Resin composition

Abstract

To provide a resin composition that can give a cured product to resist warping and show good adhesion to a conductor layer.SOLUTION: A resin composition comprises (A) epoxy resin, (B) inorganic filler, and (C) elastomers, the (A) epoxy resin including (A-1) epoxy resin having an epoxy group and a chelate forming capacity.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a resin composition, and a cured product, a resin sheet, a circuit board, a semiconductor chip package, and a semiconductor device using the resin composition. [Background technology]

[0002] In recent years, the demand for small, highly functional electronic devices such as smartphones and tablet devices has been increasing, and accordingly, there is a demand for even higher functionality in encapsulants for semiconductor chip packages used in these small electronic devices. As such encapsulants, those formed by curing a resin composition are known. On the other hand, Patent Documents 1 and 2 disclose techniques for applications other than sealing materials. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2018-80221 A [Patent Document 2] Patent No. 5491276 Summary of the Invention [Problem to be solved by the invention]

[0004] Resin compositions used for sealing materials generally contain an inorganic filler for the purpose of improving insulating properties and sealing properties, etc. Cured products of resin compositions containing such inorganic fillers tend to cause significant warping.

[0005] If the cured product contains a fiber base material like a prepreg, the fiber base material acts to increase the rigidity of the entire cured product and reduce thermal expansion, which is thought to suppress warping. However, since encapsulants usually do not contain a fiber base material, it has been difficult to suppress warping.

[0006] Therefore, the present inventors attempted to suppress warpage by lowering the elastic modulus of the cured resin composition. Specifically, they attempted to suppress warpage by adopting a resin composition containing an elastomer, thereby lowering the elastic modulus of the cured resin composition. As a result, suppression of warpage was achieved. However, the cured resin composition containing an elastomer had poor adhesion to the conductor layer.

[0007] Therefore, the present inventors conducted further research and attempted to improve adhesion by combining an adhesion imparting agent with an elastomer. However, when the adhesion imparting agent was used, although the adhesion was improved, the warpage increased. Therefore, it was difficult to achieve both suppression of warpage and improvement of adhesion with conventional sealing materials.

[0008] The present invention has been devised in view of the above problems, and has an object to provide a resin composition that can give a cured product that is suppressed in warping and has excellent adhesion to a conductor layer; a cured product of the resin composition; and a resin sheet, a circuit board, a semiconductor chip package, and a semiconductor device that each use the resin composition. [Means for solving the problem]

[0009] The present inventors have conducted extensive research to solve the above-mentioned problems, and as a result, have found that the above-mentioned problems can be solved by a resin composition comprising (A) an epoxy resin, (B) an inorganic filler, and (C) an elastomer, in which the epoxy resin (A) comprises (A-1) an epoxy resin containing an epoxy group and a structure having chelating ability, and have completed the present invention. That is, the present invention includes the following.

[0010] [1] A composition comprising (A) an epoxy resin, (B) an inorganic filler, and (C) an elastomer, A resin composition, wherein the (A) epoxy resin comprises (A-1) an epoxy resin containing an epoxy group and a structure having chelate forming ability. [2] The resin composition according to [1], wherein the amount of chelate modification of the component (A-1) is 0.3% by mass to 10% by mass. [3] The resin composition according to [1] or [2], in which the ratio W(A-1) / W(C) of the mass W(A-1) of the component (A-1) to the mass W(C) of the component (C) is 0.01 to 1.0. [4] The resin composition according to any one of [1] to [3], wherein the amount of the component (B) is 40 mass % or more relative to 100 mass % of the non-volatile components of the resin composition. [5] The resin composition according to any one of [1] to [4], wherein the component (C) has a number average molecular weight of 1,000 or more. [6] The resin composition according to any one of [1] to [5], further comprising (D) a curing agent. [7] The resin composition according to any one of [1] to [6], further comprising (E) a curing accelerator. [8] The resin composition according to any one of [1] to [7], which is for use in a sealing layer. [9] A cured product of the resin composition according to any one of [1] to [8].

[10] A resin sheet comprising a support and a resin composition layer formed on the support, the resin composition layer comprising the resin composition according to any one of [1] to [8].

[11] A circuit board comprising a cured product of the resin composition according to any one of [1] to [8].

[12] A semiconductor chip package comprising a cured product of the resin composition according to any one of [1] to [8].

[13] A semiconductor device comprising the circuit board according to

[11] or the semiconductor chip package according to

[12] . Effect of the Invention

[0011] According to the present invention, it is possible to provide a resin composition which can give a cured product which is excellent in suppressing warping and in adhesion to a conductor layer; a cured product of the resin composition; and a resin sheet, a circuit board, a semiconductor chip package, and a semiconductor device which use the resin composition. [Brief description of the drawings]

[0012] [Figure 1]FIG. 1 is a cross-sectional view showing a schematic diagram of a fan-out type WLP as an example of a semiconductor chip package according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] The present invention will be described below with reference to embodiments and examples. However, the present invention is not limited to the embodiments and examples shown below, and may be modified and implemented as desired without departing from the scope of the claims and their equivalents.

[0014] [1. Overview of resin composition] A resin composition according to one embodiment of the present invention contains a combination of (A) an epoxy resin, (B) an inorganic filler, and (C) an elastomer. The epoxy resin (A) contains (A-1) an epoxy resin containing an epoxy group and a structure capable of forming a chelate. In the following description, "(A-1) an epoxy resin containing an epoxy group and a structure capable of forming a chelate" may be referred to as "(A-1) a chelate-type epoxy resin." In addition, in the following description, "a structure capable of forming a chelate" may be referred to as "a structure capable of forming a chelate."

[0015] The resin composition according to the present embodiment can be thermally cured to obtain a cured product. The obtained cured product can suppress warping and has excellent adhesion to the conductor layer. Furthermore, the cured product of the resin composition according to the present embodiment can usually have excellent adhesion to silicon. Furthermore, the resin composition according to the present embodiment preferably has a low minimum melt viscosity, and preferably can obtain a cured product with a small tensile modulus.

[0016] The resin composition according to the present embodiment may further contain any optional components in combination with the above-mentioned components. For example, the resin composition may contain (D) a curing agent, (E) a curing accelerator, etc.

[0017] [2. (A) Epoxy resin] The resin composition according to the present embodiment contains an epoxy resin (A) as component (A). The epoxy resin (A) is a curable resin having an epoxy group.

[0018] The epoxy resin (A) according to this embodiment contains a chelate-type epoxy resin (A-1) as the component (A-1). The chelate-type epoxy resin (A-1) contains an epoxy group and a chelating structure.

