Resin film forming film and method for manufacturing sealed body

Abstract

To provide a resin film forming film capable of forming a resin film capable of suppressing deviation of a fixed position of a workpiece on a support when the workpiece on the support is sealed with sealing resin by flowing the sealing resin on the support after the workpiece obtained by processing a work is fixed on the support by the resin film.SOLUTION: A heat curable resin film forming film 13 is a cured product obtained by heat-curing one sheet of the resin film forming film 13 or a laminate of a plurality of sheets of the resin film forming films 13 having a thickness of less than 200 μm by heating at 140°C for two hours. A first test piece having thickness of 200±20 μm and a width of 5 mm has a storage modulus E (200) of 0.2 GPa or more at a temperature of 200°C when measured while being heated from 0°C to 300°C at a frequency of 11 Hz and a heating rate of 3°C / min.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a resin film-forming film and a method for producing an encapsulated body. [Background technology]

[0002] In the manufacturing process of a substrate device, a sealing resin is poured onto a support on which a semiconductor chip is provided, and the semiconductor chip on the support is sealed with the sealing resin to produce a sealed body. Examples of the support include a circuit board for constituting a semiconductor device, and a support substrate that does not constitute a semiconductor device but serves as a base for producing the sealed body.

[0003] The semiconductor chip is fixed on the support via an adhesive layer, for example. The adhesive layer may be provided on the support in advance, may be provided on the semiconductor chip, or may be provided on both the support and the semiconductor chip. As the adhesive layer, a thermosetting material containing a thermosetting resin is preferably used, and the semiconductor chip is fixed on the support by the thermosetting material.

[0004] For example, when a circuit board is used as the support, a method is sometimes adopted in which multiple semiconductor chips are stacked on the support and these semiconductor chips are bonded together with a film-like adhesive layer. Such a thermosetting adhesive layer has a melt viscosity of 1.0×10 at 90°C. 0 ~5.0×10 5 The cured product has an average linear expansion coefficient of 45 ppm or less at 0 to 130°C, and the cured product has a storage modulus of 1.0 × 10 2 ~1.0×10 5 MPa is preferable (see Patent Document 1). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] International Publication No. 2017 / 175480 Summary of the Invention [Problem to be solved by the invention]

[0006] On the other hand, when the semiconductor chip on the support is sealed with sealing resin to produce a sealed body as described above, the semiconductor chip on the support is subjected to pressure by the sealing resin that flows in. At this time, the pressure may cause the thermosetting material of the adhesive layer on the support, which is integrated with the semiconductor chip, to deform, resulting in a shift in the fixed position of the semiconductor chip on the support. In this case, even if the shift in the fixed position is only slight in the order of μm, it may adversely affect the performance of the substrate device. In contrast, the thermosetting adhesive layer disclosed in Patent Document 1 is not a resin film intended to solve such problems.

[0007] So far, we have described a case where the fixing position of the semiconductor chip on the support is misaligned when the semiconductor chip is sealed to create a sealed body in the process of manufacturing a substrate device using a semiconductor wafer as a workpiece and a semiconductor chip as a workpiece. However, the problem of such a misalignment of the fixing position is not limited to semiconductor chips, but can occur in the same way with workpieces other than semiconductor chips, and can occur in the manufacturing process of a substrate device involving the creation of a sealed body using general workpieces.

[0008] The present invention aims to provide a resin film forming film capable of forming a resin film that can suppress deviation of the fixed position of a workpiece on a support when a workpiece obtained by processing the workpiece is fixed on a support by a resin film and then sealing resin is poured onto the support to seal the workpiece on the support with sealing resin. [Means for solving the problem]

[0009] In order to solve the above problems, the present invention employs the following configuration. [1] A thermosetting resin film-forming film, which is a cured product obtained by heating a test laminate prepared by laminating one of the resin film-forming films or multiple sheets of the resin film-forming films each having a thickness of less than 200 μm at 140° C. for 2 hours to heat and cure the film, and which is a first test piece having a thickness of 200±20 μm and a width of 5 mm, is held at two points spaced 10 mm apart, and the storage modulus E' of the first test piece is measured while heating the first test piece from 0° C. to 300° C. in a tensile mode under conditions of a frequency of 11 Hz, a heating rate of 3° C. / min, and a uniform heating rate. When the temperature of the first test piece is 200° C., the storage modulus E'(200) of the first test piece is 0.2 GPa or more. [2] The resin film-formed film described in [1], wherein the resin film-formed film contains a filler (D), and the content of the filler (D) in the resin film-formed film is greater than 60 mass% relative to the total mass of the resin film-formed film. [3] The resin film-forming film according to [1] or [2], wherein tan δ of the first test piece is measured in the same manner as in measuring the storage modulus E' of the first test piece, and the temperature showing the peak of tan δ is defined as the glass transition temperature of the first test piece, and the glass transition temperature is 150°C or lower. [4] A test laminate prepared by laminating one of the resin film-formed films or a plurality of the resin film-formed films each having a thickness of less than 200 μm is heated at 140° C. for 2 hours to obtain a cured product. A second test piece having a thickness of 200±20 μm and a width of 4.5 mm is held at two points with an interval of 15 mm, and the second test piece is heated from -60° C. to 300° C. at a heating rate of 5° C. / min. A load of 2 g is applied to the second test piece to perform a thermomechanical analysis of the second test piece. The second test piece is heated at a temperature t 50° C. lower than the glass transition temperature of the second test piece. 1 and the temperature t 1 The displacement L of the second test piece at 1 and a temperature t 20° C. lower than the glass transition temperature. 2 and the temperature t 2 The displacement L of the second test piece at 2and the linear expansion coefficient α of the second test piece calculated using the formula (1) is 60 ppm or less.

[0010] [5] The resin film-forming film according to any one of [1] to [4], wherein the resin film-forming film is used to form a resin film, which is a thermoset product, on a support, and the workpiece obtained by processing the workpiece is fixed on the support by the resin film, and then a sealing resin is poured onto the support to seal the workpiece on the support with the sealing resin. [6] The resin film-forming film according to any one of [1] to [5], wherein the resin film-forming film is heated at 140°C for 2 hours to obtain a cured product having a surface roughness Ra of 2.5 µm or less. [7] A method for producing an encapsulated body using a resin film-forming film or a composite sheet, the resin film-forming film being the resin film-forming film according to any one of [1] to [6], the composite sheet being configured with a support sheet and the resin film-forming film according to any one of [1] to [6] provided on one side of the support sheet, the method comprising: a bonding step of bonding the resin film-forming film not constituting the composite sheet or the resin film-forming film in the composite sheet to any location on a support; and a heat-curing step of bonding the resin film-forming film not constituting the composite sheet to any location on the support after the bonding step. a heat curing step (1) of forming a resin film by heat curing the resin film-forming film in the composite sheet, or a heat curing step (2) of forming a resin film by heat curing the resin film-forming film in the composite sheet; a removal step of removing the support sheet from the resin film after the heat curing step (2); a fixing step of fixing a workpiece obtained by processing a workpiece to the resin film on the support after the heat curing step (1) or the removal step; and a sealing step of sealing the workpiece on the support with the sealing resin by flowing a sealing resin onto the support, thereby obtaining a sealed body. Effect of the Invention

[0011] According to the present invention, a resin film forming film is provided that can form a resin film that can suppress deviation of the fixed position of the workpiece on the support when the workpiece obtained by processing the workpiece is fixed on a support by a resin film and then sealing resin is poured onto the support to seal the workpiece on the support with the sealing resin. [Brief description of the drawings]

[0012] [Figure 1] FIG. 1 is a cross-sectional view showing a schematic example of a resin film-forming film according to an embodiment of the present invention. [Diagram 2] FIG. 1 is a cross-sectional view showing a schematic example of a composite sheet provided with a resin film-forming film according to an embodiment of the present invention. [Diagram 3] FIG. 11 is a cross-sectional view showing a schematic diagram of another example of a composite sheet provided with a resin film-forming film according to one embodiment of the present invention. [Figure 4] 1A to 1C are cross-sectional views for illustrating an example of a method for manufacturing a sealed body according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] ◇Resin film forming film The resin film-forming film according to one embodiment of the present invention is a thermosetting resin film-forming film, and is a cured product obtained by heating a test laminate prepared by laminating one of the resin film-forming films or a plurality of the resin film-forming films each having a thickness of less than 200 μm at 140° C. for 2 hours to heat and cure the film. A first test piece having a thickness of 200±20 μm and a width of 5 mm is held at two points spaced 10 mm apart, and the storage modulus E' of the first test piece is measured while heating the first test piece from 0° C. to 300° C. in a tensile mode under conditions of a frequency of 11 Hz, a heating rate of 3° C. / min, and a uniform heating rate. When the temperature of the first test piece is 200° C., the storage modulus E'(200) (sometimes simply referred to as "E'(200)" in this specification) of the first test piece is 0.2 GPa or more. The resin film-formed film of the present embodiment can be laminated with a support sheet to form a composite sheet, for example, as described below.

[0014] The resin film forming film of this embodiment can be used to form a resin film when the workpiece on a support is sealed with sealing resin by fixing the workpiece on the support with a resin film and then flowing the sealing resin onto the support. The resin film-forming film of this embodiment is soft and can be attached well to a support. That is, by using the resin film-forming film, a support with a resin film-forming film can be produced, which is composed of a support and a resin film-forming film provided at any location on the support. The resin film-forming film forms a resin film having adhesive properties by thermal curing. That is, by using the resin film-forming film of this embodiment, a support with a resin film can be produced, which is composed of a support and a resin film provided at any location on the support. On the other hand, when the composite sheet is used, the resin film-forming film in the composite sheet is attached to a support to prepare a support with the composite sheet, and then the resin film-forming film is thermally cured to prepare a support with a cured composite sheet, which includes a support sheet, a resin film provided on one side of the support sheet, and a support provided on the side of the resin film opposite to the support sheet side.Then, the support sheet is removed from the resin film to prepare a support with a resin film, which includes a support and a resin film provided at any location on the support. The workpiece is fixed on the support by the resin film in the support with resin film. For example, a workpiece with film-like adhesive, which is configured to include a workpiece and a film-like adhesive provided at any location on the workpiece, is fixed on the support by the resin film in the support with resin film in the film-like adhesive. In this case, a liquid adhesive may be used instead of the film-like adhesive.

[0015] In this embodiment, the workpiece is obtained by machining a workpiece. Examples of the workpiece include a wafer and a semiconductor device panel.

[0016] Examples of the wafer include semiconductor wafers made of elemental semiconductors such as silicon, germanium, and selenium, and compound semiconductors such as GaAs, GaP, InP, CdTe, ZnSe, and SiC; and insulating wafers made of insulators such as sapphire and glass. For example, if the workpiece is a semiconductor wafer, the workpiece artifacts may include semiconductor chips. A circuit is formed on one surface of each of these wafers, and in this specification, the surface of the wafer on which the circuit is formed is referred to as the "circuit surface," and the surface of the wafer opposite the circuit surface is referred to as the "back surface." The wafer is divided into chips by dicing or other means. In this specification, as in the case of the wafer, the surface of the chip on which the circuit is formed is referred to as the "circuit surface," and the surface of the chip opposite the circuit surface is referred to as the "back surface." Both the circuit surface of the wafer and the circuit surface of the chip are provided with protruding electrodes such as bumps, pillars, etc. The protruding electrodes are preferably made of solder.

[0017] The semiconductor device panel is handled during the manufacturing process of a semiconductor device, and a specific example thereof is a configuration in which a semiconductor device in which one or more electronic components are sealed with sealing resin is used, and multiple such semiconductor devices are arranged in a planar manner within an area of ​​a circular, rectangular, or other shape.

[0018] The workpiece is preferably a chip in an encapsulation body mounted on a substrate device, and more preferably a semiconductor chip in an encapsulation body mounted on a substrate device. The substrate device may be, for example, a device in which a workpiece is fixed to a resin film directly or via a film-like adhesive, the film-like adhesive may be cured, and further, a sealing body is provided on a substrate in which the workpiece on the resin film is sealed with a sealing resin. For example, in the case where a semiconductor wafer is used as the workpiece, a substrate device may be provided with a sealing body having a semiconductor chip. When fixing the workpiece, a liquid adhesive may be used instead of the film-like adhesive.

[0019] When sealing the workpiece on the support with sealing resin, high-temperature sealing resin is poured onto the support. At this time, the workpiece on the support is subjected to pressure by the pouring sealing resin, but by using the resin film-forming film of this embodiment, the storage modulus of the thermosetting resin film at high temperatures is high, so that the workpiece is prevented from shifting from its fixed position on the support. In this way, by preventing the workpiece from shifting, the performance of the substrate device is achieved as intended and is not adversely affected. The degree of the storage modulus of the resin film at high temperatures can be determined by the storage modulus E'(200) at 200°C of the first test piece obtained by thermally curing the resin film-forming film. In this embodiment, E'(200) is 0.2 GPa or more.

[0020] In other words, the resin film forming film of this embodiment is intended to form a thermoset resin film on a support, and is preferably used to fix a workpiece obtained by processing a work on the support with the resin film, and then to seal the workpiece on the support with the sealing resin by flowing a sealing resin onto the support.

[0021] The curing conditions when the resin film-forming film of this embodiment is thermally cured to form a resin film are not particularly limited as long as the resin film is cured to a degree that allows it to fully perform its function, and can be appropriately selected depending on the type of thermosetting resin film-forming film. For example, the heating temperature during thermal curing of the resin film-forming film is preferably 100 to 200° C., more preferably 110 to 170° C., and particularly preferably 120 to 150° C. The heating time during thermal curing is preferably 0.5 to 5 hours, more preferably 0.5 to 4 hours, and particularly preferably 1 to 3 hours. The resin film formed by thermosetting is preferably cooled slowly to room temperature. The method of cooling is not particularly limited, and the resin film may be cooled naturally.

[0022] In this specification, "room temperature" means a temperature that is neither particularly cooled nor heated, that is, an ordinary temperature, and examples thereof include temperatures of 15 to 25°C.

[0023] <<E'(200) of the first test piece>> In this embodiment, the storage modulus E'(200) of the first test piece is 0.2 GPa or more. The resin film-forming film in which the first test piece exhibits such characteristics forms a resin film having a high storage modulus at high temperatures by its thermal curing. By using such a resin film-forming film, as explained above, when the workpiece on the support is sealed with a sealing resin, the shift of the fixed position of the workpiece on the support can be suppressed.

[0024] In order to achieve a greater effect in suppressing the shift of the fixed position of the workpiece described above, E'(200) is preferably 0.25 GPa or more, more preferably 0.3 GPa or more, and may be, for example, either 0.35 GPa or more or 0.4 GPa or more. The upper limit of E'(200) is not particularly limited. For example, a resin film having E'(200) of 0.9 GPa or less can be easily realized. In one embodiment, E'(200) may be any of 0.2 to 0.9 GPa, 0.25 to 0.9 GPa, 0.3 to 0.9 GPa, 0.35 to 0.9 GPa, and 0.4 to 0.9 GPa, although these are only examples of E'(200).

[0025] The thickness of the first test piece is preferably 200 μm. However, as long as the thickness of the first test piece is 180 to 220 μm (200±20 μm), the measured value of E'(200) will be exactly the same as or have a negligible small error with respect to the measured value of E'(200) when the thickness of the first test piece is 200 μm, regardless of the thickness.

