Wiring structure

Abstract

To ensure electrical connection stability for solder.SOLUTION: In a wiring structure 1, a first conductor pattern 10 includes a land portion 12. The land portion 12 is composed of a conductive material embedded in a first groove portion 5. The land portion 12 has a central conductive portion 13 and a peripheral conductive portion 14. The central conductive portion 13 and the peripheral conductive portion 14 each include a recessed portion 17. The recessed portion 17 is configured to be recessed from a position corresponding to the surface of the first layer 3 toward the bottom of the first groove portion 5 in a cross-sectional view.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present disclosure relates to wiring structures. [Background technology]

[0002] Conventionally, as an example of a wiring structure applicable to a semiconductor device or the like, there is a wiring structure shown in Patent Document 1. Specifically, Patent Document 1 discloses a printed wiring board 11. A connection land 12 is provided on one surface of the printed wiring board 11. The connection land 12 is connected to an external electrode 7 via a solder layer 13. The connection land 12 and the external electrode 7 are connected to form a mounting structure of the semiconductor device. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2002-313991 A Summary of the Invention [Problem to be solved by the invention]

[0004] The connection land 12 shown in Patent Document 1 is formed solidly on one surface of the printed wiring board 11 in a plan view. Due to this shape, when the amount of the solder layer 13 is relatively small, the adhesion between the connection land 12 and the solder layer 13 may not be sufficiently ensured. As a result, there is a risk that the stability of the electrical connection between the connection land 12 and the external electrode 7 may be impaired.

[0005] Moreover, the connection land 12 protrudes from one surface of the printed wiring board 11 in a cross-sectional view (see FIG. 2(b) of Patent Document 1). That is, the side portion of the connection land 12 is exposed to the outside. On the other hand, the side portion of the connection land 12 is not covered by an insulating layer or the like. For this reason, for example, when the printed wiring board 11 is processed or when the printed wiring board 11 comes into contact with another object during storage of the printed wiring board 11, the connection land 12 may be damaged. Even in such a case, the adhesion between the connection land 12 and the solder layer 13 is not sufficiently guaranteed, and the electrical connection stability between the connection land 12 and the external electrode 7 may be impaired. Furthermore, in order to prevent the risk of the connection land 12 being damaged in advance, it is necessary to cover the connection land 12 with an insulating layer that is not disclosed in Patent Document 1 in advance. However, there is also a problem that the labor required to cover the insulating layer is additionally required, which results in an increase in manufacturing costs.

[0006] The present disclosure has been made in consideration of the above points, and has an object to ensure electrical connection stability to solder in a wiring structure. [Means for solving the problem]

[0007] In order to achieve the above object, one embodiment of the present disclosure is a wiring structure, the wiring structure including a substrate including a first layer and a first conductor pattern provided in the first layer. A plurality of first grooves are provided in the first layer. The first conductor pattern includes at least one land portion. The land portion is formed of a conductive material embedded in at least one of the plurality of first grooves. The land portion has a central conductive portion and at least one peripheral conductive portion formed in a ring shape in a plan view. The peripheral conductive portion is disposed at an interval from the central conductive portion in a plan view and disposed so as to surround the central conductive portion from the outside. Each of the central conductive portion and the peripheral conductive portion is provided with a recessed portion, and the recessed portion is configured to be recessed from a position corresponding to the surface of the first layer toward the bottom of the first groove portion in a cross-sectional view. Effect of the Invention

[0008] According to the present disclosure, it is possible to ensure the stability of electrical connection to solder. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a cross-sectional view that illustrates a schematic cross-sectional configuration of a wiring structure according to an embodiment of the present disclosure. [Diagram 2] FIG. 2 is a plan view showing the configuration of the land portion. [Diagram 3] FIG. 3 is a cross-sectional view taken along line III-III in FIG. [Figure 4] FIG. 4 is a partially enlarged plan view showing a portion IV in FIG. [Diagram 5] FIG. 5 is a cross-sectional view taken along line VV in FIG. [Figure 6] FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The following description of the embodiments is merely illustrative in nature and is not intended to limit the present disclosure, its application, or its uses.

