Polishing system, polishing method, and lathe system

Abstract

To provide a polishing system and a polishing method that can perform polishing with high polishing accuracy and degree of freedom, and to provide a lathe system that can perform polishing with high polishing accuracy and degree of freedom by mounting a robot to which a polishing tool is held thereto.SOLUTION: A polishing system for performing polishing of bringing a polishing tool into contact with a workpiece includes: a robot for holding the polishing tool; and a work holding part for holding the workpiece and moving the workpiece relatively to the polishing tool.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a polishing system, a polishing method, and a lathe system. [Background technology]

[0002] Patent Document 1 discloses a grinding device for grinding rolls used in rolling mills. This grinding device includes a bearing assembly that rotatably supports the roll to be ground, and a grinding roll that is rotated by a motor. The grinding roll moves toward the roll while rotating, and grinds the roll by contacting the roll. Patent Document 1 also discloses that the roundness of the roll is improved by grinding the bearing portion of the roll with a grinding wheel of a cylindrical grinding machine. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2010-149257 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the polishing apparatus described in Patent Document 1, polishing is performed by bringing a polishing tool such as a polishing roll or a grinding wheel close to and in contact with the roll to be polished. However, there is a problem in that the polishing accuracy cannot be precisely controlled by simply moving the polishing tool close.

[0005] On the other hand, a method for increasing the degree of freedom of movement of the mechanism for moving the polishing tool may be considered, but in that case, there is a problem that the positional accuracy of the polishing tool is likely to decrease, which ultimately leads to a decrease in polishing accuracy.

[0006] Therefore, there is a need to realize a polishing system that can perform polishing with high precision and a high degree of freedom. [Means for solving the problem]

[0007] A polishing processing system according to an application example of the present invention includes: A polishing processing system for performing a polishing process by contacting a polishing tool with a workpiece, A robot for holding the polishing tool; a workpiece holding unit that holds the workpiece and moves the workpiece relatively to the polishing tool; Equipped with.

[0008] A polishing method according to an application example of the present invention includes the steps of: A polishing method for performing the polishing process on the workpiece using a polishing system according to an application example of the present invention, comprising: The workpiece is moved relative to the polishing tool by operating the workpiece holding portion, while the polishing tool is brought into contact with the workpiece by operating the robot, thereby performing the polishing process.

[0009] A lathe system according to an application example of the present invention includes: A workpiece rotating unit that holds a workpiece and rotates the workpiece; a robot fixing unit for fixing a robot holding the polishing tool; Equipped with. [Brief description of the drawings]

[0010] [Figure 1] 1 is a perspective view showing a polishing processing system according to a first embodiment. [Diagram 2] FIG. 2 is an enlarged view showing a part of FIG. [Diagram 3] FIG. 2 is a functional block diagram of the polishing processing system shown in FIG. [Figure 4] 4 is a diagram illustrating an example of a hardware configuration of the control device in FIG. 3. [Diagram 5] 2 is a flowchart showing the configuration of a polishing method according to the first embodiment. [Figure 6]This is a schematic diagram showing the polishing tool as viewed from a reference point set to a point outside the polishing processing system, and the contacted portion, which is the area of ​​the inner surface (polished surface) of the workpiece with which the polishing tool is in contact. [Figure 7] FIG. 2 is a perspective view showing a polishing system according to a first modified example of the first embodiment. [Figure 8] FIG. 11 is a perspective view showing a polishing system according to a second modified example of the first embodiment. [Figure 9] FIG. 11 is a perspective view showing a polishing system according to a third modified example of the first embodiment. [Figure 10] FIG. 11 is a perspective view showing a polishing processing system according to a second embodiment. [Figure 11] FIG. 11 is an enlarged view showing a part of FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a polishing system, a polishing method, and a lathe system of the present invention will be described in detail based on the embodiments shown in the accompanying drawings.

[0012] 1. First embodiment A polishing system according to a first embodiment will be described.

[0013] Fig. 1 is a perspective view showing a polishing system 1 according to a first embodiment. Fig. 2 is an enlarged view showing a part of Fig. 1.

[0014] The polishing system 1 shown in Fig. 1 performs polishing by bringing a polishing tool 8 into contact with a workpiece 9. The polishing process refers to a process of removing a part of the surface of the workpiece 9 by the polishing tool 8. Specifically, the polishing process includes a process of polishing the surface of the workpiece 9 using a polishing tape, a polishing cloth, a polishing paper, or the like as the polishing tool 8. In addition, the polishing process in this specification also includes a process called grinding using a grindstone or the like as the polishing tool 8 and a process called cutting using a cutting tool or the like as the polishing tool 8.

