Adjustment method, information processing device, and program

Abstract

To provide an adjustment method capable of reducing pulsation with a simpler structure.SOLUTION: Provided is an adjustment method for adjusting an amount of gas contained in a tank, the tank being in communication with a conduit carrying a liquid for cooling a controlled object and configured to accumulate the liquid and the gas. The adjustment method comprises an acquisition step of acquiring control data of the controlled object, a calculation step of calculating evaluation data based on the control data, and a control step of controlling the amount of gas contained in the tank based on the evaluation data.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to an adjustment method, an information processing apparatus, and a program.

Background Art

[0002] Suppressing the influence of vibration in industrial equipment is important for maintaining the performance of industrial equipment. Taking a lithography apparatus as an example, with the recent miniaturization of semiconductor elements, higher performance has been required, and it is necessary to further improve the alignment accuracy between the substrate and the reticle, the transfer accuracy of the reticle pattern onto the substrate, etc. To ensure the performance of the lithography apparatus, it is necessary to suppress the influence of vibrations generated by each vibration source in the apparatus and prevent vibration transmission to the apparatus. An example of the cause of vibration is pulsation. Here, pulsation refers to a phenomenon in which the pressure generated by a pump fluctuates. For example, in a lithography apparatus equipped with a liquid cooling circulation system for cooling a stage that holds and moves a substrate or a reticle, vibration due to pump pulsation being transmitted to the stage becomes a problem.

[0003] To reduce pulsation, a method has been put into practical use in which a tank (air chamber) for storing liquid and gas (e.g., air) is provided in communication with a conduit through which the liquid flows, and the gas in the tank is used as a buffer to suppress the pressure fluctuations generated by the pump. However, the liquid level in the tank fluctuates over time due to the dissolution of gas in the liquid, gas leakage, vaporization of the liquid, etc. Therefore, in order to maintain the effect of reducing pulsation, it is necessary to adjust the liquid level in the tank within a certain range. Patent Document 1 describes adjusting (controlling) the liquid level of the liquid in the tank within a predetermined range based on the detection signal of a liquid level sensor.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In Patent Document 1, it is necessary to provide a liquid level sensor in order to adjust the liquid level of the liquid in the tank within a predetermined range, and a technique for reducing pulsation with a simpler configuration is desired.

[0006] Therefore, an object of the present invention is to provide an adjustment method, an information processing apparatus, and a program capable of reducing pulsation with a simpler configuration.

Means for Solving the Problems

[0007] The adjustment method according to the present invention is an adjustment method for adjusting the amount of the gas contained in a tank that communicates with a conduit through which a liquid for cooling a control target flows and stores the liquid and the gas, the adjustment method including: an acquisition step of acquiring control data of the control target; a calculation step of calculating evaluation data based on the control data; and a control step of controlling the amount of the gas contained in the tank based on the evaluation data.

Effects of the Invention

[0008] According to the present invention, it is possible to provide an adjustment method, an information processing apparatus, and a program capable of reducing pulsation with a simpler configuration.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Embodiments for Carrying Out the Invention

[0010] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims. Although a plurality of features are described in the embodiments, not all of these plurality of features are essential for the invention, and the plurality of features may be arbitrarily combined. Further, in the accompanying drawings, the same or similar configurations are denoted by the same reference numerals, and redundant descriptions are omitted. In addition, in the accompanying drawings, in order to facilitate understanding of the present embodiment, there are cases where it is drawn at a scale different from the actual one.

[0011] <First Embodiment> FIG. 1 is a diagram showing a lithography apparatus 1000 including a stage apparatus 100. Here, the lithography apparatus 1000 may be referred to as an exposure apparatus. The lithography apparatus 1000 includes a light source unit 500 including a light source, an illumination optical system 400, a projection optical system 200, and a first control unit 110. Further, the lithography apparatus 1000 includes a reticle stage 300 that holds and moves a reticle R (master, mask), and a wafer stage 102 that holds and moves a wafer W (substrate). The stage apparatus 100 will be described as having a wafer stage 102 that holds and moves the wafer W, but the stage apparatus may have a reticle stage 300. That is, the stage apparatus 100 has a stage that holds and moves an object.

[0012] Here, in this specification and the accompanying drawings, unless otherwise specified, directions are indicated in an XYZ coordinate system with the direction parallel to the holding surface for the wafer stage 102 to hold the wafer W as the XY plane. Directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are referred to as the X-direction, Y-direction, and Z-direction, respectively.

