Film forming device, alignment method, and method for manufacturing electronic device

Abstract

To provide a film forming device capable of improving the accuracy of positioning between a substrate and a mask; an alignment method; and a method for manufacturing an electronic device.SOLUTION: A film forming device 1 forms a thin film on a substrate 30 via a mask 40, where the film forming device is characterized by including: a mask placement table 124 that includes a positioning member 125 for positioning the mask 40; an optical fiber 72 that is provided to the mask placement table 124 and that constitutes a confirmation means for confirming the relative positional relationship between the mask 40 positioned by the positioning member 125 and the substrate 30; and a flow path 83 provided to the mask placement table 124 and disposed between the optical fiber 72 and the positioning member 125.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a film forming apparatus, an alignment method, and a method for manufacturing an electronic device.

Background Art

[0002] Organic EL display devices (organic EL displays) are applied not only to smartphones, TVs, and automotive displays, but also to VR HMDs (Virtual Reality HeadMount Displays) and other fields. In particular, displays used in VR HMDs are required to form pixel patterns with high precision, such as reducing user dizziness, and further higher resolution is required.

[0003] In the manufacture of an organic EL display device, when forming an organic light emitting element (organic EL element; OLED) that constitutes the organic EL display device, a film forming material emitted from a film forming source is formed on a substrate through a mask on which a pixel pattern is formed, thereby forming an organic layer or a metal layer. In such a device, in order to improve film forming accuracy, the relative positional relationship between the substrate and the mask is measured (confirmed) before the film forming process. When the positional relationship is deviated, an alignment process is performed in which the substrate and the mask are relatively moved for position adjustment. In this process, a method is often adopted in which an alignment mark formed on at least one of the substrate and the mask is imaged by an imaging means such as a camera, and the relative positional relationship between the substrate and the mask is measured by detecting this mark.

[0004] With the increase in the resolution of displays, the allowable error in substrate positioning has become stricter year by year. Generally, high precision of 10 μm or less is required, and in recent years, high precision of 3 μm or less is not uncommon. In the latest VR and HMDs, even higher precision is required, and the precision reaches 1 μm or less. Therefore, as described above, it is common to perform substrate positioning by inserting an alignment process before the film formation process. When the method of imaging marks with a camera is used as described above, a method of arranging a light source or a light introducer at a position facing the camera with the mark sandwiched therebetween is known to improve mark recognition efficiency. For example, Patent Document 1 discloses a technique of irradiating light onto a mark at a desired position by using an optical fiber as a light introducer through an introduction portion on the device wall surface in order to introduce light into the interior of the device in a vacuum environment.

[0005] In this technique, the light introducer generates heat due to energy loss that occurs when introducing light. Therefore, the member to which the light introducer is attached is deformed by linear expansion. When a configuration in which a mask is placed on this member is adopted, there is a concern that the positioning of the mask becomes unstable due to the above-described linear expansion.

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0007] For example, when high precision with a relative positional deviation amount between the substrate and the mask of 1 μm or less is required, a decrease in the positioning accuracy of the mask caused by the linear expansion of the member on which the mask is placed, which has not been a problem conventionally, becomes an issue.

[0008] An object of the present invention is a film forming apparatus and an alignment device capable of improving the positioning accuracy between a substrate and a mask. An object of the present invention is to provide a film forming method and a method for manufacturing an electronic device.

Means for Solving the Problem

[0009] The present invention employs the following means to solve the above problems.

[0010] The film forming apparatus of the present invention is a film forming apparatus for forming a thin film on a substrate through a mask, a mask mounting table having a positioning member for positioning the mask, a confirmation means component provided on the mask mounting table for constituting a confirmation means for confirming the relative positional relationship between the mask positioned by the positioning member and the substrate, a cooling means provided on the mask mounting table and provided between the confirmation means component and the positioning member, and is characterized by comprising the above.

[0011] The alignment method of the present invention is an alignment method for performing relative positioning between a substrate to be film formed and a mask disposed on the film forming surface side of the substrate during film formation, a positioning step of positioning the mask on a positioning member provided on a mask mounting table, a cooling step of cooling a portion between the positioning member and a confirmation means component provided on the mask mounting table and constituting a confirmation means for confirming the relative positional relationship between the mask and the substrate on the mask mounting table by a cooling means, an alignment step of performing relative positioning between the substrate and the mask during a period in which the mask mounting table is cooled by the cooling means, and is characterized by comprising the above.

[0012] The method for manufacturing an electronic device of the present invention is characterized by having a film forming step of forming a film on the substrate after relative positioning between the substrate and the mask is performed by the above alignment method.

Effects of the Invention

[0013] As described above, according to the present invention, the positioning accuracy between the substrate and the mask can be improved.

Brief Description of the Drawings

[0014]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Embodiments for Carrying Out the Invention

[0015] Hereinafter, with reference to the drawings, embodiments for carrying out this invention will be exemplarily and specifically described based on examples. However, the dimensions, materials, shapes, relative arrangements, etc. of the components described in these examples are not intended to limit the scope of this invention only to those, unless otherwise specifically described.

