Sensor device and image display device including the same

Abstract

To provide a sensor device having improved reliability and efficiency of signal transmission and reception, and an image display device including the sensor device.SOLUTION: A sensor device and an image display device including the same are provided. The sensor device includes touch sensing electrodes, traces extending from the touch sensing electrodes, touch sensor pads connected to the traces, an antenna unit disposed adjacent to the touch sensing electrodes and including a radiator, a transmission line connected to the radiator, and ground lines extending around the transmission line, and antenna pads forming a pad row together with the touch sensor pads, and including a signal pad connected to the transmission line and ground pads connected to the ground lines.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a sensor element and an image display device including the same, and more particularly to a sensor element including a sensing electrode and a pad, and an image display device including the same. [Background technology]

[0002] In recent years, with the development of the information society, wireless communication technologies such as Wi-Fi and Bluetooth (registered trademark) have been combined with image display devices, for example, in the form of smartphones. In this case, an antenna is combined with the image display device, and a communication function can be performed.

[0003] Furthermore, with the development of mobile communication technology, for example, an antenna for performing communication in high frequency or ultra-high frequency bands corresponding to 3G to 5G or higher can be combined with the image display device.

[0004] Meanwhile, electronic devices that realize both image display and information input functions have been developed by combining an image display device with a touch panel or touch sensor, which is an input device that selects instructions displayed on a screen with a person's hand or an object and inputs a user's command. For example, as shown in Patent Document 1, touch screen panels that combine various image display devices with touch sensors have been developed.

[0005] When the antenna structure is disposed together with the touch sensor, signal interference may occur between the antenna and the touch sensing electrode, and separate circuit connection structures (e.g., multiple circuit boards) are required to power the antenna structure and the touch sensor, respectively.

[0006] For example, Patent Document 2 discloses an antenna structure built into a portable terminal, but does not take into consideration compatibility with other electric elements such as a touch sensor. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Korean Patent Publication No. 2014-0092366 [Patent Document 2] Korean Patent Publication No. 2003-0095557 Summary of the Invention [Problem to be solved by the invention]

[0008] One object of the present invention is to provide a sensor element with improved reliability and efficiency of signal transmission and reception.

[0009] It is an object of the present invention to provide an image display device including a sensor element having improved reliability and efficiency of signal transmission and reception. [Means for solving the problem]

[0010] 1. A sensor element including a touch sensing electrode, a trace extending from the touch sensing electrode, a touch sensor pad connected to the trace, an antenna unit arranged adjacent to the touch sensing electrode and including a radiator, a transmission line connected to the radiator, and a ground line extending around the transmission line, and an antenna pad forming a pad row together with the touch sensor pad and including a signal pad connected to the transmission line, and a ground pad connected to the ground line.

[0011] 2. The sensor element according to item 1, wherein a pair of the ground lines face each other with the transmission line in between.

[0012] 3. The sensor element according to item 1, wherein the transmission line and the ground line each have a polygonal line shape.

[0013] 4. The sensor element according to claim 1, wherein the transmission line includes an extended line section whose width is increased at an end adjacent to the radiator.

[0014] 5. A sensor element according to claim 1, wherein the ground line includes an extended ground section whose width increases at an end adjacent to the radiator.

[0015] 6. The sensor element according to item 1, wherein the ground pad is disposed between the signal pad and the touch sensor pad.

[0016] 7. A sensor element according to item 1, wherein a plurality of the antenna units are arranged along a row direction, and the signal pad and the ground pad are independently connected to each of the plurality of the antenna units via the transmission line and the ground line.

[0017] 8. A sensor element according to item 7, wherein at least one of the touch sensor pads is disposed between the antenna pads connected to adjacent ones of the plurality of antenna units.

[0018] 9. A sensor element according to item 7, wherein the transmission lines connected to each of the plurality of antenna units have a polygonal line shape and have the same length.

[0019] 10. The sensor element according to item 1, wherein the antenna pad and the touch sensor pad form a single pad row on the same layer.

[0020] 11. A sensor element according to item 1, wherein the transmission line of the antenna unit includes a first transmission line and a second transmission line extending in different directions from each other and connected to the radiator, and the signal pad is connected to each of the first transmission line and the second transmission line.

[0021] 12. The sensor element according to item 1, further including an antenna driving integrated circuit electrically connected to the antenna unit, applying a reference potential to the ground pad and applying a power supply signal having a potential greater than the reference potential to the signal pad.

[0022] 13. The sensor element according to item 12, further comprising a blocking pad interposed between adjacent ones of the touch sensor pads, or a guard pad disposed at an end of the pad row.

[0023] 14. In the above item 13, the sensor element further includes a touch sensor drive integrated circuit electrically connected to the touch sensor pad, applying a reference potential to the blocking pad or the guard pad, and applying a touch drive signal to the touch sensor pad at a potential greater than the reference potential.

[0024] 15. A sensor element according to item 14, wherein the reference potential applied to the blocking pad or the guard pad is the same as the reference potential applied to the ground pad.

[0025] 16. The sensor element according to claim 13, further comprising a blocking line extending from the blocking pad between adjacent ones of the traces.

[0026] 17. The sensor element according to item 13, further comprising a loop-shaped guard line extending from the guard pad and surrounding the periphery of the touch sensing electrode.

[0027] 18. An image display device comprising a display panel and a sensor element according to any of the previous embodiments. Effect of the Invention

[0028] According to the embodiment of the present invention, the emitter and the sensing electrode are disposed together in the active area of ​​the sensor element, thereby improving the space efficiency, and the touch sensor pad and the antenna pad are disposed together in the bonding area, thereby enabling the power supply / signal transmission by one circuit board.

