Bed structure, heat source, magnetic refrigeration apparatus, and method for manufacturing bed structure

By forming a flow path in the bed structure of a magnetic refrigeration refrigeration equipment and filling it with resin with low thermal conductivity, the thermal conductivity between particles is suppressed, and the problem of thermal conductivity in existing equipment is solved, and the temperature difference and heat exchange performance are improved.

JP2025060187APending Publication Date: 2025-04-10DAIKIN INDUSTRIES LTD

Patent Information

Application Number
JP2023170751
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-09-29
Publication Date
2025-04-10

AI Technical Summary

Technical Problem

In existing magnetic refrigeration equipment, the thermal conductivity between particles cannot be suppressed, resulting in the inability to form temperature differences at both ends of the bed structure and insufficient equipment performance.

Method used

By forming a flow path between particles in the bed structure of a magnetic refrigeration refrigeration device, and filling the particles with a resin with low thermal conductivity, the thermal conductivity between particles is suppressed, thereby suppressing the thermal conductivity in the flow path direction.

Benefits of technology

It effectively increases the temperature difference between the particles at both ends of the bed structure, promotes heat exchange between the fluid and the particles, and improves the overall performance of the equipment.

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Abstract

To provide a bed structure, a heat source, a magnetic refrigeration apparatus with improved performance, and a method for manufacturing the bed structure.SOLUTION: A bed structure (10) is used in a magnetic refrigeration apparatus and equipped with a plurality of particles (11). The particles (11) have a magnetocaloric effect. Flow channels (14) through which fluid passes are formed between the particles (11). The bed structure (10) has a structure in which thermal conduction between the particles (11) is suppressed. The heat source comprises an application part which applies a magnetic field to the bed structure and particles. The heat source has a plurality of kinds of particles with different magnetocaloric effects. The magnetic refrigeration apparatus is equipped with a heat source and a moving part which moves fluid performing heat exchange with the particles.SELECTED DRAWING: Figure 1
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Description

[Technical field]

[0001] The present invention relates to a bed structure, a heat source, a magnetic refrigeration device, and a method for manufacturing the bed structure. [Background technology]

[0002] Conventionally, an active magnetic refrigeration (AMR) type magnetic refrigeration device is known as an environmentally friendly refrigeration technology. As disclosed in Patent Document 1 (JP Patent Publication No. 2016-530479), an AMR type magnetic refrigeration device has a bed structure including particles having a magnetocaloric effect filled in a bed as a container. Paragraph

[0050] of Patent Document 1 discloses that most of the particles are in contact with each other. Summary of the Invention [Problem to be solved by the invention]

[0003] However, in the technology disclosed in Patent Document 1, most of the particles are in contact with each other, so that heat conduction between the particles cannot be suppressed. Therefore, the temperature difference between both ends of the bed structure is suppressed, and the bed structure cannot have sufficient performance. [Means for solving the problem]

[0004] A bed structure according to a first aspect is a bed structure for use in a magnetic refrigeration device, and includes a plurality of particles. The particles have a magnetocaloric effect. A flow path through which a fluid passes is formed between the particles. The bed structure has a structure in which thermal conduction between the particles is suppressed.

[0005] The bed structure of the first aspect has a structure in which heat conduction between particles is suppressed, so that heat conduction between particles can be suppressed in the moving direction of the fluid passing through the flow path. Therefore, the temperature difference between the particles at both ends of the bed structure can be increased. Therefore, the heat exchange between the fluid and the particles can be promoted, so that the performance of the bed structure can be improved.

[0006] The bed structure according to a second aspect is the bed structure according to the first aspect, further comprising a resin interposed between the particles.

[0007] In the bed structure of the second aspect, since a resin having a lower thermal conductivity than the particles is interposed between the particles, a structure in which thermal conduction between the particles is suppressed can be easily realized.

[0008] A bed structure according to a third aspect is the bed structure according to the second aspect, in which the resin bonds a plurality of particles.

[0009] In the bed structure of the third aspect, since a plurality of particles are bonded together, heat conduction between the particles can be further suppressed.

[0010] A bed structure according to a fourth aspect is the bed structure according to the third aspect, in which the thickness of the resin in the flow path portion is different from the thickness of the resin in the particle bonding portion.

[0011] In the bed structure of the fourth aspect, by increasing the thickness of the resin at the bonded portions, the thermal conduction between the particles can be more effectively suppressed.

[0012] A bed structure according to a fifth aspect is the bed structure according to any one of the first to fourth aspects, in which a plurality of layers having the above-mentioned structure are laminated. The magnetocaloric effects of the particles constituting the plurality of layers are different.

[0013] In the bed structure of the fifth aspect, since the heat conduction between particles in each layer having different magneto-calorific effect can be suppressed, the temperature difference between the layers can be increased. Therefore, the heat exchange between the fluid and the particles can be further promoted, and the performance of the bed structure can be further improved.

