Method and apparatus for manufacturing photocatalyst module

Abstract

To provide a method for manufacturing a photocatalyst module capable of inhibiting uneven application of the photocatalyst to a substrate.SOLUTION: According to an embodiment of the method for manufacturing a photocatalyst module, a photocatalyst is applied to a substrate having a plurality of through-holes, each penetrating between a pair of major surfaces. In the manufacturing method, a gas is introduced from the side facing one of the paired major surfaces of the substrate to which the photocatalyst is applied, and the introduced gas is passed through the plurality of through-holes in the substrate.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] An embodiment of the present invention relates to a method and an apparatus for manufacturing a photocatalyst module. [Background technology]

[0002] Photocatalyst modules are used to treat air, such as by sterilizing and deodorizing it. In air treatment using a photocatalyst module, light such as ultraviolet light or visible light is irradiated onto the photocatalyst module while air is flowing through the module. This causes products such as active oxygen and OH radicals to be produced in the photocatalyst module, and the air flowing through the photocatalyst module is sterilized, deodorized, etc., using the products produced by the photocatalyst module.

[0003] In the manufacture of a photocatalyst module used for air treatment as described above, a plurality of through holes are formed in a substrate having a pair of main surfaces, each of which passes between the pair of main surfaces. In air treatment using a photocatalyst, air flowing through the photocatalyst module passes through one of the plurality of through holes. In the manufacture of a photocatalyst module, a photocatalyst is applied to the substrate in which the plurality of through holes are formed. The substrate to which the photocatalyst has been applied is then fired, or the like, to form the photocatalyst module.

[0004] When manufacturing a photocatalyst module as described above, it is required to suppress the occurrence of uneven coating of the photocatalyst on the substrate. In other words, it is required to make the coating degree of the photocatalyst uniform on the substrate. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent No. 6144311 Summary of the Invention [Problem to be solved by the invention]

[0006] The problem to be solved by the present invention is to provide a manufacturing method and manufacturing apparatus for a photocatalyst module that can suppress the occurrence of uneven coating of a photocatalyst on a substrate. [Means for solving the problem]

[0007] According to the embodiment of the method for manufacturing a photocatalyst module, a photocatalyst is applied to a substrate having a plurality of through holes penetrating between a pair of main surfaces. In the manufacturing method, gas is made to flow into the substrate coated with the photocatalyst from the side facing one of the pair of main surfaces, and the gas that has flowed in through the substrate is made to flow through the plurality of through holes. Effect of the Invention

[0008] According to the present invention, it is possible to provide a manufacturing method and manufacturing apparatus for a photocatalyst module that can suppress the occurrence of uneven coating of the photocatalyst on a substrate. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a perspective view showing an example of a photocatalyst module manufactured in an embodiment. [Diagram 2] FIG. 2 is a block diagram illustrating an example of a manufacturing apparatus for manufacturing a photocatalyst module in the embodiment. [Diagram 3] FIG. 3 is a perspective view showing an example of a state in which a process is being performed by an airflow forming unit in the manufacture of a photocatalyst module in the embodiment. [Figure 4] FIG. 4 is a flow chart that outlines an example of a process in the manufacturing process of a photocatalyst module in the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] In the manufacturing method of the photocatalyst module (1) of the embodiment, a photocatalyst is applied to a base material (2) having a plurality of through holes (7) each penetrating between a pair of main surfaces (5, 6). In the manufacturing method, gas is made to flow into the base material (2) coated with the photocatalyst from the side facing one of the pair of main surfaces (5, 6), and the gas that has flowed into the base material (2) is made to flow through the plurality of through holes (7). This suppresses the occurrence of uneven application of the photocatalyst on the base material (2), and makes the degree of application of the photocatalyst uniform.

[0011] In the manufacturing method of the photocatalyst module (1) of the embodiment, the base material (2) is revolved around the rotation axis (P) to allow air, which is a gas, to flow into the base material (2) coated with the photocatalyst, and the air flows through the multiple through holes (7). When the base material (2) is revolving, air flows into the revolving base material (2) in the direction of rotation of the base material (2) during the revolution and from the inner peripheral side. Therefore, air flows appropriately through the multiple through holes (7) in the base material (2).

