Display device

Abstract

To provide a display device having a display panel on a curved surface, in which the increase in capacity or weight is suppressed, or an electronic apparatus having a display panel on a curved surface, in which the increase in capacity or weight is suppressed.SOLUTION: A display device includes a display panel mounted on a curved surface, and a driving circuit including circuit elements mounted on a plurality of planes provided in a step-shape along the curved surface on a back side of the curved surface.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a display device and an electronic device using the same. The present invention relates to a display device and an electronic device using the same. [Background technology]

[0002] Conventional display panels are flat, so the display panel is mounted on the product (e.g., display device). The outer shape of the part where the display panel is installed (such as a display device or electronic device) is required to be flat. It was.

[0003] In recent years, flexible display panels have been developed (Patent Document 1). The outer shape of the panel is not limited to a flat surface. Therefore, a flexible display panel is installed. The outer shape of the part of the article on which the display panel is provided does not necessarily have to be flat. As a result, the degree of freedom in designing the outer shape of the product on which the flexible display panel is mounted is increased. This makes it possible, for example, to apply designs with high added value. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2012-28761 A Summary of the Invention [Problem to be solved by the invention]

[0005] Until now, the outer shape of the display device where the display panel is provided has been required to be flat. As a result, there were restrictions on the design of the outer shape of the object. However, this increases the volume and weight of the display device.

[0006] On the other hand, by using a flexible display panel, it is possible to provide a flat display panel. The volume of the display device was reduced because the external shape was no longer necessary. There is a need to utilize this effectively and efficiently accommodate the drive circuits of the display device and the like.

[0007] One aspect of the present invention has been made against this technical background. To provide a display device having a display panel on a curved surface and suppressing an increase in volume or weight. Alternatively, the display panel has a curved surface, and an increase in volume or weight is suppressed. It is an object of the present invention to provide an electronic device having such a configuration. [Means for solving the problem]

[0008] In order to solve the above problems, one aspect of the present invention is a display device comprising: a curved surface of a base body on which a display panel is mounted; The design was created with a focus on the structure behind the curved surface. The inventors have come up with the idea of ​​a display device having such a configuration.

[0009] The display device according to one embodiment of the present invention includes a display panel mounted on a curved surface, and a curved display panel mounted on the rear side of the curved surface. and a drive circuit including circuit elements mounted on a plurality of planes arranged in a stepped manner along the .

[0010] That is, one aspect of the present invention is a base body having a curved outer surface and a The display panel and the inner surface of the base have a step that increases from the center toward the outer area. A plurality of electronic circuit boards are provided, and a wiring member electrically connects the electronic circuit boards to each other. The display panel is connected to an electronic circuit board at a side portion of the base. is.

[0011] Another embodiment of the present invention is a display panel, a driver circuit for driving the display panel, and a display device including the display panel. and a plurality of flat surfaces provided in a stepped manner along the curved surface on the back side of the curved surface. and a substrate for supporting the display device, and the driving circuit includes circuit elements mounted on the surface.

[0012] The display device according to one aspect of the present invention includes a display panel mounted on a curved surface and a curved display device on the rear side of the curved surface. and a drive circuit including circuit elements mounted on a plurality of planes arranged in a stepped manner along the surface. This makes it possible to effectively utilize the volume that is reduced by providing a display panel on a curved surface. As a result, the display panel has a curved surface, and an increase in volume or weight is suppressed. It is possible to provide a display device.

[0013] In addition, one aspect of the present invention is a display device comprising a base body having a curved outer surface and a display device attached along the curved outer surface. The panel and the inner surface of the base are provided with a step that increases in height from the center toward the outer area. and a wiring member for electrically connecting the electronic circuit boards to each other. The display panel is connected to an electronic circuit board at the side of the base, and The daughter board includes a plurality of planarization layers and wiring between the planarization layers.

[0014] Another embodiment of the present invention is a display panel, a driver circuit for driving the display panel, and a display device including the display panel. and a plurality of flat surfaces provided in a stepped manner along the curved surface on the back side of the curved surface. The multi-layer substrate has a circuit element and a multi-layer substrate that overlap the flat surface. A planarization layer for planarizing the plurality of planes provided in a stepped shape and a wiring provided on the planarization layer. The display device includes a display line or driving circuitry.

[0015] The display device according to one embodiment of the present invention includes a planarization layer that planarizes a stepped surface, and The planarization layer includes wiring or a driving circuit. This allows the display panel to bend. As a result, the volume of the display panel can be effectively utilized. It is possible to provide a display device having a curved surface and suppressing an increase in volume or weight.

[0016] In addition, one aspect of the present invention is a display device comprising a base body having a curved outer surface and a display device attached along the curved outer surface. The panel and the inner surface of the base are provided with a step that increases in height from the center toward the outer area. and a wiring member for electrically connecting the electronic circuit boards to each other. The display panel is connected to an electronic circuit board at the side of the base, and The daughter circuit board has a through hole for electrically connecting to the display panel.

[0017] Another embodiment of the present invention is a display panel, a driver circuit for driving the display panel, and a display device including the display panel. and a plurality of flat surfaces provided in a stepped manner along the curved surface on the back side of the curved surface. The driving circuit includes circuit elements mounted on a plurality of planes, and the substrate has a surface. The display device is provided with a through hole that electrically connects a display panel to a drive circuit.

[0018] In the display device according to the aspect of the present invention, the through hole provided in the base is provided on the rear side of the base. The driving circuit is electrically connected to the display panel provided on the curved surface. As a result, the volume of the display panel can be effectively utilized. It is possible to provide a display device having a curved surface and suppressing an increase in volume or weight.

[0019] In addition, one aspect of the present invention is a display device comprising a base body having a curved outer surface and a display device attached along the curved outer surface. The panel and the inner surface of the base are provided with a step that increases in height from the center toward the outer area. a plurality of electronic circuit boards, wiring members for electrically connecting the electronic circuit boards to each other; The display panel is a display device having a substrate and a battery for supplying power to the substrate. The surface portion is connected to an electronic circuit board.

[0020] Another embodiment of the present invention is a display panel, a driver circuit for driving the display panel, and a display device including the display panel. and a plurality of flat surfaces provided in a stepped manner along the curved surface on the back side of the curved surface. and a battery for supplying power to the drive circuit, the battery having an outer shape along one of the planes. The display device is provided with:

[0021] The display device according to one aspect of the present invention includes a display panel mounted on a curved surface and a curved display device on the rear side of the curved surface. The battery has an outer shape along a plane with a stepped surface. By providing the display panel on a curved surface, the reduced volume can be effectively utilized. As a result, it is possible to provide a display device having a display panel on a curved surface and suppressing an increase in volume or weight. Cut.

[0022] In addition, one aspect of the present invention is the above-mentioned liquid crystal display device, wherein the base body has a touch panel at a position overlapping the display panel. It is a display device.

[0023] The display device according to one embodiment of the present invention has a touch panel disposed at a position overlapping a display panel mounted on a curved surface. This allows the movement of parts (such as fingers) that move in an arc around a joint. A person inputs information into a display device using a part of the body of the person or a pointing device held on a part of the body. As a result, the display panel has a curved surface and there is no need to increase the volume or weight. It is possible to provide a display device with improved operability.

[0024] Another embodiment of the present invention is the display device according to the above, wherein the base body includes a metal film between the curved surface and the plurality of flat surfaces. It is.

[0025] The display device according to one aspect of the present invention includes a metal film that functions as a shielding film on a substrate. This allows the control circuit behind the curved surface on which the display panel is mounted to be accessed from the outside of the display device. As a result, the driving circuit can be protected from electrical noise from the outside of the display device. It is possible to provide a display device which is less susceptible to malfunctions due to electrical noise or the like from the display unit.

[0026] Furthermore, one aspect of the present invention is a display device comprising the display panel on an upper surface and a flat portion on a bottom surface. It is a display device that can

[0027] The display device according to one embodiment of the present invention includes a display panel on an upper surface and a flat portion on a bottom surface. As a result, the display device can be placed on a flat surface such as a desk with its bottom surface facing down. This makes it possible to provide a display device in which characters and images displayed on a display panel are easy to read.

[0028] Another embodiment of the present invention is an electronic device including the above display device.

[0029] The electronic device according to one embodiment of the present invention includes a display panel mounted on a curved surface and a curved display device mounted on the rear side of the curved surface. and a drive circuit including circuit elements mounted on a plurality of planes arranged in a stepped manner along the surface. This reduces the volume of the display panel by providing it on a curved surface. As a result, the display panel can be curved and the volume or weight can be reduced. It is possible to provide an electronic device in which an increase in the amount of the components is suppressed.

[0030] In this specification, the EL layer refers to a layer provided between a pair of electrodes of a light-emitting element. Therefore, the light-emitting layer containing an organic compound, which is a light-emitting material, sandwiched between the electrodes is one of the EL layers. This is an embodiment.

