Component holder having temperature control function

Abstract

To provide a component holder whose temperature behavior can be adapted and maintained to the direct process ambient temperature of the component.SOLUTION: A component holder (1) for processing components includes a support (100), a component holding tool (300) having a component contact surface (350), and a temperature control device (200) that thermally shields one or more regions of the component contact surface (350) of the component holding tool (300) from the support (1) for predetermined process temperature.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims priority to DE 102023129487.3, filed October 25, 2023, which is incorporated by reference in its entirety.

[0002] The invention relates to a component holder with temperature control according to the features of claim 1 and to its use according to the features of claim 22. [Background technology]

[0003] Component holders for mounting components of various configurations for various applications are well known from the prior art. Component holders are typically used in the manufacture of electrical components or assemblies when mounting semiconductor chips on a substrate. The use of component holders in the case of thermal assembly processes such as soldering or bonding is problematic: due to the different two masses of the component holder and the supported component, strong temperature gradients arise, which have a negative effect on the assembly process.

[0004] It is also well known from the prior art that electrical components made from materials with a positive temperature coefficient, so-called PTC (positive temperature coefficient) elements, are often used in protection circuits, in particular as fuses. Their electrical resistance increases if the ambient temperature rises. Due to this effect, they are often used as fuse elements to limit the flow of current when the PTC element heats up if the current increases. As a result of the heating, the electrical resistance of the element increases, limiting the current flow. If the current increases unexpectedly high or uncontrolled in a very short time, the heat generation melts the PTC element, interrupting the current flow by thus destroying the PTC element.

[0005] Various solutions for component holders, including their advantages and disadvantages, are shown and discussed in detail in patent documents, e.g. DD 2 70 180 A10, JP 5 675 138 82, US 11 631 597 82, US 2003 / 0 075 537 A1, US 2005 / 0 257 160 A1 or also in US 2014 / 0 184 312 A1. Summary of the Invention

[0006] The object of the present invention is to provide a component holder for holding components, such as electrical components or semiconductor chips, for component assembly, which, despite its large mass, is able to adapt and maintain its temperature behavior to the direct process ambient temperature of the component even at high process cycles.

[0007] The problem is solved by a technical device according to independent claim 1 and its use according to claim 22. Technically advantageous embodiments are described in the dependent claims, the description and the drawings.

[0008] According to one aspect of the invention, a component holder for processing a component comprises, as elements, a support, a component holding tool having a component contact surface, and a temperature control device for thermally shielding one or more areas of the component contact surface of the component holding tool relative to the support and to a predetermined process temperature.

[0009] According to another aspect of the invention, a component holder for processing a component comprises as elements a support, a component holding tool having a component contact surface, and a temperature control device, the temperature control device being disposed between the support and the component holding tool such that during processing of the component, one or more areas of the component contact surface of the component holding tool can be thermally shielded or shielded from the support, and such that one or more areas of the component contact surface of the component holding tool can be temperature controlled relative to the support to a predetermined process temperature.

[0010] In both embodiments, thermal shielding is achieved specifically by compensating for thermal energy differences that arise between the elements.

[0011] In both embodiments, the component holder and / or at least one of its elements preferably has a large mass in order to be able to inertially counteract process-related vibrations. A large mass entails a sluggish heating and / or cooling behavior, in which the thermal energy supplied and / or dissipated can only release its effect in the form of hot or cold radiation to one or more areas of the component contact surface with a time difference. However, this drawback can be optimized by using thermally matched materials, whose thermal conductivity is optimized by matching the thermal conductivity coefficient and thickness of the material along the heat flow, so that the thermal energy supplied and / or dissipated in at least one direction in a very short time counters inertia.

[0012] In both aspects, thermal energy can be supplied to and / or dissipated from the component holder and / or at least one of its elements from at least one heat source and / or heat sink. Preferably, the heat source and / or heat sink is embedded in the component holder and / or at least one of its elements. Preferably, in both aspects, the heat source and / or heat sink is arranged to extend into a spatial volume of at least one of the component holder and / or its elements and / or to extend into a plane of at least one of the component holder and / or its elements.

[0013] In both cases, the spatial volume and / or the plane are preferably divided into temperature zones. This has the advantage that the thermal energy supplied and / or discharged can be optimally controlled by predefined temperature values ​​adapted to the process of the parts to be processed and that the target deviations can be continuously reduced by a control loop. In particular, the influence of the external environment can be reduced to a greater extent, allowing a more stable process.

[0014] In an embodiment of the component holder, the component holder and / or one or more, preferably all, of its elements, in particular the support, the component holding tool and the temperature control device, each include at least one media line section extending within a spatial volume within a temperature zone.

[0015] Preferably, the media line sections are each arranged such that in the case of a press-fit and / or form-fit connection between the support and the temperature control device and a press-fit and / or form-fit connection between the temperature control device and the part-holding tool, a continuous media line is formed from at least two media line sections, so that in a first manner, at least a portion of the positive and / or negative thermal energy for temperature control of the temperature zones, preferably for processing of the parts, can be supplied to and / or discharged from at least one temperature zone within a few seconds by at least one medium, whereby in the case of one media line, an alternating supply and / or discharge of thermal energy through the same media line within a temperature zone is possible as in the case of two or more media lines.

[0016] Industrial gases are particularly suitable as media, particularly when pressurized to high pressure, allowing temperature control within a few seconds, preferably within a few milliseconds.

[0017] In an embodiment of the component holder, the component holder and / or one or more, preferably all, of its elements include one or more heating elements for providing at least a portion of positive thermal energy for temperature control within the temperature zone in a second manner.

[0018] Preferred embodiments of the component holder comprise a heat source and / or a heat sink arranged to extend within at least one spatial volume of the component holder and / or its elements and / or arranged to extend within at least one plane of the component holder and / or its elements to provide at least a portion of positive or negative thermal energy for temperature control in the two above mentioned ways.

[0019] In the context of the present disclosure, thermal energy that can be supplied and / or removed in a very short time is used to temperature control spatial temperature zones arranged in a volume or plane in order to bring one or more areas of the component contact surface to a constant temperature and maintain this temperature during processing of the component. Preferably, the thermal conductivity coefficients of the materials of the individual elements are matched to each other to optimize the overall thermal conductivity.

[0020] In an embodiment of the component holder with multiple heating elements, at least one heating element is a PTC thermistor heating element.

[0021] In the embodiment of the component holder with several heating elements, the heating elements are electrically connected to one another in series, particularly preferably in parallel.

[0022] In such an embodiment of the component holder with one or more heating elements, the one or more heating elements are disposed in one or more temperature zones.

[0023] In contrast to a series circuit, a parallel connection of heating elements has the advantage that, in the case of a temperature difference between two areas of a component contact surface or between two temperature zones of a temperature control device, the electrical resistance of the embedded PTC thermistor heating elements increases in the area or temperature zone with the higher temperature. According to the rules of parallel electrical connection, the same voltage is applied to each electrical resistance. On the other hand, the current is lower if the electrical resistance of one arm of the electrical circuit is higher. This means that a high electrical resistance in an area or temperature zone due to a high temperature leads to a lower current in this arm and thus to a lower heating power in this area or temperature zone. The temperature then decreases and the electrical resistance of this area or temperature zone also decreases. The negative feedback loop thus realized allows a self-adaptive control system for temperature control. As a result, the temperature distribution on the component contact surface is uniform despite fluctuating or non-uniform process and / or ambient temperatures.

