Display device

Abstract

To provide a display device with long life, in which permeation of oxygen and moisture can be prevented.SOLUTION: A display device includes: a substrate including a first display region, an opening region disposed inside the first display region, a peripheral region disposed so as to surround at least a part of the opening region, and a second display region connected from the peripheral region to an edge of the first display region; a pixel defining film having at least one or more first opening parts disposed on the substrate in the first display region, and at least one or more second opening parts disposed on the substrate in the second display region; a first common layer disposed in the first opening parts; and a second common layer disposed in the second opening parts. A thickness of the first common layer and a thickness of the second common layer are mutually the same or different.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to a method and an apparatus, and more particularly to a display device manufacturing apparatus and a display device manufacturing method. [Background technology]

[0002] Recently, display devices have been used in a variety of applications, and their thickness and weight have become thinner and lighter, allowing their use in a wider range.

[0003] As the area occupied by the display area of ​​a display device increases, various functions that are integrated or linked to the display device are being added. As a method for adding various functions while expanding the area, research is being conducted on a display device in which various components can be arranged in the display area. Summary of the Invention [Problem to be solved by the invention]

[0004] It is possible to provide a display device manufacturing apparatus for manufacturing a display device including a display panel having an area in which various components can be arranged within the display area of ​​the present invention, and a display device manufacturing method for manufacturing the same. However, such a problem is merely an example, and the scope of the present invention is not limited thereby. [Means for solving the problem]

[0005] An embodiment of the present invention may disclose a display device including: a substrate having a first display region, an opening region disposed within the first display region, a peripheral region disposed to surround at least a portion of the opening region, and a second display region connected from the peripheral region to an edge of the first display region; a pixel definition layer disposed on the substrate, the pixel definition layer having at least one first opening disposed in the first display region and at least one second opening disposed in the second display region; a first common layer disposed in the first opening, and a second common layer disposed in the second opening, wherein a thickness of the first common layer and a thickness of the second common layer are the same or different.

[0006] In the present embodiment, the first common layer and the second common layer may include at least one of an intermediate layer and at least one of a counter electrode.

[0007] In the present embodiment, an edge of the first display area may be a rectangle, and the second display area may be disposed obliquely so as to face one vertex of the first display area.

[0008] In this embodiment, the first common layer may have a thickness greater than a thickness of the second common layer.

[0009] In the present embodiment, the thickness of the second common layer may decrease from the edge of the second common layer to the center of the second common layer.

[0010] In this embodiment, a through hole may be disposed in the opening region.

[0011] Another embodiment of the present invention discloses an apparatus for manufacturing a display device, the apparatus including: a chamber in which a display substrate and a mask assembly are disposed; a first support part for fixing the display substrate; a second support part for fixing the mask assembly so as to face the display substrate; and a source part disposed opposite the mask assembly and supplying a deposition material to the display substrate, the mask assembly including a mask sheet having an opening through which the deposition material passes, the mask sheet including: a body part having the opening; a rib connected to the body part and dividing the opening into two regions having different areas; and a shielding part connected to the rib and protruding from one side of the rib toward the source part to block the deposition material.

[0012] In the present embodiment, the opening may be formed in a quadrangle, and the rib may be disposed obliquely so as to face a vertex of the opening.

[0013] In the present embodiment, the first distance from the surface of the shielding portion facing the display substrate to the surface of the rib facing the display substrate is 2.7×10 mm. -4 It may be more than twice as large.

[0014] In the present embodiment, at least one of the body portion, the rib, and the shielding portion may include carbon fiber.

[0015] In this embodiment, the ribs and the shielding portion may comprise carbon fiber, and the ribs may be attached to the body portion by an adhesive material.

[0016] In the present embodiment, the body portion may include a mounting groove into which the rib is inserted and mounted.

[0017] In this embodiment, the deposition material may form at least one of the intermediate layers and the counter electrode of the display substrate.

[0018] In the present embodiment, the mask sheet may further include a magnetic material disposed on the body portion.

[0019] Yet another embodiment of the present invention discloses a method for manufacturing a display device, the method including the steps of: disposing a display substrate and a mask assembly inside a chamber; aligning the display substrate and the mask assembly; and supplying a deposition material to a source portion, passing the mask assembly, and supplying the deposition material to the display substrate, wherein the deposition material is blocked at a certain area when passing through an opening in the mask assembly, forming an opening area in the display substrate, and forming a first display area and a second display area having different thicknesses of the deposition material in the part of the display substrate excluding the opening area.

[0020] In the present embodiment, the thickness of the deposition material in the first display region may be greater than the thickness of the deposition material in the second display region.

[0021] In the present embodiment, the thickness of the deposition material in the second display area may be variable along a width direction of the second display area.

[0022] In the present embodiment, the thickness of the deposition material in the second display area may be thinner from the edge of the second display area to the center of the second display area.

[0023] In the present embodiment, the first display area may form a rectangle, and the second display area may be disposed diagonally opposite vertices of the first display area.

[0024] In this embodiment, the mask assembly may include a mask sheet including an opening, and the mask sheet may include a body portion having the opening, a rib connected to the body portion and dividing the opening into two regions having different areas, and a shielding portion connected to the rib and protruding from one side of the rib toward the source portion to block the deposition material.

[0025] Other aspects, features, and advantages in addition to those described above will be apparent from the following drawings, claims, and detailed description of the invention.

[0026] Such general and specific aspects may be implemented using a system, method, computer program, or any combination of systems, methods, and computer programs. Effect of the Invention

[0027] The display device according to the embodiment of the present invention has a uniform surface and is resistant to oxygen and moisture penetration, thereby extending the lifespan.

[0028] The method for manufacturing a display device according to an embodiment of the present invention can minimize defects in the display device during manufacturing of the display device, and can also manufacture a display device having an extended lifespan. [Brief description of the drawings]

[0029] [Figure 1] 1 is a perspective view illustrating a display device according to an embodiment of the present invention. [Diagram 2] 1 is a cross-sectional view illustrating a display device according to an embodiment of the present invention; [Diagram 3] 1 is a cross-sectional view illustrating a display device according to another embodiment of the present invention. [Figure 4] FIG. 2 is a plan view of a display panel according to an embodiment of the present invention. [Diagram 5] 1 is an equivalent circuit diagram showing one pixel in a display panel according to an embodiment of the present invention. [Figure 6] 1 is a cross-sectional view showing a display panel according to an embodiment of the present invention. [Figure 7] 5 is a cross-sectional view showing a first display region of the display panel shown in FIG. 4. [Figure 8] 5 is a cross-sectional view showing a second display area of ​​the display panel shown in FIG. 4. [Figure 9] 11 is a cross-sectional view showing a display panel according to another embodiment of the present invention. [Figure 10] 13 is a cross-sectional view showing a display panel according to still another embodiment of the present invention. [Figure 11] 13 is a cross-sectional view showing a display panel according to still another embodiment of the present invention. [Figure 12] 12 is a cross-sectional view showing the display panel shown in FIG. 11. [Figure 13] 13 is a cross-sectional view showing a display panel according to still another embodiment of the present invention. [Figure 14] 13 is a cross-sectional view showing a display panel according to still another embodiment of the present invention. [Figure 15] 1 is a cross-sectional view showing a display device manufacturing apparatus according to an embodiment of the present invention. [Figure 16] FIG. 16 is a perspective view of the mask assembly shown in FIG. [Figure 17] 17 is a cross-sectional view taken along line CC' in FIG. 16. [Figure 18] FIG. 16 is a cross-sectional view showing another embodiment of the mask sheet shown in FIG. [Figure 19] FIG. 16 is a cross-sectional view showing still another embodiment of the mask sheet shown in FIG. [Figure 20] 20 is a cross-sectional view showing how a deposition material that has passed through the ribs shown in FIGS. 17 to 19 is deposited on a display substrate. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0030] The present invention can be modified in various ways and can have various embodiments, but specific embodiments are illustrated in the drawings and will be described in detail by detailed description. The effects, features, and methods of achieving the present invention will become clear by referring to the embodiments described in detail below together with the drawings. However, the present invention is not limited to the embodiments disclosed below, and can be realized in various forms.

[0031] Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings. When describing the embodiment with reference to the drawings, the same or corresponding components are designated by the same reference numerals, and duplicate descriptions thereof will be omitted.

[0032] In the following embodiments, terms such as first and second are not used in a limiting sense but are used for the purpose of distinguishing one component from another component.

[0033] In the following embodiments, the singular expression includes the plural expression unless otherwise clearly indicated in the context.

[0034] In the following embodiments, the terms "comprise" or "have" mean the presence of features or components described in the specification, and do not preclude the possibility that one or more other features or components may be added.

[0035] In the following embodiments, when a part such as a film, region, or component is said to be on or above another part, this does not only mean that it is directly on top of the other part, but also means that there is another film, region, component, etc. in between.

