Substrate holding device, sticking device, substrate holding method, and sticking method

Abstract

To provide a substrate holding device, a sticking device, a substrate holding method, and a sticking method that are capable of restraining generation of a gap between a substrate and a holding surface.SOLUTION: A substrate holding device 100 includes a chuck 130, a plurality of suction pins 400, and a pin actuator 450. The chuck 130 has a holding surface 130a that suctions and holds a back surface Wb of the substrate W. The plurality of suction pins 400 can protrude from the holding surface 130a, and suctions and holds the substrate W. The plurality of suction pins 400 suction the back surface Wb of the substrate W at a protruding position P1. The pin actuator 450 changes the protruding amount of at least one suction pin 400 with respect to the protruding amount of the other suction pins 400, thereby curving the substrate W to follow the holding surface 130a. The pin actuator 450 moves the plurality of suction pins 400 from the protruding position P1 to a non-protruding position P2, thereby causing the chuck 130 to hold the substrate W.SELECTED DRAWING: Figure 10

Description

[Technical field]

[0001] The present invention relates to a substrate holding device, a bonding device, a substrate holding method, and a bonding method. [Background technology]

[0002] Conventionally, a bonding apparatus is known that includes a first substrate holding device that holds a first substrate and a second substrate holding device that holds a second substrate, and bonds the first substrate and the second substrate together (see, for example, Patent Document 1). Patent Document 1 discloses a bonding apparatus that includes a first holding section that suction-holds the first substrate, which is a wafer, from above, and a second holding section that is disposed below the first holding section and suction-holds the second substrate, which is a wafer, from below. The first holding section is provided with a plurality of suction holes. The bonding apparatus bonds the first substrate and the second substrate together. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-141115 Summary of the Invention [Problem to be solved by the invention]

[0004] However, a wafer may have warpage. Specifically, the device formation surface of the wafer is usually convex or concave. In the device described in Patent Document 1, a wafer having such warpage is placed on a holding surface, and then the wafer is attracted to the holding surface.

[0005] However, for example, when a warped wafer is placed on a holding surface using the device described in Patent Document 1 and then the wafer is attracted to the holding surface, there is a risk that a part of the wafer will remain warped on the holding surface. In other words, a gap will be generated between the holding surface and the wafer.

[0006] The present invention has been made in consideration of the above-mentioned problems, and its object is to provide a substrate holding device, a bonding device, a substrate holding method, and a bonding method that are capable of suppressing the occurrence of gaps between the substrate and the holding surface. [Means for solving the problem]

[0007] A substrate holding device according to a first aspect of the present invention includes a chuck, a plurality of suction pins, and a pin actuator. The chuck has a holding surface that suction-holds one side of a substrate. The plurality of suction pins are capable of protruding from the holding surface and suction-hold the substrate. The pin actuator moves the plurality of suction pins between a protruding position at which the pins protrude from the holding surface and a non-protruding position at which the pins do not protrude from the holding surface. The plurality of suction pins suction-hold the one side of the substrate at the protruding position. The pin actuator changes the protruding amount of at least one of the suction pins relative to the protruding amounts of the other suction pins, thereby curving the substrate to conform to the holding surface. The pin actuator moves the plurality of suction pins from the protruding position to the non-protruding position, thereby causing the chuck to hold the substrate.

[0008] In one embodiment, the plurality of suction pins include a central suction pin and a plurality of peripheral suction pins. The central suction pin suctions and holds the center of the substrate. The plurality of peripheral suction pins suction and holds the peripheral portion of the substrate. The pin actuator includes a central pin actuator and a peripheral pin actuator. The central pin actuator moves the central suction pin. The peripheral pin actuator moves the peripheral suction pin. The central pin actuator and the peripheral pin actuator move at least one of the central suction pin and the peripheral suction pin, and change the amount of protrusion of one of the central suction pin and the peripheral suction pin relative to the amount of protrusion of the other of the central suction pin and the peripheral suction pin, thereby curving the substrate to fit the holding surface.

[0009] In one embodiment, when moving the central suction pin and the outer periphery suction pin from the protruding position to the non-protruding position, the central pin actuator and the outer periphery pin actuator move the central suction pin to the non-protruding position and then move the outer periphery suction pin to the non-protruding position.

[0010] In one embodiment, the substrate holding device includes a deformation mechanism. The deformation mechanism deforms the chuck so that the holding surface has a convex shape, and also deforms the chuck so that the holding surface has a concave shape. The convex shape refers to a shape in which the center of the holding surface protrudes in a direction toward the substrate. The concave shape refers to a shape in which the center of the holding surface is recessed in a direction away from the substrate. When the holding surface has the convex shape, the pin actuator bends the substrate so that the center of the one surface is recessed in a direction away from the chuck. When the holding surface has the concave shape, the pin actuator bends the substrate so that the center of the one surface protrudes in a direction toward the chuck.

[0011] In one embodiment, the substrate holding device includes a control unit. The control unit controls the pin actuator. The control unit acquires warpage information including information on at least a warpage direction of the holding surface. The control unit changes a protrusion amount of the at least one suction pin relative to a protrusion amount of the other suction pins by the pin actuator based on the warpage information, thereby curving the substrate to fit the holding surface.

[0012] In one embodiment, when the warpage information indicates that the center of the holding surface is concave in a direction away from the substrate, the control unit bends the substrate using the pin actuator so that the center of one side protrudes in a direction toward the chuck.

[0013] In one embodiment, when the warp information indicates that the holding surface has the concave shape, the control unit uses the pin actuator to bend the substrate so that the center of the one side protrudes in a direction toward the chuck, and then brings the center of the one side into point contact with the center of the holding surface, and uses the pin actuator to make the curvature of the one side the same as the curvature of the holding surface.

[0014] A bonding apparatus according to a second aspect of the present invention bonds a first substrate and a second substrate. The bonding apparatus includes a first substrate holding device and a second substrate holding device. The first substrate holding device holds the first substrate. The second substrate holding device is disposed opposite the first substrate holding device and holds the second substrate. The first substrate holding device includes a first chuck, a plurality of first suction pins, and a first pin actuator. The first chuck has a first holding surface that suction-holds one surface of the first substrate. The plurality of first suction pins are capable of protruding from the first holding surface and suction-hold the first substrate. The first pin actuator moves the plurality of first suction pins between a protruding position where the pins protrude from the first holding surface and a non-protruding position where the pins do not protrude from the first holding surface. The plurality of first suction pins suction-hold the first substrate at the protruding position. The first pin actuator changes the amount of protrusion of at least one of the first suction pins relative to the amount of protrusion of the other first suction pins, thereby bending the first substrate along the first holding surface. The first pin actuator moves the first suction pins from the protruding position to the non-protruding position, thereby causing the first substrate to be held by the first chuck.

[0015] In one embodiment, the second substrate holding device includes a second chuck, a plurality of second suction pins, and a second pin actuator. The second chuck has a second holding surface that suction-holds one side of the second substrate. The plurality of second suction pins can protrude from the second holding surface and suction-hold the second substrate. The second pin actuator moves the plurality of second suction pins between a protruding position where the plurality of second suction pins protrude from the second holding surface and a non-protruding position where the plurality of second suction pins do not protrude from the second holding surface. The plurality of second suction pins suction-hold the second substrate at the protruding position. The second pin actuator changes the protruding amount of at least one of the second suction pins relative to the protruding amount of the other second suction pins, thereby curving the second substrate to conform to the second holding surface. The second pin actuator moves the plurality of second suction pins from the protruding position to the non-protruding position, thereby causing the second chuck to hold the second substrate.

[0016] In one embodiment, the second substrate holding device has a second chuck. The second chuck has a second holding surface that adsorbs and holds one side of the second substrate. The first substrate holding device and the second substrate holding device bond the first substrate and the second substrate together in a state in which one of the first holding surface and the second holding surface has a concave shape that is recessed in a direction away from the first substrate and the second substrate, and the other of the first holding surface and the second holding surface has a convex shape that protrudes in a direction toward the first substrate and the second substrate.

[0017] In one embodiment, the first holding surface is deformable into the convex shape and also into the concave shape, wherein a maximum curvature of the first holding surface in the convex shape is greater than a maximum curvature of the first holding surface in the concave shape.

[0018] A substrate holding method according to a third aspect of the present invention includes the steps of: suction-holding one side of a substrate with a plurality of suction pins; bending the substrate so that it fits a holding surface of a chuck that holds the substrate; transferring the substrate from the plurality of suction pins to the chuck; and holding the substrate with the chuck.

[0019] A bonding method according to a fourth aspect of the present invention includes the steps of: adsorbing and holding one side of a first substrate with a plurality of suction pins; curving the first substrate so that it fits along a first holding surface of a first chuck that holds the first substrate, transferring the first substrate from the plurality of suction pins to the first chuck, and holding the first substrate with the first chuck; adsorbing and holding one side of a second substrate with a second holding surface of a second chuck; and bonding the first substrate and the second substrate together in a state in which one of the first holding surface and the second holding surface has a concave shape that is concave in a direction away from the first substrate and the second substrate, and the other of the first holding surface and the second holding surface has a convex shape that protrudes in a direction toward the first substrate and the second substrate. Effect of the Invention

[0020] According to the present invention, it is possible to provide a substrate holding device, a bonding device, a substrate holding method, and a bonding method that are capable of suppressing the occurrence of a gap between the substrate and the holding surface. [Brief description of the drawings]

[0021] [Figure 1] 1 is a side view illustrating a schematic overall configuration of a substrate holding device according to a first embodiment. [Diagram 2] 1 is a cross-sectional view that illustrates a schematic diagram of a substrate holding device according to a first embodiment. [Diagram 3] 2 is a diagram showing a chuck of the substrate holding device of the first embodiment, viewed from below. FIG. [Figure 4] 4 is a schematic cross-sectional view taken along line IV-IV in FIG. 3, showing a state in which the suction pin is disposed at a protruding position. FIG. [Diagram 5] 4 is a schematic cross-sectional view taken along line IV-IV in FIG. 3, illustrating a state in which the suction pin is disposed at a non-protruding position. [Figure 6] 4 is a cross-sectional view illustrating a state in which a holding surface of a chuck of the substrate holding device of the first embodiment is formed in a convex shape. FIG. [Figure 7]4 is a cross-sectional view illustrating a state in which a holding surface of a chuck of the substrate holding device of the first embodiment is formed in a concave shape. FIG. [Figure 8] 1 is a block diagram showing a configuration of a substrate holding device according to a first embodiment. [Figure 9] 5 is a flowchart showing a substrate holding method by the substrate holding device of the first embodiment. [Figure 10] 11A to 11C are schematic cross-sectional views for explaining a method of holding a substrate by a chuck having a concave holding surface. [Figure 11] 11A and 11B are schematic cross-sectional views for explaining a method of holding a substrate by a chuck having a convex holding surface. [Figure 12] FIG. 11 is a side view that illustrates a bonding apparatus according to a second embodiment. [Figure 13] 13 is a cross-sectional view that illustrates typically a first substrate holding device and a second substrate holding device of a bonding apparatus according to a second embodiment. FIG. [Figure 14] FIG. 13 is a cross-sectional view that shows a schematic view of the second substrate holding device, illustrating a state in which the second suction pin is placed in a protruding position. [Figure 15] FIG. 13 is a block diagram showing a configuration of a bonding apparatus according to a second embodiment. [Figure 16] 10 is a flowchart showing a bonding method performed by the bonding apparatus of the second embodiment. [Figure 17] 13 is a flowchart showing a bonding step (step S24) in the bonding method by the bonding apparatus of the second embodiment. [Figure 18] FIG. 11 is a schematic diagram for explaining a lamination method in the first combination pattern. [Figure 19] 13A to 13C are schematic diagrams for explaining a lamination method in a second combination pattern. [Figure 20] 13A to 13C are schematic diagrams for explaining a lamination method in the third combination pattern. [Figure 21] FIG. 13 is a schematic diagram for explaining a bonding method in a fourth combination pattern. [Figure 22]FIG. 13 is a schematic diagram for explaining a bonding method in the fifth combination pattern. [Figure 23] FIG. 13 is a schematic diagram for explaining a bonding method in a sixth combination pattern. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] Hereinafter, an embodiment of a substrate holding device and a bonding device according to the present invention will be described with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference symbols and the description will not be repeated. In this specification, in order to facilitate understanding of the invention, an X-axis, a Y-axis, and a Z-axis that are perpendicular to each other may be described. In this embodiment, the X-axis and the Y-axis are approximately parallel to the horizontal direction, and the Z-axis is approximately parallel to the vertical direction. For convenience, one side Z1 in the Z-axis direction indicates the upward direction, and the other side Z2 in the Z-axis direction indicates the downward direction. However, the upward direction and the downward direction are determined for convenience of explanation, and do not need to coincide with the vertical direction.

[0023] (First embodiment) A substrate holding device 100 according to a first embodiment of the present invention will be described with reference to Figures 1 to 11. Figure 1 is a side view that shows a schematic overall configuration of the substrate holding device 100 of the first embodiment. However, in Figure 1, in order to prevent the drawing from becoming too complicated, only three suction pins 400 are drawn in accordance with Figure 4.

[0024] First, a schematic configuration of the substrate holding device 100 will be described with reference to Fig. 1. As shown in Fig. 1, the substrate holding device 100 includes a support frame SF, a support stand SB, a holding mechanism 110, a deformation mechanism 170, a suction mechanism 300, a plurality of suction pins 400, and a pin actuator 450.

[0025] The support frame SF is fixed to a floor (not shown) on which the substrate holding device 100 is installed. The support frame SF is made of, for example, metal. The support frame SF has, for example, a plurality of first frames SF1 extending in the vertical direction and a plurality of second frames SF2 extending in the horizontal direction. In this embodiment, four first frames SF1 are provided, and four second frames SF2 are provided. The four first frames SF1 include two first frame SF1 sets (not shown) each consisting of two first frames SF1 arranged at a predetermined interval from each other in the X direction. These two first frame SF1 sets overlap each other in the X direction and are arranged at a predetermined interval from each other in the Y direction. The four first frames SF1 are arranged at positions corresponding to the four corners of a rectangle in a plan view. The lower end of each first frame SF1 is fixed to the floor. The four second frames SF2 include two second frames SF2 connecting the upper ends of the first frames SF1 adjacent in the X direction, and two second frames SF2 connecting the upper ends of the first frames SF1 adjacent in the Y direction. That is, the four second frames SF2 are arranged at positions corresponding to the four sides of a rectangle in a plan view. The support frame SF may be fixed to a wall or ceiling of a room in which the substrate holding device 100 is installed.

[0026] The support base SB is configured not to move in the vertical and horizontal directions. Specifically, the support base SB is fixed to at least one of the first frame SF1 and the second frame SF2 of the support frame SF. In this embodiment, the support base SB is fixed to both the first frame SF1 and the second frame SF2. The support base SB is fixed to the first frame SF1 and the second frame SF2 by fasteners such as bolts (not shown).

[0027] The support base SB is made of a material that is not easily deformed by the weight and heat of the holding mechanism 110. The support base SB is made of, for example, a stone material or a metal frame. The outer shape of the support base SB is, for example, a substantially rectangular parallelepiped shape. A substantially rectangular parallelepiped through hole SBa is formed in the support base SB, penetrating it in the vertical direction. In other words, the support base SB is formed in a rectangular ring shape extending in the vertical direction.

