Manufacturing method of mounting substrate, mounting substrate, and light-emitting module

Abstract

To realize a mounting substrate having an excellent heat dissipation effect.SOLUTION: A mounting substrate includes: a mounting part that has a lower surface and a mounting surface; a first convex part that includes a first upper surface positioned upward from the mounting surface; a second convex part that includes a second upper surface that is positioned upward from the mounting surface; and an outer peripheral part in which a first penetration hole and a second penetration hole are provided, and is positioned to an outside of the mounting part. The mounting surface is positioned between the first upper surface and the second upper surface, and positioned between the first penetration hole and the second penetration hole, in top view. Both of the first penetration hole and the second penetration hole are not provided between the first upper surface and the mounting surface in top view, and the second upper surface and the mounting surface. In the lower surface, the lower surface is wrapped so as to have a shape that a point positioned just under the mounting surface is positioned downward from a virtual line connecting a point positioned just under the first upper surface and a point positioned just under the second surface.SELECTED DRAWING: Figure 17C

Description

[Technical field]

[0001] The present invention relates to a method for manufacturing a mounting board, a mounting board, and a light-emitting module. [Background technology]

[0002] International Publication WO2014 / 41936 discloses an embodiment in which a semiconductor device is attached to a heat dissipation member. The heat dissipation member suppresses a temperature rise of the semiconductor device. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] WO2014 / 41936 Summary of the Invention [Problem to be solved by the invention]

[0004] An invention is disclosed that solves the problem of realizing a mounting board on which a light emitting device is mounted, the mounting board having an excellent heat dissipation effect.

[0005] Alternatively, instead of the above-mentioned problem, an invention is disclosed that solves the problem of realizing a mounting board in which the shape of warpage is controlled.

[0006] Alternatively, instead of the above-mentioned problems, an invention is disclosed that solves the problem of realizing a mounting board in which variations in heat dissipation effect are suppressed.

[0007] In addition, this specification also discloses an invention that solves two or more of the above-mentioned problems in a composite manner. [Means for solving the problem]

[0008] A manufacturing method for a mounting board disclosed in an embodiment includes the steps of: preparing a board having a mounting portion having a mounting surface, a first convex portion having a first upper surface located above the mounting surface, and a second convex portion having a second upper surface located above the mounting surface, wherein the mounting surface is located between the first upper surface and the second upper surface in a top view; placing the board on a support member having a support surface such that the first upper surface and the second upper surface face the support surface; and providing a first through hole and a second through hole from the bottom surface side to the top surface side of the board at first and second positions that sandwich the mounting surface in a top view and that avoid the space between the first upper surface and the mounting surface and the space between the second upper surface and the mounting surface.

[0009] The mounting board disclosed in the embodiment has a lower surface, a mounting portion having a mounting surface, a first convex portion having a first upper surface located above the mounting surface, a second convex portion having a second upper surface located above the mounting surface, and an outer periphery located outside the mounting portion, in which a first through hole and a second through hole are provided, the mounting surface is located between the first upper surface and the second upper surface, and is located between the first through hole and the second through hole, in a top view, neither the first through hole nor the second through hole is provided between the first upper surface and the mounting surface, nor between the second upper surface and the mounting surface, in a top view, and the lower surface is warped in such a shape that a point directly below the mounting surface on the lower surface is located below an imaginary line segment connecting a point directly below the first upper surface and a point directly below the second upper surface.

[0010] The light emitting module disclosed in the embodiment includes the above-mentioned mounting board and a light emitting device mounted on the mounting surface.

[0011] In at least one of the one or more inventions disclosed in the embodiments, a mounting board with excellent heat dissipation effect can be realized. [Brief description of the drawings]

[0012] [Figure 1]FIG. 1 is a top view of a light emitting module according to an embodiment. [Diagram 2] FIG. 2 is a perspective view of the light emitting module in a state where it is not fixed to a heat sink according to the embodiment. [Diagram 3] FIG. 3 is a perspective view of the light emitting device according to the embodiment. [Figure 4] FIG. 4 is a side view of the light emitting device according to the embodiment. [Diagram 5] FIG. 5 is a cross-sectional view of the light emitting device taken along the line VV in FIG. [Figure 6] FIG. 6 is a perspective view showing components disposed inside the light emitting device according to the embodiment. [Figure 7] FIG. 7 is a top view showing components disposed inside the light emitting device according to the embodiment. [Figure 8] FIG. 8 is a perspective view of a package according to the embodiment. [Figure 9] FIG. 9 is a cross-sectional view of the package taken along line IX-IX in FIG. [Figure 10] FIG. 10 is a top view of the base body according to the embodiment. [Figure 11] FIG. 11 is a bottom view of the base body according to the embodiment. [Figure 12] FIG. 12 is a cross-sectional view of the base body taken along the line XII-XII in FIG. [Figure 13] FIG. 13 is a top view of the state in which the light emitting element and the protective element are arranged on the submount. [Figure 14] FIG. 14 is a side view of the state in which the light emitting element and the protective element are arranged on the submount. [Figure 15] FIG. 15 is a top view of the wiring board according to the embodiment. [Figure 16] 16 is a cross-sectional view of the wiring board taken along line XVI-XVI in FIG. [Figure 17A] FIG. 17A is a cross-sectional view for explaining a first step in the method for manufacturing a wiring board according to an embodiment. [Figure 17B]FIG. 17B is a cross-sectional view for explaining a second step in the method for manufacturing the wiring board according to the embodiment. [Figure 17C] FIG. 17C is a cross-sectional view for explaining a third step in the method for manufacturing a wiring board according to the embodiment. [Figure 18A] FIG. 18A is a cross-sectional view illustrating a fourth step in the method for manufacturing a substrate according to an embodiment. [Figure 18B] FIG. 18B is a cross-sectional view illustrating a fifth step in the method for manufacturing a substrate according to the embodiment. [Figure 18C] FIG. 18C is a cross-sectional view illustrating a sixth step in the method for manufacturing a substrate according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] In this specification and claims, polygons such as triangles and quadrangles are referred to as polygons, including shapes in which the corners of the polygons have been processed by rounding, chamfering, removing corners, rounding, etc. Furthermore, shapes in which processing has been applied not only to the corners (edges of the sides) but also to the middle parts of the sides are also referred to as polygons. In other words, shapes in which partial processing has been applied while leaving the polygon as the base are included in the interpretation of "polygon" described in this specification and claims.

[0014] This is not limited to polygons, but also applies to words expressing specific shapes such as trapezoids, circles, and irregular shapes. The same is true when dealing with each side that forms the shape. In other words, even if the corners or middle part of a side have been processed, the interpretation of "side" includes the processed part. Note that when distinguishing a "polygon" or "side" that has no processing from a processed shape, the word "strict" is added, for example, "strict quadrangle."

[0015] In addition, in this specification or the claims, descriptions such as up and down (upper / lower), left and right, front and back, front and back (front / rear), front and back, etc., merely describe relationships such as relative positions, orientations, and directions, and do not necessarily correspond to the relationships during use.

[0016] In addition, directions such as the X direction, the Y direction, and the Z direction may be indicated by using arrows in the drawings. The directions of these arrows are consistent among multiple drawings relating to the same embodiment. In addition, the direction of the arrows marked with X, Y, and Z in the drawings is the positive direction, and the opposite direction is the negative direction. For example, the direction marked with X at the tip of the arrow is the X direction and the positive direction. In this specification, the direction that is the X direction and the positive direction is referred to as the "positive X direction", and the opposite direction is referred to as the "negative X direction". When referring to the "X direction", it includes both the positive and negative directions. The same applies to the Y and Z directions.

[0017] In addition, in this specification, when an object is specified as "one or more" and the object is described, both the form in which the object is one and the form in which the object is multiple are described together. Thus, the description specifying "one or more" supports any of the following embodiments: an embodiment with one or more objects, an embodiment with at least one object, and an embodiment with multiple objects.

[0018] In addition, in this specification, the description of the "one or each" object is a description that combines a description of one object in an embodiment having one object, a description of one object in an embodiment having multiple objects, and a description of each of the objects in an embodiment having multiple objects. Therefore, the description of the "one or each" object supports all of the following: in an embodiment having one object, this one object has explanatory content; in an embodiment having multiple objects, at least one of these objects has explanatory content; in an embodiment having multiple objects, each of these multiple objects has explanatory content; and in an embodiment having one or multiple objects, all of the objects have explanatory content.

[0019] Furthermore, in this specification, the terms "component" and "part" may be used when explaining components, for example. A "component" refers to an object that is physically handled as a single unit. An object that is physically handled as a single unit can also be said to be an object that is handled as a single part in the manufacturing process. On the other hand, a "part" refers to an object that does not need to be physically handled as a single unit. For example, a "part" is used when referring to a portion of a single component, or when referring to multiple components collectively as a single object.

[0020] The distinction between "component" and "part" above does not indicate any intention to consciously limit the scope of the right in the interpretation of the doctrine of equivalents. In other words, even if there is a component described as a "component" in the scope of the patent claim, this does not mean that the applicant recognizes that treating this component as a single physical unit is essential for the application of the present invention.

[0021] In addition, in this specification or claims, when there are multiple elements of a certain type and each element needs to be expressed separately, the elements may be distinguished by adding "first" or "second" to the beginning of the element. In addition, the objects to be distinguished may differ between this specification and the claims. Therefore, even if the claims describe an element with the same notation as this specification, the object identified by this element may not be the same between this specification and the claims.

[0022] For example, if there are elements in this specification that are distinguished by the notation "first," "second," and "third," and the elements to which "first" and "third" are attached in this specification are described in the claims, the elements may be distinguished by the notation "first" and "second" in the claims from the viewpoint of readability. In this case, the elements to which "first" and "second" are attached in the claims refer to the elements to which "first" and "third" are attached in this specification, respectively. Note that this rule is not limited to elements, and can be applied rationally and flexibly to other objects as well.

