Array sensor

Abstract

To suppress cost increase due to differences in the number and arrangement of detection elements.SOLUTION: An array sensor comprises: a plurality of first wires 6X each extending in an X direction when viewed from a Z direction and adjacent to each other in a Y direction different from the X direction; a plurality of second wires 6Y each extending in the Y direction and adjacent to each other in the X direction; a plurality of thermistor elements 5 each connected to both one of the plurality of first wires 6X and one of the plurality of second wires 6Y; a read circuit 13 reading output signals of the plurality of thermistor elements 5; and a plurality of first terminals 7X electrically connected to the read circuit 13. The plurality of first terminal 7X compose at least one first terminal row 8X-1 in which at least some of the first terminals 7X are arrayed in the Y direction. The number of the plurality of first terminals 7X is greater than the number of the plurality of first wires 6X. Only some of the plurality of first terminals 7X is electrically connected to the plurality of first wires 6X.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to an array sensor.

Background Art

[0002] Array sensors such as image sensors in which detection elements are arranged in an array are known. Patent Document 1 discloses an infrared sensor in which resistance elements, which are infrared light receiving elements, are arranged in an array. The infrared sensor includes a circuit (readout circuit) for reading the resistance value of each resistance element.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The number and arrangement of detection elements are determined for each array sensor in consideration of the performance, cost, size constraints, etc. of the array sensor. On the other hand, since the readout circuit of the array sensor is configured according to the number and arrangement of detection elements, it is necessary to design the readout circuit for each array sensor for array sensors with different numbers and arrangements of detection elements, which is a constraint on cost reduction of the array sensor.

[0005] An object of the present invention is to provide an array sensor capable of suppressing an increase in cost due to different numbers and arrangements of detection elements.

Means for Solving the Problems

[0006] When viewed from a third direction orthogonal to a plane defined by a first direction and a second direction different from the first direction, the array sensor of the present invention has a plurality of first wirings each extending in the first direction and adjacent to each other in the second direction, a plurality of second wirings each extending in the second direction and adjacent to each other in the first direction when viewed from the third direction, a plurality of detection elements each connected to both one of the plurality of first wirings and one of the plurality of second wirings, a reading circuit for reading output signals of the plurality of detection elements, and a plurality of first terminals electrically connected to the reading circuit. The plurality of first terminals constitute at least one first terminal row in which at least some of the first terminals are arranged side by side in the second direction. The number of the plurality of first terminals is larger than the number of the plurality of first wirings, and only a part of the plurality of first terminals is electrically connected to the plurality of first wirings.

Advantages of the Invention

[0007] According to the present invention, it is possible to provide an array sensor capable of suppressing an increase in cost due to differences in the number and arrangement of detection elements.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

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Figure 11

Figure 12

Embodiments for Carrying Out the Invention

[0009] Hereinafter, with reference to the drawings, some embodiments of the array sensor of the present invention will be described. The drawings are schematic diagrams for exemplifying the present invention, and the shapes and dimensions of elements may not match between the drawings. In the following description and drawings, the first direction is referred to as the X direction, the second direction is referred to as the Y direction, and the third direction is referred to as the Z direction. The X direction and the Y direction are directions parallel to the main surface 11 of the first substrate 1 and the main surface 21 of the second substrate 2. The main surfaces 11 and 21 are the surfaces of the first substrate 1 and the second substrate 2 that face each other. The X direction and the Y direction are orthogonal to each other. The Z direction is a direction orthogonal to the X direction and the Y direction, a direction perpendicular to the main surface 11 of the first substrate 1 and the main surface 21 of the second substrate 2, or a direction in which the first substrate 1 and the second substrate 2 are laminated. The first direction and the second direction do not have to be orthogonal, and may be different from each other. Therefore, the third direction (Z direction) is a direction orthogonal to the plane (X-Y plane) defined by the first direction (X direction) and the second direction (Y direction) different from the first direction.

[0010] In the following embodiments, an infrared sensor will be described as an example of an array sensor. The infrared sensor is mainly used as an imaging element of an infrared camera. The infrared camera can be used as a night vision scope or night vision goggles in a dark place, and can also be used for temperature measurement of people and objects. In the present invention, the detection target is not limited to infrared rays. The array sensor of the present invention can also be applied to, for example, an electromagnetic wave sensor that detects electromagnetic waves including terahertz waves or the near-infrared region, a CMOS sensor that detects electromagnetic waves in the visible light region, and a CCD sensor. Further, the present invention is applicable to various electronic devices other than electromagnetic wave sensors.

