Light emission device

Abstract

To improve durability of a flexible light emission device.SOLUTION: A light emission part 140 is formed on one surface 101 of a substrate 100. Further, the light emission part 140 has a first electrode 110, an organic layer 120, and a second electrode 130. A cover member 180 covers the light emission part 140. An integrated circuit 300 is disposed on the one surface 101 of the substrate 100. Further, the integrated circuit 300 is electrically connected with at least one of the first electrode 110 and the second electrode 130. A protection member 400 is located at an area 105 between the cover member 180 and the integrated circuit 300. Furthermore, the protection member 400 is provided so that an entire first surface 301, which is opposite to the substrate 100, of the integrated circuit 300 is exposed.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a light emitting device, an electronic device, and a method for manufacturing a light emitting device. [Background technology]

[0002] In recent years, the development of light-emitting devices using organic electroluminescence (EL) has progressed. These light-emitting devices are used as lighting devices and display devices, and have a structure in which an organic layer is sandwiched between a first electrode and a second electrode. Flexible light-emitting devices using resin or thin glass substrates have also been developed.

[0003] Patent document 1 describes how most of the transparent substrate, except for the portions on which the semiconductor chip and the flexible printed circuit board are mounted, are covered with a protective material to improve the strength of most of the transparent substrate. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2010-27502 A Summary of the Invention [Problem to be solved by the invention]

[0005] In particular, when a glass substrate is used, the lifespan of the light-emitting part can be extended because factors that deteriorate the light-emitting part are less likely to penetrate into the glass substrate than with a resin substrate, but the glass substrate has a problem of poor durability when bent. When the substrate is bent, stress is concentrated between the integrated circuit and the sealing member on the substrate, which can easily cause cracks.

[0006] One example of a problem to be solved by the present invention is to improve the durability of a flexible light-emitting device. [Means for solving the problem]

[0007] The first invention is A substrate; a light-emitting section formed on one surface of the substrate and having a first electrode, an organic layer, and a second electrode; A covering member that covers the light emitting unit; an integrated circuit disposed on the one surface and electrically connected to at least one of the first electrode and the second electrode; a protective member located in a region between the covering member and the integrated circuit, The protective member is a light emitting device provided so as to expose the entirety of a first surface of the integrated circuit opposite to the substrate.

[0008] The second invention is A light emitting device according to the first aspect of the present invention is provided, An electronic device in which at least a portion of the substrate is curved. It is.

[0009] The third invention is forming a light-emitting portion having a first electrode, an organic layer, and a second electrode on one surface of a substrate; providing an integrated circuit electrically connected to at least one of the first electrode and the second electrode on the one surface; covering the light emitting portion with a covering member; forming a protective member in an area between the covering member and the integrated circuit; In the method for manufacturing a light emitting device, in the step of forming the protective member, the protective member is provided so as to expose the entirety of a first surface of the integrated circuit opposite to the substrate. [Brief description of the drawings]

[0010] The above objects, as well as other objects, features and advantages, will become more apparent from the following preferred embodiments and the accompanying drawings.

[0011] [Figure 1] 1 is a cross-sectional view showing a configuration of a light emitting device according to an embodiment. [Diagram 2]1 is a plan view showing a configuration of a light emitting device according to an embodiment. [Diagram 3] 3 is a diagram in which the protective member, the integrated circuit, the covering member, and the sealing film are removed from FIG. 2. [Figure 4] FIG. 4 is a diagram showing the structure of FIG. 3 with the second electrode removed. [Diagram 5] 5 is a diagram in which the insulating layer and the organic layer are removed from FIG. 4. [Figure 6] 10 is a plan view showing an example of the positional relationship between a covering member and an integrated circuit. FIG. [Figure 7] 10 is a plan view showing an example of the positional relationship between a covering member and an integrated circuit. FIG. [Figure 8] FIG. 11 is a cross-sectional view showing a modified example of the light emitting device. [Figure 9] FIG. 11 is a cross-sectional view showing a modified example of the light emitting device. [Figure 10] FIG. 11 is a cross-sectional view showing a modified example of the light emitting device. [Figure 11] FIG. 11 is a cross-sectional view showing a modified example of the light emitting device. [Figure 12] 1 is a cross-sectional view showing a configuration of an electronic device including a light-emitting device. [Figure 13] 19 is a diagram showing the structure of FIG. 18 from which the protective member, the covering member, and the integrated circuit have been removed. [Figure 14] 14 is a diagram in which the partition wall, the second electrode, the organic layer, and the insulating layer are removed from FIG. [Figure 15] 14 is a cross-sectional view of FIG. 13 taken along line B-B. [Figure 16] 14 is a cross-sectional view taken along CC in FIG. 13. [Figure 17] FIG. 14 is a cross-sectional view taken along the line DD in FIG. [Figure 18] FIG. 1 is a plan view showing a configuration of a light emitting device according to a first embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same components are given the same reference numerals and the description will be omitted as appropriate.