[0036] In the drawings, the size of components may be exaggerated or reduced for the convenience of explanation. For example, the size and thickness of each component shown in the drawings are arbitrarily shown for the convenience of explanation, and the present invention is not necessarily limited to what is shown in the drawings.

[0037] In the following embodiments, the x-axis, y-axis, and z-axis are not limited to the three axes on a Cartesian coordinate system, but are broadly interpreted as including them. For example, the x-axis, y-axis, and z-axis may be mutually orthogonal, but may not be mutually orthogonal and may point in different directions.

[0038] Certain steps may be performed out of the order described if an embodiment can be realized differently. For example, two steps described in succession may be performed substantially simultaneously or may be performed in the reverse order from that described.

[0039] FIG. 1 is a perspective view showing a display device according to an embodiment of the present invention.

[0040] Referring to Fig. 1, the display device includes an aperture region OP as a first region, a first display region DA1 as a second region at least partially surrounding the aperture region OP, and a second display region DA2 connected to the aperture region OP. The display device 1 can provide a predetermined image by using light emitted from a plurality of pixels arranged in the first display region DA1 and the second display region DA2. Fig. 1 illustrates one aperture region OP arranged inside the first display region DA1, and the aperture region OP is entirely surrounded by the first display region DA1. The aperture region OP is also an area in which components described later with reference to Fig. 2 are arranged.

[0041] Between the opening region OP and the first display region DA1, which is the second region, a second non-display region NDA2 is disposed as a third region, and the first display region DA1 may be surrounded by the first non-display region NDA1, which is the fourth region. The first non-display region NDA1 may be connected to the second display region DA2. That is, the second display region DA2 is connected from an edge of the first non-display region NDA1 to an edge of the first display region DA1. The second non-display region NDA2 and the first non-display region NDA1 may be a kind of non-display region in which no pixels are arranged. The second non-display region NDA2 is entirely surrounded by the first display region DA1 and the second display region DA2, and the first display region DA1 is entirely surrounded by the first non-display region NDA1. The edge of the first display region DA1 may be a rectangle. In addition, the second display area DA2 may be arranged diagonally with respect to the longitudinal direction (X-axis direction in Figure 1) or the lateral direction (Y-axis direction in Figure 1) of the first display area DA1 so as to face one vertex of the first display area DA1.

[0042] In the following, an organic light emitting display device will be described as an example of a display device 1 according to an embodiment of the present invention, but the display device of the present invention is not limited thereto. In other embodiments, other types of display devices such as a quantum dot light emitting display device may be used.

[0043] 1 shows one open area OP and an approximately circular shape, the present invention is not limited thereto, and it goes without saying that the number of open areas OP may be two or more, and the shape of each may be variously changed, such as a circle, an ellipse, a polygon, a star, or a diamond.

[0044] Fig. 2 is a cross-sectional view showing a display device according to an embodiment of the present invention, and Fig. 3 is a cross-sectional view showing a display device according to another embodiment of the present invention.

[0045] 2 and 3, the display device 1 may include a display panel 10, an input sensing layer 40 disposed on the display panel 10, and an optical function layer 50, which are also covered by a window 60. The display device 1 may be various electronic devices such as a mobile phone, a notebook computer, a smart watch, etc.

[0046] The display panel 10 is capable of displaying an image. The display panel 10 includes pixels arranged in a first display area DA1 and a second display area (not shown). The pixels may include a display element and a pixel circuit coupled to the display element. The display element may include an organic light emitting diode or a quantum dot organic light emitting diode, etc.

[0047] The input sensing layer 40 acquires coordinate information according to an external input, for example, a touch event. The input sensing layer 40 may include sensing electrodes (or touch electrodes) and trace lines connected to the sensing electrodes. The input sensing layer 40 may be disposed on the display panel 10. The input sensing layer 40 may sense the external input by a mutual cap method or / and a self-cap method.

[0048] The input sensing layer 40 may be formed directly on the display panel 10, or may be formed separately and then bonded to the display panel 10 via an adhesive layer such as an optical clear adhesive. For example, the input sensing layer 40 may be formed continuously after the process of forming the display panel 10. In this case, the input sensing layer 40 may be understood as a part of the display panel 10, and no adhesive layer is interposed between the input sensing layer 40 and the display panel 10. Although the input sensing layer 40 is illustrated as being interposed between the display panel 10 and the optical function layer 50 in FIG. 2, in another embodiment, the input sensing layer 40 may be disposed on the optical function layer 50.

[0049] The optical function layer 50 may include an anti-reflection layer. The anti-reflection layer can reduce the reflectance of light (external light) incident from the outside toward the display panel 10 through the window 60. The anti-reflection layer may include a phase retarder and a polarizer. The phase retarder may be a film type or a liquid crystal coating type, and may include a λ / 2 phase retarder and / or a λ / 4 phase retarder. The polarizer may also be a film type or a liquid crystal coating type. The film type may include a stretched synthetic resin film, and the liquid crystal coating type may include liquid crystals arranged in a predetermined arrangement. The phase retarder and the polarizer may further include a protective film. The phase retarder and the polarizer themselves, or the protective film, may be defined as the base layer of the anti-reflection layer.

[0050] In another embodiment, the anti-reflection layer may include a black matrix and a color filter. The color filters may be arranged in consideration of the hue of the light emitted from each pixel of the display panel 10. In yet another embodiment, the anti-reflection layer may include a destructive interference structure. The destructive interference structure may include a first reflective layer and a second reflective layer arranged on different layers. The first reflected light and the second reflected light reflected by the first reflective layer and the second reflective layer, respectively, are destructively interfered with each other, thereby reducing the external light reflectance.

[0051] The optical function layer 50 may include a lens layer. The lens layer may improve the light output efficiency of the light emitted from the display panel 10 or reduce color deviation. The lens layer may include a layer having a concave or convex lens shape and / or may include multiple layers having different refractive indices. The optical function layer 50 may include both the anti-reflection layer and the lens layer described above, or may include any one of them.

[0052] In one embodiment, the optical function layer 50 may be formed continuously after the process of forming the display panel 10 and / or the input sensing layer 40. In this case, no adhesive layer is interposed between the optical function layer 50, the display panel 10 and / or the input sensing layer 40.

[0053] The display panel 10, the input sensing layer 40, and / or the optical function layer 50 may include an opening. In this regard, FIG. 2 illustrates that the display panel 10, the input sensing layer 40, and the optical function layer 50 include a first opening 10H, a second opening 40H, and a third opening 50H, respectively, and the first opening 10H, the second opening 40H, and the third opening 50H are overlapped with each other. The first opening 10H, the second opening 40H, and the third opening 50H are positioned to correspond to the opening region OP. In another embodiment, one or more of the display panel 10, the input sensing layer 40, and the optical function layer 50 do not include an opening. For example, any one or two components selected from the display panel 10, the input sensing layer 40, and the optical function layer 50 do not include an opening. Or, the display panel 10, the input sensing layer 40, and the optical function layer 50 do not include an opening, as illustrated in FIG. 3.

[0054] As described above, the opening region OP may be a type of component region (e.g., a sensor region, a camera region, a speaker region, etc.) in which the components 30 for adding various functions to the display device 1 are located. The components 30 may be located in the first opening 10H, the second opening 40H, and the third opening 50H as shown in Fig. 2. Alternatively, the components 30 may be disposed under the display panel 10 as shown in Fig. 3.

[0055] The component 30 may include an electronic element. For example, the component 30 may be an electronic element that uses light or sound. For example, the electronic element may include a sensor that outputs and / or receives light, such as an infrared sensor, a camera that receives light and captures an image, a sensor that outputs and senses light or sound, measures distance, or recognizes fingerprints, a small lamp that outputs light, or a speaker that outputs sound. In the case of an electronic element that uses light, light in various wavelength bands, such as visible light, infrared light, and ultraviolet light, may be used. In some embodiments, the opening area OP may be understood as a transmission area through which light and / or sound can pass that is output from the component 30 to the outside or travels from the outside toward the electronic element.

[0056] In another embodiment, when the display device 1 is used in a smart watch or a vehicle instrument panel, the component 30 may be a member such as a clock hand or a hand that indicates predetermined information (e.g., vehicle speed, etc.). When the display device 1 includes a clock hand or a vehicle instrument panel, the component 30 may be exposed to the outside through the window 60, and the window 60 may include an opening corresponding to the opening region OP.

[0057] As described above, the component 30 may include components related to the function of the display panel 10, or may include components such as accessories that improve the aesthetics of the display panel 10. Although not shown in Figures 2 and 3, a layer including an optically transparent adhesive may be located between the window 60 and the optical functional layer 50.

[0058] Fig. 4 is a plan view of a display panel according to an embodiment of the present invention, and Fig. 5 is an equivalent circuit diagram showing one pixel of the display panel according to an embodiment of the present invention.

