Component mounting device, component mounting method, and component mounting system

Abstract

To provide a component mounting device, a component mounting method, and a component mounting system that are capable of properly acquiring the amount of positional deviation of a mounting head caused by the shape of a beam.SOLUTION: A component mounting device includes a control unit for controlling a moving mechanism and recognition means so as to restrict recognition of calibration marks F located in a plurality of first areas A1 set on a calibration board E and allow recognition of calibration marks F located in a second area A2, a first derivation unit for deriving a reference straight line of a beam assuming that the shape of the beam is a straight line, based on a recognition result of a calibration mark F at a specific position on a first line L1 along a predetermined direction, and a second derivation unit for deriving the shape of the beam based on the recognition result of the calibration marks F located on the second line L2 including only the calibration marks F in the second area A2 and the reference straight line.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a component mounting device, a component mounting method, and a component mounting system for mounting components on a board. [Background technology]

[0002] The component mounting device moves the mounting head in the X-axis and Y-axis directions by a movement mechanism to mount components on a board. However, in the component mounting device, due to distortion during manufacturing of the X-axis beam and the Y-axis beam constituting the movement mechanism, assembly error during device assembly, etc., a deviation may occur between the actual position of the mounting head moved by the movement mechanism and the position specified in the control data that controls the movement mechanism (for example, see Patent Document 1).

[0003] Patent Document 1 discloses that in order to correct this misalignment, all calibration marks arranged in a grid pattern on a calibration substrate are sequentially imaged by a camera that moves with a mounting head, actual measurement values ​​of the positions of the calibration marks are calculated from the image results, a displacement amount that is the difference from the positions of the calibration marks on the control data is calculated, and a correction value for correcting the control data is calculated from the displacement amount. Patent Document 1 also discloses that the correction value outside the calibration substrate is estimated from the actual measurement values ​​of the correction marks on the correction substrate. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2017-157765 A Summary of the Invention [Problem to be solved by the invention]

[0005] Incidentally, in order to reduce the effects of vibrations and the like caused by the movement of the mounting head, the moving speed of the mounting head is slowed down when capturing images of the calibration marks to obtain the correction values, and even after the mounting head stops, imaging is put on hold until the vibrations subside. Therefore, in conventional techniques including Patent Document 1, there is a problem in that it takes a long time to obtain actual measured values ​​of the positions of all the calibration marks on the calibration substrate and calculate the correction values.

[0006] SUMMARY OF THE PRESENT DISCLOSURE An object of the present invention is to provide a component mounting device, a component mounting method, and a component mounting system that are capable of properly acquiring the amount of positional deviation of a mounting head caused by the shape of a beam. [Means for solving the problem]

[0007] a control unit that controls the moving mechanism and the recognition means so as to restrict recognition of the calibration marks located in a plurality of first areas set on the calibration substrate and allow recognition of the calibration marks located in a second area different from the first areas set on the calibration substrate when recognizing a plurality of calibration marks on the calibration substrate positioned by the substrate transport device; a first derivation unit that derives a reference straight line of the beam assuming that the shape of the beam is a straight line based on a recognition result of the calibration marks at a specific position among the plurality of calibration marks arranged on a first line along a predetermined direction on the calibration substrate; and a second derivation unit that derives the shape of the beam based on the recognition result of the calibration marks arranged on a second line on the calibration substrate that includes only the calibration marks in the second area on the first line of the plurality of first lines and the reference straight line.

[0008] A component mounting method of the present invention is a component mounting method in a component mounting device including a mounting head which mounts components on a substrate transported and positioned by a substrate transport device, a moving mechanism which moves the mounting head in a horizontal plane along a beam, and a recognition means which moves together with the mounting head to recognize an area below, wherein, when recognizing a plurality of calibration marks on a calibration substrate positioned by the substrate transport device, recognition of the calibration marks located in a plurality of first areas set on the calibration substrate is restricted, and recognition of the calibration marks located in a second area different from the first areas set on the calibration substrate is permitted. The method includes a recognition process for controlling a moving mechanism and the recognition means to recognize the calibration mark, a first derivation process for deriving a reference straight line of the beam assuming that the shape of the beam is a straight line based on a recognition result by the recognition means of the calibration mark at a specific position among the multiple calibration marks arranged on a first line along a predetermined direction on the calibration substrate, and a second derivation process for deriving the shape of the beam based on the recognition result by the recognition means of the calibration mark arranged on a second line including only the calibration marks of the second area on the first line among the multiple first lines on the calibration substrate and the reference straight line.