[0013] Fig. 1 is a cross-sectional view showing the configuration of a light emitting device 10 according to this embodiment, and Fig. 2 is a plan view showing the configuration of the light emitting device 10 according to this embodiment. Fig. 1 is a cross-sectional view taken along the line AA in Fig. 2.

[0014] The light emitting device 10 according to this embodiment includes a substrate 100, a light emitting section 140, a covering member 180, an integrated circuit 300, and a protective member 400. The light emitting section 140 is formed on one surface (hereinafter also referred to as the "first surface") 101 of the substrate 100. The light emitting section 140 has a first electrode 110, an organic layer 120, and a second electrode 130. The covering member 180 covers the light emitting section 140. The integrated circuit 300 is disposed on one surface 101 of the substrate 100. The integrated circuit 300 is electrically connected to at least one of the first electrode 110 and the second electrode 130. The protective member 400 is located in a first region 105 between the covering member 180 and the integrated circuit 300. The protective member 400 is provided so as to expose the entire first surface 301 of the integrated circuit 300 opposite the substrate 100. This will be described in detail below.

[0015] The substrate 100 of the light emitting device 10 is formed of a light-transmitting material such as glass or a light-transmitting resin. However, when the light emitting device 10 is a top emission type described later, the substrate 100 may be formed of a material that does not have light-transmitting properties. The substrate 100 is, for example, a polygon such as a rectangle. Here, the substrate 100 is flexible. The thickness of the substrate 100 is, for example, 10 μm or more and 1000 μm or less. In particular, when the substrate 100 is a flexible glass substrate, the thickness of the substrate 100 is, for example, 200 μm or less. When the substrate 100 is made flexible with a resin material, the substrate 100 is formed by including, for example, PEN (polyethylene naphthalate), PES (polyethersulfone), PET (polyethylene terephthalate), or polyimide as the material. When the substrate 100 includes a resin material, in order to suppress the transmission of moisture through the substrate 100, a SiN x An inorganic barrier film such as SiON is formed.

[0016] The light-emitting section 140 is formed on the substrate 100. The light-emitting section 140 has a structure for generating light emission, for example, an organic EL element. This organic EL element has a configuration in which a first electrode 110, an organic layer 120, and a second electrode 130 are laminated in this order.

[0017] The configuration of the light-emitting section 140 will be described in detail with reference to Fig. 3 to Fig. 5. Fig. 3 is a diagram in which the protective member 400, the integrated circuit 300, the covering member 180, and the sealing film 190 have been removed from Fig. 2. In this diagram, the integrated circuit 300 and the covering member 180 are indicated by dashed lines. Fig. 4 is a diagram in which the second electrode 130 has been removed from Fig. 3. Fig. 5 is a diagram in which the insulating layer 150 and the organic layer 120 have been removed from Fig. 4.

[0018] The first electrode 110 is a transparent electrode having optical transparency. The transparent conductive material constituting the transparent electrode is a material containing metal, for example, a metal oxide such as ITO (indium tin oxide), IZO (indium zinc oxide), IWZO (indium tungsten zinc oxide), ZnO (zinc oxide), etc. The thickness of the first electrode 110 is, for example, 10 nm or more and 500 nm or less. The first electrode 110 is formed by using, for example, a sputtering method or a vapor deposition method. The first electrode 110 may be a conductive organic material such as a carbon nanotube or PEDOT / PSS.

[0019] The light emitting device 10 further includes an insulating layer 150. The insulating layer 150 defines the light emitting section 140. The insulating layer 150 is formed of a photosensitive resin material such as polyimide, and surrounds a portion of the first electrode 110 that will become the light emitting section 140. A portion of the second electrode 130 is located on the insulating layer 150. When viewed from a direction perpendicular to the substrate 100, a portion of the insulating layer 150 protrudes from the second electrode 130.