[0023] Hereinafter, the embodiment for carrying out the present invention will be described. Furthermore, a specific embodiment for carrying out the present invention will be described with reference to the drawings. Note that the embodiment for carrying out the present invention is not limited to this specific embodiment. In other words, the illustrated embodiment is not the only embodiment in which the present invention can be realized. Note that the size and positional relationship of the members shown in each drawing may be exaggerated for ease of understanding.

[0024] First Embodiment A light emitting device 1 according to a first embodiment will be described. FIGS. 1 to 18C are diagrams for explaining an exemplary embodiment of a light emitting module 901. FIG. 1 is a top view of the light emitting module 901. FIG. 2 is a perspective view of the light emitting module 901 in a state where it is not fixed to a heat sink 401. FIG. 3 is a perspective view of the light emitting device 1. FIG. 4 is a side view of the light emitting device 1. FIG. 5 is a cross-sectional view of the light emitting device 1 taken along the VV cross-sectional line in FIG. 3. FIG. 6 is a perspective view showing components disposed inside the light emitting device 1. FIG. 7 is a top view showing components disposed inside the light emitting device 1. Note that the wiring 60 shown in FIG. 6 is omitted in FIG. 7. FIG. 8 is a perspective view of the package 10. FIG. 9 is a cross-sectional view of the package 10 taken along the IX-IX cross-sectional line in FIG. 8. FIG. 10 is a top view of the base 11. FIG. 11 is a bottom view of the base 11. FIG. 12 is a cross-sectional view of the base 11 taken along the XII-XII cross-sectional line in FIG. 10. FIG. 13 is a top view of the state in which the light emitting element 20 and the protective element 50 are arranged on the submount 30. FIG. 14 is a side view of the state in which the light emitting element 20 and the protective element 50 are arranged on the submount 30. FIG. 15 is a top view of the wiring board 101. FIG. 16 is a cross-sectional view of the wiring board 101 taken along the XVI-XVI cross-sectional line in FIG. 15. FIGS. 17A to 17C are cross-sectional views for explaining each step in the manufacturing method of the wiring board 101. Note that each cross-sectional view is taken along the position corresponding to the XVIIA-XVIIA cross-sectional line in FIG. 15. FIGS. 18A to 18C are cross-sectional views for explaining each step in the manufacturing method of the substrate 9. Note that each cross-sectional view is taken along the position corresponding to the XVI-XVI cross-sectional line in FIG. 15.

[0025] The light emitting module 901 includes a plurality of components, including one or a plurality of light emitting devices 1, a wiring board 101, a connector 201, a thermistor 301, a heat sink 401, and one or a plurality of fixing members 501.

[0026] The light-emitting module 901 may include other components. For example, the light-emitting module 901 may include a light-emitting device different from the light-emitting device 1. The light-emitting module 901 may not include some of the components listed here.

[0027] The light emitting device 1 includes a plurality of components, including a package 10, one or more light emitting elements 20, one or more submounts 30, one or more reflective members 40, one or more protective elements 50, a plurality of wirings 60, and an optical member 70.

[0028] The light emitting device 1 may include other components. For example, the light emitting device 1 may include further light emitting elements in addition to the one or more light emitting elements 20. The light emitting device 1 may not include some of the components listed here.

[0029] First, each component will be described.

[0030] (Package 10) The package 10 includes a base 11 and a lid 14. The lid 14 is joined to the base 11 to form the package 10. An internal space is defined in the package 10 in which other components are disposed. This internal space is a closed space surrounded by the base 11 and the lid 14. In addition, this internal space can be a space sealed in a vacuum or airtight state.

[0031] When viewed from above, the outer edge shape of the package 10 is rectangular. This rectangle can be a rectangle having a long side and a short side. In the illustrated package 10, the long side direction of this rectangle is the same as the X direction, and the short side direction is the same as the Y direction. Note that when viewed from above, the outer edge shape of the package 10 does not have to be rectangular.

[0032] In the package 10, an internal space is formed in which other components are disposed. The first upper surface 11A of the package 10 is a part of an area that defines the internal space. In addition, each of the inner side surfaces 11E and the lower surface 14B of the package 10 is also a part of an area that defines the internal space.

[0033] The base 11 has a first upper surface 11A and a lower surface 11B. The base 11 has a second upper surface 11C. The base 11 has one or more outer surfaces 11D. The base 11 has one or more inner surfaces 11E. The one or more outer surfaces 11D intersect with the second upper surface 11C. The one or more outer surfaces 11D intersect with the lower surface 11B. The one or more inner surfaces 11E intersect with the second upper surface 11C.

[0034] When viewed from above, the outer edge shape of base 11 is rectangular. When viewed from above, the outer edge shape of base 11 is the outer edge shape of package 10. When viewed from above, the outer edge shape of first top surface 11A is rectangular. This rectangle can be a rectangle having long sides and short sides. The long side direction of first top surface 11A and the long side direction of the outer edge shape of base 11 are parallel. Note that when viewed from above, the outer edge shape of first top surface 11A does not have to be rectangular.

[0035] In top view, first top surface 11A is surrounded by second top surface 11C. Second top surface 11C is an annular surface surrounding first top surface 11A in top view. Second top surface 11C is a rectangular annular surface. Here, the frame defined by the inner edge of second top surface 11C is referred to as the inner frame of second top surface 11C, and the frame defined by the outer edge of second top surface 11C is referred to as the outer frame of second top surface 11C.

[0036] The base 11 has a recess surrounded by a frame by the second top surface 11C. The recess defines a portion of the base 11 that is recessed below the second top surface 11C. The first top surface 11A is a part of the recess. The one or more inner surfaces 11E are a part of the recess. The second top surface 11C is located above the first top surface 11A.

[0037] The base 11 has one or more step portions 11F. The step portion 11F has an upper surface 11G and a side surface 11H that intersects with the upper surface 11G and extends downward from the upper surface 11G. Here, one step portion 11F has only one upper surface 11G and one side surface 11H. The upper surface 11G intersects with the inner surface 11E. The side surface 11H intersects with the first upper surface 11A.

[0038] The or each step portion 11F is provided inside the inner frame of the second top surface 11C in top view. The or each step portion 11F is formed along a part or all of the inner side surface 11E in top view. In the base 11, the side surface 11H is an inner side surface, but the side surface 11H and the inner side surface 11E are different surfaces. The or each inner side surface 11E and the or each side surface 11H are perpendicular to the first top surface 11A. Here, the perpendicular allows a difference of ±3 degrees.

[0039] The one or more step portions 11F may include a first step portion 11F1 and a second step portion 11F2. The first step portion 11F1 and the second step portion 11F2 are provided at positions where their respective side surfaces 11H face each other. The first step portion 11F1 and the second step portion 11F2 are provided on the short side of the inner frame of the second upper surface 11C.

[0040] The base 11 has a base portion 11M and a frame portion 11N. The base portion 11M and the frame portion 11N may be members made of different materials. The base 11 may be configured to include a base member corresponding to the base portion 11M and a frame member corresponding to the frame portion 11N.

[0041] The base 11M includes a first upper surface 11A. The frame 11N includes a second upper surface 11C. The frame 11N includes one or more outer surfaces 11D and one or more inner surfaces 11E. The frame 11N includes one or more step portions 11F.

[0042] The lower surface of base 11M constitutes a part or the entire area of ​​lower surface 11B of base 11. When the lower surface of base 11M constitutes a part of the area of ​​lower surface 11B of base 11, the lower surface of frame 11N constitutes the remaining area of ​​lower surface 11B of the base.

[0043] The base 11 has a plurality of wiring portions 12A. The plurality of wiring portions 12A include one or more first wiring portions 12A1 disposed in the internal space of the package 10 and one or more second wiring portions 12A2 provided on the outer surface of the package 10.

[0044] The or each first wiring portion 12A1 is provided on the upper surface 11G of the step portion 11F. The base 11 has one or more first wiring portions 12A1 provided on the upper surface 11G of the first step portion 11F1. The base 11 has one or more first wiring portions 12A1 provided on the upper surface 11G of the second step portion 11F2.

[0045] The or each second wiring portion 12A2 is provided on the bottom surface 11B of the package 10. The or each second wiring portion 12A2 is provided on the bottom surface of the frame portion 11N. Note that the second wiring portion 12A2 may be provided on an outer surface of the package 10 different from the bottom surface 11B.

[0046] When viewed from above, the base 11 has one or more second wiring portions 12A2 provided on the lower surface 11B of the base 11 in the region that includes the upper surface 11G of the first step portion 11F1 when the base 11 is divided into two regions by a virtual line passing through the side surface 11H of the first step portion 11F1 and parallel to this side surface 11H.

[0047] When viewed from above, the base 11 has one or more second wiring portions 12A2 provided on the lower surface 11B of the base 11 in the region that includes the upper surface 11G of the second step portion 11F2 when the base 11 is divided into two regions by a virtual line that passes through the side surface 11H of the second step portion 11F2 and is parallel to this side surface 11H.

[0048] In the base 11, one or each of the first wiring portions 12A1 is electrically connected to the second wiring portion 12A2. One or more of the first wiring portions 12A1 are electrically connected to different second wiring portions 12A2.

[0049] The base 11 has a bonding pattern 13A. The bonding pattern 13A is provided on the second upper surface 11C. The bonding pattern 13A is provided in an annular shape. The bonding pattern 13A is provided in a rectangular annular shape. In a top view, the first upper surface 11A is surrounded by the bonding pattern 13A.

[0050] The base 11 can be formed, for example, using ceramic as the main material. Examples of the ceramic that is the main material of the base 11 include aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide.