[0024] Also, manufacturing tolerances (or minor imperfections) of the PTC thermistor are compensated for, resulting in a higher acceptable yield in the processing of the heating device, which in turn results in lower manufacturing costs.

[0025] Also, the auto-adaptive behavior of the design may require fewer heating devices, potentially reducing costs as each heating device would otherwise require a separate controller and its own thermocouple.

[0026] Similarly, in the case of a usable series circuit, an increase in temperature in an area or temperature zone leads to a higher electrical resistance of the PTC thermistor heating element embedded therein in the same scenario as above. According to the laws of electrical series circuits, the same current exists in every electrical resistance. The higher the electrical resistance, the higher the voltage. This means that a high electrical resistance in that area or temperature zone will result in a higher voltage in that temperature zone and thus a higher heating output. The temperature rises in an area or temperature zone. The electrical resistance increases in that area or temperature zone. This is a positive feedback loop, resulting in a self-reinforcing system. The result is a hot spot in the heating element.

[0027] In an embodiment of the component holder, the heating elements of each temperature zone are electrically connected to a respective power supply, each of the power supplies being arranged to provide a predetermined and / or controlled supply of electrical energy to the heating elements of the temperature zone. Thus, preferably, the number of power supplies corresponds to the number of temperature zones, such that each temperature zone has a power supply.

[0028] In an embodiment of the component holder, preferably at least one of the temperature zones is located in an inner central region of the component contact surface and at least one other temperature zone is located in one or more outer regions around the inner central region of the component contact surface.

[0029] In the case of the component holder embodiment, preferably the heating element(s) or the PTC thermistor heating element(s) are manufactured using thin film technology or, in the case of very powerful heating elements, using thick film technology and are thus embedded in the temperature control layer. Thermal expansion typically causes a change or deformation in length / thickness of the temperature control layer.

[0030] Also, the manufacture of temperature control devices using thin or thick film techniques to form a layered composite of multiple temperature control layers with summable thermal energy supply or summable thermal energy dissipation in the case of simultaneous or alternating thermal energy supply and / or thermal energy dissipation allows improved temperature control for thermal shielding.

[0031] For all embodiments of the component holder, the thermally induced deformation of the composite layer of the temperature control device can be advantageously reduced by using a temperature compensating material in the temperature control layer of the temperature control device, preferably an alternating pair of layer materials having matching thermal expansion coefficients that compensate for each other as a pair of layers, or in particular a mechanically rigid material in general for the temperature control layer, such as ceramic, sintered ceramic, technical glass, sapphire or semiconductor material.

[0032] In embodiments of the component holder, the component contact surface preferably has a polygonal shape, preferably the polygonal shape is a triangle, a square, a trapezoid, a rectangle, a polygon, a circle, an ellipse, a torus, an arcuate shape, or any combination thereof.

[0033] In embodiments of the component holder, preferably one or more of the temperature zones each have a polygonal shape, preferably the polygonal shape being triangular, square, trapezoidal, quadrilateral, rectangular, polygonal, circular, elliptical, linear, toroidal, arcuate, or any combination thereof.

[0034] In an embodiment of the component holder, in the case of multiple temperature zones, a first temperature zone is located in a central region of the component contact surface, a second temperature zone is located adjacent to and around a first edge of the first temperature zone, a first PTC thermistor heating element of a third temperature zone is located adjacent to and around a second edge of the first temperature zone, a fourth temperature zone is located adjacent to and around a third edge of the first temperature zone, and a second PTC thermistor heating element of the third temperature zone is located adjacent to and around a fourth edge of the first temperature zone, and the first temperature zone comprises multiple PTC thermistor heating elements connected in parallel.

[0035] In an embodiment of the component holder, a fifth temperature zone is disposed adjacent to and around a first edge of the first PTC thermistor heating element of the third temperature zone, and a sixth temperature zone is disposed adjacent to and around a first edge of the second heating element of the third temperature zone.

[0036] In an embodiment of the component holder, the first temperature zone has a square shape and the second temperature zone, the first PTC thermistor heating element in the third temperature zone, the fourth temperature zone, and the second PTC thermistor heating element in the third temperature zone have a trapezoidal shape.

[0037] In an embodiment of the component holder, the first PTC thermistor heating element of the first temperature zone is disposed in an inner central region of the component contact surface, the second PTC thermistor heating element of the first temperature zone is disposed adjacent to and around a first edge of the first PTC thermistor heating element of the first temperature zone, the third PTC thermistor heating element of the first temperature zone is disposed adjacent to and around a second edge of the first PTC thermistor heating element of the first temperature zone, the fourth PTC thermistor heating element of the first temperature zone is disposed adjacent to and around a third edge of the first PTC thermistor heating element of the first temperature zone, and the fifth heating element of the first temperature zone is disposed adjacent to and around a fourth edge of the first PTC thermistor heating element of the first temperature zone, and the first temperature zone comprises a plurality of PTC thermistor heating elements connected in parallel.

[0038] In an embodiment of the component holder, the first PTC thermistor heating element in the first temperature zone has a square shape, and the second PTC thermistor heating element in the first temperature zone, the third PTC thermistor heating element in the first temperature zone, the third PTC thermistor heating element in the first temperature zone, the fourth PTC thermistor heating element in the first temperature zone, and the fifth PTC thermistor heating element in the first temperature zone each have a polygonal shape, preferably, as previously described, the polygonal shape is triangular, square, trapezoidal, polygonal, quadrilateral, rectangular, polygonal, circular, elliptical, linear, toroidal, arcuate, or any combination thereof.

[0039] In an embodiment of the component holder, the first PTC thermistor heating element of the second temperature zone is disposed adjacent to and around a first edge of the second PTC thermistor heating element of the first temperature zone, the second PTC thermistor heating element of the second temperature zone is disposed adjacent to and around a first edge of the third PTC thermistor heating element of the first temperature zone, the third PTC thermistor heating element of the second temperature zone is disposed adjacent to and around a first edge of the fifth PTC thermistor heating element of the first temperature zone, the third PTC thermistor heating element of the second temperature zone is disposed adjacent to and around a first edge of the fifth PTC thermistor heating element of the first temperature zone, and the fourth PTC thermistor heating element of the second temperature zone is disposed adjacent to and around a first edge of the fourth PTC thermistor heating element of the first temperature zone, and the second temperature zone comprises a plurality of PTC thermistor heating elements connected in parallel.

[0040] In an embodiment of the component holder, a first PTC thermistor heating element in the third temperature zone is disposed adjacent to and around a first edge of a second PTC thermistor heating element in the second temperature zone, and a second PTC thermistor heating element in the third temperature zone is disposed adjacent to and around a first edge of a first PTC thermistor heating element in the third temperature zone, the third temperature zone comprising multiple PTC thermistor heating elements connected in parallel.

[0041] In an embodiment of the component holder, a first PTC thermistor heating element in the fourth temperature zone is disposed adjacent to and around a first edge of the first PTC thermistor heating element in the second temperature zone, and a second PTC thermistor heating element in the fourth temperature zone is disposed adjacent to and around a first edge of the first PTC thermistor heating element in the fourth temperature zone, the fourth temperature zone comprising a plurality of PTC thermistor heating elements connected in parallel.

