Testing device and testing method

Abstract

To reduce influences of the kind of a sheet, an adhesion state between a test piece and the sheet, etc., in measuring deflective strength even while adhering the test piece to the sheet.SOLUTION: A testing device measures a load in a case where a test piece in a thin plate shape is destroyed. The testing device comprises: a sheet unit holding a sheet to be adhered to the test piece and used for adhering the sheet of the first face of the test piece out of the first face and the second face which is positioned at the opposite side of the first face in the thickness direction of the test piece; an indenter which presses the first face of the test piece via the sheet; a load measurement instrument for measuring a load applied to the test piece in a case where the indenter presses the test piece; and a test piece receiving part including a pair of receiving portions disposed so as to hold the tip end of the indenter therebetween in a plan view and brought into contact with the second face of the test piece in the case where the indenter presses the test piece.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a testing device for measuring the load at which a thin plate-like test piece breaks, and a testing method for measuring the load at which a thin plate-like test piece breaks. [Background technology]

[0002] It has been known that there is a certain relationship between the state of the ground surface of a semiconductor wafer thinned by grinding and the flexural strength of the chips formed by dividing the semiconductor wafer into a plurality of pieces through grinding. Therefore, appropriate grinding conditions for the semiconductor wafer are sometimes selected with reference to the flexural strength of the chips.

[0003] The flexural strength is also called the three-point bending strength, which is calculated based on the maximum load when a test piece is broken by placing a chip (i.e., a test piece) on two supports that are spaced a certain distance apart and applying a load with an indenter to a point in the center between the supports (see, for example, Patent Document 1).

[0004] However, when a load is applied to a test specimen by lowering an indenter while the test specimen is placed on two supports, the test specimen breaks into pieces and scatters, necessitating regular cleaning.

[0005] In response to this, a testing device has been developed in which a tape (i.e., a sheet having an adhesive layer) is adhered to almost the entire surface of one side of a test piece, and then an indenter is used to press the other side of the test piece, which is located on the opposite side in the thickness direction of the test piece, to destroy the test piece (see, for example, Patent Document 2).

[0006] However, in this case, the crack origin (i.e., fracture origin) is formed on one side of the test piece bonded to the sheet. Therefore, depending on the type of sheet bonded to the test piece, the adhesive condition between the test piece and the sheet (for example, the strength of adhesive force, the strength of tension applied to the sheet), etc., the fracture of the test piece may be hindered, the position of the fracture origin and the direction of the crack may change, the flexural strength value obtained by measurement may not be stable, etc. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] JP 2020-94832 A [Patent Document 2] JP 2023-10204 A Summary of the Invention [Problem to be solved by the invention]

[0008] The present invention has been made in consideration of the above points, and aims to reduce the influence of the type of sheet, the adhesive condition between the test piece and the sheet, etc., on the measurement of flexural strength while adhering the test piece to the sheet. [Means for solving the problem]

[0009] According to one aspect of the present invention, there is provided a testing device for measuring the load at which a thin plate-shaped test piece breaks, the testing device comprising: a sheet unit that holds a sheet to be adhered to the test piece, and is used when adhering the sheet to a first surface of the test piece and a second surface located on the opposite side of the first surface in the thickness direction of the test piece; an indenter that presses the first surface of the test piece through the sheet; a load measuring device for measuring the load applied to the test piece when the indenter presses the test piece; and a test piece receiving portion that is arranged to sandwich the tip of the indenter in a planar view and has a pair of receiving portions that contact the second surface of the test piece when the indenter presses the test piece.

[0010] Preferably, the test strip receiving portion includes a lifting mechanism for lifting and lowering the pair of receiving portions.

[0011] In addition, preferably, the device further includes a controller having a processor and memory and controlling the operation of the sheet unit, the indenter, and the lifting mechanism, the test piece receiving portion being positioned below the indenter, and the controller raises the pair of receiving portions after the test piece is placed on the pair of receiving portions positioned below the sheet, thereby adhering the test piece to the sheet.

[0012] According to another aspect of the present invention, there is provided a testing method for measuring the load at which a thin plate-shaped test piece breaks, the testing method comprising: a test piece positioning step of positioning a test piece between a test piece receiving part and an indenter, the test piece having a first surface and a second surface located on the opposite side of the first surface in the thickness direction, with a sheet adhered to the first surface of the test piece, such that the test piece receiving part faces the second surface of the test piece and the indenter faces the first surface via the sheet; and a load measuring step of pressing the first surface of the test piece via the sheet with the indenter while the second surface of the test piece is received by the test piece receiving part, thereby breaking the test piece, thereby measuring the load at which the test piece breaks.

[0013] Preferably, the testing method further comprises, after the load measuring step, a fracture origin detection step of observing the broken test piece adhered to the sheet and detecting the fracture origin when the test piece is broken. Effect of the Invention

[0014] In the test device and test method according to one aspect of the present invention, the first surface of the test piece is pressed by an indenter through the sheet while the second surface of the test piece is supported by a pair of receiving parts, so that a fracture origin can be formed on the second surface of the test piece that is not bonded to the sheet. Therefore, compared to the case where a fracture origin is formed on the first surface that is bonded to the sheet, the influence of the type of sheet, the bonding state between the test piece and the sheet, etc. on the measurement of the flexural strength can be reduced. [Brief description of the drawings]

[0015] [Figure 1] FIG. [Diagram 2] FIG. 2 is a perspective view of a device chip unit. [Diagram 3] FIG. 2 is an enlarged view of the testing apparatus in the vicinity of the testing unit. [Figure 4] FIG. 1 is a flow diagram showing a test method. [Diagram 5] FIG. 5(A) is a diagram showing a chip identification process, and FIG. 5(B) is a diagram showing a pick-up process. [Figure 6] FIG. [Figure 7] FIG. [Figure 8] FIG. [Figure 9] FIG. [Figure 10] FIG. 10(A) is an oblique view showing the test piece after fracture, FIG. 10(B) is a schematic diagram of an image of the first region, FIG. 10(C) is a schematic diagram of an image of the second region, and FIG. 10(D) is a schematic diagram of an image of the third region. [Figure 11] FIG. 11 is a flow diagram of a testing method in a first modified example. [Figure 12] FIG. 11 is an enlarged view of a testing device in the vicinity of a testing unit according to a second embodiment. [Figure 13] FIG. 13 is a diagram showing how a test piece is placed on a sheet. [Figure 14] 13A and 13B are diagrams showing a state in which the pair of receiving parts are lowered. [Figure 15] FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] (First embodiment) An embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a perspective view of a test device 2 for measuring the load at which a thin plate-like test piece 21 (see Fig. 5(B)) breaks.

