Resin molding material, cured product, molded body, electronic component and electronic device

Abstract

To provide a resin molding material that is capable of yielding a cured product with improved tracking resistance, a cured product having improved tracking resistance, and a molded body, an electronic component and an electronic device which employ the cured product.SOLUTION: A resin molding material contains a diallyl cycloalkane-based resin having a structure represented by general formula (1), an initiator, and a filler.SELECTED DRAWING: None

Description

[Technical field]

[0001] The present invention relates to a resin molding material, a cured product, a molded article, an electronic component, and an electronic device. [Background technology]

[0002] Various resin molding materials are known for use in the manufacture of electronic components.

[0003] As a technique relating to such a resin molding material, for example, the technique described in Patent Document 1 can be mentioned. Patent Document 1 describes a diallyl phthalate resin molding material that is characterized in that it contains, as essential components, 300 to 700 parts by mass of ferrite powder, 0.05 to 0.15 parts by mass of a polymerization inhibitor, and 1 to 10 parts by mass of a curing catalyst, for 100 parts by mass of a resin component that is a blend of an unsaturated polyester resin and a diallyl phthalate resin in a mass ratio of 99 / 1 to 20 / 80, with the aim of providing a molding material that has excellent fluidity while maintaining a curing speed, is excellent in low-pressure moldability, and is particularly suitable for multiple-cavity molding of small parts. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2009-256671 A Summary of the Invention [Problem to be solved by the invention]

[0005] The present invention provides a resin molding material capable of improving the tracking resistance of the resulting cured product, a cured product having improved tracking resistance, and a molded article, electronic component, and electronic device using the cured product. [Means for solving the problem]

[0006] The present inventors have conducted extensive research to achieve the above object, and as a result have found that the inclusion of a specific diallylcycloalkane resin can improve the tracking resistance of the resulting cured product, thereby completing the present invention.

[0007] According to the present invention, there are provided a resin molding material, a cured product, a molded article, an electronic component, and an electronic device as described below.

[0008] [1] A diallylcycloalkane resin having a structure represented by the following general formula (1): An initiator; A resin molding material comprising: [ka] (In the above general formula (1), R A represents an alkylene group having 1 to 4 carbon atoms, the alkylene group may be linear or branched, and some of the hydrogen atoms in the alkylene group may be substituted with a substituent; R B represents an alicyclic hydrocarbon structure having 3 to 18 carbon atoms, the alicyclic hydrocarbon structure may be monocyclic or polycyclic, and some of the hydrogen atoms in the alicyclic hydrocarbon structure may be substituted with a substituent; R C represents an alkylene group having 1 to 4 carbon atoms, the alkylene group may be linear or branched, and some of the hydrogen atoms in the alkylene group may be substituted with a substituent. [2] The resin molding material according to the above [1], which can be used as an insulating material for constituting electronic components. [3] The resin molding material according to the above [1] or [2], wherein the diallylcycloalkane resin contains a constitutional unit derived from diallyl cyclohexanedicarboxylate. [4] The resin molding material according to any one of the above [1] to [3], wherein the content of the diallylcycloalkane resin is 10% by mass or more and 80% by mass or less, when the entire resin molding material is taken as 100% by mass. [5] The weight average molecular weight of the diallylcycloalkane resin in terms of polystyrene is 1.0×10 4 Above 2.0×10 5 The resin molding material according to any one of the above [1] to [4], which is: [6] The resin molding material according to any one of the above [1] to [5], wherein the initiator comprises an organic peroxide. [7] The resin molding material according to any one of the above [1] to [6], wherein the content of the initiator is 0.1% by mass or more and 5.0% by mass or less, when the entire resin molding material is taken as 100% by mass. [8] The resin molding material according to any one of the above [1] to [7], wherein the filler comprises one or more selected from the group consisting of glass fiber, antimony trioxide, zinc borate, uncalcined clay, calcined clay, aluminum hydroxide, magnesium hydroxide, powdered cellulose, and ethylene bistetrabromophthalimide. [9] The filler is Glass fiber and and one or more selected from the group consisting of antimony trioxide, zinc borate, uncalcined clay, calcined clay, aluminum hydroxide, and magnesium hydroxide.

[10] The resin molding material according to any one of the above [1] to [9], wherein the content of the filler is 30% by mass or more and 80% by mass or less, when the entire resin molding material is taken as 100% by mass.

[11] The resin molding material according to any one of the above [1] to

[10] , which is in the form of powder, tablet or granules.

[12] The resin molding material according to any one of the above [1] to

[11] , which has a bending strength of 70 MPa or more and 200 MPa or less, measured by the following (Method 1). (Method 1) The resin molding material is transfer molded under the conditions of a mold temperature of 165°C, an injection pressure of 5 MPa, and a curing time of 240 seconds to obtain a molded body of 80 mm length x 10 mm width x 4 mm thickness. The bending strength of the obtained molded body at 25°C is measured in accordance with JIS K 6911:2006.

[13] The resin molding material according to any one of the above [1] to

[12] , having a flexural modulus of 5.0 GPa or more and 20.0 GPa or less, measured by the following (Method 2): (Method 2) The resin molding material is transfer molded under the conditions of a mold temperature of 165°C, an injection pressure of 5 MPa, and a curing time of 240 seconds to obtain a molded body of 80 mm length x 10 mm width x 4 mm thickness. The flexural modulus of the obtained molded body at 25°C is measured in accordance with JIS K 6911:2006.

[14] The resin molding material according to any one of the above [1] to

[13] , which has a comparative tracking index of 750 V or more according to the following (Method 4). (Method 4) The resin molding material is transfer molded under the conditions of a mold temperature of 165°C, an injection pressure of 5 MPa, and a curing time of 240 seconds to obtain a disk-shaped molded body with a diameter of 50 mm and a thickness of 3 mm. The comparative tracking index of the obtained molded body is measured. At this time, for voltages of 600 V or less, the measurement is performed in accordance with the test method specified in the international standard IEC60112. For voltages exceeding 600 V, the electrode in the test method specified in the international standard IEC60112 is rotated 180° around the longitudinal direction of the electrode as the axis of rotation, and the electrode is fixed so that the angle between the molded body and the electrode is 30°.

