[0249] Next, in step S104, the control unit 91 moves the second substrate holder 20 to a reference position. Specifically, the control unit 91 controls the second movement actuator 200 to move the second substrate holder 20 to the reference position. The reference position is, for example, the position of the second substrate holder 20 when the center of the second holding portion 22 of the second substrate holder 20 is located directly below the center of the first holding portion 12 of the first substrate holder 10. Note that in this state, the distance between the first substrate W1 and the second substrate W2 is, for example, several mm to several tens of mm or more.

[0250] Next, in step S105, the control unit 91 determines the lowering amount of the first substrate W1 based on the mapping data of the first substrate W1 and the mapping data of the second substrate W2. Specifically, the control unit 91 identifies a region RW (see FIG. 30) where the distance between the first substrate W1 and the second substrate W2 is the smallest based on the mapping data of the first substrate W1 and the mapping data of the second substrate W2.

[0251] 30, the control unit 91 calculates the amount of lowering of the first substrate W1 and the first substrate holder 10 so that the distance Lmin between the first substrate W1 and the second substrate W2 in the region RW falls within a predetermined range. The predetermined range is, for example, from several μm to several tens of μm.

[0252] Next, in step S106, the control unit 91 lowers the first substrate W1. Specifically, the control unit 91 controls the lifting actuator 120 to lower the first substrate holder 10 by the lowering amount calculated in step S105. This brings the distance between the first substrate W1 and the second substrate W2 into a predetermined range.

[0253] Next, in step S107, the control unit 91 acquires imaging data. Specifically, the control unit 91 acquires image data captured by the imaging unit 50. The image data includes information indicating the relative positional relationship between the alignment marks of the first reference mask 410 and the alignment marks of the second reference mask 420.

[0254] Next, in step S108, the control unit 91 detects the relative positions between the alignment marks of the first reference mask 410 and the alignment marks of the second reference mask 420 based on the acquired imaging data. Here, since both the imaging unit 50 and the first reference mask 410 are fixed to the first substrate holder 10, the relative positional relationship between the imaging unit 50 and the first reference mask 410 does not change. Therefore, detecting the relative positions between the alignment marks of the first reference mask 410 and the alignment marks of the second reference mask 420 is substantially the same as detecting the relative positions indicating the relative positions of the alignment marks of the second reference mask 420 with respect to the imaging unit 50. That is, in step S108, the control unit 91 detects the relative positions of the alignment marks of the second reference mask 420 with respect to the imaging unit 50 based on the acquired imaging data. Then, based on the relative position of the second reference mask 420 with respect to the imaging section 50, the control section 91 calculates the relative position of the second substrate holder 20 with respect to the first substrate holder 10, and the relative position of the second substrate W2 with respect to the first substrate W1.

[0255] Next, in step S109, the control unit 91 calculates, based on the relative position of the second substrate W2 with respect to the first substrate W1 calculated in step S108, a correction amount for moving the second substrate holder 20 horizontally so that the central axis of the second substrate W2 coincides with the central axis of the first substrate W1.

[0256] Next, in step S110, the control unit 91 aligns the first substrate holder 10 and the second substrate holder 20. Specifically, the control unit 91 drives the second moving actuator 200 based on the correction amount calculated in step S109. This aligns the first substrate holder 10 and the second substrate holder 20. As a result, the amount of positional misalignment between the first substrate W1 and the second substrate W2 becomes, for example, several tens of nm or less.

[0257] Next, in step S111, the control unit 91 bonds the first substrate W1 and the second substrate W2 together. Specifically, the control unit 91 controls the first moving actuator 100 to move the first substrate holder 10 and the first substrate W1 downward. As a result, the first substrate W1 and the second substrate W2 are bonded together.

[0258] In this manner, the bonding of the first substrate W1 and the second substrate W2 by the bonding unit JU is completed.

[0259] The embodiments of the present invention have been described above with reference to the drawings. However, the present invention is not limited to the above embodiments, and can be implemented in various aspects without departing from the gist of the present invention. In addition, various inventions can be formed by appropriately combining multiple components disclosed in the above embodiments. For example, some components may be deleted from all components shown in the embodiments. Furthermore, components across different embodiments may be appropriately combined. The drawings are mainly shown schematically for ease of understanding, and the thickness, length, number, spacing, etc. of each component shown in the drawings may differ from the actual ones due to the convenience of drawing. In addition, the material, shape, dimensions, etc. of each component shown in the above embodiments are examples and are not particularly limited, and various changes are possible within a range that does not substantially deviate from the effects of the present invention.

[0260] For example, in the above embodiment, an example has been described in which two substrates W whose thicknesses have been measured by the pre-alignment unit PU (substrate thickness measuring device) are bonded together in the bonding unit JU, but the present invention is not limited to this. Substrates W whose thicknesses have been measured by the substrate thickness measuring device may be used for a purpose other than bonding.