[0017] 1, the X-axis direction, the Y-axis direction, and the Z-axis direction are mutually orthogonal. The X-axis direction is parallel to the +X direction and the -X direction, which are opposite to each other. The Y-axis direction is parallel to the +Y direction (forward) and the -Y direction (backward), which are opposite to each other, and the Z-axis direction is parallel to the +Z direction (upward) and the -Z direction (downward), which are opposite to each other.

[0018] The test device 2 has a base 4 that supports each of the components. A cassette elevator (not shown) for moving the cassette 6 up and down along the Z-axis direction is provided near a corner located in the -X direction and +Y direction on the upper surface 4a of the base 4.

[0019] A box-shaped cassette 6 is placed on the cassette elevator. One or more device chip units 13, each including a plurality of device chips 11, are accommodated in the cassette 6 (see FIG. 2). FIG. 2 is a perspective view of the device chip unit 13.

[0020] The device chips 11 are formed by dividing a semiconductor wafer such as a silicon wafer into a plurality of pieces by a processing device (not shown) such as a cutting device, a laser processing device, a grinding device, etc. The device chips 11 are supported by a metal ring frame 17 via a resin dicing tape 15.

[0021] A device such as an IC (Integrated Circuit) is formed on a front surface 11a of each device chip 11, which corresponds to the vicinity of the front surface of the semiconductor wafer. A back surface 11b of each device chip 11 corresponds to the back surface of the semiconductor wafer.

[0022] In order to thin the semiconductor wafer, the back surface of the semiconductor wafer is ground, so that radial grinding marks (not shown) are formed on the back surface of the semiconductor wafer, and grinding marks are also formed on the back surface 11b of each device chip 11.

[0023] The device chip 11 is the same as the test piece 21 used in the bending test described later. One or more of the device chips 11 shown in Fig. 2 are selected as the test piece 21 (see Fig. 5(B)).

[0024] The front surface 11a of the device chip 11 corresponds to the front surface (first surface) 21a of the test piece 21, and the back surface 11b of the device chip 11 corresponds to the back surface (second surface) 21b of the test piece 21. The front surface 21a of the test piece 21 is located on the opposite side to the back surface 21b in the thickness direction 21c of the test piece 21.

[0025] Returning to Fig. 1, a transport mechanism 8 having an arm that is substantially L-shaped when viewed in the XZ plane is provided near the cassette elevator. The transport mechanism 8 is movable along the Y-axis direction and the Z-axis direction by a moving mechanism (not shown). At the lower end of the arm of the transport mechanism 8, a front clamp mechanism 8a is provided on the front side surface that is substantially parallel to the XZ plane.

[0026] Similarly, a rear clamp mechanism 8b is provided on the rear side surface of the lower end of the arm that is approximately parallel to the XZ plane. Each of the front clamp mechanism 8a and the rear clamp mechanism 8b has a pair of thin plate portions that are configured to be movable toward and away from each other along the Z axis direction.

[0027] The front clamp mechanism 8a clamps the ring frame 17 between a pair of thin plate portions. In this state, the transport mechanism 8 pulls out the device chip unit 13 along the Y-axis direction. In addition, the rear clamp mechanism 8b clamps the ring frame 17 between a pair of thin plate portions. In this state, the transport mechanism 8 pushes out the device chip unit 13 along the Y-axis direction.

[0028] A pair of guide rails 10 are provided behind the cassette elevator, each arranged along the Y-axis direction. After pulling out device chip unit 13 up to the pair of guide rails 10, transport mechanism 8 moves around to the front of device chip unit 13 and pushes device chip unit 13 out along the Y-axis direction to frame holding mechanism 12.

[0029] The frame holding mechanism 12 has an annular frame support part 12a and a frame pressing part 12b that are arranged to face each other along the Z-axis direction. Each of the frame support part 12a and the frame pressing part 12b has a notch formed therein to allow the transport mechanism 8 to enter.

[0030] The frame holding mechanism 12 includes a drive mechanism 14 such as an air actuator for moving the frame support portion 12a and the frame pressing portion 12b closer to and apart from each other. The frame holding mechanism 12 clamps the ring frame 17 of the device chip unit 13 by operating the drive mechanism 14 to move the frame support portion 12a and the frame pressing portion 12b closer to each other.

[0031] The drive mechanism 14 is configured to be movable along the Y-axis direction by a Y-axis direction moving mechanism 16 via a pair of moving blocks 14a. The Y-axis direction moving mechanism 16 has a pair of Y-axis direction guide rails 18. One of the Y-axis direction guide rails 18 located relatively in the -X direction supports one of the moving blocks 14a so as to be slidable along the Y-axis direction.

[0032] A screw shaft 20 is disposed along the Y-axis direction between a pair of Y-axis guide rails 18. The screw shaft 20 is disposed near the other Y-axis guide rail 18 located relatively in the +X direction.

[0033] Another moving block 14a is supported slidably along the Y-axis direction on the other Y-axis direction guide rail 18. A nut portion (not shown) is provided on the lower surface of the other moving block 14a, and a screw shaft 20 is rotatably connected to the nut portion via a plurality of balls (not shown).

[0034] A driving source 22 such as a stepping motor is provided at one end of the screw shaft 20. When the driving source 22 is operated, the frame holding mechanism 12 moves along the Y-axis direction together with the two moving blocks 14a.

[0035] The Y-axis direction moving mechanism 16 is fixed on a rectangular ring-shaped X-axis direction moving frame 24. The X-axis direction moving frame 24 has two sides along the X-axis direction and two sides along the Y-axis direction, and the above-mentioned Y-axis direction guide rail 18 is provided on each side along the Y-axis direction.

[0036] The X-axis direction moving frame 24 includes a rectangular through-hole 24a in the center in the XY plane direction. In order to increase the opening area of ​​the through-hole 24a, the screw shaft 20 is disposed near one of the Y-axis direction guide rails 18 located in the +X direction.

[0037] The Y-axis direction moving mechanism 16 is configured to be movable along the X-axis direction by an X-axis direction moving mechanism 26. The X-axis direction moving mechanism 26 has a pair of X-axis direction guide rails 28 that support the X-axis direction moving frame 24 so that it is slidable along the X-axis direction.

[0038] The X-axis guide rails 28 are provided under each side along the X-axis direction of the X-axis moving frame 24. Between the pair of X-axis guide rails 28, a screw shaft 30 is disposed along the X-axis direction.

[0039] The screw shaft 30 is disposed near one of the X-axis direction guide rails 28 located at the rear. A nut portion (not shown) is provided on the underside of one side along the X-axis direction of the X-axis direction moving frame body 24, and the screw shaft 30 is rotatably connected to this nut portion via a plurality of balls (not shown).

[0040] A driving source 32 such as a stepping motor is provided at one end of the screw shaft 30. When the driving source 32 is operated, the X-axis direction moving frame 24 moves along the X-axis direction. Therefore, the frame holding mechanism 12 moves within the XY plane by the Y-axis direction moving mechanism 16 and the X-axis direction moving mechanism 26.