[0013] The illumination optical system 400 includes lenses, mirrors, optical integrators, diaphragms, etc. (not shown), which adjust the light from the light source unit 500 to illuminate the reticle R, which is the illuminated area. The reticle R is a master (mask), for example, made of quartz glass, on which a pattern (e.g., a circuit pattern) to be transferred onto the wafer W is formed. The reticle stage 300 holds the reticle R and is movable in the directions of the X, Y, and Z axes and the rotational directions around each axis, and is driven by a drive mechanism such as a linear motor (not shown). The projection optical system 200 projects the light that has passed through the reticle R onto the wafer W at a predetermined magnification. The wafer W is a substrate made of, for example, single-crystalline silicon, on which a photoresist (photosensitive material) is coated on its surface. The wafer stage 102 can be a mounting table that holds the wafer W via a wafer chuck (not shown). The wafer stage 102 includes an XY stage and a rotation stage, is movable in the directions of the X, Y, and Z axes and the rotational directions around each axis, and is driven by a drive mechanism such as a linear motor (not shown). In the following description, the wafer stage 102 may be simply referred to as the stage 102.

[0014] The first control unit 110 may be understood as a controller, a processor, or a computer (information processing device). The first control unit 110 may be configured, for example, by a PLD (abbreviation for Programmable Logic Device) such as an FPGA (abbreviation for Field Programmable Gate Array), or an ASIC (abbreviation for Application Specific Integrated Circuit), or a general-purpose or dedicated computer in which a program is incorporated, or a combination of all or part of these. The first control unit 110 comprehensively controls each part of the lithography apparatus 1000 and executes a lithography process of forming a pattern formed on the reticle R on the wafer W.

[0015] FIG. 2 is a diagram showing the stage device 100. In FIG. 2, the solid arrows indicate the flow of liquid or gas, and the dotted arrows indicate the flow of signals. The stage device 100 may include, for example, a stage 102 that holds and moves an object (wafer W, reticle R), a conduit 120 through which a liquid (coolant) for cooling the stage 102 flows, and the first control unit 110. Further, the stage device 100 may include a pump 108 that causes a liquid to flow through the conduit 120, a pulsation reduction device 001 that reduces the pulsation of the liquid in the conduit 120, and a heat exchanger 106 disposed in the conduit 120. The heat exchanger 106 is configured to cool the liquid flowing through the conduit 120 by heat exchange. Further, the stage device 100 may include a storage tank 107 disposed in the conduit 120. The storage tank 107 may be arranged, for example, to store the liquid flowing through the heat exchanger 106 so that the liquid in the storage tank 107 is sucked out by the pump 108. The stage device 100 may include a heater 109 that heats the liquid flowing through the conduit 120. The heater 109 may be arranged to heat the liquid sent out from the pump 108 and supply it to the stage 102 to be cooled.

[0016] The first control unit 110 can function as a controller that controls the position of the stage 102. The stage device 100 may include a drive unit 111 for driving the stage 102 and a positioning unit 112 for detecting the position of the stage 102. The first control unit 110 may be configured to output a driving amount to the drive unit 111 so as to displace the position of the stage 102 acquired from the positioning unit 112 to the target position. That is, the first control unit 110 controls the movement of the stage 102 by the drive unit 111 with the stage 102 as the control target.

[0017] The pulsation reduction device 001 may include a buffer tank 101 arranged to communicate with a conduit 120 provided with a pump 108 for circulating a liquid. The buffer tank 101 may be configured to store a liquid and a gas so that the pulsation of the liquid in the conduit 120 is reduced. The buffer tank 101 may be arranged, for example, such that the liquid sent out from the pump 108 flows into the buffer tank 101 and the liquid R in the buffer tank 101 is supplied to the stage 102 to be cooled. An air space (air layer) SP is formed above the liquid level of the liquid R in the buffer tank 101. The pulsation reduction device 001 may include an adjustment mechanism AD for adjusting the amount of gas in the buffer tank 101. The adjustment mechanism AD may be configured to adjust the amount of gas in the air space SP. The pulsation reduction device 001 may include a second control unit 104 for controlling the adjustment mechanism AD. The second control unit 104 may be configured to control the adjustment mechanism AD to adjust the amount of gas in the air space SP based on the control data of the stage 102 acquired from the first control unit 110 for controlling the position of the stage 102.

[0018] The second control unit 104 may be understood as a controller, a processor, or a computer (information processing device). The second control unit 104 may be configured by, for example, a PLD such as an FPGA, or an ASIC, or a general-purpose or dedicated computer in which a program is incorporated, or a combination of all or part of these. Here, the second control unit 104 may be configured as a part of the first control unit 110, and in that case, the function of the second control unit 104 may be realized by the first control unit 110.

[0019] The adjustment mechanism AD may include, for example, valves 103a, 103b and a pressure regulator 105. Here, at least one of valves 103a and 103b may be simply referred to as valve 103. Valve 103a supplies the gas whose pressure is adjusted by the pressure regulator 105 to the space portion SP of the buffer tank 101. By supplying gas to the space portion SP, valve 103a increases the pressure of the space portion SP, in other words, the internal pressure of the buffer tank 101. Valve 103b decreases the pressure of the space portion SP, in other words, the internal pressure of the buffer tank 101, by discharging the gas in the space portion SP. Valve 103 may be controlled by the second control unit 104. Valve 103 may also be operated by an operator.

