Substrate transfer robot system

Abstract

To provide a substrate transfer robot system that can suppress increase in the number of components or complication of device configuration associated with correction of a teaching position for a substrate mounting location.SOLUTION: A substrate transfer robot system 100 comprises: an aligner 50 that is provided in a substrate transfer chamber 20 provided separately from a substrate transfer robot 10 and detects a position of a substrate W or a substrate-shaped fixture WT held by a hand 13 ; and a main control section 60 that corrects a teaching position TP for the aligner 50 and a load port 30 on the basis of the position of the substrate W, as detected by the aligner 50, mounted on the aligner 50 and the load port 30 by the substrate transfer robot 10.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to a substrate transport robot system. [Background technology]

[0002] Conventionally, a substrate transport robot system including a control unit that controls the operation of a substrate transport robot based on a teaching position is known. For example, Patent Document 1 discloses a substrate transport robot system including a control unit that outputs an operation instruction to a transport robot so that an end effector is placed at a teaching position. In the substrate transport robot system of Patent Document 1, at least one of a sensor and a camera provided on at least one of the end effector and the transport object is used when aligning the atmospheric transport robot with a load port and an aligner. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2022-132087 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the substrate transport robot system described in the above Patent Document 1, in order to align the atmospheric transport robot with the load port and the aligner, it is necessary to provide at least one of a sensor and a camera on at least one of the end effector and the transport object. That is, in order to correct the teaching position of the substrate placement location of the load port, aligner, etc., it is necessary to separately provide at least one of a sensor and a camera on at least one of the end effector and the transport object, which increases the number of parts and complicates the device configuration. For this reason, there is a demand for a substrate transport robot system that can suppress the increase in the number of parts and the complication of the device configuration associated with the correction of the teaching position of the substrate placement location.

[0005] This disclosure has been made to solve the problems described above, and one objective of this disclosure is to provide a substrate transport robot system that can suppress an increase in the number of parts and a complication of the device configuration that occurs when correcting the taught position of the substrate placement location. [Means for solving the problem]

[0006] In order to achieve the above-mentioned object, a substrate transport robot system according to one aspect of this disclosure comprises a substrate transport robot including a hand for holding a substrate, a robot operation control unit that controls the operation of the substrate transport robot based on a taught position, a substrate transport chamber in which the substrate transport robot is disposed and substrates are transported by the substrate transport robot, a position detection device that is provided in the substrate transport chamber separately from the substrate transport robot and detects the position of a substrate or substrate-type jig held by the hand, and a taught position correction control unit that corrects the taught position of the substrate placement location based on the detected position by the position detection device of the substrate or substrate-type jig placed at the substrate placement location by the substrate transport robot, or the detected position by the position detection device of the substrate or substrate-type jig held from the substrate placement location by the substrate transport robot.

[0007] As described above, the substrate transport robot system according to one aspect of the disclosure includes a position detection device that is provided in the substrate transport chamber separately from the substrate transport robot and detects the position of the substrate or substrate-type jig held by the hand, and a teaching position correction control unit that corrects the teaching position of the substrate placement location based on the detection position of the substrate or substrate-type jig placed at the substrate placement location by the substrate transport robot by the position detection device, or the detection position of the substrate or substrate-type jig held from the substrate placement location by the substrate transport robot by the position detection device. This makes it possible to correct the teaching position of the substrate placement location based on the detection position of the substrate or substrate-type jig detected by the position detection device. Note that the substrate transport robot system generally includes a position detection device for detecting the position of the substrate or substrate-type jig held by the hand, since it is necessary to detect the position of the substrate or substrate-type jig in the substrate transport chamber. Therefore, in order to correct the teaching position of the substrate placement location, it is not necessary to separately provide at least one of a sensor and a camera on at least one of the hand, the substrate, and the substrate-type jig. As a result, it is possible to suppress an increase in the number of parts and a complication of the device configuration that would otherwise be involved in correcting the teaching position of the substrate placement location. Effect of the Invention

