Resin molding apparatus, and method of manufacturing resin molded article

Abstract

To provide a resin molding apparatus and a method of manufacturing a resin molded article capable of separating and recovering a resin material and a release film.SOLUTION: A resin molding apparatus 1 comprises: a resin feeding mechanism 26 for feeding a powder / granular resin to a resin accommodation part 24 including a release film F and a frame-shaped member 24a disposed on the release film F; a resin molding mechanism 3 having a mold M comprising an upper mold UM and a lower mold LM that faces the upper mold UM, and disposing the release film F to which the powder / granular resin is fed between the upper mold UM and the lower mold LM, to perform resin molding; and a resin recovering mechanism 6 capable of sucking and recovering the powder / granular resin fed to the release film F before disposing the release film F onto the mold M.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded product. [Background technology]

[0002] A substrate or the like on which a semiconductor chip is fixed is generally used as an electronic component by being resin-encapsulated. In a conventional resin molding device, a resin material is supplied to a pre-cut release film, and the release film to which the resin material has been supplied is transported to a molding die (for example, Patent Document 1).

[0003] In the resin molding device of Patent Document 1, if the resin material supplied onto the release film is inappropriate, such as if the amount of resin material supplied is greater than the target weight, the release film is discarded together with the supplied resin material. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2021-171920 Summary of the Invention [Problem to be solved by the invention]

[0005] When discarding the release film to which the resin material has been supplied, some users of the resin molding apparatus desire to separate the resin material and the release film for recovery for reasons such as recycling.

[0006] Therefore, there is a demand for a resin molding apparatus and a method for manufacturing a resin molded product that are capable of separating and recovering the resin material and the release film. [Means for solving the problem]

[0007] One embodiment of a resin molding apparatus according to the present invention includes a resin supplying mechanism that supplies powdered or granular resin to a resin storage section including a release film and a frame-shaped member that is placed on the release film; a resin molding mechanism that has a molding die consisting of an upper die and a lower die opposite the upper die and performs resin molding by placing the release film to which the powdered or granular resin has been supplied between the upper die and the lower die; and a resin recovery mechanism that is capable of sucking and recovering the powdered or granular resin supplied to the resin storage section before the release film is placed on the molding die.

[0008] One embodiment of a manufacturing method for a resin molded product according to the present invention includes a resin supplying step of supplying a predetermined amount of powdered resin to a resin storage section including a release film and a frame-shaped member arranged on the release film; a determination step of determining whether the powdered resin supplied to the resin storage section is appropriate or not; a recovery step of suctioning and recovering the powdered resin supplied to the resin storage section if it is determined in the determination step that the powdered resin is not appropriate; and a molding step of placing the release film to which the powdered resin has been supplied and a pre-molded substrate between an upper mold and a lower mold to perform resin molding if it is determined in the determination step that the powdered resin is appropriate. Effect of the Invention

[0009] According to the embodiments of the present invention, it is possible to provide a resin molding apparatus and a method for manufacturing a resin molded product that are capable of separating and recovering a resin material and a release film. [Brief description of the drawings]

[0010] [Figure 1] FIG. 2 is a schematic diagram illustrating a resin molding apparatus according to the present embodiment. [Diagram 2] FIG. 2 is a schematic diagram illustrating a configuration of a resin molding module. [Figure 3A] FIG. 4 is a schematic diagram illustrating a resin recovery mechanism according to the first embodiment. [Figure 3B] FIG. [Figure 4] FIG. 11 is a schematic diagram illustrating a resin recovery mechanism according to a second embodiment. [Diagram 5] 1 is a flowchart showing a method for manufacturing a resin molded product. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, an embodiment of a resin molding apparatus and a method for manufacturing a resin molded product according to the present invention will be described with reference to the drawings. Note that the embodiments described below are merely examples for explaining the present invention, and the present invention is not limited to these embodiments. Therefore, the present invention can be embodied in various forms without departing from the gist of the present invention.

[0012] Substrates (molding objects) with semiconductor chips (hereinafter sometimes referred to as "chips") fixed thereto are resin-sealed for use as electronic components (resin molded products). Techniques for resin-sealing substrates include the compression method and the transfer method. One compression method is a resin sealing method in which liquid resin or powdered resin is supplied to a release film, the release film is placed on the lower die of a molding die, and the object to be molded is immersed in the molten liquid resin or powdered resin on the release film to form a resin mold. Examples of electronic elements include resistor elements and capacitor elements in addition to semiconductor chips.

[0013] [Configuration of Resin Molding Device] FIG. 1 shows a schematic diagram of a resin molding apparatus 1. The resin molding apparatus 1 in this embodiment employs a compression system and includes a resin supply module 2, a plurality of (three in this embodiment) resin molding modules 3 (an example of a resin molding mechanism), a board supply module 4, and a control unit 5. The resin supply module 2, the plurality of resin molding modules 3, and the board supply module 4 can be attached or detached independently. Although the resin molding module 3 in this embodiment is configured with three modules, it may be configured with two or less or four or more, and an optimal number of modules can be appropriately adopted depending on the production quantity. The Z direction shown in FIG. 1 is the vertical direction of the resin molding apparatus 1, the arrangement direction of the resin supply module 2, the resin molding module 3, and the board supply module 4 is the X direction, and the direction perpendicular to the X direction and the Z direction (the depth direction of each module) is the Y direction. In the X, Y, and Z directions shown in FIG. 1, the directions indicated by the arrows are the +X, +Y, and +Z directions, and the directions opposite to the arrow directions are the -X, -Y, and -Z directions.