[0019] The chelating structure refers to a structure having a chelate forming ability. This chelating structure usually contains at least one atom selected from the group consisting of oxygen and nitrogen. In the following description, the atom selected from the group consisting of oxygen and nitrogen may be called a "specific atom". One chelating structure usually contains a plurality of specific atoms. Since a plurality of specific atoms are generally not directly bonded, there is a molecular chain connecting the specific atoms between the specific atoms. That is, the specific atoms are usually connected by a molecular chain. Here, the atoms contained in the molecular chain do not include oxygen atoms and nitrogen atoms. The number of atoms in the molecular chain is usually 1 or more, preferably 2 or more, and preferably 6 or less. Here, the number of atoms in the molecular chain connecting the specific atoms represents the minimum number of atoms between the specific atoms connected by the molecular chain. Therefore, even if a branched chain branched from the molecular chain is bonded to the molecular chain, the number of atoms contained in the branched chain is not included in the number of atoms in the molecular chain. Therefore, the chelating structure may be a structure containing adjacent specific atoms preferably via 1 to 6, more preferably 2 to 6 atoms. In this chelating structure, some or all of the specific atoms may function as coordination atoms.

[0020] The chelating structure preferably contains an oxygen atom as the specific atom. At least one of the oxygen atoms as the specific atom is more preferably derived from a hydroxy group, that is, it is more preferable that the chelating structure contains a hydroxy group, and the oxygen atom contained in the hydroxy group is the specific atom of the chelating structure. It is more preferable that at least one of the oxygen atoms as the specific atom is derived from a carbonyl group, that is, it is more preferable that the chelating structure contains a carbonyl group, and the oxygen atom contained in the carbonyl group is the specific atom of the chelating structure.

[0021] When the chelating structure contains a plurality of oxygen atoms, it is preferable that the oxygen atoms include oxygen atoms linked by a molecular chain of two atoms. That is, it is preferable that two oxygen atoms contained in the chelating structure are adjacent to each other via two atoms. The chelating structure may contain only one pair of two oxygen atoms adjacent to each other via two atoms as described above, or may contain two or more pairs.

[0022] The chelating structure usually contains a carbon atom and a hydrogen atom in combination with a specific atom. The chelating structure may further contain any heteroatom other than an oxygen atom and a nitrogen atom. Examples of the optional heteroatom that is preferably contained in the chelating structure include a phosphorus atom and a sulfur atom. The type of the optional heteroatom may be one type or two or more types. The number of the optional heteroatom may be one or two or more.

[0023] Specific examples of preferred chelating structures include a carboxyl group and a phosphate group. Among these, a phosphate group is more preferred. The chelating structure may be present in any of the basic skeleton, side chains, or terminals of the (A-1) chelating epoxy resin. The (A-1) chelating epoxy resin may contain one type of chelating structure or two or more types. The (A-1) chelating epoxy resin may contain one or two or more chelating structures in one molecule.

[0024] The number of epoxy groups contained in one molecule of the chelate type epoxy resin (A-1) may be one or more.

[0025] The (A-1) chelate type epoxy resin preferably contains an aromatic structure in its molecule. The aromatic structure is a chemical structure generally defined as aromatic, and includes polycyclic aromatic rings and aromatic heterocycles. When the (A-1) chelate type epoxy resin containing an aromatic ring structure is used, the heat resistance of the cured product of the resin composition can be improved.

[0026] The (A-1) chelate type epoxy resin may contain a structure obtained by reacting an epoxy resin not containing a chelating structure with a compound containing a chelating structure. For example, the (A-1) chelate type epoxy resin containing a phosphoric acid group may contain a structure obtained by reacting an epoxy resin not containing a chelating structure with phosphoric acid. Examples of phosphoric acid include phosphoric acid (H 3 PO 4 ), phosphonic acid (H 3 PO 3 ), magnetophosphorous acid (H 3 PO 2 ), diphosphate (H 4 P 2 O 7 ), and polyphosphates such as triphosphate.

[0027] The (A-1) chelate type epoxy resin can be produced, for example, by a method including glycidyl etherifying the hydroxyl group of a compound having a phenolic or alcoholic hydroxyl group and a chelating structure. The (A-1) chelate type epoxy resin can also be produced, for example, by a method including reacting an epoxy resin that does not contain a chelating structure with a compound that contains a chelating structure. As a specific example, the (A-1) chelate type epoxy resin containing a phosphoric acid group can be produced by the method described in WO 2021 / 039380.

[0028] In the method for producing the chelate-type epoxy resin (A-1) which includes reacting an epoxy resin not containing a chelate-type structure with a compound containing a chelate-type structure, the compound containing a chelate-type structure is usually reacted with the epoxy group of the epoxy resin to obtain the chelate-type epoxy resin (A-1). In this case, the reaction amount of the compound containing a chelate-type structure is represented by the chelate-modified amount. Specifically, the chelate-modified amount is represented by the ratio of the compound containing a chelate-type structure reacted with the epoxy resin to 100% by mass of the epoxy resin not containing a chelate-type structure. The chelate-modified amount is preferably 0.3% by mass or more, more preferably 0.5% by mass or more, particularly preferably 0.8% by mass or more, and preferably 10% by mass or less, more preferably 5.0% by mass or less, particularly preferably 3.0% by mass or less. When the chelate-modified amount is within the above range, the adhesion of the cured product of the resin composition can be effectively improved.

[0029] As the (A-1) chelate type epoxy resin, a commercially available product may be used. Examples of commercially available (A-1) chelate type epoxy resin include "EP-49-10P" and "EP-49-10P2" manufactured by ADEKA Corporation (both of which are reaction products of bisphenol A type epoxy resin and phosphoric acid); and "EP-49-23" manufactured by ADEKA Corporation.

[0030] The chelate type epoxy resin (A-1) may be used alone or in combination of two or more kinds.

[0031] Epoxy resins include epoxy resins that are liquid at a temperature of 20°C (hereinafter sometimes referred to as "liquid epoxy resins") and epoxy resins that are solid at a temperature of 20°C (hereinafter sometimes referred to as "solid epoxy resins"). The (A-1) chelate type epoxy resin contained in the resin composition may be only a liquid epoxy resin, may be only a solid epoxy resin, or may be a combination of a liquid epoxy resin and a solid epoxy resin. The (A-1) chelate type epoxy resin preferably contains a liquid epoxy resin, and more preferably contains only a liquid epoxy resin.

[0032] The epoxy equivalent of the (A-1) chelate type epoxy resin is preferably 50 g / eq. to 5,000 g / eq., more preferably 60 g / eq. to 3,000 g / eq., further preferably 80 g / eq. to 2,000 g / eq., and particularly preferably 110 g / eq. to 1,000 g / eq. The epoxy equivalent represents the mass of the resin per equivalent of epoxy group. This epoxy equivalent can be measured according to JIS K7236.

