Storage device

Abstract

To provide a highly reliable storage device.SOLUTION: At a side surface of a first conductor extending in a first direction, a first insulator, a first semiconductor, a second insulator, a second semiconductor, and a third insulator are provided sequentially when viewed from the first conductor side. The first conductor is provided with: a first region overlapping with a second conductor through the first insulator, the first semiconductor, the second insulator, the second semiconductor, and the third insulator; and a second region overlapping with a third conductor through the first insulator, the first semiconductor, the second insulator, the second semiconductor, and the third insulator. In the second region, a fourth conductor is provided between the first insulator and the first semiconductor.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] One embodiment of the present invention relates to a semiconductor device.

[0002] Note that one aspect of the present invention is not limited to the above technical field. The technical field of the invention disclosed in the present specification relates to an object, a method, or a manufacturing method. Alternatively, one aspect of the present invention relates to a process, a machine, a manufacture, or a composition of matter.

[0003] In this specification and the like, a semiconductor device generally refers to anything that can function by utilizing semiconductor characteristics. Thus, semiconductor elements such as transistors and diodes, and circuits including semiconductor elements are semiconductor devices. In addition, display devices, light-emitting devices, lighting devices, electro-optical devices, storage devices, imaging devices, communication devices, and electronic devices may include semiconductor elements and semiconductor circuits. In addition, display devices, light-emitting devices, lighting devices, electro-optical devices, storage devices, imaging devices, communication devices, and electronic devices may also be called semiconductor devices. [Background technology]

[0004] In recent years, with an increase in the amount of data handled, there is a demand for semiconductor devices with larger storage capacity. In order to increase the storage capacity per unit area, it is effective to form memory cells in a stacked manner (see Patent Documents 1 and 2). By providing memory cells in a stacked manner, the storage capacity per unit area can be increased according to the number of stacked memory cells. Patent Documents 3 and 4 disclose memory devices using an oxide semiconductor. Patent Document 5 discloses a semiconductor memory using an oxide semiconductor as a charge storage layer.

[0005] Furthermore, Non-Patent Document 1 discloses CAAC-IGZO as a crystalline oxide semiconductor, and also discloses the growth mechanism of CAAC-IGZO. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] US Patent Publication 2011 / 0065270A1 [Patent Document 2] U.S. Patent Publication No. 9634097B2 [Patent Document 3] Patent Publication No. 2018-207038 [Patent Document 4] JP-A-2019-8862 [Patent Document 5] Patent Publication 2018-157205 [Non-patent literature]

[0007] [Non-Patent Document 1] Noboru Kimizuka and Shunpei Yamazaki, “PHYSICS AND TECHNOLOGY OF CRYSTALLINE OXIDE SEMICONDUCTOR CAAC-IGZO” FUNDAMENTALS (USA), Wiley-SID Series in Display Technology, 2017, p.94-97 Summary of the Invention [Problem to be solved by the invention]

[0008] In Patent Documents 1 and 2, a plurality of storage elements (also called memory cells) are stacked and connected in series to form a three-dimensional memory cell array (also called a memory string).

[0009] In Patent Document 1, a columnar semiconductor is in contact with an insulator having a charge storage layer. In Patent Document 2, a columnar semiconductor is in contact with an insulator that functions as a tunnel dielectric. In both Patent Document 1 and Patent Document 2, writing information to a memory cell is performed by extracting and injecting charges through the insulator. In this case, a trap center may be formed at the interface where the semiconductor and the insulator are in contact. The trap center may capture electrons and cause the threshold voltage of the transistor to fluctuate. This may have a negative effect on the reliability of the memory device.

[0010] An object of one embodiment of the present invention is to provide a highly reliable memory device.Another object of one embodiment of the present invention is to provide a memory device having a large storage capacity.Another object of one embodiment of the present invention is to provide a memory device having a small occupation area.Another object of one embodiment of the present invention is to provide a memory device having low manufacturing costs.Another object of one embodiment of the present invention is to provide a highly reliable semiconductor device.Another object of one embodiment of the present invention is to provide a semiconductor device having low manufacturing costs.Another object of one embodiment of the present invention is to provide a novel semiconductor device.

[0011] Note that the description of these problems does not preclude the existence of other problems. Note that one embodiment of the present invention does not need to solve all of these problems. Note that problems other than these will become apparent from the description of the specification, drawings, claims, etc., and it is possible to extract problems other than these from the description of the specification, drawings, claims, etc. [Means for solving the problem]

[0012] One aspect of the present invention is a semiconductor device in which a first insulator, a first semiconductor, a second insulator, a second semiconductor, and a third insulator are provided in this order on a side surface of a first conductor extending in a first direction, as viewed from the first conductor side. The first conductor has a first region that overlaps with the second conductor via the first insulator, the first semiconductor, the second insulator, the second semiconductor, and the third insulator, and a second region that overlaps with the third conductor via the first insulator, the first semiconductor, the second insulator, the second semiconductor, and the third insulator. In the second region, a fourth conductor is provided between the first insulator and the first semiconductor.

[0013] Another aspect of the present invention is a memory device having a first conductor, a second conductor, a third conductor, a fourth conductor, a first insulator, a second insulator, a third insulator, a first semiconductor, and a second semiconductor, wherein the first conductor extends in a first direction, and on a side of the first conductor extending in the first direction, the first insulator is provided adjacent to the first conductor, the first semiconductor is provided adjacent to the first insulator, the second insulator is provided adjacent to the first semiconductor, the second semiconductor is provided adjacent to the second insulator, and the third insulator is provided adjacent to the second semiconductor, and the first conductor has a first region and a second region, and in the first region, the second conductor is provided adjacent to the third insulator, and in the second region, the fourth conductor is provided between the first insulator and the first semiconductor.

[0014] In the first region, the first insulator, the second insulator, the third insulator, the first semiconductor, and the second semiconductor are preferably arranged concentrically, and in the second region, the first insulator, the second insulator, the third insulator, the first semiconductor, the second semiconductor, and the fourth conductor are preferably arranged concentrically.

[0015] The first region can function as a first transistor. The second region can function as a second transistor. The first semiconductor is preferably an oxide semiconductor. The second semiconductor is preferably an oxide semiconductor.

[0016] Another aspect of the present invention is a memory device having a first conductor extending in a first direction, a second conductor extending in a second direction, a third conductor extending in the second direction, a fourth conductor, a first insulator, a second insulator, a third insulator, a first semiconductor, and a second semiconductor, wherein at a first intersection where the first conductor and the second conductor intersect and a second intersection where the first conductor and the third conductor intersect, the first insulator overlaps the first conductor, the first semiconductor overlaps the first insulator, the second insulator overlaps the first semiconductor, the second semiconductor overlaps the second insulator, and the third insulator overlaps the second semiconductor, and at the second intersection, the first semiconductor overlaps the first insulator via the fourth conductor.

[0017] At the first intersection, the first insulator, the second insulator, the third insulator, the first semiconductor, and the second semiconductor are preferably arranged concentrically.At the second intersection, the first insulator, the second insulator, the third insulator, the first semiconductor, the second semiconductor, and the fourth conductor are preferably arranged concentrically.

[0018] Additionally, the first intersection can function as a first transistor, and the second intersection can function as a second transistor. Effect of the Invention

[0019] According to one embodiment of the present invention, a highly reliable memory device can be provided. According to one embodiment of the present invention, a memory device with a large memory capacity can be provided. According to one embodiment of the present invention, a memory device with a small occupation area can be provided. According to one embodiment of the present invention, a memory device with low manufacturing costs can be provided. According to one embodiment of the present invention, a highly reliable semiconductor device can be provided. According to one embodiment of the present invention, a semiconductor device with low manufacturing costs can be provided. According to one embodiment of the present invention, a novel semiconductor device can be provided.

[0020] Note that the description of these effects does not preclude the existence of other effects. Note that one embodiment of the present invention does not need to have all of these effects. Note that effects other than these will become apparent from the description in the specification, drawings, claims, etc., and it is possible to extract effects other than these from the description in the specification, drawings, claims, etc. [Brief description of the drawings]

[0021] [Figure 1] FIG. 1 is a perspective view of a storage device. [Diagram 2] FIG. 2 is a cross-sectional view of the storage device. [Diagram 3] FIG. 3 is a cross-sectional view of a memory string. [Figure 4] FIG. 4 is a cross-sectional view of a memory string. [Diagram 5] 5A and 5B are cross-sectional views of a memory string. [Figure 6] 6A and 6B are cross-sectional views of a memory string. [Figure 7] 7A and 7B are cross-sectional and perspective cross-sectional views of a memory element. [Figure 8] 8A and 8B are cross-sectional views of a memory string. [Figure 9] 9A to 9F are cross-sectional views of a memory string. [Figure 10] 10A and 10B are cross-sectional views of a memory string. [Figure 11] Fig. 11A is a diagram for explaining the classification of IGZO crystal structures, Fig. 11B is a diagram for explaining the XRD spectrum of a CAAC-IGZO film, and Fig. 11C is a diagram for explaining the ultrafine electron beam diffraction pattern of a CAAC-IGZO film. [Figure 12] 12A to 12C are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Figure 13] 13A to 13C are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Figure 14] 14A to 14C are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Figure 15] 15A to 15C are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Figure 16] 16A to 16C are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Figure 17] 17A to 17C are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Figure 18] 18A to 18C are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Figure 19] 19A to 19D are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Figure 20] 20A to 20C are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Figure 21] 21A to 21C are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Figure 22] 22A to 22C are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Figure 23] 23A to 23C are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Figure 24] 24A to 24C are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Diagram 25] 25A to 25C are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Figure 26] 26A to 26C are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Figure 27] 27A to 27C are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Figure 28]28A to 28C are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Figure 29] FIG. 29 is a perspective view of a storage device. [Diagram 30] FIG. 30 is a cross-sectional view of a storage device. [Diagram 31] FIG. 31 is a cross-sectional view of a memory string. [Diagram 32] 32A to 32C are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Diagram 33] 33A to 33C are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Diagram 34] 34A to 34C are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Diagram 35] 35A to 35C are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Diagram 36] 36A to 36C are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Figure 37] 37A to 37C are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Figure 38] 38A to 38C are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Figure 39] 39A to 39C are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Diagram 40] 40A to 40C are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Diagram 41] 41A to 41C are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Diagram 42] 42A to 42C are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Diagram 43]43A to 43D are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Diagram 44] 44A to 44C are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Diagram 45] 45A to 45C are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Diagram 46] 46A to 46C are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Figure 47] 47A to 47C are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Figure 48] 48A to 48C are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Figure 49] 49A to 49C are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Figure 50] 50A to 50C are cross-sectional views illustrating a manufacturing process of a semiconductor device according to one embodiment of the present invention. [Figure 51] FIG. 51 is a diagram illustrating an example of the configuration of an MOCVD apparatus. [Figure 52] Fig. 52A is a schematic diagram of a multi-chamber film forming apparatus, and Fig. 52B is a cross-sectional view of a film forming chamber. [Diagram 53] FIG. 53 is a diagram for explaining an example of a circuit configuration of a memory string. [Figure 54] FIG. 54 is an equivalent circuit diagram of a memory element MC. [Figure 55] FIG. 55 is a diagram illustrating an example of a circuit configuration of a memory string. [Figure 56] FIG. 56 is a diagram for explaining an example of a circuit configuration of a memory string. [Figure 57] FIG. 57 is a diagram for explaining an example of a circuit configuration of a memory string. [Figure 58] FIG. 58 is a timing chart illustrating an example of a write operation of a memory string. [Figure 59] 59A and 59B are circuit diagrams illustrating an example of a write operation of a memory string. [Figure 60] 60A and 60B are circuit diagrams illustrating an example of a write operation of a memory string. [Figure 61] 61A and 61B are circuit diagrams illustrating an example of a write operation of a memory string. [Figure 62] 62A and 62B are circuit diagrams illustrating an example of a write operation of a memory string. [Figure 63] 63A and 63B are timing charts illustrating an example of a read operation of a memory string. [Figure 64] 64A and 64B are circuit diagrams illustrating an example of a read operation of a memory string. [Figure 65] 65A and 65B are circuit diagrams illustrating an example of a read operation of a memory string. [Figure 66] 66A and 66B are diagrams illustrating the Id-Vg characteristics of a transistor. [Figure 67] FIG. 67 is a diagram for explaining an example of a circuit configuration of a memory string. [Figure 68] FIG. 68 is a timing chart illustrating an example of a write operation of a memory string. [Figure 69] FIG. 69 is a timing chart illustrating an example of a read operation of a memory string. [Figure 70] FIG. 70 is a diagram for explaining an example of a circuit configuration of a memory string. [Figure 71] FIG. 71 is a diagram for explaining an example of a circuit configuration of a memory string. [Figure 72] FIG. 72 is a block diagram illustrating a configuration example of a semiconductor device. [Figure 73] 73A to 73C are perspective views for explaining configuration examples of a semiconductor device. [Figure 74] FIG. 74 is a cross-sectional view illustrating a semiconductor device according to one embodiment of the present invention. [Figure 75] FIG. 75 is a cross-sectional view illustrating a semiconductor device according to one embodiment of the present invention. [Figure 76] Fig. 76A is a schematic diagram of a semiconductor device, and Fig. 76B is a perspective view of the semiconductor device. [Figure 77] 77A to 77E are diagrams for explaining an example of a storage device. [Figure 78] 78A to 78G are diagrams for explaining an example of an electronic device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] The embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and it will be easily understood by those skilled in the art that the form and details of the present invention can be modified in various ways without departing from the spirit and scope of the present invention. Therefore, the present invention should not be interpreted as being limited to the description of the embodiments shown below. In the configuration of the invention described below, the same parts or parts having similar functions are denoted by the same reference numerals in different drawings, and the repeated description will be omitted.

[0023] In addition, the position, size, range, etc. of each component shown in the drawings, etc. may not represent the actual position, size, range, etc. in order to facilitate understanding of the invention. Therefore, the disclosed invention is not necessarily limited to the position, size, range, etc. disclosed in the drawings, etc. For example, in the actual manufacturing process, a resist mask, etc. may be unintentionally eroded by a process such as etching, but this may not be reflected in the drawings in order to facilitate understanding.

[0024] In addition, in the drawings, etc., some components may be omitted in order to make the explanation easier to understand.

[0025] In addition, the terms "electrode" and "wiring" used in this specification and the like do not limit the functionality of these components. For example, an "electrode" may be used as part of a "wiring", and vice versa. Furthermore, the terms "electrode" and "wiring" include cases where multiple "electrodes" or "wirings" are formed integrally.

[0026] In addition, in this specification and the like, a "terminal" in an electric circuit refers to a portion where a current is input or output, a voltage is input or output, or a signal is received or transmitted. Therefore, a part of a wiring or an electrode may function as a terminal.

[0027] In this specification, the terms "above" and "below" do not limit the positional relationship of components to being directly above or below and in direct contact. For example, the expression "electrode B on insulating layer A" does not require that electrode B be formed in direct contact with insulating layer A, and does not exclude the inclusion of other components between insulating layer A and electrode B.

[0028] In addition, the functions of the source and drain are interchangeable depending on the operating conditions, such as when transistors of different polarities are used or when the direction of current changes during circuit operation, so it is difficult to determine which is the source and which is the drain. For this reason, in this specification, the terms source and drain can be used interchangeably.

[0029] In addition, in this specification, "electrically connected" includes a direct connection and a connection via "something having some electrical action." Here, the "something having some electrical action" is not particularly limited as long as it allows the transmission and reception of electrical signals between the connected objects. Therefore, even when it is expressed as "electrically connected," in the actual circuit, there may be no physical connection and only wiring extending therethrough.

[0030] In this specification and elsewhere, "parallel" refers to, for example, a state in which two straight lines are arranged at an angle of -10° or more and 10° or less. This therefore includes cases in which the angle is -5° or more and 5° or less. Furthermore, "perpendicular" and "orthogonal" refer to, for example, a state in which two straight lines are arranged at an angle of 80° or more and 100° or less. This therefore includes cases in which the angle is 85° or more and 95° or less.

[0031] In this specification and elsewhere, when referring to counting values ​​and measurement values, or to objects, methods, and events that can be converted into counting values ​​or measurement values, terms such as "same," "equal," and "uniform" are intended to include an error of plus or minus 20%, unless otherwise expressly stated.

[0032] In addition, in this specification, the terms "adjacent" and "close to" do not limit the components to being in direct contact with each other. For example, the expression "electrode B adjacent to insulating layer A" does not require that insulating layer A and electrode B are formed in direct contact with each other, and does not exclude the inclusion of other components between insulating layer A and electrode B.

[0033] Furthermore, voltage often refers to the potential difference between a certain potential and a reference potential (for example, ground potential or source potential). Therefore, voltage and potential can often be interchanged. In this specification and the like, unless otherwise specified, voltage and potential can be interchanged.

[0034] Even when written as "semiconductor", for example, if the conductivity is sufficiently low, it has the characteristics of an "insulator". Therefore, it is also possible to use "semiconductor" instead of "insulator". In this case, the boundary between "semiconductor" and "insulator" is ambiguous, and it is difficult to strictly distinguish between the two. Therefore, "semiconductor" and "insulator" described in this specification may be read as interchangeable.

[0035] Furthermore, even when written as "semiconductor", if the conductivity is sufficiently high, it has the characteristics of a "conductor". Therefore, it is also possible to use "semiconductor" in place of "conductor". In this case, the boundary between "semiconductor" and "conductor" is ambiguous, and it is difficult to strictly distinguish between the two. Therefore, "semiconductor" and "conductor" described in this specification may be interchangeable.

[0036] In addition, ordinal numbers such as "first" and "second" in this specification are used to avoid confusion of components, and do not indicate any order or ranking, such as the order of processes or stacking. Even if a term does not have an ordinal number in this specification, an ordinal number may be added in the claims to avoid confusion of components. Even if a term has an ordinal number in this specification, a different ordinal number may be added in the claims. Even if a term has an ordinal number in this specification, the ordinal number may be omitted in the claims.

[0037] In this specification, the "on state" of a transistor refers to a state in which the source and drain of the transistor can be regarded as being electrically short-circuited (also referred to as a "conductive state"). The "off state" of a transistor refers to a state in which the source and drain of the transistor can be regarded as being electrically disconnected (also referred to as a "non-conductive state").

[0038] In this specification, the term "on-state current" may refer to a current that flows between a source and a drain when a transistor is on, and the term "off-state current" may refer to a current that flows between a source and a drain when a transistor is off.

[0039] In this specification and the like, high power supply potential VDD (hereinafter also simply referred to as "VDD", "H potential", or "H") refers to a power supply potential that is higher than the low power supply potential VSS (hereinafter also simply referred to as "VSS", "L potential", or "L"). Also, VSS refers to a power supply potential that is lower than VDD. Also, ground potential (hereinafter also simply referred to as "GND" or "GND potential") can be used as VDD or VSS. For example, when VDD is the ground potential, VSS is a potential lower than the ground potential, and when VSS is the ground potential, VDD is a potential higher than the ground potential.

[0040] In addition, unless otherwise specified, the transistors described in this specification and the like are enhancement-type (normally-off) n-channel field effect transistors. Therefore, the threshold voltage (also referred to as "Vth") is assumed to be higher than 0 V. In addition, unless otherwise specified, "supplying an H potential to the gate of a transistor" may be synonymous with "turning the transistor on." In addition, unless otherwise specified, "supplying an L potential to the gate of a transistor" may be synonymous with "turning the transistor off."

[0041] In this specification and the like, a gate refers to a gate electrode and a part or the whole of a gate wiring. A gate wiring refers to a wiring for electrically connecting a gate electrode of at least one transistor to another electrode or another wiring.

[0042] In this specification and the like, the source refers to a source region, a source electrode, and a part or all of a source wiring. The source region refers to a region of a semiconductor layer having a resistivity equal to or lower than a certain value. The source electrode refers to a conductive layer connected to the source region. The source wiring refers to a wiring for electrically connecting the source electrode of at least one transistor to another electrode or another wiring.

[0043] In this specification and the like, the drain refers to a part or all of the drain region, the drain electrode, and the drain wiring. The drain region refers to a region of the semiconductor layer whose resistivity is equal to or lower than a certain value. The drain electrode refers to a conductive layer that is connected to the drain region. The drain wiring refers to a wiring for electrically connecting the drain electrode of at least one transistor to another electrode or another wiring.

[0044] In addition, in drawings and the like, in order to make the potential of a wiring, electrode, conductor, etc. easier to understand, an "H" indicating an H potential or an "L" indicating an L potential may be added next to the wiring, electrode, conductor, etc. Furthermore, a wiring, electrode, conductor, etc. in which a potential change has occurred may be labeled with "H" or "L" enclosed in letters. Furthermore, when a transistor is in an off state, an "x" symbol may be added over the transistor.

[0045] Generally, a "capacitance" has a configuration in which two electrodes face each other via an insulator (dielectric). In this specification, etc., a "capacitance element" includes the above-mentioned "capacitance." That is, in this specification, etc., a "capacitance element" includes a configuration in which two electrodes face each other via an insulator, a configuration in which two wires face each other via an insulator, or a configuration in which two wires are arranged via an insulator.