[0028] In this embodiment, the support stand SB supports the holding mechanism 110 and a plurality of suction pins 400. The support stand SB supports the holding mechanism 110 from above. The outer periphery of the holding mechanism 110 is fixed to the support stand SB by fasteners (not shown) such as bolts.

[0029] The holding mechanism 110 adsorbs and holds the substrate W. The holding mechanism 110 holds the substrate W substantially horizontally.

[0030] The substrate W is, for example, a semiconductor wafer, a substrate for a liquid crystal display device, a substrate for a plasma display, a substrate for a field emission display (FED), a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell. In this embodiment, the substrate W is a semiconductor wafer.

[0031] The substrate W has, for example, a circular or rectangular shape in a plan view. In this embodiment, the substrate W has a substantially circular shape in a plan view.

[0032] In this embodiment, the substrate W has a front surface Wa and a back surface Wb located opposite to the front surface Wa. The front surface Wa is a device formation surface on which elements are formed. The back surface Wb is a non-device formation surface on which elements are not formed. The back surface Wb is an example of the "one side" in the present invention.

[0033] In this embodiment, the holding mechanism 110 holds the substrate W from above. The holding mechanism 110 also holds the back surface Wb of the substrate W by suction. Therefore, when the substrate W is held by the holding mechanism 110, the back surface Wb of the substrate W becomes the upper surface, and the front surface Wa of the substrate W becomes the lower surface. Needless to say, when the substrate W is not held by the holding mechanism 110, the substrate W can be turned upside down. However, in this embodiment, for ease of understanding, the substrate W is not turned upside down unless otherwise described. In other words, in this embodiment, regardless of whether the substrate W is held by the holding mechanism 110 or not, the front surface Wa of the substrate W is the lower surface, and the back surface Wb of the substrate W is the upper surface.

[0034] A part of the deformation mechanism 170 is attached to, for example, the upper part of the holding mechanism 110 using a fastener (not shown) such as a bolt. Specifically, the deformation mechanism 170 has a moving body 171 and a driving mechanism 173, as described later. The driving mechanism 173 is attached to the upper part of the holding mechanism 110 using a fastener (not shown) such as a bolt. The deformation mechanism 170 has a function of deforming a part of the holding mechanism 110. Note that the driving mechanism 173 may be attached to a support base SB. The configuration of the deformation mechanism 170 will be described later.

[0035] A part of the suction mechanism 300 is attached to, for example, the support frame SF using fasteners (not shown) such as bolts. The suction mechanism 300 is a device for adsorbing the substrate W to the holding mechanism 110, and sucks air. Note that a part of the suction mechanism 300 may be attached to the support stand SB, or may be placed on a floor (not shown) on which the substrate holding device 100 is installed. The configuration of the suction mechanism 300 and a suction method by the suction mechanism 300 will be described later.

[0036] The multiple suction pins 400 are arranged to vertically penetrate the holding mechanism 110 and are provided to be vertically movable relative to the holding mechanism 110. The multiple suction pins 400 support the substrate W before it is held by the holding mechanism 110. The multiple suction pins 400 support the back surface Wb of the substrate W by suction. The multiple suction pins 400 support the substrate W from above. The multiple suction pins 400 receive the substrate W from a transport arm TA of the transport device TR. The transport device TR is, for example, a device other than the substrate holding device 100, or a device that transports the substrate W from a substrate cassette (not shown) to the substrate holding device 100.

[0037] Furthermore, the plurality of suction pins 400 transfer the substrate W received from the transport device TR to the holding mechanism 110. The configuration of the plurality of suction pins 400 will be described later.

[0038] The pin actuator 450 is attached, for example, to the upper part of the holding mechanism 110 using a fastener (not shown) such as a bolt. The multiple suction pins 400 are moved up and down by driving the pin actuator 450. The multiple suction pins 400 are moved up and down by driving the pin actuator 450, and thereby the multiple suction pins 400 can receive the substrate W from the transport device TR and pass the substrate W to the holding mechanism 110. The pin actuator 450 may be attached to the support stand SB. The configuration of the pin actuator 450 will be described later.

[0039] Next, the substrate holding device 100 will be further described with reference to Fig. 2. Fig. 2 is a cross-sectional view that shows a schematic diagram of the substrate holding device 100 of the first embodiment. Note that in Fig. 2 and Figs. 3 and 4 described later, the suction pins 400 are omitted for ease of understanding.

[0040] As shown in FIG. 2, the holding mechanism 110 includes a base 120 , a chuck 130 , a support wall 140 , a fixing ring 150 , and a partition wall 160 .

[0041] The base 120 has a substantially circular shape in a plan view. The base 120 is, for example, a plate. The base 120 has a lower surface 120a and an upper surface 120b. The lower surface 120a and the upper surface 120b are disposed substantially horizontally.

[0042] The base 120 has a first member 121 and a second member 122. The first member 121 has a substantially circular shape in a plan view. The second member 122 has a ring shape in a plan view, and surrounds the outer periphery of the first member 121. That is, the first member 121 constitutes a central part of the base 120, and the second member 122 constitutes an outer periphery part of the base 120. Note that, in this embodiment, an example in which the base 120 has the first member 121 and the second member 122 will be described, but the base 120 does not have to be formed separately into the first member 121 and the second member 122, and may have the first member 121, the second member 122, and other members not shown.

[0043] The first member 121 is formed of, for example, ceramic or metal. The first member 121 has a substantially disk shape or a substantially cylindrical shape. The first member 121 is formed with an insertion hole 121a through which a moving body 171 of the deformation mechanism 170, which will be described later, is inserted. The insertion hole 121a penetrates the first member 121 in the thickness direction (here, the vertical direction). The insertion hole 121a is formed at the center of the first member 121. The first member 121 is formed with a through hole 121b through which air passes. The through hole 121b penetrates the first member 121 in the thickness direction. For example, a plurality of through holes 121b are provided. The through hole 121b is formed radially outward of the insertion hole 121a.

[0044] The first member 121 also has a seal groove 121c and a seal groove 121d. The seal groove 121c is formed in a substantially annular shape along the inner circumferential surface of the insertion hole 121a with the center being the central axis of the first member 121. The seal groove 121c is a groove formed on the inner circumferential surface of the insertion hole 121a. The seal groove 121d is formed in a substantially annular shape along the outer circumferential surface of the first member 121 with the center being the central axis of the first member 121. The seal groove 121c and the seal groove 121d are formed by, for example, cutting.

[0045] Moreover, the first member 121 has a flange portion 121e. The flange portion 121e is formed on an upper portion of the first member 121. The flange portion 121e protrudes radially outward further than other portions of the first member 121. The lower surface of the flange portion 121e contacts the upper surface of the second member 122, and the flange portion 121e has a function of positioning the second member 122 in the up-down direction.

[0046] The second member 122 is formed of, for example, ceramic or metal. The second member 122 is formed in an annular shape surrounding the periphery of the first member 121. In this embodiment, the second member 122 has a substantially annular shape or a substantially cylindrical shape. In addition, a step portion 122a is formed in the second member 122. The step portion 122a is formed on the inner peripheral surface of the second member 122. The step portion 122a of the second member 122 and the outer peripheral surface of the first member 121 form an insertion groove 120c. The insertion groove 120c is formed in the lower surface 120a of the base 120. In other words, the insertion groove 120c is formed at a position of the base 120 facing the chuck 130. In addition, the insertion groove 120c extends in the vertical direction. The insertion groove 120c may penetrate the base 120 in the vertical direction.

[0047] Further, the second member 122 has a through hole 122b formed therein through which air passes. The through hole 122b passes through the second member 122 in the thickness direction (here, the vertical direction). For example, a plurality of through holes 122b are provided. The through holes 122b are located radially outward of the insertion groove 120c.

[0048] Further, the second member 122 has a seal groove 122c. The seal groove 122c is formed in a substantially annular shape on the lower surface of the second member 122 along the outer circumferential edge of the second member 122. The seal groove 122c is formed by, for example, cutting.

[0049] The chuck 130 has a substantially circular shape in a plan view. The chuck 130 is, for example, a plate. The chuck 130 is disposed below the base 120. The chuck 130 is smaller than the base 120, and an upper surface of the chuck 130 faces a lower surface 120a of the base 120. The chuck 130 is disposed substantially parallel to the base 120 at a predetermined distance (for example, 5 mm or more) from the base 120. The chuck 130 is formed of, for example, ceramic, resin, metal, or synthetic rubber, and can bend by about several mm to 10 mm.

[0050] The chuck 130 has a holding surface 130a and a back surface 130c located on the opposite side to the holding surface 130a. The holding surface 130a holds a back surface Wb (here, the upper surface) of the substrate W. In this embodiment, the holding surface 130a is the lower surface of the chuck 130, and the back surface 130c is the upper surface of the chuck 130. The back surface Wb (here, the upper surface) of the substrate W is the surface that comes into contact with the holding surface 130a (here, the lower surface) of the chuck 130.

[0051] 2, the chuck 130 is formed with a through hole 130b through which air passes. The through hole 130b penetrates the chuck 130 in the thickness direction (here, the vertical direction). For example, a plurality of the through holes 130b are provided. The through holes 130b are formed over substantially the entire area of ​​the chuck 130 on which the substrate W is placed. The through holes 130b are holes for sucking in air and adsorbing the substrate W, as will be described later.

[0052] The support wall 140 supports the chuck 130. In this embodiment, the support wall 140 and the chuck 130 are formed of a single member. Note that the support wall 140 may be provided as a separate member from the chuck 130.

[0053] The support wall 140 extends from the outer circumferential end of the chuck 130 toward the base 120. In this embodiment, the support wall 140 extends upward from the outer circumferential end of the chuck 130. An upper end of the support wall 140 is fixed to the lower surface 120a of the base 120, and a lower end of the support wall 140 is connected to the chuck 130. Thus, the chuck 130 is disposed at a predetermined distance below the base 120.

[0054] The support wall 140 is formed in a substantially annular shape along the outer circumferential edge of the chuck 130. In other words, the support wall 140 is a substantially annular wall. A space S is formed by the base 120, the chuck 130, and the support wall 140.

[0055] Furthermore, the support wall 140 has a flange portion 141. The flange portion 141 is formed on an upper portion of the support wall 140. The flange portion 141 protrudes radially outward beyond other portions of the support wall 140.

[0056] The fixing ring 150 has, for example, a substantially annular shape, and is disposed along the outer circumferential surface of the support wall 140. The fixing ring 150 fixes the flange portion 141 to the lower surface 120a of the base 120. Specifically, the fixing ring 150 has a substantially L-shape in cross section, and engages with the flange portion 141. In other words, a step that engages with the flange portion 141 is formed on the inner circumferential surface of the fixing ring 150. The fixing ring 150 is fixed to the base 120 by, for example, a screw. And, the fixing ring 150 is fixed to the base 120, and thus the flange portion 141 is fixed to the base 120.

[0057] The partition wall 160 extends from the chuck 130 toward the base 120. Specifically, the partition wall 160 extends from the back surface 130c, which is the upper surface of the chuck 130, toward the base 120. The partition wall 160 is formed in a substantially annular shape. The partition wall 160 is formed at a position corresponding to the insertion groove 120c of the base 120, and the vertical length of the partition wall 160 is longer than the vertical length of the support wall 140. Therefore, the tip of the partition wall 160 is inserted into the insertion groove 120c.

[0058] Here, in this embodiment, in a state where the holding surface 130a of the chuck 130 is planar (as shown in FIG. 2), a part of the partition wall 160 is inserted into the insertion groove 120c, and the insertion groove 120c has a region S120 in which the partition wall 160 can be further inserted into the insertion groove 120c. The region S120 is defined by the tip surface 160a of the partition wall 160 and the inner surface 120d of the insertion groove 120c. That is, in a state where the holding surface 130a is planar, a gap is formed between the inner surface (ceiling surface in FIG. 2) of the insertion groove 120c and the tip surface 160a (upper surface in FIG. 2) of the partition wall 160. Therefore, it is possible to further insert the partition wall 160 into the insertion groove 120c. By further inserting the partition wall 160 into the insertion groove 120c, the holding surface 130a can be easily made into a concave shape, as described later.

[0059] In this embodiment, the partition wall 160 and the chuck 130 are formed of a single member. In this embodiment, the partition wall 160, the chuck 130, and the support wall 140 are formed of a single member. Note that the partition wall 160 may be provided as a separate member from the chuck 130.

[0060] The deformation mechanism 170 deforms the holding mechanism 110. The deformation mechanism 170 also deforms the chuck 130 so that the center of the holding surface 130a has a convex shape that protrudes in a direction toward the substrate W (here, downward). The deformation mechanism 170 also deforms the chuck 130 so that the center of the holding surface 130a has a concave shape that is recessed in a direction away from the substrate W (here, upward). That is, the deformation mechanism 170 deforms the chuck 130 so that the holding surface 130a has a convex shape, or deforms the chuck 130 so that the holding surface 130a has a concave shape. Hereinafter, the holding surface 130a being curved so that the center of the holding surface 130a protrudes in a direction toward the substrate W (here, downward) may be described as the holding surface 130a having a convex shape. Furthermore, when the holding surface 130a is curved such that the center of the holding surface 130a is recessed in a direction away from the substrate W (here, upward), this may be referred to as the holding surface 130a having a concave shape.

[0061] Specifically, the deformation mechanism 170 has a moving body 171, a fixed member 172, and a driving mechanism 173. The moving body 171 is formed of, for example, resin or metal. The moving body 171 is formed in, for example, a rod shape, a column shape, or an axis shape. In this embodiment, the moving body 171 has a cylindrical shape and is arranged so as to extend in the up-down direction. The moving body 171 is inserted into the insertion hole 121a of the first member 121. That is, the upper end of the moving body 171 protrudes upward from the insertion hole 121a of the first member 121. The lower end of the moving body 171 protrudes downward from the insertion hole 121a of the first member 121.

[0062] The lower end of the moving body 171 may be directly fixed to the center of the back surface 130c (upper surface in FIG. 2) of the chuck 130, or may be fixed via a fixing member or the like. In this embodiment, the lower end of the moving body 171 is fixed to the center of the back surface 130c of the chuck 130 via a fixing member 172. Specifically, the fixing member 172 is disposed between the moving body 171 and the chuck 130. The fixing member 172 is fixed to the back surface 130c of the chuck 130 by an adhesive, a screw, or the like. The fixing member 172 is also fixed to the lower end of the moving body 171 by an adhesive, a screw, or the like. The fixing member 172 is formed of, for example, a metal. In this embodiment, the fixing member 172 also functions as a seal member that seals between the moving body 171 and the chuck 130.

[0063] The movable body 171 is movable relative to the base 120 along the opposing direction in which the chuck 130 and the base 120 face each other (here, the up-down direction).

[0064] The driving mechanism 173 moves the moving body 171 in the vertical direction relative to the base 120. The driving mechanism 173 has an actuator. The driving mechanism 173 is not particularly limited, but has, for example, a driving source such as a pump or a motor, and a transmission member such as a gear and / or a cam that transmits the driving force of the driving source to the moving body 171. The driving mechanism 173 is fixed to, for example, the upper surface 120b of the base 120. When the driving mechanism 173 is driven, the moving body 171 moves in the vertical direction relative to the base 120. This causes the chuck 130 to deform. The deformation of the chuck 130 will be described later. In order to prevent the drawings from becoming complicated, the driving mechanism 173 may be omitted in FIG. 3 and subsequent figures, except when particularly necessary.

