Light emission type electronic component and manufacturing method thereof

Abstract

To provide a light emission type electronic component which makes high luminance and a high contrast ratio compatible while reducing luminance nonuniformity of a light-emitting device, and a manufacturing method thereof.SOLUTION: A light emission type electronic component 5 comprises: a substrate 2 with devices in which a plurality of light-emitting devices 21, 22 and 23 is disposed on a substrate 20; and an integrated sealing curable sheet 3 pressure bonded to a face of the substrate with devices on which the plurality of light-emitting devices is disposed. In the integrated sealing curable sheet, a black resin layer 30 through which light emitted from the light-emitting devices is permeable, and a semitransparent layer 35 of which the light permeability is higher than that of the back resin layer are laminated successively from the side closer to the substrate with devices. The black resin layer has a thickness larger than a height of the light-emitting device and is present in a gap of the plurality of light-emitting devices and on a top face. Luminance transmissivity of the integrated sealing curable sheet is 70% or more and full light beam transmissivity of the integrated sealing curable sheet is 5% or less.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a light-emitting electronic component and a method for manufacturing the same. [Background technology]

[0002] Displays used in TVs today are required to be visible in relatively bright places such as living rooms when they are turned on. For this reason, displays with high brightness are required. In addition, displays are required to have vivid images. For this reason, displays are required to have a high ratio of brightness when they are turned on and when they are turned off (contrast ratio). In recent years, extremely small light-emitting diodes called mini LEDs or micro LEDs have been attracting attention as light sources for high-resolution displays. There are roughly two types of methods known for using such extremely small light-emitting diodes in displays. One is a method in which a large number of light-emitting diodes are arranged on a substrate to form a backlight for a liquid crystal display, and the brightness of the backlight is controlled locally. The other is a method in which light-emitting diodes of each color (R (red), G (green), and B (blue)) are made to emit light and each color of light is sent to the eyes of the viewer of the display on a pixel-by-pixel basis.

[0003] Light-emitting diodes such as mini-LEDs or micro-LEDs are generally arranged on a substrate. When multiple light-emitting diodes (hereinafter referred to as light-emitting elements) are arranged on a substrate, it is necessary to provide light shielding between adjacent light-emitting elements. As a method for providing light shielding between multiple light-emitting elements, for example, a method using a resin film commonly called a dry film is known (see Patent Document 1). A dry film is a film obtained by applying and drying a light-shielding resin composition on a protective film.

[0004] When the dry film is pressed onto a substrate from above a number of light-emitting elements, a light-shielding resin layer is formed not only in the gaps between the light-emitting elements but also on the upper surface (light-emitting surface) of the light-emitting elements. Under such circumstances, the resin layer may block light from reaching the viewer of the display. To prevent this, the above-mentioned conventional technology employs a method in which the light-emitting surface of the light-emitting element is etched by plasma treatment or the like to remove the resin layer on the light-emitting surface, and the removed surface is covered with a light-transmitting sealant. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent Publication No. 2022-22562 Summary of the Invention [Problem to be solved by the invention]

[0006] However, the above-mentioned conventional technology requires a long time for the etching process, which leads to an increase in manufacturing costs. Also, it is difficult to completely remove the resin layer on the light-emitting surface of the light-emitting element, and as a result, it is difficult to completely prevent the blocking of light that should reach the viewer side of the display. In addition, a step of laminating a highly transparent sealing film is required after the etching process, which increases the number of manufacturing processes.

[0007] In view of the above problems, the present inventors have developed an integrated encapsulating sheet having one or more curable resin layers formed on one surface of a film substrate prior to the present invention. The integrated encapsulating sheet is pressure-bonded to a light emitting element so that the curable resin layer side faces the light emitting surface side of the light emitting element, and the curable resin layer is cured, thereby realizing a structure that allows light shielding between the light emitting elements while not blocking light emission toward the viewer.

[0008] The integrated encapsulating sheet developed prior to the present invention as described above also has further improvements. The integrated encapsulating sheet developed previously has a thickness of the light-shielding layer smaller than the height of the light-emitting element, and the light-shielding layer is filled between the light-emitting elements by press bonding, and the transparent layer has a form capable of covering the light-emitting element. However, as a result of leaving the light-shielding layer on the light-emitting element during compression bonding, the light-shielding layer may cause a decrease in the brightness of the light-emitting element. In particular, the height of the light-emitting element on the substrate may not be the same, and in such a case, the light-shielding layer is likely to remain on the low light-emitting element. Under such circumstances, it is difficult to determine a thickness that does not leave the light-shielding layer on all the light-emitting elements. Therefore, it is required to achieve both high brightness and high contrast ratio, assuming that the light-shielding layer covers the light-emitting element.

[0009] An object of the present invention is to provide a light-emitting electronic component that achieves both high brightness and a high contrast ratio, and a method for manufacturing the same. [Means for solving the problem]

[0010] (1) To achieve the above object, a light-emitting electronic component according to one embodiment comprises: a substrate having a plurality of light-emitting elements disposed thereon; an integrated encapsulating cured sheet pressure-bonded to a surface of the element-mounted substrate on which the plurality of light-emitting elements are arranged, The integrated encapsulating cured sheet includes a black resin layer that can transmit light emitted from the light-emitting element and a semi-transparent layer that has a higher light transmittance than the black resin layer, laminated in this order from the side closer to the element-mounted substrate, the black resin layer has a thickness greater than a height of the light emitting elements, and is present in gaps between the light emitting elements and on a top surface of the light emitting elements; The integrated encapsulating cured sheet has a luminance transmittance of 70% or more, The integrated encapsulating cured sheet is characterized in that the total light transmittance is 5% or less. (2) In a light-emitting electronic component according to another embodiment, the semi-transparent layer may be formed by laminating, in order from the side closer to the black resin layer, a transparent resin layer having a higher light transmittance than the black resin layer and a base material layer. (3) In the light-emitting electronic component according to another embodiment, the base layer may preferably have a hard coat layer, which has an anti-scratch effect on the base layer, on the surface opposite to the black resin layer. (4) In another embodiment of the light-emitting electronic component, the height of the plurality of light-emitting elements may differ at least at one point among the plurality of light-emitting elements, and the black resin layer may have a thickness greater than the height of the tallest light-emitting element among the plurality of light-emitting elements. (5) A method for producing a light-emitting electronic component according to one embodiment of the present invention for achieving the above object includes the steps of: a step of pressure-bonding a black curable resin layer side of an integrated encapsulating sheet including a black curable resin layer and a semi-transparent layer laminated on a surface of an element-mounted substrate on which a plurality of light-emitting elements are arranged, the surface being on which the plurality of light-emitting elements are arranged; filling the black cured resin layer between the plurality of light-emitting elements and covering the top surfaces of the plurality of light-emitting elements with the black cured resin layer; curing the black curable resin layer; Includes. (6) In the method for producing a light-emitting electronic component according to another embodiment, preferably, the semi-transparent layer is formed by laminating a transparent curable resin layer and a base material layer in this order from the side closer to the black curable resin layer, In the step of curing the black curable resin layer, the transparent curable resin layer may be cured. Effect of the Invention

[0011] The present invention can provide a light-emitting electronic component that achieves both high brightness and a high contrast ratio, and a method for manufacturing the same. [Brief description of the drawings]

[0012] [Figure 1] FIG. 1 shows a cross-sectional view of an integrated encapsulating sheet used for producing a light-emitting electronic component according to one embodiment, cut in the thickness direction. [Diagram 2] FIG. 2 shows a cross-sectional view seen in the same manner as FIG. 1 when the integrated encapsulating sheet of FIG. 1 is disposed so that the black curable resin layer thereof is in contact with the top surface of the light emitting element of the element-mounted substrate. [Diagram 3] FIG. 3 shows a cross-sectional view, as seen from FIG. 1, of a state in which the integrated encapsulating sheet has been pressure-bonded to the element-mounted substrate, proceeding from the stage shown in FIG. 2 up to a state in which a part of the black curable resin layer shown in FIG. 1 is embedded between the light-emitting elements. [Figure 4] FIG. 4 shows a cross-sectional view, seen from the same angle as FIG. 1, of a light-emitting electronic component manufactured by proceeding further from the stage shown in FIG. 3, peeling off the protective sheet on the semi-transparent layer, and carrying out a curing treatment. [Diagram 5] FIG. 5 shows a cross-sectional view taken in the same direction as FIG. 1 of an integrated encapsulating sheet used in manufacturing a light-emitting electronic component according to another embodiment. [Figure 6] FIG. 6 shows a cross-sectional view taken in the same direction as FIG. 1 of a light-emitting electronic component according to another embodiment produced using the integrated encapsulating sheet of FIG. [Figure 7] FIG. 7 shows a cross-sectional view taken in the same direction as FIG. 1 of an integrated encapsulating sheet used in manufacturing a light-emitting electronic component according to another embodiment. [Figure 8] FIG. 8 shows a cross-sectional view taken in the same direction as FIG. 1 of a light-emitting electronic component according to another embodiment produced using the integrated encapsulating sheet of FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Next, an embodiment of the present invention will be described with reference to the drawings. Note that the embodiment described below does not limit the invention according to the claims, and not all of the elements and combinations described in the embodiment are necessarily essential to the solution of the present invention. In this specification, the main component means a component that accounts for 50% by mass or more of the total solid content of the entire composition. A numerical range represented by "~" means a numerical range with the numbers before and after ~ as the lower and upper limits.

[0014] (First embodiment) FIG. 1 shows a cross-sectional view of an integrated encapsulating sheet used in the manufacture of a light-emitting electronic component according to an embodiment when cut in the thickness direction. FIG. 2 shows a cross-sectional view of the integrated encapsulating sheet of FIG. 1 when the sheet is disposed so that the black curable resin layer is in contact with the top surface of the light-emitting element of the element-mounted substrate. FIG. 3 shows a cross-sectional view of the same view as FIG. 1 in a state in which the integrated encapsulating sheet is pressed against the element-mounted substrate until a part of the black curable resin layer of FIG. 1 is embedded between the light-emitting elements, proceeding from the stage of FIG. 2. FIG. 4 shows a cross-sectional view of the same view as FIG. 1 of a light-emitting electronic component manufactured by peeling off the protective sheet on the semi-transparent layer and carrying out a curing treatment, proceeding further from the stage of FIG. 3.

[0015] 1. Integrated encapsulating sheet The integrated encapsulating sheet 1 according to the first embodiment is a state before the curing process of the integrated encapsulating cured sheet 3 provided in the light-emitting electronic component 5 according to the present embodiment. The integrated encapsulating sheet 1 is a laminate in which at least a black curable resin layer 10 and a semi-transparent layer 15 are laminated in this order. The "semi-transparent" of the semi-transparent layer 15 means a transparency between completely transparent and completely opaque, and means that the total light transmittance measured in accordance with JIS K 7361-1 is 20% or more and 99% or less. The integrated encapsulating sheet 1 is pressure-bonded on the surface of the black curable resin layer 10 to the multiple light-emitting elements 21, 22, and 23 during the pressure-bonding process described later. In addition, at least the black curable resin layer 10 is in an uncured state until the curing process described later is performed. That is, the black curable resin layer 10 is cured by the curing process to become the black resin layer 30.