[0014] A heat source according to a sixth aspect includes a bed structure and an application unit. The bed structure is any one of the bed structures according to the first aspect to the fifth aspect. The application unit applies a magnetic field to the particles. The heat source includes a plurality of types of particles. The plurality of types of particles have different magnetocaloric effects.

[0015] In the heat source of the sixth aspect, the heat conduction between particles having different magnetic heat material effects can be suppressed, so that the temperature difference between the particles can be increased. Therefore, the heat exchange between the fluid and the particles can be further promoted, so that the performance of the heat source can be improved.

[0016] A magnetic refrigeration apparatus according to a seventh aspect includes a heat source and a moving part. The module is the module according to the sixth aspect. The moving part moves a fluid that exchanges heat with the particles.

[0017] In the magnetic refrigeration device of the seventh aspect, the fluid that has been heated by heat exchange with the particles can be moved by the moving section to extract hot heat, and the fluid that has absorbed heat by heat exchange with the particles can be moved by the moving section to extract cold heat.

[0018] A method for producing a bed structure according to an eighth aspect is a method for producing the bed structure according to any one of the first aspect to the fifth aspect. The method for producing a bed structure includes a step of forming a resin on a surface of a particle, and a step of removing a part of the resin.

[0019] In the eighth aspect of the bed structure manufacturing method, a flow path through which a fluid passes can be formed by removing a part of the resin from a plurality of particles having a resin formed on the surface. In addition, since the remaining part of the resin is interposed between the plurality of particles, a structure in which heat conduction between the particles is suppressed can be formed. Therefore, a bed structure with improved performance can be manufactured.

[0020] A ninth aspect of the present invention relates to a method for manufacturing a bed structure according to the eighth aspect, wherein in the removing step, a part of the resin is removed by a solvent or a gas containing a solvent.

[0021] In the manufacturing method of the bed structure of the ninth aspect, since a solvent or a gas containing a solvent is used, a part of the resin can be easily removed.

[0022] A tenth aspect of the present invention relates to a method for manufacturing a bed structure according to the eighth or ninth aspect, and the forming step includes a step of stacking a plurality of layers. Each of the plurality of layers includes particles having different magnetocaloric effects. After the forming step, a removing step is performed.

[0023] In the manufacturing method of the bed structure of the tenth aspect, a bed structure can be efficiently manufactured in which a plurality of layers having the above-mentioned structure are laminated and the magnetocaloric effects of the particles constituting the plurality of layers are different. [Brief description of the drawings]

[0024] [Figure 1] FIG. 2 is an enlarged schematic diagram of a bed structure according to an embodiment of the present disclosure. [Diagram 2] FIG. 2 is a schematic diagram of a bed structure. [Diagram 3] 1 is a flowchart showing a method for manufacturing a bed structure. [Figure 4] FIG. 2 is a schematic diagram of a particle. [Diagram 5] FIG. 2 is a schematic diagram showing a part of a particle on which a resin is formed. [Figure 6] FIG. 1 is a schematic diagram of accumulated particles. [Figure 7] FIG. 2 is a schematic diagram in which a fluid flow is added to FIG. 1. [Figure 8] FIG. 2 is a schematic diagram of a module according to an embodiment of the present disclosure. [Figure 9] FIG. 2 is a schematic diagram of a heat source according to an embodiment of the present disclosure. [Figure 10] 1 is a schematic configuration diagram of a magnetic refrigeration device according to an embodiment of the present disclosure. [Figure 11] FIG. 13 is a diagram showing the thermal conductivity and the temperature difference between both ends in a bed structure. [Figure 12] 1 is a photograph showing a part of a bed structure. [Figure 13] FIG. 13 is a diagram showing the flow rate and pressure difference of a refrigerant when the refrigerant is caused to flow through bed structures having various resin amounts. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0025] Hereinafter, a bed structure, a module, a heat source, and a magnetic refrigeration device according to an embodiment of the present disclosure will be described with reference to examples.

[0026] (1) Bed structure (1-1) Overview The bed structure of this embodiment is used in a magnetic refrigeration device of an active magnetic refrigeration (AMR) type. The bed structure includes a plurality of particles. The particles have a magnetocaloric effect. A flow path through which a fluid passes is formed between the particles. The bed structure has a structure in which thermal conduction between the particles is suppressed. This structure is configured so that thermal conduction between the particles is suppressed in the moving direction of the fluid flowing through the bed structure.

[0027] Such a bed structure can be configured, for example, as a bed structure 10 shown in Figures 1 and 2. As shown in Figure 1, the bed structure 10 of this embodiment includes a plurality of particles 11 and a resin 12.

