Substrate processing apparatus with flow control ring and method of using the same

Abstract

To provide a substrate processing apparatus and a method for processing a substrate.SOLUTION: A substrate processing apparatus includes an upper chamber space, a lower chamber space, a susceptor, and a flow control ring assembly comprising a seal ring and a flow control ring having a shape to surround the susceptor, the flow control ring assembly sealing or substantially sealing the upper chamber space from the lower chamber space while the susceptor is in a first position.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a flow control ring assembly and a substrate processing apparatus having the flow control ring assembly, as well as methods for using the flow control ring assembly and the substrate processing apparatus, are described. [Background technology]

[0002] Substrate processing equipment, such as gas phase reactors, often includes an upper chamber space for processing the substrate and a lower chamber space for loading and unloading the substrate. During processing, if there is no substantial seal between the upper and lower chamber spaces, reactant gases may undesirably flow between the upper and lower chamber spaces. Undesirable flow of reactant gases between the chamber spaces may result in particle contamination and / or slower processing of the substrate.

[0003] In some cases, a flow control ring assembly can be used to separate the upper chamber space from the lower chamber space. However, such flow control ring assemblies may not provide the desired separation between the chambers. Thus, improved flow control ring assemblies are generally desirable. Summary of the Invention

[0004] This Summary is provided to introduce a selection of concepts in a simplified form. These concepts are described in more detail in the Detailed Description of Example Embodiments of the Disclosure below. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

[0005] The embodiments described herein provide substrate processing equipment and methods. Various embodiments of the substrate processing equipment and methods provide for reduced gas flow between an upper chamber space and a lower chamber space during substrate processing. Additional aspects are set forth in part in the description that follows, and in part will be apparent from the description, or may be learned by practice of presented embodiments of the present disclosure.

[0006] According to one or more embodiments, a substrate processing apparatus is provided. An exemplary substrate processing apparatus includes an upper chamber, a lower chamber, a susceptor, a flow control ring, and a spacer plate. The exemplary substrate processing apparatus further includes a seal ring or at least one gasket. The susceptor can be configured to hold a substrate. The susceptor can include a top surface and a ledge that protrudes from a side of the susceptor. The flow control ring can include an annular central region, a first portion disposed on the top surface, a second portion disposed on the ledge, and a third portion including a recess. The seal ring can be disposed in the recess. In other examples, the flow control ring can include one or more recesses. In some examples, one or more gaskets can be disposed in one or more recesses. In some examples, the flow control ring can include two recesses. In such cases, one gasket can be disposed in each recess. The gasket can be made of a mica-based material, such as Micatherm S0 or Micatherm S15.

[0007] According to examples of these embodiments, the substrate processing apparatus may include a susceptor motor configured to raise and lower the susceptor from at least a first position to a second position. According to additional examples, the seal ring contacts the spacer plate when the susceptor is in the first position, and the seal ring seals or substantially seals the upper chamber from the lower chamber when the susceptor is in the first position. According to other additional examples, at least one gasket contacts the spacer plate when the susceptor is in the first position, and the at least one gasket seals or substantially seals the upper chamber from the lower chamber when the susceptor is in the first position.

[0008] According to further embodiments, the seal ring is annular, the seal ring comprising a body and at least two compressible members extending from the body. According to one or more embodiments, the at least two compressible members of the seal ring extend horizontally (e.g., substantially along a plane parallel to the top surface) from the body. According to one or more embodiments, the at least two compressible members are compressible when the susceptor is in the first position.

[0009] According to yet a further embodiment, the seal ring is annular and the cross section of the seal ring is substantially U-shaped with a central portion of the U-shape and two arms extending from the central portion of the U. In some embodiments, the central portion contacts the spacer plate when the susceptor is in the first position.

[0010] According to a further embodiment, the substrate processing apparatus includes an annular recessed ring interposed between the seal ring and the flow control ring within a recess in the flow control ring, hi some embodiments, the annular recessed ring comprises metal.

[0011] By further example, the flow control ring comprises ceramic. In some embodiments, the flow control ring comprises quartz. In some embodiments, the flow control ring comprises alumina.

[0012] According to further examples, the substrate processing apparatus includes a stepped annular ring configured to contact a top surface of the flow control ring and a bottom of the recess in the flow control ring, hi some embodiments, the stepped annular ring is or includes metal.