[0011] 1 shows a cross-sectional configuration of an interconnect structure 1 according to an embodiment of the present disclosure. This interconnect structure 1 can be applied to, for example, a wiring substrate of a semiconductor device.

[0012] (substrate) 1, the wiring structure 1 includes a substrate 2. In this embodiment, in the thickness direction of the substrate 2, the side on which the first layer 3 is located is defined as the "upper side" of the substrate 2, while the side on which the second layer 4 is located is defined as the "lower side" of the substrate 2. This positional relationship is unrelated to the direction in which the wiring structure 1 or a device in which the wiring structure 1 is incorporated is actually used.

[0013] The substrate 2 includes a first layer 3 and a second layer 4. The thickness of each of the first layer 3 and the second layer 4 is, for example, 5 μm to 15 μm.

[0014] The first layer 3 and the second layer 4 are made of, for example, a resin material that does not have light transmittance (non-light transmittance resin material). Examples of the resin material include resin materials such as PET (polyethylene terephthalate), polycarbonate, COP (cycloolefin polymer), and COC (cycloolefin copolymer). The first layer 3 and the second layer 4 may be made of a resin material that is transparent and light transmittance.

[0015] (first groove) 1 and 3, a plurality of first grooves 5 are provided in the first layer 3. Each of the first grooves 5 is formed in a bottomed shape recessed from the surface of the first layer 3 (the upper surface of the first layer 3) toward the side located at the second layer 4.

[0016] The first grooves 5 are formed in a predetermined pattern (not shown) on the surface of the first layer 3. The depth of the first grooves 5 is, for example, not less than 1 μm and less than 5 μm. The width of the first grooves 5 is, for example, not more than 50 μm.

[0017] (first through hole) As shown in FIG. 1, a plurality of first through holes 6 are provided in the first layer 3. Each of the first through holes 6 penetrates from the bottom side of the first groove portion 5 (see FIG. 3) corresponding to the central conductive portion 13 described below toward the second layer 4. That is, each of the first through holes 6 is arranged so as to overlap with the central conductive portion 13. Each of the first through holes 6 is formed in a substantially conical shape such that the opening area gradually increases from the bottom side of the first groove portion 5 toward the second layer 4. Although not shown, each of the first through holes 6 may be formed in a substantially conical shape such that the opening area gradually decreases from the bottom side of the first groove portion 5 toward the second layer 4.

[0018] (Second groove) As shown in Fig. 1, a plurality of second groove portions 7 are provided in the second layer 4. Each of the second groove portions 7 is formed in a bottomed shape recessed downward from the upper surface of the second layer 4 (the surface located on the upper side of the paper in Fig. 1).

[0019] Here, when forming each second groove portion 7, it is sufficient to form it by a predetermined forming method so as to have a groove shape of a predetermined depth in the second layer 4. One example of this forming method is a method in which a base layer (not shown) having a thickness equivalent to the depth corresponding to each second groove portion 7 is formed, and then the base layer is partially removed at the places corresponding to the positions of each second groove portion 7. Each second groove portion 7 can be formed by such a forming method.

[0020] The second grooves 7 are formed in a predetermined pattern (not shown) on the upper surface of the second layer 4. The second grooves 7 have a depth of, for example, 5 μm to 20 μm. The second grooves 7 have a width of, for example, 35 μm or less.

[0021] (Second through hole) 1, the second layer 4 is provided with a plurality of second through holes 8. Each second through hole 8 penetrates downward from the bottom side of a second groove portion 7 corresponding to a second conductive portion 22 described later. Each second through hole 8 is arranged so as to correspond to the position of the first through hole 6 in the thickness direction of the substrate 2. Although not shown, the second through holes 8 may be arranged in a shifted state so as not to correspond to the position of the first through hole 6 in the thickness direction of the substrate 2.

[0022] Each second through hole 8 is formed in a generally conical shape such that the opening area gradually increases downward from the bottom side of the second groove portion 7. Although not shown, each second through hole 8 may be formed in a generally conical shape such that the opening area gradually decreases downward from the bottom side of the second groove portion 7.