[0031] In this specification, the display device refers to an image display device or a light-emitting device. In addition, connectors, such as FPC (Flexible Printed Circuits), are installed in the display device. circuit) or TCP (Tape Carrier Package) is used. A module with a printed wiring board at the end of the TCP, or a module with a surface mount The display element is mounted on the substrate by the COG (Chip On Glass) method. The display device also includes all modules on which a display device (circuit) is directly mounted. Effect of the Invention

[0032] According to one aspect of the present invention, a display panel has a curved surface, and an increase in volume or weight is suppressed. Alternatively, a display device having a curved display panel and no increase in volume or weight can be provided. It is possible to provide an electronic device in which the load is suppressed. [Brief description of the drawings]

[0033] [Figure 1] 1A to 1C are diagrams illustrating a structure of a display device having a display panel on a convex curved surface according to an embodiment. [Diagram 2] 1A to 1C are diagrams illustrating a structure of a display device having a display panel on a concave curved surface according to an embodiment. [Diagram 3]1A to 1C are diagrams illustrating a structure of a display device having a display panel on a curved surface according to an embodiment. [Figure 4] 1A to 1C are diagrams illustrating a display device having a display panel on a convex curved surface according to an embodiment. [Diagram 5] 1A to 1C are diagrams illustrating a display device having a display panel on a concave curved surface according to an embodiment. [Figure 6] 1A to 1C are diagrams illustrating a display device having a display panel on a convex curved surface according to an embodiment. [Figure 7] 1A to 1C are diagrams illustrating a display device having a display panel on a concave curved surface according to an embodiment. [Figure 8] 1A to 1C are diagrams illustrating electronic devices according to an embodiment. [Figure 9] 1A to 1C are diagrams illustrating electronic devices according to an embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0034] The embodiment will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. The present invention is not limited to the above embodiment, and various changes and modifications may be made in the form and details without departing from the spirit and scope of the present invention. It will be easily understood by those skilled in the art that the above-mentioned invention can be obtained by the following embodiments. The present invention should not be construed as being limited to the contents described below. The same reference numerals are used in different drawings to indicate the same parts or parts having similar functions. A repeated explanation will be omitted.

[0035] (Embodiment 1) In this embodiment, a display device having a display panel on a convex curved surface according to one embodiment of the present invention will be described. This will be described with reference to FIG.

[0036] FIG. 1A is a top view of a display device 100 according to one embodiment of the present invention, and FIG. 1(C) is a side view of the 00 shown in FIG. 1(A). FIG. 1(D) is a diagram showing the cross-sectional structure of the display device 100. FIG.

[0037] The display device 100 described as an example in this embodiment includes a base 110 having a curved outer surface. The display panel 120 is attached along the curved surface, and the inner surface of the base 110 is formed from the center to the outer area. A plurality of electronic circuit boards (for example, the first The printed circuit board 111C, the printed circuit board on which the driving circuit 111R is provided, and the second A wiring member (connector 111L) that electrically connects the electronic circuit boards to each other 2a and connector 112b). 0 is a side surface of the base 110, and an electronic circuit board (a printed circuit board on which the drive circuit 111R is provided) is provided. ) is connected.

[0038] Alternatively, the display device 100 exemplified and described in this embodiment includes a display panel 120 and a display A driving circuit 111R for driving the panel 120 and a curved surface on which the display panel 120 is mounted, A base 110 having a plurality of flat surfaces provided on the back side of the curved surface in a stepped manner along the curved surface. The driving circuit 111R includes circuit elements mounted on the plane.

[0039] The display device 100 illustrated in this embodiment includes a translucent touch panel 130. The display panel 120 is provided on the display panel 120 (see FIG. 1(A) to FIG. 1(C)). By providing a touch panel 130 on the display panel 120, the position of the image to be displayed on the display panel 120 can be adjusted. The mark can be easily compared with the coordinates input from the touch panel 130.

[0040] The display panel 120 is provided so as to extend along a curved surface that is continuous from the upper surface of the base 110 to the side surface. With this configuration, the image displayed by the display device 100 is It can be observed not only from the front but also from the side.

[0041] The base 110 has a terminal portion 115R on the front side of the paper in FIG. Place the L at the back of the paper.

[0042] A plurality of terminals are provided on the terminal section 115R, and the flexible printed circuit board of the display panel 120 129.

[0043] A plurality of terminals are provided on the terminal section 115L, and the flexible printed board of the touch panel 130 It is electrically connected to the plate 139 .

[0044] On the rear side of the curved surface of the base 110, a plurality of flat surfaces are provided in a stepped manner along the curved surface. For example, the base 110 has three flat surfaces arranged in a stepped manner. A plane on which the driving circuit 111C is provided, a printed circuit board on which the driving circuit 111R is provided, and a second The plane on which the print substrate 111L is provided and the plane on which the antenna 114 is provided are provided. See Figure 1(C) and Figure 1(D).

[0045] The first printed circuit board 111C is connected to the second printed circuit board 111 via a connector 112a. L, and is electrically connected to the drive circuit 111R via a connector 112b. (See Figure 1(D)).

[0046] The display device 100 illustrated in this embodiment includes a display panel 120 mounted on a curved surface, A drive circuit including circuit elements mounted on multiple flat surfaces arranged in a stepped pattern along the curved surface on the back side of the curved surface. The display panel 120 has a curved surface, and the driving circuit 111R is provided. As a result, the display panel 120 has a curved surface, Moreover, it is possible to provide a display device 100 in which an increase in volume or weight is suppressed.

[0047] Hereinafter, each element constituting the display device according to one embodiment of the present invention will be described.

[0048] Display Panel The display panel 120 is a flexible printed circuit board to which image data is supplied from the drive circuit 111R. The display unit is connected to the substrate 129 and has a display unit on a curved surface. The display unit has a plurality of pixels, and each pixel is Image data supplied via a flexible printed circuit board is displayed.

[0049] The display panel 120 having a display unit on a curved surface may be, for example, a flexible display panel. One example of a method for constructing the device is to fix the device to the curved surface of a support having a curved surface.

[0050] The method of attaching the flexible display panel to the curved surface of the base 110 includes using an adhesive layer or a pressure sensitive adhesive layer. Alternatively, a light-transmitting case is prepared to cover the curved surface of the base 110, and the base 110 and It may be sandwiched between the housings.

[0051] Each pixel in the display section of the display panel 120 includes a display element. An electroluminescent element (EL element) in which a layer containing a light-emitting organic compound is sandwiched between the In addition to the known display elements, liquid crystal display elements, electrophoretic display elements, and various other display elements are also known. can be applied.

[0052] <Drive circuit> The driving circuit 111R drives the display panel 120. For example, the first printed circuit board 111 C generates image data and outputs it to the drive circuit 111R via the connector 112b. The driving circuit 111R transmits image data to a plurality of pixels provided on the display panel 120, The pixels are driven in accordance with image data.

[0053] 《Base》 The base 110 is insulating and has a curved surface on one side, and a step is formed along the curved surface on the back side of the curved surface. The substrate 110 has a plurality of flat surfaces arranged in a shape of a square. The substrate 110 is engineered, for example, by using a mold. It can be formed by molding a plastic. Also, a dry film is laminated. The base 110 may be made of a multi-layer substrate.

[0054] <Printed circuit board> A first printed circuit board 111C, a printed circuit board on which a driving circuit 111R is provided, and a second The printed circuit board 111L includes circuit elements and wiring, both of which are a form of electronic circuit board. Examples of circuit elements include LSI chips, capacitive elements, coils, and antennas. It is possible.

[0055] When the display device 100 is used as part of an electronic device, the display panel driver circuit 111R , a driving circuit for the touch panel 130, a transmitting / receiving circuit for signal communication with an external information device, etc. A variety of circuits may be provided on the printed circuit board.

[0056] <Wiring components> The connector 112a electrically connects the first printed circuit board 111C and the second printed circuit board 111L. The connector 112b electrically connects the first printed circuit board 111C and the drive circuit 111R. The connector 112a and the connector 112b are both electronic circuits. It is a wiring member that electrically connects the circuit boards to each other.

[0057] The display device 100 includes a base 110 that includes a display panel 120 and a driving circuit 111R. It has a through hole 118 for electrical connection.

[0058] The base 110 has a plurality of through holes that are arranged in a stepped pattern and penetrate from the flat surface to the curved surface. A conductive film is formed on the wall surface of the hole to electrically connect the stepped flat surface and the curved surface. It has been done.

[0059] For example, the through hole 118 is a hole that penetrates from the plane on which the driving circuit 111R is provided to the curved surface. The conductive film provided in the through hole 118 is connected to the driving circuit 111R and the terminal portion 115R. The terminals are electrically connected to the base 11 (see FIG. 1(C)). The driving circuit 111R provided on the stepped plane of 0 is for driving the display panel 120. The signal is transmitted via a terminal provided on the curved surface of the base 110 and a flexible printed circuit board 129. , can be output to the display panel 120.

[0060] In addition, a touch panel 130 is provided on the curved surface of the base 110, overlapping the display panel 120. The touch panel 130 is electrically connected to a flexible printed circuit board 139. The flexible printed circuit board 139 is electrically connected to the terminal portion 115L. Thus, the touch panel 130 transmits a detected signal between the terminal portion 115L and the through hole (not shown). 111L is provided on the stepped surface of the base 110 via a printed circuit board 111L. It can be output.