[0026] In this specification, the term "thickness" refers not only to the first test piece, but also to the average thickness measured at five randomly selected points on the object, unless otherwise specified, and can be obtained using a constant pressure thickness gauge in accordance with JIS K7130.

[0027] When measuring the storage modulus E', the first test piece is held at two points 10 mm apart, which means that the length of the portion of the first test piece subject to measurement of the storage modulus E' is 10 mm. The first test piece can be held at the two locations using, for example, a known holding means such as a gripping tool.

[0028] The first test piece is a cured product obtained by heat-curing one sheet of the resin film-forming film at 140°C for 2 hours, or a cured product obtained by heat-curing a test laminate produced by stacking multiple sheets of the resin film-forming film each having a thickness of less than 200 μm at 140°C for 2 hours, the cured product having a thickness of 180 to 220 μm and a width of 5 mm. Typically, the thickness of the test laminate and the thickness of the first test piece are comparable. When the number of resin film-forming films constituting the test laminate is 2 or more, the number is not particularly limited and can be selected arbitrarily according to the thickness of each resin film-forming film. For example, a first test piece having a thickness of 200 μm can be prepared by using five resin film-forming films having a thickness of 40 μm. Also, a first test piece having a thickness of 200 μm can be prepared by using ten resin film-forming films having a thickness of 20 μm. However, these are only examples, and the number and thickness of the resin film-forming films used are not limited to these.

[0029] The storage modulus E' of the first test piece (in other words, the storage modulus of the resin film), such as E'(200), can be adjusted by adjusting the type and content of the components contained in the resin film-forming film. For example, by making the resin film-formed film contain a filler (D) described below and adjusting the type of filler (D) in the resin film-formed film or increasing the content of the filler (D), the storage modulus E' of the first test piece can be more easily increased. For example, if the resin film-forming film contains an epoxy resin (B1) and a thermosetting agent (B2) (thermosetting component (B)) described below, and the content of the thermosetting agent (B2) per 100 parts by mass of the epoxy resin (B1) in the resin film-forming film is increased, the storage modulus E' of the first test piece can be more easily increased. For example, by making the resin film-forming film contain the polymer component (A) described below and increasing the glass transition temperature of the polymer component (A), it is easy to make the storage modulus E' of the first test piece relatively high.

[0030] <<Glass transition temperature (Tg) of the first test piece>> When tan δ is measured instead of the storage modulus E' of the first test piece in the same manner as in the measurement of the storage modulus E' of the first test piece, and the temperature showing the peak of tan δ (the portion where tan δ changes from rising to falling, or the portion where tan δ changes from falling to rising) is adopted as the glass transition temperature (Tg) of the first test piece, the Tg of the first test piece is preferably 150 ° C or less, more preferably 100 ° C or less, and even more preferably 70 ° C or less, and may be, for example, 60 ° C or less. When the Tg of the first test piece is below the upper limit value, when the resin film (thermosetting product of the resin film-forming film) is cooled from a high temperature exceeding 100 ° C to about room temperature, the resin film is in a rubber state rather than a glass state for a long time, and the internal stress generated in the resin film during this time is easily relaxed. As a result, the effect of suppressing the occurrence of deformation such as warping in the workpiece processed product fixed on the support by the resin film is enhanced.

[0031] In this specification, not only in the case of the first test piece, but also in any other case, "tan δ" is usually also called "loss factor" or "loss tangent", and is the ratio of storage modulus to loss modulus (loss modulus / storage modulus).

[0032] The lower limit of the Tg of the first test piece is not particularly limited. For example, a resin film-formed film in which the Tg of the first test piece is 30° C. or higher can be more easily realized. In one embodiment, the Tg of the first test piece may be any one of 30 to 150° C., 30 to 100° C., 30 to 70° C., and 30 to 60° C. However, these are only examples of the Tg of the first test piece.

[0033] In the present embodiment, when measuring E'(200) or Tg of the first test specimen, in the process of increasing the temperature of the first test specimen from 0°C to 300°C, if there are two or more temperatures showing a peak of tan δ (the number of peaks of tan δ is two or more), the lowest temperature is adopted as the Tg of the first test specimen. In other words, in the process of increasing the temperature of the first test specimen from 0°C to 300°C, the temperature showing the peak of tan δ that is first detected is adopted as the Tg of the first test specimen.

[0034] The tan δ of the first test piece may be measured simultaneously with the measurement of the storage modulus E' of the first test piece, or may be measured separately from the measurement of the storage modulus E' of the first test piece.

[0035] The Tg of the first test piece can be adjusted by adjusting the type and content of the components contained in the resin film-forming film. For example, by making the resin film-forming film contain an epoxy resin (B1) and a thermosetting agent (B2) (thermosetting component (B)) described below, and not excessively increasing the content of the thermosetting agent (B2) per 100 parts by mass of the epoxy resin (B1) in the resin film-forming film, the Tg of the first test piece can be more easily lowered. For example, by making the resin film-forming film contain the polymer component (A) described below and lowering the glass transition temperature of the polymer component (A), the Tg of the first test piece can be more easily lowered.

[0036] <<Linear expansion coefficient α of the second test piece>> The second test piece is a cured product obtained by heating a test laminate prepared by laminating one of the resin film-forming films or a plurality of the resin film-forming films each having a thickness of less than 200 μm at 140° C. for 2 hours and thermally curing the laminate. The second test piece has a thickness of 200±20 μm and a width of 4.5 mm. The linear expansion coefficient α (sometimes simply referred to as “α” in this specification) is preferably 60 ppm or less. When the α of the second test piece is equal to or less than the upper limit, the adhesive structure between the thermoset product (resin film) of the resin film-forming film and the structure in contact therewith is more stably maintained even in an environment with large temperature changes, and the adhesive reliability is higher. Examples of the structure include the support, the workpiece, the film-like adhesive in the workpiece with the film-like adhesive, and the cured film-like adhesive in the workpiece with the cured film-like adhesive. Here, the cured workpiece with the film-like adhesive means the film-like adhesive in the workpiece with the film-like adhesive that has been cured.

[0037] In terms of further increasing the above-mentioned adhesion reliability, α of the second test piece is preferably 50 ppm or less, and may be, for example, any one of 40 ppm or less, 30 ppm or less, and 27 ppm or less. The lower limit of the value of α of the second test piece is not particularly limited. For example, a resin film-formed film in which the value of α of the second test piece is 10 ppm or more can be more easily realized. In one embodiment, the α of the second test piece may be any one of 10 to 60 ppm, 10 to 50 ppm, 10 to 40 ppm, 10 to 30 ppm, and 10 to 27 ppm, although these are only examples of the α of the second test piece.

[0038] The second specimen is identical to the first except that its width is 4.5 mm instead of 5 mm.

[0039] The linear expansion coefficient α of the second test piece can be calculated by a known method. That is, the second test piece was held at two points with a gap of 15 mm between them, and the second test piece was heated from -60°C to 300°C at a heating rate of 5°C / min while applying a load of 2g to the second test piece. Thermomechanical analysis (TMA) of the second test piece was performed to determine the temperature t 1 and temperature t 1 Displacement L of the second test piece at 1 and a temperature t 20°C lower than the glass transition temperature (Tg) of the second test piece. 2 and temperature t 2 Displacement L of the second test piece at 2 Using the above, the following formula: [Linear expansion coefficient α of the second test piece (ppm)] = (L 2 -L 1 ) / (t 2 -t 1 ) It is calculated as follows. The linear expansion coefficient α of the second test specimen was calculated by the following equation: 1 and the displacement L 1 The coordinates (t 1 ,L 1 ), and temperature t 2 and the displacement L 2 The coordinates (t 2 ,L 2 ) corresponds to the slope of the line segment connecting the

[0040] When measuring the linear expansion coefficient α, the second test piece is held at two points 15 mm apart, which means that the length of the portion of the second test piece to be measured for the linear expansion coefficient α is 15 mm. The second test piece can be held at the two locations using, for example, a known holding means such as a gripping tool.

[0041] The lamination mode of the resin film-formed film in the test laminate when the second test piece was prepared was the same as the lamination mode of the resin film-formed film in the test laminate when the first test piece was prepared. The test laminate used to prepare the second test specimen may be the same as or different from the test laminate used to prepare the first test specimen.

[0042] The glass transition temperature of the second test piece can be measured in the same manner as the glass transition temperature of the first test piece. Usually, the glass transition temperature of the second test piece is the same as the glass transition temperature of the first test piece.

[0043] The linear expansion coefficient α of the second test piece (in other words, the linear expansion coefficient of the resin film) can be adjusted by adjusting the types and contents of the components contained in the resin film-forming film. For example, by making the resin film-forming film contain the thermosetting component (B) described below and increasing the content of the thermosetting component (B) in the resin film-forming film, the α of the second test piece can be more easily reduced. For example, if the resin film-forming film contains an epoxy resin (B1) and a thermosetting agent (B2) (thermosetting component (B)) described below, and the content of the thermosetting agent (B2) per 100 parts by mass of the epoxy resin (B1) in the resin film-forming film is increased, the α of the second test piece can be more easily reduced. For example, if the resin film-forming film contains the filler (D) described below, the α of the second test piece can be made smaller more easily by adjusting the type of filler (D) in the resin film-forming film or increasing the content of the filler (D).

[0044] <<Surface roughness Ra of the thermoset surface of the resin film-forming film>> The surface roughness Ra of the cured product (i.e., resin film) obtained by thermally curing the resin film-forming film by heating it for 2 hours at 140° C. is preferably 2.5 μm or less. When the surface roughness Ra is equal to or less than the upper limit, the workpiece can be easily fixed by adhesion when the workpiece is fixed on a support by a resin film directly or via a film-like adhesive, and the adhesive structure can be more stably maintained.

[0045] In order to further enhance the effect of easily fixing the workpiece on the support by adhesion and maintaining the adhesion structure more stably as described above, the surface roughness Ra of the surface of the resin film may be, for example, any one of 1 μm or less, 0.4 μm or less, and 0.2 μm or less. There is no particular limitation on the lower limit of the surface roughness Ra of the resin film surface. For example, a resin film having a surface roughness Ra of 0.05 μm or more can be more easily achieved. In one embodiment, the surface roughness Ra of the surface of the resin film may be any one of 0.05 to 2.5 μm, 0.05 to 1 μm, 0.05 to 0.4 μm, and 0.05 to 0.2 μm or less, however, these are just examples of the surface roughness Ra of the surface of the resin film.

[0046] It is preferable that the surface roughness Ra of at least the surface of the resin film that comes into contact with the workpiece or the surface that comes into contact with the workpiece with the film-like adhesive thereon is within any of the numerical ranges mentioned above.

[0047] In this specification, the "surface roughness Ra" is not limited to that of the surface of the resin film, but means the so-called arithmetic mean roughness determined in accordance with JIS B0601:2001.

[0048] The surface roughness Ra of the surface of the resin film (thermosetting product of the resin film-forming film) can be adjusted by adjusting the type and content of the components contained in the resin film-forming film. For example, the surface roughness Ra of the surface of the resin film (thermosetting product of the resin film-forming film) can be more easily reduced by making the resin film-forming film contain a filler (D) described later and adjusting the type of filler (D) in the resin film-forming film or reducing the content of the filler (D). More specifically, for example, the surface roughness Ra of the surface of the resin film can be more easily reduced by reducing the average particle size of the filler (D) or reducing the content of the filler (D) having a large average particle size in the resin film-forming film.

[0049] The surface roughness Ra of the surface of the resin film (thermosetting product of the resin film-formed film) can also be adjusted by applying a resin film-forming composition described below to the surface to be produced (formed) of the resin film-formed film and drying it as necessary to adjust the roughness (e.g., surface roughness Ra) of the surface to be produced (formed) when the resin film-formed film is produced (formed). The surface roughness Ra of the surface of the resin film (thermosetting product of the resin film-forming film) can also be adjusted by pressing a roughness adjustment means having a surface roughness corresponding to the desired roughness (e.g., surface roughness Ra) against the surface of the resin film-forming film or resin film, and transferring the surface roughness of this roughness adjustment means to the surface of the resin film-forming film or resin film.

[0050] The resin film-formed film of the present embodiment may be made of one layer (single layer) or may be made of two or more layers. When the resin film-formed film is made of multiple layers, these multiple layers may be the same or different from each other, and the combination of these multiple layers is not particularly limited.

[0051] In this specification, not only in the case of a resin film-forming film, "multiple layers may be the same or different from one another" means "all layers may be the same, all layers may be different, or only some layers may be the same", and further, "multiple layers are different from one another" means "at least one of the constituent materials and thicknesses of each layer is different from one another".

[0052] When the resin film-forming film is composed of two or more layers, the adhesion between the layers may be poor, or the resin film may warp due to differences in the ease of expansion and contraction of the layers, causing problems such as peeling off of the resin film from the bonded structure. Furthermore, laminating multiple layers may increase the number of steps required to manufacture the resin film-forming film, making the manufacturing process complicated. Furthermore, the increase in the number of steps tends to increase the manufacturing cost of the resin film-forming film. In terms of suppressing these problems, it is preferable that the resin film-forming film is composed of one layer.

[0053] The thickness of the resin film-forming film is preferably 5 to 200 μm, more preferably 10 to 80 μm, and even more preferably 15 to 50 μm. When the thickness of the resin film-forming film is equal to or greater than the lower limit, the strength of the resin film-forming film and the resin film becomes higher. When the thickness of the resin film-forming film is equal to or less than the upper limit, the sealing body can be easily thinned. Here, "thickness of the resin film-formed film" means the thickness of the entire resin film-formed film, and for example, the thickness of a resin film-formed film consisting of multiple layers means the total thickness of all layers that make up the resin film-formed film.

[0054] <<Composition for forming resin film>> The resin film-forming film can be produced using a resin film-forming composition (more specifically, a thermosetting resin film-forming composition) containing its constituent materials. For example, the resin film-forming film can be produced by applying the resin film-forming composition to the surface to be formed and drying it as necessary. The ratio of the contents of the components that do not vaporize at room temperature in the resin film-forming composition is usually the same as the ratio of the contents of the components in the resin film-forming film.

[0055] The resin film-forming film may or may not have energy ray curing properties in addition to heat curing properties.

[0056] In this specification, the term "energy rays" refers to electromagnetic waves or charged particle beams having an energy quantum, examples of which include ultraviolet rays, radiation, and electron beams. Ultraviolet rays can be irradiated, for example, by using a high-pressure mercury lamp, a fusion lamp, a xenon lamp, a black light, an LED lamp, or the like as an ultraviolet ray source. Electron beams can be irradiated by generating them using an electron beam accelerator, or the like. In this specification, "energy ray curable" means a property that is cured by irradiation with energy rays, and "non-energy ray curable" means a property that is not cured even when irradiated with energy rays.

[0057] In the resin film-formed film, the ratio of the total content of one or more of the components contained in the resin film-formed film, which will be described later, to the total mass of the resin film-formed film does not exceed 100 mass %. Similarly, in the composition for forming a resin film, the ratio of the total content of one or more components contained in the composition for forming a resin film, which will be described later, to the total mass of the composition for forming a resin film does not exceed 100 mass %.

[0058] The resin film-forming composition may be applied by a known method, such as a method using various coaters such as an air knife coater, a blade coater, a bar coater, a gravure coater, a roll coater, a roll knife coater, a curtain coater, a die coater, a knife coater, a screen coater, a Mayer bar coater, or a kiss coater.

