Module mounting structure and electronic apparatus

Abstract

To provide a module mounting structure that has good area efficiency and does not impose stress on chips.SOLUTION: A module mounting structure 12 includes: a cover 36 that covers a front surface of a memory module 26 on which a memory chip 32 is mounted; a relay connector board 42 that is located between a rear side of a part of the memory module 26 where the memory chip 32 is mounted and a substrate 28, and that brings a large number of contact portions of the memory module 26 and a large number of contact portions of the substrate 28 into contact with each other by a large number of elastic pins 42e; and a screw 46 that fastens the cover 36, a module board 30, the relay connector board 42, and the substrate 28 in a Z direction. The cover 36 includes a board support protruding portion 48a that protrudes toward the substrate 28 and abuts on the module board 30 at a position along the memory chip 32.SELECTED DRAWING: Figure 11

Description

[Technical field]

[0001] The present invention relates to a module mounting structure in which a module having chips on a module board is mounted on a substrate, and to an electronic device in which a module having chips on a module board is mounted on a substrate. [Background technology]

[0002] In electronic devices, a module having chips on a module board may be mounted on a substrate. An example of the module is a memory module. It is preferable that the module is replaceable to improve performance or in the event of a malfunction. In the structure described in Patent Document 1, a relay connector board having multiple elastic pins is provided between the memory module and the substrate, and multiple contact parts on the back surface of the memory module and the front surface of the substrate are connected to each other by the elastic pins. In such a structure, multiple contact parts can be provided in a relatively large area on the back surface of the module. In this example, a substrate, a relay connector board, and a substrate are stacked, and these are fastened by multiple screws and nuts, and the memory module can be removed from the substrate and replaced by removing these screws and nuts. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] US Patent Application Publication No. 2023 / 309227 Summary of the Invention [Problem to be solved by the invention]

[0004] The memory module of Patent Document 1 has poor area efficiency because the memory chip and the relay connector board are attached in different positions. In contrast, the area efficiency is improved if the relay connector board is provided on the back side of the part of the memory module where the memory chip is mounted. However, the relay connector board is provided with many elastic pins, and if both ends of the board are fastened with screws, the center part is pushed up by the many elastic pins, and the module board may bend in a warping manner, which may cause stress to the chips on the surface.

[0005] The present invention has been made in view of the above problems, and has an object to provide a module mounting structure and electronic equipment that are area efficient and do not impose stress on chips. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems and achieve the object, a module mounting structure according to a first aspect of the present invention is a module mounting structure in which a module having a chip on a module board is mounted on a substrate, the module mounting structure comprising: a cover covering a surface of the module on which the chip is mounted; a relay connector board provided between a back side of the module on which the chip is mounted and the substrate, the relay connector board bringing a number of contact portions of the module and the substrate into contact with each other with a number of elastic pins; and a fastening member fastening the cover, module board, relay connector board and substrate in a stacked state in the stacking direction, the cover comprising a board support protrusion that protrudes toward the substrate and abuts the module board at a position along the chip.

[0007] An electronic device according to a second aspect of the present invention is an electronic device in which a module having a chip on a module board is mounted on a substrate, the electronic device having a cover covering the surface of the module on which the chip is mounted, a relay connector board provided between the back side of the module where the chip is mounted and the substrate and bringing multiple contact portions of the module and the substrate into contact with each other with multiple elastic pins, and a fastening member fastening the cover, module board, relay connector board and substrate in a stacked state in the stacking direction, the cover having a board support protrusion that protrudes toward the substrate and abuts against the module board along the periphery of the chip. Effect of the Invention

[0008] According to the above-mentioned aspects of the present invention, the area efficiency is good and no stress is applied to the chip. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a perspective view of a notebook PC, which is an electronic device according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a perspective view of the memory module. [Diagram 3] FIG. 3 is a perspective view of the module mounting structure. [Figure 4] FIG. 4 is an exploded perspective view of the module mounting structure. [Diagram 5] FIG. 5 is a partially enlarged perspective sectional view of the module mounting structure. [Figure 6] FIG. 6 is a plan view of the cover. [Figure 7] FIG. 7 is a perspective view of the cover as seen from the back. [Figure 8] FIG. 8 is a schematic cross-sectional view showing a screw hole and a screw provided in the screw hole. [Figure 9]FIG. 9 is a schematic cross-sectional view showing a memory module, a relay connector board, a substrate, and a back plate, where (a) shows the state before assembly, and (b) shows the state after assembly. [Figure 10] FIG. 10 is an enlarged plan view showing a corner of the cover. [Figure 11] FIG. 11 is a schematic cross-sectional view of a module mounting structure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, examples of a module mounting structure and an electronic device according to an embodiment of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to these examples.