[15] A cured product of the resin molding material according to any one of the above [1] to

[14] .

[16] A molded article comprising the cured product described in

[15] above.

[17] An electronic part comprising the cured product according to

[15] above.

[18] An electronic device comprising the electronic component described in

[17] above. Effect of the Invention

[0009] According to the present invention, it is possible to provide a resin molding material capable of improving the tracking resistance of the obtained cured product, as well as a cured product, a molded article, an electronic component, and an electronic device having improved tracking resistance. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an embodiment of the present invention will be described in detail. In this specification, unless otherwise specified, the expression "X to Y" in the explanation of a numerical range means from X to Y. For example, "1 to 5% by mass" means "from 1% by mass to 5% by mass".

[0011] <Resin molding material> First, the resin molding material of the present embodiment will be described.

[0012] The resin molding material of the present embodiment contains a diallylcycloalkane resin having a structure represented by the following general formula (1), an initiator, and a filler.

[0013] [ka]

[0014] In the above general formula (1), R A represents an alkylene group having 1 to 4 carbon atoms, the alkylene group may be linear or branched, and some of the hydrogen atoms in the alkylene group may be substituted with a substituent; R B represents an alicyclic hydrocarbon structure having 3 to 18 carbon atoms, the alicyclic hydrocarbon structure may be monocyclic or polycyclic, and some of the hydrogen atoms in the alicyclic hydrocarbon structure may be substituted with a substituent; R C represents an alkylene group having 1 to 4 carbon atoms, the alkylene group may be linear or branched, and some of the hydrogen atoms in the alkylene group may be substituted with a substituent.

[0015] The resin molding material of this embodiment contains a diallylcycloalkane resin having a structure represented by the above general formula (1), and thus the obtained cured product can have improved tracking resistance. The reason for this is believed to be that the diallylcycloalkane resin contained in the resin molding material of this embodiment has an alicyclic hydrocarbon structure that has excellent tracking resistance, and therefore the cured product of the resin molding material of this embodiment can have improved tracking resistance. Therefore, the resin molding material of this embodiment can be used as an insulating material that constitutes electronic components.

[0016] Hereinafter, each component contained in the resin molding material of the present embodiment will be described in more detail.

[0017] [Diallylcycloalkane resin] The resin molding material of the present embodiment contains a diallylcycloalkane resin having a structure represented by the following general formula (1), which can improve the tracking resistance of the resulting cured product.

[0018] [ka]

[0019] In the above general formula (1), R A represents an alkylene group having 1 to 4 carbon atoms, the alkylene group may be linear or branched, and some of the hydrogen atoms in the alkylene group may be substituted with a substituent; R B represents an alicyclic hydrocarbon structure having 3 to 18 carbon atoms, the alicyclic hydrocarbon structure may be monocyclic or polycyclic, and some of the hydrogen atoms in the alicyclic hydrocarbon structure may be substituted with a substituent; R C represents an alkylene group having 1 to 4 carbon atoms, the alkylene group may be linear or branched, and some of the hydrogen atoms in the alkylene group may be substituted with a substituent.

[0020] In the diallylcycloalkane resin in the resin molding material of this embodiment, R BExamples of the alicyclic hydrocarbon structure having 3 or more and 18 or less carbon atoms in the formula (2) include structures of the following formulas (2) to (5). Among these, from the viewpoint of improving the tracking resistance of the obtained cured product, a structure selected from the group consisting of formulas (2) to (4) is preferable, a structure selected from the group consisting of formulas (2) to (3) is more preferable, and a structure selected from the group consisting of formula (3) is even more preferable. In the formula, * indicates the bonding site with the allyl group.

[0021] [ka]

[0022] [ka]

[0023] [ka]

[0024] [ka]

[0025] From the viewpoint of improving the balance between the mechanical strength and tracking resistance of the resulting cured product, R A and R C are each independently preferably an alkylene group having 1 to 3 carbon atoms, more preferably an alkylene group having 1 to 2 carbon atoms, and even more preferably a methylene group.

[0026] In addition, from the viewpoint of improving the balance between the mechanical strength and tracking resistance of the resulting cured product, R Bis preferably an alicyclic hydrocarbon structure having 3 to 16 carbon atoms, more preferably an alicyclic hydrocarbon structure having 4 to 12 carbon atoms, even more preferably an alicyclic hydrocarbon structure having 5 to 9 carbon atoms, even more preferably an alicyclic hydrocarbon structure having 5 to 7 carbon atoms, and even more preferably an alicyclic hydrocarbon structure having 6 carbon atoms (cyclohexane structure).

[0027] R B However, when the structure is an alicyclic hydrocarbon structure having 6 carbon atoms (cyclohexane structure), examples of the structure include structures selected from the group consisting of the following formulas (6) to (8), and the structure of formula (6) is preferred.

[0028] [ka]

[0029] [ka]

[0030] [ka]

[0031] The diallylcycloalkane resin in the resin molding material of the present embodiment preferably contains a constitutional unit derived from diallyl cyclohexanedicarboxylate. A is a methylene group, and R B is a cyclohexane structure, and R C is a methylene group. This can improve the balance of mechanical strength and tracking resistance of the resulting cured product.

[0032] As such a diallylcycloalkane resin, for example, RADPAR AD-032, RADPAR AD-044 (manufactured by Osaka Soda Co., Ltd.) and the like can be used.

