Stage device, substrate processing device, information processing device, information processing method, program, and article manufacturing method

By using a stage device with a control unit that determines a driving profile based on optimized movement parameters, the limitations of hardware configuration are overcome, reducing operating time and improving throughput in semiconductor and liquid crystal display device manufacturing.

JP2025072235AActive Publication Date: 2025-05-09CANON KK
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Patent Information

Application Number
JP2023182845
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-10-24
Publication Date
2025-05-09
Estimated Expiration
2043-10-24

AI Technical Summary

Technical Problem

In semiconductor and liquid crystal display device manufacturing, stage devices are limited by their hardware configuration, which restricts the combined speed of movement in the X and Y directions, preventing maximum speed in each direction and thus potentially increasing operating time.

Method used

A stage device with a control unit that determines a driving profile based on parameters for movement in the X and Y directions, where the moving distance in the X direction is longer than in the Y direction, allowing for optimized speed control and reduced operating time.

Benefits of technology

The proposed solution enables the stage device to reduce operating time by optimizing speed control, thereby improving throughput and productivity in semiconductor and liquid crystal display device manufacturing.

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Abstract

To provide a stage device capable of shortening a driving time.SOLUTION: A stage device has: a movable stage that holds a substrate; and a control unit that controls the movement of the stage on the basis of a drive profile. The drive profile is determined on the basis of a first parameter which is a parameter related to the movement of the stage in a first direction and a second parameter which is a parameter related to the movement of the stage in a second direction determined on the basis of the first parameter. A distance of the movement of the stage in the first direction is longer than a distance of the movement thereof in the second direction.SELECTED DRAWING: Figure 4
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Description

[Technical field]

[0001] The present invention relates to a stage apparatus, a substrate processing apparatus, an information processing apparatus, an information processing method, a program, and a method for manufacturing an article. [Background technology]

[0002] In the manufacturing process of semiconductor devices, liquid crystal display devices, etc., a stage device is used to move a substrate to a desired position. Patent Document 1 describes a method of calculating three target trajectories of the stage for moving from the end of exposure to the start of the next exposure, and adopting the target trajectory that is feasible and minimizes the driving time of the stage among the calculated target trajectories. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2015-216326 A Summary of the Invention [Problem to be solved by the invention]

[0004] Here, the stage is driven in two orthogonal directions (X-axis and Y-axis directions) on the surface holding the substrate to move the substrate to the desired position, but when driven in these two directions simultaneously, the stage speed is the combined speed of the two directions. The maximum value of this combined speed (speed limit) is determined by the hardware configuration, so this restriction may prevent the stage from being driven at the maximum speed in each of the two directions.

[0005] SUMMARY OF THE PRESENT EMBODIMENT An object of the present invention is to provide a stage device capable of shortening the drive time. [Means for solving the problem]

[0006] In order to achieve the above-mentioned object, a stage device as one aspect of the present invention has a stage capable of moving while holding a substrate, and a control unit that controls movement of the stage based on a drive profile, wherein the drive profile is determined based on a first parameter that is a parameter related to movement of the stage in a first direction and a second parameter that is a parameter related to movement of the stage in a second direction determined based on the first parameter, and wherein a movement distance of the stage in the first direction is longer than a movement distance in the second direction.

[0007] Further objects or other aspects of the present invention will become apparent from the embodiments described below with reference to the drawings. Effect of the Invention

[0008] According to the present invention, it is possible to provide a stage device capable of shortening the drive time. [Brief description of the drawings]

[0009] [Figure 1] 1 is a schematic view showing a configuration of a substrate processing apparatus in a first embodiment. [Diagram 2] 1 is a schematic diagram showing scanning exposure of a substrate; [Diagram 3] FIG. 13 is a diagram showing a driving profile of the substrate stage when exposing the 84th shot area and the 85th shot area in the conventional method. [Figure 4] FIG. 13 is a diagram showing a drive profile of the substrate stage when exposing the 84th shot area and the 85th shot area in the first embodiment. [Diagram 5] FIG. 4 is a flowchart showing a process for determining a drive profile in the first embodiment. [Figure 6] FIG. 11 is a diagram showing a drive profile of the substrate stage when exposing the 84th shot area and the 85th shot area in the second embodiment. [Figure 7]FIG. 13 is a diagram showing a drive profile of the substrate stage when exposing the 84th shot area and the 85th shot area in the third embodiment. [Figure 8] FIG. 13 is a diagram showing a conventional driving profile of the substrate stage when the 87th shot area is moved to a target position and then the 8th shot area is moved. [Figure 9] FIG. 13 is a diagram showing a driving profile of the substrate stage when the 87th shot area is moved to a target position and then the 8th shot area is moved in the fourth embodiment. [Figure 10] FIG. 13 is a flowchart showing a method for manufacturing an article according to a fifth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Note that the following embodiment does not limit the invention according to the claims. Although the embodiment describes a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.

[0011] In addition, in this specification and drawings, directions are basically indicated by an XYZ coordinate system in which the vertical direction is the Z axis and the horizontal plane perpendicular to the vertical direction is the XY plane, and the axes are mutually orthogonal. However, if an XYZ coordinate system is shown in each drawing, that coordinate system takes precedence.

[0012] A specific configuration will be described below for each embodiment.

[0013] First Embodiment FIG. 1 is a schematic diagram showing the configuration of a substrate processing apparatus 1 in this embodiment. In this embodiment, the substrate processing apparatus 1 is a projection exposure apparatus that exposes a pattern of an original (mask, reticle) onto a substrate through a projection optical system by a step-and-scan method. However, the substrate processing apparatus 1 is not limited to a projection exposure apparatus, and may be, for example, a step-and-repeat projection exposure apparatus. Alternatively, the substrate processing apparatus 1 may be a drawing apparatus that draws on a substrate by an electron beam or an ion beam, etc., to form a pattern on the substrate. The substrate processing apparatus 1 may also be another lithography apparatus (substrate exposure apparatus), for example, an imprint apparatus that forms a pattern on a substrate by molding an imprint material on the substrate with a mold. Alternatively, the substrate processing apparatus 1 may be another apparatus for processing a substrate such as a semiconductor wafer or a glass plate, such as an ion implantation apparatus, a development apparatus, an etching apparatus, a film formation apparatus, an annealing apparatus, a sputtering apparatus, or a deposition apparatus. The substrate processing apparatus 1 may also be a planarization apparatus that planarizes a composition on a substrate using a flat plate.

