Peeling jig and peeling method

Abstract

To provide a peeling jig and a peeling method that can accurately measure the joining strength at a joined portion of two samples joined to each other.SOLUTION: A peeling jig comprises a wedge that is arranged sandwiched between two samples joined to each other, and is driven toward a joined portion of the samples to separate the samples from each other. The wedge is rounded at an end facing the joined portion. A peeling method includes arranging the wedge sandwiched between the samples, driving the wedge toward the joined portion, measuring the value of driving force to drive the wedge, and calculating the joining strength at the joined portion on the basis of the value of the driving force.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a peeling tool and a peeling method. [Background technology]

[0002] Non-Patent Document 1 discloses a technique for measuring the bonding strength at the bonded portion of a specimen made of a thermoplastic composite material by a wedge peel test. According to the wedge peel test, a wedge is used that is driven at a constant speed against the bonded portion that bonds and fixes two thermoplastic composite materials to each other. [Prior art documents] [Non-patent literature]

[0003] [Non-Patent Document 1] CM Stokes Griffin et al., Compos. Part A Appl. Sci. Manuf., 121 (2019), 84-91 Summary of the Invention [Problem to be solved by the invention]

[0004] According to the technique described in Non-Patent Document 1, the wedge advances inside the thermoplastic composite material, and a load unrelated to the bonding strength is measured. As a result, there is a problem that the bonding strength of the bonded portion of the specimen cannot be measured with high accuracy.

[0005] The present disclosure has been made in view of the above-mentioned problems, and has an object to provide a peeling tool and a peeling method that can accurately measure the bonding strength of a bonded portion of two samples that are bonded to each other. [Means for solving the problem]

[0006] The peeling tool according to the present disclosure is placed between two samples that are bonded to each other and includes a wedge that is driven toward the bonded portion between the samples to separate the samples from each other, with the end of the wedge facing the bonded portion having rounded corners.

[0007] The wedge may further include a support that is provided on the wedge and contacts the sample at a location different from the end.

[0008] A gap may be provided between the sample and the wedge in a section between a position where the end of the sample comes into contact and a position where the support comes into contact.

[0009] The support may comprise rollers to guide the drive of the wedge relative to the sample.

[0010] A support may be provided on a front surface of the wedge facing a first one of the samples, and a back surface of the wedge facing a second one of the samples.

[0011] The peeling method according to the present disclosure uses the above-described peeling tool, a wedge included in the peeling tool is sandwiched between the samples, the wedge is driven toward the bonded portion, a value of a driving force for driving the wedge is measured, and the bond strength at the bonded portion is calculated based on the value of the driving force. Effect of the Invention

[0012] According to the present disclosure, it is possible to measure the bonding strength of the bonded portion of two samples that are bonded to each other with high accuracy. [Brief description of the drawings]

[0013] [Figure 1] FIG. 2 is a schematic diagram of a peeling tool according to an embodiment of the present disclosure. [Diagram 2] 1A to 1C are schematic diagrams illustrating peeling using a peeling jig according to an embodiment of the present disclosure. [Diagram 3] 13A and 13B are schematic diagrams illustrating peeling using a peeling jig according to a modified example of the present disclosure. [Figure 4] 1 is a flow chart of a stripping method according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, some exemplary embodiments will be described with reference to the drawings. In addition, common parts in each drawing are given the same reference numerals, and duplicated explanations will be omitted.

[0015] [Composition of peeling jig] FIG. 1 is a schematic diagram of a peeling jig according to an embodiment of the present disclosure. FIG. 2 is a schematic diagram of peeling using a peeling jig according to an embodiment of the present disclosure. As shown in FIGS. 1 and 2, the peeling jig JG includes a wedge WG. Two samples CM1 and CM2 bonded to each other are split only partially in the longitudinal direction of the samples CM1 and CM2, and the wedge WG is sandwiched between the samples CM1 and CM2 so that the tip of the wedge WG hits the split. Then, the wedge WG is driven toward the bonded portion AS between the samples CM1 and CM2 to separate the samples CM1 and CM2 from each other.