[0061] In the display device 100 exemplified in this embodiment, the through-hole 118 provided in the base 110 is The driving circuit 111R provided on the rear side of the display panel 120 is electrically connected to the curved display panel 120. This effectively utilises the reduced volume caused by providing the display panel 120 on a curved surface. As a result, the display panel 120 can be curved and the volume or weight can be reduced. It is possible to provide a display device 100 in which an increase in

[0062] The display device 100 has a base 110 that is made of a metal material provided between a curved surface and a plurality of flat surfaces. The film 117 may be included (see FIG. 1C).

[0063] The display device 100 illustrated in this embodiment has a metal film that functions as a shielding film on the base 110. This allows the display panel to be mounted on the curved surface behind the control circuit. This can protect the display device from external electrical noise, etc. It is possible to provide a display device that is less susceptible to malfunctions due to electrical noise or the like from outside the display device. .

[0064] The metal film that functions as the shielding film may be made of aluminum, copper, brass, or the like. When a conductive film is provided on the wall surface of the through hole 118, the metal film 117 is The conductive film provided on the wall surface of the through hole 118 and the metal film 117 are shorted. This is to prevent tangling.

[0065] <Modification> As a modification of the display device of one embodiment of the present invention illustrated in this embodiment, a display panel having a concave curved surface is provided. The configuration of a display device having a panel will be described with reference to FIG.

[0066] FIG. 2A is a top view of a display device 200 according to one embodiment of the present invention, and FIG. 2B is a top view of the display device 200 according to one embodiment of the present invention. 2(C) is a side view of the 00 shown in FIG. 2(A). FIG. 2(D) is a diagram showing the cross-sectional structure of the display device 200. FIG.

[0067] The display device 200 shown and described in FIG. 2 has a concave curved surface, which is different from the display device 200 shown and described in FIG. This differs from the display device 100 described below.

[0068] The display device 200 described as an example in this embodiment includes a display panel 220 and a display panel 2 20, and a curved surface on which the display panel 220 is mounted and the back surface of the curved surface. and a base 210 having a plurality of flat surfaces arranged in a stepped manner along a curved surface on one side. The driving circuit 111R includes circuit elements mounted on a plane.

[0069] The display device 200 illustrated in this embodiment includes a light-transmitting touch panel 230. The display panel 220 is provided on the display panel 220 (see FIG. 2(A) to FIG. 2(C)). By providing a touch panel 230 on the display panel 220, the location of an image to be displayed on the display panel 220 can be adjusted. This makes it easier to compare the mark with the coordinates input from the touch panel 230.

[0070] On the back side of the curved surface of the base 210, a plurality of flat surfaces are provided in a stepped manner along the concave curved surface. For example, the base 210 has three flat surfaces. C is provided, the printed circuit board on which the driving circuit 111R is provided, and the second printed circuit board The substrate 111L is provided on a plane, and the antenna 114 is provided on a plane (FIG. 2( C) and Figure 2(D)).

[0071] The first printed circuit board 111C is connected to the second printed circuit board 111 via a connector 112a. L, and is electrically connected to the drive circuit 111R via a connector 112b. (See Figure 2(D)).

[0072] In addition, the base 210 of the display device 200 displays the touch panel 230 on a concave curved surface. Provided for positioning to overlap panel 220 .

[0073] The display device 200 exemplified in this embodiment is a display panel mounted on the curved surface of a base 210. A touch panel is installed at the overlapping position, allowing the robot to move in an arc around the joint. Using a part (e.g., a body part such as a finger, or a pointing device held on a body part), The operation of inputting information into the display device becomes easier. As a result, the display panel has a curved surface, and It is possible to provide a display device with improved operability and with a suppressed increase in volume or weight.

[0074] Note that this embodiment mode can be appropriately combined with other embodiment modes described in this specification. .

[0075] (Embodiment 2) In this embodiment, a structure of a display device according to one embodiment of the present invention will be described with reference to FIG. do.

[0076] FIG. 3A shows a display panel having a convex curved surface according to one embodiment of the present invention described in Embodiment 1. 1 is a diagram showing a cross-sectional structure of the display device 100 taken along dashed lines A1-A2 and A3-A4. do.

[0077] The display device 100 shown in FIG. 3A in this embodiment includes a base 1 having a curved outer surface. 10, a display panel 120 attached along a curved surface, and a base 110 attached to the inner surface of the base 110 from the center to the outside. A plurality of electronic circuit boards (e.g., A first printed circuit board 111C, a printed circuit board on which a driving circuit 111R is provided, and a second Printed circuit board 111L) and wiring member (connector) that electrically connects electronic circuit boards The display device has a display panel 112a and a connector 112b. 120 is an electronic circuit board (a printed circuit board on which the driving circuit 111R is provided) on the side surface of the base 110. The electronic circuit board is connected to a substrate, and the electronic circuit board has a plurality of planarization layers and wiring between the planarization layers. .

[0078] Alternatively, the display device 100 illustrated in FIG. 3A in this embodiment includes a display panel 120 and A driving circuit 111R for driving the display panel 120 and a curved surface on which the display panel 120 is mounted and a base body 1 having a plurality of flat surfaces provided in a stepped manner along the curved surface on the back side of the curved surface. The multi-layer substrate 111 has a flat surface 10 and a multi-layer substrate 111 that is in contact with the flat surface. A planarization layer (e.g., For example, planarization layer 11a, planarization layer 11b, and planarization layer 11c) and a planarization layer provided on the planarization layer The wiring 12 or the driving circuit 111R is included.

[0079] The display device 100 exemplified in this embodiment is a flattening device that flattens a stepped surface. layers (planarization layer 11a, planarization layer 11b, and planarization layer 11c) and The display panel 120 includes the wiring 12 and the driving circuit 111R. By providing the display on a curved surface, the reduced volume can be effectively utilized. The display device 100 has a curved panel 120 and is suppressed from increasing in volume or weight. can.

[0080] Elements constituting a display device according to one embodiment of the present invention will be described below.

[0081] 《Multilayer board》 The multi-layer substrate 111 includes multiple planarization layers, and is configured to mount the circuit elements 10, the wiring 12, or the driving circuit 11. Includes functional circuits such as 1R.

[0082] The planarization layer is insulating and has a plurality of planar surfaces provided in a stepped shape and a The planarization layer is a layer that flattens the steps caused by the circuit elements 10 and the like that are formed on the substrate. On the planarization layer, an antenna 114, a circuit element 10 or various functional circuits ( For example, a driving circuit 111R and the like and wiring for electrically connecting these are provided.

[0083] An example of a material that can be used for the planarization layer is an insulating resin. For example, imide, acrylic, etc. can be used.

[0084] Also, a through hole 18 having a conductive film formed on the wall surface may be formed in the planarizing layer. The through hole 18 having the film formed on the wall surface electrically connects the wiring 12 provided on a different planarization layer. Can be connected.

[0085] As a method for forming a through hole in an insulating resin, in addition to a method using a laser or the like, A method of applying photolithography to a photosensitive resin is also available. Methods for forming the through hole on the side surface include plating and electroforming.

[0086] <Modification> As a modification of the display device of one embodiment of the present invention illustrated in this embodiment, a display panel having a concave curved surface is provided. The structure of a display device having a panel will be described with reference to FIG.

[0087] FIG. 3B shows a liquid crystal display device having a display panel on a concave curved surface according to one embodiment of the present invention described in Embodiment 1. 1 is a diagram showing a cross-sectional structure of a display device 200 taken along dashed lines A1-A2 and A3-A4. do.

[0088] The display device 200 shown in FIG. 3B has a concave curved surface, which is different from the display device 200 shown in FIG. This is different from the display device 100 shown and described in FIG.

[0089] Note that this embodiment mode can be appropriately combined with other embodiment modes shown in this specification. .

[0090] (Embodiment 3) In this embodiment, a display device having a display panel on a convex curved surface according to one embodiment of the present invention will be described. This will be described with reference to FIG.

[0091] A display device 300 having a display panel on a convex curved surface according to one embodiment of the present invention, as illustrated in FIG. A has a housing 160a for housing a battery on its back surface, which is the same as that described in the first embodiment. This is different from the display device 100.

[0092] The display device 300A described as an example in this embodiment includes a base 11 having a curved outer surface. 0, the display panel 120 attached along the curved surface, and the inner surface of the base 110 from the center to the outside A plurality of electronic circuit boards are provided with steps that are higher toward the area, and the electronic circuit The boards are electrically connected to each other by wiring members, and a battery 170 is provided to supply power to the electronic circuit. The display panel is connected to an electronic circuit board at a side portion of the base. There are.

[0093] Alternatively, the display device 300A described as an example in this embodiment includes a display panel 120 and a display A driving circuit 111R for driving the display panel 120, and a curved surface on which the display panel 120 is mounted, A base body 110 having a curved surface and a plurality of flat surfaces provided in a stepped shape along the curved surface on the back side of the curved surface; The battery 170 supplies power to the driving circuit 111R. It has an outline along one plane.

[0094] The display device 300A illustrated in FIG. 4A has a housing 160a, which is curved in a convex shape. The curved surface has a surface and a plurality of flat surfaces provided in a stepped manner along the curved surface on the rear side of the curved surface.

[0095] Between one of the stepped flat surfaces of the housing 160a and the base body 110, a battery 170 and a battery 1 70, a control circuit 161L and a function circuit 161R are provided.

