Sensor

Abstract

To provide a sensor capable of improving characteristics.SOLUTION: A sensor according to the embodiment comprises a substrate, a fixation part fixed to the substrate, and an element part. The fixation part includes a first wiring fixation part and a first fixation part. The element part includes: a first wiring part supported by the first wiring fixation part and including first wiring; a first bearing member supported by the first fixation part; a first intermediate member connected to the first wiring part and the first bearing member; and a movable part connected to the first intermediate member. The movable part includes a first movable conductive layer electrically connected to the first wiring. A first gap is provided between the substrate and the element part. A second direction from the first wiring fixation part to the first intermediate member intersects a first direction from the substrate to the first wiring fixation part. The first wiring part includes a first part connected to the first wiring fixation part, a first intermediate part connected to the first part, a first other intermediate part connected to the first intermediate part, and a first other part connected to the first other intermediate part.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] SUMMARY OF THE DISCLOSURE The present invention relates to a sensor. [Background technology]

[0002] For example, gases are detected by sensors having a MEMS (Micro Electro Mechanical Systems) structure. It is desirable to improve the characteristics of such sensors. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2022-19147 Summary of the Invention [Problem to be solved by the invention]

[0004] Embodiments of the present invention provide sensors with improved performance. [Means for solving the problem]

[0005] According to an embodiment of the present invention, the sensor includes a base, a fixing portion fixed to the base, and an element portion. The fixing portion includes a first wiring fixing portion and a first fixing portion. The element portion includes a first wiring portion supported by the first wiring fixing portion and including a first wiring, a first support member supported by the first fixing portion, a first intermediate member connected to the first wiring portion and the first support member, and a movable portion connected to the first intermediate member. The movable portion includes a first movable conductive layer electrically connected to the first wiring. A first gap is provided between the base and the element portion. A second direction from the first wiring fixing portion to the first intermediate member intersects with a first direction from the base to the first wiring fixing portion. The first wiring portion includes a first portion connected to the first wiring fixing portion, a first intermediate portion connected to the first portion, a first other intermediate portion connected to the first intermediate portion, and a first other portion connected to the first other intermediate portion. A direction from the first intermediate portion to the first portion is along the second direction. A direction from the first intermediate portion to the first other intermediate portion is along a third direction intersecting a plane including the first direction and the second direction. A direction from the first other intermediate portion to the first other portion is along the second direction. The first other portion is connected to the first intermediate member. [Brief description of the drawings]

[0006] [Figure 1] FIG. 1 is a schematic plan view illustrating the sensor according to the first embodiment. [Diagram 2] FIG. 2 is a schematic cross-sectional view illustrating the sensor according to the first embodiment. [Diagram 3] FIG. 3 is a schematic plan view illustrating the sensor according to the first embodiment. [Figure 4] FIG. 4 is a schematic plan view illustrating the sensor according to the first embodiment. [Diagram 5] FIG. 5 is a schematic plan view illustrating the sensor according to the first embodiment. [Figure 6] FIG. 6 is a schematic plan view illustrating the sensor according to the first embodiment. [Figure 7] FIG. 7 is a schematic plan view illustrating the sensor according to the second embodiment. [Figure 8] FIG. 8 is a schematic plan view illustrating the sensor according to the third embodiment. [Figure 9] FIG. 9 is a schematic cross-sectional view illustrating the sensor according to the third embodiment. As shown in FIG. [Figure 10] FIG. 10 is a schematic plan view illustrating the sensor according to the third embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0007] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The drawings are schematic or conceptual, and the relationship between the thickness and width of each part, the size ratio between parts, etc. are not necessarily the same as those in reality. Even when the same part is shown, the dimensions and ratios of each part may be different depending on the drawing. In this specification and each drawing, elements similar to those described above with reference to the previous drawings are given the same reference numerals and detailed descriptions thereof will be omitted as appropriate.

[0008] (First embodiment) FIG. 1 is a schematic plan view illustrating the sensor according to the first embodiment. FIG. 2 is a schematic cross-sectional view illustrating the sensor according to the first embodiment. FIG. 2 is a cross-sectional view taken along line A1-A2 in FIG. 1 and 2, a sensor 110 according to the embodiment includes a base 50s, a fixed portion 20, and an element portion 10A. The fixed portion 20 is fixed to the base 50s. In this example, the sensor 110 includes a fixed electrode 51E. The fixed electrode 51E is fixed to the base 50s.

[0009] The fixed portion 20 includes a first wiring fixing portion 31F and a first fixed portion 21F. The element portion 10A includes a first wiring portion 31P, a first support member 21S, a first intermediate member 41, and a movable portion 11M. The first wiring portion 31P is supported by the first wiring fixing portion 31F. The first wiring portion 31P includes a first wiring 31L. The first support member 21S is supported by the first fixed portion 21F. The first intermediate member 41 is connected to the first wiring portion 31P and the first support member 21S. The movable portion 11M is connected to the first intermediate member 41. The movable portion 11M includes a first movable conductive layer 11L. The first movable conductive layer 11L is electrically connected to the first wiring 31L.

[0010] 2, a first gap g1 is provided between the base 50s and the element portion 10A. A second direction D2 from the first wiring fixing portion 31F to the first intermediate member 41 intersects with a first direction D1 from the base 50s to the first wiring fixing portion 31F.