[0020] The second electrode 130 includes a metal layer made of a metal selected from a first group consisting of Al, Au, Ag, Pt, Mg, Sn, Zn, and In, or an alloy of a metal selected from this first group. In this case, the second electrode 130 has a light-shielding property. The thickness of the second electrode 130 is, for example, 10 nm or more and 500 nm or less. However, the second electrode 130 may be formed using the material exemplified as the material of the first electrode 110. The second electrode 130 is formed using, for example, a sputtering method or a vapor deposition method.

[0021] The above-mentioned materials of the first electrode 110 and the second electrode 130 are examples of the case where light passes through the substrate 100, that is, the light emitted from the light emitting device 10 passes through the substrate 100 (i.e., bottom emission type). In other cases, light passes through the opposite side of the substrate 100. That is, the light emitted from the light emitting device 10 does not pass through the substrate 100 (i.e., top emission type). In the top emission type, either of two types of stacked structures, an inverted stack type or a forward stack type, can be adopted. In the inverted stack type, the materials of the first electrode 110 and the second electrode 130 are reversed to those of the bottom emission type. That is, the material of the first electrode 110 is the material of the second electrode 130 described above, and the material of the second electrode 130 is the material of the first electrode 110 described above. On the other hand, in the forward stack type, the material of the first electrode 110 is formed on the material of the second electrode 130 described above, and the organic layer 120 is further formed on the first electrode 110, and the second electrode 130 is further formed as a thin film on the organic layer 120, so that light is extracted from the opposite side of the substrate 100. The material to be thinly formed is, for example, the material exemplified as the material of the second electrode 130 or an MgAg alloy. When the second electrode 130 is formed of Al or Ag, the thickness of the second electrode 130 is preferably 30 nm or less. The light emitting device 10 according to this embodiment may have either a bottom emission type or the two types of top emission types described above.

[0022] The organic layer 120 has a structure in which, for example, a hole injection layer, a light emitting layer, and an electron injection layer are laminated in this order. A hole transport layer may be formed between the hole injection layer and the light emitting layer. Also, an electron transport layer may be formed between the light emitting layer and the electron injection layer. The organic layer 120 may be formed by a deposition method. Also, at least one layer of the organic layer 120, for example, a layer in contact with the first electrode, may be formed by a coating method such as an inkjet method, a printing method, or a spray method. In this case, the remaining layers of the organic layer 120 are formed by a deposition method. Also, all layers of the organic layer 120 may be formed using a coating method.

[0023] The light-emitting section 140 is sealed by a sealing film 190 (see FIG. 1). The sealing film 190 is formed on at least the surface of the substrate 100 on which the light-emitting section 140 is formed, and covers the light-emitting section 140. However, a first terminal 112 and a second terminal 132, which will be described later, are not covered by the sealing film 190. The sealing film 190 is formed of, for example, an insulating material, more specifically, an inorganic material such as aluminum oxide or titanium oxide. The thickness of the sealing film 190 is preferably 300 nm or less. The thickness of the sealing film 190 is, for example, 50 nm or more.

[0024] The sealing film 190 is formed by using, for example, an ALD (Atomic Layer Deposition) method. In this case, the step coverage of the sealing film 190 is high. In this case, the sealing film 190 may have a multi-layer structure in which a plurality of layers are laminated. In this case, the sealing film 190 may have a structure in which a first sealing layer made of a first material (e.g., aluminum oxide) and a second sealing layer made of a second material (e.g., titanium oxide) are repeatedly laminated. The bottom layer may be either the first sealing layer or the second sealing layer. The top layer may also be either the first sealing layer or the second sealing layer. The sealing film 190 may be a single layer in which the first material and the second material are mixed.

[0025] However, the sealing film 190 may be formed by other film forming methods, such as CVD or sputtering. In this case, the sealing film 190 is formed of SiO2 Alternatively, it is formed of an insulating film such as SiN, and the thickness thereof is, for example, 10 nm or more and 1000 nm or less.

[0026] Moreover, a covering member 180 for protecting the sealing film 190 is further provided on the sealing film 190. The covering member 180 is formed using a resin such as an epoxy resin or an acrylic resin. The covering member 180 may or may not have a sealing function.

[0027] The covering member 180 may be formed using, for example, glass or resin having translucency. In this case, the covering member 180 has a polygonal or circular shape similar to the substrate 100, and is fixed to the light-emitting section 140 via an adhesive layer. The covering member 180 may also have a shape with a recess in the center. In this case, the edge of the covering member 180 is fixed to the substrate 100 with an adhesive. This seals the space surrounded by the covering member 180 and the substrate 100. The light-emitting section 140 is located in the sealed space. The sealing film 190 does not have to be provided.