[0051] Here, the main material refers to the material that occupies the largest proportion of the mass or volume of the target structure. Note that when the target structure is formed from one material, that material is the main material. In other words, when a material is the main material, it includes the possibility that the proportion of that material can be 100%.

[0052] The base 11 may be formed using a base member and a frame member formed using different main materials. The base member may be formed using, for example, a material having excellent heat dissipation properties, such as a metal or a metal-containing composite, graphite, or diamond, as the main material. Examples of metals that are the main material of the base member include copper, aluminum, and iron. Examples of metal-containing composites that are the main material of the base member include copper molybdenum and copper tungsten. The frame member may be formed using, for example, the ceramics listed above as the main material of the base 11 as the main material.

[0053] The wiring portion 12A can be formed, for example, by using a metal material as a main material. Examples of the metal material that is the main material of the wiring portion 12A include simple metals such as Cu, Ag, Ni, Au, Ti, Pt, Pd, Cr, and W, and alloys containing these metals. The wiring portion 12A can be composed of, for example, one or more metal layers.

[0054] The bonding pattern 13A can be formed, for example, by using a metal material as a main material. Examples of the metal material that is the main material of the bonding pattern 13A include simple metals such as Cu, Ag, Ni, Au, Sn, Ti, and Pd, and alloys containing these metals. The bonding pattern 13A can be formed, for example, by one or more metal layers.

[0055] The lid body 14 has an upper surface 14A and a lower surface 14B. The lid body 14 also has one or more side surfaces 14C. The lid body 14 is configured in a rectangular parallelepiped flat plate shape. The shape of the lid body 14 does not have to be a rectangular parallelepiped.

[0056] The lid 14 is bonded to the base 11. The lower surface 14B of the lid 14 is bonded to the second upper surface 11C of the base 11. The lid 14 is bonded to the bonding pattern 13A of the base 11. The lid 14 is bonded to the base 11 via an adhesive.

[0057] The lid body 14 has a translucency that transmits light. Here, translucency means that the transmittance of light incident on the lid body 14 is 80% or more. The lid body 14 may have a non-translucent region (a region that does not have translucency) in part.

[0058] The cover 14 can be formed, for example, using glass as a main material, or can be formed, for example, using sapphire as a main material.

[0059] (Light emitting element 20) The light-emitting element 20 has an upper surface 21A, a lower surface 21B, and multiple side surfaces 21C. The shape of the upper surface 21A is rectangular. This rectangle has long sides and short sides. The outer shape of the light-emitting element 20 when viewed from above is rectangular. This rectangle has long sides and short sides. Note that the shape of the upper surface 21A and the outer shape of the light-emitting element 20 when viewed from above are not limited to this.

[0060] The light-emitting element 20 has a light emitting surface 22 that emits light. For example, the side surface 21C can be the light emitting surface 22. The side surface 21C that becomes the light emitting surface 22 intersects with a short side of the top surface 21A. Alternatively, for example, the top surface 21A can be the light emitting surface 22. The light-emitting element 20 has one or more light emitting surfaces 22.

[0061] For example, a light emitting element that emits blue light can be used as the light emitting element 20. Also, for example, a light emitting element that emits green light can be used as the light emitting element 20. Also, for example, a light emitting element that emits red light can be used as the light emitting element 20. Note that a light emitting element that emits light of other colors or wavelengths may also be used as the light emitting element 20.

[0062] Here, blue light refers to light whose emission peak wavelength is in the range of 420nm to 494nm, green light refers to light whose emission peak wavelength is in the range of 495nm to 570nm, and red light refers to light whose emission peak wavelength is in the range of 605nm to 750nm.

[0063] The light emitting element 20 that emits blue light or the light emitting element 20 that emits green light may be a light emitting element containing a nitride semiconductor. For example, a GaN-based semiconductor such as GaN, InGaN, or AlGaN may be used as the nitride semiconductor. The light emitting element 20 that emits red light may be a light emitting element containing an InAlGaP-based, GaInP-based, or GaAs-based semiconductor such as GaAs or AlGaAs.

[0064] For example, a semiconductor laser element can be used as the light emitting element 20. A single-emitter semiconductor laser element having one emitter can be used as the light emitting element 20. A multi-emitter semiconductor laser element having multiple emitters can be used as the light emitting element 20. Note that the light emitting element 20 is not limited to a semiconductor laser element, and a light emitting diode or the like may also be used.

[0065] Here, a semiconductor laser element, which is an example of the light emitting element 20, will be described.

[0066] The semiconductor laser element emits directional laser light. Diverging light with a spread is emitted from the light emission surface 22 of the semiconductor laser element. The light emitted from the semiconductor laser element forms an elliptical far-field pattern (hereinafter referred to as "FFP") on a plane parallel to the light emission surface 22. The FFP refers to the shape and light intensity distribution of the emitted light at a position away from the light emission surface of the semiconductor laser element.

[0067] Here, the light passing through the center of the elliptical shape of the FFP, in other words, the light with the peak intensity in the light intensity distribution of the FFP, is called the light traveling along the optical axis or the light passing through the optical axis. Also, in the light intensity distribution of the FFP, the peak intensity value is 1 / e 2 The light having an intensity equal to or greater than this will be referred to as the main portion of the light.

[0068] The shape of the FFP of the light emitted from the semiconductor laser element is an ellipse in which the stacking direction is longer than the direction perpendicular to the stacking direction on a plane parallel to the light emitting surface 22. The stacking direction is the direction in which multiple semiconductor layers including the active layer are stacked in the semiconductor laser element. The direction perpendicular to the stacking direction can also be called the in-plane direction of the semiconductor layers. The long axis direction of the elliptical shape of the FFP can also be called the fast axis direction of the semiconductor laser element, and the short axis direction can also be called the slow axis direction of the semiconductor laser element.

[0069] Based on the light intensity distribution of FFP, the peak light intensity is 1 / e 2 The angle at which the light of the semiconductor laser element spreads is defined as the spread angle of the light. Here, the spread angle of the light is the angle between the light of the peak light intensity (light passing through the optical axis) and 1 / e of the peak light intensity. 2 The spread angle of light is expressed as the angle between the light with a peak light intensity of 1 / e 2 In addition to the light intensity at half the peak light intensity, the light intensity may also be calculated from the light intensity at half the peak light intensity. 2 This refers to the spread angle of light at a light intensity of

[0070] The divergence angle of the light emitted from the semiconductor laser element in the fast axis direction can be equal to or greater than 20 degrees and less than 80 degrees. The divergence angle of this light in the slow axis direction can be greater than 0 degrees and equal to or less than 20 degrees. The divergence angle of this light in the fast axis direction is greater than the divergence angle of the light in the slow axis direction.

[0071] For example, the spread angle in the fast axis direction of blue light emitted from the semiconductor laser element can be 30 degrees or more and less than 60 degrees, and the spread angle in the slow axis direction can be 5 degrees or more and less than 20 degrees. For example, the spread angle in the fast axis direction of green light emitted from the semiconductor laser element can be 30 degrees or more and less than 60 degrees, and the spread angle in the slow axis direction can be 5 degrees or more and less than 20 degrees. For example, the spread angle in the fast axis direction of red light emitted from the semiconductor laser element can be 40 degrees or more and less than 80 degrees, and the spread angle in the slow axis direction can be 5 degrees or more and less than 20 degrees.

[0072] (Submount 30) The submount 30 has an upper surface 31A, a lower surface 31B, and one or more side surfaces 31C. The upper surface 31A can be said to be a mounting surface on which other components are mounted. The shape of the upper surface 31A is rectangular. This rectangle of the upper surface 31A can have short sides and long sides. It should be noted that the shape of the upper surface 31A does not have to be rectangular.

[0073] The outer shape of the submount 30 when viewed from above is rectangular. This rectangle of the submount 30 may have a short side and a long side. It should be noted that the outer shape of the submount 30 when viewed from above does not have to be rectangular. The submount 30 may have an outer shape in which the length in one direction (hereinafter, this direction will be referred to as the short side direction of the submount 30) when viewed from above is smaller than the length in the direction perpendicular to the short side direction (hereinafter, this direction will be referred to as the long side direction of the submount 30). In the illustrated submount 30, the short side direction is the same as the X direction, and the long side direction is the same as the Y direction.

[0074] The submount 30 may be configured to include a substrate 32A and an upper metal member 32B. The submount 30 may further be configured to include a lower metal member 32C. The upper metal member 32B is provided on the upper surface side of the substrate 32A. The lower metal member 32C is provided on the lower surface side of the substrate 32A. The submount 30 further includes a wiring layer 33. The wiring layer 33 is provided on the upper metal member 32B.

[0075] The substrate 32A has insulating properties. The substrate 32A is made of, for example, silicon nitride, aluminum nitride, or silicon carbide. It is preferable to select ceramic, which has relatively good heat dissipation properties (high thermal conductivity), as the main material of the substrate 32A.

[0076] The upper metal member 32B is mainly made of a metal such as copper or aluminum. The upper metal member 32B has one or more metal layers. The upper metal member 32B may have multiple metal layers made of different metals as main materials.

[0077] The lower metal member 32C is mainly made of a metal such as copper or aluminum. The lower metal member 32C has one or more metal layers. The lower metal member 32C may have multiple metal layers made of different metals as main materials.

[0078] The wiring layer 33 can be formed using a metal. For example, the wiring layer 33 can be formed using AuSn solder (a metal layer of AuSn).

[0079] For example, the length of the short side or lateral direction of the submount 30 is 300 μm or more and 2000 μm or less. The length of the long side or longitudinal direction of the submount 30 is 500 μm or more and 10000 μm or less. The difference between the length of the long side and the length of the lateral direction of the submount 30 is 200 μm or more and 9000 μm or less.