[0016] For ease of handling, the integrated encapsulating sheet 1 may further include a protective sheet on the outer surface of either one or both of the black curable resin layer 10 and the semi-transparent layer 15. FIG. 1 shows an example of the integrated encapsulating sheet 1 having protective sheets 13, 14 on the outer surfaces of both the black curable resin layer 10 and the semi-transparent layer 15. More specifically, the integrated encapsulating sheet 1 has a structure in which the protective sheet 14, the semi-transparent layer 15, the black curable resin layer 10, and the protective sheet 13 are laminated in this order. Each layer constituting the integrated encapsulating sheet 1 will be described below.

[0017] (1) Black curable resin layer The black curable resin layer 10 is a layer for blocking light between the light emitting elements 21, 22, and 23. It is also a layer for improving the contrast of the display. The black curable resin layer 10 is also a layer for sufficiently filling the gaps between the multiple light emitting elements 21, 22, and 23 arranged on the element-mounted substrate 2 in a pressure bonding process represented by thermocompression bonding, and for preventing poor appearance due to expansion of unfilled gaps in a hardening process represented by thermosetting, and damage to the light emitting elements 21, 22, and 23 due to external factors in a later process.

[0018] [Lab value] The Lab values ​​of the black curable resin layer 10 in a cured state are measured in accordance with JIS Z 8722 using a light source D65, a field of view of 2°, and a transmission method, and are preferably L: 5 to 60, a: -3 to 7, and b: -20 to 20, and more preferably L: 5 to 30, a: -2 to 5, and b: -15 to 15. When the Lab values ​​in a cured state are within the preferred ranges, the black curable resin layer 10, after curing, can block light between the light emitting elements 21, 22, and 23, and can further improve the contrast of the display.

[0019] [Total light transmittance] The total light transmittance of the black curable resin layer 10 in the cured state is lower than that of the translucent layer 15 described later. Specifically, the total light transmittance of the black curable resin layer 10 in the cured state is adjusted to be greater than 0% and equal to or less than 8%. The total light transmittance of the black curable resin layer 10 in the cured state is preferably adjusted to be greater than 0% and equal to or less than 7%, more preferably greater than 0% and equal to or less than 6%. When the total light transmittance is equal to or less than the upper limit value such as 8%, 7% or 6%, the black curable resin layer 10 can realize light shielding between the light emitting elements 21, 22, and 23 after curing, and can maintain a high contrast ratio of the light emitting electronic component 5. The total light transmittance in this specification can be measured in accordance with JIS K 7361-1. The total light transmittance in the cured state can be changed mainly by the presence or absence of carbon black or the amount of carbon black. The total light transmittance in the cured state can also be changed by changing the thickness of the black curable resin layer 10 and the type of resin composition.

[0020] [Storage modulus] The storage modulus of the black curable resin layer 10 in an uncured state at 100° C. is preferably 1.0×10 5 Pa or less, more preferably 1.0×10 1 Pa or more 1.0×10 5 Pa or less, and even more preferably 1.0×10 2 Pa or more 5.0×10 4 Pa or less. In an uncured state, the storage modulus of the black curable resin layer 10 at 100°C is a preferred upper limit or less, so that the black curable resin layer 10 exhibits sufficient fluidity when pressure-bonded to the element-mounted substrate 2, and can sufficiently fill the gaps between the light-emitting elements 21, 22, 23 by following the unevenness of the element-mounted substrate 2 due to the light-emitting elements 21, 22, 23. In an uncured state, the storage modulus of the black curable resin layer 10 at 100°C is a preferred lower limit or more, so that pressure bias during thermocompression of the black curable resin layer 10 can be prevented, and a uniform appearance can be maintained. In addition, the outflow of the resin outside a predetermined range can be prevented, and the film thickness after pressure bonding can be ensured.

[0021] The storage modulus of the black curable resin layer 10 at 60° C. after heat treatment at 120° C. for 1 hour is preferably 7×10 8 Pa or more 2×10 10 Pa or less. When the storage modulus is equal to or less than the preferred upper limit, it is possible to prevent cracks from occurring in the cured black curable resin layer 10 when the edge of the substrate 20 is cut. When the storage modulus is equal to or more than the preferred lower limit, it is possible to prevent the cured black curable resin layer 10 from deforming and expanding and contracting when the edge of the substrate 20 is cut, and to prevent the integrated encapsulating sheet 1 on the edge side of the substrate 20 from becoming wavy.

[0022] [Curable resin composition] The black curable resin layer 10 includes a curable resin composition. An example of the curable resin composition is a curable resin composition containing at least one resin selected from an epoxy resin, an acrylic resin, a polyester resin, a polyurethane resin, and a silicone resin, and a curing agent. Among the above curable resin compositions, an epoxy resin composition that can achieve curing at low temperatures and has excellent heat resistance and reliability is preferred. In this specification, the epoxy resin composition is a composition containing an epoxy resin as a main component, or a composition containing an epoxy resin and a curing agent as main components.

[0023] When the black curable resin layer 10 is made of an epoxy resin composition, it may contain a curing agent for epoxy resin other than the modified elastomer having a functional group capable of reacting with an epoxy group. Examples of the other curing agent include known curing agents such as phenol-based curing agents, acid anhydride-based curing agents, and amine-based curing agents. Two or more types of the other curing agents may be used in combination.

[0024] (Epoxy resin) In the present application, an epoxy resin is a compound having an epoxy group in a molecule. The epoxy resin used in the present invention is preferably one having two or more epoxy groups in one molecule. This is because a crosslinked structure is formed by reaction with a modified resin having a functional group capable of reacting with an epoxy group, and the cured product can exhibit high heat resistance. In addition, when an epoxy resin having two or more epoxy groups is used, the degree of crosslinking with a curing agent having a functional group capable of reacting with an epoxy group is sufficient, and sufficient heat resistance is obtained in the cured product.

[0025] Examples of epoxy resins include bifunctional epoxy resins having two epoxy groups in a molecule, polyfunctional epoxy resins having three or more epoxy groups in a molecule, and high molecular weight epoxy resins having a weight average molecular weight of 10,000 or more. They may also be hydrogenated epoxy resins. In this application, high molecular weight epoxy resins are not classified as bifunctional epoxy resins or polyfunctional epoxy resins, but as phenoxy-type epoxy resins, regardless of the number of epoxy groups in the molecule. The weight average molecular weight of an epoxy resin is a polystyrene-equivalent molecular weight measured by gel permeation chromatography.

[0026] Examples of epoxy resins include bisphenol A type epoxy resins, bisphenol F type epoxy resins, phenoxy type epoxy resins obtained by polymerizing these resins, and hydrogenated versions of these resins; glycidyl ester-based epoxy resins such as diglycidyl phthalate, diglycidyl isophthalate, diglycidyl terephthalate, glycidyl p-hydroxybenzoate, diglycidyl tetrahydrophthalate, diglycidyl succinate, diglycidyl adipic acid, diglycidyl sebacate, and triglycidyl trimellitate; ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, Examples of the epoxy resin include, but are not limited to, glycidyl ether-based epoxy resins such as 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, trimethylolpropane triglycidyl ether, pentaerythritol tetraglycidyl ether, tetraphenyl glycidyl ether ethane, triphenyl glycidyl ether ethane, polyglycidyl ether of sorbitol, and polyglycidyl ether of polyglycerol; glycidyl amine-based epoxy resins such as triglycidyl isocyanurate and tetraglycidyl diaminodiphenylmethane; and linear aliphatic epoxy resins such as epoxidized polybutadiene and epoxidized soybean oil. In addition, novolac-type epoxy resins such as xylene structure-containing novolac epoxy resins, naphthol novolac-type epoxy resins, phenol novolac epoxy resins, o-cresol novolac epoxy resins, and bisphenol A novolac epoxy resins can also be used.

[0027] Examples of epoxy resins that can be used include brominated bisphenol A type epoxy resins, phosphorus-containing epoxy resins, fluorine-containing epoxy resins, dicyclopentadiene skeleton-containing epoxy resins, naphthalene skeleton-containing epoxy resins, anthracene type epoxy resins, tertiary butyl catechol type epoxy resins, triphenylmethane type epoxy resins, tetraphenylethane type epoxy resins, biphenyl type epoxy resins, and bisphenol S type epoxy resins.

[0028] Examples of high molecular weight epoxy resins that can be used include phenoxy type epoxy resins, epoxy modified polybutadiene, copolymers of glycidyl methacrylate and methyl methacrylate, modified polymers obtained by epoxy modifying other resins, etc. These epoxy resins may be used alone or in combination of two or more.

[0029] Among the above epoxy resins, the epoxy resin used in the black curable resin layer 10 is preferably a multifunctional epoxy resin from the viewpoint of increasing the crosslink density after curing. Among the multifunctional epoxy resins, novolac-type epoxy resins are particularly more preferable for the following reasons. Novolac-type epoxy resins are epoxy resins that can be appropriately introduced with a flexible skeleton and can adjust the flexibility and softening point. This makes the cured product less likely to undergo brittle fracture, improves the stability of the performance of the cured product of the epoxy resin composition over long-term use, and increases the crosslink density. In addition, the heat resistance of the cured product is also improved.

[0030] Specific examples of novolac-type epoxy resins include "YX7700" manufactured by Mitsubishi Chemical Corporation, "NC7000L", "XD1000", and "EOCN-1020" manufactured by Nippon Kayaku Co., Ltd., "ESN485" manufactured by Nippon Steel Chemical & Material Co., Ltd., and "N-660", "N-690", "N-695", and "HP-7200H" manufactured by DIC Corporation.

[0031] The blending amount of the polyfunctional epoxy resin in the black curable resin layer 10 is preferably 10 to 99% by mass, more preferably 40 to 95% by mass, and even more preferably 60 to 90% by mass, based on 100% by mass of the total resin solid content of the black curable resin layer 10. When the blending amount is equal to or more than the lower limit, the crosslinking density can be increased to impart chemical resistance and heat resistance. When the blending amount is equal to or less than the upper limit, the storage modulus during thermocompression bonding can be adjusted, and the fluidity of the black curable resin layer 10 can be ensured.

[0032] The black curable resin layer 10 preferably does not contain a high molecular weight epoxy resin. This makes it easier to ensure sufficient fluidity of the black curable resin layer 10 during thermocompression bonding. When the black curable resin layer 10 contains a high molecular weight epoxy resin, the amount of the high molecular weight epoxy resin is preferably less than 50 mass%, more preferably less than 30 mass%, and even more preferably less than 10 mass%, relative to 100 mass% of the total resin solid content of the black curable resin layer 10.

[0033] From the viewpoint of ensuring sufficient fluidity during thermocompression bonding, the black curable resin layer 10 preferably contains an epoxy resin having a softening point or melting point of 100° C. or less. From the viewpoint of handleability and heat resistance of the cured product, the black curable resin layer 10 more preferably contains an epoxy resin having a softening point or melting point of 40 to 95° C. By containing an epoxy resin having a softening point or melting point within the above range, it becomes easy to control the storage modulus of the black curable resin layer 10.