[0096] The display device 300A according to the embodiment of the present invention includes a display panel 120 mounted on a curved surface, The battery 170 has an outer shape along a plane provided in a stepped manner along the curved surface on the back side of the curved surface. This effectively utilizes the volume that is reduced by providing the display panel 120 on a curved surface. As a result, the display panel 120 can be used in a curved state without compromising the volume or weight. It is possible to provide a display device in which the increase is suppressed.

[0097] The display device 300A has a display panel on the top surface and a flat portion on the bottom surface. Therefore, the display device 300A can be placed on a flat surface such as a desk with its bottom surface facing down. As a result, a display device can be provided in which characters and images displayed on the display panel are easy to see.

[0098] Hereinafter, each element constituting the display device 300A according to one embodiment of the present invention will be described.

[0099] "battery" In addition to dry batteries, secondary batteries (such as Li-ion batteries and nickel-metal hydride batteries) are also available. etc. can be used.

[0100] Battery Control Circuit The control circuit 161L controls the battery 170. For example, the battery 170 supplies power to the display device 3. When a secondary battery is applied to the battery 170, the power supply is controlled to supply 00A according to the usage state. In this case, the battery 170 is monitored to prevent overcharging. Charging is performed under optimal conditions based on the information.

[0101] <Variation 1.> The modified example of the display device of one embodiment of the present invention illustrated in FIG. 4B has a housing for storing a battery. The fact that 160b has a concave curved surface on the back surface of the display device 300B is the same as that shown in FIG. This differs from display device 300A.

[0102] The display device 300B illustrated in FIG. 4B has a concave curved surface and a curved surface on the back side of the concave curved surface. The housing 160b has a plurality of flat surfaces arranged in a stepped manner along the axis.

[0103] Between one of the stepped flat surfaces of the housing 160b and the base body 110, a battery 170L and a battery 170C and a battery 170R, a battery control circuit 161L and a function circuit 161R are provided. By providing a plurality of thin batteries, the display panel 120 can be used as a display device 30. By providing it on the curved surface of 0B, the reduced volume can be effectively utilized.

[0104] <Variation 2.> In a modification of the display device according to one embodiment of the present invention illustrated in FIG. 4C, a battery 170 is attached to the base 110. The printed circuit board 161C is mounted on the housing 160c, as shown in FIG. This is different from the display device 300A described in (A).

[0105] The display device 300C illustrated in FIG. 4C has a housing 160c. The housing 160c has a convex The device has a curved surface and a plurality of flat surfaces provided in a stepped manner along the curved surface on the rear side of the curved surface. .

[0106] Between one of the stepped flat surfaces of the housing 160c and the base body 110, a battery 170 and a battery 1 70, a control circuit 161L and a function circuit 161R are provided.

[0107] <Variation 3.> The modification of the display device according to one embodiment of the present invention illustrated in FIG. 5A is similar to that described in Embodiment 1. The display device 200 differs from the display device 200 in that it has a housing 260a for housing a battery on its rear surface.

[0108] The display device 400A described as an example in this embodiment includes a display panel 220 and a display panel A driving circuit 111R for driving the display panel 220, and a curved surface on which the display panel 220 is mounted and a curved surface A base 210 having a plurality of flat surfaces arranged in a stepped manner along a curved surface on the back side, and a driving circuit 1 11R. The battery 270 is disposed on one side of the plane. It has an outer shape that conforms to the

[0109] The display device 400A illustrated in FIG. 5A has a housing 260a, which is curved in a convex shape. The curved surface has a surface and a plurality of flat surfaces provided in a stepped manner along the curved surface on the rear side of the curved surface.

[0110] Between one of the stepped flat surfaces of the housing 260a and the base body 210, a battery 270 and a battery 2 70 control circuits 261L and function circuits 261R are provided.

[0111] <Modification 4.> The modified example of the display device of one embodiment of the present invention illustrated in FIG. 5B has a housing for storing a battery. 260b has a concave curved surface on the back surface of the display device 400B and has multiple batteries. , which is different from the display device 400A described with reference to FIG.

[0112] The display device 400B illustrated in FIG. 5B has a concave curved surface and a curved surface on the back side of the concave curved surface. The housing 260b has a plurality of flat surfaces arranged in a stepped manner along the axis.

[0113] Between one of the stepped flat surfaces of the housing 260b and the base body 210, a battery 270L and A battery 270R, a battery control circuit 261L and a function circuit 261R are provided. By providing a plurality of display panels 220 on the curved surface of the display device 400B, The reduced volume can be effectively utilized.

[0114] <Variation 5.> In a modification of the display device according to one embodiment of the present invention illustrated in FIG. 5C, a battery 270L and a battery 270 The fact that R is provided on the base body 210 side and the battery 270C is provided on the housing 260b side is the same as that described in FIG. This is different from the display device 400A.

[0115] The display device 400C illustrated in FIG. 5C has a housing 260c. The housing 260c has a convex The device has a curved surface and a plurality of flat surfaces provided in a stepped manner along the curved surface on the rear side of the curved surface. .

[0116] Between one of the stepped flat surfaces of the housing 260c and the base body 210, a battery 270L and a battery Battery 270R is provided on the base body 210 side, and battery 270C is provided on the housing 260b side.

[0117] Note that this embodiment mode can be appropriately combined with other embodiment modes described in this specification. .

[0118] (Embodiment 4) In this embodiment, a display device having a display panel on a convex curved surface according to one embodiment of the present invention will be described. This will be described with reference to FIG.

[0119] FIG. 6A is a diagram showing a cross-sectional structure of a display device 300D according to one embodiment of the present invention. ) is a perspective view for explaining partial overlap of the configuration of the display device 300D.

[0120] The display device 300D is a display panel 120 and a spacer 140 having a curved surface and translucency. The difference from the display device 300A described in the third embodiment is that it is provided between the touch panel 130. do.

[0121] The display device 300D described as an example in this embodiment includes a display panel 120 and a display panel A driving circuit 111R for driving the display panel 120, and a curved surface on which the display panel 120 is mounted and a curved surface A base 110 having a plurality of flat surfaces arranged in a stepped manner along a curved surface on the back side, and a driving circuit 1 11R. The battery 170 is disposed on one side of the plane. It has an outer shape that conforms to the

[0122] The display device 300D has a housing 160a, which has a convex curved surface and a back surface of the curved surface. The side has a plurality of flat surfaces provided in a stepped manner along the curved surface.

[0123] Between one of the stepped flat surfaces of the housing 160a and the base body 110, a battery 170 and a battery 1 70, a control circuit 161L and a function circuit 161R are provided.

[0124] In addition, the display device 300D has a transparent spacer 140 in contact with the display panel 120. The spacer 140 is provided between the touch panel 130 and the touch panel 130. It may be possible to do so.

[0125] The spacer 140 separates the touch panel 130 from the display panel 120. This reduces the effect of the display panel 120 on the touch panel 130. This has the effect of preventing a decrease in sensitivity.

[0126] In addition, the spacer 140 is molded to fit the curved surface of the base 110, and the spacer 140 and the base The display panel 120 is flexible and has a shape that fits into the body 110. , a clamping configuration may also be used.

[0127] In addition, a ceramic coating layer or a hard coat layer is formed on the surface of the touch panel 130 of the display device 300D. A ceramic coating layer may be formed on the rear surface of the display device 300D. Alternatively, a hard coat layer may be formed.

[0128] In addition, a circular polarizer may be provided on the viewer side of the display panel 120 or the touch panel 130. Alternatively, a circular polarizing plate may be used as the spacer 140. By providing a circular polarizing plate, The contrast is reduced by the external light reflected by the display panel 120 or the touch panel 130. This can eliminate the problem of deterioration.

[0129] Note that this embodiment mode can be appropriately combined with other embodiment modes described in this specification. .

[0130] (Embodiment 5) In this embodiment, a display device having a display panel on a concave curved surface according to one embodiment of the present invention will be described. This will be described with reference to FIG.

[0131] FIG. 7A is a perspective view for explaining the configuration of a display device 400D. 13 is a diagram illustrating an example of a cross section of a pixel portion of a display panel applicable to a device 400D. FIG.

[0132] FIG. 7(C) is a perspective view of a configuration of a touch panel that can be applied to the display device 400D. D) is a diagram illustrating the cross-sectional structure.

[0133] The display device 400D has a concave curved surface, a display panel 220, a touch panel 230, The arrangement of the cover 245 and the circularly polarizing plate 250 in this order corresponds to the display device described in the fourth embodiment. This is different from device 300D.

[0134] The display device 400D described as an example in this embodiment includes a display panel 220 and a display panel A curved surface on which 220 is mounted and a plurality of flat surfaces provided in a stepped manner along the curved surface on the back side of the curved surface and a substrate 210 comprising:

[0135] The display device 400D includes a display panel 220, a touch panel 230, a cover 245, and a circular polarizer. The light plates 250 are provided in this order.

[0136] For example, a flexible display panel 22 having a display element having a layer containing a light-emitting organic compound. The thickness of the touch panel 230 formed integrally with the spacer is about 50 μm. The thickness of the cover can be about 500 μm, and the thickness of the circular polarizer can be about 400 μm. The thickness may be approximately 300 μm.

