Electronic apparatus

Abstract

To provide a light-emitting device with excellent portability, a light-emitting device with excellent perspicuity, or a light-emitting device with excellent portability and perspicuity.SOLUTION: In a light-emitting device, a light-emitting panel with flexibility is supported by a plurality of frames provided apart from each other. By bending the light-emitting panel to such a degree that surfaces of the adjacent frames are in contact, the light-emitting device can be folded. Moreover, the frames have magnetism partially or entirely, so that when the light-emitting device is used in a folded state, the adjacent two frames are fixed with a magnetic force.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] One aspect of the present invention relates to a light-emitting device. In particular, an electroluminescent (EL:El The present invention relates to a light-emitting device utilizing the ectroluminescence phenomenon. The present invention relates to a display device.

[0002] Note that one embodiment of the present invention is not limited to the above technical fields. One aspect of the present invention relates to a process, a machine, or a method of manufacture. , manufacture, or composition of matter. More specifically, the technical field of one embodiment of the present invention disclosed in this specification is a semiconductor device, Display device, light-emitting device, power storage device, storage device, electronic device, lighting device, input device, input / output device , their driving methods, or their manufacturing methods can be cited as examples.

[0003] In this specification and the like, a semiconductor device is a device that can function by utilizing semiconductor characteristics. Refers to devices in general. Semiconductor elements such as transistors, semiconductor circuits, computing devices, memory The device is one aspect of a semiconductor device. Optical devices, power generation devices (including thin-film solar cells, organic thin-film solar cells, etc.), and electronic devices The device may include a semiconductor device. [Background technology]

[0004] In recent years, light-emitting devices and display devices are expected to be used for a variety of purposes, and diversification is required. is.

[0005] For example, in light-emitting devices and display devices for mobile devices, etc., they must be thin and lightweight. It is required that the material be highly resistant to damage, etc.

[0006] Light-emitting devices that utilize the EL phenomenon (also called EL elements) have become a Since no backlight is required, it is easy to make the device thin and lightweight. It also responds quickly to input signals. The present invention has the following characteristics: it can be driven by a low-voltage DC power supply, and the light-emitting device and the display device Applications to the following fields are being considered.

[0007] For example, Patent Document 1 discloses a film substrate on which transistors, which are switching elements, are mounted. A flexible active matrix type light emitting device having an organic EL element is disclosed. do. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] JP 2003-174153 A Summary of the Invention [Problem to be solved by the invention]

[0009] In recent years, the amount of information displayed has increased by enlarging the display area of ​​the display device, and the display list On the other hand, for mobile device applications, the display area needs to be enlarged. If the number of documents is increased, portability will decrease. It has been difficult to achieve both high speed and portability.

[0010] An object of one embodiment of the present invention is to provide a light-emitting device or the like that is highly portable. Another object of the present invention is to provide a light emitting device with excellent visibility. Another object of the present invention is to provide a light-emitting device or the like that is excellent in visibility and visibility. One of the objectives is to provide facilities such as

[0011] The description of these problems does not preclude the existence of other problems. It is not necessary to solve all of these problems. Problems other than those mentioned above are not necessarily solved. It will become clear from the description of the specification, etc., and problems other than those mentioned above will not be identified from the description of the specification, etc. It is possible to extract [Means for solving the problem]

[0012] One embodiment of the present invention is a flexible light-emitting panel and a light-emitting device that supports the light-emitting panel and is provided in parallel. and a plurality of housings each provided at a distance from one another, the plurality of housings each having a light-emitting panel folded therein. This is a light-emitting device in which two opposing housings are fixed magnetically when bent.

[0013] Each of the plurality of housings has a ferromagnetic material, and the ferromagnetic material is disposed on the upper and lower surfaces of the housing. The magnetic poles of each of the two adjacent enclosures are facing in the opposite direction, and the top surfaces of the two enclosures are facing in the opposite direction. They are preferably arranged in their respective housings so that the poles face each other.

[0014] Alternatively, each of the plurality of housings is strengthened so that the magnetic poles face the upper and lower surfaces of the housing. A first housing having a magnetic body, or a second housing having a soft magnetic body that can be magnetized by a ferromagnetic body. The first and second housings are arranged alternately, and the light-emitting panel is folded. The first and second housings facing each other when bent are fixed together magnetically. It is preferable.

[0015] The soft magnetic material may be Fe, Fe-Ni alloy, Fe-Si-Al alloy, or Fe-Co alloy. It is preferable that the metal oxide contains one or more metals selected from the group consisting of gold and silver.

[0016] The ferromagnetic material may be an isotropic ferrite magnet, an anisotropic ferrite magnet, or a neodymium magnet. , samarium cobalt magnet, and alnico magnet.

[0017] In addition, when the light-emitting panel is folded and the two opposing housings are fixed, The adhesive force between the two housings is preferably 0.1 kgf or more and 2.0 kgf or less.

[0018] In any of the above configurations, the light-emitting panels are arranged so that adjacent housings are alternately stacked. When the device is folded, one of the two housings located at the ends of the device is the The first state is folded so that it is at the top, and the second state is folded so that it is at the bottom. It is preferable that the elastic member 100 be configured to be reversibly deformable between the states A and B.

[0019] In this specification, the term "light-emitting device" refers to a display device using a light-emitting element as well as a light source (illumination Also, the light emitting device may include a connector, such as an FPC (Flexible Printed Circuit). printed circuit) or TCP (Tape Carrier Pa A module with a printed wiring board at the end of the TCP. COG (Chip On Glass) method on a substrate on which a module or light emitting element is formed Modules in which ICs (integrated circuits) are directly mounted may be included in the category of light-emitting devices. do. Effect of the Invention

[0020] According to one embodiment of the present invention, a light emitting device having excellent portability can be provided. Alternatively, a light emitting device with excellent portability and visibility can be provided. Note that the effects of one embodiment of the present invention are not limited to these. In some cases or depending on the situation, the above effects may be different. be. [Brief description of the drawings]

[0021] [Figure 1] 1A to 1C illustrate a structural example of a light-emitting device according to an embodiment. [Diagram 2] 1A to 1C illustrate a structural example of a light-emitting device according to an embodiment. [Diagram 3] 1A to 1C illustrate a structural example of a light-emitting device according to an embodiment. [Figure 4] 1A to 1C illustrate a structural example of a light-emitting device according to an embodiment. [Diagram 5] 1A to 1C illustrate a structural example of a light-emitting device according to an embodiment. [Figure 6] 1A to 1C illustrate a structural example of a light-emitting device according to an embodiment. [Figure 7] 1A to 1C illustrate a structural example of a light-emitting device according to an embodiment. [Figure 8] 1A to 1C illustrate a structural example of a light-emitting device according to an embodiment. [Figure 9] 1A to 1C are diagrams illustrating a light-emitting panel according to an embodiment. [Figure 10] 1A to 1C are diagrams illustrating a light-emitting panel according to an embodiment. [Figure 11] 1A to 1C are diagrams illustrating a light-emitting panel according to an embodiment. [Figure 12] 1A to 1C are diagrams illustrating a light-emitting panel according to an embodiment. [Figure 13] 1A to 1C illustrate an example of a method for manufacturing a light-emitting panel according to an embodiment. [Figure 14] 1A to 1C illustrate an example of a method for manufacturing a light-emitting panel according to an embodiment. [Figure 15]1A to 1C are diagrams illustrating a light-emitting panel according to an embodiment. [Figure 16] 1A to 1C illustrate a structural example of a light-emitting device according to an embodiment. [Figure 17] 1A to 1C are diagrams illustrating examples of electronic devices. [Figure 18] 1A to 1C illustrate a structural example of a light-emitting device according to an embodiment. [Figure 19] 1A to 1C illustrate a structural example of a light-emitting device according to an embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] The embodiment will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. The present invention is not limited to the above embodiment, and various changes and modifications may be made in the form and details without departing from the spirit and scope of the present invention. It will be easily understood by those skilled in the art that the present invention can be realized by the following embodiments. The present disclosure should not be construed as being limited to the contents of the preceding paragraph.

[0023] In the configuration of the invention described below, the same parts or parts having similar functions are The same reference numerals are used in common between different drawings, and the repeated explanations are omitted. When referring to a function, the same hatch pattern may be used and no particular symbol may be added.

[0024] In each figure described in this specification, the size, layer thickness, or area of ​​each component is indicated by the following formula: The figures may be exaggerated for clarity and are not necessarily limited to scale. stomach.

[0025] In this specification, ordinal numbers such as "first" and "second" are used to avoid confusion of components. The numbers are added for the purpose of convenience and are not intended to be limiting.

[0026] (Embodiment 1) In this embodiment, a light-emitting device according to one embodiment of the present invention will be described with reference to the drawings.

[0027] A light-emitting device according to one embodiment of the present invention includes a plurality of flexible light-emitting panels provided at a distance from each other. The light emitting device has a structure supported by two adjacent housings. It is possible to bend the light-emitting panel in the area where the surfaces of adjacent housings face each other. The light-emitting device can be folded by bending the light-emitting panel. The light device is highly portable when folded and has a wide, seamless light emitting area when unfolded. The optical area (display area) provides excellent visibility of the display.

[0028] In addition, the light-emitting device according to one embodiment of the present invention can be provided with a light-emitting diode by imparting magnetism to a part or the entire housing. When the light emitting device is folded and used, the two adjacent housings are fixed together by magnetic force. Therefore, no mechanical fixture is required to fix the housings together. This makes it possible to suppress an increase in the number of parts and simplify the design.

[0029] In addition, because magnetic force is used to secure the two cases together, it is difficult to fold them up from their unfolded state. When transforming the light-emitting device into a flat state, simply bend the light-emitting panel to bring the adjacent housings closer together. This generates an attractive force, and the light-emitting device can be semi-automatically transformed into a predetermined shape. When the light-emitting device is transformed from an unfolded state to a folded state, the light-emitting device may be lit in an unintended direction. It is possible to prevent the light panel from bending or twisting, and to suppress damage to the light-emitting panel. On the other hand, for example, if a user bends the light-emitting panel so that the two housings come into contact, and then fixes the housings, In the case of a configuration where the light-emitting panel connecting the two housings is fixed by a fixture, the specification limit is reached. The light-emitting panel may bend to an unintended direction or the light-emitting panel may bend to an unintended direction. There is a risk of the light-emitting panel being damaged by such things.

[0030] In addition, since the magnetic force of attraction is inversely proportional to the square of the distance between the two bodies, When transforming the device into its unfolded state, do not insert your fingers or other objects between the two fixed housings. By leaving a small gap, the two housings can be easily separated. This eliminates the need to pull the two connected housings apart, for example by pulling them in opposite directions. The light-emitting panel connecting the two housings may be pulled accidentally and damaged. You can suppress the condition.

[0031] The light-emitting panel of the light-emitting device according to one embodiment of the present invention can be bent inward or outward. It is possible.

[0032] In this specification, the term "inward bending" refers to bending the light-emitting surface of the light-emitting panel inward. "When the light-emitting panel is bent so that the light-emitting surface faces outward, it is called "outward bending." The light-emitting surface of a panel or a light-emitting device refers to the surface from which light from a light-emitting element is extracted.