[0020] The liquid delivered from the pump 108 may flow into the buffer tank 101 of the pulsation reducing device 001 with pulsations caused by the operation of the pump 108. The gas accumulated in the space portion SP of the buffer tank 101 may function as a buffer for reducing pulsations. The flow rate of the liquid may vary due to pulsations. When the pressure of the liquid is higher than the reference pressure, the liquid corresponding to the difference flows into the buffer tank 101. On the other hand, when the pressure of the liquid is lower than the reference pressure, the liquid R is pushed out of the buffer tank 101 by the pressure of the gas in the space portion SP so as to replenish the liquid corresponding to the difference. By the above mechanism, the pulsations transmitted to the downstream side of the buffer tank 101 are reduced, and the liquid R is always supplied to the stage 102 to be cooled at a constant flow rate.

[0021] FIG. 3 is a diagram showing the flow of fluid and data in the stage device 100. In FIG. 3, solid arrows indicate the flow of fluid (liquid or gas), and dotted arrows indicate the flow of data (information such as signals, displacements, or positions). The drive unit 111 converts the drive amount given from the first control unit 110 into a physical quantity (displacement) of the stage 102. That is, the drive unit 111 displaces the stage 102 based on the drive amount. The drive unit 111 may be configured with a motor and a driver. The positioning unit 112 detects the position of the stage 102 and feeds back position information to the first control unit 110. The positioning unit 112 may be configured with at least one of an interferometer, an encoder, and a sensor. Also, the feedback destination of the positioning unit 112 may be the drive unit 111. In this case, the drive unit 111 feeds back the position information of the stage 102 to the first control unit 110. The second control unit 104 acquires control data of the stage 102 from the first control unit 110. The second control unit 104 generates a command value for the valve 103 based on the acquired control data and adjusts the amount of gas in the buffer tank 101. That is, the second control unit 104 adjusts the amount of gas in the buffer tank 101 based on the control data.

[0022] FIG. 4 is a flowchart showing the adjustment method according to the present embodiment. Each step in FIG. 4 will be described as being executed by the second control unit 104, but it may also be executed by the first control unit 110. The flowchart shown in FIG. 4 can be executed at a predetermined execution timing. The execution timing may be, for example, the timing when the first substrate W included in the lot is conveyed to the stage device 100. Here, a lot is used when a predetermined number (for example, 25) of substrates W are referred to as one unit. That is, the execution timing may be the timing when the first substrate W among the plurality of substrates W included in the lot is conveyed when the plurality of substrates W included in the lot are sequentially conveyed to the stage device 100.

[0023] Also, the execution timing may be, for example, the timing when the stage device 100 stops or the timing when the substrate W is not being conveyed to the stage device 100 so as not to affect the throughput of the stage device 100.

[0024] The second control unit 104 stores information regarding the execution timing in a memory (not shown), determines whether it is the execution timing at regular intervals, and executes the flowchart shown in FIG. 4 when it is determined to be the execution timing. The memory for storing the information regarding the execution timing may be inside the second control unit 104 or outside the second control unit 104. The flowchart shown in FIG. 4 may be executed by the second control unit 104 at the timing instructed by the first control unit 110 or an external information processing device.

[0025] In step S402, the second control unit 104 acquires the control data of the stage 102. That is, the second control unit 104 has an acquisition unit that acquires the control data of the stage 102. The control data may include at least one of information regarding the target position of the stage 102, information regarding the position of the stage 102, and information regarding the control deviation of the stage 102. The control data may include information regarding the settling time until the control deviation of the stage 102 falls within a predetermined range. The control data may include information regarding the vibration of the stage 102. Here, the vibration of the stage 102 may include not only the vibration generated by the stage 102 but also the vibration transmitted from the outside, such as a vibration source other than the stage 102, to the stage 102 (hidden vibration). That is, the information regarding the vibration of the stage 102 may include information regarding the vibration generated by the stage 102 and information regarding the vibration transmitted from the outside to the stage 102.

[0026] In step S404, the second control unit 104 calculates evaluation data based on the control data acquired in step S402. That is, the second control unit 104 has a calculation unit that calculates evaluation data based on the control data acquired in step S402. The evaluation data may include statistical data calculated based on the control data (for example, at least one of the average value, median value, maximum value, minimum value, variance, and standard deviation of the control data). For example, the evaluation data may include 3σ (a value obtained by multiplying the standard deviation by 3) of the control deviation calculated based on the control deviation of the stage 102. Further, the evaluation data may include analysis data obtained by analyzing the control data (such as frequency analysis). For example, the evaluation data may include analysis data calculated by numerical analysis based on the control data. For example, the evaluation data may include data obtained by subjecting the control data to frequency analysis (Fourier transform). The analysis data obtained by frequency analysis (Fourier transform) may include, for example, data related to the frequency of vibration of the stage 102 or data related to the amplitude at the natural frequency of vibration of the stage 102.