[0028] A desiccant may be placed in the space sealed by the covering member 180. The desiccant contains a desiccant such as CaO or BaO. For example, the desiccant is fixed to the surface of the covering member 180 facing the substrate 100.

[0029] The light emitting device 10 further includes a terminal portion formed on the first surface 101 of the substrate 100 and electrically connected to the first electrode 110 or the second electrode 130. The terminal portion is connected to the integrated circuit 300. In the example shown in the figure, the light emitting device 10 includes a first terminal 112, a first outgoing wiring 114, a second terminal 132, and a second outgoing wiring 134. The first terminal 112 and the second terminal 132 are the above-mentioned terminal portions. The first terminal 112, the first outgoing wiring 114, the second terminal 132, and the second outgoing wiring 134 are all formed on the same surface of the substrate 100 as the light emitting portion 140. The first terminal 112 and the second terminal 132 are located outside the covering member 180. The first outgoing wiring 114 connects the first terminal 112 and the first electrode 110, and the second outgoing wiring 134 connects the second terminal 132 and the second electrode 130. In other words, the first escape routing 114 and the second escape routing 134 both extend from the inside to the outside of the covering member 180.

[0030] The first terminal 112, the second terminal 132, the first outgoing wiring 114, and the second outgoing wiring 134 have a layer formed of, for example, the same material as the first electrode 110. At least a part of at least one of the first terminal 112, the second terminal 132, the first outgoing wiring 114, and the second outgoing wiring 134 may have a metal film (not shown) having a lower resistance than the first electrode 110 on this layer. This metal film does not need to be formed on all of the first terminal 112, the second terminal 132, the first outgoing wiring 114, and the second outgoing wiring 134. The layer of the first terminal 112, the first outgoing wiring 114, the second terminal 132, and the second outgoing wiring 134 formed of the same material as the first electrode 110 is formed in the same process as the first electrode 110. Therefore, the first electrode 110 is integrated with at least a part of the layer of the first terminal 112. Furthermore, when these have a metal film, the light transmittance of the first terminal 112 , the first escape wiring 114 , the second terminal 132 , and the second escape wiring 134 is lower than the light transmittance of the substrate 100 .

[0031] Returning to FIG. 1, the integrated circuit 300 has a plurality of electrodes 305 on a surface facing the substrate 100. The plurality of electrodes 305 include a positive terminal and a negative terminal of the integrated circuit 300. The first terminal 112 and the second terminal 132 are electrically connected to the electrodes 305 of the integrated circuit 300 via an anisotropic conductive resin layer 310. The anisotropic conductive resin layer 310 has a configuration in which a plurality of conductive particles are mixed into an insulating resin. The conductive particles are, for example, metal particles, but may be particles in which a metal such as gold is formed on the surface of insulating particles such as resin particles. The first terminal 112 is connected to the positive terminal of the integrated circuit 300, and the second terminal 132 is connected to the negative terminal of the integrated circuit 300, so that the first terminal 112 and the second terminal 132 can be electrically connected to the integrated circuit 300. The integrated circuit 300 is fixed to the substrate 100 via the anisotropic conductive resin layer 310.

[0032] When the light emitting device 10 includes a plurality of light emitting sections 140, the first escape wiring 114 and the second escape wiring 134 are formed one for each light emitting section 140. The plurality of first escape wirings 114 are all connected to the same first terminal 112, and the plurality of second escape wirings 134 are all connected to the same second terminal 132. However, the first escape wiring 114 and the second escape wiring 134 may be formed one for each light emitting section 140. The first escape wiring 114 may be connected one for each first terminal 112, and the second escape wiring 134 may be connected one for each second terminal 132.

[0033] The integrated circuit 300 is, for example, a semiconductor integrated circuit (IC), and functions as a control circuit for the light emitting unit 140. The integrated circuit 300 is fixed so that a second surface 302 opposite to the first surface 301 faces the first surface 101 of the substrate 100. The shape and size of the integrated circuit 300 are not particularly limited, but for example, the height h from the first surface 101 of the substrate 100 to the first surface 181 of the covering member 180 opposite to the substrate 100 may be C is the height h from the first surface 101 of the substrate 100 to the first surface 301 of the integrated circuit 300 on the opposite side to the substrate 100. ICThe integrated circuit 300 includes a plurality of electrodes 305, which are electrically connected to the terminal portion (first terminal 112, second terminal 132) connected to the first electrode 110 or the second electrode 130, as described above.