[0012] In the manufacturing method of the photocatalyst module (1) of the embodiment, the base material (2) coated with the photocatalyst is revolved around the rotation axis (P) in a position where one of the pair of main surfaces (5, 6) faces the direction of rotation during the revolution. This makes it easier for air that flows into the base material (2) from the direction of rotation of the base material (2) during the revolution to pass through the multiple through holes (7) while the base material (2) is revolving.

[0013] In the manufacturing method of the photocatalyst module (1) of the embodiment, the base material (2) coated with the photocatalyst is revolved around the rotation axis (P) at any speed in the range of 500 rpm or more and 2000 rpm or less. By setting the speed of rotation of the base material (2) to a certain level, a part of the attached photocatalyst is appropriately removed from the portion where the photocatalyst is excessively attached, and the liquid film blocking the through hole (7) is also appropriately removed. In addition, by suppressing the speed of rotation of the base material (2) within a range that does not exceed a reference level, excessive removal of the photocatalyst from the base material (2) is appropriately suppressed.

[0014] The manufacturing device (10) for the photocatalyst module (1) of the embodiment includes a photocatalyst application unit (11) and an airflow forming unit (12). The photocatalyst application unit (11) applies a photocatalyst to a substrate (2) having a plurality of through holes (7) penetrating between a pair of main surfaces. The airflow forming unit (12) causes gas to flow into the substrate (2) coated with the photocatalyst from the side facing one of the pair of main surfaces (5, 6), and causes the gas that has flowed in the substrate (2) to flow through the plurality of through holes (7). This suppresses the occurrence of uneven application of the photocatalyst on the substrate (2), and makes the degree of application of the photocatalyst uniform.

[0015] Hereinafter, embodiments will be described with reference to the drawings.

[0016] First, the photocatalyst module manufactured in the embodiment will be described. FIG. 1 shows an example of a photocatalyst module 1 manufactured in the embodiment in a perspective view. As shown in FIG. 1, the photocatalyst module 1 such as a photocatalyst filter includes a substrate (base material) 2. The substrate 2 is formed from, for example, ceramics, metal, glass, plastic, or resin material. Examples of ceramics that are materials for forming the substrate 2 include aluminum oxide and aluminum nitride, and examples of metals that are materials for forming the substrate 2 include stainless steel and nickel. The photocatalyst module 1 also includes a photocatalyst (not shown), which is supported on the surface of the substrate 2. The photocatalyst supported on the substrate 2 is formed from, for example, a metal oxide such as titanium oxide and tungsten oxide.

[0017] In the photocatalyst module 1 and the substrate 2, a depth direction (direction indicated by arrow X), a lateral direction (direction indicated by arrow Y) intersecting (perpendicular or nearly perpendicular) with respect to the depth direction, and a thickness direction (direction indicated by arrow Z) intersecting (perpendicular or nearly perpendicular) with respect to both the depth direction and the lateral direction are defined. In each of the photocatalyst module 1 and the substrate 2, the dimension along the thickness direction is smaller than the dimension along the depth direction and the dimension along the lateral direction.

[0018] The substrate 2 has a pair of main surfaces 5, 6. The main surface (first main surface) 5 faces one side in the thickness direction, and the main surface 5 forms an end surface of the substrate 2 on one side in the thickness direction. The main surface (second main surface) 6 faces the opposite side to the main surface 5 in the thickness direction, and the main surface 6 forms an end surface of the substrate 2 on the opposite side to the main surface 5 in the thickness direction. Therefore, in the substrate 2, the pair of main surfaces 5, 6 face opposite sides to each other in the thickness direction.

[0019] Further, a plurality of through holes 7 are formed in the base material 2. Each of the plurality of through holes 7 penetrates between the pair of main surfaces 5, 6, and penetrates the base material 2 along the thickness direction. Each of the through holes 7 opens on one side in the thickness direction in the main surface 5, and opens on the side toward which the main surface 5 faces. Each of the through holes 7 opens on the main surface 6 in the thickness direction in the opposite direction to the opening direction in the main surface 5, and opens on the side toward which the main surface 6 faces.