[0016] (Example 1) With reference to FIGS. 1 to 3, a film forming apparatus, an alignment method, and an electric according to Example 1 of the present invention A method for manufacturing a sub-device will be described. FIG. 1 is a schematic configuration diagram of the interior of a film forming apparatus according to Example 1 as viewed from the front side. FIG. 2 is a schematic cross-sectional view of the film forming apparatus according to Example 1, which corresponds to the AA cross-sectional view in FIG. 1, and the configuration of each part is shown schematically. FIG. 3 is a flowchart of the alignment operation of the film forming apparatus according to Example 1. In FIGS. 1 and 2, various configurations provided outside the chamber of the film forming apparatus are also shown schematically. Also, FIGS. 1 and 2 show the X, Y, and Z axes. The Z axis extends in a direction parallel to the vertical direction, the X and Y axes extend in a direction parallel to the horizontal plane, and the X axis and the Y axis are orthogonal. In the following description, the direction of rotation about the central axis parallel to the X-axis direction is referred to as the "θx direction", the direction of rotation about the central axis parallel to the Y-axis direction is referred to as the "θy direction", and the direction of rotation about the central axis parallel to the Z-axis direction is referred to as the "θz direction".

[0017] <Film forming apparatus> The film forming apparatus 1 includes a chamber 10 and a film forming unit 20 disposed inside the chamber 10. The chamber 10 is generally composed of a chamber side wall 11, a chamber top plate 12, and a chamber bottom plate 13. These are fixed in a state where an airtight state is maintained by welding or a sealing member (not shown), thereby constituting the chamber 10. As a result, the inside of the chamber 10 can be maintained in a vacuum atmosphere or an inert gas atmosphere. The chamber 10 is supported by a support base (not shown). A part of this support base is installed on the floor on which the film forming apparatus 1 is installed, and is fixed to the chamber 10 and the floor. The film forming unit 20 is disposed on the chamber bottom plate 13. The film forming unit 20 is composed of a film forming source 21 that emits a film forming substance, a linear guide 22 that enables the film forming source 21 to reciprocate, and a mechanism (not shown) for reciprocating the film forming source 21 along the linear guide 22. Since the range in which film formation can be performed by the film forming source 21 is limited, by configuring the film forming source 21 to be able to reciprocate while performing film formation, film formation over a wide range becomes possible. The film forming substance emitted from the film forming source 21 adheres to the substrate 30 through a mask 40 disposed above the film forming source 21, thereby forming a thin film on the substrate 30 that is the film formation target.

[0018] When a vacuum evaporation apparatus is applied as the film forming apparatus 1, the film forming source 21 is an evaporation source, and the film forming material (evaporation material) evaporates or sublimes from the film forming source 21 and is deposited on the substrate 30 through the opening of the mask 40 to form a thin film. Since the evaporation source is a known technique, it will be briefly described here. For example, the evaporation source includes a container (crucible) for accommodating the film forming material, a heater for heating the container, a shutter for stopping the release of the film forming material, a drive mechanism for driving various members such as the shutter, and an evaporation rate monitor for recognizing the thickness of the film to be formed. Note that the film forming source in the present invention is not limited to an evaporation source. When a sputtering apparatus is applied as the film forming apparatus 1, the film forming source corresponds to a sputtering target.

[0019] The mask 40 is provided with an opening at a position corresponding to the position where the thin film is formed on the substrate 30, and is configured to cover the position on the substrate 30 where the thin film is not formed. Thereby, by performing film formation on the substrate 30 through the mask 40, a thin film of a desired pattern (a pattern corresponding to the position where the opening is provided) is formed on the substrate 30. Note that the mask 40 according to the present embodiment is composed of a mask frame 41 provided on the outer periphery and having high rigidity and a mask foil 42 provided inside the mask frame 41 and having low rigidity, and the above-described opening is provided in the mask foil 42.

[0020] In the film forming apparatus 1, a mechanism for performing alignment (adjustment of the relative positional relationship) between the substrate 30 and the mask 40 is provided. Generally, by providing a mechanism for moving and adjusting at least one of the substrate and the mask in at least three axial directions (X-axis direction, Y-axis direction, Z-axis direction) and the θz direction, the alignment between the substrate and the mask can be performed. Such a configuration is also adopted in the present invention. In this embodiment In this example, the mask 40 is configured to be movable and adjustable in three axial directions, and is also configured to be movable and adjustable in the θz direction, and the case where a configuration that is also movable and adjustable in the θx and θy directions is adopted will be described as an example. Note that in this embodiment, the substrate 30 may adopt a configuration that cannot be moved and adjusted, a configuration that can be moved and adjusted only in the Z-axis direction, or a configuration that can be moved and adjusted in a plurality of directions similar to the mask 40. FIG. 1 shows the state after alignment is completed and the mask 40 is brought into contact with the film-forming surface side of the substrate 30. Hereinafter, a mechanism for moving and adjusting the mask 40 will be described.

[0021] <Mechanism for Moving and Adjusting the Mask> The chamber top plate 12 is provided with a mask support mechanism 100 that supports the mask 40 and can adjust the position of the mask 40. This mask support mechanism 100 is roughly composed of an alignment mechanism 110 for adjusting the position of the mask 40 and a holding mechanism 120 for holding the mask 40.