[0011] The first direction D1 is the Z-axis direction. A direction perpendicular to the Z-axis direction is the X-axis direction. A direction perpendicular to the Z-axis direction and the X-axis direction is the Y-axis direction. The second direction D2 may be, for example, the X-axis direction.

[0012] 1, the first wiring portion 31P includes a first portion 31a, a first intermediate portion 31c, a first other intermediate portion 31d, and a first other portion 31b. The first portion 31a is connected to the first wiring fixed portion 31F. The first intermediate portion 31c is connected to the first portion 31a. The first other intermediate portion 31d is connected to the first intermediate portion 31c. The first other portion 31b is connected to the first other intermediate portion 31d.

[0013] The direction from the first intermediate portion 31c to the first portion 31a is along the second direction D2. The direction from the first intermediate portion 31c to the first other intermediate portion 31d is along the third direction D3. The third direction D3 includes the first direction D1 and the second direction D2. The direction from the first other intermediate portion 31d to the first other portion 31b is along the second direction D2. The first other portion 31b is connected to the first intermediate member 41.

[0014] In the sensor 110, the movable part 11M is supported by the first fixed part 21F via the first intermediate member 41. The first movable conductive layer 11L included in the movable part 11M is drawn out to the outside via the first wiring 31L included in the first wiring part 31P.

[0015] For example, the first wiring portion 31P may be affected by a current flowing through the first wiring 31L, and the stress may change. Stress may also be generated due to a manufacturing process, etc. The generated stress may cause the first intermediate member 41 to deform or displace, and an unintended displacement may occur in the movable portion 11M.

[0016] In the embodiment, as described above, the first wiring portion 31P includes the first portion 31a, the first intermediate portion 31c, the first other intermediate portion 31d, and the first other portion 31b. With such a structure, the first wiring portion 31P becomes soft. As a result, even if stress occurs in the first wiring portion 31P, the effect on the first intermediate member 41 is suppressed. As a result, unintended displacement of the movable portion 11M can be suppressed. Stable operation can be obtained. For example, highly accurate detection can be achieved. According to the embodiment, a sensor capable of improving characteristics can be provided.

[0017] In one example, the first intermediate member 41 deforms in response to a detection target around the element portion 10A. For example, a detection target (such as a gas) causes a change in volume of a portion of the first intermediate member 41. This causes the first intermediate member 41 to deform. As the first intermediate member 41 deforms, the movable portion 11M is displaced. For example, the distance between the fixed electrode 51E and the first movable conductive layer 11L changes. This causes a change in the capacitance between the fixed electrode 51E and the first movable conductive layer 11L. The detection target can be detected by detecting the change in capacitance. The sensor 110 is, for example, a gas sensor.

[0018] The displacement of the movable part 11M may be detected, for example, optically. In this case, the fixed electrode 51E may be omitted. In this case, the first movable conductive layer 11L included in the movable part 11M may function, for example, as a heater for removing unnecessary substances (such as water).

[0019] As shown in FIG. 2, the first intermediate member 41 may include a first intermediate member layer 41L. The first intermediate member layer 41L may include at least one selected from the group consisting of Pd and Pt, for example. The first intermediate member layer 41L functions as a catalyst, for example. The first intermediate member layer 41L may further include Si and Cu, for example. The first intermediate member layer 41L may include, for example, PdCuSi, etc. For example, hydrogen is stored.

[0020] As described above, the first wiring portion 31P includes the first portion 31a, the first intermediate portion 31c, the first other intermediate portion 31d, and the first other portion 31b. The first wiring portion 31P includes a folded structure. The number of folded structures is arbitrary. This makes the first wiring portion 31P flexible. For example, the first wiring portion 31P has a meandering structure with large folds. The folded structure can reduce displacement caused by warping, for example, even if the first wiring portion 31P has a warp.

[0021] For example, the spring constant of the first wiring portion 31P (first wiring portion spring constant) is smaller than the spring constant of the first support member 21S (first support member spring constant).

[0022] 1, the position of at least a part of the first wiring fixing portion 31F in the second direction D2 is between the position of the first intermediate portion 31c in the second direction D2 and the position of the first intermediate member 41 in the second direction D2. A long-distance folded-back structure is applied. The spring constant can be made smaller. 1, the first support member 21S may extend linearly, which makes it easy to obtain a large spring constant in the first support member 21S.

[0023] As shown in FIG. 1, the direction from the first intermediate member 41 to the first support member 21S intersects with the first direction D1 and intersects with the second direction D2.

[0024] 1, the first intermediate member 41 includes a first intermediate region 41a and a first other intermediate region 41b. The first other intermediate region 41b is between the first intermediate region 41a and the movable portion 11M. The movable portion 11M is connected to the first other intermediate region 41b. The first wiring portion 31P and the first support member 21S are connected to the first intermediate region 41a.

[0025] 1, the fixing portion 20 may further include a second wiring fixing portion 32F and a second fixing portion 22F. The element portion 10A may further include a second wiring portion 32P, a second support member 22S, and a second intermediate member 42. The second wiring portion 32P is supported by the second wiring fixing portion 32F and includes a second wiring 32L. The second support member 22S is supported by the second fixing portion 22F. The second intermediate member 42 is connected to the second wiring portion 32P and the second support member 22S. The second wiring 32L may be electrically connected to a conductive layer included in the movable portion 11M.

[0026] The movable portion 11M is provided between the first intermediate member 41 and the second intermediate member 42. The direction from the second intermediate member 42 to the second wiring fixing portion 32F is along the second direction D2.