[0033] In the light-emitting device according to one embodiment of the present invention, the light-emitting surface of the light-emitting panel faces inward when the light-emitting device is folded. By bending the light emitting surface in this way, scratches and dirt on the surface can be prevented during transportation. For example, this is suitable for carrying the light emitting device in a pocket or bag.

[0034] When the light-emitting device according to one embodiment of the present invention is used, it can be opened and used as a seamless, wide light-emitting device. The entire light-emitting area may be used, or the light-emitting panel may be bent so that the light-emitting surface faces outward. A portion of the light-emitting area may be used. A portion of the light-emitting area may be folded inward and hidden from the user. By making the light region a non-light emitting region, the power consumption of the light emitting device can be reduced.

[0035] [Configuration example] A configuration example of a light-emitting device according to one embodiment of the present invention will be described below. It has a flexible light-emitting panel supported by the body, and by bending the light-emitting panel in two places, As an example, a light-emitting device that can be transformed from an unfolded state to a folded state in three will be described. Reveal.

[0036] FIG. 1(A) shows the light emitting device 100 in an unfolded state. FIG. 1(B) shows the light emitting device 100 in an unfolded state. 1 shows the light emitting device 100 in the process of changing from one folded state to the other. FIG. 2(C) shows the light emitting device 100 in a folded state. FIG.

[0037] The light emitting device 100 includes a flexible light emitting panel 101. The housing has a plurality of housings (housings 111, 112, and 113). The housings are spaced apart from each other. In the following description, the housings 111, 112, and 113 are distinguished from one another. When describing common matters without distinction, it may be referred to simply as the housing.

[0038] Each housing only needs to support the light-emitting panel 101, and the light-emitting surface side or the light-emitting surface of the light-emitting panel It is sufficient that the insulating layer is provided on at least one of the opposite sides (also called the lower side or back side). 2, the outer periphery of the light-emitting surface of the light-emitting panel 101 and the opposite side of the light-emitting surface of the light-emitting panel In this way, the case that supports both sides of the light-emitting panel 101 is By using a housing having such a structure, the mechanical strength is increased, and damage to the light emitting device 100 can be prevented. Cut.

[0039] Each housing may have rigidity, or the housing itself may be deformable in response to a twisting or bending force. Each housing is made of a material that is at least less flexible than the light-emitting panel 101. It is also possible to use elastic materials such as hard rubber for the frame. Materials that can make up the body include plastic, metals such as aluminum, stainless steel, and An alloy such as a tungsten alloy, a rubber such as a silicone rubber, etc. can be used.

[0040] As shown in FIG. 1 and FIG. 2, the outer periphery of the light-emitting surface side of the light-emitting panel 101 and the light-emitting surface It is preferable to provide a protective layer 102 for supporting the other side of the light-emitting panel 101. Even if the mechanical strength of the curved portion is low, the protective layer 102 increases the mechanical strength of the curved portion. In this embodiment, the protective layer 102 is provided so as to cover the entire light-emitting panel 101. However, it is sufficient to provide the insulating film at least in the area between the two housings, which is a curved area. As shown in FIG. 2, the light-emitting panel 101 is sandwiched between two protective layers 102. By disposing the light emitting panel 101 so as to be located at the center in the thickness direction, When the filter 101 and the protective layer 102 are curved inward or outward, the light-emitting panel 101 Such stress can be kept to a minimum.

[0041] Of the two protective layers 102, the one on the light-emitting side is positioned so as to overlap the light-emitting area of ​​the light-emitting panel 101. It is preferable that the light emitting panel 101 is provided with an opening in its position so as to cover the periphery of the light emitting panel 101. Alternatively, a protective layer 102 having a light-transmitting material at a position overlapping the light-emitting region may be used. For example, a protective layer may be provided to cover wiring and driving circuits located at the edge of the light-emitting panel 101. By providing 102, it is possible to physically protect these, and also to shield the wiring and driving circuit from light. This prevents deterioration, and furthermore, the wiring and driving circuitry can be visually confirmed, and the quality of the light-emitting device itself can be checked. This can prevent the aesthetic appearance from being impaired.

[0042] The protective layer 102 may be made of, for example, plastic, rubber, metal, alloy, or the like.

[0043] When the protective layer 102 or the housing is made of plastic, rubber, titanium alloy, or the like, the light-emitting device This is preferable because the device is lightweight and less likely to break.

[0044] In addition, it is preferable to use a highly tough material for the protective layer 102 and the housing. It is possible to realize a light-emitting device that has excellent impact resistance and is difficult to break. For example, By using metal or alloy materials, a light-emitting device that is lightweight and resistant to breakage can be realized. For the same reason, the substrate constituting the light-emitting panel 101 is also made of a highly tough material. It is preferable.

[0045] The protective layer 102 and the housing located on the light-emitting surface side do not overlap with the light-emitting area of ​​the light-emitting panel 101. In this case, the light-transmitting property is not important. If the light emitting area overlaps with the light emitting area of ​​the light emitting panel 101, a material that transmits the light emitted from the light emitting panel 101 should be used. It is preferable that the protective layer 102 and the housing located on the opposite side to the light-emitting surface are transparent. .

[0046] When any two of the protective layer 102, the housing, and the light-emitting panel 101 are bonded together, various adhesives are used. For example, a two-liquid mixed resin that hardens at room temperature, a photo-curable resin, etc. Resins such as hardening resins and thermosetting resins can be used. In addition, any two or more of the protective layer 102, the housing, and the light-emitting panel 101 may be Each component of the light emitting device is fixed using penetrating screws, pins that hold them, clips, etc. It may be determined.

[0047] The light emitting device according to one embodiment of the present invention has one light emitting panel 101 (one light emitting region) folded. The raised part can be used as a boundary to divide it into two or more parts. For example, the hidden area can be folded. Alternatively, the light source may be configured so that the light source is not emitting light and only the exposed area is emitting light. This reduces the power consumed by areas that are not recognized.

[0048] In the light-emitting device according to one embodiment of the present invention, the light-emitting panel 101 located between the housings is curved. For example, a switch, a MEMS pressure sensor, etc. may be provided to determine whether the sensor is in a non-contact state or not. The sensor may be configured using a pressure sensor or the like.

[0049] The light-emitting device according to one embodiment of the present invention includes a flexible touch sensor that is overlapped with the light-emitting panel 101. Preferably, the detection surface of the touch sensor is provided on the display surface side of the light-emitting panel 101. In this case, when the light-emitting panel 101 is bent, The detection surface of the touch sensor is curved along the curved surface of the display surface of the light-emitting panel 101. It is preferable to do so.

[0050] In addition, a touch panel having a function as a touch sensor is used as the light-emitting panel 101. This is also fine.

[0051] The light emitting device 100 can be folded from the unfolded state shown in FIG. It can be reversibly transformed from the shape shown in Fig. 1(B) to the folded shape shown in Fig. 1(C). At this time, the relative positions of the housings 111 and 112 are fixed by magnetic force. Similarly, the relative positions of the housings 112 and 113 are also changed by the magnetic force. It is fixed.

[0052] [Method of fixing the housing using magnetic force] Next, when the light emitting device is folded, the relative positions of the housings are fixed by magnetic force. An example of the law will be described.

[0053] FIG. 3(A1) is a top view of the light emitting device, and FIG. 3(A2) is a rear view of the light emitting device. FIG. 3(B1) shows a side view in the range AB when viewed from the direction of the arrow in FIG. 3(A1). 3(A1) is a schematic cross-sectional view taken along line CD in FIG. 3(A1). FIG. 3(C) shows the direction of the arrow in FIG. 3(A1) when the light emitting device is folded. FIG. 3(B2) is a schematic side view of the range AB as viewed from the front. Therefore, the thickness of light-emitting panel 101 is shown as being thick.

[0054] The light emitting device shown in FIG. 3 includes housings 111, 112, and 113 whose surfaces are magnetized. The body has a ferromagnetic body on its upper and lower surfaces, and the ferromagnetic body is attached to the upper and lower surfaces of the housing, respectively. The ferromagnetic material is magnetized so that the magnetic poles face in opposite directions. The top surfaces of the two adjacent enclosures are magnetized so that their magnetic poles face in opposite directions. The undersides of the magnets are similarly magnetized with opposite magnetic poles.

[0055] In the following, the surface of the housing with the light-emitting surface will be referred to as the top surface, and the surface opposite the light-emitting surface will be referred to as the This will be described as the underside.

[0056] Here, as an example, the upper surface of the housing 111, the lower surface of the housing 112, and the upper surface of the housing 113 are provided. The ferromagnetic material is magnetized so that the surface is the north pole, and the lower surface of the housing 111 and the housing 11 The ferromagnetic bodies provided on the upper surface of the housing 2 and the lower surface of the housing 113 are magnetized so that the corresponding surfaces are the S poles. It goes without saying that the N and S poles are swapped. Good too.

[0057] With this configuration, when the light emitting device is folded, as shown in FIG. The bottom surfaces of the housings 111 and 112 (the surfaces facing upward in FIG. 3C) are The two housings are fixed together by the attraction of the magnetic poles facing each other. The upper surface of the housing 112 (the surface facing downward in FIG. 3C) and the upper surface of the housing 113 are also attracted to each other by the gravitational force. The two cases are fixed in place.

[0058] Here, the ferromagnetic material may be, for example, an isotropic ferrite magnet, an anisotropic ferrite magnet, or a nematic magnet. Odymium magnets (Nd-Fe-B), Samarium-Cobalt magnets (Sm-Co), Alnico magnets Materials containing Fe-Al-Ni-Co can be used. In addition, there are rubber magnets made by kneading powdered magnets into rubber, and plastic magnets made by kneading powdered magnets into plastic. These are also called bonded magnets.

[0059] In particular, when the surface of the housing is magnetized, the use of the above-mentioned bonded magnet reduces the weight. This is preferable because it can reduce the weight and can be easily processed into any shape. After processing using such materials, the surfaces of the housings are magnetically aligned so that the magnetic poles face in the above-mentioned directions. Just make it so.

[0060] In this way, two adjacent housings are fixed by two opposing ferromagnetic bodies. By doing so, when the two cases are stacked, the two ferromagnetic bodies are affected by each other's magnetic fields. Therefore, it may be possible to reduce demagnetization of a ferromagnetic material due to the influence of an external magnetic field.

[0061] In the above, a ferromagnetic body is provided on the top surface of the housing, and the top surface of the housing itself is magnetized. As shown in 4(A1) and (A2), inside the housing and near the top or bottom surface of the housing A ferromagnetic material may be disposed in the above-mentioned structure. A2) and FIG. 4(A2) show a top view and a back view of the light emitting device. 4(A1) is a schematic cross-sectional view taken along line EF in FIG. 4(A1).

[0062] In FIG. 4(A2), for the sake of clarity, the north pole of the ferromagnetic material is oriented perpendicular to the surface of the housing. A ferromagnetic body arranged so that its pole faces the earth is represented as N, and a ferromagnetic body arranged so that its pole faces the earth is represented as S. The body is represented as S. As long as the magnetic poles are oriented in different directions, the same material may be used. Alternatively, different materials may be used for each.