[0013] According to yet a further embodiment, the substrate processing apparatus includes a controller coupled to a susceptor motor. The susceptor motor may include a measurement device configured to measure a load on the susceptor motor. In such a case, the controller may be configured to adjust the torque on the susceptor motor based on the load measured when the susceptor is in the first position.

[0014] According to yet a further embodiment, a flow control ring assembly is provided. An exemplary flow control ring assembly includes a flow control ring and a seal ring. The flow control ring may include an annular central region and an upper portion including a recess. The annular central region may include a stepped structure including a first flat ledge portion and a second flat ledge portion and a vertical wall extending therebetween. The second flat ledge portion may extend further toward the center of the flow control ring than the first flat ledge portion. The seal ring may be disposed within the recess.

[0015] According to still further embodiments, the flow control ring assembly may include an annular recess ring interposed between the seal ring and the flow control ring in the recess. According to embodiments, the seal ring is annular. The seal ring may include a body and at least two compressible members extending from the body. In some embodiments, the seal ring has a substantially U-shaped cross section having a central portion and two arms extending from the U-shaped central portion. According to one or more embodiments, the flow control ring assembly includes a stepped annular ring. The stepped annular ring may be configured to contact a top surface of the flow control ring and a bottom of the recess in the flow control ring.

[0016] According to one or more embodiments, a method of substantially sealing an upper chamber from a lower chamber is provided. An exemplary method includes providing a substrate processing apparatus, activating a susceptor motor to move a susceptor from a lower position to an upper position, contacting a seal ring with a spacer plate, and substantially sealing the upper chamber from the lower chamber. The substrate processing apparatus may include an upper chamber, a lower chamber, a susceptor, a susceptor motor, a flow control ring, a spacer plate, and a seal ring. The susceptor may be configured to hold a substrate. The susceptor may include a top surface and a ledge that protrudes from a side of the susceptor. The flow control ring may include an annular central region, a first portion disposed on the top surface, a second portion disposed on the ledge, and a third portion that includes a recess. The seal ring may be disposed within the recess. Contacting the seal ring with the spacer plate may thereby deform the seal ring. [Brief description of the drawings]

[0017] [Figure 1] FIG. 1 illustrates a cross-sectional view of a substrate processing apparatus in accordance with one or more embodiments of the present disclosure. [Diagram 2] FIG. 2 illustrates a cross-sectional view of the substrate processing apparatus of FIG. 1 in accordance with one or more embodiments of the present disclosure. [Diagram 3] FIG. 3 illustrates a top view of an embodiment of a susceptor and flow control ring in accordance with one or more embodiments of the present disclosure. [Figure 4] FIG. 4 is an enlarged partial cross-sectional view of an embodiment of a flow control ring according to an embodiment of the present disclosure. [Diagram 5] FIG. 5 is an enlarged partial cross-sectional view of a flow control ring assembly according to an embodiment of the present disclosure. [Figure 6] FIG. 6 is an enlarged partial cross-sectional view of a flow control ring assembly according to an embodiment of the present disclosure. [Figure 7] FIG. 7 is an enlarged partial cross-sectional view of a flow control ring assembly according to an embodiment of the present disclosure. [Figure 8]FIG. 8 is a partial cross-sectional view of a flow control ring assembly according to an additional embodiment of the present disclosure. [Figure 9] FIG. 9 is a partial cross-sectional view of a flow control ring assembly according to an additional embodiment of the present disclosure. [Figure 10] FIG. 10 illustrates a method according to one or more embodiments of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] It will be understood that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help improve understanding of the illustrated embodiments of the present disclosure.

[0019] Reference will now be made in detail to the embodiments illustrated in the accompanying drawings, wherein numerals refer to like elements throughout. In this regard, the embodiments may have different forms and should not be construed as limited to the description set forth herein. Accordingly, exemplary embodiments are described below by reference to the figures to illustrate aspects of the present specification.

[0020] As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. When preceding a list of elements, phrases such as "at least one" modify the entire list of elements, not individual elements of the list.

[0021] The terms used herein are for the purpose of describing particular embodiments and are not intended to limit the disclosure. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms unless the context clearly indicates otherwise. It will be further understood that the terms "comprises", "comprises", "including" and / or "comprising" as used herein specify the presence of stated features, integers, steps, operations, members, components and / or groups thereof, but do not exclude the presence or addition of one or more other features, integers, steps, operations, members, components and / or groups thereof.