[0028] The particles 11 can be used to obtain a magnetic calorific effect by changing the magnetic entropy, and to cool or heat an object to be temperature-regulated. The particles 11 generate heat when a magnetic field is applied, and absorb heat when the application of the magnetic field is stopped and the magnetic field is removed.

[0029] The particles 11 are not limited as long as they have a magnetocaloric effect. Here, the particles 11 are a magnetic working material having a Curie temperature, which is a phase transition temperature. Examples of such particles 11 include NaZn 13 Materials with structure (La-Fe-Si materials), MnAs 1-x Sb x etc.

[0030] The particles 11 are fine particles. Specifically, the particle diameter of the particles 11 is, for example, 50 μm or more and 500 μm or less.

[0031] The resin 12 has a smaller thermal conductivity than the particles 11. Therefore, the bed structure 10 has a structure in which the thermal conduction between the particles 11 is suppressed by the resin 12. Such a resin has, for example, insulating properties, and specifically, is an epoxy resin, an acrylic resin, or the like.

[0032] The resin 12 is interposed between the particles 11. The resin 12 may or may not be in contact with the particles 11. Here, at least a part of the resin 12 bonds a plurality of particles 11 together.

[0033] In this embodiment, the ratio of the mass of the resin 12 to the mass of the particles 11 (resin 12 / particles 11) is less than 10%.

[0034] A gap is provided between the particles 11 and the resin 12, and the gap forms a flow path 14 through which a fluid passes. Since a part of the surface of the particles 11 is exposed, the fluid passing through the flow path 14 exchanges heat with the particles 11.

[0035] Here, the thickness of resin 121 in the flow path 14 portion is different from the thickness of resin 122 in the bonded portion of particles 11. In other words, the thickness of the portion of resin 12 that contacts a plurality of particles 11 (resin 122) is different from the thickness of the portion facing flow path 14 (resin 121). In further other words, the thickness of resin 122 sandwiched between particles 11 is different from the thickness of resin 121 sandwiched between particles 11 and flow path 14. In FIG. 1, the thickness of resin 122 in the bonded portion of particles 11 is greater than the thickness of resin 121 in the flow path 14 portion.

[0036] 2, the bed structure 10 further includes a bed 13 that contains particles 11 and resin 12. Here, the bed 13 contains particles 11 of the same composition. In other words, the bed 13 contains one type of particles 11. The bed 13 of this embodiment constitutes the heat source 1 and the magnetic refrigeration device 100, which will be described later.

[0037] Bed 13 is a hollow packed tank. Bed 13 has surface 131 through which a fluid passes and surface 132 through which the fluid does not pass. Surface 131 through which the fluid passes has pores smaller than particles 11. Surface 132 through which the fluid does not pass has no pores. Furthermore, resin 12 is not disposed on surface 131 through which the fluid passes, and resin 12 is disposed on surface 132 through which the fluid does not pass.

[0038] (1-2) Manufacturing method A method for manufacturing the bed structure 10 shown in FIGS. 1 and 2 will be described below with reference to FIGS.

[0039] First, as shown in Fig. 3, particles 11 having a magnetocaloric effect in Fig. 4 are prepared (step S1). The particles 11 have a magnetocaloric effect.

[0040] 5, resin 12 is formed on the surface of particle 11 (step S2). By carrying out step S2, it is possible to form particle 11 coated with resin 12 that suppresses heat transfer. Here, resin 12 is applied to the entire surface of particle 11.

[0041] 6, the particles 11 having the resin 12 formed on their surfaces are accumulated (step S3). Here, a plurality of particles 11 having the resin 12 formed on their surfaces are accommodated in a bed 13. Note that the step (S2) of forming the resin 12 on the particles 11 and the step (S3) of accumulating a plurality of particles 11 having the resin 12 formed thereon may be separate steps or may be a single step.

[0042] 1, a part of the resin 12 is removed (step S4). A space formed by the removal becomes a flow path 14 through which a fluid passes. The remaining part of the resin 12 bonds a plurality of particles 11 together.

[0043] In the removing step (S4), a part of the resin 12 is removed by a solvent or a gas containing a solvent. The solvent is capable of dissolving the resin 12.

[0044] The removing step (S4) is carried out, for example, as follows. Specifically, a solvent or gas is flowed into the inside of the bed 13. This allows the resin 12 to be efficiently removed from the portion through which the solvent or gas passes, while the resin 12 remains in the portion where the particles 11 are adjacent to each other via the resin 12, so that the particles 11 can be bonded to each other. As a result, as shown in FIG. 1, a flow path 14 is formed in which the surfaces of the particles 11 having the magnetocaloric effect are exposed, and a bed structure 10 in which the particles 11 are bonded by the resin 12 can be manufactured.