[0046] In addition, in this specification and the like, when the same reference numeral is used for multiple elements, and when it is particularly necessary to distinguish between them, the reference numeral may be accompanied by an identifying reference numeral such as "_1", "_2", "[n]", "[m,n]", etc. For example, the second wiring GL may be described as wiring GL[2].

[0047] (Embodiment 1) FIG. 1 shows a perspective view of a storage device 100 according to an embodiment of the present invention. The storage device 100 is a storage device having a three-dimensional stacked structure. FIG. 2 is a cross-sectional view of a portion A1-A2 shown by a dashed line in FIG. 1. Note that in FIG. 1 and the like, arrows indicating the X direction, the Y direction, and the Z direction may be added. The X direction, the Y direction, and the Z direction are directions that are perpendicular to each other. In this specification and the like, one of the X direction, the Y direction, and the Z direction may be called the "first direction" or the "first direction". The other one may be called the "second direction" or the "second direction". The remaining one may be called the "third direction" or the "third direction".

[0048] Fig. 2 shows a cross section of the XZ plane. As mentioned above, some of the components may be omitted in Fig. 1 and Fig. 2 for ease of understanding.

[0049] <Storage device configuration example> A memory device 100 according to one embodiment of the present invention includes a memory cell array 110. The memory cell array 110 includes a plurality of memory strings 120. The memory strings 120 extend in the Z direction and are arranged in a matrix on the XY plane.

[0050] 3 shows an example of a cross-sectional structure of a memory string 120 according to one embodiment of the present invention. The memory string 120 has a configuration in which a plurality of storage elements MC (also referred to as "memory cells") are connected in series. In this embodiment, five storage elements MC are connected in series, but the number of storage elements MC included in the memory string 120 is not limited to five. When the number of storage elements MC included in the memory string 120 is n, n may be an integer of 2 or more.

[0051] Moreover, the memory string 120 has a plurality of conductors WWL, a plurality of conductors RWL, and a conductor SG. In the memory cell array 110, the conductors WWL, the conductors RWL, and the conductor SG extend in the X direction. The plurality of conductors WWL and the plurality of conductors RWL are alternately stacked with an insulator 123 interposed therebetween. The conductor SG is provided in a lower layer than the plurality of conductors WWL and the plurality of conductors RWL.

[0052] 3, the five memory elements MC are denoted as memory elements MC[1] to MC[5]. Note that when describing matters common to the memory elements MC[1] to MC[5], they are simply referred to as "memory element MC." The same applies to other components such as the conductor WWL, the conductor RWL, and the insulator 123.

[0053] The memory string 120 includes a transistor STr1 electrically connected to the memory element MC[1], and a transistor STr2 electrically connected to the memory element MC[5].

[0054] The conductor WWL, the conductor RWL, and the conductor SG have regions that extend beyond the memory cell array 110. In addition, the conductor WWL, the conductor RWL, and the conductor SG are stacked in a stepped manner outside the memory cell array 110 (see FIGS. 1 and 2).

[0055] Fig. 5A shows a cross section seen from the Z direction of the portion B1-B2 shown by the dashed dotted line in Fig. 3. Fig. 5B shows a cross section seen from the Z direction of the portion C1-C2 shown by the dashed dotted line in Fig. 3. Fig. 7A shows an enlarged view of the region 105 shown by the two-dot dashed line in Fig. 3. Fig. 7A corresponds to a cross section of the memory element MC.

[0056] The memory string 120 has a conductor 122 on a base 121. The base 121 may be, for example, an insulator. Also, on the conductor 122, there are insulator 123[1], conductor SG, insulator 123[2], conductor RWL[1], insulator 123[3], conductor WWL[1], insulator 123[4], conductor RWL[2], insulator 123[5], conductor WWL[2], insulator 123[6], conductor RWL[3], insulator 123[7], conductor WWL[3], insulator 123[8], conductor RWL[4], insulator 123[9], conductor WWL[4], insulator 123

[10] , conductor RWL[5], insulator 123

[11] , conductor WWL[5], and insulator 123

[12] (see FIG. 3).

[0057] The memory string 120 also has an opening 141 (see FIG. 4) in which a part of each of the insulator 123[1], the conductor SG, the insulator 123[2], the conductor RWL[1], the insulator 123[3], the conductor WWL[1], the insulator 123[4], the conductor RWL[2], the insulator 123[5], the conductor WWL[2], the insulator 123[6], the conductor RWL[3], the insulator 123[7], the conductor WWL[3], the insulator 123[8], the conductor RWL[4], the insulator 123[9], the conductor WWL[4], the insulator 123

[10] , the conductor RWL[5], the insulator 123

[11] , the conductor WWL[5], and the insulator 123

[12] is removed. FIG. 4 is the same cross-sectional view as FIG. 3. However, in order to make the cross-sectional shape of opening 141 easier to recognize, components provided within opening 141 are shown by dashed lines in FIG.

[0058] The opening 141 extends in the Z direction and reaches the conductor 122. In the opening 141, the diameter of a region 142 overlapping with the conductor RWL is larger than the diameter of a region 143 overlapping with the conductor WWL. Therefore, the side surface of the opening 141 has an uneven shape.

[0059] Further, an insulator 124, a semiconductor 125, an insulator 126, and a semiconductor 127 are provided along the side surface of the opening 141. The semiconductor 125 has a region that overlaps with the side surface of the opening 141 via the insulator 124. The insulator 126 has a region that overlaps with the side surface of the opening 141 via the semiconductor 125 and the insulator 124. The semiconductor 127 has a region that overlaps with the side surface of the opening 141 via the insulator 126, the semiconductor 125, and the insulator 124. Further, at the bottom of the opening 141, the semiconductor 125 has a region that is electrically connected to the conductor 122.

[0060] The memory string 120 also has a conductor 130 extending in the Z direction. The conductor 130 is provided at or near the center of the opening 141. An insulator 129 is provided in a region of the conductor 130 that overlaps with the opening 141. At the bottom of the opening 141, the conductor 130 has a region that overlaps with the conductor 122 via the insulator 129, the semiconductor 127, the insulator 126, and the semiconductor 125. A conductor 128 is provided between the semiconductor 127 and the insulator 129 in a region that overlaps with the conductor RWL.

[0061] Between the conductor WWL and the conductor 130, an insulator 124, a semiconductor 125, an insulator 126, a semiconductor 127, and an insulator 129 are provided in this order from the conductor WWL side (see FIG. 5A). Between the conductor RWL and the conductor 130, an insulator 124, a semiconductor 125, an insulator 126, a semiconductor 127, a conductor 128, and an insulator 129 are provided in this order from the conductor RWL side (see FIG. 5B).

[0062] 5A and 5B show a cross section (XY cross section) of one memory string 120, while Figures 6A and 6B show an example in which multiple memory strings 120 are provided. The multiple memory strings 120 may be arranged side by side in the X-axis direction, may be arranged side by side in the Y-axis direction, or may be arranged in a matrix.

[0063] The memory element MC has a transistor WTr and a transistor RTr (see FIG. 7A). A region where the conductor WWL and the conductor 130 overlap functions as the transistor WTr. In other words, the intersection of the conductor WWL and the conductor 130 functions as the transistor WTr. At the intersection of the conductor WWL and the conductor 130, the insulator 129 is adjacent to the conductor 130, and the semiconductor 127 is adjacent to the insulator 129. Also, the insulator 126 is adjacent to the semiconductor 127, and the semiconductor 125 is adjacent to the insulator 126. Further, the insulator 124 is adjacent to the semiconductor 125.

[0064] The conductor WWL functions as the gate electrode of the transistor WTr, and the conductor 130 functions as the back gate electrode of the transistor WTr. Also, a part of the semiconductor 127 functions as a semiconductor layer in which the channel of the transistor WTr is formed. The semiconductor layer in which the channel of the transistor WTr is formed overlaps the gate electrode (conductor WWL) through a part of each of the insulator 126, the semiconductor 125, and the insulator 124. In the present embodiment and the like, an example in which a part of the conductor WWL functions as the gate electrode is shown, but the gate electrode and the conductor WWL may be provided independently and electrically connected to each other.

[0065] A region where the conductor RWL and the conductor 130 overlap functions as the transistor RTr. In other words, the intersection of the conductor RWL and the conductor 130 functions as the transistor RTr. Also, at the intersection of the conductor RWL and the conductor 130, the conductor 128 is provided. Similar to the intersection of the conductor WWL and the conductor 130, at the intersection of the conductor RWL and the conductor 130, each of the insulator 129, the semiconductor 127, the insulator 126, the semiconductor 125, and the insulator 124 has a region that overlaps with each other in a direction perpendicular to the Z direction. However, the intersection of the conductor RWL and the conductor 130 is different from the intersection of the conductor WWL and the conductor 130 in that the conductor 128 is provided between the insulator 129 and the semiconductor 127.

[0066] The conductor 128 functions as the gate electrode of the transistor RTr. The conductor RWL functions as the backgate electrode of the transistor RTr. A part of the semiconductor 125 functions as a semiconductor layer in which the channel of the transistor RTr is formed. The semiconductor layer in which the channel of the transistor RTr is formed overlaps with the gate electrode (conductor 128) via a part of the insulator 126. The semiconductor layer in which the channel of the transistor RTr is formed overlaps with the backgate electrode (conductor RWL) via a part of the insulator 124. Note that, in the present embodiment and the like, an example in which a part of the conductor RWL functions as the backgate electrode is shown, but the backgate electrode and the conductor RWL may be provided independently and electrically connected to each other.

[0067] Moreover, dividing the memory string 120 along the Z-axis direction is preferable because it is possible to increase the number of memory cells provided in the opening 141. When dividing the memory string 120 along the Z-axis direction, the conductor WWL and the conductor RWL may also be divided.

[0068] 8A shows how the conductor WWL and the memory string 120 are divided by the insulator 153 provided along the XZ plane, and FIG. 8B shows how the conductor RWL and the memory string 120 are divided by the insulator 153 provided along the XZ plane. Note that FIG. 8A corresponds to a modified example of the cross section shown in FIG. 5A. FIG. 8B corresponds to a modified example of the cross section shown in FIG. 5B. In FIG. 8 and other figures, the reference numerals of the divided components are suffixed with a or b.

[0069] As shown in FIG. 8A, the region where the conductor WWLa and the conductor 130a overlap functions as the transistor WTra. Specifically, the region where the conductor WWLa, the insulator 124a, the semiconductor 125a, the insulator 126a, the semiconductor 127a, the insulator 129a, and the conductor 130a overlap functions as the transistor WTra. The conductor WWLa functions as the gate electrode of the transistor WTra, and the conductor 130a functions as the backgate electrode of the transistor WTra. A part of the semiconductor 127a functions as a semiconductor layer in which the channel of the transistor WTra is formed. The semiconductor layer in which the channel of the transistor WTra is formed overlaps with the gate electrode (conductor WWLa) via a part of the insulator 124a, a part of the semiconductor 125a, and a part of the insulator 126a.

[0070] Moreover, the region where the conductor WWLb and the conductor 130b overlap functions as the transistor WTrb. Specifically, the region where the conductor WWLb, the insulator 124b, the semiconductor 125b, the insulator 126b, the semiconductor 127b, the insulator 129b, and the conductor 130b overlap functions as the transistor WTrb. The conductor WWLb functions as the gate electrode of the transistor WTrb, and the conductor 130b functions as the backgate electrode of the transistor WTrb. Furthermore, a part of the semiconductor 127b functions as a semiconductor layer in which the channel of the transistor WTrb is formed. The semiconductor layer in which the channel of the transistor WTrb is formed overlaps with the gate electrode (conductor WWLb) via a part of the insulator 124b, a part of the semiconductor 125b, and a part of the insulator 126b.

[0071] As shown in FIG. 8B, the region where the conductor RWLa and the conductor 130a overlap functions as the transistor RTra. Specifically, RWLa, the insulator 124a, the semiconductor 125a, the insulator 126a, the semiconductor 127a, the conductor 128a, the insulator 129a, and the conductor 130a function as the transistor RTra. The conductor RWLa functions as the gate electrode of the transistor RTra. The conductor 130a functions as the back gate electrode of the transistor RTra. A part of the semiconductor 125a functions as a semiconductor layer in which the channel of the transistor RTra is formed. The semiconductor layer in which the channel of the transistor RTra is formed overlaps with the gate electrode (conductor RWLa) via the insulator 124a. The semiconductor layer in which the channel of the transistor RTra is formed overlaps with the back gate electrode (conductor 130a) via a part of the insulator 126a, a part of the semiconductor 127a, a part of the conductor 128a, and a part of the insulator 129a.

[0072] Moreover, the region where the conductor RWLb and the conductor 130b overlap functions as the transistor RTrb. Specifically, RWLb, the insulator 124b, the semiconductor 125b, the insulator 126b, the semiconductor 127b, the conductor 128b, the insulator 129b, and the conductor 130b function as the transistor RTrb. The conductor RWLb functions as the gate electrode of the transistor RTrb. The conductor 130b functions as the back gate electrode of the transistor RTrb. A part of the semiconductor 125b functions as a semiconductor layer in which the channel of the transistor RTrb is formed. The semiconductor layer in which the channel of the transistor RTrb is formed overlaps with the gate electrode (conductor RWLb) via the insulator 124b. The semiconductor layer in which the channel of the transistor RTrb is formed overlaps with the back gate electrode (conductor 130b) via a part of the insulator 126b, a part of the semiconductor 127b, a part of the conductor 128b, and a part of the insulator 129b.

[0073] As described above, by dividing the conductor WWL, the conductor RWL, and the memory string 120, the number of memory cells provided in the opening 141 can be doubled. The method of dividing the memory string 120 is not limited to the above. In FIG. 8A and FIG. 8B, the memory string 120 is divided by the insulator 153 extending in the X-axis direction, but as shown in FIG. 9A and FIG. 9B, the insulator 153 may extend in a direction different from the X-axis direction. Also, as shown in FIG. 9C to FIG. 9F, the memory string 120 may be divided into three or more. FIG. 9C and FIG. 9D show an example of the memory string 120 divided into three, and FIG. 9E and FIG. 9F show an example of the memory string 120 divided into four. At this time, the number of memory cells provided in the opening 141 can be increased by three times and four times, respectively.

[0074] 9A to 9F, it is preferable that the insulator 153 is disposed so as not to impede conduction of the conductors WWL and RWL in the X-axis direction.

[0075] Here, we will explain the backgate. The gate and the backgate are arranged so as to overlap with each other via the channel formation region of the semiconductor layer. The backgate can function in the same way as the gate. In addition, the threshold voltage of the transistor can be changed by changing the potential of the backgate. Either the gate or the backgate may be called the "first gate" or "first gate," and the other may be called the "second gate" or "second gate."

[0076] The gate and back gate are formed of a conductive layer or a semiconductor layer with low resistivity, and therefore have the function of preventing an electric field generated outside the transistor from acting on the semiconductor layer in which the channel is formed (particularly, an electrostatic shielding function against static electricity). In other words, it is possible to prevent the electrical characteristics of the transistor from fluctuating due to the influence of an external electric field such as static electricity.

[0077] In addition, the threshold voltage of the transistor can be controlled by controlling the potential of the back gate, which may be the same potential as the gate, a ground potential (GND potential), or any other potential.

[0078] The semiconductor layers in which the channels of the transistors WTr and RTr are formed may be made of single crystal semiconductors, polycrystalline semiconductors, microcrystalline semiconductors, or amorphous semiconductors, either alone or in combination. Examples of the semiconductor material include silicon and germanium. Compound semiconductors such as silicon germanium, silicon carbide, gallium arsenide, oxide semiconductors, and nitride semiconductors may also be used. The same is true for the transistors STr1 and STr2.

[0079] Note that the semiconductor layers used in the transistor may be stacked. When the semiconductor layers are stacked, semiconductors having different crystal states or different semiconductor materials may be used for each of the semiconductor layers.

[0080] The semiconductor layer used in the transistors WTr, RTr, STr1, and STr2 is preferably an oxide semiconductor containing a metal oxide. A transistor using a metal oxide in the semiconductor layer can obtain a higher field-effect mobility than a transistor using amorphous silicon in the semiconductor layer. In addition, a transistor using polycrystalline silicon in the semiconductor layer may have a grain boundary in the semiconductor layer. At the grain boundary, carriers are likely to be captured, causing a decrease in the on-current of the transistor, a decrease in the field-effect mobility, and the like. On the other hand, as will be described in detail later, an oxide semiconductor can realize a crystal structure in which no clear grain boundary is confirmed or a crystal structure in which the grain boundary is extremely small. It is preferable to use such an oxide semiconductor in the semiconductor layer because a transistor having good electrical characteristics such as a high on-current and a field-effect mobility can be realized.

[0081] Furthermore, oxide semiconductors, particularly CAAC-IGZO, which is a crystalline oxide semiconductor, have a characteristic structure in which nanoclusters of a few nm (e.g., 1 to 3 nm) are linked together and their c-axes are oriented in the direction perpendicular to the surface on which they are formed. This makes it possible to form a crystal structure in which no clear crystal grain boundaries are visible even within an opening extending in the Z direction.

[0082] In particular, the transistor WTr is preferably a transistor (also referred to as an "OS transistor") that uses an oxide semiconductor, which is a type of metal oxide, in a semiconductor layer in which a channel is formed. An oxide semiconductor has a band gap of 2 eV or more, and therefore has an extremely low off-state current. When an OS transistor is used as the transistor WTr, charge written to the node ND can be held for a long period of time. When an OS transistor is used as the transistor constituting the memory element MC, the memory element MC can be called an "OS memory." In addition, the memory string 120 including the memory element MC can also be called an "OS memory." In addition, the memory device 100 can also be called an "OS memory."

[0083] The OS memory can retain written information for more than one year, or even more than ten years, even if the power supply is cut off. Therefore, the OS memory can be considered as a non-volatile memory.

[0084] In addition, since the amount of charge written into the OS memory is unlikely to change over a long period of time, the OS memory can hold not only binary (1-bit) information but also multi-value (multi-bit) information.

[0085] In addition, because OS memory uses a method of writing charge to a node via a transistor, it does not require the high voltage required for conventional flash memory, and can achieve high-speed write operations. In addition, OS memory does not require the erase operation before rewriting data, which is performed in flash memory. In addition, since no charge is injected or extracted from the floating gate or charge trapping layer, OS memory can write and read data an unlimited number of times. OS memory is less susceptible to deterioration than conventional flash memory, and is highly reliable.

[0086] In addition, the OS memory does not involve structural changes at the atomic level, as in magnetoresistive random access memory (MRAM) or resistive random access memory (ReRAM), etc. Therefore, the OS memory has better rewrite endurance than the magnetoresistive random access memory and resistive random access memory.

[0087] Moreover, the off-current of an OS transistor hardly increases even in a high-temperature environment. Specifically, the off-current hardly increases even in an environmental temperature range of room temperature or higher and 200° C. or lower. Moreover, the on-current is unlikely to decrease even in a high-temperature environment. A storage device including an OS memory is stable in operation even in a high-temperature environment, and is highly reliable. Moreover, the OS transistor has a high withstand voltage between the source and drain. By using an OS transistor as a transistor constituting a semiconductor device, a semiconductor device that is stable in operation even in a high-temperature environment and has good reliability can be realized.

[0088] The semiconductor 125 is preferably an n-type semiconductor. Also, the region of the semiconductor 127 overlapping with the conductor WWL is preferably an i-type or substantially i-type semiconductor. In this case, the transistor WTr is an enhancement type (normally off type) transistor, and the transistor RTr is a depletion type (normally on type) transistor.

[0089] Note that the semiconductor 125 and the semiconductor 127 may be made of the same material or different materials. For example, the semiconductor 125 and the semiconductor 127 may each be an oxide semiconductor. Alternatively, the semiconductor 125 and the semiconductor 127 may each be a semiconductor containing silicon. Alternatively, the semiconductor 125 may be an oxide semiconductor, and the semiconductor 127 may be a semiconductor containing silicon. Alternatively, the semiconductor 125 may be a semiconductor containing silicon, and the semiconductor 127 may be an oxide semiconductor.

[0090] 7B shows a perspective cross-sectional view of the memory element MC. Note that in order to make the structure of the memory element MC easier to understand, the insulator 123 is omitted in FIG.

[0091] 5A corresponds to the XY plane at or near the center of the transistor WTr, and FIG. 5B corresponds to the XY plane at or near the center of the transistor RTr. In FIG. 5A and FIG. 5B, when the cross-sectional shape of the conductor 130 is circular, the insulator 129 is provided concentrically outside the conductor 130, the semiconductor 127 is provided concentrically outside the insulator 129, the insulator 126 is provided concentrically outside the semiconductor 127, the semiconductor 125 is provided concentrically outside the insulator 126, and the insulator 124 is provided concentrically outside the semiconductor 125. The conductor 128 is provided concentrically between the insulator 129 and the semiconductor 127.

[0092] Furthermore, the cross-sectional shape of the conductor 130 is not limited to a circle. As shown in Fig. 10A, the cross-sectional shape of the conductor 130 may be rectangular. As shown in Fig. 10B, the cross-sectional shape of the conductor 130 may be triangular. Note that Figs. 10A and 10B correspond to a cross section of the portion B1-B2 indicated by the dashed dotted line in Fig. 3 as viewed from the Z direction.

[0093] The memory string 120 can also be called a memory device, and the memory element MC can also be called a memory device.