[0033] The content of the diallylcycloalkane resin in the resin molding material of this embodiment, when the entire resin molding material is taken as 100% by mass, is preferably 10% by mass or more, more preferably 15% by mass or more, even more preferably 20% by mass or more, even more preferably 25% by mass or more, and even more preferably 30% by mass or more, from the viewpoint of improving the performance balance of the fluidity of the resin molding material and the mechanical strength and tracking resistance of the obtained cured product, and is preferably 80% by mass or less, more preferably 70% by mass or less, even more preferably 60% by mass or less, even more preferably 50% by mass or less, and even more preferably 45% by mass or less.

[0034] The polystyrene-equivalent weight average molecular weight of the diallylcycloalkane resin in the resin molding material of the present embodiment is preferably 1.0×10 from the viewpoint of improving the balance of the fluidity of the resin molding material and the mechanical strength and tracking resistance of the obtained cured product. 4 More preferably, 1.5×10 4 More preferably, 2.0×10 4 More preferably, 2.5×10 4 and preferably 2.0×10 5 Less than or equal to 1.5×10 5 Less than 1.0×10 5 Less than 9.0×10, more preferably 4 Less than 8.0×10, more preferably 4 Less than 7.0×10, more preferably 4 The following is the result.

[0035] [Initiator] The resin molding material of the present embodiment contains an initiator, which can promote the reaction of the resin molding material and improve the curability.

[0036] The initiator in the resin molding material of the present embodiment includes, for example, one or more selected from the group consisting of organic peroxides and azo compounds, and preferably includes an organic peroxide, which can improve the curability of the resin molding material and the mechanical strength and tracking resistance of the obtained cured product. The organic peroxide includes, for example, one or more selected from the group consisting of diacyl peroxides, dialkyl peroxides, and peroxyketals, and more specifically, ketone peroxides such as methyl ethyl ketone peroxide and cyclohexanone peroxide; peroxyketals such as 1,1-di(t-butylperoxy)cyclohexane and 2,2-di(4,4-di(t-butylperoxy)cyclohexyl)propane; hydroperoxides such as p-menthane hydroperoxide, diisopropylbenzene hydroperoxide, 1,1,3,3-tetramethylbutyl hydroperoxide, cumene hydroperoxide, and t-butyl hydroperoxide; di(2-t-butylperoxyisopropyl)benzene, dicumyl peroxide, The peroxyesters include one or more selected from the group consisting of dialkyl peroxides such as 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, t-butylcumyl peroxide, di-t-hexyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)hexyne-3, and di-t-butyl peroxide; diacyl peroxides such as dibenzoyl peroxide and di(4-methylbenzoyl)peroxide; peroxydicarbonates such as di-n-propyl peroxydicarbonate and diisopropyl peroxydicarbonate; and peroxyesters such as 2,5-dimethyl-2,5-di(benzoylperoxy)hexane, t-hexyl peroxybenzoate, t-butyl peroxybenzoate, and t-butylperoxy 2-ethylhexanoate. Two or more types having different decomposition temperatures may also be used.

[0037] The organic peroxide preferably includes one having a decomposition temperature of 100°C to 200°C to obtain a half-life of 1 minute. Since the components can be kneaded at a temperature at which the initiator does not decompose, a resin molding material can be obtained in which the progress of the reaction via the initiator is suppressed. This improves the performance balance between the mechanical strength and tracking resistance of the obtained cured product.

[0038] The lower limit of the content of the initiator in the resin molding material of this embodiment is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, even more preferably 0.5% by mass or more, even more preferably 0.7% by mass or more, and even more preferably 1.0% by mass or more, when the entire resin molding material is taken as 100% by mass. By having the content of the initiator be equal to or more than the above lower limit, it is possible to improve the performance balance of the curability of the resin molding material and the mechanical strength and tracking resistance of the obtained cured product. The upper limit of the content of the initiator in the resin molding material of this embodiment is preferably 5.0% by mass or less, more preferably 4.0% by mass or less, more preferably 3.0% by mass or less, and even more preferably 2.0% by mass or less, when the entire resin molding material is taken as 100% by mass. By making the content of the initiator equal to or more than the lower limit, it is possible to improve the performance balance of the moldability of the resin molding material and the mechanical strength and tracking resistance of the obtained cured product.

[0039] [Filling material] The resin molding material of the present embodiment contains a filler, which can improve the balance of mechanical strength and tracking resistance of the resulting cured product.

[0040] The filler of the present embodiment includes, for example, one or more types selected from the group consisting of inorganic fillers and organic fillers, and preferably includes an inorganic filler from the viewpoint of improving the tracking resistance of the obtained cured product.

[0041] The inorganic filler includes, for example, one or more selected from the group consisting of fibrous inorganic fillers such as glass fiber, and non-fibrous inorganic fillers such as antimony trioxide, zinc borate, uncalcined clay, calcined clay, aluminum hydroxide, magnesium hydroxide, calcium carbonate, wollastonite, talc, silica, diatomaceous earth, alumina, magnesium oxide, barium sulfate, boron nitride, etc. Among these, from the viewpoint of improving the performance balance of the mechanical strength and tracking resistance of the obtained cured product, the inorganic filler preferably includes one or more selected from the group consisting of glass fiber, antimony trioxide, zinc borate, uncalcined clay, calcined clay, aluminum hydroxide, and magnesium hydroxide. Here, "non-fibrous" refers to, for example, spherical, plate-like, irregular shapes, and the like.

[0042] Among these, the inorganic filler in the resin molding material of the present embodiment preferably contains glass fiber and one or more selected from the group consisting of antimony trioxide, zinc borate, uncalcined clay, calcined clay, aluminum hydroxide, and magnesium hydroxide, which can reduce the orientation of the inorganic filler and increase the filler content, thereby improving the performance balance of the linear expansion anisotropy, flame retardancy, and mechanical properties of the obtained cured product.

[0043] The glass fiber is not particularly limited, and may include, for example, one or more types selected from the group consisting of C-glass fiber, D-glass fiber, E-glass fiber, S-glass fiber, T-glass fiber, and AR-glass fiber.

