Systems and methods for designing components used in thermal management applications

Abstract

To provide systems and methods for designing components used in thermal management applications.SOLUTION: Disclosed herein is a computer-implemented method of generating a three-dimensional structure for use in a thermal management component. The computer-implemented method of generating a three-dimensional structure for use in a thermal management component comprises selecting, by a processor, at least one three-dimensional element from a plurality of three-dimensional elements. The computer-implemented method of generating a three-dimensional structure for use in a thermal management component also comprises determining, by the processor, a surface area necessary to dissipate heat from a first fluid according to a desired temperature difference and a desired heat transfer coefficient. The computer-implemented method of generating a three-dimensional structure for use in a thermal management component further comprises generating, by the processor, the three-dimensional structure for the thermal management component by intercoupling a quantity of the selected three-dimensional elements whose combined surface area equals the determined surface area.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] FIELD OF THE DISCLOSURE This disclosure relates generally to component design, and more particularly to systems and methods for designing thermal management components such as those used in heat exchangers. [Background technology]

[0002] Currently, systems and methods for designing components used in thermal management applications start with designing the core. The core is the functional element of the thermal management system that transfers heat. The core design starts with sizing the core. This involves using periodically arranged cells or conduits with simple shapes (plate-and-fin and shell-and-tube structures are some common structures) and then optimizing the structure based on the thermal requirements of the thermal management application. However, this process is often driven by engineering knowledge and requires iterative steps to optimize the size of the structure. Such iterative sizing methods and design generation require significant time and are computationally limited due to the repetitive nature of the overall solution. In other words, the larger the core (core and corresponding number of consecutive cells), the longer and more computationally challenging is the process of optimizing the core. Thus, a new design method is needed that is computationally efficient while meeting the thermal requirements of the thermal management application and / or the specific shape / size required for the overall structure of which the thermal management component forms a part.

[0003] Furthermore, some applications require that the thermal management components have certain strength and load characteristics. Conventional plate and fin structures may not meet the structural requirements of some applications. Incorporating strength and load requirements into the design of thermal management components may require significant experimentation, resulting in undue delays and complexity. These shortcomings make such conventional techniques unsuitable for multiple function applications, such as thermal management components that are subject to mechanical loads. Summary of the Invention [Problem to be solved by the invention]

[0004] The subject matter of the present application has been developed in response to the current state of the art, and in particular in response to shortcomings of prior systems and methods for designing components used in thermal management applications that are not yet fully addressed by currently available technology. The subject matter of the present application has therefore been developed to provide a system and method for designing components used in thermal management applications that overcomes at least some of the above-mentioned shortcomings of the prior art.

[0005] The following is an illustrative list of examples of subject matter disclosed in this disclosure that may or may not be claimed. [Means for solving the problem]

[0006] Hereinafter, a computer-implemented method for generating a three-dimensional structure for use in a thermal management component is disclosed. The computer-implemented method for generating a three-dimensional structure for use in a thermal management component includes a step of selecting, by a processor, at least one three-dimensional element from a plurality of three-dimensional elements. The computer-implemented method for generating a three-dimensional structure for use in a thermal management component also includes a step of determining, by a processor, a surface area required to dissipate heat from a first fluid according to a desired temperature difference and a desired heat transfer rate. The computer-implemented method for generating a three-dimensional structure for use in a thermal management component further includes a step of generating, by a processor, a three-dimensional structure for use in a thermal management component by interlinking a number of selected three-dimensional elements having a combined surface area equal to the determined surface area. Example 1 of the present disclosure is characterized by the above-mentioned subject matter of this paragraph.

[0007] The step of selecting, by the processor, the three-dimensional element further includes a step of determining, by the processor, a performance factor based at least on a size and an aspect ratio of the three-dimensional element. The three-dimensional element is selected based at least on the performance factor satisfying a predefined threshold. Example 2 of the present disclosure is characterized by the above subject matter of this paragraph, and Example 2 also includes the subject matter according to Example 1 above.

[0008] The step of determining by the processor the surface area required to dissipate heat from the first fluid according to the desired temperature difference and the desired heat transfer rate further includes a step of determining by the processor a first amount of heat dissipated by the generated three-dimensional structure, and a step of determining by the processor a second surface area. The second surface area dissipates an amount of heat closer to the amount of heat dissipated by the surface area. Example 3 of the present disclosure is characterized by the above subject matter of this paragraph, and Example 3 also includes the subject matter according to any of Examples 1 to 2 above.

[0009] The amount of heat dissipated by the generated three-dimensional structure is determined by using thermal data associated with at least one selected three-dimensional element and simulating the rate of heat transfer through the generated three-dimensional structure. Example 4 of the present disclosure is characterized by the above subject matter of this paragraph, and Example 4 also includes the subject matter according to Example 3 above.

[0010] The surface area is determined based on a logarithmic mean temperature difference equation using the surface area, the first temperature difference, the heat transfer coefficient, and the second temperature difference of the second fluid, where the second fluid is used to adjust the temperature of the first fluid. Example 5 of the present disclosure is characterized by the above subject matter of this paragraph, and Example 5 also includes the subject matter according to any of Examples 1 to 4 above.

[0011] The computer-implemented method further includes receiving a desired shape of the thermal management component via an input device. A three-dimensional structure is generated such that the three-dimensional structure has the desired shape. Example 6 of the present disclosure features the above subject matter of this paragraph, and Example 6 also includes the subject matter according to any of Examples 1 to 5 above.

[0012] The first fluid is a fluid to be cooled in the heat exchanger, and the component forms part of the heat exchanger. Example 7 of the present disclosure features the subject matter described above in this paragraph, and Example 7 also includes the subject matter according to any of Examples 1 to 6 above.

[0013] The three-dimensional element comprises one or more triply periodic minimal surfaces.Example 8 of the present disclosure is characterized by the subject matter described above in this paragraph, and also includes the subject matter according to any of Examples 1 to 7 above.

[0014] Hereinafter, a system is further disclosed. The system includes a processor, an input device, a display device, and a memory device storing instructions. The memory device storing instructions, when executed by the processor, causes the processor to at least: select a three-dimensional element from a plurality of three-dimensional elements; determine a surface area required to dissipate heat from a first fluid according to a desired first temperature difference and a desired heat transfer rate; generate a three-dimensional structure for use in a thermal management component by interlinking a number of the selected three-dimensional elements having a combined surface area equal to the determined surface area; and display the generated three-dimensional structure for use in a thermal management component via a display device. Example 9 of the present disclosure is characterized by the above-mentioned subject matter of this paragraph.