[0042] In an embodiment of the component holder, a first PTC thermistor heating element in the fifth temperature zone is disposed adjacent to and around a first edge of a third PTC thermistor heating element in the second temperature zone, and a second PTC thermistor heating element in the fifth temperature zone is disposed adjacent to and around a first edge of the first PTC thermistor heating element in the fifth temperature zone, the fifth temperature zone comprising multiple PTC thermistor heating elements connected in parallel.

[0043] In an embodiment of the component holder, a first PTC thermistor heating element in the sixth temperature zone is disposed adjacent to and around a first edge of a fourth PTC thermistor heating element in the second temperature zone, and a second PTC thermistor heating element in the sixth temperature zone is disposed adjacent to and around a first edge of the first PTC thermistor heating element in the sixth temperature zone, the sixth temperature zone comprising a plurality of PTC thermistor heating elements connected in parallel.

[0044] In the component holder embodiment, the component holder and / or elements thereof, preferably the support and / or, more preferably, the temperature control device and / or the component holding tool, are also provided with one or more temperature sensors.

[0045] The temperature sensor may also be disposed as a layer on the temperature control device, covering the same area as the heating element, preferably a PTC thermistor heating element. The integration of the electric heating element and the temperature sensor may have a relatively low impact on temperature uniformity.

[0046] In the embodiment of the part holder, and particularly in the case of the resulting composite layer of the temperature control device, the combination, preferably in a parallel circuit, of heating elements in temperature zones acting both in a plane and in a spatial volume, depending on the requirements of the process-relevant temperature profile, has proven to be particularly advantageous for temperature control in order to thermally shield one or more areas of the part contact surface of the part holding tool from the support during processing of the part.

[0047] Embodiments of the component holder are positionable on the bond head such that the component holder can lift and hold any type of component, such as a semiconductor wafer, a semiconductor package, a chip, a flip chip, an integrated circuit, or an optical, electronic, electro-optical device, or a combination thereof.

[0048] Embodiments of the component holder can be positioned at a bonding station of a bonder such that the component holder can lift and hold any type of component, such as a semiconductor wafer, a semiconductor package, a chip, a flip chip, an integrated circuit, or an optical element, an electronic element, an electro-optical element, a substrate, a wafer, or a combination thereof.

[0049] The above-mentioned arrangements of heating elements and / or PTC thermistor heating elements have been described depending on the type of component, whose geometric dimensions specify the number and the geometrical occupation area of ​​the heating elements and / or PTC thermistor heating elements, respectively, and the technical effect of temperature control during processing of the component by thermally shielding the component from the support of the component holder flows directly from this in each case.

[0050] In another aspect of the invention, a method of using a component holder according to any of the above embodiments to control temperature control of one or more regions of a component contact surface of a component holding tool includes controlling the relative temperature difference between one or more temperature zones and / or between one or more PTC thermistor heating elements of the temperature zones during a process step in which the component holder is used.

[0051] In a preferred method, the method of using the component holder includes controlling the relative temperature difference between one or more temperature zones and / or between one or more PTC thermistor heating elements in a temperature zone to achieve a uniform distribution of temperature of the component contact surface.

[0052] The following embodiments EA1 to EA12 are suitable not only for use with supporting the part, but also for use with fixing the part during processing, for use with other and / or further steps, and for use with other and / or further processing machines. These embodiments are:

[0053] EA1: A temperature control device having two or more heating elements, each heating element constructed and arranged to increase the temperature of an adjacent region when an electron flow or voltage through the heating element of a current or voltage attachable to the heating element increases, at least two of the two or more heating elements are connected in parallel, and each heating element constructed and arranged such that its respective electrical resistance increases non-linearly as the temperature of the adjacent region increases.

[0054] EA2: The temperature control device of EA1, wherein each parallel-connected heating element includes one or more PTC thermistors.

[0055] EA3: The temperature control device of EA1 or EA2, wherein increasing the electron flow rate is achieved by increasing the voltage while holding the current constant, or by increasing the current while holding the voltage constant.

[0056] EA4: A temperature control device as described in EA1, EA2 or EA3, wherein each heating element comprises one or more thin conductive layers fabricated using thin film deposition techniques.

[0057] EA5: A component holder having a component contact surface and a temperature control device as described in EA1, EA2, EA3 or EA4, wherein the temperature control device is configured and arranged to increase the temperature of one or more areas of the component contact surface during operation.

[0058] EA6: A component holder as described in EA5, wherein the component contact surface has low electrical conductivity and preferably has an electrical insulating effect in one or more areas near the one or more heating elements.

[0059] EA7: A component holder as described in EA5 or EA6, wherein, in use, the temperature of the component contact surface may increase, preferably uniformly distributed across the component contact surface.

[0060] EA8: An arrangement of mutually symmetrical heating elements, the symmetry comprising concentrically arranged zones including parallel zones at the same distance to the center, and a temperature control layer having a non-quadratic surface is designed with edge regions as separate zones.

[0061] EA9: Temperature zone arrangement, preferably including a rectangular design for rectangular parts, or square or circular embodiments for thermally shielding square or circular parts.

[0062] Ea10: Temperature control device that can be placed and / or attached to the carrier plate.

[0063] EA11: A carrier plate that is exchangeably connected to the part holder.

[0064] EA12: An interface for conducting or passing process media and / or electrical signals between the temperature control device and the part holder.

[0065] EA13: Controllable pass-through for process media in temperature control devices.

[0066] Moreover, the following embodiments EA-P1 to EA-P23 have proven to be particularly suitable in practice.

[0067] EA-P1. A component holder (1) for processing a component, the component holder (1) comprising, as elements, a support (100), a component holding tool (300) having a component contact surface (350), and a temperature control device (200), the temperature control device (200) being positioned on the support (100) such that one or more areas of the component contact surface (350) of the component holding tool (300) can be temperature-controlled relative to the support (100) by positive or negative thermal energy to a predetermined process temperature for processing the component, thereby thermally shielding one or more areas of the component contact surface (350) of the component holding tool (300) from the support (100) for processing the component.

[0068] EA-P2. A part holder (1) as described in EA-P1, wherein the support (100) and the temperature control device (200) each have at least one media line (130, 131, 132, 133, 134, 135, 136, 137, 138, 139, 140, 141) each arranged such that the support (100) is connected to the temperature control device (200) and the temperature control device (200) is press-fit and / or form-fit connected to the part holding tool (300), thereby allowing at least a portion of the positive or negative thermal energy for temperature control, preferably for processing the part, to be supplied or discharged by at least one medium.

[0069] EA-P3. The component holder (1) of EA-P1 or EA-P2, wherein the temperature control device (200) comprises one or more temperature zones (301, 302, 303, 304, 305, 306) that supply positive thermal energy to one or more regions of the component contact surface (350).

[0070] EA-P4. The component holder (1) as described in EA-P3, wherein each temperature zone (301, 302, 303, 304, 305, 306) has one or more electric heating elements (301a, 301b, 302, 302b, 303a, 303b, 304a, 304b, 305a, 305b, 306a, 306b).