[0014] The control unit 5 includes a processor such as a CPU (Central Processing Unit) and a storage device such as a RAM (Random Access Memory). The control unit 5 controls the operation of the resin molding apparatus 1 by executing a control program stored in the storage device with the processor. The operation of the resin molding apparatus 1 described below is performed based on an operation command from the control unit 5 unless otherwise specified. In the following description, the operation command from the control unit 5 will be omitted in principle, and the operation command from the control unit 5 will be described as necessary.

[0015] The substrate supply module 4 is provided with a pre-molded substrate supply section 41 which supplies a pre-molded substrate Sa (an example of a molding object), a molded substrate storage section 42 which stores a molded substrate Sb (an example of a resin molded product), a substrate placement section 43 which transfers the pre-molded substrate Sa and the molded substrate Sb, and a substrate transport mechanism 44 which transports the pre-molded substrate Sa and the molded substrate Sb. The substrate placement section 43 moves in the Y direction within the substrate supply module 4. The substrate transport mechanism 44 moves in the X direction and the Y direction in the substrate supply module 4 and the resin molding module 3, respectively. The predetermined position S1 is a position where the substrate transport mechanism 44 waits when not in operation.

[0016] Each of the three resin molding modules 3 is provided with a lower mold LM that can be raised and lowered, and an upper mold UM (see also FIG. 2) arranged opposite the lower mold LM. The upper mold UM and lower mold LM constitute a molding mold M. Each of the resin molding modules 3 has a mold clamping mechanism 35 (circular part indicated by a two-dot chain line) that clamps and opens the upper mold UM and lower mold LM. The lower mold LM and the upper mold UM are clamped and opened by moving relatively by the mold clamping mechanism 35. The lower mold LM has a lower mold cavity MC to which a release film F and a powdered resin as a resin material are supplied (see also FIG. 2). A detailed configuration of the resin molding module 3 will be described later.

[0017] As the material of the release film F used in this embodiment, a material made of a resin having properties such as heat resistance, releasability, flexibility, and extensibility is used, and for example, PTFE (polytetrafluoroethylene), ETFE (ethylene / tetrafluoroethylene copolymer), PET (polyethylene terephthalate), FEP (tetrafluoroethylene / hexafluoropropylene copolymer), polypropylene, polystyrene, polyvinylidene chloride, etc. are used. In addition, the average particle size of the powdered resin used in this embodiment is not particularly limited, but is, for example, 5 mm or less. Preferably, it is 1 mm or less, more preferably 0.9 mm or less, 0.8 mm or less, 0.7 mm or less, 0.6 mm or less, 0.5 mm or less, 0.4 mm or less, 0.3 mm or less, 0.2 mm or less, or 0.1 mm or less. It is preferable that the particle size distribution of the powdered resin is such that 80% or more of the resin in the particle size distribution is within the range of the average particle size ±10%.

[0018] The resin supply module 2 is provided with an XY table 21, a release film supply mechanism 22 that supplies a release film F onto the XY table 21, a cleaning mechanism 23 that cleans the lower surface and inner surface of the frame member 24a, a resin accommodation section 24 including the frame member 24a and the release film F, a resin conveying mechanism 25 that conveys the resin accommodation section 24, a resin supply mechanism 26 that supplies powdered resin to the resin accommodation section 24, and a resin recovery mechanism 6 that recovers the powdered resin supplied onto the release film F. The XY table 21 moves in the X and Y directions within the resin supply module 2. The frame member 24a is a hollow frame that is rectangular when viewed along the Z direction. The resin conveying mechanism 25 moves in the X and Y directions within the resin supply module 2 and each of the three resin molding modules 3. The predetermined position M1 is a position where the resin conveying mechanism 25 waits when not in operation. The resin recovery mechanism 6 is disposed adjacent to the resin supply mechanism 26. A specific configuration of the resin recovery mechanism 6 will be described later.

[0019] [Configuration of resin molded module] Next, a specific configuration of the resin molding module 3 including the mold M will be described. As shown in FIG. 2, the resin molding module 3 in this embodiment is configured as a press frame in which a lower fixed platen 31 and an upper fixed platen 33 are integrated by a plate-like member 32. A movable platen 34 is provided between the lower fixed platen 31 and the upper fixed platen 33. The movable platen 34 is movable up and down along the plate-like member 32. A mold clamping mechanism 35 consisting of a ball screw or the like, which is a device for moving the movable platen 34 up and down, is provided on the lower fixed platen 31. The mold clamping mechanism 35 is configured to clamp the mold M by moving the movable platen 34 upward, and to open the mold M by moving the movable platen 34 downward. The drive source of the mold clamping mechanism 35 is not particularly limited, but for example, an electric motor (not shown) such as a servo motor can be used.