[0027] The second wiring part 32P includes a second part 32a, a second intermediate part 32c, a second other intermediate part 32d, and a second other part 32b. The second part 32a is connected to the second wiring fixed part 32F. The second intermediate part 32c is connected to the second part 32a. The second other intermediate part 32d is connected to the second intermediate part 32c. The second other part 32b is connected to the second other intermediate part 32d.

[0028] The direction from the second portion 32a to the second intermediate portion 32c is along the second direction D2. The direction from the second other intermediate portion 32d to the second intermediate portion 32c is along the third direction D3. The direction from the second other portion 32b to the second other intermediate portion 32d is along the second direction D2. The second other portion 32b is connected to the second intermediate member 42.

[0029] A small spring constant is obtained in the second wiring portion 32P. For example, the spring constant of the second wiring portion 32P is smaller than the spring constant of the second support member 22S.

[0030] 2, the second intermediate member 42 may include a second intermediate member layer 42L. The second intermediate member layer 42L may include, for example, the same material as the first intermediate member layer 41L.

[0031] 1, the fixed portion 20 may further include a first opposing fixed portion 21AF. The element portion 10A may further include a first opposing wiring portion 31AP and a first opposing support member 21AS. The first opposing wiring portion 31AP is supported by the first wiring fixed portion 31F and includes a first opposing wiring 31AL. The first opposing support member 21AS is supported by the first opposing fixed portion 21AF. The first opposing wiring 31AL may be electrically connected to a conductive layer included in the movable portion 11M.

[0032] The first intermediate member 41 is connected to the first opposing wiring portion 31AP and the first opposing support member 21AS. The first intermediate member 41 is provided between the first opposing support member 21AS and the first support member 21S in the third direction D3.

[0033] As shown in FIG. 1, the first opposing wiring portion 31AP includes a first opposing portion 31Aa, a first opposing middle portion 31Ac, a first opposing other middle portion 31Ad, and a first opposing other portion 31Ab. The first opposing portion 31Aa is connected to the first wiring fixed portion 31F. The first opposing middle portion 31Ac is connected to the first opposing portion 31Aa. The first opposing other middle portion 31Ad is connected to the first opposing middle portion 31Ac. The first opposing other portion 31Ab is connected to the first opposing other middle portion 31Ad.

[0034] The direction from the first opposing middle portion 31Ac to the first opposing portion 31Aa is along the second direction D2. The direction from the first opposing other middle portion 31Ad to the first opposing middle portion 31Ac is along the third direction D3. The direction from the first opposing other middle portion 31Ad to the first opposing other portion 31Ab is along the second direction D2. The first opposing other portion 31Ab is connected to the first intermediate member 41.

[0035] A small spring constant is obtained in the first opposing wiring portion 31AP. For example, the spring constant of the first opposing wiring portion 31AP is smaller than the spring constant of the first opposing support member 21AS.

[0036] 1, the fixed portion 20 may further include a second opposing fixed portion 22AF. The element portion 10A may include a second opposing wiring portion 32AP and a second opposing support member 22AS. The second opposing wiring portion 32AP may be supported by a second wiring fixed portion 32F and may include a second opposing wiring 32AL. The second opposing support member 22AS is supported by the second opposing fixed portion 22AF. The second opposing wiring 32AL may be electrically connected to a conductive layer included in the movable portion 11M.

[0037] The second intermediate member 42 is connected to the second opposing wiring portion 32AP and the second opposing support member 22AS. The second intermediate member 42 is provided between the second support member 22S and the second opposing support member 22AS in the third direction D3.

[0038] The second opposing wiring portion 32AP includes a second opposing portion 32Aa, a second opposing middle portion 32Ac, a second opposing other middle portion 32Ad, and a second opposing other portion 32Ab. The second opposing portion 32Aa is connected to the second wiring fixed portion 32F. The second opposing middle portion 32Ac is connected to the second opposing portion 32Aa. The second opposing other middle portion 32Ad is connected to the second opposing middle portion 32Ac. The second opposing other portion 32Ab is connected to the second opposing other middle portion 32Ad.

[0039] The direction from the second facing portion 32Aa to the second facing middle portion 32Ac is along the second direction D2. The direction from the second facing middle portion 32Ac to the second facing other middle portion 32Ad is along the third direction D3. The direction from the second facing other portion 32Ab to the second facing other middle portion 32Ad is along the second direction D2. The second facing other portion 32Ab is connected to the second intermediate member 42.

[0040] A small spring constant is obtained in the second opposing wiring portion 32AP. For example, the spring constant of the second opposing wiring portion 32AP is smaller than the spring constant of the second opposing support member 22AS.

[0041] 1, the element portion 10A may further include a first connection member 41C. The first connection member 41C is supported by the first intermediate member 41. The first connection member 41C supports the movable portion 11M.

[0042] 1, the element portion 10A may further include a second connecting member 42C. The second connecting member 42C is supported by the second intermediate member 42. The second connecting member 42C supports the movable portion 11M.

[0043] 1, the element portion 10A may further include a first other connection member 41AC. The first other connection member 41AC is supported by the first intermediate member 41. The first other connection member 41AC supports the movable portion 11M.

[0044] 1, the element portion 10A may further include a second other connection member 42AC. The second other connection member 42AC is supported by the second intermediate member 42. The second other connection member 42AC supports the movable portion 11M.