[0009] A component mounting system of the present invention is a component mounting system including a mounting head which mounts components on a substrate transported and positioned by a substrate transporting device, a moving mechanism which moves the mounting head in a horizontal plane along a beam, and a recognition means which moves together with the mounting head to recognize the downward direction, and includes a control unit which controls the moving mechanism and the recognition means so as to restrict recognition of the calibration marks located in a plurality of first areas set on the calibration substrate and allow recognition of the calibration marks located in a second area different from the first areas set on the calibration substrate when recognizing a plurality of calibration marks on a substrate positioned by the substrate transporting device, a first derivation unit which derives a reference straight line of the beam assuming that the shape of the beam is a straight line based on a recognition result of the calibration marks at specific positions among the plurality of calibration marks arranged on a first line along a predetermined direction on the calibration substrate, and a second derivation unit which derives the shape of the beam based on the recognition result of the calibration marks arranged on a second line on the calibration substrate that includes only the calibration marks in the second area on the first line among the plurality of first lines and the reference straight line. Effect of the Invention

[0010] According to the present invention, the amount of positional deviation of the mounting head caused by the shape of the beam can be appropriately obtained. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a plan view of a component mounting system according to an embodiment of the present invention; [Diagram 2] FIG. 1 is an explanatory diagram of an example of a calibration substrate used in a component mounting device according to an embodiment of the present invention; [Diagram 3] FIG. 1 is an explanatory diagram of a first line and a second line set on a calibration board used in a component mounting device according to an embodiment of the present invention. [Figure 4] FIG. 2 is a block diagram showing the configuration of a control system of a component mounting device according to an embodiment of the present invention. [Diagram 5]FIG. 1 is an explanatory diagram of recognition result data of a calibration mark on a calibration substrate recognized by a component mounting device according to an embodiment of the present invention; [Figure 6] FIG. 1 is an explanatory diagram of the distortion of an X-axis beam in a component mounting device according to an embodiment of the present invention. [Figure 7] FIG. 13 is an explanatory diagram of an example of recognition result data used to derive a reference straight line of an X-axis beam according to an embodiment of the present invention. [Figure 8] FIG. 1 is an explanatory diagram of derivation of a reference line showing the displacement amount of an X-axis beam in the Y-axis direction according to an embodiment of the present invention; [Figure 9] FIG. 1 is an explanatory diagram of derivation of a reference line showing the displacement amount of the X-axis beam in the X-axis direction according to an embodiment of the present invention; [Figure 10] FIG. 1 is an explanatory diagram of an example of reference straight line data derived by a component mounting device according to an embodiment of the present invention; [Figure 11] FIG. 1 is an explanatory diagram of an example of linearity data used to derive the X-axis beam shape according to an embodiment of the present invention. [Figure 12] FIG. 1 is an explanatory diagram of an example of calibration data derived by a component mounting device according to an embodiment of the present invention; [Figure 13] FIG. 1 is a flow diagram of a calibration data derivation processing method according to an embodiment of the present invention; [Figure 14] 1 is a flow diagram of a second derivation process according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are examples for the purpose of explanation, and can be appropriately changed according to the specifications of the component mounting system, the component mounting device, and the calibration substrate. In the following, the same reference numerals are used for corresponding elements in all the drawings, and duplicated explanations are omitted. In FIG. 1 and in some parts described later, the X-axis in the substrate transport direction (the left-right direction in FIG. 1) and the Y-axis perpendicular to the substrate transport direction (the up-down direction in FIG. 1) are shown as two axes mutually perpendicular in the horizontal plane.

[0013] First, the configuration of the component mounting system 1 will be described with reference to Fig. 1. The component mounting system 1 is configured with a component mounting device M and a management computer CP, which are connected via a communication network NT. The component mounting device M has a function of executing a component mounting operation in which components supplied from a component supply unit are mounted on a board. The management computer CP has a function of creating a program and control data used by the component mounting device M in the component mounting operation in which the component mounting device M mounts components on a board, as well as a function of acquiring measurement results in the component mounting device M to derive data for calibrating the component mounting device M and data for correcting the component mounting operation in the component mounting device M.

[0014] Next, the configuration of the component mounting device M will be described with reference to Fig. 1. A board transport device 3 is arranged along the X-axis at the center of a base 2. The board transport device 3 transports a board 4 transported from upstream to a mounting operation position, positions it, and holds it. The board transport device 3 also transports the board 4 downstream after the component mounting operation is completed.

[0015] Component supply units 5 are disposed on both sides (front and rear directions along the Y axis) of board transport device 3. Each component supply unit 5 has multiple tape feeders 6 attached in parallel along the X axis. Tape feeders 6 pitch-feed a component tape, on which pockets for storing components are formed, in a direction (tape feed direction) from the outside of component supply unit 5 toward board transport device 3, thereby supplying components to a component supply position from which the components are picked up by a mounting head, which will be described below.

[0016] In FIG. 1, a Y-axis beam 7 equipped with a linear drive mechanism is arranged along the Y-axis at both ends in the X-axis direction on the top surface of the base 2. An X-axis beam 8 similarly equipped with a linear drive mechanism is connected to the Y-axis beam 7 so as to be freely movable along the Y-axis. The X-axis beam 8 is arranged along the X-axis. A plate 8a is attached to the X-axis beam 8 so as to be freely movable along the X-axis. A mounting head 9 is attached to the plate 8a. The mounting head 9 is equipped with a suction unit that can pick up a component and move up and down. A nozzle that picks up and holds the component is attached to the lower end of the suction unit.