[0034] The total amount of epoxy resin in the black curable resin layer 10 is preferably 10 to 100% by mass, more preferably 20 to 99% by mass, and even more preferably 35 to 95% by mass, relative to 100% by mass of the total resin solid content of the black curable resin layer 10. Within the above range, the storage modulus of the black curable resin layer 10 can be easily controlled, and appropriate fluidity during thermocompression bonding can be ensured. In addition, when the amount is equal to or greater than the above lower limit, the heat resistance of the black curable resin layer 10 after curing can be improved.

[0035] (Elastomer) The black curable resin layer 10 preferably contains an elastomer in addition to a resin such as an epoxy resin. By containing an elastomer, it becomes easier to control the storage modulus of the black curable resin layer 10, that is, to control the fluidity.

[0036] As the elastomer, a thermosetting elastomer, generally called "rubber", is preferred because it provides excellent heat resistance. Examples of the thermosetting elastomer include acrylonitrile butadiene rubber (NBR), which is a random copolymer of butadiene and acrylonitrile, acrylic rubber, styrene butadiene rubber, vinyl acetate resin, silicone resin, and the like. Among these, NBR is preferred. NBR has good compatibility with epoxy resins, making it easy to control the fluidity of the black curable resin layer 10 at around 100°C, and as a result, the adhesion between the black curable resin layer 10 and the semi-transparent layer 15 and the element-mounted substrate 2 is good.

[0037] The weight average molecular weight of the elastomer is preferably 100,000 to 1,000,000, more preferably 120,000 to 500,000, and even more preferably 150,000 to 300,000. When the weight average molecular weight of the elastomer is within the above range, the storage modulus of the black curable resin layer 10 can be easily controlled, and the flowability during thermocompression bonding can be ensured. When the weight average molecular weight of the elastomer is equal to or less than the above upper limit, the compatibility between the elastomer and the epoxy resin is improved, and the flowability during thermal curing of the black curable resin layer 10 can be more effectively controlled.

[0038] In particular, when the black curable resin layer 10 is composed of an epoxy resin composition, it preferably contains a modified elastomer having a functional group capable of reacting with an epoxy group. The modified elastomer having a functional group capable of reacting with an epoxy group also acts as a curing agent for the epoxy resin. In addition, since the modified elastomer can react and bond with the epoxy resin, the heat resistance and reliability against thermal shock after curing of the black curable resin layer 10 are improved. Furthermore, the difference in polarity between the functional group capable of reacting with the epoxy resin and the resin skeleton has a favorable effect on dispersibility, and good dispersibility can be obtained when carbon black is contained in the black curable resin layer 10.

[0039] Examples of functional groups that can react with epoxy groups include acid groups such as carboxy groups, sulfo groups, nitro groups, and phosphoric acid groups, as well as their acid anhydride groups, hydroxyl groups, and amino groups. Among these, acid groups and acid anhydride groups are preferred because they can be cured at low temperatures and can ensure a long pot life. For the same reason, carboxy groups and carboxylic anhydride groups are particularly preferred.

[0040] That is, when the black curable resin layer 10 is composed of an epoxy resin composition, it preferably contains an acid-modified elastomer having an acid group or an acid anhydride group, more preferably contains an acid-modified elastomer having a carboxy group, and even more preferably contains modified NBR having a carboxy group.

[0041] The modified NBR having a carboxy group is preferably a carboxylated acrylonitrile rubber into which acrylic acid, methacrylic acid, maleic anhydride, etc. have been introduced. Commercially available products of the carboxylated acrylonitrile rubber include "NX775" and "1072CGJ" manufactured by Zeon Corporation. Two or more types of modified elastomers having a functional group capable of reacting with an epoxy group may be used in combination.

[0042] The amount of the elastomer in the black curable resin layer 10 is preferably 0.01 to 90% by mass, more preferably 1 to 80% by mass, and even more preferably 5 to 65% by mass, based on 100% by mass of the total resin solid content of the black curable resin layer 10. Within the above range, the storage modulus of the black curable resin layer 10 can be easily controlled, and appropriate fluidity of the black curable resin layer 10 during thermocompression bonding can be ensured. In addition, when the amount is equal to or greater than the above lower limit, the dispersibility of carbon black in the epoxy resin composition is improved. Furthermore, the film-forming property of the epoxy resin composition is improved, and the distribution of film thickness when the epoxy resin composition is applied to form a film can be narrowed.

[0043] (hardening agent) When the black curable resin layer 10 is made of an epoxy resin composition, it may contain a curing agent for epoxy resin other than the modified elastomer having a functional group capable of reacting with an epoxy group. Examples of the other curing agent include known curing agents such as phenol-based curing agents, acid anhydride-based curing agents, and amine-based curing agents. Two or more types of the other curing agents may be used in combination.

[0044] (curing catalyst) When the black curable resin layer 10 is composed of an epoxy resin composition, it may contain a curing catalyst that promotes the curing reaction of the epoxy resin. Examples of the curing catalyst include imidazole-based, tertiary amine-based, and phosphorus compound-based. Among them, imidazole-based catalysts are preferred because they are compatible with epoxy resins and do not easily cause yellowing. Among imidazole-based curing catalysts, those having a cyanoethyl group are particularly preferred because they are easily dissolved in epoxy resins. The blending amount of the curing catalyst is preferably 0.01 to 5 parts by mass, more preferably 0.05 to 4 parts by mass, and even more preferably 0.1 to 3 parts by mass, relative to 100 parts by mass of the total resin solid content of the black curable resin layer 10. Within the above range, the curing of the black curable resin layer 10 can be sufficiently promoted, and the usable time of the integrated encapsulating sheet 1 can be secured. Two or more types of curing catalysts may be used in combination.

[0045] (Black pigment or black dye) The black curable resin layer 10 is colored black. For coloring, it is preferable that the black curable resin layer 10 contains a black pigment or a black dye, more preferable that the black pigment is contained, and further preferable that the black curable resin layer 10 contains carbon black. By coloring the black curable resin layer 10 black, it is possible to realize light blocking properties between the multiple light emitting elements 21, 22, and 23 of the element-mounted substrate 2.

[0046] The particle size of the carbon black is preferably 10 to 500 nm, more preferably 10 to 300 nm, and even more preferably 10 to 100 nm. The particle size refers to the average particle size, and can be determined by a measuring device using the dynamic light scattering method. An example of the measuring device using the dynamic light scattering method is NanotracWave II UT151 manufactured by Microtrack Bell.

[0047] As the carbon black, one or more of known carbon blacks such as gas black, channel black, furnace black, thermal black, and lamp black can be used. Resin-coated carbon black may also be used. Furthermore, carbon nanofibers and carbon nanotubes may also be used.

[0048] Among the above carbon blacks, gas black is preferred because it has many surface functional groups and high dispersibility, and therefore exerts sufficient light-shielding properties even when added in a small amount. In addition, when the black curable resin layer 10 contains a modified elastomer having a functional group capable of reacting with an epoxy resin, the dispersibility is further increased by the interaction between the surface functional group of the gas black and the functional group of the modified elastomer having a functional group capable of reacting with an epoxy resin, and good light-shielding properties and coating liquid stability can be ensured.

[0049] The blending amount of carbon black is preferably 0.05 to 15 mass %, more preferably 0.1 to 5 mass %, based on the total solid content of the black curable resin layer 10. When the blending amount of carbon black is equal to or more than the above lower limit, sufficient light blocking properties can be obtained. When the blending amount of carbon black is equal to or less than the above upper limit, the thixotropy of the black curable resin layer 10 can be reduced, and the fluidity of the black curable resin layer 10 during thermocompression bonding can be increased. This allows the black curable resin layer 10 to sufficiently fill the spaces between the multiple light emitting elements 21, 22, and 23 of the element-mounted substrate 2.

[0050] (Other Ingredients) The black curable resin layer 10 may contain an inorganic filler to improve flame retardancy and heat resistance and to adjust the refractive index. The black curable resin layer 10 may further contain, as necessary, a resin other than the epoxy resin and the elastomer, a thickener, a defoamer and / or a leveling agent, an adhesion imparting agent such as a coupling agent, and a flame retardant.

[0051] (2) Semi-transparent layer The semi-transparent layer 15 is a layer for sufficiently pressing the black curable resin layer 10 between the multiple light-emitting elements 21, 22, 23 arranged on the element-mounted substrate 2 in the pressure bonding process. It also serves to protect the light-emitting elements 21, 22, 23 from external physical impacts, humidity, moisture, and the like.

[0052] [Total light transmittance] The total light transmittance of the semitransparent layer 15 is not particularly limited as long as it is higher than the total light transmittance of the black curable resin layer 10 in a cured state and does not affect the luminance transmittance and total light transmittance of the integrated encapsulating cured sheet 3 described below, but is preferably adjusted to 30 to 99%, more preferably adjusted to 35 to 95%, and even more preferably adjusted to 40 to 95%. When the total light transmittance of the semitransparent layer 15 is equal to or greater than the above lower limit, light is not prevented from reaching the viewer's side.

[0053] [resin] The semi-transparent layer 15 may be made of a thermoplastic resin or a thermosetting resin. Examples of the resin constituting the semi-transparent layer 15 include polyethylene terephthalate resin, polybutylene terephthalate resin, polyethylene 2,6-naphthalate resin, polyamide resin, polycarbonate resin, polycarbonate copolymer resin, triacetyl cellulose resin, polymethylpentene resin, ethylene-vinyl acetate resin, polyvinyl butyral resin, epoxy resin, acrylic resin, silicone resin, phenoxy resin, syndiotactic polystyrene resin, polyimide resin, etc., and it is preferable to include at least one resin selected from polyethylene terephthalate resin, polyethylene 2,6-naphthalate resin, polycarbonate resin, polycarbonate copolymer resin, ethylene-vinyl acetate resin, polyvinyl butyral resin, epoxy resin, acrylic resin, silicone resin, and polyamide resin in terms of heat resistance, weather resistance, availability, cost, etc. By including these resins, deformation during compression bonding can be prevented.

[0054] The semi-transparent layer 15 may contain a black pigment or black dye in order to suppress unevenness in light emission or color.

[0055] [Film thickness] The thickness of the semitransparent layer 15 is preferably 10 to 250 μm, more preferably 20 to 225 μm, and even more preferably 25 to 150 μm. When the thickness of the semitransparent layer 15 is equal to or more than the preferable lower limit, the occurrence of wrinkles during thermocompression bonding of the integrated encapsulating sheet 1 to the substrate 20 can be suppressed, and the handleability can be improved. When the thickness of the semitransparent layer 15 is equal to or less than the preferable upper limit, the visibility can be improved and the cost can be reduced.

[0056] (3) Protective sheet The protective sheets 13 and 14 have a role of protecting the integrated encapsulating sheet 1. When the integrated encapsulating sheet 1 is formed, the protective sheet 13 can also be used as a sheet to which a coating liquid of a curable resin composition is applied.