[0022] The alignment mechanism 110 includes a linear guide 111 for moving the mask 40 in the X-axis direction, a linear guide 112 for moving the mask in the Y-axis direction, and a rotary bearing 113 for rotating the mask 40 in the θz direction, and these are connected to each other. The alignment mechanism 110 also includes a drive motor 114 for driving these. Further, the alignment mechanism 110 includes a connection plate 115 for connecting the holding mechanism 120 to the upper surface side of the linear guide 111. Note that the alignment mechanism 110 is arranged at four locations at the four corners of the connection plate 115. By the driving force of the drive motor 114 described above, the connection plate 115 can move in the X-axis direction and the Y-axis direction and can rotate in the θz direction.

[0023] The holding mechanism 120 includes a lifting drive unit 121 mounted on the connection plate 115 and a lifting plate 122 connected to the lifting drive unit 121. The lifting drive unit 121 has a function of lifting the lifting plate 122 in the Z-axis direction by an actuator (not shown). The lifting drive unit 121 may be provided at three locations equally (only two locations are shown in FIG. 1). As the above actuator, various known technologies such as a ball screw mechanism and a rack and pinion mechanism can be adopted. A mask mounting table 124 is attached to the lifting plate 122 via a support column 123. The support column 123 connects the mask mounting table 124 inside the chamber and the lifting plate 122 outside the chamber through a through hole 12a provided in the chamber top plate 12. In order to maintain the vacuum environment inside the chamber, bellows 50 are attached to the support column 123 and the chamber top plate 12. By synchronously driving a plurality of lifting drive units 121, it is possible to linearly move the mask 40 in the Z-axis direction, and by applying different amounts of movement, the posture of the mask 40 can be changed in the direction of rotating (tilting) with respect to the θx direction and the direction of rotating (tilting) with respect to the θy direction. With the above configuration, the mask 40 can be driven in a total of six axes, including three axial directions and three rotational axes, and the position of the mask 40 can be adjusted by relatively moving it with respect to the substrate 30.

[0024] On the upper surface side of the mask mounting table 124, a positioning member 125 for positioning the mask 40 is provided. In the present embodiment, the positioning member 125 has a V-shaped mounting surface when viewed from the side. And on the lower surface of the mask 40, a semi-cylindrical positioning block 43 is provided. By placing the mask 40 on the mask mounting table 124 such that the positioning block 43 is placed on the positioning member 125, at a plurality of locations, the cylindrical surface portion of the positioning block 43 fits into the V-shaped mounting surface of the positioning member 125, and the mask 40 can be placed in a state of being positioned with respect to the mask mounting table 124. In the present embodiment, three positioning members 125 and three positioning blocks 43 are provided respectively. By placing the mask 40 on the mask mounting table 124 configured in this way, the mask 40 is arranged above the deposition source 21 in the vertical direction.

[0025] Here, in order to suppress the thermal deformation of the mask mounting table 124, it is also conceivable to apply a ceramic or a low thermal expansion material with a small coefficient of linear expansion as the material of the mask mounting table 124. However, in the film forming apparatus 1, since the film forming substance accumulates on the mask 40 over time during the film forming process, the mask 40 is replaced at a certain timing after being used for film formation to some extent. During mask replacement, when the mask 40 is placed on the mask mounting table 124, an impact load is transmitted to the mask mounting table 124. When ceramic is adopted as the material of the mask mounting table 124, ceramic is vulnerable to impact and has a high risk of damage. When a low thermal expansion material is adopted as the material of the mask mounting table 124, since the low thermal expansion material has a low hardness, there is a risk that the vicinity where the positioning member 125 is provided on the mask mounting table 124 is locally deformed due to the self-weight of the mask 40 and the impact during positioning. From the above, it is desirable to apply a stainless steel material as the material of the mask mounting table 124.

[0026] In addition, the film forming apparatus 1 has a control unit C. The control unit C has a function of controlling various devices such as the control of the film forming source 21 and the alignment control between the substrate 30 and the mask 40. The control unit C can be configured by, for example, a computer having a processor, a memory, a storage, an I / O, etc. In this case, the function of the control unit C is realized by the processor executing a program stored in the memory or the storage. As the computer, a general-purpose personal computer may be used, or an embedded computer or a PLC (programmable logic controller) may be used. Alternatively, part or all of the functions of the control unit C may be configured by a circuit such as an ASIC or an FPGA.

[0027] <alignment> The alignment between the substrate and the mask will be described. Since the alignment between the substrate and the mask is a known technique, it will be briefly described here. Generally, at least one of the substrate and the mask is provided with an alignment mark. For example, marks are provided on both of them, and these marks are imaged by an imaging means such as a camera, and a configuration is adopted in which the position of at least one of the substrate and the mask is adjusted so that the distance between these marks falls within a predetermined threshold. Also, a configuration can be adopted in which a through hole is provided in one of the substrate and the mask and a mark is provided in the other, and the mark is imaged by a camera. In this case, the position of at least one of the substrate and the mask may be adjusted so that the distance between the center of the mark and the center of the through hole falls within a predetermined threshold. Further, when one of the substrate and the mask is positioned in the apparatus and the positional relationship between the one and the camera is determined, a mark may be provided only on the other. In this case, the position of the other may be adjusted so that the distance between a predetermined position (which can also be called a virtual mark) in the image captured by the camera and the mark falls within a predetermined threshold.