[0261] In the above embodiment, the pre-alignment unit PU, the transport unit TU, and the joining unit JU are arranged side by side, but the present invention is not limited to this. For example, the pre-alignment unit PU may be arranged adjacent to the joining unit JU, or may be arranged at a position away from the joining unit JU. Also, for example, the pre-alignment unit PU may be arranged directly above the joining unit JU.

[0262] In the above embodiment, the transport robot TR is provided to transfer the substrate W to the pre-alignment unit PU, but the present invention is not limited to this. For example, the center robot CR may transfer the substrate W to the pre-alignment unit PU.

[0263] In the above embodiment, the transport unit TU housing the transport robot TR is provided between the pre-alignment unit PU and the joining unit JU, but the present invention is not limited to this. For example, the pre-alignment unit PU may be disposed adjacent to the joining unit JU, and the pre-alignment unit PU or the joining unit JU may include the transport robot TR.

[0264] In the above embodiment, the detection sensor 1600 has the light emitting head 1610 and the light receiving head 1620, but the present invention is not limited to this. For example, the detection sensor 1600 may have a CCD image sensor or a CMOS image sensor. Then, the position of the substrate W held by the stage 1100 may be detected based on an image captured by the CCD image sensor or the CMOS image sensor.

[0265] In the above embodiment, the pre-alignment unit PU has the control unit 1910, but the present invention is not limited to this. For example, the control unit 91 of the substrate bonding system 1 may also function as the control unit 1910. In other words, the control unit 91 may have, for example, a displacement calculation unit and a thickness calculation unit.

[0266] In the above embodiment, an example is shown in which the substrate W is loaded into the pre-alignment unit PU (step S1 in FIG. 12) and then the holder 1310 is lifted (step S2 in FIG. 12) as an example of the operation flow of the pre-alignment unit PU and the transport unit TU, but the present invention is not limited to this. For example, the substrate W may be loaded into the pre-alignment unit PU after the holder 1310 is lifted. With this configuration, it is possible to shorten the tact time. [Industrial Applicability]

[0267] The present invention can be suitably used in a substrate thickness measuring apparatus, a substrate bonding system, and a substrate thickness measuring method. [Explanation of symbols]

[0268] 1: Substrate bonding system 10: First board holder 20: Second board holder 91: Control unit (acquisition unit) 100: First moving actuator (substrate holder actuator) 1010: Alignment housing (housing) 1011c: Opening window (window) 1100: Stage 1200: Rotary actuator 1300: Misalignment correction actuator 1310: Holder 1330: Holder movement actuator 1400: First horizontal movement actuator (horizontal movement actuator) 1500: Second horizontal movement actuator (horizontal movement actuator) 1600: Detection sensor 1710: 1st optical head (1st distance measuring sensor) 1711: First light-emitting element 1712: First light receiving element 1720: Second optical head (second distance measuring sensor) 1721: Second light-emitting element 1722: Second light receiving element 1911: Displacement calculation section 1912: Thickness calculation section 3510:Transport arm JU: Bonding unit (substrate bonding device) L1710: Optical axis L1720: Optical axis PU: Pre-alignment unit (substrate thickness measuring device) S5: Step (detecting the position of the substrate) S6: Step (process for calculating the positional deviation of the substrate) S7 to S11: Steps (steps for correcting misalignment of the substrate) S13: Step (step of calculating the thickness of the substrate along the circumferential direction) S19: Step (step of calculating the thickness of the substrate along the conveying direction) TR: Transport robot (transport actuator) W: Substrate W1: First board W2: Second board Wa: Top Wb: Bottom surface

Claims

1. a stage for holding the substrate horizontally; a detection sensor for detecting a position of the substrate held by the stage; a displacement calculation unit that calculates a positional displacement amount of the substrate with respect to the stage based on a detection result of the detection sensor; a misalignment correction actuator that corrects a positional misalignment of the substrate with respect to the stage; a rotation actuator that rotates the stage while holding the substrate; a first distance measuring sensor disposed above the substrate held by the stage and configured to measure a distance to an upper surface of the substrate; a second distance measuring sensor disposed below the substrate held by the stage and configured to measure a distance to a lower surface of the substrate; a thickness calculation unit that calculates a thickness of the substrate based on a measurement result of the first distance measuring sensor and a measurement result of the second distance measuring sensor; Equipped with the misalignment correction actuator corrects a positional misalignment of the substrate with respect to the stage by moving one of the substrate and the stage in a horizontal direction relative to the other of the substrate and the stage based on a calculation result of the misalignment calculation unit; The thickness calculation unit is calculating a thickness of the substrate along a circumferential direction based on a measurement result of the first distance measuring sensor measuring a distance to the upper surface of the substrate and a measurement result of the second distance measuring sensor measuring a distance to a lower surface of the substrate while the rotary actuator rotates the stage holding the substrate whose positional deviation has been corrected; A substrate thickness measuring device that calculates a thickness of the substrate along a transport direction that is horizontal to the stage while a transport actuator transports the substrate after position misalignment has been corrected, based on a measurement result obtained by the first distance measuring sensor measuring the distance to the top surface of the substrate and a measurement result obtained by the second distance measuring sensor measuring the distance to the bottom surface of the substrate.