[0027] In step S406, the second control unit 104 determines whether the evaluation data calculated in step S404 falls within a predetermined range. That is, the second control unit 104 has a determination unit that determines whether the evaluation data calculated in step S404 falls within a predetermined range. If the evaluation data falls within the predetermined range, the second control unit 104 ends the process, and if the evaluation data does not fall within the predetermined range, it proceeds to step S408.

[0028] Here, the predetermined range can be a range in which the evaluation data is smaller than a predetermined threshold value. For example, a range in which 3σ of the control deviation of the stage 102 is smaller than a predetermined threshold value can be set as the predetermined range. Since the pulsation of the pump 108 is transmitted to the stage 102 as an external disturbance and the control deviation of the stage 102 increases, it can be determined that the influence of the pulsation of the pump 108 becomes large when 3σ of the control deviation becomes larger than the predetermined threshold value.

[0029] Further, for example, a bandwidth in which the frequency of the vibration included in the vibration of the stage 102 is lower than a predetermined threshold value (for example, the driving frequency of the pump) can be set to a predetermined range. The vibration caused by the pulsation of the pump 108 may be generated due to the influence of the slip of the motor (not shown) of the pump 108, and may be a vibration having a frequency in a bandwidth lower than the driving frequency of the pump 108 (for example, a range where the frequency is lower than 60 Hz and higher than 50 Hz).

[0030] Further, the predetermined range can be set as a range in which the amount of change (difference or ratio) between the previously calculated evaluation data and the currently calculated evaluation data is smaller than a predetermined threshold value. That is, the second control unit 104 determines whether the amount of change in the evaluation data falls within a predetermined range, and proceeds to step S408 when the amount of change in the evaluation data does not fall within the predetermined range. In this case, the second control unit 104 stores the previously calculated evaluation data in a memory (not shown) and calculates the amount of change from the currently calculated evaluation data. For example, the amount of change between 3σ of the control deviation of the stage 102 calculated previously and 3σ of the control deviation of the stage 102 calculated this time can be set to a range smaller than a predetermined threshold value (for example, a range smaller than 0). For example, since the control deviation of the stage 102 increases as the amount of gas in the buffer tank 101 decreases over time, it can be determined that the influence of the pulsation of the pump 108 has increased.

[0031] Further, the correlation between the amount of gas in the buffer tank 101 and the evaluation data may be obtained through experiments, simulations, or the like. The second control unit 104 may obtain a predetermined range based on the data regarding the obtained correlation. Also, due to the environment in which the stage device 100 is installed or the manufacturing error of the stage device 100, the data regarding the correlation may differ for each stage device 100. Therefore, the data regarding the correlation may be obtained for each stage device 100. The data regarding the correlation may be stored in the memory (not shown) of the second control unit 104. The memory for storing the data regarding the correlation may be inside the second control unit 104 or outside the second control unit 104.

[0032] Further, the second control unit 104 may calculate the number of times the evaluation data calculated in step S404 does not fall within a predetermined range, and determine that it does not fall within the predetermined range when the number of times it does not fall within the predetermined range exceeds a predetermined number of times. For example, when the number of times the difference or ratio between 3σ of the control deviation of the stage 102 calculated last time and 3σ of the control deviation of the stage 102 calculated this time exceeds a predetermined number of times, the second control unit 104 may determine that it does not fall within the predetermined range.

[0033] In step S408, the second control unit 104 controls the adjustment mechanism AD to control the amount of gas contained in the buffer tank 101. That is, the second control unit 104 has a control unit that controls the amount of gas contained in the buffer tank 101. The second control unit 104 and the adjustment mechanism AD control the amount of gas contained in the buffer tank 101. The adjustment mechanism AD opens and closes the valve 103, supplies or discharges gas to the space portion SP of the buffer tank 101, and adjusts the amount of gas in the buffer tank 101. The second control unit 104 determines the amount of gas to be adjusted based on the evaluation data calculated in step S404. For example, the amount of gas to be adjusted may be determined based on the difference or ratio between the evaluation data and a predetermined threshold value. Also, for example, a correlation relationship between the amount of gas to be adjusted and the evaluation data is obtained through experiments or simulations, etc., and the amount of gas to be adjusted may be determined based on the correlation relationship between the amount of gas to be adjusted and the evaluation data.