[0045] 2, the element portion 10A may include an insulating member 11i. The insulating member 11i is provided, for example, around the first movable conductive layer 11L. The insulating member 11i is provided on the first wiring portion 31P or the like.

[0046] FIG. 3 is a schematic plan view illustrating the sensor according to the first embodiment. 3, in sensor 111 according to the embodiment, the position at which a wiring portion (e.g., first wiring portion 31P) and a wiring fixing portion (e.g., first wiring fixing portion 31F) are connected is different from the position in sensor 110. Except for this, the configuration of sensor 111 may be similar to the configuration of sensor 110.

[0047] FIG. 4 is a schematic plan view illustrating the sensor according to the first embodiment. 4, in sensor 112 according to the embodiment, the shape of a wiring portion (for example, first wiring portion 31P) is different from that in sensor 110. Except for this, the configuration of sensor 112 may be similar to the configuration of sensor 110.

[0048] FIG. 5 is a schematic plan view illustrating the sensor according to the first embodiment. 5, in the sensor 113 according to the embodiment, the first opposing wiring portion 31AP and the second opposing wiring portion 32AP are omitted. Except for this, the configuration of the sensor 113 may be similar to the configuration of the sensor 110.

[0049] FIG. 6 is a schematic plan view illustrating the sensor according to the first embodiment. As shown in FIG. 6, in sensor 114 according to the embodiment, the shape of the folded portion in the wiring portion (for example, first wiring portion 31P) is curved. The configuration of sensor 114 other than this may be the same as that of sensor 110. In sensors 111, 112, 113, and 114, unintended displacement of movable portion 11M can also be suppressed. Stable operation can be obtained. For example, highly accurate detection can be achieved. According to the embodiment, a sensor capable of improving characteristics is provided.

[0050] Second embodiment FIG. 7 is a schematic plan view illustrating the sensor according to the second embodiment. 7, the sensor 120 according to the embodiment includes a base body 50s, a fixed portion 20 fixed to the base body 50s, and an element portion 10A. The cross-sectional structure of the sensor 120 may be similar to the cross-sectional structure described with reference to FIG.

[0051] The fixing portion 20 includes a first wiring fixing portion 31F and a first fixing portion 21F. The element portion 10A includes a first wiring portion 31P supported by the first wiring fixing portion 31F and including a first wiring 31L, a first support member 21S supported by the first fixing portion 21F, a first intermediate member 41 connected to the first wiring portion 31P and the first support member 21S, and a movable portion 11M. The movable portion 11M is connected to the first intermediate member 41. The movable portion 11M includes a first movable conductive layer 11L electrically connected to the first wiring 31L (see FIG. 2). A first gap g1 is provided between the base 50s and the element portion 10A (see FIG. 2).

[0052] In the sensor 120, a second direction D2 from the first wiring fixing portion 31F to the first intermediate member 41 intersects with a first direction D1 from the base 50s to the first wiring fixing portion 31F.

[0053] The first wiring portion 31P includes a first portion 31a connected to the first wiring fixing portion 31F, a first intermediate portion 31c connected to the first portion 31a, a first other intermediate portion 31d connected to the first intermediate portion 31c, and a first other portion 31b connected to the first other intermediate portion 31d.

[0054] In the sensor 120, the direction from the first portion 31a to the first intermediate portion 31c is along a third direction D3 that intersects with a plane including the first direction D1 and the second direction D2. The direction from the first intermediate portion 31c to the first other intermediate portion 31d is along the second direction D2. The direction from the first other portion 31b to the first other intermediate portion 31d is along the second direction D2. The first other portion 31b is connected to the first intermediate member 41.

[0055] The first intermediate member 41 includes a first connection region 41p connected to the first other portion 31b. The position of the first connection region 41p in the third direction D3 is between the position of the first portion 31a in the third direction D3 and the position of the first other intermediate portion 31d in the third direction D3.

[0056] In the first wiring portion 31P having such a structure, a small spring constant is obtained. For example, the spring constant of the first wiring portion 31P is smaller than the spring constant of the first support member 21S. In the sensor 120, for example, unintended displacement of the movable portion 11M can be suppressed. Stable operation can be obtained. For example, highly accurate detection can be achieved. According to the embodiment, a sensor capable of improving characteristics can be provided.

[0057] In the sensor 120, the element portion 10A may also include a second wiring portion 32P, a first opposing wiring portion 31AP, and a second opposing wiring portion 32AP. These wiring portions in the sensor 120 may have the same configuration as the first wiring portion 31P in the sensor 120.

[0058] For example, in the sensor 120, the element portion 10A may further include a first connecting member 41C. The first connecting member 41C is supported by the first intermediate member 41. The first connecting member 41C supports the movable portion 11M.

[0059] In the first and second embodiments, for example, the length of the first wiring portion 31P along the path along which the first wiring portion 31P extends (first wiring length) is longer than the length of the first support member 21S along the path along which the first support member 21S extends (first support member length). A small spring constant is easily obtained in the first wiring portion 31P.

[0060] Third embodiment FIG. 8 is a schematic plan view illustrating the sensor according to the third embodiment. FIG. 9 is a schematic cross-sectional view illustrating the sensor according to the third embodiment. As shown in FIG. FIG. 9 is a cross-sectional view taken along line B1-B2 in FIG. 8 and 9, a sensor 130 according to the embodiment includes a base body 50s, a fixed portion 20, and an element portion 10A. The fixed portion 20 is fixed to the base body 50s.