[0008] According to the present disclosure, as described above, it is possible to provide a substrate transport robot system that is capable of suppressing an increase in the number of parts and a complication of the device configuration that accompanies correction of the taught position of the substrate placement location. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a plan view showing a substrate transport robot system according to an embodiment of the present disclosure. [Diagram 2] 1 is a block diagram showing a configuration of a control system of a substrate transport robot system according to an embodiment of the present disclosure. [Diagram 3] FIG. 11 is a flow diagram of correction of a teaching position in a substrate transport robot system according to an embodiment of the present disclosure. [Figure 4]11 is a plan view showing a state in which a substrate is initially placed on an aligner when correcting a teaching position of the aligner. FIG. [Diagram 5] 13 is a plan view showing a state in which a substrate is initially placed on the aligner and then the hand is retracted from the aligner when correcting the teaching position of the aligner. FIG. [Figure 6] 13 is a plan view showing how, when correcting the teaching position of the aligner, the hand is shifted by an amount corresponding to the eccentricity between the substrate and the aligner to pick up the substrate. FIG. [Figure 7] FIG. 13 is a plan view showing how, when correcting the teaching position of the aligner, the hand is shifted by an amount corresponding to the eccentricity between the substrate and the aligner to pick up the substrate, and then the hand is retracted from the aligner. [Figure 8] This is a plan view showing the process of correcting the teaching position of the aligner, in which the hand is shifted by the amount of eccentricity between the substrate and the aligner, the substrate is picked up, the hand is retracted from the aligner, and the hand is then returned to its original position and the substrate is placed on the aligner. [Figure 9] This is a plan view showing the process of correcting the aligner's teaching position, in which the hand is shifted by the amount of eccentricity between the substrate and the aligner, the substrate is picked up, the hand is retracted from the aligner, the hand is returned to its original position by the amount it was shifted, and the access direction to the aligner is changed to place the substrate on the aligner. [Figure 10] FIG. 13 is a plan view showing how a substrate is initially placed on the aligner after the teaching position of the aligner has been corrected. [Figure 11] 11 is a plan view showing how a substrate is initially placed on an aligner when correcting a teaching position of a load port. FIG. [Figure 12] This is a plan view showing the process of correcting the teaching position of the load port, in which the hand is shifted by the eccentricity between the substrate and the aligner, the substrate is picked up, the hand is retracted from the aligner, and the hand is then returned to its original position and the substrate is placed on the aligner. [Figure 13] FIG. 13 is a block diagram showing a configuration of a control system of a substrate transport robot system according to a first modified example of the present disclosure. [Figure 14] FIG. 11 is a plan view showing a substrate transport robot system according to a second modified example of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, specific embodiments of the present disclosure will be described with reference to the drawings.

[0011] The configuration of a substrate transport robot system 100 according to an embodiment of the present disclosure will be described with reference to FIGS.

[0012] (Overall configuration of the substrate transport robot system) 1, the substrate transfer robot system 100 includes a substrate transfer robot 10, a substrate transfer chamber 20, a plurality of load ports 30, a plurality of load locks 40, and an aligner 50. The load port 30 is an example of a substrate placement location and a storage chamber. The aligner 50 is an example of a substrate placement location and a position detection device.

[0013] The substrate transport robot 10 is a horizontal articulated robot that transports a substrate W. The substrate transport robot 10 includes a base 11, a robot arm 12 supported by the base 11, and a hand 13 attached to the tip of the robot arm 12. The hand 13 holds the substrate W when the substrate transport robot 10 transports the substrate W. The substrate W is, for example, a silicon wafer having a disk shape.

[0014] The substrate transfer robot 10 is disposed in the substrate transfer chamber 20. The substrate transfer chamber 20 is a space in which the substrate W is transferred by the substrate transfer robot 10. The interior of the substrate transfer chamber 20 is maintained at atmospheric pressure.

[0015] Each of the multiple load ports 30 is connected to the substrate transfer chamber 20. A FOUP (Front Opening Unify Pod) 31, which is a container capable of accommodating multiple substrates W, is disposed in each of the multiple load ports 30. That is, a substrate W is accommodated in each of the multiple load ports 30.

[0016] Each of the multiple load locks 40 is connected to the substrate transfer chamber 20 at a position different from each of the multiple load ports 30. Each of the multiple load locks 40 includes a substrate placement portion 41 on which a substrate W is placed. Each of the multiple load locks 40 is connected to a substrate transfer chamber VC maintained in a vacuum atmosphere.

[0017] The substrate transfer chamber VC is connected to a substrate processing chamber in which processes such as resist coating and etching are performed on the substrate W, at a position different from each of the multiple load locks 40. In other words, the substrate transfer robot system 100 is an EFEM (Equipment Front End Module) that transfers the substrate W between the FOUP 31 arranged on each of the multiple load ports 30 and the substrate transfer chamber VC connected to the substrate processing chamber.

[0018] The aligner 50 is a device for performing at least one of alignment and eccentricity correction of the substrate W or the substrate-type jig WT. Specifically, the aligner 50 includes a substrate placement part 51 on which the substrate W or the substrate-type jig WT is placed and which can rotate along a horizontal plane. The substrate-type jig WR has substantially the same shape as the substrate W, and is a jig used in place of the substrate W when correcting a teaching position TP, which will be described later. The aligner 50 rotates the substrate placement part 51 on which the substrate W or the substrate-type jig WT is placed, detects a notch or the like on the outer periphery of the substrate W or the substrate-type jig WT using an optical sensor or the like, and performs at least one of alignment and eccentricity correction of the substrate W or the substrate-type jig WT placed on the substrate placement part 51 based on the detected notch or the like.

[0019] The aligner 50 is a device for detecting the position of the substrate W or the substrate-type jig WT held by the hand 13. Details of detection of the position of the substrate W or the substrate-type jig WT by the aligner 50 will be described later. The aligner 50 is provided in the substrate transfer chamber 20 separately from the substrate transfer robot 10.

[0020] 2, the substrate transport robot system 100 includes a main control unit 60 and a robot operation control unit 70. The main control unit 60 is an example of a teaching position correction control unit.

[0021] The main control unit 60 is a circuit board including a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), etc. The main control unit 60 controls the operation of the aligner 50. A teaching position TP is stored in the main control unit 60. The main control unit 60 outputs the teaching position TP to the robot operation control unit 70. The teaching position TP means a position in the substrate transport robot system 100 that is taught to the robot operation control unit 70 by the main control unit 60 so that the substrate transport robot 10 operates in the substrate transport robot system 100.