[0063] In this case, it is preferable to use a material with low magnetic permeability for the housing.

[0064] This structure allows the housing to be made of plastic, glass, ceramic, It is possible to use rubber or metals or alloys with low magnetic permeability, and the material of the housing This is preferable because it increases the freedom of selection.

[0065] In addition, as shown in Figures 4(B1) and (B2), the ferromagnetic material is not applied to the entire housing, but to only a part of the housing. In this case, two or more ferromagnetic bodies may be arranged on one surface of one housing. When the two housings are arranged facing each other, it is preferable that the housings are spaced apart from each other. The ferromagnetic bodies attached to the body are attracted to each other at two or more points, and the The relative positions of the two housings in a plane are fixed, and the two-dimensional positions of these two housings The deviation can be effectively eliminated.

[0066] In addition, if a ferromagnetic material is placed in part of the housing, the two ferromagnetic bodies may be damaged when the light-emitting device is folded. Since the area of ​​the magnetic material facing each other is smaller, it is more efficient than placing ferromagnetic materials over the entire surface of the housing. Therefore, it is preferable to use a material having a high magnetic flux density (or residual magnetic flux density) for the ferromagnetic material.

[0067] The ferromagnetic material used is the surface where the two ferromagnetic materials face each other when the two housings are placed one on top of the other. Depending on the product and the distance between the two ferromagnetic bodies, the magnetic flux density of the material should be taken into consideration. For example, the larger the opposing area of ​​two ferromagnetic bodies, or the shorter the distance between the two ferromagnetic bodies, the greater the magnetization. The stronger the attractive force between ferromagnetic materials, the lower the magnetic flux density of the material can be used. In this case, the magnetic flux density of the ferromagnetic material may be less than 100 mT. If it is necessary to use a ferromagnetic material with a high magnetic field, for example, 100 mT or more, or 200 Ferromagnetic materials having a magnetic field of 500 mT or more, or 500 mT or more, may also be used.

[0068] For example, when two housings are placed one on top of the other, the area of ​​each ferromagnetic body facing each other and the The magnetic flux density of the ferromagnetic material determines the force required to separate the two housings. The force required to separate the housings (also called adhesion force) is, for example, 0.1 kgf to 2.0 kgf. kgf or less, preferably 0.2kgf to 1.0kgf. It is preferable to appropriately set the material (magnetic flux density) of the ferromagnetic body and the area where the two ferromagnetic bodies face each other. By setting the distance in this range, the two housings can be securely attached to each other when the light emitting device is folded. The two housings can be easily separated while being fixed in place when deploying the light emitting device. For example, if the adhesive force between the two housings is less than 0.05 kgf, the two housings cannot be securely fixed together. On the other hand, if it is larger than the above range, the two housings may not be able to be attracted to each other. The force acting on the two housings may become so strong that it may become difficult to separate the two housings easily.

[0069] As shown in Figs. 4(C1) and 4(C2), a depression is provided on the surface of the housing, and the bottom of the depression In this way, when the two housings are stacked, the opposing sides may be provided with ferromagnetic materials. Since there is no material that constitutes the housing between the two ferromagnetic bodies, the attractive force between the two ferromagnetic bodies is strengthened. In addition, the position where the ferromagnetic body is provided can be visually recognized by the user. This configuration prevents, for example, the mistake of inserting a material with high magnetic permeability between two ferromagnetic materials. This prevents problems such as the two housings being unable to be fixed together. The recess is filled with a material having a lower magnetic permeability than the material of the housing, or a material having a higher optical transparency. , or may be covered.

[0070] [Variation 1] In the above example, a ferromagnetic body is placed in each of the adjacent housings, and the magnetic force between the two ferromagnetic bodies Although a configuration in which the positions of the two housings are fixed has been shown, one of them may be replaced with a soft magnetic material.

[0071] That is, each of the multiple housings is provided with a strong magnetic field so that the magnetic poles face the upper and lower surfaces of the housing. or a soft magnetic material that can be magnetized by the ferromagnetic material. In addition, the housings having ferromagnetic materials and the housings having soft magnetic materials are arranged alternately. Just do that.

[0072] 5(A1) and (A2) show the case 11 of the configuration shown in FIG. 4(B1) and (B2). 1 and the ferromagnetic material in the housing 113 are replaced with a soft magnetic material 122. In this case, the direction of the magnetic pole of the ferromagnetic body provided in the housing 112 does not matter, so the ferromagnetic body 121 are shown with the same hatching pattern as

[0073] The soft magnetic body 122 may be made of a material having high magnetic permeability, such as Fe, Materials containing soft magnetic materials such as Fe-Ni alloys, Fe-Si-Al alloys, and Fe-Co alloys It can be used.

[0074] In addition, under ideal conditions, the force of attraction between two identical ferromagnetic bodies is The force of attraction between the soft magnetic material and the ferromagnetic material is about half. As described above, by using a material with a higher magnetic flux density for the ferromagnetic body than when using a pair of ferromagnetic bodies, is preferred.

[0075] In addition, in Figs. 5(A1) and (A2), the housing of the configuration shown in Figs. 4(B1) and (B2) is The ferromagnetic material in the housing 111 and the housing 113 is replaced with a soft magnetic material 122. For example, as shown in FIG. 5(B1) and (B2), a ferromagnetic body in the housing 112 may be The soft magnetic material 122 may be substituted. In the other configuration shown, the ferromagnetic body of one of the adjacent housings is as shown in FIG. Alternatively, the ferromagnetic body 121 and the soft magnetic body 122 may be replaced with each other. When two adjacent housings are stacked together, the ferromagnetic material 121 and the soft magnetic material 122 are mixed in. The soft magnetic body 122 may be disposed so as to face each other.

[0076] In place of the soft magnetic material 122, a soft magnetic material is provided on the surface of the housing or on a part of the area near the surface. It may also be configured to use a material.

[0077] [Modification 2] In the above, a configuration in which a ferromagnetic material or a soft magnetic material is arranged along the top or bottom surface of a housing has been shown. However, these may be provided on the side of the housing.

[0078] An example of the configuration of a light-emitting device to be described below is shown in FIG. 6(A) shows the light-emitting device in an expanded state. 6(B) is a schematic cross-sectional view taken along line GH in FIG. 6(A). FIG. 6(C) is a schematic cross-sectional view of the light emitting device in a folded state.

[0079] In the configuration shown in FIG. 6, the ferromagnetic body 121 is inside the housing 112. They are arranged along the side surface (the surface perpendicular to the light emitting surface of light emitting panel 101).

[0080] In addition, the housing 111 and the housing 113 are provided with a folded light emitting device as shown in FIG. The soft magnetic body 122 is disposed at a position where it overlaps with the ferromagnetic body 121 in the housing 112 when the soft magnetic body 122 is in the closed position. do.

[0081] At least one of the ferromagnetic body 121 and the soft magnetic body 122 is exposed to the outside of each housing. It may be provided as such.

[0082] In this case, it is preferable that the magnetic pole of the ferromagnetic material 121 is oriented in a direction perpendicular to the light emitting surface. If the magnetic pole of the ferromagnetic material 121 is oriented perpendicular to the light emitting surface, the ferromagnetic material 12 This is preferable because it increases the force of attraction between the ferromagnetic body 121 and the soft magnetic body 122. If the force of attraction between the ferromagnetic body 122 and the ferromagnetic body 121 is too strong, the magnetic pole of the ferromagnetic body 121 is oriented in such a way that the light emitting surface By shifting it away from the perpendicular direction, this force can be controlled to be weaker.

[0083] In this way, by disposing the ferromagnetic body 121 near the side of the housing, The thickness of the housing can be significantly reduced compared to when two ferromagnetic bodies 121 are arranged along the In particular, since the light-emitting device according to one embodiment of the present invention can be used in a folded state, The reduced thickness of the folded device makes it easier to carry around. It can be improved.

[0084] In this embodiment, the ferromagnetic body 121 is provided in the housing 112. The ferromagnetic body 121 may be provided in the housing 113, and the soft magnetic body may be provided in the housing 112. In addition, near the sides of each of the three housings, there are magnetic poles that face in opposite directions when folded. Alternatively, a ferromagnetic body 121 may be provided in the

[0085] The above is a description of the modified example.

[0086] In any of the above-described light-emitting devices according to the embodiments of the present invention, a light-emitting element is disposed between two housings. Whether the optical panel 101 is bent inward or outward, the two housings are magnetically connected. It can be fixed by force.

[0087] Therefore, for example, as shown in FIG. 7, the light emitting device is in an expanded state, that is, form X, as a starting point. The area between the housings 111 and 112 is bent outward, and the area between the housings 112 and 113 is bent inward. By bending the housing 111 in each direction, the housing 111 is positioned at the top through the configuration Y1. The light emitting device can be reversibly transformed into the form Y2 in which 3 is located at the bottom. Starting from the shape X, the area between the housing 111 and the housing 112 is bent inward, and the area between the housing 112 and the housing 113 is bent inward. By bending the portions between the first and second wiring members in the outward bending direction, the housing 111 is positioned at the bottom through the configuration Z1. The light emitting device can be reversibly transformed into a configuration Z2 in which the housing 113 is located at the top. can.

[0088] In both of the configurations Y2 and Z2 shown in FIG. 7, the two adjacent housings are magnetically This realizes a state in which the relative positions of these are fixed.

[0089] That is, in the light emitting device according to one embodiment of the present invention, the light emitting panels are arranged so that adjacent housings are alternately stacked. When the panel is folded, one of the two outermost housings is When folded so that the top is at the top, and when folded so that the bottom is at the bottom, It can be said that the light emitting device is capable of reversibly transforming.

[0090] However, one aspect of the embodiment of the present invention is not limited to this. For example, in FIG. 3(C), FIG. 16(A) shows an example in which multiple housings are fixed so that the display panel is bent inward. As shown in (B), the polarity of the ferromagnetic material changes in both the inward and outward bending cases. The fittings match so that the parts can be fixed in place properly.

[0091] When the display device is not used (when not displaying), as shown in FIG. It is preferable that all the display panels are bent inward and fixed. Since the display surface is not exposed to the outside, the display device can be protected from scratches. It can be stored compactly even when it is stored in a storage case. In the case of the folded state, the surface can be fixed as shown in FIG. 3(C). However, one aspect of an embodiment of the present invention is not limited thereto.

[0092] In the above, we have taken an example of a light-emitting device that has three housings and can be folded into three. The number of housings is not limited to this. For example, a two-body housing 110 shown in FIG. A foldable light-emitting device, as shown in FIG. 8(B), is a light-emitting device having four housings 110 and capable of being folded into four. The present invention also relates to a light emitting device and a light emitting device having five housings 110 and capable of being folded into five, as shown in FIG. This is one aspect of the invention, and the configuration may include six or more housings 110.

[0093] In the above, the two housings are connected by the protective layer 102. Alternatively, the two housings may be mechanically connected to each other using a hinge. This limits the relative movement range between the two housings, preventing damage to the light-emitting panel 101. It can be stopped.