[0029] In an exemplary embodiment, the antenna unit includes a transmission line and a ground line, and the antenna pad includes an antenna signal pad connected to the antenna unit via the transmission line and an antenna ground pad connected to the ground line. By arranging the antenna ground pad adjacent to the touch sensor pad, interference / noise between the touch sensing signal and the antenna signal can be blocked.

[0030] This allows the bonding area to independently drive the touch sensor and power the antenna using a single circuit board. [Brief description of the drawings]

[0031] [Figure 1] FIG. 1 is a schematic plan view illustrating a sensor element according to an exemplary embodiment. [Diagram 2] FIG. 2 is a schematic cross-sectional view illustrating a structure of a touch sensing electrode of a sensor element according to an exemplary embodiment. [Diagram 3] FIG. 3 is a partial enlarged plan view illustrating a sensor element according to an exemplary embodiment. [Figure 4] FIG. 4 is a partial enlarged plan view illustrating a sensor element according to an exemplary embodiment. [Diagram 5] FIG. 5 is a schematic, partially enlarged plan view illustrating a sensor element according to some exemplary embodiments. [Figure 6] FIG. 6 is a schematic partial enlarged plan view illustrating a sensor element package according to an exemplary embodiment. [Figure 7] FIG. 7 is a schematic plan view showing an image display device according to an exemplary embodiment. [Figure 8] FIG. 8 is a schematic cross-sectional view showing an image display device according to an exemplary embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0032] An embodiment of the present invention provides a sensor element including an antenna unit and a sensing electrode, and an image display device including the sensor element.

[0033] The antenna unit may be, for example, a microstrip patch antenna made in the form of a transparent film. The sensor element including the antenna unit may be applied, for example, to communication devices for high frequency or ultra-high frequency (e.g., 3G, 4G, 5G or higher) mobile communication. However, the sensor element is not limited to an image display device, and may be applied to various structures such as vehicles, home appliances, and buildings.

[0034] Hereinafter, the embodiments of the present invention will be described in more detail with reference to the drawings. However, the drawings attached to this specification are intended to illustrate preferred embodiments of the present invention and, together with the detailed description of the invention, serve to aid in further understanding of the technical concept of the present invention, and therefore the present invention should not be interpreted as being limited only to the matters depicted in the drawings.

[0035] As used in this specification, terms such as "first," "second," "one side," "other side," "one end," "other end," "top," "bottom," "upper portion," "lower portion," "column direction," and "row direction" are not intended to limit absolute positions or orders, but are used in a relative sense to distinguish different configurations or parts.

[0036] As used herein, the term "row direction" may correspond to a width direction parallel to an active or display surface of a sensor element or image display device, and a "column direction" may be a longitudinal direction parallel to said active or display surface and perpendicular to said row direction.

[0037] Fig. 1 is a schematic plan view showing a sensor element according to an exemplary embodiment. Fig. 2 is a schematic cross-sectional view showing a structure of a touch sensing electrode of a sensor element according to an exemplary embodiment. Fig. 2 is a cross-sectional view cut in the thickness direction along "I-I'" in Fig. 1.

[0038] For ease of illustration, detailed connections of traces 140 are not shown in FIG.

[0039] 1 and 2, the sensor element may include a base layer 100, as well as touch sensing electrodes 110, 130 (hereinafter abbreviated as "sensing electrodes") and an antenna unit 200 arranged on the base layer 100.

[0040] The substrate layer 100 may include a support layer, an interlayer insulating layer, or a film-type substrate for forming the sensing electrodes 110, 130 and the antenna unit 200. For example, the substrate layer 100 may also serve as a dielectric layer of the antenna unit 200.

[0041] For example, the base layer 100 may include a transparent resin film including polyester-based resins such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, and polybutylene terephthalate; cellulose-based resins such as diacetyl cellulose and triacetyl cellulose; polycarbonate-based resins; acrylic resins such as polymethyl (meth)acrylate and polyethyl (meth)acrylate; styrene-based resins such as polystyrene and acrylonitrile-styrene copolymers; polyolefin-based resins such as polyethylene, polypropylene, polyolefins having a cyclo- or norbornene structure, and ethylene-propylene copolymers; vinyl chloride-based resins; amide-based resins such as nylon and aromatic polyamide; imide-based resins; polyethersulfone-based resins; sulfone-based resins; polyetheretherketone-based resins; polyphenylene sulfide-based resins; vinyl alcohol-based resins; vinylidene chloride-based resins; vinyl butyral-based resins; arylate-based resins; polyoxymethylene-based resins; epoxy-based resins; urethane-based or acrylic urethane-based resins; silicone-based resins, etc. These may be used alone or in combination of two or more.

[0042] In some embodiments, the base layer 100 can include an adhesive film such as an Optically Clear Adhesive (OCA), an Optically Clear Resin (OCR), or the like.

[0043] In some embodiments, the substrate layer 100 can include an inorganic insulating material, such as silicon oxide, silicon nitride, silicon oxynitride, glass, or the like.

[0044] In one embodiment, the substrate layer 100 may be provided in a substantially single layer.

[0045] In one embodiment, the substrate layer 100 may each include a multi-layer structure of at least two layers. For example, the substrate layer 100 may include a lower substrate and a dielectric layer, and may also include an adhesive layer between the lower substrate and the dielectric layer.

[0046] The base layer 100 forms an impedance or inductance with respect to the antenna unit 200, and can adjust the frequency band in which the antenna unit 200 can be driven or sensed. In some embodiments, the dielectric constant of the base layer 100 can be adjusted to a range of about 1.5 to 12. If the dielectric constant exceeds about 12, the driving frequency is too low, and driving in a high frequency band may not be realized.