[0045] Furthermore, in the removing step (S4), a relatively large amount of resin 12 remains on surface 132 of bed 13 through which the fluid does not pass, because the solvent or gas containing the solvent does not easily flow thereon. This reduces the number of flow paths 14 formed between surface 132 and particles 11. Therefore, by using bed 13 in heat source 1 and magnetic refrigeration device 100 described below, it is possible to suppress the fluid from flowing along both surfaces 132, thereby improving the efficiency of heat exchange between the fluid and resin 12.

[0046] (1-3) How to confirm that the structure has reduced thermal conduction In the manufacturing method (1-2) above, the thermal conductivity is measured when a plurality of particles 11 are filled in a bed 13 without forming resin 12 on the surface of the particles 11. When the thermal conductivity of the bed structure 10 of this embodiment is measured and compared to when there is no resin 12, it can be confirmed that the bed structure has a structure in which thermal conduction between the particles 11 is suppressed.

[0047] (1-4) Operation The operation of the bed structure 10 of this embodiment will be described with reference to Fig. 7. The arrows in Fig. 7 indicate the flow of fluid.

[0048] As shown in Fig. 7, a fluid passes through the flow path 14 of the bed structure 10 of this embodiment. The fluid flows while exchanging heat with the exposed particles 11. At this time, when the particles 11 generate heat due to the application of a magnetic field, or absorb heat due to the cessation of the application of the magnetic field, the fluid is heated or cooled by the particles 11.

[0049] (2) Module The module includes a plurality of bed structures. The module includes at least two bed structures arranged side by side. The shape and arrangement of the module are not particularly limited.

[0050] Such a module can be configured, for example, as a module 20 shown in Fig. 8. As shown in Fig. 8, the module 20 of this embodiment includes a first bed structure 10a, a second bed structure 10b, a third bed structure 10c, a fourth bed structure 10d, and a fifth bed structure 10e. The first to fifth bed structures 10a to 10e are the bed structures of (1-1) above, and include particles 11a to 11e, resins 12a to 12e, and beds 13a to 13e. The flow paths of the bed structures 10a to 10e are connected to each other.

[0051] The particles 11a to 11e constituting the bed structures 10a to 10e are different from each other. In other words, the module 20 has a plurality of kinds of particles 11a to 11e. The particles 11a of the first bed structure 10a, the particles 11b of the second bed structure 10b, the particles 11c of the third bed structure 10c, the particles 11d of the fourth bed structure 10d, and the particles 11e of the fifth bed structure 10e are made of materials having lower Curie temperatures in this order. In other words, the particles 11a of the first bed structure 10a, the particles 11b of the second bed structure 10b, the particles 11c of the third bed structure 10c, the particles 11d of the fourth bed structure 10d, and the particles 11e of the fifth bed structure 10e are arranged in order of decreasing Curie temperature.

[0052] (3)Heat source The heat source of this embodiment exchanges heat with the fluid by utilizing heat released from the particles. The heat source includes the bed structure of (1) above and an application unit. Here, the heat source includes the module of (2) above and an application unit. Therefore, the heat source has multiple types of particles with different magnetocaloric effects.

[0053] The application unit applies a magnetic field to the particles. In particular, the application unit is capable of changing the magnetic field applied to the particles. The application unit has a magnetic circuit or the like, and has a portion located on one side and a portion located on the other side with respect to the plurality of types of particles.

[0054] The application unit can switch between a state in which a magnetic field is applied to the particles and a state in which a magnetic field is not applied. The application unit may also be capable of performing a process of strengthening the magnetic field applied to the particles and a process of weakening the magnetic field without reducing the magnetic field to zero.

[0055] Such a heat source can be configured, for example, as a heat source 1 shown in Fig. 9. This heat source 1 includes a module 20 and an application unit 30.

[0056] 8, the module 20 has a plurality of bed structures 10a to 10e arranged side by side. The application unit 30 has a portion located on one side of the module 20 and a portion located on the other side, and can apply a magnetic field to the module 20, and can also stop the application of the magnetic field to remove the magnetic field.

[0057] (4) Magnetic refrigeration equipment The magnetic refrigeration device of this embodiment is of the AMR type, and includes the heat source (3) and a moving unit.

[0058] The moving part moves a fluid that exchanges heat with the particles. The fluid is in thermal contact with the particles. The fluid is, for example, a heat medium such as a refrigerant or water.

[0059] In detail, the moving part moves the fluid relative to the multiple types of particles included in the module. The moving part is not particularly limited, and may be composed of pistons provided on both sides of the particles, or may be composed of a pump provided in a closed circuit.

[0060] Such a magnetic refrigeration device can be configured, for example, as a magnetic refrigeration device 100 shown in Fig. 10. The magnetic refrigeration device 100 here is a temperature control device. The magnetic refrigeration device 100 includes a heat source 1, a movement circuit 60, a high-temperature side circuit 40, and a low-temperature side circuit 50.