[0011] (First Embodiment) FIG. 1 is a schematic cross-sectional view of an infrared sensor 100, and FIG. 2 is a schematic plan view showing the positional relationship of main elements when the infrared sensor 100 shown in FIG. 1 is viewed in plan from the Z direction. The infrared sensor 100 has a first substrate 1 and a second substrate 2 arranged to face each other, and a side wall 3 connecting the first substrate 1 and the second substrate 2. A sealed internal space 4 is formed by the first substrate 1, the second substrate 2, and the side wall 3. A plurality of thermistor elements 5 (an example of detection elements) are provided in the internal space 4. The first substrate 1 is mainly made of a silicon substrate and has an electric circuit portion 12. The electric circuit portion 12 includes a readout circuit 13, internal wirings 14, 15, and the like. The readout circuit 13 reads out the output signals of the plurality of thermistor elements 5 and is also called a ROIC (Readout IC). A plurality of pads 16 for input / output with the outside are formed outside the side wall 3 of the first substrate 1. The pads 16 are electrically connected to the readout circuit 13 by the internal wiring 15. The second substrate 2 is mainly made of a silicon substrate and constitutes a light incident portion.

[0012] The plurality of thermistor elements 5 function as a sensing unit of the infrared sensor 100. The plurality of thermistor elements 5 are arranged in an arrangement region 51 having a rectangular (square in this embodiment) shape as shown in FIG. 2, and form a two-dimensional lattice array composed of a plurality of rows extending in the X direction and a plurality of columns extending in the Y direction. As shown in FIG. 2, an array of four thermistor elements 5 in the X direction and four thermistor elements 5 in the Y direction is arranged, but the number of thermistor elements 5 is an example and does not limit the present invention. The thermistor element 5 is, for example, a film of vanadium oxide, titanium oxide, amorphous silicon, polycrystalline silicon, an oxide having a spinel crystal structure containing manganese, or yttrium-barium-copper oxide. Since the internal space 4 is made to have a negative pressure or a vacuum, convection of gas in the internal space 4 is prevented or suppressed, and the thermal influence on the thermistor element 5 can be reduced. Each thermistor element 5 is supported by the first substrate 1 via two conductive support columns 52. Since the thermistor element 5 is arranged at a position away from the first substrate 1, the influence of heat generation of the electric circuit unit 12 can be reduced.

[0013] When viewed from the Z direction, the infrared sensor 100 has a plurality of first wirings 6X each extending in the X direction and adjacent to each other in the Y direction, and a plurality of second wirings 6Y each extending in the Y direction and adjacent to each other in the X direction. Each of the plurality of thermistor elements 5 is connected to one of the plurality of first wirings 6X and one of the plurality of second wirings 6Y via a conductive support column 52. In this embodiment, four first wirings 6X and four second wirings 6Y are arranged.

[0014] FIG. 3 is a schematic partial plan view of the infrared sensor 100 showing the thermistor element 5, the first and second wirings 6X and 6Y, the first and second terminals 7X and 7Y, and the readout circuit 13. The readout circuit 13 is a conceptual diagram and does not show an actual area. In FIG. 3, the thermistor element 5 and the conductive support column 52 are schematically shown for easy understanding of the electrical connection between the thermistor element 5 and the first and second wirings 6X and 6Y.