[0094] In addition, the housing of the light-emitting device of one embodiment of the present invention may include a battery, a computing device, a driver circuit, and the like. Printed circuit boards with various ICs mounted, wireless receivers, wireless transmitters, wireless power receivers, acceleration By appropriately incorporating various electronic components including sensors, The device can function as an electronic device such as a portable image reproducing device or a portable lighting device. In this case, the electronic components may be integrated in one of the multiple housings, or may be integrated in multiple housings. Wiring that is distributed in the housing and sandwiched between the protective layer 102 or wiring that is provided inside the protective layer 102 The electronic components in the multiple housings may be electrically connected by wiring or the like. The housing of the light emitting device also contains a camera, a speaker, various input / output terminals including a power supply terminal, Various sensors including optical sensors, operation buttons, etc. may also be incorporated.

[0095] In addition, in each of the drawings exemplified above, the thicknesses of the multiple housings are shown to be approximately the same, However, the thickness of each housing may be different. If the thickness of all the housings is the same, the horizontality of the light-emitting surface when the light-emitting device is unfolded is In addition, all of the various electronic components can be mounted in one of the multiple housings. A part or most of the components are integrated into the housing, and the housing is used as a relatively thick main body, and the thickness of the other housings is reduced. It is also possible to reduce the thickness and use the light-emitting panel 101 simply as a member for supporting the light-emitting panel 101.

[0096] Although the example in which the light-emitting element is used as the display element has been described, One embodiment of the form is not limited to this.

[0097] For example, in this specification, a display element, a display device which is a device having a display element, a light-emitting A light-emitting device, which is a device having an element and a light-emitting element, can be used in various forms or can be used in various forms. As an example of a display element, a display device, a light-emitting element, or a light-emitting device, EL (electroluminescence) elements (EL elements including organic and inorganic materials, organic EL LED elements, inorganic EL elements), LEDs (white LEDs, red LEDs, green LEDs, blue LEDs, etc. etc.), transistors (transistors that emit light according to current), electron emission elements, liquid crystal elements, Electronic ink, electrophoretic element, grating light valve (GLV), plasma display LCD panels (PDPs), MEMS (Micro-Electro-Mechanical Systems), Digital Micromirror Device (DMD), DMS (Digital Micro Shutter) , IMOD (Interference Modulation) element, Electrowetting Electromagnetic effects such as magnetoelectric elements, piezoelectric ceramic displays, and carbon nanotubes Some display media have display characteristics such as contrast, brightness, reflectance, and transmittance that change depending on the display. An example of a display device using an EL element is an EL display. An example of a display device using electrons is a field emission display (FED). is a flat panel display using the SED method (SED: Surface-conduction E LCD displays are used in the following applications: An example of the device is a liquid crystal display (transmissive liquid crystal display, semi-transmissive liquid crystal display, etc.). play, reflective LCD, direct-view LCD, projection LCD) An example of a display device using electronic ink or electrophoretic elements is electronic paper. - and others.

[0098] For example, in this specification, an active matrix type having active elements in pixels, Alternatively, a passive matrix system in which the pixels do not have active elements can be used.

[0099] In the active matrix method, a transistor is used as an active element (active element, nonlinear element). By using not only transistors but also various active elements (active elements, nonlinear elements), For example, MIM (Metal Insulator Metal) or T It is also possible to use FD (Thin Film Diode) and other elements. Since the number of manufacturing steps is small, it is possible to reduce manufacturing costs and improve yields. Alternatively, these elements can improve the aperture ratio due to their small size. This makes it possible to achieve low power consumption and high brightness.

[0100] As a non-active matrix type, active elements (active elements, nonlinear elements It is also possible to use a passive matrix type that does not use active elements. Since it does not use any nonlinear elements, there are fewer manufacturing steps, which reduces manufacturing costs and improves yield. It is possible to improve the accuracy. Or, it is possible to use active elements (active elements, nonlinear elements) Since the aperture ratio is not increased, it is possible to achieve low power consumption and high brightness. This can be done.

[0101] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0102] (Embodiment 2) In this embodiment mode, a light-emitting panel will be described with reference to the drawings.

[0103] [Example 1] FIG. 9A is a plan view of the light-emitting panel 101 illustrated in the first embodiment. FIG. 9B shows an example of a cross-sectional view taken along dashed line A1-A2 in the embodiment.

[0104] The light-emitting panel shown in FIG. 9B includes an element layer 501 , an adhesive layer 505 , and a substrate 503 . The element layer 501 includes a substrate 201, an adhesive layer 203, an insulating layer 205, a plurality of transistors, a conductive layer, and a conductive film. layer 557, insulating layer 207, insulating layer 209, a plurality of light-emitting elements, insulating layer 211, and sealing layer 213 , an insulating layer 261 , a colored layer 259 , a light-shielding layer 257 , and an insulating layer 255 .

[0105] The conductive layer 557 is electrically connected to the FPC 508 via the connector 215 .

[0106] The light emitting element 230 includes a lower electrode 231, an EL layer 233, and an upper electrode 235. The terminal electrode 231 is electrically connected to the source electrode or the drain electrode of the transistor 240. The end of the lower electrode 231 is covered with an insulating layer 211. The upper electrode 235 has a light-transmitting property and transmits the light emitted by the EL layer 233. do.

[0107] A colored layer 259 is provided at a position overlapping the light emitting element 230, and a colored layer 259 is provided at a position overlapping the insulating layer 211. The colored layer 259 and the light-shielding layer 257 are covered with an insulating layer 261. The space between the light emitting element 230 and the insulating layer 261 is filled with a sealing layer 213.

[0108] The light-emitting panel has a plurality of transistors in the light extraction section 504 and the driving circuit section 506. The transistor 240 is provided on the insulating layer 205. 01 is bonded to the substrate 503 by the adhesive layer 203. The insulating layer 255 and the substrate 503 are bonded to each other. The insulating layer 205 and the insulating layer 255 are laminated with a low water permeability film. By using the above, it is possible to prevent impurities such as water from entering the light emitting element 230 and the transistor 240. This is preferable because it can improve the reliability of the light-emitting panel. Various materials can be used.

[0109] In the first specific example, the insulating layer 205, the transistor 240, and the light-emitting element 240 are formed on a substrate having high heat resistance. The substrate is peeled off, and an insulating layer 2 is formed on the substrate 201 using an adhesive layer 203. 2 shows a light-emitting panel that can be manufactured by transposing the transistor 240 and the light-emitting element 230. In the specific example 1, the insulating layer 255 and the colored layer 259 are formed on a highly heat-resistant substrate. and a light-shielding layer 257 is formed, the formed substrate is peeled off, and the light-shielding layer 257 is formed on the substrate 503 using an adhesive layer 505. A light-emitting panel can be produced by transposing the insulating layer 255, the colored layer 259, and the light-shielding layer 257. It shows.

[0110] When using a material with high water permeability and low heat resistance (such as resin) for the substrate, Since high temperatures cannot be applied, the conditions for fabricating transistors and insulating films on the substrate are limited. In the manufacturing method of this embodiment, transistors and the like are fabricated on a highly heat-resistant fabrication substrate. This allows the formation of highly reliable transistors and insulating films with sufficiently low water permeability. By transferring them to the substrate 503 or the substrate 201, a highly reliable As a result, in one embodiment of the present invention, a light-emitting panel that is lightweight or thin and A highly reliable light emitting device can be realized. The details of the manufacturing method will be described later.

[0111] It is preferable that the substrate 503 and the substrate 201 are each made of a material having high toughness. This makes it possible to realize a display device that is highly impact resistant and less likely to break. The substrate 201 is an organic resin substrate, and the substrate 202 is a substrate made of a thin metal material or alloy material. This allows for a light-emitting panel that is lighter and less prone to breakage than a glass substrate. It can be achieved.

[0112] Metallic and alloy materials have high thermal conductivity and can easily conduct heat across the entire substrate, making it possible to This is preferable because it can suppress local temperature rises in the panel. The thickness of the substrate is preferably 10 μm or more and 200 μm or less, and more preferably 20 μm or more and 50 μm or less. It is more preferable to do so.

[0113] Furthermore, if a material with high thermal emissivity is used for the substrate 201, the surface temperature of the light-emitting panel will become high. This can prevent the light-emitting panel from being damaged or the reliability from being reduced. A metal substrate and a layer with high thermal emissivity (e.g., metal oxide or ceramic material) can be used. The laminated structure may be a laminated structure of the above-mentioned.

[0114] [Example 2] FIG. 10(A) shows another example of a light extraction section 504 in a light-emitting panel. The light-emitting panel is a touch-operable light-emitting panel. Description of the same configuration as in Example 1 will be omitted.

[0115] The light-emitting panel shown in FIG. 10A includes an element layer 501, an adhesive layer 505, and a substrate 503. The element layer 501 includes a substrate 201, an adhesive layer 203, an insulating layer 205, a plurality of transistors, an insulating layer 206, and a semiconductor device. An edge layer 207, an insulating layer 209, a plurality of light-emitting elements, an insulating layer 211, an insulating layer 217, and a sealing layer 21 3, an insulating layer 261, a colored layer 259, a light-shielding layer 257, a plurality of light-receiving elements, a conductive layer 281, a conductive The insulating layer 283 , the insulating layer 291 , the insulating layer 293 , the insulating layer 295 , and the insulating layer 255 .

[0116] In the specific example 2, an insulating layer 217 is provided on the insulating layer 211. , the distance between the substrate 503 and the substrate 201 can be adjusted.

[0117] FIG. 10A shows an example in which a light-receiving element is provided between an insulating layer 255 and a sealing layer 213. The non-light-emitting region on the substrate 201 side (for example, the region where the transistor 240 and wiring are provided) is overlapped. Since the light receiving element can be arranged in a wide area, the aperture ratio of the pixel (light emitting element) is not reduced. A touch sensor can be provided on the light-emitting panel.

[0118] The light receiving element of the light emitting panel is, for example, a pn-type or pin-type photodiode. In this embodiment, a p-type semiconductor layer 271, an i-type semiconductor layer A pin type photodiode having a conductor layer 273 and an n-type semiconductor layer 275 is used.

[0119] The i-type semiconductor layer 273 contains impurities that give p-type conductivity and impurities that give n-type conductivity. Each item is 1×10 20 atoms / cm 3 The concentration is less than or equal to the photoconductivity. The i-type semiconductor layer 273 contains an element of Group 13 or 15 of the periodic table. In other words, i-type semiconductors are characterized by valence electron control. When the desired impurity element is not intentionally added, it exhibits weak n-type electrical conductivity, i The p-type semiconductor layer 273 is formed by intentionally or after the deposition of an impurity element that imparts p-type conductivity. This category includes substances that are added unintentionally.

[0120] The light-shielding layer 257 overlaps the light-receiving element on the side closer to the substrate 503. The light-shielding layer 257 located between the light-emitting element 230 and the light-receiving element prevents the light emitted by the light-emitting element 230 from being irradiated to the light-receiving element. This can prevent the risk of this happening.

[0121] The conductive layer 281 and the conductive layer 283 are electrically connected to the light receiving element. It is preferable that the light receiving element 1 is made of a conductive layer that transmits light incident on the light receiving element. It is preferable to use a conductive layer that blocks light incident on the light receiving element.