[0020] The upper mold UM and the lower mold LM as the molding mold M are arranged opposite to each other, and each is composed of a metal mold or the like. An upper mold holder 39 including an upper heater 37 is arranged on the lower surface of the upper fixed platen 33, and the upper mold UM is attached below the upper mold holder 39. The upper mold UM is provided with an upper mold substrate setting section (not shown) for placing the pre-molded substrate Sa, and the pre-molded substrate Sa with a chip or the like fixed thereto is attached to the lower surface of the upper mold UM. A lower mold holder 38 including a lower heater 36 is arranged on the upper surface of the movable platen 34, and the lower mold LM is provided on the lower mold holder 38. The lower mold LM has a lower mold cavity MC to which a release film F and a powdered resin R are supplied. The pre-molded substrate Sa is resin-sealed with the powdered resin R to become a molded substrate Sb.

[0021] [Configuration of the resin recovery mechanism of the first embodiment] Next, a specific configuration of the resin recovery mechanism 6 according to the first embodiment will be described with reference to Figures 3A and 3B. The resin recovery mechanism 6 of this embodiment includes a plate-shaped member 61, a first hose 63 (an example of a recovery path), a second hose 64, an air pump 65 (an example of a suction source), a resin recovery section 66 (an example of a recovery section), and a film recovery section 67 (see Figure 1).

[0022] The plate-shaped member 61 is made of resin or metal, and is a rectangular plate material whose outer shape is approximately the same size as that of the frame-shaped member 24a. The plate surface of the plate-shaped member 61 has an area sufficient to cover at least the entire hollow portion inside the frame-shaped member 24a. The plate-shaped member 61 has a first hole 61a which is a circular through hole at the center, and has a plurality of (four in this embodiment) second holes 61b which are circular through holes with a smaller diameter than the first hole 61a around the first hole 61a. In this embodiment, the four second holes 61b are formed near the four corners of the plate-shaped member 61. The first hole 61a and the second hole 61b are formed at locations located in the hollow portion inside the frame-shaped member 24a when the plate-shaped member 61 is placed so as to overlap the frame-shaped member 24a.

[0023] One end of a first hose 63 is connected to the first hole 61a of the plate-like member 61 via a first connecting part 63a. Packings (not shown) are arranged at the connection points between the plate-like member 61 and the first connecting part 63a and at the connection points between the first connecting part 63a and the first hose 63, so that air does not leak from these connection points. An air pump 65 capable of sucking air is connected to the other end of the first hose 63. The air pump 65 is housed in a box-shaped resin recovery section 66. The resin recovery section 66 is, for example, a dust collection box provided in the resin molding device 1, but may be a dedicated box separate from the dust collection box.

[0024] One end of a second hose 64 is connected to each of the four second holes 61b of the plate-like member 61 via a second connection part 64a. Packings (not shown) are disposed at the connection points between the plate-like member 61 and the second connection parts 64a and at the connection points between the second connection parts 64a and the second hoses 64, so that air does not leak from these connection points. An air compressor (not shown) capable of sending out air (an example of gas) is connected to the other end of each of the four second hoses 64.

[0025] Next, a method for recovering the powdered or granular resin R supplied onto the release film F of the resin storage section 24 will be described. The resin storage section 24 is configured by placing the frame-shaped member 24a on the release film F cut to a predetermined size. The resin storage section 24 is moved by the XY table 21 and stops at a predetermined position below the resin supply mechanism 26 (see FIG. 1). After stopping, the powdered or granular resin R is supplied to the resin storage section 24. At this time, when it becomes necessary to recover the powdered or granular resin R for a reason described later, the resin storage section 24 is left as it is at a predetermined position below the resin supply mechanism 26, and the plate-shaped member 61 is moved by an actuator (not shown) or the like to place the plate-shaped member 61 so as to cover the upper part of the resin storage section 24 including the frame-shaped member 24a. At this time, the plate-shaped member 61 and the frame-shaped member 24a are brought into close contact with each other so that no gap G (see FIG. 4) is generated at the boundary between them. For this reason, a small force may be applied to the plate-shaped member 61 to press it toward the frame-shaped member 24a. As a result, the powdered or granular resin R is accommodated in the resin accommodation space 62, which is a space defined by the release film F, the frame-shaped member 24a, and the plate-shaped member 61.

[0026] Next, in this state, the air pump 65 and the air compressor are operated. As a result, the powdered or granular resin R together with the air in the resin containing space 62 is sucked into the air pump 65 via the first hose 63, and is discharged from the resin containing space 62 to the outside (first hose 63) through the first hole 61a. At this time, if the amount of air sucked from the resin containing space 62 through the first hole 61a by the air pump 65 per unit time is made equal to the total amount of air supplied to the resin containing space 62 from the four second holes 61b by the air compressor per unit time, the powdered or granular resin R can be discharged while maintaining the pressure (atmospheric pressure) in the resin containing space 62 constant.

[0027] When the air pump 65 sucks the powdered resin R together with the air in the resin storage space 62, the suction force of the air pump 65 also acts on the release film F. The release film F is adsorbed to the XY table 21 by the air suction, but if the suction force of the air pump 65 is large, the release film F may be sucked into the air pump 65. However, in this embodiment, the compressed air supplied from the second hole 61b is directed toward the release film F, and this compressed air presses the release film F against the XY table 21 on which the release film F is placed, thereby preventing the release film F from being sucked. In particular, since the second hole 61b is formed in the vicinity of the four corners of the plate-like member 61, the release film F can be more effectively prevented from being sucked. In addition, when the compressed air hits the powdered resin R, the powdered resin R is lifted up, so that the powdered resin R located away from the first hole 61a is easily sucked, and the powdered resin R can be collected in a short time.