[0020] The outer periphery of each of the multiple through holes 7 is surrounded by a hole circumferential surface 8. The hole circumferential surface 8 of each of the through holes 7 is formed from the base material 2. In the base material 2, a photocatalyst is supported on the main surfaces 5 and 6, and also on the hole circumferential surface 8 of each of the through holes 7.

[0021] In the example of FIG. 1, the multiple through holes 7 are arranged in an arrangement similar to the so-called "60° staggered type". However, the arrangement of the multiple through holes 7 in the substrate 2 is not limited to the arrangement of the example of FIG. 1. In one example, the multiple through holes 7 are arranged in an arrangement similar to the so-called "parallel type". However, in either case, the multiple through holes 7 do not overlap with each other when projecting the substrate 2 (photocatalyst module 1) from the thickness direction. In other words, each of the through holes 7 is arranged independently of each other. Therefore, the multiple through holes 7 are partitioned from each other by the substrate 2 and isolated from each other.

[0022] 1, the cross-sectional shape of each of the multiple through holes 7 is circular or approximately circular in a cross section perpendicular or approximately perpendicular to the thickness direction of the base material 2. However, the cross-sectional shape of each of the multiple through holes 7 may be a shape other than a circle, such as an ellipse or a polygon. In one example, the cross-sectional area of ​​each of the multiple through holes 7 is uniform or approximately uniform over the entire area between the main surfaces 5 and 6. In another example, the cross-sectional area of ​​each of the multiple through holes 7 changes depending on the position in the thickness direction of the base material 2, and the cross-sectional area is not uniform.

[0023] In an air treatment device (not shown) that performs air treatment using the photocatalyst module 1 as described above, the photocatalyst module 1 is disposed inside a housing (not shown). Then, air is introduced into the housing, and an air flow in which the introduced air flows through the photocatalyst module 1 is generated inside the housing. At this time, the air flowing through the photocatalyst module 1 passes through one of the multiple through holes 7. Then, in a state in which air flows through the photocatalyst module 1, light such as ultraviolet light or visible light is irradiated onto the photocatalyst module 1. As a result, products such as active oxygen and OH radicals are generated in the photocatalyst module 1, and the air flowing through the photocatalyst module is sterilized, deodorized, etc. using the products in the photocatalyst module. Then, the air that has been subjected to air treatment such as sterilization and deodorization is discharged to the outside of the housing.

[0024] Here, "sterilization" means inactivating viruses and bacteria (bacteria) present in the air, and terms such as "disinfection", "sterilization" and "sterilization" can be used instead of "sterilization". Therefore, although the term "sterilization" is used in the embodiment, the term "sterilization" can be replaced with "sterilization", "sterilization" and "sterilization".

[0025] FIG. 2 is a schematic diagram of an example of a manufacturing apparatus 10 for manufacturing a photocatalyst module 1. As shown in FIG. 2 and other figures, the manufacturing apparatus 10 includes a photocatalyst application unit 11, an airflow forming unit 12, and a baking unit 13. In the photocatalyst application unit 11, a photocatalyst is applied to the substrate 2. At this time, the photocatalyst is applied to the substrate 2 in which a plurality of through holes 7 are formed, each of which penetrates between a pair of main surfaces 5 and 6. In one example, in applying the photocatalyst to the substrate 2, a liquid in which the photocatalyst is dissolved is stored in a container or the like. Then, the substrate 2 is immersed in the stored liquid to apply the photocatalyst to the substrate 2. At this time, the substrate 2 is immersed in the liquid in which the photocatalyst is dissolved, for example, for about 5 minutes.

[0026] In another example, in applying the photocatalyst to the substrate 2, a liquid in which the photocatalyst is dissolved is sprayed or dripped onto the substrate 2. At this time, the liquid in which the photocatalyst is dissolved is sprayed or dripped onto the substrate 2, for example, from one side in the thickness direction of the substrate 2, that is, from the side toward which one of the pair of main surfaces 5, 6 faces. As a result, the photocatalyst contained in the sprayed or dripped liquid is applied to the substrate 2.