[0044] In the case of a fibrous inorganic filler, the average fiber diameter of the inorganic filler in the resin molding material of this embodiment is, from the viewpoint of improving the workability in the production stage of the resin molding material and the performance balance of the mechanical properties and tracking resistance of the obtained cured product, for example, 3 μm or more, preferably 6 μm or more, more preferably 9 μm or more, and even more preferably 10 μm or more, and is, for example, 30 μm or less, preferably 25 μm or less, more preferably 20 μm or less, even more preferably 15 μm or less, and even more preferably 12 μm or less.

[0045] In the case of non-fibrous inorganic fillers, the average particle size of the inorganic filler in the resin molding material of this embodiment is, from the viewpoint of improving the performance balance of the dimensional stability, mechanical properties, and tracking resistance of the obtained cured product, for example, 0.1 μm or more, preferably 0.3 μm or more, more preferably 0.5 μm or more, and even more preferably 0.8 μm or more, and is, for example, 100 μm or less, preferably 80 μm or less, more preferably 60 μm or less, even more preferably 40 μm or less, even more preferably 20 μm or less, and even more preferably 15 μm or less.

[0046] The organic filler includes, for example, one or more selected from the group consisting of acrylic resin particles; olefin resin particles such as polyethylene and polypropylene; silicone resin particles such as organosilicone powder; polystyrene resin particles; polyacrylonitrile resin particles; fluororesin particles such as tetrafluoroethylene; powdered cellulose such as pulp and wood flour; and ethylenebistetrabromophthalimide. These may be used alone or in combination of two or more.

[0047] In the case of an organic filler, the average particle diameter of the organic filler in the resin molding material of this embodiment is, from the viewpoint of improving the performance balance of the dimensional stability, mechanical properties, and tracking resistance of the obtained cured product, for example, 0.1 μm or more, preferably 0.3 μm or more, more preferably 0.5 μm or more, even more preferably 0.8 μm or more, even more preferably 1.0 μm or more, even more preferably 1.5 μm or more, even more preferably 2.0 μm or more, even more preferably 2.5 μm or more, and even more preferably 3.0 μm or more, and is, for example, 100 μm or less, preferably 80 μm or less, more preferably 60 μm or less, even more preferably 50 μm or less, and even more preferably 40 μm or less.

[0048] The filler in the resin molding material of this embodiment preferably contains one or more of the above-mentioned inorganic and organic fillers selected from the group consisting of glass fiber, antimony trioxide, zinc borate, uncalcined clay, calcined clay, aluminum hydroxide, magnesium hydroxide, powdered cellulose, and ethylene bistetrabromophthalimide, from the viewpoint of improving the performance balance of the mechanical strength and tracking resistance of the obtained cured product, and more preferably contains glass fiber and one or more of the group consisting of antimony trioxide, zinc borate, uncalcined clay, calcined clay, aluminum hydroxide, and magnesium hydroxide. This makes it possible to reduce the orientation of the inorganic filler and increase the content of the filler, thereby further improving the performance balance of the linear expansion anisotropy, flame retardancy, and mechanical properties of the obtained cured product.

[0049] The content of the filler in the resin molding material of this embodiment, when the entire resin molding material is taken as 100% by mass, is, from the viewpoint of improving the workability in the production stage of the resin molding material and the dimensional stability of the obtained cured product, and the performance balance of the mechanical properties and tracking resistance, preferably 30% by mass or more, more preferably 35% by mass or more, even more preferably 40% by mass or more, even more preferably 45% by mass or more, even more preferably 50% by mass or more, and is preferably 80% by mass or less, more preferably 75% by mass or less, even more preferably 70% by mass or less, and even more preferably 65% ​​by mass or less.

[0050] [Other ingredients] The resin molding material of the present embodiment may contain the components shown below.

[0051] (Coupling Agent) The resin molding material of the present embodiment preferably further contains a coupling agent, which improves the adhesion between the diallylcycloalkane resin and the filler in the resin molding material, and improves the balance of the mechanical properties and tracking resistance of the resulting cured product.

[0052] The coupling agent of the present embodiment preferably contains one or more selected from the group consisting of methoxysilane, ethoxysilane, and epoxysilane, which can improve the adhesion between the diallylcycloalkane resin and the filler in the resin molding material, and the balance of the mechanical properties and tracking resistance of the resulting cured product.

[0053] The methoxysilane includes, for example, one or more selected from the group consisting of vinyltrimethoxysilane, p-styryltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-acryloxypropyltrimethoxysilane, N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, phenylaminopropyltrimethoxysilane, 3-mercaptopropylmethyldimethoxysilane, and 3-mercaptopropyltrimethoxysilane. Furthermore, the ethoxysilane includes, for example, one or more selected from the group consisting of vinyltriethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-aminopropyltriethoxysilane, and 3-isocyanatopropyltriethoxysilane. The epoxy silane includes, for example, one or more selected from the group consisting of 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, and 3-glycidoxypropyltriethoxysilane. These may be used alone or in combination of two or more.

[0054] The content of the coupling agent in the resin molding material of the present embodiment, when the entire resin molding material is taken as 100% by mass, is, from the viewpoint of improving the performance balance between the mechanical properties and tracking resistance of the obtained cured product, preferably 0.01% by mass or more, more preferably 0.05% by mass or more, even more preferably 0.10% by mass or more, and even more preferably 0.15% by mass or more, and is preferably 5.0% by mass or less, more preferably 4.5% by mass or less, even more preferably 4.0% by mass or less, even more preferably 3.5% by mass or less, and even more preferably 3.0% by mass or less.

[0055] (Diallyl phthalate monomer) The resin molding material of the present embodiment may contain a diallyl phthalate monomer. Diallyl phthalate monomer is an ester of phthalic acid and allyl alcohol. Depending on the type of phthalic acid used, diallyl phthalate monomer may be of ortho type using phthalic anhydride or orthophthalic acid, meta type using isophthalic acid, or para type using terephthalic acid. These may be used alone or in combination of two or more.