[0011] 1 is a perspective view of a notebook PC 10, which is an electronic device according to an embodiment of the present invention. The notebook PC 10 includes a module mounting structure 12 according to an embodiment of the present invention. The module mounting structure 12 is incorporated inside a housing 14 of the notebook PC 10. The electronic device according to the present invention is not limited to the notebook PC 10, and may be, for example, a desktop PC or a mobile tablet terminal.

[0012] The notebook PC 10 has a cover 16 that can be opened and closed by a hinge 18 with respect to a housing 14, and by closing the cover 16, the notebook PC 10 becomes compact and is suitable for mobile use.

[0013] The housing 14 is provided with a keyboard device 20 and a touch pad 22. On the front side of the cover 16, a display device 24 that occupies most of the area, as well as a speaker and a camera (not shown) are provided.

[0014] The module mounting structure 12 is incorporated in the housing 14. The module mounting structure 12 includes a memory module 26 and a board 28. The board 28 is the main board in the notebook PC 10 and is provided inside the housing 14, spanning almost both the left and right ends. A CPU 28a that controls the entire notebook PC 10 is mounted on the board 28.

[0015] 2 is a perspective view of the memory module 26. The memory module 26 has four memory chips 32 and a power chip 34 mounted on a module board 30 of a PCB. The memory module 26 is compliant with, for example, the Compression Attached Memory Module (CAMM). The memory chip 32 is read and written by a CPU 28a. The present invention is also applicable to modules (such as SSDs) other than the memory module 26 and semiconductor chips (such as CPUs) other than the memory chips 32.

[0016] The surface of the module board 30 on which the memory chip 32 and the power supply chip 34 are mounted is referred to as the front surface 30a, and the opposite surface is referred to as the back surface 30b. The module board 30 is long in the X direction and short in the Y direction, and one of the long sides is formed with a trapezoidal bulge 30c on which the power supply chip 34 is mounted. The X direction, the Y direction, and the Z direction described below are perpendicular to each other.

[0017] Each of the four memory chips 32 is substantially square and is linearly arranged along the X direction. The memory chips 32 are arranged in pairs adjacent to each other, with a central screw space 30d between each pair. End screw spaces 30e are provided at both ends of the module board 30 in the X direction. Stud holes 30f are formed in the central screw spaces 30d and the end screw spaces 30e at approximately the centers in the Y direction. The widths of the central screw spaces 30d and the end screw spaces 30e in the X direction are approximately 3 to 5 times the widths of the stud holes 30f. Studs 44a and screws 46, which will be described later, are inserted into the stud holes 30f. In other words, a pair of memory chips 32 is provided at a position sandwiched between the screws 46 on both sides in the X direction.

[0018] Pin holes 30g are formed in the central screw space 30d at a location opposite the bulging portion 30c (hereinafter also referred to as the Y1 side) and in the end screw space 30e at a location near the bulging portion 30c (hereinafter also referred to as the Y2 side). The width of the memory board 30 in the Y direction excluding the bulging portion 30c is slightly larger than the memory chip 32. A large number of contact parts 30h (see FIG. 9) are provided in a matrix on the back surface 30b of the module board 30. The number of contact parts 30h is 600 or more in this embodiment. The contact parts 30h are generally located on the back side of the memory chips 32. Therefore, the module board 30 has almost no wasted space on the front surface 30a and back surface 30b, resulting in good area efficiency and contributing to the miniaturization of the memory module 26.

[0019] Fig. 3 is a perspective view of the module mounting structure 12. Fig. 4 is an exploded perspective view of the module mounting structure 12. Fig. 5 is an enlarged, partially sectional perspective view of the module mounting structure 12. Fig. 6 is a plan view of the cover 36. Fig. 7 is a perspective view of the cover 36 as viewed from the back.