[0061] The fixed portion 20 includes a first wiring fixing portion 31F and a first fixed portion 21F. The element portion 10A includes a first wiring portion 31P, a first support member 21S, and a movable portion 11M. The first wiring portion 31P is supported by the first wiring fixing portion 31F and includes a first wiring 31L. The first support member 21S is supported by the first fixed portion 21F. The movable portion 11M is connected to the first wiring portion 31P and the first support member 21S. The movable portion 11M includes a first movable conductive layer 11L electrically connected to the first wiring 31L. A first gap g1 is provided between the base 50s and the element portion 10A.

[0062] A second direction D2 from the first wiring fixing portion 31F to the movable portion 11M intersects with a first direction D1 from the base body 50s to the first wiring fixing portion 31F. The first direction D1 is, for example, the Z-axis direction. The second direction D2 is, for example, the X-axis direction.

[0063] The first wiring portion 31P includes a first portion 31a connected to the first wiring fixing portion 31F, a first intermediate portion 31c connected to the first portion 31a, a first other intermediate portion 31d connected to the first intermediate portion 31c, and a first other portion 31b connected to the first other intermediate portion 31d.

[0064] The direction from the first intermediate portion 31c to the first portion 31a is along the second direction D2. The direction from the first intermediate portion 31c to the first other intermediate portion 31d is along the third direction D3 that intersects with a plane including the first direction D1 and the second direction D2. The third direction D3 is, for example, the Y-axis direction. The direction from the first other intermediate portion 31d to the first other portion 31b is along the second direction D2. The first other portion 31b is connected to the movable portion 11M.

[0065] In the sensor 130, a small spring constant is obtained in the first wiring portion 31P. For example, the spring constant of the first wiring portion 31P is smaller than the spring constant of the first support member 21S. In the sensor 120, for example, unintended displacement of the movable portion 11M can be suppressed. Stable operation can be obtained. For example, highly accurate detection can be achieved. According to the embodiment, a sensor capable of improving characteristics can be provided.

[0066] In the sensor 130, the temperature state of the movable part 11M changes depending on the detection target around the element part 10A. For example, thermal conduction occurs due to the detection target (e.g., gas, etc.). Heat dissipation changes depending on the type and concentration of the detection target. The temperature of the movable part 11M changes depending on the change in heat dissipation. For example, the first movable conductive layer 11L may function as a heater. The heater increases the temperature of the movable part 11M. The temperature of the movable part 11M changes depending on the detection target.

[0067] In the embodiment, the detection of the change in temperature may be performed by any method. In one example, the temperature of the movable part 11M may be detected by an infrared temperature sensor or the like. In another example, a resistive layer may be provided for temperature detection.

[0068] As shown in FIG. 8 and FIG. 9, in this example, the movable part 11M further includes a second movable conductive layer 12L. The electrical resistance of the second movable conductive layer 12L changes depending on the detection target. The second movable conductive layer 12L functions as, for example, a resistive element. By detecting the change in the resistance of the second movable conductive layer 12L, the change in the temperature of the movable part 11M can be detected. By detecting the change in the resistance of the second movable conductive layer 12L, the detection target can be detected. In this example, the second movable conductive layer 12L is connected to an external circuit via the first opposing wiring 31AL. The sensor 130 functions as, for example, a thermal conduction type sensor. The sensor 130 functions as, for example, a resistance type sensor.

[0069] In the sensor 130, the second movable conductive layer 12L may be a catalyst layer capable of reacting with the detection target. In this case, the second movable conductive layer 12L (catalyst layer) may be provided with a large area so as to cover the first movable conductive layer 11L. In this case, the sensor 130 functions as, for example, a reducing gas combustion reaction type sensor. In one example, the second movable conductive layer 12L (catalyst layer) may be exposed.

[0070] In the sensor 130, the element portion 10A may also include a second wiring portion 32P, a first opposing wiring portion 31AP, and a second opposing wiring portion 32AP. These wiring portions in the sensor 120 may have the same configuration as the first wiring portion 31P in the sensor 130.

[0071] For example, in the sensor 130, the element portion 10A may further include a first connecting member 41C. The first connecting member 41C is supported by the first intermediate member 41. The first connecting member 41C supports the movable portion 11M.

[0072] In the third embodiment, for example, the length of the first wiring portion 31P along the path along which the first wiring portion 31P extends (first wiring length) is longer than the length of the first support member 21S along the path along which the first support member 21S extends (first support member length). A small spring constant is easily obtained in the first wiring portion 31P.

[0073] FIG. 10 is a schematic plan view illustrating the sensor according to the third embodiment. 10, in a sensor 131 according to the embodiment, a recess is provided in a wiring portion. Except for this, the configuration of the sensor 131 may be similar to the configuration of the sensor .

[0074] In the sensor 131, for example, the first wiring portion 31P includes a first recess 31v. This makes the movable portion 11M less susceptible to the effect of the stress of the first wiring portion 31P. The second wiring portion 32P may include a second recess 32v. The first opposing wiring portion 31AP may include a first opposing recess 31Av. The second opposing wiring portion 32AP may include a second opposing recess 32Av.