2. the transport actuator transports the substrate in the transport direction such that the first distance measuring sensor and the second distance measuring sensor measure the distance along a straight line passing through a center of the substrate; 2. The substrate thickness measuring device of claim 1, wherein the thickness calculation unit calculates the thickness of the substrate along the transport direction based on a measurement result obtained by the first distance measuring sensor measuring the distance to the top surface of the substrate along a straight line passing through the center of the substrate and a measurement result obtained by the second distance measuring sensor measuring the distance to the bottom surface of the substrate along a straight line passing through the center of the substrate while the transport actuator transports the substrate in the transport direction.

3. The deviation correction actuator includes: a holder that moves in a vertical direction relative to the stage to transfer the substrate between the stage and the holder; a holder movement actuator that moves the holder in a vertical direction relative to the stage; a horizontal movement actuator that moves one of the holder and the stage in a horizontal direction relative to the other of the holder and the stage; having 2. The substrate thickness measuring device of claim 1, wherein when the holder holds the substrate by the holder movement actuator moving the holder upward relative to the stage, the horizontal movement actuator corrects positional misalignment of the substrate relative to the stage by moving one of the holder and the stage horizontally relative to the other of the holder and the stage based on the calculation result of the misalignment calculation unit.

4. The substrate thickness measuring device according to claim 1 , further comprising a housing that houses the first distance measuring sensor and the second distance measuring sensor and to which the first distance measuring sensor and the second distance measuring sensor are fixed.

5. the transport actuator is disposed outside the housing, The substrate thickness measuring device according to claim 4 , wherein the housing has a window through which a transfer arm of the transfer actuator passes.

6. the first distance measuring sensor includes a first optical head that emits a first emission light toward an upper surface of the substrate; The substrate thickness measuring device according to claim 1 , wherein the second distance measuring sensor includes a second optical head that emits a second emission light toward a lower surface of the substrate.

7. 7. The substrate thickness measuring device according to claim 6, wherein an optical axis of the second outgoing light emitted from the second optical head is coaxial with an optical axis of the first outgoing light emitted from the first optical head.

8. The first optical head includes: A first light emitting element that emits the first emitted light; a first light receiving element that receives light reflected by an upper surface of the substrate out of the first emitted light emitted from the first light emitting element; having The second optical head is A second light emitting element that emits the second emitted light; a second light receiving element that receives light reflected by a lower surface of the substrate out of the second emitted light emitted from the second light emitting element; The substrate thickness measuring device according to claim 6 .

9. The substrate thickness measuring device according to claim 1 , a substrate bonding apparatus for bonding a first substrate and a second substrate whose thickness has been measured by the substrate thickness measuring apparatus; A substrate bonding system comprising:

10. The substrate bonding apparatus includes: a first substrate holder that horizontally holds the first substrate; a second substrate holder that horizontally holds the second substrate; a substrate holder actuator that moves one of the first substrate holder and the second substrate holder in a vertical direction relative to the other of the first substrate holder and the second substrate holder; an acquisition unit that acquires a calculation result of the thickness calculation unit of the substrate thickness measuring device; Including, 10. The substrate bonding system of claim 9, wherein the substrate holder actuator moves one of the first substrate holder and the second substrate holder relative to the other of the first substrate holder and the second substrate holder so that the distance between the first substrate and the second substrate is within a predetermined range based on a calculation result of the thickness calculation unit.

11. detecting a position of a substrate held horizontally on a stage; calculating a positional deviation of the substrate relative to the stage based on a detection result of the position of the substrate; correcting a positional deviation of the substrate relative to the stage by moving one of the substrate and the stage in a horizontal direction relative to the other of the substrate and the stage based on a result of calculating the positional deviation; calculating a thickness of the substrate along a circumferential direction based on a measurement result of a first distance measuring sensor measuring a distance to an upper surface of the substrate and a measurement result of a second distance measuring sensor measuring a distance to a lower surface of the substrate while the stage holding the substrate whose positional deviation has been corrected is rotating; calculating a thickness of the substrate along the transport direction based on a measurement result of the first distance measuring sensor measuring a distance to an upper surface of the substrate and a measurement result of the second distance measuring sensor measuring a distance to a lower surface of the substrate while the substrate having undergone positional misalignment correction is transported in the transport direction that is horizontal to the stage; A method for measuring a thickness of a substrate, comprising:

Images