[0094] [Materials Constituting Semiconductor Devices] Next, materials that can be used for the storage device 100 will be described.

[0095] [substrate] The memory device 100 can be provided on a substrate. For example, an insulating substrate, a semiconductor substrate, or a conductive substrate may be used as the substrate. For example, the insulating substrate may be a glass substrate, a quartz substrate, a sapphire substrate, a stabilized zirconia substrate (such as an yttria stabilized zirconia substrate), or a resin substrate. For example, the semiconductor substrate may be a semiconductor substrate made of silicon or germanium, or a compound semiconductor substrate made of silicon carbide, silicon germanium, gallium arsenide, indium phosphide, zinc oxide, or gallium oxide. For example, the semiconductor substrate may be a semiconductor substrate having an insulating region inside the semiconductor substrate, such as an SOI (Silicon On Insulator) substrate. For example, the conductive substrate may be a graphite substrate, a metal substrate, an alloy substrate, or a conductive resin substrate. For example, a substrate having a metal nitride, or a substrate having a metal oxide may be used. For example, a substrate having a conductor or semiconductor provided on an insulating substrate, a substrate having a conductor or insulator provided on a semiconductor substrate, or a substrate having a semiconductor or insulator provided on a conductive substrate may be used. Alternatively, a substrate provided with elements may be used. The elements provided on the substrate include a capacitor element, a resistor element, a switch element, a light-emitting element, a memory element, and the like.

[0096] [Insulator] Examples of the insulator include oxides, nitrides, oxynitrides, nitride oxides, metal oxides, metal oxynitrides, and metal nitride oxides, each of which has insulating properties.

[0097] In this specification, etc., the term "oxynitride" refers to a material that contains more oxygen than nitrogen. For example, "silicon oxynitride" refers to a silicon material that contains more oxygen than nitrogen. In this specification, etc., the term "nitride oxide" refers to a material that contains more nitrogen than oxygen, and the term "aluminum nitride oxide" refers to an aluminum material that contains more nitrogen than oxygen.

[0098] For example, as transistors become smaller and more highly integrated, problems such as leakage current can occur due to thinner gate insulators. By using a high-k material for the insulator that functions as the gate insulator, it is possible to reduce the voltage required for transistor operation while maintaining the physical film thickness. On the other hand, by using a material with a low dielectric constant for the insulator that functions as the interlayer film, it is possible to reduce the parasitic capacitance that occurs between wiring. Therefore, it is best to select materials according to the function of the insulator.

[0099] Further, examples of insulators with a high relative dielectric constant include gallium oxide, hafnium oxide, zirconium oxide, oxides having aluminum and hafnium, oxynitrides having aluminum and hafnium, oxides having silicon and hafnium, oxynitrides having silicon and hafnium, and nitrides having silicon and hafnium.

[0100] Examples of insulators with a low dielectric constant include silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, silicon oxide with fluorine added, silicon oxide with carbon added, silicon oxide with carbon and nitrogen added, silicon oxide with voids, or resin.

[0101] In addition, the electrical characteristics of the OS transistor can be stabilized by surrounding it with an insulator that has a function of suppressing the permeation of impurities such as hydrogen and oxygen. As the insulator that has a function of suppressing the permeation of impurities such as hydrogen and oxygen, for example, an insulator containing boron, carbon, nitrogen, oxygen, fluorine, magnesium, aluminum, silicon, phosphorus, chlorine, argon, gallium, germanium, yttrium, zirconium, lanthanum, neodymium, hafnium, or tantalum may be used in a single layer or a stacked layer. Specifically, as the insulator that has a function of suppressing the permeation of impurities such as hydrogen and oxygen, metal oxides such as aluminum oxide, magnesium oxide, gallium oxide, germanium oxide, yttrium oxide, zirconium oxide, lanthanum oxide, neodymium oxide, hafnium oxide, and tantalum oxide, and metal nitrides such as aluminum nitride, silicon nitride oxide, and silicon nitride can be used.

[0102] When an oxide semiconductor is used for the semiconductor 125 and / or the semiconductor 127, the insulator functioning as a gate insulator is preferably an insulator having a region containing oxygen that is released by heating. For example, by using a structure in which silicon oxide or silicon oxynitride having a region containing oxygen that is released by heating is in contact with the semiconductor 125 and / or the semiconductor 127, oxygen vacancies in the semiconductor 125 and / or the semiconductor 127 can be compensated for.

[0103] [conductor] As the conductor, it is preferable to use a metal element selected from aluminum, chromium, copper, silver, gold, platinum, tantalum, nickel, titanium, molybdenum, tungsten, hafnium, vanadium, niobium, manganese, magnesium, zirconium, beryllium, indium, ruthenium, iridium, strontium, lanthanum, etc., or an alloy containing the above-mentioned metal elements as a component, or an alloy combining the above-mentioned metal elements. For example, it is preferable to use tantalum nitride, titanium nitride, tungsten, nitride containing titanium and aluminum, nitride containing tantalum and aluminum, ruthenium oxide, ruthenium nitride, oxide containing strontium and ruthenium, oxide containing lanthanum and nickel, etc. In addition, tantalum nitride, titanium nitride, nitride containing titanium and aluminum, nitride containing tantalum and aluminum, ruthenium oxide, ruthenium nitride, oxide containing strontium and ruthenium, oxide containing lanthanum and nickel are conductive materials that are difficult to oxidize, or materials that maintain conductivity even when oxygen is absorbed, so they are preferable. Furthermore, a semiconductor having high electrical conductivity, typified by polycrystalline silicon containing an impurity element such as phosphorus, or a silicide such as nickel silicide may be used.

[0104] A plurality of conductive layers formed of the above-mentioned materials may be stacked. For example, a stacked structure may be formed by combining the above-mentioned material containing a metal element and a conductive material containing oxygen. A stacked structure may be formed by combining the above-mentioned material containing a metal element and a conductive material containing nitrogen. A stacked structure may be formed by combining the above-mentioned material containing a metal element, a conductive material containing oxygen, and a conductive material containing nitrogen.

[0105] In the case where an oxide semiconductor, which is a type of metal oxide, is used for the channel formation region of a transistor, a conductor functioning as a gate electrode preferably has a stacked structure in which a material containing the above-mentioned metal element and a conductive material containing oxygen are combined. In this case, the conductive material containing oxygen is preferably provided on the channel formation region side. By providing the conductive material containing oxygen on the channel formation region side, oxygen released from the conductive material is easily supplied to the channel formation region.

[0106] In particular, as a conductor functioning as a gate electrode, it is preferable to use a conductive material containing oxygen and a metal element contained in an oxide semiconductor in which a channel is formed. The conductive material containing the above-mentioned metal element and nitrogen may be used. For example, a conductive material containing nitrogen, such as titanium nitride or tantalum nitride, may be used. Indium tin oxide, indium oxide containing tungsten oxide, indium zinc oxide containing tungsten oxide, indium oxide containing titanium oxide, indium tin oxide containing titanium oxide, indium zinc oxide, or indium tin oxide to which silicon is added may be used. Indium gallium zinc oxide containing nitrogen may be used. By using such a material, hydrogen contained in an oxide semiconductor in which a channel is formed may be captured. Alternatively, hydrogen mixed in from an external insulator or the like may be captured.

[0107] [Oxide semiconductor] A metal oxide (oxide semiconductor) functioning as a semiconductor is preferably used as the semiconductor 125 and the semiconductor 127. An oxide semiconductor that can be used for the semiconductor 125 and the semiconductor 127 will be described below.

[0108] The oxide semiconductor preferably contains at least one of indium and zinc. In particular, it is preferable that the oxide semiconductor contains indium and zinc. In addition to these, it is preferable that the oxide semiconductor contains aluminum, gallium, yttrium, tin, etc. Furthermore, the oxide semiconductor may contain one or more elements selected from boron, titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, magnesium, cobalt, etc.

[0109] Here, the case where the oxide semiconductor is an In-M-Zn oxide containing indium, an element M, and zinc is considered. The element M is one or more selected from aluminum, gallium, yttrium, and tin. Other elements applicable to the element M include boron, titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, magnesium, and cobalt. However, there are cases where the element M may be a combination of a plurality of the above elements.

[0110] In this specification and the like, metal oxides containing nitrogen may also be collectively referred to as metal oxides. Furthermore, metal oxides containing nitrogen may also be referred to as metal oxynitrides.

[0111] [Classification of crystal structures] First, classification of crystal structures in oxide semiconductors will be described with reference to Fig. 11A. Fig. 11A is a diagram for explaining classification of crystal structures of oxide semiconductors, typically IGZO (metal oxide containing In, Ga, and Zn).

[0112] As shown in FIG. 11A, oxide semiconductors are broadly classified into "Amorphous", "Crystalline", and "Crystal". "Amorphous" includes completely amorphous. "Crystalline" includes c-axis-aligned crystalline (CAAC), nanocrystalline (nc), and cloud-aligned composite (CAC). "Crystalline" excludes single crystal, poly crystal, and completely amorphous. "Crystal" includes single crystal and poly crystal.

[0113] The structure in the bold frame shown in Fig. 11A is an intermediate state between "Amorphous" and "Crystal" and belongs to a new boundary region (New crystalline phase). In other words, this structure is completely different from the energetically unstable "Amorphous" and "Crystal".

[0114] The crystal structure of the film or substrate can be evaluated using an X-ray diffraction (XRD) spectrum. Figure 11B shows an XRD spectrum obtained by GIXD (Grazing-Incidence XRD) measurement of the CAAC-IGZO film classified as "Crystalline". The GIXD method is also called the thin film method or the Seemann-Bohlin method. Hereinafter, the XRD spectrum obtained by the GIXD measurement shown in Figure 11B will be simply referred to as the XRD spectrum. The composition of the CAAC-IGZO film shown in Figure 11B is in the vicinity of In:Ga:Zn=4:2:3 [atomic ratio]. The thickness of the CAAC-IGZO film shown in Figure 11B is 500 nm.

[0115] As shown in Figure 11B, a peak indicating clear crystallinity is detected in the XRD spectrum of the CAAC-IGZO film. Specifically, a peak indicating c-axis orientation is detected near 2θ=31° in the XRD spectrum of the CAAC-IGZO film. Note that, as shown in Figure 11B, the peak near 2θ=31° is asymmetric with respect to the angle at which the peak intensity is detected.

[0116] The crystal structure of the film or substrate can be evaluated by a diffraction pattern (also called a nanobeam electron diffraction pattern) observed by nanobeam electron diffraction (NBED). The diffraction pattern of the CAAC-IGZO film is shown in FIG. 11C. FIG. 11C is a diffraction pattern observed by NBED, which causes an electron beam to be incident parallel to the substrate. The composition of the CAAC-IGZO film shown in FIG. 11C is approximately In:Ga:Zn=4:2:3 [atomic ratio]. In the nanobeam electron diffraction method, electron diffraction is performed with a probe diameter of 1 nm.

[0117] As shown in FIG. 11C, multiple spots indicating c-axis orientation are observed in the diffraction pattern of the CAAC-IGZO film.

[0118] [Structure of oxide semiconductor] In addition, when focusing on the crystal structure, oxide semiconductors may be classified differently from that shown in FIG. 11A. For example, oxide semiconductors are divided into single-crystal oxide semiconductors and other non-single-crystal oxide semiconductors. Examples of non-single-crystal oxide semiconductors include the above-mentioned CAAC-OS and nc-OS. In addition, non-single-crystal oxide semiconductors include polycrystalline oxide semiconductors, pseudo-amorphous-like oxide semiconductors (a-like OS), amorphous oxide semiconductors, and the like.

[0119] Next, the details of the above-mentioned CAAC-OS, nc-OS, and a-like OS will be explained.

[0120] [CAAC-OS] CAAC-OS is an oxide semiconductor having a plurality of crystalline regions, each of which has a c-axis aligned in a specific direction. The specific direction is the thickness direction of the CAAC-OS film, the normal direction of the surface on which the CAAC-OS film is formed, or the normal direction of the surface of the CAAC-OS film. The crystalline region is a region having periodic atomic arrangement. If the atomic arrangement is considered as a lattice arrangement, the crystalline region is also a region with a uniform lattice arrangement. CAAC-OS has a region in which a plurality of crystalline regions are connected in the ab-plane direction, and the region may have distortion. The distortion refers to a portion in which the direction of the lattice arrangement changes between a region with a uniform lattice arrangement and another region with a uniform lattice arrangement in the region in which the plurality of crystalline regions are connected. In other words, CAAC-OS is an oxide semiconductor having a c-axis aligned and no clear orientation in the ab-plane direction.

[0121] Each of the multiple crystalline regions is composed of one or more minute crystals (crystals with a maximum diameter of less than 10 nm). When a crystalline region is composed of one minute crystal, the maximum diameter of the crystalline region is less than 10 nm. When a crystalline region is composed of many minute crystals, the size of the crystalline region may be about several tens of nm.

[0122] In the In-M-Zn oxide, the CAAC-OS tends to have a layered crystal structure (also referred to as a layered structure) in which a layer containing indium (In) and oxygen (hereinafter, an In layer) and a layer containing an element M, zinc (Zn), and oxygen (hereinafter, an (M, Zn) layer) are stacked. Note that indium and the element M are mutually substituted. Thus, the (M, Zn) layer may contain indium. Note that the In layer may contain the element M. Note that the In layer may contain Zn. The layered structure is observed as a lattice image in a high-resolution TEM image, for example.

[0123] When the CAAC-OS film is subjected to structural analysis using, for example, an XRD device, a peak indicating c-axis orientation is detected at or near 2θ=31° in out-of-plane XRD measurement using θ / 2θ scan. Note that the position of the peak indicating c-axis orientation (2θ value) may vary depending on the type and composition of the metal elements constituting the CAAC-OS.

[0124] For example, a plurality of bright points (spots) are observed in the electron diffraction pattern of the CAAC-OS film, and the two spots are observed at positions symmetrical to each other with respect to the spot of the incident electron beam that has passed through the sample (also called the direct spot).

[0125] When the crystal region is observed from the specific direction, the lattice arrangement in the crystal region is based on a hexagonal lattice, but the unit cell is not necessarily a regular hexagon and may be a non-regular hexagon. The above distortion may have a pentagonal or heptagonal lattice arrangement. In addition, no clear grain boundary can be confirmed in the CAAC-OS even in the vicinity of the distortion. That is, it is found that the formation of grain boundaries is suppressed by the distortion of the lattice arrangement. This is considered to be because the CAAC-OS can tolerate distortion due to the fact that the arrangement of oxygen atoms is not dense in the ab-plane direction and the bond distance between atoms changes due to the substitution of metal atoms.

[0126] A crystal structure in which clear grain boundaries are observed is called a polycrystal. The grain boundaries are likely to become recombination centers and capture carriers, causing a decrease in the on-current of a transistor and a decrease in field effect mobility. Therefore, CAAC-OS in which clear grain boundaries are not observed is one of the crystalline oxides having a crystal structure suitable for a semiconductor layer of a transistor. In order to form a CAAC-OS, a structure containing Zn is preferable. For example, In-Zn oxide and In-Ga-Zn oxide are suitable because they can suppress the occurrence of grain boundaries more than In oxide.

[0127] The CAAC-OS is an oxide semiconductor with high crystallinity and no clear crystal grain boundaries. Therefore, it can be said that the CAAC-OS is less susceptible to a decrease in electron mobility due to crystal grain boundaries. In addition, since the crystallinity of an oxide semiconductor can be decreased by the inclusion of impurities or the generation of defects, the CAAC-OS can be said to be an oxide semiconductor with few impurities and defects (such as oxygen vacancies). Therefore, the physical properties of an oxide semiconductor having the CAAC-OS are stable. Therefore, an oxide semiconductor having the CAAC-OS is resistant to heat and has high reliability. In addition, the CAAC-OS is stable against high temperatures (so-called thermal budget) in the manufacturing process. Therefore, the use of the CAAC-OS in an OS transistor can increase the degree of freedom in the manufacturing process.

[0128] [nc-OS] The nc-OS has periodic atomic arrangement in a minute region (for example, a region of 1 nm to 10 nm, particularly a region of 1 nm to 3 nm). In other words, the nc-OS has minute crystals. Note that the size of the minute crystals is, for example, 1 nm to 10 nm, particularly 1 nm to 3 nm, and therefore the minute crystals are also called nanocrystals. In addition, the nc-OS does not show regularity in the crystal orientation between different nanocrystals. Therefore, no orientation is seen in the entire film. Therefore, depending on the analysis method, the nc-OS may be indistinguishable from an a-like OS or an amorphous oxide semiconductor. For example, when a structure analysis is performed on an nc-OS film using an XRD device, no peak indicating crystallinity is detected in out-of-plane XRD measurement using θ / 2θ scan. In addition, when an nc-OS film is subjected to electron diffraction (also called selected area electron diffraction) using an electron beam with a probe diameter larger than that of nanocrystals (for example, 50 nm or more), a diffraction pattern like a halo pattern is observed. On the other hand, when electron diffraction (also called nanobeam electron diffraction) is performed on an nc-OS film using an electron beam with a probe diameter (e.g., 1 nm to 30 nm) that is close to the size of a nanocrystal or smaller than the nanocrystal, an electron diffraction pattern in which multiple spots are observed within a ring-shaped region centered on the direct spot may be obtained.

[0129] [a-like OS] The a-like OS is an oxide semiconductor having a structure between the nc-OS and an amorphous oxide semiconductor. The a-like OS has a void or low-density region. That is, the a-like OS has lower crystallinity than the nc-OS and CAAC-OS. Moreover, the a-like OS has a higher hydrogen concentration in the film than the nc-OS and CAAC-OS.

[0130] [Oxide semiconductor composition] Next, the above-mentioned CAC-OS will be described in detail, with reference to its material composition.

[0131] [CAC-OS] CAC-OS is, for example, a material configuration in which elements constituting a metal oxide are unevenly distributed in a size range of 0.5 nm to 10 nm, preferably 1 nm to 3 nm, or in the vicinity thereof. In the following, a state in which one or more metal elements are unevenly distributed in a metal oxide and the regions having the metal elements are mixed in a size range of 0.5 nm to 10 nm, preferably 1 nm to 3 nm, or in the vicinity thereof, is also referred to as a mosaic or patch state.

[0132] Furthermore, CAC-OS is a composite metal oxide in which the material is separated into a first region and a second region, forming a mosaic structure, and the first region is distributed throughout the film (hereinafter, also referred to as a cloud structure). In other words, CAC-OS is a composite metal oxide in which the first region and the second region are mixed together.

[0133] Here, the atomic ratios of In, Ga, and Zn to the metal elements constituting the CAC-OS in the In-Ga-Zn oxide are represented as [In], [Ga], and [Zn], respectively. For example, in the CAC-OS in the In-Ga-Zn oxide, the first region is a region where [In] is larger than [In] in the composition of the CAC-OS film. Also, the second region is a region where [Ga] is larger than [Ga] in the composition of the CAC-OS film. Alternatively, for example, the first region is a region where [In] is larger than [In] in the second region and [Ga] is smaller than [Ga] in the second region. Also, the second region is a region where [Ga] is larger than [Ga] in the first region and [In] is smaller than [In] in the first region.

[0134] Specifically, the first region is a region mainly composed of indium oxide, indium zinc oxide, etc., and the second region is a region mainly composed of gallium oxide, gallium zinc oxide, etc. In other words, the first region can be rephrased as a region mainly composed of In, and the second region can be rephrased as a region mainly composed of Ga.

[0135] In addition, there are cases where a clear boundary between the first region and the second region cannot be observed.

[0136] For example, in the case of a CAC-OS of an In-Ga-Zn oxide, EDX mapping obtained using EDX (Energy Dispersive X-ray spectroscopy) has confirmed that the CAC-OS has a structure in which a region mainly composed of In (first region) and a region mainly composed of Ga (second region) are unevenly distributed and mixed.

[0137] When CAC-OS is used in a transistor, the conductivity due to the first region and the insulating property due to the second region act in a complementary manner, giving the CAC-OS a switching function (On / Off function). In other words, CAC-OS has a conductive function in part of the material and an insulating function in other parts of the material, and the material as a whole functions as a semiconductor. By separating the conductive function from the insulating function, it is possible to maximize both functions. Therefore, by using CAC-OS in a transistor, it is possible to achieve a high on-current (I on ), high field effect mobility (μ), and good switching behavior can be achieved.

[0138] Oxide semiconductors have a variety of structures and each structure has different characteristics. The oxide semiconductor of one embodiment of the present invention may include two or more of an amorphous oxide semiconductor, a polycrystalline oxide semiconductor, an a-like OS, a CAC-OS, an nc-OS, and a CAAC-OS.

[0139] [Transistor Having Oxide Semiconductor] Next, the case where the oxide semiconductor is used for a transistor will be described.

[0140] By using the oxide semiconductor for a transistor, a transistor with high field-effect mobility and high reliability can be realized.