[0061] As described above, the heat source 1 includes the module 20 and the application unit 30. As described in (2) above, the module 20 includes a plurality of bed structures 10a to 10e shown in Fig. 2 as shown in Fig. 8. The application unit 30 can apply a magnetic field to all of the first to fifth particles 11a to 11e included in the plurality of bed structures 10a to 10e, and can remove the magnetic field by weakening or stopping the applied magnetic field.

[0062] The movement circuit 60 has a tank 62, a pump 63, and a flow path 61 connecting them, and a fluid is sealed inside. The bed structures 10a to 10e may be disposed inside the tank 62, or may be disposed outside the tank 62 so that the fluid inside the tank 62 and the particles 11a to 11e are in thermal contact with each other. The tank 62 has a high-temperature storage section 62a that is a high-temperature side with respect to the module 20, and a low-temperature storage section 62b that is a low-temperature side with respect to the module 20. In the module 20, the particles 11e with a high Curie temperature are located on the high-temperature storage section 62a side, and the particles 11a with a low Curie temperature are located on the low-temperature storage section 62b side. When a magnetic field is applied from the application section 30 to the module 20 and the fluid is heated by the heat radiated from the module 20, the pump 63 is driven to move the fluid to the high-temperature side with respect to the module 20. As a result, the high-temperature fluid is stored in the high-temperature storage section 62a. Furthermore, when the application unit 30 stops applying the magnetic field to the module 20 and removes the magnetic field, the module 20 absorbs heat from the fluid, and when the temperature of the fluid drops, the pump 63 is driven to move the fluid to the low temperature side relative to the module 20. As a result, the low temperature fluid is stored in the low temperature storage unit 62b. By repeating the above-mentioned movement of the fluid and the application and removal of the magnetic field, the high temperature fluid is collected in the high temperature storage unit 62a, and the low temperature fluid is collected in the low temperature storage unit 62b.

[0063] The high-temperature side circuit 40 has a high-temperature side first heat exchanger 41, a high-temperature side pump 44, a high-temperature side second heat exchanger 42, and a high-temperature side flow path 43 connecting them, and a high-temperature side heat medium such as a refrigerant or water circulates inside. The high-temperature side first heat exchanger 41 is provided in the high-temperature storage section 62a, and heat exchange is performed between the high-temperature side heat medium flowing inside the high-temperature side first heat exchanger 41 and the high-temperature fluid in the high-temperature storage section 62a. The high-temperature side second heat exchanger 42 uses the high temperature of the high-temperature side heat medium flowing inside to heat an object to be temperature-adjusted. The object to be temperature-adjusted may be air, a fluid such as water, or a solid to be heated. The high-temperature side flow path 43 connects the high-temperature side first heat exchanger 41, the high-temperature side pump 44, and the high-temperature side second heat exchanger 42 so that the high-temperature side heat medium can circulate between them. The high-temperature side pump 44 circulates the high-temperature side heat medium within the high-temperature side circuit 40 when driven.

[0064] The low-temperature side circuit 50 has a low-temperature side first heat exchanger 51, a low-temperature side pump 54, a low-temperature side second heat exchanger 52, and a low-temperature side flow path 53 connecting them, and a low-temperature side heat medium such as a refrigerant or water circulates inside. The low-temperature side first heat exchanger 51 is provided in the low-temperature storage section 62b, and heat exchange is performed between the low-temperature side heat medium flowing inside the low-temperature side first heat exchanger 51 and the low-temperature fluid in the low-temperature storage section 62b. The low-temperature side second heat exchanger 52 cools a temperature adjustment target by utilizing the low temperature of the low-temperature side heat medium flowing inside. The temperature adjustment target may be air, a fluid such as water, or a solid to be cooled. The low-temperature side flow path 53 connects the low-temperature side first heat exchanger 51, the low-temperature side pump 54, and the low-temperature side second heat exchanger 52 so that the low-temperature side heat medium can circulate between them. The low-temperature side pump 54 circulates the low-temperature side heat medium within the low-temperature side circuit 50 when driven.

[0065] (5) Features (5-1) The bed structure 10 according to this embodiment is a bed structure used in a magnetic refrigeration device 100, and includes a plurality of particles 11. The particles 11 have a magnetocaloric effect. A flow path 14 through which a fluid passes is formed between the particles 11. The bed structure 10 has a structure in which thermal conduction between the particles 11 is suppressed.

[0066] The bed structure 10 of the present embodiment has a structure in which heat conduction between the particles 11 is suppressed, and therefore, the heat conduction between the particles 11 can be suppressed in the moving direction of the fluid passing through the flow path 14. Therefore, as shown in Fig. 11, the temperature difference between the particles at both ends of the bed structure 10 can be increased. Therefore, the heat exchange between the fluid flowing from one end of the bed structure 10 to the other end and the particles 11 can be promoted, and the performance of the bed structure 10 can be improved.