[0023] Here, when forming each second through hole 8, it is sufficient to form it by a predetermined method so as to have a shape of a predetermined depth with respect to the second layer 4. One example of this method is a method in which a base layer (not shown) (a layer different from the base layer for forming each of the above-mentioned second groove portions 7) having a thickness equivalent to the depth corresponding to each of the second through holes 8 is formed, and then the base layer is partially removed at the locations corresponding to the positions of each of the second through holes 8. By such a method, each of the second through holes 8 can be formed.

[0024] (First conductor pattern) As shown in Fig. 1, the wiring structure 1 includes a first conductor pattern 10. The first conductor pattern 10 is provided on a first layer 3. The first conductor pattern 10 is composed of a plurality of first conductive wires 11 and a plurality of land portions 12. Note that, for convenience of illustration, each land portion 12 is shown in a simplified manner in Fig. 1.

[0025] (First conductive wire) The first conductive wire 11 is made of a conductive material embedded in the first groove portion 5. The conductive material is, for example, a conductive metal. Suitable conductive metals include, for example, copper, a copper-nickel alloy, silver, gold, and an alloy containing at least one of these metals. The first conductive wire 11 is formed by, for example, deposition, sputtering, electroless plating, or electroplating.

[0026] The first conductive wires 11 are thinned. The line width of the first conductive wires 11 is, for example, 50 μm or less. The multiple first conductive wires 11 are formed in a predetermined pattern (not shown).

[0027] Each of the first conductive wires 11 is disposed at a distance from each of the land portions 12. In other words, the first conductive wires 11 are electrically insulated from the land portions 12.

[0028] (Land section) The multiple lands 12 are elements for connection with solder (see symbol S shown in Figs. 1 to 3). As shown in Fig. 1, the multiple lands 12 are arranged at intervals from one another in the planar direction of the first layer 3. In other words, the lands 12, 12 are electrically insulated from one another.

[0029] As shown in Figure 2, the land portion 12 of this embodiment has one central conductive portion 13, multiple (three in the illustrated example) peripheral conductive portions 14, multiple first ladder portions 15, and multiple second ladder portions 16.

[0030] (Central conductive part) 2, the central conductive portion 13 in this embodiment is formed in a circular shape in a plan view. The central conductive portion 13 is disposed such that the center of the circle overlaps with the center of the land portion 12.

[0031] As shown in Fig. 3, central conductive portion 13 is made of a conductive material embedded in first groove portion 5 located at the center of land portion 12. As shown in Fig. 4, central conductive portion 13 is configured so that width dimension W1 (diameter of the circular shape) is larger than width dimension W2 of each peripheral conductive portion 14. Width dimension W1 of central conductive portion 13 is set to, for example, 10 µm.

[0032] (Outer conductive part) 2, each of the outer circumferential conductive portions 14 is formed in a ring shape in a plan view. Specifically, each of the outer circumferential conductive portions 14 has a diameter different from the others, and is formed in a concentric ring shape with the central conductive portion 13 as the center in a plan view.

[0033] The multiple peripheral conductive portions 14 are arranged at intervals from the central conductive portion 13 in a plan view. In this embodiment, the multiple peripheral conductive portions 14 are arranged at equal intervals. The multiple peripheral conductive portions 14 are arranged so as to surround the central conductive portion 13 from the outside in a plan view.

[0034] 3, the peripheral conductive portion 14 is made of a conductive material embedded in the first groove portion 5. The width dimension W2 (see FIG. 4) of the peripheral conductive portion 14 is set to, for example, 3 μm.

[0035] (First and second ladder sections) 2, the multiple first ladder portions 15 are disposed, in a plan view, between the central conductive portion 13 and the outer circumferential conductive portion 14 adjacent to the central conductive portion 13. Each first ladder portion 15 is formed integrally with the central conductive portion 13 and the outer circumferential conductive portion 14. In other words, the first ladder portion 15 is configured to connect the central conductive portion 13 and the outer circumferential conductive portion 14.

[0036] In a plan view, the multiple first ladder portions 15 extend radially from the central conductive portion 13 toward the peripheral conductive portion 14. Specifically, each first ladder portion 15 extends along a normal direction relative to a tangent to the outline (circle) of the central conductive portion 13.

[0037] The multiple first ladder portions 15 are arranged at intervals in the circumferential direction of the central conductive portion 13. In this embodiment, the multiple first ladder portions 15 are arranged at equal intervals (45° in the illustrated example) in the circumferential direction of the central conductive portion 13.