[0020] In addition to the memory module 26 and substrate 28, the module mounting structure 12 has a cover 36, an insulating sheet (insulating material) 38, a TIM (Thermal Interface Material) 40, a relay connector board 42, a back plate 44, and three screws (fastening members) 46. The module mounting structure 12 is fastened by the screws 46 with the cover 36, TIM 40, memory module 26, relay connector board 42, substrate 28, and back plate 44 stacked in this order in the Z direction.

[0021] The cover 36 covers the surface 30a side of the memory module 26 on which the memory chips 32 are mounted, and is made by cutting or die-casting a metal material such as aluminum.

[0022] The cover 36 has substantially the same shape and size as the module board 30 in a plan view, and includes a rectangular portion 36a and a trapezoidal bulging portion 36b. The bulging portion 36b covers the bulging portion 30c of the module board 30, and the rectangular portion 36a covers the other portions. The bulging portion 30c is slightly thinner in the Z direction than the rectangular portion 36a. The rectangular portion 36a has a flat portion 47 and an edge protruding portion 48. The edge protruding portion 48 is formed so as to protrude from the edge of the rectangular portion 36a toward the substrate 28. The rectangular portion 36a has high rigidity due to the edge protruding portion 48 provided around it, and is less prone to bending and twisting. Small module confirmation notches 50 are formed at the four corners of the rectangular portion 36a of the cover 36, exposing the four corners of the module board 30.

[0023] The edge protrusion 48 has a two-stage shape, consisting of a board support protrusion 48a that abuts along the edge of the front surface 30a of the module board 30, and a wall portion 48b that protrudes outward beyond the board support protrusion 48a to the outside of the edge of the module board 30. The board support protrusion 48a and the wall portion 48b may be separated from each other.

[0024] The board support protrusion 48a is formed so as to slightly enter the boundary between the edges of both ends of the rectangular portion 36a in the X direction, the entire length of the edge in the Y1 direction, and the edge in the Y2 direction and the bulging portion 36b. The board support protrusion 48a further has a portion 36e that protrudes in the Y2 direction from the edge in the Y1 direction at the middle position in the X direction, and the screw hole 36c and the pin confirmation hole 36d are provided in this portion 36e and the edges of both ends in the X direction. The board support protrusion 48a has an inner route at the four corners of the rectangular portion 36a to avoid the module confirmation notch 50. The board support protrusion 48a is conceptually shaped like a combination of a square C-shape and an E-shape. The screw hole 36c and the pin confirmation hole 36d are located at positions corresponding to the stud hole 30f and the pin hole 30g.

[0025] Wall portion 48b has a square C-shape except for the boundary between rectangular portion 36a and bulging portion 36b, and although it is conceptually square C-shaped, it is discontinuous at module confirmation notches 50 at the four corners of rectangular portion 36a.

[0026] The board support protrusion 48a contacts the module board 30 via the insulating sheet 38 so as to surround the four memory chips 32 and to fit along each memory chip 32. The board support protrusion 48a is discontinuous at the bulge 36b in order to prevent a load from being applied to the wiring pattern between the memory chips 32 and the power chip 34. The board support protrusion 48a has an appropriate width so as not to apply a local load to the module board 30. The insulating sheet 38 has the same shape as the board support protrusion 48a and is attached to the board support protrusion 48a. The insulating sheet 38 has holes and notches corresponding to the stud holes 30c and the pin holes 30d. The insulating sheet 38 is provided between the board support protrusion 48a and the module board 30 to prevent a short circuit of the patterns of the module board 30.

[0027] The wall portion 48b protrudes beyond the edge of the module board 30 but does not abut against the substrate 28 (see FIG. 5). The wall portion 48b abuts against the edge of the module board 30 to position the cover 36. The wall portion 48b is thinner than the board support protrusion 48a, and is about 1 / 5 the thickness in this embodiment.

[0028] The memory chip 32 has a cover 36 above, the sides are almost entirely covered with edge projections 48, and a back plate 44 below via the substrate 28, etc., so that electromagnetic leakage is low.