[0041] Specifically, the frame holding mechanism 12 moves between a receiving position A1 for the device chip unit 13 and a pick-up position A2 for the device chip 11. A rectangular opening 4b is formed in the upper surface 4a of the base 4 near a corner diagonally opposite to the corner on which the cassette 6 is placed.

[0042] The opening 4b is located at a position corresponding to the pickup position A2 of the frame holding mechanism 12. A camera unit 34 for capturing an image of the device chip unit 13 is provided above the opening 4b. The camera unit 34 includes a lens, a solid-state imaging element, and a light-emitting element such as an LED (Light Emitting Diode) (none of which are shown).

[0043] The camera unit 34 is configured to be movable along the Z-axis direction. Images obtained by capturing an image of one or more device chips 11 with the camera unit 34 are used by a controller 134, which will be described later, to provide identification information to each device chip 11.

[0044] For example, the controller 134 assigns identification information to all the device chips 11 based on the size and notch position of the semiconductor wafer, the size of the device chips 11, the image of the device chips 11 acquired by the camera unit 34, etc. The controller 134 associates this identification information with the flexural strength measured by the pressing unit 72 described later and stores them.

[0045] The opening 4b is provided with a push-up mechanism 36 for selectively pushing one device chip 11 upward. The push-up mechanism 36 has a cylindrical suction section 36a. A negative pressure is transmitted to the suction section 36a from a vacuum pump or the like, and the lower surface of the dicing tape 15 can be sucked and held by the negative pressure.

[0046] A driving unit (not shown) such as a stepping motor or an air cylinder is connected to the lower end of the suction unit 36a. When the driving unit is operated, the suction unit 36a moves along the Z-axis direction. A push-up needle or push-up pin (not shown) is provided in the radial center of the suction unit 36a so as to be movable along the Z-axis direction.

[0047] The push-up mechanism 36 promotes the peeling of the device chip 11 from the dicing tape 15 by pushing up one device chip 11 with a push-up needle or push-up pin while holding the underside of the dicing tape 15 by suction with the raised suction section 36a.

[0048] A pickup mechanism 40 is provided above the opening 4b in a manner that does not interfere with the camera unit 34. The pickup mechanism 40 has a moving base 44 that is configured to be movable by a Y-axis direction moving mechanism 42.

[0049] The Y-axis movement mechanism 42 has a pair of Y-axis guide rails 46 arranged along the Y-axis direction. A movement base 44 is attached to the pair of Y-axis guide rails 46 so as to be slidable along the Y-axis direction.

[0050] A screw shaft 48 is disposed along the Y-axis direction between the pair of Y-axis direction guide rails 46. The screw shaft 48 is rotatably connected to a nut portion (not shown) provided on the back side of the movable base 44 via a plurality of balls (not shown).

[0051] A driving source 50 such as a stepping motor is provided at one end of the screw shaft 48. When the driving source 50 is operated, the moving base 44 moves along the Y-axis direction. The Y-axis direction moving mechanism 42 is configured to be movable along the Z-axis direction by a Z-axis direction moving mechanism 52.

[0052] The Z-axis direction moving mechanism 52 has a pair of Z-axis direction guide rails 56 arranged along the Z-axis direction. A slide plate 54 fixed to the Y-axis direction moving mechanism 42 is attached to the pair of Z-axis direction guide rails 56 so as to be slidable along the Z-axis direction.

[0053] A screw shaft 58 is disposed along the Z-axis direction between the pair of Z-axis guide rails 56. The screw shaft 58 is rotatably connected via a plurality of balls (not shown) to a nut portion (not shown) provided on the rear surface side of the slide plate 54. A drive source 60 such as a stepping motor is provided on the lower end portion of the screw shaft 58.

[0054] When the drive source 60 is operated, the Y-axis direction moving mechanism 42 moves along the Z-axis direction. The Y-axis direction moving mechanism 42 and the Z-axis direction moving mechanism 52 allow the moving base 44 to move within the YZ plane. An X-axis direction driving mechanism 62 such as a ball screw is provided on the front surface side of the moving base 44. The X-axis direction driving mechanism 62 adjusts the position of the collet 64 in the X-axis direction.

[0055] An opening (not shown) having an area smaller than the front surface 11a (or the back surface 11b) of the device chip 11 is formed on the bottom surface of the collet 64. The collet 64 sucks and holds one of the device chips 11 in the device chip unit 13 by negative pressure transmitted to the opening from a vacuum pump or the like.

[0056] A bottom surface observation mechanism 66 for capturing an image of the bottom surface of the device chip 11 suction-held by the collet 64 is provided in front of the opening 4b of the base 4. The bottom surface observation mechanism 66 includes a lens whose optical axis is arranged along the Z-axis direction, and a solid-state image sensor that is irradiated with light captured through the lens.

[0057] A side observation mechanism 68 for observing the side surface of the device chip 11 is provided in front of the bottom observation mechanism 66. The side observation mechanism 68 includes a mounting table 68a on which the device chip 11 is mounted, and an imaging unit 68b that captures an image of the side surface of the device chip 11 mounted on the mounting table 68a.

[0058] The imaging unit 68b includes a lens whose optical axis is arranged along the X-axis direction, and a solid-state imaging element that is irradiated with light captured through the lens. A test unit 70 is provided in front of the side observation mechanism 68. Fig. 3 is an enlarged view of the test device 2 in the vicinity of the test unit 70 that performs a three-point bending test on the test piece 21.

[0059] This three-point bending test is in accordance with or equivalent to, for example, Japanese Industrial Standards (JIS) R1601:2008, International Organization for Standardization ISO 14704:2016, SEMI (Semiconductor Equipment and Materials International) standard G86-0303:2011, etc.

[0060] The test unit 70 has a pressing unit 72. The pressing unit 72 has a rod-shaped or plate-shaped indenter 74 whose longitudinal portion is arranged along the Y-axis direction. The indenter 74 generally corresponds to a support tool defined in JIS R1601:2008.

[0061] However, as described below, the indenter 74 of this embodiment does not come into direct contact with the test piece 21, but applies a load to the test piece 21 via the sheet 100d described below, and therefore is not completely identical to the support device that is specified in JIS R1601:2008 as being in direct contact with the test piece 21.

[0062] The indenter 74 has a tapered shape in which the width in the X-axis direction narrows as it advances downward, and has a substantially V-shape in the XZ plane view. The tip 74a of the indenter 74 has a rounded shape and has a curvature radius of, for example, 2.0 mm to 3.0 mm.

[0063] The bottom of a load measuring device 78 is fixed to the base end of the indenter 74 via a cylindrical first connecting member 76. The load measuring device 78 includes a load cell including a strain gauge, and a measuring device that converts an electrical signal generated by the strain gauge into a load (unit: N).

