Surface treatment apparatus and coating material

Abstract

To provide a surface treatment apparatus and a coating material, in which the accuracy of surface treatment can be improved.SOLUTION: A surface treatment apparatus comprises: a housing arranged facing a to-be-treated object including a conductor part, in which a liquid chamber can be formed inside; an electrode arranged in the housing; an ion conductive membrane between the electrode and the to-be-treated object; a coating material arranged between the to-be-treated object and the ion conductive membrane; and a power supply unit for applying a voltage between the electrode and the to-be-treated object. The coating material includes a metal mask. The metal mask includes a covering part for covering a non-treated part of the to-be-treated object and a mask opening part for exposing a to-be-treated part of the to-be-treated object. The surface on the ion conductive membrane side of the covering part is subjected to insulation treatment. The surface of the to-be-treated object is treated by electrolysis through the ion conductive membrane and the coating material by applying the voltage between the electrode and the to-be-treated object.SELECTED DRAWING: Figure 1A

Description

[Technical field]

[0001] The present invention relates to a surface treatment device and a coated member. [Background technology]

[0002] Conventionally, there has been known a film formation apparatus that includes an anode, a cathode, a solid electrolyte membrane disposed between the anode and the cathode, and a power supply unit that applies a voltage between the anode and the cathode, and that forms a metal coating on the surface of a substrate by applying a voltage between the anode and the cathode to cause metal ions contained within the solid electrolyte membrane to precipitate on the cathode side (e.g., Patent Document 1).

[0003] This film formation apparatus includes a solution storage section that stores a solution containing metal ions between an anode and a solid electrolyte membrane. An opening is formed in the bottom of the solution storage section, and the solid electrolyte membrane is disposed so as to cover the opening. A moving section is connected to a lid of the solution storage section. The moving section moves the solid electrolyte membrane together with the solution storage section toward the substrate, thereby pressing the solid electrolyte membrane against the film formation region of the substrate. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2014-051701 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, in conventional film forming apparatuses, when performing special surface treatment such as forming a metal coating of a predetermined pattern by placing a resin coating member having a predetermined pattern between the solid electrolyte membrane and the substrate, there is a problem that the resin coating member cannot form a metal coating of a fine pattern with high accuracy.

[0006] Furthermore, with regard to a metallic coating member, even if a coating member having a fine pattern can be created, the coating member also becomes conductive when a voltage is applied, and a metal coating is formed on the surface of the coating member, which poses the problem that it is not possible to form a metal coating with a fine pattern with precision on the surface of the substrate.

[0007] The present invention has been made in consideration of the above problems, and an object of the present invention is to provide a surface treatment device and a coated member that can improve the accuracy of surface treatment. [Means for solving the problem]

[0008] The surface treatment device according to the present invention comprises a housing arranged opposite a workpiece including a conductor portion and capable of forming a liquid chamber therein, an electrode arranged within the housing, an ion conductive membrane arranged between the electrode and the workpiece, and a covering member arranged between the workpiece and the ion conductive membrane, the covering member including a metal mask, the metal mask including a covering portion for covering a non-treated portion of the workpiece and a mask opening for exposing a treated portion of the workpiece, the surface of the covering portion facing the ion conductive membrane being insulated, and the surface of the workpiece is treated by electrolysis via the ion conductive membrane and the covering member by applying a voltage between the electrode and the workpiece.

[0009] The surface treatment device of the present invention includes an electrically conductive part electrically connected to the power supply part, the metal mask includes a power supply side electrically conductive part for electrically connecting to the electrically conductive part, and the covering part has a conductor side electrically conductive part on the surface facing the workpiece for electrically connecting to the conductor part of the workpiece, and the workpiece and the electrically conductive part may be electrically connected via the metal mask.

[0010] In the surface treatment apparatus according to the present invention, the inner surface of the mask opening may be subjected to an insulating treatment.

[0011] In the surface treatment device according to the present invention, an insulating layer may be formed by insulation treatment on a surface of the covering portion facing the treatment object except for the conductor-side current-carrying portion.

[0012] In the surface treatment device according to the present invention, the covering member may include a conductive spacer configured to have a thickness sufficient to fill in a height difference between the insulating layer and the conductor-side current-carrying portion.

[0013] In the surface treatment device of the present invention, the coating member includes a conductive spacer provided on the conductor side current-carrying portion of the coating portion, and a buffer portion provided on the surface of the coating portion facing the workpiece, the buffer portion being arranged in a portion of the surface facing the workpiece excluding the conductor side current-carrying portion and having better adhesion to the workpiece than the coating portion, and the conductive spacer may be configured to a thickness sufficient to fill the height difference between the buffer portion and the conductor side current-carrying portion.

[0014] In the surface treatment device of the present invention, the conductor side current-carrying portion protrudes from the surface of the coating portion facing the workpiece toward the workpiece, and an insulating layer may be provided on the surface of the coating portion facing the workpiece excluding the conductor side current-carrying portion so as to fill the height difference with the conductor side current-carrying portion.

[0015] In the surface treatment device of the present invention, the coating member includes a buffer portion on the surface of the coating portion facing the workpiece, the conductor side current-carrying portion protruding from the surface of the coating portion facing the workpiece toward the workpiece, and the buffer portion is provided in a portion of the surface facing the workpiece excluding the conductor side current-carrying portion so as to fill the height difference with the conductor side current-carrying portion, and may have better adhesion to the workpiece than the coating portion.

[0016] In the surface treatment device according to the present invention, the insulating layer formed by the insulation treatment may have better adhesion to the workpiece than the covering portion, and may be formed from a chemical-resistant material.

[0017] The covering member according to the present invention is a covering member used in a surface treatment device that is disposed opposite a workpiece and is capable of forming a liquid chamber therein, the housing being provided with an electrode, an ion conductive membrane disposed between the electrode and the workpiece, and a power supply unit that applies a voltage between the electrode and the workpiece, and that treats the surface of the workpiece by electrolysis via the ion conductive membrane by applying a voltage between the electrode and the workpiece, the covering member including a metal mask and configured to be capable of being disposed between the workpiece and the ion conductive membrane, the metal mask including a covering portion for covering a non-treated portion of the workpiece and a mask opening for exposing a treated portion of the workpiece, and the surface of the covering portion facing the ion conductive membrane is insulated.