[0015] In each figure of the present application, the X-axis, Y-axis, and Z-axis are set as three mutually orthogonal axes. Each axis is represented by an arrow, with the tip of the arrow being "plus" and the base of the arrow being "minus." In the following description, for example, the "X-axis direction" includes both the plus and minus directions of the X-axis. The same applies to the Y-axis and Z-axis directions. In the following description, the plus side of the Z-axis is also referred to as "upper" and the minus side of the Z-axis is also referred to as "lower."

[0016] 1.1. Overview of the polishing processing system The polishing system 1 shown in FIG. 1 includes a robot 2, a workpiece holder 3, and a control device 7.

[0017] The robot 2 has a base 21, a robot arm 22, a force sensor 23, and a polishing tool holder 24.

[0018] The base 21 is fixed to a floor surface 20. A base end of a robot arm 22 is attached to the base 21. A force sensor 23 (force sensor) and a polishing tool holder 24 are attached to the tip end of the robot arm 22. The polishing tool holder 24 holds the polishing tool 8. The force sensor 23 detects an external force applied to the polishing tool 8.

[0019] The workpiece holding unit 3 has a stand 31 and a workpiece rotating unit 32. The workpiece rotating unit 32 holds a cylindrical workpiece 9 and rotates it about a central axis AX of the workpiece 9 shown in Fig. 2. An inner peripheral surface 91 of the workpiece 9 is the surface to be polished. Examples of such a cylindrical workpiece 9 include the inner and outer rings of a bearing.

[0020] 1 and 2, the attitude of the robot arm 22 is controlled to insert the polishing tool 8 into the hollow portion of the workpiece 9. The polishing tool 8 is in contact with the inner peripheral surface 91 of the workpiece 9. When the workpiece 9 rotates in this state, the polishing tool 8 polishes the inner peripheral surface 91, which is a curved surface.

[0021] The force sensor 23 detects forces such as translational force and rotational force (moment) acting on the polishing tool 8, and outputs force detection information. The control device 7 reflects this force detection information in the posture of the robot arm 22. Note that the force sensor 23 may be provided as necessary, and may be omitted, for example, when it is not necessary to reflect the force detection information.

[0022] The control device 7 acquires the force detection information output from the force sensor 23. In addition, the control device 7 controls the operations of the robot 2 and the workpiece holder 3.

[0023] 1.2.Robots 1 is a vertical articulated robot. However, the form of the robot 2 is not limited to this, and may be a horizontal articulated robot, an orthogonal robot using a slider mechanism, or a dual-arm robot having multiple robot arms 22.

[0024] The base 21 is fixed to the floor surface 20 and supports the base end 222 of the robot arm 22 shown in Fig. 1. The base 21 may be fixed to a position other than the floor surface 20, for example, to a wall surface, a ceiling surface, a stand 31 of the workpiece holder 3, or a linear guide provided on the stand 31.

[0025] A robot fixing part 202 for fixing the robot 2 is provided on the floor surface 20. The robot fixing part 202 may have any structure capable of fixing the robot 2, and examples of such structures include bolt through holes, screw holes, anchor bolts, a base plate, and a stand.

[0026] The robot arm 22 has a tip portion 224 to which various end effectors can be attached, as shown in Fig. 2. The polishing tool 8 is attached to the tip portion 224 shown in Fig. 2 via a polishing tool holder 24 and a force sensor 23. The robot arm 22 moves the polishing tool 8 to any position in space.

[0027] The robot arm 22 shown in FIG. 1 has six joints. The number of joints of the robot arm 22 is not limited to six, but may be two or more, and is preferably three or more. Such a robot arm 22 has a high degree of freedom in the posture that it can take, and therefore can hold the polishing tool 8 in a desired posture at a desired position around the workpiece 9. This allows the polishing tool 8 to come into contact with each part of the surface of the workpiece 9 in an appropriate posture. In particular, when the robot 2 is a vertical multi-joint robot, such an effect becomes more pronounced.

[0028] Moreover, the robot arm 22 allows the polishing tool 8 to be freely moved while being in contact with the workpiece 9. The robot arm 22 moves the polishing tool 8, for example, in the Y-axis direction and in the circumferential direction around the Y-axis. As a result, a polishing system 1 capable of performing polishing with high polishing accuracy and high degree of freedom can be realized. Furthermore, the polishing system 1 allows the polishing to be performed without the operator approaching the workpiece 9. This makes it possible to perform the polishing more safely. Furthermore, since the operator does not need to hold the polishing tool 8, the polishing can be automated and labor-saving.