[0065] In this embodiment, the moving body 171 includes a pipe having a through hole 171a connected to the holding surface 130a. The through hole 171a penetrates the inside of the moving body 171 in the direction in which the moving body 171 extends. Air passes through the through hole 171a. The through hole 171a is a suction hole that sucks the substrate W. In this embodiment, the fixing member 172 is formed with a through hole 172a through which air passes. The through hole 172a is connected to the through hole 171a of the moving body 171. In this embodiment, one through hole 130b of the chuck 130 is connected to the through hole 171a of the moving body 171 via the through hole 172a of the fixing member 172. The through hole 130b connected to the through hole 171a is formed in the center of the chuck 130.

[0066] 2, the holding mechanism 110 will be described. The holding mechanism 110 has a seal member 123a, a seal member 123b, and a seal member 123c. Each of the seal members 123a, 123b, and 123c is formed of an elastic member such as rubber. Each of the seal members 123a, 123b, and 123c is an O-ring, for example.

[0067] The seal member 123a is disposed in the seal groove 121c. When disposed in the seal groove 121c, the seal member 123a is in contact with the outer circumferential surface of the moving body 171. The seal member 123a provides a seal between the moving body 171 and the first member 121. The seal member 123b is disposed in the seal groove 121d. When disposed in the seal groove 121d, the seal member 123b is in contact with the inner circumferential surface of the partition wall 160. The seal member 123b provides a seal between the first member 121 and the partition wall 160. The seal member 123c is disposed in the seal groove 122c. When disposed in the seal groove 122c, the seal member 123c is in contact with the upper surface of the support wall 140. The seal member 123c provides a seal between the support wall 140 and the second member 122. Therefore, when the pressure in the space S is reduced by the suction mechanism 300, air can be prevented from flowing into the space S from between the moving body 171 and the first member 121, between the first member 121 and the partition wall 160, and between the support wall 140 and the second member 122.

[0068] The suction mechanism 300 is connected to the through holes 171a, 121b, and 122b, and sucks air. Specifically, the suction mechanism 300 has a pipe 301a connected to the through holes 171a, 121b, and 122b, a suction device 302, and a valve 310a. The suction device 302 is attached to, for example, a support frame SF (see FIG. 1) using a fastener such as a bolt (not shown). The suction device 302 has, for example, a suction pump or an exhaust fan. Note that the substrate holding device 100 does not have to have the suction device 302. For example, the pipe 301a may be connected to a suction device outside the substrate holding device 100. The valve 310a is provided in the pipe 301a, and switches the inside of the pipe 301a between an open state and a closed state.

[0069] When the suction device 302 is driven and the valve 310a is open, air in the space S is sucked through the through holes 121b and 122b, and the space S becomes negative pressure. Therefore, air flows into the space S from the through hole 130b connected to the space S in the chuck 130. Also, when the suction device 302 is driven and the valve 310a is open, air in the through hole 171a is sucked, and the through hole 171a becomes negative pressure. Therefore, air flows into the through hole 171a from the through hole 130b connected to the through hole 171a in the chuck 130. Therefore, when the suction device 302 is driven and the valve 310a is open, if the substrate W is brought close to the holding surface 130a of the chuck 130, the back surface Wb of the substrate W is adsorbed to the holding surface 130a of the chuck 130.

[0070] Next, the chuck 130 and the partition wall 160 will be further described with reference to FIG. 3. FIG. 3 is a schematic view of the chuck 130 of the substrate holding device 100 of the first embodiment from below. As shown in FIG. 2 and FIG. 3, the partition wall 160 divides the space S into a plurality of spaces. In this embodiment, the partition wall 160 divides the space S into two spaces S1 and S2. The space S1 is a circular space in the center of the space S. The space S2 is a substantially annular space located on the outside of the space S. In this embodiment, an example in which the space S is divided into two spaces S1 and S2 by one partition wall 160 will be described, but for example, the space S may be divided into three or more spaces by one or more partition walls 160.

[0071] Moreover, one or more through holes 130b of the chuck 130 are formed at a position radially inward of the partition wall 160 of the chuck 130. In other words, the one or more through holes 130b connect the space S1 to the external space. In this embodiment, the multiple through holes 130b are formed at a position radially inward of the partition wall 160 of the chuck 130.

[0072] Moreover, one or more through holes 130b of the chuck 130 are formed at a position radially outward from the partition wall 160 of the chuck 130. In other words, the one or more through holes 130b connect the space S2 to the external space. In this embodiment, the multiple through holes 130b are formed at a position radially outward from the partition wall 160 of the chuck 130.

[0073] In this embodiment, the through hole 130b includes a through hole 130d and a plurality of through holes 130e through which the suction pin 400 is inserted, and a plurality of through holes 130f through which the suction pin 400 is not inserted. In this embodiment, the through hole 130d is formed in the center of the chuck 130. The plurality of through holes 130e are formed on the periphery of the chuck 130.

[0074] Next, the plurality of suction pins 400 will be described with reference to FIG. 4 and FIG. 5. FIG. 4 is a schematic cross-sectional view taken along line IV-IV in FIG. 3, showing a state in which the suction pins 400 are disposed at the protruding position P1. FIG. 5 is a schematic cross-sectional view taken along line IV-IV in FIG. 3, showing a state in which the suction pins 400 are disposed at the non-protruding position P2. As shown in FIG. 4, the plurality of suction pins 400 support the substrate W before it is held by the holding mechanism 110. In this embodiment, the plurality of suction pins 400 support the back surface Wb (here, the upper surface) of the substrate W. The plurality of suction pins 400 support the substrate W and deliver the substrate W to the holding mechanism 110. Specifically, the plurality of suction pins 400 have a plurality of suction pins 400 extending in the vertical direction. The plurality of suction pins 400 suction and hold the substrate W. The plurality of suction pins 400 deliver the substrate W to the holding mechanism 110. The plurality of suction pins 400 may deliver the substrate W from the transport device TR. In addition, the transport arm TA of the transport device TR may transport the substrate W to the holding mechanism 110 from another position.

[0075] The suction pins 400 are arranged at equal angular intervals in a plan view. The suction pins 400 suction and hold the back surface Wb (here, the upper surface) of the substrate W. Specifically, the suction pins 400 have a through hole (not shown) through which air passes. The suction mechanism 300 has a pipe 301b connected to the through hole of the suction pin 400 and a valve 310b that switches the inside of the pipe 301b between an open state and a closed state. The pipe 301b has, for example, a rubber tube. The suction pin 400 is connected to the pipe 301b by inserting an upper end (not shown) of the suction pin 400 into the rubber tube. When the suction mechanism 300 is driven and the valve 310b is opened, the air in the through hole of the suction pin 400 is sucked in, and the inside of the through hole of the suction pin 400 becomes negative pressure. Therefore, when the suction device 302 is driven and the valve 310b is open, the back surface Wb of the substrate W is attracted to the tip (here, the lower end) of the suction pin 400, and the suction device 302 is driven and the valve 310b is open.

[0076] The suction pins 400 have a central suction pin 400a and multiple (here, eight) peripheral suction pins 400b. The central suction pin 400a suctions and holds the center of the back surface Wb (here, the upper surface) of the substrate W. The multiple peripheral suction pins 400b suction and hold the outer periphery of the back surface Wb of the substrate W.

[0077] In this embodiment, one or more (here, eight) through holes 130e are located below through holes 122b. The outer periphery suction pin 400b is inserted through through holes 122b and through holes 130e. The center suction pin 400a is inserted through through holes 171a and the center through hole 130d.

[0078] The suction pins 400 are movable between, for example, a protruding position P1 (see FIG. 4) where they protrude downward from the holding surface 130a, and a non-protruding position P2 (see FIG. 5) where they do not protrude downward from the holding surface 130a. In this embodiment, the multiple (here, eight) outer periphery suction pins 400b are connected to each other by a connecting member (not shown). Therefore, all the outer periphery suction pins 400b move vertically as a unit. Meanwhile, the central suction pin 400a and the outer periphery suction pins 400b are configured to be able to move vertically separately.

[0079] As described above, the substrate holding device 100 has the pin actuator 450 that moves the suction pin 400 in the up-down direction. The pin actuator 450 is fixed to, for example, the upper surface 120b of the base 120. The pin actuator 450 is not particularly limited, but has, for example, a driving source such as a pump or a motor, and a transmission member such as a gear and / or a cam that transmits the driving force of the driving source to the upper part of the suction pin 400. When the pin actuator 450 is driven, the suction pin 400 moves in the up-down direction relative to the base 120. For example, when the pin actuator 450 moves the suction pin 400 to the protruding position P1, the suction pin 400 protrudes from the holding surface 130a and contacts the substrate W, and can receive the substrate W from the transport device TR. That is, the suction pin 400 adsorbs the substrate W at the protruding position P1. When the suction pin 400 receives the substrate W from the transport device TR, the suction pin 400 receives the substrate W in a state in which it protrudes from the holding surface 130a by, for example, 10 mm or more. At this time, the height positions of the tips of all the suction pins 400 are approximately constant. The substrate W may be warped by a maximum of several mm, but the substrate W is attracted to the suction pins 400 and adsorbed by the suction of air by the suction pins 400. Note that the height positions of the central suction pins 400a and the peripheral suction pins 400b may be made different from each other based on the warp information obtained by acquiring warp information of the substrate W. Also, for example, the pin actuator 450 moves the suction pins 400 from the protruding position P1 to the non-protruding position P2, so that the suction pins 400 do not protrude from the holding surface 130a. As a result, the substrate W is moved upward from a position below the holding surface 130a and contacts the holding surface 130a, and the substrate W is transferred from the suction pins 400 to the holding surface 130a.

[0080] The pin actuator 450 changes the amount of protrusion of at least one suction pin 400 relative to the amount of protrusion of the other suction pins 400, thereby changing the substrate W so as to conform to the holding surface 130a.

[0081] Specifically, the pin actuator 450 has a central pin actuator 450a and a peripheral pin actuator 450b. The central pin actuator 450a and the peripheral pin actuator 450b are fixed to, for example, the upper surface 120b of the base 120. The central pin actuator 450a moves the central suction pin 400a in the vertical direction relative to the base 120. The peripheral pin actuator 450b moves the peripheral suction pin 400b in the vertical direction relative to the base 120. In this embodiment, the peripheral pin actuator 450b moves all the peripheral suction pins 400b by the same amount. In order to prevent the drawings from becoming complicated, the pin actuators 450 (the central pin actuator 450a and the peripheral pin actuator 450b) may be omitted from FIG. 6 onwards, except when particularly necessary.

[0082] Next, deformation of the holding surface 130a of the chuck 130 will be described with reference to Fig. 6 and Fig. 7. Fig. 6 is a cross-sectional view that shows a state in which the holding surface 130a of the chuck 130 of the substrate holding device 100 of the first embodiment has a convex shape. Fig. 7 is a cross-sectional view that shows a state in which the holding surface 130a of the chuck 130 of the substrate holding device 100 of the first embodiment has a concave shape.

[0083] As shown in FIG. 6 and FIG. 7, in this embodiment, the chuck 130 can be deformed so that the holding surface 130a has a convex shape, and can also be deformed so that the holding surface 130a has a concave shape. The holding surface 130a having a convex shape means that the holding surface 130a is curved so that the center of the holding surface 130a protrudes in a direction toward the substrate W (here, downward), as shown in FIG. 6. In other words, the convex shape of the holding surface 130a indicates a shape in which the center of the holding surface 130a protrudes in a direction toward the substrate W. The holding surface 130a having a concave shape means that the holding surface 130a is curved so that the center of the holding surface 130a is concave in a direction away from the substrate W (here, upward), as shown in FIG. In other words, the concave shape of the holding surface 130a indicates a shape in which the center of the holding surface 130a is concave in a direction away from the substrate W.

[0084] For example, when the driving mechanism 173 moves the movable body 171 downward relative to the base 120, the lower end of the movable body 171 is fixed to the center of the chuck 130 by the fixing member 172, and therefore, as the movable body 171 moves downward relative to the base 120, the center of the chuck 130 is pressed downward relative to the base 120. Therefore, in a state in which the outer circumferential edge of the chuck 130 is fixed by the fixing ring 150, the center of the chuck 130 is pressed downward. Therefore, since the chuck 130 can bend, the chuck 130 is deformed to have a convex shape in the downward direction. As a result, the holding surface 130a becomes convex (see FIG. 6).

[0085] Also, for example, when the driving mechanism 173 moves the movable body 171 upward relative to the base 120, since the lower end of the movable body 171 is fixed to the center of the chuck 130 by the fixing member 172, the central part of the chuck 130 is pulled upward relative to the base 120 as the movable body 171 moves upward relative to the base 120. Therefore, in a state in which the outer peripheral edge part of the chuck 130 is fixed by the fixing ring 150, the central part of the chuck 130 is pulled upward. Therefore, since the chuck 130 is flexible, the chuck 130 is deformed to have a concave shape in the upward direction. As a result, the holding surface 130a becomes concave (see FIG. 7).

[0086] Next, the substrate holding apparatus 100 will be further described with reference to Fig. 8. Fig. 8 is a block diagram showing the configuration of the substrate holding apparatus 100 of the first embodiment.

[0087] In this embodiment, the substrate holding apparatus 100 has a control device 190. The control device 190 controls the substrate holding apparatus 100. The control device 190 controls the deformation mechanism 170. In this embodiment, the control device 190 controls the deformation mechanism 170, the suction mechanism 300, and the pin actuator 450.

[0088] The control device 190 includes a control unit 191 and a storage unit 193. The control unit 191 has a processor. The control unit 191 has, for example, a central processing unit (CPU). Alternatively, the control unit 191 may have a general-purpose computer.

[0089] The storage unit 193 stores data and computer programs. The data defines, for example, the process content and the process procedure for holding the substrate W.

[0090] The storage unit 193 includes a main storage device and an auxiliary storage device. The main storage device is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and / or a hard disk drive. The storage unit 193 may include a removable medium. The control unit 191 executes a computer program stored in the storage unit 193 to perform a substrate holding operation.

[0091] The control unit 191 causes the deformation mechanism 170 to deform the chuck 130 so that the holding surface 130a has a concave or convex shape. The control unit 191 may control the deformation mechanism 170 based on a detection result from a detection unit (not shown) that detects the force of the deformation mechanism 170 or the amount of movement of the moving body 171.

[0092] The control unit 191 acquires warpage information of the holding surface 130a. The warpage information includes information on at least the warpage direction of the holding surface 130a. That is, the warpage information includes information on whether the holding surface 130a is convex, concave, or flat. In this embodiment, the warpage information includes information on the warpage amount of the holding surface 130a in addition to information on the warpage direction of the holding surface 130a.

[0093] The warpage information includes, for example, information indicating the height position of the moving body 171. The warpage information may include, for example, information indicating the height position of the base 120 in addition to the information indicating the height position of the moving body 171. The warpage information may include, for example, information indicating the relative height position of the moving body 171 with respect to the base 120. The warpage information may include, for example, information regarding a control signal transmitted from the control unit 191 to the driving mechanism 173 when the control unit 191 moves the moving body 171 by the driving mechanism 173. Alternatively, the warpage information may be transmitted to the control device 190 from a warpage detection sensor that detects the warpage of the holding surface 130a. For example, the storage unit 193 stores the warpage information, and the control unit 191 acquires the warpage information from the storage unit 193.