[0067] The bed structure 10 of this embodiment can increase the temperature difference between both ends of the bed structure compared to a bed structure in which particles having a magnetocaloric effect are filled in a metal sheath (Comparative Example 1), a bed structure in which particles are sintered (Comparative Example 2), and a bed structure in which a flow path is formed by cutting (Comparative Example 3). Specifically, in Comparative Example 1, the temperature difference between both ends of the bed structure is reduced due to the thermal conduction of the metal sheath. Also, when the metal sheaths are in contact with each other, thermal conduction occurs, so the temperature difference between both ends of the bed structure is reduced. In Comparative Example 2, the sintered body in which the particles are sintered has very good thermal conduction, so the temperature difference between both ends of the bed structure is reduced. In Comparative Example 3, even if a flow path is formed by processing after a mass of metal having a magnetocaloric effect is produced, the temperature difference between both ends of the bed structure is reduced due to the thermal conduction of the metal itself. Thus, while the particles are in contact with each other over the entire surface in Comparative Examples 1 to 3, the present embodiment has a structure in which the thermal conduction between the particles 11 is suppressed.

[0068] (5-2) The bed structure 10 according to this embodiment further includes a resin 12 interposed between the particles 11 in the bed structure according to (5-1) above.

[0069] Here, since the resin 12 having a lower thermal conductivity than the particles 11 is interposed between the particles 11, a structure in which the thermal conduction between the particles 11 is suppressed can be easily realized.

[0070] (5-3) The bed structure 10 according to this embodiment is the same as the bed structure according to (5-2) above, in which the resin 12 bonds a plurality of particles 11 together.

[0071] Here, since a plurality of particles 11 are bonded together, the heat conduction between the particles 11 can be further suppressed.

[0072] In addition, since the particles 11 are fixed by the resin 12, it is possible to prevent the particles 11 from colliding with each other even when the fluid flows through the flow path 14. This makes it possible to prevent the particles 11 from changing in shape, such as being pulverized.

[0073] (5-4) In the bed structure 10 according to this embodiment, in the bed structure according to (5-3) above, the thickness of the resin 121 in the flow path 14 portion and the thickness of the resin 122 in the bonded portion of the particles 11 are different.

[0074] Here, by increasing the thickness of the resin 12 at the bonded portion of the particles 11, the heat conduction between the particles 11 can be suppressed more effectively.

[0075] (5-5) The module 20 according to this embodiment includes a plurality of bed structures 10 according to any one of the above (5-1) to (5-4). The particles 11a to 11e constituting the plurality of bed structures 10a to 10e have different magnetocaloric effects.

[0076] Here, since the heat conduction between the particles 11a-11e can be suppressed in the bed structures 10a-10e having different magneto-calorific effects, the temperature difference between the bed structures 10a-10e can be increased, and therefore the heat exchange between the fluid and the particles 11a-11e can be further promoted, thereby improving the performance of the module 20.

[0077] (5-6) The heat source 1 according to this embodiment includes a bed structure 10 and an application unit 30. The bed structure 10 is any one of the bed structures (5-1) to (5-4) above. The application unit 30 applies a magnetic field to the particles 11. The heat source 1 has multiple types of particles 11a to 11e. The multiple types of particles 11a to 11e have different magnetocaloric effects.

[0078] Here, since the heat conduction between the particles 11a-11e having different magneto-calorific effects can be suppressed, the temperature difference between the particles 11a-11e (each of the bed structures 10a-10e in this embodiment) can be increased. Therefore, the heat exchange between the fluid and the particles 11a-11e can be further promoted, and the performance of the heat source 1 can be improved.

[0079] (5-7) The magnetic refrigeration device 100 according to this embodiment includes a heat source 1 and a pump 63 as a moving part. The heat source 1 is the heat source according to (5-6) above. The pump 63 as a moving part moves a fluid that exchanges heat with the particles 11.

[0080] Here, the fluid heated by heat exchange with the particles 11 can be moved by the pump 63 as a moving part to extract hot heat, and the fluid that has absorbed heat by heat exchange with the particles 11 can be moved by the pump 63 as a moving part to extract cold heat.

[0081] (5-8) The method for manufacturing the bed structure 10 of this embodiment is a method for manufacturing any one of the bed structures (5-1) to (5-4) above. The method for manufacturing the bed structure 10 includes a step of forming a resin on the surface of the particle 11 (step S2) and a step of removing a part of the resin 12 (step S4).