[0028] The powdered or granular resin R that has been sucked by the air pump 65 and discharged from the resin containing space 62 flows through the first hose 63 together with the air, and is collected in a resin recovery section 66. The release film F from which the powdered or granular resin R has been collected is delivered together with the frame-shaped member 24a from the XY table 21 to the resin conveying mechanism 25. The control section 5 returns the resin conveying mechanism 25 to a predetermined position M1, and then moves it from the +X direction to the -Y direction, causing the release film F to be collected in a film recovery section 67 (see FIG. 1).

[0029] In this way, the resin recovery mechanism 6 of this embodiment can automatically separate and recover the powdered resin R and the release film F even after the powdered resin R is supplied from the resin supply mechanism 26 onto the release film F of the resin containing section 24. Therefore, the manual separation of the powdered resin R and the release film F, which was conventionally required, is no longer necessary, and separation and recovery can be easily performed.

[0030] [Configuration of Resin Recovery Mechanism of Second Embodiment] Next, a specific configuration of the resin recovery mechanism 6 according to the second embodiment will be described with reference to Fig. 4. In this embodiment, the method of maintaining the pressure in the resin storage space 62 constant is different from that of the first embodiment. Other than that, the configuration is the same as that of the first embodiment. Therefore, in the description of this embodiment, the same reference numerals are used for the parts having the same configuration as the first embodiment, and detailed description of the same configuration will be omitted.

[0031] In the resin recovery mechanism 6 of this embodiment, the plate-shaped member 61 has only the first hole 61a and does not have the second hole 61b. When recovering the powdered or granular resin R supplied onto the release film F, the plate-shaped member 61 covers the upper part of the resin containing section 24 including the frame-shaped member 24a so that a gap G is formed at the boundary between the plate-shaped member 61 and the frame-shaped member 24a. "Covering the upper part of the resin containing section 24 including the frame-shaped member 24a with the plate-shaped member 61" includes both the case where the plate-shaped member 61 and the frame-shaped member 24a are brought into contact with each other as in the first embodiment, and the case where a gap G is provided between the plate-shaped member 61 and the frame-shaped member 24a as in this embodiment. When the plate-like member 61 is configured to cover the upper part of the resin containing section 24 including the frame-like member 24a with the gap G therebetween as in this embodiment, the resin containing space 62 is connected to the outside of the resin containing section 24 by the gap G even if air is not supplied to the resin containing space 62 from the four second holes 61b by an air compressor, and the pressure (atmospheric pressure) of the resin containing space 62 is always equal to the pressure of the air outside the resin containing section 24. Therefore, even if the air and powdered or granular resin R in the resin containing space 62 are sucked in by the air pump 65, the pressure in the resin containing space 62 does not become negative.

[0032] [Method of manufacturing molded substrate] Next, a method for manufacturing a molded substrate Sb (a resin molded product) using a resin molding apparatus 1 equipped with a resin recovery mechanism 6 according to the first embodiment will be described with reference to Fig. 1 to Fig. 3 and Fig. 5. The method for manufacturing a molded substrate Sb includes a resin supplying step of supplying a predetermined amount of powdered granular resin R to a resin containing section 24 including a release film F and a frame-shaped member 24a for holding the release film F, a judging step of judging whether the powdered granular resin R supplied to the resin containing section 24 is proper or not, a collecting step of suctioning and collecting the powdered granular resin R supplied to the release film F when it is judged that the powdered granular resin R is not proper in the judging step, and a molding step of arranging the release film F to which the powdered granular resin R has been supplied and a pre-molded substrate Sa (molding target) between an upper mold UM and a lower mold LM to perform resin molding when it is judged that the powdered granular resin R is proper in the judging step.

[0033] First, in the substrate supply module 4, the pre-molded substrate Sa is sent from the pre-molded substrate supply section 41 to the substrate placement section 43. Next, the substrate transport mechanism 44 is moved in the -Y direction from the predetermined position S1 to receive the pre-molded substrate Sa from the substrate placement section 43, and after receiving the substrate, the substrate transport mechanism 44 is returned to the predetermined position S1. Next, for example, the substrate transport mechanism 44 is moved in the +X direction to a predetermined position P1 of the resin molding module 3 arranged in the center of the three resin molding modules 3. Next, in the central resin molding module 3, the substrate transport mechanism 44 is moved in the -Y direction and stopped at a predetermined position C1 on the lower mold LM. Next, the substrate transport mechanism 44 is moved upward to fix the pre-molded substrate Sa to the upper mold UM. Thereafter, the substrate transport mechanism 44 is returned to the predetermined position S1 of the substrate supply module 4.