[0018] In the coated member according to the present invention, the metal mask includes a power-source-side conductive portion for electrically connecting to a conductive portion electrically connected to the power source portion, and the coated portion may have a conductor-side conductive portion on a surface facing the workpiece for electrically connecting to the conductor portion of the workpiece. Effect of the Invention

[0019] According to the present invention, it is possible to provide a surface treatment device and a coated member that can improve the accuracy of surface treatment. [Brief description of the drawings]

[0020] [Figure 1A] FIG. 2 is a schematic view showing a mold-open state of the surface treatment device according to the embodiment of the present invention. [Figure 1B] FIG. 2 is a schematic view showing a mold-closed state of the surface treatment device according to the embodiment; [Figure 1C] FIG. 2 is a schematic view showing a mold-closed state of the surface treatment device according to the embodiment; [Diagram 2] FIG. 2 is a schematic diagram showing a covering member according to the present embodiment. [Diagram 3] FIG. 2 is a schematic diagram showing a covering member according to the present embodiment. [Figure 4]FIG. 2 is a cross-sectional view showing a covering member according to the present embodiment. [Diagram 5] FIG. 2 is a plan view showing an example of a metal mask before an insulation process according to the present embodiment. [Figure 6] FIG. 2 is a plan view showing an example of a metal mask after an insulation process according to the present embodiment. [Figure 7] FIG. 2 is a plan view showing an example of a metal mask before an insulation process according to the present embodiment. [Figure 8] FIG. 2 is a plan view showing an example of a metal mask after an insulation process according to the present embodiment. [Figure 9] FIG. 2 is a plan view showing an example of a metal mask before an insulation process according to the present embodiment. [Figure 10] FIG. 2 is a plan view showing an example of a metal mask after an insulation process according to the present embodiment. [Figure 11] 4 is a schematic diagram showing electrical connection between a workpiece and a current-carrying part via a metal mask according to the present embodiment. FIG. [Figure 12] FIG. 2 is a schematic diagram showing a first modified example of the covering member according to the present embodiment. [Figure 13] FIG. 4 is a schematic diagram showing a second modified example of the covering member according to the embodiment. [Figure 14] FIG. 4 is a schematic diagram showing a third modified example of the covering member according to the embodiment. [Figure 15] FIG. 11 is a schematic diagram showing a fourth modified example of the covering member according to the present embodiment. [Figure 16] FIG. 11 is a schematic diagram showing a fifth modified example of the covering member according to the present embodiment. [Figure 17] FIG. 11 is a schematic diagram showing a sixth modified example of the covering member according to the present embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] The best mode for carrying out the present invention will be described below with reference to the drawings. Note that the following embodiments do not limit the inventions according to the claims, and all of the combinations of features described in the embodiments are not necessarily essential to the solution of the invention.

[0022] [Overall configuration of the surface treatment device according to this embodiment] First, a surface treatment device 1 according to this embodiment of the present invention will be outlined with reference to Figures 1A and 1B. As shown in Figure 1A, the surface treatment device 1 according to this embodiment can be used as a plating treatment device that reduces metal ions to deposit metal and forms a coating made of the metal on the surface E of the workpiece C. However, the surface treatment device 1 is not limited to this, and can be applied to various devices as long as they are capable of treating the surface E of the workpiece C.

[0023] In this embodiment, the workpiece C is described as a conductor such as a metal material, but is not limited thereto. For example, when the workpiece C is a material having a conductor portion formed on a resin base material, a glass substrate, a silicon wafer, a ceramic substrate, or the like, the surface treatment device 1 can also treat the surface of the conductor portion.

[0024] The surface treatment device 1 is disposed opposite to a workpiece C including a conductor portion and includes a housing 4 capable of forming a liquid chamber (closed space, sealed space) 3 therein, an electrode 20 disposed within the housing 4, an ion conductive membrane 6 disposed between the electrode 20 and the workpiece C, a covering member 60 disposed between the workpiece C and the ion conductive membrane 6, and a power supply unit 7 that applies a voltage between the electrode 20 and the workpiece C. The surface treatment device 1 also includes an electric current supply unit 10 electrically connected to the power supply unit 7.

[0025] The surface treatment device 1 further includes a mounting base 2 on which the workpiece C can be placed, a movement mechanism 5 for moving at least one of the mounting base 2 and the housing 4 relative to the other, a solution supply unit (not shown) for supplying or discharging the electrolyte into the liquid chamber 3, and a holding jig 35 for holding the ion conductive membrane 6. The holding jig 35 includes an inner frame membrane jig 36 and an outer frame membrane jig 37 that engages with the inner frame membrane jig 36.

[0026] In this embodiment, the electrolytic solution is, for example, a liquid containing a metal in an ionic state to be deposited on the surface E of the workpiece C, and examples of the metal contained include copper, gold, silver, nickel, etc. The electrolytic solution is an ionized version of these metals, and various known electrolytic solutions can be used. Note that the electrolytic solution is not limited to the ones exemplified here.

[0027] The mounting base 2 is disposed between the support base 8 and the housing 4, and is configured so that the workpiece C can be placed on its surface. In this embodiment, the surface treatment device 1 has a tray 9 into which the workpiece C can be fitted, and the mounting base 2 has a recess into which the tray 9 can be fitted, but for example, the workpiece C may be fitted into the mounting base 2 without the tray 9, or the workpiece C may simply be placed on the mounting base 2.

[0028] The mounting base 2 and the tray 9 have electrode portions (not shown) that are connected to the workpiece C when the workpiece C is placed thereon. The electrode portions of the mounting base 2 and the tray 9, and therefore the workpiece C, are connected to the negative pole (- pole) of the power supply unit 7. As a result, the workpiece C constitutes the cathode in the surface treatment device 1.

[0029] 11, the electrode portion of the tray 9 has a current-carrying portion 10. The current-carrying portion 10 is configured in a cylindrical shape, and penetrates from the mounting surface of the tray 9 to the back surface (the surface on the mounting base 2 side). Note that the shape of the current-carrying portion 10 is not limited to the above-mentioned shape, and various arbitrary shapes can be adopted.

[0030] In the present embodiment, the current-carrying units 10 are provided on the left and right sides of the tray 9, one each facing each other. However, the present invention is not limited to this, and any number and arrangement may be adopted.