[0033] The weight average molecular weight (Mw) of the chelate type epoxy resin (A-1) is preferably 100 to 5,000, more preferably 250 to 3,000, and further preferably 400 to 1,500. The number average molecular weight of the chelate type epoxy resin (A-1) is usually less than 5,000, and preferably less than 3000. The weight average molecular weight and number average molecular weight of the resin can be measured as polystyrene-equivalent values ​​by gel permeation chromatography (GPC).

[0034] The amount of the chelate type epoxy resin (A-1) in the resin composition is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, particularly preferably 0.5% by mass or more, and is preferably 20% by mass or less, more preferably 10% by mass or less, particularly preferably 5% by mass or less, based on 100% by mass of the non-volatile components of the resin composition. When the amount of the chelate type epoxy resin (A-1) is within the above range, it is possible to effectively improve adhesion while suppressing warpage, and moreover, usually, it is possible to effectively lower the minimum melt viscosity.

[0035] The amount of the (A-1) chelate type epoxy resin in the resin composition is preferably 0.1% by mass or more, more preferably 1% by mass or more, particularly preferably 2% by mass or more, and preferably 40% by mass or less, more preferably 30% by mass or less, particularly preferably 20% by mass or less, based on 100% by mass of the resin components of the resin composition. The resin components of the resin composition refer to the non-volatile components of the resin composition excluding the (B) inorganic filler, unless otherwise specified. When the amount of the (A-1) chelate type epoxy resin is within the above range, the adhesion can be effectively improved while suppressing warpage, and furthermore, the minimum melt viscosity can usually be effectively reduced.

[0036] The mass of the chelate type epoxy resin (A-1) is preferably 1 mass% or more, more preferably 3 mass% or more, particularly preferably 5 mass% or more, and is preferably 80 mass% or less, more preferably 60 mass% or less, particularly preferably 40 mass% or less, based on 100 mass% of the total amount of the epoxy resin (A). When the amount of the chelate type epoxy resin (A-1) is within the above range, it is possible to effectively improve adhesion while suppressing warpage, and moreover, usually, it is possible to effectively lower the minimum melt viscosity.

[0037] The ratio W(A-1) / W(C) of the mass W(A-1) of the chelate type epoxy resin (A-1) to the mass W(C) of the elastomer (C) in the resin composition is preferably within a specific range. Specifically, the ratio W(A-1) / W(C) is preferably 0.01 or more, more preferably 0.02 or more, particularly preferably 0.04 or more, and preferably 1.0 or less, more preferably 0.8 or less, particularly preferably 0.7 or less. When the ratio W(A-1) / W(C) is within the above range, the adhesion can be effectively improved while suppressing warpage, and furthermore, the minimum melt viscosity can usually be effectively reduced.

[0038] The epoxy resin (A) may contain, as component (A-2), an epoxy resin other than the chelate-type epoxy resin (A-1) (A-2) in combination with the chelate-type epoxy resin (A-1). In the following description, "an epoxy resin other than the chelate-type epoxy resin (A-2) (A-1)" may be referred to as "an arbitrary epoxy resin (A-2)".

[0039] Examples of the optional epoxy resin (A-2) include bixylenol type epoxy resins, bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, bisphenol AF type epoxy resins, dicyclopentadiene type epoxy resins, trisphenol type epoxy resins, naphthol novolac type epoxy resins, phenol novolac type epoxy resins, tert-butyl-catechol type epoxy resins, naphthalene type epoxy resins, naphthol type epoxy resins, anthracene type epoxy resins, glycidylamine type epoxy resins, cresol novolac type epoxy resins, phenol aralkyl type epoxy resins, biphenyl type epoxy resins, linear aliphatic epoxy resins, epoxy resins having a butadiene structure, alicyclic epoxy resins, heterocyclic epoxy resins, spiro ring-containing epoxy resins, cyclohexane type epoxy resins, cyclohexane dimethanol type epoxy resins, naphthylene ether type epoxy resins, trimethylol type epoxy resins, tetraphenylethane type epoxy resins, isocyanurate type epoxy resins, and phenolphthalimidine type epoxy resins. The optional epoxy resin (A-2) may be used alone or in combination of two or more kinds.

[0040] From the viewpoint of obtaining a cured product having excellent heat resistance, it is preferable that the optional epoxy resin (A-2) contains an epoxy resin containing an aromatic structure. Examples of the optional epoxy resin (A-2) containing an aromatic structure include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AF type epoxy resin, dicyclopentadiene type epoxy resin, trisphenol type epoxy resin, naphthol novolac type epoxy resin, phenol novolac type epoxy resin, tert-butyl-catechol type epoxy resin, naphthalene type epoxy resin, naphthol type epoxy resin, anthracene type epoxy resin, bisxylenol type epoxy resin, glycidylamine type epoxy resin having an aromatic structure, cresol novolac type epoxy resin, biphenyl type epoxy resin, linear aliphatic epoxy resin having an aromatic structure, epoxy resin having a butadiene structure having an aromatic structure, alicyclic epoxy resin having an aromatic structure, heterocyclic epoxy resin, spiro ring-containing epoxy resin having an aromatic structure, cyclohexane dimethanol type epoxy resin having an aromatic structure, naphthylene ether type epoxy resin, trimethylol type epoxy resin having an aromatic structure, tetraphenylethane type epoxy resin having an aromatic structure, and the like.

[0041] The (A-2) optional epoxy resin preferably contains an epoxy resin having two or more epoxy groups in one molecule. The proportion of the epoxy resin having two or more epoxy groups in one molecule relative to 100% by mass of the non-volatile components of the (A-2) optional epoxy resin is preferably 50% by mass or more, more preferably 60% by mass or more, and particularly preferably 70% by mass or more.

[0042] The optional epoxy resin (A-2) may be only a liquid epoxy resin, only a solid epoxy resin, or a combination of a liquid epoxy resin and a solid epoxy resin.

[0043] The liquid epoxy resin is preferably a liquid epoxy resin having two or more epoxy groups in one molecule.Preferable liquid epoxy resins that can be used as the (A-2) optional epoxy resin include, for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, naphthalene type epoxy resin, glycidylamine type epoxy resin, phenol novolac type epoxy resin, cyclohexane type epoxy resin, cyclohexane dimethanol type epoxy resin, and epoxy resin having a butadiene structure.