[0071] EA-P5. The component holder (1) of EA-P3, wherein one or more of the temperature zones (301, 302, 303, 304, 305, 306) have two or more PTC thermistor heating elements (301a, 301b, 302b, 303a, 303b, 304a, 304b, 305a, 305b, 306a, 306b) electrically connected in parallel.

[0072] EA-P6. A component holder (1) as described in EA-P4 or EA-P5, wherein each of the one or more temperature zones (301, 302, 303, 304, 305, 306) is arranged to be electrically connected to one of the n power sources, each of the electrical energy supplies being arranged to provide a predetermined and / or controlled supply of electrical energy to one of the temperature zones (301, 302, 303, 304, 305, 306).

[0073] EA-P7. A component holder (1) described in any one of embodiments EA-P3 to EA-P6, wherein at least one (301) of the n temperature zones is arranged in an inner central region of the component contact surface (350) and at least one or more further temperature zones (302, 303, 304, 305, 306) are arranged in one or more outer regions around the inner central region of the component contact surface (350).

[0074] EA-P8. The component holder (1) according to EA-P4 or EA-P5, wherein the one or more heating elements (301a, 301b, 302, 302b, 303a, 303b, 304a, 304b, 305a, 305b, 306a, 306b) or the one or more PTC thermistor heating elements (301a, 301b, 302, 302b, 303a, 303b, 304a, 304b, 305a, 305b, 306a, 306b) are applied as a thin film.

[0075] EA-P9. The component holder (1) of any one of the preceding embodiments, wherein the component contact surface (350) comprises a triangle, a square, a trapezoid, a quadrilateral, a rectangle, a polygon, a circle, an ellipse, a torus, an arcuate shape, or any combination thereof.

[0076] EA-P10. The component holder (1) of any one of embodiments EA-P3 to EA-P9, wherein one or more of the temperature zones (301, 302, 303, 304, 305, 306) have a triangular, square, trapezoidal, quadrilateral, rectangular, polygonal, circular, elliptical, linear, toroidal, arcuate shape, or any combination thereof.

[0077] EA-P11. In the case of multiple temperature zones, a first temperature zone (301) is disposed in a central region of the component contact surface (350), a second temperature zone (302) is disposed adjacent to and around a first edge of the first temperature zone (301), a first PTC thermistor heating element (303a) of a third temperature zone (303) is disposed adjacent to and around a second edge of the first temperature zone (301), and a fourth temperature zone (304) is disposed adjacent to and around the first temperature zone (301). A component holder (1) according to one of embodiments EA-P3 to EA-P9, wherein a second PTC thermistor heating element (303b) of the third temperature zone (303) is disposed adjacent to and around a third edge of the first temperature zone (301), and a second PTC thermistor heating element (303b) of the third temperature zone (303) is disposed adjacent to and around a fourth edge of the first temperature zone (301), the first temperature zone (301) comprising a plurality of PTC thermistor heating elements (301a, 301b, 301c, 301d, 301e) connected in parallel.

[0078] EA-P12. The component holder (1) of embodiment EA-P11, wherein a fifth temperature zone (305) is disposed adjacent to and around a first edge of the first PTC thermistor heating element (303a) of the third temperature zone (303), and a sixth temperature zone (306) is disposed adjacent to and around a first edge of the second heating element (303b) of the third temperature zone (303).

[0079] EA-P13. The component holder (1) of embodiment EA-P11 or embodiment EA-P12, wherein the first temperature zone (301) comprises a square shape, and the second temperature zone (302), the first PTC thermistor heating element (303a) of the third temperature zone (303), the fourth temperature zone (304) and the second PTC thermistor heating element (303b) of the third temperature zone (303) comprise trapezoidal shapes.

[0080] EA-P14. A first PTC thermistor heating element (301a) of the first temperature zone (301) is disposed in an inner central region of the component contact surface (350), a second PTC thermistor heating element (301b) of the first temperature zone (301) is disposed adjacent to and around a first edge of the first PTC thermistor heating element (301a) of the first temperature zone (301), a third PTC thermistor heating element (301c) of the first temperature zone (301) is disposed adjacent to and around a second edge of the first PTC thermistor heating element (301a) of the first temperature zone (301), and The component holder (1) according to one of the first embodiments, wherein a fourth PTC thermistor heating element (301d) of (301) is disposed adjacent to and around a third edge of the first PTC thermistor heating element (301a) of the first temperature zone (301), and a fifth heating element (301e) of the first temperature zone (301) is disposed adjacent to and around a fourth edge of the first PTC thermistor heating element (301a) of the first temperature zone (301), and the first temperature zone (301) comprises a plurality of PTC thermistor heating elements (301a, 301b, 301c, 301d, 301e) connected in parallel.

[0081] EA-P15. The component holder (1) of embodiment EA-P14, wherein the first PTC thermistor heating element (301a) of the first temperature zone (301) comprises a square or rectangular shape, and the second PTC thermistor heating element (301b) of the first temperature zone (301), the third PTC thermistor heating element (301c) of the first temperature zone (301), the third PTC thermistor heating element (301c) of the first temperature zone (301), the fourth PTC thermistor heating element (301d) of the first temperature zone (301) and the fifth PTC thermistor heating element (301d) of the first temperature zone (301) comprise polygonal shapes.

[0082] EA-P16. A first PTC thermistor heating element (302a) of the second temperature zone (302) is disposed adjacent to and around a first edge of a second PTC thermistor heating element (301b) of the first temperature zone (301), a second PTC thermistor heating element (302b) of the second temperature zone (302) is disposed adjacent to and around a first edge of a third PTC thermistor heating element (301c) of the first temperature zone (301), and a third PTC thermistor heating element (302c) of the second temperature zone (302) is disposed adjacent to and around a first edge of a third PTC thermistor heating element (301c) of the first temperature zone (301). The component holder (1) of embodiment EA-P14 or embodiment EA-P15, wherein the fifth PTC thermistor heating element (301e) of the first temperature zone (301) is disposed adjacent to and around a first edge of the fifth PTC thermistor heating element (301e) of the first temperature zone (301), and the fourth PTC thermistor heating element (302d) of the second temperature zone (302) is disposed adjacent to and around a first edge of the fourth PTC thermistor heating element (301d) of the first temperature zone (301), and the second temperature zone (302) is composed of multiple PTC thermistor heating elements (302a, 302b, 302c, 302d) connected in parallel.

[0083] EA-P17. The component holder (1) of embodiment EA-P10, wherein a first PTC thermistor heating element (303a) of the third temperature zone (303) is disposed adjacent to and around a first edge of the second PTC thermistor heating element (302b) of the second temperature zone (302), and a second PTC thermistor heating element (303b) of the third temperature zone (303) is disposed adjacent to and around a first edge of the first PTC thermistor heating element (303a) of the third temperature zone (303), the third temperature zone (303) comprising a plurality of PTC thermistor heating elements (303a, 303b) connected in parallel.

[0084] EA-P18. The component holder (1) of embodiment EA-P10 or embodiment EA-P11, wherein the first PTC thermistor heating element (304a) of the fourth temperature zone (304) is disposed adjacent to and around a first edge of the first PTC thermistor heating element (302a) of the second temperature zone (302), and the second PTC thermistor heating element (304b) of the fourth temperature zone (304) is disposed adjacent to and around a first edge of the first PTC thermistor heating element (304a) of the fourth temperature zone (304), and the fourth temperature zone (304) comprises a plurality of PTC thermistor heating elements (304a, 304b) connected in parallel.