[0031] The housing 4 is disposed vertically above the mounting base 2 and is formed in a bottomed tubular shape (bottomed cylindrical shape, bottomed square tubular shape, etc.) that constitutes a liquid chamber 3 having an inner upper surface and an inner side surface. In this embodiment, the housing 4 is described as being bottomed square tubular, but is not limited to this. An ion conductive membrane 6 having a shape conforming to the shape of the liquid chamber 3 (rectangular in this embodiment) is attached to the bottomed tubular opening. The housing 4 may also be configured so that a covering member 60 can be attached to the bottomed tubular opening. The housing 4 includes an exhaust flow path 31 that is formed penetrating the wall surface of the housing 4 and can exhaust gas from the liquid chamber 3, a supply flow path 41 that can supply the electrolyte to the liquid chamber 3, and a clamp portion 39 for fitting the housing 4 to the mounting base 2.

[0032] A supply flow passage 41 having an opening is formed at the bottom of the inner side surface of the housing 4, and a flow passage opening / closing valve 40 described later is connected to the supply flow passage 41. Also, a discharge flow passage 31 having an opening is formed at the top of the inner side surface of the housing 4 (preferably the opposing inner side surface), and a pressurizing mechanism 30 described later is connected to the discharge flow passage 31.

[0033] Here, "opposite" means that the supply flow path 41 and the discharge flow path 31 are disposed in positions symmetrical to each other with respect to the central axis of the housing 4. When the supply flow path 41 is configured to be disposed opposite the discharge flow path 31, the electrolyte and air can be smoothly injected into and discharged from the liquid chamber 3 of the housing 4.

[0034] The housing 4 is provided with a pressurizing mechanism 30 on the outer wall surface of the discharge flow path 31 so as to protrude from the side surface of the housing 4. Furthermore, the housing 4 is provided with a flow path opening / closing valve 40 that opens and closes the supply flow path 41. The flow path opening / closing valve 40 has a supply and exhaust port. The housing 4 is disposed opposite the mounting base 2 as described above, and is configured to be able to form the liquid chamber 3, which is a closed space, between the housing 4 and the mounting base 2 when, for example, the housing 4 is moved toward the mounting base 2 by the moving mechanism 5.

[0035] The pressurizing mechanism 30 is connected to the discharge flow path 31 and has an on-off valve that opens and closes the discharge flow path 31. The pressurizing mechanism 30 is configured to be able to open and close the discharge flow path 31, and is also configured to be able to pressurize the electrolyte solution supplied into the liquid chamber 3. Specifically, the pressurizing mechanism 30 is attached to the outer wall surface of the discharge flow path 31 formed by penetrating the wall surface of the housing 4, and is provided so as to protrude from the side surface of the housing 4 at a position opposite (including a diagonal position) the flow path on-off valve 40 with respect to the vertical center of the housing 4.

[0036] The pressurizing mechanism 30 and the flow path opening / closing valve 40 are disposed, for example, opposite to each other on the short side of the housing 4. The pressurizing mechanism 30 closes the opening / closing valve and then reduces the volume of the liquid chamber 3 to pressurize the electrolyte in the liquid chamber 3.

[0037] The clamp unit 39 is provided with an exhaust means for exhausting (preferably evacuating) the air in the lower space between the mounting base 2 and the ion conductive membrane 6 when the clamp unit 39 and the mounting base 2 are fitted together. The exhaust means has an on-off valve 47 that is opened and closed to reduce the pressure in the lower space. The on-off valve 47 is provided so as to be located outside a pressure reduction flow path 48 that opens into the lower space and communicates with the lower side of the clamp unit 39.

[0038] The pressure reduction flow path 48 is connected to the liquid chamber 3 (the space above the ion conductive membrane 6) via a pressure reduction flow path, a flow path opening / closing valve, and a bypass flow path (none of which are shown). The bypass flow path is connected to a pressure reduction unit (not shown) having a vacuum pump for reducing pressure or the like. Such a pressure reduction system circuit is provided as a separate circuit from the solution supply system circuits such as the pressurizing mechanism 30 and the flow path opening / closing valve 40.

[0039] The electrode 20 is a metal plate and is made of any metal material (e.g., copper, etc.). The electrode 20 is suspended from the inner upper surface of the housing 4, and is disposed in the liquid chamber 3 such that the bottom 23 of the electrode 20 is located directly above the ion conductive membrane 6.

[0040] The electrode 20 is connected to the positive electrode (+ electrode) of the power supply unit 7 via the housing 4. With this configuration, the electrode 20 constitutes the anode of the surface treatment device 1. The electrode 20 is not limited to a metal plate, and various configurations (e.g., a cage-shaped member containing a metal of any shape) and arrangements can be adopted as long as it can be placed at a position immersed in the electrolyte in the liquid chamber 3.

[0041] The power supply unit 7 applies a voltage between the electrode 20 serving as an anode and the workpiece C serving as a cathode. The power supply unit 7 can employ various known configurations.

[0042] 1C, the movement mechanism 5 moves at least one of the mounting base 2 and the housing 4 in a direction approaching or moving away from the other. Specifically, the movement mechanism 5 has a linear motion rod 51, and is configured to move the housing 4 toward or away from the mounting base 2 by raising and lowering the housing 4 with the linear motion rod 51.

[0043] In addition, the moving mechanism 5 is configured to be able to stop the housing 4 at at least three locations: an upper end position (original position: see Figure 1A) where the housing 4 is furthest away from the mounting base 2; a decompression position where a liquid chamber 3 is formed between the housing 4 and the mounting base 2 and the lower space formed by the mounting base 2 and the clamp portion 39 engaging with the liquid chamber 3 and the lower part of the ion conductive membrane 6 is decompressed; and a treatment position (see Figure 2) where the housing 4 is brought even closer to the mounting base 2 than the decompression position and surface treatment is performed.

[0044] In this embodiment, the moving mechanism 5 moves the housing 4 toward or away from the mounting base 2, but is not limited to this. In addition, the moving mechanism 5 is not limited to the configuration including the linear motion rod 51 described above, and any configuration can be adopted as long as it is capable of moving the housing 4 toward or away from the mounting base 2.

[0045] The ion conductive membrane 6 is a sheet-like thin film member formed with a thickness of several μm to several hundreds of μm (for example, 5 to 450 μm). Examples of the ion conductive membrane 6 include a porous membrane and a solid electrolyte membrane, and resins such as polyethylene, polypropylene, hydrocarbon resins, and fluororesins can be used. Note that the ion conductive membrane 6 is not limited to these, so long as it is capable of permeating metal ions in the electrolytic solution by contacting the electrolytic solution supplied to the liquid chamber 3 and of depositing metal derived from the metal ions on the surface E of the workpiece C when a voltage is applied by the power supply unit 7.