[0015] When viewed from the Z direction, a plurality of (six in this embodiment) first terminals 7X are provided on one side in the X direction of the arrangement region 51 of the plurality of thermistor elements 5. The arrangement region 51 is the smallest rectangular region that includes all the thermistor elements 5 when viewed from the Z direction, and in FIG. 2, it is shown slightly separated from the thermistor elements 5 for the sake of convenience. "One side in the X direction" means one of two regions 53 that do not overlap with the arrangement region 51 in the X direction (that is, are on both sides of the arrangement region 51 in the X direction). The same applies to "the other side in the X direction" described later. "One side" is the region 53 on the left side of the arrangement region 51 in FIG. 3, but it may also be the region 53 on the right side of the arrangement region 51. The plurality of first terminals 7X are electrically connected to the readout circuit 13 through the internal wiring 14 (see FIG. 1) of the first substrate 1. The plurality of first terminals 7X are not electrically connected to circuits other than the readout circuit 13 inside the first substrate 1. As shown in FIG. 3, the first terminal 7X has the shape of a pad. In FIG. 3, the first terminal 7X is circular, but the shape is not limited. Functionally, the first terminal 7X is an open end of a wiring that can connect to other wirings, and its shape is not limited to the pad shape. As shown in FIG. 3, the plurality of first terminals 7X constitute one first terminal row 8X in which at least some (six in this embodiment) of the first terminals 7X are arranged side by side in the Y direction.

[0016] The number of the plurality of first terminals 7X (six in this embodiment) is larger than the number of the plurality of first wirings 6X (four in this embodiment). For this reason, only some of the plurality of first terminals 7X are electrically connected to the plurality of first wirings 6X, and the other first terminals 7X are not connected to the first wirings 6X. In other words, the plurality of first terminals 7X that constitute one first terminal row 8X include at least one connection terminal 7X-A that is electrically connected to the first wiring 6X and at least one separated terminal 7X-B that is electrically separated from (or not electrically connected to) the first wiring 6X. The separated terminal 7X-B is not electrically connected to circuits other than the readout circuit 13. In other words, the separated terminal 7X-B is a terminal that is not used. In FIGS. 3 to 10, the connection terminal 7X-A is shown in white and the separated terminal 7X-B is shown in black.

[0017] When viewed from the Z direction, a plurality of (six in this embodiment) second terminals 7Y are provided on one side in the Y direction of the arrangement region 51 of the plurality of thermistor elements 5. "One side in the Y direction" means one of two regions 54 that do not overlap with the arrangement region 51 in the Y direction (that is, on both sides of the arrangement region 51 in the Y direction). The plurality of second terminals 7Y are electrically connected to the readout circuit 13 through the internal wiring 14 of the first substrate 1. The plurality of second terminals 7Y are not electrically connected to circuits other than the readout circuit 13 inside the first substrate 1. The plurality of second terminals 7Y also have the shape of pads. The plurality of second terminals 7Y constitute one second terminal row 8Y in which at least some (six in this embodiment) of the second terminals 7Y are arranged side by side in the X direction.

[0018] The number of the plurality of second terminals 7Y (six in this embodiment) is larger than the number of the plurality of second wirings 6Y (four in this embodiment). For this reason, only some of the plurality of second terminals 7Y are electrically connected to the plurality of second wirings 6Y, and the other second terminals 7Y are not connected to the second wirings 6Y. In other words, the plurality of second terminals 7Y constituting one second terminal row 8Y include at least one connection terminal 7Y-A electrically connected to the second wiring 6Y and at least one separated terminal 7Y-B electrically separated from (or electrically non-connected to) the second wiring 6Y. The separated terminal 7Y-B is not electrically connected to circuits other than the readout circuit 13. In other words, the separated terminal 7Y-B is a terminal that is not used. In FIGS. 3 to 10, the connection terminal 7Y-A is shown in white and the separated terminal 7Y-B is shown in black.

[0019] The readout circuit 13 is configured corresponding to six first terminals 7X and six second terminals 7Y. That is, the readout circuit 13 has functional components (not shown) such as selection transistors, operational amplifiers, AD converters, memories, etc. corresponding to the internal wiring 14 connected to the first terminal 7X or the second terminal 7Y. In other words, all the first terminals 7X and the second terminals 7Y are connected to the internal wiring 14 and further electrically connected to the readout circuit 13 via the internal wiring 14. In this embodiment, since two first terminals 7X and two second terminals 7Y are not used, unused internal wiring 14 and functional components are generated. The control unit (not shown) of the infrared sensor 100 is configured to scan only the internal wiring 14 connected to the four connection terminals 7X-A and the four connection terminals 7Y-A.