[0034] The light emitting device 10 may include a plurality of integrated circuits 300 on the first surface 101 of the substrate 100. In this case, the protective member 400 is provided in the region between each of the integrated circuits 300 and the covering member 180.

[0035] As described above, the protective member 400 is located in the first region 105 between the covering member 180 and the integrated circuit 300. The protective member 400 preferably covers at least the entirety of the substrate 100 in the first region 105. The protective member 400 may further cover at least a portion of the first surface 181 of the covering member 180 on the side opposite to the substrate 100. The protective member 400 may further cover a portion of the substrate 100 other than the first region 105.

[0036] 6 and 7 are plan views showing an example of the positional relationship between the covering member 180 and the integrated circuit 300. The first region 105 will be described with reference to FIG. 6 and FIG. 7. In the example shown in this figure, the main member (for example, an inorganic material such as silicon) of the integrated circuit 300 and the covering member 180 are rectangular when viewed from a direction perpendicular to the substrate. The integrated circuit 300 may include leads and the like in addition to the main member. When viewed from a direction perpendicular to the substrate 100, the first region 105 can be said to be a rectangular region having two opposing sides, a portion 304 of the integrated circuit 300 facing the covering member 180 and a portion 184 of the covering member 180 facing the integrated circuit 300. FIG. 6 shows an example in which the entire side surface 303 of the integrated circuit 300 faces the side surface 183 of the covering member 180, and FIG. 7 shows an example in which only a part of the side surface 303 faces the side surface 183 of the covering member 180.

[0037] 7, when only a portion of side surface 303 faces side surface 183 of covering member 180, protective member 400 preferably covers the entire second region 106 in addition to first region 105. Here, second region 106 is a rectangular region adjacent to first region 105. One side of second region 106 is one side of first region 105 perpendicular to side surface 303 of integrated circuit 300, and the other side of second region 106 is a line connecting one corner of integrated circuit 300 to an end of portion 304.

[0038] The protective member 400 is made of, for example, an epoxy or acrylic resin. The protective member 400 can be formed by fixing the covering member 180 and the integrated circuit 300 to the first surface 101 of the substrate 100, and then applying and solidifying a resin material. It is preferable that the protective member 400 has a suitable degree of elasticity and flexibility in the solidified state.

[0039] In the light emitting device 10 according to this embodiment, the protective member 400 covers the first region 105 of the first surface 101 of the substrate 100 as described above, thereby reducing the stress concentrated on the first region 105 of the substrate 100 when the substrate 100 is curved, and preventing cracks and the like from occurring in the substrate 100. Therefore, the durability of the light emitting device 10 can be improved.

[0040] Returning to FIG. 1, the protective member 400 will be further described. The protective member 400 is preferably in contact with at least one side surface 303 perpendicular to the first surface 301 of the integrated circuit 300. In addition, the height from the first surface 101 of the substrate 100 to the first surface 301 of the integrated circuit 300 is defined as h IC When the protective member 400 is placed on the side surface 303 of the integrated circuit 300, the protective member 400 is placed on the first surface 101 of the substrate 100. IC It is more preferable that the first region 105 covers an area up to a height of 1 / 2 of the substrate 100. In this way, when the substrate 100 is curved, the stress concentrated in the first region 105 of the substrate 100 can be reduced, and the durability of the light emitting device 10 can be improved.

[0041] On the other hand, the protective member 400 is provided so as to expose the entire first surface 301 of the integrated circuit 300 on the side opposite to the substrate 100. This can prevent the thickness of the light emitting device 10 from increasing as a whole due to the light emitting portion 140. Here, the first surface 301 of the integrated circuit 300 is preferably water repellent. Specifically, the contact angle of the first surface 301 of the integrated circuit 300 with respect to water is preferably 90° or more, more preferably 150° or more. For example, the first surface 301 can be made water repellent by subjecting the surface of the integrated circuit 300 to a water repellent treatment or applying a water repellent coating. In this way, when the protective member 400 is formed by a coating method, the first surface 301 of the integrated circuit 300 repels the resin material. Therefore, the light emitting device 10 can be efficiently manufactured while preventing the first surface 301 from being covered by the protective member 400. The side surface 303 of the integrated circuit 300 may or may not be water repellent.