[0044] Specific examples of liquid epoxy resins that can be used as the optional epoxy resin (A-2) include "HP4032", "HP4032D", and "HP4032SS" (naphthalene type epoxy resins) manufactured by DIC Corporation; "828US", "828EL", "jER828EL", "825", and "Epikote 828EL" (bisphenol A type epoxy resins) manufactured by Mitsubishi Chemical Corporation; "jER807" and "1750" (bisphenol F type epoxy resins) manufactured by Mitsubishi Chemical Corporation; "jER152" (phenol novolac type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "630", "630LSD", and "604" (glycidylamine type epoxy resins) manufactured by Mitsubishi Chemical Corporation; and "ED-5" manufactured by ADEKA Corporation. 23T" (glycirol type epoxy resin); ADEKA's "EP-3950L" and "EP-3980S" (glycidylamine type epoxy resin); ADEKA's "EP-4088S" (dicyclopentadiene type epoxy resin); Nippon Steel Chemical & Material Chemical's "ZX-1059" (mixture of bisphenol A type epoxy resin and bisphenol F type epoxy resin); Daicel's "PB-3600", Nippon Soda's "JP-100" and "JP-200" (epoxy resin having a butadiene structure); Nippon Steel Chemical & Material's "ZX1658" and "ZX1658GS" (liquid 1,4-glycidylcyclohexane type epoxy resin), etc. may be used. These may be used alone or in combination of two or more.

[0045] As the solid epoxy resin, a solid epoxy resin having three or more epoxy groups in one molecule is preferable, and an aromatic solid epoxy resin having three or more epoxy groups in one molecule is more preferable. (A-2) As the preferred solid epoxy resin that can be used as any epoxy resin, for example, bixylenol type epoxy resin, naphthalene type epoxy resin, naphthalene type 4-functional epoxy resin, naphthol novolac type epoxy resin, cresol novolac type epoxy resin, dicyclopentadiene type epoxy resin, trisphenol type epoxy resin, naphthol type epoxy resin, biphenyl type epoxy resin, naphthylene ether type epoxy resin, anthracene type epoxy resin, bisphenol A type epoxy resin, bisphenol AF type epoxy resin, phenol aralkyl type epoxy resin, tetraphenylethane type epoxy resin, phenolphthalimidine type epoxy resin are preferable.

[0046] Specific examples of solid epoxy resins that can be used as the optional epoxy resin (A-2) include "HP4032H" (naphthalene type epoxy resin) manufactured by DIC Corporation; "HP-4700" and "HP-4710" (naphthalene type tetrafunctional epoxy resins) manufactured by DIC Corporation; "N-690" (cresol novolac type epoxy resin) manufactured by DIC Corporation; "N-695" (cresol novolac type epoxy resin) manufactured by DIC Corporation; "HP-7200", "HP-7200HH", "HP-7200H", and "HP-7200L" (dicyclopentadiene type epoxy resins) manufactured by DIC Corporation. epoxy resins); DIC's "EXA-7311", "EXA-7311-G3", "EXA-7311-G4", "EXA-7311-G4S", "HP6000", and "HP6000L" (naphthylene ether type epoxy resins); Nippon Kayaku's "EPPN-502H" (trisphenol type epoxy resins); Nippon Kayaku's "NC7000L" (naphthol novolac type epoxy resins); Nippon Kayaku's "NC3000H", "NC3000L", "NC3000FH", and "NC3100" (biphenyl type epoxy resins) resin); "ESN475V", "ESN4100V" (naphthalene type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "ESN485" (naphthol type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "ESN375" (dihydroxynaphthalene type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "YX4000H", "YX4000", "YX4000HK", "YL7890" (bixylenol type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd.; "YL6121" (biphenyl type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd. Examples of epoxy resins include "YX8800" (anthracene type epoxy resin); "YX7700" (phenol aralkyl type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "PG-100" and "CG-500" manufactured by Osaka Gas Chemicals Co., Ltd.; "YL7760" (bisphenol AF type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YL7800" (fluorene type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "jER1031S" (tetraphenylethane type epoxy resin) manufactured by Mitsubishi Chemical Corporation; and "WHR991S" (phenolphthalimidine type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.These may be used alone or in combination of two or more.

[0047] The epoxy equivalent range of the optional epoxy resin (A-2) may be the same as the epoxy equivalent range of the chelate-type epoxy resin (A-1).

[0048] The ranges of the weight average molecular weight and number average molecular weight of the optional epoxy resin (A-2) may be the same as the ranges of the weight average molecular weight and number average molecular weight of the chelate-type epoxy resin (A-1).

[0049] When a liquid epoxy resin and a solid epoxy resin are used in combination as the (A) epoxy resin, the mass ratio thereof (liquid epoxy resin:solid epoxy resin) is preferably 20:1 to 1:5, more preferably 10:1 to 1:2, and particularly preferably 5:1 to 1:1.

[0050] The amount of the epoxy resin (A) in the resin composition is preferably 1% by mass or more, more preferably 2% by mass or more, particularly preferably 5% by mass or more, and is preferably 40% by mass or less, more preferably 30% by mass or less, particularly preferably 20% by mass or less, based on 100% by mass of the non-volatile components of the resin composition. When the amount of the epoxy resin (A) is within the above range, the effects of suppressing warpage and improving adhesion can be significantly obtained, and furthermore, the minimum melt viscosity can usually be effectively reduced.

[0051] The amount of the epoxy resin (A) in the resin composition is preferably 10% by mass or more, more preferably 20% by mass or more, particularly preferably 30% by mass or more, and is preferably 70% by mass or less, more preferably 60% by mass or less, particularly preferably 50% by mass or less, based on 100% by mass of the resin components of the resin composition. When the amount of the epoxy resin (A) is within the above range, the effects of suppressing warpage and improving adhesion can be significantly obtained, and furthermore, the minimum melt viscosity can usually be effectively reduced.

[0052] [3.(B) Inorganic filler] The resin composition according to the present embodiment contains an inorganic filler (B) as component (B). The inorganic filler (B) is usually contained in the resin composition in the form of particles.

[0053] (B) An inorganic compound is used as the material of the inorganic filler. (B) Examples of the material of the inorganic filler include silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium zirconate titanate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium tungstate phosphate. Among these, silica and alumina are preferred, and silica is particularly preferred. Examples of silica include amorphous silica, fused silica, crystalline silica, synthetic silica, and hollow silica. In addition, spherical silica is preferred as the silica. The (B) inorganic filler may be used alone or in combination of two or more kinds.

[0054] (B) Commercially available inorganic fillers include, for example, "UFP-30" manufactured by Denka Chemical Industry Co., Ltd.; "SP60-05" and "SP507-05" manufactured by Nippon Steel & Sumitomo Metal Materials Co., Ltd.; "YC100C", "YA050C", "YA050C-MJE", and "YA010C" manufactured by Admatechs Co., Ltd.; "UFP-30" manufactured by Denka Company, Ltd.; "Silfill NSS-3N", "Silfill NSS-4N", and "Silfill NSS-5N" manufactured by Tokuyama Corporation; and "SC2500SQ", "SO-C4", "SO-C2", "SO-C1", and "SC2050-SXF" manufactured by Admatechs Co., Ltd.