[0064] The load measuring device 78 measures the load applied to the test piece 21 when the indenter 74 presses the test piece 21. More specifically, the load measuring device 78 measures the load that the indenter 74 receives as a reaction from the test piece 21 as a result of the indenter 74 pressing the test piece 21.

[0065] The measuring device may be a part of the controller 134 described later, or may be electrically connected to the controller 134, and is not necessarily provided in the pressing unit 72. However, the load cell is fixed to the indenter 74 directly or indirectly.

[0066] A movable block 82 is fixed to the top of the load measuring device 78 via a cylindrical second connecting member 80. As shown in FIG. 1, the movable block 82 can be moved along the Z-axis direction by a Z-axis direction moving mechanism 84 formed of a ball screw.

[0067] 1, the Z-axis direction movement mechanism 84 has a pair of guide rails 86 arranged along the Z-axis direction. The moving block 82 is slidably attached to the pair of guide rails 86. A screw shaft 88 is arranged between the pair of guide rails 86.

[0068] The screw shaft 88 is rotatably connected via a plurality of balls (not shown) to a nut portion (not shown) provided on the moving block 82. A driving source 90 such as a stepping motor is provided on the upper end portion of the screw shaft 88. When the driving source 90 is operated, the indenter 74 moves along the Z-axis direction together with the moving block 82.

[0069] 3, a test piece receiving portion 94 is disposed below the indenter 74. The test piece receiving portion 94 has a pair of receiving portions 92 whose longitudinal portions are disposed along the Y-axis direction. The upper end portion of each receiving portion 92 has a rounded shape, for example, with a radius of curvature of 2.0 mm to 3.0 mm.

[0070] The pair of receiving portions 92 correspond to the support defined in JIS R1601:2008. The apex of each receiving portion 92 serves as a fulcrum for supporting the test piece 21. The distance between the fulcrums of the pair of receiving portions 92 is set to a predetermined distance in accordance with the shape of the test piece 21.

[0071] The distance between the fulcrums of the pair of receiving portions 92 is set to, for example, 30±0.1 mm or 40±0.1 mm. In the XY plane view, the pair of receiving portions 92 are arranged to sandwich the tip portion 74a of the indenter 74 therebetween. Such a pair of receiving portions 92 and the indenter 74 approximately corresponds to the test jig in JIS R1601:2008.

[0072] Each receiving portion 92 is fixed to the top of a rectangular parallelepiped base portion 96. In this embodiment, the pair of base portions 96 are configured to be movable up and down (i.e., movable along the Z-axis direction) by a lifting mechanism 98. In Fig. 3, the position of the lifting mechanism 98, which is a component of the test piece receiving portion 94, is indicated by an arrow, and the specific structure is omitted.

[0073] 3 is at a first position P1 which is relatively low in the Z-axis direction. In contrast, when raised by the lifting mechanism 98, as shown in FIG 7, the pair of receiving parts 92 moves to a second position P2 which is higher than when they are at the first position P1.

[0074] In this embodiment, when the test piece 21 is placed on the pair of receiving portions 92, the lifting mechanism 98 positions the pair of receiving portions 92 at a first position P1 (see Figure 3), and when the test piece 21 is bonded to the sheet 100d, the lifting mechanism 98 positions the pair of receiving portions 92 at a second position P2 (see Figure 7).

[0075] The lifting mechanism 98 has, for example, a ball screw and includes a pair of guide rails, a nut portion, multiple balls, a screw shaft, a stepping motor, etc., but is not limited to these, and may also have an air cylinder that raises and lowers the pair of bases 96 by supplying and exhausting compressed air.

[0076] 3, a ribbon-shaped tape 100 with a predetermined width is disposed in the Z-axis direction between the pressing unit 72 and the test piece receiving portion 94. The tape 100 with a release liner has a laminated structure including, for example, a base material layer 100a and an adhesive layer 100b each made of resin, and a release liner 100c attached to the adhesive layer 100b.

[0077] The base layer 100a is formed of a material such as polyolefin, polyvinyl chloride, polyethylene terephthalate, etc. The adhesive layer 100b is formed of an adhesive such as an epoxy-based, acrylic-based, or rubber-based adhesive.

[0078] The adhesive layer 100b may be an ultraviolet-curable resin whose adhesive strength decreases when irradiated with ultraviolet light. In an unused tape 100 with release liner, the adhesive layer 100b is covered with the release liner 100c and is not exposed.

[0079] An unused release paper-backed tape 100 is wound around a feed roller 102a. After the release paper 100c is peeled off from the release paper-backed tape 100 fed from the feed roller 102a by a peel plate 104, the tape is fed along the X-axis direction via a guide roller 102c.

[0080] A winding roller 102b is provided below the delivery roller 102a. The winding roller 102b winds up the release paper 100c peeled off from the release paper-backed tape 100, whereby the release paper 100c is peeled off from the release paper-backed tape 100, and a sheet 100d (i.e., a tape) having the base layer 100a and the adhesive layer 100b is formed.

[0081] The sheet 100d in this embodiment is arranged so that its longitudinal direction is along the X-axis direction, the base layer 100a faces the pressing unit 72, and the adhesive layer 100b faces the test strip receiving portion 94. That is, a pair of receiving portions 92 are arranged below the sheet 100d.

[0082] The delivery roller 102a, the take-up roller 102b, the guide roller 102c, and the peel plate 104 constitute a delivery unit 102 that delivers the sheet 100d. Each component of the delivery unit 102 is fixed to the support wall 106 like a cantilever protruding from a side surface of the support wall 106 that is approximately parallel to the XZ plane (see FIG. 1).

[0083] The base end of the sheet 100d is supported by the guide roller 102c, and the tip end is pulled by the tension unit 110. In this manner, the sheet 100d is in a state in which bending is reduced (i.e., the sheet 100d is tensioned).

[0084] The tension unit 110 has a clamp mechanism 112 that clamps the other end of the sheet 100d in the Z-axis direction. The clamp mechanism 112 has a pair of thin plates provided like a cantilever at the upper end of a columnar support 114 (see FIG. 1).

[0085] The pair of thin plates are arranged with their longitudinal sides aligned along the Y-axis direction. The length of each thin plate in the Y-axis direction is equal to or greater than the width of the sheet 100d. The pair of thin plates are configured to move toward and away from each other electrically or manually.

[0086] A support 114 that supports the clamp mechanism 112 is configured to be movable along the X-axis direction by a moving mechanism 116 such as a ball screw, an air cylinder, etc. In Fig. 3, the position of the moving mechanism 116 is indicated by an arrow, and the specific structure is omitted.

[0087] The delivery unit 102 and the tension unit 110 constitute a sheet unit 118 that holds a sheet 100d to be adhered to the test specimen 21. The test specimen 21 is adhered to the sheet 100d that is held in a tensioned state by the sheet unit 118.