[0059] Referring to Figures 4 and 5, the display panel 10 may include an opening region OP which is a first region, a first display region DA1 and a second display region DA2 which are second regions, a second non-display region NDA2 which is a third region, and a first non-display region NDA1 which is a fourth region.

[0060] The display panel 10 includes a plurality of pixels P arranged in a first display area DA1 and a second display area DA2. Each pixel P may include a pixel circuit PC and an organic light emitting diode OLED as a display element coupled to the pixel circuit PC, as shown in Fig. 5. The pixel circuit PC may include a first thin film transistor T1, a second thin film transistor T2, and a storage capacitor Cst. Each pixel P may emit, for example, red, green, or blue light, or emit red, green, blue, or white light through the organic light emitting diode OLED.

[0061] The second thin film transistor T2 is a switching thin film transistor, and is connected to the scan line SL and the data line DL, and can transmit a data voltage input from the data line DL to the first thin film transistor T1 according to a switching voltage input from the scan line SL. The storage capacitor Cst is connected to the second thin film transistor T2 and the driving voltage line PL, and can store a voltage corresponding to a difference between the voltage transmitted from the second thin film transistor T2 and the first power supply voltage ELVDD supplied to the driving voltage line PL.

[0062] The first thin film transistor T1 is a driving thin film transistor, and is connected to the driving voltage line PL and the storage capacitor Cst, and corresponds to the voltage value stored in the storage capacitor Cst, and can control the driving current flowing from the driving voltage line PL to the organic light emitting diode OLED. The organic light emitting diode OLED can emit light having a predetermined brightness according to the driving current. A second power supply voltage ELVSS is supplied to the counter electrode (e.g., cathode) of the organic light emitting diode OLED.

[0063] 5 illustrates the pixel circuit PC including two thin film transistors and one storage capacitor, the present invention is not limited thereto. The number of thin film transistors and the number of storage capacitors may be variously changed according to the design of the pixel circuit PC. For example, the pixel circuit PC may further include four, five or more thin film transistors in addition to the above-mentioned two thin film transistors.

[0064] In the first non-display area NDA1, a scan driver 1100 for providing a scan signal to each pixel P, a data driver 1200 for providing a data signal to each pixel P, and main power supply wiring (not shown) for providing a first power supply voltage and a second power supply voltage may be arranged. Although FIG. 5 illustrates the data driver 1200 arranged adjacent to one side of the substrate 100, according to another embodiment, the data driver 1200 may be arranged on a flexible printed circuit board (FPCB) electrically connected to a pad arranged on one side of the display panel 10.

[0065] For example, a wiring section for supplying various signals and / or power to be applied to the first display area DA1 and the second display area DA2 may be disposed in the first non-display area NDA1. In this case, the wiring section may include a drive circuit. For example, the drive circuit may include at least one of a scan drive circuit (not shown), a terminal section (not shown), a drive power supply wiring (not shown) and a second wiring, and may further include a thin film transistor for controlling an electrical signal applied to the first display area DA1 and the second display area DA2. In addition, a partition wall or a trench for preventing the flow of an organic film used in manufacturing a display device may be disposed in the first non-display area NDA1.

[0066] 4 again, the second non-display area NDA2 may surround the aperture area OP on a plane. The second non-display area NDA2 and the aperture area OP are areas in which display elements such as organic light emitting diodes that emit light are not arranged, and signal lines that provide signals to pixels P arranged around the aperture area OP may pass through the second non-display area NDA2.

[0067] In addition to the signal lines, a special groove (not shown in the drawings) may be arranged in the second non-display area NDA2 as described above. In this case, a plurality of the grooves may be provided, and the plurality of grooves may be arranged to be spaced apart from each other in the second non-display area NDA2.

[0068] Fig. 6 is a cross-sectional view showing a display panel according to an embodiment of the present invention. Fig. 7 is a cross-sectional view showing a first display area of ​​the display panel shown in Fig. 4. Fig. 8 is a cross-sectional view showing a second display area of ​​the display panel shown in Fig. 4.

[0069] 6 to 8, the display panel 10 includes a display layer 200 disposed on a substrate 100. Such a display layer 200 may be disposed on a first display area DA1 and a second display area DA2.

[0070] The substrate 100 may include a glass material or a polymer resin. The substrate 100 may be formed in multiple layers. For example, the substrate 100 may include a first base layer 100-1, a first barrier layer 100-2, a second base layer 100-3, and a second barrier layer 100-4, as shown in the enlarged view of FIG. 6.

[0071] The first base layer 100-1 and the second base layer 100-3 may each include a polymer resin. For example, the first base layer 100-1 and the second base layer 100-3 may include a polymer resin such as polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, or cellulose acetate propionate. The aforementioned polymer resin may be transparent.

[0072] The first barrier layer 100-2 and the second barrier layer 100-4 are barrier layers that prevent the penetration of external foreign matter, and are made of silicon nitride (SiN x ), silicon oxide (SiO x The layer may be a single layer or multiple layers including inorganic materials such as

[0073] The display layer 200 includes a plurality of pixels. The display layer 200 may include a display element layer 200A including a display element arranged for each pixel, and a pixel circuit layer 200B including a pixel circuit and an insulating layer arranged for each pixel. Each pixel circuit may include a thin film transistor and a storage capacitor, and each display element may include an organic light emitting diode (OLED).

[0074] The display elements of the display layer 200 may be covered by a sealing member such as a thin-film sealing layer 500, which may include at least one inorganic sealing layer and at least one organic sealing layer. When the display panel 10 includes the substrate 100 including a polymer resin and the thin-film sealing layer 500 including an inorganic sealing layer and an organic sealing layer, the flexibility of the display panel 10 can be improved.

[0075] The display panel 10 may include a first opening 10H penetrating the display panel 10. The first opening 10H may be located in an opening region OP, in which case the opening region OP may be a kind of hole. Fig. 6 illustrates that the substrate 100 and the thin film encapsulation layer 500 include through holes 100H, 500H, respectively, corresponding to the first opening 10H of the display panel 10. The display layer 200 may also include a through hole 200H corresponding to the opening region OP.

[0076] The display panel 10 includes a substrate 100 including a first display area DA1, a second display area DA2, and a non-display area, and a thin-film sealing layer 500 that seals the first display area DA1, the second display area DA2, and the non-display area. In this case, the display panel 10 may include a display layer 200 and a thin-film sealing layer 500 as described above.

[0077] The buffer layer 101 is located on the substrate 100 and can reduce or block penetration of foreign matter, moisture, or external air from the bottom of the substrate 100, and can provide a flat surface on the substrate 100. The buffer layer 101 may include an inorganic material such as an oxide or a nitride, an organic material, or an inorganic-organic composite, and may have a single-layer structure or a multi-layer structure of an inorganic material and an organic material.

[0078] The first thin film transistor T1 includes a semiconductor layer A1, a first gate electrode G1, a source electrode S1, and a drain electrode D1, and the second thin film transistor T2 includes a semiconductor layer A2, a second gate electrode G2, a source electrode S2, and a drain electrode D2.

[0079] In the following description, the thin film transistors T1 and T2 are illustrated as being of a top gate type, but the present embodiment is not limited thereto, and various types of thin film transistors such as a bottom gate type may be used.

[0080] In the following description, the number of thin film transistors T1 and T2 is illustrated as two, but is not limited thereto. In some embodiments of the present invention, the display device may employ two or more thin film transistors T1 and T2 per pixel. In some embodiments, the number of thin film transistors T1 and T2 may be varied in various ways, such as employing six or seven thin film transistors T1 and T2 per pixel.

[0081] The semiconductor layers A1 and A2 may include amorphous silicon or polycrystalline silicon. In another embodiment, the semiconductor layers A1 and A2 may include an oxide of at least one material selected from the group including indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). The semiconductor layers A1 and A2 may include a channel region, and a source region and a drain region having a higher carrier concentration than the channel region.

[0082] A first gate electrode G1 is disposed on the semiconductor layer A1 with a first gate insulating layer 103 sandwiched therebetween. The first gate electrode G1 may contain molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be made of a single layer or multiple layers. As an example, the first gate electrode G1 may be a single layer of Mo.

[0083] The first gate insulating layer 103 is for insulating the semiconductor layer A1 from the first gate electrode G1, and is made of silicon oxide (SiO 2 ), silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), tantalum oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ) or zinc oxide (ZnO 2 ) etc.

[0084] A second gate electrode G2 is disposed on the semiconductor layer A2, sandwiched between a first gate insulating layer 103 and a second gate insulating layer 105. The second gate electrode G2 may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed in a multilayer or single layer including the above-mentioned materials. As an example, the second gate electrode G2 may be a single layer of Mo, or a multilayer of a Mo / Al / Mo structure.

[0085] The second gate insulating layer 105 may include an inorganic material including an oxide or a nitride. For example, the second gate insulating layer 105 may include silicon oxide (SiO 2 ), silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), tantalum oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ) or zinc oxide (ZnO 2 ) etc.