[0016] Here, the samples CM1 and CM2 may be linear materials or may be tape- or sheet-shaped materials. When the samples CM1 and CM2 are tape- or sheet-shaped materials, the samples CM1 and CM2 may have a predetermined width in a direction perpendicular to the paper surface of FIG. 1. As shown in FIG. 1, the joint area AS is a region extending in the longitudinal direction of the samples CM1 and CM2, and the samples CM1 and CM2 are joined at the joint area AS. Note that the end TB of the wedge WG has a width wider than the samples CM1 and CM2 in a direction perpendicular to the paper surface of FIG. 1.

[0017] In the wedge peel test, a driving force DR is applied to the wedge WG by a weight (not shown) or the like, driving the wedge WG toward the bonded portion AS. The wedge WG to which the driving force DR is applied advances the bonded portion AS, separating the samples CM1 and CM2 from each other. Here, it can be seen that the greater the driving force DR, the greater the bond strength at the bonded portion AS, and conversely, the smaller the driving force DR, the smaller the bond strength at the bonded portion AS. Therefore, the value of the driving force DR can be measured, and the bond strength can be calculated based on the value of the driving force DR.

[0018] In the wedge peel test, there are various types of bonding at the bonded portion AS, the bonding strength of which is to be calculated. The bonding may be any of "material bonding," "chemical bonding," and "mechanical bonding."

[0019] As an example of "material joining", for example, the samples CM1 and CM2 may be fusion welded at the joining portion AS. Alternatively, the samples CM1 and CM2 may be pressure welded or brazed at the joining portion AS.

[0020] As an example of "chemical bonding", for example, the samples CM1 and CM2 may be bonded at the bonding site AS with an adhesive or the like. As an example of "mechanical bonding", for example, the samples CM1 and CM2 may be mechanically fixed at the bonding site AS with fasteners such as screws or bolts.

[0021] The end TB of the wedge WG facing the joint site AS is rounded. More specifically, the end TB may be processed so that the cross-sectional shape of the end TB has a rounded shape. The radius of the rounded shape appearing in the cross-sectional shape of the end TB may be, for example, about 0.5 mm. Conventionally, the end TB has not been rounded, and the curvature radius of the cross-sectional shape of the end TB is less than 0.05 mm. In addition, when the surface roughness of the samples CM1 and CM2 is large, a wedge WG with a large radius of the rounded shape may be used, and when the surface roughness of the samples CM1 and CM2 is small, a wedge WG with a small radius of the rounded shape may be used.

[0022] The wedge WG comes into contact with the samples CM1 and CM2 at the rounded corner end TB. In Fig. 2, the wedge WG is shown coming into contact with the sample CM1 at a position P11 and coming into contact with the sample CM2 at a position P21.

[0023] Furthermore, the peeling jig JG may further include a support SB. The support SB is provided on the wedge WG. The support SB may be a separate member from the wedge WG, or may be formed integrally with the wedge WG.

[0024] The support SB comes into contact with the samples CM1 and CM2 at a position different from the end TB of the wedge WG. In FIG. 2, the support SB comes into contact with the sample CM1 at a position P12 and with the sample CM2 at a position P22.

[0025] Consider a state in which the wedge WG is sandwiched between the samples CM1 and CM2 as shown in Fig. 2. In the above-mentioned sandwiched state, a gap SP1 is provided between the sample CM1 and the wedge WG in a section sandwiched between a position P11 where the end TB of the sample CM1 comes into contact and a position P12 where the support SB comes into contact.

[0026] In addition, in the state sandwiched as described above, a gap SP2 is provided between the sample CM2 and the wedge WG in the section sandwiched between position P21 where the end TB of the sample CM2 comes into contact and position P22 where the support SB comes into contact.