[0137] <Display panel> The display panel 220 has a display section in the area enclosed by the dashed line in the figure (see FIG. 7(A)). The display section is provided with a plurality of pixels 228 arranged in a matrix. A display element applicable to the pixel 228 is a light-emitting organic EL element between a pair of electrodes. Electroluminescence elements (also called EL elements) in which layers containing compounds are sandwiched, liquid crystal Display elements include electrophoretic display elements as well as various other known display elements.

[0138] In addition, the display panel 220 is provided with a flexible printed circuit board 229. The cable printed circuit board 229 is electrically connected to a drive circuit (not shown) and drives the display panel. The display unit 200 receives a signal for driving the display panel 220.

[0139] FIG. 7B shows an example of a configuration of a pixel 228 that can be applied to an active matrix type display panel. The pixel 228 includes a transistor 227 and a source electrode or The EL element 223 is electrically connected to the drain electrode, and the color filter 225 overlaps the EL element 223. The filter 225a is provided.

[0140] "substrate" The display panel 220 is made up of a first substrate 221 disposed on the base 210 side and a second substrate 222 disposed on the viewer side. The pixel 228 is disposed between the first substrate 221 and the second substrate 222. Both the first substrate 221 and the second substrate 222 are flexible. The display panel 220 is also flexible.

[0141] The thermal expansion coefficient of the first substrate 221 and the thermal expansion coefficient of the second substrate 222 are approximately the same. By matching the thermal expansion coefficient, a flexible display panel can be created. This prevents the problem of the 220 curling.

[0142] In addition, when an EL element is used as the display element, the first substrate 221 and the second substrate 222 are In this case, a substrate having excellent gas barrier properties is used. A substrate with improved barrier properties may also be used.

[0143] "Transistor" The transistor 227 includes a semiconductor layer. Known semiconductors such as silicon, low-temperature polysilicon, and oxide semiconductors can be used.

[0144] The transistor 227 may also be provided with a back gate electrode. The pole may be used to control the threshold of transistor 227 .

[0145] EL element The EL element 223 has a first electrode 223a, a second electrode 223c, and a first electrode 223a. A layer 223b containing a light-emitting organic compound is provided between the second electrodes 223c.

[0146] The color of the light emitted by the EL element 223 is determined by the material used in the layer 223b containing the light-emitting organic compound. The EL element 223 exemplified in this embodiment exhibits white light. It emits light.

[0147] Color Filter The color filter 225a converts the white light emitted by the EL element into light of a desired color. A color filter 225a is placed on the EL element 223 that exhibits white light. The beam configuration is called a light emitting module 225.

[0148] The first electrode 223a of the EL element is covered at its end with the partition wall 224 and overlaps with the opening of the partition wall 224. become.

[0149] The spacer 226 is provided on the partition wall 224 and is disposed between the EL element 223 and the color filter 225. Adjust the spacing of a.

[0150] 《Sealing structure》 The display element is made up of a first substrate 221 and a second substrate 222 bonded together with a sealing material (not shown). 22, and is sealed.

[0151] In addition, a light-transmitting adhesive is used to bond the light-emitting element 223 and the color filter 225a. It may also be glued.

[0152] The sealing material is preferably a material with low moisture permeability. When an EL element is used as a display element, It is preferable to use an inorganic material such as low-melting-point glass as the sealing material.

[0153] <<Method of manufacturing a display panel>> An example of a method for manufacturing the display panel 220 will be described.

[0154] In the first step, a release layer is provided on a substrate for the manufacturing process, and a highly gas-barrier film is then formed on the release layer. The substrate for the manufacturing process does not need to be flexible, but it is required to have heat resistance and dimensions. A substrate having excellent chemical stability (for example, a glass substrate) is preferred.

[0155] As the release layer, a metal layer such as tungsten can be used in addition to a polyimide layer. The layer to be peeled off in contact with the peeling layer is silicon oxide, silicon nitride with high gas barrier properties, etc. Two substrates for the manufacturing process having this structure are prepared.

[0156] In the second step, a pixel circuit is formed by stacking the high gas barrier film of the first fabrication process substrate. A display element is then fabricated to be connected to the pixel circuit.

[0157] In the third step, the color filter is applied to a highly gas-barrier film of another substrate for the manufacturing process. The order of the second and third steps does not matter.

[0158] In the fourth step, the first manufacturing process substrate and the second manufacturing process substrate are bonded to each other. The side with the optical element and the side with the color filter are placed facing each other using an adhesive. Then glue them together.

[0159] In the fifth step, the first manufacturing process substrate is peeled off from the peeled layer, and the peeled layer that appears on the surface is A flexible substrate is attached to the layer. Then, the substrate for another manufacturing process is peeled off from the layer to be peeled off, and the surface is A flexible substrate is attached to the layer to be peeled off. An adhesive is used for the attachment. In addition, a circularly polarizing plate may be attached to the layer to be peeled off from the substrate for other manufacturing steps. By directly bonding a circular polarizer to the peelable layer, the number of parts required is reduced when using a circular polarizer. It is possible.

[0160] Through the above steps, a flexible display panel 220 can be manufactured.

[0161] <Touch panel> The touch panel 230 includes a touch sensor unit in the area surrounded by the dashed line in the figure (FIG. 7(A) ) The display unit has touch sensors arranged in a matrix.

[0162] The touch panel 230 is also provided with a flexible printed circuit board 239. The switch panel 230 transmits the detected signal via a flexible printed circuit board 239 as shown in FIG. The signal is output to a signal processing circuit or the like that is not connected to the

[0163] The configuration of a touch sensor provided in region 235 of touch panel 230 is shown in FIG. The touch sensor shown in the example is a projected capacitive touch sensor. It has a pole 231 and an electrode 232 .

[0164] The electrode 231 is an electrode in which the vertices of a linearly arranged quadrilateral conductive film are connected by wiring 233. The electrode 232 is a rectangular conductive film that is arranged in a line in a direction intersecting with the electrode 231. The vertices of the conductive film are aligned in a line in a direction intersecting with the electrode 231. The electrodes 231 and 232 are arranged to cross each other, The rectangular conductive film of the electrode 231 and the rectangular conductive film of the electrode 232 are arranged in a staggered manner. An insulating film is formed in the area where the line 233 overlaps the electrode 232, and the electrodes 231 and 232 are It prevents short circuits.

[0165] The electrodes 231 and 232 are arranged so that the area of ​​their intersection is as small as possible. This reduces the area of ​​the region where no electrodes are provided. This can reduce display unevenness caused by differences in transmittance due to the difference in transmittance between the display devices.

[0166] Reducing the thickness of the touch panel 230 is preferable because it reduces the weight and increases the transmittance.

[0167] One method for producing a thin touch panel is to use a manufacturing process that has excellent dimensional stability and heat resistance. A touch sensor is fabricated on a substrate (e.g., a glass substrate, etc.) for use, and the fabricated touch sensor is One method is to transfer the substrate from which it is made to another light and thin base material.

[0168] Specifically, a peelable layer is provided on a glass substrate, and a peelable layer including a touch sensor is laminated on the peelable layer. The release layer may be a metal layer such as tungsten, in addition to polyimide. A film of silicon oxide or the like is formed on the metal layer as a layer to be peeled off, and a touch panel is then formed on the film. A lightweight film is attached to the top surface of the fabricated touch sensor. When the film to which the peelable layer is adhered is peeled from the interface between the peelable layer and the peelable layer, a lightweight and thick This makes it possible to create thin touch panels.

[0169] <Display panel with touch sensor> The display panel 220 may be provided with a touch sensor. The display panel 220 can also function as the touch panel 230, so the weight of the display device can be reduced. It can be reduced further.

[0170] The display panel 220 can be provided with various touch sensors. For example, capacitive elements A touch sensor can be used to detect the movement of a display panel. By arranging them in a trix shape, it is possible to detect the coordinates of the part of the body that is touched by a finger or other object.

[0171] The touch sensor is provided on the first substrate 221 or the second substrate 222 of the display panel 220. Alternatively, a structure provided on the first substrate 221 and a structure provided on the second substrate 222 may be used. , which constitutes a touch sensor.

[0172] An example of a touch sensor provided on the first substrate 221 is a photoelectric conversion element. The photoelectric conversion element can optically detect a finger or other object that touches the surface of the second substrate.

[0173] The touch sensor provided on the second substrate 222 may be a photoelectric conversion element or a capacitance element. The touch sensor is provided on the side of the second substrate facing the first substrate. The capacitance element has a pair of electrodes. A change in the potential of the electrode caused by a finger or the like touching the second substrate is detected.

[0174] The structure is composed of a structure provided on a first substrate 221 and a structure provided on a second substrate 222. An example of the touch sensor is a capacitance element. The electrode connected to the second substrate 222 and the electrode provided on the second substrate 222 constitute a capacitor element. The change in capacitance caused by the touch of a finger bringing the second substrate closer to the first substrate is detected. do.

[0175] When the display panel 220 is an active matrix type, the first substrate 221 or The transistors are provided in a matrix on the second substrate 222. A transistor sensor may be provided on the second substrate 222 so as to overlap the first substrate side. The process is simplified by providing the touch sensor and the touch panel on the same surface of the same substrate. It is possible.

[0176] Note that this embodiment mode can be appropriately combined with other embodiment modes shown in this specification. .

[0177] (Embodiment 6) The present invention can be suitably used in a region in which a channel of the transistor illustrated in the above embodiment is formed. An example of a semiconductor that can achieve this will be described below.