[0020] The number of thermistor elements 5 corresponding to the number of pixels of the infrared sensor 100 is determined in consideration of performance, cost, size constraints, etc. For example, when high resolution is required, it is preferable to increase the number of thermistor elements 5. On the other hand, the sensitivity of the thermistor element 5 depends on the size of the thermistor element 5 (more precisely, the area of the heat sensing part of the thermistor element 5). For example, it is known that the minimum detectable temperature difference of the thermistor element 5 becomes smaller as the thermistor element 5 becomes larger. Therefore, in order to detect a finer temperature difference of the measurement object, it is preferable to increase the size of each thermistor element 5. However, when the arrangement area 51 of the thermistor elements 5 is constant, increasing the size of the thermistor element 5 leads to a decrease in the number of thermistor elements 5. Thus, a configuration with a large number of thermistor elements 5 and a configuration with a small number of them each have their advantages and disadvantages and are selected according to the purpose.

[0021] Conventionally, the design and manufacture of the readout circuit 13 were performed individually according to the number of rows of the thermistor elements 5 (the number arranged in the Y direction of the thermistor elements 5) and the number of columns of the thermistor elements 5 (the number arranged in the X direction of the thermistor elements 5). In other words, the design and manufacture of the first substrate 1 were performed according to the number of rows and columns of the thermistor elements 5. For example, if the number of thermistor elements 5 is increased while keeping the arrangement region 51 of the thermistor elements 5 constant, the infrared sensor 100 can be made to have a higher resolution. However, in this case, since the number of thermistor elements 5 changes, the first substrate 1 needs to be redesigned. Even when the number of thermistor elements 5 is the same but the number of rows and columns is different, the first substrate 1 needs to be redesigned.

[0022] However, the labor required to design the first substrate 1 for each infrared sensor 100 with a different array configuration (the number of rows and columns of the thermistor elements 5) is large, and problems such as cost increase and lengthening of the product development period occur. Also, it is necessary to manufacture the first substrate 1 for each array configuration, which causes a decrease in manufacturing efficiency and an increase in cost. In the present embodiment, since it is possible to allow the occurrence of unused internal wirings 14 and functional components and to make the design and manufacture of the first substrate 1 common for infrared sensors 100 with different array configurations, it is possible to reduce the degree of these problems.

[0023] Each of the plurality of first wirings 6X is electrically connected to a corresponding first terminal 7X by soldering or the like. Each of the plurality of second wirings 6Y is electrically connected to a corresponding second terminal 7Y by soldering or the like. As shown in FIG. 1, the first wiring 6X and the second wiring 6Y are arranged on the surface of the first substrate 1. The first wiring 6X and the second wiring 6Y are exposed, but can also be covered with a protective film. The first wiring 6X and the second wiring 6Y are formed in a later process than the first terminal 7X and the second terminal 7Y. However, since the first terminal 7X and the second terminal 7Y have the shape of pads as described above, electrical connection with the first wiring 6X and the second wiring 6Y can be easily performed. The pad 16 is created in advance according to the readout circuit 13. Therefore, as shown in FIG. 1, most of the first substrate 1 becomes a common range 17 that is shared, and the first wiring 6X, the second wiring 6Y, the support 52, and the thermistor element 5 formed thereon become individual ranges 18 that are individually designed and manufactured. However, most of the first substrate 1 is the common range 17, and since the common range 17 can be batch-produced in advance in terms of process, rationalization and simplification of the process are possible in both design and manufacturing.

[0024] FIG. 4 is a schematic partial plan view of an infrared sensor 100 in which thermistor elements 5 are arranged in 6 rows and 6 columns. All the first terminals 7X are electrically connected to the first wiring 6X, and all the second terminals 7Y are electrically connected to the second wiring 6Y. The common range 17 is the same as that in FIG. 1. Although not shown, if the thermistor elements 5 are within the range of 6 rows and 6 columns (for example, 4 rows and 6 columns, 5 rows and 5 columns, etc.), the common range 17 is the same as that in FIG. 1. FIG. 5 is a schematic partial plan view of an infrared sensor 100 in which smaller thermistor elements 5 than those in FIG. 3 are arranged in 4 rows and 4 columns. The number of the first terminals 7X and the second terminals 7Y used is the same as that in FIG. 3, but the routes of the first wiring 6X and the second wiring 6Y are changed. In this example as well, the common range 17 is the same as that in FIG. 1, and the change in the routes of the first wiring 6X and the second wiring 6Y can be handled in the individual range 18.