[0046] As shown in FIG. 1A, the ion conductive membrane 6 is sandwiched between an inner frame membrane jig 36 and an outer frame membrane jig 37 of a holding jig 35. The ion conductive membrane 6 is held in a uniformly stretched state by being sandwiched between the inner frame membrane jig 36 and the outer frame membrane jig 37. The inner frame membrane jig 36 and the outer frame membrane jig 37 are attached to the lower part of the housing 4, and the ion conductive membrane 6 is disposed directly below the electrode 20 disposed in the liquid chamber 3. The attachment of the ion conductive membrane 6 is not limited to the above-mentioned configuration, and various arbitrary configurations can be adopted as long as the ion conductive membrane 6 can be stretched without slack.

[0047] [Configuration of covering materials] The covering member 60 includes a metal mask 70 as shown in Fig. 2. The covering member 60 also includes a frame 61 that supports the metal mask 70. The metal mask 70 is attached to the frame 61 by adhesive, pins, spot welding, or the like as shown in Fig. 3. In this embodiment, the covering member 60 is configured to be able to be placed on a tray 9 as shown in Fig. 1A, but is not limited thereto, and may be attached to a bottomed cylindrical opening of the housing 4 via an outer frame film jig 37 or a clamp portion 39.

[0048] 2, the frame 61 is, for example, a rectangular flat plate, and has an opening 62 in the center that is larger than the surface E of the workpiece C. In this embodiment, the frame 61 is made of stainless steel, but is not limited to this, and any of various configurations can be adopted as long as it is chemical resistant and not easily deformed. In addition, the shape of the frame 61 is not limited to a rectangular shape, and any of various shapes can be adopted.

[0049] Fig. 5 to Fig. 10 are diagrams showing an example of the surface of the metal mask 70 on the side of the workpiece C in this embodiment. Fig. 5, Fig. 7 and Fig. 9 are diagrams showing an example of the metal mask 70 before the insulation treatment in this embodiment, and Fig. 6, Fig. 8 and Fig. 10 are diagrams showing an example of the metal mask 70 after the insulation treatment in this embodiment. In this embodiment, the metal mask 70 has a rectangular shape, but is not limited to this and various arbitrary shapes can be adopted.

[0050] The metal mask 70 includes a covering portion 71 for covering a non-processed portion of the workpiece C, and a mask opening 75 for exposing a processed portion of the workpiece C. The metal mask 70 also includes a power supply side current-carrying portion 77 (see FIG. 4) for electrically connecting to the current-carrying portion 10. The metal mask 70 may be, for example, a mask in which the covering portion 71 is formed by plating on a metal mesh as shown in FIGS. 2 and 9, or may be a laser metal mask or an additive metal mask in which the mask opening 75 is formed by processing a metal plate as shown in FIGS. 5 and 7.

[0051] The metal material constituting the metal mask 70 is, for example, stainless steel, titanium, nickel, etc. The metal mask 70 may also be made of a metal material that forms a passivation film, such as stainless steel or titanium. When the metal mask 70 is made of a metal material that forms a passivation film, the adhesion of plating is poor, and therefore, as shown in Fig. 16, there is an advantage that insulation treatment is not required on the surface 71b of the covering portion 71 on the workpiece C side, excluding the conductor-side current-carrying portion 73 described below.

[0052] 4, the covering portion 71 has a conductor-side current-carrying portion 73 on a surface 71b facing the workpiece C for electrically connecting to a conductor portion of the workpiece C (surface E of the workpiece C in this embodiment). An insulating layer 74 is formed by insulation treatment on a surface 71a facing the ion conductive membrane 6 of the covering portion 71. In addition, an insulating layer 74 is formed by insulation treatment on a portion of the surface 71b facing the workpiece C of the covering portion 71 excluding the conductor-side current-carrying portion 73.

[0053] The insulating layer 74 formed by the insulating process is made of a chemical-resistant material, such as fluororubber, silicone rubber, fluororesin, polyvinyl chloride, or the like.

[0054] When the material of the metal mask 70 is stainless steel, the insulation treatment may be an oxidation coloring (chemical coloring) treatment, and the insulation layer 74 may be an oxide film formed by the oxidation coloring. When the material of the metal mask 70 is titanium, the insulation treatment may be anodization treatment, and the insulation layer 74 may be an oxide film formed by the anodization treatment.

[0055] 6, 8, and 10, the conductor-side current-carrying portion 73 is not insulated and the surface of the metal mask 70 is exposed. From the viewpoint of uniformly surface-treating the treatment portion of the workpiece C, the conductor-side current-carrying portion 73 is preferably provided around the mask opening 75, but is not limited to this. In addition, the shape of the conductor-side current-carrying portion 73 is not limited to a rectangle, and various arbitrary shapes can be adopted depending on the coating pattern.

[0056] Mask opening 75 may be rectangular as shown in Fig. 5 or circular as shown in Fig. 7, and various arbitrary configurations can be adopted depending on the coating pattern. In addition, in this embodiment, mask opening 75 is not limited to a shape with four closed sides, and may be configured as a concave shape with one open side. Furthermore, inner surface 75a of mask opening 75 is insulated as shown in Fig. 4, and insulating layer 74 is formed.

[0057] The power supply side current-carrying part 77 is provided on the outer edge of the surface of the metal mask 70 facing the workpiece C, and like the conductor side current-carrying part 73, is not insulated and the surface of the metal mask 70 is exposed. Specifically, as shown in Fig. 11, the power supply side current-carrying part 77 is provided at a position where it contacts the current-carrying part 10 of the tray 9 placed on the mounting base 2. With this configuration, the power supply side current-carrying part 77 is configured to be electrically connectable to the current-carrying part 10.

[0058] In this embodiment, the power supply side conductive part 77 is configured to be circular like the conductive part 10, but is not limited to this and various arbitrary shapes can be adopted. Also, the power supply side conductive part 77 is provided at two locations on each of the left and right sides of the metal mask 70, but is not limited to this and various arbitrary numbers and arrangements can be adopted as long as it is configured to be electrically connectable to the conductive part 10. Also, in the case where the tray 9 also has a conductive part 10 on the mounting surface for the workpiece C, the metal mask 70 may further include a power supply side conductive part 77 at a position corresponding to the conductive part 10 on the mounting surface.