[0014] The substrate processing apparatus 1 has an illumination optical system 2 that irradiates light, a projection optical system 3, a reticle stage 6 that holds a reticle 4, a substrate stage 7 that can be driven (moved) in the X and Y directions while holding a substrate 5, and a main control unit (information processing unit) 8. Note that the substrate stage 7 may be driven (moved) in the Z direction instead of the X and Y directions. Furthermore, the substrate stage 7 may include a six-axis drive system that can be driven in the X-axis direction, the Y-axis direction, the Z-axis direction, around the X-axis, around the Y-axis, and around the Z-axis. The substrate stage 7 also includes a stage control unit 9.

[0015] The position of the substrate stage 7 in the Y-axis direction is measured by a bar mirror 10 extending from the substrate stage 7 along the X-axis direction and a laser interferometer 11. The position of the substrate stage 7 in the X-axis direction is measured by a bar mirror (not shown) extending from the substrate stage 7 along the Y-axis direction and a laser interferometer (not shown). Note that a plurality of laser interferometers 11 for measuring the position of the substrate stage 7 in the Y-axis direction and a plurality of laser interferometers for measuring the position of the substrate stage 7 in the X-axis direction may be provided. With this configuration, not only the position of the substrate stage 7 in the X-axis direction and the position of the substrate stage 7 in the Y-axis direction, but also the amount of deviation in the rotation direction around the X-axis, the amount of deviation in the rotation direction around the Y-axis, and the amount of deviation in the rotation direction around the Z-axis can be measured. Note that, in this embodiment, an example in which the position of the substrate stage 7 is measured by an interferometer system has been shown, but the position of the substrate stage 7 may be measured by another means such as an encoder.

[0016] The position of the reticle stage 6 in the Y-axis direction is measured by a bar mirror 12 extending along the X-axis direction on the reticle stage 6, and a laser interferometer 13. In addition, the position of the reticle stage 6 in the X-axis direction is measured by a bar mirror (not shown) extending along the Y-axis direction on the reticle stage 6, and a laser interferometer (not shown).

[0017] The reticle 4 is, for example, an original plate in which a pattern to be transferred (for example, a circuit pattern) is formed on the surface of quartz glass with chrome. The substrate 5 is, for example, single crystal silicon, and when the substrate processing apparatus 1 is an exposure apparatus, the substrate 5 transported to the substrate processing apparatus 1 has a surface coated with a photosensitive material (resist). Here, the illumination optical system 2 is a pattern forming section that forms a pattern on the substrate 5. Note that in this embodiment, an example of a lithography apparatus that forms a pattern using light is shown, and the pattern forming section is the illumination optical system 2, but it may also be a lithography apparatus that uses heat to harden a thermosetting material to which a pattern has been transferred. In that case, the pattern forming section is, for example, a heating section that heats the thermosetting material. The part in which the substrate processing apparatus 1 processes the substrate is a substrate processing section, and if the substrate processing apparatus 1 is, for example, a projection exposure apparatus, the illumination optical system and the projection optical system are included in the substrate processing section. When the substrate processing apparatus 1 is an imprint apparatus or a planarization apparatus, the illumination optical system and the heating section for hardening the imprint material or composition are included in the substrate processing section.

[0018] The main control unit 8 controls each part in the substrate processing apparatus 1, and the stage control unit 9 controls the drive (movement) of the substrate stage 7. The main control unit 8 is also an information processing device that adjusts (determines) the drive profile of the substrate stage 7 by a method described later. The main control unit 8 transmits the adjusted (determined) drive profile to the stage control unit 9. The stage control unit 9 controls the drive (movement) of the substrate stage 7 based on the drive profile transmitted from the main control unit 8 and the position of the substrate stage 7 obtained by the bar mirror and laser interferometer described above, and moves the substrate 5 to a desired position.

[0019] The main control unit 8 and the stage control unit 9 include a processing unit, a bus, a ROM, a RAM, and a storage device, and each component functions according to a program. The processing unit is a processing device that performs calculations for control according to the program and controls each component connected to the bus. The processing unit can be configured by a CPU, a PLD such as an FPGA, an ASIC, a computer with a program built in, or a combination of all or part of these. The ROM is a memory dedicated to reading data, and stores programs and data. The RAM is a memory for reading and writing data, and is used to store programs and data. The RAM is used for temporarily storing data such as the results of CPU calculations. The storage device is also used for storing programs and data. The storage device is also used as a temporary storage area for programs and data of the operating system (OS) of the main control unit 8 and the stage control unit 9. The storage device is slower in inputting and outputting data than the RAM, but is capable of storing large amounts of data. It is desirable for the storage device to be a non-volatile storage device that can store data as permanent data so that the data to be stored can be referenced for a long period of time. The storage device is mainly composed of a magnetic storage device (HDD), but may also be a device that reads and writes data by inserting external media such as CDs, DVDs, and memory cards.

[0020] In the substrate processing apparatus 1, exposure light from a light source (not shown) passes through an illumination optical system 2 and illuminates a reticle 4 held on a reticle stage 6. The light transmitted through the reticle 4 passes through a projection optical system 3 and is irradiated onto a substrate 5. At this time, light from a pattern formed on the reticle 4 forms an image on the surface of the substrate 5, and the substrate 5 (photosensitive material) is exposed to the pattern image. The substrate processing apparatus 1 exposes a shot area on the substrate 5 in this manner, and performs similar exposure on each of a plurality of shot areas.