[0017] The Y-axis beam 7 and the X-axis beam 8 are two beams B each extending along two intersecting axial directions (X-axis direction, Y-axis direction) in a horizontal plane. The linear drive mechanism of the Y-axis beam 7 and the X-axis beam 8 constitutes a moving mechanism 10 that moves a mounting head 9 in a horizontal plane along the beam B. The moving mechanism 10 and the mounting head 9 perform a mounting turn in which a component is picked up by a nozzle from a component supply position of the tape feeder 6 arranged in the component supply unit 5, and the component is mounted at a mounting position on the board 4 that has been transported and positioned by the board transport device 3.

[0018] In Fig. 1, a component recognition camera 11 is disposed between the component supply unit 5 and the board transport device 3. When the mounting head 9 which has picked up a component from the component supply unit 5 moves above the component recognition camera 11, the component recognition camera 11 captures an image of the component held by the mounting head 9. From the captured image, the holding posture of the component is recognized. A board recognition camera 12 is attached to the plate 8a on which the mounting head 9 is attached. The board recognition camera 12 moves integrally with the mounting head 9.

[0019] As the mounting head 9 moves, the board recognition camera 12 moves above the board 4 positioned on the board transport device 3 and captures an image of the board mark 4a provided on the board 4. The position of the board 4 is recognized from the image capture result. In other words, the board recognition camera 12 is a recognition means that moves together with the mounting head 9 and recognizes the downward direction. When the mounting head 9 mounts components on the board 4, the mounting position is corrected taking into account the recognition results of the components by the component recognition camera 11 and the recognition results of the board position by the board recognition camera 12.

[0020] 2, a description will be given of the configuration of a calibration substrate E used in a calibration data derivation process for deriving calibration data for correcting a positional deviation of the mounting head 9 caused by distortion of the beam B (Y-axis beam 7, X-axis beam 8) of the component mounting device M and an assembly error. The calibration substrate E is transported by the substrate transport device 3, like the substrate 4 on which components are mounted, and is used in a state where it is positioned at the mounting work position.

[0021] On the upper surface of the calibration substrate E, a plurality of calibration marks F are arranged in a grid pattern at equal intervals along the X-axis and Y-axis directions. In Fig. 2, 169 calibration marks F are arranged in 13 columns in the X-axis direction and 13 rows in the Y-axis direction. The number of calibration marks F arranged on the calibration substrate E is not limited to 13 rows and 13 columns, and may be changed depending on the specifications of the component mounting device M, etc. In the calibration data derivation process, the calibration marks F of the calibration substrate E positioned at the mounting work position are imaged by the substrate recognition camera 12 (recognition means), and the positions of the calibration marks F are recognized.

[0022] In this embodiment, the calibration substrate E is provided with a second area A2 in which a calibration mark F that is imaged by the substrate recognition camera 12 during the calibration data derivation process is located, and a first area A1 in which a calibration mark F that is not imaged is located.

[0023] In the example of Fig. 2, the second area A2 is set so that all the calibration marks F in the first, fifth, ninth, and thirteenth columns from the left side of the paper and all the calibration marks F in the first, fifth, ninth, and thirteenth rows from the bottom of the paper are to be imaged. The first area A1 is set so that the calibration marks F located outside the second area A2 are not to be imaged. That is, in this example, nine first areas A1 including nine calibration marks F arranged in three columns and three rows are set in the calibration board E. The number of first areas A1 set in the calibration board E is not limited to three rows and three columns, and may be changed depending on the specifications of the component mounting device M, the accuracy of the calibration data, and the like.

[0024] Next, definitions of terms related to the calibration marks F of the calibration substrate E in the calibration data derivation process will be described with reference to FIG. 3. In the following description of the calibration data derivation process, a plurality of (13) calibration marks F arranged on a straight line in the X-axis direction or the Y-axis direction are defined as the first line L1. That is, on the calibration substrate E, the first line L1 consisting of a plurality of calibration marks F arranged on a straight line in the Y-axis direction is arranged in 13 columns in the X-axis direction, and the first line L1 consisting of a plurality of calibration marks F arranged on a straight line in the X-axis direction is arranged in 13 rows in the Y-axis direction. Among the plurality of first lines L1, the one including only the calibration marks F in the second area A2 is defined as the second line L2. Specifically, the first lines L1 in the first, fifth, ninth, and thirteenth columns and the first lines L1 in the first, fifth, ninth, and thirteenth rows are the first lines L1 and also the second lines L2.

[0025] Next, the configuration of the control system of the component mounting device M will be described with reference to Fig. 4. Here, the function of deriving calibration data among the functions of the component mounting device M will be mainly described. The board transport device 3, tape feeder 6, mounting head 9, moving mechanism 10, component recognition camera 11, and board recognition camera 12 are connected to a control device 20 provided in the component mounting device M. The control device 20 includes a memory unit 21, a calibration processing control unit 27, a recognition processing unit 28, a first derivation unit 29, a second derivation unit 30, and a correction value calculation unit 31.

[0026] The storage unit 21 is a storage device, and stores calibration substrate data 22, recognition result data 23, reference straight line data 24, beam shape data 25, calibration data 26, etc. The calibration substrate data 22 stores the size of the calibration substrate E used in the calibration data derivation process, the mark positions P (XY coordinates) of the calibration marks F, the number of the calibration marks F in the X-axis direction (number of columns), the number of the calibration marks F in the Y-axis direction (number of rows), the pitch (spacing) in the X-axis direction and the Y-axis direction, etc. The calibration substrate data 22 also stores information on a first area A1 in which the calibration marks F that are not recognized (imaged) in the calibration data derivation process are located, and a second area A2 in which the calibration marks F that are recognized (imaged) are located.