[0055] From the viewpoint of significantly obtaining the desired effects of the present invention, the average particle size of the (B) inorganic filler is preferably 0.01 μm or more, more preferably 0.05 μm or more, particularly preferably 0.1 μm or more, and is preferably 10 μm or less, more preferably 7 μm or less, and even more preferably 5 μm or less.

[0056] (B) The average particle size of the inorganic filler can be measured by a laser diffraction / scattering method based on the Mie scattering theory. Specifically, the particle size distribution of the inorganic filler is prepared on a volume basis using a laser diffraction / scattering particle size distribution measuring device, and the median diameter is used as the average particle size. The measurement sample can be prepared by weighing 100 mg of the inorganic filler and 10 g of methyl ethyl ketone into a vial and dispersing the mixture by ultrasonic waves for 10 minutes. The measurement sample can be measured by using a laser diffraction particle size distribution measuring device with blue and red light wavelengths as the light source, and the volume-based particle size distribution of the inorganic filler can be measured by a flow cell method, and the average particle size can be calculated from the obtained particle size distribution as the median diameter. An example of a laser diffraction particle size distribution measuring device is the "LA-960" manufactured by Horiba, Ltd.

[0057] The specific surface area of ​​the (B) inorganic filler is preferably 1 m or less from the viewpoint of significantly obtaining the desired effects of the present invention. 2 / g or more, more preferably 2m 2 / g or more, particularly preferably 3m 2 / g or more. There is no particular upper limit, but it is preferably 60m 2 / g or less, 50m 2 / g or less or 40m 2 The specific surface area can be measured by adsorbing nitrogen gas onto the surface of a sample using a specific surface area measuring device (Macsorb HM-1210 manufactured by Mountech Co., Ltd.) according to the BET method, and calculating the specific surface area using the BET multipoint method.

[0058] (B) The inorganic filler is preferably treated with a surface treatment agent from the viewpoint of improving moisture resistance and dispersibility. Examples of the surface treatment agent include fluorine-containing silane coupling agents, aminosilane coupling agents, epoxysilane coupling agents, mercaptosilane coupling agents, silane coupling agents, alkoxysilanes, organosilazane compounds, titanate coupling agents, etc. The surface treatment agent may be used alone or in any combination of two or more.

[0059] Examples of commercially available surface treatment agents include Shin-Etsu Chemical Co., Ltd.'s "KBM403" (3-glycidoxypropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM803" (3-mercaptopropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBE903" (3-aminopropyltriethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM573" (N-phenyl-3-aminopropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "SZ-31" (hexamethyldisilazane), Shin-Etsu Chemical Co., Ltd.'s "KBM103" (phenyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM-4803" (long-chain epoxy-type silane coupling agent), and Shin-Etsu Chemical Co., Ltd.'s "KBM-7103" (3,3,3-trifluoropropyltrimethoxysilane).

[0060] From the viewpoint of improving the dispersibility of the (B) inorganic filler, the degree of surface treatment with the surface treatment agent is preferably within a specific range. Specifically, 100% by mass of the inorganic filler is preferably surface-treated with 0.2% to 5% by mass of the surface treatment agent, more preferably with 0.2% to 3% by mass of the surface treatment agent, and even more preferably with 0.3% to 2% by mass of the surface treatment agent.

[0061] The degree of surface treatment with the surface treatment agent can be evaluated by the amount of carbon per unit surface area of ​​the inorganic filler. From the viewpoint of improving the dispersibility of the inorganic filler, the amount of carbon per unit surface area of ​​the inorganic filler is set to 0.02 mg / m 2 More than 0.1 mg / m is preferable. 2More preferably, 0.2 mg / m or more 2 On the other hand, from the viewpoint of suppressing an increase in the melt viscosity of the resin composition, it is more preferable that the content is 1.0 mg / m 2 Less than 0.8 mg / m is preferred. 2 Less than 0.5 mg / m is more preferable. 2 The following is even more preferred:

[0062] (B) The amount of carbon per unit surface area of ​​the inorganic filler can be measured after the surface-treated inorganic filler is washed with a solvent (e.g., methyl ethyl ketone (MEK)). Specifically, a sufficient amount of MEK as a solvent is added to the inorganic filler that has been surface-treated with a surface treatment agent, and ultrasonic cleaning is performed at 25°C for 5 minutes. After removing the supernatant and drying the solid content, the amount of carbon per unit surface area of ​​the inorganic filler can be measured using a carbon analyzer. As the carbon analyzer, the "EMIA-320V" manufactured by Horiba, Ltd., or the like can be used.

[0063] The amount of (B) inorganic filler in the resin composition is preferably 40% by mass or more, more preferably 50% by mass or more, even more preferably 60% by mass or more, particularly preferably 70% by mass or more, and preferably 95% by mass or less, more preferably 90% by mass or less, even more preferably 85% by mass or less, particularly preferably 80% by mass or less, based on 100% by mass of the non-volatile components of the resin composition. In general, when the amount of inorganic filler is large as described above, the problems of an increase in the minimum melt viscosity of the resin composition and a decrease in adhesion of the cured product of the resin composition are likely to occur. In contrast, according to the resin composition of this embodiment, even when the amount of inorganic filler is large as described above, the adhesion of the cured product can be improved, and more preferably the minimum melt viscosity can be lowered. Therefore, when a large amount of (B) inorganic filler is contained that is equal to or greater than the lower limit, the advantages of the resin composition of this embodiment can be particularly effectively utilized. In addition, when the amount of (B) inorganic filler is equal to or less than the upper limit, the effects of suppressing warping and improving adhesion can be significantly obtained, and moreover, the minimum melt viscosity can usually be effectively lowered.

[0064] [4. (C) Elastomer] The resin composition according to the present embodiment includes an elastomer (C) as the component (C). The elastomer (C) does not include any of the components (A) to (B) described above. The elastomer (C) is a resin having flexibility, and is preferably a resin having rubber elasticity or a resin exhibiting rubber elasticity by polymerization with another component. Examples of rubber elasticity include resins exhibiting an elastic modulus of 1 GPa or less when a tensile test is performed at a temperature of 25° C. and a humidity of 40% RH according to the Japanese Industrial Standards (JIS K7161). The elastomer (C) is usually an amorphous resin component that can be dissolved in an organic solvent. The elastomer (C) may be used alone or in combination of two or more kinds in any ratio. The elastomer (C) can reduce the elastic modulus of the cured product of the resin composition.