[0034] As described above, according to the stage device according to the present embodiment, since the amount of gas in the buffer tank 101 is adjusted based on the control data of the stage 102, pulsation can be reduced with a simpler configuration.

[0035] <Second Embodiment> Next, a stage device according to the second embodiment will be described. Matters not mentioned as this embodiment may follow the first embodiment. FIG. 5 is a flowchart showing the adjustment method according to this embodiment. Here, descriptions of the same matters as those in the description of FIG. 4 are omitted.

[0036] As a cause for the evaluation data not falling within a predetermined range, in addition to the cause due to the pulsation of the pump 108, there may be other causes such as a sudden disturbance to the stage 102. In order to suppress the erroneous adjustment of the gas due to such a cause, in the present embodiment, the adjustment of the gas is performed according to the number of times the evaluation data does not fall within the predetermined range.

[0037] In step S402, the second control unit 104 acquires the control data of the stage 102.

[0038] In step S404, the second control unit 104 calculates evaluation data based on the control data acquired in step S402.

[0039] In step S406, the second control unit 104 determines whether the evaluation data falls within a predetermined range. If the evaluation data falls within the predetermined range, the second control unit 104 proceeds to step S506. If the evaluation data does not fall within the predetermined range, the second control unit 104 proceeds to step S502.

[0040] In step S502, the second control unit 104 adds 1 to a counter C stored in a memory (not shown). The counter C is a value for recording the number of times the evaluation data does not fall within the predetermined range, and is an integer of 0 or more.

[0041] In step S504, the second control unit 104 determines whether the counter C is a predetermined number of times. The predetermined number of times can be, for example, 3. If the counter C is the predetermined number of times, the second control unit 104 proceeds to step S408. If the counter C is not the predetermined number of times, the process ends. Here, the predetermined number of times is an integer of 1 or more. When the predetermined number of times is 1, it is the same as the flowchart of FIG. 4.

[0042] In step S408, the second control unit 104 controls the adjustment mechanism AD to control the amount of gas in the buffer tank 101.

[0043] In step S506, the second control unit 104 resets the counter C. When the counter C is reset, it becomes 0.

[0044] Here, with reference to FIG. 6, changes in the evaluation data calculated based on the control data will be described. FIG. 6 is a diagram showing changes in the evaluation data calculated based on the control data. In FIG. 6, the horizontal axis represents time, and the vertical axis represents the evaluation data. Here, the evaluation data is, for example, 3σ of the control deviation of the stage 102. The black circles represent the actually calculated evaluation data, and the white circles represent the estimated evaluation data.

[0045] In section a, the number of times the evaluation data has not continuously fallen within a predetermined range (a range greater than the threshold value c in the example of FIG. 6) has not reached a predetermined number of times (3 in the example of FIG. 6). When the number of times the evaluation data has not continuously fallen within a predetermined range has not reached a predetermined number of times, it is estimated that the amount of gas in the buffer tank 101 is maintained within a certain range and the pulsation of the pump 108 is suppressed.

[0046] On the other hand, in section b, at time t1, the number of times the evaluation data has not continuously fallen within a predetermined range has reached a predetermined number of times. When the number of times the evaluation data has not continuously fallen within a predetermined range has reached a predetermined number of times, it is estimated that the amount of gas in the buffer tank 101 decreases with the passage of time, the influence of the pulsation of the pump 108 increases, and the evaluation data continues to increase after time t1.

[0047] In this way, by adjusting the gas at time t1, even when the evaluation data does not fall within a predetermined range due to a sudden disturbance or the like, it is possible to suppress incorrect adjustment of the gas.

[0048] As described above, according to the stage device according to the present embodiment, since the amount of gas in the buffer tank 101 is adjusted based on the control data of the stage 102, pulsation can be reduced with a simpler configuration. Further, since the gas can be adjusted according to the number of times the evaluation data does not fall within a predetermined range, even when the control data of the stage 102 is affected by other causes such as sudden disturbances, erroneous adjustment of the gas can be suppressed.

[0049] <Third Embodiment> Next, a stage device according to the third embodiment will be described. Matters not mentioned in this embodiment may follow the first and second embodiments. FIG. 7 is a flowchart showing the adjustment method according to this embodiment. Here, descriptions of the same matters as in FIGS. 4 and 5 are omitted.

[0050] If the evaluation data does not fall within the predetermined range even after adjusting the amount of gas in the buffer tank 101, for example, there is a high possibility that an abnormality has occurred due to a cause other than the pulsation of the pump 108, such as a failure of the stage device 100. Therefore, in this embodiment, when the evaluation data does not fall within the predetermined range after adjusting the amount of gas in the buffer tank 101, information indicating that an abnormality has occurred is output.

[0051] In step S402, the second control unit 104 acquires the control data of the stage 102.

[0052] In step S404, the second control unit 104 calculates evaluation data based on the control data acquired in step S402.