[0015] The instructions further cause the processor to determine a performance factor based at least on a size and an aspect ratio of the three-dimensional element. The three-dimensional element is selected based at least on the performance factor satisfying a predefined threshold. Example 10 of the present disclosure is characterized by the above subject matter of this paragraph, and Example 10 also includes the subject matter according to Example 9 above.

[0016] The instructions further cause the processor to receive an input of a desired heat transfer rate via the input device, determine a first surface area, determine a first estimated heat transfer rate, and determine a second surface area corresponding to the first estimated heat transfer rate. The second surface area dissipates an amount of heat closer to the amount of heat dissipated by the first surface area. Example 11 of the present disclosure features the above subject matter of this paragraph, and Example 11 also includes the subject matter of any of Examples 9 to 10 above.

[0017] The instructions further cause the processor to determine a first estimated heat transfer rate by simulating a rate of heat transfer over the first surface area and equating the first estimated heat transfer rate to a heat transfer rate associated with the simulated rate of heat transfer. Example 12 of the present disclosure features the above subject matter of this paragraph, and Example 12 also includes the subject matter of any of Examples 9-11 above.

[0018] The instructions further cause the processor to determine the surface area based on a logarithmic mean temperature difference equation using the surface area, the first temperature difference, the heat transfer coefficient, and a second temperature difference of a second fluid, where the second fluid is used to adjust the temperature of the first fluid. Example 13 of the present disclosure features the above subject matter of this paragraph, and Example 13 also includes the subject matter according to any of Examples 9 to 12 above.

[0019] The instructions further cause the processor to receive via the input device a desired shape of the thermal management component. A three-dimensional structure is generated such that the three-dimensional structure has the desired shape. Example 14 of the present disclosure features the above subject matter of this paragraph, and Example 14 also includes the subject matter according to any of Examples 9 to 13 above.

[0020] The first fluid is a fluid to be cooled in the heat exchanger, and the thermal management component forms part of the heat exchanger. Example 15 of the present disclosure features the subject matter described above in this paragraph, and Example 15 also includes the subject matter according to any of Examples 9 to 14 above.

[0021] The three-dimensional element comprises one or more triply periodic minimal surfaces.Example 16 of the present disclosure is characterized by the subject matter described above in this paragraph, and also includes the subject matter according to any of Examples 9 to 15 above.

[0022] In addition to the above, a non-transitory computer-readable storage medium is disclosed below that stores instructions, which when executed by a processor, causes the processor to select a three-dimensional element from a plurality of three-dimensional elements, determine a surface area required to dissipate heat from a first fluid according to a desired first temperature difference and a desired heat transfer rate, generate a three-dimensional structure for use in a thermal management component by interlinking a number of selected three-dimensional elements having a combined surface area equal to the determined surface area, and display the generated three-dimensional structure for use in a thermal management component via a display device. Example 17 of the present disclosure is characterized by the above-mentioned subject matter of this paragraph.

[0023] The instructions further cause the processor to receive an input of a desired heat transfer rate via the input device, determine an amount of heat dissipated by the generated three-dimensional structure, and determine a second surface area. The second surface area dissipates an amount of heat closer to the amount of heat dissipated by the first surface area. The amount of heat dissipated by the generated three-dimensional structure is determined by using thermal data associated with at least one selected three-dimensional element and simulating a rate of heat transfer by the generated three-dimensional structure. Example 18 of the present disclosure is characterized by the above-mentioned subject matter of this paragraph, and Example 18 also includes the subject matter according to Example 17 above.

[0024] The instructions further cause the processor to determine the surface area based on a logarithmic mean temperature difference equation using the surface area, the first temperature difference, the heat transfer coefficient, and a second temperature difference of a second fluid, where the second fluid is used to adjust the temperature of the first fluid. Example 19 of the present disclosure features the above subject matter of this paragraph, and Example 19 also includes the subject matter according to any of Examples 17-18 above.

[0025] The instructions further cause the processor to receive via the input device a desired shape of the thermal management component. A three-dimensional structure is generated such that the three-dimensional structure has the desired shape. Example 20 of the present disclosure features the above subject matter of this paragraph, and Example 20 also includes the subject matter according to any of Examples 17-19 above.

[0026] In one or more examples and / or embodiments, the described features, structures, advantages and / or characteristics of the protected subject matter of the present disclosure may be combined in any suitable manner. In the following description, numerous specific details are set forth to provide a thorough understanding of examples of the protected subject matter of the present disclosure. Those skilled in the art will appreciate that the protected subject matter of the present disclosure may be practiced without one or more of the specific features, details, components, materials and / or methods of a particular example or embodiment. However, some examples and / or embodiments may conceive of other features and advantages that may not be present in all examples or embodiments. Furthermore, in some cases, well-known structures, materials, or operations have not been shown or described in detail to avoid obscuring aspects of the protected subject matter of the present disclosure. The features and advantages of the protected subject matter of the present disclosure will become more fully apparent from the following description and the appended claims, and can be understood by the practice of the protected subject matter as set forth below.

[0027] In order that the effects of the protected subject matter may be more readily understood, a more particular description of the protected subject matter briefly described above will now be given, with reference to some examples which are illustrated in the accompanying drawings, in which the protected subject matter will be described and explained with greater specificity and detail, with the understanding that the drawings are not necessarily drawn to scale, that they merely illustrate some examples of the protected subject matter, and that therefore they should not be considered as limiting the scope of the protected subject matter. [Brief description of the drawings]