[0057] The protective sheets 13 and 14 may be, for example, sheets made of polyesters such as polyethylene terephthalate and polyethylene naphthalate, thermoplastic resins such as polyimide, polyamideimide, polyethylene, polytetrafluoroethylene, polypropylene, and polystyrene, or surface-treated paper.

[0058] Among these, polyester sheets are preferably used from the viewpoints of heat resistance, mechanical strength, ease of handling, etc. The thickness of the protective sheets 13, 14 is not particularly limited and is appropriately selected from the range of about 10 to 150 μm depending on the application. The surface of the protective sheet 13 on which the black curable resin layer 10 is to be provided may be subjected to a release treatment.

[0059] 2. Manufacturing method of integrated encapsulating sheet In order to obtain the integrated encapsulating sheet 1, first, a coating liquid of the curable resin composition for the black curable resin layer 10 is applied to the protective sheet 13 and then dried to prepare the sheet. As the semi-transparent layer 15, a commercially available resin film or the like may be used as it is, or a coating liquid of the curable resin composition for the semi-transparent layer 15 may be applied to the protective sheet 14 and then dried to prepare the sheet.

[0060] Thereafter, these are stacked and laminated so that the semi-transparent layer 15 and the black curable resin layer 10 are in contact with each other, thereby obtaining a laminate in which at least the black curable resin layer 10 and the semi-transparent layer 15 are sequentially stacked on the protective sheet 13. When a commercially available resin film is used for the semi-transparent layer 15, the surface of the semi-transparent layer 15 opposite to the surface on the black curable resin layer 10 side may be covered with a protective sheet 14 as necessary.

[0061] The coating liquid of the curable resin composition of the black curable resin layer 10 preferably contains an organic solvent in an amount that provides a viscosity that allows coating without hindrance. The organic solvent is not particularly limited, but examples thereof include ketones, aromatic hydrocarbons, glycol ethers, glycol ether acetates, esters, alcohols, aliphatic hydrocarbons, and petroleum-based solvents. Specific examples of the organic solvent include ketones such as methyl ethyl ketone, cyclohexanone, methyl butyl ketone, and methyl isobutyl ketone; aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene; glycol ethers such as cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, and triethylene glycol monoethyl ether; ethyl acetate, butyl acetate, isobutyl acetate, ethyl ... Examples of the solvent include esters such as propylene glycol monoethyl ether acetate, dipropylene glycol methyl ether acetate, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, and propylene glycol butyl ether acetate; alcohols such as ethanol, propanol, 2-methoxypropanol, n-butanol, isobutyl alcohol, isopentyl alcohol, ethylene glycol, and propylene glycol; aliphatic hydrocarbons such as octane and decane; petroleum solvents such as petroleum ether, petroleum naphtha, hydrogenated petroleum naphtha, and solvent naphtha, as well as N,N-dimethylformamide (DMF), tetrachloroethylene, and turpentine. When carbon black is blended in the coating liquid, carbon black powder may be added to the coating liquid, or a liquid in which carbon black has been previously dispersed (carbon black dispersion) may be added.

[0062] Examples of the method for applying the curable resin composition include methods using various coaters such as a die coater, a gravure coater, a roll coater, a curtain flow coater, a spin coater, a bar coater, a reverse coater, a kiss coater, a fountain coater, a rod coater, an air doctor coater, a knife coater, a blade coater, a cast coater, a screen coater, etc. The drying temperature is preferably 60 to 160°C, more preferably 80 to 130°C, and even more preferably 90 to 120°C.

[0063] The temperature during lamination is preferably 20 to 120° C., more preferably 30 to 100° C., and even more preferably 40 to 80° C. By setting the temperature to a preferred lower limit or higher, it is possible to ensure adhesion between the black curable resin layer 10 and the semi-transparent layer 15 that allows handling even in uncured state. Furthermore, by setting the temperature to a preferred upper limit or lower, it is possible to prevent air bubbles from being trapped between the black curable resin layer 10 and the semi-transparent layer 15 and the occurrence of wrinkles in each layer 10, 15. Lamination can be performed using, for example, a roll laminator, a press machine, a vacuum press machine, or the like.

[0064] 3. Substrate with elements As shown in Fig. 2, the element-mounted substrate 2 has a plurality of light-emitting elements 21, 22, and 23 arranged on a substrate 20. Fig. 2 and other figures show a schematic view of a portion where three light-emitting elements (light-emitting element 21, light-emitting element 22, and light-emitting element 23) are arranged.

[0065] There is no limitation on the material of the substrate 20, but a known printed circuit board can be suitably used. Known printed circuit boards include a glass epoxy board, a fluororesin board, a ceramic board, and a glass board.

[0066] The light emitting elements 21, 22, 23 are typically light emitting diodes. This embodiment is particularly suitable for the case where the light emitting elements 21, 22, 23 are extremely small. For example, a light emitting diode having a height of 1000 nm to 200 μm and a side length of 0.001 to 0.5 mm can be used. For the element-attached substrate 20 for obtaining mini LEDs or micro LEDs, light emitting diodes of three colors R, G, and B, or blue light emitting diodes can be used as the light emitting elements 21, 22, 23. In addition, the heights of the multiple light emitting elements 21, 22, 23 on the substrate 20 are not limited to being all the same, and may be different from one another, and are preferably different at at least one point. The heights of the light emitting elements 21, 22, 23 are not particularly limited as long as they are smaller than the thickness of the black resin layer 30 described later, but are preferably 5 to 200 μm.

[0067] 4. Light-emitting electronic components and manufacturing method thereof The light-emitting electronic component 5 according to the present embodiment includes an element-mounted substrate 2 having a plurality of light-emitting elements 21, 22, 23 arranged on a substrate 20, and an integrated encapsulating cured sheet 3 that is pressure-bonded to the surface of the element-mounted substrate 2 on which the plurality of light-emitting elements 21, 22, 23 are arranged. The integrated encapsulating cured sheet 3 includes at least a black resin layer 30 that can transmit light emitted from the light-emitting elements 21, 22, 23, and a semi-transparent layer 35 that has higher light transmittance than the black resin layer 30, and the black resin layer 30 and the semi-transparent layer 35 are laminated in this order from the side closer to the element-mounted substrate 2. The black resin layer 30 is a cured layer obtained by thermally curing the black curable resin layer 10. That is, the integrated encapsulating cured sheet 3 is a sheet obtained after the black curable resin layer 10 of the integrated encapsulating sheet 1 has been cured.

[0068] The black resin layer 30 has a thickness greater than the height of the light-emitting elements 21, 22, 23, and is filled in the gaps between the light-emitting elements 21, 22, 23, covering the top surfaces of the light-emitting elements 21, 22, 23. The thickness of the black resin layer 30 is not particularly limited, but is preferably greater than 100% and less than 106%, more preferably greater than 100% and less than 105%, even more preferably greater than 100% and less than 104%, and particularly preferably 101 to 104% of the height of the light-emitting elements 21, 22, 23. When the thickness of the black resin layer 30 is within the above range, the luminance and contrast ratio of the light-emitting electronic component 5 when it is turned on can be both at a high level. In addition, by having a thickness greater than the height of the light-emitting elements 21, 22, 23, all the light-emitting elements 21, 22, 23 are uniformly covered with the black resin layer 30, and the luminance unevenness of each of the light-emitting elements 21, 22, 23 can be suppressed. When the heights of the multiple light emitting elements 21, 22, 23 are different, the thickness of the black resin layer 30 is greater than the height of the tallest light emitting element 21, 22, 23. This ensures that all of the light emitting elements 21, 22, 23 are covered even if they have different heights.

[0069] The black resin layer 30 is capable of transmitting light emitted from the light emitting elements 21, 22, and 23. In this specification, "capable of transmitting light" means that the total light transmittance is greater than 0%.

[0070] The light transmittance of the semi-transparent layer 35 is higher than that of the black resin layer 30. In this specification, the term "light transmittance" refers to light transmittance measured by various known methods, and may be, for example, total light transmittance measured in accordance with JIS K 7361-1 using a haze meter. In addition, the semi-transparent layer 35 may be the same layer as the semi-transparent layer 15 in the integrated encapsulant sheet 1.

[0071] (Luminance transmittance) The luminance transmittance of the cured sheet 3 for integral encapsulation is 70% or more, and preferably 73% or more. In this specification, the term "luminance transmittance" refers to a transmittance calculated from the luminance of the light-emitting elements 21, 22, and 23 on the substrate 2 with elements before and after the cured sheet 3 for integral encapsulation is pressed. Specifically, the luminance transmittance is measured by measuring the luminance of the light-emitting elements 21, 22, and 23 on the substrate 2 with elements before the cured sheet 3 for integral encapsulation is pressed (hereinafter also referred to as pre-mounting luminance) when they are turned on, and the luminance of the light-emitting electronic component 5 when they are turned on (hereinafter also referred to as post-mounting luminance). Then, the luminance transmittance is calculated by substituting each measured value into the following formula (I). That is, the luminance transmittance is calculated by dividing the value of the post-mounting luminance by the value of the pre-mounting luminance. If the luminance transmittance is equal to or greater than the lower limit of the numerical value, the post-mounting luminance can be kept high. The luminance transmittance is 70 to 100%, preferably 70 to 99%, more preferably 70 to 95%, even more preferably 70 to 90%, and particularly preferably 73 to 83%. If the luminance transmittance is within this range, the luminance after mounting can be maintained at a high value. Luminance transmittance (%) = (Luminance after mounting / Luminance before mounting) × 100 (I)

[0072] (Total light transmittance of one-piece encapsulation cured sheet) The total light transmittance of the integrated encapsulating cured sheet 3 (hereinafter, sometimes referred to as the total light transmittance after curing) is 5% or less, preferably 1% or less, more preferably 0.5% or less, and even more preferably 0.3% or less. The total light transmittance can be measured by various known methods, such as a method conforming to JIS K 7361-1 using a haze meter. If the total light transmittance is equal to or less than the upper limit of the numerical value, the contrast ratio of the light-emitting electronic component 5 can be increased. In addition, the total light transmittance is preferably 0.01 to 5%, more preferably 0.03 to 1%, even more preferably 0.03 to 0.5%, and particularly preferably 0.03 to 0.3%. If the total light transmittance is within the numerical range, the contrast ratio of the light-emitting electronic component 5 can be kept high.

[0073] The luminance after mounting is not particularly limited, but is preferably 1800 cd / m 2 More preferably, it is 1900 cd / m 2 or more, and even more preferably 2000 cd / m 2 If the luminance after mounting is equal to or greater than the lower limit, visibility in a bright place when the display is turned on can be improved.

[0074] The contrast ratio of the light-emitting electronic component 5 is not particularly limited, but is preferably at least 1,000,000:1, more preferably at least 1,200,000:1, and even more preferably at least 1,500,000:1. When the contrast ratio is at least the lower limit, bright and dark colors can be displayed more vividly when the display is turned on.