[0085] EA-P19. A component holder (1) as described in embodiments EA-P10 to EA-P12, wherein a first PTC thermistor heating element (305a) of the fifth temperature zone (305) is disposed adjacent to and around a first edge of the third PTC thermistor heating element (302c) of the second temperature zone (302), and a second PTC thermistor heating element (305b) of the fifth temperature zone (305) is disposed adjacent to and around a first edge of the first PTC thermistor heating element (305a) of the fifth temperature zone (305), and the fifth temperature zone (305) is composed of multiple PTC thermistor heating elements (305a, 305b) connected in parallel.

[0086] EA-P20. A component holder (1) as described in embodiments EA-P10 to EA-P13, wherein a first PTC thermistor heating element (306a) of the sixth temperature zone (306) is disposed adjacent to and around a first edge of the fourth PTC thermistor heating element (302d) of the second temperature zone (302), and a second PTC thermistor heating element (306b) of the sixth temperature zone (306) is disposed adjacent to and around a first edge of the first PTC thermistor heating element (306a) of the sixth temperature zone (306), and the sixth temperature zone (306) is composed of multiple PTC thermistor heating elements (306a, 306b) connected in parallel.

[0087] EA-P21. The component holder (1) of any one of the preceding embodiments, wherein the component holder (1) further comprises one or more temperature sensors (400).

[0088] EA-P22. A method of using a component holder (1) described in any one of embodiments EA-P1 to EA-P21 for controlling the temperature of one or more regions of a component contact surface (350), the method comprising controlling and / or adjusting the relative temperature difference between one or more temperature zones and / or between one or more PTC thermistor heating elements of the temperature zones during a process step.

[0089] EA-P23. A method of using the component holder (1) of embodiment EA-P22, wherein the method includes controlling the relative temperature difference between one or more temperature zones and / or between one or more PTC thermistor heating elements of the temperature zones to achieve a uniform distribution of temperature of the component contact surface (350).

[0090] All embodiments of the part holder ensure a constant process temperature with a uniform temperature distribution or a constant temperature profile over time in the immediate vicinity of the part during operation and machining. [Brief description of the drawings]

[0091] Further advantages and features of the invention emerge from the following drawings.

[0092] [Figure 1] 1 shows a perspective view of a component holder with a support, a component holding tool, and a temperature control device. [Diagram 2] A top view of a component holder with a support, a component holding tool, and a temperature control device is shown. [Diagram 3] A side view of a component holder with a support, a component holding tool, and a temperature control device is shown. [Figure 4] 1 shows a cross-sectional view of a part holder with a part holding tool and a temperature control device with a pass-through for process media. [Diagram 5] 1 shows the top side of the temperature control device of the part holder. [Figure 6] 1 shows the underside of the temperature control device of the part holder. [Figure 7a] 1 illustrates an embodiment of the arrangement of heating elements in a temperature control layer of a temperature control device. [Figure 7b] 7b shows an embodiment of temperature zoning of the heating element arrangement of FIG. 7a. [Figure 8] 13 shows an embodiment of a further temperature control layer of a temperature control device comprising an arrangement of heating elements. [Figure 9] 1 shows an embodiment of a temperature control device with an arrangement of heating elements to form a square temperature zone. [Figure 10] 13 shows an embodiment of a further temperature control layer of the temperature control device with an arrangement of heating elements and temperature zones. [Figure 11] 1 illustrates an embodiment of a temperature control device. [Figure 12] 12 shows a side view of the component holder with the support, component holding tool and temperature control device of FIG. 11 . DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0093] FIG. 1 shows a perspective view of a component holder 1 including a support 100, a temperature control device 200, and a component holding tool 300 having a component contact surface 350 for receiving and holding any type of non-depicted component, such as a semiconductor wafer, a semiconductor package, a chip, a flip chip, an integrated circuit, a substrate, an optical element, an electronic element, an electro-optical element, or a combination thereof.

[0094] The component contact surface 350 may be adapted for a variety of shapes to support a component (not shown), including, for example, a triangle, a square, a trapezoid, a polygon, a quadrilateral, a rectangle, a polygon, a circle, an ellipse, an annulus, an arcuate shape, or any combination thereof.

[0095] A vacuum is typically used to hold the components (not shown) in place on the component contact surface 350 during operation and is provided as a process medium on the surface by openings (not shown) in the media lines 130, 131, 132, 133 and 134. Preferably, the process medium can also be distributed on the surface of the component contact surface 350 via additional recesses formed as half-channels preferably extending perpendicular to each other. The additional half-channel shaped recesses increase the intake surface of the components, resulting in a higher intake pressure and thus a higher thermal gradient between the component contact surface 350 and the components held in contact by the vacuum.

[0096] The component holder 1 is suitable for use in apparatus for processing non-depicted bondheads, non-depicted bond sites or components.

[0097] The component holder 1 may be used in any type of equipment or process step where an improved, preferably temperature-compensated, temperature behavior of the component holder is required in order to ensure a constant process temperature with a homogenous temperature distribution or with a constant temperature profile in time in the immediate vicinity of the component in operation, in particular for mechanically very stable large mass component holders with high heat capacity and thermal inertia due to their mass, for example in the case of TCB (thermo-compression bonding) with heated bonding inserts or heated chucks, as well as other assembly processes of semiconductor chips and their required holding tools.

[0098] The support 100 has a recess 101 into which the temperature control device 200 is inserted with a press fit and / or form fit. The temperature control device 200 has a number of electrical contacts 160, 161, shown as dashed lines, arranged on two opposite sides. The electrical contacts 160, 161 are preferably also PTC thermistor heating elements and are arranged for electrical contact with and control of hidden temperature zones (not shown) with embedded electrical heating elements (not shown), which are preferably connected in parallel and / or arranged for electrical contact with and reading by non-depicted temperature sensors. The electrical contacts 160, 161 can be provided, for example, using contact spring pins to allow quick replacement. Using more than one contact spring pin per contact makes it possible to avoid overloading of the contact spring pins. The electrical contact can also be achieved via a rigid contact, for example in the form of a pin, or a surface contact.

[0099] Also not visible are openings 142 and 143 in bottom surface 51 which, in greater number, also serve to supply and / or exhaust at least one medium to supply and / or exhaust at least a portion of positive or negative thermal energy for temperature control.

[0100] The support 100 has eight holder clips 110 , 111 , 112 , 113 , 114 , 115 , 116 and 117 arranged in opposing pairs for fixing the temperature control device 200 .

[0101] Further shown is a holder 120 which is one of two holders 120, 121 arranged opposite to each other during operation for fixing the component holding tool 300.

[0102] The component holder 350 is preferably centered and aligned with the temperature control device 200. It may be advantageous to take into account thermal expansion during fixturing and accordingly mechanical tolerances of the holders 120, 121, as well as to use additional fixturing by the vacuum already provided to the component holder, as well as additional support fixturing of the component holding tool 300.