[0086] The source electrodes S1, S2 and the drain electrodes D1, D2 are disposed on the interlayer insulating layer 107. The source electrodes S1, S2 and the drain electrodes D1, D2 may include conductive materials including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed by a multilayer or single layer including the above-mentioned materials. As an example, the source electrodes S1, S2 and the drain electrodes D1, D2 may be formed by a multilayer structure of Ti / Al / Ti.

[0087] The interlayer insulating layer 107 is made of silicon oxide (SiO x ), silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), tantalum oxide (Ta 2 O 5 ), hafnium oxide (HfO2 ) or zinc oxide (ZnO 2 ) etc.

[0088] As mentioned above, the first gate electrode G1 of the first thin film transistor T1 and the second gate electrode G2 of the second thin film transistor T2 may be disposed in different layers, so that the driving ranges of the first thin film transistor T1 and the second thin film transistor T2 can be adjusted to be different.

[0089] The first electrode CE1 of the storage capacitor Cst may be formed in the same layer and made of the same material as the first gate electrode G1. The second electrode CE2 of the storage capacitor Cst is disposed on the second gate insulating layer 105 and overlaps the first electrode CE1. The second electrode CE2 may be formed in the same layer and made of the same material as the second gate electrode G2.

[0090] 7 and 8, the storage capacitor Cst is illustrated not to overlap with the first thin film transistor T1 and the second thin film transistor T2. However, the present invention is not limited thereto. For example, the storage capacitor Cst may be disposed overlapping with the first thin film transistor T1. In some embodiments, the first electrode CE1 of the storage capacitor Cst may be integrally formed with the first gate electrode G1. That is, the first gate electrode G1 of the first thin film transistor T1 may perform the function of the first electrode CE1 of the storage capacitor Cst.

[0091] A planarization layer 109 is located on the source electrodes S1, S2 and the drain electrodes D1, D2, and an organic light emitting device (OLED) 300 may be located on the planarization layer 109. The planarization layer 109 may be formed of a single layer or multiple layers of a film made of an organic material. The organic material may include a general-purpose polymer such as polymethyl methacrylate (PMMA) or polystyrene (PS), a polymer derivative having a phenol group, an acrylic polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorine polymer, a p-xylene polymer, a vinyl alcohol polymer, and blends thereof. The planarization layer 109 may be formed of a composite laminate of an inorganic insulating film and an organic insulating film.

[0092] An organic light-emitting element 300 may be disposed on the planarization layer 109 in the first display area DA1 and the second display area DA2 of the substrate 100. The organic light-emitting element 300 may include a common layer. In this case, the common layer may be a layer formed in common in the first display area DA1 and the second display area DA2. For example, the common layer may include at least one layer of the intermediate layer 320 (for example, one layer of the remaining layers in the intermediate layer 320 excluding the light-emitting layer 322) and a counter electrode 330. The organic light-emitting element 300 as described above may include a pixel electrode 310, a counter electrode 330, and an intermediate layer 320 interposed therebetween.

[0093] The pixel electrode 310 contacts one of the source electrode S1 and the drain electrode D1 of the first thin film transistor T1 through an opening formed in the planarization layer 109 or the like, and is electrically connected to the first thin film transistor T1. The pixel electrode 310 may be a reflective electrode. For example, the pixel electrode 310 may include a reflective film formed of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or a compound thereof, and a transparent or semi-transparent electrode layer formed on the reflective film. The transparent or semi-transparent electrode layer may be made of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In 2 O 3The insulating layer may include at least one selected from the group consisting of indium gallium oxide (IGO) and aluminum doped zinc oxide (AZO).

[0094] A pixel definition film 112 may be disposed on the planarization layer 109. The pixel definition film 112 has an opening corresponding to each subpixel, i.e., an opening exposing at least a central portion of the pixel electrode 310, thereby defining the pixel. The opening disposed in the first display area DA1 is referred to as a first opening. The opening disposed in the second display area DA2 is referred to as a second opening. The pixel definition film 112 increases the distance between the edge of the pixel electrode 310 and the counter electrode 330 disposed on the pixel electrode 310, thereby preventing arcing or the like from occurring at the edge of the pixel electrode 310. Such a pixel definition film 112 may be formed of an organic material such as polyimide or hexamethyldisiloxane (HMDSO).

[0095] The intermediate layer 320 includes an emitting layer 322. The emitting layer 322 may be formed of an organic material including a fluorescent material or a phosphorescent material that emits red, green, and blue light, and may be patterned corresponding to the pixels P in the first display area DA1 and the second display area DA2. The intermediate layer 320 may include at least one functional layer of a first functional layer 321 interposed between the emitting layer 322 and the pixel electrode 310, and a second functional layer 323 interposed between the emitting layer 322 and the counter electrode 330.

[0096] The first functional layer 321 may include a hole injection layer (HIL) and / or a hole transport layer (HTL).

[0097] The hole injection layer allows holes to be easily released to the anode, and the hole transport layer allows holes from the hole injection layer to be transported to the light emitting layer.

[0098] The hole injection layer may be formed from a phthalocyanine compound such as copper phthalocyanine, N,N'-diphenyl-N,N'-bis-[4-(phenyl-m-tolyl-amino)-phenyl]-biphenyl-4,4'-diamine (DNTPD), 4,4',4"-tris(3-methylphenylphenylamino)triphenylamine (m-MTDATA), 4,4',4"-tris(N,N-diphenylamino)triphenylamine (TDATA), 4,4',4"-tris{N-(2-naphthyl)-N-phenylamino}-triphenylamine (TDATA), 4,4',4"-tris(3-methylphenylphenylamino) ... The polymerizable compound may include, but is not limited to, poly(3,4-ethylenedioxythiophene) / poly(4-styrenesulfonate) (PEDOT / PSS), polyaniline / dodecylbenzenesulfonic acid (PANI / DBSA), polyaniline / camphorsulfonic acid (PANI / CSA) or polyaniline / poly(4-styrenesulfonate) (PANI / PSS).

[0099] The hole transport layer may include, but is not limited to, carbazole derivatives such as N-phenylcarbazole, polyvinylcarbazole; triphenylamine-based materials such as N,N'-bis(3-methylphenyl)-N,N'-diphenyl-[1,1-biphenyl]-4,4'-diamine (TPD), N,N'-di(1-naphthyl)-N,N'-diphenylbenzidine (NPB), 4,4',4"-tris(N-carbazolyl)triphenylamine (TCTA).

[0100] The second functional layer 323 may include an electron transport layer (ETL) and / or an electron injection layer (EIL).

[0101] The electron injection layer facilitates the release of electrons from the cathode, and the electron transport layer allows electrons from the electron injection layer to be transported to the light-emitting layer.

[0102] The electron transport layer may be formed of Alq3, 2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline (BCP), 4,7-diphenyl-1,10-phenanthroline (Bphen), 3-(4-biphenylyl)-4-phenyl-5-tert-butylphenyl-1,2,4-triazole (TAZ), 4-(naphthalen-1-yl)-3,5-diphenyl-4H-1,2,4-triazole (NTAZ), 2-(4-biphenyl The suitable cation exchange materials may include, but are not limited to, bis(2-methyl-8-quinolinolato-N1,O8)-(1,1'-biphenyl-4-olate)aluminum (BAlq), beryllium bis(benzoquinolin-10-olate (Bebq2), 9,10-di(naphthalen-2-yl)anthracene (ADN), and the like.

[0103] The electron injection layer is made of LiF, NaCl, CsF, Li 2 These may include, but are not limited to, materials such as O, BaO, and Liq.

[0104] Here, it goes without saying that the intermediate layer 320 is not necessarily limited thereto and may have various structures. The intermediate layer 320 may include a layer that is integrated across the plurality of pixel electrodes 310, or may include layers patterned to correspond to each of the plurality of pixel electrodes 310. In the following, for convenience of explanation, a detailed explanation will be given mainly on a case where the light emitting layer 322 is patterned to correspond to each of the plurality of pixel electrodes 310, and the first functional layer 321 and the second functional layer 323 are integrally disposed on the substrate 100 across the plurality of pixel electrodes 310.

[0105] The counter electrode 330 is disposed on the first display area DA1 and the second display area DA2, and may be disposed to cover the first display area DA1 and the second display area DA2 as shown in FIGS. 7 and 8. That is, the counter electrode 330 may be integrally formed in a plurality of organic light emitting elements and correspond to a plurality of pixel electrodes 310. In another embodiment, the counter electrode 330 may be disposed to cover an upper portion of the first display area DA1, an upper portion of the second display area DA2, and an upper portion of a part of the non-display area. In the following, for convenience of explanation, a detailed explanation will be given mainly on a case where the counter electrode 330 is disposed to cover an upper portion of the first display area DA1, an upper portion of the second display area DA2, and an upper portion of a part of the non-display area.