[0075] The manufacturing method of the light-emitting electronic component according to the present embodiment includes a step of pressing the black curing resin layer 10 side of the integrated encapsulating sheet 1, in which the black curing resin layer 10 and the semi-transparent layer 15 are laminated, to the surface on which the light-emitting elements 21, 22, 23 are arranged in the element-mounted substrate 2, in which the light-emitting elements 21, 22, 23 are arranged on the substrate 20 (hereinafter, referred to as a pressing step), a step of filling the black curing resin layer 10 between the light-emitting elements 21, 22, 23 and covering the top surfaces of the light-emitting elements 21, 22, 23 with the black curing resin layer 10 (hereinafter, referred to as a filling step), and a step of curing the black curing resin layer 10 (hereinafter, referred to as a curing step). Hereinafter, the manufacturing method of the light-emitting electronic component according to one embodiment (also simply referred to as a "manufacturing method according to one embodiment") will be described with reference to Figs. 2 to 4.

[0076] (i) Pressure bonding process In the manufacturing method of this embodiment, first, as shown in FIG. 2, an integrated encapsulating sheet 1 from which the protective sheet 13 has been peeled off to expose the black curable resin layer 10 is placed on the surface of the element-mounted substrate 2 on which the light-emitting elements 21, 22, and 23 are arranged, so that the black curable resin layer 10 is in contact with the surface.

[0077] The thickness of the black curable resin layer 10 before pressure bonding is not particularly limited as long as it does not affect the contrast ratio and post-mounting brightness of the light-emitting electronic component 5, but is preferably greater than 100% and less than 106%, more preferably greater than 100% and less than 105%, even more preferably greater than 100% and less than 104%, and particularly preferably 101 to 104% of the height of the plurality of light-emitting elements 21, 22, 23 to be pressure bonded. If the thickness is within the above range, the thickness of the black resin layer 30 in a cured state can be kept in an appropriate range, and the brightness transmittance can be kept in a preferred numerical range, so that both high brightness and high contrast ratio can be achieved.

[0078] (ii) Filling process 2, a part of the black curable resin layer 10 of the integrated encapsulating sheet 1 is embedded between the light emitting elements 21, 22, 23 as shown in FIG. 3. At the same time, the entire light emitting elements 21, 22, 23, including the upper part of the elements, are covered with the black curable resin layer 10. At this time, if the storage modulus of the black curable resin layer 10 is relatively low and the fluidity of the layer 10 is ensured, the black curable resin layer 10 will easily fill between the light emitting elements 21, 22, 23 while following the unevenness of the light emitting elements 21, 22, 23.

[0079] The temperature in the thermocompression bonding is preferably 80 to 120° C., more preferably 90 to 110° C. By setting the temperature at 80° C. or higher, the fluidity of the black curable resin layer 10 of the integrated encapsulating sheet 1 is easily ensured. Furthermore, by setting the temperature at 120° C. or lower, the light emitting elements 21, 22, and 23 are less likely to be damaged. By setting the temperature at 90 to 110° C., the fluidity of the black curable resin layer 10 can be more precisely controlled, and the occurrence of unevenness or crack-like defects can be suppressed.

[0080] The pressure in the thermocompression bonding is 0.05 to 5.0 MPa, preferably 0.05 to 1.0 MPa, and more preferably 0.1 to 0.5 MPa. By setting the pressure to a preferable lower limit or more, the black curable resin layer 10 can be sufficiently filled between the light emitting elements 21, 22, and 23. By setting the pressure to a preferable upper limit or less, the light emitting elements 21, 22, and 23 are less likely to be damaged. The thermocompression bonding is preferably performed using a vacuum press machine capable of molding in a vacuum state. This makes it easier to avoid defects caused by air being mixed into the obtained light emitting electronic component 5.

[0081] (iii) Curing process After the pressure bonding, as shown in FIG. 4, the protective sheet 14 is peeled off and then thermally cured, so that the black curable resin layer 10 of the integrated encapsulating sheet 1 becomes a black resin layer 30 (a cured layer of the black curable resin layer 10), thereby obtaining a light-emitting electronic component 5.

[0082] The curing temperature is preferably 100 to 160° C., and more preferably 110 to 150° C. By setting the curing temperature to 100° C. or more, the black curable resin layer 10 of the integrated encapsulating sheet 1 can be reliably cured. By setting the curing temperature to 110° C. or more, the curing time of the black curable resin layer 10 can be shortened. Furthermore, by setting the curing temperature to the above upper limit temperature or less, the light emitting elements 21, 22, and 23 are less likely to be damaged.

[0083] 2 to 4, a light-emitting electronic component 5 is obtained in which an integrated encapsulating cured sheet 3 is pressure-bonded to the surface of the element-mounted substrate 2 on which the light-emitting elements 21, 22, and 23 are arranged, the surface being formed by pressure bonding the light-emitting elements 21, 22, and 23 of the element-mounted substrate 2 having the light-emitting elements 21, 22, and 23 arranged on the substrate 20. In the obtained light-emitting electronic component 5, the black curable resin layer 10 is cured to form a black resin layer 30. A portion of the black resin layer 30 is filled between the light-emitting elements 21, 22, and 23. The black resin layer 30 also covers the top surfaces of the light-emitting elements 21, 22, and 23.

[0084] Second embodiment Next, a second embodiment will be described. The same reference numerals will be used for the parts common to the first embodiment, and the description will be omitted. Fig. 5 shows a cross-sectional view in the same view as Fig. 1 of an integrated encapsulating sheet used in the manufacture of a light-emitting electronic component according to another embodiment. Fig. 6 shows a cross-sectional view in the same view as Fig. 1 of a light-emitting electronic component according to another embodiment manufactured using the integrated encapsulating sheet of Fig. 5.

[0085] 1. Integrated encapsulating sheet The integrated encapsulating sheet 1a according to the second embodiment is a laminate in which at least a black curable resin layer 10 and a semi-transparent layer 15a are laminated in this order. The semi-transparent layer 15a is a layer in which a transparent curable resin layer 11 and a base layer 12 are laminated in this order from the side closer to the black curable resin layer 10.

[0086] (4)Transparent curable resin layer The transparent curable resin layer 11 is a layer for sufficiently pressing the black curable resin layer 10 between the plurality of light emitting elements 21, 22, 23 arranged on the element-mounted substrate 2 in the pressure bonding process. The transparent curable resin layer 11 is formed between the black curable resin layer 10 and a base layer 12 described below. The transparent curable resin layer 11 is not in contact with the plurality of light emitting elements 21, 22, 23.

[0087] [Total light transmittance] The total light transmittance of the transparent curable resin layer 11 in the cured state is not particularly limited as long as it does not affect the contrast ratio and luminance when lit of the light-emitting electronic component 5a described below, and is preferably adjusted to be 30 to 99%, more preferably 35 to 95%, and even more preferably 40 to 90%.

[0088] [Storage modulus] The storage elastic modulus of the transparent curable resin layer 11 in an uncured state is preferably greater than that of the black curable resin layer 10. Similarly, at 100° C. and 150° C., the storage elastic modulus of the transparent curable resin layer 11 is preferably greater than that of the black curable resin layer 10.

[0089] The storage elastic modulus of the transparent curable resin layer 11 is preferably greater than that of the black curable resin layer 10 at 100 to 150° C. When the storage elastic modulus of the transparent curable resin layer 11 is greater than that of the black curable resin layer 10 at 100° C. and 150° C., the storage elastic modulus of the transparent curable resin layer 11 is usually greater than that of the black curable resin layer 10 over the entire range of 100 to 150° C.

[0090] The storage modulus of the transparent curable resin layer 11 at 100° C. is preferably 1.0×10 3 Pa or more 1.0×10 7 Pa or less, more preferably 5.0×10 3 Pa or more 5.0×10 5 Pa or less.

[0091] Since the storage modulus of the transparent curable resin layer 11 at 100° C. is equal to or less than the preferred upper limit, sufficient fluidity is obtained that does not hinder the flow of the black curable resin layer 10 when pressure-bonded to the element-mounted substrate 2. In addition, the transparent curable resin layer 11 can sufficiently fill the spaces between the light-emitting elements 21, 22, and 23 by conforming to the unevenness of the element-mounted substrate 2 caused by the light-emitting elements 21, 22, and 23.

[0092] By making the storage modulus of the transparent curable resin layer 11 at 100°C equal to or greater than the preferred lower limit, the fluidity of the transparent curable resin layer 11 can be suppressed, and the surface of the transparent curable resin layer 11 can be made smoother after thermocompression bonding in accordance with the light emitting elements 21, 22, and 23. As a result, the appearance can be improved, and appearance defects such as a repellency phenomenon that creates recesses on the layer surface during thermal curing can be prevented.

[0093] The storage modulus of the transparent curable resin layer 11 at 150° C. is preferably 1.0×10 4 Pa or more, more preferably 1.0×10 4 Pa or more 5.0×10 7 Pa or less, and even more preferably 1.0×10 5 Pa or more 5.0×10 6Pa or less. When the storage modulus of the transparent curable resin layer 11 at 150°C is equal to or less than the preferred upper limit, cracks due to cure shrinkage during thermal curing are unlikely to occur. When the storage modulus of the transparent curable resin layer 11 at 150°C is equal to or more than the preferred lower limit, flow during thermal curing of the transparent curable resin layer 11 can be suppressed, and poor appearance after curing, such as a repellency phenomenon, can be suppressed. Furthermore, problems are unlikely to occur when etching is performed in a later process.

[0094] The storage modulus of the transparent curable resin layer 11 at 100°C is preferably 10 to 1000 times, more preferably 30 to 500 times, the storage modulus of the black curable resin layer 10. The storage modulus of the transparent curable resin layer 11 at 150°C is preferably 5 to 10000 times, more preferably 10 to 1000 times, the storage modulus of the black curable resin layer 10. When the storage modulus of the transparent curable resin layer 11 is greater than that of the black curable resin layer 10 at 100°C and 150°C, the storage modulus of the transparent curable resin layer 11 is usually greater than that of the black curable resin layer 10 over the entire range of 100 to 150°C.

[0095] The storage modulus of the transparent curable resin layer 11 at 60° C. after heat treatment at 120° C. for 1 hour is preferably 7×10 8 Pa or more 2×10 10 Pa or less. When the storage modulus is equal to or less than the preferred upper limit, cracks can be prevented in the cured transparent curable resin layer 11 when the edge of the substrate 20 is cut. When the storage modulus is equal to or more than the preferred lower limit, deformation and expansion / contraction of the cured transparent curable resin layer 11 can be prevented when the edge of the substrate 20 is cut. As a result, wavy distortion of the integrated encapsulating sheet 1 on the edge side of the substrate 20 can be prevented.

[0096] [Curable resin composition] The transparent curable resin layer 11 is composed of a curable resin composition. As with the black curable resin layer 10, the curable resin composition may be a curable resin composition containing at least one resin selected from an epoxy resin, an acrylic resin, a polyester resin, a polyurethane resin, and a silicone resin, and a curing agent. Among these, an epoxy resin composition is preferred because it can be cured at low temperatures and has excellent heat resistance and reliability.