[0059] The surface treatment device 1 of this embodiment is provided with such a conductor side conductive part 73 and a power supply side conductive part 77, so that the conductor part of the workpiece C and the conductive part 10 are electrically connected via the metal mask 70, as shown in FIG. 11.

[0060] The covering member 60 also includes a conductive spacer 80 configured to have a thickness that fills the height difference between a buffer section 90 (described later) and the conductor side current-carrying section 73. Specifically, the conductive spacer 80 is provided on the conductor side current-carrying section 73. The conductive spacer 80 is made of a metal material such as nickel, gold, titanium, or stainless steel that has high conductivity and chemical resistance to the electrolyte used. The conductive spacer 80 may be, for example, a plating layer formed by plating the surface of the conductor side current-carrying section 73, or may be a metal foil.

[0061] When the conductive spacer 80 is a metal foil, the conductive spacer 80 is attached onto the conductor-side current-carrying part 73 by spot welding, adhesion with a conductive adhesive, or the like. The conductive spacer 80 is not limited to a metal material, and may be made of any material with high conductivity, such as carbon or conductive ink.

[0062] Furthermore, the covering member 60 includes a buffer section 90 provided on the surface 71b of the covering section 71 facing the workpiece C. The buffer section 90 is disposed on a portion of the surface 71b facing the workpiece C excluding the conductor-side current-carrying section 73, and has better adhesion to the workpiece C than the covering section 71. The buffer section 90 is made of an insulating material having chemical resistance. Specifically, the buffer section 90 is made of, for example, silicone rubber, fluororubber, or the like.

[0063] Note that the covering member 60 may not include the buffer portion 90 if the insulating layer 74 formed by the insulation treatment has better adhesion to the workpiece C than the covering portion 71. Furthermore, if the covering member 60 does not include the buffer portion 90, the conductive spacer 80 may be configured to have a thickness on the surface 71b of the covering portion 71 facing the workpiece C so as to fill in the height difference between the insulating layer 74 and the conductor-side current-carrying portion 73, as shown in FIG.

[0064] The surface treatment device 1 having the above configuration applies a voltage between the electrode 20 and the object C to be treated, thereby treating the surface E of the object C to be treated by electrolysis via the ion conductive membrane 6 and the covering member 60.

[0065] Although the covering member 60 includes a conductive spacer 80 to eliminate the step on the surface 71b of the covering part 71 facing the workpiece C, if the step on the surface 71b of the covering part 71 facing the workpiece C can be eliminated by another configuration, the covering member 60 does not need to include the conductive spacer 80. For example, as shown in Fig. 14, the conductor-side current-carrying part 73 may protrude from the surface 71b of the covering part 71 facing the workpiece C toward the workpiece C, and the buffer part 90 may be provided on the part of the surface 71b facing the workpiece C excluding the conductor-side current-carrying part 73 so as to fill the height difference with the conductor-side current-carrying part 73.

[0066] In this case, the difference in height between the insulating layer 74 provided on the portion of the surface 71b of the coating portion 71 facing the workpiece C excluding the conductor side conductive portion 73 and the conductor side conductive portion 73 is small enough not to affect the accuracy of the surface treatment, and therefore there is no need to fill the difference in height with a conductive spacer 80.

[0067] Similarly, as shown in Figure 15, the conductor side conductive portion 73 protrudes from the surface 71b of the coating portion 71 facing the workpiece C toward the workpiece C, and an insulating layer 74 may be provided on the portion of the surface 71b of the coating portion 71 facing the workpiece C excluding the conductor side conductive portion 73 so as to fill the height difference with the conductor side conductive portion 73.

[0068] The surface treatment device 1 may also include an ion conductive membrane protection member (not shown) between the ion conductive membrane 6 and the covering member 60. The ion conductive membrane protection member is made of a mesh member and is configured to prevent deformation of the ion conductive membrane 6 and to drain the liquid that has passed through the ion conductive membrane 6.

[0069] [Advantages of the surface treatment device and coated member according to this embodiment] As described above, the surface treatment device 1 according to this embodiment is provided with a housing 4 that is disposed opposite a workpiece C including a conductor portion and capable of forming a liquid chamber 3 therein, an electrode 20 disposed within the housing 4, an ion conductive membrane 6 disposed between the electrode 20 and the workpiece C, a covering member 60 disposed between the workpiece C and the ion conductive membrane 6, and a power supply unit 7 that applies a voltage between the electrode 20 and the workpiece C, the covering member 60 including a metal mask 70 that includes a covering portion 71 for covering a non-processed portion of the workpiece C and a mask opening 75 for exposing a processed portion of the workpiece C, and a surface 71a of the covering portion 71 on the ion conductive membrane 6 side that is insulated, and a voltage is applied between the electrode 20 and the workpiece C to treat the surface E of the workpiece C by electrolysis via the ion conductive membrane 6 and the covering member 60.

[0070] The surface treatment device 1 according to this embodiment has such a configuration, and since the covering member 60 includes the metal mask 70 made of metal, and at least the surface 71a of the covering portion 71 of the metal mask 70 facing the ion conductive membrane 6 is insulated, the ion conductive membrane 6 side of the covering member 60 is not surface-treated when a voltage is applied, and the surface E of the workpiece C can be treated with a finer pattern or a pattern having a high aspect ratio than a resin covering member, thereby improving the accuracy of the surface treatment.

[0071] The surface treatment device 1 according to the present embodiment includes a current-carrying section 10 electrically connected to the power supply section 7, the metal mask 70 includes a power supply side current-carrying section 77 for electrically connecting to the current-carrying section 10, the covering section 71 has a conductor side current-carrying section 73 for electrically connecting to the conductor section of the workpiece C on the surface on the side of the workpiece C, and the workpiece C and the current-carrying section 10 are electrically connected via the metal mask 70. By providing such a configuration, the workpiece C and the power supply section 7 are electrically connected via the metal mask 70 and the current-carrying section 10, and a voltage can be applied between the electrode 20 and the workpiece C. Therefore, for example, it is not necessary to interpose another current-carrying member between the surface E of the workpiece C and the covering member 60, and the workpiece C and the covering member 60 can be closely attached to each other, which has the advantage of improving the accuracy of the surface treatment. In addition, since no other current-carrying member is required, the surface treatment device 1 has the advantage of being able to reduce the cost of the surface treatment device 1. Furthermore, when multiple workpieces C are placed on the tray 9 and surface-treated collectively, the vicinity of each workpiece C can be electrically connected to the conductive section 10, which has the advantage that the variation in film thickness is reduced more than before and the accuracy of the surface treatment can be improved.