[0042] It is preferable that the protective member 400 contacts the first surface 101 of the substrate 100 over the entire first region 105. However, when a coating layer or the like is formed on the first surface 101 of the substrate 100 in the first region 105, the protective member 400 does not need to contact the first surface 101 of the substrate 100.

[0043] 8 to 11 are cross-sectional views showing modified examples of the light emitting device 10. Fig. 8 to Fig. 11 correspond to Fig. 1. In the example of Fig. 8, the surface of the protective member 400 is convex toward the side opposite to the first surface 101 of the light emitting device 10. The protective member 400 covers at least a part of the first surface 181 of the covering member 180.

[0044] 9, the surface of the protective member 400 is concave toward the side opposite to the first surface 101 of the light emitting device 10. The protective member 400 does not cover either the first surface 301 of the integrated circuit 300 or the first surface 181 of the covering member 180.

[0045] 10, the protective member 400 covers only a portion of the side surface 303 of the integrated circuit 300. In the example of this figure, the protective member 400 covers only a portion of the side surface 303 of the integrated circuit 300 that is adjacent to the first surface 101 of the substrate 100. IC It covers at least an area up to a height of / 2.

[0046] 11, the protective member 400 covers only a portion of the side surface 183 of the covering member 180. Also, the protective member 400 covers only a portion of the side surface 303 of the integrated circuit 300. In the example of this figure, the protective member 400 covers only a portion of the side surface 183 of the covering member 180 that is adjacent to the first surface 101 of the substrate 100. C 1 / 2 of the side surface 303 of the integrated circuit 300, and IC It covers at least an area up to a height of / 2.

[0047] As in these modified examples, the shape of the protective member 400 can vary depending on the viscosity and application amount of the resin material that forms the protective member 400, the wettability of the surfaces of the integrated circuit 300 and the covering member 180, and the like.

[0048] Even in these modified examples, the protective member 400 covers the first region 105 of the first surface 101 of the substrate 100 as described above, thereby reducing the stress concentrated on the first region 105 of the substrate 100 when the substrate 100 is curved, and preventing cracks and the like from occurring in the substrate 100. Therefore, the durability of the light emitting device 10 can be improved.

[0049] A method for manufacturing the light emitting device 10 will be described below. The manufacturing method includes a step of forming the light emitting section 140, a step of providing the integrated circuit 300 on the first surface 101 of the substrate 100, a step of covering the light emitting section 140 with the covering member 180, and a step of forming the protective member 400. In the step of forming the light emitting section 140, the light emitting section 140 having the first electrode 110, the organic layer 120, and the second electrode 130 is formed on the first surface 101 of the substrate 100. In the step of providing the integrated circuit 300, the integrated circuit 300 is electrically connected to at least one of the first electrode 110 and the second electrode 130. In the step of forming the protective member 400, the protective member is formed in the first region 105 between the covering member 180 and the integrated circuit 300. In addition, in the step of forming the protective member 400, the protective member 400 is provided so as to expose the entire first surface 301 of the integrated circuit 300 opposite to the substrate 100. This will be described in detail below.

[0050] First, the first electrode 110 is formed on the first surface 101 of the substrate 100. In this process, the first terminal 112 and the second terminal 132 are also formed. Next, the insulating layer 150, the organic layer 120, and the second electrode 130 are formed in this order (a process of forming the light-emitting section 140).

[0051] Next, an anisotropic conductive resin layer 310 is formed on the first surface 101 of the substrate 100 in an area including the first terminal 112 and the second terminal 132, and in an area in which the integrated circuit 300 is to be arranged. Then, the integrated circuit 300 is arranged and fixed on the first surface 101 of the substrate 100 via the anisotropic conductive resin layer 310. At this time, the first terminal 112 and the second terminal 132 are electrically connected to the electrode 305 of the integrated circuit 300 via a plurality of conductive particles (a step of providing the integrated circuit 300). Note that the anisotropic conductive resin layer 310 has low conductivity in a direction parallel to the substrate 100, and the first terminal 112 and the second terminal 132 are not short-circuited.

[0052] Next, the sealing film 190 and the covering member 180 are formed on the first surface 101 of the substrate 100 so as to cover the light emitting section 140 (covering step).

[0053] Next, a resin material for forming the protective member 400 is applied to the first region 105 between the covering member 180 and the integrated circuit 300, and is solidified (a process for forming the protective member 400). The resin material can be applied only to desired regions using, for example, a dispenser or the like.