[0178] Oxide semiconductors have a large energy gap of 3.0 eV or more, and The oxide semiconductor film obtained by processing the oxide semiconductor film under the above-mentioned conditions and sufficiently reducing the carrier density was applied. In a transistor, the leakage current between the source and drain in the off state (off current) is , can be made extremely low compared to conventional transistors using silicon.

[0179] When an oxide semiconductor film is used in a transistor, the thickness of the oxide semiconductor film is 2 nm to 40 nm. It is preferable that the thickness is set to nm or less.

[0180] Applicable oxide semiconductors include at least indium (In) or zinc (Zn). It is preferable that the oxide semiconductor contains In and Zn. As a stabilizer to reduce the variation in the electrical characteristics of the transistors used, In addition to gallium (Ga), tin (Sn), hafnium (Hf), and zirconium (Zr) , titanium (Ti), scandium (Sc), yttrium (Y), lanthanides (e.g. , cerium (Ce), neodymium (Nd), gadolinium (Gd), or It is preferable that one or more kinds of the amine compound are contained.

[0181] For example, oxide semiconductors include indium oxide, tin oxide, zinc oxide, and In-Zn oxide. substances, Sn-Zn oxides, Al-Zn oxides, Zn-Mg oxides, Sn-Mg oxides In-Mg oxide, In-Ga oxide, In-Ga-Zn oxide (IGZO and (also written as In-Al-Zn oxide, In-Sn-Zn oxide, Sn-Ga-Z n-based oxides, Al-Ga-Zn-based oxides, Sn-Al-Zn-based oxides, In-Hf-Zn In-Zr-Zn oxide, In-Ti-Zn oxide, In-Sc-Zn oxide Oxide, In-Y-Zn oxide, In-La-Zn oxide, In-Ce-Zn oxide In-Pr-Zn oxides, In-Nd-Zn oxides, In-Sm-Zn oxides , In-Eu-Zn oxide, In-Gd-Zn oxide, In-Tb-Zn oxide, In-Dy-Zn oxide, In-Ho-Zn oxide, In-Er-Zn oxide, I n-Tm-Zn oxide, In-Yb-Zn oxide, In-Lu-Zn ​​oxide, In -Sn-Ga-Zn oxide, In-Hf-Ga-Zn oxide, In-Al-Ga-Z n-based oxides, In-Sn-Al-Zn-based oxides, In-Sn-Hf-Zn-based oxides, In -Hf-Al-Zn based oxides can be used.

[0182] Here, the In-Ga-Zn oxide is an oxide having In, Ga, and Zn as the main components. The ratio of In, Ga, and Zn does not matter. Metal elements may also be included.

[0183] In addition, as an oxide semiconductor, InMO3(ZnO) m (m>0 and m is not an integer) In addition, M may be selected from Ga, Fe, Mn, and Co. Indicates one or more metal elements, or the above-mentioned elements as stabilizers In addition, as an oxide semiconductor, In2SnO5(ZnO) n (n>0 and n is an integer) Materials represented by the formula:

[0184] For example, In:Ga:Zn=1:1:1, In:Ga:Zn=3:1:2, or In In-Ga-Zn oxides with an atomic ratio of Ga:Zn=2:1:3 and oxides with similar compositions It is a good idea to use compounds.

[0185] When a large amount of hydrogen is contained in the oxide semiconductor film, the hydrogen is bonded to the oxide semiconductor. Some of the electrons become donors and generate electron carriers. This causes the transistor Therefore, after the formation of the oxide semiconductor film, the threshold voltage of the In the step of FIG. 1, a dehydration treatment (dehydrogenation treatment) is performed to remove hydrogen or moisture from the oxide semiconductor film. By removing impurities, it is highly purified so that it contains as few impurities as possible, and then it is dehydrated (dehydrogenated) In order to compensate for the increased oxygen vacancies, a treatment for adding oxygen to the oxide semiconductor film is preferably performed. stomach..

[0186] In this specification and the like, supplying oxygen to an oxide semiconductor film is referred to as oxygen supplying treatment. In some cases, the amount of oxygen contained in the oxide semiconductor film is larger than that in the stoichiometric composition. This is sometimes referred to as hyperoxia treatment.

[0187] In this manner, hydrogen or moisture is removed from the oxide semiconductor film by the dehydration treatment (dehydrogenation treatment). By adding oxygen to the material, the oxygen vacancies are compensated for, resulting in an i-type (intrinsic) or The oxide semiconductor film can be an oxide semiconductor film that is close to i-type and is substantially i-type (intrinsic). The term "substantially intrinsic" means that there are very few carriers derived from donors in the oxide semiconductor film ( zero), and the carrier density is 1×10 17 / cm 3 Below, 1×10 16 / cm 3 below, 1×10 15 / cm 3 Below, 1×10 14 / cm 3 Below, 1×10 13 / cm 3 Below This means that...

[0188] In addition, in the transistor including the i-type or substantially i-type oxide semiconductor film, For example, a transistor using an oxide semiconductor film can be The drain current when the device is off is 1×10 at room temperature (approximately 25°C). -18 A or below, good Preferably 1×10 -21 A or less, more preferably 1×10 -24 A or below, or 85℃ 1×10 -15 A or less, preferably 1×10 -18 A or less, more preferably 1×1 0 -21 A or less. Note that the off state of a transistor is an n-channel In the case of a transistor, this refers to a state in which the gate voltage is sufficiently smaller than the threshold voltage. If the gate voltage is 1V or more, 2V or more, or 3V or more less than the threshold voltage, The transistor is turned off.

[0189] Oxide semiconductor films are roughly classified into non-single-crystal oxide semiconductor films and single-crystal oxide semiconductor films. The single-crystal oxide semiconductor film is called CAAC-OS (C Axis Aligned Crystalline Oxide Semiconductor). Talline Oxide Semiconductor film, polycrystalline oxide semiconductor film The CAAC-OS film is a c-axis crystalline oxide semiconductor film, a microcrystalline oxide semiconductor film, an amorphous oxide semiconductor film, and the like. This is one of the oxide semiconductor films having a plurality of oriented crystal parts.

[0190] Preferably, the oxide semiconductor film is a CAAC-OS (C Axis Aligned Cr The film is a crystalline oxide semiconductor.

[0191] The CAAC-OS film was observed under a transmission electron microscope (TEM). When observed under a ferromagnetic microscope, clear boundaries between the crystals, i.e., crystal boundaries, were observed. It is not possible to confirm the grain boundary. It can be said that the AC-OS film is less susceptible to the decrease in electron mobility caused by grain boundaries.

[0192] The CAAC-OS film was observed by TEM from a direction roughly parallel to the sample surface (cross-sectional TEM observation ) It can be confirmed that the metal atoms are arranged in layers in the crystal part. Each layer has a surface on which the CAAC-OS film is formed (also called a surface on which the film is formed) or a top surface having irregularities. The shape of the CAAC-OS film reflects this, and the CAAC-OS film is aligned parallel to the surface on which the film is formed or the top surface.

[0193] On the other hand, the CAAC-OS film was observed by TEM from a direction roughly perpendicular to the sample surface (planar TEM). When the metal atoms were observed, they were found to be arranged in triangular or hexagonal shapes in the crystals. However, no regularity was observed in the arrangement of metal atoms between different crystal parts. stomach.

[0194] In addition, when electron diffraction was performed on the CAAC-OS film, spots (bright points) indicating orientation were observed. Observed.

[0195] Cross-sectional and planar TEM observations revealed that the crystals in the CAAC-OS film had an orientation. It is clear that there are

[0196] Most of the crystals in the CAAC-OS film are cubes with sides less than 100 nm. Therefore, the crystal part in the CAAC-OS film has a side length of 10n This also includes cases where the size fits within a cube of less than 100 mm, 5 nm, or 3 nm. In addition, multiple crystals in the CAAC-OS film are connected to form a single large crystal region. For example, in a planar TEM image, 2 More than 5μm 2 More than or equal to 1000μm 2 In some cases, crystal regions having more than this amount may be observed.

[0197] X-ray diffraction (XRD) was performed on the CAAC-OS film. For example, a CAAC-OS film with InGaZnO4 crystals was In the out-of-plane analysis, a peak was observed at a diffraction angle (2θ) of approximately 31°. This peak is attributed to the (009) plane of the InGaZnO4 crystal. This indicates that the crystals in the CAAC-OS film have a c-axis orientation, and the c-axis is generally aligned on the surface on which the film is formed or on the upper surface. It can be seen that it is oriented in a substantially vertical direction.

[0198] On the other hand, in-plane X-ray irradiation is performed on the CAAC-OS film in a direction perpendicular to the c-axis. In the analysis by the ane method, a peak may appear at 2θ around 56°. This peak is This is attributed to the (110) plane of the InGaZnO4 crystal. In the case of a semiconductor film, 2θ is fixed at around 56°, and the normal vector of the sample surface is set as the axis (φ axis). When the sample is rotated and analyzed (φ scan), the crystal plane equivalent to the (110) plane is In contrast, in the case of the CAAC-OS film, the 2θ is set to 5 Even when the φ is fixed at around 6° and scanned, no clear peak appears.