[0141] It is preferable to use an oxide semiconductor having a low carrier concentration for a channel formation region of a transistor. For example, the carrier concentration of the channel formation region of an oxide semiconductor is 1×10 18 cm -3 It is preferable that the value is less than 1×10 17 cm -3 More preferably, it is less than 1×10 16 cm -3 More preferably, it is less than 1×10 13 cm -3 More preferably, it is less than 1×10 12 cm-3 It is more preferable that the carrier concentration of the oxide semiconductor film is less than 100%. Note that in the case of lowering the carrier concentration of the oxide semiconductor film, the impurity concentration in the oxide semiconductor film may be lowered to lower the density of defect states. In this specification and the like, an oxide semiconductor having a low impurity concentration and a low density of defect states is referred to as a high-purity intrinsic or substantially high-purity intrinsic oxide semiconductor. Note that an oxide semiconductor having a low carrier concentration may be referred to as a high-purity intrinsic or substantially high-purity intrinsic oxide semiconductor. In addition, a high-purity intrinsic or substantially high-purity intrinsic oxide semiconductor may be referred to as an i-type or substantially i-type.

[0142] Furthermore, a highly purified intrinsic or substantially highly purified intrinsic oxide semiconductor film has a low density of defect states, and therefore the density of trap states might also be low.

[0143] In addition, charges trapped in the trap states of an oxide semiconductor take a long time to disappear and may behave as if they are fixed charges. Therefore, a transistor in which a channel formation region is formed in an oxide semiconductor with a high density of trap states may have unstable electrical characteristics.

[0144] Therefore, in order to stabilize the electrical characteristics of a transistor, it is effective to reduce the impurity concentration in the oxide semiconductor. In order to reduce the impurity concentration in the oxide semiconductor, it is preferable to also reduce the impurity concentration in a nearby film. Examples of impurities include hydrogen, nitrogen, alkali metals, alkaline earth metals, iron, nickel, silicon, and the like.

[0145] 〔impurities〕 Here, the influence of each impurity in an oxide semiconductor will be described.

[0146] When an oxide semiconductor contains silicon or carbon, which is one of the group 14 elements, defect levels are formed in the oxide semiconductor. For this reason, the concentrations of silicon and carbon in the channel formation region of the oxide semiconductor and the vicinity of the interface with the channel formation region of the oxide semiconductor (concentrations obtained by secondary ion mass spectrometry (SIMS)) are set to 2×10 18 atoms / cm 3 Less than or equal to 2×10 17 atoms / cm 3 The following applies.

[0147] In addition, when an oxide semiconductor contains an alkali metal or an alkaline earth metal, defect levels are formed and carriers are generated in some cases. Therefore, a transistor using an oxide semiconductor containing an alkali metal or an alkaline earth metal is likely to have normally-on characteristics. For this reason, when the concentration of the alkali metal or the alkaline earth metal in the channel formation region of the oxide semiconductor obtained by SIMS is set to 1×10 18 atoms / cm 3 Less than or equal to 2 x 10 16 atoms / cm 3 To the following:

[0148] Furthermore, when nitrogen is contained in an oxide semiconductor, electrons serving as carriers are generated, the carrier concentration increases, and the semiconductor is likely to become n-type. As a result, a transistor using an oxide semiconductor containing nitrogen as a semiconductor is likely to have normally-on characteristics. Alternatively, when nitrogen is contained in an oxide semiconductor, trap states may be formed. As a result, the electrical characteristics of the transistor may become unstable. For this reason, the nitrogen concentration in the channel formation region of the oxide semiconductor obtained by SIMS is set to 5×10 19 atoms / cm 3 Less than 5 x 10 18 atoms / cm 3 Less than or equal to 1×10 18 atoms / cm 3 Less than 5×10, more preferably 17 atoms / cm3 To the following:

[0149] Furthermore, hydrogen contained in the oxide semiconductor reacts with oxygen bonded to a metal atom to form water, which may form an oxygen vacancy. When hydrogen enters the oxygen vacancy, electrons serving as carriers may be generated. In addition, some of the hydrogen may bond with oxygen bonded to a metal atom to generate electrons serving as carriers. Therefore, a transistor using an oxide semiconductor containing hydrogen is likely to have normally-on characteristics. For this reason, it is preferable to reduce hydrogen in the channel formation region of the oxide semiconductor as much as possible. Specifically, the hydrogen concentration measured by SIMS in the channel formation region of the oxide semiconductor is 1×10 20 atoms / cm 3 Less than 5 x 10 19 atoms / cm 3 less than 1×10 19 atoms / cm 3 less than 5×10 18 atoms / cm 3 less than 1×10 18 atoms / cm 3 Make it less than.

[0150] When an oxide semiconductor in which impurities are sufficiently reduced is used for a channel formation region of a transistor, stable electrical characteristics can be obtained.

[0151] [Other semiconductor materials] The semiconductor material that can be used for the semiconductor 125 and the semiconductor 127 is not limited to the above-mentioned oxide semiconductors. A semiconductor material having a band gap (a semiconductor material that is not a zero-gap semiconductor) may be used for the semiconductor 125 and the semiconductor 127. For example, a semiconductor of a single element such as silicon, a compound semiconductor such as gallium arsenide, a layered material that functions as a semiconductor (also referred to as an atomic layer material, a two-dimensional material, or the like) may be used for the semiconductor material. In particular, it is preferable to use a layered material that functions as a semiconductor for the semiconductor material.

[0152] In this specification, the layered material is a general term for a group of materials having a layered crystal structure. The layered crystal structure is a structure in which layers formed by covalent bonds or ionic bonds are stacked via bonds weaker than covalent bonds or ionic bonds, such as van der Waals forces. The layered material has high electrical conductivity within a unit layer, that is, high two-dimensional electrical conductivity. By using a material that functions as a semiconductor and has high two-dimensional electrical conductivity in the channel formation region, a transistor with a large on-current can be provided.

[0153] Layered materials include graphene, silicene, and chalcogenides. Chalcogenides are compounds that contain chalcogen. Chalcogen is a general term for elements in group 16, including oxygen, sulfur, selenium, tellurium, polonium, and livermorium. Chalcogenides include transition metal chalcogenides and group 13 chalcogenides.

[0154] It is preferable to use, for example, a transition metal chalcogenide that functions as a semiconductor as the semiconductor 125 and the semiconductor 127. Specifically, molybdenum sulfide (representatively, MoS 2 ), molybdenum selenide (represented by MoSe 2 ), molybdenum tellurium (represented by MoTe 2 ), tungsten sulfide (represented by WS 2 ), tungsten selenide (represented by WSe 2 ), tungsten tellurium (represented by WTe 2 ), hafnium sulfide (represented by HfS 2 ), hafnium selenide (represented by HfSe 2 ), zirconium sulfide (typically ZrS 2 ), zirconium selenide (represented by ZrSe 2 ) etc.

[0155] <Example of how to make a memory device> Next, an example of a method for manufacturing a memory device according to the present invention will be described with reference to FIGS. 12A to 28C. In each of FIGS. 12A to 28C, A is a top view seen from the Z direction, and B is a cross-sectional view of a portion indicated by a dashed line A1-A2 in A. In each of FIGS. 12A to 28C, C is a cross-sectional view of a portion indicated by a dashed line A3-A4 in A. In addition, FIG. 19D is a cross-sectional view of an enlarged portion surrounded by a dashed line in FIG. 19B. In this manufacturing method, one memory string 120 having two (also called "two stages") memory elements MC is illustrated, but this embodiment is not limited to this. The memory string 120 may have three or more stages of memory elements MC. For example, it is preferable that the memory string 120 has 32 or more stages, preferably 64 or more stages, more preferably 128 or more stages, and even more preferably 256 or more stages of memory elements MC.

[0156] First, a conductor 122 is formed on a base 121 having an insulating surface, and an insulator 132 is formed around the conductor 122 (see FIGS. 12A to 12C).

[0157] First, a conductive film is formed and processed by using a lithography method to form the conductor 122. Next, an insulating film is formed on the base 121 so as to cover the conductor 122. Next, it is preferable to perform a planarization treatment on the insulating film. In the planarization treatment, it is preferable to polish the insulating film until the surface of the conductor 122 is exposed. The insulator 132 can be formed by the above method, but the method of forming the conductor 122 and the insulator 132 is not limited to this. The insulator 132 may be formed on the base 121, and unnecessary parts of the insulator 132 may be removed to form grooves or openings, and the conductor 122 may be formed to be embedded in the grooves or openings. Such a method of forming a conductor may be called a damascene method (single damascene method, dual damascene method). By the above method, the structure of the conductor 122 and the insulator 132 shown in Figures 12A to 12C can be obtained.

[0158] The conductor 122 and the insulator 132 can be formed by using a sputtering method, a CVD method, a molecular beam epitaxy (MBE) method, a pulsed laser deposition (PLD) method, an ALD method, or the like.

[0159] CVD methods can be classified into plasma enhanced CVD (PECVD), which uses plasma, thermal CVD (TCVD), which uses heat, photo CVD (Photo CVD), etc. They can also be further divided into metal CVD (MCVD) and metal organic CVD (MOCVD), depending on the source gas used.

[0160] The plasma CVD method can obtain a high-quality film at a relatively low temperature. Moreover, the thermal CVD method is a film formation method that can reduce plasma damage to the object to be processed because it does not use plasma. For example, wiring, electrodes, elements (transistors, capacitive elements, etc.) included in a semiconductor device may be charged up by receiving electric charge from plasma. At this time, the wiring, electrodes, elements, etc. included in the semiconductor device may be destroyed by the accumulated electric charge. On the other hand, in the case of the thermal CVD method that does not use plasma, such plasma damage does not occur, so the yield of the semiconductor device can be increased. Furthermore, in the thermal CVD method, plasma damage does not occur during film formation, so a film with few defects can be obtained.

[0161] The ALD method is also a film formation method that can reduce plasma damage to the workpiece. Also, since the ALD method does not cause plasma damage during film formation, films with fewer defects can be obtained.

[0162] The CVD method and the ALD method are different from the film formation method in which particles emitted from a target or the like are deposited, and are film formation methods in which a film is formed by a reaction on the surface of a workpiece. Therefore, they are film formation methods that are not easily affected by the shape of the workpiece and have good step coverage. In particular, the ALD method has excellent step coverage and excellent thickness uniformity, so it is suitable for coating the surface of an opening with a high aspect ratio. However, since the ALD method has a relatively slow film formation speed, it may be preferable to use it in combination with other film formation methods such as the CVD method, which has a fast film formation speed.

[0163] In the CVD method and the ALD method, the composition of the film obtained can be controlled by the flow rate ratio of the raw material gases. For example, in the CVD method and the ALD method, a film of any composition can be formed by changing the flow rate ratio of the raw material gases. In addition, for example, in the CVD method and the ALD method, a film whose composition changes continuously can be formed by changing the flow rate ratio of the raw material gases while forming the film. When forming a film while changing the flow rate ratio of the raw material gases, the time required for film formation can be shortened by the time required for transportation and pressure adjustment compared to the case of forming a film using multiple film formation chambers. Therefore, the productivity of semiconductor devices can be increased in some cases.

[0164] In the lithography method, first, the resist is exposed through a photomask. Next, the exposed area is removed or left using a developer to form a resist mask. Next, a conductor, a semiconductor, an insulator, or the like can be processed into a desired shape by etching through the resist mask. For example, a resist mask may be formed by exposing the resist using KrF excimer laser light, ArF excimer laser light, EUV (Extreme Ultraviolet) light, or the like. Also, a liquid immersion technique may be used in which a liquid (e.g., water) is filled between the substrate and the projection lens and exposure is performed. Also, an electron beam or an ion beam may be used instead of the light described above. Note that when an electron beam or an ion beam is used, a photomask is not required. Note that, to remove the resist mask, a dry etching process such as ashing may be performed, a wet etching process may be performed, a wet etching process may be performed after the dry etching process, or a dry etching process may be performed after the wet etching process.

[0165] Instead of the resist mask, a hard mask made of an insulator or a conductor may be used. In the case of using a hard mask, an insulating film or a conductive film that serves as a hard mask material is formed on a conductive film, a resist mask is formed thereon, and the hard mask material is etched to form a hard mask having a desired shape.

[0166] This processing can be performed by dry etching or wet etching, and the dry etching method is suitable for fine processing.

[0167] As the dry etching apparatus, a capacitively coupled plasma (CCP) etching apparatus having parallel plate electrodes can be used. The capacitively coupled plasma etching apparatus having parallel plate electrodes can be configured to apply a high frequency power supply to one of the parallel plate electrodes. Alternatively, it can be configured to apply a plurality of different high frequency power supplies to one of the parallel plate electrodes. Alternatively, it can be configured to apply a high frequency power supply of the same frequency to each of the parallel plate electrodes. Alternatively, it can be configured to apply a high frequency power supply of different frequencies to each of the parallel plate electrodes. Alternatively, a dry etching apparatus having a high density plasma source can be used. As the dry etching apparatus having a high density plasma source, for example, an inductively coupled plasma (ICP) etching apparatus or the like can be used.

[0168] When a hard mask is used for etching the conductive film, the etching process may be performed after removing the resist mask used for forming the hard mask, or may be performed while leaving the resist mask. In the latter case, the resist mask may disappear during etching. The hard mask may be removed by etching after etching the conductive film. On the other hand, if the material of the hard mask does not affect a later process or can be used in a later process, it is not necessarily required to remove the hard mask.

[0169] The conductive film to be the conductor 122 is preferably formed by a sputtering method, and may contain a metal element. Alternatively, the conductive film can be formed by a CVD method.

[0170] If necessary, the surface of the insulator 132 is preferably subjected to planarization processing, which may be performed by chemical mechanical polishing (CMP) or reflow processing.

[0171] An insulating film 123A, a conductive film 134A, and a conductive film 136A are alternately stacked over the conductor 122 and the insulator 132. In this embodiment, an example is shown in which the insulating film 123A is formed over the insulator 132, the conductive film 134A is formed over the insulating film 123A, the insulating film 123A is formed over the conductive film 134A, and the conductive film 136A is formed over the insulating film 123A (see FIGS. 12A to 12C). The conductive film 134A, the conductive film 136A, and the insulating film 123A can be formed by a CVD method. Alternatively, a sputtering method may be used.

[0172] The conductor 122, the conductive film 134A, and the conductive film 136A can be made of a conductive material such as silicon to which an impurity is added or a metal. The conductive film 136A is preferably made of a material different from that of the conductor 122 and the conductive film 134A because selective etching needs to be performed on the conductor 122 and the conductive film 134A in a later step. On the other hand, the conductor 122 and the conductive film 134A may be made of the same material or different materials. When silicon is used as the conductor 122, the conductive film 134A, or the conductive film 136A, amorphous silicon or polysilicon can be used. In addition, in order to impart conductivity to silicon, p-type impurities or n-type impurities may be added. As a conductive material containing silicon, silicide containing titanium, cobalt, or nickel can be used as the conductor 122, the conductive film 134A, or the conductive film 136A. Furthermore, when a metal material is used for the conductor 122, the conductive film 134A, or the conductive film 136A, a material containing one or more metal elements selected from aluminum, chromium, copper, silver, gold, platinum, tantalum, nickel, titanium, molybdenum, tungsten, hafnium, vanadium, niobium, manganese, magnesium, zirconium, beryllium, indium, ruthenium, etc. can be used.

[0173] An insulating oxide, nitride, oxynitride, nitride oxide, metal oxide, metal oxynitride, metal nitride oxide, or the like can be used as the insulator 132 and the insulating film 123A. Silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, silicon oxide to which fluorine is added, silicon oxide to which carbon is added, silicon oxide to which carbon and nitrogen are added, silicon oxide or resin having voids, aluminum oxide, gallium oxide, hafnium oxide, zirconium oxide, oxide having aluminum and hafnium, oxynitride having aluminum and hafnium, oxide having silicon and hafnium, oxynitride having silicon and hafnium, nitride having silicon and hafnium, or the like can be used.

[0174] In addition, in the present embodiment, an example in which six insulating films 123A, three conductive films 134A, and two conductive films 136A are formed is shown, but the number of layers is not limited to this. They can be formed according to the required performance of the semiconductor device. Here, if the number of layers of the conductive films 134A is m (m is an integer of 2 or more), the number of layers of the insulating films 123A is 2×m, and the number of layers of the conductive films 136A is m-1. For example, m can be 33 or more, preferably 65 or more, more preferably 129 or more, and even more preferably 257 or more.

[0175] Next, a mask (not shown) is formed over the insulating film 123A, and the insulating film 123A, the conductive film 134A, and the conductive film 136A are processed using lithography to form a first opening to expose the conductor 122 (see Figures 13A to 13C).

[0176] Next, the conductive film 136A is isotropically etched to set the side surface of the conductive film 136A in the first opening back from the side surfaces of the insulating film 123A and the conductive film 134A (see FIGS. 14A to 14C). This process makes the diameter of the first opening overlapping the conductive film 136A larger than the diameter of the first opening overlapping the insulating film 123A and the diameter of the first opening overlapping the conductive film 134A. Thus, unevenness is formed on the side surface of the first opening. For such processing, isotropic etching by dry etching using gas, radicals, plasma, or the like, or isotropic etching by wet etching using a liquid can be used. The liquid used for wet etching is sometimes called an etchant. When isotropic etching is performed using dry etching, gas, radicals, plasma, or the like containing at least one of chlorine, bromine, and fluorine can be used. It is preferable to perform isotropic etching without removing the mask used to form the first opening. The first opening obtained by the above process corresponds to the opening 141 shown in FIG. 4.

[0177] Next, the insulating film 124A is formed on the insulating film 123A and inside the first opening (see FIGS. 15A to 15C). Although the insulating film 124A has a single-layer structure in FIGS. 15B and 15C, it may have a multilayer structure. The insulating film 124A can be formed by using a CVD method or an ALD method. In particular, the ALD method is preferable because it allows a film with a uniform thickness to be formed even in a groove or an opening with a large aspect ratio. Alternatively, the insulating film 124A may be formed by combining the ALD method and the CVD method. When the insulating film 124A has a multilayer structure, each insulating film may be formed by the same film formation apparatus or different film formation apparatuses.

[0178] The insulating film 124A formed by the above method has good coverage and can be formed even on the uneven shape of the side surface of the first opening. That is, the insulating film 124A can be formed so as to contact not only the side surfaces of the insulating film 123A, the conductive film 134A, and the conductive film 136A, but also part of the upper surface and part of the lower surface of the insulating film 123A.

[0179] Next, the insulating film 124A formed on the bottom of the first opening is removed to obtain the insulator 124. It is preferable to use anisotropic etching to remove the insulating film 124A. At this time, the insulating film 124A on the insulating film 123A is also removed, so that the insulator 124 is provided only on the sidewall of the first opening (see FIGS. 16A to 16C). By removing the insulating film 124A on the bottom of the first opening, the conductor 122 is exposed again.

[0180] Next, a semiconductor film 125A, an insulating film 126A, and a semiconductor film 127A are formed inside the first opening (see FIGS. 17A to 17C).

[0181] The semiconductor film 125A, the insulating film 126A, and the semiconductor film 127A can be formed by using a CVD method or an ALD method. In particular, the ALD method is preferable because it allows a film of uniform thickness to be formed even in a groove or an opening with a large aspect ratio. Alternatively, the semiconductor film 125A, the insulating film 126A, and the semiconductor film 127A may be formed by combining the ALD method and the CVD method. Also, different film formation methods and film formation devices may be used for each film to be formed. For example, it is preferable to use the MOCVD method for forming the semiconductor film 125A and the semiconductor film 127A.

[0182] Next, a conductive film 128A is formed inside the first opening (see FIGS. 17A to 17C). The conductive film 128A is only required to be formed so as to fill the recesses of the conductive film 136A via at least the insulator 124, the semiconductor film 125A, the insulating film 126A, and the semiconductor film 127A, and does not necessarily need to fill the entire inside of the first opening. The conductive film 128A can be formed using a CVD method or an ALD method. In particular, the ALD method is preferable because it allows a film of uniform thickness to be formed even in grooves or openings with a large aspect ratio. Alternatively, the conductive film 128A may be formed by combining the ALD method and the CVD method.

[0183] The semiconductor film 125A and the semiconductor film 127A are preferably oxide semiconductors having a CAAC structure. When the semiconductor film 125A and the semiconductor film 127A are oxide semiconductors having a CAAC structure, the c-axis of the semiconductor film 125A is oriented in the normal direction of the formation surface inside the first opening. At this time, the c-axes of the semiconductor film 125A and the semiconductor film 127A located on the side surfaces of the insulating film 123A, the conductive film 134A, and the conductive film 136A through the insulator 124 are oriented from the formation surface toward the axis 182 shown in FIGS. 17A to 17C. The axis 182 can be called the central axis of the first opening. As a result, the c-axes of the semiconductor 125 and the semiconductor 127 located above are oriented from the formation surface toward the axis 182.

[0184] Next, the conductive film 128A is processed to form the conductor 128 (see FIGS. 18A to 18C). The conductive film 128A can be processed by isotropic etching or anisotropic etching. In forming the conductive film 128A, if the conductive film 128A fills the recess and the first opening is not completely filled as shown in FIGS. 17A to 17C, it is preferable to use isotropic etching to process the conductive film 128A. On the other hand, if the conductive film 128A is formed so as to fill the recess and the first opening, it is preferable to use anisotropic etching. By the above-mentioned processing, the conductor 128 can be formed inside the recess.