[0038] The second ladder sections 16 are disposed between adjacent peripheral conductive sections 14, 14 in a plan view. Each second ladder section 16 is formed integrally with the adjacent peripheral conductive sections 14, 14. That is, the second ladder sections 16 are configured to connect the adjacent peripheral conductive sections 14, 14 to each other.

[0039] In a plan view, the multiple second ladder portions 16 extend radially from the outer circumferential conductive portion 14 located closer to the central conductive portion 13 to the outer circumferential conductive portion 14 located on the outermost periphery. Specifically, each second ladder portion 16 extends along a normal direction to a tangent to the outline (circle) of the outer circumferential conductive portion 14.

[0040] The multiple second ladder portions 16 are arranged at intervals in the circumferential direction of the outer circumferential conductive portion 14. In this embodiment, the multiple second ladder portions 16 are arranged at equal intervals (45° in the illustrated example) in the circumferential direction of the outer circumferential conductive portion 14.

[0041] First and second ladder portions 15, 16 are configured to be narrower than peripheral conductive portion 14. Note that first and second ladder portions 15, 16 may have the same width as peripheral conductive portion 14.

[0042] In this embodiment, one first ladder portion 15 and two second ladder portions 16, 16 are arranged in a straight line from the outer circumferential conductive portion 14 located on the outermost periphery toward the central conductive portion 13.

[0043] (Recessed part) 4, each of central conductive portion 13 and peripheral conductive portion 14 has recessed portion 17. Recessed portion 17 is configured to be recessed from a position corresponding to the surface of first layer 3 (upper surface of first layer 3) toward the bottom of first groove portion 5 in cross-sectional view. Specifically, recessed portion 17 is formed so that its side and bottom surfaces curve from a position corresponding to the surface of first layer 3 toward the center of the bottom surface of recessed portion 17 in cross-sectional view.

[0044] Recess 17a of central conductive portion 13 is configured to have a width dimension W1 shown in Fig. 4. Recess 17b of peripheral conductive portion 14 is configured to have a width dimension W2 shown in Fig. 4.

[0045] Central conductive portion 13 is configured such that width dimension W1 of recessed portion 17a is larger than width dimension W2 of recessed portion 17b in peripheral conductive portion 14. Central conductive portion 13 is also configured such that depth dimension D1 of recessed portion 17a is larger than depth dimension D2 of recessed portion 17b in peripheral conductive portion 14.

[0046] 5, a recess 17c is provided in each first ladder portion 15. In this embodiment, a width dimension W3 of the recess 17c is configured to be smaller than a width dimension W2 of the recess 17b in the outer circumferential conductive portion 14.

[0047] 6, a recess 17d is provided in each second ladder portion 16. In this embodiment, a width dimension W4 of the recess 17d is configured to be smaller than a width dimension W2 of the recess 17b in the outer circumferential conductive portion 14.

[0048] (Second Conductor Pattern) 1, the wiring structure 1 includes a second conductor pattern 20. The second conductor pattern 20 is provided on a second layer 4. The second conductor pattern 20 is composed of a plurality of second conductive lines 21 and a plurality of second conductive portions 22.

[0049] Each second conductive wire 21 is made of a conductive material embedded in each second groove portion 7. The line width of the second conductive wire 21 is formed to be larger than the line width of the first conductive wire 11. The method of forming each second groove portion 7 is as described above.

[0050] The conductive material constituting the second conductive wire 21 may be the same as the conductive material of the first conductive wire 11. Alternatively, when the conductive material is made of a predetermined alloy, the first conductive wire 11 and the second conductive wire 21 may be made of conductive materials having different properties by appropriately adjusting the content of nickel, etc.

[0051] Each second conductive portion 22 is made of a conductive material embedded in each second groove portion 7. The conductive material constituting the second conductive portion 22 is the same as the conductive material of the second conductive wire 21.

[0052] (Third Conductor Pattern) 1, the wiring structure 1 includes a third conductor pattern 30. The third conductor pattern 30 is provided on the lower surface of the second layer 4. The third conductor pattern 30 is composed of a plurality of third conductive lines 31 and a plurality of third conductive portions 32.