[0097] (Epoxy resin) Examples of the epoxy resin used in the transparent curable resin layer 11 include the same types as those in the black curable resin layer 10. From the viewpoint of imparting an appropriate viscosity during compression bonding to the transparent curable resin layer 11, the transparent curable resin layer 11 preferably contains a high molecular weight epoxy resin having a weight average molecular weight of 10,000 to 100,000. In addition, from the viewpoint of having good compatibility with other resin components and being able to dissolve without mixing with a high boiling point solvent that may remain in the integrated encapsulating sheet 1a even after drying, the transparent curable resin layer 11 more preferably contains a high molecular weight epoxy resin having a weight average molecular weight of 10,000 to 35,000.

[0098] The transparent curable resin layer 11 has an appropriate viscosity when heated because it contains a high molecular weight epoxy resin with a weight average molecular weight of 10,000 to 100,000. Therefore, the storage modulus of the transparent curable resin layer 11 at 100 to 150° C. can be adjusted to a preferred range. The high molecular weight epoxy resin is preferably a phenoxy type epoxy resin because it has good compatibility with other epoxy resins.

[0099] Phenoxy type epoxy resin has a relatively large molecular weight among epoxy resins and has a suitable viscosity when heated. Therefore, the storage modulus of the transparent curable resin layer 11 containing the phenoxy type epoxy resin in the range of 100 to 150 ° C. can be adjusted to a preferred range. Moreover, unlike other thermoplastic resins such as polyester, the phenoxy type epoxy resin can be cured as an epoxy resin. Therefore, the phenoxy type epoxy resin increases the crosslinking density and does not impair the heat resistance of the cured product or the reliability of the performance for long-term use. From the viewpoint of ensuring the storage modulus that presses the black curable resin layer 10 during thermocompression bonding, the glass transition temperature of the phenoxy type epoxy resin used in the transparent curable resin layer 11 is preferably 100 ° C. or higher.

[0100] Specific examples of phenoxy type epoxy resins include "1256", "YX7200", "YX8100", and "YX7180" manufactured by Mitsubishi Chemical Corporation, "YP-50", "YP-50S", and "YP-70" manufactured by Nippon Steel Chemical & Material Co., Ltd., and "N-690", "HM-091", "H-157", and "EXA-192" manufactured by DIC Corporation.

[0101] The blending amount of the high molecular weight epoxy resin in the transparent curable resin layer 11 is preferably 30 to 80 mass %, more preferably 40 to 70 mass %, and even more preferably 45 to 60 mass %, relative to 100 mass % of the total resin solid content of the transparent curable resin layer 11. The same is true for the preferred blending amount of the phenoxy type epoxy resin in the transparent curable resin layer 11.

[0102] When the blending amount is within the above range, it becomes easy to control the storage modulus. This ensures a storage modulus that can press the transparent curable resin layer 11 during thermocompression bonding. In addition, flow during thermosetting can be suppressed, and poor appearance after curing such as a repellent phenomenon can be suppressed. Furthermore, problems are unlikely to occur when etching is performed in a later process. In addition, toughness is improved, and crack-like defects are unlikely to occur during thermocompression bonding. In addition, when the blending amount is equal to or less than the above upper limit, the crosslink density of the transparent curable resin layer 11 in the cured state can be increased, and the heat resistance and chemical resistance can be improved.

[0103] Furthermore, the epoxy resin used in the transparent curable resin layer 11 preferably contains a polyfunctional epoxy resin. The polyfunctional epoxy resin can increase the crosslink density, thereby further improving the stability of the performance of the cured product of the epoxy resin composition over long-term use and improving the heat resistance. In addition, the viscosity of the polyfunctional epoxy resin is lower than that of the phenoxy type epoxy resin in the range of 100 to 150°C. Therefore, the storage modulus of the transparent curable resin layer 11 can be adjusted by combining the polyfunctional epoxy resin with the phenoxy type epoxy resin.

[0104] Specific examples of polyfunctional epoxy resins include "YX7700", "157S70", and "1032S60" manufactured by Mitsubishi Chemical Corporation, "NC7000L", "XD1000", and "EOCN-1020" manufactured by Nippon Kayaku Co., Ltd., "ESN485" manufactured by Nippon Steel Chemical & Material Co., Ltd., and "N-660", "N-690", "N-695", and "HP-7200H" manufactured by DIC Corporation.

[0105] The blending amount of the polyfunctional epoxy resin in the transparent curable resin layer 11 is preferably 90% by mass or less, more preferably 10 to 80% by mass, and even more preferably 25 to 60% by mass, relative to 100% by mass of the total resin solid content of the transparent curable resin layer 11. Within the above range, the storage modulus of the transparent curable resin layer 11 during thermocompression bonding can be controlled, and heat resistance and chemical resistance can be imparted in the cured state.

[0106] From the viewpoint of ensuring sufficient fluidity during thermocompression bonding, the transparent curable resin layer 11 preferably contains an epoxy resin having a softening point or melting point of 120° C. or less, and from the viewpoint of handleability and heat resistance of the cured product, more preferably contains an epoxy resin having a softening point or melting point of 50 to 105° C. By containing an epoxy resin having a softening point or melting point within the above range, it becomes possible to control the storage modulus.

[0107] The total amount of epoxy resin in the transparent curable resin layer 11 is preferably 10 to 100% by mass, more preferably 30 to 99% by mass, and even more preferably 50 to 95% by mass, relative to 100% by mass of the total resin solid content of the transparent curable resin layer 11. Within the above range, the storage modulus is easily controlled. This ensures a storage modulus that presses the black curable resin layer 10 during thermocompression bonding. Furthermore, within the above range, flow during thermal curing can be suppressed, and poor appearance after curing, such as a repellency phenomenon, can be suppressed. Furthermore, problems are unlikely to occur when etching is performed in a subsequent process. Furthermore, when the amount is equal to or greater than the above lower limit, heat resistance is improved in the cured state.

[0108] (Elastomer) The transparent curable resin layer 11 preferably contains an elastomer in addition to a resin such as an epoxy resin. By containing an elastomer, it becomes easy to control the storage modulus. As the elastomer, the same types as those of the black curable resin layer 10 can be mentioned. Among them, NBR is preferable for the following reasons. NBR has good compatibility with epoxy resin. In addition, it is because it can increase the storage modulus of the transparent curable resin layer 11 at about 150°C, and as a result, the adhesion between the transparent curable resin layer 11 and the black curable resin layer 10 becomes good. The preferable weight average molecular weight of the elastomer is the same as that of the black curable resin layer 10.

[0109] In particular, when the transparent curable resin layer 11 is composed of an epoxy resin composition, it preferably contains a modified elastomer having a functional group capable of reacting with an epoxy group. The modified elastomer also acts as a curing agent for the epoxy resin. In addition, since it can react and bond with the epoxy resin, it improves heat resistance and reliability against thermal shock. Furthermore, the difference in polarity between the functional group and the resin skeleton has a favorable effect on dispersibility. This allows good dispersibility to be obtained when carbon black is contained in the transparent curable resin layer 11.

[0110] Examples of functional groups capable of reacting with an epoxy group include the same types as those in the black curable resin layer 10. Among them, an acid group or an acid anhydride group is preferred, and a carboxy group or a carboxylic acid anhydride group is particularly preferred, since they can be cured at low temperatures and can ensure a long pot life.

[0111] When the transparent curable resin layer 11 is composed of an epoxy resin composition, it particularly preferably contains modified NBR having a carboxy group. Examples of modified NBR having a carboxy group include the same types as those of the black curable resin layer 10. Two or more types of modified elastomers having a functional group capable of reacting with an epoxy group may be used in combination.

[0112] The blending amount of the elastomer in the transparent curable resin layer 11 is preferably 0 to 50% by mass, more preferably 1 to 70% by mass, and even more preferably 5 to 50% by mass, based on 100% by mass of the total resin solid content of the transparent curable resin layer 11. Within the above range, the storage modulus can be controlled. Furthermore, when the blending amount is equal to or less than the upper limit, the storage modulus for pressing the black curable resin layer 10 during thermocompression bonding can be ensured. Furthermore, flow during thermal curing can be suppressed, and poor appearance after curing such as a repellent phenomenon can be suppressed. Furthermore, problems are unlikely to occur when etching is performed in a later process. Furthermore, when the blending amount is equal to or more than the lower limit, the dispersibility of carbon black is improved. Furthermore, the film-forming property is improved, and the distribution of film thickness can be narrowed when the epoxy resin composition is applied to form a film.

[0113] (hardening agent) When the transparent curable resin layer 11 is made of an epoxy resin composition, it may contain a curing agent for other epoxy resins in addition to the modified elastomer having a functional group capable of reacting with an epoxy group. Examples of the other curing agent include the same curing agents as those used for the black curable resin layer 10. Two or more types of the other curing agents may be used in combination.

[0114] (curing catalyst) When the transparent curable resin layer 11 is made of an epoxy resin composition, it may contain a curing catalyst that accelerates the curing reaction of the epoxy resin. Examples of the curing catalyst include the same curing catalysts as those for the black curable resin layer 10, and the preferred embodiments are also the same.

[0115] The blending amount of the curing catalyst is preferably 0.01 to 5 parts by mass, more preferably 0.05 to 4 parts by mass, and even more preferably 0.1 to 3 parts by mass, relative to 100 parts by mass of the total resin solid content of the transparent curable resin layer 11. When it is within the above range, curing can be sufficiently promoted and the pot life of the integrated encapsulating sheet 1a can be secured. Two or more types of curing catalysts may be used in combination.

[0116] (Other Ingredients) The transparent curable resin layer 11 may contain a black pigment or black dye in order to suppress uneven light emission or color unevenness.

[0117] When the transparent curable resin layer 11 contains carbon black, the amount of carbon black is preferably less than 5 parts by mass, more preferably 1 part by mass or less, and even more preferably 0.1 part by mass or less, relative to 100 parts by mass of the total resin solid content. The transparent curable resin layer 11 may further contain, as necessary, a resin other than the epoxy resin and the elastomer, a thickener, a defoamer and / or a leveling agent, an adhesion imparting agent such as a coupling agent, and a flame retardant.

[0118] [Film thickness] The thickness of the transparent curable resin layer 11 is not particularly limited as long as it does not affect the contrast ratio and luminance when lit of the light-emitting electronic component 5a described later, and is preferably 10 to 250 μm, more preferably 20 to 225 μm, and even more preferably 25 to 150 μm.

[0119] (5) Base material layer The base layer 12 is a layer for protecting the light emitting elements 21, 22, 23 from external physical impacts, humidity, moisture, etc. The base layer 12 also serves as a support for forming another layer (in this embodiment, the transparent curable resin layer 11). The base layer 12 may be made of the same material as the semi-transparent layer 15 in the first embodiment described above, or may be made of a different material.

[0120] [Total light transmittance] The total light transmittance of the base layer 12 is not particularly limited as long as it does not affect the contrast ratio and luminance when lit of the light-emitting electronic component 5a described later, and is preferably 30 to 99%, more preferably 35 to 95%, and even more preferably 40 to 95%. When the total light transmittance of the base layer 12 is equal to or greater than the above lower limit, the light is not prevented from reaching the viewer.