[0103] Figure 2 is a top view of the component holder 1 of Figure 1 with additional details shown, comprising a support 100, a component holding tool 300 in a recess 101 and a temperature control device 200 which is secured to the recess during operation by two illustrated holders 120, 121 together with a vacuum fixation.

[0104] In particular, the recess 101 simplifies handling as a means of guidance in case of quick tool change, although embodiments without the recess 101 are also possible.

[0105] The two holders 120, 121 lie on holder clips 112, 115 and 116, 117, which are shown in pairs in dashed lines. The holder clips 110, 111 and 114, 115 are not covered.

[0106] Between the marked openings of the media line sections 130, 131, 132, 133 and 134 one can see the semi-channel shaped u-shaped intersecting recesses for holding the component on the component contact surface 350 during operation. As already explained, the vacuum clamping surface of the component is increased by the additional channel shaped recesses, which results in a higher suction pressure and thus a higher thermal gradient between the component contact surface 350 and the applied vacuum clamping component.

[0107] 3 shows a side view of the component holder 1 with the support 100, the component holding tool 300, the temperature control device 200, and the holder 120 resting on the holder clips 117, 116. The side view shows possible locations of embeddable temperature control layers 201, 202, 203, 204 and associated elements for electrical or fluidic operation of the temperature control device 200, some of which are shown by dashed lines. Similarly, the media line section 140 and the media line section 141 are shown by dashed lines and extend through the press-fit and / or form-fit bottom surface 251 of the temperature control device 200 and the recess 101 of the support 100. Preferably, a vacuum can be attached through the two media lines 140 and 141 during operation to provide additional support for the temperature control device 200 in the recess 101.

[0108] Within temperature control device 200, media line section 140 and media line section 141, in addition to supporting temperature control device 200 in recess 101 during operation, also serve to supply and / or evacuate at least a portion of positive or negative thermal energy through media line section 139 for temperature control by temperature control layer 204, preferably via at least one medium such as compressed air, nitrogen, vacuum or another process gas used in processing the part. Supply and / or evacuation is accomplished by unillustrated openings 142 and 143 in the surface of bottom surface 251, through which media line section 139 extends.

[0109] For clarity, the side view of FIG. 3 is shown as a cross-section in FIG.

[0110] FIG. 4 shows a cross-sectional view of a component holder 1 with a component holding tool 300 and a temperature control device 200 held in a recess 101 of a support 100 by holders 110,115.

[0111] In use, the part holding tool 300 can be additionally secured by a vacuum on the top surface 250 of the temperature control device 200. Thus, a vacuum can be applied using the media line sections 138 and 136 formed by the pass-throughs of the support 100 and the temperature control device 200 in use.

[0112] The support 100 has media line sections 140 and 141, media line sections 131, 133, and a pass-through for process media in the form of media line section 140, media line section 139 embedded in temperature control device 200, and media line section 141. In operation, a vacuum can be applied by media line sections 131, 133, and 130 to support the part at part contact surface 350.

[0113] The media line section 139 embedded in the temperature control layer 204 is parallel to the temperature control layers 201, 202, 203 as shown in the figure, preferably meandering in the XY plane drawn around at least a portion of the media line sections 131, 130, 130 as shown in the figure. The media line section 139 serves the temperature control layer 204 to supply and / or drain at least one of the available media for supplying and / or draining at least a portion of the positive or negative thermal energy for temperature control. It has proven advantageous, especially in the case of fast or short heating or cooling cycles, to embed not a single media line section 139 but several media line sections, preferably running parallel to each other, in the temperature control layer 204. Furthermore, it has proven advantageous to at least partially divide the media line sections into single channels of parallel channel shape, whose course shape is adapted to the available spatial volume and the required temperature profile. Practice has shown that channel-shaped division of media line sections improves the static behavior of the temperature control device when the number of media line sections is increased, thereby allowing increased supply and / or discharge of thermal energy in the same area.

[0114] The temperature control layers 201 , 202 and 203 are interconnected by electrical through-hole connections 150 and may be electrically contacted by electrical contacts 160 and 161 , for example by non-delineated spring contact pins in recesses 101 of the support 100 .

[0115] FIG. 5 shows the top surface 250 of the temperature control device 200 of the component holder 1 with the centrally located media line section 130 and media line sections 131, 132, 133, 134, 135, 136, 137 and 138 each leading to the top surface 250.

[0116] 6 shows the bottom surface 251 of the temperature control device 200 of the component holder 1 with a centrally located media line section 130. Around the centrally located media line section 130, the media line sections 131, 132, 133, 134, 135, 136, 137 and 138 are arranged in a cross shape. Also visible in this embodiment are both openings 142 and 143 in the bottom surface 251. Between these two openings 142 and 143, the media line section 139 extends for the supply and / or exhaust of at least a portion of the positive or negative thermal energy.

[0117] Figures 7a and 7b show the same embodiment of the arrangement of heating elements 301a, 302a, 303a, 303b, 304a, 305a, 306a of the temperature control layers 201, 202, 203 of the non-depicted rectangular temperature control device 200, and the reference numbers and temperature zones are distributed in the two figures 7a and 7b such that the temperature zones are only depicted in Figure 7b for clarity. Figure 7a shows the arrangement of heating elements 301a, 302a, 303a, 303b, 304a, 305a, 306a of the temperature control layers 201, 202, 203 of the non-depicted rectangular temperature control device 200, which is suitable for parts with a rectangular base surface. Heating elements 301a, 302a, 303a, 303b, 304a, 305a, 306a embedded in temperature control device 200 each have electrical through-hole connections 150 at either end for electrical contact, and electrical contacts 160 provided, only three of which are shown for clarity. Also, for this embodiment of temperature control layers 201, 202, 203, media line sections 130, 131, 132, 133, 134, 135, and 137 (shown here as having circular cross-sections) can be seen in corresponding recesses in the serpentines of heating elements 301a, 302a, 303a, 303b, 304a, and 305a. The detailed design of the cross sections of the media line sections 130, 131, 132, 133, 134, 135 and 137 may also comprise optional, but preferably channel shape divisions in this embodiment, and should not be limited by the schematic diagram used to keep an overview when interpreting this disclosure. In particular, embodiments of the temperature control layer may also have more or less media line sections than are shown diagrammatically in FIG. 7, depending on the temperature zone requirements.

[0118] In this embodiment, the heating elements 301a, 302a, 303a, 303b, 304a, 305a, 306a are divided by an electrical circuit (not shown) of the heating elements 301a, 302a, 304a, 305a and 306a into temperature zones 301, 302, 304, 305 and 306 shown in Figure 7b. Two heating elements 303a, 303b are connected together in parallel to form a further temperature zone 303.