[0080] For example, the thickness of the submount 30 (width in a direction perpendicular to the upper surface 31A) is 100 μm or more and 500 μm or less. Also, for example, the thickness of the substrate 32A is 100 μm or more and 400 μm or less. Also, for example, the thickness of the upper metal member 32B is 20 μm or more and 200 μm or less. Also, for example, the thickness of the lower metal member 32C is 20 μm or more and 200 μm or less. Also, for example, the thickness of the wiring layer 33 is 0.1 μm or more and 5 μm or less.

[0081] (Reflective member 40) The reflecting member 40 has a lower surface 41A and a light reflecting surface 41B that reflects light. The light reflecting surface 41B is inclined with respect to the lower surface 41A. A straight line connecting the lower end and the upper end of the light reflecting surface 41B is inclined with respect to the lower surface 41A. The angle at which the light reflecting surface 41B is inclined with respect to the lower surface 41A is referred to as the inclination angle of the light reflecting surface 41B.

[0082] The light reflecting surface 41B is a flat surface. The light reflecting surface 41B may be a curved surface. The inclination angle of the light reflecting surface 41B is 45 degrees. The inclination angle of the light reflecting surface 41B does not have to be 45 degrees.

[0083] The main material of the reflective member 40 may be glass, metal, or the like. It is preferable to use a heat-resistant material as the main material of the reflective member 40. The main material may be, for example, glass such as quartz or BK7 (borosilicate glass), or metal such as Al. The reflective member 40 may also be formed using Si as the main material.

[0084] If the main material is a reflective material such as Al, the light reflecting surface 41B can be formed from the main material. Instead of forming the light reflecting surface 41B from the main material, the general shape of the reflecting member 40 may be formed from the main material, and the light reflecting surface 41B may be formed on the surface of the general shape. In this case, the light reflecting surface 41B can be formed using, for example, a metal layer such as Ag or Al, or a dielectric multilayer film such as Ta2O5 / SiO2, TiO2 / SiO2, or Nb2O5 / SiO2.

[0085] The light reflecting surface 41B has a reflectance of 90% or more for the peak wavelength of light irradiated onto the light reflecting surface 41B. This reflectance may be 95% or more. This reflectance can also be 99% or more. The light reflectance is 100% or less or less than 100%.

[0086] (Protection element 50) The protection element 50 has an upper surface 51A, a lower surface 51B, and one or more side surfaces 51C. The shape of the protection element 50 is a rectangular parallelepiped. Note that the shape of the protection element 50 does not have to be a rectangular parallelepiped.

[0087] The protective element 50 is intended to prevent an excessive current from flowing through a specific element (such as a semiconductor laser element) and causing the element to be destroyed. An example of the protective element 50 is a Zener diode. The Zener diode may be made of Si.

[0088] (Wiring 60) The wiring 60 is a linear conductive material with joints at both ends. The joints at both ends become joints with other components. The wiring 60 is used for electrical connection between two components. The wiring 60 is, for example, a metal wire. Examples of metals that can be used include gold, aluminum, silver, and copper.

[0089] (Optical member 70) The optical member 70 has an upper surface 71A, a lower surface 71B, and one or more side surfaces 71C. The optical member 70 provides an optical effect to light incident on the optical member 70. Examples of the optical effects provided to light by the optical member 70 include light collection, collimation, diffusion, polarization, diffraction, wave combining, light guiding, reflection, and wavelength conversion.

[0090] The optical member 70 has an optically active surface that provides an optical effect. The upper surface 71A, the lower surface 71B, or the side surface 71C can be the optically active surface. Alternatively, the optically active surface may be located at a position different from the upper surface 71A, the lower surface 71B, or the side surface 71C. For example, the optically active surface may be formed inside the optical member 70, rather than on the surface thereof.

[0091] The optical member 70 may have one or more lens surfaces 71D. The lens surface 71D is an optically active surface of the optical member 70. The optical member 70 having the lens surface 71D may be called a lens member. The optical member 70 provides the optical effect of focusing, diffusing, or collimating the light that passes through the lens surface 71D and is emitted from the optical member 70. For example, the optical member 70 is a collimating lens that converts the light that is incident on the optical member 70 into collimated light and emits it.

[0092] One or each lens surface 71D is provided on the upper surface 71A side. Alternatively, lens surface 71D may be provided on the lower surface 71B side. Upper surface 71A and lower surface 71B are flat surfaces. One or each lens surface 71D intersects with upper surface 71A. In top view, one or each lens surface 71D is surrounded by upper surface 71A.

[0093] When viewed from above, the outer shape of the optical member 70 is rectangular. However, the outer shape of the optical member 70 when viewed from above does not have to be rectangular. The lower surface 71B is flat. No lens surface 71D is formed on the lower surface 71B side of the optical member 70. The shape of the lower surface 71B is rectangular. However, the shape of the lower surface 71B does not have to be rectangular.

[0094] In optical member 70, a portion overlapping with lens surface 71D in a top view is defined as lens portion 72A. In optical member 70, a portion overlapping with top surface 71A in a top view is defined as non-lens portion 72B. Bottom surface 71B has a region that forms the bottom surface of one or each lens portion 72A, and a region that forms the bottom surface of non-lens portion 72B.

[0095] The optical member 70 may have a plurality of lens surfaces 71D formed in a line in one direction. The direction in which the plurality of lens surfaces 71D are arranged in a top view is referred to as the lens connection direction. In the illustrated optical member 70, the connection direction is the same as the X direction.

[0096] The lens surfaces 71D are formed such that the vertices of the lens surfaces 71D are aligned in a straight line. This imaginary line connecting the vertices is parallel to the lower surface 71B of the optical member 70. Note that "parallel" here includes a difference of ±5 degrees or less.

[0097] The curvature of two or more lens surfaces 71D, which may be part or all of the multiple lens surfaces 71D, may be the same. All of the multiple lens surfaces 71D may have the same curvature.

[0098] The optical member 70 is translucent. The optical member 70 has a transmittance of 80% or more for the peak wavelength of light incident on the optical member 70. The optical member 70 may have a region having translucency and a region not having translucency (hereinafter referred to as a non-translucent region). In the non-translucent region, the transmittance for the peak wavelength of light incident on the optical member 70 is 50% or less. The optical member 70 can be formed using glass such as BK7.

[0099] (wiring board 101) Wiring board 101 has an upper surface 101A, a lower surface 101B, and one or more side surfaces 101C. Wiring board 101 has a plate-like shape. When viewed from above, the outer edge shape of wiring board 101 is rectangular. This rectangle can have long sides and short sides. In the illustrated package 10, the short side direction of this rectangle is the same as the X direction, and the long side direction is the same as the Y direction.

[0100] The wiring board 101 has a heat dissipation section 101D, an electrode section 101E, and an insulating section 101F. The heat dissipation section 101D functions as a heat dissipation path for heat generated from other components mounted on the wiring board 101. The heat dissipation section 101D can be said to be a mounting section having one or more mounting surfaces on which other components are mounted. The electrode section 101E is electrically connected to the other components mounted on the wiring board 101.

[0101] Insulating portion 101F insulates heat dissipation portion 101D from electrode portion 101E. Insulating portion 101F is provided on wiring board 101 to insulate heat dissipation portion 101D from electrode portion 101E from each other electrically.

[0102] Top surface 101A of wiring board 101 includes an area that will become one or more mounting surfaces for heat dissipation portion 101D, an area that will become the top surface of electrode portion 101E, and an area that will become the top surface of insulating portion 101F. The top surface of insulating portion 101F is located higher than the top surface of heat dissipation portion 101D. The top surface of insulating portion 101F is located higher than the top surface of electrode portion 101E.

[0103] Here, the term "thickness" of wiring board 101 refers to the width in the vertical direction from lower surface 101B to upper surface 101A. In the illustrated wiring board 101, the vertical direction is the same as the Z direction.

[0104] The thickness of wiring board 101 in a region of upper surface 101A that will become one or more mounting surfaces of heat dissipation portion 101D is smaller than the thickness of wiring board 101 in a region that will become the upper surface of insulating portion 101F. The thickness of wiring board 101 in a region of upper surface 101A that will become the upper surface of electrode portion 101E is smaller than the thickness of wiring board 101 in a region that will become the upper surface of insulating portion 101F.

[0105] When upper surface 101A is divided into three regions by two imaginary straight lines parallel to the short side direction, which divide the width of wiring board 101 in the long side direction into thirds in top view, at least a part of one or more mounting surfaces of heat dissipation section 101D is arranged in the middle region. Also, of the three regions, the area of ​​one or more mounting surfaces arranged in the middle region is the largest.

[0106] The insulating section 101F has a protruding section 101M that protrudes upward from the mounting surface of the heat dissipation section 101D. The protruding section 101M has an upper surface located above the mounting surface. The wiring board 101 may be provided with one or more protruding sections 101M such that, in a top view, two regions sandwiching the one or more mounting surfaces have upper surfaces located above the one or more mounting surfaces.

[0107] The wiring board 101 has a first convex portion 101M1 having a first upper surface located above the mounting surface, and a second convex portion 101M2 having a second upper surface located above the mounting surface, and one or more mounting surfaces are located between the first upper surface and the second upper surface when viewed from above.

[0108] The convex portion 101M surrounds the mounting surface of the heat dissipation portion 101D in a top view. In a top view, the mounting surface is surrounded by the upper surface of the convex portion 101M, which is located above the mounting surface, and is located inside this upper surface. The convex portion 101M surrounding the mounting surface of the heat dissipation portion 101D in a top view can be configured as a single, continuously connected convex portion. By configuring it as a single connected convex portion, the first upper surface 101A1 and the second upper surface 101A2 can be provided on the same plane.