[0121] [resin] The base layer 12 may be made of a thermoplastic resin or a thermosetting resin. Examples of the resin constituting the base layer 12 include polyethylene terephthalate resin, polybutylene terephthalate resin, polyethylene 2,6-naphthalate resin, polyamide resin, polycarbonate resin, polycarbonate copolymer resin, triacetyl cellulose resin, polymethylpentene resin, phenoxy resin, syndiotactic polystyrene resin, polyimide resin, etc., and it is preferable to include at least one resin selected from polyethylene terephthalate resin, polyethylene 2,6-naphthalate resin, polycarbonate resin, polycarbonate copolymer resin, and polyamide resin in terms of heat resistance, weather resistance, availability, cost, etc. By including these resins, deformation during pressure bonding can be prevented. The base layer 12 may contain a black pigment or black dye to suppress uneven light emission and color unevenness.

[0122] [Film thickness] The thickness of the base layer 12 is not particularly limited as long as it does not affect the contrast ratio and luminance during lighting of the light-emitting electronic component 5a described later, and is preferably 10 to 250 μm, more preferably 20 to 225 μm, and even more preferably 25 to 150 μm. When the thickness of the base layer 12 is equal to or greater than the preferred lower limit, the occurrence of wrinkles during thermocompression bonding of the integrated encapsulating sheet 1 to the substrate 20 can be suppressed, and the handleability can be improved. When the thickness of the base layer 12 is equal to or less than the preferred upper limit, visibility can be improved and costs can be reduced.

[0123] 2. Manufacturing method of integrated encapsulating sheet In order to obtain the integrated encapsulating sheet 1a according to the present embodiment, a coating liquid of a curable resin composition for the black curable resin layer 10 is applied to the protective sheet 13 and then dried, and a coating liquid of a curable resin composition for the transparent curable resin layer 11 is applied to the base material layer 12 and then dried.

[0124] Thereafter, these are stacked and laminated so that the transparent curable resin layer 11 and the black curable resin layer 10 are in contact with each other, thereby obtaining a laminate in which the black curable resin layer 10, the transparent curable resin layer 11, and the base layer 12 are stacked in this order on the protective sheet 13. A protective sheet 14 may be laminated on the outer surface of the base layer 12 as necessary.

[0125] 3. Substrate with elements The element-mounted substrate 2 is the same as that in the above-mentioned first embodiment.

[0126] 4. Light-emitting electronic components and manufacturing method thereof The light-emitting electronic component 5a according to this embodiment includes an element-mounted substrate 2 having a plurality of light-emitting elements 21, 22, 23 arranged on a substrate 20, and an integrated encapsulating cured sheet 3a that is pressure-bonded to the surface of the element-mounted substrate 2 on which the plurality of light-emitting elements 21, 22, 23 are arranged. The integrated encapsulating cured sheet 3a is laminated with at least a black resin layer 30 that is capable of transmitting light emitted from the light-emitting elements 21, 22, 23, and a semi-transparent layer 35a that has higher light transmittance than the black resin layer 30, and the black resin layer 30 and the semi-transparent layer 35a are laminated in this order from the side closer to the element-mounted substrate 2.

[0127] The semi-transparent layer 35a is formed by laminating, in order from the side closer to the black resin layer 30, a transparent resin layer 31 having higher light transmittance than the black resin layer 30 and a base material layer 12. The transparent resin layer 31 is a cured layer obtained by thermally curing the transparent curable resin layer 11. That is, the integrated encapsulating cured sheet 3a is a sheet obtained after curing the black curable resin layer 10 and the transparent curable resin layer 11 in the integrated encapsulating sheet 1a.

[0128] Other points are the same as those in the first embodiment described above.

[0129] The method for manufacturing the light-emitting electronic component 5a according to this embodiment includes the steps of: pressing the black curable resin layer 10 side of the integrated encapsulating sheet 1a, in which the black curable resin layer 10 and the translucent layer 15a are laminated, onto the surface on which the plurality of light-emitting elements 21, 22, 23 are arranged in the element-mounted substrate 2, in which the plurality of light-emitting elements 21, 22, 23 are arranged on the substrate 20; filling the black curable resin layer 10 between the plurality of light-emitting elements 21, 22, 23 and covering the top surfaces of the plurality of light-emitting elements 21, 22, 23 with the black curable resin layer 10; and curing the black curable resin layer 10 and the transparent curable resin layer 11.

[0130] The thickness of the transparent curable resin layer 11 before compression bonding is preferably 10 to 500% of the height of the light emitting elements 21, 22, 23. The lower limit is more preferably 20% or more, and even more preferably 30% or more. The upper limit is more preferably 200% or less, and even more preferably 150% or less.

[0131] When the storage modulus of the transparent curable resin layer 11 is relatively high and the fluidity of the layer 11 is suppressed, the transparent curable resin layer 11 can be suppressed from flowing together with the black curable resin layer 10 during thermal curing, and poor appearance is unlikely to occur on the surface. When the thickness of the transparent curable resin layer 11 is less than 20% of the height of the light emitting elements 21, 22, and 23, the range in which the transparent curable resin layer 11 can flow is insufficient, and crack-like defects may occur on the surface. In addition, when the storage modulus of the transparent curable resin layer 11 is relatively high and the fluidity of the layer 11 is suppressed, the transparent curable resin layer 11 can sufficiently press the black curable resin layer 10.

[0132] The total thickness of the black curable resin layer 10 and the transparent curable resin layer 11 before compression bonding is preferably 110 to 550% with respect to the height of the light emitting elements 21, 22, 23. If the total thickness of the black curable resin layer 10 and the transparent curable resin layer 11 is equal to or greater than the above lower limit with respect to the height of the light emitting elements 21, 22, 23, the integrated encapsulating sheet 1 can be sufficiently embedded between the light emitting elements 21, 22, 23. If the total thickness of the black curable resin layer 10 and the transparent curable resin layer 11 is equal to or less than the above upper limit with respect to the height of the light emitting elements 21, 22, 23, thickness unevenness is unlikely to occur during compression bonding, and appearance defects are unlikely to occur on the surface.

[0133] Other points are the same as those in the first embodiment described above.

[0134] Third embodiment Next, a third embodiment will be described. The same reference numerals will be used for the parts common to the first and second embodiments, and the description will be omitted. Fig. 7 shows a cross-sectional view in the same view as Fig. 1 of an integrated encapsulating sheet used in the manufacture of a light-emitting electronic component according to another embodiment. Fig. 8 shows a cross-sectional view in the same view as Fig. 1 of a light-emitting electronic component according to another embodiment manufactured using the integrated encapsulating sheet of Fig. 7.

[0135] 1. Integrated encapsulating sheet The integrated encapsulating sheet 1b according to the third embodiment includes a transparent curable resin layer 11 as a semi-transparent layer 15b, a base material layer 12, and a hard coat layer 16 having an anti-scratch effect on the base material layer 12. In the semi-transparent layer 15b, the transparent curable resin layer 11, the base material layer 12, and the hard coat layer 16 are laminated in this order from the side closer to the black curable resin layer 10.

[0136] (6) Hard Coat Layer The hard coat layer 16 has a scratch-proof effect on the base layer 12 and is a layer for protecting the light-emitting electronic component 5 from scratches. The hard coat layer 16 is formed on the surface of the base layer 12 opposite to the surface having the transparent curable resin layer 11. The hard coat layer 16 is a cured layer.

[0137] [hardness] The pencil hardness of the surface of the hard coat layer 16 is preferably H or more, more preferably 2H or more, and even more preferably 3H or more.

[0138] [Surface roughness] The arithmetic surface roughness (Ra) of the surface of the hard coat layer 16 is preferably 0.1 to 3 μm, more preferably 0.2 to 3 μm, and even more preferably 0.3 to 3 μm. When the Ra of the hard coat layer 16 is equal to or greater than the preferred lower limit, the reflectance of the surface of the hard coat layer 16 can be reduced. When the Ra of the hard coat layer 16 is equal to or less than the preferred upper limit, production becomes easier.

[0139] [Total light transmittance] The total light transmittance of the hard coat layer 16 is not particularly limited as long as it does not affect the contrast ratio and luminance when lit of the light-emitting electronic component 5b described later, and is preferably 20 to 99%, more preferably 40 to 99%, and even more preferably 60 to 99%. When the total light transmittance of the hard coat layer 16 is equal to or greater than the lower limit, it does not prevent light from reaching the viewer.

[0140] [resin] The hard coat layer 16 may be made of either a thermoplastic resin or a thermosetting resin, and is preferably made of a thermosetting resin. Examples of the thermosetting resin constituting the hard coat layer 16 include an acrylic resin, a urethane resin, a silicone resin, a melamine resin, and the like, and may contain one or more of these. The hard coat layer 16 may contain a black pigment or dye.

[0141] [Fine particles] The hard coat layer 16 preferably contains fine particles. As the fine particles, one or both of inorganic fine particles and organic fine particles can be used. As inorganic fine particles, silica fine particles and titanium fine particles can be mentioned. As organic fine particles, polymethyl methacrylate resin (PMMA resin) and urethane resin can be mentioned. Among them, silica fine particles are preferable. By containing fine particles, it is possible to adjust the surface roughness of the hard coat layer 16 and improve the surface hardness.

[0142] [Film thickness] The thickness of the hard coat layer 16 is preferably 1 to 20 μm, more preferably 2 to 10 μm, and even more preferably 3 to 8 μm. When the thickness of the hard coat layer 16 is equal to or greater than the preferred lower limit, sufficient hardness can be ensured. When the thickness of the hard coat layer 16 is equal to or less than the preferred upper limit, defects such as curling do not occur.

[0143] 2. Manufacturing method of integrated encapsulating sheet To obtain the integrated encapsulating sheet 1b according to this embodiment, for example, a protective sheet 13 obtained in the same manner as in the first embodiment is coated with a coating liquid of a curable resin composition for the black curable resin layer 10 and dried, and a substrate layer 12 on which a hard coat layer 16 is formed in advance is coated with a coating liquid of a curable resin composition for the transparent curable resin layer 11 on the surface opposite to the hard coat layer 16. Thereafter, the lamination method and the like are the same as those in the above-mentioned second embodiment.

[0144] The substrate layer 12 having the hard coat layer 16 formed thereon can be obtained by applying a coating agent for the hard coat layer 16 to the surface of the substrate layer 12 and curing the coating agent. Examples of methods for applying the coating agent include various coaters such as a die coater, gravure coater, roll coater, curtain flow coater, spin coater, bar coater, reverse coater, kiss coater, fountain coater, rod coater, air doctor coater, knife coater, blade coater, cast coater, and screen coater. Examples of methods for curing the coating agent include heat curing, ultraviolet curing, and electron beam curing.

[0145] 3. Substrate with elements The element-mounted substrate 2 is the same as that in the above-mentioned first embodiment.