[0122] When the optical touch sensor is provided between the substrate 503 and the sealing layer 213, the light emission of the light emitting element 230 This is preferable because it is less susceptible to the effects of light and can improve the S / N ratio.

[0123] [Example 3] FIG. 10B shows another example of the light extraction section 504 in the light-emitting panel. The light-emitting panel is a touch-operable light-emitting panel.

[0124] The light-emitting panel shown in FIG. 10B has an element layer 501, an adhesive layer 505, and a substrate 503. The element layer 501 includes a substrate 201, an adhesive layer 203, an insulating layer 205, a plurality of transistors, an insulating layer 206, and a semiconductor device. An edge layer 207, an insulating layer 209a, an insulating layer 209b, a plurality of light-emitting elements, an insulating layer 211, an insulating layer 217, a sealing layer 213, a coloring layer 259, a light-shielding layer 257, a plurality of light-receiving elements, a conductive layer 280, It includes a conductive layer 281 and an insulating layer 255 .

[0125] FIG. 10B shows an example in which a light-receiving element is provided between the insulating layer 205 and the sealing layer 213. The light receiving element is provided between the insulating layer 205 and the sealing layer 213 to form a transistor 240. The conductive layer and the semiconductor layer are made of the same material and in the same process as the conductive layer and the semiconductor layer that are electrically connected to the light receiving element. Therefore, the number of manufacturing steps is greatly increased. It is possible to manufacture a light-emitting panel that can be touched without any distortion.

[0126] [Example 4] FIG. 11A shows another example of a light-emitting panel. The light-emitting panel in FIG. 11A is a touch-operated panel. It is a light-emitting panel that can

[0127] The light-emitting panel shown in FIG. 11A includes an element layer 501, an adhesive layer 505, and a substrate 503. The element layer 501 includes a substrate 201, an adhesive layer 203, an insulating layer 205, a plurality of transistors, a conductive layer, and a conductive layer. A conductive layer 556, a conductive layer 557, an insulating layer 207, an insulating layer 209, a plurality of light-emitting elements, an insulating layer 21 1, insulating layer 217, sealing layer 213, coloring layer 259, light-shielding layer 257, insulating layer 255, conductive layer 272, conductive layer 274, insulating layer 276, insulating layer 278, conductive layer 294 and conductive layer 296. Yes.

[0128] In FIG. 11A, a capacitive touch sensor is provided between an insulating layer 255 and a sealing layer 213. The capacitive touch sensor has a conductive layer 272 and a conductive layer 274. .

[0129] The conductive layer 556 and the conductive layer 557 are electrically connected to the FPC 508 via the connector 215. The conductive layer 294 and the conductive layer 296 are electrically connected to the conductive layer 274 via the conductive particles 292. Therefore, the capacitive touch sensor is driven through the FPC508. It is possible.

[0130] [Example 5] Another example of the light-emitting panel is shown in FIG. 11B. The light-emitting panel in FIG. 11B is a touch panel. It is a light-emitting panel that can

[0131] The light-emitting panel shown in FIG. 11B has an element layer 501, an adhesive layer 505, and a substrate 503. The element layer 501 includes a substrate 201, an adhesive layer 203, an insulating layer 205, a plurality of transistors, a conductive layer, and a conductive layer. A conductive layer 556, a conductive layer 557, an insulating layer 207, an insulating layer 209, a plurality of light-emitting elements, an insulating layer 21 1, insulating layer 217, sealing layer 213, coloring layer 259, light-shielding layer 257, insulating layer 255, conductive layer 270 , conductive layer 272 , conductive layer 274 , insulating layer 276 , and insulating layer 278 .

[0132] In FIG. 11B, a capacitive touch sensor is provided between the insulating layer 255 and the sealing layer 213. The capacitive touch sensor has a conductive layer 272 and a conductive layer 274. .

[0133] The conductive layer 556 and the conductive layer 557 are electrically connected to the FPC 508a via the connector 215a. The conductive layer 270 is electrically connected to the FPC 508b via the connection body 215b. Therefore, the light emitting element 230 and the transistor 240 are driven via the FPC 508a. A capacitive touch sensor can be driven via FPC508b.

[0134] [Example 6] FIG. 12A shows another example of a light extraction section 504 in a light-emitting panel.

[0135] The light extraction portion 504 shown in FIG. 12(A) includes a substrate 503, an adhesive layer 505, a substrate 202, An insulating layer 205, a plurality of transistors, an insulating layer 207, a conductive layer 208, an insulating layer 209a, an insulating The light-emitting element includes an edge layer 209b, a plurality of light-emitting elements, an insulating layer 211, a sealing layer 213, and a coloring layer 259. do.

[0136] The light emitting element 230 includes a lower electrode 231, an EL layer 233, and an upper electrode 235. The external electrode 231 is connected to the source electrode or drain electrode of the transistor 240 via the conductive layer 208. The end of the lower electrode 231 is covered with an insulating layer 211. The lower electrode 231 has a light-transmitting property, and the EL layer 23 It transmits the light emitted by 3.

[0137] A colored layer 259 is provided at a position overlapping the light emitting element 230, and the light emitted by the light emitting element 230 is The light emitting element 230 and the substrate 202 are connected to each other via the colored layer 259. The gap is filled with a sealing layer 213. The substrate 202 is made of the same material as the substrate 201 described above. It can be made by

[0138] The touch sensor may be provided on a substrate other than the substrate 503 or the substrate 201. As an example, a touch panel 999 is provided on the substrate 503 as shown in FIG. An example in which a touch panel 999 is provided under the substrate 201 is shown in FIG. The touch panel 999 is formed with a plurality of electrodes and operates as a capacitive touch sensor. It can be made to work.

[0139] [Example 7] FIG. 12B shows another example of a light-emitting panel.

[0140] The light-emitting panel shown in FIG. 12B has an element layer 501, an adhesive layer 505, and a substrate 503. The element layer 501 includes a substrate 202, an insulating layer 205, a conductive layer 310a, a conductive layer 310b, and a plurality of The light-emitting element includes an insulating layer 211 , a conductive layer 212 , and a sealing layer 213 .

[0141] The conductive layer 310a and the conductive layer 310b are external connection electrodes of the light-emitting panel, and are connected to an FPC or the like. It can be electrically connected.

[0142] The light emitting element 230 includes a lower electrode 231, an EL layer 233, and an upper electrode 235. The end of the bottom electrode 231 is covered with an insulating layer 211. The lower electrode 231 has a light-transmitting property and transmits light emitted from the EL layer 233. The conductive layer 212 is electrically connected to the lower electrode 231 .

[0143] The substrate 503 has a hemispherical lens, a microlens array, a concave-convex structure, etc. as a light extraction structure. For example, the resin substrate may have a film on which the above-mentioned The lens or film is attached to the substrate or to a bonding agent having a refractive index similar to that of the lens or film. By bonding with an adhesive or the like, a light extraction structure can be formed.

[0144] The conductive layer 212 is not necessarily provided, but it is preferable to use the conductive layer 212 in order to prevent a voltage drop caused by the resistance of the lower electrode 231. For the same purpose, the upper electrode 235 and the An electrically conductive layer may be provided on the insulating layer 211 to electrically connect the two.

[0145] The conductive layer 212 may be made of copper, titanium, tantalum, tungsten, molybdenum, chromium, or neodymium. Materials selected from the group consisting of aluminum, scandium, nickel, and aluminum, or materials containing these as main components The conductive layer 212 can be formed of a single layer or a stacked layer using an alloy material. The thickness can be 0.1 μm or more and 3 μm or less, and preferably 0.1 μm or more and 0.5 μm or less. Below.

[0146] A paste (such as silver paste) is used as the material for the conductive layer electrically connected to the upper electrode 235. When the conductive layer is heated, the metal constituting the conductive layer becomes granular and aggregates. This results in a structure with many gaps, making it difficult for the EL layer 233 to completely cover the conductive layer. This is preferable because it makes it easier to electrically connect the conductive layer to the insulating layer.

[0147] [Example of materials] Next, materials that can be used for the light-emitting panel will be described. The description of the configuration described above will be omitted.

[0148] The element layer 501 includes at least a light-emitting element. The category includes elements whose luminance is controlled by current or voltage. For example, light-emitting diodes (LEDs), organic EL elements, inorganic EL elements, etc. can be done.

[0149] The element layer 501 further includes transistors for driving light-emitting elements, touch sensors, etc. It may have.

[0150] The structure of the transistor in the light-emitting panel is not particularly limited. For example, a staggered transistor The transistor may be a top gate transistor or an inverted staggered transistor. The transistor may have either a top gate type or a bottom gate type structure. The semiconductor material is not particularly limited, and examples thereof include silicon and germanium. , In-Ga-Zn-based metal oxides, etc. An oxide semiconductor including one of these may be used.

[0151] The crystallinity of the semiconductor material used in the transistor is not particularly limited. A semiconductor having crystallinity (a microcrystalline semiconductor, a polycrystalline semiconductor, a single crystal semiconductor, or a semiconductor having a partially crystalline region) If a semiconductor having crystallinity is used, the This is preferable because it is possible to suppress deterioration of the resistor characteristics.

[0152] The light-emitting element of the light-emitting panel has a pair of electrodes (a lower electrode 231 and an upper electrode 235) and The light-emitting device has an EL layer 233 provided between the pair of electrodes. One of the pair of electrodes is an anode. one functions as a cathode and the other as a cathode.

[0153] The light-emitting element is available in a top emission structure, bottom emission structure, and dual emission structure. The electrode on the light extraction side is provided with a conductive film that transmits visible light. In addition, a conductive film that reflects visible light can be used for the electrode on the side from which light is not extracted. preferable.

[0154] The conductive film that transmits visible light is, for example, indium oxide or indium tin oxide (ITO). Indium Tin Oxide, Indium Zinc Oxide, Zinc Oxide, Gallium-doped It can be formed using zinc oxide with added metals. It can also be formed using gold, silver, platinum, magnesium , nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, if Metallic materials such as titanium, alloys containing these metallic materials, or nitrides of these metallic materials (e.g. For example, titanium nitride can be used by forming it thin enough to have light transmission properties. A laminated film of the above materials can also be used as the conductive layer. For example, a layer of silver and magnesium It is preferable to use a laminated film of an alloy of tungsten and ITO, since the electrical conductivity can be increased. Graphene or the like may also be used.

[0155] The conductive film that reflects visible light is made of, for example, aluminum, gold, platinum, silver, nickel, tungsten, etc. Metallic materials such as stainless steel, chromium, molybdenum, iron, cobalt, copper, or palladium, or In addition, the above-mentioned metal materials and alloys may be used. Tungsten, neodymium, germanium, etc. may be added. Aluminum alloys such as tungsten alloys, aluminum-nickel alloys, and aluminum-neodymium alloys Alloys containing palladium (aluminum alloys), silver and copper alloys, silver, palladium and copper alloys, It can be formed using an alloy containing silver, such as an alloy of silver and magnesium. The alloy is preferable because of its high heat resistance. By laminating the metal oxide film, the oxidation of the aluminum alloy film can be suppressed. Examples of materials for the metal film and metal oxide film include titanium and titanium oxide. A conductive film that transmits visible light and a film made of a metal material may be laminated. For example, silver and ITO A laminated film of an alloy of silver and magnesium and ITO, or the like can be used.