[0027] In the following, the X coordinate of the mark position P(i,j) of the calibration mark F that is the i-th mark from the left in the X-axis direction and the j-th mark from the bottom in the Y-axis direction is designated as Xi and the Y coordinate is designated as Yj. That is, in the example of the calibration substrate E shown in Fig. 2, the mark position P(i,j) = (Xi,Yj) (i = 1, 2, 3,..., 13, j = 1, 2, 3,..., 13).

[0028] 4, the calibration process control unit 27 controls each unit of the component mounting device M to execute a calibration data derivation process. The calibration data derivation process is executed immediately after the assembly of the component mounting device M is completed in the manufacturing process or immediately after the component mounting device M is installed in a factory.

[0029] First, the calibration process control unit 27 controls the substrate transport device 3 to transport the calibration substrate E and position it at the mounting work position. Next, the calibration process control unit 27 controls the movement mechanism 10 and the substrate recognition camera 12 based on the calibration substrate data 22 to move the substrate recognition camera 12 in sequence within the horizontal plane so that the imaging center of the substrate recognition camera 12 is at the mark position P(i,j), and causes the substrate recognition camera 12 (recognition means) to image the calibration mark F. When imaging, the calibration process control unit 27 skips the calibration mark F in the first area A1 without imaging it, and moves the substrate recognition camera 12 so as to image only the calibration mark F in the second area A2.

[0030] In this way, the calibration process control unit 27 is a control unit that controls the moving mechanism 10 and the substrate recognition camera 12 (recognition means) so that, when recognizing the multiple calibration marks F on the calibration substrate E positioned by the substrate transport device 3, the recognition of the calibration marks F located in the multiple first areas A1 set on the calibration substrate E is restricted, and the recognition of the calibration marks F located in the second area A2 different from the first area A1 set on the calibration substrate E is permitted.

[0031] 4, the recognition processing unit 28 recognizes the center position of the calibration mark F by performing recognition processing on the image of the calibration mark F captured by the board recognition camera 12, and calculates the recognition position R(i,j) of the calibration mark F from the position of the center of the image captured by the board recognition camera 12 and the recognized center position of the calibration mark F. That is, the recognition position R(i,j) of the calibration mark F is the amount of displacement of the center position of the calibration mark F recognized by the board recognition camera 12 with the mark position P(i,j) of the calibration mark F as the starting point. Hereinafter, the amount of displacement of the recognition position R(i,j) in the X-axis direction is referred to as the displacement amount Rx(i,j), and the amount of displacement in the Y-axis direction is referred to as the displacement amount Ry(i,j). The recognition processing unit 28 stores the acquired recognition position R(i,j)=(Rx(i,j),Ry(i,j)) of the calibration mark F in the storage unit 21 as the recognition result data 23.

[0032] Here, an example of the recognition result data 23 will be described with reference to Fig. 5. In this embodiment, only the recognition position R(i,j) of the calibration mark F in the second area A2 is stored in the recognition result data 23. That is, in Fig. 5, the recognition position R(i,j) of the calibration mark F in the first area A1 is left blank.

[0033] In the calibration data derivation process, in order to reduce the influence of vibrations of the component mounting device M caused by the movement and stopping of the board recognition camera 12, the movement speed of the board recognition camera 12 is slower than in normal component mounting work, and the waiting time from stopping to the start of imaging is also longer. Therefore, it takes a long time to image (recognize) one calibration mark F. In this embodiment, only 88 of the 169 marks arranged on the calibration board E are imaged (recognized), so that the time required for the calibration data derivation process can be shortened.

[0034] Next, with reference to Fig. 6, the influence of distortion and installation error of beam B (X-axis beam 8, Y-axis beam 7) in component mounting device M will be described. Fig. 6 shows the state where the distorted X-axis beam 8 is moved in the Y-axis direction and stopped at positions Y1, Y5, Y9, and Y13. Even if the X-axis beam 8 moves in the Y-axis direction, the distortion of the X-axis beam 8 does not change, but the inclination of the X-axis beam 8 with respect to the X-axis varies depending on the position in the Y-axis direction due to the influence of assembly error, etc. Such distortion and installation error of beam B differ for each component mounting device M, and are characteristic values ​​specific to the device that vary little after the component mounting device M is assembled.

[0035] In a component mounting device M in which the beam B has distortion or an installation error, when the moving mechanism 10 is controlled based on the control data to move the mounting head 9, a deviation occurs between the control data and the stopping position of the mounting head 9. In order to correct the deviation between the control data and the stopping position of the mounting head 9 and accurately mount components on the board 4, calibration data 26 specific to the component mounting device M is used. In the component mounting device M, the control data is corrected based on this calibration data 26 to perform the component mounting work, thereby achieving high component mounting accuracy.