[0021] Fig. 2 is a schematic diagram when scanning and exposing a substrate 5. Fig. 2(a) shows a shot layout of a plurality of shot areas on a substrate 5, and in this embodiment, 98 shot areas are provided on the substrate 5. The numbers in each shot area indicate the order in which each shot area is scanned and exposed, and the plurality of shot areas on the substrate 5 are scanned and exposed in sequence in the order shown by the dotted lines. The arrows written on each shot area indicate the direction in which each shot area is scanned and exposed.

[0022] FIG. 2B is an example of the trajectory of the position of the projection optical system 3 relative to the substrate stage 7 when the shot area is exposed. In this embodiment, the Y-axis direction is the scanning direction. In reality, the relative position between the projection optical system 3 and the substrate stage 7 changes as the substrate stage 7 moves relative to the fixed projection optical system 3, and scanning exposure is performed, but for the sake of convenience, the trajectory of the position of the projection optical system 3 relative to the substrate stage 7 will be described. FIG. 2B shows the 84th and 85th shot areas to be exposed among the shot areas shown in FIG. 2A. First, exposure of the 84th shot area is started from position A, and exposure of the 84th shot area is completed when the projection optical system 3 reaches position B. Then, in order to expose the 85th shot area, the substrate stage 7 moves in the +X direction while moving in the -Y direction, and the projection optical system 3 reaches position C. After that, the substrate stage 7 moves in the -Y direction, and the projection optical system 3 reaches position D, and the speed of the substrate stage 7 at position D is 0. Next, the substrate stage 7 moves in the +Y direction, causing the projection optical system 3 to reach position E, which is the exposure start position for the 85th shot area, and starts exposure of the 85th shot area from position E. The substrate stage 7 moves in the +Y direction, causing the projection optical system 3 to reach position F, which is the exposure end position for the 85th shot area.

[0023] The 85th shot area is located in a different position in the Y-axis direction (scanning direction) on the substrate from the 84th shot area, and the movement of the substrate stage 7 between shot areas with such a positional relationship is sometimes referred to as "starting a line." When starting a line, the movement distance of the substrate stage 7 in the Y-axis direction is particularly longer than the movement distance of the substrate stage 7 in the X-axis direction, as shown in FIG. 2(b).

[0024] Fig. 3 is a diagram showing a conventional driving profile of the substrate stage 7 when exposing the 84th shot area and the 85th shot area. The upper graph in Fig. 3 shows the driving speed of the substrate stage 7 in the X-axis direction (hereinafter sometimes referred to as X speed), and the middle graph shows the driving speed of the substrate stage 7 in the Y-axis direction (hereinafter sometimes referred to as Y speed). The lower graph shows the driving speed of the substrate stage 7 obtained by combining the driving speed of the substrate stage 7 in the X-axis direction and the driving speed of the substrate stage 7 in the Y-axis direction (hereinafter sometimes referred to as combined speed). Note that in this embodiment, the driving speed of the substrate stage 7 is sometimes referred to as the moving speed of the substrate stage 7.

[0025] In the example of FIG. 3, between positions A and B, scanning exposure is in progress and there is no movement in the X-axis direction, so the X velocity is 0, and the Y velocity is a constant velocity of -Vy. When the projection optical system 3 reaches position B, the X velocity starts to increase, and increases until it reaches Vx. Meanwhile, the Y velocity remains at -Vy. Then, by position C, the X velocity decreases from Vx to 0, completing the movement in the X-axis direction. Also, between positions C and D, the Y velocity approaches 0, and at position D, the Y velocity is 0. Next, between positions D and E, the movement in the X-axis direction is completed, so the X velocity is 0, and the Y velocity increases to Vy. Then, between positions E and F, scanning exposure is in progress and there is no movement in the X-axis direction, so the X velocity is 0, and the Y velocity is a constant velocity of Vy.

[0026] Here, the maximum value of the combined speed of the substrate stage 7 (hereinafter, sometimes referred to as the limit speed) is determined by the hardware configuration, and this limit speed is the maximum speed within the range of allowable speeds at which the substrate stage 7 can perform normal operations multiple times without any problems. In other words, this limit speed of the combined speed is the limit value of the combined speed. For example, the substrate stage 7 may include a coarse movement stage and a fine movement stage that moves together with the coarse movement stage in a state of non-contact with the coarse movement stage by an electromagnetic actuator or the like. In this case, for example, the limit speed of the combined speed is defined as the limit speed at which the fine movement stage without a brake mechanism does not collide with the coarse movement stage even when the coarse movement stage stops from the limit speed. In other words, the limit speed of the combined speed is defined as the limit speed at which the electromagnetic actuator can suppress a collision between the coarse movement stage and the fine movement stage. Alternatively, the limit speed of the combined speed is defined as the limit speed at which a component included in the substrate stage 7 (for example, a fine movement top plate) is not damaged even if it collides with a shock absorber (shock absorbing device) or the like, as long as the combined speed is equal to or lower than the limit speed. In addition, the limit speed of the composite speed may be defined based on the specifications of a drive mechanism (e.g., a linear motor) included in the substrate stage 7. The limit speed of the composite speed may also be variable. For example, the limit speed of the composite speed may be determined according to the drive direction or drive start position of the substrate stage 7.

[0027] The main control unit 8 determines the X velocity and Y velocity so that the combined velocity is equal to or less than the limit velocity Vmax, and determines the drive profile of the substrate stage 7. In other words, the main control unit 8 determines the X velocity (Vx) and Y velocity (Vy) so as to satisfy equation (1), and determines the drive profile of the substrate stage 7.

[0028]

number

[0029] 3, the timing when the absolute value of the X velocity is maximum (Vx) and the timing when the absolute value of the Y velocity is maximum (-Vy) overlap, so the X velocity and the Y velocity are mutually restricted. Furthermore, when the Y velocity is restricted (the Y velocity becomes slow), the driving time of the substrate stage 7 becomes longer, and the throughput (productivity) decreases.