[0022] 1 and 2 are cross-sectional views of a substrate processing apparatus 10 in accordance with at least one embodiment. In an exemplary embodiment, the substrate processing apparatus 10 is configured as a film deposition apparatus capable of performing cyclical deposition cycles, such as chemical vapor deposition, to deposit material on a substrate. In some embodiments, the substrate processing apparatus 10 may be configured to perform a thermal chemical vapor deposition process. In some embodiments, the substrate processing apparatus 10 may be configured to perform a plasma enhanced chemical vapor deposition process.

[0023] In some embodiments, the substrate processing equipment 10 may be configured to process substrates at temperatures greater than 600° C. In some embodiments, the substrate processing equipment 06 may be configured to process substrates at temperatures greater than 900° C.

[0024] In the illustrated embodiment, the substrate processing apparatus 10 includes an upper chamber 12, a lower chamber 14, and at least one chamber wall 11. The substrate processing apparatus 10 may include a spacer plate 28 between the upper chamber 12 and the lower chamber 14. In some embodiments, the spacer plate 28 is attached to the chamber wall 11. In some embodiments, the spacer plate 28 is an integral part of the chamber wall 11. A gas distribution apparatus, such as a showerhead 16, may be provided within the upper chamber 12. The showerhead 16 may be provided with a plurality of holes 16a through which gas may pass into the upper chamber 12.

[0025] In the exemplary substrate processing apparatus 10, a susceptor 18 is provided facing the showerhead 16. The susceptor 18 includes a top surface 18a configured to receive and support a substrate. In some embodiments, the susceptor 18 has a generally cylindrical shape. In some embodiments, the susceptor 18 further includes a ledge 18b protruding from a side of the susceptor 18. The ledge 18b may include a flat top surface 18c. The susceptor 18 may be made of a ceramic material, such as aluminum nitride (AlN). In some embodiments, the showerhead 16 and the susceptor 18 may be electrodes to form a parallel plate structure in which a plasma can be formed.

[0026] In the substrate processing apparatus 10, a flow control ring assembly 13 is provided. The flow control ring assembly 13 may separate the upper chamber 12 from the lower chamber 14. The flow control ring assembly 13 may laterally surround the susceptor 18 and be disposed on a top surface 18a of the susceptor 18. In the illustrated embodiment, the flow control ring assembly 13 includes a flow control ring 20 and a seal ring 22.

[0027] In one embodiment, the flow control ring 20 has an annular central region having a first portion 20a disposed on the top surface 18a of the susceptor 18. The annular central region of the flow control ring 20 provides space for a substrate to be disposed on the top surface 18a of the susceptor 18. In some embodiments, the flow control ring 20 has an annular central region second portion 20b disposed on the ledge 18b of the susceptor 18. In some embodiments, the top surface of the flow control ring 20 can include a recess 24. The recess 24 can be positioned below a spacer plate 28.

[0028] As shown in FIG. 1 and FIG. 2, the flow control ring 20 includes an outer diameter (OD), a first inner diameter (ID1), a second inner diameter (ID2), and a third inner diameter (ID3), where ID1 is smaller than ID2, and ID2 is smaller than ID3. As an example, ID1 can be about 300 mm to about 310 mm. As an example, ID2 can be about 320 mm to about 330 mm. As an example, ID3 can be about 330 mm to about 340 mm. Referring to FIG. 5, the height (H1) of the first portion 20a can be about 2 mm to about 5 mm. The height (H2) of the second portion 20b can be about 10 mm to about 15 mm. The height (H3) of the third portion 20c can be about 1 mm to about 5 mm.

[0029] First portion 20a of the flow control ring can have an upper surface 20d. The flow control ring can include a fourth portion 20e having an upper surface 20f. Upper surface 20f of fourth portion 20e can be at a lower height (H4) from upper surface 20d. Height (H4) can be between about 3 mm and about 7 mm.

[0030] The recess 24 may be formed on the upper surface 20e of the flow control ring 20. The recess 24 may be radially outward of the first portion 20a, and the depth (D) of the second portion 20b of the recess 24 may be from about 5 mm to about 10 mm. The recess may be substantially annular in shape.