[0053] The third conductive wire 31 is composed of a conductive material laminated on the lower surface of the second layer 4. The conductive material constituting the third conductive wire 31 is the same as the conductive material of each of the second conductive wires 21. The line width of the third conductive wire 31 is approximately the same as the line width of the second conductive wires 21.

[0054] The third conductive portion 32 is made of a conductive material laminated on the lower surface of the second layer 4. The conductive material that makes up the third conductive portion 32 is the same as the conductive material of the third conductive wire 31.

[0055] (First and second vias) 1, the wiring structure 1 includes a plurality of first via portions 41 and a plurality of second via portions 42. The first and second via portions 41, 42 are elements for electrically connecting the land portion 12 of the first conductor pattern 10, the second conductive portion 22, and the third conductive portion 32.

[0056] A plurality of first via portions 41 are provided in the first layer 3. The first via portions 41 are configured to electrically connect the land portion 12 and the second conductive portion 22. The first via portions 41 are formed in a generally conical shape that gradually becomes larger from the bottom side of the first groove portion 5 toward the second layer 4.

[0057] The first via portion 41 is made of a conductive material embedded in the first through hole 6. This conductive material is, for example, a conductive metal. As the conductive metal, for example, copper, silver, gold, nickel, or an alloy containing at least one of these metals is suitable. The first via portion 41 is formed by, for example, vapor deposition, sputtering, electroless plating, or electroplating.

[0058] The second via portions 42 are provided in the second layer 4. The second via portions 42 are configured to electrically connect the first via portions 41 and the third conductive portion 32. The second via portions 42 are formed in a generally conical shape that gradually becomes larger from the bottom side of the second groove portion 7 downward.

[0059] The second via portion 42 is formed of a conductive material filled in the second through hole 8. The conductive material forming the second via portion 42 is the same as the conductive material of the first via portion 41.

[0060] [Effects of the embodiment] In this embodiment, the land portion 12 is made of a conductive material embedded in the first groove portion 5. According to this configuration, the conductive material constituting the land portion 12 is covered by the first groove portion 5. That is, the land portion 12 is not formed in a solid shape on the surface of the substrate 2 (first layer 3) in a plan view, and the side portion of the land portion 12 is not exposed to the outside. For this reason, for example, when a product (for example, a wiring board of a semiconductor device) having the wiring structure 1 is processed, or even if the wiring board comes into contact with another object during storage of the wiring board, the land portion 12 is less likely to be damaged. That is, the shape of the land portion 12 is easily maintained. As a result, when solder is joined to the land portion 12, adhesion between the solder and the land portion 12 is easily obtained. For this reason, it is possible to ensure the stability of the electrical connection between the land portion 12 and an external electrode (not shown) via the solder.

[0061] Each of the central conductive portion 13 and the peripheral conductive portion 14 includes a recessed portion 17, which is configured to recess from a position corresponding to the surface of the first layer 3 toward the bottom of the first groove portion 5 in a cross-sectional view. With this configuration, when the liquefied solder is joined to the land portion 12, the solder easily enters the recessed portion 17. After that, the contact area between the solidified solder and the recessed portion 17 relatively increases. As a result, a so-called anchor effect is easily generated between the solidified solder and the recessed portion 17, and the adhesion between the solder and the recessed portion 17 is improved. This makes it possible to ensure the stability of the electrical connection between the land portion 12 and the external electrode via the solder.

[0062] Therefore, in the wiring structure 1 according to the embodiment of the present disclosure, it is possible to ensure electrical connection stability with respect to the solder. Note that, unlike the configuration of the conventional technology (for example, the printed wiring board of Patent Document 1), in the wiring structure 1 according to the embodiment of the present disclosure, there is no need to coat an insulating layer (not shown) in advance. Therefore, the labor required for coating an insulating layer is not required, and the problem of increased manufacturing costs does not occur.