[0025] Referring back to FIG. 3, the average interval PX1 in the Y direction of the plurality of first terminals 7X that constitute one first terminal row 8X is smaller than the average interval PX2 in the Y direction of the plurality of first wirings 6X. In this embodiment, since all the first terminals 7X are arranged at equal intervals in the Y direction, the average interval PX1 coincides with the interval in the Y direction between adjacent first terminals 7X. However, the intervals in the Y direction between the first terminals 7X may be different. Similarly, the average interval PY1 along the X direction of the plurality of second terminals 7Y that constitute one second terminal row 8Y is smaller than the average interval PY2 in the X direction of the plurality of second wirings 6Y. In this embodiment, since all the second terminals 7Y are arranged at equal intervals in the X direction, the average interval PY2 coincides with the interval in the X direction between adjacent second terminals 7Y. However, the intervals in the X direction between the second terminals 7Y may be different.

[0026] In this embodiment, the plurality of first terminals 7X that constitute one first terminal row 8X include a plurality of (two in this embodiment) spaced terminals 7X-B, and at least one connection terminal 7X-A is arranged between each spaced terminal 7X-B and the other spaced terminal 7X-B that is closest to the spaced terminal 7X-B in the Y direction. In other words, the plurality of spaced terminals 7X-B are not adjacent to each other. Also, in the modified example shown in FIG. 6, the plurality of first terminals 7X that constitute one first terminal row 8X include a plurality of connection terminals 7X-A, and at least one spaced terminal 7X-B is arranged between each connection terminal 7X-A and the other connection terminal 7X-A that is closest to the connection terminal 7X-A in the Y direction. In other words, the plurality of connection terminals 7X-A are not adjacent to each other. In either configuration, as a result of the connection terminals 7X-A being dispersed in the Y direction, the first wirings 6X are dispersed in the portion between the arrangement region 51 and the first terminal row 8X. As a result, the possibility of the first wirings 6X contacting each other and the possibility of the first wirings 6X being electrically connected to incorrect first terminals 7X are reduced, leading to an improvement in the reliability of the infrared sensor 100. Also, since it is easy to connect each first wiring 6X to the nearby first terminal 7X, it is also possible to reduce the total length of the first wirings 6X between the arrangement region 51 and the first terminal row 8X.

[0027] The same applies to the second terminal 7Y. As shown in FIG. 3, a plurality of second terminals 7Y that constitute one second terminal row 8Y include a plurality of (two in this embodiment) spaced terminals 7Y-B, and at least one connection terminal 7Y-A is disposed between each spaced terminal 7Y-B and the other spaced terminal 7Y-B that is closest in the X direction to the respective spaced terminal 7Y-B. Further, as shown in FIG. 6, a plurality of second terminals 7Y that constitute one second terminal row 8Y include a plurality of connection terminals 7Y-A, and at least one spaced terminal 7Y-B is disposed between each connection terminal 7Y-A and the other connection terminal 7Y-A that is closest in the X direction to the respective connection terminal 7Y-A.

[0028] (Second Embodiment) FIG. 7 is a schematic plan view showing a thermistor element 5, first and second wirings 6X and 6Y, first and second terminal rows 8X and 8Y, and a readout circuit 13 of an infrared sensor 100 according to the second embodiment. The infrared sensor 100 has a plurality of (two in this embodiment) first terminal rows 8X. When viewed from the Z direction, a first terminal row 8X-1 that is part of the plurality of first terminal rows 8X is disposed on one side in the X direction of the arrangement region 51, and a first terminal row 8X-2 that is the remainder of the plurality of first terminal rows 8X is disposed on the other side in the X direction of the arrangement region 51. That is, when viewed from the Z direction, one first terminal row 8X is disposed on each of both sides in the X direction of the arrangement region 51.