[0036] 4, the first derivation unit 29 derives reference straight lines Gx and Gy of the X-axis beam 8 assuming that the shape of the X-axis beam 8 is a straight line, based on the recognition result data 23. The first derivation unit 29 derives a reference straight line Gx representing the displacement amount of the X-axis beam 8 in the X-axis direction and a reference straight line Gy representing the displacement amount of the X-axis beam 8 in the Y-axis direction, based on the recognition result data 23.

[0037] First, the recognition result data 23 used by the first derivation unit 29 to derive the reference line Gy representing the displacement amount of the X-axis beam 8 in the Y-axis direction will be described with reference to FIG. 7. In deriving the reference line Gy representing the displacement amount of the X-axis beam 8 in the Y-axis direction, the displacement amount Ry(i,j) in the Y-axis direction included in the recognition position R(i,j) of the calibration mark F in the second line L2 of the first, fifth, ninth, and thirteenth rows in which the calibration marks F are arranged on the line in the Y-axis direction in the recognition result data 23 is used (FIG. 7). In other words, the first derivation unit 29 derives the reference line Gy representing the displacement amount of the X-axis beam 8 in the Y-axis direction based on the displacement amount Ry(i,j) (recognition result) in the Y-axis direction of the calibration marks F in the first, fifth, ninth, and thirteenth rows (specific positions) among the calibration marks F arranged on the first line L1 along the X-axis direction (predetermined direction) in the calibration substrate E.

[0038] Similarly, in deriving the reference straight line Gx representing the displacement amount of the X-axis beam 8 in the X-axis direction, the displacement amount Rx(i,j) in the X-axis direction included in the recognition position R(i,j) of the calibration mark F in the second line L2 of the first, fifth, ninth, and thirteenth rows in which the calibration marks F are arranged on a straight line in the Y-axis direction in the recognition result data 23 is used (not shown). In other words, the first derivation unit 29 derives the reference straight line Gx representing the displacement amount of the X-axis beam 8 in the X-axis direction based on the displacement amount Rx(i,j) (recognition result) in the X-axis direction of the calibration marks F in the first, fifth, ninth, and thirteenth rows (specific positions) among the calibration marks F arranged on the first line L1 along the X-axis direction (predetermined direction) in the calibration substrate E. In this way, the first derivation unit 29 derives the reference straight lines Gx, Gy for the first line L1 in one direction (X-axis direction) of the two axial directions, the X-axis direction and the Y-axis direction.

[0039] Next, a specific example of derivation of the reference straight line Gy representing the displacement amount of the X-axis beam 8 in the Y-axis direction by the first derivation unit 29 will be described with reference to Fig. 8. Fig. 8 describes a method of deriving the reference straight line Gy representing the displacement amount in the Y-axis direction by assuming the distorted X-axis beam 8 to be a straight line based on the recognition positions R(1,j), R(5,j), R(9,j), and R(13,j) of the calibration mark F in the jth row. The first derivation unit 29 derives the reference straight line Gy(j) (=myj×X+byj) from the displacement amounts Ry(1,j), Ry(5,j), Ry(9,j), and Ry(13,j) in the Y-axis direction of the four recognition positions R(1,j), R(5,j), R(9,j), and R(13,j) using the least squares method or the like. Here, myj is the slope of the reference line Gy(j) of the jth row, and byj is the intercept.

[0040] The first derivation unit 29 derives the slope myj and intercept byj of the reference line Gy(j) representing the displacement amount in the Y-axis direction of the X-axis beam 8 in each row, and stores them in the storage unit 21 as the reference line data 24. That is, the first derivation unit 29 derives the slope myj and intercept byj for each row based on the displacement amount Ry(i,j) in the Y-axis direction included in the recognition position R(i,j) of the calibration mark F for 13 rows shown in FIG. 7 (see FIG. 10). Similarly, the first derivation unit 29 derives the slope mxj and intercept bxj of the reference line Gx(j) representing the displacement amount in the X-axis direction of the Y-axis beam 7 in each row (see FIG. 9), and stores them in the storage unit 21 as the reference line data 24 (not shown).

[0041] 4, the second derivation unit 30 derives the shape of the X-axis beam 8 based on the recognition positions R(i,j) (recognition results) of the calibration marks F arranged on the second line L2 of the 1st, 5th, 9th, and 13th rows and the reference straight lines Gx, Gy of the X-axis beam 8, based on the recognition result data 23 and the reference straight line data 24. Specifically, the second derivation unit 30 first calculates the predicted position Ty(i,j) (=myj×Xi+byj) in the Y-axis direction of the mark position P(i,j) of the jth row for each X coordinate (Xi) of the mark position P(i,j) based on the reference straight line data 24. Next, the second derivation unit 30 calculates the linearity Dy(i,j) in the Y-axis direction, which is the difference between the displacement amount Ry(i,j) in the Y-axis direction contained in the recognition position R(i,j) of the calibration mark F and the predicted position Ty(i,j) (=Ry(i,j)-Ty(i,j)).