[0094] Furthermore, based on the warpage information, the control unit 191 causes the pin actuator 450 to change the protrusion amount of at least one suction pin 400 relative to the protrusion amounts of the other suction pins 400, thereby curving the substrate W to fit along the holding surface 130a. In other words, the control unit 191 changes the protrusion amount of at least one suction pin 400 relative to the protrusion amounts of the other suction pins 400, thereby curving the substrate W in the same direction as the holding surface 130a.

[0095] Specifically, when the warpage information indicates that the holding surface 130a is concave, for example, the control unit 191 bends the substrate W by the pin actuator 450 so that the center of the back surface Wb (here, the upper surface) of the substrate W is convex and protrudes in a direction toward the chuck 130. Then, the control unit 191 holds the back surface Wb of the substrate W by the chuck 130 with the back surface Wb in a convex state. Here, making the back surface Wb convex means that the substrate W is curved so that the center of the back surface Wb protrudes in a direction toward the chuck 130 (here, upward). Making the back surface Wb convex means that the front surface Wa is concave. Making the front surface Wa concave means that the substrate W is curved so that the center of the front surface Wa is concave in a direction toward the chuck 130 (here, upward).

[0096] Furthermore, when the warpage information indicates that the holding surface 130a is convex, for example, the control unit 191 causes the pin actuator 450 to bend the substrate W such that the center of the back surface Wb (here, the upper surface) of the substrate W is concave in a direction away from the chuck 130. Then, the control unit 191 causes the chuck 130 to hold the back surface Wb of the substrate W in a state in which the back surface Wb is concave. Here, making the back surface Wb concave means that the substrate W is curved such that the center of the back surface Wb is concave in a direction away from the chuck 130 (here, downward). Making the back surface Wb concave means that the front surface Wa is convex. Making the front surface Wa convex means that the substrate W is curved such that the center of the front surface Wa protrudes in a direction away from the chuck 130 (here, downward).

[0097] More specifically, the control unit 191 brings the center of the back surface Wb (here, the upper surface) of the substrate W into point contact with the center of the holding surface 130a (here, the lower surface) of the chuck 130. At this time, for example, when the warpage information indicates that the holding surface 130a is concave, the control unit 191 brings the back surface Wb of the substrate W into point contact with the holding surface 130a in a state in which the back surface Wb is convex and the curvature of the substrate W is larger than the curvature of the holding surface 130a. Note that, when the warpage information indicates that the holding surface 130a is convex, the control unit 191 brings the back surface Wb of the substrate W into contact with the holding surface 130a in a concave, flat, or convex state.

[0098] Thereafter, the control unit 191 causes the pin actuator 450 to move the suction pins 400 to deform the substrate W so that the back surface Wb (here, the upper surface) of the substrate W comes into close contact with the holding surface 130a. At this time, the control unit 191 causes the pin actuator 450 to make the curvature of the back surface Wb the same as the curvature of the holding surface 130a. As a result, the entire back surface Wb of the substrate W comes into close contact with the holding surface 130a. Therefore, the back surface Wb of the substrate W is held by the holding surface 130a. Note that the curvature is a value indicating the degree of bending of a curved surface. As the curvature increases, the radius of curvature decreases.

[0099] Next, a substrate holding method by the substrate holding device 100 of this embodiment will be described with reference to Figs. 9 to 11. Fig. 9 is a flow chart showing a substrate holding method by the substrate holding device 100 of the first embodiment. Fig. 10 is a schematic cross-sectional view for explaining a method for holding the substrate W by the chuck 130 whose holding surface 130a is concave. Fig. 11 is a schematic cross-sectional view for explaining a method for holding the substrate W by the chuck 130 whose holding surface 130a is convex. In this embodiment, the substrate holding method by the substrate holding device 100 includes steps S11 to S13. Step S11 is an example of the "step of holding by suction pins" of the present invention. Step S13 is an example of the "step of holding the substrate by the chuck" and the "step of holding the first substrate by the first chuck" of the present invention.

[0100] As shown in FIG. 9, in step S11, the control unit 191 holds the substrate W by the suction pins 400. Specifically, in a state where the substrate W is disposed below the holding surface 130a by the transport device TR, the control unit 191 controls the pin actuator 450 to make the plurality of suction pins 400 protrude downward from the holding surface 130a. At this time, the control unit 191 causes the plurality of suction pins 400 to contact or approach the back surface Wb (here, the upper surface) of the substrate W by the pin actuator 450. In addition, the control unit 191 switches the valve 310b from the closed state to the open state while driving the suction device 302. As a result, the plurality of suction pins 400 suction the back surface Wb (here, the upper surface) of the substrate W to lift the substrate W, and the plurality of suction pins 400 hold the substrate W held by the transport device TR. Note that the timing of switching the valve 310b from the closed state to the open state may be, for example, before, after, or simultaneously with the timing when the suction pins 400 contact or approach the back surface Wb of the substrate W.

[0101] Next, in step S12, the control unit 191 acquires the warpage information. Specifically, the control unit 191 acquires the warpage information from the storage unit 193.

[0102] Next, in step S13, the control unit 191 causes the pin actuator 450 to deform the substrate W. Specifically, the control unit 191 changes the amount of protrusion of one of the central suction pins 400a and the peripheral suction pins 400b relative to the amount of protrusion of the other of the central suction pins 400a and the peripheral suction pins 400b using the pin actuator 450 based on the warp information, thereby curving the substrate W to conform to the holding surface 130a. Specifically, for example, the control unit 191 does not drive the peripheral pin actuator 450b but drives the central pin actuator 450a to move the central suction pins 400a in the vertical direction relative to the peripheral suction pins 400b, thereby deforming the substrate W. In this embodiment, curving the substrate W along the holding surface 130a means, for example, curving the substrate W so that the back surface Wb of the substrate W has an upward convex shape when the holding surface 130a has an upward concave shape, and curving the substrate W so that the back surface Wb of the substrate W has a downward convex shape when the holding surface 130a has a downward convex shape. Note that the control unit 191 may deform the substrate W by the pin actuator 450 so that the substrate W becomes planar based on the warpage information.

[0103] 10, when the warpage information indicates that the holding surface 130a (here, the lower surface) of the chuck 130 has a concave shape (see the upper part of FIG. 10), the control unit 191 moves the suction pins 400 by the pin actuator 450 so that the back surface Wb (here, the upper surface) of the substrate W has a convex shape. Specifically, the control unit 191 moves the central suction pins 400a upward relative to the outer periphery suction pins 400b. At this time, the control unit 191 deforms the substrate W so that the curvature of the back surface Wb of the substrate W becomes larger than the curvature of the holding surface 130a.

[0104] Then, the control unit 191 moves the suction pins 400 upward relative to the base 120 by the pin actuator 450, so that the substrate W comes into contact with the holding surface 130a (see the middle part of FIG. 10). At this time, the control unit 191 moves the central suction pins 400a and the peripheral suction pins 400b simultaneously by the same amount by the pin actuator 450, so that the curvature of the substrate W does not change. As a result, the center of the back surface Wb (here, the upper surface) of the substrate W comes into point contact with the center of the holding surface 130a (here, the lower surface) of the chuck 130. Therefore, the center of the substrate W is sucked by the through hole 130b located at the center of the chuck 130. At this time, the central suction pin 400a is located at the non-protruding position P2, and the peripheral suction pins 400b are located at the protruding position P1.

[0105] Thereafter, the control unit 191 makes the curvature of the substrate W the same as that of the holding surface 130a (see the lower part of FIG. 10). Specifically, the control unit 191 moves the outer periphery suction pins 400b upward with respect to the base 120 by the pin actuator 450. As a result, when the curvature of the back surface Wb of the substrate W becomes the same as that of the holding surface 130a, the entire back surface Wb of the substrate W is suctioned to the holding surface 130a. At this time, the outer periphery suction pins 400b are located at the non-protruding position P2. Also, at this time, the back surface Wb of the substrate W gradually comes into contact with the holding surface 130a from the center of the substrate W toward the radially outer side. Specifically, after the through hole 130d at the center of the chuck 130 suctions the substrate W, the through hole 130f radially outer than the through hole 130d suctions the substrate W, and then the through hole 130e at the outer periphery of the chuck 130 suctions the substrate W. This makes it possible to prevent air from entering between the rear surface Wb of the substrate W and the holding surface 130a.

[0106] In this manner, the substrate W is held by the substrate holding device 100 .

[0107] Also, for example, as shown in FIG. 11, when the warpage information indicates that the holding surface 130a (here, the lower surface) of the chuck 130 has a convex shape (see the upper part of FIG. 11), the control unit 191 moves the suction pins 400 by the pin actuators 450 so that the back surface Wb (here, the upper surface) of the substrate W has a concave shape. Specifically, the control unit 191 moves the outer periphery suction pins 400b upward relative to the central suction pins 400a. At this time, the control unit 191 deforms the substrate W so that the curvature of the back surface Wb of the substrate W is smaller than the curvature of the holding surface 130a. Also, when the warpage information indicates that the holding surface 130a has a convex shape, the control unit 191 may deform the substrate W by the pin actuators 450 so that the back surface Wb of the substrate W has a flat shape. Furthermore, when the warpage information indicates that the holding surface 130a has a convex shape, the control unit 191 may deform the substrate W using the pin actuator 450 so that the rear surface Wb of the substrate W has a convex shape.

[0108] Then, the control unit 191 moves the suction pins 400 upward relative to the base 120 by the pin actuator 450, so that the substrate W comes into contact with the holding surface 130a (see the middle part of FIG. 11). At this time, the control unit 191 moves the central suction pins 400a and the peripheral suction pins 400b simultaneously by the same amount by the pin actuator 450, so that the curvature of the substrate W does not change. As a result, the center of the back surface Wb (here, the upper surface) of the substrate W comes into point contact with the center of the holding surface 130a (here, the lower surface) of the chuck 130. Therefore, the center of the substrate W is sucked by the through hole 130b located at the center of the chuck 130. At this time, the central suction pin 400a is located at the non-protruding position P2, and the peripheral suction pins 400b are located at the protruding position P1.

[0109] Thereafter, the control unit 191 makes the back surface Wb of the substrate W concave and the curvature of the back surface Wb of the substrate W the same as the curvature of the holding surface 130a (see the lower part of FIG. 11). Specifically, the control unit 191 moves the outer periphery suction pin 400b upward with respect to the base 120. As a result, when the curvature of the back surface Wb of the substrate W becomes the same as the curvature of the holding surface 130a, the entire back surface Wb of the substrate W is sucked to the holding surface 130a. At this time, the outer periphery suction pin 400b is located at the non-protruding position P2. Also, at this time, the back surface Wb of the substrate W gradually contacts the holding surface 130a from the center of the substrate W toward the radially outer side. Specifically, after the through hole 130d at the center of the chuck 130 sucks the substrate W, the through hole 130f radially outer than the through hole 130d sucks the substrate W, and then the through hole 130e at the outer periphery of the chuck 130 sucks the substrate W. This makes it possible to prevent air from entering between the rear surface Wb of the substrate W and the holding surface 130a.

[0110] In this manner, the substrate W is held by the substrate holding device 100 .

[0111] In addition, when the warpage information indicates that the holding surface 130a of the chuck 130 is flat, the control unit 191 executes processing in the same manner as when the warpage information indicates that the holding surface 130a of the chuck 130 is concave (see FIG. 10).

[0112] As described above with reference to FIGS. 1 to 11, in this embodiment, the pin actuator 450 changes the protruding amount of at least one suction pin 400 relative to the protruding amount of the other suction pins 400, thereby curving the substrate W along the holding surface 130a. Then, the pin actuator 450 moves the plurality of suction pins 400 from the protruding position P1 to the non-protruding position P2, thereby causing the chuck 130 to hold the substrate W. Therefore, the chuck 130 can hold the substrate W in a state in which the substrate W is curved along the holding surface 130a. This can prevent a gap from being generated between the substrate W and the holding surface 130a. In other words, it can prevent the substrate W from being partially bent on the holding surface 130a.

[0113] As described above, the central pin actuator 450a and the peripheral pin actuator 450b move at least one of the central suction pins 400a and the peripheral suction pins 400b to change the amount of protrusion of one of the central suction pins 400a and the peripheral suction pins 400b relative to the amount of protrusion of the other of the central suction pins 400a and the peripheral suction pins 400b, thereby curving the substrate W to follow the holding surface 130a. Therefore, the central pin actuator 450a and the peripheral pin actuator 450b can easily curve the substrate W.

[0114] As described above, when the central pin actuator 450a and the peripheral pin actuator 450b move the central suction pin 400a and the peripheral suction pin 400b from the protruding position P1 to the non-protruding position P2, the central pin actuator 450a and the peripheral pin actuator 450b move the central suction pin 400a to the non-protruding position P2 and then move the peripheral suction pin 400b to the non-protruding position P2. Therefore, the central part of the back surface Wb of the substrate W is brought into point contact with the holding surface 130a, and then the entire surface of the back surface Wb of the substrate W can be brought into contact with the holding surface 130a. At this time, the substrate W is sucked in order from the central through-hole 130d of the chuck 130 to the through-hole 130e of the peripheral part. This can further prevent a gap from being generated between the substrate W and the holding surface 130a.

[0115] As described above, the first substrate holding device 100 includes the deformation mechanism 170 that deforms the chuck 130 so that the holding surface 130a has a convex shape and that deforms the chuck 130 so that the holding surface 130a has a concave shape. Therefore, the holding surface 130a can be easily deformed into a convex shape or a concave shape. When the holding surface 130a has a convex shape, the pin actuator 450 bends the substrate W so that the center of the back surface Wb is recessed in a direction away from the chuck 130 (here, downward). When the holding surface 130a has a concave shape, the pin actuator 450 bends the substrate W so that the center of the back surface Wb protrudes toward the chuck 130 (here, upward). Therefore, whether the holding surface 130a has a convex shape or a concave shape, the substrate W can be easily curved along the holding surface 130a by the pin actuator 450.

[0116] Furthermore, as described above, the control unit 191 acquires warpage information. Then, based on the warpage information, the control unit 191 changes the protrusion amount of at least one suction pin 400 with respect to the protrusion amounts of the other suction pins 400 using the pin actuator 450, thereby curving the substrate W so as to conform to the holding surface 130a. Therefore, since the substrate W can be curved based on the warpage information, the substrate W can be easily curved so as to conform to the holding surface 130a.

[0117] Furthermore, as described above, when the warpage information indicates that the holding surface 130a is concave, the control unit 191 causes the pin actuator 450 to bend the substrate W so that the center of the back surface Wb protrudes toward the chuck 130 (here, upward). Therefore, when the holding surface 130a is concave, the substrate W can be easily bent to fit the holding surface 130a.

[0118] Furthermore, as described above, when the warpage information indicates that the holding surface 130a is concave, the control unit 191 bends the substrate W so that the center of the back surface Wb protrudes toward the chuck 130 (here, upward) by the pin actuator 450, and after the center of the back surface Wb of the substrate W is brought into point contact with the center of the holding surface 130a, the control unit 191 makes the curvature of the back surface Wb the same as the curvature of the holding surface 130a by the pin actuator 450. Therefore, when the holding surface 130a is concave, it is possible to easily bring the center of the back surface Wb of the substrate W into point contact with the holding surface 130a, and then to bring the entire surface of the back surface Wb of the substrate W into contact with the holding surface 130a. Therefore, it is possible to easily and more effectively prevent a gap from being generated between the substrate W and the holding surface 130a.