[0030] Therefore, the substrate stage 7 in this embodiment determines (adjusts) the timing of movement in the X-axis direction during the non-exposure period. This makes the timing at which the absolute value of the X velocity becomes maximum and the timing at which the absolute value of the Y velocity becomes maximum different from each other, reducing mutual restrictions on the X velocity and the Y velocity. This makes it possible to improve the Y velocity and shorten the drive time of the substrate stage 7. Note that, in this embodiment, the parameter in the X-axis direction is determined based on the Y velocity in the Y-axis direction, but the other parameter may be determined based on the velocity in the direction in which the movement distance of the substrate stage 7 is long, in other words, in the direction that is likely to be the rate limiting direction. Note that, in this embodiment, time may be expressed as timing.

[0031] Fig. 4 is a diagram showing a drive profile of the substrate stage 7 when exposing the 84th shot area and the 85th shot area in this embodiment. The upper graph in Fig. 4 shows the X velocity of the substrate stage 7, and the middle graph shows the Y velocity of the substrate stage 7. The lower graph shows the combined velocity of the substrate stage 7.

[0032] In this embodiment, the timing at which the substrate stage 7 starts moving in the X-axis direction is shifted by time t3. Specifically, the timing at which the substrate stage 7 starts moving in the X-axis direction is determined (adjusted) based on the first parameter (Y speed). This prevents the timing at which the absolute value of the X speed becomes maximum from overlapping with the timing at which the absolute value of the Y speed becomes maximum, thereby improving the Y speed.

[0033] First, the main control unit 8 determines ±V2y, which is a Y speed that satisfies a desired throughput and production conditions (e.g., scanning speed in exposure), as the Y speed (first parameter). This determination is made based on, for example, the shot layout, the order in which a plurality of shot areas are exposed, and the specifications of the product to be manufactured. The Y speed (first parameter) may be set by a user through an input device (not shown). The absolute value of this ±V2y can be set to a value larger than the absolute value of the conventional ±Vy, for example, a value that satisfies formula (2). |±V y |<|±V2 y |···Formula (2)

[0034] Next, the main control unit 8 determines the X velocities ±V2x that satisfy the formulas (3) and (4) based on the determined Y velocities ±V2y. |±V x |>|±V2 x |···Formula (3)

[0035]

number

[0036] Next, the main control unit 8 calculates the time t1 required for the substrate stage 7 to reach the calculated X velocity ±V2x after it starts moving in the X-axis direction. Then, it calculates time t3 (second parameter) from the time t1 and the time t2 from the end of exposure of the previous shot until the Y velocity changes from -V2y (maximum velocity) (the time during which the absolute value of the Y velocity remains maximum after the end of exposure of the previous shot) using equation (5). t3=t2-t1...Equation (5)

[0037] The main control unit 8 determines a drive profile in which the timing at which the substrate stage 7 starts moving in the X-axis direction is shifted by the calculated time t3. As a result, the absolute value of the X-velocity becomes maximum (|±V x |) and the absolute value of the Y velocity is maximum (|±V2 y Therefore, the maximum value of the absolute value of the Y velocity in this embodiment (|±V2y |) is the maximum absolute value of the conventional Y velocity (|±V y |), improving throughput.

[0038] FIG. 5 is a diagram showing a flowchart of determining a drive profile in this embodiment. The main control unit 8 determines a second parameter, which is a parameter related to the movement of the substrate stage 7 in the second direction (X-axis direction), based on a first parameter, which is a parameter related to the movement of the substrate stage 7 in the first direction (Y-axis direction) (S110, first determination step). Here, the movement distance of the substrate stage 7 in the first direction is longer than the movement distance in the second direction. The movement distance in each direction can be obtained based on the shot layout and the order in which a plurality of shot areas are exposed. The first determination step in this embodiment is a step of determining a time t3 at which the movement in the X-axis direction, which is the second parameter, starts, based on the Y speed, which is the first parameter. Next, the main control unit 8 determines a drive profile for controlling the movement of the substrate stage 7 based on the first parameter and the second parameter determined in the first determination step (S120, second determination step). In other words, the drive profile is determined based on the first parameter and the second parameter determined in the first determination step. Then, the main control unit 8 transmits the drive profile determined in the second determination step to the stage control unit 9 (S130, transmission step). Note that determining the drive profile includes both generating the drive profile and adjusting the drive profile. Steps S110 to S130 are an information processing method executed by the main control unit (information processing device) 8 in accordance with a program stored inside.

[0039] In this embodiment, the driving profile of the substrate stage 7 when exposing the 84th shot area and the 85th shot area has been described as an example, but the same can also be applied to other shot areas.

[0040] When delaying the timing to start the movement in the X-axis direction, it is preferable to consider the relationship between the time to end the movement in the X-axis direction and the exposure start time of the next shot area. First, the movement in the X-axis direction must be completed by the time the exposure start time of the next shot area is to start. Also, if the time to end the movement in the X-axis direction is too close to the exposure start time of the next shot area, the exposure accuracy of the next shot area may be deteriorated due to the influence of vibrations caused by the movement. Taking these factors into consideration, it is preferable to determine the time t3 by which the timing to start the movement in the X-axis direction is shifted.

[0041] In this embodiment, an example has been shown in which the main control unit 8 determines the drive profile of the substrate stage 7 as an information processing device, but the drive profile may be determined by the stage control unit 9, or may be determined by an information processing device external to the substrate processing apparatus 1. If the stage control unit 9 determines the drive profile, the transmission step does not need to be performed. If an information processing device external to the substrate processing apparatus 1 determines the drive profile, the drive profile determined in the second determination step may be transmitted from the information processing device to the stage control unit 9 in the transmission step, or may be transmitted to the main control unit 8 that controls the substrate processing apparatus 1.