[0027] In the airflow forming unit 12, an airflow is formed in the base material 2 coated with the photocatalyst, and the formed airflow is used for processing. The processing by the airflow forming unit 12 is performed before the base material 2 is baked by the baking unit 13, and before the catalyst applied to the base material 2 dries. In the processing by the airflow forming unit 12, air is made to flow into the base material 2 from the side to which one of the pair of main surfaces 5, 6 faces, that is, from one side in the thickness direction of the base material 2. Then, in the base material 2, the air that has flowed in is made to flow through the multiple through holes 7. As a result, an airflow in which the flowed in air flows through the multiple through holes 7 is formed in the base material 2, suppressing and preventing the photocatalyst from blocking the through holes 7.

[0028] FIG. 3 shows an example of a state in which a process is being performed by the airflow forming unit 12 in the manufacture of the photocatalyst module 1. In the example of FIG. 3, the airflow forming unit 12 includes a rotating shaft 21 and a substrate mounting unit 22. The rotating shaft 21 has a rotation axis P as a central axis and can rotate around the rotation axis P. The substrate 2 can be mounted on the substrate mounting unit 22. In the example of FIG. 3, two substrate mounting units 22 are provided, and one substrate 2 can be mounted on each of the two substrate mounting units 22. When the rotating shaft 21 is rotated, the substrate mounting unit 22 rotates together with the rotating shaft 21 around the rotation axis P.

[0029] In one example shown in FIG. 3, in the manufacture of a photocatalyst module 1, the substrate 2 coated with a photocatalyst is placed on the substrate placement section 22. Then, with the substrate 2 placed on the substrate placement section 22, the rotating shaft 21 and the substrate placement section 22 are rotated around the rotation axis P. As a result, the substrate 2 placed on the substrate placement section 22 revolves around the rotation axis P (arrow A in FIG. 3). In the state in which the substrate 2 revolves around the rotation axis P, one side of the axial direction of the rotation axis P is the rotation direction of the substrate 2.

[0030] When the air flow forming part 12 is configured as in the example of Fig. 3, an axial direction along the rotation axis P and a circumferential direction that coincides or approximately coincides with the direction around the rotation axis P are defined in the rotating shaft 21. Also, a radial direction that is perpendicular or approximately perpendicular to both the axial direction and the circumferential direction is defined in the rotating shaft 21. In the example of the air flow forming part 12 of Fig. 3, the side of the rotating shaft 21 that faces the rotation axis P in the radial direction is the inner circumferential side, and the side of the rotating shaft 21 that faces away from the rotation axis P in the radial direction is the outer circumferential side.

[0031] 3, in the substrate 2 placed on the substrate placement section 22, the main surface 5 faces one side in the axial direction around the rotation axis P, and the main surface 6 faces the opposite side to the main surface 5 in the axial direction around the rotation axis P. For this reason, the substrate 2 is placed on the substrate placement section 22 in a position where one of the pair of main surfaces 5, 6 faces the direction of rotation during revolution. Then, by rotating the rotating shaft 21 with the substrate 2 placed on the substrate placement section 22, the substrate 2 revolves around the rotation axis P in a position where one of the pair of main surfaces 5, 6 faces the direction of rotation.

[0032] In the example of FIG. 3, by revolving the substrate 2 placed on the substrate placement unit 22, air flows into the revolving substrate 2 from the direction of rotation. At this time, since the substrate 2 revolves with one of the pair of main surfaces 5, 6 facing the direction of rotation, air flows into the substrate 2 from the side to which one of the main surfaces 5, 6 faces. Then, in the revolving substrate 2, the flowing air flows through the through holes 7 toward the opposite side to the direction of rotation. Therefore, an airflow in which the flowing air flows through the multiple through holes 7 is generated in the substrate 2.

[0033] The duration of revolution of the substrate 2 around the rotation axis P is adjusted appropriately, for example, within a range of 10 seconds or more and 30 seconds or less. The rotation speed of the substrate 2 is adjusted appropriately, for example, within a range of 500 rpm or more and 2000 rpm or less. In this case, the substrate 2 coated with the photocatalyst revolves at any rotation speed within a range of 500 rpm or more and 2000 rpm or less during the revolution of the substrate 2 around the rotation axis P. The duration of revolution may be adjusted within a range of 30 seconds or more and 60 seconds or less, and in this case, the rotation speed of revolution may be 500 rpm or less, or may be in a range of 500 rpm or more and 2000 rpm or less.