[0027] In order to form the gap SP1, the positions P11 and P12 may be set so that the distance from the position P12 to a plane passing through the joint site AS is greater than the distance from the position P11 to a plane passing through the joint site AS.

[0028] In order to form the gap SP2, the positions P21 and P22 may be set so that the distance from the position P22 to a plane passing through the joint site AS is greater than the distance from the position P21 to a plane passing through the joint site AS.

[0029] 1 and 2, supports SB may be provided on the front surface of the wedge WG facing the sample CM1 (first sample) and the back surface of the wedge WG facing the sample CM2 (second sample). In Figs. 1 and 2, the front surface of the wedge WG is shown as the left boundary line of the wedge WG, and the back surface of the wedge WG is shown as the right boundary line of the wedge WG.

[0030] [Configuration of the modified example] 3 is a schematic diagram of peeling using a peeling jig according to a modified example of the present disclosure. As shown in FIG. 3, the support SB may include rollers GR1 and GR2 that guide the drive of the wedge WG relative to the samples CM1 and CM2.

[0031] The roller GR1 is rotatably attached to the other end opposite to the end where the support SB is fixed to the wedge WG. The roller GR1 is configured to come into contact with the sample CM1 and rotate with the movement of the sample CM1. As a result, the roller GR1 guides the drive of the wedge WG relative to the sample CM1.

[0032] The roller GR2 is rotatably attached to the other end opposite to the end where the support SB is fixed to the wedge WG. The roller GR2 is configured to come into contact with the sample CM2 and rotate with the movement of the sample CM2. As a result, the roller GR2 guides the drive of the wedge WG relative to the sample CM2.

[0033] [Removal procedure] Next, a procedure of a peeling method using the peeling jig JG will be described. Fig. 4 is a flowchart of the peeling method according to an embodiment of the present disclosure.

[0034] First, in step S101, the wedge WG of the peeling jig JG is disposed. More specifically, the wedge WG is disposed so as to be sandwiched between the two specimens CM1 and CM2 that are bonded to each other.

[0035] In step S103, the wedge WG is driven. More specifically, a driving force DR is applied to the wedge WG by a weight (not shown) or the like, to drive the wedge WG toward the joint site AS. The wedge WG to which the driving force DR is applied advances in the joint site AS, separating the samples CM1 and CM2 from each other. Here, the wedge WG separates the samples CM1 and CM2 from each other in a direction approximately perpendicular to both the moving direction of the wedge WG and the width direction of the end TB of the wedge WG.

[0036] In step S105, the value of the driving force when driving the wedge WG is measured.

[0037] In step S107, the bonding strength at the bonded portion AS is calculated based on the measured value of the driving force.

[0038] For example, the value of the driving force when the bonding site AS with a known bonding strength is developed is measured in advance, and the relationship between the driving force value and the bonding strength is obtained. Then, based on the value of the driving force when the bonding site AS with an unknown bonding strength is developed, the bonding strength may be calculated by referring to the previously obtained relationship between the driving force value and the bonding strength.

[0039] [Effects of the embodiment] As described in detail above, the peeling tool according to the present disclosure is sandwiched between two joined samples and includes a wedge that is driven toward the bonded portion between the samples to separate the samples from each other, and the end of the wedge facing the bonded portion has rounded corners.

[0040] This allows the bonding strength of the bonded portion of the two samples bonded to each other to be measured with high accuracy. In particular, the rounded corners of the end of the wedge reduce friction at the end of the wedge. Also, the end of the wedge is prevented from getting caught on unevenness on the surface of the sample. This prevents the wedge from progressing inside the sample. This prevents the load required for the wedge to progress inside the sample from being added to the driving force when driving the wedge toward the bonded portion. Therefore, the bonding strength can be measured in a state where the load unrelated to the bonding strength is reduced. As a result, the bonding strength can be measured with high accuracy based on the driving force when driving the wedge.