[0031] The flow control ring 20 can be made of a material that can withstand the forces and processing temperatures applied to the flow control ring 20. In some embodiments, the flow control ring 20 comprises a ceramic material. In some embodiments, the flow control ring 20 comprises quartz. In other embodiments, the flow control ring 20 may comprise alumina.

[0032] 3 is a plan view showing an example of a susceptor 18 and a flow control ring 20. The flow control ring 20 surrounds and is disposed on the upper surface 18a of the susceptor 18. The flow control ring 20 is not centered on the upper surface 18a of the susceptor 18 to allow the susceptor 18 to hold a substrate. The upper surface 20d of the flow control ring is radially inward relative to the upper surface 20f of the flow control ring. A recess 24 may be disposed in the upper surface 20f of the control ring.

[0033] 4 is an enlarged partial cross-sectional view showing an example of a flow control ring 20. In some embodiments, the top surface 20d of the flow control ring 20 may include a sloped surface 20g. The sloped surface 20g may increase the thickness of the first portion 20a from the inner radius of the flow control ring 20 toward the outer radius of the flow control ring 20. The sloped surface 20g may slope upward from the inner radius of the flow control ring 20 toward the outer radius of the flow control ring 20. The sloped surface 20g may help direct flow into the chamber. The sloped surface may help direct exhaust gases from the chamber to an exhaust outlet.

[0034] 1 and 2, a seal ring 22 may be disposed within the recess 24. The seal ring 22 may comprise any material suitable for forming a seal, such as a material that can be compressed and withstand high forces. The seal ring 22 may be made of a material that can deform when compressed. The seal ring 22 may be made of, for example, INCONEL® X-750 manufactured by Ulbrich Stainless Steels & Special Metals, Inc.

[0035] In some embodiments, an annular recessed ring 26 may be disposed within the recess 24 below the seal ring 22. The recessed ring 26 may have substantially the same annular shape as the annular recess 24. For example, as shown in FIG. 4, the height (H5) of the recessed ring 26 may be between 1 mm and 5 mm. The recessed ring 26 may be made of any material suitable for withstanding the temperatures and forces of the substrate processing device 10. In some embodiments, the recessed ring 26 may be made of metals and metal alloys such as titanium, Hastelloy C-22, Hastelloy C-276, etc. In some embodiments, the recessed ring 26 may be made of ceramics such as alumina and aluminum nitride (AlN).

[0036] In the exemplary substrate processing apparatus 10, the susceptor 18 may be configured to move vertically. The susceptor 18 may be supported by a sliding shaft 30. The susceptor 18 and flow control ring assembly may be raised and lowered by a susceptor motor 32.

[0037] In some embodiments, the susceptor 18 may be moved to at least two positions by the susceptor motor 32. FIG. 1 illustrates the susceptor in a first position. In the first position, the seal ring 22 contacts the spacer plate 28. In the first position, the seal ring 22 may be deformed by a force of the spacer plate 28 provided by the susceptor motor 32. In the first position, the upper chamber 12 may be sealed or substantially sealed from the lower chamber 14. In some embodiments, the substrate processing apparatus 10 may process a substrate when the substrate is in the first position.

[0038] In the first position, there is a downward force from the spacer plate 28 to the seal ring 22. In some embodiments, the recessed ring 26 receives the downward force of the seal ring 22 and distributes the force (e.g., evenly) to the flow control ring 10. In some embodiments, the force from the seal ring 22 is received by the flow control ring 20. The force on the flow control ring 20 is then transferred to the susceptor 18. The flow control ring 20 distributes the downward force onto the susceptor 18. In some embodiments, the downward force from the flow control ring 20 may be substantially evenly distributed to the susceptor 18, for example, around the periphery of the top surface 18a. In some embodiments, the downward force from the flow control ring 20 may be substantially evenly distributed to the susceptor 18, for example, by the top surface 18a and the peripheral region 18d of the ledge 18b.

[0039] 2 shows the substrate processing apparatus 10 with the susceptor 18 in a second position. In the second position, the susceptor 18 is lowered so that the seal ring 22 does not contact the spacer plate 18. In the second position, the upper chamber 12 is not sealed from the lower chamber 14. In FIG. 2, the upper chamber 12 and the lower chamber 14 are fluidly connected to one another.