[0106] The counter electrode 330 may be a light-transmitting electrode. For example, the counter electrode 330 may be a transparent or semi-transparent electrode, and may be formed of a metal thin film having a small work function, including Li, Ca, LiF / Ca, LiF / Al, Al, Ag, Mg, and compounds thereof. In addition, ITO, IZO, ZnO, or In may be formed on the metal thin film. 2 O 3 A TCO (transparent conductive oxide) film such as may be further disposed.

[0107] The pixel electrode 310 may be a reflective electrode and the counter electrode 330 may be a translucent electrode, so that light emitted from the intermediate layer 320 is emitted toward the counter electrode 330, which is a front emission type. However, the present embodiment is not limited thereto, and the display device may be a rear emission type in which light emitted from the intermediate layer 320 is emitted toward the substrate 100. In that case, the pixel electrode 310 may be a transparent or semi-transparent electrode, and the counter electrode 330 may be a reflective electrode. The display device of the present embodiment may be a double-sided emission type in which light is emitted in both the front and rear directions.

[0108] A capping layer 400 may be disposed on the counter electrode 330. In this case, the capping layer 400 may be in direct contact with the counter electrode 330. The capping layer 400 may have a refractive index lower than that of the counter electrode 330 and higher than that of the first inorganic sealing layer 510. The capping layer 400 may reduce the ratio of light generated from the intermediate layer 320 including the light emitting layer 322 that is totally reflected and not emitted to the outside, thereby improving light efficiency.

[0109] The thickness of the first common layer disposed in the first display area DA1 and the thickness of the second common layer disposed in the second display area DA2 may be different from each other. More specifically, the thickness of the first common layer disposed in the first display area DA1 may be thicker than the thickness of the second common layer disposed in the second display area DA2. For example, the thickness of one of the first functional layer 321, the light-emitting layer 322, the second functional layer 323, the counter electrode 330, or the capping layer 400 may be different from each other in the first display area DA1 and the second display area DA2 illustrated in FIG. 6. For example, the thickness of one of the first functional layer 321, the light-emitting layer 322, the second functional layer 323, the counter electrode 330, or the capping layer 400 disposed in the first display area DA1 may be greater than the thickness of one of the first functional layer 321, the light-emitting layer 322, the second functional layer 323, the counter electrode 330, or the capping layer 400 disposed in the second display area DA2. In particular, one of the first functional layer 321, the light-emitting layer 322, the second functional layer 323, the counter electrode 330 or the capping layer 400 arranged in the first display area DA1 may be deposited by a deposition material that has completely passed through an opened portion of a mask described below, while one of the first functional layer 321, the light-emitting layer 322, the second functional layer 323, the counter electrode 330 or the capping layer 400 arranged in the second display area DA2 may be partially blocked by a rib of the mask.

[0110] In addition, the thickness of one of the first functional layer 321, the light-emitting layer 322, the second functional layer 323, the counter electrode 330, or the capping layer 400 arranged in the second display area DA2 may vary with respect to the width direction of the second display area DA2. In this case, the width direction of the second display area DA2 may be a direction between the X-axis and the Y-axis in FIG. 4. In particular, the width of the second display area DA2 may be measured in a direction perpendicular to the edge of the second display area DA2. In the above case, the thickness of one of the first functional layer 321, the light-emitting layer 322, the second functional layer 323, the counter electrode 330, or the capping layer 400 arranged in the second display area DA2 is the thinnest at any point in the width direction of the second display area DA2. In this case, the thickness of one of the first functional layer 321, the light emitting layer 322, the second functional layer 323, the counter electrode 330, or the capping layer 400 arranged in the second display area DA2 increases linearly from a point in the second display area DA2 where the thickness of one of the first functional layer 321, the light emitting layer 322, the second functional layer 323, the counter electrode 330, or the capping layer 400 arranged in the width direction of the second display area DA2 is the thinnest toward the edge of the second display area DA2. In particular, the thickness of one of the first functional layer 321, the light emitting layer 322, the second functional layer 323, the counter electrode 330, or the capping layer 400 arranged at the edge of the second display area DA2 is the same as or substantially similar to the thickness of one of the first functional layer 321, the light emitting layer 322, the second functional layer 323, the counter electrode 330, or the capping layer 400 arranged in the first display area DA1. In the above case, the point in the second display area DA2 where the thickness of one of the first functional layer 321, the light emitting layer 322, the second functional layer 323, the counter electrode 330, or the capping layer 400 is the thinnest is also the center part of the width of the second display area DA2. That is, the thickness of one of the first functional layer 321, the light emitting layer 322, the second functional layer 323, the counter electrode 330, or the capping layer 400 increases from the center part of the width of the second display area DA2 toward the edge of the second display area DA2. Therefore, the thickness of the second common layer may become thinner from the edge of the second common layer toward the center of the second common layer.

[0111] The thin film encapsulation layer 500 covers the first display area DA1, the second display area DA2, and the non-display area, and can prevent the penetration of external moisture and oxygen. The thin film encapsulation layer 500 can include at least one organic encapsulation layer and at least one inorganic encapsulation layer. Although Figs. 7 and 8 show an example in which the thin film encapsulation layer 500 includes two inorganic encapsulation layers 510 and 530 and one organic encapsulation layer 520, the stacking order and the number of stacking are not limited to the embodiment shown in Figs. 7 and 8.

[0112] The first inorganic sealing layer 510 covers the counter electrode 330 and may include silicon oxide, silicon nitride and / or silicon oxynitride. It goes without saying that, if necessary, other layers such as the capping layer 400 may be interposed between the first inorganic sealing layer 510 and the counter electrode 330. Since the first inorganic sealing layer 510 is formed along the underlying structure, the upper surface of the first inorganic sealing layer 510 is not flat as shown in FIGS. 7 and 8.

[0113] The organic sealing layer 520 covers the first inorganic sealing layer 510, but may have a substantially flat upper surface, unlike the first inorganic sealing layer 510. Specifically, the organic sealing layer 520 may have a substantially flat upper surface in a portion corresponding to the first display area DA1. Such an organic sealing layer 520 may include one or more materials selected from the group consisting of polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyethylene sulfonate, polyoxymethylene, polyarylate, and hexamethyldisiloxane. The second inorganic sealing layer 530 covers the organic sealing layer 520 and may include silicon oxide, silicon nitride, and / or silicon oxynitride.

[0114] As such, the thin film encapsulation layer 500 includes the first inorganic encapsulation layer 510, the organic encapsulation layer 520, and the second inorganic encapsulation layer 530. Even if a crack occurs in the thin film encapsulation layer 500 through such a multi-layer structure, such a crack does not connect between the first inorganic encapsulation layer 510 and the organic encapsulation layer 520, or between the organic encapsulation layer 520 and the second inorganic encapsulation layer 530. Therefore, it is possible to prevent or minimize the formation of a path through which moisture or oxygen from the outside permeates into the first display area DA1, the second display area DA2, and the non-display area. Such a second inorganic encapsulation layer 530 does not expose the organic encapsulation layer 520 to the outside by contacting the first inorganic encapsulation layer 510 at its edge located outside the first display area DA1 and the second display area DA2.

[0115] In the non-display area of ​​the substrate 100, a partition wall 120 is disposed.

[0116] The partition 120 can prevent the organic material from flowing to the edge side of the substrate 100 when forming the organic sealing layer 520 of the thin film encapsulation layer 500 for sealing the first display area DA1 and the non-display area, thereby preventing the formation of an edge tail of the organic sealing layer 520.

[0117] There may be at least one partition 120 as described above. In the case where a plurality of partitions 120 are provided, the plurality of partitions 120 include a first partition 120A and a second partition 120B spaced apart from each other.

[0118] At least one of the first partition 120A and the second partition 120B may be formed in a multi-layer structure. In FIG. 7, the first partition 120A is illustrated as a structure in which a first layer 121A formed of the same material as the planarization layer 109 and a second layer 123A formed of the same material as the pixel defining layer 112 are stacked, and the second partition 120B is illustrated as a structure in which a first layer 121B formed of the same material as the planarization layer 109 and a second layer 123B formed of the same material as the pixel defining layer 112 are stacked. However, the present invention is not limited thereto. One of the first partition 120A and the second partition 120B may be formed in a single layer, or may have a two-layer structure, or may have a three-layer structure. In addition, an additional partition spaced apart from the first partition 120A and the second partition 120B may be further included.

[0119] 7 and 8, the spacers may be disposed on the flat portion of the pixel defining film 112 and protrude from the flat surface of the pixel defining film 112 into the thin film encapsulation layer 500. The spacers may be formed of an organic material such as polyimide or hexamethyldisiloxane (HMDSO).

[0120] Since the partition 120 includes a plurality of partitions, overflow of the organic material can be more effectively prevented when the organic sealing layer 520 is formed.

[0121] FIG. 9 is a cross-sectional view showing a display panel according to another embodiment of the present invention.