[0119] Furthermore, by holding the substrate W by the holding surface 130a in a concave state, when the back surface Wb of the substrate W gradually comes into contact with the holding surface 130a from the center toward the outside in the radial direction, a restoring force acts on the back surface Wb of the substrate W to return it from a convex shape to a flat shape. Therefore, by utilizing the restoring force of the substrate W, the entire surface of the substrate W from the center to the outer end can be easily brought into close contact with the holding surface 130a.

[0120] Second embodiment A bonding apparatus 1 according to a second embodiment of the present invention will be described with reference to Fig. 12 to Fig. 23. Fig. 12 is a side view that shows a schematic diagram of the bonding apparatus 1 according to the second embodiment. However, in Fig. 12, in order to prevent the drawing from becoming complicated, only three first suction pins 400 of the substrate holding device 100 are drawn, similar to Fig. 1 of the first embodiment, and only three second suction pins 410 of the second substrate holding device 200 are drawn in accordance with Fig. 14.

[0121] 12, the bonding apparatus 1 according to the second embodiment includes a substrate holding device 100 (hereinafter, referred to as a first substrate holding device 100) and a second substrate holding device 200 disposed opposite the first substrate holding device 100. In the second embodiment, for ease of understanding, the substrate holding device 100 of the first embodiment will be described as the first substrate holding device 100.

[0122] In the following description, for ease of understanding, the substrate W, support stand SB, holding mechanism 110, base 120, chuck 130, holding surface 130a, deformation mechanism 170 and moving body 171 of the first embodiment will be respectively referred to as first substrate W1, first support stand SB1, first holding mechanism 110, first base 120, first chuck 130, first holding surface 130a, first deformation mechanism 170 and first moving body 171. In addition, the suction pins 400, central suction pins 400a, outer periphery suction pins 400b, pin actuator 450, central pin actuator 450a and outer periphery pin actuator 450b of the first embodiment will be respectively referred to as first suction pins 400, first central suction pins 400a, first outer periphery suction pins 400b, first pin actuator 450, first central pin actuator 450a and first outer periphery pin actuator 450b.

[0123] In this embodiment, the first substrate holding device 100 does not include a support frame SF, a suction mechanism 300, and a control device 190, and the bonding apparatus 1 includes a support frame SF, a suction mechanism 300, and a control device 190. Other configurations of the first substrate holding device 100 are similar to those of the substrate holding device 100 of the first embodiment.

[0124] The bonding apparatus 1 bonds a first substrate W1 held by a first substrate holding device 100 and a second substrate W2 held by a second substrate holding device 200. The bonding apparatus 1 includes a support frame SF, the first substrate holding device 100, the second substrate holding device 200, a first movement mechanism 610, and a second movement mechanism 620.

[0125] The support frame SF is fixed to a floor (not shown) on which the bonding apparatus 1 is installed. The support frame SF supports the first substrate holding device 100. In this embodiment, the support frame SF has a horizontal rail SF3 that guides the first substrate holding device 100 in the horizontal direction and a vertical rail SF4 that guides the first substrate holding device 100 in the up-down direction. For example, two horizontal rails SF3 and two vertical rails SF4 are provided. The horizontal rail SF3 extends, for example, in the X direction. The two horizontal rails SF3 are fixed to two second frames SF2 that extend in the X direction, respectively. The two vertical rails SF4 are attached to two horizontal rails SF3, respectively. The vertical rails SF4 are configured to be movable in the X direction along the horizontal rails SF3. The other configurations of the support frame SF are the same as those of the first embodiment.

[0126] In this embodiment, the first substrate holding device 100 is configured to be movable relative to the second substrate holding device 200. Specifically, the first support stand SB1 of the first substrate holding device 100 is supported by a vertical rail SF4 and moves horizontally along the horizontal rail SF3 together with the vertical rail SF4. The first support stand SB1 also moves up and down along the vertical rail SF4. As the first support stand SB1 moves, the first holding mechanism 110, the first base 120, the first chuck 130, the first holding surface 130a, the first deformation mechanism 170, and the first movable body 171 also move horizontally and up and down.

[0127] In this embodiment, the second substrate holding device 200 is disposed below the first substrate holding device 100. The second substrate holding device 200 is provided so as to be upside down the first substrate holding device 100. Note that the first substrate holding device 100 and the second substrate holding device 200 may be disposed upside down. The configuration of the second substrate holding device 200 will be described later.

[0128] The first moving mechanism 610 is fixed to, for example, the horizontal rail SF3. The first moving mechanism 610 may be fixed to the second frame SF2. The first moving mechanism 610 moves the first substrate holding device 100 in the horizontal direction. In this embodiment, the first moving mechanism 610 moves the first substrate holding device 100 in the horizontal direction together with the vertical rail SF4. The first moving mechanism 610 has an actuator. The first moving mechanism 610 is not particularly limited, but has, for example, a driving source such as a pump or a motor, and a transmission member such as a gear that transmits the driving force of the driving source to the vertical rail SF4 or the first support stand SB1. The first moving mechanism 610 may move the second substrate holding device 200, or may move both the first substrate holding device 100 and the second substrate holding device 200.

[0129] The second moving mechanism 620 is fixed to, for example, a vertical rail SF4. The second moving mechanism 620 moves the first substrate holding device 100 in the up-down direction. The second moving mechanism 620 has an actuator. The second moving mechanism 620 is not particularly limited, but has, for example, a driving source such as a pump or a motor, and a transmission member such as a gear that transmits the driving force of the driving source to the first support stand SB1. The second moving mechanism 620 may move the second substrate holding device 200, or may move both the first substrate holding device 100 and the second substrate holding device 200.

[0130] 12, the second substrate holding device 200 will be described. The second substrate holding device 200 includes a second support stand SB2, a second holding mechanism 210, a second deformation mechanism 270, a plurality of second suction pins 410, and a second pin actuator 460.

[0131] The second support stand SB2 is configured not to move in the vertical and horizontal directions. Specifically, the second support stand SB2 is fixed to a floor (not shown) on which the bonding apparatus 1 is installed. The support frame SF may have a floor material, and the second support stand SB2 may be fixed to the floor material of the support frame SF.

[0132] The second support stand SB2 is made of a material that is not easily deformed by the weight and heat of the second holding mechanism 210. The second support stand SB2 is made of, for example, a stone material or a metal frame. The outer shape of the second support stand SB2 has, for example, a substantially rectangular parallelepiped shape. The second support stand SB2 has a substantially rectangular parallelepiped through hole SBa that penetrates in the vertical direction. In other words, the second support stand SB2 is formed in a rectangular ring shape that extends in the vertical direction.

[0133] In this embodiment, the second support stand SB2 supports the second holding mechanism 210 and the multiple second suction pins 410. The second support stand SB2 supports the second holding mechanism 210 from below. The outer periphery of the second holding mechanism 210 is fixed to the second support stand SB2 by fasteners such as bolts (not shown).

[0134] The second holding mechanism 210 holds the second substrate W2 by suction. The second holding mechanism 210 holds the second substrate W2 substantially horizontally.

[0135] In this embodiment, the second holding mechanism 210 holds the second substrate W2 from below. In addition, the second holding mechanism 210 holds the back surface Wb of the second substrate W2 by suction. Therefore, when the second substrate W2 is held by the second holding mechanism 210, the back surface Wb of the second substrate W2 is the lower surface, and the front surface Wa of the second substrate W2 is the upper surface. When the second substrate W2 is not held by the second holding mechanism 210, it goes without saying that the second substrate W2 can be turned upside down. However, in this embodiment, in order to facilitate understanding, the second substrate W2 is not turned upside down unless otherwise specified. In other words, in this embodiment, regardless of whether the second substrate W2 is held by the second holding mechanism 210 or not, the front surface Wa of the second substrate W2 is the upper surface, and the back surface Wb of the second substrate W2 is the lower surface.

[0136] A portion of the second deformation mechanism 270 is attached to, for example, the lower portion of the second holding mechanism 210 using a fastener (not shown) such as a bolt. Specifically, the second deformation mechanism 270 has a second moving body 271 and a driving mechanism 273, as described later. The driving mechanism 273 is attached to the lower portion of the second holding mechanism 210 using a fastener (not shown) such as a bolt. The second deformation mechanism 270 has a function of deforming a portion of the second holding mechanism 210. The driving mechanism 273 may be attached to the second support stand SB2. The configuration of the second deformation mechanism 270 will be described later.

[0137] A part of the suction mechanism 300 is attached to, for example, the first frame SF1 of the support frame SF using fasteners (not shown) such as bolts. The suction mechanism 300 is a device for adsorbing the first substrate W1 and the second substrate W2 to the first holding mechanism 110 and the second holding mechanism 210, respectively, and sucks air. Note that a part of the suction mechanism 300 may be attached to the first support stand SB1 or the second support stand SB2, or may be attached to the second frame SF2 of the support frame SF, or may be placed on a floor (not shown) on which the bonding apparatus 1 is installed. The configuration of the suction mechanism 300 and a suction method by the suction mechanism 300 will be described later.

[0138] The multiple second suction pins 410 are arranged to penetrate the second holding mechanism 210 in the vertical direction, and are provided to be movable in the vertical direction relative to the second holding mechanism 210. The multiple second suction pins 410 support the second substrate W2 before it is held by the second holding mechanism 210. The multiple second suction pins 410 support the back surface Wb of the second substrate W2 by suction. The multiple second suction pins 410 support the second substrate W2 from below. The multiple second suction pins 410 receive the second substrate W2 from the transport arm TA of the transport device TR.

[0139] Furthermore, the multiple second suction pins 410 transfer the second substrate W2 received from the transport device TR to the second holding mechanism 210. The configuration of the multiple second suction pins 410 will be described later.

[0140] Second pin actuator 460 is attached, for example, to the lower part of second holding mechanism 210 using a fastener (not shown) such as a bolt. Second pin actuator 460 drives the plurality of second suction pins 410. By second pin actuator 460 driving the plurality of second suction pins 410, the plurality of second suction pins 410 can receive second substrate W2 from transport device TR and deliver second substrate W2 to second holding mechanism 210. Note that second pin actuator 460 may be attached to second support stand SB2. The configuration of second pin actuator 460 will be described later.

[0141] Next, the first substrate holding device 100 and the second substrate holding device 200 will be further described with reference to FIG. 13. FIG. 13 is a cross-sectional view that shows a schematic diagram of the first substrate holding device 100 and the second substrate holding device 200 of the bonding apparatus 1 of the second embodiment. In FIG. 13, the first suction pin 400 and the second suction pin 410 are omitted for ease of understanding. As shown in FIG. 13, the second holding mechanism 210 of the second substrate holding device 200 suctions and holds the second substrate W2. The second holding mechanism 210 holds the second substrate W2 approximately horizontally. The second substrate W2 is configured similarly to the first substrate W1. However, the second substrate W2 is held by the second substrate holding device 200 with the front surface Wa facing upward and the back surface Wb facing downward.

[0142] The second holding mechanism 210 has a second base 220, a second chuck 230, a support wall 140, a fixing ring 150, and a partition wall 160. The second base 220 has a substantially circular shape in a plan view. The second base 220 is, for example, a plate. The second base 220 has an upper surface 220a and a lower surface 220b. Similarly to the first base 120, the second base 220 has a first member 121 and a second member 122. The upper surface 220a and the lower surface 220b are disposed substantially horizontally.

[0143] The second chuck 230 has a substantially circular shape in a plan view. The second chuck 230 is, for example, a plate. The second chuck 230 is disposed above the second base 220. The second chuck 230 is smaller than the second base 220, and the lower surface of the second chuck 230 faces the upper surface 220a of the second base 220. The second chuck 230 is disposed substantially parallel to the second base 220 at a predetermined distance (for example, 5 mm or more) from the second base 220. The second chuck 230 is formed of, for example, ceramic, resin, metal, or synthetic rubber, and can bend by about several mm to 10 mm.

[0144] The second chuck 230 has a second holding surface 230a and a back surface 230c located on the opposite side to the second holding surface 230a. The second holding surface 230a holds the back surface Wb (here, the bottom surface) of the second substrate W2. In this embodiment, the second holding surface 230a is the upper surface of the second chuck 230, and the back surface 230c is the bottom surface of the second chuck 230. The back surface Wb (here, the bottom surface) of the second substrate W2 is the surface that comes into contact with the second chuck 230.

[0145] The second deformation mechanism 270 deforms the second holding mechanism 210. In this embodiment, the second deformation mechanism 270 deforms the second chuck 230 so that the center of the second holding surface 230a has a convex shape that protrudes in a direction toward the second substrate W2 (here, upward). The second deformation mechanism 270 deforms the second chuck 230 so that the center of the second holding surface 230a has a concave shape that is concave in a direction away from the second substrate W2 (here, downward). That is, the second deformation mechanism 270 deforms the second chuck 230 so that the second holding surface 230a has a convex shape, or deforms the second chuck 230 so that the second holding surface 230a has a concave shape. Hereinafter, when the second holding surface 230a is curved such that the center of the second holding surface 230a protrudes in a direction toward the second substrate W2 (here, upward), it may be described as the second holding surface 230a having a convex shape. Also, when the second holding surface 230a is curved such that the center of the second holding surface 230a is recessed in a direction away from the second substrate W2 (here, downward), it may be described as the second holding surface 230a having a concave shape. In this embodiment, the second deformation mechanism 270 has a second movable body 271 fixed to the center of the second chuck 230. The second movable body 271 includes a pipe having a through hole 171a.

[0146] In this embodiment, the second deformation mechanism 270 has a drive mechanism 273 that moves the second moving body 271 in the vertical direction relative to the second base 220. In order to prevent the drawings from becoming complicated, the drive mechanism 273 may be omitted in FIG. 14 and subsequent figures, except when particularly necessary. The drive mechanism 273 has an actuator. The drive mechanism 273 of the second deformation mechanism 270 is configured similarly to the drive mechanism 173 of the first deformation mechanism 170. The drive mechanism 273 is fixed to, for example, the lower surface 220b of the second base 220. The drive mechanism 273 is driven to move the second moving body 271 in the vertical direction relative to the second base 220. This causes the second chuck 230 to deform.

[0147] Specifically, for example, when the driving mechanism 273 moves the second moving body 271 upward relative to the second base 220, the upper end of the second moving body 271 is fixed to the center of the second chuck 230 by the fixing member 172, and therefore, as the second moving body 271 moves upward relative to the second base 220, the center of the second chuck 230 is pressed upward relative to the second base 220. Therefore, in a state in which the outer peripheral edge of the second chuck 230 is fixed by the fixing ring 150, the center of the second chuck 230 is pressed upward. Therefore, since the second chuck 230 can bend, the second chuck 230 is deformed to have a convex shape in the upward direction. Therefore, the second holding surface 230a becomes a convex shape.

[0148] Also, for example, when the driving mechanism 273 moves the second moving body 271 downward relative to the second base 220, since the upper end of the second moving body 271 is fixed to the center of the second chuck 230 by the fixing member 172, the center of the second chuck 230 is pulled downward relative to the second base 220 as the second moving body 271 moves downward relative to the second base 220. Therefore, in a state in which the outer circumferential edge of the second chuck 230 is fixed by the fixing ring 150, the center of the second chuck 230 is pulled downward. Therefore, since the second chuck 230 is flexible, the second chuck 230 is deformed to become concave in the downward direction. Therefore, the second holding surface 230a becomes concave.