[0040] 1 and 2, in some embodiments, the susceptor motor 32 may include a load sensor 35 for measuring the load on the susceptor motor 32. When the seal ring 22 contacts the spacer plate 28, the seal ring 22 deforms and the flow control assembly 13 exerts a downward force on the susceptor 18, which places a load on the susceptor motor 32 that is measured by the load sensor 35. The susceptor motor 32 may increase its power so that the seal ring further deforms and the load on the susceptor motor 32 increases. In some embodiments, the susceptor motor may also sense the height of the susceptor 18 using a height sensor 36. In some embodiments, the height sensor 36 or another sensor is used to measure the height of the susceptor 18, e.g., the height (H6) relative to the spacer plate 28.

[0041] In some embodiments, the controller 34 is connected to the susceptor motor 32. In some embodiments, the controller 34 is connected to a separate height sensor 38 to measure the height of the susceptor 18. In other embodiments, the controller 34 is connected to a height sensor 36 to measure the height of the susceptor 18. The controller 34 includes electronic circuitry and software for selectively operating the susceptor motor 32. The controller 34 may include software or hardware components, such as modules, such as FPGAs or ASICs, that perform specific tasks. The modules may be advantageously configured to reside on an addressable storage medium of the controller 34 and may be configured to perform one or more processes.

[0042] The controller 34 may be configured to control the position of the susceptor 32 by controlling the output of the susceptor motor 32. In some embodiments, the controller 34 is configured to move the susceptor 18 between a first position and a second position. In some embodiments, the controller 34 may be configured to move the susceptor 18 to another position. In some embodiments, the controller 34 may be configured to move the susceptor 28 to a predetermined height. In some embodiments, the controller 34 may be configured to control the susceptor motor 32 to move the susceptor 18 to the first position by moving the susceptor 18 upward until the seal ring 22 contacts the spacer plate 28 and exerts a sufficient force on the seal ring 22 such that the predetermined load setpoint is measured on the sensor. The predetermined load setpoint may indicate that there is sufficient downward force on the seal ring 22 such that the upper chamber 12 is sealed or substantially sealed from the lower chamber 14.

[0043] In some embodiments, while in the first position, the controller 34 is configured to maintain sufficient power of the susceptor motor 32 to maintain sufficient force between the seal ring 22 and the spacer plate 28 such that the upper chamber 12 is sealed or substantially sealed from the lower chamber 14 during substrate processing.

[0044] In some embodiments, the controller 34 may be configured to adjust the output of the susceptor motor 32 using a feedback loop from the load on the susceptor motor 32 and / or the height of the susceptor 18. In one embodiment, the compression of the seal ring 22 may be such that the amount of compression of the seal ring 22 is proportional to the force on the seal ring 22 and the spring constant of the seal ring 22. The spring constant of the seal ring 22 may change over time due to fatigue or other changes in the seal ring 22. Based on the measured load on the susceptor motor 32 and the measured height of the susceptor 18, the controller 34 may adjust the output of the susceptor motor 32 to maintain sufficient force on the seal ring 22 such that the upper chamber 12 maintains a seal or substantial seal from the lower chamber 14 in real time.

[0045] FIGURE 5 is an enlarged, partial cross-sectional view of one embodiment of a flow control ring assembly 500 in accordance with one or more embodiments of the present disclosure. FIGURE 5 illustrates the susceptor 18, the flow control ring 20, and other components of the substrate processing apparatus 10. The susceptor 18 includes a top surface 18a configured to receive and support a substrate. The susceptor 18 further includes a ledge 18b that protrudes from a side of the susceptor 16. The ledge may include a flat top surface 18c. The flow control ring 20 may be as described above.

[0046] In some embodiments, the seal ring 122 may include a body 122a and at least two compressible members 122b extending from the body 122. The seal ring 122 may be disposed within the recess 24 such that the at least two compressible members 122b extend horizontally. The at least two compressible members 122b are compressed when the susceptor 18 is in the first position.

[0047] 6 is an enlarged partial cross-sectional view of another embodiment of a flow control ring assembly 600 suitable for use as the flow control ring assembly 13. FIG. 6 illustrates another embodiment of a seal ring 222 suitable for use as the seal ring 22. The seal ring 222 may be substantially U-shaped having a U-shaped central portion 222a and two arms 222b extending from the U-shaped central portion 222a. As shown, the middle portion may contact the spacer plate 28 when the susceptor 18 is in the first position. When the susceptor 18 is in the first position, the central portion of the seal ring 222 contacts the spacer plate 28, causing the two arms to deform and press against the side wall 24a of the recess 24.