[0199] From the above, it is considered that the a-axis and b-axis orientations are inconsistent between different crystal regions in the CAAC-OS film. The crystal is regular, but has a c-axis orientation, and the c-axis is parallel to the normal vector of the surface on which the crystal is formed or the upper surface. Therefore, the layered arrangement confirmed by the cross-sectional TEM observation mentioned above is consistent with the above. Each layer of aligned metal atoms is a plane parallel to the ab plane of the crystal.

[0200] The crystalline portion is formed when the CAAC-OS film is formed or when a crystallization process such as a heat treatment is performed. As described above, the c-axis of the crystal is aligned along the surface on which the CAAC-OS film is formed or along the surface on which the CAAC-OS film is formed. The orientation of the CAAC-OS film is parallel to the normal vector of the top surface. When the shape of the CAAC-OS film is changed by etching, the c-axis of the crystal is aligned with the surface on which the CAAC-OS film is formed. Or it may not be parallel to the normal vector of the upper surface.

[0201] Furthermore, the distribution of c-axis oriented crystal parts in the CAAC-OS film does not need to be uniform. For example, the crystals in the CAAC-OS film grow from the top surface of the CAAC-OS film. When the crystal is formed by the above method, the region near the top surface has more c-axis oriented crystals than the region near the surface on which the crystal is formed. In addition, when impurities are added to the CAAC-OS film, the proportion of impurities may increase. The region where the ZnO was added was altered, and regions with different proportions of c-axis oriented crystals were formed. This may also occur.

[0202] In addition, the out-of-plane method of CAAC-OS film with InGaZnO4 crystals In the analysis by , in addition to the peak at 2θ near 31°, a peak also appeared at 2θ near 36°. The peak at 2θ of around 36° may be due to the c-axis orientation in some parts of the CAAC-OS film. The CAAC-OS film contains crystals that do not have a 2θ of around 31°. It is preferred that the spectrum exhibits a peak and does not exhibit a peak at 2θ of around 36°.

[0203] The CAAC-OS film is an oxide semiconductor film with a low concentration of impurities. The impurities include hydrogen, carbon, and The elements are other than the main components of the oxide semiconductor film, such as silicon and transition metal elements. The elements that bond to oxygen more strongly than the metal elements that form the oxide semiconductor film, such as arsenic, are oxidized. By removing oxygen from the oxide semiconductor film, the atomic arrangement of the oxide semiconductor film is disrupted, reducing its crystallinity. In addition, heavy metals such as iron and nickel, argon, and carbon dioxide have an atomic radius of Since the molecular radius is large, when the cation is included in the oxide semiconductor film, the The impurities contained in the oxide semiconductor film are likely to disturb the atomic arrangement and cause a decrease in crystallinity. Objects can act as carrier traps or carrier generation sources.

[0204] The CAAC-OS film is an oxide semiconductor film having a low density of defect states. Oxygen vacancies in the semiconductor film can become carrier traps or trap hydrogen, It can be a carrier source.

[0205] A material with a low impurity concentration and a low defect level density (few oxygen vacancies) is called a high-purity intrinsic or The term "substantially high-purity intrinsic" refers to a highly-purified intrinsic oxide semiconductor film. Since the carrier generation source is small, the carrier density can be reduced. A transistor using an oxide semiconductor film has electrical characteristics in which the threshold voltage is negative ( Also called marion.) It is rare for it to become high purity genuine or substantially high purity genuine. The oxide semiconductor film has few carrier traps. A transistor using such a material has small fluctuation in electrical characteristics and is highly reliable. Note that it takes a long time for charges trapped in the carrier traps in the oxide semiconductor film to be released. The charge is long and can behave like a fixed charge. In addition, a transistor using an oxide semiconductor film having a high density of defect states has unstable electrical characteristics. There are cases.

[0206] In addition, the electrical characteristics of transistors using CAAC-OS films were improved by irradiation with visible light or ultraviolet light. The fluctuation is small.

[0207] In addition, the following conditions are preferably applied to form the CAAC-OS film.

[0208] By increasing the substrate temperature during film formation, migration of plate-shaped sputtered particles that reach the substrate is prevented. Sputtering occurs and the flat surface of the sputtered particle adheres to the substrate. The sputtering particles are positively charged, so they repel each other while adhering to the substrate. Therefore, the sputtering particles do not overlap unevenly, resulting in a CA with a uniform thickness. Specifically, the substrate temperature is set to 100°C or higher and 740°C or lower. Preferably, the film is formed at a temperature of 200° C. or higher and 500° C. or lower.

[0209] In addition, by reducing the amount of impurities mixed in during film formation, the crystal state is prevented from being destroyed by impurities. For example, the concentration of impurities (hydrogen, water, carbon dioxide, nitrogen, etc.) present in the deposition chamber can be controlled. In addition, the impurity concentration in the deposition gas may be reduced. A deposition gas having a dew point of -80°C or less, preferably -100°C or less, is used.

[0210] In addition, by increasing the oxygen ratio in the deposition gas and optimizing the power, plasma damage during deposition is reduced. The oxygen ratio in the deposition gas is preferably 30% by volume or more, and more preferably 100% by volume or more. The product is %.

[0211] After the CAAC-OS film is formed, heat treatment may be performed. The temperature is set to 740° C. or higher, and preferably 200° C. or higher and 500° C. or lower. The heat treatment is performed for 1 minute or more and 24 hours or less, preferably 6 minutes or more and 4 hours or less. The heat treatment may be performed in an active atmosphere or an oxidizing atmosphere. It is preferable to perform the heat treatment in an inert atmosphere. After that, heat treatment is performed in an oxidizing atmosphere. The impurity concentration of the S film can be reduced in a short time. In this case, oxygen vacancies may be generated in the CAAC-OS film due to the oxidation of the The oxygen deficiency can be reduced by the heat treatment. The crystallinity of the AAC-OS film can be further improved. Hereinafter, the reaction may be carried out under reduced pressure of 100 Pa or less, 10 Pa or less, or 1 Pa or less. can reduce the impurity concentration in the CAAC-OS film in a shorter time.

[0212] As an example of a sputtering target, an In-Ga-Zn-O compound target is The details are shown below.

[0213] InO X powder, GaO Y Powder and ZnO Z The powders are mixed in a specified number of moles and then pressurized. By heat treatment at a temperature between 1000 and 1500℃, polycrystalline In-Ga -Zn-O compound target, where X, Y and Z are any positive numbers. , the predetermined molar ratio is, for example, InO X powder, GaO Y Powder and ZnO Z Powder, 1 :1:1, 1:1:2, 1:3:2, 2:1:3, 2:2:1, 3:1:1, 3:1:2 , 3:1:4, 4:2:3, 8:4:3, or values ​​close to these. The type of powder and the molar ratio of the powder to be mixed depend on the sputtering target to be prepared. The setting can be changed as appropriate depending on the kit.

[0214] Alternatively, the CAAC-OS film may be formed by the following method.

[0215] First, a first oxide semiconductor film is formed to a thickness of 1 nm or more and less than 10 nm. The semiconductor film is formed by sputtering. 00℃ or less, preferably 150℃ to 450℃, and the oxygen ratio in the deposition gas is 30 % or more, preferably 100% by volume.

[0216] Next, heat treatment is performed to convert the first oxide semiconductor film into a first CAAC-OS film having high crystallinity. The temperature of the heat treatment is 350°C or higher and 740°C or lower, preferably 450°C or higher and 650°C or lower. The heat treatment time is from 1 minute to 24 hours, preferably from 6 minutes to 4 hours. The heat treatment may be carried out in an inert atmosphere or an oxidizing atmosphere. In the case of a heat treatment in an inert atmosphere, the heat treatment is first performed in an oxidizing atmosphere. By the heat treatment in air, the impurity concentration of the first oxide semiconductor film can be reduced in a short time. On the other hand, oxygen vacancies are generated in the first oxide semiconductor film by heat treatment in an inert atmosphere. In that case, the oxygen deficiency can be reduced by heat treatment in an oxidizing atmosphere. Heat treatment can be performed at 1000 Pa or less, 100 Pa or less, 10 Pa or less, or The deposition may be performed under reduced pressure of 1 Pa or less. Under reduced pressure, the impurity concentration of the first oxide semiconductor film is It can be reduced in a shorter time.

[0217] The first oxide semiconductor film has a thickness of 1 nm or more and less than 10 nm. Compared with nanometers or more, it can be easily crystallized by heat treatment.

[0218] Next, a second oxide semiconductor film having the same composition as the first oxide semiconductor film is formed to a thickness of 10 nm or more and 50 nm or more. The second oxide semiconductor film is formed to a thickness of 1 nm or less by sputtering. Specifically, the substrate temperature is set to 100° C. or higher and 500° C. or lower, preferably 150° C. or higher and 450° C. or lower. The oxygen ratio in the deposition gas is set to 30% by volume or more, preferably 100% by volume. do.