[0041] The peeling tool according to the present disclosure may further include a support provided on the wedge and contacting the sample at a position different from the end. This prevents the sample from being pressed against the wedge. This prevents the frictional force generated between the wedge and the sample from being added to the driving force when driving the wedge toward the bonding site. This allows the bonding strength to be measured in a state where a load unrelated to the bonding strength is reduced. As a result, the bonding strength can be measured with high accuracy based on the driving force when driving the wedge.

[0042] In the peeling tool according to the present disclosure, a gap may be provided between the sample and the wedge in a section between the position where the end of the sample contacts and the position where the support contacts. This reduces the frictional force generated between the wedge and the sample, and allows the bonding strength to be measured in a state where a load unrelated to the bonding strength is reduced. As a result, the bonding strength can be measured with high accuracy based on the driving force when driving the wedge.

[0043] In the peeling tool according to the present disclosure, the support may include a roller for guiding the drive of the wedge relative to the sample. This reduces the frictional force generated between the wedge and the sample, and allows the bond strength to be measured in a state where a load unrelated to the bond strength is reduced. As a result, the bond strength can be measured with high accuracy based on the drive force when driving the wedge.

[0044] In the peeling tool according to the present disclosure, a support may be provided on the front surface of the wedge facing the first sample of the samples and the back surface of the wedge facing the second sample of the samples. This prevents the sample from being pressed against the wedge on both the front and back surfaces of the wedge. Furthermore, it is possible to move both the first and second samples away from the wedge and drive the wedge toward the joining site with high accuracy. As a result, the wedge is prevented from advancing inside the sample.

[0045] The peeling method according to the present disclosure includes placing a wedge included in the peeling tool described above between samples, driving the wedge toward the bonded portion, measuring the value of the driving force for driving the wedge, and calculating the bond strength at the bonded portion based on the value of the driving force. This makes it possible to accurately measure the bond strength at the bonded portion of two samples bonded to each other while preventing the wedge from advancing inside the sample. As a result, it is possible to reduce the cost and burden involved in measuring the bond strength.

[0046] According to the present disclosure, it becomes possible to measure the bonding strength of a bonding portion with high accuracy. Therefore, for example, it can contribute to the achievement of Goal 9 of the Sustainable Development Goals (SDGs) led by the United Nations, "Build resilient infrastructure, promote inclusive and sustainable industrialization, and foster innovation."

[0047] Although several embodiments have been described, the embodiments can be modified or modified based on the above disclosure. All components of the above embodiments and all features described in the claims may be individually extracted and combined as long as they are not mutually inconsistent. [Explanation of symbols]

[0048] AS junction site CM1, CM2 samples DR Driving Force GR1,GR2 roller JG Peeling jig P11,P12,P21,P22 position SB support SP1,SP2 void TB end WG Wedge

Claims

1. a wedge disposed between two samples bonded to each other and driven toward a bonding portion between the samples to separate the samples from each other; A peeling jig, wherein an end of the wedge facing the bonding portion is rounded.

2. The peeling tool according to claim 1 , further comprising a support provided on the wedge and contacting the sample at a position different from the end portion.

3. The peeling tool according to claim 2 , wherein a gap is provided between the sample and the wedge in a section of the sample between a position where the end portion contacts the support and a position where the support contacts the sample.

4. The peeling tool of claim 2 , wherein the support comprises a roller that guides the drive of the wedge relative to the sample.

5. a surface of the wedge facing a first one of the samples; a back surface of the wedge facing a second one of the samples; The peeling jig according to claim 2 , wherein the support is provided on each of the first and second substrates.

6. The wedge is placed between the samples; Driving the wedge towards the bond site; Measure the value of the driving force that drives the wedge; Calculating the bonding strength at the bonding portion based on the value. A peeling method using the peeling jig according to any one of claims 1 to 5.

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