[0088] Therefore, the test piece 21 is adhered to the sheet 100d in such a manner that, for example, no gap is formed between the sheet 100d and the test piece 21. However, since a pressing roller or the like is not used for pressing, air bubbles, gaps, and the like may exist between the sheet 100d and the test piece 21.

[0089] In the testing device 2 of this embodiment, after the test piece 21 is adhered to the sheet 100d, the front surface 21a of the test piece 21 is pressed by the indenter 74 through the sheet 100d in a state in which the back surface 21b of the test piece 21 is received by the pair of receiving parts 92. Therefore, a fracture origin can be formed on the back surface 21b of the test piece 21 that is not adhered to the sheet 100d.

[0090] Therefore, in comparison with the case where the fracture origin is formed on the surface 21a bonded to the sheet 100d, the influence of the type of the sheet 100d, the bonding condition between the test piece 21 and the sheet 100d, etc. on the measurement of the flexural strength can be reduced.

[0091] In the X-axis direction, a sheet fixing unit 120 is provided between the test piece receiving portion 94 and the tension unit 110. The sheet fixing unit 120 has a support table 122 that supports the sheet 100d from below, and a pressing body 124 that presses the sheet 100d from above.

[0092] The pressing body 124 is configured to be movable along the Z-axis direction by a Z-axis direction moving mechanism 126. In Fig. 3, the position of the Z-axis direction moving mechanism 126 is indicated by an arrow, and a specific structure is omitted. A Z-axis direction moving block 128 is fixed to the top of the pressing body 124.

[0093] The Z-axis direction moving mechanism 126 is, for example, an air cylinder that moves the Z-axis direction moving block 128 along the Z-axis direction by supplying and exhausting compressed air, but is not limited to this and may be a ball screw. By lowering the pressing body 124, a part of the sheet 100d is sandwiched and fixed between the support table 122 and the pressing body 124.

[0094] A support table 130 (see FIG. 1) for supporting the broken test piece 21 after the load measurement test is provided in the +X direction of the sheet fixing unit 120. In addition, a cutter 132 is provided between the sheet fixing unit 120 and the support table 130 in the X-axis direction so as to be movable along the Z-axis direction (see FIG. 9).

[0095] The pulling unit 110 pulls the sheet 100d and moves the broken test piece 21 onto the support table 130, after which the cutter 132 cuts the sheet 100d. As a result, the broken test piece 21 is separated from the main body of the release-paper-backed tape 100.

[0096] The operator collects the test piece 21 and the small piece of the sheet 100d, and, using, for example, a microscope (not shown) provided separately from the testing device 2, detects the starting point of fracture when the test piece 21 is fractured.

[0097] After collecting the test piece 21 and the small piece of sheet 100d, the tensioning unit 110 moves in the -X direction, and the leading end of the cut sheet 100d is clamped and fixed by the clamping mechanism 112. Next, the clamping mechanism 112 puts the sheet 100d in a tensioned state, and the testing unit 70 returns to a state in which it can test another test piece 21.

[0098] 1 again, the test device 2 has a controller 134 that controls the operations of the cassette elevator, the transport mechanism 8, the frame holding mechanism 12, the Y-axis direction moving mechanisms 16, 42, the X-axis direction moving mechanism 26, the push-up mechanism 36, the pickup mechanism 40, the Z-axis direction moving mechanism 52, the test unit 70, etc.

[0099] The controller 134 is configured by a computer including a processor 134a, such as a central processing unit (CPU), and a memory 134b. The memory 134b includes a main storage device such as a dynamic random access memory (DRAM), and an auxiliary storage device such as a flash memory, a hard disk drive, or a solid state drive.

[0100] The auxiliary storage device stores software including a predetermined program. The functions of the controller 134 are realized by operating the processor 134a and the like in accordance with this software. The operations of the sheet unit 118, the indenter 74, and the lifting mechanism 98 included in the test unit 70 are also controlled by the controller 134.

[0101] Next, a test method for measuring the load at which the test piece 21 breaks will be described with reference to Fig. 4 to Fig. 10. Fig. 4 is a flow diagram showing the test method using the test device 2. In this example, each step is performed in the following order: a chip identifying step S10, a picking up step S20, a test piece arranging step S30, a load measuring step S40, a sheet cutting step S50, and a breakage start point detecting step S60.

[0102] Before starting the test method using the test device 2, the operator first peels off a part of the release paper 100c from the release-paper-backed tape 100 and fastens the part of the peeled off release paper 100c to the winding roller 102b. In addition, the operator fixes the leading end of the sheet 100d to the clamp mechanism 112.

[0103] Next, the clamp mechanism 112 is moved in the +X direction, so that the sheet 100d is tensioned by the sheet unit 118. This completes the advance preparation for automatic measurement of the flexural strength. After this, automatic measurement by the test device 2 is started.

[0104] In the automatic measurement, the controller 134 controls the operation of the test apparatus 2. First, one device chip unit 13, which has been pulled out from the cassette 6 to the frame holding mechanism 12 by the transport mechanism 8, is placed at the pick-up position A2. Then, the chip identification step S10 is performed.

[0105] 5(A) is a diagram showing a chip identification step S10. In the chip identification step S10, the camera unit 34 captures images of all the device chips 11. As a result, the controller 134 stores the identification information of each device chip 11, and identifies the position of the device chip 11 (i.e., the test piece 21) to be subjected to the bending test according to predetermined conditions.

[0106] Thereafter, the Y-axis direction moving mechanism 16 and the X-axis direction moving mechanism 26 are controlled to adjust the position of the test piece 21 so that the test piece 21 is positioned directly above the push-up mechanism 36. Then, the process proceeds to the pick-up step S20.

[0107] 5(B) is a diagram showing a pick-up step S20. In the pick-up step S20, the test piece 21 to be subjected to the bending test is pushed up by the push-up mechanism 36, and then the surface 11a of the test piece 21 is sucked and held by the collet 64. The collet 64 transports the test piece 21 that is sucked and held to the test piece receiving portion 94.

[0108] After the pick-up step S20, a test piece arrangement step S30 is performed. In the test piece arrangement step S30, the test piece 21 is arranged between the test piece receiving portion 94 and the indenter 74 such that the test piece receiving portion 94 faces the back surface 21b of the test piece 21 and the indenter 74 faces the front surface 21a of the test piece 21 via the sheet 100d.

[0109] 6 is a diagram showing a placement step S32 in the test piece arrangement step S30. In the placement step S32, first, the collet 64 moves in the X-axis direction and / or the Y-axis direction at a position lower than the lower end of the winding roller 102b, thereby entering the space between the sheet 100d and the pair of receiving parts 92 in the Z-axis direction.