[0185] Next, an insulating film 129A is formed on the semiconductor film 127A and inside the conductor 128. Then, a part of the semiconductor film 127A is made high-resistance by using the conductor 128 as a mask to form a high-resistance region (I-type region). The high-resistance region may be formed by irradiating the semiconductor film 127A with microwaves 144 through the insulating film 129A to remove hydrogen contained in the semiconductor film 127A. Moreover, it is preferable to irradiate the semiconductor film 127A with microwaves 144 in an atmosphere containing oxygen, because oxygen is supplied to the semiconductor film 127A. In this embodiment, a part of the semiconductor film 127A is irradiated with microwaves 144 through the insulating film 129A in an atmosphere containing oxygen and argon to make a region 146 of the semiconductor film 127A high-resistance (see FIGS. 19A to 19D).

[0186] Here, a heat treatment may be performed. The heat treatment is preferably performed in an atmosphere containing nitrogen at a temperature of 200° C. to 500° C., preferably 300° C. to 400° C. The atmosphere in which the heat treatment is performed is not limited to the above, and may be an atmosphere containing at least one of nitrogen, oxygen, and argon. The heat treatment may be performed in a reduced pressure atmosphere or an atmospheric pressure atmosphere.

[0187] The heat treatment reduces the resistance of the semiconductor film 127A in contact with the conductor 128, and a low-resistance region (n-type region) can be formed in the region 148. When the heat treatment is performed while the semiconductor film 127A and the conductor 128 are in contact with each other, a metal compound layer containing a metal element contained in the conductor 128 and a component of the semiconductor film 127A may be formed at the interface between the conductor 128 and the semiconductor film 127A. The formation of the metal compound layer is preferable because it reduces the resistance of the semiconductor film 127A in the region in contact with the conductor 128. Furthermore, the conductor 128 may absorb oxygen contained in the semiconductor film 127A. When the heat treatment is performed while the semiconductor film 127A and the conductor 128 are in contact with each other, the resistance of the semiconductor film 127A becomes lower. The heat treatment may be performed before the microwave treatment. The region 148 whose resistance has been reduced by the heat treatment is covered with the conductor 128 and is therefore not affected by the microwaves 144, and is therefore able to maintain a low resistance value even after the microwave treatment.

[0188] The carrier concentration of the region 146 after the microwave treatment and heat treatment is 1×10 18 / cm 3 Less than 1 x 10 17 / cm 3 Less than or equal to 1×10 16 / cm 3 The carrier concentration of the region 148 is preferably 1×10 18 / cm 3 More than 1×10 19 / cm 3 More preferably, 1×10 20 / cm 3 More preferably, it is equal to or greater than this.

[0189] Next, the conductive film 130A is formed (see FIGS. 20A to 20C). The conductive film 130A can be formed by using a CVD method or an ALD method. In particular, the ALD method is preferable because it allows a film with a uniform thickness to be formed even in grooves or openings with a large aspect ratio. Alternatively, the conductive film 130A may be formed by combining the ALD method and the CVD method.

[0190] Next, a heat treatment is performed. The heat treatment is preferably performed in a nitrogen-containing atmosphere at a temperature of 200° C. to 500° C., preferably 300° C. to 400° C. The atmosphere in which the heat treatment is performed is not limited to the above, and the heat treatment may be performed in an atmosphere containing at least one of nitrogen, oxygen, and argon. The heat treatment may be performed in a reduced pressure atmosphere or an atmospheric pressure atmosphere.

[0191] Next, the conductive film 130A is removed by CMP or the like until the surface of the insulating film 129A is exposed, thereby obtaining the conductor 130 (see FIGS. 21A to 21C). Note that the above-described heat treatment may be performed after the conductor 130 is formed.

[0192] Next, the semiconductor film 125A, the insulating film 126A, the semiconductor film 127A, and the insulating film 129A are processed to obtain the semiconductor 125, the insulator 126, the oxide film 127B, and the insulating film 129B (see FIGS. 22A to 22C). Dry etching or wet etching can be used for this processing.

[0193] Next, the insulating film 123A, the conductive film 134A, and the conductive film 136A are processed to form a stepped insulator 123B, a conductor 134B, and a conductor 136B as shown in Fig. 23B (see Figs. 23A to 23C). In processing the insulating film 123A, the conductive film 134A, and the conductive film 136A, etching of the insulating film 123A, the conductive film 134A, and the conductive film 136A and slimming of a mask are alternately performed, whereby the stepped insulator 123B, the conductor 134B, and the conductor 136B can be formed.

[0194] Next, the insulator 150 is formed (see FIGS. 23A to 23C). The insulator 150 can be formed by using a CVD method. The insulator 150 is preferably subjected to planarization treatment by using a CMP method or a reflow method.

[0195] Next, the insulator 150, the insulator 123B, the conductor 134B, and the conductor 136B are processed to obtain the insulator 123, the conductor 134, and the conductor 136. (See FIGS. 24A to 24C.)

[0196] Next, an insulator 152 is formed so as to fill in the portion removed by the above processing (see FIGS. 24A to 24C). The insulator 152 can be formed using a CVD method or an ALD method. In particular, the ALD method is preferable because it allows a film of uniform thickness to be formed even in grooves and openings with a large aspect ratio. Alternatively, the insulator 152 may be formed by combining the ALD method and the CVD method. The insulator 152 is preferably planarized using a CMP method or a reflow method.

[0197] Next, the oxide film 127B and the insulating film 129B are processed by lithography to obtain the semiconductor 127 and the insulator 129 (see FIGS. 25A to 25C). The processing can be performed by dry etching or wet etching.

[0198] Next, the conductor 154 is formed so as to overlap with a part of the semiconductor 125 with the insulator 126 interposed therebetween (see FIGS. 26A to 26C). The conductor 154 is obtained by forming a conductive film over the insulators 126, 150, and 152, and processing the conductive film by a lithography method. Note that in FIG. 26A, the conductor 154 does not exist on the dashed dotted line A1-A2, but in FIG. 26B, the conductor 154 is illustrated by the dashed dotted line.

[0199] Next, the insulator 156 is formed to cover the conductor 154, the insulator 126, the insulator 150, and the insulator 152 (see FIGS. 27A to 27C). The insulator 156 can be formed by using a CVD method, an ALD method, a sputtering method, or the like.

[0200] Next, the insulator 156, the insulator 126, the insulator 129, the semiconductor 127, and the insulator 150 are processed using a lithography method to form second openings so as to expose the conductor 134, the conductor 136, the conductor 130, the conductor 154, and the semiconductor 125. The second openings are formed for the conductor 134 and the conductor 136, which are formed in a stepped shape (see FIGS. 27A to 27C).

[0201] Next, conductors 161 electrically connected to conductor 134, conductors 162 electrically connected to conductor 136, conductors 163 electrically connected to conductor 130, conductors 164 electrically connected to conductor 154, conductors 165 electrically connected to semiconductor 125, and conductors 166 electrically connecting semiconductor 125 and semiconductor 127 are formed (see FIGS. 28A to 28C). Conductors 161, 162, 163, 164, 165, and 166 can be formed using a CVD method or an ALD method. In particular, by using the ALD method, a film with a uniform thickness can be formed even for grooves and openings with a large aspect ratio, which is preferable. Alternatively, the above conductors may be formed by combining the ALD method and the CVD method. Also, conductors 161, 162, 163, 164, 165, and 166 may have a laminated structure composed of a plurality of layers. Conductors 161, 162, 163, 164, 165, and 166 can be formed by forming a conductive film on insulator 156 and inside the second opening, and removing the unnecessary conductive film using CMP or the like.

[0202] Next, conductors 171 electrically connected to conductor 161, conductors 172 electrically connected to conductor 162, conductors 173 electrically connected to conductor 163, conductors 174 electrically connected to conductor 164, and conductors 175 electrically connected to conductor 165 are formed (see FIGS. 28A to 28C). Conductors 171, 172, 173, 174, and 175 can be formed by forming a conductive film on insulator 156 and processing it using a lithography method. The processing can use a dry etching method or a wet etching method.

[0203] Conductor 171, conductor 161, and conductor 134 function as conductor SG or conductor WWL. Conductor 172, conductor 162, and conductor 136 function as conductor RWL. Conductor 173, conductor 163, and conductor 130 function as conductor BG. Conductor 174, conductor 164, and conductor 154 function as conductor SEL. Conductor 175 and conductor 165 function as BL. A memory device can be manufactured by the above process.

[0204] (Embodiment 2) In this embodiment, a memory device 100A which is a modified example of the memory device 100 shown in the first embodiment will be described. Fig. 29 shows a perspective view of the memory device 100A according to one aspect of the present invention. Fig. 30 is a cross-sectional view of a portion A1-A2 shown by a dashed line in Fig. 29. Note that other embodiments may be referred to for matters not described in this embodiment.

[0205] <Storage device configuration example> The memory device 100A has a memory string 120s. The memory string 120s differs from the memory string 120 in the configuration of the transistor STr2. FIG. 31 shows an example of a cross-sectional configuration of the memory string 120s. In the memory string 120s, a conductor SEL that functions as a gate electrode of the transistor STr2 is provided on the insulator 123

[12] . Also, an insulator 138 is provided on the conductor SEL. A part of the conductor 130 functions as a backgate electrode of the transistor STr2.

[0206] <Example of how to make a memory device> Next, another example of a method for manufacturing the memory device 100A will be described with reference to FIGS. 32A to 50C. In each of FIGS. 32A to 50C, A is a top view seen from the Z direction, and B is a cross-sectional view of a portion indicated by a dashed line A1-A2 in A. Also, C is a cross-sectional view of a portion indicated by a dashed line A3-A4 in A. Also, FIG. 43D is a cross-sectional view of an enlarged portion surrounded by a dashed line in FIG. 43B. In this manufacturing method, one memory string 120s having two stages of memory elements MC is illustrated, but this embodiment is not limited to this. The memory string 120s may have three or more stages of memory elements MC. For example, it is preferable that the memory string 120s has 32 or more stages, preferably 64 or more stages, more preferably 128 or more stages, and even more preferably 256 or more stages of memory elements MC.

[0207] First, similarly to the example of the method for manufacturing the memory device 100, a conductor 122, an insulator 132, an insulating film 123A, a conductive film 134A, and a conductive film 136A are formed over a base 121 having an insulating surface (see FIGS. 32A to 32C).

[0208] Next, a conductive film 137A is formed on the uppermost insulating film 123A, and an insulating film 138A is formed on the conductive film 137A. The conductive film 137A can be formed of the same material as the conductive film 134A by using a similar method. The insulating film 138A can be formed of the same material as the insulating film 123A by using a similar method.

[0209] Next, a mask (not shown) is formed on the insulating film 138A, and the insulating film 138A, the conductive film 137A, the insulating film 123A, the conductive film 134A, and the conductive film 136A are processed using lithography to form a first opening to expose the conductor 122 (see Figures 33A to 33C).

[0210] Next, the conductive film 136A is isotropically etched to set the side surface of the conductive film 136A in the first opening back from the side surfaces of the insulating film 123A, the conductive film 134A, the conductive film 137A, and the insulating film 138A (see FIGS. 34A to 34C). This process makes the diameter of the first opening overlapping the conductive film 136A larger than the diameters of the first openings overlapping the insulating film 123A, the conductive film 134A, the conductive film 137A, and the insulating film 138A. As a result, unevenness is formed on the side surface of the first opening.

[0211] Next, the insulating film 124A is formed on the insulating film 138A and inside the first opening (see FIGS. 35A to 35C). Although the insulating film 124A has a single-layer structure in FIGS. 35B and 35C, it may have a multilayer structure. The insulating film 124A can be formed by using a CVD method or an ALD method. In particular, the ALD method is preferable because it allows a film of uniform thickness to be formed even in a groove or an opening with a large aspect ratio. Alternatively, the insulating film 124A may be formed by combining the ALD method and the CVD method. When the insulating film 124A has a multilayer structure, each insulating film may be formed by the same film formation apparatus or different film formation apparatuses.

[0212] The insulating film 124A formed by the above method has good coverage and can be formed even on the uneven shape of the side surface of the first opening. That is, the insulating film 124A can be formed so as to contact not only the side surfaces of the insulating film 123A, the conductive film 134A, and the conductive film 136A, but also part of the upper surface and part of the lower surface of the insulating film 123A.

[0213] Next, the insulating film 124A formed on the bottom of the first opening is removed to obtain the insulator 124. It is preferable to use anisotropic etching to remove the insulating film 124A. At this time, the insulating film 124A on the insulating film 138A is also removed, so that the insulator 124 is provided only on the sidewall of the first opening (see FIGS. 36A to 36C). By removing the insulating film 124A on the bottom of the first opening, the conductor 122 is exposed again.

[0214] Next, a semiconductor film 125A and an insulating film 126A are formed inside the first opening (see FIGS. 37A to 37C).

[0215] The semiconductor film 125A and the insulating film 126A can be formed by using a CVD method or an ALD method. In particular, the ALD method is preferable because it allows a film of uniform thickness to be formed even in a groove or an opening with a large aspect ratio. Alternatively, the semiconductor film 125A and the insulating film 126A may be formed by combining the ALD method and the CVD method. Also, different film formation methods and film formation devices may be used for each film to be formed.

[0216] The semiconductor film 125A is preferably an oxide semiconductor having a CAAC structure. When the semiconductor film 125A is an oxide semiconductor having a CAAC structure, the c-axis of the semiconductor film 125A is oriented in the normal direction of the formation surface inside the first opening. At this time, the c-axis of the semiconductor film 125A located on the side surfaces of the insulating film 138A, the conductive film 137A, the insulating film 123A, the conductive film 134A, and the conductive film 136A through the insulator 124 is oriented toward the axis 182 shown in Figures 37A to 37C. As a result, the c-axis of the semiconductor 125 located above is oriented from the formation surface toward the axis 182.

[0217] Next, the region of the insulating film 126A and the semiconductor film 125A overlapping with the conductive film 137A when viewed from the Z direction is removed. To remove the insulating film 126A and the semiconductor film 125A in the region, first, a material 180 (also called a sacrificial layer) that can be easily removed in a later process is formed so as to be embedded inside the first opening, and a part of the material 180 is removed by etching or the like to a desired depth inside the first opening (see Figs. 38A to 38C). Next, the remaining material 180 is used as a mask to sequentially remove the insulating film 126A and the semiconductor film 125A exposed by the etching, thereby obtaining the insulator 126 and the semiconductor 125 (see Figs. 39A to 39C). After that, the material 180 is removed (see Figs. 40A to 40C).

[0218] When the transistor STr2 can be formed in the region without removing a part of the insulating film 126A and the semiconductor film 125A, the process of removing the insulating film 126A and the semiconductor film 125A using the material 180 can be omitted. At this time, the transistor STr2 is formed in which the insulator 124 and the semiconductor 125 are provided between the conductor 137 and the semiconductor 127 with the insulator 126 interposed therebetween.

[0219] Next, a semiconductor film 127A and a conductive film 128A are formed inside the first opening (see FIGS. 41A to 41C).

[0220] First, the semiconductor film 127A is formed. The semiconductor film 127A can be formed by using a CVD method or an ALD method. In particular, the ALD method is preferable because it allows a film with a uniform thickness to be formed even in a groove or an opening with a large aspect ratio. Alternatively, the semiconductor film 127A may be formed by combining the ALD method and the CVD method.

[0221] The semiconductor film 127A is preferably an oxide semiconductor having a CAAC structure. When the semiconductor film 127A is an oxide semiconductor having a CAAC structure, the c-axis of the semiconductor film 127A is oriented in the normal direction of the formation surface inside the first opening. At this time, the c-axis of the semiconductor film 127A located on the side surfaces of the insulating film 138A, the conductive film 137A, the insulating film 123A, the conductive film 134A, and the conductive film 136A via the insulator 124, the semiconductor 125, the insulator 126, etc. is oriented from the formation surface toward the axis 182 shown in Figures 41A to 41C. As a result, the c-axis of the semiconductor 127 located above is oriented from the formation surface toward the axis 182.

[0222] Next, the conductive film 128A is formed (see FIGS. 41A to 41C). The conductive film 128A is only required to be formed so as to fill the recesses of the conductive film 136A via at least the insulator 124, the semiconductor film 125, the insulating film 126, and the semiconductor film 127A, and does not necessarily need to fill the entire inside of the second opening. The conductive film 128A can be formed by using a CVD method or an ALD method. In particular, the ALD method is preferable because it allows a film with a uniform thickness to be formed even in grooves or openings with a large aspect ratio. Alternatively, the conductive film 128A may be formed by combining the ALD method and the CVD method.

[0223] Next, the conductive film 128A is processed to form the conductor 128 (see Figs. 42A to 42C). The conductive film 128A can be processed by isotropic etching or anisotropic etching. In the formation of the conductive film 128A, if the conductive film 128A fills the recesses and does not completely fill the openings as shown in Figs. 41A to 41C, it is preferable to use isotropic etching to process the conductive film 128A. On the other hand, if the conductive film 128A is formed so as to fill the recesses and the openings, it is preferable to use anisotropic etching. By the above-mentioned processing, the conductor 128 can be formed inside the recesses.

[0224] Next, a part of the semiconductor film 127A is made to have high resistance by using the conductor 128 as a mask, to form a high resistance region (I-type region). The high resistance region may be formed by irradiating the semiconductor film 127A with microwaves 144 to remove hydrogen contained in the semiconductor film 127A. Moreover, irradiation with microwaves 144 in an atmosphere containing oxygen is preferable because oxygen is supplied to the semiconductor film 127A. In this embodiment, a part of the semiconductor film 127A is irradiated with microwaves 144 in an atmosphere containing oxygen and argon, to make a region (region 146) of the semiconductor film 127A that does not overlap with the conductor 128 high resistance (see FIGS. 43A to 43D).

[0225] Here, a heat treatment may be performed. The heat treatment is preferably performed in an atmosphere containing nitrogen at a temperature of 200° C. to 500° C., preferably 300° C. to 400° C. The atmosphere in which the heat treatment is performed is not limited to the above, and may be an atmosphere containing at least one of nitrogen, oxygen, and argon. The heat treatment may be performed in a reduced pressure atmosphere or an atmospheric pressure atmosphere.

[0226] Heat treatment reduces the resistance of a region (region 148) of the semiconductor film 127A in contact with the conductor 128, and a low-resistance region (n-type region) can be formed. When heat treatment is performed while the semiconductor film 127A and the conductor 128 are in contact with each other, a metal compound layer containing a metal element contained in the conductor 128 and a component of the semiconductor film 127A may be formed at the interface between the conductor 128 and the semiconductor film 127A. The formation of the metal compound layer is preferable because it reduces the resistance of the semiconductor film 127A in the region where the conductor 128 and the semiconductor film 127A are in contact with each other. In addition, the conductor 128 may absorb oxygen contained in the semiconductor film 127A. When heat treatment is performed while the semiconductor film 127A and the conductor 128 are in contact with each other, the resistance of the region 148 of the semiconductor film 127A becomes lower. The heat treatment may be performed before the microwave treatment. The region 148 whose resistance has been reduced by the heat treatment is covered with the conductor 128 and is therefore not affected by the microwaves 144, and is therefore able to maintain a low resistance value even after the microwave treatment.

[0227] The carrier concentration of the region 146 after the microwave treatment and heat treatment is 1×10 18 / cm 3 Less than 1 x 10 17 / cm 3 Less than or equal to 1×10 16 / cm 3 The carrier concentration of the region 148 is preferably 1×10 18 / cm 3 More than 1×10 19 / cm 3 More preferably, 1×10 20 / cm 3 More preferably, it is equal to or greater than this.

[0228] Next, an insulating film 129A covering the semiconductor film 127A and the conductor 128 is formed, and a conductive film 130A covering the insulating film 129A is formed (see FIGS. 44A to 44C). The insulating film 129A and the conductive film 130A can be formed using a CVD method or an ALD method. In particular, by using the ALD method, a film with a uniform thickness can be formed even for grooves and openings with a large aspect ratio, which is preferable. Alternatively, they may be formed by combining the ALD method and the CVD method.

[0229] Note that the formation of the high-resistance region by the microwave treatment and the heat treatment may be performed after the formation of the insulating film 129A and before the formation of the conductive film 130A.

[0230] Next, a heat treatment is performed. The heat treatment is preferably performed in an atmosphere containing nitrogen at 200°C or higher and 500°C or lower, more preferably 300°C or higher and 400°C or lower. The atmosphere for performing the heat treatment is not limited to the above, and may be an atmosphere containing at least one of nitrogen, oxygen, and argon. Also, the heat treatment may be performed in a reduced-pressure atmosphere or an atmospheric-pressure atmosphere.

[0231] Next, the conductive film 130A is removed using a CMP method or the like until the surface of the insulating film 129A is exposed to obtain a conductor 130 (see FIGS. 45A to 45C). Note that the above-described heat treatment may be performed after the formation of the conductor 130.

[0232] Next, the semiconductor film 127A and the insulating film 129A are processed to obtain a semiconductor 127 and an insulator 129 (see FIGS. 46A to 46C). This processing can use a dry etching method or a wet etching method. At this time, a semiconductor 127 that is electrically connected to the semiconductor 125 can be formed.

[0233] Next, the insulating film 138A, the conductive film 137A, the insulating film 123A, the conductive film 134A, and the conductive film 136A are processed to form a stepped insulator 138B, a conductor 137B, an insulator 123B, a conductor 134B, and a conductor 136B as shown in Fig. 47B (see Figs. 47A to 47C). In processing the insulating film 138A, the conductive film 137A, the insulating film 123A, the conductive film 134A, and the conductive film 136A, etching of the insulating film 138A, the conductive film 137A, the insulating film 123A, the conductive film 134A, and the conductive film 136A and slimming of a mask are alternately performed, thereby forming a stepped insulator 138B, a conductor 137B, an insulator 123B, a conductor 134B, and a conductor 136B.