[0029] Since the first terminal 7X has a pad shape, it may have a relatively large size. Therefore, depending on the array pitch of the thermistor elements 5, in order to ensure an appropriate interval for the first terminal 7X, the length of the first terminal row 8X in the X direction may become larger compared to the arrangement region 51. This leads to an increase in the size of the infrared sensor 100 and an increase in the length of the first wiring 6X. In the present embodiment, since the first terminal row 8X-1 is arranged on one side in the X direction of the arrangement region 51 and the first terminal row 8X-2 is arranged on the other side in the X direction of the arrangement region 51, compared with an embodiment in which one first terminal row 8X is arranged on one side in the X direction of the arrangement region 51 (see, for example, FIG. 3), the lengths of the individual first terminal rows 8X-1 and 8X-2 can be shortened, and such a problem is less likely to occur. All the first terminals 7X included in the terminal row on one side (the first terminal row 8X-1) are electrically connected to the first wiring 6X. Further, in the modification shown in FIG. 8, all the first terminals 7X included in the first terminal row 8X-2 arranged on the other side are electrically separated from the first wiring 6X. The number of the first terminal rows 8X is not limited, and three or more first terminal rows 8X may be provided.

[0030] (Third Embodiment) FIG. 9 is a schematic plan view showing a thermistor element 5, first and second wirings 6X and 6Y, first and second terminal rows 8X and 8Y, and a readout circuit 13 of the infrared sensor 100 according to the third embodiment. When viewed from the Z direction, the infrared sensor 100 has a plurality of (two in the present embodiment) first terminal rows 8X on one side in the X direction of the arrangement region 51 of the detection elements. When viewed from the Z direction, the plurality of first terminal rows 8X include a first inner terminal row 8X-3 and a first outer terminal row 8X-4 that is farther from the arrangement region 51 than the first inner terminal row 8X-3 in the X direction. Also in the present embodiment, since a plurality of first terminal rows 8X are provided, the lengths of the individual first terminal rows 8X-3 and 8X-4 are shortened, and the same effect as in the second embodiment is achieved.

[0031] The number of connection terminals 7X-A included in the first inner terminal row 8X-3 is larger than the number of connection terminals 7X-A included in the first outer terminal row 8X-4. As a result, the total length of the first wiring 6X can be shortened. Also, in the modification shown in FIG. 10, the number of spaced terminals 7X-B included in the first outer terminal row 8X-4 is larger than the number of spaced terminals 7X-B included in the first inner terminal row 8X-3. In any of the configurations shown in FIGS. 9 and 10, the ratio of the connection terminals 7X-A in the first inner terminal row 8X-3 (75% in FIG. 9 and 100% in FIG. 10) is larger than the ratio of the connection terminals 7X-A in the first outer terminal row 8X-4 (50% in FIG. 9 and approximately 33% in FIG. 10). In other words, the ratio of the spaced terminals 7X-B in the first outer terminal row 8X-4 is larger than the ratio of the spaced terminals 7X-B in the first inner terminal row 8X-3.

[0032] The second embodiment and the third embodiment can also be combined. Although not shown, for example, when viewed from the Z direction, a plurality of first terminal rows 8X can be provided on each of one side and the other side in the X direction of the arrangement region 51. Alternatively, when viewed from the Z direction, a plurality of first terminal rows 8X can be provided on one side in the X direction of the arrangement region 51, and one first terminal row 8X can be provided on the other side. Also, in the above embodiments, the first terminal 7X has been described as the center, but for the second terminal 7Y as well, the second terminal row 8Y can be provided on both sides of the arrangement region 51 like the first terminal row 8X of the second embodiment, and a plurality of second terminal rows 8Y can be provided in a plurality of rows on one or the other side of the arrangement region 51 like the first terminal row 8X of the third embodiment.

[0033] (Fourth Embodiment) FIG. 11 is a schematic cross-sectional view of an infrared sensor 200 according to a fourth embodiment. FIG. 12 is a schematic plan view showing the positional relationship of main elements when the infrared sensor 200 shown in FIG. 11 is viewed in plan from the Z direction. The first and second wirings 6X and 6Y (the second wiring 6Y is not shown in FIG. 11) are provided on the second substrate 2, and the plurality of thermistor elements 5 are supported on the second substrate 2 via the support columns 52. The readout circuit 13 is provided on the first substrate 1 as in the first to third embodiments. In the example shown in FIGS. 11 and 12, the first terminal 7X and the second terminal 7Y are configured in the same manner as in the second embodiment shown in FIG. 7 and are provided on the first substrate 1. The first terminal 7X and the second terminal 7Y of the infrared sensor 200 according to the fourth embodiment may be configured in the same manner as a modified example of the second embodiment shown in FIG. 8, may be configured in the same manner as the first embodiment, or may be configured in the same manner as the third embodiment. The plurality of thermistor elements 5 and the first and second wirings 6X and 6Y are configured in the same manner as in the first to third embodiments and are provided in a lattice pattern. The configuration of the support columns 52 is the same as in the first to third embodiments. The first wiring 6X and the second wiring 6Y are covered with a protective layer 22. In this embodiment, compared with the first to third embodiments, since the plurality of thermistor elements 5 are provided at positions away from the first substrate 1, the influence of heat generation of the electric circuit portion 12 can be further reduced.