[0042] FIG. 11 shows the linearity Dy(i,j) in the Y-axis direction calculated by the second derivation unit 30. The linearity Dy(i,j) in the Y-axis direction is calculated as a distortion component in the Y-axis direction of the X-axis beam 8, which is a deviation in the Y-axis direction that remains even after correcting the inclination of the X-axis beam 8 with respect to the X-axis. The second derivation unit 30 further averages the linearities Dy(i,j) in the Y-axis direction of the first, fifth, ninth, and thirteenth rows for each X coordinate (Xi) (average(Dy(i,1),Dy(i,5),Dy(i,9),Dy(i,13))) to derive the beam shape ADy(i) in the Y-axis direction of the X-axis beam 8. The second derivation unit 30 stores the derived beam shape ADy(i) in the Y-axis direction of the X-axis beam 8 in the memory unit 21 as beam shape data 25.

[0043] Similarly, the second derivation unit 30 calculates a predicted position Tx(i,j) (=mxj×Xi+bxj) in the X-axis direction of the mark position P(i,j) in the jth row based on a reference straight line Gx that represents the displacement amount in the X-axis direction of the X-axis beam 8. Next, the second derivation unit 30 calculates a linearity Dx(i,j) (=Rx(i,j)-Tx(i,j)) in the X-axis direction, which is the difference between the displacement amount Rx(i,j) in the X-axis direction included in the recognition position R(i,j) of the calibration mark F and the predicted position Tx(i,j). Next, the second derivation unit 30 averages the linearities Dx(i,j) in the X-axis direction of the 1st, 5th, 9th, and 13th rows for each X coordinate (Xj) (average(Dx(i,1),Dx(i,5),Dx(i,9),Dx(i,13))) to derive the beam shape ADx(i) in the X-axis direction of the X-axis beam 8. The second derivation unit 30 stores the derived beam shape ADx(i) in the X-axis direction of the X-axis beam 8 in the memory unit 21 as beam shape data 25.

[0044] In this way, the second derivation unit 30 derives the beam shape AD(i) = (ADx(i), ADy(i)) of the X-axis beam 8 for the second line L2 in one of the two axial directions (X-axis direction) of the X-axis direction and the Y-axis direction, taking into account the predicted position T(i, j) = (Tx(i, j), Ty(i, j)) based on the reference straight line Gx, Gy of the calibration mark F placed on the second line L2.

[0045] Furthermore, a plurality of second lines L2 are set on the calibration substrate E, and the second derivation unit 30 averages the linearity D(i,j)=(Dx(i,j),Dy(i,j)), which is the difference between the position based on the recognized position R(i,j) (recognition result) of the calibration mark F arranged on the second lines L2 and the predicted position T(i,j) based on the reference straight lines Gx, Gy, to derive the beam shape AD(i) of the X-axis beam 8. By averaging multiple linearities D(i,j) (four in this case) having the same row or column, it is possible to reduce the effects of measurement variation and variation due to the recognition process.

[0046] 4, the correction value calculation unit 31 calculates a correction value S(i,j) of the control data used when the control device 20 controls the moving mechanism 10 based on the predicted position T(i,j) of the calibration mark F based on the reference straight line Gx, Gy and the beam shape AD(i) of the X-axis beam 8. At that time, the correction value calculation unit 31 also calculates a correction value S(i,j) for the mark position P(i,j) of the calibration mark F in the first area A1 where the recognition position R(i,j) (recognition result) has not been acquired. In this way, the correction value calculation unit 31 can also calculate the correction value S(i,j) for the calibration mark F in the first area A1 that is not imaged by the board recognition camera 12 (imaging means) based on the predicted position T(i,j) of the calibration mark F based on the reference straight line Gx, Gy and the beam shape AD(i) of the X-axis beam 8.

[0047] 12 shows the correction value S(i,j) calculated by the correction value calculation unit 31. The correction value S(i,j) is calculated for each mark position P(i,j) of the calibration mark F on the calibration substrate E. In this example, the correction value calculation unit 31 calculates the deviation amount from the mark position P(i,j) of the calibration mark F as the correction value S(i,j). Specifically, the correction value calculation unit 31 adds the beam shape ADx(i) of the X-axis beam 8 in the X-axis direction to the predicted position Tx(i,j) in the X-axis direction based on the reference straight line Gx(j) representing the displacement amount of the X-axis beam 8 in the X-axis direction to calculate the correction value Sx(i,j) (=Tx(i,j)+ADx(i)) in the X-axis direction.

[0048] Similarly, the correction value calculation unit 31 calculates a correction value Sy(i,j) (=Ty(i,j)+ADy(i)) in the Y-axis direction by adding the beam shape ADy(i) in the Y-axis direction of the X-axis beam 8 to a predicted position Ty(i,j) in the Y-axis direction based on a reference straight line Gy(j) that represents the displacement amount in the X-axis direction of the X-axis beam 8. The correction value calculation unit 31 stores the calculated correction value S(i,j)=(Sx(i,j),Sy(i,j)) in the memory unit 21 as the calibration data 26.