[0156] The electrodes may be formed by vapor deposition or sputtering. The shape is created using a discharge method such as the ink jet method, a printing method such as the screen printing method, or a plating method. It can be achieved.

[0157] A voltage higher than the threshold voltage of the light emitting element is applied between the lower electrode 231 and the upper electrode 235. When this occurs, holes are injected into the EL layer 233 from the anode side, and electrons are injected from the cathode side. The electrons and holes are recombined in the EL layer 233, and the light-emitting material contained in the EL layer 233 emits light. It shines.

[0158] The EL layer 233 has at least a light-emitting layer. The EL layer 233 has the following layers other than the light-emitting layer: Materials with high hole injection properties, materials with high hole transport properties, hole blocking materials, materials with high electron transport properties A material with high electron injection properties or a bipolar material (with high electron transport and hole transport properties) The layer may further include a layer containing a material such as a metal.

[0159] The EL layer 233 can be made of either a low molecular weight compound or a high molecular weight compound. The layers constituting the EL layer 233 may each be formed by deposition (vacuum deposition). It can be formed by methods such as the transfer method, printing method, inkjet method, coating method, etc. Cut.

[0160] In the element layer 501, the light-emitting element is provided between a pair of insulating films having low water permeability. This makes it possible to prevent impurities such as water from entering the light emitting element, and the light emitting This makes it possible to suppress deterioration in the reliability of the device.

[0161] Insulating films with low water permeability include silicon nitride films and silicon oxynitride films, which are made of nitrogen and silicon. and films containing nitrogen and aluminum, such as an aluminum nitride film. A silicon oxide film, a silicon oxynitride film, an aluminum oxide film, or the like may also be used.

[0162] For example, the water vapor permeability of an insulating film with low water permeability is 1×10 -5 [g / m 2 ·day] or later Lower, preferably 1 x 10 -6 [g / m 2 ·day] or less, preferably 1×10 -7 [ g / m 2 ·day] or less, and more preferably 1×10 -8 [g / m 2 ·day] or less do.

[0163] The substrate 503 has a light-transmitting property and transmits at least the light emitted by the light-emitting element included in the element layer 501. The substrate 503 may be flexible. The refractive index of the substrate 503 is set to be equal to that of the atmosphere. higher than the refractive index.

[0164] Since organic resin is lighter than glass, when organic resin is used as the substrate 503, This is preferable because it allows the light-emitting device to be made lighter than when glass is used.

[0165] Examples of materials having flexibility and transparency to visible light include materials having flexibility. Thickness of glass, polyethylene terephthalate (PET), polyethylene naphthalate Polyester resins such as (PEN), polyacrylonitrile resins, polyimide resins, methacrylate resin, polycarbonate (PC) resin, polyethersulfone (PE S) Resin, polyamide resin, cycloolefin resin, polystyrene resin, polyamide imide In particular, materials with a low thermal expansion coefficient are used. For example, polyamide-imide resin, polyimide resin, PET, etc. are preferably used. In addition, a substrate in which glass fiber is impregnated with organic resin or an inorganic filler is impregnated with organic resin can be used. It is also possible to use a substrate having a lower thermal expansion coefficient by mixing with a

[0166] The substrate 503 is a layer made of the above-mentioned material, which serves as a protective layer for protecting the surface of the light-emitting device from scratches. Hard coat layers (e.g., silicon nitride layers, etc.) and layers of materials that can disperse pressure (e.g., The light-emitting element may be laminated with a layer of a material such as an aramid resin layer. In order to suppress a decrease in the life span of the element, the element may have the insulating film having low water permeability as described above.

[0167] The adhesive layer 505 has a light-transmitting property and transmits at least the light emitted by the light-emitting element of the element layer 501. In addition, the refractive index of the adhesive layer 505 is higher than the refractive index of the air.

[0168] The adhesive layer 505 is made of a resin that hardens at room temperature, such as a two-liquid mixed resin, or a photocurable resin. Resins such as thermosetting resins can be used. For example, epoxy resins, acrylic resins, etc. Examples of resins that can be used include epoxy resins, silicone resins, and phenol resins. Low temperature materials are preferred.

[0169] The resin may contain a desiccant. For example, an oxide of an alkaline earth metal (an acid The material used is one that adsorbs moisture by chemical adsorption, such as calcium chloride or barium oxide. Alternatively, materials such as zeolite and silica gel can absorb water by physical adsorption. If a desiccant is included, impurities such as moisture may be absorbed by the light emitting element. This is preferable because it is possible to suppress the intrusion of foreign matter and improve the reliability of the light emitting device.

[0170] In addition, by mixing the above resin with a filler having a high refractive index (such as titanium oxide), the light emission This is preferable because it can improve the light extraction efficiency from the element.

[0171] The adhesive layer 505 may also include a scattering member that scatters light. The layer 505 may be made of a mixture of the above resin and particles having a different refractive index than the above resin. The particles function as light scattering members.

[0172] The difference in refractive index between the resin and the particles having a refractive index different from that of the resin is preferably 0.1 or more. More preferably, the ratio is 0.3 or more. The particles may be titanium oxide, imide resin, silicone, or the like. Examples of the usable materials include carbide, barium oxide, and zeolite.

[0173] Titanium oxide and barium oxide particles are preferred because they have a strong light scattering property. By using o-lite, water contained in resins can be adsorbed, improving the reliability of light-emitting devices. It can be done.

[0174] The insulating layer 205 and the insulating layer 255 can be made of an inorganic insulating material. It is preferable to use an insulating film with low water permeability because this allows a highly reliable light-emitting panel to be realized.

[0175] The insulating layer 207 has an effect of suppressing the diffusion of impurities into the semiconductor that constitutes the transistor. The insulating layer 207 may be a silicon oxide film, a silicon oxynitride film, or an aluminum oxide film. For example, an inorganic insulating film such as a film can be used.

[0176] The insulating layer 209, the insulating layer 209a, and the insulating layer 209b are each a transistor. It is preferable to select an insulating film having a planarizing function in order to reduce surface irregularities caused by the deposition of silicon. For example, organic materials such as polyimide, acrylic, and benzocyclobutene resins can be used. In addition to the above organic materials, low-dielectric constant materials (low-k materials) can be used. It is possible to laminate a plurality of insulating films or inorganic insulating films made of these materials. stomach.

[0177] The insulating layer 211 is provided to cover the end of the lower electrode 231. In order to improve the coverage of the EL layer 233 and the upper electrode 235 formed on the insulating layer 2, It is preferable that the side wall of 11 is an inclined surface formed with a continuous curvature.

[0178] The material of the insulating layer 211 may be a resin or an inorganic insulating material. Examples of the resin include polyimide resin, polyamide resin, acrylic resin, siloxane resin, and epoxy resin. In particular, the insulating layer 211 can be easily produced. It is preferable to use a negative photosensitive resin or a positive photosensitive resin because it is easy to stomach.

[0179] The method for forming the insulating layer 211 is not particularly limited, but may be a photolithography method, a sputtering method, or the like. , deposition method, droplet ejection method (inkjet method, etc.), printing method (screen printing, offset printing It is advisable to use a printing method, etc.

[0180] The insulating layer 217 may be formed using an inorganic insulating material, an organic insulating material, a metal material, or the like. For example, organic insulating materials include negative and positive photosensitive resins, non-photosensitive resins, Metal materials such as titanium and aluminum can be used. A conductive material is used for the insulating layer 217, and the insulating layer 217 and the upper electrode 235 are electrically connected to each other. By adopting a configuration in which the upper electrode 235 is electrically connected, it is possible to suppress a potential drop caused by the resistance of the upper electrode 235. Furthermore, the insulating layer 217 may have a forward tapered shape or an inverse tapered shape.

[0181] The insulating layer 276, the insulating layer 278, the insulating layer 291, the insulating layer 293, and the insulating layer 295 are In particular, the insulating layer 278 and the insulating layer 29 can be formed using an inorganic insulating material or an organic insulating material. 5. The use of an insulating layer having a flattening function to reduce surface irregularities caused by the sensor element. is preferred.

[0182] The sealing layer 213 is made of a resin that hardens at room temperature, such as a two-liquid mixed resin, or a photocurable resin. Resins such as thermosetting resins can be used. For example, PVC (polyvinyl chloride) ide) resin, acrylic resin, polyimide resin, epoxy resin, silicone resin, PVB( Polyvinyl butyral (PVB) resin, EVA (ethylene vinyl acetate) resin, etc. can be used. The sealing layer 213 may contain a desiccant. When the light from the optical element 230 is extracted to the outside of the light-emitting panel, the sealing layer 213 is provided with a high refractive index. It is preferable that the ink contains a filler or a scattering material. The same materials that can be used for the adhesive layer 505 can be used.

[0183] The conductive layer 556, the conductive layer 557, the conductive layer 294, and the conductive layer 296 are transistors. The conductive layer constituting the transistor or light-emitting element can be formed using the same material and in the same process. The conductive layer 280 can be formed using the same material and process as the conductive layers constituting the transistors.

[0184] For example, the conductive layers may be made of molybdenum, titanium, chromium, tantalum, or tungsten. Metallic materials such as zinc, aluminum, copper, neodymium, scandium, etc., or materials containing these elements The conductive layer can be formed of a single layer or a stacked layer using an alloy material. Each of the conductive metal oxides may be used. Indium (In2O3, etc.), tin oxide (SnO2, etc.), zinc oxide (ZnO), ITO, Indium zinc oxide (In2O3-ZnO, etc.) or these metal oxide materials with silicon oxide Containing kon can be used.

[0185] In addition, the conductive layer 208, the conductive layer 212, the conductive layer 310a, and the conductive layer 310b are also The insulating film 11 can be formed using the above-mentioned metal materials, alloy materials, conductive metal oxides, or the like.

[0186] The conductive layers 272 and 274, and the conductive layers 281 and 283 have a light-transmitting property. For example, indium oxide, ITO, indium zinc oxide, zinc oxide The conductive layer 270 may be made of zinc oxide doped with lead or gallium. It can be formed using the same materials and processes as 272.

[0187] The conductive particles 292 are particles of organic resin or silica coated with a metal material. Nickel or gold is preferable as the metal material because it can reduce the contact resistance. In addition, there are particles that are coated with layers of two or more metal materials, such as nickel coated with gold. It is preferable to use a child.

[0188] The connector 215 is a thermosetting resin containing metal particles or particles similar to the conductive particles described above. A paste or sheet-like material containing a mixture of ferrite and fluorine is used, and the material is bonded by thermocompression to give it anisotropic conductivity. As the metal particles, for example, nickel particles coated with gold can be used. It is preferable to use particles having layers of two or more metals, such as those having layers of two or more metals.