[0056] The content of diallyl phthalate monomer in the resin molding material of this embodiment, when the entire resin molding material is taken as 100 mass%, is, from the viewpoint of improving fluidity, preferably 0.1 mass% or more, more preferably 0.5 mass% or more, even more preferably 1.0 mass% or more, even more preferably 1.5 mass% or more, and is preferably 5.0 mass% or less, more preferably 4.0 mass% or less, even more preferably 3.0 mass% or less, and even more preferably 2.5 mass% or less.

[0057] (Release agent) The resin molding material of the present embodiment may contain a mold release agent. Specifically, the mold release agent in the resin molding material of the present embodiment contains one or more types selected from the group consisting of stearic acid, calcium stearate, magnesium stearate, carnauba wax, and polyethylene.

[0058] The content of the release agent in the resin molding material of this embodiment, when the entire resin molding material is taken as 100% by mass, is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, and even more preferably 0.5% by mass or more, from the viewpoint of improving the production efficiency of a cured product of the resin molding material of this embodiment and a molded article containing the cured product, and is preferably 5.0% by mass or less, more preferably 4.0% by mass or less, even more preferably 3.0% by mass or less, and even more preferably 2.0% by mass or less, from the viewpoint of improving the performance balance between the mechanical properties and tracking resistance of the obtained cured product.

[0059] (Pigments) The resin molding material of the present embodiment may contain a pigment. Specifically, the pigment in the resin molding material of the present embodiment contains one or more pigments selected from the group consisting of carbon black and nigrosine.

[0060] The pigment content in the resin molding material of this embodiment, when the entire resin molding material is taken as 100% by mass, is preferably 0.1% by mass or more, more preferably 0.2% by mass or more, and even more preferably 0.3% by mass or more, from the viewpoint of improving the imprintability of the obtained cured product and molded article, and is preferably 3.0% by mass or less, more preferably 2.5% by mass or less, even more preferably 2.0% by mass or less, even more preferably 1.5% by mass or less, and even more preferably 1.0% by mass or less, from the viewpoint of improving the performance balance of the mechanical properties and tracking resistance of the obtained cured product.

[0061] (Inhibitor) The resin molding material of the present embodiment may contain an inhibitor. The inhibitor in the resin molding material of the present embodiment may be a known inhibitor, and includes, for example, butylcatechol.

[0062] The content of the inhibitor in the resin molding material of this embodiment, when the entire resin molding material is taken as 100% by mass, is preferably 0.001% by mass or more, and more preferably 0.002% by mass or more, from the viewpoint of improving the fluidity of the resin molding material of this embodiment, and is preferably 0.100% by mass or less, more preferably 0.050% by mass or less, even more preferably 0.010% by mass or less, and even more preferably 0.005% by mass or less, from the viewpoint of improving the performance balance between the mechanical properties and tracking resistance of the obtained cured product.

[0063] (solvent) The resin molding material of the present embodiment may contain a solvent. The solvent in the resin molding material of the present embodiment may be a known solvent, and may include, for example, one or more solvents selected from the group consisting of water and ethanol.

[0064] The content of the solvent in the resin molding material of this embodiment, when the entire resin molding material is taken as 100 mass%, is preferably 0.1 mass% or more, more preferably 0.3 mass% or more, even more preferably 0.5 mass% or more, even more preferably 0.7 mass% or more, and even more preferably 0.9 mass% or more, from the viewpoint of improving the fluidity of the resin molding material of this embodiment, and is preferably 10.0 mass% or less, more preferably 8.0 mass% or less, even more preferably 6.0 mass% or less, and even more preferably 5.0 mass% or less, from the viewpoint of improving the performance balance of the mechanical properties and tracking resistance of the obtained cured product.

[0065] In addition, other additives may be contained in addition to the above-mentioned components, so long as the effect of the resin molding material of the present embodiment is not impaired.

[0066] Next, the shape of the resin molding material of this embodiment will be described. The resin molding material of the present embodiment is preferably in the form of a powder, tablet, or granule. By using the resin molding material in the above-mentioned form, it is possible to improve the production efficiency of the cured product of the resin molding material of the present embodiment and a molded product containing the cured product.

[0067] Next, a method for producing the resin molding material of this embodiment will be described. Regarding the method for producing the resin molding material, for example, the above-mentioned components are mixed by a known means, melt-kneaded in a kneading machine such as a roll, a kneader or an extruder, cooled, and then pulverized to obtain a powdered resin molding material. After pulverization, the mixture may be molded to obtain a granular resin molding material, or may be compressed into tablets to obtain a particulate resin molding material. The obtained resin molding material may be appropriately adjusted in terms of dispersion degree, flowability, etc.

[0068] [Physical properties of resin molding materials] (Bending strength) The bending strength of the resin molding material of this embodiment, measured by the following (Method 1), is, from the viewpoint of improving the performance balance between the mechanical strength and tracking resistance of the obtained cured product, preferably 70 MPa or more, more preferably 90 MPa or more, even more preferably 110 MPa or more, even more preferably 130 MPa or more, even more preferably 140 MPa or more, and is preferably 200 MPa or less, more preferably 190 MPa or less, even more preferably 180 MPa or less, even more preferably 170 MPa or less, even more preferably 160 MPa or less, and even more preferably 150 MPa or less.

[0069] (Method 1) The resin molding material is transfer molded under the conditions of a mold temperature of 165°C, an injection pressure of 5 MPa, and a curing time of 240 seconds to obtain a molded body of 80 mm length x 10 mm width x 4 mm thickness. The bending strength of the obtained molded body at 25°C is measured in accordance with JIS K 6911:2006.

[0070] In this case, a typical transfer molding machine can be used as the device for transfer molding, for example, TEP50-70 (manufactured by Fujiwa Seiki Co., Ltd.).