[0065] The (C) elastomer is preferably of high molecular weight. The number average molecular weight (Mn) of the (C) elastomer is preferably 1,000 or more, more preferably 1,500 or more, even more preferably 2,000 or more, even more preferably 3,000 or more, and particularly preferably 5,000 or more. When the (C) elastomer has a high molecular weight as described above, the effect of suppressing warpage and improving adhesion can be significantly obtained, and furthermore, the minimum melt viscosity can usually be effectively reduced. There is no particular limit to the upper limit of the number average molecular weight, but it is preferably 1,000,000 or less, more preferably 900,000 or less. The number average molecular weight (Mn) is the number average molecular weight in terms of polystyrene measured using GPC (gel permeation chromatography).

[0066] The (C) elastomer is preferably one or more selected from resins having a glass transition temperature (Tg) of 25° C. or less and resins that are liquid at 25° C. or less. The glass transition temperature of the resin having a glass transition temperature (Tg) of 25° C. or less is preferably 20° C. or less, more preferably 15° C. or less. The lower limit of the glass transition temperature is not particularly limited, but it can usually be −15° C. or more. The resin that is liquid at 25° C. is preferably a resin that is liquid at 20° C. or less, more preferably a resin that is liquid at 15° C. or less. The glass transition temperature can be measured by DSC (differential scanning calorimetry) at a heating rate of 5° C. / min.

[0067] The (C) elastomer is preferably a resin having one or more structures selected from a polybutadiene structure, a polysiloxane structure, a poly(meth)acrylate structure, a polyalkylene structure, a polyalkyleneoxy structure, a polyisoprene structure, a polyisobutylene structure, a polycarbonate structure, and a polystyrene structure in the molecule. The term "(meth)acrylate" includes methacrylate and acrylate, as well as combinations thereof. These structures may be included in the main chain or side chain of the (C) elastomer molecule.

[0068] The (C) elastomer may be, for example, a resin containing a polybutadiene structure. The polybutadiene structure may be contained in the main chain or in the side chain. The polybutadiene structure may be partially or entirely hydrogenated. A resin containing a polybutadiene structure may be called a "polybutadiene resin." Specific examples of polybutadiene resins include "Ricon 130MA8", "Ricon 130MA13", "Ricon 130MA20", "Ricon 131MA5", "Ricon 131MA10", "Ricon 131MA17", "Ricon 131MA20", and "Ricon 184MA6" (polybutadiene containing an acid anhydride group) manufactured by Cray Valley Corporation; "GQ-1000" (polybutadiene having hydroxyl groups and carboxyl groups introduced therein), "G-1000", "G-2000", and "G-3000" (polybutadiene having hydroxyl groups at both ends), "GI-1000", "GI-2000", and "GI-3000" (polybutadiene having hydrogenated hydroxyl groups at both ends) manufactured by Nippon Soda Co., Ltd.; and "FCA-061L" (hydrogenated polybutadiene skeleton epoxy resin) manufactured by Nagase ChemteX Corporation. Specific examples of polybutadiene resins include phenolic hydroxyl group-containing butadiene resins; and polyimide resins having a polybutadiene structure, a urethane structure, and an imide structure in the molecule. The polyimide resins can be produced as linear polyimide resins (polyimides described in JP 2006-37083 A and WO 2008 / 153208 A) using hydroxyl group-terminated polybutadiene, a diisocyanate compound, and a tetrabasic acid anhydride as raw materials. The content of the butadiene structure in the polyimide resin is preferably 60% by mass to 95% by mass, more preferably 75% by mass to 85% by mass. Details of the polyimide resins can be found in JP 2006-37083 A and WO 2008 / 153208 A, the contents of which are incorporated herein by reference.

[0069] Examples of the (C) elastomer include resins containing a poly(meth)acrylate structure. Resins containing a poly(meth)acrylate structure are sometimes called "poly(meth)acrylic resins." Specific examples of poly(meth)acrylic resins include Teisan Resin manufactured by Nagase ChemteX Corporation; "ME-2000," "W-116.3," "W-197C," "KG-25," and "KG-3000" manufactured by Negami Chemical Industries Co., Ltd.; and "ARUFON UH-2000" manufactured by Toagosei Co., Ltd.

[0070] Examples of the (C) elastomer include resins containing a polycarbonate structure. Resins containing a polycarbonate structure are sometimes called "polycarbonate resins". Specific examples of polycarbonate resins include "FPC0220" and "FPC2136" manufactured by Mitsubishi Gas Chemical Co., Ltd., "T6002" and "T6001" (polycarbonate diols) manufactured by Asahi Kasei Chemicals Corporation, and "C-1090", "C-2090", and "C-3090" (polycarbonate diols) manufactured by Kuraray Co., Ltd. Specific examples of polycarbonate resins include polyimide resins having an imide structure, a urethane structure, and a polycarbonate structure in the molecule. The polyimide resins can be produced as linear polyimide resins using hydroxyl-terminated polycarbonate, a diisocyanate compound, and a tetrabasic acid anhydride as raw materials. The content of the carbonate structure in the polyimide resin is preferably 60% by mass to 95% by mass, more preferably 75% by mass to 85% by mass. For details of the polyimide resin, refer to the description in International Publication No. 2016 / 129541, the contents of which are incorporated herein by reference.

[0071] Examples of the (C) elastomer include resins containing a polysiloxane structure. Resins containing a polysiloxane structure are sometimes called "siloxane resins." Specific examples of siloxane resins include "SMP-2006," "SMP-2003PGMEA," and "SMP-5005PGMEA" manufactured by Shin-Etsu Silicone Co., Ltd., and linear polyimides made from amine-terminated polysiloxanes and tetrabasic acid anhydrides (see International Publication No. 2010 / 053185, JP 2002-12667 A, JP 2000-319386 A, etc.).

[0072] Examples of the (C) elastomer include resins containing a polyalkylene structure or a polyalkyleneoxy structure. A resin containing a polyalkylene structure may be referred to as an "alkylene resin". A resin containing a polyalkyleneoxy structure may be referred to as an "alkyleneoxy resin". The polyalkyleneoxy structure is preferably a polyalkyleneoxy structure having 2 to 15 carbon atoms, more preferably a polyalkyleneoxy structure having 3 to 10 carbon atoms, and particularly preferably a polyalkyleneoxy structure having 5 to 6 carbon atoms. Specific examples of the alkylene resin and the alkyleneoxy resin include "PTXG-1000" and "PTXG-1800" manufactured by Asahi Kasei Fibers Corporation.

[0073] (C) Elastomers include, for example, resins containing a polyisoprene structure. Resins containing a polyisoprene structure are sometimes called "isoprene resins." Specific examples of isoprene resins include "KL-610" and "KL613" manufactured by Kuraray Co., Ltd.

[0074] (C) Elastomers include, for example, resins containing a polyisobutylene structure. Resins containing a polyisobutylene structure are sometimes called "isobutylene resins." Specific examples of isobutylene resins include Kaneka Corporation's "SIBSTAR-073T" (styrene-isobutylene-styrene triblock copolymer) and "SIBSTAR-042D" (styrene-isobutylene diblock copolymer).