[0059] The drying conditions of the resin film-forming composition are not particularly limited. However, when the resin film-forming composition contains a solvent described later, it is preferable to heat-dry it. The resin film-forming composition containing the solvent is preferably heat-dried, for example, at 70 to 130°C for 10 seconds to 5 minutes. However, since the resin film-forming composition is thermosetting, it is preferable to heat-dry it so that the composition itself and the thermosetting resin film-forming film formed from the composition are not thermally cured.

[0060] A preferred resin film-forming film includes, for example, one containing a polymer component (A), a thermosetting component (B) and a filler (D). More preferred resin film-forming films include, for example, those that contain a polymer component (A), a thermosetting component (B) and a filler (D), and further contain one or more selected from the group consisting of a curing accelerator (C), a coupling agent (E) and a colorant (I). The composition of the resin film-forming composition will be described in detail below.

[0061] <Composition for resin film formation (III)> A preferred example of the resin film-forming composition is a resin film-forming composition (III) (sometimes simply referred to as "composition (III)" in this specification) containing a polymer component (A), a thermosetting component (B) and a filler (D). The resin film-forming composition (III) preferably further contains one or more selected from the group consisting of a curing accelerator (C), a coupling agent (E) and a colorant (I).

[0062] [Polymer component (A)] The polymer component (A) is a polymer compound for imparting film-forming properties, flexibility, etc. to the resin film-forming film. In this specification, the polymer compound also includes products of polycondensation reactions.

[0063] The polymer component (A) contained in the composition (III) and the resin film-forming film may be one type or two or more types. When there are two or more types, the combination and ratio thereof can be selected arbitrarily.

[0064] Examples of the polymer component (A) include acrylic resins, urethane resins, phenoxy resins, silicone resins, and saturated polyester resins, with acrylic resins being preferred.

[0065] The acrylic resin in the polymer component (A) may be any known acrylic polymer. The weight average molecular weight (Mw) of the acrylic resin is preferably 10,000 to 2,000,000, and may be, for example, any one of 100,000 to 1,500,000, 150,000 to 1,200,000, and 200,000 to 1,000,000. When the weight average molecular weight of the acrylic resin is equal to or more than the lower limit, it becomes easier to increase the storage modulus E', such as E'(200) of the first test piece (resin film). When the weight average molecular weight of the acrylic resin is equal to or less than the upper limit, the resin film-forming film becomes easier to follow the uneven surface of the adherend.

[0066] In this specification, unless otherwise specified, the "weight average molecular weight" is a polystyrene equivalent value measured by gel permeation chromatography (GPC).

[0067] The glass transition temperature (Tg) of the acrylic resin is preferably −40 to 70° C., and may be, for example, any of −15 to 50° C., −5 to 30° C., and 0 to 10° C. When the Tg of the acrylic resin is equal to or higher than the lower limit, it becomes easier to increase the storage modulus E′, such as E′(200), of the first test piece (resin film). In addition, the adhesion between the resin film and the support sheet is suppressed, and the peelability of the support sheet is appropriately improved. On the other hand, when the Tg of the acrylic resin is equal to or lower than the upper limit, it becomes easier to lower the Tg of the first test piece (resin film), and the adhesive strength between the resin film-forming film and the resin film and the adherend is improved.

[0068] When the acrylic resin has two or more kinds of structural units, the glass transition temperature (Tg) of the acrylic resin can be calculated using the Fox formula. The Tg of the homopolymer of the monomer from which the structural unit is derived can be any value listed in the Polymer Data Handbook, the Adhesive Handbook, the Polymer Handbook, or the like.

[0069] Examples of the acrylic resin include polymers of one or more (meth)acrylic acid esters; copolymers of two or more monomers selected from the above-mentioned (meth)acrylic acid esters, (meth)acrylic acid, itaconic acid, vinyl acetate, acrylonitrile, styrene, and N-methylolacrylamide.

[0070] Examples of the (meth)acrylic acid ester constituting the acrylic resin include (meth)acrylic acid alkyl esters in which the alkyl group constituting the alkyl ester has a chain structure having 1 to 18 carbon atoms, such as methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, sec-butyl (meth)acrylate, tert-butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, and n-octyl (meth)acrylate; (meth)acrylic acid cycloalkyl esters such as isobornyl (meth)acrylate and dicyclopentanyl (meth)acrylate; (Meth)acrylic acid aralkyl esters such as benzyl (meth)acrylate; (Meth)acrylic acid cycloalkenyl esters such as (meth)acrylic acid dicyclopentenyl ester; (Meth)acrylic acid cycloalkenyloxyalkyl esters such as (meth)acrylic acid dicyclopentenyloxyethyl ester; (Meth)acrylic acid imide; glycidyl group-containing (meth)acrylic acid esters such as glycidyl (meth)acrylate; hydroxyl group-containing (meth)acrylic acid esters such as hydroxymethyl (meth)acrylate and 2-hydroxyethyl (meth)acrylate; Examples of the substituted amino group-containing (meth)acrylic acid ester include N-methylaminoethyl (meth)acrylate. Here, the term "substituted amino group" refers to a group having a structure in which one or two hydrogen atoms of an amino group are substituted with a group other than a hydrogen atom.

[0071] In this specification, the term "(meth)acrylic acid" is a concept that encompasses both "acrylic acid" and "methacrylic acid." The same applies to terms similar to (meth)acrylic acid.

[0072] The monomer constituting the acrylic resin may be of only one type, or may be of two or more types, and when it is of two or more types, the combination and ratio thereof can be selected arbitrarily.

[0073] The acrylic resin may or may not have a functional group capable of bonding with other compounds, such as a vinyl group, a (meth)acryloyl group, an amino group, a hydroxyl group, a carboxyl group, an isocyanate group, etc. The functional group of the acrylic resin may be bonded to other compounds via a crosslinking agent (F) described below, or may be bonded directly to other compounds without the crosslinking agent (F).

[0074] In the present invention, as the polymer component (A), a thermoplastic resin other than an acrylic resin (hereinafter sometimes simply abbreviated as "thermoplastic resin") may be used alone without using an acrylic resin, or may be used in combination with an acrylic resin. By using the thermoplastic resin, the peelability of the resin film from the support sheet may be improved, or the resin film-forming film may be easily adapted to the uneven surface of the adherend.

[0075] Examples of the thermoplastic resin include polyester, polyurethane, phenoxy resin, polybutene, polybutadiene, and polystyrene.

[0076] The thermoplastic resin contained in the composition (III) and the resin film-forming film may be one kind or two or more kinds, and when there are two or more kinds, the combination and ratio thereof can be selected arbitrarily.

[0077] In the composition (III), the ratio of the content of the polymer component (A) to the total content of all components other than the solvent is preferably 6 to 35 mass% regardless of the type of the polymer component (A), and may be, for example, any one of 6 to 25 mass%, 6 to 18 mass%, and 6 to 15 mass%. This is equivalent to saying that in the resin film-formed film, the content ratio of polymer component (A) to the total mass of the resin film-formed film is preferably 6 to 35 mass% regardless of the type of polymer component (A), and may be, for example, any one of 6 to 25 mass%, 6 to 18 mass%, and 6 to 15 mass%. This is not limited to the present embodiment, and is based on the fact that in the process of removing the solvent from the resin composition containing the solvent to form the resin film, the amount of components other than the solvent usually does not change, and the content ratio of the components other than the solvent is the same between the resin composition and the resin film. Therefore, in this specification, not only in the case of the resin film-forming film, but also in the case of the resin film-forming film, the content of the components other than the solvent will be described only in the resin film obtained by removing the solvent from the resin composition.

[0078] When the content ratio of the polymer component (A) in the resin film-formed film to the total mass of the resin film-formed film is equal to or more than the lower limit, the film-forming property and flexibility of the resin film-formed film are improved. When the content ratio is equal to or less than the upper limit, it is easier to increase E'(200).

[0079] The polymer component (A) may also correspond to the thermosetting component (B). In the present invention, when the composition (III) contains a component that corresponds to both the polymer component (A) and the thermosetting component (B), the composition (III) is considered to contain the polymer component (A) and the thermosetting component (B).

[0080] [Thermosetting component (B)] The thermosetting component (B) is a component for thermally curing the resin film-forming film. The thermosetting component (B) contained in the composition (III) and the resin film-forming film may be one type or two or more types. When there are two or more types, the combination and ratio thereof can be selected arbitrarily.

[0081] Examples of the thermosetting component (B) include epoxy-based thermosetting resins, thermosetting polyimide resins, and unsaturated polyester resins, with epoxy-based thermosetting resins being preferred. In this specification, the thermosetting polyimide resin is a general term for a polyimide precursor that forms a polyimide resin by thermal curing, and a thermosetting polyimide.

[0082] (Epoxy thermosetting resin) The epoxy thermosetting resin is made of, for example, an epoxy resin (B1) and a thermosetting agent (B2). The epoxy thermosetting resin contained in the composition (III) and the resin film-forming film may be one type or two or more types. When there are two or more types, the combination and ratio thereof can be selected arbitrarily.

[0083] Epoxy resin (B1) The epoxy resin (B1) may be any known epoxy resin, such as a polyfunctional epoxy resin, a biphenyl compound, bisphenol A diglycidyl ether and its hydrogenated product, orthocresol novolac epoxy resin, a dicyclopentadiene type epoxy resin, a biphenyl type epoxy resin, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, or a phenylene skeleton type epoxy resin.

[0084] As the epoxy resin (B1), an epoxy resin having an unsaturated hydrocarbon group may be used.

[0085] The molecular weight of the epoxy resin (B1) is not particularly limited, but from the viewpoint of further improving the adhesion of the resin film to an adherend, it is preferable that at least one of the number average molecular weight and the weight average molecular weight is 300 to 30,000. The epoxy equivalent of the epoxy resin (B1) is preferably 100 to 1000 g / eq, and may be, for example, any one of 100 to 400 g / eq, 400 to 700 g / eq, and 700 to 1000 g / eq.

[0086] The epoxy resin (B1) may be used alone or in combination of two or more kinds. When two or more kinds are used in combination, the combination and ratio thereof can be selected arbitrarily.

[0087] ·Heat hardener (B2) The heat curing agent (B2) functions as a curing agent for the epoxy resin (B1). The thermosetting agent (B2) may be, for example, a compound having two or more functional groups capable of reacting with an epoxy group in one molecule. The functional group may, for example, be a phenolic hydroxyl group, an alcoholic hydroxyl group, an amino group, a carboxyl group, or an anhydride group of an acid group, and the like. The phenolic hydroxyl group, the amino group, or an anhydride group of an acid group is preferred, and the phenolic hydroxyl group or the amino group is more preferred.

[0088] Among the heat curing agents (B2), examples of phenolic curing agents having a phenolic hydroxyl group include polyfunctional phenolic resins, biphenols, novolac-type phenolic resins, dicyclopentadiene-type phenolic resins, and aralkyl-type phenolic resins. Among the heat curing agents (B2), examples of amine-based curing agents having an amino group include dicyandiamide.

[0089] The heat curing agent (B2) may have an unsaturated hydrocarbon group.

[0090] Of the thermosetting agents (B2), the number average molecular weight of resin components such as polyfunctional phenol resins, novolac type phenol resins, dicyclopentadiene type phenol resins, and aralkyl type phenol resins is preferably 300 to 30,000, and may be, for example, any one of 400 to 10,000 and 500 to 3,000. Of the thermosetting agent (B2), the molecular weight of the non-resin components, such as biphenol and dicyandiamide, is not particularly limited, but is preferably 60 to 500, for example.

[0091] The heat curing agent (B2) may be used alone or in combination of two or more kinds. When two or more kinds are used in combination, the combination and ratio thereof can be selected arbitrarily.

[0092] In the composition (III) and the resin film-forming film, the content of the heat curing agent (B2) is preferably 0.1 to 20 parts by mass relative to 100 parts by mass of the epoxy resin (B1). For example, it may be any of 0.1 to 15 parts by mass and 0.1 to 10 parts by mass, or any of 1 to 20 parts by mass, 3 to 20 parts by mass, and 5 to 20 parts by mass, or any of 1 to 15 parts by mass, 3 to 10 parts by mass, and 5 to 10 parts by mass. When the content of the heat curing agent (B2) is equal to or more than the lower limit, the curing of the resin film-forming film is more likely to proceed, and it is easier to increase E'(200). Furthermore, the linear expansion coefficient of the resin film or the linear expansion coefficient α of the second test piece can be made smaller. When the content of the heat curing agent (B2) is equal to or less than the upper limit, the moisture absorption rate of the resin film-forming film is reduced, and the reliability of the sealed body obtained using the resin film-forming film is further improved.

[0093] In the resin film-forming film, the content ratio of the thermosetting component (B) relative to the total mass of the resin film-forming film is preferably 6 to 35 mass% regardless of the type of the thermosetting component (B), and may be, for example, any one of 7 to 30 mass%, 8 to 25 mass%, and 9 to 22 mass%. When the ratio is in such a range, for example, the adhesion between the resin film and the support sheet is suppressed, and the peelability of the support sheet is improved. In addition, when the ratio is equal to or more than the lower limit, the linear expansion coefficient of the resin film or the linear expansion coefficient α of the second test piece can be made smaller.

[0094] [Filling material (D)] By containing the filler (D) in the resin film-forming film, the storage modulus E', such as E'(200) of the first test piece (resin film) can be more easily increased. In addition, by containing the filler (D) in the resin film-forming film, the linear expansion coefficient α (linear expansion coefficient of the resin film) of the second test piece can be more easily adjusted, and by adjusting this linear expansion coefficient α to a value suitable for the structure in contact with the resin film, the adhesive structure between the resin film and the structure in contact with it can be more stably maintained even in an environment with large temperature changes, and the adhesive reliability can be increased. Here, the structure in contact with the resin film is the one described above. In addition, by containing the filler (D) in the resin film-forming film, the moisture absorption rate of the resin film can be reduced and the heat dissipation can be improved.

[0095] The filler (D) may be either an organic filler or an inorganic filler, but is preferably an inorganic filler. Preferred inorganic fillers include, for example, powders of silica, alumina, talc, calcium carbonate, titanium white, red iron oxide, silicon carbide, boron nitride, and the like; beads obtained by spheronizing these inorganic fillers; surface-modified products of these inorganic fillers; single crystal fibers of these inorganic fillers; glass fibers, and the like. Among these, the inorganic filler is preferably silica or alumina.

[0096] In terms of improving the dispersibility of the filler (D) in the other components in the resin film-forming composition, the silica is preferably surface-modified with an organic group (organic compound), more preferably surface-modified with a vinyl group, an epoxy group, a phenyl group or a methacryl group, and particularly preferably surface-modified with an epoxy group or a phenyl group.

[0097] The average particle size of the filler (D) is preferably 0.1 to 12 μm, and may be, for example, any of 0.1 to 1.5 μm, 1.5 to 4 μm, and 4 to 12 μm. When the average particle size of the filler (D) is within such a range, the dispersibility of the filler (D) in the other components in the resin film-forming composition is improved. In addition, the smaller the average particle size of the filler (D), the smaller the surface roughness Ra of the resin film surface can be.

[0098] In this specification, the term "average particle size" refers not only to the case of the filler (D) but also to the particle size distribution curve determined by the laser diffraction scattering method, unless otherwise specified, at a particle size distribution curve obtained by the laser diffraction scattering method. 50 ) value.