[0049] The correction value calculation unit 31 may calculate the calibration data 26 as the deviation amount from the mark position P(i,j) of the calibration mark F, or may calculate it in XY coordinates with the mark position P(1,1) of the calibration substrate E as the origin. In that case, the correction value Sx(i,j) in the X-axis direction is Tx(i,j)+ADx(j)+Xi, and the correction value Sy(i,j) in the Y-axis direction is Ty(i,j)+ADy(j)+Yj. The calibration data 26 can be used as the correction value S(i,j) of the control data in the component mounting work, as well as data for quality control after the assembly of the component mounting device M. For example, if the correction value S(i,j) has an area or a singular point exceeding a predetermined control threshold, it can be determined that there is an abnormality in the manufacture of the component mounting device M.

[0050] Next, a calibration data derivation processing method of the component mounting method in the component mounting device M will be described with reference to the flow of Fig. 13 and Fig. 14. In Fig. 13, first, the substrate transport device 3 transports the calibration substrate E and positions it at the mounting work position (ST1: calibration substrate positioning step). Next, the calibration processing control unit 27 controls the movement mechanism 10 and the substrate recognition camera 12 (recognition means) to restrict recognition of the calibration marks F located in the multiple first areas A1 set on the calibration substrate E and to allow recognition of the calibration marks F located in the second area A2, thereby capturing images of the calibration marks F, and the recognition processing unit 28 performs recognition processing on the captured image result to recognize the recognition positions R(i, j) of the calibration marks F (ST2: recognition step).

[0051] Next, the first derivation unit 29 derives a reference straight line Gx, Gy of the X-axis beam 8, which is assumed to have a straight shape, based on the recognition position R(i, j) (recognition result) of the calibration mark F at a specific position (specific row) among the multiple calibration marks F arranged on the first line L1 along the predetermined direction (X-axis direction) (ST3: first derivation step). Next, the second derivation unit 30 derives the beam shape AD(i) of the X-axis beam 8 based on the recognition position R(i, j) (recognition result) of the calibration mark F arranged on the second line L2 and the reference straight line Gx, Gy (ST4: second derivation step).

[0052] 14, in the second derivation step (ST4), first, the second derivation unit 30 calculates the predicted position T(i,j) of the calibration mark F based on the reference straight lines Gx, Gy (ST11: predicted position calculation step). Next, the second derivation unit 30 calculates the linearity D(i,j) from the difference between the recognized position R(i,j) of the calibration mark F and the predicted position T(i,j) (ST12: linearity calculation step). Next, the second derivation unit 30 averages the linearity D(i,j) in the Y-axis direction to derive the beam shape AD(i) of the X-axis beam 8 (ST13: averaging step).

[0053] 13, the correction value calculation unit 31 then calculates a correction value S(i,j) of the control data as calibration data based on the predicted position T(i,j) of the calibration mark F based on the reference straight lines Gx, Gy and the beam shape AD(i) of the X-axis beam 8 (ST5: calibration data calculation step). This makes it possible to properly obtain the amount of positional deviation (correction value S(i,j)) of the mounting head 9 caused by the shape of the beam B.

[0054] As described above, the component mounting device M of this embodiment comprises a mounting head 9 which mounts components on a board 4 which has been transported and positioned by the board transport device 3, a moving mechanism 10 which moves the mounting head 9 in a horizontal plane along the beam B, and a recognition means (board recognition camera 12) which moves together with the mounting head 9 to recognize the downward direction.

[0055] The component mounting device M is equipped with a control unit (calibration process control unit) that controls the moving mechanism 10 and the recognition means (substrate recognition camera 12) so as to restrict recognition of the calibration marks F in the multiple first areas A1 set on the calibration substrate E and allow recognition of the calibration marks F located in the second area A2 when recognizing the multiple calibration marks F on the calibration substrate E positioned by the substrate transport device 3, a first derivation unit 29 that derives reference straight lines Gx, Gy of the X-axis beam 8, assuming that the shape of the X-axis beam 8 is straight, based on the recognition result (recognition position R(i, j)) of the calibration marks F at a specific position among the multiple calibration marks F arranged on a first line L1 along a predetermined direction, and a second derivation unit 30 that derives the beam shape AD(i) of the X-axis beam 8 based on the recognition result of the calibration marks F arranged on the second line L2 including only the calibration marks F in the second area A2 and the reference straight lines Gx, Gy.

[0056] This makes it possible to appropriately obtain the amount of positional deviation (correction value S(i, j)) of the mounting head 9 caused by the shape of the beam B.

[0057] In the above description, the first derivation unit 29, the second derivation unit 30, and the correction value calculation unit 31 are provided in the component mounting device M, but the first derivation unit 29, the second derivation unit 30, and the correction value calculation unit 31 may be provided in the management computer CP. In this case, the recognition position R(i,j) (recognition result data 24) of the calibration mark F on the calibration substrate E recognized by the component mounting device M is transmitted to the management computer CP. Then, the first derivation unit 29 of the management computer CP derives the reference straight line Gx, Gy of the X-axis beam 8, the second derivation unit 30 of the management computer CP derives the beam shape AD(i) of the X-axis beam 8, and the correction value calculation unit 31 of the management computer CP calculates the correction value S(i,j) of the control data.