[0028] Also in this embodiment, the above various configurations can be adopted. In this embodiment, as shown in FIG. 1, a configuration is adopted in which a camera 60 as imaging means images an alignment mark provided on at least one of a substrate 30 and a mask 40. In the substrate 30 and the mask 40, through holes are provided in portions corresponding to the field of view of the camera 60, or at least the portions hitting the field of view are constituted by a light-transmitting member. The sensor of the camera 60 preferably has sensitivity to infrared wavelengths. In that case, both of the two members (substrate 30 and mask 40) in the overlapping state can be imaged. In FIG. 1, as an example, when alignment marks 30M and 40M are provided on both the substrate 30 and the mask 40, an example of an image captured by the camera 60 is shown below. In this embodiment, the position of the mask 40 is adjusted so that the distance between these marks 30M and 40M is within a threshold value.

[0029] And in this embodiment, in order to ensure mark contrast and increase the mark recognition rate, a configuration is adopted in which light is irradiated from below the mask 40 and received by the sensor of the camera 60. Thus, in this embodiment, as confirmation means for confirming the relative positional relationship between the mask 40 positioned by the positioning member 125 and the substrate 30, it includes a camera 60 and an illumination unit 70 that irradiates the alignment mark with light. Hereinafter, the illumination unit 70 will be described.

[0030] <Illumination Unit> The light irradiation unit 70 includes a light source 71, an optical fiber 72 as an optical introducer that forms a part of an optical path for guiding the light of the light source 71 to the alignment mark, and a reflection mirror 73. Note that the optical fiber 72 can be referred to as a confirmation means constituent member. The mask mounting table 124 is provided with a through hole extending from the end face on the light source 71 side to the end face on the reflection mirror 73 side (the opening surface of the opening 124a provided at the center of the mask mounting table 124), and a part of the optical fiber 72 is inserted into this through hole. By adopting such a configuration, a space for fixing the optical fiber 72 around the mask mounting table 124 is not required. Therefore, the distance between the film forming source 21 and the substrate 30 can be shortened, and the phenomenon that the film forming substance wraps around the back surface of the mask foil 42 can be suppressed. Further, the optical fiber 72 is configured to be drawn out from the inside of the chamber 10 to the outside through a through hole 11a provided in the chamber side wall 11 and connected to the light source 71 installed outside the chamber 10. Note that the through hole 11a is closed by a lid 11b that maintains airtightness with the optical fiber 72.

[0031] With the above configuration, the light of the light source 71 is guided by the optical fiber 72 through the through hole provided in the mask mounting table 124 to the end face on the reflection mirror side (the opening surface of the opening 124a), and the light generated therefrom has its optical axis phase-changed by 90° by the reflection mirror 73. As a result, the substrate 30 and the mask 40 are irradiated with light from below, and the alignment mark is irradiated.

[0032] In this embodiment, in order to provide the optical fiber 72 on the mask mounting table 124, a configuration in which a through hole is provided in the mask mounting table 124 is adopted. However, a groove may be provided in the mask mounting table 124, and the optical fiber 72 may be provided in this groove. Also, in this embodiment, the positioning member 125 and the positioning block 43 are adopted to be provided at approximately three locations with an equal angle of about 120°, but the number and positions of these arrangements are not limited. Similarly, in this embodiment, a configuration in which the illumination unit 70 is provided at three locations is adopted, but the number and positions of these arrangements are not limited either. Furthermore, in this embodiment, an optical fiber is adopted as the light introducer for guiding light, but other optical devices can also be adopted.

[0033] As described above, in this embodiment, a configuration in which the optical fiber 72 as a confirmation means component is provided on the mask mounting table 124 is adopted. Therefore, this optical fiber 72 becomes a heat source, and due to the deformation of the mask mounting table 124 caused by linear expansion, there is a possibility that the positioning accuracy of the mask 40 by the positioning member 125 becomes unstable. Thus, in this embodiment, a cooling device 80 is provided to suppress the deformation of the mask mounting table 124 caused by linear expansion. Hereinafter, this cooling device 80 will be described.

[0034] <Cooling Device> The cooling device 80 includes a refrigerant control device 81 having a function of circulating a refrigerant (such as cooling water or a solvent) and controlling the cooling temperature, a pipe 82 through which the refrigerant flows, and a temperature measurement unit (temperature sensor T) for measuring the temperature of the mask mounting table 124. In this embodiment, a flow path (cooling means) 83 through which the refrigerant flows is provided in the mask mounting table 124. That is, a part of the refrigerant circulation path is provided in the mask mounting table 124. The flow path 83 provided in the mask mounting table 124 is formed by embedding the pipe 82 in the mask mounting table 124, and the inside of the pipe of the pipe 82 is the flow path It can also be set to 83, or holes can be provided in the mask mounting table 124 and these holes can be used as the flow path 83. The pipe 82 is preferably a metal pipe in order to maintain a vacuum environment inside the chamber. Also, similar to the optical fiber 72, the pipe 82 is configured to be drawn out from the inside of the chamber 10 to the outside through the through hole 11a and connected to the refrigerant control device 81, and the airtightness is maintained between the pipe 82 and the lid 11b.