[0234] Next, the insulator 150 is formed (see FIGS. 47A to 47C). The insulator 150 can be formed by using a CVD method. The insulator 150 is preferably subjected to planarization treatment by using a CMP method or a reflow method.

[0235] Next, the insulator 150, the insulator 138B, the conductor 137B, the insulator 123B, the conductor 134B, and the conductor 136B are processed to obtain the insulator 138, the conductor 137, the insulator 123, the conductor 134, and the conductor 136. (See FIGS. 48A to 48C.)

[0236] Next, the insulator 152 is formed so as to fill in the portion removed by the above processing (see Figs. 48A to 48C). The insulator 152 can be formed using a CVD method or an ALD method. In particular, the ALD method is preferable because it allows a film of uniform thickness to be formed even in grooves and openings with a large aspect ratio. Alternatively, the insulator 152 may be formed by combining the ALD method and the CVD method. The insulator 152 is preferably planarized using a CMP method or a reflow method.

[0237] Next, the insulator 156 is formed to cover the conductor 130, the insulator 129, the insulator 150, and the insulator 152 (see FIGS. 49A to 49C). The insulator 156 can be formed by using a CVD method, an ALD method, a sputtering method, or the like.

[0238] Next, the insulator 156, the insulator 150, the insulator 129, and the insulator 138 are processed using a lithography method to form second openings so as to expose the conductor 134, the conductor 136, the conductor 130, the conductor 137, and the semiconductor 127. The second openings are formed for the conductor 134 and the conductor 136, which are formed in a stepped shape (see FIGS. 49A to 49C).

[0239] Next, a conductor 161 electrically connected to the conductor 134, a conductor 162 electrically connected to the conductor 136, a conductor 163 electrically connected to the conductor 130, a conductor 164 electrically connected to the conductor 137, and a conductor 165 electrically connected to the semiconductor 127 are formed so as to be embedded in the second opening (see FIGS. 50A to 50C). The conductors 161, 162, 163, 164, and 165 can be formed by using a CVD method or an ALD method. In particular, the ALD method is preferable because a film with a uniform thickness can be formed even in a groove or an opening with a large aspect ratio. Alternatively, the conductors may be formed by combining the ALD method and the CVD method. The conductors 161, 162, 163, 164, and 165 may have a laminated structure consisting of a plurality of layers. Conductor 161, conductor 162, conductor 163, conductor 164, and conductor 165 can be formed by forming a conductive film on insulator 156 and inside the second opening, and removing unnecessary conductive film using CMP or the like.

[0240] Next, conductors 171 electrically connected to conductor 161, conductor 172 electrically connected to conductor 162, conductor 173 electrically connected to conductor 163, conductor 174 electrically connected to conductor 164, and conductor 175 electrically connected to conductor 165 are formed (see FIGS. 50A to 50C). Conductors 171, 172, 173, 174, and 175 can be formed by forming a conductive film on insulator 156 and processing it using a lithography method. The processing can use a dry etching method or a wet etching method.

[0241] Conductors 171, conductor 161, and conductor 134 function as conductor SG or conductor WWL. Conductors 172, conductor 162, and conductor 136 function as conductor RWL. Conductors 173, conductor 163, and conductor 130 function as conductor BG. Conductors 174, conductor 164, and conductor 137 function as conductor SEL. Conductors 175 and conductor 165 function as BL. Through the above steps, semiconductor device 200A can be manufactured.

[0242] This embodiment can be implemented in appropriate combination with the configurations described in other embodiments and the like.

[0243] (Embodiment 3) In this embodiment, an MOCVD apparatus that can be used for forming oxides and the like, and a film forming method using the MOCVD method will be described with reference to FIGS. 51 and 52.

[0244] <Film Forming Method Using MOCVD Apparatus and MOCVD Method> In the MOCVD method, a liquid raw material (also called a precursor or metal precursor) is vaporized using a vaporizer and introduced into a chamber to form a film. The liquid precursor is held in a cylinder 1041 (cylinders 1041A to 1041D) for each precursor. A gas 1042 is supplied into the cylinder 1041 holding the precursor to be used for film formation. As the gas 1042, an inert gas such as helium, argon, or nitrogen can be used. The supply of the gas 1042 can be controlled by a valve 1043, and the inside of a desired cylinder 1041 can be pressurized. By pressurizing the inside of the cylinder 1041, the liquid precursor can be supplied to the vaporizer 1044. The gas 1042 may be supplied to one cylinder 1041, or may be supplied to two or more cylinders 1041 at the same time. In addition, FIG. 51 shows an example in which four cylinders 1041 are connected to the MOCVD device, but this embodiment is not limited to this. There may be one or more cylinders 1041.

[0245] By forming a film using a plurality of precursors, films with different compositions can be formed. For example, a precursor containing indium is held in cylinder 1041A, a precursor containing gallium is held in cylinder 1041B, and a precursor containing zinc is held in cylinder 1041C, and a gas 1042 is simultaneously supplied to cylinders 1041A to 1041C, thereby forming a film containing indium, gallium, and zinc. In addition, as will be described in detail later, the vaporized precursor is mixed with a reactive gas containing oxygen and supplied to film formation chamber 1008 or 1009, thereby forming an oxide containing indium, gallium, and zinc on wafer 1012 held in film formation chamber 1008 or 1009.

[0246] The precursor supplied to the vaporizer 1044 is first supplied to the dispersion section 1045. When multiple types of precursors are used for film formation, these precursors are mixed in the dispersion section 1045. At this time, it is preferable that a gas 1046 is supplied to the dispersion section. The gas 1046 may be called a primary carrier gas. The gas 1046 is used to supply the precursor or the mixed precursor from the dispersion section 1045 to the vaporization section 1048. As the gas 1046, an inert gas such as helium, argon, or nitrogen can be used.

[0247] The precursor or the mixed precursor is heated and vaporized in a vaporizer 1048. The vaporized precursor is supplied to a valve 1049 by a gas 1047. The gas 1047 may be called a secondary carrier gas. An inert gas such as helium, argon, or nitrogen may be used as the gas 1047.

[0248] It is preferable to exhaust the vaporized precursor and the secondary carrier gas without supplying them to the deposition chamber 1008 or 1009 until the supply of the vaporized precursor and the secondary carrier gas becomes stable. At this time, the precursor and the secondary carrier gas can be exhausted by closing the valve 1049a and opening the valve 1049b.

[0249] When the supply of the vaporized precursor and the secondary carrier gas is stabilized, valve 1049a is opened and valve 1049b is closed. The precursor and the secondary carrier gas are supplied to film formation chamber 1008 or 1009, whereby a desired film can be formed on wafer 1012.

[0250] As described above, by exhausting the precursor before it becomes stable and the secondary carrier gas, it is possible to supply a desired amount of precursor or a desired mixture ratio of precursor to the film formation chamber 1008 or 1009. By exhausting the precursor before it becomes stable and the secondary carrier gas, it is possible to form a film of a desired quality or thickness on the wafer 1012. In addition, the uniformity of the formed film is improved, which is preferable.

[0251] Gas 1050 may be mixed with the precursor and secondary carrier gas that have passed through valve 1049a. It is preferable to use a reactive gas such as an oxidizing gas or a nitriding gas as the gas 1050. Oxygen, ozone, etc. may be used as the oxidizing gas. Nitrogen, nitrous oxide, nitrogen dioxide, ammonia, etc. may be used as the nitriding gas. The supply of gas 1050 may be controlled by a valve 1051. A mass flow controller or the like may be provided as appropriate to control the supply amount of gas 1050.

[0252] Here, the precursor vaporized by the vaporizer 1048 may be liquefied or solidified due to a temperature change. For example, solidification may generate powder of the components contained in the precursor. Therefore, it is preferable to heat the piping from the vaporizer 1048 to the deposition chamber 1008 or 1009, the deposition chamber 1008, the deposition chamber 1009, and the exhaust piping. It is preferable that the heating temperature of the piping and the exhaust piping is equal to or higher than the heating temperature in the vaporizer. In addition, the heating temperature of the deposition chamber 1008 and the deposition chamber 1009 can be appropriately determined by the practitioner, taking into consideration the quality of the film to be formed, the uniformity of the film, the deposition rate, and the like.

[0253] As described above, the film forming method using the vaporized precursor can form a film with high uniformity in film thickness and quality. In addition, the surface coverage is high even on a surface having irregularities. In particular, in an opening with a large aspect ratio, a film with high uniformity in quality and thickness can be formed on the bottom and sides of the opening.

[0254] Here, as an example of an apparatus capable of forming a film by the MOCVD method, a configuration example of a film forming apparatus 1000 will be described with reference to Fig. 52A and Fig. 52B. Fig. 52A is a schematic diagram of a multi-chamber type film forming apparatus 1000, and Fig. 52B is a cross-sectional view of a film forming chamber 1008.

[0255] <Example of film formation equipment configuration> The film forming apparatus 1000 includes a cassette chamber 1002, an alignment chamber 1004, a transfer chamber 1006, a film forming chamber 1008, a film forming chamber 1009, a cooling chamber 1010, and a transfer arm 1014. The transfer arm 1014 can transfer a wafer 1012. Here, the cassette chamber 1002, the alignment chamber 1004, the film forming chamber 1008, the film forming chamber 1009, and the cooling chamber 1010 are connected to the transfer chamber 1006. This allows continuous film formation in the film forming chamber 1008 and the film forming chamber 1009 without exposure to the atmosphere, and prevents impurities from being mixed into the film. In addition, contamination of the interface between the substrate and the film and the interface between each film is reduced, and clean interfaces are obtained.

[0256] A cassette having a plurality of wafers 1012 can be placed in the cassette chamber 1002. One or a plurality of cassettes can be placed. The wafers 1012 in the cassette are taken out by the transfer arm 1014, and are returned to the desired cassette in the cassette chamber 1002 after processing such as film formation.

[0257] In the alignment chamber 1004, the position of the wafer 1012 on the transfer arm 1014 is adjusted. It is preferable to adjust the position before the wafer 1012 taken out of the cassette chamber 1002 is transferred to the film formation chamber 1008 or 1009. Alternatively, the position may be adjusted before the wafer 1012 is returned to the cassette chamber 1002 after processing such as film formation.

[0258] In the film formation chamber 1008 and the film formation chamber 1009, film formation is performed on the wafer 1012.

[0259] In the cooling chamber 1010, the temperature of the wafer 1012 processed in the film formation chamber 1008 or the film formation chamber 1009 is adjusted. For example, when the processing in the film formation chamber 1008 or the film formation chamber 1009 is performed in a heated atmosphere, it is preferable to carry out the wafer 1012 into the cassette chamber 1002 after adjusting the temperature in the cooling chamber 1010 in order to prevent the heated wafer 1012 from being rapidly cooled.

[0260] Note that the cassette chamber 1002, the alignment chamber 1004, the transfer chamber 1006, the film deposition chamber 1008, the film deposition chamber 1009, and the cooling chamber 1010 are preferably filled with an inert gas (such as nitrogen gas) with a controlled dew point to prevent moisture adhesion or the like, and it is desirable to maintain a reduced pressure.

[0261] In addition, an MOCVD apparatus can be used in the film deposition chamber 1008 and the film deposition chamber 1009. Also, a configuration may be adopted in which a film deposition apparatus other than the ALD apparatus is used in either the film deposition chamber 1008 or the film deposition chamber 1009. Examples of the film deposition apparatus used in the film deposition chamber 1008 and the film deposition chamber 1009 include a sputtering apparatus, a PECVD apparatus, a TCVD apparatus, and an ALD apparatus.

[0262] The film deposition apparatus 1000 is configured to include the cassette chamber 1002, the alignment chamber 1004, the transfer chamber 1006, the film deposition chamber 1008, the film deposition chamber 1009, and the cooling chamber 1010, but the present invention is not limited thereto. The film deposition apparatus 1000 may be configured to have three or more film deposition chambers, or may be configured to add a processing chamber for performing heat treatment or plasma treatment. Further, the film deposition apparatus 1000 may be a single-wafer type or a batch type for depositing films on a plurality of substrates at once.

[0263] <MOCVD apparatus> Next, a configuration in which an MOCVD apparatus is used as the film forming chamber 1008 will be described with reference to FIG. 52B. The film forming chamber 1008 has a bottom outer wall 1021, a side outer wall 1022, and an upper outer wall 1023. The upper outer wall 1023 is provided with a raw material inlet 1025 and a shower plate 1024. The side outer wall 1022 is provided with a gate valve 1028 for loading and unloading the wafer 1012. The bottom outer wall 1021 is provided with an exhaust unit 1026, an exhaust valve 1027, and a stage 1029. It is preferable that the bottom outer wall 1021, the side outer wall 1022, and the upper outer wall 1023 are provided with heaters for controlling the temperature during film formation. It is not necessary that the bottom outer wall 1021, the side outer wall 1022, and the upper outer wall 1023 are provided independently. For example, the bottom outer wall 1021, the side outer wall 1022, and the top outer wall 1023 may be integrally formed. Also, the bottom outer wall 1021 and the side outer wall 1022 may be integrally formed, and the top outer wall 1023 may function as a lid.

[0264] Gas containing the precursor vaporized by the vaporizer 1048 is introduced into the film formation chamber 1008 from the raw material inlet 1025 and supplied to the wafer 1012 on the stage 1029 via the shower plate 1024. The supplied gas is deposited on the wafer 1012 to form a film. Meanwhile, gas not used in forming the film, surplus gas, is exhausted to the outside of the film formation chamber 1008 from the exhaust unit 1026.

[0265] This embodiment mode can be implemented in appropriate combination with structures described in other embodiment modes.

[0266] (Embodiment 4) In this embodiment, the circuit configuration and operation of the memory string 120, which is a storage device, will be described. Fig. 53 shows an example of the circuit configuration of the memory string 120. Note that the circuit configuration example shown in this embodiment can also be applied to the memory string 120s. Therefore, in this embodiment, the "memory string 120" can be read as the "memory string 120s".

[0267] <Memory string circuit configuration example> 53 shows an example of a circuit configuration in which the number n of memory elements MC included in the memory string 120 is 5. As described in the above embodiment, the memory element MC has a transistor WTr and a transistor RTr.

[0268] In an equivalent circuit diagram, the circuit symbol of a transistor may be marked with "OS" to indicate that the transistor is an OS transistor. Similarly, the circuit symbol of a transistor may be marked with "Si" to indicate that the transistor is a Si transistor (a transistor that uses silicon in the semiconductor layer in which the channel is formed). In FIG. 53, the transistors WTr and RTr are shown to be OS transistors.

[0269] An equivalent circuit diagram of the memory element MC is shown in Fig. 54. As shown in Fig. 54, the transistor WTr can be expressed by replacing it with a capacitance Cs and a transistor Tr. The gate of the transistor Tr is electrically connected to the conductor WWL via the capacitance Cs.

[0270] In FIG. 53, the transistor WTr included in the memory element MC[1] is shown as a transistor WTr[1], and the transistor RTr included in the memory element MC[1] is shown as a transistor RTr[1]. Therefore, the memory string 120 shown in FIG. 53 has transistors WTr[1] to WTr[5] and transistors RTr[1] to RTr[5]. The memory string 120 shown in FIG. 53 also has transistors STr1 and STr2. The memory string 120 is a NAND type memory device.

[0271] A NAND type storage device that includes an OS memory is also called an "OS NAND type" or "OS NAND type storage device." Additionally, an OS NAND type storage device that has multiple OS memories stacked in the Z direction is also called a "3D OS NAND type" or "3D OS NAND type storage device."

[0272] One of the source or drain of the transistor RTr[1] is electrically connected to one of the source or drain of the transistor STr1, and the other is electrically connected to one of the source or drain of the transistor RTr[2]. One of the source or drain of the transistor WTr[1] is electrically connected to the gate of the transistor RTr[1], and the other is electrically connected to one of the source or drain of the transistor WTr[2]. The backgate of the transistor RTr[1] is electrically connected to the conductor RWL[1]. The gate of the transistor WTr[1] is electrically connected to the conductor WWL[1]. In addition, the backgate of the transistor WTr[1] is electrically connected to the conductor BG. In addition, the other of the source or drain of the transistor STr1 is electrically connected to the conductor 122, and the gate is electrically connected to the conductor SG.

[0273] In addition, one of the source or drain of the transistor RTr[5] is electrically connected to the other of the source or drain of the transistor RTr[4], and the other is electrically connected to one of the source or drain of the transistor STr2. The gate of the transistor RTr[5] is electrically connected to one of the source or drain of the transistor WTr[5]. The other of the source or drain of the transistor WTr[5] is electrically connected to one of the source or drain of the transistor STr2. The back gate of the transistor RTr[5] is electrically connected to the conductor RWL[5]. The gate of the transistor WTr[5] is electrically connected to the conductor WWL[5]. In addition, the back gate of the transistor WTr[5] is electrically connected to the conductor BG. In addition, the other of the source or drain of the transistor STr2 is electrically connected to the conductor BL, and the gate is electrically connected to the conductor SEL.

[0274] When the memory string 120 includes n memory elements MC, in the i-th (i is an integer between 1 and n) memory element MC[i] excluding the first and n-th memory elements MC, one of the source or drain of the transistor RTr[i] is electrically connected to the other of the source or drain of the transistor RTr[i-1], and the other is electrically connected to one of the source or drain of the transistor RTr[i+1]. The gate of the transistor RTr[i] is electrically connected to one of the source or drain of the transistor WTr[i]. The other of the source or drain of the transistor WTr[i] is electrically connected to one of the source or drain of the transistor WTr[i+1]. The backgate of the transistor RTr[i] is electrically connected to the conductor RWL[i]. The gate of the transistor WTr[i] is electrically connected to the conductor WWL[i]. In addition, the backgate of the transistor WTr[i] is electrically connected to the conductor BG.

[0275] Also, the node where the gate of the transistor RTr and either the source or the drain of the transistor WTr are electrically connected is referred to as a node ND. That is, the node where the gate of the transistor RTr[i] and either the source or the drain of the transistor WTr[i] are electrically connected is referred to as a node ND[i]. In FIG. 53, the node ND included in the memory element MC[1] is referred to as a node ND[1].

[0276] The transistors STr1 and STr2 may be, for example, OS transistors or Si transistors. One of the transistors STr1 and STr2 may be an OS transistor, and the other may be a Si transistor. When both the transistors WTr and RTr are formed of OS transistors, it is preferable that the transistors STr1 and STr2 are also formed of OS transistors. By using the same semiconductor material for the transistors, the productivity of the semiconductor device can be improved.

[0277] Alternatively, an OS transistor may be used as the transistor WTr, and a Si transistor may be used as the transistor RTr. An equivalent circuit diagram of the memory string 120 in the case where an OS transistor is used as the transistor WTr, and a Si transistor is used as the transistor RTr is shown in FIG.

[0278] When the transistor RTr is a Si transistor, polycrystalline silicon, for example, may be used for the semiconductor 125. When the transistor WTr is an OS transistor, CAAC-IGZO, for example, may be used for the semiconductor 127.

[0279] Note that, depending on the purpose or application, a Si transistor may be used as the transistor WTr and an OS transistor may be used as the transistor RTr as shown in Fig. 56. Also, depending on the purpose or application, a Si transistor may be used for both the transistor WTr and the transistor RTr as shown in Fig. 57. When Si transistors are used for both the transistor WTr and the transistor RTr, it is preferable to use Si transistors also for the transistors STr1 and STr2.

[0280] <Memory string operation example> Next, an example of the operation of the memory string 120 shown in FIG. 53 will be described.

[0281] [Write operation] In this embodiment, an example of an operation in which an H potential is written to the memory element MC[1] and the memory element MC[3] and an L potential is written to the other memory element MC will be described. Fig. 58 is a timing chart for explaining the write operation. Figs. 59A to 62B are circuit diagrams for explaining the write operation. Note that reference numerals and the like not shown in Figs. 59A to 62B may refer to Fig. 53 and the like.

[0282] In an initial state, an L potential is written to the memory elements MC[1] to MC[5]. Also, an L potential is supplied to the conductors WWL[1] to WWL[5], the conductors RWL[1] to RWL[5], the conductor SEL, the conductor BG, the conductor BL, the conductor SG, and the conductor 122. Note that the threshold of the transistor RTr can be controlled by adjusting the potential supplied to the conductor BG. The potential supplied to the conductor BG may be appropriately adjusted so that the transistor RTr becomes a desired normally-on type transistor.

[0283] [Period T1] In a period T1, an H potential is supplied to the conductor WWL[1] to the conductor WWL[5], the conductor BL, and the conductor SEL (see FIG. 59A). Then, the potentials of the nodes ND[1] to ND[5] become H potentials.

[0284] [Period T2] In the period T2, the L potential is supplied to the conductor WWL[1] (see FIG. 59B). Then, the transistor WTr[1] is turned off, and the charge written to the node ND[1] is held. Here, a charge equivalent to the H potential is held.