[0022] The robot operation control unit 70 is a circuit board including a CPU, a ROM, a RAM, etc. The robot operation control unit 70 controls the operation of the substrate transport robot 10 based on the teaching position TP input from the robot operation control unit 70.

[0023] (Correction of teaching position) 2, the main control unit 60 corrects the teaching positions TP of the aligner 50 and the load port 30 based on the detection position of the substrate W or the substrate-type jig WT placed on the aligner 50 by the substrate transport robot 10, detected by the aligner 50. The teaching positions TP include a teaching position TP1 of the aligner 50 and a teaching position TP2 of each of the multiple load ports 30. That is, the main control unit 60 corrects at least one of the teaching position TP1 of the aligner 50 and the teaching position TP2 of each of the multiple load ports 30, based on the detection position of the substrate W or the substrate-type jig WT placed on the aligner 50 by the substrate transport robot 10, detected by the aligner 50. The main control unit 60 automatically corrects the teaching position TP at the timing of the initial operation of the substrate transport robot system 100, resetting the substrate transport robot system 100, etc.

[0024] 3, the main control unit 60 first corrects a teaching position TP1 of the aligner 50 based on a position detected by the aligner 50 of the substrate W or substrate-type jig WT placed on the aligner 50 by the substrate transport robot 10 (step S10). After that, the main control unit 60 corrects teaching positions TP2 of each of the multiple load ports 30 based on the corrected teaching position TP1 of the aligner 50 (step S20).

[0025] The main control unit 60 maintains the position of the substrate W or substrate-type jig WT relative to the hand 13 when the substrate is transported by the substrate transport robot 10, and corrects the teaching position TP1 of the aligner 50 and the teaching position TP2 of each of the multiple load ports 30 based on the detected position of the substrate W or substrate-type jig WT placed on the aligner 50 by the substrate transport robot 10, by the aligner 50. Specifically, the hand 13 is a passive type hand that holds the substrate W or substrate-type jig WT without fixing it. Therefore, as shown in FIG. 4, when the substrate W or substrate-type jig WT is transported by the substrate transport robot 10 to correct the teaching position TP, the substrate W or substrate-type jig WT is not held at a preset center position 13a of the hand 13. That is, when the substrate is transported by the substrate transport robot 10 to correct the teaching position TP, the center position 13a of the hand 13 and the center position Wa of the substrate W or substrate-type jig WT are misaligned in the horizontal direction. On the other hand, when the substrate W is transported by the substrate transport robot 10 in order to correct the teaching position TP, the position of the substrate W relative to the hand 13 is maintained. That is, when the substrate W is transported by the substrate transport robot 10 in order to correct the teaching position TP, a state is maintained in which the center position 13a of the hand 13 and the center position Wa of the substrate W or substrate-type jig WT are shifted by a predetermined amount in the horizontal direction. Note that the center position 13a is an example of a set position.

[0026] (Correction of aligner teaching position) 4, the main controller 60 first causes the substrate W or substrate-type jig WT accommodated in the FOUP 31 to be transported to the aligner 50 by the substrate transport robot 10. Then, the substrate W or substrate-type jig WT is placed on the aligner 50. In this case, the central position 13a of the hand 13, the central position Wa of the substrate W or substrate-type jig WT, and the central position 51a of the substrate placement part 51 of the aligner 50 are misaligned in the horizontal direction. The central position 13a of the hand 13 corresponds to the taught position TP1 of the aligner 50 stored in the main controller 60.

[0027] 5, the main control unit 60 places the substrate W or the substrate-type jig WT on the aligner 50, and then temporarily retracts the substrate transport robot 10 from the aligner 50. Then, the main control unit 60 causes the aligner 50 to detect a horizontal positional deviation D1 between the center position 51a of the substrate placement portion 51 of the aligner 50 and the center position Wa of the substrate W or the substrate-type jig WT. In other words, the aligner 50 detects the eccentricity of the center position Wa of the substrate W or the substrate-type jig WT relative to the center position 51a of the substrate placement portion 51 of the aligner 50.

[0028] 6, after detecting the positional deviation amount D1 by the aligner 50, the main control unit 60 shifts the position of the hand 13 in the horizontal direction by the positional deviation amount D1, and causes the substrate transport robot 10 to pick up the substrate W or substrate-type jig WT placed on the aligner 50. Then, as shown in FIG 7, the main control unit 60 causes the substrate transport robot 10 to retreat from the aligner 50 again.

[0029] Thereafter, as shown in FIG. 8, when the main control unit 60 returns the position of the hand 13, which has been shifted by the positional deviation amount D1, to the original position and causes the aligner 50 to place the substrate W or the substrate-type jig WT, the center position 51a of the substrate placement portion 51 of the aligner 50 coincides with the center position Wa of the substrate W or the substrate-type jig WT. That is, the eccentricity of the center position Wa of the substrate W or the substrate-type jig WT with respect to the center position 51a of the substrate placement portion 51 of the aligner 50 disappears. However, in this case, the center position 13a of the hand 13 and the center position 51a of the substrate placement portion 51 of the aligner 50 remain misaligned in the horizontal direction. In addition, the main control unit 60 cannot recognize the positional deviation amount D2 between the center position 13a of the hand 13 and the center position 51a of the substrate placement portion 51 of the aligner 50.