[0053] In step S406, the second control unit 104 determines whether the evaluation data falls within a predetermined range. If the evaluation data falls within the predetermined range, the second control unit 104 proceeds to step S506. If the evaluation data does not fall within the predetermined range, the second control unit 104 proceeds to step S502.

[0054] In step S502, the second control unit 104 adds 1 to a counter C stored in a memory (not shown).

[0055] In step S504, the second control unit 104 determines whether the counter C is a predetermined number of times. If the counter C is a predetermined number of times, the second control unit 104 proceeds to step S408. If the counter C is not a predetermined number of times, the second control unit 104 proceeds to step S602.

[0056] In step S408, the second control unit 104 controls the adjustment mechanism AD to control the amount of gas in the buffer tank 101.

[0057] In step S602, the second control unit 104 determines whether the counter C is greater than a predetermined number of times. If the counter C is greater than a predetermined number of times, the second control unit 104 proceeds to step S604. If the counter C is not greater than a predetermined number of times, the process ends.

[0058] In step S604, the second control unit 104 outputs abnormality information indicating that an abnormality has occurred. Here, the second control unit 104 may output the abnormality information to a display unit (not shown) or may output the abnormality information to an external information processing device.

[0059] As described above, according to the stage device according to the present embodiment, since the amount of gas in the buffer tank 101 is adjusted based on the control data of the stage 102, pulsation can be reduced with a simpler configuration. In addition, since the gas can be adjusted according to the number of times the evaluation data does not fall within a predetermined range, even if the control data of the stage 102 is affected by other causes such as sudden disturbances, it is possible to suppress erroneously adjusting the gas. Further, when the evaluation data does not fall within a predetermined range after adjusting the amount of gas in the buffer tank 101 and there is a high possibility that an abnormality has occurred due to a cause other than the pulsation of the pump 108, the abnormality information can be output.

[0060] <Method for manufacturing an article> As an article, for example, a manufacturing method of a device (such as a semiconductor device, a magnetic storage medium, a liquid crystal display element, etc.), a color filter, or a hard disk will be described. Such a manufacturing method includes a step of forming a pattern on a substrate (such as a wafer, a glass plate, a film-like substrate, etc.) by irradiating light onto the substrate using a lithography apparatus (such as an exposure apparatus, etc.) having a temperature adjustment device for adjusting the temperature of the gas supplied to the chamber. Such a manufacturing method further includes a step (processing step) of processing the substrate on which the pattern is formed. The processing step may include a step of removing the remaining film of the pattern. Further, the processing step may include a step of etching the substrate using the pattern as a mask. Further, the processing step may include steps such as dicing, bonding, and packaging as other well-known steps. The manufacturing method of the article in the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the prior art.

[0061] Next, as an example of a manufacturing method of an article, an example of a device manufacturing method using the above-described exposure apparatus will be described with reference to FIGS. 8 and 9. FIG. 8 is a flowchart for explaining the manufacturing of a device (such as a semiconductor chip such as an IC or an LSI, an LCD, a CCD, etc.). Here, the manufacturing method of the semiconductor chip will be described as an example.

[0062] In step S1 (circuit design), the circuit of the semiconductor device is designed. In step S2 (mask fabrication), a mask (master plate) is fabricated based on the designed circuit pattern. In step S3 (wafer manufacturing), a wafer (substrate) is manufactured using materials such as silicon. Step S4 (wafer process), also called the front process, uses the mask and the wafer to form an actual circuit on the wafer by lithography technology with the above-mentioned exposure apparatus. Here, the exposure apparatus illuminates the master plate on which the circuit pattern is formed and projects the image of the circuit pattern of the master plate onto the wafer, thereby forming a circuit pattern on the wafer. Step S5 (assembly), also called the back process, is a process of forming semiconductor chips using the wafer fabricated in step S4, and includes assembly processes such as an assembly process (dicing, bonding), a packaging process (chip encapsulation), etc. In step S6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device fabricated in step S5 are performed. Through these processes, the semiconductor device is completed and shipped (step S7).

[0063] Figure 9 is a detailed flowchart of the wafer process in step S4. In step S11 (oxidation), the surface of the wafer is oxidized. In step S12 (CVD), an insulating film is formed on the surface of the wafer. In step S13 (electrode formation), electrodes are formed on the wafer by vapor deposition. In step S14 (ion implantation), ions are implanted into the wafer. In step S15 (resist treatment), a photosensitive agent is applied to the wafer. In step S16 (exposure), the circuit pattern of the mask is exposed onto the wafer by the exposure apparatus. In step S17 (development), the exposed wafer is developed. In step S18 (etching), portions other than the developed resist image are removed. In step S19 (resist stripping), the resist that has become unnecessary after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer.