[0099] The filler (D) contained in the composition (III) and the resin film-forming film may be one type or two or more types. When there are two or more types, the combination and ratio thereof can be selected arbitrarily.

[0100] In the resin film-formed film, the content ratio of the filler (D) relative to the total mass of the resin film-formed film is preferably more than 54 mass%, more preferably more than 60 mass%, even more preferably 66 mass% or more, and particularly preferably 70 mass% or more. The higher the ratio, the higher the E'(200) can be. In particular, when the ratio is more than 60 mass%, it is easier to increase E'(200). In addition, when the ratio is equal to or more than the lower limit, the linear expansion coefficient of the resin film or the linear expansion coefficient α of the second test piece can be made smaller. On the other hand, the above ratio is preferably 84% by mass or less in terms of maintaining the structure of the resin film more stably. In one embodiment, the ratio may be any of more than 54% by mass and not more than 84% by mass, more than 60% by mass and not more than 84% by mass, 66 to 84% by mass, and 70 to 84% by mass, although these are just examples of the ratio.

[0101] [Cure accelerator (C)] The composition (III) and the resin film-forming film preferably contain a curing accelerator (C). The curing accelerator (C) is a component for adjusting the curing speed of the resin film-forming film, and the curing speed of the resin film-forming film containing the curing accelerator (C) becomes faster.

[0102] Preferred examples of the curing accelerator (C) include tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris(dimethylaminomethyl)phenol; imidazoles (imidazoles in which one or more hydrogen atoms are substituted with groups other than hydrogen atoms) such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, and 2-phenyl-4-methyl-5-hydroxymethylimidazole; organic phosphines (phosphines in which one or more hydrogen atoms are substituted with organic groups) such as tributylphosphine, diphenylphosphine, and triphenylphosphine; and tetraphenylboron salts such as tetraphenylphosphonium tetraphenylborate and triphenylphosphine tetraphenylborate.

[0103] The curing accelerator (C) contained in the composition (III) and the resin film-forming film may be one type or two or more types. When there are two or more types, the combination and ratio thereof can be selected arbitrarily.

[0104] When the curing accelerator (C) is used, the content of the curing accelerator (C) in the composition (III) and the resin film-forming film is preferably 0.5 to 6 parts by mass relative to 100 parts by mass of the content of the thermosetting component (B) (for example, the total content of the epoxy resin (B1) and the thermosetting agent (B2)). For example, it may be any of 0.5 to 4 parts by mass and 0.5 to 2 parts by mass, or any of 1 to 6 parts by mass and 2 to 6 parts by mass, or it may be 1 to 4 parts by mass. When the content of the curing accelerator (C) is equal to or more than the lower limit, the effect of using the curing accelerator (C) is more remarkable. When the content of the curing accelerator (C) is equal to or less than the upper limit, for example, the effect of suppressing the highly polar curing accelerator (C) from migrating to the adhesive interface with the adherend and segregating in the resin film-forming film under high temperature and high humidity conditions is enhanced. As a result, the adhesive structure between the resin film and the structure in contact therewith, as described above, is maintained more stably even in an environment with large temperature changes, and adhesive reliability is improved.

[0105] [Coupling agent (E)] The composition (III) and the resin film-forming film preferably contain a coupling agent (E). By using a coupling agent (E) having a functional group capable of reacting with an inorganic compound or an organic compound, the adhesiveness of the resin film to the adherend can be improved. In addition, by using the coupling agent (E), the water resistance of the resin film is improved without impairing its heat resistance.

[0106] The coupling agent (E) is preferably a compound having a functional group capable of reacting with the functional groups of the polymer component (A), the thermosetting component (B), etc., and is more preferably a silane coupling agent.

[0107] Preferred examples of the silane coupling agent include 3-glycidyloxypropyltrimethoxysilane, 3-glycidyloxypropylmethyldiethoxysilane, 3-glycidyloxypropyltriethoxysilane, 3-glycidyloxymethyldiethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-methacryloyloxypropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-(2-aminoethylamino)propyltrimethoxysilane, 3-(2- Examples of the silane include bis(3-(aminoethylamino)propylmethyldiethoxysilane, 3-(phenylamino)propyltrimethoxysilane, 3-anilinopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropylmethyldimethoxysilane, bis(3-triethoxysilylpropyl)tetrasulfane, methyltrimethoxysilane, methyltriethoxysilane, vinyltrimethoxysilane, vinyltriacetoxysilane, and imidazole silane.

[0108] The coupling agent (E) contained in the composition (III) and the resin film-forming film may be one type or two or more types. When there are two or more types, the combination and ratio thereof can be selected arbitrarily.

[0109] When the coupling agent (E) is used, the content of the coupling agent (E) in the composition (III) and the resin film-forming film is preferably 0.1 to 3 parts by mass relative to 100 parts by mass of the total content of the polymer component (A) and the thermosetting component (B), and may be, for example, 0.1 to 2 parts by mass or 0.1 to 1 part by mass. When the content of the coupling agent (E) is equal to or more than the lower limit, the effects of using the coupling agent (E), such as improvement in dispersibility of the filler (D) in the resin and improvement in adhesion of the resin film-forming film to the adherend, are more significantly obtained. When the content of the coupling agent (E) is equal to or less than the upper limit, the generation of outgassing is more suppressed.

[0110] [Colorant (I)] The light transmittance of the resin film-forming film and resin film containing the colorant (I) can be more easily adjusted.

[0111] Examples of the colorant (I) include known colorants such as inorganic pigments, organic pigments, and organic dyes.

[0112] Examples of the organic pigments and organic dyes include aminium-based dyes, cyanine-based dyes, merocyanine-based dyes, croconium-based dyes, squalium-based dyes, azulenium-based dyes, polymethine-based dyes, naphthoquinone-based dyes, pyrylium-based dyes, phthalocyanine-based dyes, naphthalocyanine-based dyes, naphtholactam-based dyes, azo-based dyes, condensed azo-based dyes, indigo-based dyes, perinone-based dyes, perylene-based dyes, dioxazine-based dyes, quinacridone-based dyes, isoindolinone-based dyes, quinophthalone-based dyes, pyrrole-based dyes, thioindigo-based dyes, metal complex-based dyes (metal complex dyes), dithiol metal complex-based dyes, indolephenol-based dyes, triarylmethane-based dyes, anthraquinone-based dyes, naphthol-based dyes, azomethine-based dyes, benzimidazolone-based dyes, pyranthrone-based dyes, and threne-based dyes.

[0113] Examples of the inorganic pigments include carbon black, cobalt-based pigments, iron-based pigments, chromium-based pigments, titanium-based pigments, vanadium-based pigments, zirconium-based pigments, molybdenum-based pigments, ruthenium-based pigments, platinum-based pigments, ITO (indium tin oxide)-based pigments, and ATO (antimony tin oxide)-based pigments.

[0114] The colorant (I) contained in the composition (III) and the resin film-forming film may be one type or two or more types. When there are two or more types, the combination and ratio thereof can be selected arbitrarily.

[0115] When the colorant (I) is used, the content of the colorant (I) in the resin film-forming film may be adjusted appropriately depending on the purpose. For example, the content of the colorant (I) in the resin film-forming film is adjusted to adjust the light transmittance of the resin film-forming film, thereby adjusting the print visibility when laser printing is performed on the resin film-forming film or the resin film. In addition, the content of the colorant (I) in the resin film-forming film can be adjusted to improve the design of the resin film or to make the grinding marks on the back surface of the wafer less visible. In consideration of these points, the content ratio of the colorant (I) in the resin film-forming film to the total mass of the resin film-forming film is preferably 0.1 to 6 mass%, more preferably 0.1 to 4 mass%, and even more preferably 0.1 to 2.5 mass%. When the ratio is equal to or more than the lower limit, the effect of using the colorant (I) can be obtained more significantly. When the ratio is equal to or less than the upper limit, excessive use of the colorant (I) is suppressed.

[0116] [Crosslinker (F)] When the polymer component (A) is the above-mentioned acrylic resin or the like and has a functional group capable of bonding with other compounds, such as a vinyl group, a (meth)acryloyl group, an amino group, a hydroxyl group, a carboxyl group, an isocyanate group, or the like, the composition (III) and the resin film-forming film may contain a crosslinking agent (F). The crosslinking agent (F) is a component for bonding the functional group in the polymer component (A) with other compounds to form a crosslink, and by crosslinking in this way, the adhesive strength and cohesive strength of the resin film-forming film can be adjusted.

[0117] Examples of the crosslinking agent (F) include organic polyvalent isocyanate compounds, organic polyvalent imine compounds, metal chelate crosslinking agents (crosslinking agents having a metal chelate structure), and aziridine crosslinking agents (crosslinking agents having an aziridinyl group).

[0118] Examples of the organic polyisocyanate compound include aromatic polyisocyanate compounds, aliphatic polyisocyanate compounds, and alicyclic polyisocyanate compounds (hereinafter, these compounds may be collectively referred to as "aromatic polyisocyanate compounds, etc."); trimers, isocyanurates, and adducts of the aromatic polyisocyanate compounds, etc.; and terminal isocyanate urethane prepolymers, which are reaction products of the aromatic polyisocyanate compounds, etc., and polyol compounds. The "adduct" refers to a reaction product of the aromatic polyisocyanate compound, aliphatic polyisocyanate compound, or alicyclic polyisocyanate compound with a low molecular weight active hydrogen-containing compound such as ethylene glycol, propylene glycol, neopentyl glycol, trimethylolpropane, or castor oil. Examples of the adduct include a trimethylolpropane adduct of tolylene diisocyanate, which will be described later. In this specification, the term "isocyanate-terminated urethane prepolymer" refers to a prepolymer having a urethane bond and an isocyanate group at the terminal of the molecule.

[0119] The crosslinking agent (F) contained in the composition (III) and the resin film-forming film may be one type or two or more types. When there are two or more types, the combination and ratio thereof can be selected arbitrarily.

[0120] When the crosslinking agent (F) is used, the content of the crosslinking agent (F) in the composition (III) is preferably 0.01 to 20 parts by mass per 100 parts by mass of the polymer component (A). When the content of the crosslinking agent (F) is equal to or more than the lower limit, the effect of using the crosslinking agent (F) is more remarkable. When the content of the crosslinking agent (F) is equal to or less than the upper limit, excessive use of the crosslinking agent (F) is suppressed.

[0121] [Energy ray curable resin (G)] The composition (III) and the resin film-forming film may contain an energy ray curable resin (G). By containing the energy ray curable resin (G), the resin film-forming film can change its properties by irradiation with energy rays.

[0122] The energy ray curable resin (G) is an energy ray curable compound, or an oligomer or polymer having energy ray curability that can be regarded as having been synthesized from an energy ray curable compound. The energy ray-curable compound includes, for example, a compound having at least one polymerizable double bond in the molecule, and is preferably an acrylate-based compound having a (meth)acryloyl group.

[0123] The energy ray curable resin (G) contained in the composition (III) and the resin film-forming film may be one type or two or more types. When two or more types are contained, the combination and ratio thereof can be selected arbitrarily.

[0124] When the energy ray curable resin (G) is used, the content of the energy ray curable resin (G) in the composition (III) is preferably 1 to 30 mass % relative to the total mass of the composition (III).

[0125] [Photopolymerization initiator (H)] When the composition (III) and the resin film-forming film contain an energy ray curable resin (G), they may contain a photopolymerization initiator (H) in order to efficiently advance the polymerization reaction of the energy ray curable resin (G).

[0126] The photopolymerization initiator (H) contained in the composition (III) and the resin film-forming film may be one type or two or more types. When there are two or more types, the combination and ratio thereof can be selected arbitrarily.

[0127] When the photopolymerization initiator (H) is used, the content of the photopolymerization initiator (H) in the composition (III) is preferably 0.1 to 20 parts by mass per 100 parts by mass of the energy ray-curable resin (G).

[0128] [General Purpose Additives (J)] The composition (III) and the resin film-forming film may contain a general-purpose additive (J) within the range that does not impair the effects of the present invention. The general-purpose additive (J) may be a known one and may be arbitrarily selected depending on the purpose, and is not particularly limited. Preferred examples thereof include plasticizers, antistatic agents, antioxidants, gettering agents, and ultraviolet absorbers.

[0129] The general-purpose additive (J) contained in the composition (III) and the resin film-forming film may be one type or two or more types. When there are two or more types, the combination and ratio thereof can be selected arbitrarily. The content of the composition (III) and the general-purpose additive (J) in the resin film-forming film is not particularly limited and may be appropriately selected depending on the purpose.

[0130] [solvent] It is preferable that the composition (III) further contains a solvent. The composition (III) containing a solvent has good handleability. In this specification, unless otherwise specified, the term "solvent" is used as a concept that includes not only a substance that dissolves a target component, but also a dispersion medium that disperses the target component.

[0131] The solvent is not particularly limited, but preferred examples include hydrocarbons such as toluene and xylene; alcohols such as methanol, ethanol, 2-propanol, isobutyl alcohol (2-methylpropan-1-ol), and 1-butanol; esters such as ethyl acetate; ketones such as acetone and methyl ethyl ketone; ethers such as tetrahydrofuran; and amides (compounds having an amide bond) such as dimethylformamide and N-methylpyrrolidone. The solvent contained in the composition (III) may be only one type, or may be two or more types. When two or more types are contained, the combination and ratio thereof can be selected arbitrarily.

[0132] The content of the solvent in the composition (III) is not particularly limited, and may be appropriately selected depending on, for example, the types of components other than the solvent.

[0133] <Method for producing resin film-forming composition (III)> Composition (III) can be produced by blending the respective components constituting composition (III). The order of addition of the components when blending is not particularly limited, and two or more components may be added simultaneously. The method for mixing the components during blending is not particularly limited, and may be appropriately selected from known methods such as a method of mixing by rotating a stirrer or stirring blades, a method of mixing using a mixer, a method of mixing by adding ultrasound, etc. The temperature and time during addition and mixing of each component are not particularly limited as long as the components do not deteriorate, and may be adjusted appropriately. A temperature of 15 to 30°C is preferred.

[0134] ◎Example of resin film forming film (1) Fig. 1 is a cross-sectional view showing an example of a resin film-formed film according to an embodiment of the present invention. In addition, the drawings used in the following description may show the main parts in an enlarged manner for the sake of convenience in order to make the characteristics of the present invention easier to understand, and the dimensional ratios of each component may not necessarily be the same as the actual ones.

[0135] The resin film-forming film 13 shown here is configured to have a first release film 151 on one side (sometimes referred to as the "first side" in this specification) 13a, and a second release film 152 on the other side (sometimes referred to as the "second side" in this specification) 13b opposite the first side 13a. Such a resin film-formed film 13 is suitable for storage, for example, in a roll form.

[0136] The storage modulus E'(200) of the first test piece produced using the resin film-forming film 13 is 0.2 GPa or more. The resin film-forming film 13 can be produced using the above-mentioned resin film-forming composition.

[0137] Both the first release film 151 and the second release film 152 may be of known types. The first release film 151 and the second release film 152 may be the same as each other, or may be different from each other, for example, by requiring different peeling forces when peeling them off from the resin film-forming film 13. Both the first release film 151 and the second release film 151 are preferably release films configured by forming a silicone-based release agent layer on one side of a polyethylene terephthalate film (by silicone treatment).