[0075] The embodiments may include the following technical solutions. (Technical proposal 1) A substrate; A fixing portion fixed to the base body; An element portion; Equipped with the fixing portion includes a first wiring fixing portion and a first fixing portion, The element portion is a first wiring portion supported by the first wiring fixing portion and including a first wiring; A first support member supported by the first fixed portion; a first intermediate member connected to the first wiring portion and the first support member; a movable part connected to the first intermediate member, the movable part including a first movable conductive layer electrically connected to the first wiring; Including, a first gap is provided between the base and the element portion, a second direction from the first wiring fixing portion to the first intermediate member intersects with a first direction from the base to the first wiring fixing portion, The first wiring portion is a first portion connected to the first wiring fixing portion; a first intermediate portion connected to the first portion; a first other intermediate portion connected to the first intermediate portion; a first other portion connected to the first other intermediate portion; Including, a direction from the first intermediate portion to the first portion is along the second direction; a direction from the first intermediate portion to the first other intermediate portion is along a third direction intersecting a plane including the first direction and the second direction; a direction from the first other intermediate portion to the first other portion is along the second direction, The first other portion is a sensor connected to the first intermediate member.

[0076] (Technical proposal 2) A sensor as described in Technical Solution 1, wherein a direction from the first intermediate member to the first support member intersects with the first direction and intersects with the second direction.

[0077] (Technical proposal 3) The sensor according to technical proposal 1 or 2, wherein the first support member extends linearly.

[0078] (Technical proposal 4) The first intermediate member includes a first intermediate region and a first other intermediate region, the first other intermediate region is between the first intermediate region and the movable portion, The movable portion is connected to the first other intermediate region, The sensor according to any one of Technical Solutions 1 to 3, wherein the first wiring portion and the first support member are connected to the first intermediate region.

[0079] (Technical proposal 5) Further comprising a fixed electrode fixed to the substrate, the first intermediate member is deformed in response to a detection target around the element portion, The sensor according to any one of Technical Solutions 1 to 4, wherein the capacitance between the fixed electrode and the first movable conductive layer changes.

[0080] (Technical proposal 6) the first intermediate member includes a first intermediate member layer; The sensor described in technical proposal 5, wherein the first intermediate material layer includes at least one selected from the group consisting of Pd and Pt.

[0081] (Technical proposal 7) The sensor described in technical proposal 6, wherein the first intermediate material layer further contains Si and Cu.

[0082] (Technical proposal 8) The sensor according to any one of Technical Solutions 1 to 7, wherein a first wiring portion spring constant of the first wiring portion is smaller than a first support member spring constant of the first support member.

[0083] (Technical proposal 9) A sensor described in any one of Technical Proposals 5 to 8, wherein the position of at least a portion of the first wiring fixing portion in the second direction is between the position of the first intermediate portion in the second direction and the position of the first intermediate member in the second direction.

[0084] (Technical proposal 10) The fixing portion further includes a second wiring fixing portion and a second fixing portion, The element portion is a second wiring portion supported by the second wiring fixing portion and including a second wiring; A second support member supported by the second fixed portion; a second intermediate member connected to the second wiring portion and the second support member; Including, The movable portion is provided between the first intermediate member and the second intermediate member, a direction from the second intermediate member to the second wiring fixed portion is along the second direction, The second wiring portion is a second portion connected to the second wiring fixing portion; a second intermediate portion connected to the second portion; a second other intermediate portion connected to the second intermediate portion; a second other portion connected to the second other intermediate portion; Including, a direction from the second portion to the second intermediate portion is along the second direction; a direction from the second other intermediate portion to the second intermediate portion is along the third direction, a direction from the second other portion to the second other intermediate portion is along the second direction, The sensor according to any one of Technical Solutions 5 to 9, wherein the second other portion is connected to the second intermediate member.

[0085] (Technical proposal 11) The fixing portion further includes a first opposing fixing portion, The element portion is a first opposing wiring portion supported by the first wiring fixing portion and including a first opposing wiring; A first opposing support member supported by the first opposing fixing portion; the first intermediate member is connected to the first opposing wiring portion and the first opposing support member, the first intermediate member is provided between the first opposing support member and the first support member in the third direction, The first opposing wiring portion is a first opposing portion connected to the first wiring fixing portion; a first opposed intermediate portion connected to the first opposed portion; a first opposing other intermediate portion connected to the first opposing intermediate portion; a first opposing other portion connected to the first opposing other intermediate portion; Including, a direction from the first opposing intermediate portion to the first opposing portion is along the second direction, a direction from the first opposing other middle portion to the first opposing middle portion is along the third direction, a direction from the first opposing other intermediate portion to the first opposing other portion is along the second direction, The sensor described in Technical Solution 10, wherein the first opposing other portion is connected to the first intermediate member.

[0086] (Technical proposal 12) The fixing portion further includes a second opposing fixing portion, The element portion is a second opposing wiring portion supported by the second wiring fixing portion and including a second opposing wiring; A second opposing support member supported by the second opposing fixing portion; Including, the second intermediate member is connected to the second opposing wiring portion and the second opposing support member, the second intermediate member is provided between the second support member and the second opposing support member in the third direction, The second opposing wiring portion is a second opposing portion connected to the second wiring fixing portion; a second opposed intermediate portion connected to the second opposed portion; a second opposing other intermediate portion connected to the second opposing intermediate portion; a second opposing other portion connected to the second opposing other intermediate portion; Including, a direction from the second opposing portion to the second opposing intermediate portion is along the second direction, a direction from the second opposing intermediate portion to the second opposing other intermediate portion is along the third direction, a direction from the second opposing other portion to the second opposing other intermediate portion is along the second direction, The sensor described in Technical Proposal 11, wherein the second opposing other portion is connected to the second intermediate member.