[0146] 4. Light-emitting electronic components and manufacturing method thereof The light-emitting electronic component 5b according to this embodiment includes an element-mounted substrate 2 having a plurality of light-emitting elements 21, 22, 23 arranged on a substrate 20, and an integrated encapsulating cured sheet 3b that is pressure-bonded to the surface of the element-mounted substrate 2 on which the plurality of light-emitting elements 21, 22, 23 are arranged. The integrated encapsulating cured sheet 3b is laminated with at least a black resin layer 30 that is capable of transmitting light emitted from the light-emitting elements 21, 22, 23, and a semi-transparent layer 35b having a higher light transmittance than the black resin layer 30, and is laminated in this order from the side closer to the element-mounted substrate 2.

[0147] The semi-transparent layer 35b is formed by laminating, in order from the side closer to the black resin layer 30, a transparent resin layer 31 having higher light transmittance than the black resin layer 30, a base material layer 12, and a hard coat layer 16. That is, the integrated encapsulating cured sheet 3b is a sheet obtained after the black curable resin layer 10 and the transparent curable resin layer 11 in the integrated encapsulating sheet 1b are cured.

[0148] The manufacturing method of the light-emitting electronic component 5b according to this embodiment is similar to that of the second embodiment described above. EXAMPLES

[0149] The present invention will be specifically described below with reference to examples, although the present invention is not limited to these examples.

[0150] <Raw materials> The raw materials used in each example are as follows: [Epoxy resin] EPICLON(registered trademark) N660: Manufactured by DIC, cresol novolac type multifunctional epoxy resin (solid), softening point 61-69°C, epoxy equivalent 200-215g / eq. EPICLON(registered trademark) HM-091: Manufactured by DIC, bisphenol A type epoxy resin (solid), softening point 135-150℃, epoxy equivalent 2200-2900g / eq.

[0151] [Elastomer] Nipol(R) NX775: Manufactured by Zeon Corporation, carboxy-modified nitrile rubber, elastomer with a weight average molecular weight of 208,000.

[0152] [Curing catalyst] Curesol (registered trademark) 2E4MZ: 2-ethyl-4-methylimidazole, manufactured by Shikoku Kasei Corporation.

[0153] [Carbon black] Special Black#4: ORION ENGINEERED CARBONS, gas black, pH 3, average particle size 25nm.

[0154] [solvent] MEK: Methyl ethyl ketone, manufactured by Junsei Chemical Co., Ltd. PGM: Propylene glycol monomethyl ether, manufactured by Junsei Chemical Co., Ltd.

[0155] [Base material layer] -Cosmoshine (registered trademark) A4300: Toyobo Co., Ltd., PET film, thickness 75 μm.

[0156] [Protective sheet] 1-E: Release film manufactured by Nippa, thickness 50μm.

[0157] Example 1 [Coating liquid for transparent curable resin layer] 50 g (50 parts by mass) of epoxy resin N660, 30 g (30 parts by mass) of HM-091, 20 g (20 parts by mass) of elastomer NX775, and 3 g (3 parts by mass) of curing catalyst 2PZ-CN were mixed in a solvent of MEK / PGM = 80 / 20 (volume ratio) to prepare a coating liquid for transparent curable resin layer with a solid content concentration of 35 mass%.

[0158] [Coating liquid for black curable resin layer] 75g (75 parts by mass) of epoxy resin N660, 25g (25 parts by mass) of elastomer NX775, 3g (3 parts by mass) of curing catalyst 2PZ-CN, and 0.1g (0.1 parts by mass) of carbon black Special Black #4 were mixed in a solvent of MEK / PGM = 80 / 20 (volume ratio) to prepare a coating liquid for a black curable resin layer with a solid content concentration of 35 mass%.

[0159] [Semi-transparent layer] The transparent curable resin layer coating liquid was applied to the substrate layer A4300 using a film applicator with a thickness adjustment function (All Good Co., Ltd.) so that the dry film thickness was 25 μm. Then, it was dried at 120° C. for 5 minutes to obtain a semi-transparent layer including a transparent curable resin layer and a substrate layer.

[0160] [Black sheet] On the release surface of release PET 1-E (Nippa Corporation, 50 μm), a coating solution for the black curable resin layer was applied using a film applicator with a film thickness adjustment function (Allgood Corporation) so that the dry film thickness was 61 μm. The film thickness value is shown in Table 1 as the film thickness of the black layer. After that, it was dried at 120° C. for 5 minutes to obtain a sheet in which the black curable resin layer was supported by the release PET (hereinafter referred to as the black sheet).

[0161] [Integrated encapsulating sheet] The obtained semi-transparent layer and the black sheet were overlaid so that the transparent curable resin layer and the black curable resin layer were in contact with each other, and laminated with a roll laminator at 60°C.

[0162] <Substrate with evaluation element> A substrate with LED elements for evaluation was prepared by arranging multiple LED elements, each 0.1×0.2 mm in size and 60 μm in height, on a glass epoxy substrate.

[0163] [Manufacture of light-emitting electronic components] The release PET 1-E on the black curable resin layer side was peeled off, and the integrated encapsulant sheet was placed so that the black curable resin layer was in contact with the LED light-emitting element of the evaluation element-attached substrate. Then, the substrate was pressed and compressed in a vacuum press under conditions of 100 hPa, 100°C, 0.36 MPa, and 3 minutes. After pressing, the substrate was heated in an oven at 150°C for 1 hour to thermally cure the black curable resin layer and the transparent curable resin layer, thereby obtaining a light-emitting electronic component.

[0164] Example 2 The same procedure as in Example 1 was repeated, except that the coating liquid for the black curable resin layer was applied so that the dry film thickness was 61.9 μm.

[0165] Example 3 The same procedure as in Example 1 was repeated, except that in the coating liquid for the black curable resin layer, the carbon black content was 0.3 g (0.3 parts by mass), and the coating liquid was applied so that the dry film thickness was 61.8 μm.

[0166] Comparative Example 1 The same procedure as in Example 1 was repeated, except that the coating liquid for the black curable resin layer was applied so that the dry film thickness was 64.9 μm.

[0167] Comparative Example 2 The same procedure as in Example 1 was repeated, except that the height of the LED light emitting element was set to 30 μm, and the coating liquid for the black curable resin layer was applied so as to give a dry film thickness of 32 μm.

[0168] (Evaluation method) [Measurement of total light transmittance after curing] The integrated encapsulating cured sheet for measuring the total light transmittance was prepared as follows. The integrated encapsulating sheet obtained by lamination as described above was heated in an oven at 150°C for 1 hour to thermally cure the black curable resin layer and the transparent curable resin layer to obtain an integrated encapsulating cured sheet. The total light transmittance of the prepared sheet was measured in accordance with JIS K 7361-1 using a haze meter NDH5000 manufactured by Nippon Denshoku Industries Co., Ltd. The measurement results are shown in Table 1 as "total light transmittance after curing".

[0169] [Measurement of luminance transmittance and luminance after mounting] The luminance before mounting (luminance when the LED on the board with the evaluation element was lit) and the luminance after mounting (luminance when the light-emitting electronic component was lit) were each measured using a Konica Minolta luminance meter CA-410. The luminance values ​​after mounting are shown in Table 1. Furthermore, as shown in the above formula (I), the luminance transmittance was calculated by dividing the luminance value after mounting by the luminance value before mounting. The calculated results are shown in Table 1. When the luminance after mounting was 1800 cd / m 2 Anything above that was deemed a pass, anything below that was deemed a fail.

[0170] [Contrast ratio measurement] The luminance of the light-emitting electronic components when unlit was measured using a Konica Minolta CA-410 luminance meter. The contrast ratio was calculated by setting the maximum luminance at 70% of the luminance after mounting and the minimum luminance at the time when unlit. The luminance value when unlit was 0.003 cd / m in Comparative Example 2. 2 and 0.001 cd / m for other areas. 2 The contrast ratio was 1,000,000:1 or higher, and was deemed to have passed. The results are shown in Table 1.

[0171] [Table 1]

[0172] From Table 1 above, the contrast ratios of Examples 1 to 3 were all acceptable and were superior to Comparative Example 2. In addition, the luminance after mounting of Examples 1 to 3 was 1800 cd / m2 As described above, the results were superior to those of Comparative Example 1. From the above results, Examples 1 to 3 passed the test in terms of both the luminance value and the contrast ratio value after mounting, and achieved both high contrast ratio and luminance. [Industrial Applicability]

[0173] The light-emitting electronic component according to the present invention can be used, for example, as an electronic component for backlighting inside a display. [Explanation of symbols]

[0174] DESCRIPTION OF SYMBOLS 1, 1a, 1b...integrated encapsulating sheet, 2...substrate with element, 3, 3a, 3b...integrated encapsulating cured sheet, 5, 5a, 5b...light-emitting electronic component, 10...black curable resin layer, 11...transparent curable resin layer, 12...base material layer, 13, 14...protective sheet, 15, 15a, 15b...semi-transparent layer, 16...hard coat layer, 20...substrate, 21, 22, 23...light-emitting element, 30...black resin layer, 31...transparent resin layer, 35, 35a, 35b...semi-transparent layer.

Claims

1. a substrate having a plurality of light-emitting elements disposed thereon; an integrated encapsulating cured sheet pressure-bonded to a surface of the element-mounted substrate on which the plurality of light-emitting elements are arranged, The integrated encapsulating cured sheet includes a black resin layer that can transmit light emitted from the light-emitting element and a semi-transparent layer that has a higher light transmittance than the black resin layer, laminated in this order from the side closer to the element-mounted substrate, the black resin layer has a thickness greater than a height of the light emitting elements, and is present in gaps between the light emitting elements and on a top surface of the light emitting elements; The integrated encapsulating cured sheet has a luminance transmittance of 70% or more, A light-emitting electronic component, characterized in that the integrated encapsulating cured sheet has a total light transmittance of 5% or less.

2. 2. The light-emitting electronic component according to claim 1, wherein the semi-transparent layer is formed by laminating, in order from the side closer to the black resin layer, a transparent resin layer having a higher light transmittance than the black resin layer, and a base material layer.

3. 3. The light-emitting electronic component according to claim 2, wherein the base layer has a hard coat layer, which has an anti-scratch effect on the base layer, on a surface opposite to the black resin layer.

4. The light-emitting electronic component according to any one of claims 1 to 3, characterized in that the heights of the plurality of light-emitting elements differ at least at one point among the light-emitting elements, and the black resin layer has a thickness greater than the height of the tallest light-emitting element among the plurality of light-emitting elements.

5. a step of pressure-bonding a black curing resin layer side of an integrated encapsulating sheet including a black curing resin layer and a semi-transparent layer laminated on a surface of an element-mounted substrate on which a plurality of light-emitting elements are arranged, the surface being on which the plurality of light-emitting elements are arranged; filling the black cured resin layer between the plurality of light-emitting elements and covering the top surfaces of the plurality of light-emitting elements with the black cured resin layer; curing the black curable resin layer; A method for producing a light-emitting electronic component comprising the steps of:

6. The semi-transparent layer is formed by laminating a transparent curable resin layer and a base layer in this order from the side closer to the black curable resin layer, 6. The method for producing a light-emitting electronic component according to claim 5, wherein in the step of curing the black curable resin layer, the transparent curable resin layer is cured.

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