[0122] 9, the substrate 100 may not include a through hole corresponding to the opening region OP. The display layer 200 may include a through hole 200H corresponding to the opening region OP. The thin film sealing layer 500 may not include a through hole corresponding to the opening region OP. In this case, the insulating film may not be disposed in the opening region OP.

[0123] In the above case, the display panel 10 may include a first display area DA1, a second display area DA2, a first non-display area NDA1, and a second non-display area NDA2. In this case, the first display area DA1, the second display area DA2, the first non-display area NDA1, and the second non-display area NDA2 are the same as or similar to those described in Figures 1 to 8, and therefore detailed description thereof will be omitted.

[0124] FIG. 10 is a cross-sectional view showing a display panel according to still another embodiment of the present invention.

[0125] 10, the display layer 200 may not include a through hole 200H corresponding to the opening region OP, and the display element layer 200A may not be located in the opening region OP. In this case, the opening region OP may include a pixel circuit layer 200B in the display layer 200, or an insulating film in the pixel circuit layer 200B. As another embodiment, it is also possible that no additional layer other than the substrate 100 is disposed in the opening region OP.

[0126] In the above case, the display panel 10 may include a first display area DA1, a second display area DA2, a first non-display area NDA1, and a second non-display area NDA2. In this case, the first display area DA1, the second display area DA2, the first non-display area NDA1, and the second non-display area NDA2 are the same as or similar to those described in Figures 1 to 8, and therefore detailed description thereof will be omitted.

[0127] 11 is a cross-sectional view of a display panel according to still another embodiment of the present invention, and FIG 12 is a cross-sectional view of the display panel shown in FIG 11.

[0128] 11 and 12, unlike the above-described display panel 10 having the thin film encapsulation layer 500, the display panel 10' shown in FIGS.

[0129] One or more of the substrate 100, the display layer 200 and the encapsulation substrate 500A may have through holes 100H, 200H, 500AH corresponding to the opening region OP. The display element layer 200A does not have to be disposed in the opening region OP.

[0130] The substrate 100 may include glass or a polymer resin. The polymer resin may include a polymer resin such as polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, or cellulose acetate propionate. The substrate 100 may also have a multi-layer structure including a layer including the above-mentioned polymer resin and an inorganic layer (not shown). In the following, for convenience of explanation, a detailed explanation will be given mainly on the case where the substrate 100 is made of glass.

[0131] The sealing part 700 may be disposed between the substrate 100 and the encapsulation substrate 500A. The sealing part 700 may be disposed in the opening area OP and the second non-display area NDA2. In this case, the sealing part 700 may be disposed in the second non-display area NDA2, and the sealing part 700 disposed in the second non-display area NDA2 may be disposed to completely surround the opening area OP.

[0132] The encapsulation substrate 500A may be disposed opposite the substrate 100. In such a case, the encapsulation substrate 500A may be made of the same or similar material as the substrate 100. In particular, the encapsulation substrate 500A may be made of glass. In another embodiment, the encapsulation substrate 500A may include plastic. In this case, the encapsulation substrate 500A may include at least one or more layers including at least one or more resins.

[0133] The dummy wiring 220 may be disposed in the first non-display area NDA1 and the second non-display area NDA2 when manufacturing the source electrodes S1, S2 and / or the drain electrodes D1, D2. In particular, the dummy wiring 220 may be disposed in a portion of the substrate 100 where the sealing portion 700 is disposed.

[0134] In the above case, the sealing portion 700 can firmly bond the substrate 100 and the sealing substrate 500A.

[0135] In the above-mentioned case, the first display area DA1, the second display area DA2, the first non-display area NDA1 and the second non-display area NDA2 are similar to those described in Figures 1 to 8 above, so detailed description will be omitted.

[0136] FIG. 13 is a cross-sectional view showing a display panel according to still another embodiment of the present invention.

[0137] 13, the display panel 10' may have a through-hole 500AH formed only in the encapsulation substrate 500A. In this case, a separate display element layer 200A may not be disposed in the opening region OP. Also, the pixel circuit layer 200B may not be formed in the opening region OP. In this case, the through-hole 500AH in the encapsulation substrate 500A may be formed through a removal portion including a drill.

[0138] In the above-mentioned case, the first display area DA1, the second display area DA2, the first non-display area NDA1 and the second non-display area NDA2 are similar to those described in Figures 1 to 8 above, so detailed description will be omitted.

[0139] FIG. 14 is a cross-sectional view showing a display panel according to still another embodiment of the present invention.

[0140] 14, the display panel 10' may not include a separate through-hole in the opening region OP. In such a case, the pixel circuit layer 200B may be disposed in the opening region OP, and the display element layer 200A may not be present. In this case, the pixel circuit layer 200B may be disposed in the display layer 200, or an insulating film may be disposed in the pixel circuit layer 200B in the opening region OP. As another embodiment, it is also possible that no separate layer is disposed in the opening region OP other than the substrate 100. Also, the sealing part 700 may be disposed only in the first non-display area NDA1.

[0141] In the above case, the first display area DA1, the second display area DA2, the first non-display area NDA1 and the second non-display area NDA2 are similar to those described with reference to FIGS. 1 to 8, and therefore detailed description thereof will be omitted.

[0142] Fig. 15 is a cross-sectional view showing a display device manufacturing apparatus for manufacturing a display device according to an embodiment of the present invention. Fig. 16 is a perspective view showing a mask assembly shown in Fig. 15. Fig. 17 is a cross-sectional view taken along line CC' in Fig. 16.

[0143] 15 to 17, a display device manufacturing apparatus 800 may include a chamber 810, a first supporting unit 820, a second supporting unit 830, a mask assembly 840, a source unit 860, a pressure adjusting unit 870, and a vision unit 880.

[0144] The chamber 810 has a space formed therein, and deposition is performed in the chamber 810. At this time, an open portion is formed in the chamber 810, and a gate valve 811 is disposed in the open portion so that the open portion can be closed or opened.

[0145] The first support 820 is disposed inside the chamber 810 and can support the display substrate D. As shown in Figs. 7, 8 and 12, the display substrate D may include a substrate 100, a buffer layer 101, a first gate insulating layer 103, a second gate insulating layer 105, an interlayer insulating layer 107, a planarization layer 109, a pixel defining film 112, a pixel electrode 310, a first thin film transistor T1, a second thin film transistor T2, and a storage capacitor Cst.

[0146] The first support 820 may have various shapes. For example, the first support 820 may be fixed inside the chamber 810, and the display substrate D may be placed on the first support 820. As another embodiment, the first support 820 may have a shuttle shape that is linearly movable inside the chamber 810. As yet another embodiment, the first support 820 may be disposed inside the chamber 810 and have a clamp shape that holds the display substrate D. As yet another embodiment, the first support 820 may include an electrostatic chuck or an adhesive chuck that is disposed in the chamber 810 and fixes the display substrate D. In this case, the first support 820 is not limited to the above and may include all devices and structures that support the display substrate D. However, in the following, for convenience of explanation, a detailed explanation will be given mainly on a case where the first support 820 is fixed inside the chamber 810 and the display substrate D is placed thereon.

[0147] The mask assembly 840 is disposed on the second support part 830, and can support the mask assembly 840. At this time, the second support part 830 can adjust the position of the mask assembly 840. For example, the second support part 830 can raise and lower the mask assembly 840 by a certain distance, rotate the mask assembly 840, or linearly move the mask assembly 840 in one direction.

[0148] The mask assembly 840 can selectively pass the deposition material. In this case, the mask assembly 840 may include at least one opening 842a-1. For example, as an embodiment, the mask assembly 840 may include one opening 842a-1 through which the deposition material passes. In this case, the deposition material that passes through the opening 842a-1 may be deposited on one region of the display substrate D to form one display region. In another embodiment, the mask assembly 840 may include a plurality of openings 842a-1 through which the deposition material passes. In this case, the display substrate D is divided into a plurality of regions, and the deposition material that passes through each opening 842a-1 may be deposited on each region of the display substrate D to form one display region in each region. In particular, in this case, each region of the display substrate D may be separated from each other after the deposition material is deposited, and thus one display device may be manufactured. In the following, for convenience of explanation, a detailed explanation will be given mainly on a case where the mask assembly 840 includes a plurality of openings 842a-1.

[0149] In one embodiment, the mask assembly 840 may include a mask sheet 842. In another embodiment, the mask assembly 840 may include a mask frame 841 and a mask sheet 842. For ease of explanation, the mask assembly 840 will be described in detail below mainly in the case where it includes the mask frame 841 and the mask sheet 842.

[0150] The mask frame 841 may have an opening 841a in the center. The mask frame 841 may have a shape like a window frame.