[0110] Then, the collet 64 places the test specimen 21 on the pair of receiving parts 92 at the first position P1, and then releases the test specimen 21 by releasing the suction hold by the negative pressure. As a result, the test specimen 21 is supported by the pair of receiving parts 92 with the back surface 21b in contact with the pair of receiving parts 92.

[0111] In addition to placing the test piece 21, in the placing step S32, the Z-axis direction moving block 128 is moved downward, and the sheet 100d is sandwiched and fixed by the pressing body 124, the support table 122, and the sheet fixing unit 120.

[0112] After the placing step S32, the front surface 21a of the test piece 21 is adhered to the sheet 100d (adhering step S34). In the adhering step S34, the controller 134 operates the lifting mechanism 98 in response to the retraction of the collet 64 from between the sheet 100d and the pair of receiving portions 92.

[0113] 7 is a diagram showing a bonding step S34. The pair of receiving parts 92 is raised to the second position P2, so that substantially the entire surface 21a of the test piece 21 is bonded to the adhesive layer 100b of the sheet 100d.

[0114] Next, with the back surface 21b of the test piece 21 received by the test piece receiving portion 94 (i.e., the pair of receiving portions 92 are in contact with the back surface 21b of the test piece 21), the front surface 21a of the test piece 21 is pressed with the indenter 74 through the sheet 100d to destroy the test piece 21, thereby measuring the load at which the test piece 21 breaks (load measurement process S40).

[0115] In the load measuring step S40, the front surface 21a of the test piece 21 is pressed by the indenter 74 through the sheet 100d, so that a fracture initiation point can be formed on the back surface 21b of the test piece 21 that is not bonded to the sheet 100d.

[0116] Therefore, in comparison with the case where the fracture origin is formed on the surface 21a bonded to the sheet 100d, the influence of the type of the sheet 100d, the bonding condition between the test piece 21 and the sheet 100d, etc. on the measurement of the flexural strength can be reduced.

[0117] 8 is a diagram showing the load measuring step S40. In the load measuring step S40, the load acting on the indenter 74 increases until the test piece 21 is broken, and then suddenly decreases to approximately zero when the test piece 21 is completely broken. The load acting on the indenter 74 is measured by the load measuring device 78 described above.

[0118] The load measured during the period from when the test piece 21 breaks to when the load suddenly drops is provided to the controller 134, and the controller 134 stores at least the maximum load during this period. Next, the controller 134 calculates the flexural strength (i.e., the three-point bending strength σ) according to the following formula (1): σ=3PL / (2wt 2 )…(1)

[0119] In formula (1), P is the maximum load (unit: N) described above, L is the distance (unit: mm) between the supports of the pair of receiving parts 92, w is the width (unit: mm) of the test piece 21 (i.e., the length of the test piece 21 in the Y-axis direction in FIG. 7), and t is the thickness (unit: mm) of the test piece 21 (i.e., the length of the test piece 21 in the Z-axis direction in FIG. 7). Please also refer to FIG. 10(A) for the width w and thickness t.

[0120] After the load measuring step S40, the sheet 100d is released from the sheet fixing unit 120, and the clamp mechanism 112 is moved in the +X direction, so that the broken test piece 21 is placed on the support table .

[0121] Then, as shown in Fig. 9, the cutter 132 is lowered to cut the sheet 100d, and the tip region of the sheet 100d including the broken test piece 21 is cut off from the main body of the release-backed tape 100 with the broken test piece 21 still attached to the sheet 100d (sheet cutting step S50). Fig. 9 is a diagram showing the sheet cutting step S50.

[0122] After the sheet cutting process S50, an operator detects the fracture origin by observing the fractured test piece 21 adhered to the sheet 100d using a microscope (not shown) different from that of the testing device 2 (fracture origin detection process S60).

[0123] The operator may detect the fracture origin based on the image obtained by the microscope, or the image may be obtained using the side observation mechanism 68 of the test device 2, and the fracture origin may be automatically detected using a program for image analysis stored in the memory 134b of the controller 134.

[0124] 10(A) is a perspective view showing the test piece 21 after being broken so as to be divided into two pieces 23. A front surface 23a of each piece 23 corresponds to a front surface 21a of the test piece 21, and a back surface 23b of each piece 23 corresponds to a back surface 21b of the test piece 21. In addition, a side surface 23c of the piece 23 corresponds to an outer peripheral side surface of the test piece 21.

[0125] 10(A), the two pieces 23 are arranged so that the fracture surfaces 23d face each other. In the fracture origin detection step S60, the fracture origin is detected by observing, for example, the fracture surface 23d of one of the pieces 23 depicted by a solid line, and a corner 23e of the fracture surface 23d where the fracture surface 23d and the side surface 23c intersect.

[0126] 10(B) to 10(D) are example images of fracture surface 23d observed in a predetermined direction B1 substantially perpendicular to fracture surface 23d. Fig. 10(B) is a schematic diagram of an image of a first region 23d1 of fracture surface 23d in the vicinity of back surface 23b, the first region 23d1 being located at the center of width w of fragment 23. In Fig. 10(B), fracture origin P occurs near back surface 23b.

[0127] The fracture origin P is identified, for example, as the center position in the longitudinal direction of a linear region where a mirror surface M in fractography meets the outer surface of the test piece 21 (front surface 21a, back surface 21b, side surface 23c, etc.).

[0128] The mirror surface M is a mirror-like smooth surface on the fracture surface 23d, and in the example shown in Fig. 10(B), it is a white lump-like region in contact with the back surface 23b. The curve extending from the mirror surface M is the hackle H. The fracture of the test piece 21 progresses from the fracture initiation point P to the hackle H via the mirror surface M.

[0129] If the device chip 11 is manufactured by grinding the back surface of the semiconductor wafer and a fracture origin P is formed near the back surface 23b as shown in Figure 10 (B), it is presumed that grinding marks caused by the back surface grinding are present near the fracture origin P.

[0130] Based on such an analysis, for example, it is possible to investigate the correlation between the state of the grinding marks (i.e., grinding conditions) and the bending strength, and to search for optimal grinding conditions. In addition, it is also possible to estimate the magnitude of the fracture stress based on the size of the area of ​​the mirror surface M.

[0131] 10(C) is a schematic diagram of an image of a second region 23d2 near the back surface 23b of the fracture surface 23d near the corner 23e. If the device chip 11 is manufactured by cutting the semiconductor wafer with a cutting blade and a fracture origin P is formed near the back surface 23b as shown in FIG. 10(C), it is presumed that chipping caused by the cutting process is present near the fracture origin P.

[0132] Based on such an analysis, for example, it is possible to investigate the correlation between the cutting conditions and the flexural strength, and to search for the optimal cutting conditions. In addition, when cutting is performed and a fracture origin P exists in the vicinity of the surface 23a of the fracture surface 23d in the vicinity of the corner 23e, it is also assumed that chipping caused by the cutting is present in the vicinity of the fracture origin P.

