Built-in electronic component

Abstract

To eliminate the inclination of a built-in electronic component when the built-in electronic component is fixed into an opening of a substrate through a filler resin.SOLUTION: A built-in electronic component 1 includes an electronic component body 2, an electrode group 3G which is formed on the lower surface of the electronic component body and is composed of a plurality of electrodes 3, and a frame 21 surrounding the periphery of the electrode group. The frame is preferably made of plating or a resin. In addition, the thickness of the frame and the thickness of the electrode are made approximately equal. Furthermore, the frame is formed between the outer periphery of the electronic component body and the electrode group. Furthermore, the frame is formed on the outermost periphery of the electronic component body. In addition, the frame surrounding the periphery of the electrode group is included on the surface of the electronic component body.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a built-in electronic component that is fixed in an opening of a board via a filled resin in a board with built-in components. [Background technology]

[0002] Surface mount devices (SMD) are known as an example of electronic components. Surface mount devices are used as built-in electronic components that are fixed in an opening of a substrate via a filling resin. In the technology disclosed in Patent Document 1, the opening of a core substrate is sealed with adhesive tape, an electronic component (capacitor) is fixed on the adhesive tape, and then a resin filler is filled in the gap between the core substrate and the electronic component.

[0003] 6(a) and (b) show a side view and a bottom view of one embodiment of a conventional built-in electronic component. As shown in Fig. 6(a) and (b), conventional built-in electronic component 51 has a plurality of electrodes 53 formed on the bottom surface of electronic component body 52, protruding from the bottom surface of electronic component body 52 by a thickness T, for electrical connection with an external element. Here, the plurality of electrodes 53 are formed as an electrode group near the center of electronic component body 52. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2009-212484 A Summary of the Invention [Problem to be solved by the invention]

[0005] 7, in the technology disclosed in Patent Document 1, an opening 62 in a core substrate 61 is closed with an adhesive tape 63, and when an electronic component to be built-in 51 is fixed onto the adhesive tape 63, the electronic component body 52 is fixed in a state in which a space S exists with the electronic component body 52 floating above the adhesive tape 63 by a thickness T53 of the protruding electrodes 53. Therefore, when a resin filler 64 is filled into the gap between the core substrate 61 and the electronic component to be built-in 51, the resin filler 64 enters the space S between the electronic component body 52 and the adhesive tape 63 other than the electrodes 53, and the electronic component to be built-in 51 floats from the adhesive tape 63 and becomes tilted.

[0006] In this case, the depth of the via holes leading to the electrodes 53 of the built-in electronic component 51 differs for each electrode 53, and the diameter of the via holes on the electrodes 53 becomes smaller in the deeper via holes. This causes a problem of reduced connection reliability between the electrodes 53 and the via conductors in the small-diameter via holes. [Means for solving the problem]

[0007] The embedded electronic component of the present invention is an embedded electronic component that is fixed within an opening in a substrate via a filled resin, and includes an electronic component body, an electrode group consisting of a plurality of electrodes formed on the underside of the electronic component body, and a frame surrounding the periphery of the electrode group. [Brief description of the drawings]

[0008] [Figure 1] 1A and 1B are a side view and a bottom view, respectively, for explaining one embodiment of a built-in electronic component according to the present invention. [Diagram 2] 1A to 1C are diagrams for explaining an embodiment when an internal electronic component according to the present invention is mounted on a component-embedded substrate. [Diagram 3] 1A and 1B are diagrams for explaining a preferred embodiment of a built-in electronic component according to the present invention. [Figure 4] 1A to 1C are diagrams for explaining a preferred embodiment of a built-in electronic component according to the present invention; [Diagram 5] 1A and 1B are diagrams for explaining an embodiment of a built-in electronic component according to the present invention; [Figure 6] 1A and 1B are a side view and a bottom view, respectively, for explaining one embodiment of a conventional built-in electronic component. [Figure 7] 1A and 1B are diagrams for explaining an embodiment when a conventional built-in electronic component is mounted on a component-embedded substrate. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] <About the built-in electronic component of the present invention> An embodiment of the built-in electronic component of the present invention will be described with reference to the drawings. In the example shown in Figures 1 to 5, the dimensions of each member, particularly the height dimension, are shown as different from the actual dimensions in order to make the features of the present invention easier to understand.

[0010] 1(a) and 1(b) respectively show a side view and a top view of an embodiment of an embedded electronic component according to the present invention. As shown in Figs. 1(a) and 1(b), an embedded electronic component 1 according to the present invention has a plurality of electrodes 3 formed on the lower surface of an electronic component body 2, protruding from the lower surface of the electronic component body 2 by a thickness T3 for electrical connection with an external element. Here, the plurality of electrodes 3 are formed as an electrode group 3G near the center of the electronic component body 2. The embedded electronic component 1 according to the present invention shown in Figs. 1(a) and 1(b) is characterized in that a frame 21 is formed to surround the periphery of the electrode group 3G.