[0054] Note that after the step of providing integrated circuit 300 and before the step of forming protective member 400, a step of performing a water-repellent treatment on at least first surface 301 of integrated circuit 300 may be further included. In this way, first surface 301 of integrated circuit 300 repels the resin material, and light emitting device 10 can be efficiently manufactured while preventing first surface 301 from being covered with protective member 400.

[0055] The light emitting device 10 can be used not only when the substrate 100 is flat, but also when at least a portion of the substrate 100 is curved. In the light emitting device 10, the substrate 100 may be fixed in a state in which at least a portion of the substrate 100 is curved.

[0056] 12 is a cross-sectional view showing a configuration of an electronic device 50 including a light emitting device 10. In the electronic device 50, at least a part of the substrate 100 is curved. The electronic device 50 includes a fixing member 510, and the light emitting device 10 is fixed to the fixing member 510 with the substrate 100 in a curved state. The electronic device 50 is, for example, an advertisement board, a mobile terminal (including a wearable terminal), etc.

[0057] As described above, according to this embodiment, the protective member 400 is provided in the first region 105 between the covering member 180 and the integrated circuit 300. Therefore, when the substrate 100 is curved, the stress concentrated in the first region 105 of the substrate 100 can be reduced, and the occurrence of cracks or the like in the substrate 100 can be prevented. Therefore, the durability of the light emitting device 10 can be improved.

[0058] Moreover, the protective member 400 is provided so as to expose the entire first surface 301 of the integrated circuit 300 opposite the substrate 100. Therefore, it is possible to prevent the light emitting section 140 from increasing the thickness of the light emitting device 10 as a whole.

[0059] Example 1 FIG. 18 is a plan view showing the configuration of the light emitting device 10 according to Example 1. The light emitting device 10 according to this example is the same as the light emitting device 10 according to the embodiment, except for the points described below. FIG. 13 is a view in which the protective member 400, the covering member 180, and the integrated circuit 300 are removed from FIG. 18. In this figure, the covering member 180 and the integrated circuit 300 are shown by dashed lines. FIG. 14 is a view in which the partition wall 170, the second electrode 130, the organic layer 120, and the insulating layer 150 are removed from FIG. 13. FIG. 15 is a BB cross-sectional view of FIG. 13, FIG. 16 is a CC cross-sectional view of FIG. 13, and FIG. 17 is a DD cross-sectional view of FIG. 13. However, in FIGS. 15 to 17, the sealing film 190 and the covering member 180 are omitted.

[0060] The light-emitting device 10 in this embodiment is a display, and has a substrate 100, a first electrode 110, a light-emitting section 140, an insulating layer 150, a plurality of openings 152, a plurality of openings 154, a plurality of first escape wirings 114, an organic layer 120, a second electrode 130, a plurality of second escape wirings 134, and a plurality of partitions 170.

[0061] The first electrodes 110 extend in a line shape in a first direction (Y direction in FIG. 13).

[0062] The first escape wiring 114 is a wiring that connects the first electrode 110 to the first terminal 112. In the example shown in the figure, one end of the first escape wiring 114 is connected to the first electrode 110, and the other end of the first escape wiring 114 is the first terminal 112. A conductor layer 182 is formed on the first terminal 112 and on the first escape wiring 114. The conductor layer 182 is formed using a metal having a lower resistance than the first electrode 110, such as Al or Ag. A part of the first escape wiring 114 is covered with an insulating layer 150.

[0063] As shown in FIG. 13 and FIGS. 15 to 17, the insulating layer 150 is formed on the first electrodes 110 and in the regions between them. The insulating layer 150 has a plurality of openings 152 and a plurality of openings 154 formed therein. The second electrodes 130 extend parallel to each other in a direction intersecting with the first electrodes 110 (for example, a direction perpendicular to the first electrodes 110: the X direction in FIG. 13). A partition wall 170, the details of which will be described later, extends between the second electrodes 130. The openings 152 are located at the intersections of the first electrodes 110 and the second electrodes 130 in a plan view. Specifically, the openings 152 are aligned in the direction in which the first electrodes 110 extend (the Y direction in FIG. 13). The openings 152 are also aligned in the direction in which the second electrodes 130 extend (the X direction in FIG. 13). For this reason, the openings 152 are arranged to form a matrix.