[0149] In this embodiment, the maximum curvature of the first holding surface 130a of the first substrate holding device 100 in the convex shape is larger than the maximum curvature of the first holding surface 130a in the concave shape. In other words, the maximum curvature that the first holding surface 130a can have when the first holding surface 130a is convex is larger than the maximum curvature that the first holding surface 130a can have when the first holding surface 130a is concave. Note that the maximum curvature of the first holding surface 130a in the convex shape may be smaller than or the same as the maximum curvature of the first holding surface 130a in the concave shape.

[0150] Similarly, the maximum curvature of the second holding surface 230a of the second substrate holding device 200 in the convex shape is greater than the maximum curvature of the second holding surface 230a in the concave shape. In other words, the maximum curvature that the second holding surface 230a can have when the second holding surface 230a is convex is greater than the maximum curvature that the second holding surface 230a can have when the second holding surface 230a is concave. The maximum curvature of the second holding surface 230a in the convex shape may be smaller than or the same as the maximum curvature of the second holding surface 230a in the concave shape.

[0151] In this embodiment, the maximum curvature of the convex shape of the first holding surface 130a is approximately the same as the maximum curvature of the convex shape of the second holding surface 230a. Also, the maximum curvature of the concave shape of the first holding surface 130a is approximately the same as the maximum curvature of the concave shape of the second holding surface 230a.

[0152] In this embodiment, the suction mechanism 300 (see FIG. 12) of the bonding apparatus 1 is connected to the through holes 171a, 121b, and 122b of the first substrate holding device 100 and the second substrate holding device 200, and sucks air. Specifically, the suction mechanism 300 has a pipe 301a connected to the through holes 171a, 121b, and 122b of the first substrate holding device 100, a pipe 301c connected to the through holes 171a, 121b, and 122b of the second substrate holding device 200, and a suction device 302 (see FIG. 12). The suction device 302 is attached to, for example, the first frame SF1 (see FIG. 12) of the support frame SF using a fastener (not shown) such as a bolt.

[0153] In this embodiment, the suction mechanism 300 has an adjustment unit 303a, an adjustment unit 303b, and an adjustment unit 303c. The adjustment unit 303a, the adjustment unit 303b, and the adjustment unit 303c adjust the suction force for the through hole 171a, the through hole 121b, and the through hole 122b, respectively. The adjustment unit 303a, the adjustment unit 303b, and the adjustment unit 303c include, for example, an actuator. The adjustment unit 303a, the adjustment unit 303b, and the adjustment unit 303c are not particularly limited, but include, for example, an adjustment valve provided in the pipe 301a and the pipe 301c. In addition, in order to adjust the suction force for the through hole 171a, the through hole 121b, and the through hole 122b, the suction mechanism 300 may have, for example, a plurality of suction pumps or a plurality of exhaust fans that adjust the suction force for the through hole 171a, the through hole 121b, and the through hole 122b, respectively. The bonding apparatus 1 does not necessarily have to include the suction device 302. For example, the pipes 301a and 301c may be connected to an external suction device.

[0154] 14 is a cross-sectional view that diagrammatically shows the second substrate holding device 200, and shows a state in which the second suction pins 410 are arranged at the protruding position P1. As shown in FIG. 14, in this embodiment, the second substrate holding device 200 has a plurality of second suction pins 410. The plurality of second suction pins 410 of the second substrate holding device 200 support the second substrate W2 before it is held by the second holding mechanism 210.

[0155] In this embodiment, the second suction pins 410 of the second substrate holding device 200 suction and hold the back surface Wb (here, the lower surface) of the second substrate W2. Specifically, the second suction pins 410 have a through hole (not shown) through which air passes. The suction mechanism 300 has a pipe 301d connected to the through hole of the second suction pin 410 and a valve 310d that switches the inside of the pipe 301d between an open state and a closed state. The pipe 301d has, for example, a rubber tube. The second suction pin 410 is connected to the pipe 301d by inserting a lower end (not shown) of the second suction pin 410 into the rubber tube. When the suction mechanism 300 is driven and the valve 310d is opened, the air in the through hole of the second suction pin 410 is sucked in, and the inside of the through hole of the second suction pin 410 becomes negative pressure. Therefore, when the suction device 302 is driven and the valve 310d is open, the back surface Wb of the second substrate W2 is attracted to the tip (here, the upper end) of the second suction pin 410, and the second suction pin 410 is attracted to the back surface Wb of the second substrate W2. Note that a suction device other than the suction device 302 may be connected to the through hole of the second suction pin 410.

[0156] The second suction pins 410 include a second central suction pin 410a and a second outer periphery suction pins 410b. The second central suction pin 410a suctions and holds the center of the back surface Wb (here, the lower surface) of the second substrate W2. The second outer periphery suction pins 410b suctions and holds the outer periphery of the back surface Wb (here, the lower surface) of the second substrate W2.

[0157] As described above, the second substrate holding device 200 has the second pin actuator 460 that moves the second suction pin 410 in the up-down direction. The second pin actuator 460 is fixed to, for example, the lower surface 220b of the second base 220. When the second pin actuator 460 is driven, the second suction pin 410 moves in the up-down direction relative to the second base 220.

[0158] The second pin actuator 460 changes the amount of protrusion of at least one second suction pin 410 relative to the amount of protrusion of the other second suction pins 410, thereby moving the second substrate W2 so as to conform to the second holding surface 230a.

[0159] Specifically, the second pin actuator 460 has a second central pin actuator 460a and a second outer periphery pin actuator 460b. The second central pin actuator 460a and the second outer periphery pin actuator 460b are fixed to, for example, the lower surface 220b of the second base 220. The second central pin actuator 460a moves the central suction pin 410a in the vertical direction relative to the second base 220. The second outer periphery pin actuator 460b moves the outer periphery suction pin 410b in the vertical direction relative to the second base 220.

[0160] The other configuration of the second substrate holding device 200 is similar to that of the first substrate holding device 100 .

[0161] Next, the bonding apparatus 1 will be further described with reference to Fig. 15. Fig. 15 is a block diagram showing the configuration of the bonding apparatus 1 of the second embodiment.

[0162] In this embodiment, the bonding apparatus 1 has a control device 190. In this embodiment, the control device 190 controls the bonding apparatus 1. The control device 190 controls the first substrate holding device 100, the second substrate holding device 200, the suction mechanism 300, and the like.

[0163] The control device 190 includes a control unit 191 and a storage unit 193. The storage unit 193 stores data and computer programs. The data, for example, specifies the process contents and procedures for holding the first substrate W1 and the second substrate W2. The data also specifies the process contents and procedures for bonding the first substrate W1 and the second substrate W2 together. The control unit 191 executes the computer program stored in the storage unit 193 to perform the substrate holding operation and the substrate bonding operation.

[0164] The control unit 191 controls the first movement mechanism 610. The control unit 191 aligns the first substrate holding device 100 and the second substrate holding device 200 with the first movement mechanism 610. Specifically, the control unit 191 moves at least one of the first substrate holding device 100 and the second substrate holding device 200 in the horizontal direction with the first movement mechanism 610. In this embodiment, the control unit 191 moves the first substrate holding device 100 in the horizontal direction with the first movement mechanism 610.

[0165] The control unit 191 controls the second movement mechanism 620. The control unit 191 moves at least one of the first substrate holding device 100 and the second substrate holding device 200 in the vertical direction by the second movement mechanism 620. In this embodiment, the control unit 191 moves the first substrate holding device 100 in the vertical direction relative to the first substrate holding device 100 by the second movement mechanism 620.

[0166] The control unit 191 controls the first substrate holding device 100 and the second substrate holding device 200. The control unit 191 acquires warpage information of the first holding surface 130a and the second holding surface 230a. The warpage information of the second holding surface 230a is the same as the warpage information of the first holding surface 130a. The control unit 191 controls the first substrate holding device 100 to hold the first substrate W1 based on the warpage information of the first holding surface 130a, similar to the first embodiment. The control unit 191 controls the second substrate holding device 200 to hold the second substrate W2 based on the warpage information of the second holding surface 230a, similar to the first embodiment.

[0167] Furthermore, the control unit 191 controls the first substrate holding device 100 and the second substrate holding device 200 based on the warpage information of the first holding surface 130a and the second holding surface 230a to bond the first substrate W1 and the second substrate W2 together.

[0168] The control unit 191 acquires the first substrate warpage information. The first substrate warpage information includes information indicating the warpage direction and the warpage amount of the first substrate W1 before being held by the first substrate holding device 100. The first substrate warpage information includes, for example, information on whether the surface Wa is convex, concave, or flat. The first substrate warpage information may be transmitted to the control unit 191 from a device that detects the warpage of the first substrate W1, which is separate from the bonding device 1. Also, for example, the bonding device 1 may include a detection sensor that detects the warpage of the first substrate W1. For example, the memory unit 193 stores the first substrate warpage information, and the control unit 191 acquires the first substrate warpage information from the memory unit 193.

[0169] The control unit 191 acquires the second substrate warpage information. The second substrate warpage information includes information indicating the warpage direction and the warpage amount of the second substrate W2 before being held by the second substrate holding device 200. The second substrate warpage information includes, for example, information on whether the surface Wa is convex, concave, or flat. The second substrate warpage information may be transmitted to the control unit 191 from a device that detects the warpage of the second substrate W2, which is separate from the bonding device 1. Also, for example, the bonding device 1 may include a detection sensor that detects the warpage of the second substrate W2. For example, the memory unit 193 stores the second substrate warpage information, and the control unit 191 acquires the second substrate warpage information from the memory unit 193.

[0170] The other configurations of the second embodiment are similar to those of the first embodiment.

[0171] Next, with reference to FIG. 16, a bonding method using the bonding apparatus 1 of the present embodiment will be described. FIG. 16 is a flowchart showing the bonding method using the bonding apparatus 1 of the second embodiment. In this embodiment, the bonding method using the bonding apparatus 1 includes steps S21 to S24. Step S22 is an example of the "step of adsorbing and holding one side of the second substrate" of the present invention. Step S24 is an example of the "step of bonding the first substrate and the second substrate together" of the present invention.

[0172] 16, in step S21, the control unit 191 holds the first substrate W1 by the first substrate holding device 100. Specifically, the control unit 191 causes the first substrate holding device 100 to hold the first substrate W1 in the same manner as the substrate holding method described with reference to Fig. 9. At this time, the front surface Wa of the first substrate W1 faces downward, and the back surface Wb faces upward.

[0173] Next, in step S22, the control unit 191 holds the second substrate W2 by the second substrate holding device 200. Specifically, the control unit 191 causes the second substrate holding device 200 to hold the second substrate W2 in the same manner as the substrate holding method described with reference to Fig. 9. At this time, the front surface Wa of the second substrate W2 faces upward, and the back surface Wb faces downward.

[0174] Note that steps S21 and S22 may be performed in the reverse order, or may be performed in parallel.

[0175] Next, in step S23, the control unit 191 aligns the first substrate W1 and the second substrate W2 by the first moving mechanism 610. Specifically, the control unit 191 acquires relative position information indicating the relative positions of the first substrate W1 and the second substrate W2 by a position detection sensor (not shown). For example, the position detection sensor detects alignment marks provided on the first substrate W1 and the second substrate W2. Then, the control unit 191 moves the first substrate holding device 100 in the horizontal direction based on the relative position information by the first moving mechanism 610. As a result, the first substrate W1 and the second substrate W2 are aligned. Note that when the alignment marks are detected by the position detection sensor, the surfaces Wa of the first substrate W1 and the second substrate W2 may be made flat by the first deformation mechanism 170 and the second deformation mechanism 270. This configuration can improve the detection accuracy of the position detection sensor.

[0176] Next, in step S24, the control unit 191 bonds the first substrate W1 and the second substrate W2 together using the second movement mechanism 620. Specifically, the control unit 191 bonds the first substrate W1 and the second substrate W2 together by moving at least one of the first substrate W1 and the second substrate W2 in the vertical direction. In this embodiment, the control unit 191 bonds the first substrate W1 and the second substrate W2 together by moving the first substrate holding device 100 in the downward direction using the second movement mechanism 620.

[0177] At this time, the control unit 191 deforms at least one of the first chuck 130 of the first substrate holding device 100 and the second chuck 230 of the second substrate holding device 200 based on the warp information of the first holding surface 130a and the warp information of the second holding surface 230a, thereby bonding the first substrate W1 and the second substrate W2 together.

[0178] In this manner, the bonding process is completed.

[0179] Next, step S24 of the bonding method of the second embodiment will be described in detail with reference to Fig. 17. Fig. 17 is a flowchart showing the bonding step (step S24) in the bonding method by the bonding apparatus 1 of the second embodiment. In this embodiment, the bonding step (step S24) includes steps S241 to S244.

[0180] 17, in step S241, the control unit 191 determines the warpage shapes of the first chuck 130 and the second chuck 230 at the time of bonding based on the warpage information. Specifically, the control unit 191 determines the combination pattern of the warpage directions of the first chuck 130 and the second chuck 230 based on the warpage information of the first holding surface 130a and the second holding surface 230a.

[0181] There are, for example, six combination patterns of the warpage directions of the first chuck 130 and the second chuck 230. For example, the first combination pattern is a pattern in which both the first holding surface 130a and the second holding surface 230a are concave. The second combination pattern is a pattern in which one of the first holding surface 130a and the second holding surface 230a is flat, and the other of the first holding surface 130a and the second holding surface 230a is concave. The third combination pattern is a pattern in which one of the first holding surface 130a and the second holding surface 230a is convex, and the other of the first holding surface 130a and the second holding surface 230a is concave. The fourth combination pattern is a pattern in which both the first holding surface 130a and the second holding surface 230a are flat. The fifth combination pattern is a pattern in which one of the first holding surface 130a and the second holding surface 230a is convex and the other of the first holding surface 130a and the second holding surface 230a is flat. The sixth combination pattern is a pattern in which both the first holding surface 130a and the second holding surface 230a are convex.

[0182] Then, the control unit 191 determines the warped shapes of the first chuck 130 and the second chuck 230 at the time of bonding based on the first to sixth combination patterns. That is, the control unit 191 determines the warped shapes of the first holding surface 130a and the second holding surface 230a at the time of bonding.

[0183] At this time, in this embodiment, the control unit 191 may determine the amount of warping of the first chuck 130 and the second chuck 230 at the time of bonding based on the acquired amount of warping. In other words, the control unit 191 may determine the amount of warping of the first holding surface 130a and the second holding surface 230a at the time of bonding.

[0184] Next, in step S242, the control unit 191 deforms the first chuck 130 and the second chuck 230 so as to have the warped shape determined in step S241. Specifically, the control unit 191 deforms the first chuck 130 by the first deformation mechanism 170 and deforms the second chuck 230 by the second deformation mechanism 270 so as to have the warped shape determined in step S241. At this time, for example, the control unit 191 drives the first deformation mechanism 170 while the first base 120 is fixed, thereby moving the first moving body 171 in the vertical direction relative to the first base 120, thereby deforming the first chuck 130. Also, at this time, for example, the control unit 191 drives the second deformation mechanism 270 to move the second moving body 271 in the vertical direction relative to the second base 220, thereby deforming the second chuck 230.