[0071] (Flexural modulus) From the viewpoint of improving the performance balance between the mechanical strength and tracking resistance of the obtained cured product, the flexural modulus of the resin molding material of this embodiment, measured by the following (Method 2), is preferably 5.0 GPa or more, more preferably 6.0 GPa or more, even more preferably 7.0 GPa or more, even more preferably 8.0 GPa or more, even more preferably 9.0 GPa or more, even more preferably 10.0 GPa or more, and is preferably 20.0 GPa or less, more preferably 19.0 GPa or less, even more preferably 18.0 GPa or less, even more preferably 17.0 GPa or less, even more preferably 16.0 GPa or less, even more preferably 15.0 GPa or less, even more preferably 14.0 GPa or less, even more preferably 13.0 GPa or less, even more preferably 12.0 GPa or less, even more preferably 11.0 GPa or less.

[0072] (Method 2) The resin molding material is transfer molded under the conditions of a mold temperature of 165°C, an injection pressure of 5 MPa, and a curing time of 240 seconds to obtain a molded body of 80 mm length x 10 mm width x 4 mm thickness. The flexural modulus of the obtained molded body at 25°C is measured in accordance with JIS K 6911:2006.

[0073] In this case, a typical transfer molding machine can be used as the device for transfer molding, for example, TEP50-70 (manufactured by Fujiwa Seiki Co., Ltd.).

[0074] (Tensile strength) The tensile strength of the resin molding material of this embodiment, measured by the following (Method 3), is, from the viewpoint of improving the performance balance between the mechanical strength and tracking resistance of the obtained cured product, preferably 50 MPa or more, more preferably 60 MPa or more, even more preferably 70 MPa or more, even more preferably 80 MPa or more, and is preferably 150 MPa or less, more preferably 140 MPa or less, even more preferably 130 MPa or less, even more preferably 120 MPa or less, even more preferably 110 MPa or less, even more preferably 100 MPa or less, even more preferably 90 MPa or less.

[0075] (Method 3) The resin molding material is transfer molded under the conditions of a mold temperature of 165°C, an injection pressure of 5 MPa, and a curing time of 240 seconds to obtain a molded product having the shape and dimensions of a tensile test piece shown in Figure 30, Tensile Test Piece for Molding Material, of JIS K 6911: 2006. The tensile strength of the obtained molded product at 25°C is measured in accordance with JIS K 6911: 2006.

[0076] In this case, a typical transfer molding machine can be used as the device for transfer molding, for example, T50-E (manufactured by Matsuda Manufacturing Co., Ltd.) can be used.

[0077] (Comparative Tracking Index) From the viewpoint of improving the tracking resistance of the obtained cured product, the comparative tracking index of the resin molding material of this embodiment, as determined by the following (Method 4), is preferably 750 V or more, more preferably 800 V or more, and even more preferably 850 V or more. The upper limit of the comparative tracking index is not particularly limited, and may be, for example, 2000 V or less, 1800 V or less, 1600 V or less, 1400 V or less, 1200 V or less, 1000 V or less, or 900 V or less.

[0078] (Method 4) The resin molding material is transfer molded under the conditions of a mold temperature of 165°C, an injection pressure of 5 MPa, and a curing time of 240 seconds to obtain a disk-shaped molded body with a diameter of 50 mm and a thickness of 3 mm. The comparative tracking index of the obtained molded body is measured. At this time, for voltages of 600 V or less, the measurement is performed in accordance with the test method specified in the international standard IEC60112. For voltages exceeding 600 V, the electrode in the test method specified in the international standard IEC60112 is rotated 180° around the longitudinal direction of the electrode as the axis of rotation, and the electrode is fixed so that the angle between the molded body and the electrode is 30°.

[0079] A more specific method for measuring the comparative tracking index is, for example, the method described in "Plastic Age, November 2020 issue, '3.2 Tracking resistance test system capable of applying up to 1,000 V'". As the device for transfer molding, a general transfer molding machine, for example, TEP50-70 (manufactured by Fujiwa Seiki Co., Ltd.) can be used.

[0080] <Cured product> The cured product of the present embodiment is a cured product obtained by curing the resin molding material of the present embodiment described above. The cured product of the present embodiment can be used for any of the known uses of cured products, but is preferably used for sealing, for example, semiconductor elements, substrates, terminals, coils, magnets, etc.

[0081] The method for producing the cured product of the present embodiment includes, for example, a method of heating the resin molding material of the present embodiment. The heating conditions such as the heating temperature and heating time when heating the resin molding material of the present embodiment can be appropriately adjusted depending on the composition of the resin molding material.

[0082] From the viewpoint of production efficiency of the cured product, the heating temperature of the resin molding material in this embodiment is preferably 100°C or more, more preferably 110°C or more, even more preferably 120°C or more, even more preferably 130°C or more, even more preferably 140°C or more, even more preferably 150°C or more, and even more preferably 160°C or more, and from the viewpoint of improving the performance balance of the mechanical strength and tracking resistance of the cured product, the heating temperature is preferably 250°C or less, more preferably 240°C or less, even more preferably 230°C or less, even more preferably 220°C or less, even more preferably 210°C or less, even more preferably 200°C or less, even more preferably 190°C or less, even more preferably 180°C or less, and even more preferably 170°C or less.

[0083] The heating time of the resin molding material in this embodiment is, from the viewpoint of improving the performance balance between the mechanical strength and tracking resistance of the cured product, preferably 30 seconds or more, more preferably 50 seconds or more, even more preferably 70 seconds or more, even more preferably 90 seconds or more, and even more preferably 110 seconds or more, and from the viewpoint of production efficiency of the cured product, preferably 600 seconds or less, more preferably 550 seconds or less, even more preferably 500 seconds or less, even more preferably 450 seconds or less, even more preferably 400 seconds or less, even more preferably 350 seconds or less, even more preferably 300 seconds or less, and even more preferably 250 seconds or less.