[0109] The wiring board 101 may have a plurality of protruding portions 101M spaced apart from one another. In other words, the first protruding portion 101M1 and the second protruding portion 101M2 may be spaced apart from one another, or may be parts of a single protruding portion 101M that is connected to one another. In the illustrated wiring board 101, the first protruding portion 101M1 and the second protruding portion 101M2 are parts of a single protruding portion 101M that surrounds the mounting surface when viewed from above.

[0110] In the illustrated wiring board 101, for example, two portions sandwiching one or more mounting surfaces in the Y direction when viewed from above can be defined as a first convex portion 101M1 and a second convex portion 101M2. Also, for example, two portions sandwiching the mounting surface in the X direction when viewed from above can be defined as a first convex portion 101M1 and a second convex portion 101M2.

[0111] The upper surface of the protrusion 101M is located above the mounting surface of the heat dissipation section 101D by a distance in the range of 20 μm to 100 μm. In addition, the upper surface of the protrusion 101M is preferably located above the mounting surface of the heat dissipation section 101D by a distance in the range of 20 μm to 50 μm. By positioning the upper surface of the protrusion 101M above the mounting surface, it is possible to assist in the formation of a warp in the wiring board 101, which will be described later. In addition, by setting the difference in the vertical direction between the upper surface of the protrusion 101M and the mounting surface to 50 μm or less, it is possible to suppress the influence of the upper surface of the protrusion 101M when mounting other components on the mounting surface.

[0112] The wiring board 101 includes a heat dissipation member 111, a plurality of electrode members 121, and one or a plurality of insulating members 131. The heat dissipation section 101D includes the heat dissipation member 111, the electrode section 101E includes the plurality of electrode members 121, and the insulating section 101F includes one or a plurality of insulating members 131.

[0113] The wiring board 101 includes one or more metal layers 141. The one or more metal layers 141 include one or more first metal layers 141A included in the heat dissipation portion 101D and one or more second metal layers 141B included in the electrode portion 101E.

[0114] The wiring board 101 is provided with one or more through holes 101H. The one or more through holes 101H include a through hole 101H for fixing the wiring board 101 to another member (constituent element). For example, a screw is fitted into the through hole 101H to fix the wiring board 101 to the other member. The one or more through holes 101H include a through hole 101H used to determine a position when fixing the wiring board 101 to the other member.

[0115] One or more through holes 101H are holes provided in the vertical direction from upper surface 101A to lower surface 101B of wiring board 101. In wiring board 101, one or more through holes 101H are provided in an outer periphery located outside one or more mounting surfaces of heat dissipation section 101D in a top view.

[0116] The one or more through holes 101H include a first through hole 101H1 and a second through hole. The first through hole 101H1 is provided at a first position P1 on the upper surface 101A in a top view. The second through hole 101H2 is provided at a second position P2 on the upper surface 101A in a top view.

[0117] In top view, one or more mounting surfaces of the heat dissipation unit 101D are located between the first through hole 101H1 and the second through hole 101H2. In top view, the one or more mounting surfaces are sandwiched between a first position P1 and a second position P2. In top view, an imaginary line passing through the first through hole 101H1 and the second through hole 101H2 passes through the one or more mounting surfaces. In top view, an imaginary line segment connecting the first position P1 and the second position P2 passes through the one or more mounting surfaces.

[0118] In top view, the first position P1 and the second position P2 are positioned to avoid a space between the protruding portion 101M and the mounting surface. In other words, neither the first through hole 101H1 nor the second through hole 101H2 is provided between the upper surface of the protruding portion 101M and the mounting surface in top view.

[0119] In top view, the first position P1 and the second position P2 are positions that avoid the gap between the first upper surface 101A1 and the mounting surface, and also avoid the gap between the second upper surface 101A2 and the mounting surface. In top view, the first through hole 101H1 and the second through hole 101H2 are not provided between the first upper surface 101A1 and the mounting surface of the heat dissipation unit 101D, and are not provided between the second upper surface 101A2 and the mounting surface.

[0120] When viewed from above, when the upper surface 101A is divided into three regions by two imaginary straight lines parallel to the short side direction, which divide the width of the long side direction of the wiring board 101 into thirds, a first through hole 101H1 is provided in one of the end regions, and a second through hole 101H2 is provided in the other end region.

[0121] In top view, the first through hole 101H1 and the second through hole 101H2 are provided at positions sandwiching one or more mounting surfaces of the heat dissipation unit 101D in the first direction, and the first convex portion 101M1 and the second convex portion 101M2 can be provided at positions sandwiching one or more mounting surfaces in the first direction. In this case, in the illustrated wiring board 101, the first direction and the Y direction are the same direction.

[0122] When viewed from above, first upper surface 101A1 is provided at a position away from the mounting surface in a first direction, and first through hole 101H1 is provided at a position away from first upper surface 101A1 in the first direction. Also, when viewed from above, second upper surface 101A2 is provided at a position away from the mounting surface in a direction opposite to the first direction, and second through hole 101H2 is provided at a position away from second upper surface 101A2 in the direction opposite to the first direction. With this arrangement and a manufacturing method described below, the direction of warping in wiring board 101 can be controlled.

[0123] In top view, first through-hole 101H1 and second through-hole 101H2 are provided at positions sandwiching one or more mounting surfaces of heat dissipation unit 101D in a first direction, and first convex portion 101M1 and second convex portion 101M2 may be provided at positions sandwiching the mounting surface in a second direction intersecting with the first direction. For example, the second direction is a direction perpendicular to the first direction in top view. In this case, in the illustrated wiring board 101, the first direction is the same as the Y direction, and the second direction is the same as the X direction.

[0124] In top view, the electrode portion 101E is provided in two regions sandwiching the mounting surface of the heat dissipation portion 101D. The two regions sandwich the mounting surface in a direction perpendicular to the first direction. In top view, a virtual line passing through the two regions passes through the mounting surface. In addition, this line does not pass through the first through hole 101H1 and the second through hole 101H2.

[0125] Wiring board 101 has bottom surface 101B warped in a predetermined direction (see FIG. 17C). By manufacturing wiring board 101 so that bottom surface 101B warps in a desired direction, the direction of warping is uniform even when a large number of wiring boards 101 are manufactured, so that it is possible to reduce variation in heat dissipation performance between wiring boards 101. For example, bottom surface 101B of wiring board 101 has a warp such that the center protrudes more than both ends.

[0126] On bottom surface 101B, an imaginary line segment connecting a point located directly below first top surface 101A1 and a point located directly below second top surface 101A2 passes through the inside of wiring board 101, and bottom surface 101B of wiring board 101 is warped. On bottom surface 101B, a point located directly below the mounting surface is located below this line segment. By warping bottom surface 101B of wiring board 101 in this manner, when a heat sink is mounted on bottom surface 101B, the area directly below the mounting surface is more likely to come into contact with the heat sink, thereby achieving wiring board 101 with excellent heat dissipation properties.

[0127] The wiring board 101 can be manufactured by a manufacturing method including a step of preparing a substrate 9 (hereinafter referred to as the first step), a step of placing the substrate 9 on a support member 9X (hereinafter referred to as the second step), and a step of providing a through hole 101H in the substrate 9 (hereinafter referred to as the third step).

[0128] 17A, in a first step, a substrate 9 is prepared in which a first upper surface 101A1 and a second upper surface 101A2, which are located above one or more mounting surfaces, are provided at a position sandwiching the one or more mounting surfaces when viewed from above. At the stage of the first step, the substrate 9 is not provided with the first through hole 101H1 and the second through hole 101H2. The substrate 9 prepared in the first step can be a substrate in a state in which the wiring substrate 101 is completed once the first through hole 101H1 and the second through hole 101H2 are provided.

[0129] 17B, ​​in a second step, the substrate 9 is placed on a support member 9X having a support surface 9Y. At this time, the substrate 9 is placed on the support member 9X so that the first upper surface 101A1 and the second upper surface 101A2 of the substrate 9 face the support surface 9Y.

[0130] As shown in FIG. 17C, in the third step, a first through hole 101H1 is provided at a first position P1 from the lower surface side to the upper surface side of the substrate 9, and a second through hole 101H2 is provided at a second position P2. When providing the through holes 101H at the first position P1 and the second position P2, a force F is applied from the lower surface side to the upper surface side of the substrate, causing the lower surface 101B of the substrate 9 (wiring substrate 101) to warp. In addition, warping occurs in a predetermined direction due to the relationship between the positions and heights of one or more mounting surfaces, the first upper surface 101A1, and the second upper surface 101A2. In FIG. 17C, the lower surface 101B of the substrate 9 has a convex warp. Thus, a wiring substrate 101 with excellent heat dissipation effect can be realized.

[0131] The first through hole 101H1 and the second through hole 101H2 are provided at positions spaced apart in the long side direction of the rectangular outer edge shape of the wiring board 101 in a top view. The first through hole 101H1 and the second through hole 101H2 are provided at positions closer to the outer edge of the wiring board 101 than to the center in the long side direction of the wiring board 101 in a top view. It is easier to warp the bottom surface 101B of the wiring board 101 by selecting the long side direction rather than the short side direction.

[0132] Furthermore, the substrate prepared in the first step can be manufactured by a manufacturing method including a step of preparing a heat dissipation member 111 (hereinafter referred to as the fourth step), a step of providing a plurality of electrode members 121 (hereinafter referred to as the fifth step), and a step of providing an insulating member (hereinafter referred to as the sixth step).

[0133] 18A, the heat dissipation member 111 prepared in the fourth step has a first upper surface 111A. The heat dissipation member 111 has a second upper surface 111B that is located lower than the first upper surface 111A. The heat dissipation member 111 has one or more first side surfaces 111C that intersect with the first upper surface 111A. The heat dissipation member 111 has one or more second side surfaces 111D that each intersect with the second upper surface 111B. The heat dissipation member 111 has a lower surface 111E.