[0133] FIG. 10(D) is a schematic diagram of an image of a third region 23d3 at the center of fracture surface 23d in the direction along thickness t of fragment 23 in the vicinity of corner 23e.

[0134] If a device chip 11 is manufactured by positioning the focal point of a pulsed laser beam having a wavelength that transmits through a semiconductor wafer inside the semiconductor wafer and forming a modified layer inside the semiconductor wafer, and if a fracture origin P is formed in the center of the thickness t as shown in Figure 10 (D), it is presumed that the modified layer is present in the vicinity of the fracture origin P.

[0135] Based on such an analysis, for example, the correlation between the laser processing conditions and the bending strength can be examined, and the optimal laser processing conditions can be searched for. After the sheet cutting step S50 or the fracture origin detection step S60, the process returns to the pick-up step S20 again, and the collet 64 transports another device chip 11 as the test piece 21 to the test unit 70.

[0136] In the test device 2 and test method of the present embodiment, the fracture origin P can be formed on the back surface 21b of the test piece 21 that is not bonded to the sheet 100d. Therefore, compared to the case where the fracture origin P is formed on the front surface 21a that is bonded to the sheet 100d, the influence of the type of the sheet 100d, the bonding state between the test piece 21 and the sheet 100d, etc., on the measurement of the flexural strength can be reduced.

[0137] (First Modification) Fig. 11 is a flow diagram of a testing method in a first modification. In the first modification, in the test piece arrangement step S30, the mounting step S36 is performed after the bonding step S34. This point is different from the first embodiment.

[0138] Specifically, first, a transport unit (not shown) suction-holds the back surface 21b of the test piece 21, the front surface 21a of which is held by the collet 64, and the test piece 21 is delivered from the collet 64 to the transport unit. After that, the transport unit adheres the test piece 21 to the sheet 100d by rising from a position below the sheet 100d, rather than to the test piece receiving portion 94 (adhesion step S34).

[0139] After the bonding step S34, the lifting mechanism 98 is operated to raise the pair of receiving parts 92, so that the test piece 21 is placed on the pair of receiving parts 92 (placement step S36), as shown in Fig. 7. Since the steps other than the bonding step S34 and the placement step S36 are the same as those in the first embodiment, repeated explanations will be omitted.

[0140] (Second Modification) In the bonding step S34 in the first embodiment, the pair of receiving parts 92 are raised to bond the test piece 21 to the adhesive layer 100b, but in the second modification, instead, the positions of the pair of receiving parts 92 in the Z-axis direction are fixed, and then the support wall 106, the pulling unit 110, and the sheet fixing unit 120 are raised and lowered relative to the test piece receiving parts 94. Other than this, the second modification is the same as the first embodiment.

[0141] Second Embodiment Next, a second embodiment will be described with reference to Fig. 12 to Fig. 15. Fig. 12 is an enlarged view of the testing device 2 in the vicinity of the testing unit 140 in the second embodiment. In the second embodiment, the pressing unit 72 and the test piece receiving portion 94 are upside down compared to the testing unit 70 (see Fig. 3).

[0142] In addition, the feed roller 102a, the winding roller 102b, the guide roller 102c, and the peel plate 104 are inverted upside down compared to the feed unit 102 (see Figure 3) so that the base layer 100a faces the pressing unit 72 and the adhesive layer 100b faces the test strip receiving portion 94.

[0143] Although this point is different from the first embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and duplicated explanations of components having the same functions will be omitted.

[0144] The pressing unit 72 and the test piece receiving portion 94 of the second embodiment are each configured to be movable along the Z-axis direction. The pressing unit 72 is moved along the Z-axis direction by a Z-axis direction moving mechanism (not shown) configured with a ball screw similar to the Z-axis direction moving mechanism 84.

[0145] The test piece receiving portion 94 has an elevation mechanism 98 that moves a moving block 96a fixed to a pair of base portions 96 along the Z-axis direction. The elevation mechanism 98 moves the entire test piece receiving portion 94 along the Z-axis direction, rather than the pair of receiving portions 92. This differs from the first embodiment. The elevation mechanism 98 may have a ball screw or an air cylinder.

[0146] In the testing method of the second embodiment, similarly to FIG. 4, the steps of chip identification S10, pick-up S20, test piece placement S30, load measurement S40, sheet cutting S50, and fracture start point detection S60 are performed in this order.

[0147] In the testing method of the second embodiment, after the chip identifying step S10 and the picking up step S20, the collet 64 places the test piece 21 on the sheet 100d as shown in FIG. 13 (placement step S32).

[0148] However, in the second embodiment, after the pickup process S20 and before the collet 64 places the test piece 21 on the sheet 100d, an inversion mechanism (not shown) inverts the test piece 21 and places the test piece 21, for example, on a placement table 68a so that the back surface 21b is exposed upward.

[0149] Thereafter, the test piece 21, which has been inverted so that the back surface 21b is exposed upward, is again sucked and held by the collet 64, and placed on the sheet 100d. Therefore, the front surface 21a is adhered to the adhesive layer 100b with the back surface 21b facing the pair of receiving portions 92. Fig. 13 is a diagram showing the state of the placing step S32 in which the test piece 21 is placed on the sheet 100d.

[0150] After the placing step S32, the pair of receiving parts 92 is lowered (see FIG. 14). FIG. 14 is a diagram showing the pair of receiving parts 92 being lowered. At this time, the pair of receiving parts 92 may be in contact with the back surface 21b, or may be slightly separated from the back surface 21b due to bending of the sheet 100d caused by the weight of the test piece 21.

[0151] In either case, the test piece 21 is placed between the test piece receiving portion 94 and the indenter 74 in the test piece placement step S30. After the test piece placement step S30, the indenter 74 is gradually raised as shown in FIG.

[0152] With this, in a state where the back surface 21b of the test piece 21 is received by the test piece receiving portion 94, the front surface 21a of the test piece 21 is pressed by the indenter 74 through the sheet 100d to break the test piece 21, and the load at which the test piece 21 breaks is measured (load measuring step S40). Fig. 15 is a diagram showing the load measuring step S40.

[0153] In the second embodiment, the maximum load measured until the test piece 21 is broken is slightly larger by the weight of the test piece 21. Therefore, the controller 134 calculates the mass (m A ) and the acceleration of gravity (g) (m A The maximum load is corrected so that the value obtained by subtracting (g) is regarded as the load at which the test piece 21 breaks.

[0154] After the load measuring step S40, a fracture origin detecting step S60 is performed as in the first embodiment. Also in the second embodiment, the influence of the type of sheet 100d, the bonding state between the test piece 21 and the sheet 100d, and the like on the measurement of the flexural strength can be reduced compared to the case where the fracture origin P is formed on the surface 21a bonded to the sheet 100d.