[0138] 1, either the first release film 151 or the second release film 152 is removed, and the resulting exposed surface becomes an attachment surface to any location on the support. Then, the remaining other of the first release film 151 and the second release film 152 is removed, and the exposed surface of the resin film formed by thermally curing the resin film-forming film 13 becomes a surface to which a workpiece or a workpiece with a film-like adhesive described below is attached and fixed.

[0139] FIG. 1 shows an example in which a release film is provided on both sides (first side 13a, second side 13b) of the resin film-forming film 13, but the release film may be provided on only one side of the resin film-forming film 13, i.e., only the first side 13a or only the second side 13b.

[0140] The resin film-forming film of the present embodiment can be attached to any part of the support without using a support sheet described later. In that case, a release film may be provided on the surface of the resin film-forming film opposite to the surface attached to the support, and this release film may be removed at an appropriate time. On the other hand, the resin film-forming film of the present embodiment can be used in combination with a support sheet to be described later to form a composite sheet, which will be described in detail later.

[0141] ◎Example of resin film forming film (2) An example of a preferred resin film-forming film of the present embodiment is a thermosetting resin film-forming film, A test laminate prepared by laminating one of the resin film-formed films or a plurality of the resin film-formed films each having a thickness of less than 200 μm is heated at 140° C. for 2 hours to obtain a cured product, the test laminate being thermally cured. A first test piece having a thickness of 200±20 μm and a width of 5 mm is held at two points spaced 10 mm apart, and the storage modulus E' of the first test piece is measured while heating the first test piece from 0° C. to 300° C. in a tensile mode under conditions of a frequency of 11 Hz, a heating rate of 3° C. / min, and a uniform heating rate. When the temperature of the first test piece is 200° C., the storage modulus E'(200) of the first test piece is 0.2 GPa or more. The resin film-formed film includes a resin film-formed film containing a polymer component (A), an epoxy resin (B1), a heat curing agent (B2) and a filler (D). The resin film-forming film preferably further contains one or more selected from the group consisting of a curing accelerator (C), a coupling agent (E) and a colorant (I).

[0142] A more preferred example of the resin film-forming film of the present embodiment is a thermosetting resin film-forming film, A test laminate prepared by laminating one of the resin film-formed films or a plurality of the resin film-formed films each having a thickness of less than 200 μm is heated at 140° C. for 2 hours to obtain a cured product, the test laminate being thermally cured. A first test piece having a thickness of 200±20 μm and a width of 5 mm is held at two points spaced 10 mm apart, and the storage modulus E' of the first test piece is measured while heating the first test piece from 0° C. to 300° C. in a tensile mode under conditions of a frequency of 11 Hz, a heating rate of 3° C. / min, and a uniform heating rate. When the temperature of the first test piece is 200° C., the storage modulus E'(200) of the first test piece is 0.2 GPa or more. The resin film-forming film contains a polymer component (A), an epoxy resin (B1), a heat curing agent (B2) and a filler (D), In the resin film-forming film, the content ratio of the polymer component (A) to the total mass of the resin film-forming film is 6 to 35 mass%, In the resin film-forming film, the content ratio of the thermosetting component (B) to the total mass of the resin film-forming film is 6 to 35 mass%, In the resin film-forming film, the content of the thermosetting agent (B2) is 0.1 to 20 parts by mass with respect to 100 parts by mass of the epoxy resin (B1), In the resin film-formed film, the content ratio of the filler (D) to the total mass of the resin film-formed film is more than 54 mass%, In the resin film-forming film, the ratio of the total content of the polymer component (A), the epoxy resin (B1), the heat curing agent (B2) and the filler (D) to the total mass of the resin film-forming film does not exceed 100 mass%. It is preferable that the resin film-forming film further contains one or more selected from the group consisting of a curing accelerator (C), a coupling agent (E) and a colorant (I), When the resin film-forming film contains a curing accelerator (C), the content of the curing accelerator (C) in the resin film-forming film is 0.5 to 6 parts by mass with respect to 100 parts by mass of the total content of the epoxy resin (B1) and the heat curing agent (B2); When the resin film-forming film contains a coupling agent (E), the content of the coupling agent (E) in the resin film-forming film is 0.1 to 3 parts by mass with respect to 100 parts by mass of the total content of the polymer component (A), the epoxy resin (B1) and the heat curing agent (B2); When the resin film-forming film contains a colorant (I), the content of the colorant (I) in the resin film-forming film is 0.1 to 6 mass% relative to the total mass of the resin film-forming film, In the resin film-forming film, it is preferable that the total content of the polymer component (A), epoxy resin (B1), heat curing agent (B2), filler (D), curing accelerator (C), coupling agent (E) and colorant (I) does not exceed 100 mass% relative to the total mass of the resin film-forming film.

[0143] ◇Composite sheet The composite sheet comprises a support sheet and a resin film-forming film provided on one side of the support sheet, and the resin film-forming film is the resin film-forming film according to one embodiment of the present invention described above. Each layer constituting the composite sheet will now be described in detail.

[0144] ◎ Support sheet The support sheet may be one layer (single layer) or two or more layers. When the support sheet is made of multiple layers, the constituent materials and thicknesses of the multiple layers may be the same or different, and the combination of the multiple layers is not particularly limited as long as it does not impair the effects of the present invention.

[0145] The support sheet may be transparent or opaque, and may be colored depending on the purpose. For example, when the resin film-forming film has energy ray curability, it is preferable that the support sheet transmits energy rays.

[0146] Examples of the support sheet include those provided with a base material and an adhesive layer provided on one surface of the base material, and those composed of only the base material. When the support sheet has an adhesive layer, in the composite sheet, the adhesive layer is disposed between the base material and the resin film-forming film.

[0147] When using a support sheet provided with a base material and an adhesive layer, in the composite sheet, the adhesion and peelability between the support sheet and the resin film-forming film can be adjusted more easily. When using a support sheet composed of only the base material, a composite sheet can be manufactured at low cost.

[0148] ◎ An example of a composite sheet FIG. 2 is a cross-sectional view schematically showing an example of a composite sheet including a resin film-forming film according to an embodiment of the present invention. In the figures after FIG. 2, the same components as those shown in the already described figures are given the same reference numerals as in the case of the already described figures, and the detailed description thereof is omitted.

[0149] The composite sheet 101 shown here is configured to include a support sheet 10 and a resin film-forming film 13 provided on one surface (which may be referred to as the "first surface" in this specification) 10a of the support sheet 10. The support sheet 10 is configured to include a base material 11 and an adhesive layer 12 provided on one surface 11a of the base material 11. In the composite sheet 101, the adhesive layer 12 is disposed between the base material 11 and the resin film-forming film 13. That is, the composite sheet 101 is configured by laminating the base material 11, the adhesive layer 12, and the resin film-forming film 13 in this order in their thickness directions. The first surface 10a of the support sheet 10 is the same as the surface (which may be referred to as the "first surface" in this specification) 12a on the opposite side of the adhesive layer 12 from the base material 11 side.

[0150] The composite sheet 101 further includes a jig adhesive layer 16 and a release film 15 on the resin film-forming film 13 . In the composite sheet 101, the resin film-forming film 13 is laminated over the entire or almost entire surface of the first surface 12a of the pressure-sensitive adhesive layer 12, and a jig adhesive layer 16 is laminated over a portion of the surface 13a of the resin film-forming film 13 opposite the pressure-sensitive adhesive layer 12 side (sometimes referred to as the "first surface" in this specification), i.e., the area near the periphery. Furthermore, a release film 15 is laminated over the area of ​​the first surface 13a of the resin film-forming film 13 where the jig adhesive layer 16 is not laminated, and over the surface 16a of the jig adhesive layer 16 opposite the resin film-forming film 13 side.

[0151] Not only in the case of composite sheet 101, but in the composite sheet of this embodiment, the release film is an optional configuration, and the composite sheet of this embodiment may or may not include a release film.

[0152] The jig adhesive layer 16 is used to fix the composite sheet 101 to a jig such as a ring frame. The jig adhesive layer 16 may have, for example, a single-layer structure containing an adhesive component, or a multi-layer structure in which layers containing adhesive components are laminated on both sides of a core sheet.

[0153] The resin film-formed film 13 is the resin film-formed film according to one embodiment of the present invention as described above and shown in FIG.

[0154] In the composite sheet 101, the release film 15 is removed, and the exposed surface of the resin film formed by thermally curing the resin film-forming film 13 becomes the surface to which the workpiece or the workpiece with film-like adhesive described below is attached and fixed.

[0155] FIG. 3 is a cross-sectional view that illustrates a schematic diagram of another example of a composite sheet provided with a resin film-forming film according to one embodiment of the present invention. The composite sheet 102 shown here is the same as the composite sheet 101 shown in FIG. 2, except that the size of the resin film-forming film is different and the jig adhesive layer 16 is not provided.

[0156] More specifically, in the composite sheet 102, the resin film-forming film 23 is laminated in a partial region of the first surface 12a of the pressure-sensitive adhesive layer 12, i.e., in a central region in the width direction (left-right direction in FIG. 3) of the pressure-sensitive adhesive layer 12. A release film 15 is laminated on a surface 23a (sometimes referred to as the "first surface" in this specification) opposite the pressure-sensitive adhesive layer 12 side of the resin film-forming film 23 and on a region of the first surface 12a of the pressure-sensitive adhesive layer 12 where the resin film-forming film 23 is not laminated. A support sheet 10 is provided on a surface 23b opposite the first surface 23a of the resin film-forming film 23.

[0157] The composite sheet of the present embodiment is not limited to that shown in FIGS. 2 and 3, and may be one in which some of the configurations shown in FIGS. 2 and 3 have been changed or removed, or other configurations have been added to those described above, within the scope that does not impair the effects of the present invention. For example, the composite sheet of the present embodiment may be the composite sheet 101 shown in FIG. 2 in which the jig adhesive layer 16 is not provided. For example, the composite sheet of the present embodiment may be a composite sheet 101, 102 shown in Fig. 2 and Fig. 3 in which the support sheet 10 is composed of only a substrate. In this case, it is preferable that at least the surface of the substrate 11 on the side of the resin film-forming film 13 is adhesive.

[0158] Next, each layer constituting the support sheet will be described in more detail.

[0159] ○Base material The substrate is in the form of a sheet or film, and examples of the constituent materials thereof include various resins. Examples of the resin include polyethylene; polyolefins other than polyethylene, such as polypropylene; ethylene-based copolymers (copolymers obtained using ethylene as a monomer), such as ethylene-vinyl acetate copolymer; vinyl chloride-based resins (resins obtained using vinyl chloride as a monomer), such as polyvinyl chloride; polystyrene; polycycloolefins; polyesters, such as polyethylene terephthalate; poly(meth)acrylic acid esters; polyurethanes; polyurethane acrylates; polyimides; polyamides; polycarbonates; fluororesins; polyacetals; modified polyphenylene oxides; polyphenylene sulfides; polysulfones; polyether ketones, and the like. The resin may be, for example, a polymer alloy such as a mixture of the polyester with another resin. Examples of the resin include crosslinked resins in which one or more of the resins exemplified above are crosslinked; and modified resins such as ionomers using one or more of the resins exemplified above.

[0160] The resin constituting the substrate may be of only one type, or of two or more types. When two or more types are used, the combination and ratio thereof can be selected arbitrarily.

[0161] The substrate may consist of one layer (single layer), or may consist of two or more layers. When the substrate consists of multiple layers, the multiple layers may be the same or different, and the combination of the multiple layers is not particularly limited.

[0162] The thickness of the substrate is preferably 50 to 300 μm, and may be, for example, 60 to 100 μm. When the thickness of the substrate is in this range, the flexibility of the composite sheet is further improved. Here, the "thickness of the substrate" means the thickness of the entire substrate. For example, the thickness of a substrate consisting of multiple layers means the total thickness of all layers constituting the substrate.

[0163] The substrate may contain, in addition to the main constituent materials such as the resin, various known additives such as fillers, colorants, antioxidants, organic lubricants, catalysts, softeners (plasticizers), and the like.

[0164] The substrate may be transparent or opaque, may be colored according to the purpose, and may have other layers vapor-deposited thereon.

[0165] In order to adjust the adhesiveness to a layer (for example, a pressure-sensitive adhesive layer, a resin film-forming film, a resin film, or the other layer) provided thereon, the surface of the substrate may be subjected to roughening treatment such as sandblasting or solvent treatment, oxidation treatment such as corona discharge treatment, electron beam irradiation treatment, plasma treatment, ozone / ultraviolet radiation treatment, flame treatment, chromic acid treatment, or hot air treatment, lipophilic treatment, hydrophilic treatment, etc. The surface of the substrate may be treated with a primer.

[0166] The substrate may have adhesiveness on at least one surface thereof by containing a specific range of components (for example, a resin, etc.).

[0167] The substrate can be produced by a known method. For example, a substrate containing a resin can be produced by molding a resin composition containing the resin.

[0168] Adhesive layer The pressure-sensitive adhesive layer is in the form of a sheet or film and contains a pressure-sensitive adhesive. Examples of the adhesive include adhesive resins such as acrylic resins, urethane resins, rubber-based resins, silicone resins, epoxy-based resins, polyvinyl ethers, polycarbonates, and ester-based resins.

[0169] The adhesive layer may consist of one layer (single layer), or may consist of two or more layers. If it consists of multiple layers, these multiple layers may be the same or different, and the combination of these multiple layers is not particularly limited.

[0170] The thickness of the pressure-sensitive adhesive layer is not particularly limited, but is preferably from 1 to 100 μm, and may be, for example, any one of from 1 to 60 μm and 1 to 30 μm. Here, "the thickness of the adhesive layer" means the thickness of the entire adhesive layer, and for example, the thickness of an adhesive layer consisting of multiple layers means the total thickness of all layers that make up the adhesive layer.

[0171] The pressure-sensitive adhesive layer may be either energy ray-curable or non-energy ray-curable. The energy ray-curable pressure-sensitive adhesive layer can adjust the physical properties before and after curing.

[0172] The adhesive layer can be formed using an adhesive composition containing an adhesive such as an adhesive resin. For example, the adhesive composition is applied to the surface on which the adhesive layer is to be formed, and dried as necessary to form the adhesive layer at the desired site. The ratio of the contents of the components that do not vaporize at room temperature in the adhesive composition is usually the same as the ratio of the contents of the components in the adhesive layer.

[0173] The pressure-sensitive adhesive composition can be applied and dried, for example, by the same method as in the application and drying of the above-mentioned resin film-forming composition.

[0174] When the adhesive layer is energy ray curable, examples of the energy ray curable adhesive composition include an adhesive composition (I-1) containing a non-energy ray curable adhesive resin (I-1a) and an energy ray curable compound; an adhesive composition (I-2) containing an energy ray curable adhesive resin (I-2a) in which an unsaturated group has been introduced into the side chain of the non-energy ray curable adhesive resin (I-1a); an adhesive composition (I-3) containing the adhesive resin (I-2a) and an energy ray curable compound, and the like.

[0175] When the adhesive layer is non-energy ray curable, examples of the non-energy ray curable adhesive composition include an adhesive composition (I-4) containing the non-energy ray curable adhesive resin (I-1a).