[0285] [Period T3] In the period T3, an L potential is supplied to the conductor BL (see FIG. 59B). Then, the potentials of the nodes ND[2] to ND[5] become an L potential. In this case, the gates of the transistors RTr[2] to RTr[5] also become an L potential. However, because the transistors RTr are normally-on transistors, the transistors RTr[2] to RTr[5] are not turned off.

[0286] [Period T4] In the period T4, the L potential is supplied to the conductor WWL[2] (see FIG. 60A). Then, the transistor WTr[2] is turned off, and the charge written to the node ND[2] is held. Here, the charge equivalent to the L potential is held.

[0287] [Period T5] In a period T5, an H potential is supplied to the conductor BL (see FIG. 60B). Then, the potentials of the nodes [3] to [5] become H potentials.

[0288] [Period T6] In the period T6, the conductor WWL[3] is supplied with an L potential (see FIG. 61A). Then, the transistor WTr[3] is turned off, and the charge written to the node ND[3] is held. Here, a charge equivalent to an H potential is held.

[0289] [Period T7] In a period T7, an L potential is supplied to the conductor BL (see FIG. 61B). Then, the potentials of the nodes ND[4] and ND[5] become L potential.

[0290] [Period T8] In the period T8, the L potential is supplied to the conductor WWL[4] (see FIG. 62A). Then, the transistor WTr[4] is turned off, and the charge written to the node ND[4] is held. Here, the charge equivalent to the L potential is held.

[0291] [Period T9] In the period T9, the conductor BL remains at the L potential, so the potential of the node ND[5] also remains at the L potential.

[0292] [Period T10] In period T10, an L potential is supplied to the conductor WWL[5] (see FIG. 62B). Then, the transistor WTr[5] is turned off, and the charge written to the node ND[5] is held. Here, a charge equivalent to the L potential is held. Also, an L potential is supplied to the conductor SEL.

[0293] In this manner, information can be written to the memory element MC.

[0294] In addition, when writing information to the i-th memory element MC (excluding i=1) among the multiple memory elements MC, the operation of writing information to the i-1th memory elements MC can be omitted. For example, when writing information to the memory element MC[4], it is not necessary to write information to the memory elements MC[1] to MC[3]. In other words, the write operation from the period T1 to the period T6 described in this embodiment can be omitted. Therefore, the time and power consumption required for the write operation of the memory device can be reduced.

[0295] [Read operation] An example of a read operation of the memory string 120 having the above circuit configuration will be described. As an initial state, it is assumed that an H potential is held in the memory element MC[1] and the memory element MC[3], and an L potential is held in the memory element MC[2], the memory element MC[4], and the memory element MC[5]. It is also assumed that an L potential is supplied to the conductor WWL[1] to the conductor WWL[5], the conductor RWL[1] to the conductor RWL[5], the conductor SEL, the conductor BG, the conductor BL, the conductor SG, and the conductor 122. FIG. 63A and FIG. 63B are timing charts for explaining the read operation. FIG. 64A, FIG. 64B, FIG. 65A, and FIG. 65B are circuit diagrams for explaining the read operation. Note that reference numerals and the like not shown in FIG. 64A, FIG. 64B, FIG. 65A, and FIG. 65B may refer to FIG. 53 and the like.

[0296] <When holding potential is H potential> First, the read operation of the memory element MC[3] in which the H potential is held will be described.

[0297] [Period T11] In a period T11, an H potential is supplied to the conductors RWL[1] to RWL[5] and the conductor SEL (see FIG. 64A). Then, the transistor STr2 is turned on, and the semiconductor 125 and the conductor BL included in the transistor RTr are brought into a conductive state. In this state, the conductor BL and the semiconductor 125 are precharged with an H potential, and both are brought into a floating state.

[0298] Here, the Id-Vg characteristics of a transistor will be described. Figures 66A and 66B are diagrams for explaining the Id-Vg characteristics of a transistor. The horizontal axis of Figures 66A and 66B indicates the gate voltage (Vg), and the vertical axis indicates the drain current (Id). Figure 66A shows the Id-Vg characteristics of a normally-off type transistor, and Figure 66B shows the Id-Vg characteristics of a normally-on type transistor.

[0299] The H potential is a higher potential than the L potential. If the L potential is 0V, then the H potential is a positive voltage. In a normally-off transistor, when Vg is at the L potential (0V), the channel resistance (resistance between the source and drain) is extremely large and Id hardly flows. Furthermore, when Vg becomes the H potential, the channel resistance decreases and Id increases (see Figure 66A).

[0300] In a normally-on transistor, the channel resistance is small even when Vg is at potential L, and a large amount of Id flows compared to a normally-off transistor. When Vg becomes potential H, the channel resistance becomes even smaller and Id increases even more (see Figure 66B).

[0301] Since the transistor RTr is a normally-on transistor, the semiconductor 125 can be precharged even if the potential of the conductor RWL remains at L potential. However, by supplying H potential to the conductor RWL, the channel resistance value of the transistor RTr becomes even smaller. Therefore, the time and power consumption required for precharging can be reduced.

[0302] [Period T12] In period T12, an L potential is supplied to the conductor RWL[3] (see FIG. 64B). The node ND[3] is held at an H potential. Therefore, even if the potential of the conductor RWL[3] becomes an L potential, the channel resistance value of the transistor RTr[3] is smaller than when the node ND[3] is held at an L potential.

[0303] [Period T13] In the period T13, the H potential is supplied to the conductor SG, and the transistor STr1 is turned on (see FIG. 65A). Then, the conductor BL and the conductor 122 are conductive. At this time, the H potential is supplied to the conductor RWL[1], the conductor RWL[2], the conductor RWL[4], and the conductor RWL[5], so that the channel resistance values ​​of the transistors RTr[1], RTr[2], RTr[4], and RTr[5] become small regardless of the potential of the node ND. Also, as described above, the L potential is supplied to the conductor RWL[3], but the H potential is held at the node ND[3], so that the channel resistance value of the transistor RTr[3] becomes small. Therefore, the potential of the conductor BL, which is in a floating state, changes suddenly from the H potential to the L potential (see FIG. 63A).

[0304] [Period T14] In a period T14, an L potential is supplied to the conductor SEL, the conductor RWL, and the conductor SG (see FIG. 65B).

[0305] <When holding potential is L potential> Next, the read operation of the memory element MC[2] holding an L potential will be described. When reading information (potential) held in the memory element MC[2], the potential of the conductor RWL[2] is set to an L potential in period T12 (see FIG. 63B). At this time, since an L potential is held in the node ND[2], the channel resistance value of the transistor RTr[2] is larger than when an H potential is held in the node ND[2].

[0306] Next, in period T13, an H potential is supplied to the conductor SG, and the conductor BL and the conductor 122 are brought into a conductive state. At this time, since the channel resistance value of the transistor RTr[2] is large, the potential of the conductor BL changes gradually from the H potential to the L potential.

[0307] In this manner, in the period T13, the potential of the conductor RWL corresponding to the memory element MC to be read is set to the L potential, and a change in the potential of the conductor BL is detected, whereby the data held in the memory element MC can be known.

[0308] <Modification> 67 shows an example of a circuit configuration of a memory string 120A which is a modified example of the memory string 120. The memory string 120A has a circuit configuration in which a transistor STr3 is added to the memory string 120.

[0309] In the memory string 120A shown in FIG. 67, the other of the source or drain of the transistor RTr[5] is electrically connected to the source or drain of the transistor STr3, not the source or drain of the transistor STr2. The other of the source or drain of the transistor STr3 is electrically connected to the conductor BL. The gate of the transistor STr2 is electrically connected to the conductor WSEL, and the gate of the transistor STr3 is electrically connected to the conductor RSEL.

[0310] Fig. 68 is a timing chart illustrating a write operation of the memory string 120A. Fig. 69 is a timing chart illustrating a read operation of the memory string 120A.

[0311] In the memory string 120A, during a write operation, an H potential is supplied to the conductor WSEL, and an L potential is supplied to the conductor RSEL. Also, during a read operation, an L potential is supplied to the conductor WSEL, and an H potential is supplied to the conductor RSEL. Thus, during a write operation, the transistor STr2 is turned on, and the transistor STr3 is turned off. During a read operation, the transistor STr2 is turned off, and the transistor STr3 is turned on. When writing or reading information via the conductor BL, the information transmission path can be switched by a dedicated transistor. Thus, the operation of the storage device is stabilized, and the reliability of the storage device can be improved.

[0312] In addition, in the memory string 120, the memory string 120A, and the memory string 120B described later, it is preferable to supply a potential lower than the L potential (also referred to as an "LL potential") to the conductor BG during operations other than the write operation. By supplying the LL potential to the conductor BG, the transistor WTr can be turned off more reliably. Therefore, the data written to the node ND can be retained for a longer period of time.

[0313] Furthermore, in the memory string 120, the memory string 120A, and the memory string 120B described later, a potential higher than the L potential may be supplied to the conductor BG during a write operation. For example, an H potential may be supplied to the conductor BG during a write operation. By supplying an H potential to the conductor BG during a write operation, the resistance value of the semiconductor 127 is reduced, and the write speed can be increased.

[0314] 70, the other of the source and the drain of the transistor STr2 may be electrically connected to a conductor WBL, and the other of the source and the drain of the transistor STr3 may be electrically connected to a conductor RBL. During a write operation, information is written via the conductor WBL, and during a read operation, information is read via the conductor RBL. By providing a dedicated conductor BL for each of the write operation and the read operation, the operation of the memory device can be stabilized and the reliability of the memory device can be improved.

[0315] The memory string 120B shown in FIG. 71 has a circuit configuration in which a transistor STr4 is added to the memory string 120A. One of the source or drain of the transistor STr4 is electrically connected to one of the source or drain of the transistor WTr[1], and the other is electrically connected to the conductor WBL[2]. The gate of the transistor STr4 is electrically connected to the conductor WSEL[2].

[0316] In the memory string 120B, the gate of the transistor STr2 is electrically connected to the conductor WSEL[1], and the other of the source or drain of the transistor STr2 is electrically connected to the conductor WBL[1]. Note that, as shown in FIG. 67, the circuit configuration may be such that the transistors STr2 and STr3 are electrically connected to the conductor BL.

[0317] In the memory string 120B, information can be written from both the conductor WBL[1] and the conductor WBL[2]. This allows the speed at which information can be written to be increased. In addition, the supply of electric charge corresponding to the information to be written can be more reliably achieved.

[0318] Furthermore, when writing information to the i-th memory element MC, if i is close to n, the operation of writing information to the 1st to i-1th memory elements MC can be omitted by writing information from the conductor WBL[1] side. Furthermore, if i is close to 1, the operation of writing information to the i+1th to nth memory elements MC can be omitted by writing information from the conductor WBL[2] side. In the memory string 120B, the time and power consumption required for the write operation can be further reduced.

[0319] This embodiment mode can be implemented in appropriate combination with structures described in other embodiment modes.

[0320] (Embodiment 5) In this embodiment, a configuration example of a semiconductor device 200 including a memory device 100 will be described. Note that a memory device 100A may be used instead of the memory device 100. In this embodiment and the like, it is assumed that the memory device 100A can be used instead of the memory device 100 unless otherwise specified.

[0321] Fig. 72 is a block diagram illustrating a configuration example of a semiconductor device 200 of one embodiment of the present invention. The semiconductor device 200 illustrated in Fig. 72 includes a driver circuit 210 and a memory array 220. The memory array 220 includes one or more memory devices 100. Fig. 72 illustrates an example in which the memory array 220 includes a plurality of memory devices 100 arranged in a matrix.

[0322] The drive circuit 210 has a PSW 241 (power switch), a PSW 242, and a peripheral circuit 215. The peripheral circuit 215 has a peripheral circuit 211 (row decoder), a control circuit 212, and a voltage generating circuit 228. The semiconductor device 200 has elements or circuits having various functions, such as a memory array 220, PSWs 241 and 242, the peripheral circuit 211, the control circuit 212, and the voltage generating circuit 228. Therefore, the semiconductor device 200 may be called a system or a subsystem.

[0323] In the semiconductor device 200, each circuit, each signal, and each voltage can be appropriately selected or omitted as necessary. Alternatively, other circuits or other signals may be added. The signals BW, CE, GW, CLK, WAKE, ADDR, WDA, PON1, and PON2 are input signals from the outside, and the signal RDA is an output signal to the outside. The signal CLK is a clock signal.

[0324] Moreover, signals BW, CE, and GW are control signals. Signal CE is a chip enable signal, signal GW is a global write enable signal, and signal BW is a byte write enable signal. Signal ADDR is an address signal. Signal WDA is write data, and signal RDA is read data. Signals PON1 and PON2 are power gating control signals. Signals PON1 and PON2 may be generated by the control circuit 212.

[0325] The control circuit 212 is a logic circuit having a function of controlling the overall operation of the semiconductor device 200. For example, the control circuit performs a logical operation on the signals CE, GW, and BW to determine an operation mode (e.g., a write operation, a read operation) of the semiconductor device 200. Alternatively, the control circuit 212 generates a control signal for the peripheral circuit 211 so that this operation mode is executed.

[0326] The voltage generating circuit 228 has a function of generating a negative voltage. The signal WAKE has a function of controlling the input of the signal CLK to the voltage generating circuit 228. For example, when an H-level signal is provided to the signal WAKE, the signal CLK is input to the voltage generating circuit 228, and the voltage generating circuit 228 generates a negative voltage.

[0327] The peripheral circuit 211 is a circuit for writing and reading data to and from the memory device 100. The peripheral circuit 211 has a row decoder 221, a column decoder 222, a row driver 223, a column driver 224, an input circuit 225, an output circuit 226, and a sense amplifier 227.

[0328] The row decoder 221 and the column decoder 222 have a function of decoding the signal ADDR. The row decoder 221 is a circuit for specifying a row to be accessed, and the column decoder 222 is a circuit for specifying a column to be accessed. The row driver 223 has a function of selecting the wiring WL specified by the row decoder 221. The column driver 224 has a function of writing data to the memory device 100, a function of reading data from the memory device 100, a function of holding the read data, and the like.

[0329] The input circuit 225 has a function of holding a signal WDA. The data held by the input circuit 225 is output to the column driver 224. The output data of the input circuit 225 is data (Din) to be written to the memory device 100. The data (Dout) read from the memory device 100 by the column driver 224 is output to the output circuit 226. The output circuit 226 has a function of holding Dout. In addition, the output circuit 226 has a function of outputting Dout to the outside of the semiconductor device 200. The data output from the output circuit 226 is a signal RDA.

[0330] The PSW241 has a function of controlling the supply of VDD to the peripheral circuit 215. The PSW242 has a function of controlling the supply of VHM to the row driver 223. Here, the high power supply voltage of the semiconductor device 200 is VDD, and the low power supply voltage is GND (ground potential). Also, VHM is a high power supply voltage used to set the word line to a high level, and is higher than VDD. The on / off of the PSW241 is controlled by a signal PON1, and the on / off of the PSW242 is controlled by a signal PON2. In FIG. 72, the number of power supply domains to which VDD is supplied in the peripheral circuit 215 is one, but it may be multiple. In this case, a power switch may be provided for each power supply domain.

[0331] The driving circuit 210 and the memory array 220 may be provided on the same plane. Also, as shown in Fig. 73A, the driving circuit 210 and the memory array 220 may be provided so as to overlap each other. By providing the driving circuit 210 and the memory array 220 so as to overlap each other, the signal propagation distance can be shortened. Also, as shown in Fig. 73B, the memory array 220 may be provided in multiple layers on the driving circuit 210.

[0332] Also, as shown in FIG. 73C, memory arrays 220 may be provided above and below the driving circuit 210. FIG. 73C shows an example in which one memory array 220 is provided above and below the driving circuit 210. By arranging the driving circuit 210 between a plurality of memory arrays 220, the signal propagation distance can be further shortened. Note that the number of layers of the memory array 220 stacked above the driving circuit 210 and the memory array 220 stacked below the driving circuit 210 may each be one or more. It is preferable that the number of memory arrays 220 stacked above the driving circuit 210 and the number of memory arrays 220 stacked below the driving circuit 210 are equal.

[0333] <Example of cross-sectional structure of semiconductor device> Fig. 74 shows a cross-sectional configuration example of the semiconductor device 200 shown in Fig. 73A. Fig. 74 shows a part of the semiconductor device 200 shown in Fig. 73A. Fig. 75 shows a cross-sectional configuration example when the semiconductor device 200 shown in Fig. 73A is replaced with the semiconductor device 200A. Fig. 75 also shows a part of the semiconductor device 200A.

[0334] FIG. 74 shows transistors 301, 302, and 303 included in the driver circuit 210. The transistors 301 and 302 function as a part of a sense amplifier 304. The transistor 303 functions as a column selection switch. Specifically, the conductor BL included in the memory array 220 is electrically connected to one of the source and drain of the transistor 301, the gate of the transistor 301 is electrically connected to one of the source and drain of the transistor 302, and the gate of the transistor 302 is electrically connected to the other of the source and drain of the transistor 301. The one of the source and drain of the transistor 301 and the other of the source and drain of the transistor 302 are electrically connected to one of the source and drain of the transistor 303, which functions as a column selection switch. This makes it possible to reduce the layout area of ​​the semiconductor device 200. FIG. 74 shows an example in which seven memory elements MC are provided per memory string. However, the number of memory elements MC provided in one memory string is not limited to this. For example, the number of memory elements MC provided in one memory string may be 32, 64, 128, or 200 or more.

[0335] The conductor BL of the memory array 220 is electrically connected to the sense amplifier 304 and the transistor 303 functioning as a column selection switch through the conductor 752 formed so as to be embedded in the insulator 726 and the insulator 722, the conductor 705, the conductor 714, and the conductor 715. Note that the circuits and transistors included in the driver circuit 210 are merely examples, and are not limited to the circuit configuration and transistor structure. In addition to the above, appropriate circuits and transistors such as a control circuit, a row decoder, a row driver, a source line driver, and an input / output circuit can be provided depending on the configuration of the semiconductor device 200 and its driving method.

[0336] The transistors 301, 302, and 303 are provided on a substrate 311, and each of them has a conductor 316, an insulator 315, a semiconductor region 313 made of a part of the substrate 311, and a low-resistance region 314a and a low-resistance region 314b functioning as a source region or a drain region. As shown in FIG. 74, one low-resistance region may be shared by the transistors 301 and 302 as both the source region or drain region of one of them and the source region or drain region of the other.

[0337] In the transistors 301, 302, and 303, a semiconductor region 313 (a part of a substrate 311) in which a channel is formed has a convex shape. A conductor 316 is provided to cover the side and top surface of the semiconductor region 313 via an insulator 315. Note that the conductor 316 may be made of a material that adjusts the work function. Such transistors 301, 302, and 303 are also called FIN type transistors because they use a convex portion of a semiconductor substrate. Note that an insulator that is in contact with an upper portion of the convex portion and functions as a mask for forming the convex portion may be provided. Note that, although a case where a convex portion is formed by processing a part of a semiconductor substrate has been shown here, a semiconductor film having a convex shape may be formed by processing an SOI substrate.

[0338] The transistors 301, 302, and 303 may each be a p-channel type or an n-channel type, but it is preferable that the transistors 301 and 302 have opposite conductivity types.

[0339] The region where the channel of the semiconductor region 313 is formed, the region nearby, the low resistance region 314a which becomes the source region or the drain region, and the low resistance region 314b preferably contain a semiconductor such as a silicon-based semiconductor, and preferably contain single crystal silicon. Alternatively, they may be formed of a material containing Ge (germanium), SiGe (silicon germanium), GaAs (gallium arsenide), GaAlAs (gallium aluminum arsenide), or the like. A configuration using silicon in which the effective mass is controlled by applying stress to the crystal lattice and changing the lattice spacing may be used. Alternatively, the transistors 301, 302, and 303 may be HEMTs (High Electron Mobility Transistors) by using GaAs and GaAlAs, or the like.

[0340] Low resistance region 314a and low resistance region 314b contain, in addition to the semiconductor material applied to semiconductor region 313, an element that imparts n-type conductivity, such as arsenic or phosphorus, or an element that imparts p-type conductivity, such as boron.

[0341] The insulator 315 functions as a gate insulating film for the transistor 301 , the transistor 302 , and the transistor 303 .

[0342] The conductor 316 functioning as the gate electrode can be made of a conductive material such as a semiconductor material, such as silicon, containing an element that imparts n-type conductivity, such as arsenic or phosphorus, or an element that imparts p-type conductivity, such as boron, a metal material, an alloy material, or a metal oxide material.

[0343] Since the work function is determined by the material of the conductor, the threshold voltage can be adjusted by changing the material of the conductor. Specifically, it is preferable to use materials such as titanium nitride and tantalum nitride for the conductor. Furthermore, in order to achieve both electrical conductivity and embeddability, it is preferable to use metal materials such as tungsten and aluminum as a laminate for the conductor, and in particular, it is preferable to use tungsten in terms of heat resistance.