[0185] Next, in step S243, the control unit 191 brings the first substrate W1 and the second substrate W2 into point contact. Specifically, the control unit 191 causes the second moving mechanism 620 to bring the center of the first substrate W1 into point contact with the center of the second substrate W2.

[0186] Next, in step S244, the control unit 191 brings the first substrate W1 and the second substrate W2 into contact with each other over their entire surfaces. That is, the control unit 191 bonds the first substrate W1 and the second substrate W2 together.

[0187] Hereinafter, the lamination method for each of the first to sixth combination patterns will be further described with reference to FIGS.

[0188] (First combination pattern) Fig. 18 is a schematic diagram for explaining a bonding method in the first combination pattern. With reference to Fig. 18, a case where both the first holding surface 130a and the second holding surface 230a have a concave shape will be explained.

[0189] As shown in Fig. 18, when both the first holding surface 130a and the second holding surface 230a are concave (the state shown in the upper part of Fig. 18), the control unit 191, for example, makes one of the first holding surface 130a, which is the lower surface of the first chuck 130, and the second holding surface 230a, which is the upper surface of the second chuck 230, convex, and maintains the other of the first holding surface 130a and the second holding surface 230a in a concave shape. Which of the first holding surface 130a and the second holding surface 230a is to be made convex is appropriately determined. The control unit 191 may, for example, make the holding surface with the lesser amount of warping out of the first holding surface 130a and the second holding surface 230a, convex. Alternatively, the control unit 191 may acquire first substrate warpage information indicating the warpage direction and the warpage amount of the first substrate W1 before being held by the first substrate holding device 100, and second substrate warpage information indicating the warpage direction and the warpage amount of the second substrate W2 before being held by the second substrate holding device 200, and may determine which of the first holding surface 130a and the second holding surface 230a should be made convex based on the first substrate warpage information and the second substrate warpage information. In this case, the control unit 191 may make the holding surface that holds the substrate that has a smaller change in the warpage amount when made convex into a convex shape into a convex shape. In other words, the control unit 191 may determine which of the first holding surface 130a and the second holding surface 230a should be made convex so as to suppress the increase in the stress generated in the first substrate W1 and the second substrate W2.

[0190] In this embodiment, the control unit 191, for example, maintains the first holding surface 130a, which is the lower surface of the first chuck 130, in a concave shape and makes the second holding surface 230a, which is the upper surface of the second chuck 230, in a convex shape (the state shown in the middle part of FIG. 18). At this time, for example, the control unit 191 drives the second deformation mechanism 270 to move the second moving body 271 in an upward direction relative to the second base 220, thereby making the second holding surface 230a in a convex shape. Note that the control unit 191 may, for example, make the other of the first holding surface 130a and the second holding surface 230a flat or convex.

[0191] When one of the first holding surface 130a and the second holding surface 230a is made convex and the other of the first holding surface 130a and the second holding surface 230a is made concave, the control unit 191 makes the curvature of one of the first holding surface 130a and the second holding surface 230a larger than the curvature of the other of the first holding surface 130a and the second holding surface 230a. In this embodiment, the control unit 191 makes the curvature of the second holding surface 230a larger than the curvature of the first holding surface 130a.

[0192] Thereafter, the control unit 191 moves the first substrate holding device 100 downward by the second moving mechanism 620. At this time, the first support stand SB1, the first base 120, and the first suction pins 400 move downward by the same amount. As a result, the surface Wa (here, the lower surface) of the first substrate W1 and the surface Wa (here, the upper surface) of the second substrate W2 come into point contact with each other.

[0193] Then, the control unit 191, for example, gradually reduces the suction force on the second substrate W2. As a result, the second substrate W2 is peeled off from the second chuck 230 by the restoring force of the second substrate W2, and the surface Wa (here, the upper surface) of the second substrate W2 is deformed to approach a flat surface, and the entire surface Wa of the second substrate W2 is in close contact with the entire surface Wa of the first substrate W1 (here, the lower surface) (the state shown in the lower part of FIG. 18). Specifically, from a state in which the surface Wa of the first substrate W1 and the surface Wa of the second substrate W2 are in point contact at one point in the center, the contact area gradually expands radially outward, and the surface Wa of the first substrate W1 and the surface Wa of the second substrate W2 are in contact with each other over their entire surfaces. Therefore, the generation of voids between the first substrate W1 and the second substrate W2 is suppressed.

[0194] In this embodiment, when the control unit 191 gradually reduces the suction force on the second substrate W2, the control unit 191 gradually reduces the suction force from the center of the second substrate W2 toward the radially outer side. Specifically, the control unit 191 switches the adjustment unit 303a of the second substrate holding device 200 from an open state to a closed state, then switches the adjustment unit 303b from an open state to a closed state, and then switches the adjustment unit 303c from an open state to a closed state. In this manner, the suction forces on the through holes 171a, the through holes 121b, and the through holes 122b are reduced in this order. Therefore, from a state in which the first substrate W1 and the second substrate W2 are in point contact at one point in the center, the contact area between the first substrate W1 and the second substrate W2 tends to gradually expand radially outward. Therefore, it is possible to easily suppress the generation of voids between the first substrate W1 and the second substrate W2.

[0195] Furthermore, although not shown, the control unit 191 may deform the second chuck 230 so that the second holding surface 230a approaches a flat surface without reducing the suction force on the second substrate W2 from a state in which the surface Wa of the first substrate W1 and the surface Wa of the second substrate W2 are in point contact with each other. In this case, the control unit 191 moves the first substrate holding device 100 downward by a distance that the second moving body 271 moves downward. Specifically, the control unit 191 moves the first moving body 171 downward relative to the first base 120 by the drive mechanism 173 while moving the first substrate holding device 100 downward by the second moving mechanism 620. Furthermore, the control unit 191 causes the drive mechanism 273 to move the second moving body 271 downward relative to the second base 220 at a speed equal to the sum of the moving speed of the first substrate holding device 100 by the second moving mechanism 620 and the moving speed of the first moving body 171 relative to the first base 120. At this time, the control unit 191 causes the second pin actuator 460 to move the second suction pin 410 downward relative to the second base 220 so that the second suction pin 410 does not protrude upward from the second holding surface 230a. This causes the first substrate W1 and the second substrate W2 to come into contact with each other over their entire surfaces.

[0196] Whether to reduce the suction force on the second substrate W2 or to deform the second chuck 230 from the state where the first substrate W1 and the second substrate W2 are in point contact with each other may be determined based on the second substrate warpage information and the warpage information of the first holding surface 130a. Specifically, when the surface Wa of the second substrate W2 (hereinafter, sometimes referred to as the second substrate W2 before being held by the second substrate holding device 200) is concave or flat, the control unit 191 may reduce the suction force on the second substrate W2 from the state where the first substrate W1 and the second substrate W2 are in point contact with each other. Also, when the surface Wa of the second substrate W2 before being held is convex and the amount of warping of the surface Wa of the second substrate W2 before being held is smaller than the amount of warping of the first holding surface 130a, the control unit 191 may reduce the suction force on the second substrate W2 from the state where the first substrate W1 and the second substrate W2 are in point contact with each other. On the other hand, if the surface Wa of the second substrate W2 before holding has a convex shape and the amount of warping of the surface Wa of the second substrate W2 before holding is greater than or the same as the amount of warping of the first holding surface 130a, the control unit 191 may deform the second chuck 230 from a state in which the first substrate W1 and the second substrate W2 are in point contact.

[0197] (Second combination pattern) Fig. 19 is a schematic diagram for explaining a bonding method in the second combination pattern. With reference to Fig. 19, a case will be explained in which one of the first holding surface 130a and the second holding surface 230a is flat and the other of the first holding surface 130a and the second holding surface 230a is concave.

[0198] As shown in FIG. 19, when one of the first holding surface 130a and the second holding surface 230a is planar and the other of the first holding surface 130a and the second holding surface 230a is concave (the state shown in the upper part of FIG. 19), the control unit 191, for example, makes one of the first holding surface 130a, which is the lower surface of the first chuck 130, and the second holding surface 230a, which is the upper surface of the second chuck 230, convex, and maintains the other of the first holding surface 130a and the second holding surface 230a in a concave shape. In this embodiment, the control unit 191, for example, maintains the first holding surface 130a in a concave shape and makes the second holding surface 230a in a convex shape (the state shown in the middle part of FIG. 19). Note that the control unit 191 may, for example, make the other of the first holding surface 130a and the second holding surface 230a planar or convex.

[0199] Other lamination methods in the second combination pattern are similar to those in the first combination pattern.

[0200] (Third combination pattern) Fig. 20 is a schematic diagram for explaining a bonding method in the third combination pattern. With reference to Fig. 20, a case will be explained in which one of the first holding surface 130a and the second holding surface 230a has a convex shape and the other of the first holding surface 130a and the second holding surface 230a has a concave shape.

[0201] As shown in FIG. 20, when one of the first holding surface 130a and the second holding surface 230a is convex and the other of the first holding surface 130a and the second holding surface 230a is concave (the state shown in the upper part of FIG. 20), the control unit 191 maintains, for example, one of the first holding surface 130a, which is the lower surface of the first chuck 130, and the second holding surface 230a, which is the upper surface of the second chuck 230, in a convex shape, and maintains the other of the first holding surface 130a and the second holding surface 230a in a concave shape. In this embodiment, the control unit 191 maintains, for example, the first holding surface 130a in a concave shape and the second holding surface 230a in a convex shape (the state shown in the middle part of FIG. 20). Note that the control unit 191 may, for example, make the other of the first holding surface 130a and the second holding surface 230a flat or convex.

[0202] Other lamination methods in the second combination pattern are similar to those in the first and second combination patterns.

[0203] (4th combination pattern) 21 is a schematic diagram for explaining a bonding method in the fourth combination pattern. With reference to FIG. 21, a case where both the first holding surface 130a and the second holding surface 230a are flat will be explained.

[0204] As shown in FIG. 21, when both the first holding surface 130a and the second holding surface 230a are flat (the state shown in the upper part of FIG. 21), the control unit 191, for example, maintains either the first holding surface 130a, which is the lower surface of the first chuck 130, or the second holding surface 230a, which is the upper surface of the second chuck 230, in a flat shape, and makes the other of the first holding surface 130a and the second holding surface 230a a convex shape. Which of the first holding surface 130a and the second holding surface 230a is to be made convex is appropriately determined. For example, the control unit 191 may obtain first substrate warpage information indicating the warpage direction and warpage amount of the first substrate W1 before being held, and second substrate warpage information indicating the warpage direction and warpage amount of the second substrate W2 before being held, and determine which of the first holding surface 130a and the second holding surface 230a is to be made convex based on the first substrate warpage information and the second substrate warpage information. In this case, the control unit 191 may make the holding surface that holds the substrate with the least change in the amount of warping when the holding surface is made convex into a convex shape. In this embodiment, the control unit 191 may, for example, maintain the first holding surface 130a in a flat shape and make the second holding surface 230a in a convex shape (the state shown in the middle part of FIG. 21). Note that the control unit 191 may, for example, make the other of the first holding surface 130a and the second holding surface 230a in a convex shape and make one of the first holding surface 130a and the second holding surface 230a in a concave or convex shape. Also, the control unit 191 may, for example, maintain both the first holding surface 130a and the second holding surface 230a in a flat shape.

[0205] Thereafter, the control unit 191 moves the first substrate holding device 100 downward using the second moving mechanism 620. This brings the first substrate W1 and the second substrate W2 into point contact.

[0206] Then, the control unit 191, for example, gradually reduces the suction force on the second substrate W2. As a result, the second substrate W2 is peeled off from the second chuck 230 by the restoring force of the second substrate W2, and the surface Wa (here, the upper surface) of the second substrate W2 is deformed into a flat shape, and the entire surface Wa of the second substrate W2 is brought into close contact with the entire surface Wa (here, the lower surface) of the first substrate W1 (the state shown in the lower part of FIG. 21). Note that the manner in which the suction force is reduced and the manner in which the contact area between the first substrate W1 and the second substrate W2 is expanded are the same as those in the bonding in the first combination pattern described above.

[0207] Although not shown, the control unit 191 may deform the second chuck 230 so that the second holding surface 230a becomes flat without reducing the suction force on the second substrate W2 from the state where the first substrate W1 and the second substrate W2 are in point contact. In this case, the control unit 191 moves the first substrate holding device 100 downward by the distance that the second moving body 271 moves downward by the second moving mechanism 620. Specifically, the control unit 191 moves the first base 120 and the first moving body 171 downward at the same speed by the second moving mechanism 620 while moving the second moving body 271 downward relative to the second base 220 by the drive mechanism 273. At this time, the control unit 191 moves the second suction pin 410 downward relative to the second base 220 so that the second suction pin 410 does not protrude upward from the second holding surface 230a. As a result, the first substrate W1 and the second substrate W2 come into contact with each other over their entire surfaces.

[0208] Whether to reduce the suction force on the second substrate W2 or to deform the second chuck 230 from the state where the first substrate W1 and the second substrate W2 are in point contact may be determined based on the second substrate warpage information and the warpage information of the first holding surface 130a (here, the amount of warpage is zero). Specifically, when the surface Wa of the second substrate W2 before being held is concave, the control unit 191 may reduce the suction force on the second substrate W2 from the state where the first substrate W1 and the second substrate W2 are in point contact. Also, when the surface Wa of the second substrate W2 before being held is convex or flat, the control unit 191 may deform the second chuck 230 from the state where the first substrate W1 and the second substrate W2 are in point contact.

[0209] (5th combination pattern) Fig. 22 is a schematic diagram for explaining a bonding method in the fifth combination pattern. With reference to Fig. 22, a case will be explained in which one of the first holding surface 130a and the second holding surface 230a has a convex shape and the other of the first holding surface 130a and the second holding surface 230a has a flat shape.

[0210] As shown in Fig. 22, when one of the first holding surface 130a and the second holding surface 230a is convex and the other of the first holding surface 130a and the second holding surface 230a is flat (the state shown in the upper part of Fig. 22), the control unit 191, for example, makes one of the first holding surface 130a, which is the lower surface of the first chuck 130, and the second holding surface 230a, which is the upper surface of the second chuck 230, convex and maintains the other of the first holding surface 130a and the second holding surface 230a flat. In this embodiment, the control unit 191, for example, maintains the first holding surface 130a flat and maintains the second holding surface 230a convex (the state shown in the middle part of Fig. 22). For example, the control unit 191 may make one of the first holding surface 130a and the second holding surface 230a convex and the other of the first holding surface 130a and the second holding surface 230a concave or convex. Also, the control unit 191 may make both the first holding surface 130a and the second holding surface 230a flat.

[0211] Other lamination methods in the fifth combination pattern are similar to those in the fourth combination pattern.

[0212] (6th combination pattern) Fig. 23 is a schematic diagram for explaining a bonding method in the sixth combination pattern. With reference to Fig. 23, a case where both the first holding surface 130a and the second holding surface 230a have a convex shape will be explained.

[0213] 23, when both the first holding surface 130a and the second holding surface 230a are convex (the state shown in the upper part of FIG. 23), the control unit 191 maintains both the first holding surface 130a, which is the lower surface of the first chuck 130, and the second holding surface 230a, which is the upper surface of the second chuck 230, in a convex shape (the state shown in the middle part of FIG. 23). Note that the control unit 191 may, for example, make either the first holding surface 130a or the second holding surface 230a flat or concave.