[0072] Furthermore, in the surface treatment device 1 according to this embodiment, the inner surface 75a of the mask opening 75 is subjected to an insulating treatment. With this configuration, since the inner surface 75a of the mask opening 75 is insulated, the inner surface 75a of the mask opening 75 can be prevented from being surface-treated and forming a plating layer, and even if the metal mask 70 is used repeatedly, the size of the mask opening 75 can be prevented from changing due to the plating layer formed by the surface treatment, and the ion conductive film 6 deformed when pressed can be prevented from being taken into the formed plating layer and damaged, which has the advantage of improving the accuracy of the surface treatment.

[0073] Furthermore, in the surface treatment device 1 according to this embodiment, an insulating layer 74 is formed by insulating treatment on the surface 71b of the covering part 71 on the workpiece C side excluding the conductor-side current-carrying part 73. With such a configuration, the electrolyte seeping out from the ion conductive film 6 can be prevented from entering the gap between the surface 71b of the covering part 71 on the workpiece C side and the surface E of the workpiece C through the mask opening 75, and the non-treatment part of the workpiece C and the surface 71b of the covering part 71 on the workpiece C side from being surface-treated when a voltage is applied. This has the advantage that the surface E of the workpiece C can be treated according to a desired coating pattern, and the accuracy of the surface treatment can be improved.

[0074] In the surface treatment device 1 according to the present embodiment, the covering member 60 includes a conductive spacer 80 configured to have a thickness that fills the height difference between the insulating layer 74 and the conductor side current-carrying part 73. With this configuration, the height difference (step) between the insulating layer 74 formed on the surface 71b of the covering part 71 facing the workpiece C and the conductor side current-carrying part 73 is reduced or eliminated, and the surface of the metal mask 70 facing the workpiece C is evenly in contact with the surface E of the workpiece C, which is advantageous in that the accuracy of the surface treatment can be improved. In addition, the reduced height difference or elimination of the height difference is advantageous in that electrical conduction failure during voltage application can be suppressed.

[0075] Furthermore, in the surface treatment device 1 according to this embodiment, the covering member 60 includes a conductive spacer 80 provided on the conductor side current-carrying portion 73 of the covering portion 71 and a buffer portion 90 provided on the surface 71b of the covering portion 71 on the side of the workpiece C, the buffer portion 90 being arranged on the portion of the surface 71b on the side of the workpiece C excluding the conductor side current-carrying portion 73 and having better adhesion to the workpiece C than the covering portion 71, and the conductive spacer 80 being configured to have a thickness that fills the height difference between the buffer portion 90 and the conductor side current-carrying portion 73. By providing such a configuration, the surface of the buffer portion 90 can follow the fine unevenness of the surface E of the workpiece C to more reliably cover the non-processed portion of the workpiece C, and therefore the electrolyte seeping out from the boundary between the processed portion and the non-processed portion of the workpiece C can be prevented from bleeding by surface treatment, and therefore the surface E of the workpiece C can be treated according to a desired coating pattern, which has the advantage of improving the accuracy of the surface treatment. Furthermore, by providing the buffer section 90 on the surface 71b of the covering section 71 facing the workpiece C, a height difference (step) between the buffer section 90 (surface 71b of the covering section 71 facing the workpiece C) and the conductor-side current-carrying section 73 is filled with the conductive spacer 80, and the height difference (step) between the buffer section 90 (surface 71b of the covering section 71 facing the workpiece C) and the conductor-side current-carrying section 73 is reduced or eliminated, so that the surface of the metal mask 70 facing the workpiece C is evenly in contact with the surface E of the workpiece C, which has the advantage of improving the accuracy of the surface treatment. Furthermore, by reducing or eliminating the height difference, it has the advantage of suppressing poor electrical conduction when a voltage is applied.

[0076] Furthermore, in the surface treatment device 1 according to this embodiment, the conductor side current-carrying portion 73 protrudes from the surface 71b of the coating portion 71 on the workpiece C side toward the workpiece C, and an insulating layer 74 is provided on the surface 71b of the coating portion 71 on the workpiece C side except for the conductor side current-carrying portion 73 so as to fill the height difference with the conductor side current-carrying portion 73. By providing such a configuration, even if the coating member 60 does not include the conductive spacer 80, the height difference (step) between the insulating layer 74 formed on the surface 71b of the coating portion 71 on the workpiece C side and the conductor side current-carrying portion 73 is reduced or eliminated, and the surface of the metal mask 70 on the workpiece C side is in contact with the surface E of the workpiece C evenly, which is advantageous in that the accuracy of the surface treatment can be improved. In addition, the height difference is reduced or eliminated, which is advantageous in that electrical conduction failure during voltage application can be suppressed.

[0077] In the surface treatment device 1 according to the present embodiment, the covering member 60 includes a buffer section 90 on the surface 71b of the covering section 71 facing the workpiece C, the conductor side current-carrying section 73 protrudes from the surface 71b of the covering section 71 facing the workpiece C toward the workpiece C, and the buffer section 90 is provided on the portion of the surface 71b facing the workpiece C excluding the conductor side current-carrying section 73 so as to fill the height difference with the conductor side current-carrying section 73, and has better adhesion to the workpiece C than the covering section 71. By providing such a configuration, even if the covering member 60 does not include the conductive spacer 80, the height difference (step) between the buffer section 90 (the surface 71b of the covering section 71 facing the workpiece C) and the conductor side current-carrying section 73 becomes smaller or there is no height difference, and the surface of the metal mask 70 facing the workpiece C comes into even contact with the surface E of the workpiece C, which has the advantage of improving the accuracy of the surface treatment. In addition, since the height difference is reduced or eliminated, there is an advantage that electrical conduction failure during voltage application can be suppressed.

[0078] Furthermore, in the surface treatment device 1 according to this embodiment, the insulating layer 74 formed by the insulation treatment has better adhesion to the workpiece C than the covering portion 71, and is made of a chemical-resistant material. With this configuration, even if the covering member 60 does not include the buffer portion 90, the insulating layer 74 can follow the fine irregularities of the surface E of the workpiece C and more reliably cover the non-treated portions of the workpiece C, so that the surface E of the workpiece C can be treated according to a desired coating pattern, which is advantageous in that the accuracy of the surface treatment can be improved.