[0030] 9, the main control unit 60 returns the position of the hand 13, which has been shifted by the positional deviation amount D1, to the original position, changes the orientation of the hand 13 with respect to the aligner 50, and causes the substrate transport robot 10 to place the substrate W or the substrate-type jig WT on the aligner 50. In this case, the central position 51a of the substrate placement part 51 of the aligner 50 and the central position Wa of the substrate W or the substrate-type jig WT are misaligned in the horizontal direction. The positional deviation amount D3 between the central position 51a of the substrate placement part 51 of the aligner 50 and the central position Wa of the substrate W or the substrate-type jig WT is proportional to the positional deviation amount D2 between the central position 51a of the substrate placement part 51 of the aligner 50 and the central position Wa of the substrate W or the substrate-type jig WT. Therefore, the main control unit 60 can obtain the positional deviation amount D2 based on the positional deviation amount D3. Then, the main control unit 60 performs a correction to shift the teaching position TP1 of the aligner 50 by the positional deviation amount D2.

[0031] As described above, the main control unit 60 corrects the taught position TP1 of the aligner 50 based on the detected position by the aligner 50 of the substrate W or substrate-type jig WT after the aligner 50 corrects eccentricity and the access direction of the hand 13 is changed and the substrate W or substrate-type jig WT is placed on the aligner 50.

[0032] (Correction of teaching position of load port) 10, the main control unit 60 first causes the substrate W or the substrate-type jig WT accommodated in the FOUP 31 to be transported to the aligner 50 by the substrate transport robot 10. Then, the substrate W or the substrate-type jig WT is placed on the aligner 50. In this case, the center position Wa of the substrate W or the substrate-type jig WT and the center position 51a of the substrate placement portion 51 of the aligner 50 are misaligned in the horizontal direction. On the other hand, since the taught position TP1 of the aligner 50 has already been corrected, the center position 13a of the hand 13 and the center position 51a of the substrate placement portion 51 of the aligner 50 coincide with each other.

[0033] As shown in FIG. 11, the main control unit 60 causes the substrate W or substrate-type jig WT to be placed on the aligner 50, and then causes the substrate transport robot 10 to temporarily retreat from the aligner 50. Then, the main control unit 60 causes the aligner 50 to detect a horizontal positional deviation D4 between the center position 51a of the substrate placement portion 51 of the aligner 50 and the center position Wa of the substrate W or substrate-type jig WT. That is, the aligner 50 detects the eccentricity of the center position Wa of the substrate W or substrate-type jig WT relative to the center position 51a of the substrate placement portion 51 of the aligner 50. After detecting the positional deviation D4 with the aligner 50, the main control unit 60 shifts the position of the hand 13 by the positional deviation D4, and causes the substrate transport robot 10 to pick up the substrate W or substrate-type jig WT placed on the aligner 50. Then, the main control unit 60 causes the substrate transport robot 10 to retreat from the aligner 50 again.

[0034] As shown in FIG. 12, the main control unit 60 returns the position of the hand 13, which has been shifted by the positional deviation amount D4, to the original position, and causes the substrate transport robot 10 to place the substrate W or the substrate-type jig WT on the aligner 50. In this case, the center position 51a of the substrate placement portion 51 of the aligner 50 coincides with the center position Wa of the substrate W or the substrate-type jig WT. Meanwhile, the center position 13a of the hand 13 and the center position 51a of the substrate placement portion 51 of the aligner 50 are misaligned in the horizontal direction. The positional deviation amount D5 between the center position 13a of the hand 13 and the center position 51a of the substrate placement portion 51 of the aligner 50 corresponds to the positional deviation amount of the teaching position TP2 of each of the multiple load ports 30. The main control unit 60 performs a correction to shift the teaching position TP2 of each of the multiple load ports 30 by the positional deviation amount D5.

[0035] (Effects of the embodiment) In this embodiment, the following effects can be obtained.

[0036] In this embodiment, the substrate transport robot system 100 includes an aligner 50 as a position detection device provided in the substrate transport chamber 20 separately from the substrate transport robot 10 for detecting the position of the substrate W or substrate-type jig WT held by the hand 13, and a main control unit 60 as a teaching position correction control unit that corrects the teaching position TP of the aligner 50 and the load port 30 as the substrate placement location based on the detection position by the aligner 50 as a position detection device of the substrate W or substrate-type jig WT placed on the aligner 50 as the substrate placement location by the substrate transport robot 10. This makes it possible to correct the teaching position TP of the aligner 50 and the load port 30 as the substrate placement location based on the detection position detected by the aligner 50 as a position detection device of the substrate W or substrate-type jig WT. Since the substrate transport robot system 100 needs to accurately grasp the position of the substrate W or the substrate-type jig WT in the substrate transport chamber 20, it is common to provide an aligner 50 as a position detection device that is provided separately from the substrate transport robot 10 in the substrate transport chamber 20 and detects the position of the substrate W or the substrate-type jig WT held by the hand 13. Therefore, in order to correct the teaching position TP of the aligner 50 and the load port 30 as the substrate placement location, it is not necessary to provide at least one of a sensor and a camera separately in at least one of the hand 13, the substrate W, and the substrate-type jig WT. As a result, it is possible to suppress an increase in the number of parts and a complication of the device configuration due to the correction of the teaching position TP of the aligner 50 and the load port 30 as the substrate placement location.