[0028] [Figure 1] FIG. 1 is a schematic block diagram of a system for designing components used in thermal management applications in accordance with one or more examples of the present disclosure. [Diagram 2]2 is a schematic block diagram of a data management device used by components of the system of FIG. 1 in accordance with one or more examples of the present disclosure. [Diagram 3] FIG. 1 is a schematic flow diagram of a method for designing components for use in thermal management applications, in accordance with one or more examples of the present disclosure. [Figure 4] FIG. 2 is a diagram of a three-dimensional structure having triply periodic minimal surfaces (TPMS), in accordance with one or more examples of the present disclosure. [Figure 5A] FIG. 2 is an exposed view of a three-dimensional structure in accordance with one or more examples of the present disclosure. [Figure 5B] FIG. 1 is a diagram of a three-dimensional structure according to one or more examples of the present disclosure. [Figure 5C] FIG. 1 is a diagram of a three-dimensional structure according to one or more examples of the present disclosure. [Figure 5D] FIG. 1 is a diagram of a three-dimensional structure according to one or more examples of the present disclosure. [Figure 6A] FIG. 1 is a diagram of components used in applying thermal management in accordance with one or more examples of the present disclosure. [Figure 6B] 6B illustrates a three-dimensional structure that may be incorporated into a component, such as the component of FIG. 6A, in accordance with one or more examples of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0029] The use of "one example," "one example," or similar phrases throughout this specification means that the particular form, structure, or characteristic described in connection with that example is included in at least one example of the present disclosure. Each occurrence of the phrase "in one example," "in one example," or similar phrases throughout this specification may, but does not necessarily, refer to the same example. Similarly, use of the term "embodiment" means an embodiment having the particular form, structure, or characteristic described in connection with one or more examples of the present disclosure, but an embodiment may relate to one or more examples unless a clear connection is made to the contrary.

[0030] The systems and methods disclosed in this disclosure allow for the design of components used in thermal management applications. The heat exchanger uses thousands of cells, i.e., continuous units of a three-dimensional structure, to create a large surface area in the thermal management component. This large surface area is used for heat exchange. In one example, the thermal management component cools a first fluid passing through the body of the thermal management component by passing a cooler second fluid across the large surface area of ​​the three-dimensional structure. In a second example, the first fluid passes through cavities in the three-dimensional structure. In another example, instead of the first fluid passing through the body of the heat exchanger, the thermal management component is used to dissipate heat from components that generate it. In some of these examples, three-dimensional structures in the form of long fins or tubes are used to maximize the surface area in the thermal management component. This may be referred to as a plate-and-fin or shell-and-tube heat exchanger. In another example, the thermal management component is used in a multi-fluid heat exchanger. In another example, the thermal management component is used in a phase change heat exchanger.

[0031] While plate-and-fin heat exchangers can be modified to support a variety of thermal management applications and have readily determinable heat transfer characteristics, such designs may require total volumes that exceed the spatial constraints of a particular application, and may not provide a completely optimized solution since the core structure is comprised of a periodic arrangement of the cells or conduits. In most thermal management devices, the temperature differential varies across the core envelope. Thus, in some instances, a truly optimized solution is one that is not periodic but reflects the temperature differential across the envelope.

[0032] In other words, to achieve a particular heat transfer exchange rate with a plate-and-fin structure, a designer must determine the surface area and therefore dimensions of the structure, but such dimensions may not necessarily allow the design to work within the constraints of the size and / or shape requirements of a particular application, resulting in poor performance or making the structure less than ideal for a particular application.

[0033] In various examples, the systems and methods of the present disclosure generate structures that conform to the shape of a particular application, incorporating interconnected three-dimensional elements, which may be any of a variety of three-dimensional elements or structures, such as three-dimensional elements having triply periodic minimal surfaces (TPMS) (i.e., TPMS elements), or any other thermally or structurally optimized shapes or structures. The surface area of ​​the three-dimensional elements (e.g., TPMS elements) is equal to the surface area determined according to the systems and methods of the present disclosure.

[0034] The disclosed system and method provide a design of a structure that is likely to meet thermal management requirements as well as size and / or shape requirements, because, by way of example, an optimization process that proceeds with a thermal requirement function is used to optimize the surface area required for a particular application based on the selected TPMS elements. A TPMS is a triply periodic minimal surface. Triply periodic means that the structure has units that are repeated along each of the three axes of a three-dimensional coordinate system. A minimal surface means a surface with zero mean curvature, where the mean curvature is the average of the principal curvatures of the surface.

[0035] 1, in various examples, the system 100 includes one or more information processing devices 102, one or more data management systems 104, one or more data networks 106, one or more servers 108, and one or more aircraft (not shown). While a particular number of information processing devices 102, data management systems 104, data networks 106, and servers 108 are shown in FIG 1 for some examples, those skilled in the art will understand in light of this disclosure that the system 100 may include any number of information processing devices 102, data management systems 104, data networks 106, servers, and aircraft.

[0036] In one example, the system 100 includes one or more information processing devices 102. The information processing device 102 may be implemented as one or more of a desktop computer, a laptop computer, a tablet computer, a smartphone, a smart speaker (e.g., Amazon Echo®, Google Home®, Apple HomePod®), an Internet of Things device, a security system, a set-top box, a game console, a smart TV, a smart watch, a fitness band or other wearable activity tracking device, an optical head mounted display (e.g., virtual reality headset, smart glasses, headphones, etc.), a High-Definition Multimedia Interface (HDMI)® or other electronic display dongle, a personal digital assistant, a digital camera, a video camera, or another computing device that includes a processor (e.g., a central processing unit (CPU), a processor core, a field programmable gate array (FPGA) or other programmable logic, an application specific integrated circuit (ASIC), a controller, a microcontroller, and / or other semiconductor integrated circuit device), a volatile memory and / or a non-volatile storage medium, a display, a connection to a display, and / or the like.

[0037] In some examples, the information processing device 102 is part of a three-dimensional design system, an artificial intelligence system, a simulation system, and / or the like.

[0038] In one example, the data manager 104 includes a field programmable gate array (FPGA) or other programmable logic, firmware for use with the FPGA or other programmable logic, microcode for execution on a microcontroller, an application specific integrated circuit (ASIC), a processor, a processor core, or other semiconductor integrated circuit device (e.g., one or more chips, dies, or other discrete logic hardware). In one example, the data manager 104 is mounted on a printed circuit board having one or more electrical lines or connections (e.g., to volatile memory, non-volatile storage media, network interfaces, peripheral devices, graphical / display interfaces, etc.). The hardware appliance includes one or more pins, pads, or other electrical connections configured to send and receive data (e.g., data in communication with one or more electrical lines on the printed circuit board, etc.) and one or more hardware circuits and / or other electrical circuits configured to perform various functions of the data manager 104.