[0034] The first substrate 1 and the second substrate 2 are connected by a plurality of electrical connection members 9 installed in the internal space 4. The electrical connection member 9 is a conductor having a pillar shape and can be created, for example, by plating. The electrical connection member 9 is electrically connected to the first wiring 6X or the second wiring Y. The electrical connection member 9 electrically connected to the first wiring 6X is connected to the connection terminal 7X-A among the first terminals 7X by solder or the like. The electrical connection member 9 electrically connected to the second wiring 6Y is connected to the connection terminal 7Y-A among the second terminals 7Y by solder or the like. In other words, only a part (connection terminal 7X-A) of the plurality of first terminals 7X is electrically connected to the plurality of first wirings 6X via the plurality of electrical connection members 9. Also, only a part (connection terminal 7Y-A) of the plurality of second terminals 7Y is electrically connected to the plurality of second wirings 6Y via the plurality of electrical connection members 9. Since the illustrated example corresponds to the second embodiment in which the first terminal row 8X-1 is provided on both sides in the X direction of the arrangement region 51, the electrical connection members 9 are also provided on both sides in the X direction of the arrangement region 51, but the electrical connection members 9 can be provided in accordance with the arrangement of the connection terminals 7X-A and the connection terminals 7Y-A. The plurality of thermistor elements 5 are connected to the reading circuit 13 by the first and second wirings 6X, 6Y and the plurality of electrical connection members 9. Therefore, the electrical connection members 9 can be omitted at the positions of the first terminals 7X and the second terminals 7Y that are not electrically connected to the first and second wirings 6X, 6Y. Thus, this embodiment is configured in the same manner as the first to third embodiments, except that the first and second wirings 6X, 6Y are provided on the second substrate 2, the plurality of thermistor elements 5 are supported on the second substrate 2 via the support columns 52, and the electrical connection members 9 are provided. Therefore, this embodiment can also achieve the same effects as the first to third embodiments.

Description of Reference Numerals

[0035] 1 First substrate 2 Second substrate 3 Side wall 4 Internal space 5 Thermistor element (detection element) 6X First wiring 6Y Second wiring 7X First terminal 7X-A Connection terminal 7X-B Separation terminal 7Y Second terminal 8X, 8X-1, 8X-2 First terminal row 8X-3 First inner terminal row 8X-4 First outer terminal row 8Y Second terminal row 9 Electrical connection member 13 Readout circuit 51 Arrangement area of thermistor element (detection element) 100, 200 Infrared sensor (array sensor) X First direction Y Second direction

Claims

1. a plurality of first wirings each extending in the first direction and adjacent to each other in the second direction when viewed from a third direction perpendicular to a plane defined by the first direction and a second direction different from the first direction; a plurality of second wirings each extending in the second direction and adjacent to each other in the first direction when viewed from the third direction; a plurality of detection elements each connected to both one of the plurality of first wirings and one of the plurality of second wirings; a readout circuit that reads out output signals from the plurality of detection elements; a plurality of first terminals electrically connected to the readout circuit; the plurality of first terminals form at least one first terminal row in which at least some of the first terminals are arranged side by side in the second direction; An array sensor in which the number of the plurality of first terminals is greater than the number of the plurality of first wirings, and only a portion of the plurality of first terminals are electrically connected to the plurality of first wirings.

2. 2. The array sensor according to claim 1, wherein an average spacing in the second direction of the first terminals constituting one of the first terminal rows is smaller than an average spacing in the second direction of the first wirings.