[0011] In the built-in electronic component 1 according to the present invention having the above-mentioned configuration, as shown in FIG. 2, the opening 12 of the core substrate 11 is closed with the adhesive tape 13, and when the built-in electronic component 1 is fixed on the adhesive tape 13, a frame 21 is formed around the electrode group 3G. Therefore, the built-in electronic component 1 can be fixed on the adhesive tape 13 without any space between the electronic component body 2 and the adhesive tape 13. As a result, even if the resin filler 14 is filled between the core substrate 11 and the built-in electronic component 1, the resin filler 14 does not penetrate into the lower surface of the electronic component body 2. In this case, the depth of the via hole leading to the electrode 3 of the built-in electronic component 1 does not differ for each electrode 3, the diameter of the via hole on the electrode 3 does not change, and the connection reliability between the via conductor and the electrode 3 can be maintained.

[0012] <Preferred Examples of Built-in Electronic Components of the Present Invention> 1(a) and (b), frame 21 is preferably made of plated material or resin. In addition, when comparing plated material with resin material, plated frame 21 can be formed simultaneously when electrodes 3 are formed on the lower surface of electronic component body 2, and is therefore more preferable than resin frame 21, which needs to be formed separately from the formation of electrodes 3.

[0013] Furthermore, in the example shown in Figures 1(a) and (b), the present invention can be achieved if the thickness T21 of the frame 21 is greater than the thickness T3 of the electrode 3. However, making the frame 21 too thick results in waste, so it is preferable that the thickness T21 of the frame 21 and the thickness T3 of the electrode 3 are approximately equal.

[0014] Furthermore, in the example shown in Figures 1(a) and (b), the present invention can be achieved regardless of the position of frame 21 as long as it continuously surrounds the periphery of electrode group 3G. However, it is preferable that frame 21 be formed between the outer periphery of electronic component body 2 and electrode group 3G, as shown in the figures, because this is less likely to result in wasted space in the pattern of frame 21.

[0015] 1(a) and (b), the present invention can be achieved by forming frame 21 at a certain distance along the outer periphery of electronic component body 2, but the resin filler 14 will seep into the underside of electronic component body 2 by the distance that is set back. In the present invention, this degree of seepage is not particularly problematic, but it is even more preferable to form frame 21 along the outermost periphery of electronic component body 2 as shown in Figures 3(a) and (b), since this will completely prevent resin filler 14 from seeping into the underside of electronic component body 2.

[0016] 1(a) and 1(b), frame 21 is provided only on the underside of electronic component body 2, but as shown in Fig. 4, frame 21 can be formed on the underside of electronic component body 2 and also formed on the upper surface of electronic component body 2 at a position corresponding to frame 21 formed on the underside. In this case, warping of built-in electronic component 1 can be eliminated and infiltration of resin filler 14 into the underside of electronic component body 2 can be more effectively prevented than in the case where frame 21 is provided only on the underside, which is preferable.

[0017] <Another embodiment of the built-in electronic component of the present invention> In the above description, a capacitor has been used as an example of the built-in electronic component 1 of the present invention. However, the capacitor is only one example, and the present invention can be applied to any surface mount device (SMD) with exposed electrodes. For example, as shown in FIG. 5, the present invention can be applied to a built-in electronic component 1 having pad-shaped electrodes 32 protruding from the lower surface of a resin layer (solder resist layer) 31, as long as an electrode group 32G is surrounded by a frame 33. [Explanation of symbols]

[0018] 1 Built-in electronic components 2 Electronic component body 3 electrodes 3G electrode group 11 Core Board 12 Aperture 13 Adhesive Tape 14 Resin filler 21 slots 31 Resin layer 32 electrodes 32G electrode group 33 slots T3, T21 Thickness

Claims

1. An embedded electronic component that is fixed in an opening of a substrate via a filling resin, An electronic component body; an electrode group consisting of a plurality of electrodes formed on a lower surface of the electronic component body; A frame surrounding the electrode group; Includes.

2. 2. The built-in electronic component according to claim 1, wherein the frame is made of plating or resin.

3. 2. The built-in electronic component according to claim 1, wherein the thickness of said frame and the thickness of said electrodes are substantially equal.

4. 2. The built-in electronic component according to claim 1, wherein the frame is formed between an outer periphery of the electronic component body and the electrode group.

5. 2. The built-in electronic component according to claim 1, wherein the frame is formed on the outermost periphery of the electronic component body.

6. 2. The built-in electronic component according to claim 1, wherein a surface of the electronic component body includes a frame surrounding the periphery of the electrode group.

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