[0037] In this embodiment, the position detection device includes an aligner 50 as a substrate placement location for performing at least one of alignment and eccentricity correction of the substrate W or the substrate-type jig WT. The substrate transport robot system 100 also includes load ports 30 as a plurality of accommodation chambers as substrate placement locations in which the substrate W is accommodated. The main control unit 60 as a teaching position correction control unit corrects at least one of the teaching position TP1 of the aligner 50 and the teaching position TP2 of each of the load ports 30 as a plurality of accommodation chambers based on the position detected by the aligner 50 of the substrate W or the substrate-type jig WT placed on the aligner 50 by the substrate transport robot 10. This makes it possible to obtain the deviation of the teaching position TP1 of the aligner 50 based on the position of the substrate W or the substrate-type jig WT detected by the aligner 50 when correcting the eccentricity of the substrate W or the substrate-type jig WT placed on the aligner 50 relative to the aligner 50. This makes it possible to correct the teaching position TP1 of the aligner 50 based on the deviation of the teaching position TP1 of the aligner 50 that has been acquired. Furthermore, when the teaching position TP1 of the aligner 50 has been corrected or the accurate teaching position TP1 of the aligner 50 has been acquired, when correcting the eccentricity of the substrate W or the substrate-type jig WT, which is transported from each of the load ports 30 as the multiple storage chambers to the aligner 50 and placed on the aligner 50, with respect to the aligner 50, it is possible to acquire the deviation of the teaching position TP2 of each of the load ports 30 as the multiple storage chambers based on the position of the substrate W or the substrate-type jig WT detected by the aligner 50. This makes it possible to correct the teaching position TP2 of each of the load ports 30 as the multiple storage chambers based on the deviation of the teaching position TP2 of each of the load ports 30 as the multiple storage chambers that has been acquired.

[0038] In this embodiment, the main control unit 60 as a teaching position correction control unit corrects both the teaching position TP1 of the aligner 50 and the teaching position TP2 of each of the load ports 30 as the multiple accommodation chambers based on the position detected by the aligner 50 of the substrate W or substrate-type jig WT placed on the aligner 50 by the substrate transport robot 10. This makes it possible to standardize the configuration for correcting the teaching position TP1 of the aligner 50 and the configuration for correcting the teaching position TP2 of each of the load ports 30 as the multiple accommodation chambers. As a result, it is possible to effectively suppress an increase in the number of parts and a complication of the device configuration associated with the correction of the teaching positions TP of the aligner 50 and the load port 30 as the substrate placement locations.

[0039] In this embodiment, the main control unit 60 as a teaching position correction control unit corrects the teaching position TP1 of the aligner 50 based on the detected position by the aligner 50 of the substrate W or the substrate-type jig WT placed on the aligner 50 by the substrate transport robot 10, and then corrects the teaching position TP2 of each of the load ports 30 as the multiple storage chambers based on the corrected teaching position TP1 of the aligner 50. As a result, after appropriately correcting the teaching position TP1 of the aligner 50, it is possible to appropriately correct the teaching position TP2 of each of the load ports 30 as the multiple storage chambers based on the appropriately corrected teaching position TP1 of the aligner 50. As a result, both the teaching position TP1 of the aligner 50 and the teaching position TP2 of each of the load ports 30 as the multiple storage chambers can be appropriately corrected.

[0040] In this embodiment, when the substrate W or the substrate-type jig WT is not held at the center position 13a as a preset position in the hand 13, the main control unit 60 as a teaching position correction control unit corrects the teaching position TP1 of the aligner 50 based on the detected position of the substrate W or the substrate-type jig WT by the aligner 50 after the aligner 50 corrects the eccentricity and the access direction of the hand 13 is changed to place the substrate W or the substrate-type jig WT on the aligner 50. This allows the aligner 50 and the substrate W or the substrate-type jig WT to be aligned by the correction of the eccentricity of the substrate W or the substrate-type jig WT by the aligner 50. Then, the access direction of the hand 13 is changed to place the substrate W or the substrate-type jig WT on the aligner 50, so that the aligner 50 and the substrate W or the substrate-type jig WT can be shifted from each other by an amount proportional to the amount of deviation of the teaching position TP1 of the aligner 50. As a result, the amount of deviation of the taught position TP1 of the aligner 50 can be obtained, and the taught position TP1 of the aligner 50 can be corrected.

[0041] In this embodiment, the main control unit 60 as a taught position correction control unit maintains the position of the substrate W or substrate-type jig WT relative to the hand 13 when transported by the substrate transport robot 10, and corrects the taught position TP1 of the aligner 50 based on the detected position by the aligner 50 of the substrate W or substrate-type jig WT placed on the aligner 50 by the substrate transport robot 10. This makes it possible to prevent a situation in which the position of the substrate W or substrate-type jig WT relative to the hand 13 is not maintained when the substrate transport robot 10 moves the substrate W or substrate-type jig WT to place the substrate W or substrate-type jig WT on the aligner 50, and the detected position by the aligner 50 of the substrate W or substrate-type jig WT placed on the aligner 50 by the substrate transport robot 10 does not reflect a deviation of the taught position TP1 of the aligner 50. As a result, the detection position by the aligner 50 of the substrate W or substrate-type jig WT placed on the aligner 50 by the substrate transport robot 10 reliably reflects the deviation of the taught position TP1 of the aligner 50, so that the taught position TP1 of the aligner 50 can be reliably corrected based on the detection position by the aligner 50 of the substrate W or substrate-type jig WT placed on the aligner 50 by the substrate transport robot 10.