[0047] In one embodiment, a ground plane (not shown) may be disposed beneath the bottom surface of the substrate layer 100 .

[0048] In one embodiment, the ground layer can provide a conductive member of an image display device or a display panel to which the sensor element is applied.

[0049] For example, the conductive member may include electrodes or wiring such as a gate electrode, a source / drain electrode, a pixel electrode, a common electrode, a data line, a scan line, etc., included in a thin film transistor (TFT) array panel.

[0050] In one embodiment, the ground layer can also serve as a SUS plate arranged on the rear surface of the image display device, a sensor component such as a digitizer, and a metallic component such as a heat dissipation sheet.

[0051] The top surface of the substrate layer 100 may include an active area (AA) and a peripheral area (PA) around the active area (AA). The sensing electrodes 110, 130 and the antenna unit 200 may be arranged on the active area (AA) of the substrate layer 100. According to an exemplary embodiment, the sensing electrodes 110, 130 and the antenna unit 200 may be disposed at the same level on the top surface of the substrate layer 100.

[0052] The sensing electrodes 110 and 130 may be disposed on the upper surface of the base layer 100 in the active area (AA). When a user's touch is input onto the active area (AA), a change in capacitance may occur due to the sensing electrodes 110 and 130. As a result, a predetermined sensing function may be performed by converting a physical touch into an electrical signal.

[0053] The sensing electrodes 110, 130 may include a first sensing electrode 110 and a second sensing electrode 130. The first sensing electrode 110 and the second sensing electrode 130 may be arranged in a direction crossing each other. The first sensing electrode 110 and the second sensing electrode 130 may be located in the same layer or at the same level on the upper surface of the base layer 100.

[0054] For example, the first sensing electrodes 110 may be arranged along a column direction (e.g., Y direction). The first sensing electrodes 110 may be connected along the column direction via a merging portion 115. The merging portion 115 may be integrally connected to the first sensing electrodes 110 and may be provided as a substantially single member.

[0055] A plurality of first sensing electrodes 110 may be connected by merging portions 115 to define a sensing channel column extending in the column direction. In addition, a plurality of the sensing channel columns may be arranged in a row direction (e.g., an X direction).

[0056] The second sensing electrodes 130 may be arranged along the row direction. Each of the second sensing electrodes 130 may have a pattern shape of islands that are spaced apart. The second sensing electrodes 130 adjacent to each other in the row direction may be electrically connected to each other by a bridge electrode 135.

[0057] For example, a pair of second sensing electrodes 130 adjacent to each other across a merging portion 115 included in the sensing channel column may be electrically connected to each other by a bridge electrode 135. As a result, a sensing channel row may be defined by a plurality of second sensing electrodes 130 and bridge electrodes 135 connected in the row direction. In addition, a plurality of the sensing channel rows may be arranged along the column direction.

[0058] As shown in FIG. 2, an interlayer insulating layer 120 is formed to cover the first and second sensing electrodes 110 and 130, and the bridge electrodes 135 may penetrate the interlayer insulating layer 120 to connect the adjacent second sensing electrodes 130.

[0059] In some embodiments, a protective layer 190 covering the bridge electrode 135 may be formed on the interlayer insulating layer 120. The interlayer insulating layer 120 and the protective layer 190 may include the above-mentioned resin material or inorganic insulating material and may cover both the sensing electrodes 110, 130 and the antenna unit 200. The interlayer insulating layer 120 and the protective layer 190 may be removed in the bonding area (BA) to expose the pads.

[0060] 1 shows that each of the sensing electrodes 110, 130 has a diamond-shaped pattern, but the shapes of the sensing electrodes 110, 130 can be appropriately changed in consideration of the pattern density, compatibility with the optical characteristics of the image display device, the arrangement of the antenna unit 200, etc. For example, the sensing electrodes 110, 130 may be formed to have a wavy frame.

[0061] Although FIG. 1 shows that the sensing electrodes in the column direction are connected together by a merging portion and the sensing electrodes in the row direction are connected by a bridge electrode, the column direction and the row direction are used relatively to indicate two different intersecting directions and are not intended to limit a specific direction.

[0062] Also, in FIG. 1, for convenience of explanation, the number of sensing channel rows and sensing channel columns, as well as the number of sensing electrodes included therein, are shown only partially, and can be expanded depending on the area of ​​the active area (AA).

[0063] The area on the upper surface of the base layer 100 excluding the active area (AA) may be defined as a peripheral area (PA). The peripheral area (PA) may be defined as an area that at least partially surrounds the active area (AA). The peripheral area (PA) may include a bezel area of ​​the image display device, and may include a bonding area (BA) where pads are arranged. The active area (AA) may overlap with a display area of ​​the image display device.

[0064] The sensor element may further include a trace 140 and a touch sensor pad 150 .

[0065] The traces 140 may branch off from each of the sensing channel rows and sensing channel columns and extend onto the peripheral area (PA). The traces 140 may include a first trace 142 branching off from the sensing channel column and a second trace 144 branching off from the sensing channel row. The traces 140 may include substantially the same or similar conductive material and / or layered structure as the sensing electrodes 110, 130.

[0066] In some embodiments, the second traces 144 may be arranged in a double-routing manner: the second traces 144 may be distributed alternately on both sides of the peripheral area (PA) in the row direction.

[0067] For example, the second traces 144 may be arranged alternately on both sides along the column direction. The second traces 144 may branch off from one end of one of the sensing channel rows, and the second traces 144 may branch off from the other end of a sensing channel row adjacent to the one sensing channel row.