[0042] In this embodiment, an example has been shown in which the second parameter is determined based on the first parameter, and the drive profile is determined. This drive profile may include a first drive profile used to control the movement of the substrate stage 7 in the Y-axis direction (first direction), and a second drive profile used to control the movement of the substrate stage 7 in the X-axis direction (second direction). In other words, the drive profile may be managed and determined separately for each direction. In this case, the drive profile in the Y-axis direction (first drive profile) is determined based on the first parameter, and the drive profile in the X-axis direction (second drive profile) is determined based on the second parameter.

[0043] In this embodiment, the example of determining the drive profile has been described, but the drive profile stored in the storage device may be adjusted. For example, when the storage device (storage unit) stores the first drive profile and the second drive profile, the second drive profile stored in the storage device may be adjusted based on the second parameter. In addition to adjusting the second drive profile, the first drive profile may be adjusted based on the first parameter and the second parameter. This adjustment may be performed multiple times. In this embodiment, the drive of the substrate stage 7 in the X-axis direction is determined based on the drive of the substrate stage 7 in the Y-axis direction. However, when the moving distance of the substrate stage 7 in the X-axis direction is longer than the moving distance of the substrate stage 7 in the Y-axis direction, the drive of the substrate stage 7 in the Y-axis direction may be determined (adjusted) based on the drive of the substrate stage 7 in the X-axis direction.

[0044] That is, the adjustment in this embodiment is to adjust at least one of the first drive profile and the second drive profile based on a combined speed obtained by combining the moving speed of the substrate stage 7 in the first direction and the moving speed of the substrate stage 7 in the second direction. Specifically, the timing at which the substrate stage 7 starts moving is adjusted in at least one of the first drive profile and the second drive profile. The moving speed of the substrate stage 7 in the first direction can be obtained from the first drive profile, and the moving speed of the substrate stage 7 in the second direction can be obtained from the second drive profile.

[0045] In the present embodiment, the maximum Y speed during the exposure period is the same as the maximum Y speed during the non-exposure period, but the maximum Y speed during the exposure period may be different from the maximum Y speed during the non-exposure period. For example, the Y speed (scanning speed) may be based on the specifications of the product (such as a chip) to be manufactured during the exposure period, and the Y speed may be faster than the scanning speed in order to improve the throughput during the non-exposure period.

[0046] In this embodiment, the time (second parameter) at which the substrate stage 7 starts moving in the X-axis direction (second direction), whose moving distance is shorter than that in the Y-axis direction, is determined based on the moving speed (Y speed, first parameter) of the substrate stage 7 in the Y-axis direction (first direction). x |) and the timing when the absolute value of the Y velocity is maximum (|±V2 y Therefore, the driving time of the substrate stage 7 is shorter than in the past, and throughput (productivity) can be improved.

[0047] <Second embodiment> This embodiment differs from the first embodiment in the method of determining (adjusting) the drive profile so that the timing when the absolute value of the X velocity becomes maximum and the timing when the absolute value of the Y velocity becomes maximum do not overlap. In this embodiment, the acceleration of the movement of the substrate stage 7 in the X-axis direction during the non-exposure period is changed so that the timing when the absolute value of the X velocity becomes maximum and the timing when the absolute value of the Y velocity becomes maximum are made different from each other.

[0048] FIG. 6 is a diagram showing a drive profile of the substrate stage 7 when the 84th shot area and the 85th shot area are exposed in this embodiment.

[0049] The main control unit 8 obtains the X velocity ±V2x based on the determined Y velocity (first parameter) in the same manner as in the first embodiment. In this embodiment, the time t2 from the end of the exposure of the previous shot until the Y velocity changes from -V2y (the time during which the absolute value of the Y velocity remains at its maximum after the end of the exposure of the previous shot) and the absolute value of the X velocity |±V2 x The time when | occurs is the same. Specifically, the absolute value of the X velocity is | ± V2 x |The acceleration (second parameter) when changing to | is made small, so that the X velocity increases gradually. This allows the absolute value of the X velocity to be up to |±V x | and the absolute value of the Y speed is maximum (| ± V2 yTherefore, the maximum value of the absolute value of the Y velocity in this embodiment (|±V2 y |) is the maximum absolute value of the conventional Y velocity (|±V y |), improving throughput.

[0050] In this embodiment, similarly to the first embodiment, when the movement distance of the substrate stage 7 in the X-axis direction is longer than the movement distance of the substrate stage 7 in the Y-axis direction, the drive of the substrate stage 7 in the Y-axis direction may be determined (adjusted) based on the drive of the substrate stage 7 in the X-axis direction. That is, similarly to the first embodiment, the adjustment in this embodiment adjusts at least one of the first drive profile and the second drive profile based on a combined speed that combines the movement speed of the substrate stage 7 in the first direction and the movement speed of the substrate stage 7 in the second direction. Specifically, the acceleration of the substrate stage 7 is adjusted in at least one of the first drive profile and the second drive profile.

[0051] In this embodiment, the driving profile of the substrate stage 7 when exposing the 84th shot area and the 85th shot area has been described as an example, but it is also applicable to other shot areas. In addition, the determination (adjustment) of the acceleration in the X-axis direction in this embodiment and the determination (adjustment) of the timing to start movement in the X-axis direction in the first embodiment may be performed together.

[0052] <Third embodiment> This embodiment differs from the first and second embodiments in the method of determining (adjusting) the drive profile. Fig. 7 is a diagram showing the drive profile of the substrate stage 7 when the 84th shot area and the 85th shot area are exposed in this embodiment.

[0053] The main control unit 8 obtains the X velocity ±V2x (second parameter) based on the determined Y velocity (first parameter) in the same manner as in the first embodiment. In this embodiment, the absolute value of the maximum X velocity during the non-exposure period is |±V2 xThis makes the Y speed the maximum absolute value of the conventional Y speed (|±V y The maximum absolute value of the Y velocity (|±2V y |), which can improve the throughput.