[0048] In the embodiment shown in FIG. 6, the seal ring 222 does not have any deep or narrow spaces between the arms 222b. When the seal ring 222 is compressed and relaxed as the susceptor 18 moves in and out of the first position, any buildup on the seal ring 222 may flake off and generate particles. The seal ring 222 can be easily cleaned using in-situ processing. The seal ring 222 is shaped so that there are no deep grooves or contours that cannot be reached by in-situ processing. In this way, the seal ring 222 generates less particles.

[0049] FIG. 7 is an enlarged partial cross-sectional view of yet another embodiment of a flow control ring assembly 700 suitable for use as the flow control ring assembly 13. FIG. 7 shows yet another embodiment of a seal ring 322 suitable for use as the seal ring 22. The seal ring 322 may be substantially U-shaped with a middle portion 322a and two arms 322b extending from the U-shaped central portion 322a, and a member 322c extending from the end of each arm 322b. As shown, the central portion 322a contacts the spacer plate 28 when the susceptor 18 is in the first position. When the susceptor 18 is in the first position, the central portion 322a of the seal ring 322 contacts the spacer plate 28, deforming the two arms 322b and forcing them against the side wall 24a of the recess 24. The member 322c is further pressed into the bottom of the recess 24 or into the recess ring 26. Additionally, when the seal ring 322 is compressed, it deforms, creating a larger volume for the recess 24, reducing the need for in-situ cleaning.

[0050] In the embodiment shown in FIG. 7, the seal ring 322 does not have any deep or narrow spaces between the arms 322b. When the seal ring 322 is compressed and relaxed as the susceptor 18 moves in and out of the first position, any deposits on the seal ring 322 may flake off and generate particles. The seal ring 322 can be easily cleaned using in-situ processing. The seal ring 322 is shaped so that there are no deep grooves or contours that cannot be reached by in-situ processing. In this way, the seal ring 322 generates less particles.

[0051] 8 is a partial cross-sectional view of a flow control ring assembly 800 suitable for use as the flow control ring assembly 13 according to additional embodiments of the present disclosure. In some embodiments, the flow control ring assembly 800 includes a stepped annular ring 36. The stepped annular ring 36 may be disposed on an upper surface of the flow control ring 20 and on a bottom of the recess 24 of the flow control ring 20. The stepped annular ring 36 may distribute the downward force from the seal ring 22 and / or the recess ring 26 across a larger surface of the flow control ring 20.

[0052] The stepped annular ring 36 may be made of any suitable material. In some embodiments, the stepped annular ring 36 includes metals and alloys such as titanium, Hastelloy C-22, and Hastelloy C-276. As shown in FIG. 8 , the stepped annular ring may include a first portion 36a, a second portion 36b, and a third portion 36c. The first portion 36a may be disposed within the flow control ring recess 24. The second portion 36b may be disposed on the top surface 20f of the flow control ring 20. The third portion 36c may be disposed on the top surface 20d of the flow control ring 20.

[0053] 9 is a partial cross-sectional view of a flow control ring assembly 900 suitable for use as the flow control ring assembly 13 according to additional embodiments of the present disclosure. In some embodiments, the flow control ring assembly 900 includes a flow control ring 20, a spacer plate 28, and at least one gasket 29 in contact with the flow control ring 20 and the spacer plate 28. In some embodiments, the flow control ring can include two recesses (24b, 24c). In some embodiments, the spacer plate 28 can include protrusions 28a and 28b. A gasket 29a can be disposed in one recess 24b and another gasket 29b can be disposed in the other recess 29c. Each gasket 29a, 29b can be made of a mica-based material, such as Micatherm S0 or Micatherm S15 manufactured by Planichem SRL.