[0219] Next, heat treatment is performed to form a second oxide semiconductor film from the first CAAC-OS film by solid phase growth. The heat treatment temperature was 350° C. The temperature is set to 450° C. or higher and 740° C. or lower, preferably 450° C. or higher and 650° C. or lower. The heat treatment is performed for 1 minute or more and 24 hours or less, preferably 6 minutes or more and 4 hours or less. The heat treatment may be performed in an active atmosphere or an oxidizing atmosphere. Preferably, the heat treatment is performed in an inert atmosphere. After that, heat treatment is performed in an oxidizing atmosphere. The impurity concentration of the semiconductor film can be reduced in a short time. Oxygen vacancies may be generated in the second oxide semiconductor film by the treatment. The oxygen deficiency can be reduced by heat treatment in a 10 The pressure may be reduced to 00 Pa or less, 100 Pa or less, 10 Pa or less, or 1 Pa or less. Under reduced pressure, the impurity concentration of the second oxide semiconductor film can be reduced in a shorter time. do.

[0220] In this manner, a CAAC-OS film having a total thickness of 10 nm or more can be formed. can.

[0221] The oxide semiconductor film may have a structure in which a plurality of oxide semiconductor films are stacked.

[0222] For example, the oxide semiconductor film is a first layer, a gate insulating film, and a second layer. Between them, there is a layer made of the elements that make up the first layer, and the electron affinity is 0.2 eV or more smaller than that of the first layer. In this case, when an electric field is applied from the gate electrode, a charge is generated in the first layer. In the first layer, a channel is formed, and in the second layer, no channel is formed. Since the values ​​of the refractive index and the refractive index of the first layer and the second layer are the same, almost no interfacial scattering occurs at the interface between the first layer and the second layer. Therefore, by providing a second layer between the first layer and the gate insulating film, the current of the transistor can be reduced. The field effect mobility can be increased.

[0223] Furthermore, the gate insulating film may be a silicon oxide film, a silicon oxynitride film, a silicon nitride oxide film, or In the case of using a silicon nitride film, silicon contained in the gate insulating film is transferred to the oxide semiconductor film. When silicon is contained in the oxide semiconductor film, the crystallinity of the oxide semiconductor film may deteriorate. This leads to a decrease in the channel density and carrier mobility. In order to reduce the silicon concentration, it is preferable to provide a second layer between the first layer and the gate insulating film. For the same reason, the second layer is made of the elements that make up the first layer and has a lower electron affinity than the first layer. It is preferable to provide a third layer that is at least 0.2 eV smaller, and to sandwich the first layer between the second and third layers.

[0224] By adopting such a structure, the diffusion of impurities such as silicon into the region where the channel is formed is suppressed. This reduces or even prevents diffusion, resulting in a highly reliable transistor. Cut.

[0225] Note that in order for the oxide semiconductor film to be a CAAC-OS film, Silicon concentration 2.5×10 21 / cm 3 Preferably, the oxide semiconductor film The silicon concentration is 1.4×10 21 / cm 3 less than 4×10 19 / cm 3 less than 2.0×10 18 / cm 3The oxide semiconductor film The silicon concentration in 21 / cm 3 If this is the case, the transistor current There is a risk of a decrease in mobility due to the magnetic field effect, which is 4.0×10 19 / cm 3 If the above is the case, the oxide semiconductor This is because there is a risk that the oxide semiconductor film will become amorphous at the interface with the film in contact with the substrate. In addition, the silicon concentration in the oxide semiconductor film is set to 2.0×10 18 / cm 3 Less than As a result, the reliability of the transistor can be further improved and the DOS (de In addition, the silicon in the oxide semiconductor film can be expected to reduce the density of states. The concentration of ions was measured by secondary ion mass spectrometry (SIMS). It can be measured using a spectrometry (ESD) system.

[0226] This embodiment may be implemented in appropriate combination with other embodiments described in this specification. can be done.

[0227] (Embodiment 7) In this embodiment, a display panel mounted on a curved surface and a display device for displaying the curved surface, which are one embodiment of the present invention, will be described. A driving circuit including circuit elements mounted on multiple flat surfaces arranged in a stepped pattern along a curved surface on the back side An example of an electronic device including a display device having the above will be described with reference to FIG.

[0228] The electronic devices shown in FIGS. 8A to 8C are examples of portable information terminals.

[0229] A portable information terminal 1010 shown in FIG. 8A includes a display device 101 incorporated in a housing 1011. In addition to 2A, there are an operation button 1013, a speaker 1014, a microphone 1015, and other components (not shown). Stereo headphone jack, memory card slot, camera, USB connector, etc. It is equipped with external connection ports, etc.

[0230] Here, the display device according to one embodiment of the present invention described in the above embodiment is used as the display device 1012A. A display device 1012A shown in FIG. 8A has a convex curved surface. 1 is an example having a display panel mounted on a display panel.

[0231] The portable information terminal 1020 shown in FIG. 8B has a similar configuration to the portable information terminal 1010. A display device having a display panel mounted on a curved surface that is curved to fit the side of a housing 1011 8C is an example of a portable information terminal 1030. A display having a similar configuration to that of the terminal 1010 and a display panel mounted on a concavely curved surface. The display device 1012B and the display device 1012C are provided as an example. In this case, the display device according to one embodiment of the present invention described in the above embodiment can be applied.

[0232] The electronic device according to one embodiment of the present invention includes a display panel having a curved surface on an upper surface and a flat portion on a bottom surface. This allows the electronic device to be placed face-down on a flat surface such as a desk. As a result, it is possible to provide an electronic device in which characters and images displayed on a display panel are easy to see. This can be done.

[0233] The portable information terminals shown in FIG. 8(A) to FIG. 8(C) are, for example, telephones, electronic books, personal computers, etc. The display device has one or more functions as a game machine, a display device, and a display device for displaying a game. The sensor may include a touch sensor.

[0234] 9(A) to 9(D) show a portable information device terminal 300E. FIG. 9B is a perspective view illustrating the external shape of the information terminal 300E. 9(C) is a top view of the portable information device terminal 300E of FIG. FIG. 9(D) is a cross-sectional view taken along the line Z1-Z2 of the portable information device terminal 300E. FIG.

[0235] The portable information device terminal 300E is, for example, a telephone, a notebook, an information viewing device, etc. It has one or more functions. Specifically, it can be used as a smartphone. .

[0236] The portable information terminal 300E includes a housing 160a and a housing 16 that fits together with the housing 160a. 0b, the space surrounded by the housing 160a and the housing 160b, the base 110, the housing 160a and the base 110, a display panel 120 and a printed circuit board 161C for driving the display panel 120 (See FIG. 9(C)).

[0237] The display panel 120 is provided along multiple surfaces of the housing 160a. The display panel 120 having the above structure is disposed along the inner side of the housing 160a. The portable information device terminal 300E can display text and image information on multiple sides. For example, three operation buttons can be displayed on one side (see FIG. 9(A)). The information shown in the dashed rectangle can be displayed on another surface (see FIG. 9(B)).

[0238] The portable information device terminal 300E can display text and image information on multiple surfaces. As a result, the user can easily carry the portable information terminal 300E in, for example, a breast pocket of his / her clothes. The display can be confirmed in this state (see FIG. 9(D)).

[0239] Specifically, the telephone number or name of the caller of the incoming call is displayed on the display panel 120. The display is displayed at a position where it can be observed from above the portable information device terminal 300E. The user can check the display panel 120 without taking the mobile terminal 300E out of his / her pocket. This allows you to, for example, answer calls if they are urgent and reject calls if they are not urgent. It can be denied.

[0240] The portable information device 300E includes a vibration sensor and a vibration sensor that detects the vibration. The device is provided with a storage device that stores a program for switching to a mode for rejecting incoming calls based on vibration. This allows the user to carry the portable information device terminal 300E lightly over his / her clothes. By tapping the phone to make it vibrate, it can be put into a mode where it will reject incoming calls.

[0241] This embodiment may be implemented in appropriate combination with other embodiments described in this specification. can be done. [Explanation of symbols]

[0242] 10 Circuit elements 11a Planarization layer 11b Planarization layer 11c Planarization layer 12 Wiring 18 Through hole 100 display device 110 Base 111 Multilayer board 111C Printed Circuit Board 111L Printed Circuit Board 111R Drive circuit 112a Connector 112b Connector 114 Antenna 115L terminal section 115R terminal section 117 Metal Film 118 Through hole 120 Display Panel 129 Flexible Printed Circuit Board 130 Touch Panel 139 Flexible Printed Circuit Board 140 Spacer 160a housing 160b case 160c case 161C Printed Circuit Board 161L Control circuit 161R Functional circuit 170 Batteries 170C battery 170L battery 170R battery 200 Display device 210 Base 220 Display Panel 226 Spacer 229 Flexible Printed Circuit Board 233 Wiring 230 Touch Panel 239 Flexible Printed Circuit Board 260a Case 260b case 260c case 261L Control circuit 261R Functional circuit 270 batteries 270C battery 270L battery 270R battery 300A display device 300B display device 300C display unit 300D display device 400A display device 400B display device 400D display device 400C display unit 1010 Mobile information terminal 1011 Case 1012A Display device 1012B Display device 1012C Display device 1013 Operation button 1014 Speaker 1015 Mike 1020 Mobile Information Terminal 1030 Portable information terminal

Claims

[Claim 1] A base body having an outer surface molded into a curved surface; A display panel attached along the curved surface; A plurality of electronic circuit boards are provided on the inner surface of the base body with steps that increase in height from a center portion toward an outer region; a wiring member that electrically connects the electronic circuit boards to each other, The display panel is a display device connected to the electronic circuit board at a side portion of the base.

Images