[0039] In some examples, the semiconductor integrated circuit device or other hardware appliance of the data management apparatus 104 includes and / or is communicatively coupled to one or more volatile memory media, which may include, but are not limited to, random access memory (RAM), dynamic RAM (DRAM), cache, etc. In one example, the semiconductor integrated circuit device or other hardware appliance of the data management apparatus 104 includes and / or is communicatively coupled to one or more non-volatile memory media, which may include, but are not limited to, NAND flash memory, NOR flash memory, nano random access memory (nano RAM or "NRAM"), memory using nanocrystal interconnects, sub-10 nanometer silicon oxide process memory, graphene memory, Silicon-Oxide-Nitride-Oxide-Silicon (SONOS), resistive RAM (RRAM), programmable metallization cell (PMC), conductive-bridging RAM (CBRAM), magnetoresistive RAM (MRAM), dynamic RAM (DRAM), phase change RAM (PRAM or PCM), magnetic storage media (e.g., hard disk, tape), optical storage media, etc.

[0040] In one example, the data network 106 includes a digital communication network that transmits digital communication information. The data network 106 may include a wireless network such as a wireless cellular network, a local wireless network such as a Wi-Fi network, a Bluetooth network, a Near Field Communication (NFC) network, an ad-hoc network, and / or the like. The data network 106 may include a wide area network (WAN), a storage area network (SAN), a local area network (LAN) (e.g., a home network), an optical fiber network, the Internet, or other digital communication networks. The data network 106 may include two or more networks. The data network 106 may include one or more servers, routers, switches, and / or other network devices. The data network 106 may also include one or more computer-readable storage media, such as hard disk drives, optical drives, non-volatile memory, RAM, etc.

[0041] The wireless connection may be a cellular network. The wireless connection may also use a Wi-Fi network based on any of the Institute of Electrical and Electronics Engineers (IEEE) 802.11 standards. Alternatively, the wireless connection may be a Bluetooth® connection. Additionally, the wireless connection may use Radio Frequency Identification (RFID) communications, including RFID standards established by the International Organization for Standardization (ISO), the International Electrotechnical Commission (IEC), the American Society for Testing and Materials (ASTM®), the DASH7™ Alliance, and EPCGlobal®.

[0042] The wireless connection may be an infrared connection, including at least a connection conforming to the Infrared Physical Layer Specification (IrPHY) defined by the Infrared Data Association® (IrDA®). Alternatively, the wireless connection may be a cellular telephone network communication. All standards and / or connection types include current versions and revisions of those standards and / or connection types as of the filing date of this application.

[0043] In one example, one or more servers 108 may be implemented as blade servers, mainframe servers, tower servers, rack servers, and / or the like. One or more servers 108 may be configured as mail servers, web servers, application servers, FTP servers, media servers, data servers, web servers, file servers, virtual servers, and / or the like. One or more servers 108 may be communicatively coupled (e.g., networked) to one or more information processing devices 102 via a data network 106 and may be configured to store content and execute video / audio conferencing and / or other online presentation algorithms, programs, applications, processes, and / or the like. One or more servers 108 may be part of a flight management system managed by an aviation authority, e.g., the Federal Aviation Administration, an airline, an airport, and / or the like.

[0044] Although the thermal management components of the present disclosure are designed for use in aerospace applications such as the aircraft of system 100, in other applications the thermal management components can be designed for use in other structures and / or vehicles. It is noted that, as an example, the aircraft may include civilian and military aircraft such as personal planes, commercial planes, cargo planes, jets, helicopters, drones, and / or the like. In light of this disclosure, one of ordinary skill in the art will recognize various types of aircraft that may be used with the solutions proposed in this disclosure.

[0045] 2, in various examples, the system 200 includes a data manager 104. The data manager 104 includes an input device 212, a processor 214, a communication device 216, a display 218, a database 220, and a memory device 210 configured to store executable instructions. In various examples, the executable instructions cause the data manager 104 to generate a three-dimensional structure of a thermal management component.

[0046] With reference to FIG. 3, a method 300 for generating a three-dimensional structure of a thermal management component according to some examples is disclosed below. In block 310, a three-dimensional element is selected. FIG. 4 shows seven examples of different three-dimensional elements 402A-G. In one example, the three-dimensional element has a triply periodic minimal surface (TPMS). According to some examples, the three-dimensional element is obtained by the input device 212 from a plurality of three-dimensional elements displayed on the display 218. In one particular example, the database 220 stores the plurality of three-dimensional elements. The database also stores various properties of each three-dimensional element, such as surface area, one or more j / f ratios (or j and f coefficients stored separately), and corresponding Reynolds numbers. In one or more examples, a user selects a particular three-dimensional element to use based on one or more properties, such as the j and f coefficients. In one example, the j and f coefficients are determined by experimental measurements on one or more three-dimensional elements stored in the database. In one example, the j and f coefficients are determined by CFD simulations on one or more three-dimensional elements stored in the database. In some examples, the processor 214 selects the three-dimensional element from the database 220 based on certain parameters provided via the input device 212 .

[0047] In one example, in addition to selecting the three-dimensional elements, an aspect ratio of the three-dimensional elements is also selected. For example, the shape of three-dimensional element 402A is the same as the shape of three-dimensional element 402B, except that the size of three-dimensional element 402B is twice the size of three-dimensional element 402A. In another example, an aspect ratio is specified for one or more axes to modify the size of the three-dimensional elements along one or more axes. In one example, method 300 is repeated with different three-dimensional elements to determine which of the multiple three-dimensional elements performs best. In one or more examples, two or more different three-dimensional elements are selected and used to generate the shape.