[0082] Here, by removing a portion of the resin 12 from a plurality of particles 11 having the resin 12 formed on the surface thereof, a flow path 14 through which a fluid passes can be formed. In addition, the remaining portion of the resin 12 is interposed between the plurality of particles 11, so that a structure can be formed in which heat conduction between the particles 11 is suppressed. Therefore, a bed structure 10 with improved performance can be manufactured.

[0083] Furthermore, the bed structure 10 can be easily manufactured, thereby reducing manufacturing costs.

[0084] (5-9) In the manufacturing method of the bed structure 10 of this embodiment, in the manufacturing method of the bed structure of the above (5-7), in the removing step (step S4), a part of the resin 12 is removed by a solvent or a gas containing a solvent.

[0085] Here, since a solvent or a gas containing a solvent is used, a part of the resin 12 can be easily removed.

[0086] In detail, the resin 12 present in the portion that becomes the flow path 14 through which the fluid passes can be efficiently removed by the passage of the solvent, and the resin 12 present in the portion that comes into contact with the particles 11 remains without being removed because the flow of the solvent is weak, and can bond the particles 11 together. As a result, a part of the surface of the particles 11 is exposed, the flow path 14 is formed, and a bed structure in which the particles are bonded together by the resin 12 can be manufactured.

[0087] (6) Variations (6-1) Variation 1 (6-1-1) Overview In the above embodiment, the bed structure 10 including one type of particles 11 is taken as an example for explanation, but is not limited thereto. The bed structure of this modification includes a plurality of types of particles.

[0088] Specifically, a plurality of layers having a structure in which the thermal conduction between the above-mentioned particles is suppressed are stacked. The magnetocaloric effects of the particles constituting the plurality of layers are different. Here, inside one bed, the particles are arranged in descending order of Curie temperature from one end to the other. For this reason, the bed structure of this modification is a structure in which the surface 131 through which the fluid of the bed 13 passes is omitted in the module 20 shown in FIG. 8.

[0089] Moreover, the heat source and the magnetic refrigeration device of this modification include one or more bed structures of this modification.

[0090] (6-1-2) Manufacturing method The manufacturing method of the bed structure of this modified example is basically the same as the manufacturing method of the bed structure of the above embodiment, but differs in that the forming process (step S2) includes a step of stacking multiple layers, each of which contains particles having different magnetocaloric effects.

[0091] Specifically, in the preparation step (step S1), a plurality of particles having different Curie temperatures are prepared. Then, in the formation step (step S2), a resin is formed on the surfaces of the plurality of types of particles. Then, in the accumulation step (step S3), the particles having different Curie temperatures are filled into one bed 13 in the order of highest Curie temperature. Then, in the removal step (step S4), a portion of the resin covering the surfaces of the plurality of types of particles is removed. It is preferable that the resin covering the surfaces of the resin constituting each layer is the same so that the resin can be removed with one solvent.

[0092] (6-1-3) Features (6-1-3-1) The bed structure according to this modification is a bed structure according to any one of the above (5-1) to (5-4), in which a plurality of layers having the above structure are stacked. The magnetocaloric effects of the particles constituting the plurality of layers are different.

[0093] In this case, the heat conduction between the particles in each layer with different magneto-calorific effect can be suppressed, so that the temperature difference between the layers can be increased, and therefore the heat exchange between the fluid and the particles can be further promoted, thereby improving the performance of the bed structure.

[0094] (6-1-3-2) In the manufacturing method of the bed structure of this modification, in the manufacturing method of the bed structure 10 of the above (5-8) or (5-9), the forming step (step S2) includes a step of stacking a plurality of layers. Each of the plurality of layers includes particles having different magnetocaloric effects. After the forming step (step S2), a removing step (step S4) is performed.

[0095] Here, a bed structure can be efficiently manufactured in which a plurality of layers having the above-mentioned structure are stacked, and the magnetocaloric effects of the particles constituting the plurality of layers are different.

[0096] (6-2) Variation 2 In the above embodiment, in the removing step (step S4) of the method for manufacturing the bed structure, a part of the resin is removed by a solvent or a gas containing a solvent, but this is not limited thereto. In the removing step (step S4) of the present disclosure, at least one of a liquid and a gas can be used.

[0097] In the removing step (S4) of this modified example, a part of the resin is blown off using compressed gas, or a part of the resin is blown off by rotating the packed bed and applying centrifugal force.

[0098] (6-3) Variation 3 In the above embodiment, the bed structure 10 is manufactured using the heat source 1 and the bed 13 to be incorporated in the magnetic refrigeration device 100, but this is not limited to the above. In this modification, the bed structure is manufactured using a filling tank different from the bed to be incorporated in the magnetic refrigeration device. The manufactured bed structure is cut out and molded, and filled into the heat source and the bed to be incorporated in the magnetic refrigeration device.