[0068] The above-mentioned double routing arrangement can reduce the area of ​​the peripheral area (PA) on both sides while ensuring a sufficient area of ​​the active area (AA). In addition, the variation in length of the second trace 144 can be reduced to improve resistance / sensing uniformity. Furthermore, the conductive lines can be distributed on both sides to uniformly distribute stress caused by folding the sensor element.

[0069] In some embodiments, the first traces 142 may each branch off from one end of the sensing channel row adjacent to a bonding area (BA), thereby shortening the length of the first traces 142 and improving the sensing / signal transmission speed.

[0070] In one embodiment, a portion of the first trace 142 may branch off from the other end of the array of sensing channels and extend to a bonding area (BA).

[0071] As shown in FIGS. 1 and 2, the sensing electrodes 110 and 130 may be arranged in a mutual capacitance manner.

[0072] In some embodiments, the sensing electrodes 110, 130 may be arranged in a self-capacitance manner. In this case, each sensing electrode 110, 130 may have an independent island pattern shape, and the trace 140 may branch off from each island pattern sensing electrode 110, 130. Also, the merger 115 and the bridge electrode 135 may be omitted.

[0073] The traces 140 may extend over a peripheral area (PA) and meet at a bonding area (BA) within which a touch sensor pad 150 may be located that is connected to an end of the traces 140.

[0074] The touch sensor pad 150 may include a first touch sensor pad 152 electrically connected to each of the sensing channel columns via a first trace 142 and a second touch sensor pad 154 electrically connected to each of the sensing channel rows via a second trace 144.

[0075] In an exemplary embodiment, touch sensor pad 150 may further include blocking pad 151 and guard pad 153. Blocking pad 151 and guard pad 153 may not be electrically / physically connected to trace 140.

[0076] 1 shows that the blocking pad 151 and the guard pad 153 are included in the touch sensor pad 150. However, the blocking pad 151 and the guard pad 153 are arranged independently without being connected to the touch sensing electrodes 110, 130 and the first and second touch sensor pads 152, 154, but may be included as a configuration for improving the reliability of touch sensing / driving.

[0077] The blocking pad 151 may be disposed between adjacent first and second touch sensor pads 152 and 154. For example, a plurality of first touch sensor pads 152 may be arranged in the row direction to form a first touchpad row, and a plurality of second touch sensor pads 154 may be arranged in the row direction to form a second touchpad row. The blocking pad 151 may be inserted between the first and second touchpad rows.

[0078] Blocking pads 151 provide improved isolation of currents and signals to the sensing channel rows and sensing channel columns, and prevent mutual interference between drive currents and receive currents.

[0079] The guard pads 153 may be located at the ends of a row of pads located in a bonding area (BA). For example, the guard pads 153 may be the outermost pads included in the row of pads.

[0080] In some embodiments, guard pads 153 may be placed at either end of the row of pads.

[0081] According to an exemplary embodiment, blocking lines 141 and guard lines 143 may be connected to blocking pads 151 and guard pads 153, respectively. Blocking lines 141 and guard lines 143 may extend from blocking pads 151 and guard pads 153, respectively, within the peripheral area (PA).

[0082] 1, a first region (I) in which first traces 142 extend in the row direction and a second region (II) in which second traces 144 extend in the row direction can be divided by blocking lines 141. The blocking lines 141 prevent signal collision between the first traces 142 and the second traces 144 and prevent mutual interference between the driving current and the receiving current.

[0083] The guard lines 143 may extend to at least partially surround the active areas (AA). For example, the guard lines 143 may extend continuously between the guard pads 153 disposed at both ends of the pad row to form a loop. This can reduce / block interference between the touch signals in the active areas (AA) and external noise.

[0084] The antenna unit 200 may include a radiator 210 , a transmission line 220 , and a ground line 230 .

[0085] For example, the radiator 210 can have a polygonal plate shape.

[0086] For example, the transmission line 220 may have a width less than that of the emitter 210 and may be connected to one end or side of the emitter 210. The emitter 210 and the transmission line 220 may be formed as a single member that is integrally connected to one another.

[0087] The target resonant frequency of the antenna unit 200 can be adjusted by the shape and size of the radiator 210. For example, the radiator 210 can be designed to be capable of radiating in high frequency / ultra-high frequency bands of 3G, 4G, 5G or more. For example, the radiator 210 can realize a radiation band of a frequency band of about 0.5 GHz or more, about 1 GHz or more, about 10 GHz or more, about 20 GHz or more, about 30 GHz or more, or about 40 GHz or more.

[0088] The ground line 230 can be arranged around the transmission line 220. For example, a pair of ground lines 230 can be arranged to face each other with the transmission line 220 in between. The ground line 230 can be physically and electrically separated from the radiator 210 and the transmission line 220.

[0089] An antenna pad 250 may be arranged in the bonding area (BA) together with the touch sensor pad 150. An antenna power / drive signal for the antenna unit 200 or the radiator 210 may be transmitted from the antenna pad 250 to the transmission line 220.

[0090] According to an exemplary embodiment, the touch sensor pads 150 and the antenna pads 250 may form a single row of pads at one end of the sensor element. The antenna pads 250 may include a signal pad 252 and a ground pad 254.

[0091] The connection / arrangement structure of the antenna pad 250 and the antenna unit 200 will be described in more detail with reference to FIGS.

[0092] The sensing electrodes 110, 130, traces 140 and / or antenna unit 200 may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), or an alloy containing at least one of these, which may be used alone or in combination of two or more.