[0035] The flow path 83 as the cooling means provided in the mask mounting table 124 is provided so as to be arranged between the positioning member 125 and the optical fiber 72. In this embodiment, when viewed in the Z-axis direction, since the positioning members 125 are arranged on both sides of the optical fiber 72, the flow paths 83 are arranged on both sides of the optical fiber 72. That is, the flow path 83 is arranged so as to surround two directions of the optical fiber 72. This flow path 83 is preferably arranged so as to surround the optical fiber 72 in the vicinity of the optical fiber 72, and the cooling effect can be enhanced as the distance between the flow path 83 and the optical fiber 72 is shorter. Note that the flow path 83 is configured to reach the vicinity of the opening 124a of the mask mounting table 124. However, when it is possible to provide a flow path up to the region within the opening 124a, a configuration in which a pipe 84 connecting the flow paths 83 is provided as shown in the portion surrounded by the upper ellipse in FIG. 2 can also be adopted.

[0036] The temperature sensor T is provided in the mask mounting table 124 in the vicinity of the optical fiber 72 and at a position between the optical fiber 72 and the flow path 83. The electric wire connected to this temperature sensor T is also drawn out from the inside of the chamber 10 to the outside through the through hole 11a and connected to the control unit C, similar to the optical fiber 72 and the pipe 82, and the airtightness is maintained between the electric wire and the lid 11b. With such a temperature sensor T, real-time temperature measurement can be performed. A specific example of the temperature sensor T is a thermoresistive element.

[0037] In this embodiment, a configuration is adopted in which the optical fiber 72, the pipe 82, and the electric wire connected to the temperature sensor T are drawn out from the common through-hole 11a. However, depending on the arrangement configuration and the like, separate through-holes can also be provided for each.

[0038] According to the cooling device 80 configured as described above, the refrigerant flows through the pipe 82 and the flow path 83 so as to circulate by the refrigerant control device 81. As a specific example of the refrigerant control device 81, a chiller can be mentioned. Hereinafter, an example of the flow of temperature control of the mask mounting table 124 will be described with reference to FIG. 3.

[0039] When the mask 40 is placed on the mask mounting table 124 and the position of the mask 40 is adjusted by the positioning member 125 (step S1 (positioning step)), the temperature obtained by the temperature sensor T at that time is recorded in the control unit C (step S2 (temperature measurement step)). Then, the circulation of the refrigerant is started by the refrigerant control device 81 (step S3 (cooling step)), and when the alignment step of the substrate 30 and the mask 40 is started (step S4), transmission illumination by the light source 71 is also started in the illumination unit 70 (step S5). After that, the measured temperature obtained from the temperature sensor T is sent to the control unit C, and it is determined whether or not this measured temperature is within a preset threshold range (recorded measured temperature ± threshold) based on the above-recorded temperature (measured temperature) (step S6). Then, the control unit C controls the refrigerant control device 81 to adjust the flow rate of the refrigerant so that the sequentially measured temperature falls within this temperature range (recorded measured temperature ± threshold) (step S7).

[0040] Thereby, if the measured temperature is within the above temperature range, the flow rate of the refrigerant is maintained (step S8), and the flow rate of the refrigerant is adjusted until the alignment is completed. When the alignment is completed (step S9), the temperature control is also terminated (step SE). As described above, the temperature measurement step is performed after the positioning step and before the confirmation by the confirmation means.

[0041] As described above, in this embodiment, the flow rate of the refrigerant flowing through the pipe 82 is controlled so that the mask mounting table 124 reaches thermal equilibrium. Note that the temperature control flow is not limited to the above flow. For example, simultaneously with the start of irradiation by the light source 71, recording of the measured temperature and control of the refrigerant flow rate may be started. Alternatively, the refrigerant flow rate control may be performed before the irradiation by the light source 71. Further, in this embodiment, a case where the temperature is controlled by adjusting the flow rate of the refrigerant is shown, but a configuration for controlling the temperature of the refrigerant may also be adopted.

[0042] After the above alignment process is performed, film formation is performed on the substrate 30 by the film formation source 21 (film formation process).

[0043] <Advantages of the Film Forming Apparatus and Alignment Method According to this Embodiment> In this embodiment, when the alignment process is performed, the temperature of the mask mounting table 124 is controlled. Therefore, after the mask 40 is positioned on the mask mounting table 124, deformation of the mask mounting table 124 due to linear expansion is suppressed. Accordingly, the positioning accuracy between the substrate 30 and the mask 40 can be improved.

[0044] (Embodiment 2) FIGS. 4 and 5 show Embodiment 2 of the present invention. In Embodiment 1, a configuration in the case of providing an illumination unit as a confirmation means was shown. In this embodiment, a configuration in the case of providing a measurement unit that measures the distance between the substrate and the mask as a confirmation means is shown. Since the other basic configurations and operations are the same as those in Embodiment 1, the same reference numerals are given to the same components, and the description thereof will be omitted as appropriate.