[0054] FIG. 10 illustrates a method of one or more embodiments of the present disclosure. Method 1000 can be used to seal or substantially seal an upper chamber from a lower chamber. Substrates may be processed in the upper chamber, which may desirably be sealed or substantially sealed from the lower chamber. Without a substantial seal, process gases may leak between the upper and lower chambers, potentially causing contamination or particles. Method 1000 includes providing a substrate processing device (step 1010), activating a susceptor motor to move a susceptor from a lower position to an upper position (step 1020), creating or forming a seal or substantial seal between a seal ring and a spacer plate (step 1030), and adjusting the power of the susceptor motor to maintain a seal or substantial seal ring to the spacer plate (step 1040).

[0055] The step 1010 of providing a substrate processing device includes providing a substrate processing device including an upper chamber, a lower chamber, a susceptor configured to hold a substrate and including a top surface and a ledge protruding from a side of the susceptor, a susceptor motor, a flow control ring including an annular central region, a first portion disposed on the top surface, a second portion disposed on the ledge, and a third portion forming a recess, a spacer plate, and a seal ring disposed within the recess. The flow control ring and the spacer plate may be disposed between the upper chamber and the lower chamber. The susceptor motor may be configured to move the susceptor, the flow control ring, and the seal ring vertically. The susceptor motor may be connected to a controller. The susceptor motor may include a sensor for measuring the load on the motor. The susceptor motor may include a height sensor for measuring the position of the susceptor. A separate height sensor may be used to measure the susceptor height as disclosed above.

[0056] The processing apparatus may be configured such that the susceptor has at least a lower position, in which the seal ring does not contact the spacer plate, and an upper position, in which the seal ring contacts the spacer plate.

[0057] Step 1020 includes actuating a susceptor motor, which may move the susceptor (and the flow control ring assembly) from a lower position to an upper position.

[0058] Step 1030 includes forming a seal or substantial seal between the seal ring and the spacer plate. After the seal ring contacts the spacer plate, the power of the susceptor motor may be increased to increase the force between the seal ring and the spacer plate. The seal ring may deform to form a seal or substantial seal between the seal ring and the flow control ring.

[0059] In some embodiments, the method 1000 includes a step 1040 of maintaining a seal or a substantial seal between the seal ring and the spacer plate. For example, during substrate processing, the controller may adjust the output of the susceptor motor using a feedback loop from the load on the susceptor motor and the susceptor height. In one example, the compression of the seal ring may be such that the amount of compression of the seal ring is proportional to the force on the seal ring and the spring constant of the seal ring. The spring constant of the seal ring may change over time due to fatigue or other changes in the seal ring. Based on the measured load on the susceptor motor and the measured susceptor height, the controller may adjust the output of the susceptor motor, for example, using closed loop control, to maintain sufficient force on the seal ring so that the upper chamber maintains a seal or a substantial seal from the lower chamber in real time. In some cases, an indication may be provided to a user or a user interface if the spring constant is determined to be above or below a threshold (e.g., from the force on the susceptor motor and the measured height of the susceptor).

[0060] The exemplary embodiments of the present disclosure described above are merely examples of embodiments of the present invention, as defined by the appended claims and their legal equivalents, and therefore do not limit the scope of the present invention. Any equivalent embodiments are intended to be within the scope of the present invention. Indeed, various modifications of the present disclosure, in addition to those shown and described herein, such as alternative useful combinations of the described elements, may become apparent to those skilled in the art from the description. Such modifications and embodiments are also intended to be included within the scope of the appended claims. [Explanation of symbols]

[0061] 10. Substrate Processing Equipment 11 Chamber Wall 12 Upper chamber 13 Flow Control Ring Assembly 14 Lower Chamber 16. Shower Head 16a hole 18 Susceptor 18a Top side 18b Ledge 18c top surface 18d Surrounding Area 20 Flow Control Ring 20a First Part 20b Second Part 20c Third Part 20d top surface 20e Fourth Part 20f top surface 20g inclined surface 22 Seal ring 24 Annular recess 24a side wall 24b Recess 24c Recess 26 Annular recessed ring 28 Spacer plate 28a Protrusion 28b Projection 29 Gasket 29a Gasket 29b Gasket 29c Recess 30 Sliding shaft 32 Susceptor motor 34 Controller 35 Load Sensor 36 Stepped Annular Ring 36a First Part 36b Second Part 36c Third Part 38 Sensors 122 Seal ring 122a Main unit 122b Parts 222 Seal Ring 222a central part 222b Arm 322 Seal ring 322a central part 322b Arm 322c Parts 500 Flow Control Ring Assembly 600 Flow Control Ring Assembly 700 Flow Control Ring Assembly 800 Flow Control Ring Assembly 900 Flow Control Ring Assembly

Claims

1. A substrate processing device, comprising: An upper chamber; A lower chamber; a susceptor configured to hold a substrate, the susceptor comprising a top surface and a ledge protruding from a side of the susceptor; a flow control ring comprising an annular central region, a first portion disposed on the upper surface, a second portion disposed on the ledge, and a third portion comprising a recess; A spacer plate; A seal ring, The substrate processing apparatus, wherein the seal ring is disposed within the recess.