[0029] A TIM 40 is provided between the cover 36 and the memory chip 32, so that heat from the memory chip 32 is transferred to the cover 36 and dissipated. There are two TIMs 40, one for each pair of adjacent memory chips 32. The TIM 40 is, for example, a thermally conductive sheet. To improve the heat dissipation effect, the area of ​​the cover 36 may be increased, or the cover 36 may be in thermal contact with another thermally conductive material. If heat dissipation from the memory chip 32 is not required, the TIM 40 may be omitted.

[0030] FIG. 8 is a schematic cross-sectional view showing the screw hole 36c and the screw 46 provided in the screw hole 36c. A countersunk 36ca is formed around the screw hole 36c. The screw 46 is a captive screw, and a neck 46c is provided between the head 46a and the threaded portion 46b. After the threaded portion 46b is screwed into and penetrates the female threaded portion of the screw hole 36c, the screw 46 cannot be removed unless it is rotated in the reverse direction. Therefore, the screw 46 is basically unable to fall off, and can be prevented from being lost and from shorting out on the board 28, etc. A washer 46d is provided on the neck 46c.

[0031] Returning to FIG. 4, the relay connector board 42 is a rectangle slightly smaller than the rectangular portion 36a of the module board 30. The relay connector board 42 is provided between the portion where the memory chip 42 of the memory module 26 is mounted and the back side of the central screw space 30d, and the substrate 28. The relay connector board 42 is provided so as to cross the central screw space 30d, but may be divided into two parts, one on the left and one on the right, with the central screw space 30d as a boundary. The relay connector board 42 has a central screw space 42a and an end screw space 42b similar to the central screw space 30d and the end screw space 30e, and a stud hole 42c is formed in each of them. In addition, a positioning pin 42d protruding upward and downward is provided in the central screw space 42a and the end screw space 42b at a position corresponding to the pin hole 30g.

[0032] A large number of elastic pins 42e are provided in the area excluding the central screw space 42a and the end screw spaces 42b of the relay connector board 42. The elastic pins 42e are located at positions corresponding to the contact portions 28b of the substrate 28 and the contact portions 30h of the module board 30 (see FIG. 9).

[0033] Furthermore, substrate 28 is provided with contact portion 28b at a position corresponding to contact portion 30h. Substrate 28 is provided with stud hole 28c at a position corresponding to stud hole 30f, and with pin hole 28d at a position corresponding to pin hole 30g.

[0034] FIG. 9 is a schematic cross-sectional view showing the memory module 26, the relay connector board 42, the substrate 28, and the back plate 44, where (a) shows the state before assembly, and (b) shows the state after assembly.

[0035] 9(a), the elastic pin 42e of the relay connector board 42 is substantially heart-shaped and protrudes upward and downward before assembly of the module mounting structure 12. At this time, the upward and downward protruding portions of the elastic pin 42e are discontinuous and non-contacting at their intermediate positions.

[0036] As shown in Fig. 9(b), after the module mounting structure 12 is assembled, the relay connector board 42 is sandwiched and pressed between the substrate 28 and the rear surface 30b of the module board 30. This causes the elastic pins 42e to be elastically compressed from above and below, thereby electrically connecting the contact portions 30h of the module board 30 and the contact portions 28b of the substrate 28. At this time, the elastic pins 42e come into contact with each other at their intermediate positions, reducing the electrical resistance between the top and bottom. Also, the repulsive force received by the contact portions 28b, 30h increases, reducing the contact resistance.

[0037] 4, the backplate 44 is made of a metal material, supports the backside of the substrate 28, and has a rectangular shape substantially the same as the rectangular portion 36a of the module board 30. An insulating sheet may be provided between the backplate 44 and the substrate 28. The backplate 44 has studs 44a provided at positions corresponding to the above-mentioned stud holes 30f, and pin holes 44b provided at positions corresponding to the pin holes 30g.

[0038] The three positioning pins 42d of the relay connector board 42 are positioned by fitting their upward protruding portions into the pin holes 30g of the module board 30. These portions can be confirmed through the pin confirmation hole 36d of the cover 36. The three positioning pins 42d of the relay connector board 42 are positioned by fitting their downward protruding portions into the pin holes 28d, 44b of the substrate 28 and the back plate 44. The stud 44a fits into the stud holes 28c, 42c, 30f of the substrate 28, the relay connector board 42, and the module board 30, and is screwed into the screw 46 provided in the cover 36. As a result, the cover 36, the insulating sheet 38, the TM 40, the memory module 26, the relay connector board 42, the substrate 28, and the back plate 44 are fixed in a stacked state in the Z direction, and the module mounting structure 12 is configured.