[0075] Examples of the (C) elastomer include resins containing a polystyrene structure. Resins containing a polystyrene structure are sometimes called "polystyrene resins". The polystyrene resin may be a copolymer containing an arbitrary repeating unit other than the styrene unit in combination with the styrene unit, or may be a hydrogenated polystyrene resin. Examples of the polystyrene resin include styrene-butadiene-styrene block copolymers (SBS), styrene-isoprene-styrene block copolymers (SIS), styrene-ethylene-butylene-styrene block copolymers (SEBS), styrene-ethylene-propylene-styrene block copolymers (SEPS), styrene-ethylene-ethylene-propylene-styrene block copolymers (SEEPS), styrene-butadiene-butylene-styrene block copolymers (SBBS), styrene-butadiene diblock copolymers, hydrogenated styrene-butadiene block copolymers, hydrogenated styrene-isoprene block copolymers, hydrogenated styrene-butadiene random copolymers, and styrene-maleic anhydride copolymers. Specific examples of polystyrene resins include hydrogenated styrene-based thermoplastic elastomers "H1041", "Tuftec H1043", "Tuftec P2000", and "Tuftec MP10" (manufactured by Asahi Kasei Corporation); epoxidized styrene-butadiene thermoplastic elastomers "Epofriend AT501" and "CT310" (manufactured by Daicel Corporation); modified styrene-based elastomers having hydroxyl groups "Septon HG252" (manufactured by Kuraray Co., Ltd.); modified styrene-based elastomers having carboxyl groups "Tuftec N503M", modified styrene-based elastomers having amino groups "Tuftec N501", modified styrene-based elastomers having acid anhydride groups "Tuftec M1913" (manufactured by Asahi Kasei Chemicals Corporation); unmodified styrene-based elastomers "Septon S8104" (manufactured by Kuraray Co., Ltd.); styrene-ethylene / butylene-styrene block copolymers "FG1924" (manufactured by Kraton Corporation), and "EF-40" (manufactured by CRAY VALLEY Co., Ltd.).

[0076] Among the above, the (C) elastomer is more preferably a resin containing at least one structure selected from the group consisting of a polybutadiene structure, a polycarbonate structure, and a poly(meth)acrylate structure in the molecule. Furthermore, the (C) elastomer is particularly preferably a resin having a polybutadiene structure or a polycarbonate structure in the molecule. The (C) elastomer having a polybutadiene structure or a polycarbonate structure generally has low compatibility with the (A-1) chelate type epoxy resin. Therefore, the (C) elastomer can microscopically phase separate from the (A-1) chelate type epoxy resin to form a fine domain with excellent flexibility. In the cured product of the resin composition, the flexibility of the domain is exerted, so that the elastic modulus of the cured product can be effectively reduced, and warpage can be particularly effectively suppressed without impairing adhesion.

[0077] The (C) elastomer may have a functional group capable of reacting with the (A) epoxy resin. When the (C) elastomer reacts with the (A) epoxy resin, the mechanical strength of the cured product of the resin composition can be increased. The (A) epoxy resin-reactive functional group includes a functional group that appears upon heating. The (A) epoxy resin-reactive functional group may be one or more functional groups selected from the group consisting of a hydroxy group, a carboxy group, an acid anhydride group, a phenolic hydroxyl group, an epoxy group, an isocyanate group, and a urethane group. Among these, the functional group is preferably a hydroxy group, an acid anhydride group, a phenolic hydroxyl group, an epoxy group, an isocyanate group, and a urethane group, more preferably a hydroxy group, an acid anhydride group, a phenolic hydroxyl group, and an epoxy group, and particularly preferably a phenolic hydroxyl group. The number average molecular weight (Mn) of the (C) elastomer containing a functional group is preferably 5,000 or more.

[0078] The amount of the (C) elastomer in the resin composition is preferably 1% by mass or more, more preferably 2% by mass or more, and even more preferably 3% by mass or more, and is preferably 20% by mass or less, more preferably 15% by mass or less, and even more preferably 10% by mass or less, based on 100% by mass of the non-volatile components of the resin composition. When the amount of the (C) elastomer is within the above range, the effects of suppressing warpage and improving adhesion can be significantly obtained, and furthermore, the minimum melt viscosity can usually be effectively reduced.

[0079] The amount of the (C) elastomer in the resin composition is preferably 5% by mass or more, more preferably 10% by mass or more, and even more preferably 20% by mass or more, and is preferably 80% by mass or less, more preferably 60% by mass or less, and even more preferably 50% by mass or less, based on 100% by mass of the resin components of the resin composition. When the amount of the (C) elastomer is within the above range, the effects of suppressing warpage and improving adhesion can be significantly obtained, and furthermore, the minimum melt viscosity can usually be effectively reduced.

[0080] [5. (D) Hardener] The resin composition according to the present embodiment may further contain a (D) curing agent as an optional component in combination with the above-mentioned (A) to (C) components. The (D) curing agent as the (D) component does not include those corresponding to the above-mentioned (A) to (C) components. The (D) curing agent can have the function of reacting with the (A) epoxy resin to cure the resin composition.

[0081] Examples of the (D) curing agent include phenol-based curing agents, naphthol-based curing agents, active ester-based curing agents, amine-based curing agents, acid anhydride-based curing agents, benzoxazine-based curing agents, cyanate ester-based curing agents, carbodiimide-based curing agents, and thiol-based curing agents, among which phenol-based curing agents, naphthol-based curing agents, and active ester-based curing agents are preferred, and phenol-based curing agents and active ester-based curing agents are particularly preferred. The (D) curing agent may be used alone or in combination of two or more types.

[0082] As the phenol-based curing agent and naphthol-based curing agent, those having a novolak structure are preferred from the viewpoint of heat resistance and water resistance, and from the viewpoint of adhesion, nitrogen-containing phenol-based curing agents are preferred, and triazine skeleton-containing phenol-based curing agents are more preferred.

[0083] Specific examples of phenol-based curing agents and naphthol-based curing agents include, for example, "MEH-7700", "MEH-7810", "MEH-7851", and "MEH-8000H" manufactured by Meiwa Chemical Industry Co., Ltd.; "NHN", "CBN", and "GPH" manufactured by Nippon Kayaku Co., Ltd.; and "SN-170", "SN-180", "SN-190", "SN-475", "SN-485", "SN-495", "SN-495V", and "SN-37" manufactured by Nippon Steel Chemical & Material Co., Ltd. 5" and "SN-395" manufactured by DIC Corporation; "TD-2090", "TD-2090-60M", "LA-7052", "LA-7054", "LA-1356", "LA-3018", "LA-3018-50P", "EXB-9500", "HPC-9500", "KA-1160", "KA-1163", and "KA-1165" manufactured by Gun-ei Chemical Co., Ltd.; and the like.