[0054] The absolute value of the maximum X-speed is |±V2 x When setting | (when reducing the absolute value of the maximum X speed), it is preferable to consider the relationship between the time when movement in the X-axis direction ends and the exposure start time of the next shot area. First, movement in the X-axis direction must be completed by the time when exposure starts for the next shot area. Also, if the time when movement in the X-axis direction ends is too close to the exposure start time for the next shot area, the exposure accuracy of the next shot area may deteriorate due to the effects of vibrations caused by movement. Taking these factors into consideration, the absolute value of the maximum X speed, |±V2 x | should be decided.

[0055] In this embodiment, the maximum X speed is +V2x, but the Y speed is the maximum absolute value (|±V2 y If it is necessary to move further in the X-axis direction at the point where it is no longer |), the X velocity may be increased from +V2x as long as it does not affect the Y velocity.

[0056] In this embodiment, similarly to the first embodiment, when the movement distance of the substrate stage 7 in the X-axis direction is longer than the movement distance of the substrate stage 7 in the Y-axis direction, the drive of the substrate stage 7 in the Y-axis direction may be determined (adjusted) based on the drive of the substrate stage 7 in the X-axis direction. That is, in the adjustment of this embodiment, similarly to the first embodiment, at least one of the first drive profile and the second drive profile is adjusted based on a combined speed that combines the movement speed of the substrate stage 7 in the first direction and the movement speed of the substrate stage 7 in the second direction. Specifically, the maximum speed (in a predetermined direction) of the substrate stage 7 is adjusted in at least one of the first drive profile and the second drive profile.

[0057] This embodiment may be implemented in combination with either or both of the first and second embodiments. That is, in at least one of the first and second drive profiles, at least one of the timing at which the substrate stage 7 moves, the acceleration of the substrate stage 7, and the maximum speed of the substrate stage is adjusted.

[0058] In this embodiment, the driving profile of the substrate stage 7 when exposing the 84th shot area and the 85th shot area has been described as an example, but the same can also be applied to other shot areas.

[0059] <Fourth embodiment> This embodiment differs from the above-described embodiment in the method of determining (adjusting) the drive profile. For example, in order to detect each of the alignment marks formed in a plurality of sample shot areas, the substrate stage 7 may continuously move each of two shot areas at discrete positions to a target position (for example, an alignment mark detection position). As a specific example, for example, among the plurality of shot areas on the substrate 5 shown in FIG. 2(a), the 87th shot area and the 8th shot area are assumed to be sample shot areas. In this case, first, the substrate stage 7 moves so that the 87th shot area moves to the target position, and the alignment mark of the 87th shot area is detected. Next, the substrate stage 7 moves so that the 8th shot area moves to the target position, and the alignment mark of the 87th shot area is detected.

[0060] FIG. 8 is a diagram showing a conventional driving profile of the substrate stage 7 when the 87th shot area is moved to a target position and then the 8th shot area is moved. 8 shows the X velocity of the substrate stage 7, and the middle graph shows the Y velocity of the substrate stage 7. The lower graph shows the combined velocity of the substrate stage 7.

[0061] As shown in Fig. 8, conventionally, movement in the X-axis direction and movement in the Y-axis direction started at the same time, so the X-speed and the Y-speed were mutually limited. The main control unit 8 calculated the X-speed Vx and the Y-speed Vy that satisfied the formula (1), and the stage control unit 9 controlled the movement of the substrate stage 7 at a constant speed of Vx in the X-axis direction and at a constant speed of Vy in the Y-axis direction. As a result, the substrate stage 7 was moved at X-speed and Y-speed that were mutually limited, which resulted in a long drive time for the substrate stage 7.

[0062] 9 is a diagram showing the drive profile of the substrate stage 7 when the 87th shot area is moved to a target position and then the 8th shot area is moved in this embodiment. The upper graph in Fig. 9 shows the X velocity of the substrate stage 7, and the middle graph shows the Y velocity of the substrate stage 7. The lower graph shows the combined velocity of the substrate stage 7.

[0063] When moving the substrate stage 7 from a state in which the 87th shot area is at the target position to a state in which the 8th shot area is at the target position, the main control unit 8 determines a drive profile so that the substrate stage 7 is moved only in the Y-axis direction at the Y-speed limit Vmax. The main control unit 8 then determines a drive profile so that the X-speed increases from the timing (first parameter) at which the Y-speed changes from the limit speed Vmax (maximum speed) and the X-speed becomes the limit speed Vmax at the timing at which the Y-speed becomes 0. In other words, the main control unit 8 determines a drive profile so that the timing (second parameter) at which the substrate stage 7 starts moving in the X-axis direction is shifted to time t4 at which the Y-speed changes from the limit speed Vmax. That is, the main control unit 8 determines (adjusts) the timing (second parameter) at which the substrate stage 7 starts moving in the X-axis direction based on the first parameter.

[0064] By determining the drive profile in this manner, the X and Y velocities are not restricted by each other, and each can be set to the limit velocity Vmax, thereby shortening the drive time of the substrate stage 7.

[0065] In this embodiment, the driving profile of the substrate stage 7 when the 87th shot area is moved to the target position and then the 8th shot area is moved is described as an example, but it can also be applied to other shot areas. Also, in this embodiment, an example is shown in which the substrate stage 7 is first driven in the Y-axis direction and then driven in the X-axis direction, and an example is shown in which a parameter in the X-axis direction is determined based on a parameter in the Y-axis direction. However, it is only necessary to determine the other parameter based on the speed in the direction in which the movement distance of the substrate stage 7 is long, in other words, in the direction that is likely to be the speed limiting direction, and the example is not particularly limited to the example of this embodiment.

[0066] This embodiment may be realized by adjusting the drive profile stored in the storage unit, similarly to the first embodiment. In other words, this adjustment is to adjust at least one of the first drive profile and the second drive profile based on a combined speed obtained by combining the moving speed of the substrate stage 7 in the first direction and the moving speed of the substrate stage 7 in the second direction.

[0067] <Fifth embodiment> This embodiment is characterized in that an article is manufactured by moving the substrate stage 7 according to the drive profile described above.