[0034] In addition, the posture of the substrate 2 placed in the substrate placement section 22 is not limited to the posture of the example in FIG. 3. In one example, the substrate 2 is placed in the substrate placement section 22 in a posture in which one of the main surfaces 5, 6 faces the inner periphery side, and the other of the main surfaces 5, 6 faces the outer periphery side. In this case, by revolving the substrate 2 placed in the substrate placement section 22, centrifugal force due to the rotation is generated, and air flows into the substrate 2 revolving from the inner periphery side. At this time, since the substrate 2 revolves in a posture in which one of the pair of main surfaces 5, 6 faces the inner periphery side, air flows into the substrate 2 from the side to which one of the main surfaces 5, 6 faces. Then, in the substrate 2 revolving, the flowing air flows toward the outer periphery side through the through holes 7. Therefore, even in this example, an airflow in which the flowing air flows through the multiple through holes 7 is generated in the substrate 2.

[0035] In addition, in a configuration in which the substrate 2 installed on the substrate installation unit 22 is revolved as in the example of FIG. 3, the substrate installation unit 22 and the substrate 2 installed on the substrate installation unit 22 may be movable along the axial direction (rotation axis P) of the rotating shaft 21. In one example, in a state in which a liquid in which a photocatalyst is dissolved is stored in a container or the like, the substrate 2 installed on the substrate installation unit 22 is moved along the axial direction of the rotating shaft 21, and the substrate 2 is immersed in the liquid stored in the container or the like. At this time, in a state in which the substrate 2 is installed on the substrate installation unit 22, the substrate 2 is immersed in the liquid, and the photocatalyst is applied to the substrate 2. Then, after immersing the substrate 2 in the liquid for a certain period of time, the substrate 2 installed on the substrate installation unit 22 is moved along the axial direction of the rotating shaft 21 until the substrate 2 is not immersed in the liquid. Then, in a state in which the substrate 2 is not immersed in the liquid, the substrate 2 is revolved around the rotation axis P as described above, and air is caused to flow through the multiple through holes 7 in the substrate 2.

[0036] In addition, the configuration of flowing air through the multiple through holes 7 in the base material 2 is not limited to the configuration of flowing air by revolving the base material 2. In one example, a gas (air, nitrogen, oxygen, etc.) is ejected toward the base material 2 coated with a photocatalyst to form an airflow in the base material 2, and the air is caused to flow through the multiple through holes 7. At this time, air is ejected toward the base material 2 from one side in the thickness direction of the base material 2, that is, from the side toward which one of the pair of main surfaces 5 and 6 faces. As a result, air flows into the base material 2 from the side toward which one of the main surfaces 5 and 6 faces, and the air that has flowed in flows through the multiple through holes 7. The duration of ejecting air toward the base material 2 is appropriately adjusted, for example, within a range of 10 seconds or more and 60 seconds or less.

[0037] In one example, the photocatalyst is applied to the substrate 2 by jetting (dripping) a liquid in which the photocatalyst is dissolved toward the substrate 2 from one side in the thickness direction of the substrate 2. Then, gas is jetted toward the substrate 2 to which the photocatalyst has been applied. In this case, gas is jetted toward the substrate 2 from the side from which the liquid has been jetted in the thickness direction of the substrate 2. For example, when the photocatalyst is applied to the substrate 2 by jetting a liquid from the side facing the main surface 5, gas is jetted toward the substrate 2 to which the photocatalyst has been applied from the side facing the main surface 5. Then, when the photocatalyst is applied to the substrate 2 by jetting a liquid from the side facing the main surface 6, gas is jetted toward the substrate 2 to which the photocatalyst has been applied from the side facing the main surface 6.

[0038] In the baking section 13, the base material 2 coated with the photocatalyst is baked. In the baking section 13, the base material 2 that has been treated by the air flow forming section 12, i.e., the base material 2 that has been treated by flowing air through the multiple through holes 7, is baked. The photocatalyst module 1 is formed by baking in the baking section 13. In one example, the base material 2 is baked twice with a time interval between each baking. In this case, the first baking is continued for six hours in an environment at a temperature of 100°C. Then, the second baking is continued for six hours in an environment at a temperature of 200°C.