[0151] The mask sheet 842 may be disposed on the mask frame 841. One or more mask sheets 842 may be included. When a plurality of mask sheets 842 are included, the plurality of mask sheets 842 may be formed in a plate shape and arranged on the mask frame 841 to be adjacent to each other. For example, the mask sheets 842 may be arranged to be spaced apart from each other in the longitudinal direction of the mask frame 841 (e.g., the X-axis direction in FIG. 10) or the width direction of the mask frame 841 (e.g., the Y-axis direction in FIG. 10). However, for ease of explanation, the following detailed description will be given mainly on the case where the mask sheet 842 is formed of a single sheet.

[0152] The mask sheet 842 may include a body portion 842a, a shielding portion 842b, and a rib 842c.

[0153] The body part 842a may include a plurality of openings 842a-1 arranged to correspond to each region of the display substrate D. The openings 842a-1 may have a shape corresponding to the display region of each region of the display substrate D. At this time, the deposition material passing through the openings 842a-1 may be deposited on each region of the display substrate D to form the display region. At this time, after forming the plurality of display regions in each region of the display substrate D, the display substrates D may be separated from each other to manufacture one display panel. As another embodiment, the body part 842a may include one opening 842a-1 to guide the deposition material to the display region of one display substrate D to manufacture one display panel. Hereinafter, for convenience of explanation, a detailed explanation will be given mainly on the case where the body part 842a includes a plurality of openings 842a-1.

[0154] The shielding portion 842b may be connected to the rib 842c so as to protrude toward the display substrate D. One surface of the shielding portion 842b (or an end of the shielding portion 842b) may be disposed so as to be farther away from the source portion 860 than one surface of the rib 842c. In this case, the shielding portion 842b may have a planar shape corresponding to the shape of the opening region described above. For example, when the opening region to be formed is circular, the shielding portion 842b may be formed to have a circular planar shape. In another embodiment, when the opening region to be formed is polygonal, the shielding portion 842b may be formed to have a polygonal planar shape. In this case, the planar shape of the shielding portion 842b is not limited to the above, and may be formed to correspond to the shape of the opening region depending on the shape of the opening region.

[0155] The surface of the shielding portion 842b facing the display substrate D as described above may be disposed closer to the display substrate D than the surface of the body portion 842a facing the display substrate D. In such a case, the shielding portion 842b may be in complete contact with the display substrate D.

[0156] The rib 842c may extend obliquely with respect to the longitudinal direction of the mask sheet 842 (for example, one of the X-axis direction and the Y-axis direction in FIG. 16). In this case, the rib 842c may be disposed inside the opening 842a-1. That is, the rib 842c may be disposed so as to cross the opening 842a-1.

[0157] In the above-mentioned case, the first distance I1 from one surface of the rib 842c facing the display substrate D to one surface of the shielding portion 842b facing the display substrate D is 2.7×10 times the second distance I2 from one surface of the rib 842c facing the source portion 860 to the source portion 860. -4 In this case, the first distance I1 may be 2.7×10 times the second distance I2. -4If the thickness is less than 100 nm, the deposition material is deposited on the portion of the display substrate D located on the rear surface of the shielding portion 842b, and one of the first functional layer 321, the light-emitting layer 322, the second functional layer 323, the counter electrode 330 or the capping layer 400 is formed in the aforementioned opening region, thereby reducing the transmittance in the opening region.

[0158] The mask frame 841 and / or the mask sheet 842 may further include a magnetic body 843. In this case, when the mask frame 841 includes the magnetic body 843, the mask frame 841 itself may be made of a magnetic body, or as shown in FIG. 10, a plurality of magnetic bodies 843 may be provided and disposed on the mask frame 841 so as to be spaced apart from each other. In addition, when the mask sheet 842 includes the magnetic body 843, the mask sheet 842 itself may be made of a magnetic body. As shown in FIG. 10, a plurality of magnetic bodies 843 may be provided and disposed on the body part 842a so as to be spaced apart from each other. In the following, for convenience of explanation, a detailed explanation will be given mainly on the case where the mask sheet 842 includes a plurality of magnetic bodies 843.

[0159] The mask frame 841 and / or the mask sheet 842 as described above may include carbon fiber. In one embodiment, the mask sheet 842 is made of carbon fiber, and the mask frame 841 is made of a magnetic material or an invar material. In another embodiment, the mask frame 841 and the body part 842a may be made of a magnetic material or an invar material, and the rib 842c and the shielding part 842b may be made of carbon fiber. In such a case, the rib 842c may be fixed to the body part 842a by a bolt or a screw, or may be fixed to the body part 842a by a separate adhesive material (e.g., a toll seal such as a VAC seal (high vacuum leak sealant)). In yet another embodiment, the mask frame 841, the body part 842a, and the rib 842c may be made of a magnetic material or an invar material, and only the shielding part 842b may be made of carbon fiber. In yet another embodiment, both the mask frame 841 and the mask sheet 842 may be made of carbon fiber. For ease of explanation, the following detailed description will be centered on the case where the mask sheet 842 is integrally formed and made of carbon fiber.

[0160] The display device manufacturing apparatus 800 may further include a magnetic force generator 850 disposed in the chamber 810. In this case, the magnetic force generator 850 may or may not be included depending on the shape of the mask assembly 840. For ease of explanation, the display device manufacturing apparatus 800 will be described in detail below mainly in the case where the magnetic force generator 850 is included.

[0161] The magnetic force generating unit 850 is disposed inside the chamber 810 and can bring the mask assembly 840 into close contact with the display substrate D. In such a case, the magnetic force generating unit 850 may include at least one of a magnet and an electromagnet that generate a magnetic force.

[0162] The source unit 860 may accommodate a deposition material and sublimate or vaporize the deposition material. In this case, the source unit 860 may include a heater to apply heat to the deposition material. In addition, the source unit 860 may include a crucible to accommodate the deposition material. The source unit 860 may be stationary inside the chamber 810 or may move linearly and reciprocate in one direction inside the chamber 810. In this case, when the source unit 860 moves, a source driver (not shown) for moving the source unit 860 linearly and reciprocally may be disposed in the chamber 810. In this case, the source driver may include a linear motor. However, in the following, for convenience of explanation, a detailed explanation will be given mainly on the case where the source unit 860 is fixed inside the chamber 810.

[0163] The vision unit 880 is disposed in the chamber 810 and can photograph at least one of the display substrate D and the mask assembly 840. Based on the data photographed by the vision unit 880, the display substrate D and the mask assembly 840 can be aligned.

[0164] The pressure adjusting unit 870 is connected to the chamber 810 and can adjust the pressure inside the chamber 810. The pressure adjusting unit 870 may include a guide pipe 871 connected to the chamber 810 and a vacuum pump 872 disposed in the guide pipe 871 and adjusting the pressure inside the chamber 810. In this case, gas inside the chamber 810 can be exhausted to the outside or a separate gas can be supplied into the chamber 810 by operating the vacuum pump 872.

[0165] When a display device (not shown) is manufactured using the display device manufacturing apparatus 800 as described above, a display substrate D can be placed inside a chamber 810. At this time, a mask assembly 840 can be placed inside the chamber 810.

[0166] In such a case, the display substrate D may be disposed on a first support 820 and the mask assembly 840 may be disposed on a second support 830 .

[0167] As described above, when the display substrate D and the mask assembly 840 are arranged, the display substrate D and the mask assembly 840 can be aligned by photographing and comparing the alignment marks of the display substrate D and the mask assembly 840 via the vision unit 880. At this time, the second support unit 830 can finely adjust the position of the mask assembly 840.

[0168] The magnetic force generating unit 850 can apply a magnetic force to the mask assembly 840. As described above, when the magnetic force generating unit 850 applies a magnetic force, the mask assembly 840 can move toward the display substrate D.

[0169] In the above-mentioned case, the shielding portion 842b can be in contact with one surface of the display substrate D or can be adjacent to the display substrate D by being completely attached to the display substrate D.

[0170] The source unit 860 may be operated to supply a deposition material into the chamber 810. At this time, the deposition material may pass through the opening 842a-1 and be deposited on the display substrate D. In such a case, the deposition material that has passed through the opening 842a-1 may be deposited on a first display region (not shown) and a second display region (not shown) of the display substrate D.

[0171] In the above case, a portion of the display substrate D is exposed to the outside through the opening 842a-1, and the other portion of the display substrate D may not be exposed to the outside due to the portion of the mask sheet 842 where the opening 842a-1 is not formed, the rib 842c, and the shielding portion 842b. In this case, the deposition material may be deposited on the exposed portion of the display substrate D.