[0176] The curing conditions during energy ray curing of the pressure-sensitive adhesive layer are not particularly limited as long as the energy ray curing proceeds sufficiently, and can be appropriately selected depending on the type of the energy ray-curable pressure-sensitive adhesive layer. For example, the illuminance of the energy beam during energy beam curing is 60 to 320 mW / cm 2 The light amount of the energy beam is preferably 100 to 1000 mJ / cm. 2 It is preferable that the energy rays are ultraviolet rays.

[0177] The pressure-sensitive adhesive composition can be obtained by blending the pressure-sensitive adhesive and, if necessary, components other than the pressure-sensitive adhesive, which are components for constituting the pressure-sensitive adhesive composition. The pressure-sensitive adhesive composition can be produced in the same manner as in the case of the resin film-forming composition described above, except that the types of ingredients used are different.

[0178] ◇ Manufacturing method of composite sheet The composite sheet can be produced by laminating the above-mentioned layers in a corresponding positional relationship and adjusting the shape of some or all of the layers as necessary. The method of forming each layer is as described above.

[0179] For example, when a pressure-sensitive adhesive layer is laminated on a substrate during the production of a support sheet, the pressure-sensitive adhesive composition may be applied onto the substrate and dried as necessary. Alternatively, the pressure-sensitive adhesive layer can be laminated on the substrate by coating the pressure-sensitive adhesive composition on a release film, drying it as necessary to form a pressure-sensitive adhesive layer on the release film, and then laminating the exposed surface of the pressure-sensitive adhesive layer to one surface of the substrate. In this case, the pressure-sensitive adhesive composition is preferably coated on the release-treated surface of the release film. Up to this point, the case where the pressure-sensitive adhesive layer is laminated on the substrate is given as an example, but the above-mentioned method can also be applied to the case where the resin film-forming film or the other layer is laminated on the substrate. When laminating the resin film-forming film on the substrate, the above-mentioned resin film-forming composition is applied on the substrate and dried as necessary, or the resin film-forming composition is applied on the release film and dried as necessary to form the resin film-forming film on the release film, and the exposed surface of this resin film-forming film is bonded to one surface of the substrate.

[0180] For example, when a resin film-forming film is laminated on top of an adhesive layer already laminated on a substrate, a resin film-forming film may first be formed on a release film using a resin film-forming composition, and the exposed surface of the formed resin film-forming film opposite the side in contact with the release film may then be bonded to the exposed surface (first surface) of the adhesive layer. Here, the case where a resin film-forming film is laminated on the pressure-sensitive adhesive layer has been taken as an example, but the same method can also be used when, for example, a layer other than the resin film-forming film is laminated on the pressure-sensitive adhesive layer.

[0181] ◇ Manufacturing method of encapsulated body (method of using resin film forming film) The resin film-forming film of this embodiment can be used to fix a workpiece that needs to be sealed with a sealing resin on a support in the manufacturing process of a sealed body.

[0182] A method for producing an encapsulated body according to one embodiment of the present invention is a method for producing an encapsulated body using a resin film-forming film or a composite sheet, the resin film-forming film being the resin film-forming film according to the embodiment of the present invention described above, the composite sheet being configured to include a support sheet and the resin film-forming film provided on one surface of the support sheet, and the manufacturing method includes a bonding step of bonding the resin film-forming film not constituting the composite sheet or the resin film-forming film in the composite sheet to any location on a support, and a bonding step of bonding the resin film-forming film not constituting the composite sheet to any location on a support after the bonding step. The method includes a heat curing step (1) of forming a resin film by heat curing a film, or a heat curing step (2) of forming a resin film by heat curing the resin film-forming film in the composite sheet, a removal step of removing the support sheet from the resin film after the heat curing step (2), a fixing step of fixing a workpiece obtained by processing a workpiece to the resin film on the support after the heat curing step (1) or the removal step, and a sealing step of sealing the workpiece on the support with the sealing resin by flowing a sealing resin onto the support to obtain a sealed body after the fixing step. According to the manufacturing method of this embodiment, when the workpiece on the support is sealed with the sealing resin, the workpiece is subjected to pressure by the inflowing sealing resin. This pressure also causes the resin film on the support, which is integrated with the workpiece, to receive external force from the workpiece. However, by using the resin film-forming film of this embodiment, the storage modulus of the resin film, which is a thermoset, at high temperatures (storage modulus E'(200) of the first test piece) is high, so that even if the workpiece is subjected to pressure, deformation of the resin film is suppressed, and displacement of the fixed position of the workpiece on the support is suppressed.

[0183] <<Manufacturing method (1)>> 4 is a cross-sectional view for illustrating an example of a method for manufacturing an encapsulated body (sometimes referred to as "manufacturing method (1)" in this specification) when a resin film-forming film that does not constitute a composite sheet is used. Here, a manufacturing method when the resin film-forming film 13 shown in FIG. 1 is used will be described. In this specification, the method for producing an encapsulated body using a resin film-forming film that does not constitute a composite sheet is sometimes referred to as "production method (1)".

[0184] That is, the manufacturing method (1) is a method for manufacturing a sealed body using a resin film-forming film, and the resin film-forming film is a resin film-forming film according to one embodiment of the present invention described above. The manufacturing method (1) includes an attachment step (sometimes referred to as "attaching step (1)" in this specification) of attaching the resin film-forming film, which does not constitute the composite sheet, to any location on a support, a heat curing step (1) of forming a resin film by heat curing the resin film-forming film after the attachment step, a fixing step (sometimes referred to as "fixing step (1)" in this specification) of fixing a workpiece obtained by processing a workpiece to the resin film on the support after the heat curing step (1), and a sealing step (sometimes referred to as "sealing step (1)" in this specification) of sealing the workpiece on the support with the sealing resin by flowing a sealing resin onto the support after the fixing step to obtain a sealed body.

[0185] <Attachment process (1)> In the pasting step (1) of the manufacturing method (1), as shown in FIG. 4(a), the resin film-forming film 13 is pasted to any part of the support 8 to produce a support 801 with a resin film-forming film. In particular, a plate-shaped support 8 is used here, and the resin film-forming film 13 is pasted to one surface 8a of the support 8. In this case, the resin film-forming film 13 may be pasted to the entire surface of one surface 8a of the support 8, or may be pasted to a partial area of ​​the one surface 8a. When the resin film-forming film 13 is pasted to a partial area of ​​the one surface 8a, the size and shape of the resin film-forming film 13 on the support 8 can be selected arbitrarily according to the purpose.

[0186] The support 8 may be any known one as long as it can maintain a laminated structure with the resin film-forming film 13 and its thermoset (a resin film 130 described later), and is not particularly limited. Examples of the constituent material of the support 8 include organic materials such as resin, and inorganic materials such as glass. The thickness of the support 8 is preferably 150 to 2000 μm.

[0187] The resin film-forming film 13 shown in FIG. 1 can be produced into a support 801 with a resin film-forming film by, for example, removing either the first release film 151 or the second release film 152 and attaching the resulting exposed surface (i.e., the first surface 13a or the second surface 13b) to one surface 8a of the support 8. Here, the remaining other of the first release film 151 and the second release film 152 is also shown removed from the resin film-forming film 13.

[0188] In the attaching step (1), the resin film-forming film 13 may be softened by heating and attached to the support 8.

[0189] In the pasting step (1), a part of the resin film-forming film 13 after pasting on the support 8 may be cut off to adjust the shape and size of the resin film-forming film 13.

[0190] <Thermosetting process (1)> After the attachment step (1) of the manufacturing method (1), in the heat curing step (1), the resin film-forming film 13 after being attached to the support 8 is heat cured to form a resin film 130 as shown in Figure 4 (b), thereby producing a support 8010 with a resin film.

[0191] In the heat curing step (1), the heating temperature and heating time of the resin film-forming film 13 when the resin film-forming film 13 is heat cured are as described above.

[0192] <Fixed process (1)> After the heat curing step (1) of the manufacturing method (1), in the fixing step (1), the workpiece 9 is fixed to the resin film 130 on the support 8. Here, as shown in FIG. 4(c), the case where the workpiece 9 is fixed to the resin film 130 by the film-like adhesive 7 provided thereon is shown. That is, the workpiece 9 is fixed to the resin film 130 as a workpiece 901 with a film-like adhesive. However, in this embodiment, the workpiece 9 may be fixed directly to the resin film 130 without using the film-like adhesive 7. Both the workpiece 9 and the workpiece 901 with a film-like adhesive can be fixed to the resin film 130 by attaching them to the resin film 130. The workpiece 9 can be fixed more firmly by fixing it to the resin film 130 by using the film-like adhesive 7 (as the workpiece 901 with a film-like adhesive).

[0193] The workpiece 9 is plate-shaped, and the workpiece 901 with the film-like adhesive is configured to include the workpiece 9 and the film-like adhesive 7 provided on one surface 9b of the workpiece 9. However, the shape of the workpiece 9 is not limited to this.

[0194] The fixing process (1) produces a first laminate 981 in which the workpiece 901 with the film-like adhesive is fixed and held on the support 8 by the resin film 130 in the support 8010 with the resin film in the film-like adhesive 7 therein.

[0195] In the fixing step (1), the workpiece 9 is preferably attached to the resin film 130 while applying an external force of 1 to 4 N, regardless of whether or not the film-like adhesive 7 is present (i.e., in both the case of the workpiece 9 and the workpiece 901 with the film-like adhesive), and it is preferable to apply such an external force for 0.2 to 2 seconds while attaching the workpiece to the resin film 130.

[0196] In the fixing step (1), when the workpiece 9 is attached to the resin film 130 regardless of whether the film-like adhesive 7 is present or not (i.e., in the case of either the workpiece 9 or the workpiece 901 with the film-like adhesive), it is preferable to heat the resin film 130, and the heating temperature at that time may be, for example, any one of 100 to 200° C., 110 to 170° C., and 120 to 150° C. By attaching the workpiece 9 or the workpiece 901 with the film-like adhesive to the resin film 130 in a heated state, the workpiece 9 can be fixed more firmly onto the support 8.

[0197] The film adhesive 7 may be a known one and is not particularly limited. The film-like adhesive 7 is preferably one that has a curing property, more preferably one that has a thermosetting property, and is preferably one that has a pressure-sensitive adhesive property.

[0198] Examples of the thermosetting film-like adhesive 7 include those containing a polymer component (a) and an epoxy-based thermosetting resin (b). In addition to these, examples of the film-like adhesive 7 include those containing one or more types selected from the group consisting of a curing accelerator (c), a filler (d), a coupling agent (e), a crosslinking agent (f), an energy ray-curable resin (g), a photopolymerization initiator (h), a colorant (i) and a general-purpose additive (j). The epoxy thermosetting resin (b) is composed of an epoxy resin (b1) and a thermosetting agent (b2).

[0199] The polymer component (a), epoxy resin (b1), heat curing agent (b2), curing accelerator (c), filler (d), coupling agent (e), crosslinking agent (f), energy ray curable resin (g), photopolymerization initiator (h), colorant (i) and general-purpose additive (j) contained in the thermosetting film-like adhesive 7 may be, for example, the same as the polymer component (A), epoxy resin (B1), heat curing agent (B2), curing accelerator (C), filler (D), coupling agent (E), crosslinking agent (F), energy ray curable resin (G), photopolymerization initiator (H), colorant (I) and general-purpose additive (J) listed above as the components contained in the resin film-forming film. However, the storage modulus of a test piece prepared using the film-like adhesive 7 containing such a polymer component (a) and the like in the same manner as in the case of the first test piece prepared using the resin film-forming film 13 is less than 0.2 GPa at a temperature of 200° C. That is, in this embodiment, the film-like adhesive 7 is different from the resin film-forming film 13.

[0200] When the film-like adhesive 7 is curable, the production method (1) may or may not further include an adhesive curing step described below for curing the film-like adhesive 7.

[0201] The thickness of the film-like adhesive 7 is preferably 2 to 15 μm, and more preferably 2 to 9 μm. When the thickness of the film-like adhesive 7 is equal to or greater than the lower limit, the strength of the film-like adhesive 7 becomes higher, and when the film-like adhesive 7 is curable, the strength of the cured product also becomes higher. When the thickness of the film-like adhesive 7 is equal to or less than the upper limit, the sealing body can be easily made thinner. In this specification, "thickness of a film-like adhesive" means the thickness of the entire film-like adhesive; for example, the thickness of a film-like adhesive consisting of multiple layers means the total thickness of all layers that make up the film-like adhesive.

[0202] The workpiece with film-like adhesive 901 can be manufactured in the same manner as a conventional workpiece with film-like adhesive, such as a semiconductor chip with film-like adhesive comprising a semiconductor chip and a film-like adhesive provided on one side of the semiconductor chip.

[0203] <Adhesive curing process (1)> As shown here, in the fixing step (1), the workpiece 9 is fixed to the resin film 130 not alone but together with the film-like adhesive 7 in the form of a workpiece 901 with a film-like adhesive, and further, if the film-like adhesive 7 is curable, an adhesive curing step (sometimes referred to as "adhesive curing step (1)" in this specification) for curing the film-like adhesive 7 may or may not be performed after the fixing step (1) in the manufacturing method (1). In order to fix the workpiece 9 to the resin film 130 more firmly, it is preferable to perform the adhesive curing step (1).

[0204] 4(d), the film-like adhesive-attached workpiece 901 becomes a cured film-like adhesive-attached workpiece 9010 in which the film-like adhesive 7 therein becomes a cured film-like adhesive (thermoset) 70. Then, a cured first laminate 9810 is obtained in which the workpiece 9 is fixed and held to the resin film 130 in the resin-film-attached support 8010 by the cured film-like adhesive 70.

[0205] When the film-like adhesive 7 is thermosetting, the heating temperature and heating time during thermal curing of the film-like adhesive 7 in the adhesive curing step (1) may be, for example, similar to the heating temperature and heating time during thermal curing of the resin film-forming film 13.

[0206] <Sealing process (1)> In the sealing step (1) after the adhesive curing step (1) of the manufacturing method (1), as shown in Fig. 4(e), the sealing resin 6 is poured onto the support 8 to seal the workpiece 9 on the support 8 with the sealing resin 6. As a result, as shown in Fig. 4(f), a sealed body 902 is obtained, and a second laminate 982 is obtained that includes the support 8 and the sealing body 902 provided on the support 8. The sealed body 902 is configured to include the resin film 130, the workpiece 9010 with the cured film-like adhesive, and the sealing resin 6 that covers the workpiece 9010 with the cured film-like adhesive on the resin film 130.

[0207] In the sealing step (1), the workpiece 9 on the support 8 is subjected to pressure by the flowing sealing resin 6, but since the resin film 130, which is a thermoset of the resin film-forming film 13, has a high storage modulus at high temperatures, the workpiece 9 is prevented from shifting from its fixed position on the support 8. As a result, the performance of the sealed body and the substrate device that is finally manufactured is achieved as intended and is not adversely affected.

[0208] In the sealing step (1), the temperature of the sealing resin 6 poured onto the support 8 depends on the type of sealing resin, but is preferably 190 to 210° C. When the temperature of the sealing resin 6 is in such a range, the effect of suppressing the shift of the fixing position of the workpiece described above is further increased.

[0209] The encapsulation step (1) can be performed by a known method, except that the cured first laminate 9810 is used as the object to be encapsulated. For example, the sealing resin 6 may be a known sealing resin. For example, sealing with the sealing resin 6 can be performed by placing the cured first laminate 9810 inside a metal mold and pouring the sealing resin 6 into the metal mold. At this time, the temperature of the metal mold can be set to the heating temperature of the sealing resin 6. For example, after the end of the flow (coating of the workpiece 9010 with the cured film-like adhesive on the resin film 130), the resin is preferably thermally cured by heating it as is, preferably while maintaining the temperature at which it was flowed in, more preferably at a temperature of 190 to 210° C. Heating for thermal curing is preferably performed for, for example, 2 to 10 hours.