[0119] Fig. 8 shows an embodiment of the temperature control layers 201, 202, 203 of the temperature control device 200 with an example arrangement of heating elements of components with rectangular base surfaces that can be arranged together with further temperature control layers in the temperature control device 200. The arrangement of the heating elements 31a, 32a, 33a, 33b, 34a, 35a, 36a corresponds to the arrangement of the heating elements 301a, 302a, 303a, 303b, 304a, 305a, 306a shown in Fig. 7. Even though their respective serpentine shapes are different from each other, the respective electrical through-hole connections 150 are aligned with each other in the case of the superimposed arrangement of the two temperature control layers, so that the heating elements of the two temperature control layers in Figs. 7 and 8 can be electrically interconnected in the temperature control device 200 to form temperature zones of the temperature control device 200 using electrical connecting lines not shown. Specifically, heating elements 301a, 302a, 303a, 303b, 304a, 305a, 306a of Fig. 7 may be interconnected in parallel with heating elements 31a, 302a, 33a, 33b, 34a, 35a, 36a of Fig. 8 such that heating elements 301a and 31a form a first temperature zone 31 in the spatial volume of the resulting composite layer of temperature control device 200. Heating elements 302a and 32a form a second temperature zone 32 in the spatial volume of the resulting composite layer of temperature control device 200. Heating elements 304a and 34a, 305a and 35a, and 306a and 36a also form respective temperature zones 304, 305, and 306 in the spatial volume of the resulting composite layer of temperature control device 200 in corresponding parallel connections. The heating elements 303a and 303b and 33a and 33b are already connected in parallel to each other in the plane of the temperature control layers 201, 202, 203 shown, thus forming temperature zones 303 and 33 in the composite layer, each acting in a plane and spatial volume.

[0120] The electrical circuitry of the heating elements is not shown for clarity. In particular, the combination of heating elements to form temperature zones acting in both planar and spatial volumes in the resulting composite layer of the temperature control device is particularly advantageous for temperature control, depending on the requirements of the process-related temperature profile, such that one or more regions of the part contact surface of the part holding tool are thermally shielded from the support for processing of the part.

[0121] FIG. 9 shows an embodiment of the temperature control layer 201, 202, 203 of the temperature control device 200. The temperature control layer 201, 202, 203 has a square-shaped temperature zone 301 with a first heating element 301a in the middle and four further heating elements 301b, 301c, 301d and 301e evenly arranged around the heating element 301a. The temperature zones 301 are arranged around the outer edge of the temperature control layer 201, 202, 203, preferably symmetrically, as shown in the figure. The electrical circuit of the heating elements is not shown for clarity. The heating elements are preferably all designed as PTC thermistor heating elements, and the outer heating elements 301b, 301c, 301d and 301e may be connected in pairs in parallel, adjacent or opposite pairs, respectively, depending on the requirements of the temperature profile.

[0122] 10 shows an embodiment of a rectangular temperature control layer 201, 202, 203 of a temperature control device 200 (not shown) with an advantageous arrangement of temperature zones 301, 302, 303, 304, 305 and 306 for one or more components (not shown) with a square or rectangular base area. The temperature control layer 201, 202, 203 has a square-shaped first temperature zone 301 with a first heating element 301a in the center and four further heating elements 301b, 301c, 301d and 301e evenly arranged around the heating element 301a. The temperature zones 301 are preferably symmetrically arranged around the outer edge of the temperature control layer 201, 202, 203. The second heating element 301b of the temperature zone 301, the third heating element 301c of the temperature zone 301, the fourth heating element 301d of the temperature zone 301 and the fifth heating element 301d of the first temperature zone 301 each have a polygonal shape so as to surround the first heating element 301a, which is uniformly arranged in the XY plane. In this embodiment, the polygonal shape is in each case angular or L-shaped. Also, the first heating element 301a of the first temperature zone 301 has a meander-shaped recess in the center, through which the media line section 130 passes vertically through the image plane XY. The heating elements are preferably all configured as PTC thermistor heating elements. The first temperature zone 301 is surrounded by temperature zones 302 arranged in a concentric circle. The temperature zone 302 also includes four evenly spaced polygons, each angled or L-shaped, surrounding the five heating elements of the first temperature zone in the XY plane, i.e., the plane of the composite layer of the temperature control device 200 not shown.

[0123] FIG. 11 shows an embodiment of a temperature control device 200 with a composite layer including temperature control layers 201, 202, 203 and 204, where for clarity only the temperature control layer 204 is shown in the composite layer. A perspective view of the bottom surface of the temperature control device 200 with a transparent drawing of the bottom surface 251 allows a better understanding of the composite layer. The temperature control layer 204 comprises a media line section 139 extending in the composite layer in a serpentine pattern and a media line section 1390 extending in the composite layer in a serpentine pattern. In this embodiment, the two media line sections are arranged in a mirror image of each other so that the serpentine paths interdigitate. Furthermore, the two media line sections 139 and 1390 are each partially divided into at least sections or into single channels 144a, 144b, 144c, 144d in the shape of channels extending parallel to each other, and their course shapes are adapted to the available space volume and the required temperature profile. The recessed openings 142 and 143 are clearly visible on the bottom surface 251, which in greater numbers also serve to supply and / or drain at least one medium to and / or from the media line sections 139, 1390 for supplying and / or draining at least a portion of the positive or negative thermal energy for temperature control, and the channel shape division 144 can be easily recognized by a perspective view at each opening 142 of the media line section 139. In fact, it is shown that the channel shape division 144 of the media line sections improves the static behavior of the temperature control device 200 when the number of media line sections increases, so that an increased supply and / or drain of thermal energy is possible in the same area of ​​the temperature control layer 204. Also, in this embodiment of the temperature control layer 204, the media line sections 130, 132, 134, 136, 137 and 138 are partially recognizable in the corresponding recesses of the media line sections 139 and 1390.

[0124] FIG. 12 shows a cross-sectional view of the part holder 1 with a partially depicted support 100, which supports the temperature control device of FIG. 11 with holder clips 110 and 115 as well as other not depicted holder clips. A part holding tool 300 with a part contact surface 350 is placed on the upper surface of the temperature control device 200. The contacts 160 and 161 of the temperature control device 200 for electrical contact of the corresponding temperature control layers 201, 202, 203 in the composite layer of the temperature control device 200 are electrically contacted by contact spring pins 1600, which establish an electrical connection with the power supply and control unit of the temperature control device 200, not shown. The contact spring pins 1600 are embedded in the support 100 and the part holder 1. Furthermore, the support 100 and the part holder 1 have a number of media line sections 136, 138, 140, 141 for the supply of thermal energy to and / or the discharge from the temperature control device 200 with the aid of a medium that is an energy carrier, preferably a liquid or gas process medium. Furthermore, the cross-sectional view provides an advantageous arrangement and embodiment of the channel shape division 144 of the two media line sections 139 and 1390 into single channels 144a, 144b, 144c, 144d that run parallel to one another in at least a section or part of the composite layer of the temperature control device 200. Furthermore, the press-fit and / or form-fit connection between the support 100 and the temperature control device 200 and the press-fit and / or form-fit connection between the temperature control device 200 and the component holding tool 300 show media lines (not labeled) formed from the media line sections 130, 130a, 131, 131a, 136, 138, 140 and 141. The media lines (not labeled) thus formed also serve to supply and / or exhaust at least one medium to and / or from the media line sections for supplying and / or exhausting at least a portion of the positive or negative thermal energy for temperature control. [Explanation of symbols]