[0048] At block 320 of the method 300, the processor 214 determines the surface area (A). In one example, a desired first temperature difference (ΔT1) is obtained via the input device 212. The desired first temperature difference (ΔT1) is the desired difference between the temperature of the first fluid and the temperature of the second fluid at the inlet of the thermal management component design. In one example, a desired second temperature difference (ΔT2) is also obtained via the input device 212. The desired second temperature difference (ΔT2) is the desired difference between the temperature of the first fluid and the temperature of the second fluid at the outlet of the thermal management component design. In one example, a desired heat transfer coefficient (U) for the thermal management component design is obtained or selected via the input device 212. In one example, the following formula: Q=U×A×LMTD (Formula 1) Determine the surface area A using

[0049] In the above equation, Q is the heat flow rate (Watts) and U is the overall heat transfer coefficient (e.g., W / m 2 K) and A is the surface area (e.g., m 2LMTD is the logarithmic mean temperature difference between the first and second fluids. As used in this disclosure, the first fluid dissipates heat and the second fluid absorbs heat from the first fluid. The LMTD function is modified based on whether the two fluids flow simultaneously or in opposite directions. Often, the four temperature values ​​obtained via the input device 212 are the inlet temperature of the first fluid, the inlet temperature of the second fluid, the outlet temperature of the first fluid, and the outlet temperature of the second fluid. Additionally, in one example, an input is obtained via the input device 212 indicating whether the first and second fluids flow simultaneously or in opposite directions. Based on these inputs, values ​​of ΔT1 and ΔT2 are calculated and used to calculate the following equation: LMTD=(ΔT1-ΔT2) / ln(ΔT1 / ΔT2) (Equation 2). Calculate the LMTD value using:

[0050] In one example, ΔT1 and ΔT2 are the temperature difference at the inlet and outlet of the thermal management design, respectively, when both fluids flow in parallel, or in another example, ΔT1 is the temperature difference between the first and second fluids at the inlet of the first fluid (and outlet of the second fluid) and ΔT2 is the temperature difference between the first and second fluids at the outlet of the first fluid (and inlet of the second fluid) when the fluids flow in opposite directions.

[0051] In one example, a value of U is assumed and the surface area A is calculated using Equation 1. In one example, the value of Q is a known value for the heat transfer application. In one example, the value of Q for the heat transfer application is obtained via the input device 212. At block 330 of the method 300, a structure corresponding to the determined surface area A is generated by the processor 214.

[0052] In one example, the number of selected three-dimensional elements is interlinked across the three-dimensional structure. Examples of three-dimensional structures are shown in Figures 5A-5D (e.g., three-dimensional structure 504 in Figure 5A, three-dimensional structure 506 in Figure 5B, three-dimensional structure 508 in Figure 5C, and three-dimensional structure 510 in Figure 5D). In one example, the three-dimensional structure is provided via the input device 212. The three-dimensional structure can be modeled in a 3D design file prepared or loaded into the memory 210. In one example, the three-dimensional structure is selected from several three-dimensional structures stored in the memory 210. In one or more examples, the shape of the three-dimensional structure is determined by distributing the selected three-dimensional elements to achieve a desired surface area. In some of the examples, the distribution is predefined. In some of the examples, the distribution is provided via the input device 212. In some of the examples, the distribution is constrained based on the design requirements of the three-dimensional structure provided via the input device 212.

[0053] In one example, block 330 of method 300 also includes selecting a number of selected three-dimensional elements. In one example, the determined number of three-dimensional elements is distributed by the processor 214 over a surface area per unit length of the three-dimensional structure. In one example, the determined number of individual three-dimensional elements is distributed across the three-dimensional structure. In another example, two or more different three-dimensional elements are interconnected across the three-dimensional structure.

[0054] At block 335 of the method 300, the processor 214 determines a modified surface area of ​​the generated three-dimensional structure. In one or more examples, determining the modified surface area of ​​the generated three-dimensional structure includes determining a heat transfer rate of the generated structure. In one example, the heat transfer rate is determined by the processor 214 based on j and f coefficients of the three-dimensional elements used to generate the three-dimensional structure. In another example, the processor 214 estimates the heat transfer rate based on the j and f coefficients. In one or more examples, determining the modified surface area of ​​the generated three-dimensional structure also includes determining an updated value of LMTD based on the calculated or estimated heat transfer rate. In one or more examples, the processor 214 further determines the modified surface area based on the updated value of LMTD and the heat transfer rate used using Equation 1.

[0055] In one example, the simulated temperature difference (dT) of the generated three-dimensional structure is calculated according to the following formula: Q=U×A×dT (formula 3) Calculate the correction value of U by determining using

[0056] In the above equation, Q is the heat flow rate (Watts) and U is the overall heat transfer coefficient (W / m 2 K) and A is the surface area (m 2 ) and dT is the actual temperature difference in the heat exchanger.

[0057] The calculated value of U is then used to recalculate the value of A based on Equation 1. At block 340, the processor 214 determines whether the generated structure requires further iterations. In one or more examples, the processor 214 compares the revised surface area to the surface area determined at block 320 of the method 300. In one example, the processor 214 may determine that further iterations are required if the difference exceeds a predefined threshold. In another example, the processor may determine whether the difference exceeds a particular percentage or tolerance. In another example, the processor 214 may compare the number of iterations performed to a predefined number of iterations or a number of iterations defined by a user. In yet another example, the processor 214 determines whether the generated structure requires further iterations based on (i) the LMTD value, (ii) the heat transfer rate, (iii) the surface area, or (iv) a combination of these factors or a difference in one or more of these factors.

[0058] If the processor 214 determines that more iterations are required, control of the method 300 returns to block 330 to generate a structure corresponding to the modified surface area, as described herein.

[0059] If the processor 214 determines that no further iterations are required, the processor 214 determines whether the generated three-dimensional structure meets the structural requirements at block 345 of the method 300. In some examples, the processor 214 checks whether the generated three-dimensional structure meets the requirements using module structural data. In some such examples, the processor 214 may further determine whether the generated three-dimensional structure meets thermal requirements.

[0060] After the generation of the three-dimensional structure is complete and the generated three-dimensional structure meets the structural requirements, the method 300 displays the generated three-dimensional structure via the display 218 at block 350. On the other hand, if the generated three-dimensional structure does not meet the structural requirements at 345, the method 300 returns to block 310 to select a different three-dimensional element. In one example, the executable instructions generate a three-dimensional model file that can be exported via the communication device 216. The three-dimensional model file is used as an input for additive manufacturing or other manufacturing processes.

[0061] FIG. 4 shows seven examples of different three-dimensional elements 402A-G. Three-dimensional elements 402A-E are examples of TPMS structures. Three-dimensional elements 402F and 402G are examples of single TPMS units with skins attached to both sides. In one or more examples, these structures are stored in database 220 in a suitable format. In addition to the above, data corresponding to these structures such as j coefficient, f coefficient, aspect ratio, heat transfer ratio, etc. are also stored in database 220.