[0210] <Other process (1)> The manufacturing method (1) may or may not include other steps (sometimes referred to as “other steps (1)” in this specification) that do not correspond to any of the above-mentioned attachment step (1), heat curing step (1), fixing step (1), adhesive curing step (1), and sealing step (1) as long as the effect of the present invention is not impaired.

[0211] The type and timing of the other step (1) can be selected arbitrarily depending on, for example, the type of workpiece to be fixed to the resin film on the support.

[0212] For example, other steps (1) include a circuit formation step in which electrodes, wiring, terminals or insulating films are formed on the support as necessary to form a circuit; a cutting step in which the support with the resin film is cut using a known dicing saw or the like to obtain a shape and size that is easy to perform the sealing step in a sealing device; an unnecessary material removal step in which unnecessary components such as the resin film or insulating film are removed by grinding; and a printing step in which printing is performed by irradiating a laser beam onto any component in the sealed body, such as a workpiece.

[0213] <<Manufacturing method (2)>> Next, a method for producing an encapsulant using a composite sheet provided with a resin film-forming film will be described. In this specification, such a method for producing a sealed body may be referred to as "production method (2)".

[0214] That is, the manufacturing method (2) is a method for manufacturing an encapsulant using a composite sheet, the composite sheet being configured to include a support sheet and a resin film-forming film according to one embodiment of the present invention provided on one surface of the support sheet, and the manufacturing method (2) includes a bonding step (sometimes referred to as "bonding step (2)" in this specification) of bonding the resin film-forming film in the composite sheet to any location on a support, and a thermal curing step (sometimes referred to as "bonding step (2)") of forming a resin film by thermally curing the resin film-forming film in the composite sheet after the bonding step (2). The method includes a step (2), a removal step of removing the support sheet from the resin film after the thermosetting step (2), a fixing step (sometimes referred to in this specification as "fixing step (2)") of fixing a workpiece obtained by processing a workpiece to the resin film on the support after the removal step, and a sealing step (sometimes referred to in this specification as "sealing step (2)") of sealing the workpiece on the support with the sealing resin by flowing a sealing resin onto the support to obtain a sealed body after the fixing step.

[0215] The manufacturing method (2) is the same as the above-mentioned manufacturing method (1) except that the composite sheet (e.g., the composite sheet 101 shown in FIG. 2 or the composite sheet 102 shown in FIG. 3) is used instead of the resin film-forming film (e.g., the resin film-forming film 13 shown in FIG. 1) and that the manufacturing method (2) includes the removal step. That is, the attachment step (2) in the manufacturing method (2) is explained by the attachment step (1) in the manufacturing method (1) in the case where the resin film-forming film 13 in Figure 4(a) is replaced with a composite sheet (for example, the composite sheet 101 shown in Figure 2 or the composite sheet 102 shown in Figure 3). The thermal curing step (2) in the manufacturing method (2) is explained by the thermal curing step (1) in the manufacturing method (1) in the case where the resin film 130 in FIG. 4(b) is replaced with a resin film provided with a support sheet. The fixing step (2), adhesive curing step (2), sealing step (2) and processing step (2) in the manufacturing method (2) are respectively explained in terms of the fixing step (1), adhesive curing step (1), sealing step (1) and processing step (1) in the manufacturing method (1) in the case where the resin film 130 is replaced with the resin film after the support sheet has been removed (after the removing step) in Figures 4(c) to 4(f). The manufacturing method (2) may or may not include other steps (2) (e.g., a circuit forming step, a cutting step, an unnecessary material removing step, a printing step) similar to the other steps (1) in the manufacturing method (1).

[0216] In the manufacturing method (2), when the support sheet has an energy ray-curable adhesive layer (for example, adhesive layer 12 in support sheet 10 shown in Figures 2 and 3), an adhesive layer curing step of curing the adhesive layer with energy rays may or may not be included prior to the removing step. When the adhesive layer curing step is included, the adhesive strength between the energy ray-cured product of the adhesive layer and the resin film is reduced after the adhesive layer curing step. Therefore, in the removing step, the support sheet having the energy ray-cured product of the adhesive layer can be more easily removed from the resin film.

[0217] In the pressure-sensitive adhesive layer curing step, the illuminance and light amount of the energy rays when the pressure-sensitive adhesive layer is cured with the energy rays are as described above.

[0218] <<Other examples of manufacturing methods>> The manufacturing method of this embodiment is not limited to the manufacturing method described above with reference to FIG. 4, and some components may be changed, deleted, or added in the manufacturing method described with reference to FIG. 4, as long as the effects of the present invention are not impaired.

[0219] For example, in the above-mentioned manufacturing method (1), the workpiece is fixed to the resin film together with the curable film-like adhesive, not by itself, and then the film-like adhesive is thermally cured (the adhesive curing step (1)) before the sealing step (1) is performed. However, in this embodiment, when the workpiece is fixed to the resin film either by itself or together with the non-curable film-like adhesive, the sealing step (1) can be performed after the fixing step (1) without performing the adhesive curing step (1). That is, in the sealing step (1) in this case, instead of the cured first laminate (for example, the cured first laminate 9810 shown in FIG. 4(e)), a laminate of the workpiece and the support body with the resin film, or the first laminate, can be used as the object to be sealed. Even when the workpiece is fixed to the resin film together with the curable film-like adhesive in the state of a workpiece with a film-like adhesive, the sealing step (1) can be performed without performing the adhesive curing step (1). In this case, in the sealing step (1), the first laminate may be used as the object to be sealed in place of the cured first laminate.

[0220] The same is true for the manufacturing method (2). That is, in the thermal curing step (2), when the cured composite sheet obtained by thermally curing the resin film-forming film in the composite sheet to form a resin film is used, and the workpiece is fixed to the resin film together with the curable film-like adhesive, not alone, but in the state of a workpiece with a film-like adhesive (fixing step (2) is performed), the film-like adhesive can then be thermally cured (adhesive curing step (2) is performed) before the sealing step (2). On the other hand, when the workpiece is fixed to the resin film alone or in the state of a workpiece with a film-like adhesive together with a non-curable film-like adhesive, after the fixing step (2), the sealing step (2) can be performed without performing the adhesive curing step (2). In this case, in the sealing step (2), instead of the cured first laminate in which the workpiece with the cured film-like adhesive is fixed and held on the support by the cured film-like adhesive in the cured film-like adhesive, a laminate of the workpiece and the support with the resin film, or the first laminate, may be used as the object to be sealed. Even when the workpiece is fixed to the resin film together with the curable film-like adhesive in the state of a workpiece with a film-like adhesive, the sealing step (2) can be performed without performing the adhesive curing step (2). In this case, in the sealing step (2), the first laminate may be used as the object to be sealed in place of the cured first laminate.

[0221] ◇ Manufacturing method of substrate device After obtaining the encapsulated body by the manufacturing method of the encapsulated body of the present embodiment, the support is removed from the resin film, and the encapsulated body is further processed to produce a processed product of the encapsulated body, and then the processed product of the encapsulated body can be used to manufacture a substrate device by a known method. For example, by adopting a known process such as picking up the processed product of the encapsulated body and mounting it on a substrate, a substrate device equipped with the encapsulated body having the target work processed product can be manufactured.

[0222] The support can be removed from the resin film by a known method, for example, a method of grinding with a grinder.

[0223] The type of processing of the sealing body can be appropriately selected from known types depending on the type of workpiece. A representative processing includes, for example, a division process in which the sealing body is cut and divided into a specific number of workpieces when the number of workpieces fixed on the support is two or more. EXAMPLES

[0224] The present invention will be described in more detail below with reference to specific examples, although the present invention is not limited to the following examples.

[0225] <Raw materials for resin production> The full names of the raw materials for producing the resins, which are abbreviated in the present examples and comparative examples, are shown below. BA: n-butyl acrylate MA: Methyl acrylate GMA: glycidyl methacrylate HEA: 2-hydroxyethyl acrylate

[0226] <Raw materials for producing the resin film-forming composition> The raw materials used in the production of the resin film-forming composition are shown below. [Polymer component (A)] (A)-1: Acrylic resin (weight average molecular weight: 800,000, glass transition temperature: −28° C.) obtained by copolymerizing BA (55 parts by mass), MA (10 parts by mass), GMA (20 parts by mass), and HEA (15 parts by mass). (A)-2: Acrylic resin (weight average molecular weight 400,000, glass transition temperature -1°C) obtained by copolymerizing BA (10 parts by mass), MA (70 parts by mass), GMA (5 parts by mass), and HEA (15 parts by mass). (A)-3: Acrylic resin (weight average molecular weight: 350,000, glass transition temperature: 6° C.) obtained by copolymerizing MA (85 parts by mass) and HEA (15 parts by mass). [Epoxy resin (B1)] (B1)-1: Liquid bisphenol A type epoxy resin containing 20% ​​by mass of acrylic rubber fine particles ("BPA328" manufactured by Nippon Shokubai Co., Ltd., epoxy equivalent 235g / eq) (B1)-2: Liquid bisphenol A type epoxy resin ("jER828" manufactured by Mitsubishi Chemical Corporation, weight average molecular weight 370, epoxy equivalent 183-194g / eq) (B1)-3: Solid bisphenol A type epoxy resin ("jER1055" manufactured by Mitsubishi Chemical Corporation, number average molecular weight 1600, epoxy equivalent 800-900g / eq) (B1)-4: Dicyclopentadiene type solid epoxy resin (DIC "Epicron HP-7200HH", compound with weight average molecular weight of less than 20,000, softening point of 88 to 98°C, epoxy equivalent of 254 to 264g / eq) (B1)-5: Dicyclopentadiene type solid epoxy resin (DIC "Epicron HP-7200", compound with weight average molecular weight of less than 20,000, softening point of 56 to 66°C, epoxy equivalent of 274 to 284g / eq) [Heat hardener (B2)] (B2)-1: Dicyandiamide (thermally activated latent epoxy resin curing agent, ADEKA Corporation's "ADEKA Hardener EH-3636AS", active hydrogen amount 21g / eq, average particle size 5μm) (B2)-2: Dicyandiamide (thermally activated latent epoxy resin hardener, Mitsubishi Chemical Corporation's "DICY7", average particle size 3 μm, maximum particle size 25 μm) [Cure accelerator (C)] (C)-1: 2-phenyl-4,5-dihydroxymethylimidazole (manufactured by Shikoku Chemical Industry Co., Ltd., "Curezol (registered trademark) 2PHZ-PW") [Filling material (D)] (D)-1: Silica filler ("SC2050MB" manufactured by Admatechs Co., Ltd., spherical silica filler surface-modified with an epoxy compound, average particle size 0.5 μm, maximum particle size 2.0 μm) (D)-2: Silica filler ("SV-10" manufactured by Tatsumori Co., Ltd., spherical silica filler, average particle diameter 10 μm) (D)-3: Silica filler (Admatechs Co., Ltd. "5SP-CM1", spherical silica filler surface-modified with phenyl groups, average particle size 0.5 μm, maximum particle size 2.0 μm) (D)-4: Alumina filler (Resonac's "CB-P02", spherical alumina filler, average particle diameter 2 μm) [Coupling agent (E)] (E)-1: Silane coupling agent ("KBM-403" manufactured by Shin-Etsu Silicones, 3-glycidoxypropyltrimethoxysilane, molecular weight 236.3) [Crosslinker (F)] (F)-1: Trimethylolpropane adduct tolylene diisocyanate ("Coronate (registered trademark) L" manufactured by Tosoh Corporation) [Colorant (I)] (I)-1: Carbon black ("MA600" manufactured by Mitsubishi Chemical Corporation, average particle size 20 nm) (I)-2: Carbon black (manufactured by Mitsubishi Chemical Corporation, #20, average particle size 50 nm)

[0227] [Example 1] <<Production of resin film>> <Production of resin film-forming composition (III)> Polymer component (A)-1 (18.48 parts by mass), epoxy resin (B1)-1 (11.18 parts by mass), epoxy resin (B1)-3 (1.86 parts by mass), epoxy resin (B1)-4 (5.59 parts by mass), heat curing agent (B2)-1 (0.6 parts by mass), Curing accelerator (C)-1 (0.45 parts by mass), filler (D)-1 (5.96 parts by mass), filler (D)-2 (53.65 parts by mass), coupling agent (E)-1 (0.37 parts by mass) and colorant (I)-1 (1.86 parts by mass) were dissolved or dispersed in methyl ethyl ketone and stirred at 23°C to obtain a thermosetting resin film-forming composition (III) having a total concentration of 67% by mass of all components other than the solvent. The amounts of all components other than methyl ethyl ketone shown here are the amounts of the target product excluding the solvent.

[0228] <Production of resin film-forming film> A release film (second release film, "SP-PET50 2150" manufactured by Lintec Corporation, thickness 50 μm) made of polyethylene terephthalate film, one side of which had been treated for release by silicone treatment, was used, and the resin film-forming composition (III) obtained above was applied to the release-treated surface, followed by drying at 100°C for 2 minutes to produce a thermosetting resin film-forming film (thickness 20 μm).

[0229] Furthermore, a release film (first release film, "SP-PET38 1031" manufactured by Lintec Corporation, thickness 38 μm) made of polyethylene terephthalate film with one side treated for release by silicone treatment was used, and the release-treated surface of this first release film was attached to the exposed surface of the resin film-formed film obtained above that was not provided with the second release film. As a result, a laminated film was obtained that was composed of the resin film-formed film, the first release film provided on one side of the resin film-formed film, and the second release film provided on the other side of the resin film-formed film.

[0230] <<Evaluation of resin film-forming films>> <Measurement of E'(200) of the first test piece> Using the 10 laminate films obtained above, the exposed surfaces of the resin film-forming films were sequentially bonded together while removing the first release films to produce a test laminate with a second release film, which was composed of a second release film, a laminate of 10 resin film-forming films (total thickness 200 μm), and the second release film, laminated in that order. This test laminate with a second release film was heated at 140°C for 2 hours to thermally cure all of the resin film-forming films (test laminate) to produce a cured test laminate with a second release film. The second release films provided on both sides of this cured test laminate were removed, and a first test piece measuring 5 mm wide, 20 mm long and approximately 200 μm thick was cut out from the cured test laminate.

[0231] Using a viscoelasticity measuring device ("DMA Q800" manufactured by TA instruments), the storage modulus E' of the first test piece was measured by the tensile method (tensile mode) under the measurement conditions of a chuck distance of 10 mm, a frequency of 11 Hz, a temperature rise rate of 3°C / min, and a uniform temperature rise rate, while the first test piece was heated in a temperature range from 0°C to 300°C. Among these, the storage modulus E' (E'(200)) of the first test piece when the temperature of the first test piece was 200°C is shown in Table 1.

[0232] <Measurement of Tg of the first test piece> When the above E'(200) was measured, the tan δ of the first test piece was measured at the same time, and the temperature showing the peak of the tan δ was adopted as the glass transition temperature (Tg) of the first test piece. The results are shown in Table 1.