[0064] The openings 154 are located in an area overlapping with one end side of each of the multiple second electrodes 130 in a plan view. The openings 154 are arranged along one side of the matrix formed by the openings 152. When viewed in a direction along this side (for example, the Y direction in FIG. 13, i.e., the direction along the first electrodes 110), the openings 154 are arranged at predetermined intervals. A portion of the second escape wiring 134 is exposed from the openings 154. The second escape wiring 134 is connected to the second electrode 130 via the openings 154.

[0065] The second escape wiring 134 is a wiring that connects the second electrode 130 to the second terminal 132, and has a layer made of the same material as the first electrode 110. One end of the second escape wiring 134 is located under the opening 154, and the other end of the second escape wiring 134 is extracted to the outside of the insulating layer 150. In the example shown in the figure, the other end of the second escape wiring 134 serves as the second terminal 132. A part of the second escape wiring 134 is covered with the insulating layer 150.

[0066] The organic layer 120 is formed in the region overlapping with the opening 152. The hole injection layer of the organic layer 120 is in contact with the first electrode 110, and the electron injection layer of the organic layer 120 is in contact with the second electrode 130. Therefore, the light emitting section 140 is located in each of the regions overlapping with the opening 152.

[0067] 15 and 16 show a case where each layer constituting the organic layer 120 extends to the outside of the opening 152. As shown in Fig. 13, the organic layer 120 may or may not be formed continuously between the adjacent openings 152 in the extending direction of the partition wall 170. However, as shown in Fig. 17, the organic layer 120 is not formed in the opening 154.

[0068] As shown in Fig. 13 and Fig. 15 to Fig. 17, the second electrodes 130 extend in a second direction (X direction in Fig. 13) intersecting with the first direction. A partition wall 170 is formed between adjacent second electrodes 130. The partition wall 170 extends parallel to the second electrodes 130, that is, in the second direction. The base of the partition wall 170 is, for example, an insulating layer 150. The partition wall 170 is, for example, a photosensitive resin such as a polyimide resin, and is formed into a desired pattern by exposure and development. The partition wall 170 may be made of a resin other than the polyimide resin, for example, an epoxy resin, an acrylic resin, or an inorganic material such as silicon dioxide.

[0069] The partition wall 170 has a cross section formed by turning a trapezoid upside down (an inverted trapezoid). That is, the width of the upper surface of the partition wall 170 is greater than the width of the lower surface of the partition wall 170. Therefore, if the partition wall 170 is formed before the second electrodes 130, a plurality of second electrodes 130 can be formed at once by forming the second electrodes 130 on one surface side of the substrate 100 using a vapor deposition method or a sputtering method. The partition wall 170 also has a function of dividing the organic layer 120.

[0070] Next, a method for manufacturing the light emitting device 10 in this embodiment will be described. The method for manufacturing the light emitting device 10 in this embodiment is the same as the method for manufacturing the light emitting device 10 according to the embodiment, except for the step of forming the light emitting section 140. First, the first electrode 110, the first escape wiring 114, and the second escape wiring 134 are formed on the substrate 100. The method for forming these is the same as the method for forming the first electrode 110 in the embodiment.

[0071] Next, the insulating layer 150 is formed, and further the partition wall 170 is formed. Next, the organic layer 120 and the second electrode 130 are formed.

[0072] Thereafter, the steps of providing the integrated circuit 300, covering the integrated circuit 300, and forming the protective member 400 are performed in the same manner as in the method of the embodiment.

[0073] According to this example, similarly to the embodiment, the protective member 400 is provided in the first region 105 between the covering member 180 and the integrated circuit 300. Therefore, when the substrate 100 is curved, the stress concentrated in the first region 105 of the substrate 100 can be reduced, and the occurrence of cracks in the substrate 100 can be prevented. Therefore, the durability of the light emitting device 10 can be improved.

[0074] Moreover, the protective member 400 is provided so as to expose the entire first surface 301 of the integrated circuit 300 opposite the substrate 100. Therefore, it is possible to prevent the light emitting section 140 from increasing the thickness of the light emitting device 10 as a whole.

[0075] Although the embodiment and examples have been described above with reference to the drawings, these are merely examples of the present invention, and various configurations other than those described above can also be adopted.

Claims

[Claim 1] A substrate; a light-emitting portion formed on one surface of the substrate and having a first electrode, an organic layer, and a second electrode; A covering member that covers the light emitting unit; an integrated circuit disposed on the one surface and electrically connected to at least one of the first electrode and the second electrode; a protective member located in an area between the covering member and the integrated circuit, The protective member is provided so as to expose the entirety of a first surface of the integrated circuit opposite to the substrate.

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