[0093] In one embodiment, the sensing electrodes 110, 130, the traces 140, and / or the antenna unit 200 may include silver (Ag) or a silver alloy (e.g., a silver-palladium-copper (APC) alloy), or copper (Cu) or a copper alloy (e.g., a copper-calcium (CuCa) alloy) to achieve low resistance and fine linewidth.

[0094] In some embodiments, the sensing electrodes 110, 130, the traces 140, and / or the antenna unit 200 may also include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (ITZO), zinc oxide (ZnOx), or the like.

[0095] In some embodiments, the sensing electrodes 110, 130, the traces 140, and / or the antenna unit 200 may include a laminated structure of a transparent conductive oxide layer and a metal layer, for example, a two-layer structure of a transparent conductive oxide layer-metal layer, or a three-layer structure of a transparent conductive oxide layer-metal layer-transparent conductive oxide layer. In this case, the metal layer can improve flexibility and reduce resistance to improve signal transmission speed, and the transparent conductive oxide layer can improve corrosion resistance and transparency.

[0096] The sensing electrodes 110, 130 and / or the antenna unit 200 (the emitter 210) may include a blackening treatment, which reduces the reflectance on the surfaces of the sensing electrodes 110, 130 and / or the antenna unit 200, thereby reducing the visibility of the pattern due to light reflection.

[0097] In one embodiment, the surface of the metal layer included in the sensing electrodes 110, 130 and / or the antenna unit 200 may be converted to a metal oxide or metal sulfide to form a blackened layer. In one embodiment, a blackened layer such as a black material coating layer or a plating layer may be formed on the sensing electrodes 110, 130 and / or the antenna unit 200 or the metal layer. The black material or plating layer may include silicon, carbon, copper, molybdenum, tin, chromium, molybdenum, nickel, cobalt, or an oxide, sulfide, alloy, etc. containing at least one of these elements.

[0098] The composition and thickness of the blackening layer can be adjusted taking into consideration the effect of reducing reflectance and the radiation characteristics of the antenna.

[0099] In one embodiment, the sensing electrodes 110, 130 and the emitter 210 may include a mesh structure, which may prevent the sensing electrodes 110, 130 and the emitter 210 from being visually recognized by a user in the active area (AA).

[0100] In one embodiment, at least a portion of the transmission line 220 may include a solid structure formed from the aforementioned metal or alloy, which can reduce the increase in resistance between the antenna unit 200 and the antenna pad 250 and improve the power supply efficiency.

[0101] The antenna unit 200 may be located in the active area (AA) and partially located in the peripheral area (PA). For example, the transmission line 220 may be located in the peripheral area (PA). In one embodiment, the transmission line 220 may extend across the active area (AA) and the peripheral area (PA).

[0102] In one embodiment, the transmission line 220 may also share the mesh structure. The transmission line 220 may also have a partially solid structure.

[0103] In one embodiment, the sensing electrodes 110, 130 and / or the emitter 210 may also include solid thin-film transparent metal structures, which may further improve the sensing sensitivity and emission performance.

[0104] The touch sensor pad 150 and the antenna pad 250 may have a solid structure made of the aforementioned metals or alloys, which may reduce the bonding resistance with the circuit board 300.

[0105] In an exemplary embodiment, the sensing electrodes 110, 130 and the antenna unit 200 may be disposed in the same layer or at the same level. For example, the sensing electrodes 110, 130 and the emitter 210 may be formed together in the same layer and by the same patterning process to have a mesh structure.

[0106] In some embodiments, the antenna unit 200 and the traces 140 may be formed in the same layer or level.

[0107] According to an exemplary embodiment, the touch sensor pad 150 and the antenna pad 250 can be arranged together in the same layer or level in the bonding area (BA), so that one circuit board 300 can achieve both antenna bonding and touch sensor bonding, as described below.

[0108] In some embodiments, the antenna unit 200 and the antenna pad 250 can be directly connected to each other on the same layer, which can reduce the antenna's feed resistance while suppressing the antenna's signal loss.

[0109] In some embodiments, the sensing electrodes 110, 130, the traces 140, and the touch sensor pads 150 can be directly connected to each other on the same layer, which can improve touch sensing sensitivity while reducing the resistance of the sensing channel.

[0110] As shown in FIG. 1, a plurality of antenna units 200 may be arranged in an array at one end of an active area (AA) adjacent to a bonding area (BA).

[0111] The sensing electrodes 110, 130 adjacent to the emitter 210 of the antenna unit 200 may have a smaller area than the other sensing electrodes 110, 130. This allows the mutual independence of touch sensing and antenna radiation to be maintained while securing an arrangement space for the antenna unit 200. For example, the sensing electrodes 110, 130 adjacent to the emitter 210 may include a recess that is etched so that the emitter 210 can be partially inserted therein.

[0112] 3 and 4 are partial enlarged plan views showing a sensor element according to an exemplary embodiment.

[0113] 3 and 4, as described above, the antenna pads 250 and the touch sensor pads 150 may be arranged together in a bonding area (BA) allocated at one end of the peripheral area (PA) to form a pad row.

[0114] The antenna pad 250 may include a signal pad 252 and a ground pad 254. The transmission line 220 of the antenna unit 200 may be connected to the signal pad 252. The ground line 230 of the antenna unit 200 may be connected to the ground pad 254 of the antenna pad 250.

[0115] Each of the first traces 142 branching off from the column of sensing channels may be connected to a first touch sensor pad 152. Each of the second traces 144 branching off from the row of sensing channels may be connected to a second touch sensor pad 154.

[0116] An antenna pad unit can be defined by an antenna pad 250 connected to one antenna unit 200. For example, the antenna pad unit can be defined by a signal pad 252 and a pair of ground pads 254 that face each other with the signal pad 252 in between.