[0042] [Variations] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present disclosure is indicated by the claims, not by the description of the embodiments described above, and further includes all modifications (variations) within the meaning and scope equivalent to the claims.

[0043] For example, in the above embodiment, an example has been shown in which the main control unit 60 as a teaching position correction control unit corrects the teaching position TP1 of the aligner 50 based on the detection position by the aligner 50 of the substrate W or substrate-type jig WT placed on the aligner 50 by the substrate transport robot 10, while the position of the substrate W or substrate-type jig WT relative to the hand 13 is maintained when the substrate is transported by the substrate transport robot 10, but the present disclosure is not limited to this. In the present disclosure, the teaching position correction control unit may correct the teaching position of the aligner based on the detection position by the aligner of the substrate W or substrate-type jig WT placed on the aligner by the substrate transport robot, while the position of the substrate W or substrate-type jig WT relative to the hand is not maintained when the substrate is transported by the substrate transport robot.

[0044] In the above embodiment, the main control unit 60 as the teaching position correction control unit corrects the teaching position TP1 of the aligner 50 based on the detection position of the substrate W or substrate-type jig WT by the aligner 50 after the aligner 50 corrects the eccentricity and the access direction of the hand 13 is changed and the substrate W or substrate-type jig WT is placed on the aligner 50 when the substrate W or substrate-type jig WT is not held at the center position 13a as a preset position in the hand 13, but the present disclosure is not limited to this. In the present disclosure, the teaching position correction control unit may correct the teaching position of the aligner based on the detection position of the substrate or substrate-type jig by the aligner after the aligner corrects the eccentricity when the substrate or substrate-type jig is held at a preset position in the hand. In the present disclosure, the teaching position correction control unit may correct the teaching position of the aligner based on the relative position of the substrate or substrate-type jig and the hand detected by the camera when the substrate or substrate-type jig is not held at a preset position in the hand.

[0045] In the above embodiment, the hand 13 is a passive hand that holds the substrate W or substrate-type jig WT without fixing it, and therefore, when the teaching position TP is corrected, the substrate W or substrate-type jig WT is not held at the center position 13a as a preset position in the hand 13, but the present disclosure is not limited to this. In the present disclosure, the hand is a suction-type hand that suctions the substrate or substrate-type jig, and when the teaching position is corrected, the substrate or substrate-type jig does not have to be held at a preset position in the hand. In the present disclosure, the hand is an edge grip type that can forcibly hold the substrate or substrate-type jig at a preset position by gripping the substrate or substrate-type jig, but the hand holds the substrate or substrate-type jig without gripping it, and therefore, when the teaching position is corrected, the substrate or substrate-type jig does not have to be held at a preset position in the hand.

[0046] In the above embodiment, the main control unit 60 as a teaching position correction control unit corrects the teaching position TP1 of the aligner 50 based on the detected position by the aligner 50 of the substrate W or substrate-type jig WT placed on the aligner 50 by the substrate transport robot 10, and then corrects the teaching position TP2 of each of the load ports 30 as a plurality of accommodation chambers based on the corrected teaching position TP1 of the aligner 50, but the present disclosure is not limited to this. In the present disclosure, the teaching position correction control unit may calculate a deviation of the teaching position of the aligner based on the detected position by the aligner of the substrate W or substrate-type jig placed on the aligner by the substrate transport robot, and then correct the teaching position of each of the plurality of accommodation chambers based on the deviation of the teaching position of the aligner without correcting the deviation of the teaching position of the aligner.

[0047] In the above embodiment, an example has been shown in which the main control unit 60 as a teaching position correction control unit corrects both the teaching position TP1 of the aligner 50 and the teaching position TP2 of each of the load ports 30 as the multiple accommodation chambers based on the detection position by the aligner 50 of the substrate W or substrate-type jig WT placed on the aligner 50 by the substrate transport robot 10, but the present disclosure is not limited to this. In the present disclosure, the teaching position correction control unit may correct only one of the teaching position of the aligner and the teaching position of each of the multiple accommodation chambers based on the detection position by the aligner of the substrate W or substrate-type jig placed on the aligner by the substrate transport robot.

[0048] In the above embodiment, the position detection device includes the aligner 50 as a substrate placement location for performing alignment and eccentricity correction of the substrate W or the substrate-type jig WT, and the main control unit 60 as a teaching position correction control unit corrects at least one of the teaching position TP1 of the aligner 50 and the teaching position TP2 of each of the load ports 30 as the multiple storage chambers based on the detection position by the aligner 50 of the substrate W or the substrate-type jig WT placed on the aligner 50 by the substrate transport robot 10, but the present disclosure is not limited to this. In the present disclosure, the position detection device may include a camera 80, and the main control unit 260 as a teaching position correction control unit may correct at least one of the teaching position TP1 of the aligner 50 and the teaching position TP2 of each of the load ports 30 as the multiple storage chambers based on the detection position by the camera 80 of the substrate or the substrate-type jig.