[0068] FIG. 10 is a diagram showing a flowchart of a method for manufacturing an article in this embodiment. The main control unit (information processing device) 8 determines a second parameter, which is a parameter related to the movement of the substrate stage 7 in the second direction, based on a first parameter, which is a parameter related to the movement of the substrate stage 7 in the first direction (S210, first determination step). Here, the movement distance of the substrate stage 7 in the first direction is longer than the movement distance in the second direction. Next, the main control unit 8 determines a drive profile for controlling the movement of the substrate stage 7 based on the first parameter and the second parameter determined in the first determination step (S220, second determination step). Then, a formation step (S230) is performed in which a pattern is formed on the substrate while controlling the movement of the substrate stage 7 that holds the substrate based on the drive profile determined in the second determination step. Next, a manufacturing step (S240) is performed in which an article is manufactured from the substrate on which the pattern is formed in the formation step.

[0069] Products manufactured by this manufacturing method include, for example, semiconductor IC elements, liquid crystal display elements, color filters, MEMS, and the like.

[0070] In the forming step, for example, a substrate (silicon wafer, glass plate, etc.) coated with a photosensitive material is exposed to light by an exposure apparatus (lithography apparatus) to form a pattern on the substrate.

[0071] The manufacturing process includes, for example, developing a substrate (photosensitive material) on which a pattern is formed, etching the developed substrate, removing the resist, dicing, bonding, and packaging. According to this manufacturing method, it is possible to manufacture articles with a higher throughput than conventional methods.

[0072] The disclosure of this specification includes the following stage apparatus, substrate processing apparatus, information processing apparatus, information processing method, program, and method for manufacturing an article.

[0073] [Item 1] a stage capable of holding and moving a substrate; A control unit that controls the movement of the stage based on a drive profile, the drive profile is determined based on a first parameter which is a parameter related to movement of the stage in a first direction, and a second parameter which is a parameter related to movement of the stage in a second direction determined based on the first parameter; A moving distance of the stage in the first direction is longer than a moving distance of the stage in the second direction. A stage apparatus comprising:

[0074] [Item 2] 2. The stage device according to item 1, wherein the second parameter is determined based on the first parameter and a limit speed of a combined speed of the movement speed of the stage in the first direction and the movement speed of the stage in the second direction.

[0075] [Item 3] 3. The stage device according to item 1 or 2, characterized in that the first parameter is a speed at which the stage moves in the first direction, and the second parameter is a time at which the stage starts moving in the second direction, or an acceleration at which the stage moves in the second direction, or a maximum speed at which the stage moves in the second direction.

[0076] [Item 4] 3. The stage device according to item 1 or 2, characterized in that the first parameter is a time at which a speed of the movement of the stage in the first direction changes from a maximum speed, and the second parameter is a time at which the stage starts moving in the second direction.

[0077] [Item 5] 5. The stage device according to any one of items 1 to 4, wherein the speed at which the stage moves in the first direction and the speed at which the stage moves in the second direction reach their maximum speeds at different times.

[0078] [Item 6] 6. The stage device according to any one of items 1 to 5, wherein the first direction is a scanning direction when scanning exposure is performed on the substrate, and the second direction is a direction perpendicular to the first direction.

[0079] [Item 7] the drive profile includes a first drive profile used to control the movement of the stage in the first direction and a second drive profile used to control the movement of the stage in the second direction; 7. The stage apparatus according to any one of items 1 to 6, wherein the first drive profile is determined based on the first parameter, and the second drive profile is determined based on the second parameter.

[0080] [Item 8] a storage unit that stores a second drive profile used to control the movement of the stage in the second direction; 8. The stage apparatus according to any one of items 1 to 7, wherein the second drive profile stored in the storage unit is adjusted based on the second parameter.

[0081] [Item 9] the storage unit stores a first drive profile used to control the movement of the stage in the first direction; 9. The stage apparatus of item 8, wherein the first drive profile is adjusted based on the first parameter and the second parameter.

[0082] [Item 10] 10. The stage device according to any one of items 1 to 9, wherein the drive profile is used to control the movement of the stage in a non-exposure period.

[0083] [Item 11] 11. The stage device according to any one of items 1 to 10, wherein the drive profile is used when the stage moves between shot areas having different positions in a scanning direction of the stage.

[0084] [Item 12] a stage capable of holding and moving a substrate; A control unit that controls the driving of the stage based on a driving profile, the drive profile includes a first drive profile used to drive the stage in a first direction and a second drive profile used to drive the stage in a second direction; the control unit controls driving of the stage with the driving profile obtained by adjusting at least one of the first driving profile and the second driving profile based on a combined speed of the moving speed of the stage in the first direction and the moving speed of the stage in the second direction. A stage apparatus comprising:

[0085] [Item 13] The stage device described in item 12, characterized in that in at least one of the first drive profile and the second drive profile, at least one of the time when the stage starts moving, the acceleration of the stage, and the maximum speed of the stage is adjusted.

[0086] [Item 14] a stage capable of holding and moving a substrate; A control unit that controls the movement of the stage based on a drive profile; a substrate processing unit that processes the substrate held by the stage; having the drive profile is determined based on a first parameter which is a parameter related to movement of the stage in a first direction, and a second parameter which is a parameter related to movement of the stage in a second direction determined based on the first parameter; A moving distance of the stage in the first direction is longer than a moving distance of the stage in the second direction. The substrate processing apparatus according to claim 1,

[0087] [Item 15] an information processing unit that determines a drive profile used to control the movement of a movable stage that holds a substrate; The information processing unit includes: determining a second parameter, which is a parameter related to movement of the stage in a second direction having a movement distance shorter than the movement distance in the first direction, based on a first parameter, which is a parameter related to movement of the stage in a first direction; determining the drive profile based on the first parameter and the second parameter; 23. An information processing apparatus comprising:

[0088] [Item 16] 1. An information processing method for determining a drive profile used to control movement of a movable stage holding a substrate, comprising: a first determination step of determining, based on a first parameter which is a parameter related to the movement of the stage in a first direction, a second parameter which is a parameter related to the movement of the stage in a second direction having a movement distance shorter than the movement distance in the first direction; a second determination step of determining the drive profile based on the first parameter and the second parameter; A transmission step of transmitting the driving profile determined in the second determination step. 23. An information processing method comprising:

[0089] [Item 17] Item 17. A program for causing a computer to execute the information processing method according to item 16.