[0039] 10 is an enlarged plan view showing the corners of the cover 36. In the assembled module mounting structure 12, the four corners of the module board 30 can be seen through the module confirmation notches 50 formed in the corners of the cover 36. This makes it possible to confirm that no memory modules 26 are missing and that they are fixed in the correct positions.

[0040] Fig. 11 is a schematic cross-sectional view of the module mounting structure 12. In Fig. 11, the edge protrusion 48 is omitted at the left end so that other parts can be seen, and the right end is not cut to show the wall part 48b. In addition, the board support protrusion 48a is cut at the boundary with the wall part 48b, but hatching is omitted to avoid complexity. Parts other than the edge protrusion 48 are cut at the center in the Y direction and hatched. The TIM 40 is omitted.

[0041] 11, the module board 30 is fixed by three screws 46 threaded into the studs 44a, and each of the two memory chips 32 is located in a position sandwiched between two screws 46 on both sides, making it reasonably stable. However, as described above, the contacts 28b, 30h receive a repulsive force from the elastic pins 42e, and because there are a large number of these elastic pins 42e, the force received by the module board 30 as a whole from the relay connector board 42 becomes quite large, so that the intermediate portions of the two screws 46 may be warped as shown by the imaginary lines, raising the concern that this may cause stress to the memory chips 32 on the surface 30a.

[0042] In contrast, in the module mounting structure 12 and electronic device 10 according to the present embodiment, the board support protrusion 48a of the cover 36 protrudes toward the substrate 28 and abuts against the module board 30 at a position aligned with the memory chip 32, thereby preventing the module board 30 from warping and preventing stress from being applied to the memory chip 32.

[0043] The board support protrusions 48a may be flexibly applied depending on the arrangement of the module board 30 and the memory chips 32, but in this embodiment, the four memory chips 32 are arranged linearly in the X direction, and correspondingly, at least one of the board support protrusions 48a on the Y1 side (see FIG. 7) is provided over a range L3 that is longer than the total overall length L4 in the X direction of the four memory chips 32, so that the module board 30 can be maintained flat at least on the Y1 side. The range L3 is almost the entire length of the rectangular portion 36a excluding the range of the module confirmation notch 50, and includes the range L1+L1 that is the range of the three screws 46, assuming that the spacing between the screws 46 is L1, so that the module board 30 can be maintained flat more reliably.

[0044] The module board 30 is considered to receive the greatest force at the midpoint of the line segment L1 connecting the two screws 46, that is, at a position distance L2 (=L1 / 2) from the screws 46. Therefore, it is preferable that the board support protrusions hold the module board 30 at least at this portion. In other words, the board support protrusions 48a should be at least perpendicular to the perpendicular bisector L1 of the line segment L1 connecting the two screws 46. M As shown in FIG. 7, the board support protrusion 48a is provided at a position including the perpendicular bisector L M The position includes:

[0045] The board support protrusions 48a extend not only in the X direction but also in the Y direction, and can more reliably hold the module board 30 in a planar state. In particular, the board support protrusions 48a are provided over the entire length in the Y direction near the memory chips 32 at both ends in the X direction, and the X-direction extending portions and the ends are connected to each other to form an integrated unit, so that the X-direction extending portions and the Y-direction extending portions complement each other in strength, and can more reliably hold the module board 30.

[0046] The memory chips 32 are often substantially square, and even if the total dimension L4 in the X direction is large due to a linear arrangement of multiple memory chips in the X direction, the dimension in the Y direction is relatively small. Therefore, even if it is not possible to provide the board support protrusion 48a on either the Y1 side or the Y2 side due to design constraints, if the board support protrusion 48a is provided along the entire length of the memory chip 32 in the Y direction, warping of the module board 30 can be appropriately prevented. Note that, like the module board 30, the substrate 28 is also subjected to a large elastic force, but the substrate 28 is supported by the back plate 44 and does not warp. If the substrate 28 is sufficiently strong, the back plate 44 may be omitted and the studs 44a may be provided directly on the substrate 28.