[0029] The force sensor 23 may be a sensor capable of detecting at least a force (pressing force of the polishing tool 8) in a direction from the polishing tool 8 toward the surface of the workpiece 9 to be processed. On the other hand, a sensor capable of detecting forces in other directions is preferably used. By using such a sensor as the force sensor 23, it is possible to detect not only the pressing force of the polishing tool 8 against the workpiece 9 but also the frictional force of the polishing tool 8 in the in-plane direction of the surface of the workpiece 9. The pressing force is fed back to the force control of the robot arm 22 and can be used, for example, to adjust the polishing amount of the polishing tool 8. On the other hand, the frictional force can be used, for example, to detect the surface roughness after the polishing process, the uniformity of the surface roughness, the amount of wear and the presence or absence of abnormality of the polishing tool 8, the presence or absence of abnormality of the workpiece 9, and the like. These elements are factors that affect the accuracy of the polishing process. Therefore, by detecting the frictional force and controlling the operation of the robot arm 22 by a force control method based on the detected frictional force, it is possible to improve the polishing accuracy. In light of the above, it is useful to use a sensor with two or more detection axes as the force sensor 23. Examples of such sensors include a three-axis force sensor and a six-axis force sensor.

[0030] 2, the force sensor 23 is disposed between the polishing tool 8 and the polishing tool holder 24. Therefore, the force sensor 23 can detect the external force received by the polishing tool 8 without significant attenuation. This can further improve the accuracy of detecting the external force, and can more accurately control the posture of the robot arm 22 based on the detected external force.

[0031] The polishing tool holder 24 shown in FIG. 2 connects the tip 224 of the robot arm 22 and the force sensor 23. As a result, the polishing tool 8 is held via the force sensor 23. The polishing tool holder 24 shown in FIG. 2 has a shaft 242 and a head 244. The shaft 242 is made of a rod-shaped member. The shaft 242 ensures a distance between the robot arm 22 and the polishing tool 8, thereby contributing to sending the polishing tool 8 into a narrow space that the robot arm 22 cannot enter, such as the inner space of the workpiece 9. Therefore, if the shaft 242 is made longer, polishing processing can be performed on the inner circumferential surface 91 even if the Y-axis direction of the workpiece 9 is long. The head 244 is attached to the tip of the shaft 242 in a rotatable state. The polishing tool 8 is connected to the head 244 via the force sensor 23. Therefore, the force sensor 23 and the polishing tool 8 can be directed in a desired direction by changing the attachment angle of the head 244. This can further increase the degree of freedom of the polishing processing. By using the force sensor 23 in a lathe and lathe system described below, it is possible to improve the degree of freedom in processing and the finishing precision compared to conventional processing (polishing processing) with only position control, and to achieve effects that could not be obtained with conventional lathes (lathe systems). Even if the force sensor is held without a robot, it is possible to obtain some of the above effects, although they will not reach the present invention.

[0032] 1.3. Polishing tools The polishing tool 8 is a tool that performs polishing processing on the surface of the workpiece 9. Examples of the polishing tool 8 include polishing tape, polishing cloth, polishing paper, grinding stone, and bit, and the dry type or wet type is appropriately selected. The polishing tool 8 shown in FIG. 2 is a grinding stone. The polishing tool 8 performs polishing processing for the purpose of smoothing and improving surface roughness while removing a part of the surface of the workpiece 9. In FIG. 2, the polishing tool 8 is held so as to contact the inner peripheral surface 91 of the workpiece 9.

[0033] 1.4. Workpiece holding section As shown in Fig. 1, the workpiece holding unit 3 has a stand 31 and a workpiece rotating unit 32. The workpiece rotating unit 32 holds a cylindrical workpiece 9 and rotates the workpiece 9 about a central axis AX shown in Fig. 2. As a result, the surface of the workpiece 9 moves relative to the polishing tool 8. The stand 31 is placed on the floor surface 20 and has a built-in motor and the like (not shown). As a result, the workpiece rotating unit 32 is held in a rotatable state.

[0034] According to this configuration, a wide area of ​​the workpiece 9 can be polished by moving the workpiece 9 relative to the polishing tool 8. Furthermore, the relative movement of the surface of the workpiece 9 by the work turning part 32 can ensure a large movement amount and can also improve the positional accuracy during movement, compared to the case where the robot 2 moves the polishing tool 8 relative to the workpiece 9. Therefore, according to the above configuration, high polishing accuracy can be easily achieved.

[0035] The robot 2 may be configured to move the polishing tool 8 as described above. In this case, since the workpiece 9 moves relative to the polishing tool 8, a wide polished surface of the workpiece 9 can be ensured even if the amount of movement of the polishing tool 8 is kept small. Therefore, even if the positional accuracy of the polishing tool 8 by the robot 2 is low, the effect can be minimized.

[0036] 1 illustrates a lathe system 10 according to an embodiment. The lathe system 10 illustrated in FIG. 1 includes a workpiece rotating unit 32 and a robot fixing unit 202. The workpiece rotating unit 32 may be a so-called lathe. As described above, the robot fixing unit 202 has a structure capable of fixing the robot 2 holding the polishing tool 8. The position of the robot fixing unit 202 is not limited to the floor surface 20, and may be a wall surface, a ceiling surface, a stand 31 of the workpiece holding unit 3, a linear guide provided on the stand 31, or the like.