[0090] [Item 18] a first determination step of determining, based on a first parameter which is a parameter related to movement of a stage capable of moving while holding a substrate in a first direction, a second parameter which is a parameter related to movement of the stage in a second direction which is a movement distance shorter than the movement distance in the first direction; a second determination step of determining a drive profile used to control the movement of the stage based on the first parameter and the second parameter; a forming step of forming a pattern on the substrate held by the stage while controlling the movement of the stage based on the drive profile determined in the second determination step; A manufacturing process for manufacturing an article from the substrate on which the pattern is formed in the forming process. A method for producing an article comprising the steps of:

[0091] The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention.

Claims

1. a stage capable of holding and moving a substrate; A control unit that controls the movement of the stage based on a drive profile, the drive profile is determined based on a first parameter which is a parameter related to movement of the stage in a first direction, and a second parameter which is a parameter related to movement of the stage in a second direction determined based on the first parameter; A moving distance of the stage in the first direction is longer than a moving distance of the stage in the second direction. A stage apparatus comprising:

2. 2. The stage device according to claim 1, wherein the second parameter is determined based on the first parameter and a limit speed of a combined speed of the moving speed of the stage in the first direction and the moving speed of the stage in the second direction.

3. 2. The stage device of claim 1, wherein the first parameter is a speed at which the stage moves in the first direction, and the second parameter is a time at which the stage starts moving in the second direction, or an acceleration at which the stage moves in the second direction, or a maximum speed at which the stage moves in the second direction.

4. 2. The stage apparatus of claim 1, wherein the first parameter is the time at which the speed of movement of the stage in the first direction changes from a maximum speed, and the second parameter is the time at which the stage starts moving in the second direction.

5. 2. The stage device according to claim 1, wherein a speed at which said stage moves in said first direction and a speed at which said stage moves in said second direction reach their maximum speeds at different times.

6. 2. The stage device according to claim 1, wherein the first direction is a scanning direction when scanning exposure is performed on the substrate, and the second direction is a direction perpendicular to the first direction.

7. the drive profile includes a first drive profile used to control the movement of the stage in the first direction and a second drive profile used to control the movement of the stage in the second direction; 2. The stage apparatus according to claim 1, wherein the first drive profile is determined based on the first parameter, and the second drive profile is determined based on the second parameter.

8. a storage unit that stores a second drive profile used to control the movement of the stage in the second direction; 2. The stage apparatus according to claim 1, wherein the second drive profile stored in the storage unit is adjusted based on the second parameter.

9. the storage unit stores a first drive profile used to control the movement of the stage in the first direction; 9. The stage apparatus according to claim 8, wherein the first drive profile is adjusted based on the first parameter and the second parameter.

10. 2. The stage apparatus according to claim 1, wherein the drive profile is used to control the movement of the stage during a non-exposure period.

11. 2. The stage apparatus according to claim 1, wherein the drive profile is used when the stage moves between shot areas having different positions in a scanning direction of the stage.

12. a stage capable of holding and moving a substrate; A control unit that controls the driving of the stage based on a driving profile, the drive profile includes a first drive profile used to drive the stage in a first direction and a second drive profile used to drive the stage in a second direction; the control unit controls driving of the stage with the driving profile obtained by adjusting at least one of the first driving profile and the second driving profile based on a combined speed of a moving speed of the stage in the first direction and a moving speed of the stage in the second direction. A stage apparatus comprising:

13. 13. The stage device according to claim 12, wherein at least one of the time when the stage starts moving, the acceleration of the stage, and the maximum speed of the stage are adjusted in at least one of the first drive profile and the second drive profile.

14. a stage capable of holding and moving a substrate; A control unit that controls the movement of the stage based on a drive profile; a substrate processing unit that processes the substrate held by the stage; having the drive profile is determined based on a first parameter which is a parameter related to movement of the stage in a first direction, and a second parameter which is a parameter related to movement of the stage in a second direction determined based on the first parameter; A moving distance of the stage in the first direction is longer than a moving distance of the stage in the second direction. The substrate processing apparatus according to claim 1,

15. an information processing unit that determines a drive profile used to control the movement of a movable stage that holds a substrate; The information processing unit includes: determining a second parameter, which is a parameter related to movement of the stage in a second direction having a movement distance shorter than the movement distance in the first direction, based on a first parameter, which is a parameter related to movement of the stage in a first direction; determining the drive profile based on the first parameter and the second parameter; 23. An information processing apparatus comprising:

16. 1. An information processing method for determining a drive profile used to control movement of a movable stage holding a substrate, comprising: a first determination step of determining, based on a first parameter which is a parameter related to the movement of the stage in a first direction, a second parameter which is a parameter related to the movement of the stage in a second direction having a movement distance shorter than the movement distance in the first direction; a second determination step of determining the drive profile based on the first parameter and the second parameter; a transmission step of transmitting the driving profile determined in the second determination step.

23. An information processing method comprising:

17. A program for causing a computer to execute the information processing method according to claim 16.

18. a first determination step of determining, based on a first parameter which is a parameter related to movement of a stage capable of moving while holding a substrate in a first direction, a second parameter which is a parameter related to movement of the stage in a second direction having a movement distance shorter than the movement distance in the first direction; a second determination step of determining a drive profile used to control the movement of the stage based on the first parameter and the second parameter; a forming step of forming a pattern on the substrate held by the stage while controlling the movement of the stage based on the drive profile determined in the second determination step; A manufacturing process for manufacturing an article from the substrate on which the pattern is formed in the forming process. A method for producing an article.

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