[0039] Fig. 4 is a flow chart showing an example of a process (step) in the manufacturing process of the photocatalyst module 1. As shown in Fig. 4 etc., in the manufacturing process of the photocatalyst module 1, the base material 2 is formed (S31). At this time, a plurality of through holes 7 each penetrating between a pair of main surfaces 5, 6 are formed in the base material 2. Then, a photocatalyst is applied to the base material 2 (S32). The photocatalyst is applied to the base material 2 by any of the methods described above.

[0040] Then, a process is performed in which air is introduced into the base material 2 from the side facing one of the main surfaces 5, 6, and the introduced air is made to flow through the multiple through holes 7 (S33). At this time, an airflow in which gas (e.g., air) flows through the multiple through holes 7 is generated in the base material 2 by any of the methods described above, and the airflow is generated in the base material 2 by, for example, revolving the base material 2. Then, the base material 2 that has been subjected to the process of S33 is fired (S34). The photocatalyst module 1 is formed by firing the base material 2 to which the photocatalyst has been applied.

[0041] Immediately after the process of applying the photocatalyst to the substrate 2, there may be areas on the substrate 2 where the photocatalyst is excessively attached and areas where the photocatalyst is hardly attached, resulting in uneven application of the photocatalyst. In addition, in the substrate 2, due to the excessive attachment of the photocatalyst, any of the multiple through holes 7 may be blocked by a film of the liquid in which the photocatalyst is dissolved.

[0042] In this embodiment, after applying the photocatalyst to the substrate 2, and before baking the substrate 2, air is introduced into the substrate 2 from the side facing one of the main surfaces 5 and 6, and the introduced air is made to flow through the multiple through holes 7 in the substrate 2. By forming the airflow as described above in the substrate 2, a part of the attached photocatalyst is removed by the airflow in the portion where the photocatalyst is excessively attached. In addition, in the substrate 2, the formed airflow moves the liquid in which the photocatalyst is dissolved from the portion where the photocatalyst is excessively attached to the portion where the photocatalyst is hardly attached. Therefore, in the substrate 2, by flowing air through the multiple through holes 7, the occurrence of uneven application of the photocatalyst is suppressed, and the degree of application of the photocatalyst is made uniform.

[0043] In this embodiment, the base material 2 in which the degree of application of the photocatalyst has been made uniform by the process of flowing air through the multiple through holes 7 is then fired. Therefore, the occurrence of uneven application of the photocatalyst is appropriately suppressed in the fired base material 2. In other words, the process of flowing air through the multiple through holes 7 makes it possible to realize a uniform degree of application of the photocatalyst in the fired base material 2.

[0044] Furthermore, in this embodiment, as described above, before the base material 2 is fired, air is caused to flow through the plurality of through holes 7 in the base material 2. Therefore, even if any of the plurality of through holes 7 is blocked by a liquid film due to application of a photocatalyst to the base material 2, the film blocking the through hole 7 is removed by the air flowing through the through hole 7. This effectively prevents the formation of a photocatalyst film blocking any of the through holes 7 in the fired base material 2.

[0045] Since the degree of application of the photocatalyst to the substrate 2 in the photocatalyst module 1 is uniform, products such as active oxygen and OH radicals are appropriately generated in the photocatalyst module 1 by irradiating the photocatalyst module 1 with light. As a result, in air treatment using the photocatalyst module 1, the treatment performance of the air treatment, such as sterilization performance and deodorization performance, is appropriately ensured.

[0046] Furthermore, as described above, in the photocatalyst module 1, the formation of a photocatalyst film blocking any of the through-holes 7 is effectively suppressed. Therefore, in air treatment using the photocatalyst module 1, air flows appropriately through the multiple through-holes 7, and an appropriate flow rate of air passing through the photocatalyst module 1 is ensured. By ensuring the air flow rate in the photocatalyst module 1, the treatment performance is improved in air treatment using the photocatalyst module 1.