[0034] In parallel with the sending out of the pre-molding substrate Sa from the substrate supply module 4 to the resin molding module 3, a predetermined amount of powdered resin is supplied onto the release film F in the resin supply module 2 (resin supply step). The specific operation is as follows. In the resin supply module 2, the release film F supplied from the release film supply mechanism 22 to the XY table 21 is cut to a predetermined size (step S51 in FIG. 5). Next, the resin transport mechanism 25 is moved in the -Y direction from the predetermined position M1 to receive the frame-shaped member 24a cleaned by the cleaning mechanism 23. Next, the resin transport mechanism 25 is moved in the -Y direction to place the frame-shaped member 24a on the release film F air-adsorbed to the XY table 21. As a result, the release film F is held by the frame-shaped member 24a to form the resin storage section 24. Thereafter, the resin transport mechanism 25 is returned to the original position M1.

[0035] Next, the XY table 21 on which the resin containing section 24 is placed is moved in the +X direction, and the resin containing section 24 is stopped at a predetermined position below the resin supply mechanism 26. Next, the XY table 21 is moved in the X and Y directions to supply a predetermined amount of powdered resin from the resin supply mechanism 26 onto the release film F located in the hollow portion inside the frame member 24a of the resin containing section 24 (step S52). At this time, the weight of the powdered resin R supplied to the resin containing section 24 is measured by a weight sensor (not shown) (step S53). The weight sensor may be provided in the resin storage section 26a of the resin supply mechanism 26 or may be provided in the XY table 21. When the weight sensor is provided in the resin storage section 26a, the weight (supply amount) of the powdered resin R supplied to the resin containing section 24 is measured based on the reduced weight of the powdered resin R, and when the weight sensor is provided in the XY table 21, the weight (supply amount) of the powdered resin R supplied to the resin containing section 24 is measured based on the increased weight of the powdered resin R. The measured weight data of the powdered or granular resin R is sent to the control unit 5 at any time.

[0036] The control unit 5 constantly judges whether the powdered resin R supplied to the resin containing unit 24 is appropriate or not based on the weight data of the powdered resin R sent from the weight sensor (judging step). When the weight of the powdered resin R supplied to the resin containing unit 24 reaches a predetermined amount, the control unit 5 judges that the supplied powdered resin R is appropriate (predetermined amount) and causes the resin supply mechanism 26 to stop supplying the powdered resin R (No in step S54). Thereafter, the XY table 21 carrying the resin containing unit 24 with a predetermined amount of powdered resin R supplied on the release film F is returned to its original position.

[0037] Next, after the suction of the release film F by the XY table 21 is released, the release film F is sucked using a suction groove (not shown) provided in the frame member 24a, and the release film F is held on the frame member 24a. Then, the resin conveying mechanism 25 is moved in the -Y direction from the predetermined position M1 to receive the resin accommodation unit 24 placed on the XY table 21. The resin conveying mechanism 25 is returned to the original position M1. Next, the resin conveying mechanism 25 is moved in the -X direction to a predetermined position P1 of the resin molding module 3 arranged in the center of the three resin molding modules 3. Next, in the resin molding module 3, the resin conveying mechanism 25 is moved in the -Y direction and stopped at a predetermined position C1 on the lower mold LM. Next, the resin conveying mechanism 25 is lowered to supply the powdered resin and the release film F to the lower mold cavity MC (step S55). Then, the release film F sucked by the suction mechanism (not shown) is held face-down in the lower mold cavity MC. As a result, the powdered resin R on the release film F is supplied to the lower die cavity MC. Thereafter, the resin transport mechanism 25 on which the frame member 24a is placed is returned to the predetermined position M1.

[0038] Next, in the resin molding module 3, the movable platen 34 is moved upward (in the +Z direction) by the clamping mechanism 35 to clamp the upper mold UM and the lower mold LM. In the clamped state, the lower mold LM is heated by the lower heater 36 and the upper mold UM is heated by the upper heater 37, so that the powdered resin R in the lower mold cavity MC melts and hardens. That is, in a state in which the pre-molding substrate Sa and the release film F having the powdered resin R are arranged between the upper mold UM and the lower mold LM, the mold clamping mechanism 35 clamps the molding mold M and resin-seals the molded substrate by resin molding (molding process). As a result, the chips and the like fixed to the pre-molding substrate Sa are resin-sealed by the powdered resin R in the lower mold cavity MC to become the molded substrate Sb (step S56). Thereafter, the movable platen 34 is moved downward by the clamping mechanism 35 to open the upper mold UM and the lower mold LM. Next, the substrate transport mechanism 44 is moved from the predetermined position S1 of the substrate supply module 4 to a predetermined position C1 on the lower mold LM, and the substrate transport mechanism 44 receives the molded substrate Sb. Next, the substrate transport mechanism 44 is moved to above the substrate placement part 43 via the predetermined position S1, and the molded substrate Sb is delivered to the substrate placement part 43. The substrate placement part 43 stores the molded substrate Sb in the molded substrate storage part 42.

[0039] As described above, when the resin supply mechanism 26 supplies the powdered resin R to the resin storage section 24, the weight of the supplied powdered resin R is measured by a weight sensor (not shown), and the measured weight data of the powdered resin R is sent to the control section 5 at any time. Then, when the weight of the powdered resin R supplied to the resin storage section 24 reaches a predetermined amount, the supply of the powdered resin R is stopped. Note that the "predetermined amount" is the amount of resin that can properly seal the pre-molded substrate Sa to be resin-sealed without unfilled or voids. The control section 5 determines that the weight of the powdered resin R finally supplied to the resin storage section 24 is appropriate when it is the predetermined amount. However, if the weight of the powdered resin R in the resin storage section 24 exceeds the predetermined amount for some reason while the resin supply mechanism 26 has stopped supplying the powdered resin R, the powdered resin R cannot be used to seal the pre-molded substrate Sa. Therefore, such powdered resin R and the release film F must be discarded. In this case, the control unit 5 determines that the supplied powdered or granular resin R is not proper (Yes in step S54).