[0045] FIG. 4 is a schematic configuration diagram of the inside of the film forming apparatus according to Embodiment 2 as viewed from the front side. FIG. 5 is a schematic cross-sectional view of the film forming apparatus according to Embodiment 2, corresponding to the cross-sectional view BB in FIG. 4, and the configuration of each part is schematically shown. In FIGS. 4 and 5, various configurations provided outside the chamber of the film forming apparatus are also briefly shown, and the X, Y, and Z axes are shown in the same manner as in FIGS. 1 and 2.

[0046] Also in the film forming apparatus 1A according to this embodiment, as in the first embodiment, in addition to the chamber 10, the film forming unit 20, the mask support mechanism 100, the control unit C, etc., a cooling device 80 is provided. The basic configurations and operations of these are as described in the first embodiment. In this embodiment, although the illumination unit 70 shown in the first embodiment is not provided, a configuration including the illumination unit 70 can also be adopted as in the first embodiment.

[0047] In the film forming apparatus 1A according to this embodiment, the substrate holding member 30X that holds the substrate 30 is configured to be movable and adjustable in three axial directions, and also movable and adjustable in the θx direction, θy direction, and θz direction, similar to the mask mounting table 124. For the mechanism and the like for configuring the substrate holding member 30X to be movable and adjustable, a configuration similar to the mask support mechanism 100 can be adopted, or a configuration can be adopted in which the substrate holding member 30X is moved and adjusted in a state of being suspended in the air by using a linear motor. Although not particularly shown, the drive source for driving the mechanism for moving and adjusting the substrate holding member 30X is connected to the control unit C by an electric wire, and this electric wire can also be configured to be drawn out from the through hole 11a.

[0048] Then, the film forming apparatus 1A according to this embodiment includes a measurement unit 90 that measures the distance between the substrate 30 and the mask 40 as a confirmation means. This measurement unit 90 includes a sensor 91 provided on the mask mounting table 124 and a target 92 provided on the substrate holding member 30X. The sensor 91 and the target 92 are configured to be arranged at opposing positions. The distance to the target 92 is determined by the sensor 91 as a component of the confirmation means configuration. It is configured to be measurable and can measure the distance between the substrate 30 and the mask 40. Also, the signal line of the sensor 91 is drawn out from the inside of the chamber 10 to the outside through the through hole 11a and connected to the control unit C, and the airtightness is maintained between the signal line and the lid 11b. With such a sensor 91, the distance between the substrate 30 and the mask 40 can be measured in real time. As a specific example of the sensor 91, an eddy current sensor can be mentioned.

[0049] The measurement units 90 are provided at a plurality of locations, and based on the data obtained from all the measurement units 90, the amount of misalignment between the substrate 30 and the mask 40 and the amount of misalignment of the posture of the substrate 30 with respect to the mask 40 can be measured (confirmed). Based on these misalignment amounts, the control unit C can adjust the position of the substrate holding member 30X to align the substrate 30 and the mask 40. In this embodiment, the measurement units 90 are arranged approximately 120° apart at three locations, but the number and arrangement positions of the measurement units are not limited.

[0050] In this embodiment, the sensor 91 as a confirmation means constituent member serves as a heat source. Therefore, in this embodiment, the flow path 83 as a cooling means provided on the mask mounting table 124 is provided so as to be arranged between the positioning member 125 and the sensor 91. In this embodiment, when viewed in the Z-axis direction, since the positioning members 125 are arranged on both sides of the sensor 91, the flow paths 83 are arranged on both sides of the sensor 91. That is, the flow paths 83 are arranged so as to surround two directions of the sensor 91. This flow path 83 is preferably arranged so as to surround the sensor 91 in the vicinity of the sensor 91, and the cooling effect can be enhanced as the distance between the flow path 83 and the sensor 91 is shorter. The flow path 83 is configured to reach the vicinity of the opening 124a of the mask mounting table 124. However, when it is possible to provide the flow path up to the region inside the opening 124a, as described in the first embodiment, a configuration in which a pipe connecting the flow paths 83 is provided can also be adopted.

[0051] The temperature sensor T is provided at a position near the sensor 91 on the mask mounting table 124. With such a temperature sensor T, as described in Example 1, real-time temperature measurement can be performed.

[0052] In the film forming apparatus 1A configured as described above, in advance, the distance from the sensor 91 to the target 92 when the substrate holding member 30X is stationary at the reference position is measured by the sensor 91, and the value is recorded in the control unit C as a target value. Then, when the alignment process is performed, the distance to the target 92 is measured in real time by the sensor 91, and the control unit C controls the position of the substrate holding member 30X so that the measured value becomes the target value. And, in order to suppress deformation due to linear expansion caused by a temperature rise near the sensor 91 on the mask mounting table 124 with the energization of the sensor 91, temperature control is performed in the same manner as in Example 1.