[0037] According to such a lathe system 10, by simply mounting the robot 2 on the robot fixing portion 202, a polishing system 1 capable of performing polishing with high polishing accuracy and a high degree of freedom can be constructed.

[0038] 1.5.Control Unit FIG. 3 is a functional block diagram of the polishing system 1 shown in FIG.

[0039] As shown in FIG. 3, the control device 7 has a robot control unit 71, a force detection information acquisition unit 72, and a workpiece holding control unit 73 as functional units.

[0040] The robot control unit 71 has a function of controlling the operation of the robot arm 22, holding the polishing tool 8 at a desired position, and performing force control of the robot arm 22 based on the force detected by the force sensor 23.

[0041] The force detection information acquisition unit 72 acquires the force detection information output from the force sensor 23. Then, the force detection information is reflected in the operation of the robot arm 22 by the robot control unit 71.

[0042] The workpiece holding control unit 73 controls the operation of the workpiece holding unit 3. This allows the workpiece holding unit 3 and the robot 2 to be linked together. As a result, for example, the rotation speed of the workpiece 9 can be adjusted according to the moving speed and moving direction of the polishing tool 8 by the robot 2, thereby improving the polishing accuracy.

[0043] The workpiece holding control unit 73 may be provided as necessary, and may be omitted.

[0044] FIG. 4 is a diagram illustrating an example of a hardware configuration of the control device 7 in FIG. The functions of each functional unit of the control device 7 are realized by hardware including a CPU 701, a ROM 702, a RAM 703, an external interface 704, and an external bus 705, as shown in Fig. 4. The CPU 701, the ROM 702, the RAM 703, and the external interface 704 are capable of communicating with each other via the external bus 705.

[0045] The CPU 701 is a central processing unit. Various programs stored in the ROM 702 are loaded into the RAM 703 and executed by the CPU 701, thereby implementing the functions of each functional unit. The CPU 701 may be, for example, a DSP (Digital Signal Processor). Furthermore, all or part of the hardware may be configured with an FPGA (Field-Programmable Gate Array), an ASIC (Application Specific Integrated Circuit), or the like.

[0046] ROM 702 is a read-only memory and is composed of any non-volatile storage element. RAM 703 is a random access memory and is composed of any volatile storage element. ROM 702 stores programs, data, setting values, etc. These may be provided from the outside via a removable storage medium or a network. ROM 702 and RAM 703 may be removable external storage devices, or may be storage devices installed in a different location via a network.

[0047] Examples of the external interface 704 include a digital input / output port such as a Universal Serial Bus (USB), an Ethernet (registered trademark) port, etc. The external interface 704 is used for transmitting and receiving signals between the robot 2 and each of the other parts.

[0048] 1.6. Polishing method Next, a polishing method according to the first embodiment will be described. Note that, here, a method using the polishing system 1 according to the first embodiment described above will be described as an example.

[0049] FIG. 5 is a flowchart showing the configuration of the polishing method according to the first embodiment. The polishing method shown in FIG. 5 includes a workpiece rotating step S102, a polishing tool contact step S104, and a polishing tool displacing step S106.

[0050] 1.6.1. Workpiece rotation step In the workpiece rotation step S102, the workpiece 9 is rotated by the workpiece holding unit 3. As a result, the surface of the workpiece 9 moves relative to the polishing tool 8. For this reason, when the polishing tool 8 is brought into contact with the workpiece 9 in the polishing tool contact step S104 described below, the surface of the workpiece 9 is rubbed by the polishing tool 8 even in a state in which the polishing tool 8 is not displaced relative to the workpiece holding unit 3. In this way, the polishing process is performed.

[0051] 1.6.2. Polishing Tool Contact Step In the polishing tool contact step S104, the polishing tool 8 is brought into contact with the surface of the workpiece 9. In the example of Fig. 2, the polishing tool 8 is brought into contact with the inner peripheral surface 91 of the workpiece 9. In this case, the robot arm 22 operates based on position control to hold the polishing tool 8 at a target position. As a result, the surface of the workpiece 9 polished by the polishing tool 8 becomes an annular region extending in the circumferential direction on the inner peripheral surface 91 of the workpiece 9.

[0052] In the example of FIG. 2, the external force that the polishing tool 8 receives from the workpiece 9 is detected by a force sensor 23. The operation of the robot arm 22 is controlled based on the force detection information output from the force sensor 23. This makes it possible to press the polishing tool 8 against the workpiece 9 with a constant load. This type of control is a type of force control, and is also called constant load control. According to the force control, the polishing tool 8 can be brought into contact with the workpiece 9 with a desired pressing force, which makes it easy to improve the polishing accuracy.