2. The substrate processing apparatus of claim 1 , further comprising a susceptor motor configured to raise and lower the susceptor from at least a first position to a second position.

3. 3. The substrate processing apparatus of claim 2, wherein the seal ring contacts the spacer plate when the susceptor is in the first position, and the seal ring substantially seals the upper chamber from the lower chamber when the susceptor is in the first position.

4. The substrate processing device of claim 2 , wherein the sealing ring is annular, the sealing ring comprising a body and at least two compressible members extending from the body.

5. The substrate processing apparatus of claim 4 , wherein the at least two compressible members extend horizontally, and wherein the at least two compressible members are compressed when the susceptor is in the first position.

6. 3. The substrate processing apparatus of claim 2, wherein the seal ring is annular, a cross section of the seal ring is substantially U-shaped, the U-shape having a central portion and two arms extending from the central portion of the U-shape, the central portion contacting the spacer plate when the susceptor is in the first position.

7. The substrate processing apparatus of claim 1 , further comprising an annular recessed ring interposed between the seal ring and the flow control ring within the recess of the flow control ring.

8. The substrate processing apparatus of claim 7 , wherein the annular recessed ring comprises metal.

9. The substrate processing apparatus of claim 1 , wherein the flow control ring comprises a ceramic.

10. The substrate processing apparatus of claim 9 , wherein the flow control ring comprises quartz.

11. The substrate processing apparatus of claim 9 , wherein the flow control ring comprises alumina.

12. The substrate processing apparatus of claim 1 , further comprising a stepped annular ring configured to contact the top surface of the flow control ring and a bottom of the recess in the flow control ring.

13. The substrate processing apparatus of claim 12 , wherein the stepped annular ring comprises metal.

14. a controller connected to the susceptor motor; the susceptor motor comprises a measurement device configured to measure a load on the susceptor motor; The substrate processing apparatus of claim 1 , wherein the controller is configured to adjust torque on the susceptor motor based on the load measured when the susceptor is in the first position.

15. 1. A flow control ring assembly comprising: a flow control ring comprising an annular central region and an upper portion including a recess, the annular central region comprising a stepped structure including a first planar ledge portion and a second planar ledge portion with a vertical wall extending therebetween, the second planar ledge portion extending further toward a center of the flow control ring than the first planar ledge portion; a seal ring disposed within the recess.

16. The flow control ring assembly of claim 15 further comprising an annular recessed ring interposed between the seal ring and the flow control ring within the recess.

17. 16. The flow control ring assembly of claim 15, wherein the sealing ring is annular, the sealing ring comprising a body and at least two compressible members extending from the body.

18. 16. The flow control ring assembly of claim 15, wherein the sealing ring is annular, the cross section of the sealing ring is substantially U-shaped, the U-shape having a middle portion and two arms extending from the middle portion of the U-shape.

19. 16. The flow control ring assembly of claim 15, further comprising a stepped annular ring configured to contact a top surface of the flow control ring and a bottom of the recess in the flow control ring.

20. 1. A method for substantially sealing an upper chamber from a lower chamber, the method comprising: To provide a substrate treatment apparatus, comprising: An upper chamber; A lower chamber; a susceptor configured to hold a substrate, the susceptor comprising a top surface and a ledge protruding from a side of the susceptor; A susceptor motor; a flow control ring having an annular central region, a first portion disposed on the upper surface, a second portion disposed on the ledge, and a third portion having a recess; A spacer plate; providing an apparatus for processing substrates comprising: a seal ring, the seal ring being disposed within the recess; activating the susceptor motor to move the susceptor from a lower position to an upper position; and contacting the seal ring with the spacer plate, thereby deforming the seal ring and substantially sealing the upper chamber from the lower chamber.

Images