[0040] When the control unit 5 determines that the powdered or granular resin R supplied to the resin containing unit 24 is not appropriate, the control unit 5 operates the resin recovery mechanism 6 to recover the powdered or granular resin R. In response to an instruction from the control unit 5, the resin recovery mechanism 6 moves the plate-shaped member 61 by an actuator (not shown) or the like, and places the plate-shaped member 61 so as to cover the upper part of the resin containing unit 24 including the frame-shaped member 24a. Then, the air pump 65 and the air compressor (not shown) are operated to cause the powdered or granular resin R in the resin containing unit 24 (resin containing space 62) to flow through the first hose 63 from the first hole 61a and be recovered in the resin recovery unit 66 (recovery process) (step S57). The release film F after the powdered or granular resin R is recovered is transferred from the XY table 21 to the resin conveying mechanism 25 together with the frame-shaped member 24a. The control unit 5 returns the resin transport mechanism 25 to the predetermined position M1, and then moves it from the +X direction to the -Y direction, and causes the release film F to be collected by the film collecting unit 67 (step S58).

[0041] [Another embodiment] Hereinafter, an embodiment other than the first and second embodiments will be described. Note that, for ease of understanding, the same terms and symbols will be used for the same members as those in the above-mentioned embodiments.

[0042] <1> In the first embodiment described above, the plate-shaped member 61 and the frame-shaped member 24a are closely attached to each other so that no gap G is generated at the boundary between them, but as in the second embodiment, the plate-shaped member 61 may be disposed so that a gap G is generated at the boundary between the plate-shaped member 61 and the frame-shaped member 24a. With this configuration, the pressure in the resin accommodating space 62 is always equal to the pressure of the air outside the resin accommodating section 24. Therefore, even if the amount of air in the resin accommodating space 62 sucked per unit time from the first hole 61a by the air pump 65 is not equal to the amount of air per unit time supplied to the resin accommodating space 62 from the four second holes 61b by the air compressor, the pressure (air pressure) in the resin accommodating space 62 can always be kept constant.

[0043] <2> In the above-described first embodiment, the second hose 64 is connected to the second hole 61b to supply air to the resin accommodating space 62, but the second hole 61b may be configured to communicate with outside air without connecting the second hose 64. By doing so, even if the plate-shaped member 61 and the frame-shaped member 24a are brought into close contact with each other so that no gap G is formed at the boundary between them, the pressure in the resin accommodating space 62 can always be equal to the pressure of the air outside the resin accommodating section 24.

[0044] <3> In each of the above-described embodiments, only one first hole 61a is formed, but two or more first holes 61a may be formed. The first holes 61a can be formed at optimal positions depending on the distribution of the powdered or granular resin R on the release film F.

[0045] <4> In each of the above-described embodiments, the second holes 61b are formed near the four corners of the plate-like member 61, but they may be formed in other locations. Also, four second holes 61b are formed around the first hole 61a, but three or less, or five or more, may be formed. The second holes 61b can be formed in optimal locations and in an optimal number depending on the distribution of the powdered or granular resin R on the release film F.

[0046] <5> In each of the above-described embodiments, the resin recovery mechanism 6 is disposed adjacent to the resin supply mechanism 26, but the resin recovery mechanism 6 may be disposed at a position where the powdered resin R supplied by the resin supply mechanism 26 can be recovered without significantly moving the resin storage unit 24 when the powdered resin R supplied by the resin supply mechanism 26 is not appropriate. For example, the plate-like member 61 of the resin recovery mechanism 6 may be disposed above the resin supply mechanism 26 (in the +Z direction) or above the moving path of the XY table 21. With this configuration, the plate-like member 61 can be lowered to easily cover the upper part of the resin storage unit 24 disposed on the XY table 21. Also, the film recovery unit 67 of the resin recovery mechanism 6 may be provided in the middle of the moving path of the XY table 21.

[0047] <6> In each of the above-described embodiments, the criterion by the control unit 5 as to whether the powdered resin R is appropriate or not is whether the weight of the powdered resin R supplied to the release film F is a predetermined amount or not, but is not limited thereto. The criterion as to whether the powdered resin R is appropriate or not may be, for example, whether the flow rate of the powdered resin R when the powdered resin R is supplied from the resin supply mechanism 26 exceeds a threshold value or not. In this case, if the flow rate of the powdered resin R exceeds the threshold value, the control unit 5 determines that the powdered resin R is not appropriate. In addition, the criterion may be whether the distribution of the powdered resin R supplied on the release film F is uniform or not. In this case, if the distribution of the powdered resin R supplied on the release film F is not uniform, the control unit 5 determines that the powdered resin R is not appropriate. The criterion as to whether the powdered resin R is appropriate or not is whether a good molded substrate Sb can be manufactured when the powdered resin R supplied on the release film F is used, and any criterion for this purpose may be adopted.