[0053] 1.6.3. Polishing tool displacement step In the polishing tool displacement step S106, the polishing tool 8 is moved relatively to the workpiece holder 3 while the polishing tool 8 is in contact with the workpiece 9.

[0054] FIG. 6 is a schematic diagram showing the polishing tool 8 as viewed from a reference point when a point outside the polishing system 1 is set as the reference point, and the contacted portion 92, which is the range of the inner peripheral surface 91 (surface to be polished) of the workpiece 9 with which the polishing tool 8 is in contact. Furthermore, FIG. 6 illustrates the polishing tool 8 and the contacted portion 92 as viewed from a reference point set in the hollow portion of the workpiece 9 shown in FIG. 2. When the workpiece 9 is rotated (the inner peripheral surface 91 of the workpiece 9 moves relative to the polishing tool 8) by the operation of the workpiece holding unit 3, the inner peripheral surface 91 (surface to be polished) is displaced accordingly. At this time, the displacement direction of the inner peripheral surface 91 as viewed from the reference point is the "first direction D1" and is represented by a dashed arrow. When the inner peripheral surface 91 is displaced in the first direction D1, the contacted portion 92 is swept along the inner peripheral surface 91. As a result, the polishing process is performed on the inner peripheral surface 91 in a ring-shaped region (polished surface) around the central axis AX shown in FIG. 2.

[0055] 6, when the polishing tool 8 is reciprocated in, for example, the Y-axis direction by the operation of the robot 2, the displacement direction of the polishing tool 8 as viewed from the reference point is designated as the "second direction D2" and is indicated by a solid arrow. When the polishing tool 8 is displaced in the second direction D2, the area swept of the polished portion 92 further expands along the central axis AX. This allows a wider area of ​​the inner circumferential surface 91 to be polished.

[0056] Furthermore, the first direction D1 and the second direction D2 may be the same direction, but are preferably different directions. This is expected to have the effect of, for example, facilitating the discharge of polishing debris adhering to the polishing tool 8. As a result, it is possible to suppress the deterioration of polishing accuracy due to polishing debris. Furthermore, by adjusting the direction and displacement of the second direction D2, it is possible to adjust the finishing accuracy, such as the direction of processing marks (polishing marks) and surface roughness. In other words, it is possible to perform work similar to that performed by a craftsman.

[0057] Although the polishing method has been described above, the steps may be performed sequentially, in a different order, or overlapping in time. Also, the polishing tool shifting step S106 may be performed as necessary, and may be omitted.

[0058] 2. First Modification of the First Embodiment Next, a polishing system according to a first modified example of the first embodiment will be described. FIG. 7 is a perspective view showing a polishing system 1 according to a first modified example of the first embodiment.

[0059] The first modified example of the first embodiment will be described below, but in the following description, the differences from the first embodiment will be mainly described, and the description of the similarities will be omitted. Note that in FIG. 7, the same reference numerals are used for the same configurations as the first embodiment.

[0060] The polishing system 1 according to the first modified example is similar to the polishing system 1 according to the first embodiment, except that the position of the force sensor 23 in the robot 2 is different.

[0061] The force sensor 23 shown in FIG. 7 is disposed between the polishing tool holding portion 24 and the tip portion 224 of the robot arm 22.

[0062] In this configuration, the external force received by the polishing tool 8 is transmitted to the force sensor 23 via the polishing tool holding part 24. For this reason, of the external forces received by the polishing tool 8, a force equivalent to a disturbance (noise) is less likely to be transmitted to the force sensor 23. In other words, the force equivalent to the disturbance can be attenuated by the polishing tool holding part 24, and a decrease in the S / N ratio (signal-to-noise ratio) associated with the disturbance in the force detection information output from the force sensor 23 can be suppressed.

[0063] 3. Second Modification of the First Embodiment Next, a polishing system according to a second modification of the first embodiment will be described. FIG. 8 is a perspective view showing a polishing system 1 according to a second modified example of the first embodiment.

[0064] The second modified example of the first embodiment will be described below, but in the following description, the differences from the first embodiment will be mainly described, and the description of the similarities will be omitted. Note that in FIG. 8, the same reference numerals are used for the same configurations as the first embodiment.

[0065] In the polishing system 1 according to the second modification, the pedestal 31 shown in Fig. 8 has a pedestal body 310 and an extending portion 312. The pedestal body 310 is a portion extending along the Y-axis. The extending portion 312 is a portion extending from the pedestal body 310 to the negative side of the X-axis. The extending portion 312 is provided with a robot fixing portion 202, and the robot 2 is fixed to the robot fixing portion 202.