[0063] Moreover, the central conductive portion 13 is configured such that the width dimension W1 of the recessed portion 17a is larger than the width dimension W2 of the recessed portion 17b of the peripheral conductive portion 14 in a cross-sectional view. With this configuration, when the liquefied solder is joined to the land portion 12, the solder is more likely to enter the recessed portion 17a of the central conductive portion 13 than the recessed portion 17b of the peripheral conductive portion 14. That is, the liquefied solder is less likely to diffuse toward the outside of the area of ​​the land portion 12. This makes it easier to obtain an anchor effect between the solidified solder and the recessed portion 17a of the central conductive portion 13. As a result, the adhesion between the solidified solder and the land portion 12 is improved near the center of the land portion 12. Therefore, it is possible to improve the stability of the electrical connection between the land portion 12 and the external electrode via the solder.

[0064] Furthermore, the central conductive portion 13 is configured such that, in a cross-sectional view, the depth dimension D1 of the recess 17a is greater than the depth dimension D2 of the recess 17b of the peripheral conductive portion 14. With this configuration, when liquefied solder is joined to the land portion 12, the solder is more likely to enter the recess 17a of the central conductive portion 13 than the recess 17b of the peripheral conductive portion 14. In other words, the liquefied solder is less likely to diffuse outward from the area of ​​the land portion 12. This makes it easier to obtain the anchor effect, and makes it possible to increase the stability of the electrical connection between the land portion 12 and the external electrode via the solder.

[0065] Furthermore, in this embodiment, the width dimension W1 of the recessed portion 17a is larger than the width dimension W2 of the recessed portion 17b, and the depth dimension D1 of the recessed portion 17a is larger than the depth dimension D2 of the recessed portion 17b. Therefore, due to the above-mentioned action, it is possible to further improve the stability of the electrical connection between the land portion 12 and the external electrode via the solder.

[0066] Further, the first ladder portions 15 are disposed between the central conductive portion 13 and the peripheral conductive portion 14 adjacent to the central conductive portion 13 in a plan view. Each first ladder portion 15 is integrally formed with the central conductive portion 13 and the peripheral conductive portion 14 adjacent to the central conductive portion 13. Each first ladder portion 15 is provided with a recessed portion 17c. With this configuration, when liquefied solder is joined to the land portion 12, the solder is likely to pass from the recessed portion 17b of the peripheral conductive portion 14 through the recessed portion 17c of each first ladder portion 15 and enter the recessed portion 17a of the central conductive portion 13. This makes it easier to obtain the anchor effect, and makes it possible to increase the stability of the electrical connection between the land portion 12 and the external electrode via the solder.

[0067] Moreover, each of the multiple outer circumferential conductive portions 14 has a different diameter and is formed in a concentric ring shape centered on the central conductive portion 13 in a plan view. By providing the multiple outer circumferential conductive portions 14, the contact area between the solder and the land portion 12 is increased, thereby ensuring the stability of the electrical connection to the solder.

[0068] Moreover, the second ladder portions 16 are disposed between the peripheral conductive portions 14, 14 adjacent to each other in a plan view. Each second ladder portion 16 is formed integrally with the peripheral conductive portions 14, 14 adjacent to each other. Each second ladder portion 16 is provided with a recessed portion 17d. With this configuration, when liquefied solder is joined to the land portion 12, the solder is likely to flow from the recessed portion 17b of each peripheral conductive portion 14 through the recessed portion 17c of each first ladder portion 15 and the recessed portion 17d of each second ladder portion 16 into the recessed portion 17a of the central conductive portion 13. This makes it easier to obtain the above-mentioned anchor effect, and the stability of the electrical connection between the land portion 12 and the external electrode can be improved via the solder.

[0069] Furthermore, in this embodiment, the one first ladder portion 15 and the two second ladder portions 16, 16 are arranged in a straight line from the outer peripheral conductive portion 14 located at the outermost periphery toward the central conductive portion 13. With this configuration, when liquefied solder is joined to the land portion 12, the solder easily flows from the recessed portion 17b of each outer peripheral conductive portion 14 through the recessed portion 17c of the first ladder portion and the recessed portions 17d, 17d of the second ladder portions 16, 16 arranged in a straight line into the recessed portion 17a of the central conductive portion 13. This makes it easier to obtain the above-mentioned anchor effect, and the stability of the electrical connection between the land portion 12 and the external electrode can be improved via the solder.

[0070] The first layer 3 is provided with a first via portion 41 for electrically connecting the land portion 12 and the second conductor pattern 20 provided on the second layer 4. This allows the wiring structure 1 according to this embodiment to be configured as a multilayer wiring structure.