[0053] Hereinafter, an example of the temperature control flow of the mask mounting table 124 will be briefly described. When the mask 40 is placed on the mask mounting table 124 and the position of the mask 40 is adjusted by the positioning member 125 (positioning process), the temperature obtained by the temperature sensor T at that time is recorded in the control unit C (temperature measurement process). Then, the circulation of the refrigerant is started by the refrigerant control device 81 (cooling process), and when the alignment process of the substrate 30 and the mask 40 is started, the energization of the sensor 91 is started. After that, the measured temperature obtained from the temperature sensor T is sent to the control unit C, and it is determined whether or not this measured temperature is within a predetermined threshold range (recorded measured temperature ± threshold) based on the above-recorded temperature (measured temperature). Then, the control unit C controls the refrigerant control device 81 to adjust the flow rate of the refrigerant so that the temperature falls within this temperature range. Thereby, if the measured temperature is within the above temperature range, the flow rate of the refrigerant is maintained and the flow rate of the refrigerant is adjusted until the alignment is completed. When the alignment is completed , the temperature control also ends.

[0054] Also in the film forming apparatus 1A according to the present embodiment configured as described above, the same effects as those in the first embodiment can be obtained. Note that also in this embodiment, the flow of temperature control is not limited to the above flow. For example, simultaneously with the start of energization of the sensor 91, recording of the measured temperature and control of the refrigerant flow rate may be started. Further, the refrigerant flow rate control may be performed before energization of the sensor 91. Furthermore, also in this embodiment, a configuration may be adopted in which the temperature is controlled not by adjusting the flow rate of the refrigerant but by controlling the temperature of the refrigerant. As described above, in this embodiment, both the mask mounting table 124 and the substrate holding member 30X are configured to be movable and adjustable in the three-axis directions, and can also be moved and adjusted in the θx direction, θy direction, and θz direction. For example, when performing relative position adjustment between the substrate 30 and the mask 40, after performing position adjustment within a predetermined range (for example, up to 1 μm) by the mask mounting table 124, further fine adjustment (less than 1 μm) can be performed by the substrate holding member 30X.

[0055] <Method for manufacturing an electronic device> An example of a method for manufacturing an electronic device using the film forming apparatuses 1 and 1A according to the above embodiments will be described. Hereinafter, the configuration and manufacturing method of an organic EL display device will be exemplified as an example of an electronic device. First, the organic EL display device to be manufactured will be described. FIG. 6(a) is an overall view of the organic EL display device 560, and FIG. 6(b) shows a cross-sectional structure of one pixel.

[0056] As shown in FIG. 6(a), in the display region 561 of the organic EL display device 560, a plurality of pixels 562 each including a plurality of light-emitting elements are arranged in a matrix. Although details will be described later, each of the light-emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. Here, the pixel refers to the minimum unit capable of displaying a desired color in the display region 561. In the case of the organic EL display device according to this embodiment, the pixel 562 is composed of a combination of a first light-emitting element 562R, a second light-emitting element 562G, and a third light-emitting element 562B that exhibit different emissions. The pixel 562 is often composed of a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but may also be a combination of a yellow light-emitting element, a cyan light-emitting element, and a white light-emitting element, and is not particularly limited as long as it is at least one color or more.

[0057] FIG. 6(b) is a partial cross-sectional schematic view taken along line A-B in FIG. 6(a). The pixel 562 has an organic EL element including a first electrode (anode) 564, a hole transport layer 565, one of light-emitting layers 566R, 566G, 566B, an electron transport layer 567, and a second electrode (cathode) 568 on a substrate 563. Among these, the hole transport layer 565, the light-emitting layers 566R, 566G, 566B, and the electron transport layer 567 correspond to the organic layer. Also, in this embodiment, the light-emitting layer 566R is an organic EL layer that emits red light, the light-emitting layer 566G is an organic EL layer that emits green light, and the light-emitting layer 566B is an organic EL layer that emits blue light. The light-emitting layers 566R, 566G, 566B are formed in patterns corresponding to light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue light, respectively. Also, the first electrode 564 is formed separately for each light-emitting element. The hole transport layer 565, the electron transport layer 567, and the second electrode 568 may be formed in common with a plurality of light-emitting elements 562R, 562G, 562B, or may be formed for each light-emitting element. In addition, in order to prevent the first electrode 564 and the second electrode 568 from being short-circuited by foreign matter, an insulating layer 569 is provided between the first electrodes 564. Further, since the organic EL layer deteriorates due to moisture and oxygen, a protective layer 570 for protecting the organic EL element from moisture and oxygen is provided.

[0058] In FIG. 6(b), the hole transport layer 565 and the electron transport layer 567 are shown as a single layer, but depending on the structure of the organic EL display element, they may be formed of a plurality of layers including a hole blocking layer and an electron blocking layer. Also, between the first electrode 564 and the hole transport layer 565, a hole injection layer having an energy band structure capable of smoothly injecting holes from the first electrode 564 into the hole transport layer 565 can be formed. Similarly, an electron injection layer can be formed between the second electrode 568 and the electron transport layer 567.

[0059] Next, an example of a method for manufacturing an organic EL display device will be specifically described. First, a substrate 563 on which a circuit (not shown) for driving the organic EL display device and a first electrode 564 are formed is prepared.

[0060] An acrylic resin is spin-coated on the substrate 563 on which the first electrode 564 is formed, and the acrylic resin is patterned by a lithography method so that an opening is formed in the portion where the first electrode 564 is formed to form an insulating layer 569. This opening corresponds to the light-emitting region where the light-emitting element actually emits light.