[0066] 8 includes a workpiece rotating unit 32 and a robot fixing unit 202 provided on a stand 31. Such a lathe system 10 has the advantage that the workpiece holding unit 3 and the robot fixing unit 202 are integrated, making it easy to install.

[0067] The extension 312 may be fixed to the gantry body 310, but may be movable along the Y axis. For example, the gantry body 310 may have a guide rail (not shown) extending along the Y axis. The extension 312 may have a slider that is guided by the guide rail and moves smoothly in the Y axis direction. In this case, the robot 2 can move in the Y axis direction together with the slider. Therefore, when moving the polishing tool 8 in the Y axis direction, it is only necessary to operate the slider instead of operating the robot arm 22. This allows the polishing tool 8 to be moved in the Y axis direction with high positional accuracy even if the positional accuracy of the polishing tool 8 by the robot 2 is low. As a result, high polishing accuracy can be achieved over a wider range.

[0068] 4. Third Modification of the First Embodiment Next, a polishing system according to a third modified example of the first embodiment will be described. FIG. 9 is a perspective view showing a polishing system 1 according to a third modified example of the first embodiment.

[0069] The third modified example of the first embodiment will be described below, but in the following description, the differences from the first embodiment will be mainly described, and the description of the similarities will be omitted. Note that in Fig. 9, the same reference numerals are used for the same configurations as the first embodiment.

[0070] The polishing system 1 according to the third modified example is similar to that of the first embodiment, except that the robot 2 is a Cartesian robot.

[0071] The robot 2 shown in Fig. 9 is a Cartesian robot composed of an X-axis actuator 22X, a Y-axis actuator 22Y, and a Z-axis actuator 22Z. The X-axis actuator 22X is fixed to a stand 31, and moves the Y-axis actuator 22Y and the Z-axis actuator 22Z along the X-axis. The Y-axis actuator 22Y moves the Z-axis actuator 22Z along the Y-axis. The Z-axis actuator 22Z holds the polishing tool holder 24.

[0072] Each actuator is, for example, a single-axis electric actuator, a ball screw actuator, an air cylinder, etc. Such a robot 2 has the same functions as the robot 2 of the first embodiment, despite its relatively simple structure. Therefore, such a robot 2 contributes to simplifying the structure and reducing the cost of the polishing system 1. The number of actuators that the robot 2 has is not particularly limited as long as it is two or more. In each of the above-described modified examples, the same effects as those of the first embodiment can be obtained.

[0073] 5. Second embodiment Next, a polishing system according to a second embodiment will be described.

[0074] Fig. 10 is a perspective view showing a polishing system 1 according to a second embodiment of the present invention, and Fig. 11 is an enlarged view showing a part of Fig. 10.

[0075] The second embodiment will be described below, focusing on the differences from the first embodiment and omitting the description of the similarities. Note that in Fig. 10 and Fig. 11, the same reference numerals are used for the same configurations as the first embodiment.

[0076] The polishing system 1 according to the second embodiment is similar to the polishing system 1 according to the first embodiment, except that the shape of the workpiece 9, the shape of the polishing tool 8, and the configuration of the workpiece holding unit 3 are different.

[0077] 10 and 11 has a rectangular parallelepiped shape. An upper surface 93 of the workpiece 9 is the surface to be polished.

[0078] The workpiece holding unit 3 shown in Figs. 10 and 11 has a stand 31 and a workpiece linear motion unit 33. A robot fixing unit 202 is provided on the stand 31, and the robot 2 is fixed thereto. The workpiece linear motion unit 33 holds a rectangular parallelepiped workpiece 9 and moves the workpiece 9 back and forth in the X-axis direction. As a result, the surface of the workpiece 9 moves relative to the polishing tool 8. The polishing surface of the workpiece 9 becomes a band-shaped region extending in the X-axis direction. As a result, the polishing process can be performed on the flat upper surface 93.

[0079] In Fig. 11, the attitude of the robot arm 22 is controlled to bring the polishing tool 8 into contact with the upper surface 93 of the workpiece 9. The polishing tool 8 shown in Fig. 11 is a disk-shaped grindstone centered on an axis parallel to the Y axis. The polishing tool 8 shown in Fig. 11 rotates around its central axis. With such a rotating polishing tool 8, the polishing process can be performed while mitigating wear and temperature rise of the polishing tool 8, thereby improving the polishing accuracy.

[0080] Moreover, the robot arm 22 shown in FIG. 11 presses the polishing tool 8 against the negative side of the Z axis. This makes it possible to adjust the amount of polishing. Furthermore, the robot arm 22 moves the polishing tool 8 in any direction within the XY plane. This makes it possible to adjust the finishing precision, such as the direction of the processing marks (polishing marks) and the surface roughness. In other words, it is possible to have the robot perform work similar to that performed by a craftsman, and it is possible to perform polishing processing with high polishing precision and a high degree of freedom. In the second embodiment as described above, the same effects as in the first embodiment can be obtained.