[0071] [Other embodiments] In the illustrated examples of the above embodiment, the substrate 2 includes the first layer 3 and the second layer 4, but is not limited to this. For example, a third layer (not shown) may be provided on the surface of the second layer 4 opposite to the surface on which the first layer 3 is located.

[0072] In the illustrated examples of the above embodiment, a configuration in which the second layer 4 is provided is shown, but the present invention is not limited to this configuration. That is, the wiring structure 1 may be configured by the first layer 3, the first conductor pattern 10 (plurality of first conductive wires 11 and plurality of land portions 12) provided on the first layer 3, and plurality of second conductive portions 22, without providing the second layer 4. In such a configuration, the plurality of second conductive wires 21 may be omitted. Also, in the above configuration, the third conductor pattern 30 and the second via portion 42 are omitted.

[0073] In the illustrated examples relating to the above-described embodiment, the third conductor pattern 30 includes a plurality of third conductive wires 31 and a plurality of third conductive portions 32, but is not limited to this. For example, the third conductor pattern 30 may be composed of only a plurality of third conductive portions 32. In other words, a plurality of third conductive wires 31 does not have to be provided.

[0074] In the illustrated examples of the above embodiment, the land portion 12 has a plurality of peripheral conductive portions 14, but the present invention is not limited to this. That is, it is sufficient that the land portion 12 has at least one peripheral conductive portion 14.

[0075] In the illustrated example of the above embodiment, the multiple peripheral conductive parts 14 are arranged at equal intervals, but the present invention is not limited to this. That is, the multiple peripheral conductive parts 14 may be arranged such that the intervals between the peripheral conductive parts 14, 14 are different from each other.

[0076] In the illustrated example of the above embodiment, the central conductive portion 13 has a circular shape, but is not limited to this shape. Although not illustrated, the central conductive portion 13 may have, for example, a polygonal shape such as a triangular shape or a rectangular shape in a plan view.

[0077] In the illustrated example of the above embodiment, each of the outer circumferential conductive portions 14 has a circular ring shape, but is not limited to this shape. Although not illustrated, each of the outer circumferential conductive portions 14 may have, for example, a polygonal ring shape such as a triangular shape or a rectangular shape in a plan view.

[0078] In the illustrated example of the above embodiment, the side and bottom surfaces of the recessed portion 17 are curved, but the present invention is not limited to this. Although not illustrated, for example, only the side surfaces of the recessed portion 17 may be curved. Alternatively, only the bottom surface of the recessed portion 17 may be curved.

[0079] In the illustrated example of the above embodiment, a configuration in which the width dimension W1 of the recessed portion 17a in the central conductive portion 13 is larger than the width dimension W2 of the recessed portion 17b in the peripheral conductive portion 14 is shown, but this is not limited to this configuration. For example, the width dimension W1 of the recessed portion 17a may be set to the same size as the width dimension W2 of the recessed portion 17b.

[0080] In the illustrated example of the above embodiment, a configuration in which depth dimension D1 of recessed portion 17a in central conductive portion 13 is greater than depth dimension D2 of recessed portion 17b in peripheral conductive portion 14 is shown, but this is not limited to the configuration. For example, depth dimension D1 of recessed portion 17a may be set to the same size as depth dimension D2 of recessed portion 17b.

[0081] In the illustrated example of the above embodiment, the land portion 12 has a plurality of first ladder portions 15 and a plurality of second ladder portions 16, but the present invention is not limited to this. That is, if necessary, either one of the plurality of first ladder portions 15 or the plurality of second ladder portions 16 may be omitted. Alternatively, both the plurality of first ladder portions 15 and the plurality of second ladder portions 16 may be omitted.

[0082] In the illustrated example of the above embodiment, one first ladder portion 15 and two second ladder portions 16, 16 are arranged in a straight line from the outer peripheral conductive portion 14 located at the outermost periphery toward the central conductive portion 13, but this is not limited to the above. Although not illustrated, for example, multiple first ladder portions 15 may be arranged alternately with multiple second ladder portions 16 in the circumferential direction of the central conductive portion 13.