[0062] FIG. 5A shows an exposed view of three-dimensional elements of a three-dimensional structure 504. FIG. 5B shows an exposed view of a three-dimensional structure 506 formed of three-dimensional elements according to one or more examples of the present disclosure. FIG. 5C shows a surface and exposed view of a portion of a three-dimensional structure 508 according to another example of the present disclosure. In particular, the three-dimensional structure 508 is a TPMS structure formed of TPMS elements having skins arranged to correspond to the curved surfaces to form a sandwich panel. FIG. 5D shows an exposed view of a three-dimensional structure 510 according to another example of the present disclosure. The three-dimensional structures 502, 504, 506, 508, and 510 are generated by the data management device 104 using the processes disclosed in the present disclosure.

[0063] FIG 6A is a diagram of a thermal management component 602 for use in a thermal management application, in accordance with one or more examples of the present disclosure. The thermal management component 602 has an exterior surface 606 that encapsulates a three-dimensional structure. The exterior surface 606 can encapsulate a fluid flowing through the thermal management component 602. FIG 6B is a diagram of a three-dimensional structure 608 incorporated into the thermal management component 604, in accordance with one or more examples of the present disclosure.

[0064] In one or more examples, the systems and methods disclosed herein can be used to generate three-dimensional structures that satisfy certain acoustic constraints in addition to, or instead of, satisfying thermal constraints.

[0065] In some examples, the three-dimensional structures are incorporated into thermal management components used in multi-fluid heat exchangers. In some examples, the three-dimensional structures are incorporated into thermal management components used in phase change heat exchangers.

[0066] In one or more instances, the three-dimensional structure incorporates two or more different three-dimensional shapes.

[0067] In some examples, inputs such as thermal constraints and requirements are used by the data management system. In some examples, inputs such as acoustic constraints and requirements are used by the data management system. In some examples, inputs such as structural constraints and requirements are used by the data management system. In some examples, the inputs include thermal constraints, acoustic constraints, and / or structural constraints, while in other examples, the inputs may include additional or alternative constraints such as, but not limited to, economic constraints, weight constraints, aerodynamic constraints, manufacturability constraints, and / or the like.

[0068] In the above description, several terms may be used, such as "top", "bottom", "upper", "lower", "horizontal", "vertical", "left", "right", "above", "below". Such terms are used to provide some clarity when dealing with relative relationships, where applicable. However, such terms are not intended to imply absolute relationships, positions and / or orientations. For example, for an object, a "top" surface can become a "bottom" surface by simply flipping the object. It is the same object even when flipped. Furthermore, the terms "include", "comprise", "have" and variations thereof mean "including but not limited to" unless otherwise expressly stated. A listing of things does not imply that any or all of the things are mutually exclusive and / or mutually inclusive, unless otherwise expressly stated. The terms "a", "an" and "the" refer to "one or more" unless otherwise expressly stated. Furthermore, the term "plurality" may be defined as "at least two". Moreover, unless specifically stated otherwise, a plurality of particular features does not necessarily imply every particular feature of a whole set or class of particular features as defined in this disclosure.

[0069] Furthermore, examples herein of an element being "coupled" to another element include direct coupling and indirect coupling. A direct coupling can be defined as an element being coupled to another element and being in some contact. An indirect coupling can be defined as a coupling between two elements that are not in direct contact with each other, but have one or more other elements between the coupled elements. Furthermore, as used in this disclosure, fixing an element to another element can include direct fixing and indirect fixing. In addition to the above, as used in this disclosure, "adjacent" does not necessarily indicate contact. For example, an element can be adjacent to another element without contacting the element.

[0070] As used in this disclosure, the phrase "at least one" when used in conjunction with a list of things means that one or more different combinations of the things in the list may be used, or only one of the things in the list may be required. The things may be specific objects, things, or categories. That is, "at least one" means that any combination or number of things from the list may be used, but not all of the things in the list may be required. For example, "at least one of thing A, thing B, and thing C" may mean "thing A," "thing A and thing B," "thing B," "thing A, thing B, and thing C," or "thing B and thing C." In some cases, "at least one of thing A, thing B, and thing C" may mean, for example, but not limited to, "two things A, one thing B, and ten things C," "four things B, and seven things C," or any other suitable combination.

[0071] Unless otherwise indicated, the terms "first," "second," etc. are used in this disclosure as labels only and are not intended to impose any order, position, or hierarchy on the things they refer to. Further, a reference to, for example, a "second" thing does not require or preclude the presence of, for example, a "first" thing or things numbered lower than "first," and / or, for example, a "third" thing or things numbered higher than "third."

[0072] As used in this disclosure, a system, device, structure, article, element, component, or hardware that is "configured to" perform a particular function is not only capable of performing the particular function after further modification, but can actually perform the particular function without any modification. In other words, a system, device, structure, article, element, component, or hardware that is "configured to" perform a particular function is selected, created, implemented, utilized, programmed, and / or designed specifically for performing the particular function. As used in this disclosure, "configured to" refers to existing characteristics of a system, device, structure, article, element, component, or hardware that enable the system, device, structure, article, element, component, or hardware to perform a specified function without further modification. Additionally or alternatively, for purposes of this disclosure, a system, device, structure, article, element, component, or hardware that is described as "configured to" perform a particular function may be described as "adapted" and / or "operable" to perform that function.

[0073] The schematic flow chart diagrams included in this disclosure are often presented as logical flow chart diagrams. Thus, the depicted order and indexed steps represent one example of the presented method. Other steps and methods may be conceived that are functionally, logically, or effectively equivalent to one or more steps, or portions thereof, of the depicted method. It is further understood that the format and symbols used are provided to describe the logical steps of the method and do not limit the scope of the method. Although various types of arrows and lines may be used in the flow chart diagrams, it is understood that these do not limit the scope of the corresponding method. Of course, some arrows and other connectors may only be used to indicate the logical flow of the method. For example, arrows may indicate waiting or monitoring periods of unspecified duration between the enumerated steps of the depicted method. In addition to the above, the order in which a particular method is performed may or may not strictly represent the order of the corresponding steps shown. Blocks represented by dashed lines represent alternatives of operations and / or portions thereof. The presence of dashed lines connecting various blocks represents alternatives of dependencies of operations or portions thereof. It is understood that not all dependencies between the various disclosed operations are necessarily expressed.