[0134] The heat dissipation member 111 has a third top surface 111F that is located higher than the second top surface 111B. The heat dissipation member 111 has a fourth top surface 111G that is located higher than the second top surface 111B. The third top surface 111F is provided in an area including the first position P1 and the vicinity of the first position P1. The fourth top surface 111G is provided in an area including the second position P2 and the vicinity of the second position P2.

[0135] In the third step, the first through hole 101H1 is provided so that the first through hole 101H1 is located inside the outer edge of the third upper surface 111F in top view. In the third step, the second through hole 101H2 is provided so that the second through hole 101H2 is located inside the outer edge of the fourth upper surface 111G in top view.

[0136] The third upper surface 111F is at the same height as the first upper surface 111A. The fourth upper surface 111G is at the same height as the first upper surface 111A. Note that these upper surfaces do not have to be at the same height. The third upper surface 111F is located lower than the first upper surface 101A1 of the first convex portion 101M1. The fourth upper surface 111G is located lower than the second upper surface 101A2 of the second convex portion 101M2.

[0137] The heat dissipation member 111 has one or more protrusions 112 formed on the upper surface side. The heat dissipation member 111 has one or more protrusions 112 each protruding from the second upper surface 111B. The one or more protrusions 112 include a protrusion 112 having a first upper surface 111A and one or more first side surfaces 111C. The height of the protrusion 112 of the heat dissipation member 111 (height from the second upper surface 111B) is smaller than the height from the lower surface 111E to the second upper surface 111B.

[0138] The one or more protruding portions 112 have a third upper surface 111F and a fourth upper surface 111G. The one or more protruding portions 112 include a protruding portion 112 having a third upper surface 111F. The one or more protruding portions 112 include a protruding portion 112 having a fourth upper surface 111G.

[0139] First upper surface 111A, third upper surface 111F, and fourth upper surface 111G are each provided with a different protrusion 112. In other words, in heat dissipation member 111, protrusion 112 having first upper surface 111A, protrusion 112 having third upper surface 111F, and protrusion 112 having fourth upper surface 111G are formed, and these protrusions are separated from each other when viewed from above.

[0140] When viewed from above, the outer edge of the heat dissipation member 111 is rectangular. This rectangle has long sides and short sides. In the illustrated heat dissipation member 111, the long side direction is the same as the Y direction, and the short side direction is the same as the X direction.

[0141] 18B, in a fifth step, a plurality of electrode members 121 are provided on the heat dissipation member 111. The plurality of electrode members 121 are provided on the second upper surface 111B of the heat dissipation member 111. The plurality of electrode members 121 are provided on the heat dissipation member 111 via insulating members 131. The one or more insulating members 131 include a first insulating member 131A provided on the second upper surface 111B.

[0142] The electrode members 121 are provided on the first insulating member 131A. The electrode members 121 are provided in a plurality of regions spaced apart from one another. The heat dissipation member 111 and each electrode member 121 are spaced apart from one another. Each electrode member 121 is insulated from the heat dissipation member 111 via the first insulating member 131A.

[0143] The multiple electrode members 121 include a first electrode member 121A and a second electrode member 121B. In top view, the first upper surface 111A is disposed between the first electrode member 121A and the second electrode member 121B. In top view, the first electrode member 121A, the first upper surface 111A, and the second electrode member 121B are arranged in this order.

[0144] In top view, the first electrode member 121A and the second electrode member 121B are provided at a position spaced apart from one or each of the protrusions 112. In top view, the first electrode member 121A and the second electrode member 121B are provided at a position spaced apart from the protrusion 112 having the first upper surface 111A. In top view, the first electrode member 121A and the second electrode member 121B are provided at a position spaced apart from the protrusion 112 having the third upper surface 111F and the protrusion 112 having the fourth upper surface 111G.

[0145] Each electrode member 121 has an upper surface 122A and one or more side surfaces 122B. In a top view, a first upper surface 111A of the heat dissipation member 111 and the upper surface 122A of each electrode member 121 are spaced apart from each other. One or each electrode member 121 has a side surface 122B that faces the first side surface 111C of the heat dissipation member 111.

[0146] In the third step, the first through-hole 101H1 and the second through-hole 101H2 are provided in positions sandwiching the protrusion 112 having the first upper surface 111A in a first direction in top view, whereas in the fifth step, the first electrode member 121A and the second electrode member 121B are provided in positions sandwiching the protrusion 112 having the first upper surface 111A in a second direction intersecting the first direction in top view. The second direction can be a direction perpendicular to the first direction.

[0147] In top view, the first electrode member 121A and the second electrode member 121B are provided at positions spaced apart in the short side direction of the rectangular outer edge shape of the wiring board 101. By selecting the short side direction rather than the long side direction, the warping state of the lower surface 101B directly below the first electrode member 121A and the second electrode member 121B can be matched to the warping state directly below the first upper surface 111A, making it easier to mount the first electrode member 121A and the second electrode member 121B on the mounting surface.

[0148] 18C, in a sixth step, an insulating member 131 is provided in a space between the protrusion 112 having the first upper surface 111A and the electrode member 121. In a top view, the insulating member 131 is provided between the protrusion 112 and the first electrode member 121A, and between the protrusion 112 and the second electrode member 121B.

[0149] In a sixth step, an insulating member 131 is provided in a space between the convex portion 112 having the first upper surface 111A and the convex portion 112 having the third upper surface 111F. Also, an insulating member 131 is provided in a space between the convex portion 112 having the first upper surface 111A and the convex portion 112 having the fourth upper surface 111G. When viewed from above, the insulating member 131 is provided between the convex portion 112 having the first upper surface 111A and the convex portion 112 having the third upper surface 111F, and between the convex portion 112 having the first upper surface 111A and the convex portion 112 having the fourth upper surface 111G.

[0150] The one or more insulating members 131 include a second insulating member 131B provided between the heat dissipation member 111 and each electrode member 121. One or each first side surface 111C of the heat dissipation member 111 is covered by the second insulating member 131B. One or each side surface 122B of the electrode member 121, which faces the first side surface 111C, is covered by the second insulating member 131B. The second insulating member 131B fills the gap between the first side surface 111C and the side surface 122B.

[0151] The second insulating member 131B is provided between the first upper surface 111A and the third upper surface 111F in a top view. The second insulating member 131B is provided between the convex portion 112 having the first upper surface 111A and the convex portion 112 having the third upper surface 111F.

[0152] The second insulating member 131B is provided between the first upper surface 111A and the fourth upper surface 111G in a top view. The second insulating member 131B is provided between the convex portion 112 having the first upper surface 111A and the convex portion 112 having the fourth upper surface 111G.

[0153] An upper surface 132A of a second insulating member 131B provided between the first electrode member 121A and the protruding portion 112 having the first upper surface 111A is located above the first upper surface 111A. The upper surface 132A is also located above the upper surface 122A of the first electrode member 121A. The second insulating member 131B forms a protruding portion 101M that protrudes upward from the first upper surface 111A.

[0154] An upper surface 132A of a second insulating member 131B provided between the second electrode member 121B and the protruding portion 112 having the first upper surface 111A is located above the first upper surface 111A. The upper surface 132A is also located above the upper surface 122A of the second electrode member 121B. The second insulating member 131B forms a protruding portion 101M that protrudes upward from the first upper surface 111A.

[0155] An upper surface 132A of a second insulating member 131B provided between the third upper surface 111F and the first upper surface 111A in a top view is located higher than the first upper surface 111A. The upper surface 132A is also located higher than the third upper surface 111F. The second insulating member 131B forms a convex portion 101M that protrudes upward from the first upper surface 111A.

[0156] An upper surface 132A of a second insulating member 131B provided between the fourth upper surface 111G and the first upper surface 111A in a top view is located higher than the first upper surface 111A. The upper surface 132A is also located higher than the fourth upper surface 111G. The second insulating member 131B forms a convex portion 101M that protrudes upward from the first upper surface 111A.

[0157] The second insulating member 131B covers a part of the first upper surface 111A continuing from the first side surface 111C of the heat dissipation member 111. The second insulating member 131B covers a part of the upper surface 122A of the electrode member 121 continuing from the side surface 122B.

[0158] The second insulating member 131B is partially provided on the electrode member 121 in a top view. The second insulating member 131B makes the single connected electrode member 121 appear as if it were divided into a plurality of regions. In this manner, the wiring pattern 101G is formed on the upper surface 101A of the wiring board 101.

[0159] One or more metal layers 141 are provided on the heat dissipation member 111 or the electrode member 121. The first metal layer 141A is provided on the heat dissipation member 111. The second metal layer 141B is provided on the electrode member 121. The upper surfaces of the one or more metal layers 141 form a partial area of ​​the upper surface 101A of the wiring board 101. The upper surface of the insulating member 131 forms another partial area of ​​the upper surface 101A of the wiring board 101.

[0160] The upper surface of the first metal layer 141A included in the heat dissipation portion 101D may be the mounting surface of the mounting portion. The upper surface 132A of the second insulating member 131B may include the first upper surface 101A1 of the first convex portion 101M1. The upper surface 132A of the second insulating member 131B may include the second upper surface 101A2 of the second convex portion 101M2. The first convex portion 101M1 and the second convex portion 101M2 are included in the second insulating member 131B. The mounting surface of the wiring board 101 is included in the convex portion 112 having the first upper surface 111A of the heat dissipation member 111 in a top view.

[0161] The heat dissipation member 111 may be mainly made of a metal material. For example, a single metal such as Cu, Ag, Al, Ni, Rh, Au, Ti, Pt, Pd, Mo, Cr, or W, or an alloy containing these metals, may be used as the main material of the heat dissipation member 111. The heat dissipation member 111 is preferably made of a material with excellent heat dissipation properties. The heat dissipation member 111 may be made to contain 95% by mass or more of copper.