[0083] In the illustrated example of the above embodiment, the width dimension W3 of the recessed portion 17c in each first ladder portion 15 is smaller than the width dimension W2 of the recessed portion 17b in the outer circumferential conductive portion 14, but the present invention is not limited to this. For example, the width dimension W3 of the recessed portion 17c may be the same as the width dimension W2 of the recessed portion 17b.

[0084] In the illustrated example of the above embodiment, the width dimension W4 of the recessed portion 17d in each second ladder portion 16 is smaller than the width dimension W2 of the recessed portion 17b in the outer circumferential conductive portion 14, but this is not limited to the above. For example, the width dimension W4 of the recessed portion 17d may be the same as the width dimension W2 of the recessed portion 17b.

[0085] Although the embodiments of the present disclosure have been described above, the present disclosure is not limited to the above-described embodiments, and various modifications are possible within the scope of the present disclosure. [Industrial Applicability]

[0086] The present disclosure is industrially applicable, for example, as a wiring structure applicable to a semiconductor device. [Explanation of symbols]

[0087] 1: Wiring structure 2: Substrate 3: First layer 4:Second layer 5:First groove 6:First through hole 7:Second groove part 8:Second through hole 10: First conductor pattern 11: First conductive wire 12: Land Section 13: Central conductive part 14: Outer conductive part 15: First ladder section 16: Second ladder section 17: Recess 20: Second conductor pattern 21: Second conductive wire 22: Second conductive part 30: Third conductor pattern 31: Third conductive wire 32: Third conductive part 41: First Beer Section 42: Second via section S: Solder

Claims

1. a substrate including a first layer; a first conductor pattern provided on the first layer, The first layer is provided with a plurality of first groove portions, the first conductor pattern includes at least one land portion, the land portion is formed of a conductive material embedded in at least one of the first groove portions, The land portion is A central conductive portion; At least one outer peripheral conductive portion formed in a ring shape in a plan view, the peripheral conductive portion is disposed at a distance from the central conductive portion in a plan view and disposed so as to surround the central conductive portion from the outside, Each of the central conductive portion and the peripheral conductive portion is provided with a recessed portion, The recessed portion is configured to recess from a position corresponding to the surface of the first layer toward the bottom of the first groove portion in a cross-sectional view.

2. 2. The wiring structure according to claim 1, A wiring structure, wherein the central conductive portion is configured such that, in a cross-sectional view, a width dimension of the recessed portion is larger than a width dimension of the recessed portion in the peripheral conductive portion.

3. 2. The wiring structure according to claim 1, A wiring structure, wherein the central conductive portion is configured such that, in a cross-sectional view, a depth dimension of the recess is greater than a depth dimension of the recess in the peripheral conductive portion.

4. 2. The wiring structure according to claim 1, The land portion further includes a plurality of first ladder portions, the first ladder portions are disposed between the central conductive portion and the peripheral conductive portion adjacent to the central conductive portion in a plan view, each of the first ladder portions is integrally formed with the central conductive portion and the peripheral conductive portion adjacent to the central conductive portion; A wiring structure, wherein each of the plurality of first ladder sections is provided with the recessed portion.

5. 5. The wiring structure according to claim 4, The outer circumferential conductive portion is provided in plurality, A wiring structure, wherein each of the plurality of outer conductive portions has a diameter different from one another and is formed in a concentric ring shape centered on the central conductive portion in a plan view.

6. 6. The wiring structure according to claim 5, The land portion further includes a plurality of second ladder portions, the second ladder portions are disposed between the outer circumferential conductive portions adjacent to each other in a plan view, each of the second ladder portions is integrally formed with the peripheral conductive portion adjacent to the second ladder portion; A wiring structure, wherein each of the plurality of second ladder sections is provided with the recessed portion.

7. 7. The wiring structure according to claim 6, A wiring structure, wherein the first ladder portion and the second ladder portion are arranged in a straight line from the outer peripheral conductive portion located at the outermost periphery toward the central conductive portion.

8. 2. The wiring structure according to claim 1, The substrate includes a second layer for stacking the first layer, A second conductor pattern provided on the second layer, A wiring structure, wherein the first layer is provided with a first via portion for electrically connecting the land portion and the second conductor pattern.

Images