[0189] The colored layer 259 is a colored layer that transmits light of a specific wavelength band. For example, the red wavelength band A red (R) color filter transmits light in the red wavelength range, and a green (G) color filter transmits light in the green wavelength range. A color filter that transmits light in the blue wavelength band, and a blue (B) color filter that transmits light in the blue wavelength band are used. Each color layer can be formed by using various materials, by printing, inkjet printing, photolithography, etc. They are formed at desired positions by an etching method using lithography or the like.

[0190] In addition, a light-shielding layer 257 is provided between adjacent colored layers 259. The light-shielding layer 257 is This blocks light that is coming around from adjacent light emitting elements, thereby suppressing color mixing between adjacent pixels. The end of the colored layer 259 is provided so as to overlap with the light-shielding layer 257, thereby suppressing light leakage. The light-shielding layer 257 can be made of a material that blocks light emitted from the light-emitting element. The insulating layer 11 can be formed by using a metal material or a resin material containing a pigment or a dye. As shown in (A), the light shielding layer 257 is disposed on the driving circuit section 506 and other parts other than the light extraction section 504. It is preferable to provide the insulating film in the region, since unintended light leakage due to guided light or the like can be suppressed.

[0191] In addition, when an insulating layer 261 is provided to cover the colored layer 259 and the light-shielding layer 257, This is preferable because it can suppress the diffusion of impurities such as pigments contained in the optical layer 257 to the light emitting element and the like. It is preferable that the insulating layer 261 is made of a light-transmitting material, and that an inorganic insulating material or an organic insulating material is used. The insulating layer 261 may be made of the insulating film having low water permeability.

[0192] The above is an explanation of one example of the material.

[0193] [Example of manufacturing method] Next, a method for manufacturing a light-emitting panel will be illustrated with reference to FIGS. 13 and 14. The following description will be given taking the light-emitting panel having the configuration shown in FIG. 1 (FIG. 9B) as an example.

[0194] First, a release layer 303 is formed on a substrate 301, and an insulating layer 205 is formed on the release layer 303. Next, a plurality of transistors, a conductive layer 557, an insulating layer 207, and an insulating film are formed on the insulating layer 205. An edge layer 209, a plurality of light-emitting elements, and an insulating layer 211 are formed. Note that the conductive layer 557 is exposed. In this manner, the insulating layer 211, the insulating layer 209, and the insulating layer 207 are opened (FIG. 13(A)). ).

[0195] In addition, a peeling layer 307 is formed on the production substrate 305, and an insulating layer 255 is formed on the peeling layer 307. Next, a light-shielding layer 257, a colored layer 259, and an insulating layer 261 are formed on the insulating layer 255. (Figure 13(B)).

[0196] The substrates 301 and 305 are made of a glass substrate, a quartz substrate, and a surface treatment substrate, respectively. A fiber substrate, a ceramic substrate, a metal substrate, etc. can be used.

[0197] The glass substrate may be made of, for example, aluminosilicate glass or aluminoborosilicate glass. Glass materials such as quartz glass, barium borosilicate glass, etc. can be used. If the degree of hardness is high, it is advisable to use a material with a strain point of 730°C or higher. By adding more BaO, a more practical heat-resistant glass can be obtained. Russ etc. can be used.

[0198] When a glass substrate is used as the substrate, a silicon oxide film, an acid film, etc. are interposed between the substrate and the peeling layer. When an insulating film such as a silicon oxynitride film, a silicon nitride film, or a silicon oxynitride film is formed, the glass This is preferable because it can prevent contamination from the substrate.

[0199] The peeling layers 303 and 307 are made of tungsten, molybdenum, and titanium, respectively. Tantalum, Niobium, Nickel, Cobalt, Zirconium, Zinc, Ruthenium, Rhodium An element selected from the group consisting of ruthenium, palladium, osmium, iridium, and silicon, It is made of an alloy material or a compound material containing the element, and is a single layer or a laminated layer. The crystal structure of the layer containing silicon may be any of amorphous, microcrystalline, and polycrystalline.

[0200] The release layer can be formed by a sputtering method, a plasma CVD method, a coating method, a printing method, etc. The coating method includes a spin coating method, a droplet ejection method, and a dispense method.

[0201] When the peeling layer has a single layer structure, it is preferably a tungsten layer, a molybdenum layer, or a combination of tungsten and molybdenum. It is preferable to form a layer containing a mixture of tungsten and tungsten oxide. A layer containing an oxynitride, a layer containing an oxide or oxynitride of molybdenum, or a layer containing a tungsten oxide or nitride. Alternatively, a layer containing an oxide or oxynitride of a mixture of fluorine and molybdenum may be formed. A mixture of tungsten and molybdenum is, for example, a mixture of tungsten and molybdenum. Correct.

[0202] In addition, a layer including tungsten and a layer including a tungsten oxide may be used as the peeling layer. When forming a structure, a layer containing tungsten is formed, and an insulating layer formed of oxide is formed on the layer. By forming a film, a tungsten oxide-containing film is formed at the interface between the tungsten layer and the insulating film. Alternatively, the surface of the layer containing tungsten may be subjected to a thermal oxidation treatment. Treatment with oxygen plasma, nitrous oxide (N2O) plasma, ozone water, and other highly oxidizing agents A layer containing tungsten oxide may be formed by treating with a solution or the like. Treatment and heating may be carried out using oxygen, nitrogen, or nitrous oxide, either alone or in combination with other gases. The above plasma treatment or heat treatment may be performed under a mixed gas atmosphere. By changing the temperature, it is possible to control the adhesion between the release layer and the insulating film that will be formed later. be.

[0203] Each insulating layer is formed by using a sputtering method, a plasma CVD method, a coating method, a printing method, etc. For example, it is possible to form a thin film at a temperature of 250°C or higher and 400°C or higher by plasma CVD. By forming the membrane at a temperature of 0.4 °C or lower, it is possible to obtain a dense membrane with extremely low water permeability.

[0204] Thereafter, the surface of the production substrate 305 on which the colored layer 259 and the like are provided or the light-emitting element of the production substrate 301 is A material for the sealing layer 213 is applied to the surface on which the chip 230 and the like are provided, and the The surfaces are glued together (Figure 13(C)).

[0205] Then, the fabricated substrate 301 is peeled off, and the exposed insulating layer 205 and substrate 201 are bonded to the adhesive layer 20. 3. The manufacturing substrate 305 is peeled off, and the exposed insulating layer 255 and the substrate 14A, the substrate 503 is attached to the conductive layer 505 using an adhesive layer 505. Although the conductive layer 557 does not overlap with the substrate 503, the conductive layer 557 and the substrate 503 may overlap with each other.

[0206] For example, a peeling layer may be formed by a method using a film made of a When a layer including a metal oxide film is formed on the side in contact with the peeling layer, the metal oxide film is crystallized. The layer to be peeled off can be peeled off from the substrate by weakening the layer to be peeled off. When an amorphous silicon film containing hydrogen is formed as a peeling layer between the substrate and the peeled layer, the laser beam The amorphous silicon film is removed by irradiation or etching, so that the layer to be peeled off is separated from the production substrate. The peeling layer can be peeled off from the layer to be peeled off. The metal oxide film is weakened by crystallization, and a part of the peeling layer is dissolved in a solution or NF. 3. After removal by etching using fluoride gas such as BrF3 or ClF3, the material was weakened. It can be peeled off at the metal oxide film. Furthermore, nitrogen, oxygen, hydrogen, etc. can be used as a peeling layer. (e.g., hydrogen-containing amorphous silicon film, hydrogen-containing alloy film, oxygen-containing alloy film, etc.) The peeling layer is irradiated with laser light to release nitrogen, oxygen, and hydrogen contained in the peeling layer as gas. A method of promoting peeling between the peeled layer and the substrate by exposing the peeled layer to the substrate may also be used. The substrate is mechanically removed or fluorinated with a solution or fluoride gas such as NF3, BrF3, or ClF3. In this case, the peeling layer is not required. good.

[0207] In addition, the peeling process can be performed more easily by combining a plurality of the above peeling methods. In other words, laser irradiation, etching of the peeling layer with gas or solution, sharp knife or Mechanical removal is performed using a scalpel or similar tool to make the peeling layer and the layer to be peeled easier to peel off. Peeling can also be achieved by physical force (mechanically, etc.).

[0208] In addition, a liquid is permeated into the interface between the release layer and the layer to be peeled off, and the layer to be peeled off is peeled off from the substrate. Also, the peeling may be performed while pouring liquid such as water on the film.

[0209] As for other peeling methods, when the peeling layer is made of tungsten, it is possible to use ammonia water and The peeling layer may be etched with a mixed solution of hydrogen peroxide and water to perform the peeling.

[0210] In addition, if peeling can be performed at the interface between the preparation substrate and the layer to be peeled off, a peeling layer may not be provided. For example, glass is used as the substrate, and an organic resin such as polyimide is formed on the glass. Then, an insulating film, a transistor, etc. are formed on the organic resin. In this case, the organic resin is heated. By this, it is possible to peel off the substrate at the interface between the substrate and the organic resin. A metal layer is placed between the resin and the organic resin, and an electric current is passed through the metal layer to heat the metal layer. Peeling may occur at the oil interface.

[0211] Finally, the insulating layer 255 and the sealing layer 213 are opened to expose the conductive layer 557. (FIG. 14B). In addition, in the case where the substrate 503 overlaps with the conductive layer 557, The adhesive layer 505 is also opened (FIG. 14(C)). Laser ablation, etching, ion beam sputtering, etc. Also, a sharp blade or the like is used to make a cut in the film on the conductive layer 557, and the film is cut by physical force. A part of the material may be peeled off.

[0212] In this manner, a light-emitting panel can be manufactured.

[0213] As described above, the light-emitting panel of the present embodiment includes the substrate 503 and the substrate 201 or the substrate The touch sensor is also included in the configuration. By minimizing the number of substrates, the light extraction efficiency and This facilitates clarity of display.

[0214] [Variations] A light-emitting panel that is partially different from the above will be described below with reference to FIG.

[0215] The light-emitting panel shown in FIG. 15 includes a substrate 401, a transistor 240, a light-emitting element 230, and an insulating Layer 207, insulating layer 209, insulating layer 211, insulating layer 217, space 405, insulating layer 261, shielding The optical layer 257, the colored layer 259, the light receiving element (p-type semiconductor layer 271, i-type semiconductor layer 273, n-type semiconductor layer 275), conductive layer 281, conductive layer 283, insulating layer 291, insulating layer 2 93 , an insulating layer 295 , and a substrate 403 .

[0216] The light-emitting panel includes a light-emitting element 230 and a light-receiving element between a substrate 401 and a substrate 403. The adhesive layer (not shown) is arranged in a frame shape so as to cover the substrate 401 and the substrate 402. The light emitting element 230 is sealed by the plate 403 .

[0217] In the light-emitting panel of this embodiment, the substrate 403 has a light-transmitting property. The light emitted passes through the colored layer 259, the substrate 403, and the like and is extracted into the atmosphere.

[0218] The light-emitting panel of this embodiment is a touch-operable light-emitting panel. The proximity or contact of an object to be detected with the surface of the substrate 403 can be detected using an optical element.