[0117] A touch sensor pad 150 (e.g., a first touch sensor pad 152) may be disposed on both sides of the antenna unit in the row direction. According to an exemplary embodiment, a ground pad 254 of the antenna pad 250 may be disposed between the touch sensor pad 150 and a signal pad 252 of the antenna pad 250.

[0118] In some embodiments, a touch sensor pad 150 (e.g., a first touch sensor pad 152) may be disposed between adjacent antenna pad units. For example, a plurality of antenna pad units may be repeatedly arranged along the row direction with the touch sensor pad 150 therebetween.

[0119] The above-mentioned pad arrangement can improve the mutual independence and reliability of antenna power supply / radiation by the antenna unit 200 and touch sensing by the sensing electrodes 110 and 130. For example, the ground pad 254 can block interference between the antenna power supply / driving signal and the touch sensing signal, and absorb / shield mutual noise.

[0120] In one embodiment, a reference potential or ground potential is applied to the ground pad 254 to increase the mutual independence of the antenna power / drive signal and the touch sensing signal. The reference potential or ground potential may be smaller than both the potential of the touch drive signal to the touch sensor pad 150 and the power supply potential to the signal pad 252.

[0121] In one embodiment, the reference potential or ground potential applied to the ground pad 254 may be substantially 0 V. For example, the power supply potential may be applied to the signal pad 252 and the reference potential or ground potential may be applied to the ground pad 254 via the antenna driving IC chip 350b (see FIG. 8).

[0122] In some embodiments, the reference potential or ground potential can also be applied to blocking pad 151 and / or guard pad 153. For example, a touch drive signal potential can be applied to touch sensor pads 152 and 154 via touch sensor drive IC chip 370b (see FIG. 8 ), and the reference potential or ground potential can be applied to blocking pad 151 and / or guard pad 153.

[0123] The reference or ground potential applied to blocking pad 151 and / or guard pad 153 may be substantially the same as the reference or ground potential applied to ground pad 254. In one embodiment, a reference potential of substantially 0V may be applied to both blocking pad 151, guard pad 153, and ground pad 254.

[0124] In some embodiments, a plurality of touch sensor pads 150 may be disposed between adjacent antenna pad units. For example, a plurality of first touch sensor pads 152 may be disposed between adjacent antenna pad units. In this case, a plurality of first traces 142 may be disposed between adjacent antenna units 200.

[0125] In some embodiments, one touch sensor pad 150 may be disposed between adjacent antenna pad units. For example, one first touch sensor pad 152 may be disposed between adjacent antenna pad units. This may increase the pad density in the pad row while reducing the number of touch sensor pads 150 sandwiched between the antenna pad units.

[0126] According to the above-described exemplary embodiment, the antenna pad 250 can be arranged together with the touch sensor pad 150 in the bonding area (BA) using the ground line 230 and the transmission line 220. Thus, while increasing the pad density in the bonding area (BA), it is possible to realize both the connection between the antenna driving integrated circuit (IC) chip and the antenna unit 200 and the connection between the touch sensor IC chip and the sensing electrodes 110, 130 by a single circuit board 300, as described below.

[0127] In addition, the insertion of the ground pad 254 can enhance the independence between the antenna power supply / driving signal and the touch sensing signal. The ground pad 254 is connected to the ground line 230 of the antenna unit 200, and can further improve the efficiency of shielding / absorbing mutual noise.

[0128] In some embodiments, the ground pad 254 can apply a reference or ground potential as described above and supply a ground current via the ground line 230. This allows the ground line 230 to improve isolation from the touch sensing signal and also to improve isolation from adjacent antenna units 200.

[0129] The ground line 230 may extend adjacent to the radiator 210 along with the transmission line 220 and serve as a guard line for the antenna unit 200 to the traces 140 around the periphery of the antenna unit 200. The ground line 230 may function as a coplanar waveguide (CPW) line that extends together with the transmission line 220 around the periphery to facilitate electric field delivery to the radiator 210.

[0130] In addition, the ground line 230 can be provided as a blocking line for a parasitic capacitance generated by a potential difference between the antenna power supply signal applied via the transmission line 220 and the channel signal of the touch sensor.

[0131] The transmission line 220 and the ground line 230 each have a bent line shape, and can efficiently gather the antenna pads 250 in the bonding area (BA). For example, the transmission line 220 and the ground line 230 each can include two bent portions.

[0132] In some embodiments, the transmission line 220 can have a variable width. As shown in FIG. 3, the transmission line 220 can include an extended line section 225 with an increased width at the end adjacent the emitter 210.

[0133] In some embodiments, the ground line 230 may also have a variable width. The ground line 230 may include an extended ground portion 235 that increases in width at the end adjacent the radiator 210. For example, a pair of extended ground portions 235 may face each other in the row direction with the extended line portion 225 in between.

[0134] An extended line section 225 and an extended ground section 235 may be formed at the end adjacent the radiator 210 to facilitate power and signal delivery to the radiator 210 and reduce signal loss in the antenna.

[0135] 3, the lengths of the transmission lines 220 of the antenna units 200 may all be substantially the same. In this case, the phases of the signals applied to the antenna units 200 can be made uniform. This makes it possible to suppress phase interference and achieve radiation of a desired frequency band with high reliability.

[0136] According to the embodiment shown in Fig. 4, the transmission line 220 of the antenna unit 200 may include transmission lines of different lengths. In this case, the phase is corrected from the antenna driving integrated circuit (IC) chip, and the overall phase of the transmission line can be made uniform.

[0137] FIG. 5 is a schematic, partially enlarged plan view illustrating a sensor element according to some exemplary embodiments.