[0214] Thereafter, the control unit 191 moves the first substrate holding device 100 downward by the second moving mechanism 620. As a result, the surface Wa (here, the lower surface) of the first substrate W1 and the surface Wa (here, the upper surface) of the second substrate W2 come into point contact with each other.

[0215] Then, the control unit 191, for example, deforms the first chuck 130 so that the first holding surface 130a becomes planar, and deforms the second chuck 230 so that the second holding surface 230a becomes planar. In this case, the control unit 191 moves the second moving body 271 downward relative to the second base 220 by the drive mechanism 273, and moves the first moving body 171 downward at the same speed by the second moving mechanism 620. At this time, the control unit 191 moves the first base 120 downward at a speed higher than that of the first moving body 171. In other words, the control unit 191 moves the first moving body 171 upward relative to the first base 120 by the second moving mechanism 620. At this time, the control unit 191 causes the first pin actuator 450 to move the first suction pins 400 of the first substrate holding device 100 upward relative to the first base 120 so that the first suction pins 400 do not protrude downward from the first holding surface 130a. This causes the first substrate W1 and the second substrate W2 to come into contact with each other over their entire surfaces (the state shown in the lower part of FIG. 23).

[0216] In this embodiment, as described above, the first pin actuator 450 changes the protruding amount of at least one first suction pin 400 relative to the protruding amount of the other first suction pins 400, thereby curving the first substrate W1 along the first holding surface 130a. Then, the first pin actuator 450 moves the multiple first suction pins 400 from the protruding position P1 to the non-protruding position P2, thereby causing the first chuck 130 to hold the first substrate W1. Therefore, the first substrate W1 can be held by the first chuck 130 in a state in which the first substrate W1 is curved along the first holding surface 130a. Therefore, it is possible to prevent a gap from being generated between the first substrate W1 and the first holding surface 130a. In other words, it is possible to prevent the first substrate W1 from being partially bent on the first holding surface 130a.

[0217] In this way, since it is possible to prevent the first substrate W1 from being partially warped on the first holding surface 130a, it is possible to prevent a gap from being generated between the first substrate W1 and the second substrate W2 when the first substrate W1 and the second substrate W2 are bonded together, which means that it is possible to prevent a void from being generated between the first substrate W1 and the second substrate W2.

[0218] As described above, the second pin actuator 460 changes the protruding amount of at least one second suction pin 410 relative to the protruding amount of the other second suction pins 410, thereby curving the second substrate W2 along the second holding surface 230a. The second pin actuator 460 then moves the second suction pins 410 from the protruding position P1 to the non-protruding position P2, thereby causing the second substrate W2 to be held by the second chuck 230. Thus, the second substrate W2 can be held by the second chuck 230 in a state in which the second substrate W2 is curved along the second holding surface 230a. This makes it possible to prevent a gap from being generated between the second substrate W2 and the second holding surface 230a. In other words, it is possible to prevent the second substrate W2 from being partially bent on the second holding surface 230a. Therefore, when the first substrate W1 and the second substrate W2 are bonded together, it is possible to further prevent a gap from being generated between the first substrate W1 and the second substrate W2. In other words, the generation of voids between the first substrate W1 and the second substrate W2 can be further suppressed.

[0219] As described above, the first substrate holding device 100 and the second substrate holding device 200 bond the first substrate W1 and the second substrate W2 together in a state in which one of the first holding surface 130a and the second holding surface 230a is convex and the other of the first holding surface 130a and the second holding surface 230a is concave. Specifically, the first substrate W1 and the second substrate W2 are bonded together as described with reference to Figs. 18 to 20 (first combination pattern to third combination pattern). Therefore, the first substrate W1 and the second substrate W2 can be bonded together by utilizing the restoring force of the first substrate W1 or the second substrate W2 held by one of the first holding surface 130a and the second holding surface 230a.

[0220] Furthermore, when utilizing the restoring force, by making the other of the first holding surface 130a and the second holding surface 230a concave, the first substrate W1 and the second substrate W2 can be more reliably brought into contact from the center to the outer ends, compared to when the other of the first holding surface 130a and the second holding surface 230a is made, for example, flat or convex.

[0221] As described above, the maximum curvature of the convex shape of the first holding surface 130a and the second holding surface 230a is larger than the maximum curvature of the concave shape of the first holding surface 130a and the second holding surface 230a. Therefore, for example, when the first holding surface 130a is made concave and the second holding surface 230a is made convex (for example, see the middle parts of FIGS. 18 to 20), the curvature of the second holding surface 230a can be easily made larger than the curvature of the first holding surface 130a.

[0222] Other configurations and other effects of the second embodiment are similar to those of the first embodiment.

[0223] The embodiments of the present invention have been described above with reference to the drawings. However, the present invention is not limited to the above embodiments, and can be implemented in various aspects without departing from the gist of the present invention. In addition, various inventions can be formed by appropriately combining multiple components disclosed in the above embodiments. For example, some components may be deleted from all components shown in the embodiments. Furthermore, components across different embodiments may be appropriately combined. The drawings are mainly shown schematically for ease of understanding, and the thickness, length, number, spacing, etc. of each component shown in the drawings may differ from the actual ones due to the convenience of drawing. In addition, the material, shape, dimensions, etc. of each component shown in the above embodiments are examples and are not particularly limited, and various changes are possible within a range that does not substantially deviate from the effects of the present invention.

[0224] For example, in the above embodiment, the substrate W is a semiconductor wafer, but the present invention is not limited to this. The present invention can use various substrates other than a semiconductor wafer as the substrate W.

[0225] In addition, for example, in the first embodiment, the example in which the substrate holding device 100 is arranged so that the holding surface 130a faces downward has been described, but the present invention is not limited to this. For example, the substrate holding device 100 may be arranged so that the holding surface 130a faces upward.

[0226] In addition, for example, in the first embodiment, an example has been described in which the holding surface 130a of the substrate holding device 100 is deformed into a convex shape and also into a concave shape, but the present invention is not limited to this. The holding surface 130a of the substrate holding device 100 does not have to be deformed.

[0227] In addition, for example, in the second embodiment, an example in which both the first holding surface 130a of the first substrate holding device 100 and the second holding surface 230a of the second substrate holding device 200 are deformed into a convex shape and also into a concave shape has been described, but the present invention is not limited to this. For example, the first holding surface 130a of the first substrate holding device 100 may be deformed into a convex shape and also into a concave shape, while the second holding surface 230a of the second substrate holding device 200 may not be concave. In other words, a bonding device may be configured by the first substrate holding device 100 and a second substrate holding device having a structure different from that of the first substrate holding device 100. However, when a bonding device is configured by the first substrate holding device 100 and a second substrate holding device having a structure different from that of the first substrate holding device 100, and the second substrate holding device 200 does not have a second suction pin 410, it is preferable that the first substrate holding device 100 is disposed above the second substrate holding device. In other words, it is preferable that the first substrate holding device 100 holds the upper substrate of the two substrates.

[0228] Also, for example, in the second embodiment, an example has been described in which the second substrate holding device 200 arranged on the lower side has the second suction pins 410, but the present invention is not limited to this. The second substrate holding device 200 arranged on the lower side may not have the second suction pins 410 that suction the second substrate W2, but may have, for example, support pins that support the second substrate W2 from below. However, when the second substrate W2 is suctioned by the second suction pins 410, unlike when the second substrate W2 is simply supported from below by support pins, it is possible to suppress the second substrate W2 from being misaligned.

[0229] In the first embodiment, for example, the suction pin 400 has one central suction pin 400a and eight outer peripheral suction pins 400b, but the present invention is not limited to this. The suction pin 400 may have, for example, two outer peripheral suction pins 400b arranged symmetrically around the central suction pin 400a. The suction pin 400 may have, for example, two or more central suction pins 400a.

[0230] For example, in the above embodiment, the chuck is deformed by moving the movable body fixed to the chuck in the vertical direction, but the present invention is not limited to this. For example, the chuck may be deformed by providing a separate sealed space between the chuck and the base and introducing compressed air into the sealed space or reducing the pressure in the sealed space. In this case, the deformation mechanism includes, for example, a pump or a blower fan. [Industrial Applicability]

[0231] The present invention can be suitably used in a substrate holding device, a bonding device, a substrate holding method, and a bonding method. [Explanation of symbols]

[0232] 1: Bonding device 100: Substrate holding device, first substrate holding device 130: Chuck, 1st chuck 130a: Holding surface, first holding surface 170: Transformation mechanism 191: Control section 200:Second board holding device 230: Second chuck 230a: 2nd holding surface 400: Suction pin, 1st suction pin 400a: Center suction pin 400b: Periphery suction pin 410: Second suction pin 450: Pin actuator, 1st pin actuator 450a: Center pin actuator 450b: Periphery pin actuator 460: 2nd pin actuator P1:Protruding position P2: Non-protruding position S11: Step (step of adsorbing and holding with suction pins) S13: Step (step of holding a substrate by a chuck, step of holding a first substrate by a first chuck) S22: Step (step of adsorbing and holding one side of the second substrate) S24: Step (step of bonding the first substrate and the second substrate) W: Substrate W1: First board W2: Second board Wb: Back side (one side)

Claims

1. a chuck having a holding surface that suctions and holds one surface of the substrate; a plurality of suction pins that can protrude from the holding surface and that suction-hold the substrate; a pin actuator that moves the plurality of suction pins between a protruding position at which the pins protrude from the holding surface and a non-protruding position at which the pins do not protrude from the holding surface; Equipped with the plurality of suction pins suction the one surface of the substrate at the protruding position; The pin actuator includes: a protruding amount of at least one of the suction pins is changed relative to a protruding amount of the other suction pins, thereby curving the substrate so as to conform to the holding surface; The substrate holding device causes the chuck to hold the substrate by moving the plurality of suction pins from the protruding position to the non-protruding position.

2. the plurality of suction pins include a central suction pin that suction-holds a center of the substrate and a plurality of peripheral suction pins that suction-holds a peripheral portion of the substrate, the pin actuator includes a central pin actuator that moves the central suction pin and an outer periphery pin actuator that moves the outer periphery suction pin, 2. The substrate holding device of claim 1, wherein the central pin actuator and the peripheral pin actuator move at least one of the central suction pin and the peripheral suction pin, and change the amount of protrusion of one of the central suction pin and the peripheral suction pin relative to the amount of protrusion of the other of the central suction pin and the peripheral suction pin, thereby curving the substrate to conform to the holding surface.

3. 3. The substrate holding device of claim 2, wherein when moving the central suction pin and the outer periphery suction pin from the protruding position to the non-protruding position, the central pin actuator and the outer periphery pin actuator move the central suction pin to the non-protruding position and then move the outer periphery suction pin to the non-protruding position.

4. a deformation mechanism that deforms the chuck so that the holding surface has a convex shape and that deforms the chuck so that the holding surface has a concave shape, the convex shape indicates a shape in which a center of the holding surface protrudes in a direction toward the substrate, the concave shape indicates a shape in which a center of the holding surface is concave in a direction away from the substrate, The pin actuator includes: When the holding surface has a convex shape, the substrate is curved so that the center of the one surface is concave in a direction away from the chuck; The substrate holding device according to claim 1 , wherein when the holding surface has the concave shape, the substrate is curved so that a center of the one surface protrudes in a direction toward the chuck.

5. a control unit for controlling the pin actuator, The control unit is Obtaining warpage information including information on at least the warpage direction of the holding surface; 4. A substrate holding device as described in claim 1, wherein the pin actuator changes the protrusion amount of at least one of the suction pins relative to the protrusion amounts of the other suction pins based on the warpage information, thereby curving the substrate to conform to the holding surface.

6. 6. The substrate holding device of claim 5, wherein when the warpage information indicates that the center of the holding surface is concave in a direction away from the substrate, the control unit uses the pin actuator to bend the substrate so that the center of one surface protrudes in a direction toward the chuck.

7. 7. The substrate holding device of claim 6, wherein when the warpage information indicates that the holding surface has the concave shape, the control unit uses the pin actuator to bend the substrate so that the center of the one side protrudes in a direction toward the chuck, and after bringing the center of the one side into point contact with the center of the holding surface, the control unit uses the pin actuator to make the curvature of the one side the same as the curvature of the holding surface.

8. A bonding apparatus for bonding a first substrate and a second substrate, a first substrate holding device that holds the first substrate; a second substrate holding device disposed opposite to the first substrate holding device and configured to hold the second substrate; Equipped with The first substrate holding device is a first chuck having a first holding surface that suction-holds one surface of the first substrate; a plurality of first suction pins that can protrude from the first holding surface and that suction-hold the first substrate; a first pin actuator that moves the first suction pins between a protruding position at which the first suction pins protrude from the first holding surface and a non-protruding position at which the first suction pins do not protrude from the first holding surface; having the first suction pins suction the first substrate at the protruding position; The first pin actuator includes: a protruding amount of at least one of the first suction pins is changed relative to a protruding amount of the other first suction pins, thereby curving the first substrate so as to conform to the first holding surface; a bonding apparatus for holding the first substrate by the first chuck by moving the first suction pins from the protruding position to the non-protruding position.

9. The second substrate holding device is a second chuck having a second holding surface that suction-holds one surface of the second substrate; a plurality of second suction pins that can protrude from the second holding surface and that suction-hold the second substrate; a second pin actuator that moves the second suction pins between a protruding position at which the second suction pins protrude from the second holding surface and a non-protruding position at which the second suction pins do not protrude from the second holding surface; having the second suction pins suction the second substrate at the protruding position; The second pin actuator includes: a protruding amount of at least one of the second suction pins is changed relative to a protruding amount of the other second suction pins, thereby curving the second substrate so as to conform to the second holding surface; The bonding apparatus according to claim 8 , wherein the second substrate is held by the second chuck by moving the second suction pins from the protruding position to the non-protruding position.

10. the second substrate holding device includes a second chuck having a second holding surface that suction-holds one surface of the second substrate; 10. The bonding apparatus of claim 8 or claim 9, wherein the first substrate holding device and the second substrate holding device bond the first substrate and the second substrate together in a state in which one of the first holding surface and the second holding surface has a concave shape recessed in a direction away from the first substrate and the second substrate, and the other of the first holding surface and the second holding surface has a convex shape protruding in a direction toward the first substrate and the second substrate.

11. The first holding surface is deformable into the convex shape and is deformable into the concave shape, The bonding apparatus according to claim 10 , wherein a maximum curvature of the convex shape of the first holding surface is larger than a maximum curvature of the concave shape of the first holding surface.

12. a step of suction-holding one surface of the substrate by a plurality of suction pins; bending the substrate so as to conform to a holding surface of a chuck that holds the substrate, transferring the substrate from the plurality of suction pins to the chuck, and holding the substrate by the chuck; A method of holding a substrate comprising:

13. a step of suction-holding one surface of a first substrate by a plurality of suction pins; bending the first substrate so as to conform to a first holding surface of a first chuck that holds the first substrate, transferring the first substrate from the plurality of suction pins to the first chuck, and holding the first substrate by the first chuck; a step of suction-holding one surface of a second substrate by a second holding surface of a second chuck; a step of bonding the first substrate and the second substrate together in a state in which one of the first holding surface and the second holding surface has a concave shape recessed in a direction away from the first substrate and the second substrate, and the other of the first holding surface and the second holding surface has a convex shape protruding in a direction toward the first substrate and the second substrate; A bonding method comprising:

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