[0049] In the above embodiment, an example has been shown in which the substrate transport robot system 100 includes the main control unit 60 as a teaching position correction control unit that corrects the teaching position TP of the aligner 50 and the load port 30 as the substrate mounting location based on the detection position by the aligner 50 as a position detection device of the substrate W or substrate-type jig WT placed on the aligner 50 as the substrate mounting location by the substrate transport robot 10, but the present disclosure is not limited to this. In the present disclosure, as in a second modified example shown in Fig. 14, the substrate transport robot system 300 may include a main control unit as a teaching position correction control unit that corrects the teaching position TP of the aligner 50 and the load port 30 as the substrate mounting location based on the detection position by the sensor 90 as a position detection device of the substrate W or substrate-type jig WT held by the substrate transport robot 10 from the aligner 50 and the load port 30 as the substrate mounting location. The sensors 90 as position detection devices are provided as a pair near the load lock 40 in the substrate transfer chamber 20 and are capable of detecting the substrate W transferred from the substrate transfer chamber 20 to the load lock 40 and passing between the pair of sensors 90.

[0050] In the above embodiment, the main control unit 60 as a teaching position correction control unit corrects the teaching position TP of the aligner 50 and the load port 30 as the substrate placement location, but the present disclosure is not limited to this. In the present disclosure, the teaching position correction control unit may correct the teaching position of the load lock as the substrate placement location. In that case, the aligner may be used as a position detection device, or the above sensor 90 may be used.

[0051] In the above embodiment, an example has been shown in which the substrate transport robot system 100 includes a robot operation control unit 70 that controls the operation of the substrate transport robot 10 based on the taught position TP, and a main control unit 60 that serves as a taught position correction control unit that corrects the taught position TP of the aligner 50 as a substrate placement location and the load port 30 based on the position detected by the aligner 50 as a position detection device of the substrate W or substrate jig WT placed on the aligner 50 as a substrate placement location and the load port 30 by the substrate transport robot 10, but the present disclosure is not limited to this. In the present disclosure, the substrate transport robot system may include a single control unit that combines the functions of the robot operation control unit and the taught position correction control unit.

[0052] The functions of the elements disclosed herein can be performed using circuits or processing circuits, including general purpose processors, special purpose processors, integrated circuits, Application Specific Integrated Circuits (ASICs), conventional circuits, and / or combinations thereof, configured or programmed to perform the disclosed functions. Processors are considered processing circuits or circuits because they include transistors and other circuits. In this disclosure, a circuit, unit, or means is hardware that performs the recited functions or hardware that is programmed to perform the recited functions. The hardware may be hardware disclosed herein or other known hardware that is programmed or configured to perform the recited functions. Where the hardware is a processor, which is considered a type of circuit, the circuit, means, or unit is a combination of hardware and software, and the software is used to configure the hardware and / or the processor.

[0053] [Aspects] It will be appreciated by those skilled in the art that the exemplary embodiments described above are examples of the following aspects.

[0054] (Item 1) a substrate transport robot including a hand for holding a substrate; a robot operation control unit that controls an operation of the substrate transport robot based on a teaching position; a substrate transfer chamber in which the substrate transfer robot is disposed and the substrate is transferred by the substrate transfer robot; a position detection device that is provided in the substrate transport chamber separately from the substrate transport robot and detects a position of the substrate or substrate-type jig held by the hand; a teaching position correction control unit that corrects the teaching position of the substrate placement location based on the detected position by the position detection device of the substrate or the substrate-type jig placed at the substrate placement location by the substrate transport robot, or the detected position by the position detection device of the substrate or the substrate-type jig held from the substrate placement location by the substrate transport robot.

[0055] (Item 2) the position detection device includes an aligner serving as the substrate placement location for performing at least one of alignment and eccentricity correction of the substrate or the substrate-type jig; a plurality of accommodation chambers as the substrate placement locations in which the substrates are accommodated; The substrate transport robot system of item 1, wherein the teaching position correction control unit corrects at least one of the teaching position of the aligner and the teaching positions of each of the multiple accommodation chambers based on a detection position by the aligner of the substrate or the substrate-type jig placed on the aligner by the substrate transport robot.

[0056] (Item 3) The substrate transport robot system described in item 2, wherein the teaching position correction control unit corrects both the teaching position of the aligner and the teaching positions of each of the multiple accommodation chambers based on a detection position by the aligner of the substrate or the substrate-type jig placed on the aligner by the substrate transport robot.

[0057] (Item 4) The substrate transport robot system described in item 3, wherein the teaching position correction control unit corrects the teaching position of the aligner based on a detection position by the aligner of the substrate or the substrate-type jig placed on the aligner by the substrate transport robot, and then corrects the teaching position of each of the multiple accommodation chambers based on the corrected teaching position of the aligner.

[0058] (Item 5) The teaching position correction control unit is when the substrate or the substrate-type jig is held at a preset position in the hand, the taught position of the aligner is corrected based on a detected position of the substrate or the substrate-type jig by the aligner after the eccentricity is corrected by the aligner; A substrate transport robot system according to any one of items 2 to 4, wherein when the substrate or the substrate-type jig is not held at a preset position in the hand, the aligner corrects eccentricity, and corrects the taught position of the aligner based on the detected position of the substrate or the substrate-type jig by the aligner after the substrate or the substrate-type jig is placed on the aligner by changing the access direction of the hand.