[0219] Optical touch sensors have no effect on detection accuracy even if the surface that the object touches is scratched. Therefore, it is preferable because it is highly durable. In addition, optical touch sensors are non-contact sensing. It is possible to apply the same to a display device without reducing the clarity of the image. It is also possible to apply the same to a large light-emitting panel or display. Another advantage is that it can be applied to display devices.

[0220] When the optical touch sensor is provided between the substrate 403 and the space 405, the light emitted by the light emitting element 230 This is preferable because it is less susceptible to the effects of noise and can improve the S / N ratio.

[0221] The light-shielding layer 257 overlaps the light-receiving element on the side closer to the substrate 403. This can prevent the light emitted by the light emitting element 230 from being irradiated onto the light receiving element.

[0222] There is no particular limitation on the materials used for the substrate 401 and the substrate 403. The substrate on the other side is made of a material that transmits the light. For example, a thin glass substrate that is flexible is used. Materials such as quartz, ceramic, sapphire, and organic resin can be used. The substrate on the side not exposed does not need to have light-transmitting properties. In addition to the substrates listed above, A metal substrate using a metal material or an alloy material may also be used. The plate 403 can be made of the substrate materials exemplified in the previous embodiments.

[0223] The sealing method of the light-emitting panel is not limited, and may be, for example, solid sealing or hollow sealing. For example, glass materials such as glass frit and two-liquid mixed resins that harden at room temperature For example, a resin material such as a light-curable resin, a photocurable resin, or a thermosetting resin can be used. The space 405 may be filled with an inert gas such as nitrogen or argon, and the sealing layer 21 It may be filled with the same resin as in 3. In addition, the resin may contain the above-mentioned desiccant, a high refractive index agent, etc. Fillers or scattering materials may also be included.

[0224] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0225] (Embodiment 3) In this embodiment, examples of electronic devices and lighting devices to which the display device of one embodiment of the present invention is applied will be described. This will be described with reference to the drawings.

[0226] As an example of an electronic device that uses a display device having a flexible shape, a television Television equipment (also called television or television receiver), computer monitors, display devices, etc. Digital cameras, digital video cameras, digital photo frames, mobile phones (mobile phones , also known as mobile phone devices), portable game machines, portable information terminals, audio playback devices, pachinko machines and other large game consoles.

[0227] In addition, lighting devices and display devices can be installed on the interior or exterior walls of houses and buildings, and on the interior or exterior of automobiles. It is also possible to incorporate it along the curved surface of the equipment.

[0228] 17(A) and 17(B) show an example of a tablet terminal 9600 that can be folded in half. In addition, although an example of folding in two is shown here, it is also possible to fold in three or four, etc. FIG. 17A shows a tablet terminal 9600 in an open state. In this state, the tablet terminal 9600 includes a housing 9630, a display unit 9631, and a display mode Switch 9626, power switch 9627, power saving mode switch 96 25, a fastener 9629, and an operating switch 9628.

[0229] The housing 9630 includes a housing 9630a and a housing 9630b. 30b are connected by a hinge portion 9639. The housing 9630 is also connected by a hinge portion 9639. 639 allows it to be folded in half.

[0230] The display unit 9631 includes a housing 9630a, a housing 9630b, and a hinge portion 9639. By using the display device disclosed in this specification for the display portion 9631, This allows the display portion 9631 to be bent, making it possible to provide a highly reliable tablet terminal. become.

[0231] A part of the display unit 9631 can be used as a touch panel area 9632. Data can be input by touching the operation keys 9638. For example, half of the area may have a display function and the other half may be used as a touch panel. In addition, the entire area of ​​the display unit 9631 can be configured to have a touch panel function. For example, the entire surface of the display portion 9631 may be provided with a keyboard. It can also be used as a data entry terminal by displaying a button.

[0232] A display mode changeover switch 9626 changes the display orientation, such as vertical or horizontal. You can choose between black and white and color display. The 9625 uses a light sensor built into the tablet device to detect external light during use. The tablet device has a light sensor, which can adjust the display brightness to suit the amount of light. In addition to the sensor, other detection devices such as gyro, acceleration sensor, etc. that detect the inclination are also included. It may be built-in.

[0233] FIG. 17B shows the tablet terminal 9600 in a closed state. The display 600 includes a housing 9630, a solar cell 9633, and a charge / discharge control circuit 9634. In FIG. 17B, a battery 9635 and a DCDC controller are used as an example of a charge / discharge control circuit 9634. 96 shows a configuration having an inverter 9636.

[0234] By using the display device disclosed in this specification for the display portion 9631, For example, the tablet 9600 can be folded in half. The housing 9630 can be closed when not in use. This protects the display unit 9631, making it highly durable and portable, and ideal for long-term use. This makes it possible to produce a highly reliable tablet-type terminal.

[0235] In addition, the tablet terminals shown in Figs. 17(A) and 17(B) can be used in various Functions that display information (still images, videos, text images, etc.), calendars, dates, or times A function to display information on the display unit, and a function to input or edit information displayed on the display unit. It has input functions, functions to control processing by various software (programs), etc. It is possible.

[0236] The solar cell 9633 attached to the surface of the tablet device supplies power to the touch panel. The solar cell 9633 can supply the solar cell 9633 with the following components: The battery 9635 is charged by the battery 9635 provided on one or two surfaces of the housing 9630. This is preferable because it can be used with a lithium ion battery. This has the advantage of enabling miniaturization.

[0237] The configuration and operation of the charge / discharge control circuit 9634 shown in FIG. A block diagram is shown in FIG. 17(C) and will be explained. FIG. 17(C) shows a solar cell 9633, a battery 9 635, DC-DC converter 9636, converter 9637, switches SW1 to SW3 , a display unit 9631, a battery 9635, a DC-DC converter 963 6. The converter 9637 and the switches SW1 to SW3 are configured to perform the charge / discharge control shown in FIG. 17(B). This corresponds to the circuit 9634 .

[0238] First, an example of operation in which power is generated by the solar cell 9633 using external light will be described. The power generated by the solar cell is converted to DC voltage to charge the Battery 9635. The voltage is increased or decreased by the DC converter 9636. When power is being used from the solar cell 9633, switch SW1 is turned on and the converter 9 The voltage is increased or decreased to a voltage required for the display unit 9631 by the display unit 9637. When not displaying on the 631, turn SW1 off and SW2 on to charge the battery. 635 may be configured to charge the battery.

[0239] The solar cell 9633 is shown as an example of a power generating means, but is not limited thereto. Other power generation methods such as piezoelectric elements and thermoelectric conversion elements (Peltier elements) For example, the battery 9635 may be charged. A non-contact power transmission module that receives and charges, or a structure that combines other charging methods It may also be composed of.

[0240] Note that the above-described electronic devices and lighting devices each include a display device according to one embodiment of the present invention. It goes without saying that the present invention is not particularly limited to the above.

[0241] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination. [Explanation of symbols]

[0242] 100 Light emitting device 101 Light-emitting panel 102 Protective layer 110 Cabinet 111 Cabinet 112 Cabinet 113 Cabinet 121 Ferromagnetic materials 122 Soft magnetic material 201 Substrate 202 Substrate 203 Adhesive layer 205 Insulating layer 207 Insulating Layer 208 Conductive Layer 209 Insulating Layer 209a Insulating layer 209b Insulating layer 211 Insulating layer 212 Conductive layer 213 Sealing layer 215 Connectors 215a Connector 215b Connector 217 Insulating Layer 230 Light emitting element 231 Lower Electrode 233 EL layer 235 Upper electrode 240 Transistor 255 Insulation Layer 257 Light blocking layer 259 Colored layer 261 Insulating Layer 270 Conductive Layer 271 p-type semiconductor layer 272 Conductive Layer 273 i-type semiconductor layer 274 Conductive Layer 275 n-type semiconductor layer 276 Insulating Layer 278 Insulating Layer 280 Conductive Layer 281 Conductive Layer 283 Conductive Layer 291 Insulating Layer 292 Conductive Particles 293 Insulating Layer 294 Conductive Layer 295 Insulating Layer 296 Conductive Layer 301 Preparation Board 303 Peeling layer 305 Preparation Board 307 Peeling layer 310a conductive layer 310b conductive layer 401 Substrate 403 Substrate 405 Space 501 Element Layer 503 Substrate 504 Light extraction section 505 Adhesive layer 506 Drive circuit section 508 FPC 508a FPC 508b FPC 556 Conductive Layer 557 Conductive Layer 999 Touch Panel 9600 Tablet PC 9625 Switch 9626 Switch 9627 Power Switch 9628 Operation Switch 9629 Fastener 9630 Case 9631 Display section 9632 area 9633 Solar Cells 9634 Charge / discharge control circuit 9635 Battery 9636 DC-DC Converter 9637 Converter 9638 Operation key 9639 Hinge part 9630a Case 9630b Case

Claims

1. An electronic device having a first form in which a display unit is unfolded and a second form in which the display unit is folded, a light-emitting panel, a first protective layer adhered to a back surface of the light-emitting panel, a second protective layer disposed on a front surface side of the light-emitting panel, a first housing and a second housing having lower flexibility than the light-emitting panel, a first magnet adhered to the first housing, and a second magnet adhered to the second housing; In the first embodiment, each of the first magnet and the second magnet has an area overlapping with the first protective layer, In the first embodiment, the second protective layer does not have an area overlapping the display unit, In the first embodiment, the light-emitting panel has a first region that overlaps with a gap between the first housing and the second housing, In the first embodiment, each of the first protective layer and the second protective layer has an area overlapping with the first area, In the second embodiment, a region of the first housing overlapping with the first magnet is disposed to face a region of the second housing overlapping with the second magnet, In the second embodiment, the first magnet and the second magnet have a function of fixing a relative positional relationship between the first housing and the second housing. electronic equipment.

2. An electronic device having a first form in which a display unit is unfolded and a second form in which the display unit is folded, a light-emitting panel, a first protective layer adhered to a back surface of the light-emitting panel, a second protective layer disposed on a front surface side of the light-emitting panel, a first housing and a second housing having lower flexibility than the light-emitting panel, a first magnet adhered to the first housing, and a second magnet adhered to the second housing; In the first embodiment, each of the first magnet and the second magnet has an area overlapping with the first protective layer, In the first embodiment, the second protective layer does not have an area overlapping the display unit, In the first embodiment, the light-emitting panel has a first region that overlaps with a gap between the first housing and the second housing, In the first embodiment, each of the first protective layer and the second protective layer has an area overlapping with the first area, In the second embodiment, a region of the first housing overlapping with the first magnet is disposed to face a region of the second housing overlapping with the second magnet, In the second embodiment, the first magnet and the second magnet have a function of fixing a relative positional relationship between the first housing and the second housing, the first protective layer comprises a metal or an alloy; electronic equipment.

3. In claim 1 or 2, In the first embodiment, the first protective layer has an area overlapping the display unit. electronic equipment.

4. In any one of claims 1 to 3, The first protective layer is adhered to the back surface of the light-emitting panel with a sheet-like adhesive. electronic equipment.

5. In any one of claims 1 to 4, In the second embodiment, the light-emitting panel is non-light-emitting. electronic equipment.

6. In any one of claims 1 to 5, The light-emitting panel is an active matrix type. electronic equipment.

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