[0087] (Technical proposal 13) A substrate; A fixing portion fixed to the base body; An element portion; Equipped with the fixing portion includes a first wiring fixing portion and a first fixing portion, The element portion is a first wiring portion supported by the first wiring fixing portion and including a first wiring; A first support member supported by the first fixed portion; a first intermediate member connected to the first wiring portion and the first support member; a movable part connected to the first intermediate member, the movable part including a first movable conductive layer electrically connected to the first wiring; Including, a first gap is provided between the base and the element portion, a second direction from the first wiring fixing portion to the first intermediate member intersects with a first direction from the base to the first wiring fixing portion, The first wiring portion is a first portion connected to the first wiring fixing portion; a first intermediate portion connected to the first portion; a first other intermediate portion connected to the first intermediate portion; a first other portion connected to the first other intermediate portion; Including, a direction from the first portion to the first intermediate portion is along a third direction intersecting a plane including the first direction and the second direction; a direction from the first intermediate portion to the first other intermediate portion is along the second direction, a direction from the first other portion to the first other intermediate portion is along the second direction, the first other portion is connected to the first intermediate member, the first intermediate member includes a first connection region connected to the first other portion, A sensor wherein a position of the first connection region in the third direction is between a position of the first portion in the third direction and a position of the first other intermediate portion in the third direction.

[0088] (Technical proposal 14) the element portion further includes a first connection member, the first connection member is supported by the first intermediate member, The sensor according to any one of Technical Solutions 1 to 12, wherein the first connecting member supports the movable part.

[0089] (Technical proposal 15) A substrate; A fixing portion fixed to the base body; An element portion; Equipped with the fixing portion includes a first wiring fixing portion and a first fixing portion, The element portion is a first wiring portion supported by the first wiring fixing portion and including a first wiring; A first support member supported by the first fixed portion; a movable portion connected to the first wiring portion and the first support member, the movable portion including a first movable conductive layer electrically connected to the first wiring; Including, a first gap is provided between the base and the element portion, a second direction from the first wiring fixing portion to the movable portion intersects with a first direction from the base to the first wiring fixing portion, The first wiring portion is a first portion connected to the first wiring fixing portion; a first intermediate portion connected to the first portion; a first other intermediate portion connected to the first intermediate portion; a first other portion connected to the first other intermediate portion; Including, a direction from the first intermediate portion to the first portion is along the second direction; a direction from the first intermediate portion to the first other intermediate portion is along a third direction intersecting a plane including the first direction and the second direction; a direction from the first other intermediate portion to the first other portion is along the second direction, The first other portion is a sensor connected to the movable portion.

[0090] (Technical proposal 16) The sensor described in Technical Proposal 15, wherein the temperature state of the movable part changes depending on the detection target around the element part.

[0091] (Technical proposal 17) The movable portion further includes a second movable conductive layer, The sensor described in Technical Proposal 16, wherein the electrical resistance of the second movable conductive layer changes depending on the object to be detected.

[0092] (Technical proposal 18) The sensor described in Technical Proposal 16, wherein the movable part includes a catalyst layer capable of reacting with the object to be detected.

[0093] (Technical proposal 19) The sensor according to any one of Technical Solutions 15 to 18, wherein a first wiring portion spring constant of the first wiring portion is smaller than a first support member spring constant of the first support member.

[0094] (Technical proposal 20) A sensor described in any one of Technical Proposals 1 to 19, wherein a first wiring length of the first wiring portion along the path along which the first wiring portion extends is longer than a first support member length of the first support member along the path along which the first support member extends.

[0095] According to the embodiment, a sensor capable of improving characteristics can be provided.

[0096] The above describes the embodiment of the present invention with reference to specific examples. However, the present invention is not limited to these specific examples. For example, the specific configurations of each element included in the sensor, such as the base body, element unit, fixed electrode, fixed unit, wiring unit, support member, and movable unit, are included in the scope of the present invention as long as a person skilled in the art can implement the present invention in the same way and obtain the same effect by appropriately selecting them from the known range.

[0097] Any combination of two or more elements of each embodiment, within the scope of technical feasibility, is also included within the scope of the present invention as long as it includes the gist of the present invention.

[0098] In addition, all sensors that can be implemented by a person skilled in the art by appropriately modifying the design based on the sensor described above as an embodiment of the present invention also belong to the scope of the present invention as long as they include the gist of the present invention.

[0099] In addition, within the scope of the concept of the present invention, a person skilled in the art may think of various modifications and alterations, and it will be understood that these modifications and alterations also fall within the scope of the present invention.