[0344] Moreover, an insulator 317 functioning as an etch stopper is preferably provided above the conductor 316. Moreover, an insulator 318 functioning as a spacer is preferably provided on the side of the insulator 315. By providing the insulators 317 and 318, the region where the low resistance region 314a and the low resistance region 314b are electrically connected to the conductor 328 can be determined in a self-aligned manner. Therefore, even if misalignment occurs when forming an opening for exposing a part of the low resistance region 314a and the low resistance region 314b, an opening for exposing an intended region can be formed. By forming the conductor 328 in the opening thus formed, a good contact with reduced contact resistance can be obtained between the low resistance region 314a and the conductor 328 and the low resistance region 314b. The contact between the low resistance region 314a and the low resistance region 314b formed in this manner and the conductor 328 may be called a self-aligned contact. A conductor 329 electrically connected to the conductor 316 may also be provided so as to be embedded in the insulator 317 and the insulator 322 .

[0345] An insulator 320, an insulator 322, an insulator 324, an insulator 326, and an insulator 327 are stacked in this order to cover the transistor 301, the transistor 302, and the transistor 303.

[0346] As the insulators 320, 322, 324, 326, and 327, for example, silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, aluminum oxide, aluminum oxynitride, aluminum nitride oxide, aluminum nitride, or the like can be used.

[0347] The insulator 322 may function as a planarizing film that planarizes steps caused by the transistor 301 provided therebelow. For example, the top surface of the insulator 322 may be planarized by planarization treatment using a chemical mechanical polishing (CMP) method or the like to improve the planarity.

[0348] In addition, the insulator 324 is preferably a film having a barrier property that prevents hydrogen or impurities from diffusing from the substrate 311 or the transistor 301 to a region where the memory array 220 is provided.

[0349] As an example of a film having a barrier property against hydrogen, for example, silicon nitride formed by a CVD method can be used. Here, hydrogen diffusion into a semiconductor element having an oxide semiconductor such as the memory element MC may deteriorate the characteristics of the semiconductor element. Therefore, it is preferable to use a film that suppresses hydrogen diffusion between the memory element MC and the transistor 301 or the like. Specifically, the film that suppresses hydrogen diffusion is a film that releases a small amount of hydrogen.

[0350] The amount of desorption of hydrogen can be analyzed, for example, by using thermal desorption spectrometry (TDS). For example, the amount of desorption of hydrogen from the insulator 324 is calculated as 10×10 per area of ​​the insulator 324 when the surface temperature of the film is in the range of 50° C. to 500° C. in the TDS analysis. 15 atoms / cm 2 Less than or equal to 5×10 15 atoms / cm 2 The following is acceptable.

[0351] Note that the insulators 326 and 327 preferably have a lower dielectric constant than the insulator 324. For example, the relative dielectric constant of the insulators 326 and 327 is preferably less than 4, and more preferably less than 3. For example, the relative dielectric constant of the insulators 326 and 327 is preferably 0.7 times or less, and more preferably 0.6 times or less, the relative dielectric constant of the insulator 324. By using a material with a low dielectric constant as the interlayer film, the parasitic capacitance generated between wirings can be reduced.

[0352] Conductors 328, 329, and 330, which are electrically connected to the memory array 220, are embedded in the insulators 320, 322, 324, 326, and 327. The conductors 328, 329, and 330 function as plugs or wiring. A plurality of structures of conductors that function as plugs or wiring may be collectively given the same reference numeral. In this specification, the wiring and the plug that electrically connects to the wiring may be integrated. That is, a part of the conductor may function as the wiring, and a part of the conductor may function as the plug.

[0353] As the material for each plug and wiring (conductor 328, conductor 329, conductor 330, etc.), a conductive material such as a metal material, an alloy material, a metal nitride material, or a metal oxide material can be used in a single layer or a laminated layer. It is preferable to use a high melting point material such as tungsten or molybdenum that has both heat resistance and conductivity, and it is preferable to use tungsten. Alternatively, it is preferable to form it from a low resistance conductive material such as aluminum or copper. By using a low resistance conductive material, it is possible to reduce the wiring resistance.

[0354] A wiring layer may be provided over the insulator 327 and the conductor 330. For example, in FIG. 74, an insulator 350, an insulator 352, and an insulator 354 are stacked in this order. A conductor 356 is formed in the insulator 350, the insulator 352, and the insulator 354. The conductor 356 functions as a plug or a wiring. The conductor 356 can be provided using a material similar to that of the conductors 328, 329, and 330.

[0355] Note that, for example, the insulator 350 is preferably an insulator having a barrier property against hydrogen, similar to the insulator 324. The conductor 356 preferably includes a conductor having a barrier property against hydrogen. In particular, a conductor having a barrier property against hydrogen is formed in an opening of the insulator 350 having a barrier property against hydrogen. With this structure, the transistor 301 and the like can be separated from the memory element MC by a barrier layer, and diffusion of hydrogen from the transistor 301 and the like to the memory element MC can be suppressed.

[0356] As a conductor having a barrier property against hydrogen, for example, tantalum nitride or the like may be used. By stacking tantalum nitride and tungsten having high conductivity, diffusion of hydrogen from the transistor 301 or the like can be suppressed while maintaining the conductivity as a wiring. In this case, a structure in which the tantalum nitride layer having a barrier property against hydrogen is in contact with the insulator 350 having a barrier property against hydrogen is preferable.

[0357] A wiring layer may be provided over the insulator 354 and the conductor 356. For example, in FIG. 74, an insulator 360, an insulator 362, and an insulator 364 are stacked in this order. A conductor 366 is formed in the insulator 360, the insulator 362, and the insulator 364. The conductor 366 functions as a plug or a wiring. The conductor 366 can be provided using a material similar to that of the conductors 328, 329, and 330.

[0358] Note that, for example, the insulator 360 is preferably an insulator having a barrier property against hydrogen, similar to the insulator 324. The conductor 366 preferably includes a conductor having a barrier property against hydrogen. In particular, a conductor having a barrier property against hydrogen is formed in an opening of the insulator 360 having a barrier property against hydrogen. With this structure, the transistor 301 and the like can be separated from the memory element MC by a barrier layer, and diffusion of hydrogen from the transistor 301 and the like to the memory element MC can be suppressed.

[0359] An insulator 722 is provided over the insulator 364 and the conductor 366, and the memory array 220 is provided above the insulator 722. A barrier film made of a material similar to that of the insulator 324 may be provided between the insulator 364 and the insulator 722.

[0360] This embodiment mode can be implemented in appropriate combination with structures described in other embodiment modes.

[0361] (Embodiment 6) In this embodiment, an example of a chip 1200, which is a type of semiconductor device on which the memory device of the present invention is mounted, is shown using Figures 76A and 76B. A plurality of circuits (systems) are mounted on the chip 1200. A technology for integrating a plurality of circuits (systems) on a single chip in this way is sometimes called a system on chip (SoC).

[0362] As shown in FIG. 76A, the chip 1200 includes a CPU 1211, a GPU 1212, one or more analog computing units 1213, one or more memory controllers 1214, one or more interfaces 1215, one or more network circuits 1216, and the like.

[0363] Chip 1200 is provided with bumps (not shown) and is connected to a first surface of a printed circuit board (PCB) 1201 as shown in Fig. 76B. In addition, a plurality of bumps 1202 are provided on the back side of the first surface of PCB 1201 and are connected to a motherboard 1203.

[0364] The motherboard 1203 may be provided with a storage device such as a DRAM 1221 or a flash memory 1222. The semiconductor device described in the above embodiment is preferably used as the flash memory 1222. By using the semiconductor device described in the above embodiment for the flash memory 1222, the storage capacity of the flash memory 1222 can be increased.

[0365] The CPU 1211 preferably has a plurality of CPU cores. The GPU 1212 preferably has a plurality of GPU cores. The CPU 1211 and the GPU 1212 may each have a memory for temporarily storing data. Alternatively, a memory common to the CPU 1211 and the GPU 1212 may be provided in the chip 1200. The GPU 1212 is suitable for parallel calculation of a large amount of data, and can be used for image processing and multiplication and accumulation. By providing the GPU 1212 with an image processing circuit and a multiplication and accumulation circuit, it becomes possible to execute image processing and multiplication and accumulation with low power consumption.

[0366] In addition, by providing the CPU 1211 and GPU 1212 on the same chip, the wiring between the CPU 1211 and GPU 1212 can be shortened, and data transfer from the CPU 1211 to the GPU 1212, data transfer between the memories of the CPU 1211 and GPU 1212, and transfer of calculation results from the GPU 1212 to the CPU 1211 after calculation in the GPU 1212 can be performed quickly.

[0367] The analog calculation unit 1213 has one or both of an A / D (analog / digital) conversion circuit and a D / A (digital / analog) conversion circuit. The analog calculation unit 1213 may also be provided with the above-mentioned product-sum calculation circuit.

[0368] The memory controller 1214 has a circuit that functions as a controller for the DRAM 1221 and a circuit that functions as an interface for the flash memory 1222 .

[0369] The interface 1215 has an interface circuit with externally connected devices such as a display device, a speaker, a microphone, a camera, and a controller. The controller includes a mouse, a keyboard, a game controller, etc. As such an interface, a USB (Universal Serial Bus), an HDMI (registered trademark) (High-Definition Multimedia Interface), etc. can be used.

[0370] The network circuit 1216 includes a network circuit for connecting to a LAN (Local Area Network), etc. It may also include a circuit for network security.

[0371] The above circuits (systems) can be formed in the same manufacturing process in the chip 1200. Therefore, even if the number of circuits required for the chip 1200 increases, there is no need to increase the manufacturing process, and the chip 1200 can be manufactured at low cost.

[0372] A PCB 1201 on which a chip 1200 having a GPU 1212 is provided, a motherboard 1203 on which a DRAM 1221 and a flash memory 1222 are provided can be referred to as a GPU module 1204.

[0373] The GPU module 1204 has the chip 1200 using SoC technology, so that its size can be reduced. In addition, since it excels in image processing, it is suitable for use in portable electronic devices such as smartphones, tablet terminals, laptop PCs, and portable (portable) game consoles. In addition, a multiply-and-accumulate circuit using the GPU 1212 can execute techniques such as deep neural networks (DNN), convolutional neural networks (CNN), recurrent neural networks (RNN), autoencoders, deep Boltzmann machines (DBM), and deep belief networks (DBN), so that the chip 1200 can be used as an AI chip, and the GPU module 1204 can be used as an AI system module.

[0374] The structure described in this embodiment mode can be used in appropriate combination with structures described in other embodiment modes.

[0375] (Embodiment 7) In this embodiment, an application example of a semiconductor device using the storage device shown in the previous embodiment will be described. The storage device shown in the previous embodiment can be applied to various removable storage devices such as memory cards (e.g., SD cards), USB memories, and SSDs (solid state drives). Figures 77A to 77E show some configuration examples of removable storage devices. For example, the semiconductor device shown in the previous embodiment is processed into a packaged memory chip and used in various storage devices and removable memories.

[0376] 77A is a schematic diagram of a USB memory. A USB memory 1100 has a housing 1101, a cap 1102, a USB connector 1103, and a board 1104. The board 1104 is housed in the housing 1101. For example, a memory chip 1105 and a controller chip 1106 are attached to the board 1104. The storage device or the semiconductor device described in the above embodiment can be incorporated into the memory chip 1105 or the like.

[0377] FIG. 77B is a schematic diagram of the appearance of an SD card, and FIG. 77C is a schematic diagram of the internal structure of the SD card. The SD card 1110 has a housing 1111, a connector 1112, and a substrate 1113. The substrate 1113 is housed in the housing 1111. For example, a memory chip 1114 and a controller chip 1115 are attached to the substrate 1113. The capacity of the SD card 1110 can be increased by providing a memory chip 1114 on the back side of the substrate 1113 as well. In addition, a wireless chip having a wireless communication function may be provided on the substrate 1113. This makes it possible to read and write data from and to the memory chip 1114 by wireless communication between the host device and the SD card 1110. The memory chip 1114 or the like can be incorporated with the memory device or semiconductor device described in the above embodiment.

[0378] FIG. 77D is a schematic diagram of the appearance of an SSD, and FIG. 77E is a schematic diagram of the internal structure of the SSD. The SSD 1150 has a housing 1151, a connector 1152, and a board 1153. The board 1153 is housed in the housing 1151. For example, a memory chip 1154, a memory chip 1155, and a controller chip 1156 are attached to the board 1153. The memory chip 1155 is a work memory for the controller chip 1156, and may be, for example, a DOSRAM chip. The capacity of the SSD 1150 can be increased by providing a memory chip 1154 on the back side of the board 1153. The memory chip 1154 or the like can be incorporated with the storage device or semiconductor device shown in the previous embodiment.

[0379] This embodiment mode can be implemented in appropriate combination with structures described in other embodiment modes.

[0380] (Embodiment 8) 78A to 78G illustrate specific examples of electronic devices equipped with a memory device or a semiconductor device according to one embodiment of the present invention.

[0381] <Electronic equipment and systems> The memory device or semiconductor device according to one embodiment of the present invention can be mounted on various electronic devices. Examples of the electronic devices include information terminals, computers, smartphones, e-book terminals, television devices, digital signage, large game machines such as pachinko machines, digital cameras, digital video cameras, digital photo frames, mobile phones, portable game machines, recording and playback devices, navigation systems, and audio playback devices. Note that the term "computer" as used herein includes tablet computers, notebook computers, desktop computers, and large computers such as server systems.

[0382] The electronic device of one embodiment of the present invention may have an antenna. By receiving a signal through the antenna, images, information, and the like can be displayed on a display portion. In addition, when the electronic device has an antenna and a secondary battery, the antenna may be used for contactless power transmission.

[0383] An electronic device according to one embodiment of the present invention may have a sensor (including a function of measuring force, displacement, position, velocity, acceleration, angular velocity, rotation speed, distance, light, liquid, magnetism, temperature, chemical substances, sound, time, hardness, electric field, current, voltage, power, radiation, flow rate, humidity, gradient, vibration, odor, or infrared rays).

[0384] The electronic device of one embodiment of the present invention can have various functions, such as a function of displaying various information (still images, videos, text images, etc.) on a display unit, a touch panel function, a function of displaying a calendar, date, time, etc., a function of executing various software (programs), a wireless communication function, a function of reading out a program or data recorded in a recording medium, etc.

[0385] [Information terminal] A memory device for storing programs of a microcontroller can be formed using a memory device or a semiconductor device according to one embodiment of the present invention, and therefore, according to one embodiment of the present invention, a microcontroller chip can be made smaller.

[0386] FIG. 78A illustrates a mobile phone (smartphone), which is a type of information terminal. The information terminal 5100 includes a housing 5101 and a display unit 5102. As input interfaces, a touch panel is provided on the display unit 5102 and buttons are provided on the housing 5101. By using a miniaturized microcontroller according to one embodiment of the present invention, a limited space inside the mobile phone can be effectively used. In addition, a storage device according to one embodiment of the present invention may be used for storage of the mobile phone. This allows the storage capacity per unit area of ​​the storage to be increased.

[0387] FIG. 78B illustrates a notebook information terminal 5200. The notebook information terminal 5200 includes a main body 5201 of the information terminal, a display unit 5202, and a keyboard 5203. By using a miniaturized microcontroller according to one embodiment of the present invention, it is possible to effectively use a limited space inside the notebook information terminal. In addition, a storage device according to one embodiment of the present invention may be used for the storage of the notebook information terminal. This allows the storage capacity per unit area of ​​the storage to be increased.

[0388] In the above description, a smartphone and a notebook type information terminal are illustrated in Fig. 78A and Fig. 78B as examples of electronic devices, but information terminals other than smartphones and notebook type information terminals can also be applied. Examples of information terminals other than smartphones and notebook type information terminals include PDAs (Personal Digital Assistants), desktop type information terminals, and workstations.

[0389] [Game consoles] FIG. 78C illustrates a portable game machine 5300, which is an example of a game machine. The portable game machine 5300 includes a housing 5301, a housing 5302, a housing 5303, a display unit 5304, a connection unit 5305, an operation key 5306, and the like. The housing 5302 and the housing 5303 can be detached from the housing 5301. By attaching the connection unit 5305 of the housing 5301 to another housing (not shown), a video output to the display unit 5304 can be output to another video device (not shown). In this case, the housing 5302 and the housing 5303 can each function as an operation unit. This allows a plurality of players to play a game at the same time. A memory device or a semiconductor device according to one embodiment of the present invention can be incorporated into chips provided on the substrates of the housing 5301, the housing 5302, and the housing 5303.

[0390] 78D shows a stationary game machine 5400, which is an example of a game machine. A controller 5402 is connected to the stationary game machine 5400 wirelessly or by wire.

[0391] A miniaturized microcontroller according to one embodiment of the present invention can be used effectively in a game machine such as a portable game machine 5300 or a stationary game machine 5400. A storage device or a semiconductor device according to one embodiment of the present invention can be used for storage of the portable game machine. This can increase the storage capacity per unit area of ​​the storage.

[0392] 78C and 78D show a portable game machine and a stationary game machine as examples of game machines, but game machines to which the microcontroller of one embodiment of the present invention is applied are not limited to these. Examples of game machines to which the microcontroller of one embodiment of the present invention is applied include arcade game machines installed in entertainment facilities (game centers, amusement parks, etc.) and pitching machines for batting practice installed in sports facilities.

[0393] [Mainframe computers] A memory device or a semiconductor device according to one embodiment of the present invention can be applied to a large-scale computer.

[0394] Fig. 78E is a diagram showing a supercomputer 5500, which is an example of a large computer. Fig. 78F is a diagram showing a rack-mounted calculator 5502 included in the supercomputer 5500.

[0395] The supercomputer 5500 includes a rack 5501 and a plurality of rack-mounted computers 5502. The plurality of computers 5502 are stored in the rack 5501. The computer 5502 is provided with a plurality of boards 5504, and a microcontroller according to one embodiment of the present invention can be mounted on the board. By using the miniaturized microcontroller according to one embodiment of the present invention, the limited space of a large computer can be effectively utilized. In addition, a storage device or a semiconductor device according to one embodiment of the present invention may be used for the storage of the large computer. This allows the storage capacity per unit area of ​​the storage to be increased.

[0396] 78E and 78F show a supercomputer as an example of a large computer, but the large computer to which the microcontroller according to an embodiment of the present invention is applied is not limited to this. Examples of large computers to which the microcontroller according to an embodiment of the present invention is applied include computers that provide services (servers) and large general-purpose computers (mainframes).

[0397] [electric appliances] 78G shows an example of an electric appliance, an electric refrigerator-freezer 5800. The electric refrigerator-freezer 5800 has a housing 5801, a refrigerator door 5802, a freezer door 5803, and the like.

[0398] A memory device or a semiconductor device according to one embodiment of the present invention can also be applied to an electric refrigerator-freezer 5800. For example, by applying a miniaturized microcontroller according to one embodiment of the present invention to the electric refrigerator-freezer 5800, the limited space of the electric refrigerator-freezer can be effectively utilized.

[0399] Although an electric refrigerator-freezer has been described as an example of an electrical appliance, other electrical appliances include, for example, vacuum cleaners, microwave ovens, electric ovens, rice cookers, water heaters, induction cookers, water servers, heating and cooling appliances including air conditioners, washing machines, dryers, and audio-visual equipment.

[0400] The electronic devices, functions, effects, and the like described in this embodiment mode can be appropriately combined with descriptions of other electronic devices.

[0401] This embodiment mode can be implemented in appropriate combination with structures described in other embodiment modes. [Explanation of symbols]

[0402] 100: memory device, 105: region, 110: memory cell array, 120: memory string, 121: substrate, 122: conductor, 123: insulator, 124: insulator, 125: semiconductor, 126: insulator, 127: semiconductor, 128: conductor, 129: insulator, 130: conductor, 141: opening, 142: region, 143: region

Claims

1. a first conductor having a region that functions as a first gate electrode of a first transistor; a second conductor having a region that functions as a first electrode of the capacitance element; a third conductor having a region that functions as a first gate electrode of the second transistor; a fourth conductor having a region that functions as a second gate electrode of the second transistor; a first insulator having a region that functions as a first gate insulating film of the first transistor; a second insulator having a region that functions as a second gate insulating film of the first transistor and a region that functions as a second gate insulating film of the second transistor; a third insulator having a region that functions as a first gate insulating film of the second transistor; A fourth insulator; and a first semiconductor having a channel formation region of the first transistor; a second semiconductor having a region that functions as a second gate electrode of the first transistor and a second electrode of the capacitive element, and a channel formation region of the second transistor; The first conductor extends in a first direction; On a side surface of the first conductor extending in the first direction, The first insulator has a region in contact with the first conductor, The first semiconductor has a region in contact with the first insulator, The second insulator has a region in contact with the first semiconductor, The second semiconductor has a region in contact with the second insulator, The third insulator has a region in contact with the second semiconductor, The first conductor has a first region and a second region, In the first region, the second conductor has a region in contact with the third insulator, In the second region, the third conductor has a region in contact with the third insulator, In the second region, the fourth conductor has a region located between the first insulator and the first semiconductor, A memory device, wherein on a side of the fourth insulator extending in the first direction, the fourth insulator has a region in contact with the first conductor, a region in contact with the first insulator, a region in contact with the first semiconductor, a region in contact with the second insulator, a region in contact with the second semiconductor, a region in contact with the third insulator, a region in contact with the second conductor, a region in contact with the third conductor, and a region in contact with the fourth conductor.

2. the first semiconductor is an oxide semiconductor; The second semiconductor is an oxide semiconductor. The storage device according to claim 1 .

3. the first semiconductor includes at least one of indium and zinc; The second semiconductor contains at least one of indium and zinc. The storage device according to claim 2.

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