[0047] Furthermore, in the photocatalyst module 1, the degree of application of the photocatalyst to the substrate 2 is made uniform, which effectively prevents the occurrence of areas where the photocatalyst is excessively attached to the substrate 2. Therefore, when air treatment is being performed using the photocatalyst module 1, the photocatalyst is effectively prevented from peeling off from the substrate 2 due to air passing through the photocatalyst module 1. This effectively prevents the photocatalyst peeled off from the substrate 2 from adhering to areas other than the photocatalyst module 1 in the air treatment device.

[0048] 3, the substrate 2 is revolved around the rotation axis P, so that air flows into the substrate 2 coated with the photocatalyst, and the air flows through the through-holes 7. When the substrate 2 is revolving, air flows into the revolving (rotating) substrate 2 from the rotation direction of the substrate 2 during the revolution and from the inner peripheral side. Therefore, an airflow in which air flows through the through-holes 7 is appropriately formed in the revolving substrate 2. That is, air flows appropriately through the through-holes 7 in the substrate 2.

[0049] 3, the substrate 2 coated with the photocatalyst revolves in a position in which one of the pair of main surfaces 5, 6 faces the direction of rotation during revolution. Therefore, while the substrate 2 is revolving, air that has flowed into the substrate 2 from the direction of rotation of the substrate 2 during revolution can easily pass through the through holes 7. This allows air to flow more appropriately through the through holes 7 in the substrate 2 that is revolving.

[0050] In addition, in one example of this embodiment, as in the example of FIG. 3, the base material 2 is revolved around the rotation axis P, so that air flows through the through-holes 7 in the base material 2. Then, in the revolution around the rotation axis P, the base material 2 coated with the photocatalyst is revolved at any rotation speed in the range of 500 rpm or more and 2000 rpm or less. In the revolution of the base material 2, for example, by setting the rotation speed to a certain level, such as setting the rotation speed to 500 rpm or more, a part of the attached photocatalyst is appropriately removed in the part where the photocatalyst is excessively attached, and the liquid film blocking the through-holes 7 is also appropriately removed. In addition, in the revolution of the base material 2, for example, by suppressing the rotation speed within a range that does not exceed a reference level, such as setting the rotation speed to 2000 rpm or less, excessive removal of the photocatalyst from the base material 2 is appropriately suppressed.

[0051] According to at least one of these embodiments, a gas is introduced into the substrate coated with a photocatalyst from the side facing one of the pair of main surfaces, and the introduced gas is made to flow through the plurality of through holes in the substrate. This makes it possible to provide a method and an apparatus for manufacturing a photocatalyst module that can suppress the occurrence of uneven coating of the photocatalyst on the substrate.

[0052] Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and spirit of the invention, and are included in the scope of the invention and its equivalents described in the claims. [Explanation of symbols]

[0053] Reference Signs List 1: photocatalyst module, 2: substrate, 5, 6: main surfaces, 7: through hole, 10: manufacturing apparatus, 11: photocatalyst application section, 12: airflow forming section, 13: baking section, P: rotation shaft.

Claims

1. Applying a photocatalyst to a substrate having a plurality of through holes each penetrating between a pair of main surfaces; causing a gas to flow into the base material coated with the photocatalyst from a side toward which one of the pair of main surfaces faces, and causing the gas to flow through the plurality of through holes in the base material; A method for manufacturing a photocatalyst module comprising the steps of:

2. The manufacturing method according to claim 1 , wherein the substrate is revolved around a rotation axis, thereby causing the gas, air, to flow into the substrate coated with the photocatalyst and causing the air to flow through the plurality of through holes.

3. The manufacturing method according to claim 2 , wherein the base material coated with the photocatalyst is revolved around the rotation axis in such a manner that one of the pair of main surfaces faces the direction of rotation during the revolution.

4. 4. The manufacturing method according to claim 2 or 3, wherein the base material coated with the photocatalyst is revolved around the rotation axis at a rotation speed in the range of 500 rpm or more and 2000 rpm or less.

5. a photocatalyst application unit that applies a photocatalyst to the base material in which each of the plurality of through holes penetrates between a pair of main surfaces; an airflow forming unit that causes a gas to flow into the base material coated with the photocatalyst from a side toward which one of the pair of main surfaces faces, and causes the gas that has flowed into the base material to flow through the plurality of through holes; A photocatalyst module manufacturing apparatus comprising:

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