[0100] Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and spirit of the invention, and are included in the scope of the invention and its equivalents described in the claims. [Explanation of symbols]

[0101] 10A: Element part, 11L, 12L: First and second movable conductive layers, 11M: Movable part, 11i: Insulating member, 20: Fixed part, 21AF, 22AF: First and second opposing fixed parts, 21AS, 22AS: First and second opposing support members, 21F, 22F: First and second fixed parts, 21S, 22S: First and second support members, 31AL, 32AL: First and second opposing wirings, 31AP, 32AP: First and second opposing wiring parts, 31Aa, 32Aa: First and second opposing portions, 31Ab, 32Ab: First and second other opposing parts, 31Ac, 32Ac: First and second opposing intermediate parts, 31Ad, 32Ad: First and second other opposing intermediate parts, 31Av, 32Av: First and second opposing concave parts, 31F, 32F: First and second wiring fixing parts, 31L, 32L: First and second wirings, 31P, 32P: First and second wiring parts, 31a, 32a: First and second portions, 31b, 32b: First and second other parts, 31c, 32c: First and second intermediate parts, 31d, 32d: First and second other intermediate parts, 31v, 31v: First and second concave parts, 41, 42: First and second intermediate members, 41AC, 42AC: First and second other connection members, 41C, 42C: First and second connection members, 41L, 42L: First and second intermediate member layers, 41a: First intermediate region, 41b: First other intermediate region, 41p: First connection region, 50s: Substrate, 51E: Fixed electrode, 110~131: Sensors, D1~D3: First to third directions, g1: First gap

Claims

1. A substrate; A fixing portion fixed to the base body; An element portion; Equipped with the fixing portion includes a first wiring fixing portion and a first fixing portion, The element portion is a first wiring portion supported by the first wiring fixing portion and including a first wiring; A first support member supported by the first fixed portion; a first intermediate member connected to the first wiring portion and the first support member; a movable part connected to the first intermediate member, the movable part including a first movable conductive layer electrically connected to the first wiring; Including, a first gap is provided between the base and the element portion, a second direction from the first wiring fixing portion to the first intermediate member intersects with a first direction from the base to the first wiring fixing portion, The first wiring portion is a first portion connected to the first wiring fixing portion; a first intermediate portion connected to the first portion; a first other intermediate portion connected to the first intermediate portion; a first other portion connected to the first other intermediate portion; Including, a direction from the first intermediate portion to the first portion is along the second direction; a direction from the first intermediate portion to the first other intermediate portion is along a third direction intersecting a plane including the first direction and the second direction; a direction from the first other intermediate portion to the first other portion is along the second direction, The first other portion is a sensor connected to the first intermediate member.

2. The sensor according to claim 1 , wherein a direction from the first intermediate member to the first support member intersects the first direction and intersects the second direction.

3. The first intermediate member includes a first intermediate region and a first other intermediate region, the first other intermediate region is between the first intermediate region and the movable portion, The movable portion is connected to the first other intermediate region, The sensor according to claim 1 , wherein the first wiring portion and the first support member are connected to the first intermediate region.

4. Further comprising a fixed electrode fixed to the substrate, the first intermediate member is deformed in response to a detection target around the element portion, The sensor of claim 1 , wherein a capacitance between the fixed electrode and the first movable conductive layer varies.

5. the first intermediate member includes a first intermediate member layer; The sensor of claim 4 , wherein the first intermediate member layer comprises at least one selected from the group consisting of Pd and Pt.

6. 6. The sensor according to claim 1, wherein a first wiring portion spring constant of the first wiring portion is smaller than a first support member spring constant of the first support member.

7. The sensor according to claim 4 , wherein a position of at least a portion of the first wiring fixing portion in the second direction is between a position of the first intermediate portion in the second direction and a position of the first intermediate member in the second direction.

8. A substrate; A fixing portion fixed to the base body; An element portion; Equipped with the fixing portion includes a first wiring fixing portion and a first fixing portion, The element portion is a first wiring portion supported by the first wiring fixing portion and including a first wiring; A first support member supported by the first fixed portion; a first intermediate member connected to the first wiring portion and the first support member; a movable part connected to the first intermediate member, the movable part including a first movable conductive layer electrically connected to the first wiring; Including, a first gap is provided between the base and the element portion, a second direction from the first wiring fixing portion to the first intermediate member intersects with a first direction from the base to the first wiring fixing portion, The first wiring portion is a first portion connected to the first wiring fixing portion; a first intermediate portion connected to the first portion; a first other intermediate portion connected to the first intermediate portion; a first other portion connected to the first other intermediate portion; Including, a direction from the first portion to the first intermediate portion is along a third direction intersecting a plane including the first direction and the second direction; a direction from the first intermediate portion to the first other intermediate portion is along the second direction; a direction from the first other portion to the first other intermediate portion is along the second direction, the first other portion is connected to the first intermediate member, the first intermediate member includes a first connection region connected to the first other portion, A sensor wherein a position of the first connection region in the third direction is between a position of the first portion in the third direction and a position of the first other intermediate portion in the third direction.

9. A substrate; A fixing portion fixed to the base body; An element portion; Equipped with the fixing portion includes a first wiring fixing portion and a first fixing portion, The element portion is a first wiring portion supported by the first wiring fixing portion and including a first wiring; A first support member supported by the first fixed portion; a movable portion connected to the first wiring portion and the first support member, the movable portion including a first movable conductive layer electrically connected to the first wiring; Including, a first gap is provided between the base and the element portion, a second direction from the first wiring fixing portion to the movable portion intersects with a first direction from the base to the first wiring fixing portion, The first wiring portion is a first portion connected to the first wiring fixing portion; a first intermediate portion connected to the first portion; a first other intermediate portion connected to the first intermediate portion; a first other portion connected to the first other intermediate portion; Including, a direction from the first intermediate portion to the first portion is along the second direction; a direction from the first intermediate portion to the first other intermediate portion is along a third direction intersecting a plane including the first direction and the second direction; a direction from the first other intermediate portion to the first other portion is along the second direction, The first other portion is a sensor connected to the movable portion.

10. The sensor according to claim 9 , wherein a temperature state of the movable portion changes in response to a detection target around the element portion.

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