[0064] As described above, the preferred embodiments of the present invention have been explained. Needless to say, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist thereof.

[0065] Also, as an example of a lithographic apparatus, an exposure apparatus has been described, but it is not limited thereto. As an example of a lithographic apparatus, an imprint apparatus that performs a process of forming a pattern of an imprint material on a substrate using a mold (die, template) having a concavo-convex pattern may be used. Further, as an example of a lithographic apparatus, a planarization apparatus that performs a process of molding a composition on a substrate so as to be planarized using a mold (planar template) having a flat portion without a concavo-convex pattern may be used. Further, as an example of a lithographic apparatus, a drawing apparatus that performs a process of forming a pattern on a substrate by drawing with a charged particle beam (such as an electron beam or an ion beam) through a charged particle optical system may be used.

[0066] <Other Embodiments> The present invention can also be realized by supplying a program that realizes one or more functions of the above-described embodiments to a system or apparatus via a network or a storage medium, and causing one or more processors in a computer of the system or apparatus to read and execute the program. Further, it can also be realized by a circuit (for example, an ASIC) that realizes one or more functions.

[0067] <Summary of Embodiments> The disclosure of this specification includes the following adjustment method, information processing apparatus, program, lithographic apparatus, and article manufacturing method.

[0068] (Item 1) An adjustment method for adjusting the amount of gas contained in a tank that communicates with a conduit through which a liquid for cooling a control target flows and stores the liquid and the gas, comprising: an acquisition step of acquiring control data of the control target; a calculation step of calculating evaluation data based on the control data; A control step of controlling the amount of the gas contained in the tank based on the evaluation data, characterized by the adjustment method.

[0069] (Item 2) In the control step, when the evaluation data does not fall within a predetermined range, the amount of the gas is controlled. The adjustment method according to Item 1, characterized by the above.

[0070] (Item 3) In the control step, when the amount of change in the evaluation data does not fall within a predetermined range, the amount of the gas is controlled. The adjustment method according to Item 1, characterized by the above.

[0071] (Item 4) In the control step, when the number of times the evaluation data does not fall within a predetermined range exceeds a predetermined number of times, the amount of the gas is controlled. The adjustment method according to Item 1, characterized by the above.

[0072] (Item 5) The control data includes at least one of information on the target position of the control target, information on the position of the control target, and information on the control deviation of the control target. The adjustment method according to any one of Items 1 to 4, characterized by the above.

[0073] (Item 6) The control data includes information on the settling time until the control deviation of the control target falls within a predetermined range. The adjustment method according to any one of Items 1 to 4, characterized by the above.

[0074] (Item 7) The control data includes information on the vibration of the control target. The adjustment method according to any one of Items 1 to 4, characterized by the above.

[0075] (Item 8) The information regarding the vibration of the controlled object includes information regarding the vibration generated by the controlled object and information regarding the vibration transmitted to the controlled object from the outside. The adjustment method according to item 7, characterized in that.

[0076] (Item 9) The evaluation data includes statistical data calculated based on the control data. The adjustment method according to any one of items 1 to 8, characterized in that.

[0077] (Item 10) The statistical data includes at least one of the average value, median value, maximum value, minimum value, variance, and standard deviation of the control data. The adjustment method according to item 9, characterized in that.

[0078] (Item 11) The evaluation data includes analysis data calculated based on the control data. The adjustment method according to any one of items 1 to 8, characterized in that.

[0079] (Item 12) The analysis data includes data obtained by frequency analysis of the control data. The adjustment method according to item 11, characterized in that.

[0080] (Item 13) The analysis data includes data regarding the frequency of the vibration of the controlled object. The adjustment method according to item 12, characterized in that.

[0081] (Item 14) The analysis data includes data regarding the amplitude at the natural frequency of the vibration of the controlled object. The adjustment method according to item 13, characterized in that.

[0082] (Item 15) An information processing apparatus that communicates with a conduit through which a liquid for cooling a controlled object flows and adjusts the amount of the gas contained in a tank that stores the liquid and the gas, an acquisition unit that acquires control data of the controlled object; a calculation unit that calculates evaluation data based on the control data; a determination unit that determines whether to adjust the amount of the gas based on the evaluation data; and a control unit that controls the amount of the gas contained in the tank when it is determined by the determination unit that the amount of the gas is to be adjusted. An information processing apparatus characterized by the above.

[0083] (Item 16) A program for causing a computer to execute the adjustment method according to any one of Items 1 to 14.

[0084] (Item 17) A stage device having a stage for holding and moving an object, a conduit through which a liquid for cooling the stage flows; and a tank that communicates with the conduit and stores the liquid and the gas. The control unit includes an acquisition unit that acquires control data of the stage; a calculation unit that calculates evaluation data based on the control data; a determination unit that determines whether to adjust the amount of the gas based on the evaluation data; and a control unit that controls the amount of the gas contained in the tank when it is determined by the determination unit that the amount of the gas is to be adjusted. A lithography apparatus characterized by the above.