[0059] (Item 6) the position detection device includes a camera for capturing an image of the board or the board-type jig, 6. The substrate transport robot system according to item 5, wherein the teaching position correction control unit corrects the teaching position of the aligner based on the relative position between the substrate or the substrate-type jig and the hand detected by the camera when the substrate or the substrate-type jig is not held at a preset position in the hand.

[0060] (Item 7) 6. The substrate transport robot system of claim 5, wherein the hand is an edge grip type that can forcibly hold the substrate or the substrate-type jig in a preset position by gripping the substrate or the substrate-type jig, but the hand holds the substrate or the substrate-type jig without gripping it, so the substrate or the substrate-type jig is not held in the preset position in the hand.

[0061] (Item 8) The substrate transport robot system according to any one of items 2 to 5, wherein the taught position correction control unit maintains a position of the substrate or the substrate-type jig relative to the hand when transported by the substrate transport robot, and corrects the taught position of the aligner based on a detected position by the aligner of the substrate or the substrate-type jig placed on the aligner by the substrate transport robot. [Explanation of symbols]

[0062] 10 Substrate transport robot 13 Hands 13a Center position (setting position) 20 Substrate transfer chamber 30 Load port (accommodation chamber (substrate placement location)) 50 Aligner (position detection device, substrate placement location) 60, 360 Main control unit (Teaching position correction control unit) 70 Robot motion control unit 80 Camera (position detection device) 90 Sensors (position detection devices) 100, 200, 300 Substrate transport robot system TP teaching position TP1 (Aligner) teaching position TP2 (Containment Room) Teaching Position W substrate WT PCB type jig

Claims

1. a substrate transport robot including a hand for holding a substrate; a robot operation control unit that controls an operation of the substrate transport robot based on a teaching position; a substrate transfer chamber in which the substrate transfer robot is disposed and the substrate is transferred by the substrate transfer robot; a position detection device that is provided in the substrate transport chamber separately from the substrate transport robot and detects a position of the substrate or substrate-type jig held by the hand; a teaching position correction control unit that corrects the teaching position of the substrate placement location based on the detected position by the position detection device of the substrate or the substrate-type jig placed at the substrate placement location by the substrate transport robot, or the detected position by the position detection device of the substrate or the substrate-type jig held from the substrate placement location by the substrate transport robot.

2. the position detection device includes an aligner serving as the substrate placement location for performing at least one of alignment and eccentricity correction of the substrate or the substrate-type jig; a plurality of accommodation chambers as the substrate placement locations in which the substrates are accommodated; 2. The substrate transport robot system of claim 1, wherein the teaching position correction control unit corrects at least one of the teaching position of the aligner and the teaching positions of each of the multiple accommodation chambers based on a detection position by the aligner of the substrate or the substrate-type jig placed on the aligner by the substrate transport robot.

3. 3. The substrate transport robot system of claim 2, wherein the teaching position correction control unit corrects both the teaching position of the aligner and the teaching positions of each of the multiple accommodation chambers based on a detection position by the aligner of the substrate or the substrate-type jig placed on the aligner by the substrate transport robot.

4. The substrate transport robot system of claim 3, wherein the teaching position correction control unit corrects the teaching position of the aligner based on a detection position by the aligner of the substrate or the substrate-type jig placed on the aligner by the substrate transport robot, and then corrects the teaching position of each of the multiple accommodation chambers based on the corrected teaching position of the aligner.

5. The teaching position correction control unit is when the substrate or the substrate-type jig is held at a preset position in the hand, the taught position of the aligner is corrected based on a detected position of the substrate or the substrate-type jig by the aligner after the eccentricity is corrected by the aligner; 3. The substrate transport robot system of claim 2, wherein when the substrate or the substrate-type jig is not held at a preset position in the hand, the aligner corrects eccentricity, and the taught position of the aligner is corrected based on the detected position of the substrate or the substrate-type jig by the aligner after the access direction of the hand is changed and the substrate or the substrate-type jig is placed on the aligner.

6. the position detection device includes a camera for capturing an image of the board or the board-type jig, 6. The substrate transport robot system of claim 5, wherein the teaching position correction control unit corrects the teaching position of the aligner based on the relative position between the substrate or the substrate-shaped jig detected by the camera and the hand when the substrate or the substrate-shaped jig is not held at a preset position in the hand.

7. 6. A substrate transport robot system as described in claim 5, wherein the hand is an edge grip type that can forcibly hold the substrate or the substrate-shaped jig in a preset position by grasping the substrate or the substrate-shaped jig, but the substrate or the substrate-shaped jig is held without being grasped, so that the substrate or the substrate-shaped jig is not held in the preset position in the hand.

8. 3. The substrate transport robot system of claim 2, wherein the taught position correction control unit maintains the position of the substrate or the substrate-type jig relative to the hand when transported by the substrate transport robot, and corrects the taught position of the aligner based on the detected position of the substrate or the substrate-type jig placed on the aligner by the substrate transport robot.

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