[0172] As described above, the deposition material is also blocked by the rib 842c while being deposited. However, since the deposition material sprayed from the source unit 860 has various incident angles on the display substrate D, some of the deposition material is also deposited on the portion of the display substrate D facing the rib 842c. That is, when the deposition material sprayed from the source unit 860 has an angle greater than or equal to a certain angle between the deposition material and one surface of the display substrate D on which the deposition material is deposited, the deposition material is incident at an angle to the one surface of the display substrate D, so that the deposition material can reach the portion of the display substrate D disposed behind the rib 842c. In particular, the deposition material sprayed from the source unit 860 that avoids the rib 842c is deposited on the display substrate D, so that the deposition material is deposited on the display region of the display substrate D disposed behind the rib 842c even when the rib 842c is disposed. In such a case, the ribs 842c are disposed to be spaced apart from the display substrate D to a certain extent, so that the deposition material is not hindered from being deposited on the portion of the display substrate D disposed behind the ribs 842c.

[0173] When the deposition material is deposited in this manner, the shielding portion 842b is completely attached to the display substrate D as described above, so that the deposition material is not deposited on the portion of the display substrate D where the shielding portion 842b is arranged. Therefore, the deposition material is deposited on the remaining area of ​​the display region of the display substrate D excluding the shielding portion 842b from the display region. In addition, since the deposition material is not deposited on the portion where the shielding portion 842b is arranged, a second non-display area and an opening area where the deposition material is not deposited can be formed on the display substrate D.

[0174] While the above-mentioned operations are being carried out, the vacuum pump 872 is operated to exhaust the gas inside the chamber 810 to the outside.

[0175] After the above-mentioned processes are completed, the mask assembly 840 can be pulled out of the chamber 810. At this time, the vacuum pump 872 can be operated to adjust the pressure inside the chamber 810 to be the same as or similar to atmospheric pressure.

[0176] Thereafter, the display substrate D may be removed from the chamber 810, and a new display substrate D may be inserted into the chamber 810, and the above-described process may be repeated. As described above, the display substrate D on which the deposition material is deposited may have holes formed or some layers removed by irradiating the opening region with a laser or by mechanical abrasion.

[0177] After the above steps are completed, a thin film encapsulation layer can be formed on the display substrate D on which the deposition material is deposited.

[0178] Therefore, the display device manufacturing apparatus 800 and the display device manufacturing method can manufacture a display device having an opening region formed therein. In addition, the display device manufacturing apparatus 800 and the display device manufacturing method can minimize foreign matter generated when the opening region is formed by preventing a deposition material from being applied to the opening region through a simple structure.

[0179] FIG. 18 is a cross-sectional view showing another embodiment of the mask sheet shown in FIG.

[0180] 18, a mask assembly 840 may include a mask sheet 842. In this case, the mask sheet 842 may include a body portion 842a, a shielding portion 842b, and ribs 842c. In this case, the body portion 842a, the shielding portion 842b, and the ribs 842c are similar to those described in FIGS. 15 to 17, and therefore detailed description thereof will be omitted.

[0181] One surface of the shielding portion 842b facing the display substrate D and one surface of the body portion 842a facing the display substrate D may be spaced apart from the display substrate D by the same distance. In this case, the mask sheet 842 is in complete contact with the display substrate D, thereby minimizing deformation of the mask sheet 842 even when a force is applied from the outside. In particular, the mask sheet 842 can be prevented from being deformed by a force applied to the display substrate D. In addition, by being in close contact with the display substrate D, deformation of the mask sheet 842 due to twisting of the mask sheet 842 caused by a high-temperature deposition material can be reduced.

[0182] FIG. 19 is a cross-sectional view showing still another embodiment of the mask sheet shown in FIG.

[0183] 19, a mask assembly 840 may include a mask sheet 842. In this case, the mask sheet 842 may include a body portion 842a, a shielding portion 842b, and a rib 842c. In this case, the body portion 842a, the shielding portion 842b, and the rib 842c are similar to those described in FIGS. 15 to 17, and therefore detailed description thereof will be omitted.

[0184] The body portion 842a and the rib 842c may be formed to be separated from each other. In this case, the body portion 842a and the rib 842c may be formed from different materials. For example, the body portion 842a may include a magnetic material or Invar, and the rib 842c may be formed from carbon fiber. In this case, the shielding portion 842b may also be formed from carbon fiber.

[0185] In the above-mentioned case, the body portion 842a may be formed with a mounting groove 842d in which the end of the rib 842c is placed. In this case, an adhesive 844 may be disposed between the rib 842c and the body portion 842a. In this case, the adhesive 844 may include a toll seal as described above.

[0186] In the above-mentioned case, one surface of the shielding portion 842b facing the display substrate D and one surface of the body portion 842a may be disposed at the same distance from the display substrate D, or may be disposed at different distances from the display substrate D. In such a case, the distance from the display substrate D to the one surface of the shielding portion 842b facing the display substrate D may be equal to or less than the distance from the display substrate D to the one surface of the body portion 842a.

[0187] Therefore, in the above-mentioned case, the deposition material can be prevented from being deposited on a portion of the display substrate D through the shielding portion 842b.

[0188] FIG. 20 is a cross-sectional view showing how the deposition material that has passed through the ribs shown in FIGS. 17 to 19 is deposited on a display substrate.

[0189] Referring to FIG. 20, when deposition material DM is deposited on display substrate D through mask assembly 840 shown in FIGS. 15 to 19, a portion of deposition material DM is blocked by rib 842c in the portion of display substrate D opposite rib 842c.

[0190] In such a case, the deposition material DM supplied from a source portion (not shown) is incident on one side of the display substrate D at various angles or directions, so that another portion of the deposition material DM is not blocked by the rib 842c and can reach the portion of the display substrate D arranged opposite the rib 842c.

[0191] In the above-described case, the deposition material DM that has passed through the edge portion of the rib 842c can reach the display substrate D portion of the centerline CL that passes through the center of the rib 842c, and the deposition material DM proceeding from the edge of the rib 842c to the center of the rib 842c may be blocked by the rib 842c.

[0192] In such a case, the thickness of the deposition material DM deposited on the display substrate D becomes linearly thicker as it becomes farther from the center line CL passing through the center of the rib 842c. That is, the thickness of the deposition material in the second display area DA2 formed by depositing the deposition material DM on the display substrate D may vary along the width direction of the second display area DA2. Specifically, the thickness of the deposition material in the second display area DA2 becomes linearly thicker as it moves from an arbitrary point (e.g., the center point) of the second display area DA2 to an edge of the second display area DA2 (e.g., the boundary between the first display area DA1 and the second display area DA2). Also, the thickness of the deposition material at the edge of the second display area DA2 is almost similar or the same as the thickness of the deposition material in the first display area DA1.

[0193] Although the present invention has been described above with reference to the embodiments shown in the drawings, these are merely illustrative, and those skilled in the art will understand that various modifications and variations of the embodiments are possible therefrom. Therefore, the true technical scope of the present invention is defined by the technical ideas of the claims. [Explanation of symbols]

[0194] 1...Display device 10,10'···Display panel 30. Components 40 Input sensing layer 50...Optical functional layer 60... Window 100... Substrate 101 Buffer layer 103: First gate insulating layer 105: Second gate insulating layer 107 Interlayer insulation layer 109...flattening layer 112...Pixel-defined membrane 120...Bulkhead 200...display layer 200A···Display element layer 200B Pixel circuit layer 220...Dummy wiring 300 Organic light-emitting device 310...Pixel electrode 320 Middle class 321...1st functional layer 322...Emitting layer 323...2nd functional layer 330... Counter electrode 400···Capping layer 500...Thin film sealing layer 510...first inorganic sealing layer 520...Organic sealing layer 530...Second inorganic sealing layer 700···Sealing part 800....Display device manufacturing equipment 810...Chamber 820...1st support part 830...Second support part 840... Mask assembly 841···Mask frame 842 Mask sheet 842a···Body 842b...Shielding part 842c···Rib 843...Magnetic material 844...Adhesive 850 Magnetic force generating unit 860 Source section 870 Pressure adjustment unit 871···Pilot piping 872 Vacuum pump 880 Vision Department 1100...Scan driver 1200 Data driver

Claims

1. a substrate including a first display area, an opening area disposed inside the first display area, a peripheral area disposed so as to surround at least a portion of the opening area, and a second display area connected from the peripheral area to an edge of the first display area; a pixel defining layer disposed on the substrate, the pixel defining layer having at least one first opening disposed in the first display region and at least one second opening disposed in the second display region; a first common layer disposed in the first opening, commonly formed in the first display area, and including a deposition material; a second common layer disposed in the second opening, commonly formed in the second display area, and including a deposition material; the second display area is disposed linearly and obliquely with respect to one direction of the first display area so as to face one vertex of the first display area, a thickness of the second common layer in a width direction of the second display area is thinner than a thickness of the first common layer and becomes thinner from an edge of the second display area to a center of the second display area; the open area is free of deposition material; Display device.

2. The first common layer and the second common layer are 2. The display device according to claim 1, further comprising at least one intermediate layer interposed between the pixel electrode and the counter electrode, and at least one of the counter electrodes.

3. The display device according to claim 1 , wherein the edge of the first display area is a rectangle.

4. The display device according to claim 1 , wherein a through hole is arranged in the opening region.

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