[0125] List of reference numbers 1 Part holder 100 support 101 Recess 110 Holder clip 111 Holder clip 112 Holder clip 113 Holder Clip 114 Holder Clip 115 Holder Clip 116 Holder Clip 117 Holder Clip 120 Holder 121 Holder 130 Media Line Section 131 Media Line Section 131a Media Line Section 132 Media Line Section 133 Media Line Section 133a Media Line Section 134 Media Line Section 135 Media Line Section 136 Media Line Section 137 Media Line Section 138 Media Line Section 139 Media Line Section 1390 Media Line Section 140 Media Line Section 141 Media Line Section 142 Opening 143 Opening 144 Channel Shape Division 144a Single Channel 144b single channel 144c single channel 144d Single Channel 150 Electrical through-hole connection 160 Electrical Contacts 161 Electrical Contacts 1600 Contact Spring Pin 200 Temperature control device 201 Temperature Control Layer 202 Temperature Control Layer 203 Temperature Control Layer 204 Temperature Control Layer 250 Top of temperature control device 251 Bottom of temperature control device 300 Parts Holding Tools 301 Temperature Zone 301a Heating element / PTC thermistor heating element 301b Heating element / PTC thermistor heating element 301c Heating element / PTC thermistor heating element 301d Heating element / PTC thermistor heating element 301e Heating element / PTC thermistor heating element 302 Temperature Zone 302a Heating element / PTC thermistor heating element 302b Heating element / PTC thermistor heating element 303 Temperature Zone 303a Heating element / PTC thermistor heating element 303b Heating element / PTC thermistor heating element 304 Temperature Zone 304a Heating element / PTC thermistor heating element 304b Heating element / PTC thermistor heating element 305 Temperature Zones 305a Heating element / PTC thermistor heating element 305b Heating element / PTC thermistor heating element 306 Temperature Zones 306a Heating element / PTC thermistor heating element 306b Heating element / PTC thermistor heating element 350 Part contact surface 400 Temperature Sensor 31a Heating element / PTC thermistor heating element 32a Heating element / PTC thermistor heating element 33a Heating element / PTC thermistor heating element 33b Heating element / PTC thermistor heating element 34a Heating element / PTC thermistor heating element 35a Heating element / PTC thermistor heating element 36a Heating element / PTC thermistor heating element

Claims

1. A component holder (1) for processing a component, the component holder (1) comprising, as elements, a support (100), a component holding tool (300) having a component contact surface (350), and a temperature control device (200), the temperature control device (200) being arranged on the support (100) such that, relative to the support (100), one or more areas of the component contact surface (350) of the component holding tool (300) can be temperature-controlled to a predetermined process temperature for processing the component by positive or negative thermal energy, thereby thermally shielding one or more areas of the component contact surface (350) of the component holding tool (300) from the support (100) for the processing of the component.

2. 2. The part holder (1) according to claim 1, wherein the support (100) and the temperature control device (200) each have at least one media line (130, 131, 132, 133, 134, 135, 136, 137, 138, 139, 140, 141) each arranged such that the support (100) is connected to the temperature control device (200) and the temperature control device (200) is both press-fit and / or form-fit connected to the part holding tool (300), thereby making it possible to supply or discharge at least a portion of the positive or negative thermal energy for temperature control, preferably for the processing of the part, by at least one medium.

3. 3. The component holder (1) of claim 1 or claim 2, wherein the temperature control device (200) comprises one or more temperature zones (301, 302, 303, 304, 305, 306) that supply positive thermal energy to the one or more regions of the component contact surface (350).

4. 4. The component holder (1) according to claim 3, wherein each temperature zone (301, 302, 303, 304, 305, 306) comprises one or more electric heating elements (301a, 301b, 302a, 302b, 303a, 303b, 304a, 304b, 305a, 305b, 306a, 306b).

5. 4. The component holder (1) of claim 3, wherein one or more of the temperature zones (301, 302, 303, 304, 305, 306) comprises two or more PTC thermistor heating elements (301a, 301b, 302b, 303a, 303b, 304a, 304b, 305a, 305b, 306a, 306b) electrically connected in parallel.

6. 6. A component holder (1) according to claim 4 or claim 5, wherein each of the one or more temperature zones (301, 302, 303, 304, 305, 306) is arranged to be electrically connected to one of n power sources, each of the electrical energy supplies being arranged to provide a defined and / or controlled supply of electrical energy to one of the temperature zones (301, 302, 303, 304, 305, 306).

7. 7. The component holder (1) according to claim 3, wherein at least one (301) of the n temperature zones is arranged in an inner central region of the component contact surface (350) and at least one further temperature zone (302, 303, 304, 305, 306) is arranged in one or more outer regions around the inner central region of the component contact surface (350).

8. 6. The component holder (1) according to claim 4 or claim 5, wherein the one or more heating elements (301a, 301b, 302, 302b, 303a, 303b, 304a, 304b, 305a, 305b, 306a, 306b) or the one or more PTC thermistor heating elements (301a, 301b, 302, 302b, 303a, 303b, 304a, 304b, 305a, 305b, 306a, 306b) are deposited as a thin film.

9. 9. The component holder (1) of any one of claims 1 to 8, wherein the component contact surface (350) comprises a triangle, a square, a trapezoid, a polygon, a square, a rectangle, a circle, an ellipse, a torus, an arcuate shape, or any combination thereof.

10. 10. The component holder (1) of any one of claims 3 to 9, wherein one or more of the temperature zones (301, 302, 303, 304, 305, 306) comprises a triangular, square, trapezoidal, polygonal, quadrilateral, rectangular, circular, elliptical, linear, toric, arcuate, or any combination thereof.

11. In the case of multiple temperature zones, a first temperature zone (301) is disposed in a central region of the component contact surface (350), a second temperature zone (302) is disposed adjacent to and around a first edge of the first temperature zone (301), a first PTC thermistor heating element (303a) of a third temperature zone (303) is disposed adjacent to and around a second edge of the first temperature zone (301), and a fourth temperature zone (304) is disposed adjacent to and around a second edge of the first temperature zone (301).

10. The component holder (1) according to claim 3, wherein a second PTC thermistor heating element (303b) of the third temperature zone (303) is disposed adjacent to and around a third edge of the first temperature zone (301), and a second PTC thermistor heating element (303b) of the third temperature zone (303) is disposed adjacent to and around a fourth edge of the first temperature zone (301), the first temperature zone (301) comprising a plurality of parallel-connected PTC thermistor heating elements (301a, 301b, 301c, 301d, 301e).

12. 11. The component holder (1) of claim 10, wherein a first PTC thermistor heating element (303a) of a third temperature zone (303) is disposed adjacent to and around a first edge of the second PTC thermistor heating element (302b) of the second temperature zone (302) and a second PTC thermistor heating element (303b) of the third temperature zone (303) is disposed adjacent to and around a first edge of the first PTC thermistor heating element (303a) of the third temperature zone (303), the third temperature zone (303) comprising a plurality of PTC thermistor heating elements (303a, 303b) connected in parallel.

13. Component holder (1) according to any one of the preceding claims, wherein the component holder (1) further comprises one or more temperature sensors (400).

14. 14. A method of using a component holder (1) according to any one of claims 1 to 13 for controlling the temperature of one or more regions of the component contact surface (350), the method comprising controlling a relative temperature difference between one or more temperature zones and / or between one or more PTC thermistor heating elements of a temperature zone during a process step.

15. 15. A method of using a component holder (1) according to claim 14, the method comprising controlling relative temperature differences between one or more temperature zones and / or between one or more PTC thermistor heating elements of a temperature zone to achieve a uniform distribution of the temperature of the component contact surface (350).

Images