[0079] [Variations] Although the preferred embodiments of the present invention have been described above, the technical scope of the present invention is not limited to the scope described in the above-mentioned embodiments. Various modifications and improvements can be made to the above-mentioned embodiments.

[0080] For example, in the present embodiment, the surface treatment device 1 includes the current-carrying part 10 electrically connected to the power supply part 7, the metal mask 70 includes the power supply side current-carrying part 77 for electrically connecting to the current-carrying part 10, the covering part 71 has the conductor side current-carrying part 73 for electrically connecting to the conductor part of the workpiece C on the surface on the side of the workpiece C, and the workpiece C and the current-carrying part 10 are described as being electrically connected via the metal mask 70, but this is not limited thereto. The surface treatment device 1 may not include the current-carrying part 10. In addition, the metal mask 70 may not include the power supply side current-carrying part 77, and the covering part 71 may not have the conductor side current-carrying part 73. That is, the surface treatment device 1 may electrically connect the workpiece C and the power supply part 7 by another means other than the current-carrying part 10 and the metal mask 70, and apply a voltage between the electrode 20 and the workpiece C to treat the surface of the workpiece C by electrolysis via the ion conductive membrane 6 and the covering member 60.

[0081] In the present embodiment, the inner surface 75a of the mask opening 75 is described as being insulated, but is not limited thereto. The inner surface 75a of the mask opening 75 does not have to be insulated, and it is sufficient that at least the surface 71a of the covering portion 71 facing the ion conductive membrane 6 of the metal mask 70 is insulated as shown in FIG.

[0082] In the present embodiment, the insulating layer 74 is formed by insulation treatment on the surface 71b of the covering 71 on the workpiece C side, except for the conductor-side current-carrying portion 73, but this is not limited to the above. For example, as shown in Fig. 16, the insulating layer 74 does not have to be formed by insulation treatment on the surface 71b of the covering 71 on the workpiece C side, except for the conductor-side current-carrying portion 73.

[0083] In the present embodiment, the covering member 60 has been described as including the conductive spacer 80 configured to have a thickness that fills the height difference between the insulating layer 74 and the conductor side current-carrying portion 73, but is not limited thereto, and the covering member 60 may not include the conductive spacer 80. In addition, when the covering member 60 includes the conductive spacer 80, the conductive spacer 80 may not be configured to have a thickness that fills the height difference between the insulating layer 74 and the conductor side current-carrying portion 73. Furthermore, when the covering member 60 does not include the conductive spacer 80, the conductor side current-carrying portion 73 of the metal mask 70 may be deformed into a convex shape by hammering out the surface 71a of the metal mask 70 on the ion conductive membrane 6 side corresponding to the conductor side current-carrying portion 73 toward the workpiece C side, thereby filling the height difference between the insulating layer 74 and the conductor side current-carrying portion 73.

[0084] In the present embodiment, the covering member 60 includes a conductive spacer 80 provided on the conductor side current-carrying portion 73 of the covering portion 71 and a buffer portion 90 provided on the surface 71b of the covering portion 71 on the workpiece C side, the buffer portion 90 is disposed on the portion of the surface 71b on the workpiece C side excluding the conductor side current-carrying portion 73, and has better adhesion to the workpiece C than the covering portion 71, and the conductive spacer 80 is configured to have a thickness that fills the height difference between the buffer portion 90 and the conductor side current-carrying portion 73, but is not limited thereto. For example, as shown in FIG. 12, the covering member 60 may not include the conductive spacer 80 and the buffer portion 90. In addition, when the covering member 60 includes the conductive spacer 80 and the buffer portion 90, the conductive spacer 80 may not be configured to have a thickness that fills the height difference between the buffer portion 90 and the conductor side current-carrying portion 73. Furthermore, the covering member 60 may not include the conductive spacer 80 and may only include the buffer portion 90.

[0085] In the present embodiment, the conductor side current-carrying portion 73 protrudes from the surface 71b of the covering portion 71 facing the workpiece C toward the workpiece C, and the insulating layer 74 is provided on the surface 71b of the covering portion 71 facing the workpiece C excluding the conductor side current-carrying portion 73 so as to fill the height difference with the conductor side current-carrying portion 73, but this is not limited thereto. The conductor side current-carrying portion 73 does not have to protrude from the surface 71b of the covering portion 71 facing the workpiece C toward the workpiece C, for example, as shown in FIG. 4. In addition, when the conductor side current-carrying portion 73 protrudes from the surface 71b of the covering portion 71 facing the workpiece C toward the workpiece C, the insulating layer 74 does not have to be provided on the surface 71b of the covering portion 71 facing the workpiece C except the conductor side current-carrying portion 73 so as to fill the height difference with the conductor side current-carrying portion 73.

[0086] In the present embodiment, the covering member 60 includes a buffer section 90 on the surface 71b of the covering section 71 facing the workpiece C, the conductor side current-carrying section 73 protrudes from the surface 71b of the covering section 71 facing the workpiece C toward the workpiece C, and the buffer section 90 is provided in the portion of the surface 71b facing the workpiece C excluding the conductor side current-carrying section 73 so as to fill the height difference with the conductor side current-carrying section 73, and has been described as having better adhesion to the workpiece C than the covering section 71, but is not limited thereto. The buffer section 90 does not have to be provided in the portion of the surface 71b facing the workpiece C excluding the conductor side current-carrying section 73 so as to fill the height difference with the conductor side current-carrying section 73.

[0087] In the present embodiment, the insulating layer 74 formed by the insulating process has better adhesion to the workpiece C than the covering portion 71 and is formed from a chemical-resistant material, but is not limited thereto. The insulating layer 74 does not necessarily have to have better adhesion to the workpiece C than the covering portion 71. Moreover, the insulating layer 74 does not necessarily have to be formed from a chemical-resistant material.

[0088] In the present embodiment, the buffer section 90 has been described as being provided on the insulating layer 74 formed by insulating treatment on the portion of the surface 71b of the covering section 71 facing the workpiece C excluding the conductor-side current-carrying portion 73, but is not limited thereto. For example, when the buffer section 90 has insulating properties, the buffer section 90 may be provided directly on the portion of the surface 71b of the covering section 71 facing the workpiece C that has not been subjected to insulating treatment, excluding the conductor-side current-carrying portion 73, as shown in FIG.

[0089] In the present embodiment, the covering member 60 has been described as including the frame portion 61 that supports the metal mask 70, but this is not limited thereto, and the covering member 60 does not have to include the frame portion 61. In addition, the frame portion 61 may be a conductive material or an insulating material.