[0061] The substrate 563 on which the insulating layer 569 is patterned is carried into a first film-forming apparatus, the substrate is held by a substrate support unit, and the hole transport layer 565 is formed as a common layer on the first electrode 564 in the display region. The hole transport layer 565 is formed by vacuum evaporation. Actually, since the hole transport layer 565 is formed to have a size larger than that of the display region 561, a high-definition mask is not required.

[0062] Next, the substrate 563 on which the hole transport layer 565 is formed is carried into a second film-forming apparatus and held by a substrate support unit. Alignment between the substrate and the mask (first alignment and second alignment) is performed, the substrate is placed on the mask, and a light-emitting layer 566R that emits red light is formed in the portion where the element that emits red light of the substrate 563 is arranged.

[0063] Similar to the formation of the light-emitting layer 566R, a light-emitting layer 566G that emits green light is formed by a third film-forming apparatus, and further, a light-emitting layer 566B that emits blue light is formed by a fourth film-forming apparatus. After the formation of the light-emitting layers 566R, 566G, and 566B is completed, an electron transport layer 567 is formed over the entire display region 561 by a fifth film-forming apparatus. The electron transport layer 567 is formed as a layer common to the three-color light-emitting layers 566R, 566G, and 566B.

[0064] The substrate on which up to the electron transport layer 567 is formed is transferred to a sputtering apparatus to form the second electrode 568, and then transferred to a plasma CVD apparatus to form a protective layer 570, completing the organic EL display device 560.

[0065] If the substrate 563 on which the insulating layer 569 is patterned is exposed to an atmosphere containing moisture or oxygen from when it is carried into the film-forming apparatus until the formation of the protective layer 570 is completed, the light-emitting layer made of the organic EL material may be deteriorated by moisture or oxygen. Therefore, in this example, the loading and unloading of the substrate between the film-forming apparatuses are performed under a vacuum atmosphere or an inert gas atmosphere.

Explanation of Reference Numerals

[0066] 1,1A: Film-forming apparatus 10: Chamber 20: Film-forming unit 21: Film-forming source 30: Substrate 30X: Substrate holding member 40: Mask 43: Positioning block 50: Bellows 60: Camera 70: Illuminating unit 71: Light source 72: Optical fiber 73: Reflecting mirror 80: Cooling device 81: Refrigerant control device 82: Pipe 83: Flow path 84: Pipe 90: Measuring unit 91: Sensor 92: Target 100: Mask support mechanism 110: Alignment mechanism 111,112: Linear guide 113: Rotary bearing 114: Driving motor 115: Connecting plate 120: Holding mechanism 121: Lifting drive unit 122: Lifting plate 123: Support column 124: Mask mounting table 124a: Opening 125: Positioning member C: Control unit T: Temperature sensor

Claims

1. A film forming apparatus for forming a thin film on a substrate through a mask, a mask placement table having a positioning member for positioning the mask; a confirmation means for confirming a relative positional relationship between the mask and the substrate positioned by the positioning member, the confirmation means being provided on the mask placement table; a cooling means provided on the mask placement table and disposed between the confirmation means component and the positioning member; A film forming apparatus comprising:

2. 2. The film forming apparatus according to claim 1, wherein the cooling means is disposed so as to surround the confirmation means component member on at least two sides.

3. the confirmation means includes a light source and a light introducer forming a part of an optical path that introduces light from the light source to an alignment mark provided on at least one of the substrate and the mask, 3. The film forming apparatus according to claim 1, wherein the confirmation means component is the light introducing device.

4. 4. The film forming apparatus according to claim 3, wherein the light introducing device is an optical fiber.

5. the confirmation means includes a target provided on a substrate holding member that holds the substrate, and a sensor provided on the mask placement table for measuring a distance to the target, 3. The film forming apparatus according to claim 1, wherein the confirmation means component is the sensor.

6. 3. The film forming apparatus according to claim 1, wherein the cooling means is a flow path configured to allow a coolant to flow.

7. 7. The film forming apparatus according to claim 6, wherein a flow rate of the coolant flowing through the flow path is controlled so that the mask stage is in thermal equilibrium.

8. 1. An alignment method for performing relative positioning between a substrate on which a film is to be formed and a mask that is to be placed on a film-forming surface of the substrate during film formation, comprising: a positioning step of positioning the mask on a positioning member provided on a mask placement table; a cooling step of cooling, by a cooling means, a portion of the mask placing table between the positioning member and a confirmation means component member that is provided on the mask placing table and that constitutes a confirmation means for confirming a relative positional relationship between the mask and the substrate; an alignment step of performing relative positioning of the substrate and the mask while the mask mounting table is being cooled by the cooling means; An alignment method comprising the steps of:

9. a temperature measuring step of measuring a temperature of the mask placement table after the positioning step and before the confirmation by the confirmation means, and storing the measured temperature; 9. The alignment method according to claim 8, wherein in the cooling step, the temperature of the mask mounting table is maintained within a range of a threshold value based on the measured temperature.

10. 10. An electrochemical device comprising: a film forming step of forming a film on the substrate after the substrate and the mask are relatively positioned by the alignment method according to claim 8 or 9. A method for manufacturing a child device.

Images