[0048] <7> In each of the above-described embodiments, the release film F after the powdered or granular resin R is collected is transported to the film collection section 67 by the resin transport mechanism 25, but this is not limited to the above. Any other mechanism can be used. For example, after the powdered or granular resin R is collected, the release film F may be adsorbed to the plate-like member 61 by the air pump 65 and transported to the film collection section 67, and the release film F may be collected in the film collection section 67.

[0049] <8> The pre-molded substrate Sa resin-molded by the resin molding apparatus 1 in the above-described embodiment is, for example, a semiconductor substrate (such as a silicon wafer), a metal substrate (such as a lead frame), a glass substrate, a ceramic substrate, a resin substrate, or a wiring substrate.

[0050] [Summary of the above embodiment] Hereinafter, an outline of the resin molding apparatus 1 and the method for manufacturing the resin molded product (Sb) described in the above embodiment will be described.

[0051] (1) The resin molding apparatus (1) is characterized by comprising: a resin supplying mechanism (26) which supplies powdered or granular resin (R) to a resin storage section (24) including a release film (F) and a frame-shaped member (24a) arranged on the release film (F); a resin molding mechanism (3) which has a molding die (M) consisting of an upper die (UM) and a lower die (LM) facing the upper die (UM) and which performs resin molding by placing the release film (F) to which the powdered or granular resin (R) has been supplied between the upper die (UM) and the lower die (LM); and a resin recovery mechanism (6) which is capable of sucking and recovering the powdered or granular resin (R) supplied to the resin storage section (24) before the release film (F) is arranged in the molding die (M).

[0052] The resin molding apparatus (1) according to this characteristic configuration has a resin recovery mechanism (6), so that the powdered or granular resin (R) supplied onto the release film (F) in the resin storage section (24) can be separated from the release film (F) and recovered. As a result, only the release film (F) remains in the resin storage section (24), so that only the release film (F) can be recovered. Therefore, it is possible to provide a resin molding apparatus (1) that can automatically separate and recover the powdered or granular resin (R) and the release film (F).

[0053] (2) In the resin molding apparatus (1) described in (1) above, the resin recovery mechanism (6) may include a plate-shaped member (61) covering an upper portion of the resin storage section (24) including the frame-shaped member (24a) and forming a resin storage space (62) between the release film (F) and the frame-shaped member (24a), a recovery path (63) having one end connected to a first hole (61a) formed in the plate-shaped member (61) and the other end connected to a suction source (65), and a recovery section (66) connected to the other end of the recovery path (63).

[0054] With this configuration, the upper part of the resin storage section (24) is covered with the plate-shaped member (61) to form a resin storage space (62), and by operating the suction source (65), the powdered or granular resin (R) supplied to the resin storage section (24) can be sucked in and recovered from the first hole (61a) through the recovery path (63) to the recovery section (66).

[0055] (3) In the resin molding apparatus (1) described in (2) above, the plate-like member (61) may have a second hole (61b) that connects the resin accommodating space (62) to the outside of the resin accommodating space (62) and allows gas to be supplied thereto.

[0056] Gas (air) is sucked in together with the powdered or granular resin (R) from the first hole (61a). With this configuration, gas is supplied to the resin containing space (62) from the second hole (61b), so that the gas in the resin containing space (62) can be prevented from decreasing. As a result, problems such as the release film (F) floating up or leakage of the powdered or granular resin (R) can be prevented.

[0057] (4) In the resin molding apparatus (1) described in (3) above, the plate-like member (61) may have a plurality of second holes (61b), and the plurality of second holes (61b) may be arranged around the first hole (61a).

[0058] When the suction source (65) sucks the resin in the resin storage space (62), a suction force also acts on the release film (F). However, in this configuration, since the multiple second holes (61b) are arranged around the first hole (61a), even if a suction force acts on the release film (F), the gas supplied to the resin storage space (62) from the multiple second holes (61b) arranged around the first hole (61a) can hold the periphery of the part of the release film (F) where the suction force acts, so that the release film (F) can be effectively prevented from being sucked by the suction force. In addition, when the gas hits the powdered or granular resin (R), the powdered or granular resin (R) is lifted up, so that the powdered or granular resin (R) around the first hole (61a) is easily sucked, and the powdered or granular resin (R) can be collected in a short time.

[0059] (5) In the resin molding apparatus (1) described in (3) or (4) above, the plate-like member (61) may be in contact with the frame-like member (24a) and cover the upper part of the resin containing portion (24).

[0060] Since gas (air) is sucked in together with the powdered or granular resin (R) through the first hole (61a), when the plate-shaped member (61) is in contact with the frame-shaped member (24a) and covers the upper part of the resin containing section (24), the resin containing space (62) will be under negative pressure unless gas is supplied to the resin containing space (62) through the second hole (61b). However, with this configuration, by supplying gas to the resin containing space (62) through the second hole (61b) and making the amount of gas in the resin containing space (62) sucked in per unit time through the first hole (61a) by the suction source (65) equal to the amount of gas supplied per unit time to the resin containing space (62) through the second hole (61b), the powdered or granular resin (R) can be collected while maintaining the pressure (atmospheric pressure) in the resin containing space (62) constant.