[0084] <Molded body> The molded article of the present embodiment includes a cured product of the resin molding material of the present embodiment described above. Examples of the molding method for obtaining the molded body include injection molding, transfer molding, compression molding, etc. Conditions such as molding temperature and molding time when molding the resin molding material of this embodiment can be appropriately adjusted depending on the molding method, molding device, or compounding of the resin molding material.

[0085] From the viewpoint of the production efficiency of the molded body, the molding temperature of the resin molding material of this embodiment is preferably 100°C or more, more preferably 110°C or more, even more preferably 120°C or more, even more preferably 130°C or more, even more preferably 140°C or more, even more preferably 150°C or more, and even more preferably 160°C or more, and from the viewpoint of improving the performance balance of the mechanical strength and tracking resistance of the molded body, it is preferably 250°C or less, more preferably 240°C or less, even more preferably 230°C or less, even more preferably 220°C or less, even more preferably 210°C or less, even more preferably 200°C or less, even more preferably 190°C or less, even more preferably 180°C or less, and even more preferably 170°C or less.

[0086] The molding time of the resin molding material of this embodiment is, from the viewpoint of improving the performance balance of the mechanical strength and tracking resistance of the molded body, preferably 30 seconds or more, more preferably 50 seconds or more, even more preferably 70 seconds or more, even more preferably 90 seconds or more, and even more preferably 110 seconds or more, and from the viewpoint of the production efficiency of the molded body, preferably 600 seconds or less, more preferably 550 seconds or less, even more preferably 500 seconds or less, even more preferably 450 seconds or less, even more preferably 400 seconds or less, even more preferably 350 seconds or less, even more preferably 300 seconds or less, and even more preferably 250 seconds or less.

[0087] <Electronic components> The electronic component of the present embodiment includes a cured product of the resin molding material of the present embodiment described above. The method for obtaining electronic components may be, for example, using the resin molding material of the present embodiment as a molding resin to encapsulate substrates, terminals, bus bars, connectors, etc. by injection molding, transfer molding, compression molding, etc. The conditions during encapsulation molding, such as temperature, pressure, and molding time, can be appropriately adjusted depending on the molding method, molding device, or compounding of the resin molding material.

[0088] <Electronic equipment> The electronic device of this embodiment includes the electronic component of this embodiment described above. Examples of the electronic device of the present embodiment include a sensor, an inverter, a motor, a bus bar, a battery, a battery junction box, an on-board charger, etc. The resin molding material of the present embodiment can be used as a sealing material, a coating material, an interlayer insulating material, a cover, a case, a separator, etc. in these electronic devices.

[0089] Although the embodiments of the present invention have been described above, these are merely examples of the present invention, and various configurations other than those described above can be adopted. Furthermore, the present invention is not limited to the above-described embodiments, and modifications and improvements within the scope of the present invention are included in the present invention. EXAMPLES

[0090] The embodiments of the present invention will be described in detail based on Examples and Comparative Examples. It should be noted that the present invention is not limited to the Examples.

[0091] <Resin molding material> <Examples 1 and 2, Comparative Examples 1 and 2> The components were mixed according to the compounding ratio shown in Table 1, melt-kneaded for 5 minutes with a heated roll at 90° C., then removed and crushed into granules to obtain a resin molding material. Details of each component in Table 1 are as follows: The blending ratio of each component shown in Table 1 indicates the blending ratio (mass %) to the entire resin molding material.

[0092] (Diallylcycloalkane Resin) Diallylcycloalkane resin 1: Osaka Soda Co., Ltd., product name: RADPAR AD-032, mass average molecular weight (polystyrene equivalent): 4.5 x 10 4

[0093] (Diallyl phthalate resin) Diallyl phthalate resin 1: manufactured by Osaka Soda Co., Ltd., product name: Daisodapp K, mass average molecular weight (polystyrene equivalent): 2.5 x 10 4

[0094] (Diallyl phthalate monomer) Diallyl phthalate monomer 1: manufactured by Osaka Soda Co., Ltd., product name: Daisoda-dap monomer

[0095] (Initiator) Initiator 1: Dicumyl peroxide (NOF Corporation, product name: Percumyl D)

[0096] (filling material) Filler 1: Ethylenebistetrabromophthalimide (manufactured by Juko Co., Ltd., product name: RDT-5, average particle size: 3.2 μm) Filler 2: Antimony trioxide (manufactured by Nihon Seiko Co., Ltd., product name: PATOX-C, average particle size: 3.5 μm (catalog value)) Filler 3: Zinc borate (manufactured by USBorax, product name: FIREBRAKE ZB, average particle size: 9 μm (catalog value)) Filler 4: Glass fiber (manufactured by Nippon Electric Glass, product name: ECS03 B-180H, average fiber diameter: 10.5 μm)

[0097] (Release agent) Release agent 1: Calcium stearate (manufactured by Nitto Kasei Kogyo Co., Ltd., product name: Ca-St)

[0098] (Pigments) Pigment 1: Carbon black (Mitsubishi Chemical Corporation, product name: Carbon Black #750B)

[0099] (Physical property evaluation) The physical properties of the resin molding materials obtained in each example were evaluated by the following methods. The results are shown in Table 1.

[0100] (Flexural strength / flexural modulus) Using a transfer molding machine (manufactured by Fujiwa Seiki Co., Ltd., "TEP50-70"), the resin molding materials of Examples 1-2 and Comparative Examples 1-2 were transfer molded under the conditions of a mold temperature of 165°C, an injection pressure of 5 MPa, and a curing time of 240 seconds to obtain molded bodies of length 80 mm x width 10 mm x thickness 4 mm. The flexural strength and flexural modulus of the obtained molded bodies at 25°C were measured in accordance with JIS K 6911:2006.