[0081] 6. Advantages of the above embodiment As described above, the polishing system 1 according to the embodiment is a polishing system that performs a polishing process by bringing the polishing tool 8 into contact with the workpiece 9, and includes the robot 2 and the workpiece holding unit 3. The robot 2 holds the polishing tool 8. The workpiece holding unit 3 holds the workpiece 9 and moves the workpiece 9 relatively to the polishing tool 8.

[0082] With this configuration, a polishing system 1 that can perform polishing with high polishing accuracy and a high degree of freedom can be obtained. Furthermore, with the polishing system 1, the polishing can be performed without an operator approaching the workpiece 9. This makes the polishing safer. Furthermore, since an operator does not need to hold the polishing tool 8, the polishing can be automated and labor-saving.

[0083] In the polishing system 1 according to the embodiment, the robot 2 has a force sensor 23 (force sensor) that detects an external force applied to the polishing tool 8.

[0084] According to such a configuration, it becomes possible to control the operation of the robot arm 22 by a force control method based on the force detection information output from the force sensor 23.

[0085] In the polishing system 1 according to the embodiment, the number of detection axes of the force sensor 23 (force sensor) is two or more.

[0086] According to this configuration, the force sensor 23 can detect not only the pressing force of the polishing tool 8 against the workpiece 9, but also the frictional force of the polishing tool 8 in the in-plane direction of the surface of the workpiece 9. The pressing force is fed back to the force control of the robot arm 22 and can be used, for example, to adjust the amount of polishing by the polishing tool 8. Meanwhile, the frictional force can be used, for example, to detect the surface roughness after polishing processing, the uniformity of the surface roughness, the amount of wear and the presence or absence of abnormalities of the polishing tool 8, the presence or absence of abnormalities of the workpiece 9, etc. This can improve the polishing accuracy.

[0087] In the polishing system 1 according to the embodiment, the robot 2 includes a robot arm 22 having two or more joints. The polishing tool 8 is held by the robot arm 22.

[0088] According to such a configuration, the robot arm 22 has a high degree of freedom in the posture that it can take, so that the polishing tool 8 can be held in a desired posture at a desired position around the workpiece 9. This allows the polishing tool 8 to come into contact with each part of the surface of the workpiece 9 in an appropriate posture.

[0089] In the polishing system 1 according to the embodiment, the robot 2 is a vertical articulated robot.

[0090] According to such a configuration, the degree of freedom of the posture that the robot arm 22 can take is increased, so that the polishing tool 8 can be brought into contact with each portion of the surface of the workpiece 9 in a more appropriate posture.

[0091] In the polishing system 1 according to the embodiment, the workpiece 9 may be cylindrical. In this case, the workpiece holder 3 rotates the workpiece 9 about the central axis AX of the workpiece 9 as the rotation axis. The robot 2 holds the polishing tool 8 so that the polishing tool 8 contacts the inner peripheral surface 91 of the workpiece 9.

[0092] According to this configuration, it is possible to realize a polishing system 1 capable of polishing the inner peripheral surface 91 of a cylindrical workpiece 9.

[0093] In the polishing system 1 according to the embodiment, the workpiece holding unit 3 may move the workpiece 9 back and forth.

[0094] According to this configuration, it is possible to realize a polishing system 1 capable of performing a polishing process on a workpiece 9 having a flat upper surface 93.

[0095] In addition, in the polishing processing system 1 of the above embodiment, when the work holding unit 3 moves the work 9 relative to the polishing tool 8, the robot 2 may move the polishing tool 8 relative to the work holding unit 3 while holding the polishing tool 8.

[0096] According to such a configuration, it is possible to ensure a wide polishing surface of the workpiece 9. In other words, it is possible to perform polishing with high polishing accuracy and a high degree of freedom over a wider range.

[0097] Furthermore, in the polishing processing system 1 according to the above embodiment, when an external point is taken as a reference point and the inner surface 91 (polished surface) of the workpiece 9 in contact with the polishing tool 8 is displaced by the operation of the workpiece holding unit 3, the displacement direction of the inner surface 91 as viewed from the reference point is taken as a first direction D1, and when the polishing tool 8 in contact with the workpiece 9 is displaced by the operation of the robot 2, the displacement direction of the polishing tool 8 as viewed from the reference point is taken as a second direction D2, the first direction D1 and the second direction D2 are different from each other.

[0098] According to such a configuration, it is easy to discharge the polishing debris adhering to the polishing tool 8. As a result, it is possible to suppress the deterioration of the polishing accuracy due to the polishing debris. In addition, it is possible to adjust the finishing accuracy such as the direction of the processing marks (polishing marks) and the surface roughness.