[0090] In the present embodiment, the mounting base 2 and the tray 9 have been described as having electrode parts, and the electrode part of the tray 9 has the current-carrying part 10, but this is not limiting. The mounting base 2 and the tray 9 may not have electrode parts, and the electrode part of the tray 9 may not have the current-carrying part 10. For example, in the surface treatment device 1, the clamp part 39 may have an electrode part, the electrode part of the clamp part 39 may be connected to the negative pole (- pole) of the power supply part 7, and the electrode part of the clamp part 39 may have the current-carrying part 10. In this case, the power supply side current-carrying part 77 of the metal mask 70 is preferably provided on the surface of the metal mask 70 on the ion conductive membrane 6 side, but may be provided on the surface of the metal mask 70 on the workpiece C side.

[0091] That is, in a state where the covering member 60 is attached to the surface treatment device 1, the current-carrying unit 10 may be provided below or above the covering member 60. In the surface treatment device 1, the mounting base 2 and the tray 9 and the clamp unit 39 each have an electrode unit, and the electrode unit of the tray 9 and the electrode unit of the clamp unit 39 each have a current-carrying unit 10, and these current-carrying units 10 may be used depending on the configuration of the covering member 60. [Explanation of symbols]

[0092] 1 Surface treatment equipment 2. Mounting Base 3 Liquid chamber 4. Housing 5 Moving mechanism 6 Ion Conductive Membrane 7 Power supply section 8 Support base 9 Tray 10 Electrical Conductor 20 electrodes 23 Bottom 30 Pressurizing mechanism 31 Exhaust flow path 35 Holding fixture 36 Inner frame membrane jig 37 Outer frame film jig 39 Clamp section 40 Flow passage opening and closing valve 41 Supply Channel 47 On-off valve 48 Pressure reducing flow path 50 Tilt mechanism 51 Linear rod 60 Covering material 61 Frame 62 Aperture 70 Metal Mask 71 Covering part 71a Ion conductive membrane side 71b Surface on the side of the workpiece 73 Conductor side current-carrying part 74 Insulating Layer 75 Mask opening 75a Inner surface of mask opening 77 Power supply side current carrying part 80 Conductive spacer 90 Buffer C. Processing object E surface

Claims

1. a housing arranged to face the workpiece including the conductor portion and capable of forming a liquid chamber therein; an electrode disposed within the housing; an ion conductive membrane disposed between the electrode and the object to be treated; A coating member disposed between the object to be treated and the ion conductive membrane; a power supply unit that applies a voltage between the electrode and the object to be processed; Equipped with the covering member includes a metal mask, The metal mask is A covering portion for covering a non-processing portion of the object to be processed; a mask opening for exposing a treatment portion of the workpiece; Including, The surface of the covering portion facing the ion conductive membrane is subjected to an insulating treatment, A voltage is applied between the electrode and the workpiece, and the surface of the workpiece is treated by electrolysis via the ion conductive membrane and the covering member. A surface treatment device comprising:

2. a current-carrying unit electrically connected to the power supply unit, the metal mask includes a power supply side conductive portion for electrically connecting to the conductive portion, the covering portion has a conductor-side current-carrying portion on a surface facing the workpiece for electrically connecting to the conductor portion of the workpiece, The workpiece and the conductive portion are electrically connected via the metal mask. The surface treatment device according to claim 1 .

3. The inner surface of the mask opening is subjected to the insulating treatment.

3. The surface treatment device according to claim 1, wherein the surface treatment device is a surface treatment apparatus.

4. An insulating layer is formed by the insulation treatment on the surface of the covering portion on the side of the treatment object except for the conductor-side current-carrying portion. The surface treatment device according to claim 2 .

5. The covering member includes a conductive spacer having a thickness that fills the height difference between the insulating layer and the conductor-side current-carrying portion. The surface treatment device according to claim 4 .

6. The covering member is a conductive spacer provided on the conductor side conductive portion of the coating portion; a buffer portion provided on a surface of the covering portion facing the workpiece; Including, the buffer portion is disposed on a portion of the surface on the workpiece side excluding the conductor-side current-carrying portion, and has better adhesion to the workpiece than the covering portion; The conductive spacer is configured to have a thickness that fills the height difference between the buffer portion and the conductor side conductive portion. The surface treatment device according to claim 2 .

7. the conductor-side current-carrying portion protrudes from a surface of the coating portion facing the workpiece toward the workpiece, An insulating layer is provided on the surface of the coating portion on the side of the workpiece, except for the conductor-side current-carrying portion, so as to fill in the height difference with the conductor-side current-carrying portion. The surface treatment device according to claim 2 .

8. The covering member includes a buffer portion on a surface of the covering portion facing the workpiece, the conductor-side current-carrying portion protrudes from a surface of the coating portion facing the workpiece toward the workpiece, The buffer portion is provided on the surface of the workpiece side except for the conductor-side current-carrying portion so as to fill in the height difference with the conductor-side current-carrying portion, and has better adhesion to the workpiece than the covering portion. The surface treatment device according to claim 2 .

9. The insulating layer formed by the insulating treatment has better adhesion to the workpiece than the covering portion and is made of a chemical-resistant material.

3. The surface treatment device according to claim 1, wherein the surface treatment device is a surface treatment apparatus.

10. A covering member used in a surface treatment device comprising: a housing arranged opposite a workpiece including a conductor portion and capable of forming a liquid chamber therein; an electrode arranged in the housing; an ion conductive membrane arranged between the electrode and the workpiece; and a power supply unit that applies a voltage between the electrode and the workpiece, the covering member being used in a surface treatment device that treats a surface of the workpiece by electrolysis via the ion conductive membrane by applying a voltage between the electrode and the workpiece, A metal mask is included, and the metal mask is configured to be able to be disposed between the object to be treated and the ion conductive membrane, The metal mask is A covering portion for covering a non-processing portion of the object to be processed; a mask opening for exposing a treatment portion of the workpiece; Including, The surface of the covering portion on the side of the ion conductive membrane is subjected to an insulating treatment. A covering member characterized by:

11. the metal mask includes a power supply side conductive portion for electrically connecting to a conductive portion electrically connected to the power supply portion, The covering portion has a conductor-side current-carrying portion on the surface facing the workpiece for electrically connecting to the conductor portion of the workpiece. The covering member according to claim 10 .

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