[0058] That is, the component mounting system 1 may be configured such that the component mounting device M includes a control unit (calibration process control unit 27) that controls the moving mechanism 10 and the recognition means (board recognition camera 12), and the management computer CP includes a first derivation unit 29 and a second derivation unit 30. This makes it possible to appropriately obtain the positional deviation amount (correction value S(i,j)) of the mounting head 9 caused by the shape of the beam B. [Industrial Applicability]

[0059] The component mounting device, component mounting method, and component mounting system of the present invention have the effect of being able to properly obtain the amount of positional deviation of a mounting head caused by the shape of a beam, and are useful in the field of mounting components on a substrate. [Explanation of symbols]

[0060] 1. Parts mounting system 3. Substrate transport device 4. Board 7 Y-axis beam 8 X-axis beam 9 Mounting Head 10 Moving mechanism 12 Board recognition camera (recognition means) A1 1st Area A2 2nd Area AD, ADx, ADy beam shape B Beam D, Dx, Dy Linearity (difference) E Calibration board F Calibration mark Gx, Gy reference straight line L1 First Line L2 Second Line R Recognition position (recognition result) Rx, Ry Displacement (recognition result) S, Sx, Sy correction values T, Tx, Ty predicted position

Claims

1. A component mounting device comprising: a mounting head that mounts components on a board that has been transported and positioned by a board transport device; a movement mechanism that moves the mounting head within a horizontal plane along a beam; and recognition means that moves together with the mounting head to recognize an area below, a control unit that controls the moving mechanism and the recognition means so that, when recognizing a plurality of calibration marks on a calibration substrate positioned by the substrate transport device, recognition of the calibration marks located in a plurality of first areas set on the calibration substrate is restricted and recognition of the calibration marks located in a second area different from the first areas set on the calibration substrate is permitted; a first derivation unit that derives a reference straight line of the beam assuming that the shape of the beam is a straight line based on a recognition result of the calibration mark at a specific position among the plurality of calibration marks arranged on a first line along a predetermined direction on the calibration substrate; a second derivation unit that derives the shape of the beam based on the recognition result of the calibration mark that is placed on a second line that includes only the calibration mark in the second area on the first line among the multiple first lines on the calibration substrate and the reference straight line.

2. The component mounting device according to claim 1 , wherein the second derivation unit derives the shape of the beam in consideration of a predicted position of the calibration mark arranged on the second line based on the reference straight line.

3. a plurality of the second lines are set on the calibration substrate, 3. The component mounting device according to claim 2, wherein the second derivation unit derives the shape of the beam by averaging a difference between a position of the calibration mark arranged on the second line based on the recognition result and the predicted position based on the reference straight line.

4. 2. The component mounting device according to claim 1, further comprising: a correction value calculation unit that calculates a correction value of control data used when controlling the moving mechanism, based on a predicted position of the calibration mark based on the reference straight line and a shape of the beam.

5. 5. The component mounting device according to claim 4, wherein the correction value calculation unit calculates the correction value for the position of the calibration mark in the first area based on a predicted position of the calibration mark based on the reference straight line and a shape of the beam.

6. The component mounting device includes two beams aligned along two intersecting axes in a horizontal plane, The first derivation unit derives the reference straight line for a first line in one of the two axial directions, The component mounting device according to claim 1 , wherein the second derivation unit derives a shape of a beam along the one direction for a second line in the one direction.

7. A component mounting method for a component mounting device including a mounting head that mounts components on a board that has been transported and positioned by a board transport device, a movement mechanism that moves the mounting head within a horizontal plane along a beam, and recognition means that moves together with the mounting head to recognize an area below, the method comprising the steps of: a recognition process for recognizing a plurality of calibration marks on a calibration substrate positioned by the substrate transport device by controlling the moving mechanism and the recognition means so as to restrict recognition of the calibration marks located in a plurality of first areas set on the calibration substrate and to permit recognition of the calibration marks located in a second area different from the first areas set on the calibration substrate; a first derivation step of deriving a reference straight line of the beam, assuming that the shape of the beam is a straight line, based on a recognition result by the recognition means of the calibration mark at a specific position among the plurality of calibration marks arranged on a first line along a predetermined direction on the calibration substrate; a second derivation step of deriving a shape of the beam based on the recognition result by the recognition means of the calibration mark arranged on a second line that includes only the calibration mark in the second area on the first line among the plurality of first lines on the calibration substrate and the reference straight line.

8. A component mounting system comprising: a mounting head that mounts components on a board that has been transported and positioned by a board transport device; a movement mechanism that moves the mounting head within a horizontal plane along a beam; and recognition means that moves together with the mounting head to recognize an area below, a control unit that controls the moving mechanism and the recognition means so that, when recognizing a plurality of calibration marks on a calibration substrate positioned by the substrate transport device, recognition of the calibration marks located in a plurality of first areas set on the calibration substrate is restricted and recognition of the calibration marks located in a second area different from the first areas set on the calibration substrate is permitted; a first derivation unit that derives a reference straight line of the beam assuming that the shape of the beam is a straight line based on a recognition result of the calibration mark at a specific position among the plurality of calibration marks arranged on a first line along a predetermined direction on the calibration substrate; a second derivation unit that derives the shape of the beam based on the recognition result of the calibration mark that is placed on a second line that includes only the calibration mark in the second area on the first line among the multiple first lines on the calibration substrate and the reference straight line.

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