[0155] In addition, in the second embodiment, not only the broken pieces 23 but also some of the fine debris generated by the destruction of the test piece 21 adhere to the adhesive layer 100b of the sheet 100d. Therefore, compared to the first embodiment in which almost all of the debris generated by the destruction falls, there is an advantage that the frequency of cleaning can be further reduced.

[0156] In addition, the structures, methods, etc. according to the above-described embodiments can be modified as appropriate without departing from the scope of the present invention. For example, the above-described test can be performed on one device chip 11 in the device chip unit 13, or on multiple device chips 11.

[0157] In addition, instead of the sheet 100d from which the release paper 100c has been peeled off from the release paper tape 100, another sheet (not shown) that does not have the adhesive layer 100b and has the base material layer 100a may be adhered to the test piece 21 by thermocompression bonding, thereby adhering the test piece 21 and the sheet without using the adhesive layer 100b.

[0158] In the above-described embodiment and modified examples, each device chip 11 is manufactured by grinding the back surface of the semiconductor wafer. As described above, the state of the ground surface is related to the flexural strength of the device chip 11.

[0159] Therefore, in the test piece arrangement step S30, the sheet 100d is adhered to the front surface 21a of the test piece 21 so that the fracture origin P is formed on the back surface 21b of the test piece 21 corresponding to the back surface 11b of the device chip 11.

[0160] However, for example, when performing cutting processing using a cutting blade, laser processing using a laser beam, or the like, a fracture origin P may be formed on surface 21a of test piece 21 corresponding to surface 11a in order to evaluate the relationship between chipping formed on surface 11a and / or in the vicinity of surface 11a of device chip 11 and the flexural strength.

[0161] Therefore, in the test piece placement step S30, the back surface (first surface) 21b of the test piece 21 may be adhered to the sheet 100d instead of the front surface 21a of the test piece 21, and in the load measurement step S40, the back surface 21b of the test piece 21 may be pressed by the indenter 74 through the sheet 100d while the front surface (second surface) 21a of the test piece 21 is received by the test piece receiving portion 94, thereby destroying the test piece 21. [Explanation of symbols]

[0162] 2: Test equipment 4: Base, 4a: Top surface, 4b: Opening 6: cassette, 8: transport mechanism, 8a: front clamp mechanism, 8b: rear clamp mechanism 10: Guide rail 11: device chip, 11a: front surface, 11b: back surface 12: frame holding mechanism, 12a: frame support portion, 12b: frame pressing portion 13: device chip unit, 15: dicing tape, 17: ring frame 14: driving mechanism, 14a: moving block 16: Y-axis direction movement mechanism, 18: Y-axis direction guide rail, 20: screw shaft, 22: drive source 21: test piece, 21a: front surface, 21b: back surface, 21c: thickness direction 23: Fragment, 23a: Surface, 23b: Back, 23c: Side, 23d: Fracture surface 23d1: 1st area, 23d2: 2nd area, 23d3: 3rd area, 23e: Corner 24: X-axis direction moving frame, 24a: through hole 26: X-axis direction movement mechanism, 28: X-axis direction guide rail, 30: screw shaft, 32: drive source 34: Camera unit 36: Raising mechanism, 36a: Suction part 40: Pickup mechanism 42: Y-axis direction movement mechanism, 44: movement base, 46: Y-axis direction guide rail 48: Screw shaft, 50: Drive source 52: Z-axis direction movement mechanism, 54: slide plate, 56: Z-axis direction guide rail 58: screw shaft, 60: driving source 62: X-axis direction drive mechanism 64: Colette 66: bottom observation mechanism, 68: side observation mechanism, 68a: mounting table, 68b: imaging unit 70,140: Test unit 72: pressing unit, 74: indenter, 74a: tip portion, 76: first connecting member 78: load measuring device, 80: second connecting member, 82: moving block 84: Z-axis direction movement mechanism, 86: guide rail, 88: screw shaft, 90: drive source 92: Receiving part, 94: Test piece receiving part, 96: Base part, 96a: Moving block, 98: Lifting mechanism 100: Tape with release paper 100a: base layer, 100b: adhesive layer, 100c: release paper, 100d: sheet 102: delivery unit, 102a: delivery roller, 102b: take-up roller 102c: guide roller, 104: peel plate, 106: support wall 110: tension unit, 112: clamp mechanism, 114: support, 116: movement mechanism 118: Seat unit 120: sheet fixing unit, 122: support table, 124: pressing body 126: Z-axis direction movement mechanism, 128: Z-axis direction movement block, 130: support table 132: Cutter 134: controller, 134a: processor, 134b: memory A1: Receiving position, A2: Pickup position, B1: Predetermined direction P: starting point of destruction, M: mirror surface, H: hackle P1: 1st position, P2: 2nd position, t: thickness, w: width S10: Chip identification process, S20: Pick-up process S30: test piece placement process, S32, S36: placement process, S34: bonding process S40: Load measurement process, S50: Sheet cutting process, S60: Breakage origin detection process

Claims

1. A test device for measuring the load at which a thin plate-shaped test piece breaks, a sheet unit that holds a sheet to be adhered to the test piece, and is used when adhering the sheet to the first surface of the test piece and a second surface located on the opposite side to the first surface in the thickness direction of the test piece; an indenter that presses the first surface of the test piece through the sheet; a load measuring device for measuring a load applied to the test piece when the indenter presses the test piece; a test piece receiving portion having a pair of receiving portions arranged to sandwich the tip of the indenter in a plan view and contacting the second surface of the test piece when the indenter presses the test piece; A test apparatus comprising:

2. 2. The test device according to claim 1, wherein the test piece receiving portion includes a lifting mechanism for lifting and lowering the pair of receiving portions.

3. a controller having a processor and a memory, and controlling the operation of the sheet unit, the indenter, and the lift mechanism; The test piece receiving portion is disposed below the indenter, The testing apparatus according to claim 2, characterized in that the controller adheres the test piece to the sheet by raising the pair of receiving parts after the test piece is placed on the pair of receiving parts that are arranged below the sheet.

4. A test method for measuring the load at which a thin plate-shaped test piece breaks, comprising the steps of: a test piece positioning step of positioning the test piece between the test piece receiving portion and the indenter such that the test piece has a first surface and a second surface located on the opposite side of the first surface in a thickness direction and the test piece is placed between the test piece receiving portion and the indenter such that the test piece receiving portion faces the second surface of the test piece and the indenter faces the first surface via the sheet; a load measuring step of pressing the first surface of the test piece with the indenter through the sheet to break the test piece while the second surface of the test piece is received by the test piece receiving portion, thereby measuring the load at which the test piece breaks; A test method comprising:

5. 5. The test method according to claim 4, further comprising a fracture origin detection step of observing the broken test piece adhered to the sheet after the load measurement step, and detecting a fracture origin when the test piece is broken.

Images