[0061] (6) In the resin molding apparatus (1) described in any one of (2) to (4) above, the plate-shaped member (61) may cover an upper portion of the resin storage section (24) with a gap (G) formed between the plate-shaped member (61) and the frame-shaped member (24a).

[0062] With this configuration, the gas pressure in the resin containing space (62) can always be equal to the air pressure outside the resin containing section (24). As a result, the powdered or granular resin (R) around the first hole (61a) is easily sucked in, and the powdered or granular resin (R) can be collected in a short time.

[0063] (7) The manufacturing method of the resin molded product (Sb) is characterized in that it includes a resin supplying step of supplying a predetermined amount of powdered or granular resin (R) to a resin storage section (24) including a release film (F) and a frame-shaped member (24a) arranged on the release film (F); a determination step of determining whether the powdered or granular resin (R) supplied to the resin storage section (24) is appropriate or not; a recovery step of suctioning and recovering the powdered or granular resin (R) supplied to the resin storage section (24) if it is determined in the determination step that the powdered or granular resin (R) is not appropriate; and a molding step of placing the release film (F) to which the powdered or granular resin (R) has been supplied and the object to be molded (Sa) between the upper mold (UM) and the lower mold (LM) to perform resin molding if it is determined in the determination step that the powdered or granular resin (R) is appropriate.

[0064] The manufacturing method for the resin molded product (Sb) according to this feature includes a judgment step of judging whether the powdered resin (R) supplied to the resin storage section (24) in the resin supply step is proper or not. Therefore, only the powdered resin (R) judged to be proper in the judgment step can be placed between the upper die (UM) and the lower die (LM) for resin molding. If the powdered resin (R) is judged to be improper in the judgment step, the powdered resin (R) supplied to the resin storage section (24) is separated from the release film (F) and collected in the collection step, so that the powdered resin (R) and the release film (F) can be automatically separated and collected.

[0065] (8) In the manufacturing method of the resin molded product (Sb) described in (7) above, the judgment step may judge that the powdered resin (R) is inappropriate when the supply amount of the powdered resin (R) exceeds a predetermined amount, when the flow rate of the powdered resin (R) exceeds a threshold value, or when the distribution of the powdered resin (R) is uneven.

[0066] This feature makes it possible to reliably recover powdered or granular resin (R) that may not be able to be used to produce non-defective products during the molding process. [Industrial Applicability]

[0067] The present invention can be used in a resin molding apparatus and a method for manufacturing a resin molded product. [Explanation of symbols]

[0068] 1:Resin molding equipment 3: Resin molding module (resin molding mechanism) 6: Resin recovery mechanism 24: Resin storage section 24a: Frame-shaped member 26:Resin supply mechanism 61: Plate-shaped member 61a: 1st hole 61b: 2nd hole 62: Resin storage space 63: First hose (recovery route) 65: Air pump (suction source) 66: Resin recovery section (recovery section) F: Release film G: Gap LM: Lower mold M: Molding mold R: Powder-like resin Sa: Pre-molding substrate (molding target) Sb: Molded substrate (plastic molded product) UM: Upper mold

Claims

1. a resin supplying mechanism that supplies a powdered or granular resin to a resin containing section including a release film and a frame-shaped member disposed on the release film; a resin molding mechanism having a molding die including an upper die and a lower die facing the upper die, the release film having the powdered resin supplied thereto being disposed between the upper die and the lower die, and performing resin molding; a resin recovery mechanism capable of sucking and recovering the powdered resin supplied to the resin storage section before the release film is placed on the molding die.

2. The resin molding apparatus of claim 1, wherein the resin recovery mechanism includes a plate-shaped member that covers an upper portion of the resin accommodation section including the frame-shaped member and forms a resin accommodation space between the release film and the frame-shaped member, a recovery path having one end connected to a first hole formed in the plate-shaped member and the other end connected to a suction source, and a recovery section connected to the other end of the recovery path.

3. The resin molding apparatus according to claim 2 , wherein the plate-like member has a second hole through which the resin containing space can communicate with the outside of the resin containing space and through which gas can be supplied.

4. the plate-like member has a plurality of the second holes, The resin molding apparatus according to claim 3 , wherein the second holes are arranged around the first hole.

5. The resin molding apparatus according to claim 3 or 4, wherein the plate-like member contacts the frame-like member to cover an upper portion of the resin containing portion.

6. The resin molding apparatus according to claim 2 , wherein the plate-like member covers an upper portion of the resin containing portion with a gap between the plate-like member and the frame-like member.

7. a resin supplying step of supplying a predetermined amount of powdered or granular resin to a resin containing section including a release film and a frame-shaped member disposed on the release film; a determining step of determining whether the powdered or granular resin supplied to the resin storage section is proper; a recovery step of suctioning and recovering the powdered or granular resin supplied to the resin storage section when the powdered or granular resin is determined to be inappropriate in the determination step; and if the powdered or granular resin is judged to be appropriate in the judgment step, a molding step is performed in which the release film to which the powdered or granular resin has been supplied and an object to be molded are placed between an upper mold and a lower mold to perform resin molding.

8. The method for manufacturing a resin molded product according to claim 7, wherein the determination step determines that the powdered resin is not appropriate when the supply amount of the powdered resin exceeds the predetermined amount, when the flow rate of the powdered resin exceeds a threshold value, or when the distribution of the powdered resin is uneven.

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