[0162] A metal material can be used as the main material of the electrode member 121. For example, the main material of the electrode member 121 can be a single metal such as Cu, Ag, Al, Ni, Rh, Au, Ti, Pt, Pd, Mo, Cr, or W, or an alloy containing these metals.

[0163] The insulating member 131 is formed of an insulating material. For example, the insulating member 131 may be mainly made of polyimide. Alternatively, the insulating member 131 may be mainly made of glass epoxy, which is made by impregnating one or more sheets of glass cloth with a thermosetting insulating resin such as epoxy resin and then curing the thermosetting insulating resin, or liquid crystal polymer. For example, the first insulating member 131A may be made of a film-like polyimide, and the second insulating member 131B may be made of a resist such as a solder resist.

[0164] The metal layer 141 may be mainly made of a metal material such as Au, Ag, Cu, Pt, Ni, Pd, or an alloy containing one of these metal materials. The metal layer 141 may be formed by plating.

[0165] (Connector 201) The connector 201 has a socket into which a connector cable is inserted.

[0166] (Thermistor 301) The thermistor 301 can be used as an element for measuring temperature.

[0167] (Heat sink 401) The heat sink 401 is a member having excellent heat dissipation performance.

[0168] (Fixing member 501) The fixing member 501 is a member for fixing one component to another component. An example of the fixing member 501 is a screw.

[0169] Next, the light emitting module 901 will be described.

[0170] (Light emitting module 901) In the light emitting module 901, one or more light emitting devices 1 are arranged on a wiring board 101. The one or more light emitting devices 1 are mounted on one or more mounting surfaces of the wiring board 101. A bottom surface 11B of the one or each light emitting device 1 is joined to the mounting surface of the wiring board 101.

[0171] The second wiring portion 12A2 of the or each light emitting device 1 is joined to the electrode portion 101E of the wiring board 101. The or each light emitting device 1 is joined to the first electrode member 121A and the second electrode member 121B of the wiring board 101.

[0172] In the light emitting device 1, one or more light emitting elements 20 are arranged in a package . The one or more light emitting elements 20 are arranged on a first upper surface 11A of a base 11. The one or more light emitting elements 20 are arranged in an internal space of the package .

[0173] The light emitting device 1 may have a plurality of light emitting elements 20 arranged side by side in a direction perpendicular to the first direction in a top view. Since the lower surface 101B of the wiring substrate 101 has a shape warped in the first direction, arranging the plurality of light emitting elements 20 side by side in a direction perpendicular to the first direction can suppress variation in the heat dissipation effect for heat generated from each light emitting element 20.

[0174] One or each of the light emitting elements 20 is disposed on an upper surface 31A of the submount 30. One or each of the submounts 30 is disposed on a first upper surface 11A of the base 11. By interposing the submount 30 between the light emitting element 20 and the base 11, the height of the light emitting element 20 can be adjusted. Furthermore, by the submount 30 having the upper metal member 32B and the lower metal member 32C, heat dissipation can be improved, and heat generated from the light emitting element 20 can be smoothly dissipated to the base 11.

[0175] In the light emitting device 1, one or more reflective members 40 are disposed in the package 10. The one or more reflective members 40 are disposed on a first top surface 11A of the base 11. The one or more reflective members 40 are disposed in the internal space of the package 10. A bottom surface 41A of the one or each reflective member 40 is bonded to the first top surface 11A.

[0176] The one or more reflecting members 40 reflect light emitted from the one or more light-emitting elements 20. In the light-emitting device 1, the light emitted from the one or more light-emitting elements 20 is emitted upward from the upper surface 14A of the lid 14. The light emitted from the light-emitting element 20 is reflected by the light reflecting surface 41B and emitted from the upper surface 14A of the lid 14.

[0177] The light emitting device 1 may have a plurality of reflective members 40 arranged side by side in a direction perpendicular to the first direction in a top view. The one or more reflective members 40 are arranged at positions spaced apart from the one or more light emitting elements 20 in the first direction.

[0178] In the light emitting device 1, one or more protection elements 50 are disposed in the package 10. The one or more protection elements 50 are disposed in the internal space of the package 10. The or each protection element 50 is provided to protect the light emitting element 20.

[0179] In the light emitting device 1, a plurality of wirings 60 are provided to electrically connect one or a plurality of light emitting elements 20 to the package 10. The plurality of wirings 60 includes a wiring 60 joined to the first wiring portion 12A1. The plurality of wirings 60 also includes a wiring 60 joined to the upper surface 21A of the light emitting element 20. The plurality of wirings 60 also includes a wiring 60 joined to the upper surface 31A of the submount 30.

[0180] In the light emitting device 1, the optical member 70 is fixed to the package 10. The optical member 70 is bonded to the top surface 14A of the package 10. Light emitted from the top surface 14A of the package 10 passes through the optical member 70. The light emitted from the optical member 70 becomes the light emitted from the light emitting device 1.

[0181] The main heat source in the light emitting device 1 is the one or more light emitting elements 20. In an operating environment in which the light emitting device 1 is emitting light, the temperature of the entire lower surface 11B of the package 10 becomes relatively high directly below where the one or more light emitting elements 20 are arranged. The heat dissipation section 101D of the wiring board 101 serves as a dissipation path for heat generated by the light emitting device 1.

[0182] In the light emitting module 901, the wiring board 101 is placed on the heat sink 401. The wiring board 101 is placed on the heat sink 401 so that the lower surface 101B of the wiring board 101 faces the upper surface of the heat sink 401. Heat generated from the light emitting device 1 is transferred to the heat sink 401 via the heat dissipation portion 101D of the wiring board 101.

[0183] The wiring board 101 is fixed to the heat sink 401 by a fixing member 501. The wiring board 101 can be fixed to the heat sink 401 by a plurality of fixing members 501. The plurality of fixing members 501 include a first fixing member 501A arranged in the first through hole 101H1 and a second fixing member 501B arranged in the second through hole 101H2.

[0184] When fixing members 501 (screws) are inserted into first through-hole 101H1 and second through-hole 101H2 for fixing, if lower surface 101B of wiring board 101 is warped in a shape such that the center is recessed more than both ends, the heat sink 401 will not come into contact directly below the mounting surface, and the heat dissipation effect of heat generated by light emitting device 1 may be insufficient. By warping lower surface 101B of wiring board 101 in a shape such that the center protrudes more than both ends, wiring board 101 and heat sink 401 can be firmly in contact directly below the mounting surface. Therefore, it can be said that wiring board 101 having the latter shape of warping has a superior heat dissipation effect.

[0185] In the light-emitting module 901, the connector 201 is disposed on the wiring board 101. The connector 201 is joined to an electrode portion 101E of the wiring board 101. The connector 201 is electrically connected to the light-emitting device 1 via the electrode portion 101E. By using the connector 201, it is possible to supply power to one or more light-emitting devices 1 using a connector cable.

[0186] In light emitting module 901, thermistor 301 is disposed on wiring board 101. Thermistor 301 is bonded to electrode portion 101E of wiring board 101. Thermistor 301 is disposed in the vicinity of light emitting device 1. Thermistor 301 can be used to manage the temperature of light emitting device 1.

[0187] The wiring board 101 in the embodiment is an example of a mounting board on which other components are mounted. The components mounted on the mounting surface are heat source devices that generate heat in an operating environment. For example, a light emitting device equipped with a semiconductor laser element is an example of a heat source device that generates heat from the semiconductor laser element in an operating environment in which the semiconductor laser element emits light.

[0188] Although the embodiments of the present invention have been described above, the light emitting module and mounting board according to the present invention are not strictly limited to the light emitting module and mounting board of the embodiments. In other words, the present invention can be realized without being limited to the outer shape and structure of the light emitting module and mounting board disclosed in the embodiments. The present invention can be applied without necessarily having all the components. For example, if some of the components of the light emitting module or mounting board disclosed in the embodiments are not described in the claims, the freedom of design by those skilled in the art, such as substitution, omission, deformation of shape, and change of material, is allowed for some of the components, and the invention described in the claims is specified to be applied.