[0101] (Tensile strength) Using a transfer molding machine (Matsuda Manufacturing Co., Ltd., "T50-E"), the resin molding materials of Examples 1-2 and Comparative Examples 1-2 were transfer molded under conditions of a mold temperature of 165°C, an injection pressure of 5 MPa, and a curing time of 240 seconds to obtain molded bodies having the shape and dimensions of tensile test pieces shown in Figure 30 Tensile test pieces for molding materials of JIS K 6911: 2006. The tensile strength of the obtained molded bodies at 25°C was measured in accordance with JIS K 6911: 2006.

[0102] (Comparative Tracking Index) Using a transfer molding machine (manufactured by Fujiwa Seiki Co., Ltd., "TEP50-70"), the resin molding materials of Examples 1-2 and Comparative Examples 1-2 were transfer molded under the conditions of a mold temperature of 165°C, an injection pressure of 5 MPa, and a curing time of 240 seconds to obtain a disk-shaped molded body having a diameter of 50 mm and a thickness of 3 mm. The comparative tracking index of the obtained molded body was measured. At this time, at a voltage of 600 V or less, the measurement was performed in accordance with the test method defined in the international standard IEC60112. In addition, at a voltage of more than 600 V, the electrode in the test method defined in the international standard IEC60112 was rotated 180° around the longitudinal direction of the electrode as the axis of rotation, and the measurement was performed by fixing the electrode so that the angle between the cured product and the electrode was 30°.

[0103] [Table 1]

[0104] The resin molding materials of Examples 1 and 2 had improved tracking resistance compared to Comparative Examples 1 and 2 in which no diallylcycloalkane-based resin was used.

Claims

1. A diallylcycloalkane resin having a structure represented by the following general formula (1): An initiator; A resin molding material comprising: 【Chemistry 1】 (In the general formula (1), R Ａ represents an alkylene group having 1 to 4 carbon atoms, the alkylene group may be linear or branched, and some of the hydrogen atoms in the alkylene group may be substituted with a substituent; R Ｂ represents an alicyclic hydrocarbon structure having 3 to 18 carbon atoms, the alicyclic hydrocarbon structure may be monocyclic or polycyclic, and some of the hydrogen atoms in the alicyclic hydrocarbon structure may be substituted with a substituent; R Ｃ represents an alkylene group having 1 to 4 carbon atoms, the alkylene group may be linear or branched, and some of the hydrogen atoms in the alkylene group may be substituted with a substituent.

2. The resin molding material according to claim 1, which can be used as an insulating material for constituting electronic parts.

3. The resin molding material according to claim 1 or 2, wherein the diallylcycloalkane resin contains a constitutional unit derived from diallyl cyclohexanedicarboxylate.

4. The resin molding material according to claim 1 or 2, wherein the content of the diallylcycloalkane resin is 10% by mass or more and 80% by mass or less when the entire resin molding material is taken as 100% by mass.

5. The diallylcycloalkane resin has a polystyrene-equivalent weight average molecular weight of 1.0×10 ４ Above 2.0 x 10 ５ The resin molding material according to claim 1 or 2, wherein:

6. The resin molding material according to claim 1 or 2, wherein the initiator comprises an organic peroxide.

7. The resin molding material according to claim 1 or 2, wherein a content of the initiator is 0.1% by mass or more and 5.0% by mass or less, when the entire resin molding material is taken as 100% by mass.

8. 3. The resin molding material according to claim 1, wherein the filler comprises one or more selected from the group consisting of glass fiber, antimony trioxide, zinc borate, uncalcined clay, calcined clay, aluminum hydroxide, magnesium hydroxide, powdered cellulose, and ethylene bistetrabromophthalimide.

9. The filler is Glass fiber and 3. The resin molding material according to claim 1 or 2, further comprising one or more selected from the group consisting of antimony trioxide, zinc borate, uncalcined clay, calcined clay, aluminum hydroxide and magnesium hydroxide.

10. The resin molding material according to claim 1 or 2, wherein the content of the filler is 30% by mass or more and 80% by mass or less when the entire resin molding material is taken as 100% by mass.

11. 3. The resin molding material according to claim 1, which is in the form of a powder, tablet or granule.

12. The resin molding material according to claim 1 or 2, having a bending strength of 70 MPa or more and 200 MPa or less, measured by the following (Method 1). (Method 1) The resin molding material is transfer molded under the conditions of a mold temperature of 165° C., an injection pressure of 5 MPa, and a curing time of 240 seconds to obtain a molded body having a length of 80 mm, a width of 10 mm, and a thickness of 4 mm. The bending strength of the obtained molded body at 25° C. is measured in accordance with JIS K 6911:2006.

13. The resin molding material according to claim 1 or 2, having a flexural modulus of 5.0 GPa or more and 20.0 GPa or less, measured by the following (Method 2). (Method 2) The resin molding material is transfer molded under the conditions of a mold temperature of 165° C., an injection pressure of 5 MPa, and a curing time of 240 seconds to obtain a molded body having a length of 80 mm, a width of 10 mm, and a thickness of 4 mm. The flexural modulus of the obtained molded body at 25° C. is measured in accordance with JIS K 6911:2006.

14. The resin molding material according to claim 1 or 2, which has a comparative tracking index of 750 V or more according to the following (Method 4). (Method 4) The resin molding material is transfer molded under the conditions of a mold temperature of 165°C, an injection pressure of 5 MPa, and a curing time of 240 seconds to obtain a disk-shaped molded body with a diameter of 50 mm and a thickness of 3 mm. The comparative tracking index is measured for the obtained molded body. At this time, for a voltage of 600 V or less, the measurement is performed in accordance with the test method specified in the international standard IEC 60112. For a voltage of more than 600 V, the electrode in the test method specified in the international standard IEC 60112 is rotated 180° around the longitudinal direction of the electrode as the axis of rotation, and the electrode is fixed so that the angle between the molded body and the electrode is 30°.

15. A cured product of the resin molding material according to claim 1 or 2.

16. A molded article comprising the cured product according to claim 15.

17. An electronic component comprising the cured product according to claim 15.

18. An electronic device comprising the electronic component of claim 17.

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