[0233] <Measurement of linear expansion coefficient α of the second test piece> A second test piece measuring 4.5 mm wide, 20 mm long and approximately 200 μm thick was cut out from the cured test laminate prepared when measuring E′(200) above and after removing the second release film.

[0234] Using a thermomechanical analyzer (Bruker AXS, "TMA4000 SA"), the second test piece was subjected to thermomechanical analysis under the measurement conditions of a chuck distance of 15 mm, a temperature increase rate of 5°C / min, and a uniform temperature increase rate, while applying a load of 2 g to the second test piece while heating the second test piece in the temperature range from -60°C to 300°C. Then, at a temperature t 50°C lower than the glass transition temperature of the second test piece, 1 Displacement L of the second test piece at 1 and a temperature t 20° C. lower than the glass transition temperature of the second test piece. 2 Displacement L of the second test piece at 2 and measuring the t 1 , L 1 , t 2 and L 2 The linear expansion coefficient α of the second test piece was calculated using the above formula. The results are shown in Table 1.

[0235] <Measurement of surface roughness Ra of the thermoset surface of resin film-forming film> In the laminated film obtained above, the first release film and the second release film were removed from the resin film-forming film, and then the resin film-forming film was heat-cured by heating the resin film-forming film at 140°C for 2 hours to produce a heat-cured product (i.e., a resin film). The surface roughness Ra of the surface of this thermoset was measured in accordance with JIS B0601:2001. More specifically, the surface roughness Ra was measured using a surface roughness measuring device ("SURFTEST SV-3000" manufactured by Mitutoyo Corporation) under the measurement conditions of a measurement length of 10.525 mm and a measurement speed of 1.0 mm / s. The results are shown in Table 1.

[0236] <Evaluation of the effect of suppressing deviation of the fixed position of the workpiece> (Preparation of workpieces with film-like adhesive) A silicon chip with a film-like adhesive was fabricated by a known method, which was composed of a silicon chip with a size of 8 mm × 8 mm and a thickness of 200 μm, and a film-like adhesive (thickness of 7 μm) provided on the back surface of the silicon chip. This silicon chip with a film-like adhesive is a workpiece with a film-like adhesive. The film-like adhesive was produced by applying a thermosetting adhesive composition containing polymer component (a)-1 (100 parts by mass), epoxy resin (b1)-1 (10 parts by mass), thermosetting agent (b2)-1 (1.5 parts by mass), filler (d)-1 (75 parts by mass), coupling agent (e)-1 (0.5 parts by mass), and crosslinking agent (f)-1 (0.5 parts by mass) to the release-treated surface of a release film and drying by heating at 80°C for 2 minutes.

[0237] The raw materials used in the production of the above adhesive composition are shown below. Polymer component (a)-1: Acrylic resin (weight average molecular weight 800,000, glass transition temperature 9°C) obtained by copolymerizing MA (95 parts by mass) and HEA (5 parts by mass). Epoxy resin (b1)-1: cresol novolac type solid epoxy resin with acryloyl groups added ("CNA147" manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent 517g / eq, number average molecular weight 2100, unsaturated group content is equal to the epoxy group) Heat curing agent (b2)-1: Aralkyl type phenolic resin (Mitsui Chemicals "Milex XLC-4L", number average molecular weight 1100, softening point 63°C) Filler (d)-1: Silica filler ("YA050C-MJE" manufactured by Admatechs Co., Ltd., spherical silica filler surface-modified with methacrylsilane, average particle diameter 50 nm) Coupling agent (e)-1: Silane coupling agent (Shin-Etsu Silicone Co., Ltd. "KBE-402", 3-glycidoxypropylmethyldiethoxysilane) Crosslinking agent (f)-1: Trimethylolpropane adduct tolylene diisocyanate ("Coronate (registered trademark) L" manufactured by Tosoh Corporation)

[0238] (Preparation of a support with a resin film-forming film) The laminated film obtained above was used to remove the first release film, and the exposed surface of the resin film-forming film (the surface on which the first release film was provided) was attached to the entire surface of one side of a stainless steel plate (thickness 1 mm). Then, the area of ​​the laminate of the resin film-forming film and the second release film that was not attached to the stainless steel plate was cut off. Next, the second release film was removed from the resin film-forming film attached to the stainless steel plate. Through the above steps, a stainless steel plate with a resin film-forming film was produced, which comprises a stainless steel plate and a resin film-forming film provided over the entire surface of one side of the stainless steel plate, and in which the area of ​​the one side of the stainless steel plate is the same as the surface area of ​​the resin film-forming film (attachment process (1)).

[0239] (Preparation of support with resin film) The stainless steel plate with the resin film-forming film was heated at 140° C. for 2 hours to thermally cure the resin film-forming film, thereby producing a stainless steel plate with a resin film (thermal curing step (1)).

[0240] (Preparation of the first laminate) Using a pick-up die bonding device (Canon Machinery's "BESTEM D02"), the eight silicon chips with film-like adhesive obtained above were attached, spaced apart from one another, to the exposed surface of the resin film (the surface opposite to the side with the stainless steel plate) in a stainless steel plate with a resin film heated to 120°C. At this time, the film-like adhesive in the silicon chip with film-like adhesive was attached to the resin film in the stainless steel plate with a resin film. The silicon chip with film-like adhesive was attached to the resin film while applying an external force of 2.45N (load of 250gf) to it for 0.5 seconds. As a result of the above, a first laminate was obtained in which eight silicon chips with a film-like adhesive were fixed and held on the stainless steel plate by the resin film in the resin-film-coated stainless steel plate through the film-like adhesive (fixing process (1)).

[0241] (Preparation of hardened first laminate) The first laminate obtained above was heated at 130° C. for 2 hours to thermally cure the film-like adhesive, thereby forming a silicon chip with the film-like adhesive into a silicon chip with a cured film-like adhesive. This resulted in a cured first laminate in which the silicon chip was fixed and held by the cured film-like adhesive to the resin film in the resin-film-covered stainless steel plate (adhesive curing step (1)).

[0242] The obtained cured first laminate was allowed to cool until its temperature was the same as room temperature, and then the fixed position of the silicon chip on the stainless steel plate (in other words, the fixed position of the silicon chip with the cured film-like adhesive on the stainless steel plate with the resin film) was recorded.

[0243] (Preparation of the second laminate (sealing body)) Using a sealing device (Apic Yamada's "MPC-06M TriAl Press"), the mold temperature was set to 200°C, and sealing resin (Kyocera Chemical's "KE-G1250") was poured onto the resin-coated stainless steel plate at a pressure of 7 MPa for 1.5 minutes. Next, the poured sealing resin was heated at 200° C. for 5 hours to thermally cure the sealing resin. As a result, a sealing body was obtained that was composed of the resin film, the silicon chip with the cured film-like adhesive, and the thermoset product of the sealing resin that covered the silicon chip with the cured film-like adhesive on the resin film, and a second laminate was obtained that was composed of the stainless steel plate and the sealing body provided on the stainless steel plate (sealing process (1)). The thickness of this sealing body on the stainless steel plate with the resin film was 400 μm.

[0244] (Evaluation of the effect of suppressing the shift of the fixed position of the workpiece on the support) Using an ultrasonic microscope (Sonoscan's "D-9600"), the eight silicon chips in the encapsulated body obtained above were observed, and the fixed positions of these silicon chips on the stainless steel plate were confirmed. Then, the deviation between the fixed positions of these silicon chips on the stainless steel plate before the encapsulation resin was poured and the fixed positions of these silicon chips on the stainless steel plate in the encapsulated body, which were recorded earlier, was measured. The measurement of the deviation of the fixed position of the silicon chip was performed on the same silicon chip before the encapsulation resin was poured and after the encapsulated body was produced, and was performed a total of eight times. More specifically, the maximum value of the length of the line connecting the surface of the silicon chip before the encapsulation resin was poured and the surface of the same silicon chip in the encapsulated body was adopted as the deviation of the fixed position of the silicon chip. Then, based on the obtained eight measurement values, the suppression effect of the deviation of the fixed position of the silicon chip was evaluated according to the following criteria. The results are shown in the "Suppression effect of the deviation of the fixed position of the workpiece on the support" column in Table 1. [Evaluation Criteria] A: The deviation in the fixing positions of the eight silicon chips was all less than 15 μm, and the effect of suppressing deviation in the fixing positions was extremely high. B: The deviation of the fixing positions of the eight silicon chips is all 20 μm or less, and the deviation of the fixing positions of one or more silicon chips is more than 15 μm, and the effect of suppressing the deviation of the fixing positions is high. C: The deviation of the fixing positions of 1 to 3 silicon chips exceeds 20 μm, and the deviation of the fixing positions of the other silicon chips is 20 μm or less, and the effect of suppressing the deviation of the fixing positions is recognized. D: The deviation of the fixing positions of 4 to 8 silicon chips exceeds 20 μm, and the effect of suppressing the deviation of the fixing positions is not observed or is low.

[0245] <<Production and evaluation of resin film>> [Examples 2 to 6. Comparative Example 1] Resin film-forming films were produced and evaluated in the same manner as in Example 1, except that either or both of the types and amounts of the components were changed during the production of the resin film-forming composition (III) so that the types and contents of the components contained in the resin film-forming composition (III) were as shown in Tables 1 and 2. The results are shown in Tables 1 and 2.

[0246] In the "Resin film-formed film" column in Tables 1 and 2, "Filler (D) content (mass %)" means "the filler (D) content (mass %) in the resin film-formed film relative to the total mass of the resin film-formed film."

[0247] [Table 1]

[0248] [Table 2]

[0249] As is clear from the above results, in Examples 1 to 6, the displacement of the fixed position of the silicon chip on the stainless steel plate was suppressed after the sealing resin was poured in. The resin film-forming film in these Examples was capable of suppressing the displacement of the fixed position of the workpiece on the support when the workpiece on the support is sealed with the sealing resin by pouring the sealing resin onto the support after the workpiece is fixed on the support with the resin film. This effect was particularly high in Examples 3 to 5.

[0250] In Examples 1 to 6, the E'(200) of the first test piece was 0.23 GPa or more, which indicated that the storage modulus of the thermosetting material (resin film) of the resin film-forming film at high temperatures was high. In particular, in Examples 3 to 5, the E'(200) of the first test piece was 0.41 GPa or more.

[0251] In Examples 1 to 6, the Tg of the first test piece was 142°C or less, the linear expansion coefficient α of the second test piece was 39 ppm or less, and the surface roughness Ra of the thermoset (resin film) of the resin film-forming film was 2.3 μm or less. The resin film-forming films of Examples 1 to 6 had such physical properties, and thus were able to form a resin film with particularly preferable characteristics as a resin film for use when fixing a workpiece on a support and sealing it with a sealing resin.

[0252] In contrast, in Comparative Example 1, the effect of suppressing the shift of the fixed position of the silicon chip on the stainless steel plate after the sealing resin flowed in was low. The resin film-forming film in Comparative Example 1 was unable to suppress the shift of the fixed position of the workpiece on the support when the workpiece on the support was sealed with the sealing resin by flowing the sealing resin onto the support after the workpiece was fixed on the support with the resin film. In Comparative Example 1, E'(200) of the first test piece was 0.1 GPa, which indicated that the storage modulus at high temperatures of the thermoset product (resin film) of the resin film-forming film was low. [Industrial Applicability]

[0253] The present invention can be used to form a resin film for sealing a workpiece on a support by fixing the workpiece on the support with the resin film and then flowing the sealing resin onto the support. [Explanation of symbols]

[0254] 6...Sealing resin 8: Support body; 8a: One surface of the support body 9. Workpiece 10. Support sheet 11...Base material 12...Adhesive layer 13...Resin film forming film 101, 102 Composite sheet 130...Resin film 902...Sealing body

Claims

1. A thermosetting resin film-forming film, A cured product obtained by heat-curing a test laminate prepared by laminating one of the resin film-forming films or a plurality of the resin film-forming films each having a thickness of less than 200 μm, at 140° C. for 2 hours, said cured product being obtained by heat-curing said test laminate prepared by laminating one of the resin film-forming films or a plurality of the resin film-forming films each having a thickness of less than 200 μm, said test laminate being heat-cured at two points spaced 10 mm apart from each other, and said first test piece being held at two points 10 mm apart from each other in a tensile mode, while said first test piece is heated from 0° C. to 300° C. under conditions of a frequency of 11 Hz, a heating rate of 3° C. / min and a uniform heating rate, said storage modulus E' of said first test piece being measured, when the temperature of said first test piece is 200° C., said storage modulus E'(200) of said first test piece is 0.2 GPa or more.

2. The resin film-forming film contains a filler (D), The resin film-formed film according to claim 1, wherein the content of the filler (D) in the resin film-formed film is more than 60% by mass relative to the total mass of the resin film-formed film.

3. The resin film-forming film according to claim 1 or 2, wherein the tan δ of the first test piece is measured by the same method as that used to measure the storage modulus E' of the first test piece, and the temperature showing the peak of the tan δ is taken as the glass transition temperature of the first test piece. The glass transition temperature is 150°C or lower.

4. A test laminate prepared by laminating one of the resin film-formed films or a plurality of the resin film-formed films each having a thickness of less than 200 μm is heated at 140° C. for 2 hours to obtain a cured product. A second test piece having a thickness of 200±20 μm and a width of 4.5 mm is held at two points spaced 15 mm apart, and a load of 2 g is applied to the second test piece while the second test piece is heated from −60° C. to 300° C. at a heating rate of 5° C. / min, and a thermomechanical analysis of the second test piece is performed at a temperature t 50° C. lower than the glass transition temperature of the second test piece. １ and the temperature t １ The displacement L of the second test piece at １ and a temperature t 20° C. lower than the glass transition temperature. ２ and the temperature t ２ The displacement L of the second test piece at ２ The resin film-formed film according to claim 1 or 2, wherein the linear expansion coefficient α of the second test piece calculated using the formula (1) is 60 ppm or less.

5. The resin film-forming film is for forming a resin film, which is a thermosetting product, on a support, The resin film-forming film according to claim 1 or 2, wherein the resin film-forming film is used to fix a workpiece obtained by processing a workpiece on the support by the resin film, and then seal the workpiece on the support with the sealing resin by flowing sealing resin onto the support.

6. The resin film-forming film according to claim 1 or 2, wherein the surface roughness Ra of the surface of the cured product obtained by heat curing the resin film-forming film by heating the resin film-forming film at 140°C for 2 hours is 2.5 µm or less.

7. A method for producing an encapsulated body using a resin film-forming film or a composite sheet, comprising: The resin film-formed film is the resin film-formed film according to claim 1 or 2, The composite sheet is configured to include a support sheet and the resin film-forming film according to claim 1 or 2 provided on one surface of the support sheet, The manufacturing method includes a bonding step of bonding the resin film-forming film not constituting the composite sheet or the resin film-forming film in the composite sheet to any location on a support; After the attaching step, a thermal curing step (1) of thermally curing the resin film-forming film that does not constitute the composite sheet to form a resin film, or a thermal curing step (2) of thermally curing the resin film-forming film in the composite sheet to form a resin film; a removing step of removing the support sheet from the resin film after the thermal curing step (2); After the thermal curing step (1) or the removing step, a fixing step of fixing a workpiece obtained by processing a workpiece to the resin film on the support; A method for manufacturing a sealed body, comprising: a sealing step of, after the fixing step, sealing resin being poured onto the support body to seal the workpiece on the support body with the sealing resin, thereby obtaining a sealed body.

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