[0047] While it is the board support protrusions 48a that prevent the module board 30 from warping, the flat portion 47 (see FIG. 7) of the cover 36 has the functions of connecting the board support protrusions 48a on all four sides, preventing electromagnetic leakage, and dissipating heat, but does not directly contribute to preventing the module board 30 from warping. Therefore, depending on the design conditions, the flat portion 47 does not need to cover the entire rectangular portion 36a, and may be partially exposed. In the above example, the pin confirmation hole 36d and the module confirmation notch 50 are exposed. The flat portion 47 may be provided with a hole that allows the model number and shape of the memory chip 32 to be confirmed.

[0048] The present invention is not limited to the above-described embodiment, and can of course be freely modified without departing from the spirit and scope of the present invention. [Explanation of symbols]

[0049] 10 Notebook PC (electronic device) 12 Module mounting structure 26 Memory Module (Module) 28 Substrate 28b,30h Contact part 30 Module Board 30a surface 30b back side 30c bulge 32 Memory chip (chip) 34 Power Chip 36 Cover 36a Rectangular part 36b Bulge 36c screw hole 38 Insulation Sheet 40 TIM 42 Relay connector board 42e Elastic pin 44 Backplate 44a Stud 46 Screws (fastening members) 47 Flat area 48 Edge protrusion 48a Board support protrusion 48b Wall section 50 Module confirmation notch

Claims

1. A module mounting structure in which a module having a chip on a module board is mounted on a substrate, a cover for covering a surface of the module on which the chip is mounted; a relay connector board provided between the back side of the module where the chip is mounted and the substrate, the relay connector board bringing a large number of contacts of the module and the substrate into contact with each other via a large number of elastic pins; a fastening member for fastening the cover, the module board, the relay connector board and the substrate in a stacked state in a stacking direction; having The cover includes a board support protrusion that protrudes toward the substrate and abuts against the module board at a position along the chip. A module mounting structure comprising:

2. 2. The module mounting structure according to claim 1, The cover has a wall portion that protrudes beyond the edge of the module board and is located outside the board support protrusion. A module mounting structure comprising:

3. 3. The module mounting structure according to claim 2, The cover is positioned by the wall abutting against the edge of the module board. A module mounting structure comprising:

4. 2. The module mounting structure according to claim 1, A plurality of the fastening members are provided, The chip is provided at a position where it is sandwiched between the plurality of fastening members. A module mounting structure comprising:

5. 5. The module mounting structure according to claim 4, The board support protrusion is provided along the entire length of the line segment connecting the two fastening members. A module mounting structure comprising:

6. 5. The module mounting structure according to claim 4, The board support protrusion is provided at a position including a perpendicular bisector of a line segment connecting at least two of the fastening members. A module mounting structure comprising:

7. 2. The module mounting structure according to claim 1, A plurality of the chips are arranged in a straight line, At least one of the board support protrusions is provided over the total length of the chips in the arrangement direction. A module mounting structure comprising:

8. 2. The module mounting structure according to claim 1, The fastening member is a captive screw, and is inserted into the screw hole of the cover so as not to fall out. A module mounting structure comprising:

9. 2. The module mounting structure according to claim 1, The cover is formed with a module confirmation notch that exposes a corner of the module board. A module mounting structure comprising:

10. 2. The module mounting structure according to claim 1, The cover is made of a metal material. A module mounting structure comprising:

11. The module mounting structure according to claim 10, A TIM is provided between the cover and the chip. A module mounting structure comprising:

12. 2. The module mounting structure according to claim 1, An insulating material is provided between the board support protrusion and the module board. A module mounting structure comprising:

13. An electronic device in which a module having a chip on a module board is mounted on a substrate, a cover for covering a surface of the module on which the chip is mounted; a relay connector board provided between the back side of the module where the chip is mounted and the substrate, the relay connector board bringing a large number of contacts of the module and the substrate into contact with each other via a large number of elastic pins; a fastening member for fastening the cover, the module board, the relay connector board and the substrate in a stacked state in a stacking direction; having The cover includes a board support protrusion that protrudes toward the substrate and abuts against the module board along the periphery of the chip.

1. A modular electronic device comprising:

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