[0085] (Item 18) A lithography apparatus for forming a pattern on a substrate, a stage for holding and moving the substrate; a conduit through which a liquid for cooling the stage flows; and a tank that communicates with the conduit and stores the liquid and the gas. The control unit includes an acquisition unit that acquires control data of the stage, a calculation unit that calculates evaluation data based on the control data, a determination unit that determines whether to adjust the amount of the gas based on the evaluation data, and a control unit that controls the amount of the gas contained in the tank when it is determined by the determination unit that the amount of the gas is to be adjusted. A lithography apparatus characterized by the above.

[0086] (Item 19) A step of forming a pattern on a substrate using the lithography apparatus according to Item 18, and a step of manufacturing an article from the substrate on which the pattern is formed. A method for manufacturing an article characterized by the above.

Claims

1. 1. A method for adjusting an amount of gas contained in a tank that is connected to a conduit through which a liquid for cooling a controlled object flows and that stores the liquid and the gas, comprising: an acquisition step of acquiring control data of the control target; a calculation step of calculating evaluation data based on the control data; and a control step of controlling the amount of the gas contained in the tank based on the evaluation data. The adjustment method according to claim 1,

2. In the control step, the amount of the gas is controlled when the evaluation data is not within a predetermined range. The adjustment method according to claim 1 .

3. In the control step, the amount of the gas is controlled when the amount of change in the evaluation data is not within a predetermined range. The adjustment method according to claim 1 .

4. In the control step, the amount of the gas is controlled when the number of times that the evaluation data does not fall within a predetermined range exceeds a predetermined number. The adjustment method according to claim 1 .

5. The control data includes at least one of information on a target position of the control object, information on a position of the control object, and information on a control deviation of the control object. The adjustment method according to claim 1 .

6. The control data includes information regarding a settling time required for a control deviation of the controlled object to fall within a predetermined range. The adjustment method according to claim 1 .

7. The control data includes information regarding vibration of the controlled object. The adjustment method according to claim 1 .

8. The information on the vibration of the controlled object includes information on the vibration generated by the controlled object and information on the vibration transmitted from the outside to the controlled object. The adjustment method according to claim 7 .

9. The evaluation data includes statistical data calculated based on the control data. The adjustment method according to claim 1 .

10. the statistical data includes at least one of a mean, a median, a maximum, a minimum, a variance, and a standard deviation of the control data; The adjustment method according to claim 9 .

11. The evaluation data includes analysis data calculated based on the control data. The adjustment method according to claim 1 .

12. The analysis data includes data obtained by frequency analysis of control data. The adjustment method according to claim 11 .

13. The analysis data includes data on a frequency of vibration of the controlled object. The adjustment method according to claim 12 .

14. The analysis data includes data on amplitude at a natural frequency of vibration of the controlled object. The adjustment method according to claim 13 .

15. An information processing device that adjusts an amount of gas contained in a tank that is connected to a conduit through which a liquid for cooling a controlled object flows and that stores the liquid and the gas, comprising: an acquisition unit that acquires control data of the control target; A calculation unit that calculates evaluation data based on the control data; a determination unit that determines whether to adjust the amount of the gas based on the evaluation data; a control unit that controls the amount of the gas contained in the tank when the determination unit determines that the amount of the gas should be adjusted.

23. An information processing apparatus comprising:

16. A program for causing a computer to execute the adjustment method according to claim 1.

17. A stage apparatus having a stage for holding and moving an object, a conduit through which a liquid flows for cooling the stage; a tank communicating with the conduit and configured to store the liquid and the gas; A control unit, The control unit is An acquisition unit that acquires control data for the stage; A calculation unit that calculates evaluation data based on the control data; a determination unit that determines whether to adjust the amount of the gas based on the evaluation data; a control unit that controls the amount of the gas contained in the tank when the determination unit determines that the amount of the gas should be adjusted. A stage apparatus comprising:

18. 1. A lithographic apparatus for forming a pattern on a substrate, comprising: a stage that holds and moves the substrate; a conduit through which a liquid flows for cooling the stage; a tank communicating with the conduit and configured to store the liquid and the gas; A control unit, The control unit is An acquisition unit that acquires control data for the stage; A calculation unit that calculates evaluation data based on the control data; a determination unit that determines whether to adjust the amount of the gas based on the evaluation data; a control unit that controls the amount of the gas contained in the tank when the determination unit determines that the amount of the gas should be adjusted.

13. A lithography apparatus comprising:

19. forming a pattern on a substrate using a lithographic apparatus according to claim 18; and manufacturing an article from the patterned substrate. A method for producing an article.

Images