[0099] (6-4) Variation 4 In the above embodiment, the step of forming the resin (step S2) is followed by the step of accumulating (step S3), but this is not limiting. In the method for manufacturing a bed structure of the present disclosure, the resin may be formed after accumulating the particles.

[0100] (6-5) Variation 5 In the above embodiment, the module 20, the heat source 1 and the magnetic refrigeration device 100 include, but are not limited to, two or more kinds of particles 11. The heat source and the magnetic refrigeration device of the present disclosure may include one kind of particles. EXAMPLES

[0101] Example 1 In Example 1, the bed structure of (1-1) above was manufactured according to the manufacturing method of (1-2) above. Specifically, the bed was filled with magnetocaloric fine particles having an epoxy resin layer formed on the surface (steps S1 to S3). After filling, in order to remove the resin (step S4), toluene was filled and the excess epoxy resin was removed using high-pressure air. In order to prevent the particles from coming into direct contact with each other, the pressure applied to the particles in the filling area was appropriately adjusted. An electron microscope photograph of the bed structure manufactured in this way is shown in FIG. 12.

[0102] As shown in FIG. 12, it can be seen that the bed structure of Example 1 is a structure in which resin 12 is interposed between particles 11, and the resin 12 suppresses heat conduction between the particles.

[0103] Next, the relationship between the amount of resin removed in the resin removal step (step S4) and the pressure difference when a refrigerant was passed through the bed structure as a fluid was examined. The results are shown in FIG. 13. In FIG. 13, the horizontal axis represents the flow rate of the refrigerant passed through the bed structure, and the vertical axis represents the pressure loss of the refrigerant. Also, "resin amounts 1 to 4" in FIG. 13 represent the amounts of resin removed in that order. "No resin" in FIG. 13 is a comparative bed structure manufactured without performing the step of forming resin on the surface of the particles (step S2) and the step of removing part of the resin (step S4).

[0104] As shown in FIG. 13, it can be seen that the more the amount of resin removed, the less the amount of resin constituting the bed structure, and therefore the smaller the pressure loss when the refrigerant is flowed.

[0105] Example 2 In Example 2, in the forming step (step S2), acrylic resin was formed instead of the epoxy resin in Example 1, and in the removing step (step S4), methylene dichloride was used as a solvent capable of dissolving the acrylic resin. It was confirmed that in Example 2 as well, the acrylic resin was present between the particles, and the structure in which the thermal conduction between the particles was suppressed by the acrylic resin was obtained.

[0106] Although the embodiments and examples of the present disclosure have been described above, it will be understood that various changes in form and details are possible without departing from the spirit and scope of the present disclosure described in the claims. [Explanation of symbols]

[0107] 1: Heat source 10, 10a, 10b, 10c, 10d, 10e: Bed structure 11,11a,11b,11c,11d,11e: Particle 12,121,122,12a,12b,12c,12d,12e:Resin 14: Flow path 30: Applicator 63: Pump (moving part) 100: Magnetic refrigeration device [Prior art documents] [Patent documents]

[0108] [Patent Document 1] Special Publication No. 2016-530479

Claims

1. A bed structure for use in a magnetic refrigeration device, A magnetocaloric effect is provided by a plurality of particles (11), A flow path (14) through which a fluid passes is formed between the particles, A bed structure (10) having a structure in which thermal conduction between the particles is suppressed.

2. Further comprising a resin (12) interposed between the particles. The bed structure according to claim 1.

3. The resin bonds a plurality of the particles together.

3. The bed structure according to claim 2.

4. The thickness of the resin in the flow path portion is different from the thickness of the resin in the particle bonding portion.

4. The bed structure according to claim 3.

5. A plurality of layers having the above structure are laminated, The magnetocaloric effects of the particles constituting the plurality of layers are different; The bed structure according to any one of claims 1 to 4.

6. A bed structure according to any one of claims 1 to 4, An application unit (30) that applies a magnetic field to the particles; Equipped with A heat source (1) having a plurality of types of said particles with different magnetocaloric effects.

7. A heat source according to claim 6; A moving section (63) for moving a fluid that exchanges heat with the particles; A magnetic refrigeration device (100).

8. A method for manufacturing a bed structure according to any one of claims 1 to 4, comprising the steps of: A step (S2) of forming a resin on the surface of the particles; A step (S4) of removing a portion of the resin; A method for manufacturing a bed structure comprising:

9. In the removing step, a part of the resin is removed by a solvent or a gas containing a solvent. A method for manufacturing the bed structure according to claim 8.

10. the forming step includes depositing a plurality of layers, each layer including the particles having different magnetocaloric effects; After the forming step is performed, the removing step is performed. A method for manufacturing the bed structure according to claim 8.

Citation Information

Patent Citations

  • A bed of highly porous particles structurally stabilized by epoxy

    JP2016530479A

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