[0074] Many of the functionalities described herein are labeled as modules to further emphasize their independence in implementation. By way of example, a module may be implemented as a hardware circuit comprising custom VLSI circuits, gate arrays, off-the-shelf semiconductors such as logic chips, transistors, or other discrete components. A module may also be implemented in programmable hardware devices such as field programmable gate arrays, programmable array logic, programmable logic devices, or the like.

[0075] Modules may also be implemented in code and / or software for execution by various types of processors. Where a module of code is identified, the module may comprise one or more physical or logical blocks of executable code formed, for example, as an object, procedure or function. However, while the executable files of the identified modules need not be physically located together, the executable files may comprise disjoint instructions stored in different locations, which, when logically joined together, comprise a module and achieve the stated purpose of the module.

[0076] Of course, a module of code may be a single instruction or multiple instructions, and may even be distributed across multiple different code segments, even distributed among different programs, and even distributed across several memory devices. Similarly, while operational data may be identified and illustrated in this disclosure as being in a module, the operational data may be embodied in any suitable form and formed within any suitable type of data structure. The operational data may be organized in a single data set or may be distributed in various locations (including distributed across different computer readable storage devices). If a module or a portion of a module is implemented in software, the software portion is stored in one or more computer readable storage devices.

[0077] Any combination of one or more computer readable mediums may be utilized. The computer readable medium may be a computer readable storage medium. The computer readable storage medium may be a storage device that stores the code. The storage device may be, for example, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, holographic, micromechanical, or semiconductor system, apparatus, or device, or any suitable combination of the above.

[0078] More specific examples (non-limiting enumerations) of storage devices include an electrical connection having one or more wires, a portable computer diskette, a hard disk, a random access memory (RAM), a read only memory (ROM), an erasable programmable read only memory (EPROM or flash memory), a portable compact disk read only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the context of this document, a computer readable storage medium may be any tangible medium that can contain or store a program for use by or in connection with an instruction execution system, apparatus, or device.

[0079] Code for performing the operations may be written in any combination of one or more programming languages, including, for example, object-oriented programming languages ​​such as Python, Ruby, Java, Smalltalk, C++, and traditional procedural programming languages ​​such as the C programming language, and / or machine language such as assembly language. The code may be executed entirely on the user's computer, parts of the code may be executed on the user's computer, the code may be executed as a stand-alone software package, parts of the code may be executed on the user's computer and a remote computer, or the code may be executed entirely on a remote computer or server. In the latter scenario, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., using the Internet using an Internet Service Provider).

[0080] The described forms, structures, and characteristics of the examples may be combined in any suitable manner. In the above description, numerous specific details are set forth, such as examples of programming, software modules, user selections, network transactions, database queries, database structures, hardware modules, hardware circuits, hardware chips, and the like, to provide a thorough understanding of the examples. However, one of ordinary skill in the art will recognize that the examples can be implemented without one or more of the specific details, or can be implemented with other methods, components, materials, and the like. In other instances, well-known structures, materials, or operations have not been shown or described in detail to avoid obscuring aspects of the examples.

[0081] Example aspects are described above with reference to schematic flow chart illustrations and / or schematic block diagrams of example methods, apparatus, systems and program products. It will be understood that each block of the schematic flow chart illustrations and / or schematic block diagrams, and combinations of blocks in the schematic flow chart illustrations and / or schematic block diagrams, can be implemented by code. The code may be provided to a processor of a general purpose computer, special purpose computer or other programmable data processing apparatus to produce a machine, such that the instructions executed by a processor of the computer or other programmable data processing apparatus create means for implementing the functions / acts illustrated in one or more blocks of the schematic flow chart illustrations and / or schematic block diagrams.

[0082] The storage device may also store code capable of instructing a computer, other programmable data processing apparatus, or other device to function in a particular manner, such that the instructions stored in the storage device produce an article of manufacture including instructions for implementing the functions / acts illustrated in one or more blocks of the schematic flow chart illustrations and / or schematic block diagrams.

[0083] The code may be loaded into a computer or other programmable data processing apparatus or other device such that a series of operational steps are executed by the computer or other programmable apparatus or other device to provide a process for implementing the functions / operations illustrated in one or more blocks of the flowcharts and / or block diagrams, thereby realizing a computer-implemented process.

[0084] The schematic flowcharts and / or block diagrams in the Figures illustrate the architecture, functionality, and operation of possible implementations of apparatus, systems, methods and program products according to various examples. In this regard, each block in the schematic flowcharts and / or block diagrams may represent a module, segment, or portion of code that comprises one or more executable instructions of code for implementing one or more illustrated logical functions.

[0085] The subject matter may be embodied in other specific forms without departing from its spirit or essential characteristics. The described examples are to be considered in all respects only as illustrative and not limiting. All changes that come within the meaning and range of equivalency of the claims are to be embraced within their scope. [Explanation of symbols]

[0086] 100 Systems 102 Information Processing Devices 104 Data management device 106 Data Network 108 Server 200 Systems 210 Memory Devices 212 Input Devices 214 processor 216 Communication Devices 218 Display, display device 220 Database 300 Computer-Implemented Methods 402 Three-dimensional elements 502 Three-dimensional structure 504 Three-dimensional structure 506 Three-dimensional structure 508 Three-dimensional structure 510 Three-dimensional structure 602 Thermal Management Elements 604 Thermal Management Elements 606 External surface 608 Three-dimensional structure 402A Three-dimensional elements 402B Three-dimensional elements 402C Three-dimensional elements 402D three-dimensional elements 402E Three-dimensional elements 402F Three-dimensional elements 402G three-dimensional elements

Claims

1. 1. A computer-implemented method (300) for generating a three-dimensional structure (504) for use in a thermal management component (602), the method (300) comprising: selecting (310) at least one three-dimensional element (402A) from a plurality of three-dimensional elements (402) by a processor (214); determining (320) by the processor (214) a surface area (A) required to dissipate heat from the first fluid according to a desired temperature difference and a desired heat transfer rate (U); generating (330) the three-dimensional structure (504) for use in the thermal management component (602) by interlinking a number of the selected three-dimensional elements (402A) having a combined surface area equal to the determined surface area (A); 13. A computer-implemented method (300).