[0189] Through the contents described so far in this specification, the following technical matters are disclosed. (Section 1) preparing a substrate having a mounting section having a mounting surface, a first convex portion having a first upper surface located above the mounting surface, and a second convex portion having a second upper surface located above the mounting surface, the mounting surface being located between the first upper surface and the second upper surface in a top view; a step of placing the substrate on a support member having a support surface such that the first upper surface and the second upper surface face the support surface; providing a first through hole and a second through hole from the lower surface side to the upper surface side of the substrate at a first position and a second position which sandwich the mounting surface when viewed from above and which avoid the gap between the first upper surface and the mounting surface and the gap between the second upper surface and the mounting surface. (Section 2) In the step of preparing the substrate, the substrate has a third protrusion surrounding the mounting surface in a top view, the first protrusion is a part of the third protrusion, 2. The manufacturing method according to item 1, wherein the second convex portion is a part of the third convex portion. (Section 3) 3. The manufacturing method according to item 1 or 2, wherein, in a top view, the first upper surface is provided at a position away from the mounting surface in a first direction, the first through hole is provided at a position away from the first upper surface in the first direction, the second upper surface is provided at a position away from the mounting portion in a direction opposite to the first direction, and the second through hole is provided at a position away from the second upper surface in the direction opposite to the first direction. (Section 4) The substrate prepared in the step of preparing the substrate has a third upper surface including the first position and a vicinity of the first position that is positioned lower than the first upper surface, and a fourth upper surface including the second position and a vicinity of the second position that is positioned lower than the second upper surface, 4. The manufacturing method according to any one of items 1 to 3, wherein in the step of providing the first through hole and the second through hole, the first through hole is provided inside the outer edge of the third upper surface when viewed from above, and the second through hole is provided inside the outer edge of the fourth upper surface when viewed from above. (Section 5) The step of preparing a substrate includes: preparing a heat dissipation member having a fourth protrusion formed on an upper surface side; providing a first electrode member and a second electrode member at a position spaced apart from the fourth protrusion in a top view; providing an insulating member between the fourth protrusion and the first electrode member and between the fourth protrusion and the second electrode member when viewed from above; When viewed from above, the mounting surface is included in the fourth protrusion, 5. The manufacturing method according to any one of items 1 to 4, wherein the first convex portion and the second convex portion are included in the insulating member. (Section 6) The step of preparing a substrate includes: preparing a heat dissipation member having a fourth convex portion, a fifth convex portion, and a sixth convex portion formed on an upper surface side; providing a first electrode member and a second electrode member at positions spaced apart from the fourth convex portion, the fifth convex portion, and the sixth convex portion in a top view; providing insulating members between the fourth convex portion and the first electrode member, between the fourth convex portion and the second electrode member, between the fourth convex portion and the fifth convex portion, and between the fourth convex portion and the sixth convex portion, when viewed from above; When viewed from above, the mounting surface is included in the fourth protrusion, the fifth protrusion has the third upper surface, the sixth protrusion has the fourth upper surface, When viewed from above, the fourth convex portion, the fifth convex portion, and the sixth convex portion are spaced apart from each other, 5. The manufacturing method according to item 4, wherein the first convex portion and the second convex portion are included in the insulating member. (Section 7) In the step of providing the first through hole and the second through hole, the first through hole and the second through hole are provided at positions sandwiching the fourth protrusion in a first direction in a top view, Item 7. The manufacturing method according to item 5 or 6, wherein in the step of providing the first electrode member and the second electrode member, the first electrode member and the second electrode member are provided at positions sandwiching the fourth convex portion in a second direction intersecting with the first direction when viewed from above. (Section 8) The underside and a mounting portion having a mounting surface; a first protrusion having a first upper surface located above the mounting surface; a second protrusion having a second upper surface located above the mounting surface; a first through hole and a second through hole are provided, and an outer periphery is located outside the mounting portion, the mounting surface is located between the first upper surface and the second upper surface, and between the first through hole and the second through hole, when viewed from above; neither the first through hole nor the second through hole is provided between the first upper surface and the mounting surface, nor between the second upper surface and the mounting surface, when viewed from above; A mounting board, wherein the lower surface is warped such that a point located directly below the mounting surface on the lower surface is located below an imaginary line segment connecting a point located directly below the first upper surface and a point located directly below the second upper surface. (Section 9) Item 8. The mounting board according to item 8, a light emitting device mounted on the mounting surface. (Section 10) 10. The light emitting module according to item 9, further comprising a heat sink on which the mounting board is mounted and which faces a lower surface of the mounting board. (Section 11) a first fixing member disposed in the first through hole and fixing the mounting board to the heat sink; Item 11. The light emitting module according to item 10, further comprising: a second fixing member disposed in the second through hole for fixing the mounting board to the heat sink. [Industrial Applicability]

[0190] The light-emitting module described in the embodiment can be used in a projector. In other words, a projector can be said to be one application form to which the present invention is applied. However, the present invention is not limited to this, and can be used in various applications such as illumination, exposure, in-vehicle headlights, head-mounted displays, and backlights for other displays. [Explanation of symbols]

[0191] 1 Light-emitting device 10 Package 11 Substrate 11A First upper surface 11B Lower surface 11C Second upper surface 11D Outer surface 11E Inner surface 11F Step portion 11F1 First step portion 11F2 Second step portion 11G Upper surface 11H Side surface 11M Base portion 11N Frame portion 12A Wiring portion 12A1 First wiring portion 12A2 Second wiring portion 13A Bonding pattern 14 Cover body 14A Upper surface 14B Lower surface 14C Side surface 20 Light-emitting element 21A Upper surface 21B Lower surface 21C Side surface 22 Light-emitting surface 30 Submount 31A Upper surface 31B Lower surface 31C Side surface 32A Substrate 32B Upper metal member 32C Lower metal member 33 Wiring layer 40 Reflective member 41A Lower surface 41B Light-reflective surface 50 Protection element 51A Upper surface 51B Lower surface 51C Side surface 60 Wiring 70 Optical member (lens member) 71A Upper surface 71B Lower surface 71C Side surface 71D Lens surface (optical surface) 72A Lens section 72B Non-lens part 101 Wiring board 101A Top 101A1 1st top surface 101A2 2nd top surface 101B Bottom surface 101C side 101D Heat dissipation part 101E Electrode part 101F Insulation section 101G Wiring Pattern 101H Through hole 101H1 1st through hole 101H2 2nd through hole 101M Convex 101M1 First protrusion 101M2 Second protrusion 111 Heat dissipation materials 111A 1st top surface 111B 2nd top surface 111C 1st side 111D 2nd side 111E Bottom side 111F 3rd top surface 111G 4th top surface 112 Convex 121 Electrode materials 121A first electrode member 121B second electrode member 122A Top 122B Side 131 Insulating materials 131A First insulating member 131B Second insulating member 132A Top 141 Metal layer 141A 1st metal layer 141B 2nd metal layer 201 Connector 301 Thermistor 401 Heatsink 501 Fixing member 501A First fixing member 501B Second fixing member 901 Light Emitting Module

Claims

1. preparing a substrate having a mounting portion having a mounting surface, a first convex portion having a first upper surface located above the mounting surface, and a second convex portion having a second upper surface located above the mounting surface, the mounting surface being located between the first upper surface and the second upper surface in a top view; a step of placing the substrate on a support member having a support surface such that the first upper surface and the second upper surface face the support surface; and providing a first through hole and a second through hole from the lower surface side to the upper surface side of the substrate at a first position and a second position which sandwich the mounting surface when viewed from above, and which avoid the space between the first upper surface and the mounting surface and the space between the second upper surface and the mounting surface.

2. In the step of preparing the substrate, the substrate has a third protrusion surrounding the mounting surface in a top view, the first protrusion is a part of the third protrusion, The manufacturing method according to claim 1 , wherein the second convex portion is a part of the third convex portion.

3. 2. The manufacturing method described in claim 1, wherein, when viewed from above, the first upper surface is provided at a position away from the mounting surface in a first direction, the first through hole is provided at a position away from the first upper surface in the first direction, the second upper surface is provided at a position away from the mounting portion in a direction opposite to the first direction, and the second through hole is provided at a position away from the second upper surface in the direction opposite to the first direction.

4. The substrate prepared in the step of preparing the substrate has a third upper surface including the first position and a vicinity of the first position that is located lower than the first upper surface, and a fourth upper surface including the second position and a vicinity of the second position that is located lower than the second upper surface, The manufacturing method described in claim 1, wherein in the process of providing the first through hole and the second through hole, the first through hole is provided inside the outer edge of the third upper surface when viewed from above, and the second through hole is provided inside the outer edge of the fourth upper surface when viewed from above.

5. The step of preparing a substrate includes: preparing a heat dissipation member having a fourth protrusion formed on an upper surface side; providing a first electrode member and a second electrode member at a position spaced apart from the fourth protrusion in a top view; providing an insulating member between the fourth protrusion and the first electrode member and between the fourth protrusion and the second electrode member when viewed from above; When viewed from above, the mounting surface is included in the fourth protrusion, The manufacturing method according to claim 1 , wherein the first convex portion and the second convex portion are included in the insulating member.

6. The step of preparing a substrate includes: preparing a heat dissipation member having a fourth convex portion, a fifth convex portion, and a sixth convex portion formed on an upper surface side; providing a first electrode member and a second electrode member at positions spaced apart from the fourth convex portion, the fifth convex portion, and the sixth convex portion in a top view; providing insulating members between the fourth convex portion and the first electrode member, between the fourth convex portion and the second electrode member, between the fourth convex portion and the fifth convex portion, and between the fourth convex portion and the sixth convex portion, when viewed from above; When viewed from above, the mounting surface is included in the fourth protrusion, the fifth protrusion has the third upper surface, the sixth protrusion has the fourth upper surface, When viewed from above, the fourth convex portion, the fifth convex portion, and the sixth convex portion are spaced apart from each other, The manufacturing method according to claim 4 , wherein the first convex portion and the second convex portion are included in the insulating member.

7. In the step of providing the first through hole and the second through hole, the first through hole and the second through hole are provided at positions sandwiching the fourth protrusion in a first direction in a top view, 7. The manufacturing method according to claim 5, wherein in the step of providing the first electrode member and the second electrode member, the first electrode member and the second electrode member are provided at positions sandwiching the fourth convex portion in a second direction intersecting the first direction when viewed from above.

8. The underside and A mounting portion having a mounting surface; a first protrusion having a first upper surface located above the mounting surface; a second protrusion having a second upper surface located above the mounting surface; a first through hole and a second through hole are provided, and an outer periphery is located outside the mounting portion, the mounting surface is located between the first upper surface and the second upper surface, and is located between the first through hole and the second through hole, when viewed from above; none of the first through hole and the second through hole is provided between the first upper surface and the mounting surface and between the second upper surface and the mounting surface in a top view; A mounting board, wherein the lower surface is warped such that a point located directly below the mounting surface is located below an imaginary line segment connecting a point located directly below the first upper surface and a point located directly below the second upper surface.

9. The mounting board according to claim 8 ; a light emitting device mounted on the mounting surface.

10. The light-emitting module according to claim 9 , further comprising a heat sink on which the mounting board is mounted and which faces a lower surface of the mounting board.

11. a first fixing member disposed in the first through hole and fixing the mounting substrate to the heat sink; The light emitting module according to claim 10 , further comprising: a second fixing member disposed in the second through hole and fixing the mounting board to the heat sink.

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