[0138] 5, the antenna unit 200 may include multiple transmission lines 220. For example, two transmission lines 220 may be connected to one radiator 210.

[0139] According to an example embodiment, a first transmission line 220a may be connected to a first corner of the emitter 210, and a second transmission line 220b may be connected to a second corner of the emitter 210. In some embodiments, the first corner and the second corner may include a vertex of the emitter 210 adjacent to a bonding area (BA). The first corner and the second corner may be symmetrical about an imaginary centerline of the emitter 210 extending in the column direction.

[0140] Thereby, the first transmission line 220a and the second transmission line 220b may be substantially symmetrical with respect to the imaginary center line.

[0141] In some embodiments, a first transmission line 220a can extend from the first corner toward a center of the emitter 210. A second transmission line 220b can extend from the second corner toward a center of the emitter 210.

[0142] In one embodiment, the extension directions of the first transmission line 220a and the second transmission line 220b may be substantially perpendicular to each other.

[0143] The above-described design of the first transmission line 220a and the second transmission line 220b allows the radiator 210 to achieve substantially dual polarization characteristics.

[0144] In some embodiments, a merge line 220c may be formed on the bottom side of the emitter 210 connected to the transmission line 220. The merge line 220c may be a solid metal line, and the first transmission line 220a and the second transmission line 220b may be connected to both ends of the merge line 220c. The first transmission line 220a and the second transmission line 220b may also be formed of a solid metal line.

[0145] In one embodiment, the first transmission line 220a, the second transmission line 220b and the merge line 220c may be formed from a substantially integral single piece.

[0146] The merged line 220c reduces the feeding resistance from the transmission lines 220a and 220b to the radiator 210, thereby making it possible to prevent impedance mismatch.

[0147] FIG. 6 is a schematic partial enlarged plan view illustrating a sensor element package according to an exemplary embodiment.

[0148] Referring to FIG. 6, a single circuit board 300 can be used to electrically connect the antenna driving circuit / antenna connection structure 350 to the antenna pad 250 and the touch sensor driving circuit / touch sensor connection structure 370 to the touch sensor pad 150.

[0149] The circuit board 300 may include a core insulating layer and conductive wiring formed on the core insulating layer. The conductive wiring may include an antenna conductive wiring 310 (see FIG. 7) connected to the antenna pad 250 and a touch sensor conductive wiring 320 (see FIG. 7) connected to the touch sensor pad 150. For convenience of illustration, the conductive wiring included in the circuit board 300 is omitted in FIG. 6.

[0150] The core insulating layer may include a flexible resin such as polyimide resin, MPI (Modified Polyimide), epoxy resin, polyester, cycloolefin polymer (COP), liquid crystal polymer (LCP), etc. In a preferred embodiment, the core insulating layer may include polyimide resin or MPI.

[0151] The conductive wiring of the circuit board 300 may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), tin (Sn), zinc (Zn), molybdenum (Mo), calcium (Ca), or an alloy containing at least one of these metals. In some embodiments, the conductive wiring may include copper or a copper alloy in consideration of signal efficiency.

[0152] In one embodiment, the circuit board 300 may be manufactured from a Copper Clad Laminate (CCL). The circuit board 300 may be provided as a flexible printed circuit board (FPCB).

[0153] The antenna conductive wiring 310 can be electrically connected to an antenna driving circuit / antenna connection structure 350. In one embodiment, the antenna driving circuit / antenna connection structure 350 can include an antenna connector. The antenna connector can be, for example, a board-to-board (B2B) connector. In this case, the circuit board 300 can be coupled to a chip mounting board through the antenna connector.

[0154] For example, the antenna driving circuit / antenna connection structure 350 may include an antenna driving integrated circuit (IC) chip, in which case the antenna driving IC chip 350b may be mounted directly onto the circuit board 300 via an intermediate conductive structure such as solder, conductive balls, conductive wires, etc.

[0155] The touch sensor conductive traces 320 may be electrically connected to a touch sensor driving circuit / touch sensor connection structure 370. In one embodiment, the touch sensor driving circuit / touch sensor connection structure 370 may include a touch sensor connector. The touch sensor connector may be, for example, a board-to-board (B2B) connector. In this case, the circuit board 300 may be coupled to the chip mounting substrate through the touch sensor connector.

[0156] For example, the touch sensor driving circuit / touch sensor connection structure 370 may include a touch sensor driving IC chip 370b, in which case the touch sensor driving IC chip 370b may be directly mounted on the circuit board 300 via a conductive intermediary structure such as solder, conductive balls, conductive wires, etc.

[0157] 7 and 8 are a schematic plan view and a schematic cross-sectional view, respectively, showing an image display device according to an exemplary embodiment.

[0158] 7 shows a front or window surface of an image display device 400 manufactured in the form of, for example, a smartphone. The front surface of the image display device 400 can include a display area (DA) 430 and a non-display area (NDA) 440. The non-display area 440 can correspond to, for example, a light shielding portion or a bezel portion of the image display device 400.

[0159] 7 and 8, an image display device 400 can include a display panel 410 and the above-mentioned sensor elements disposed on the display panel 410.

[0160] The sensor element according to the aforementioned exemplary embodiment can be arranged towards the front part of the image display device 400, for example, on the display panel, so that the antenna unit 200 included in the sensor element can be provided as an Antenna-On-Display (AOD) antenna.

[0161] In some embodiments, the sensor elements may be attached onto a display panel in the form of a film. In some embodiments, the sensor elements may be disposed across the display area 430 and the non-display area 440 of the image display device 400.