2. 2. The computer-implemented method of claim 1, wherein the step of selecting (310) the three-dimensional element (402) by the processor (214) further comprises the step of determining, by the processor (214), a performance factor based at least on a size and an aspect ratio of the three-dimensional element (402A), and the three-dimensional element (402A) is selected based at least on the performance factor satisfying a predefined threshold.

3. Determining (320) the surface area (A) required to dissipate heat (q) from the first fluid in response to the desired temperature difference and the desired heat transfer rate (U) by the processor (214) comprises: determining, by the processor (214), a first amount of heat dissipated by the generated three-dimensional structure (504); determining, by the processor (214), a second surface area (A2), the second surface area dissipating an amount of heat closer to the amount of heat (q) than the amount of heat dissipated by the surface area (A1); The computer-implemented method (300) of claim 1 further comprising:

4. the amount of heat dissipated by the generated three-dimensional structure (504) is determined by using thermal data associated with the at least one selected three-dimensional element (402A) and simulating a rate of heat transfer through the generated three-dimensional structure (504). The computer-implemented method (300) of claim 3.

5. 2. The computer-implemented method (300) of claim 1, wherein the surface area (A) is determined based on a log-mean temperature difference equation using the surface area (A), a first temperature difference (ΔT1), the heat transfer coefficient (U), and a second temperature difference (ΔT2) of a second fluid, the second fluid being used to adjust the temperature of the first fluid.

6. 2. The computer-implemented method of claim 1, further comprising receiving a desired shape of the thermal management component via an input device, wherein the three-dimensional structure is generated such that the three-dimensional structure has the desired shape.

7. The computer-implemented method of claim 1 , wherein the first fluid is a fluid to be cooled in a heat exchanger, and the component forms part of the heat exchanger.

8. The computer-implemented method of claim 1 , wherein the three-dimensional elements (402A) comprise one or more triply periodic minimal surfaces.

9. A processor (214); An input device (212); A display device (218); A memory device (210), When executed by the processor (214), Selecting (310) a three-dimensional element (402A) from a plurality of three-dimensional elements (402); Determining (320) a surface area (A) required to dissipate heat from the first fluid in response to a desired first temperature difference (ΔT1) and a desired heat transfer rate (U); generating (330) a three-dimensional structure (504) for use in a thermal management component (602) by interconnecting a number of the selected three-dimensional elements (402A) having a combined surface area equal to the determined surface area (A); displaying (350) the generated three-dimensional structure (504) for use in the thermal management component (602) via the display device (218); a memory device (210) storing instructions for causing said processor (214) to at least: A system (104).

10. 10. The system (104) of claim 9, wherein the instructions further cause the processor (214) to determine a performance factor based at least on a size and an aspect ratio of the three-dimensional element (402A), and the three-dimensional element (402A) is selected based at least on the performance factor satisfying a predefined threshold.

11. The instructions include: receiving an input of the desired heat transfer coefficient (U) via an input device (212); Determining a first surface area (A1); Determining a first estimated heat transfer coefficient (U1); determining a second surface area (A2) corresponding to the first estimated heat transfer rate (U1), the second surface area dissipating an amount of heat closer to the amount of heat (q) than the amount of heat dissipated by the first surface area (A1); The system (104) of claim 9, further comprising:

12. The instructions include: determining the first estimated heat transfer rate (U1) by simulating a rate of heat transfer over the surface area (A1) and equalizing the first estimated heat transfer rate (U1) to the heat transfer rate associated with the simulated rate of heat transfer; The system (104) of claim 9, further comprising:

13. The instructions include: determining the surface area (A) based on a log-mean temperature difference equation using the surface area (A), the first temperature difference (ΔT1), the heat transfer coefficient (U) and a second temperature difference (ΔT2) of a second fluid, the second fluid being used to adjust the temperature of the first fluid; The system (104) of claim 9, further comprising:

14. The instructions include: receiving a desired shape of the thermal management component (602) via an input device (212), and the three-dimensional structure (504) is generated such that the three-dimensional structure has the desired shape; The system (104) of claim 9, further comprising:

15. The system (104) of claim 9, wherein the first fluid is a fluid to be cooled in a heat exchanger, and the thermal management component (602) forms a part of the heat exchanger.

16. The system (104) of claim 9, wherein the three-dimensional element (402A) comprises one or more triply periodic minimal surfaces.

17. When executed by the processor (214), Selecting (310) a three-dimensional element (402A) from a plurality of three-dimensional elements (402); Determining (320) a surface area (A) required to dissipate heat from the first fluid in response to a desired first temperature difference (ΔT1) and a desired heat transfer rate (U); generating (330) a three-dimensional structure (504) for use in a thermal management component (602) by interconnecting a number of the selected three-dimensional elements (402A) having a combined surface area equal to the determined surface area (A); displaying (350) the generated three-dimensional structure (504) for use in the thermal management component (602) via a display device (218); A non-transitory computer-readable storage medium (210) storing instructions that cause the processor to

18. The instructions include: receiving an input of the desired heat transfer coefficient (U) via an input device (212); determining an amount of heat dissipated by the generated three-dimensional structure (504); determining a second surface area (A2) that dissipates an amount of heat closer to the amount of heat (q) than the amount of heat dissipated by the surface area (A1), the amount of heat dissipated by the three-dimensional structure (504) being determined by using thermal data associated with one of the three-dimensional elements (402A) and simulating a rate of heat transfer through the generated three-dimensional structure (504); The non-transitory computer-readable storage medium (210) of claim 17, further causing the processor (214) to:

19. The instructions include: determining the surface area (A) based on a log-mean temperature difference equation using the surface area (A), the first temperature difference (ΔT1), the heat transfer coefficient (U) and a second temperature difference (ΔT2) of a second fluid, the second fluid being used to adjust the temperature of the first fluid; The non-transitory computer-readable storage medium (210) of claim 17, further causing the processor (214) to:

20. The instructions include: receiving a desired shape of the thermal management component (602) via an input device (212), and the three-dimensional structure (504) is generated such that the three-dimensional structure has the desired shape; The non-transitory computer-readable storage medium (210) of claim 17, further causing the processor (214) to:

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