[0099] Furthermore, the polishing method according to the above embodiment is a polishing method for performing polishing processing on a workpiece 9 using the polishing processing system 1 according to the above embodiment, in which the workpiece 9 is moved relative to the polishing tool 8 by operation of the work holding unit 3, while the polishing tool 8 is brought into contact with the workpiece 9 by operation of the robot 2, thereby performing the polishing processing.

[0100] According to such a configuration, the polishing process can be performed with high polishing accuracy and a high degree of freedom. In addition, the polishing process can be performed without the operator approaching the workpiece 9. This makes the polishing process safer. Furthermore, since the operator does not need to hold the polishing tool 8, the polishing process can be automated and labor-saving.

[0101] Moreover, the lathe system 10 according to the embodiment includes a workpiece rotating unit 32 and a robot fixing unit 202. The workpiece rotating unit 32 holds the workpiece 9 and rotates the workpiece 9. The robot fixing unit 202 is for fixing the robot 2 holding the polishing tool 8.

[0102] According to this configuration, by simply mounting the robot 2 on the robot fixing part 202, a polishing system 1 can be constructed that is capable of performing polishing with high polishing accuracy and a high degree of freedom.

[0103] Although the polishing system, the polishing method, and the lathe system according to the present invention have been described above based on the illustrated embodiments, the present invention is not limited to this.

[0104] For example, the polishing processing system and lathe system of the present invention may be configured such that each part of the above-described embodiments is replaced with any component having a similar function, or any component may be added to the above-described embodiments.

[0105] Furthermore, the polishing method according to the present invention may include any step added for any purpose to the above-described embodiment. [Explanation of symbols]

[0106] 1...polishing processing system, 2...robot, 3...workpiece holder, 7...control device, 8...polishing tool, 9...workpiece, 10...lathe system, 20...floor surface, 21...base, 22...robot arm, 22X...X-axis actuator, 22Y...Y-axis actuator, 22Z...Z-axis actuator, 23...force sensor, 24...polishing tool holder, 31...frame, 32...workpiece rotating section, 33...workpiece linear motion section, 71...robot control section, 72...force detection information acquisition section, 73...workpiece holder Control unit, 91...inner surface, 92...contacted part, 93...upper surface, 202...robot fixing part, 222...base end, 224...tip end, 242...shaft, 244...head, 310...frame body, 312...extension, 701...CPU, 702...ROM, 703...RAM, 704...external interface, 705...external bus, AX...central axis, D1...first direction, D2...second direction, S102...workpiece rotation step, S104...polishing tool contact step, S106...polishing tool displacement step

Claims

1. A polishing processing system for performing a polishing process by contacting a polishing tool with a workpiece, A robot for holding the polishing tool; a workpiece holding unit that holds the workpiece and moves the workpiece relatively to the polishing tool; A polishing system comprising:

2. The polishing processing system according to claim 1 , wherein the robot has a force sensor that detects an external force applied to the polishing tool.

3. The polishing system according to claim 2 , wherein the number of detection axes of the force sensor is two or more.

4. The robot has a robot arm having two or more joints; 4. The polishing system according to claim 1, wherein the polishing tool is held by the robot arm.

5. 4. The polishing system according to claim 1, wherein the robot is a vertical articulated robot.

6. The workpiece has a cylindrical shape, The workpiece holding unit rotates the workpiece around a central axis of the workpiece as a rotation axis, 4. The polishing system according to claim 1, wherein the robot holds the polishing tool so that the polishing tool contacts an inner circumferential surface of the workpiece.

7. 4. The polishing system according to claim 1, wherein the workpiece holder reciprocates the workpiece.

8. When the workpiece holder moves the workpiece relative to the polishing tool, 4. The polishing system according to claim 1, wherein the robot moves the polishing tool relative to the workpiece holder while holding the polishing tool.

9. An external point is used as a reference point, When the polished surface of the workpiece in contact with the polishing tool is displaced by the operation of the workpiece holding portion, a displacement direction of the polished surface as viewed from the reference point is defined as a first direction; When the polishing tool in contact with the workpiece is displaced by the operation of the robot, a displacement direction of the polishing tool as viewed from the reference point is defined as a second direction. The polishing processing system according to claim 7 , wherein the first direction and the second direction are different from each other.

10. A polishing method for performing the polishing process on the workpiece by using the polishing system according to any one of claims 1 to 3, comprising the steps of: A polishing method characterized in that the polishing process is performed by operating the robot to bring the polishing tool into contact with the workpiece while operating the work holding part to move the workpiece relative to the polishing tool.

11. A workpiece rotating unit that holds a workpiece and rotates the workpiece; a robot fixing unit for fixing a robot holding the polishing tool; A lathe system comprising:

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