[0162] In some embodiments, the active area (AA) of the sensor element may overlap with the display area 430. In one embodiment, the sensing electrodes 110, 130 and / or the emitter 210 may at least partially overlap with the display area 430.

[0163] In some embodiments, the peripheral area (PA) of the sensor element may overlap with the non-display area 440. The traces 140 and / or the transmission lines 220 and ground lines 230 of the antenna unit 200 may at least partially overlap with the non-display area 440. For example, a portion of the sensor element having a solid structure may overlap with the non-display area 440.

[0164] The sensor element can be powered or driven through the circuit board 300. As described in Fig. 6, the circuit board 300 is electrically connected to the antenna driving circuit / antenna connection structure 350, which can include an antenna connector 350a and an antenna driving IC chip 350b. The touch sensor driving circuit / touch sensor connection structure 370 can include a touch sensor connector 370a and a touch sensor driving IC chip 370b.

[0165] 8 shows antenna connector 350a and touch sensor connector 370a as a single connector, but as described above, antenna connector 350a and touch sensor connector 370a can be mounted as independent separate members on circuit board 300. Antenna driving IC chip 350b and touch sensor driving IC chip 370b can also be mounted on chip mount substrate 450 as independent, separated chips.

[0166] The circuit board 300 may be electrically connected to the sensor element through the bonding intermediary structure 180. The bonding intermediary structure 180 may include an anisotropic conductive film (ACF).

[0167] For example, a bonding intermediary structure 180 may be attached to the bonding area (BA) so as to entirely cover the pad row. A circuit board 300 may be placed on the bonding intermediary structure 180 so that conductive wires 310 and 320 included in the circuit board 300 are aligned with the pads included in the pad row, respectively. Then, the circuit board 300 may be bonded to the sensor element via the bonding intermediary structure 180 by heat and pressure bonding.

[0168] The circuit board 300 is bent toward the rear surface of the image display device 400 so as to be connectable to the driving IC chips 350 b and 370 b mounted on a chip mount substrate 450 .

[0169] For example, the antenna unit 200 and the circuit board 300 can be electrically connected to the antenna driving IC chip 350b through the antenna connector 350a. The sensing electrodes 110, 130 of the touch sensor and the circuit board 300 can be electrically connected to the touch sensor driving IC chip 370b through the touch sensor connector 370a.

[0170] The chip mount substrate 450 may be a rigid printed circuit board, for example, the main board of the image display device 400 .

[0171] As described with reference to FIG. 6, the antenna driving IC chip 350b and the touch sensor driving IC chip 370b can also be mounted directly on the circuit board 300.

[0172] According to an exemplary embodiment, the display panel 410 may further include an optical layer 420. For example, the optical layer 420 may be a polarizing layer including a polarizer or a polarizing plate. In some embodiments, the sensor element may be disposed on the optical layer 420.

Claims

1. A touch sensing electrode; traces extending from the touch sensing electrodes; a touch sensor pad connected to the trace; an antenna unit disposed adjacent to the touch sensing electrode and including a radiator, a transmission line connected to the radiator, and a ground line extending around the transmission line; a sensor element including an antenna pad forming a pad row with the touch sensor pad, the antenna pad including a signal pad connected to the transmission line, and a ground pad connected to the ground line;

2. The sensor element according to claim 1 , wherein a pair of the ground lines face each other with the transmission line interposed therebetween.

3. The sensor element according to claim 1 , wherein the transmission line and the ground line each have a polygonal line shape.

4. The sensor element of claim 1 , wherein the transmission line includes an extended line section having an increased width at an end adjacent the emitter.

5. The sensor element of claim 1 , wherein the ground line includes an extended ground section having an increased width at an end adjacent the emitter.

6. The sensor element of claim 1 , wherein the ground pad is disposed between the signal pad and the touch sensor pad.

7. 2. The sensor element according to claim 1, wherein a plurality of the antenna units are arranged along a row direction, and the signal pad and the ground pad are independently connected to each of the plurality of the antenna units via the transmission line and the ground line.

8. The sensor element according to claim 7 , wherein at least one of the touch sensor pads is disposed between the antenna pads connected to adjacent ones of the plurality of antenna units.

9. The sensor element according to claim 7 , wherein the transmission lines connected to each of the plurality of antenna units have a polygonal shape and have the same length.

10. The sensor element of claim 1 , wherein the antenna pads and the touch sensor pads form a single row of pads on the same layer.

11. the transmission line of the antenna unit includes a first transmission line and a second transmission line extending in different directions from each other and connected to the radiator; The sensor element according to claim 1 , wherein the signal pad is connected to each of the first transmission line and the second transmission line.

12. The sensor element according to claim 1 , further comprising an antenna driving integrated circuit electrically connected to the antenna unit, applying a reference potential to the ground pad and applying a power supply signal having a potential higher than the reference potential to the signal pad.

13. The sensor element of claim 12 , further comprising a blocking pad interposed between adjacent ones of the touch sensor pads or a guard pad disposed at an end of the pad row.

14. 14. The sensor element of claim 13, further comprising a touch sensor drive integrated circuit electrically connected to the touch sensor pad, applying a reference potential to the blocking pad or the guard pad, and applying a touch drive signal to the touch sensor pad at a potential greater than the reference potential.

15. The sensor element according to claim 14 , wherein a reference potential applied to the blocking pad or the guard pad and a reference potential applied to the ground pad are the same.

16. The sensor element of claim 13 further comprising a blocking line extending from said blocking pad between adjacent ones of said traces.

17. The sensor element of claim 13 , further comprising a looped guard line extending from the guard pad and surrounding a periphery of the touch sensing electrode.

18. A display panel; An image display device comprising the sensor element according to claim 1.

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