3. 2. The array sensor of claim 1, wherein the first terminals constituting one of the first terminal rows include at least one connection terminal electrically connected to the first wiring and a plurality of remote terminals electrically isolated from the plurality of first wirings, and the connection terminals are arranged between each remote terminal and another remote terminal that is closest to each remote terminal in the second direction.

4. 2. The array sensor of claim 1, wherein the first terminals constituting one of the first terminal rows include a plurality of connection terminals electrically connected to the first wirings and at least one remote terminal electrically isolated from the plurality of first wirings, and the remote terminal is arranged between each connection terminal and another connection terminal that is closest to each connection terminal in the second direction.

5. the at least one first terminal row includes a plurality of first terminal rows, When viewed from the third direction, a portion of the plurality of first terminal rows is disposed on one side of an arrangement area of ​​the plurality of detection elements in the first direction, and a remainder of the plurality of first terminal rows is disposed on the other side of the arrangement area in the first direction, 2. The array sensor according to claim 1, wherein all of the first terminals included in the first terminal row arranged on the one side are electrically connected to the first wiring.

6. the at least one first terminal row includes a plurality of first terminal rows, When viewed from the third direction, a portion of the plurality of first terminal rows is disposed on one side of an arrangement area of ​​the plurality of detection elements in the first direction, and a remainder of the plurality of first terminal rows is disposed on the other side of the arrangement area in the first direction, 2. The array sensor according to claim 1, wherein all of the first terminals included in the first terminal row arranged on the other side are electrically isolated from the first wiring.

7. When viewed from the third direction, the at least one first terminal row has a first inner terminal row on one side in the first direction of an arrangement area of ​​the plurality of detection elements, and a first outer terminal row farther from the arrangement area in the first direction than the first inner terminal row, 2. The array sensor of claim 1, wherein the number of the first terminals included in the first inner terminal row and electrically connected to the first wiring is greater than the number of the first terminals included in the first outer terminal row and electrically connected to the first wiring.

8. When viewed from the third direction, the at least one first terminal row has a first inner terminal row on one side in the first direction of an arrangement area of ​​the plurality of detection elements, and a first outer terminal row farther from the arrangement area in the first direction than the first inner terminal row, 2. The array sensor of claim 1, wherein the number of the first terminals included in the first outer terminal row and electrically isolated from the first wiring is greater than the number of the first terminals included in the first inner terminal row and electrically isolated from the first wiring.

9. When viewed from the third direction, the at least one first terminal row has a first inner terminal row on one side in the first direction of an arrangement area of ​​the plurality of detection elements, and a first outer terminal row farther from the arrangement area in the first direction than the first inner terminal row, 2. The array sensor of claim 1, wherein a percentage of the first terminals electrically connected to the first wiring in the first inner terminal row is greater than a percentage of the first terminals electrically connected to the first wiring in the first outer terminal row.

10. a plurality of second terminals electrically connected to the readout circuit; the plurality of second terminals form at least one second terminal row in which at least some of the second terminals are arranged side by side in the first direction; 2. The array sensor according to claim 1, wherein the number of the plurality of second terminals is greater than the number of the plurality of second wirings, and only a portion of the plurality of second terminals are electrically connected to the plurality of second wirings.

11. 11. The array sensor according to claim 10, wherein an average spacing in the first direction of the second terminals constituting one of the second terminal rows is smaller than an average spacing in the first direction of the second wirings.

12. a first substrate and a second substrate facing each other; and a sidewall provided between the first substrate and the second substrate and forming an internal space together with the first substrate and the second substrate; 12. The array sensor of claim 1, wherein the plurality of first wirings, the plurality of second wirings, the plurality of first terminals and the readout circuit are provided on the first substrate, and the plurality of detection elements are supported on the first substrate.

13. a first substrate and a second substrate facing each other; a side wall provided between the first substrate and the second substrate and forming an internal space together with the first substrate and the second substrate; and a plurality of electrical connection members provided in the internal space and connecting the first substrate and the second substrate; 12. The array sensor of claim 1, wherein the plurality of first wirings and the plurality of second wirings are provided on the second substrate, the plurality of first terminals and the readout circuit are provided on the first substrate, the plurality of detection elements are supported on the second substrate, and only a portion of the plurality of first terminals are electrically connected to the plurality of first wirings via the plurality of electrical connection members.

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