[0084] As the active ester curing agent, a compound having one or more active ester groups in one molecule can be used. Among them, as the active ester curing agent, a compound having two or more highly reactive ester groups in one molecule, such as phenol esters, thiophenol esters, N-hydroxyamine esters, and esters of heterocyclic hydroxy compounds, is preferable. The active ester curing agent is preferably one obtained by a condensation reaction between a carboxylic acid compound and / or a thiocarboxylic acid compound and a hydroxy compound and / or a thiol compound. In particular, from the viewpoint of improving heat resistance, an active ester curing agent obtained from a carboxylic acid compound and a hydroxy compound is preferable, and an active ester curing agent obtained from a carboxylic acid compound and a phenol compound and / or a naphthol compound is more preferable. Examples of the carboxylic acid compound include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyromellitic acid. Examples of phenol compounds or naphthol compounds include hydroquinone, resorcin, bisphenol A, bisphenol F, bisphenol S, phenolphthaline, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucin, benzenetriol, dicyclopentadiene-type diphenol compounds, phenol novolac, etc. Here, the term "dicyclopentadiene-type diphenol compounds" refers to diphenol compounds obtained by condensing one molecule of dicyclopentadiene with two molecules of phenol.

[0085] Preferred specific examples of the active ester curing agent include an active ester curing agent containing a dicyclopentadiene-type diphenol structure, an active ester curing agent containing a naphthalene structure, an active ester curing agent containing an acetylated product of phenol novolac, and an active ester curing agent containing a benzoylated product of phenol novolac. Among them, an active ester curing agent containing a naphthalene structure and an active ester curing agent containing a dicyclopentadiene-type diphenol structure are more preferred. The "dicyclopentadiene-type diphenol structure" refers to a divalent structural unit consisting of phenylene-dicyclopentylene-phenylene.

[0086] Commercially available active ester curing agents include "EXB9451", "EXB9460", "EXB9460S", "HPC-8000-65T", "HPC-8000H-65TM", and "EXB-8000L-65TM" (manufactured by DIC Corporation) as active ester curing agents containing a dicyclopentadiene-type diphenol structure; "EXB-9416-70BK", "EXB-8150-65T", "EXB-8100L-65T", and "EXB-8150L-65T" (manufactured by DIC Corporation) as active ester curing agents containing a naphthalene structure; and "EXB-9416-70BK", "EXB-8150-65T", "EXB-8100L-65T", and "EXB-8150L-65T" (manufactured by DIC Corporation) as active ester curing agents containing a naphthalene structure; Examples of active ester-based curing agents that contain an acetylated product include "DC808" (manufactured by Mitsubishi Chemical Corporation); active ester-based curing agents that contain a benzoylated product of phenol novolac include "YLH1026" (manufactured by Mitsubishi Chemical Corporation); active ester-based curing agents that are acetylated products of phenol novolac include "DC808" (manufactured by Mitsubishi Chemical Corporation); and active ester-based curing agents that are benzoylated products of phenol novolac include "YLH1026" (manufactured by Mitsubishi Chemical Corporation), "YLH1030" (manufactured by Mitsubishi Chemical Corporation), and "YLH1048" (manufactured by Mitsubishi Chemical Corporation).

[0087] Examples of the amine-based curing agent include curing agents having one or more amino groups in one molecule, such as aliphatic amines, polyether amines, alicyclic amines, and aromatic amines. Among them, aromatic amines are preferred. The amine-based curing agent is preferably a primary amine or a secondary amine, and more preferably a primary amine. Specific examples of the amine-based curing agent include 4,4'-methylenebis(2,6-dimethylaniline), diphenyldiaminosulfone, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylsulfone, 3,3'-diaminodiphenylsulfone, m-phenylenediamine, m-xylylenediamine, diethyltoluenediamine, 4,4'-diaminodiphenylether, 3,3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dihydroxybenzidine, 2,2-bis(3-amino-4-hydroxyphenyl)-2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dihydroxybenzidine, and 2,2-bis(3-amino-4-hydroxyphenyl)-2,2'-dimethyl-4,4'-diaminobiphenyl. bis(4-aminophenyl)propane, 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethanediamine, 2,2-bis(4-aminophenyl)propane, 2,2-bis(4-(4-aminophenoxy)phenyl)propane, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4'-bis(4-aminophenoxy)biphenyl, bis(4-(4-aminophenoxy)phenyl)sulfone, bis(4-(3-aminophenoxy)phenyl)sulfone, etc. The amine-based curing agent may be a commercially available product, for example, "KAYABOND C-200S", "KAYABOND C-100", "KAYAHARD AA", "KAYAHARD AB", "KAYAHARD AS" manufactured by Nippon Kayaku Co., Ltd., and "Epicure W" manufactured by Mitsubishi Chemical Corporation.

[0088] Examples of the acid anhydride curing agent include a curing agent having one or more acid anhydride groups in one molecule. Specific examples of the acid anhydride curing agent include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic anhydride, hydrogenated methylnadic anhydride, trialkyltetrahydrophthalic anhydride, dodecenyl succinic anhydride, 5-(2,5-dioxotetrahydro-3-furanyl)-3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, trimellitic anhydride, pyromellitic anhydride, and benzophenonetetracarboxylic dianhydride. Examples of acid anhydrides include polymeric acid anhydrides such as biphenyltetracarboxylic dianhydride, naphthalenetetracarboxylic dianhydride, oxydiphthalic dianhydride, 3,3'-4,4'-diphenylsulfonetetracarboxylic dianhydride, 1,3,3a,4,5,9b-hexahydro-5-(tetrahydro-2,5-dioxo-3-furanyl)-naphtho[1,2-C]furan-1,3-dione, ethylene glycol bis(anhydrotrimellitate), and styrene-maleic acid resins in which styrene and maleic acid are copolymerized. Examples of commercially available acid anhydride-based hardeners include "MH-700" manufactured by New Japan Chemical Co., Ltd.

[0089] Specific examples of benzoxazine-based curing agents include "JBZ-OD100" (benzoxazine ring equivalent: 218 g / eq.), "JBZ-OP100D" (benzoxazine ring equivalent: 218 g / eq.), and "ODA-BOZ" (benzoxazine ring equivalent: 218 g / eq.) manufactured by JFE Chemical Corporation; "Pd" (benzoxazine ring equivalent: 217 g / eq.) and "Fa" (benzoxazine ring equivalent: 217 g / eq.) manufactured by Shikoku Chemical Industry Co., Ltd.; and "HFB2006M" (benzoxazine ring equivalent: 432 g / eq.) manufactured by Showa Polymer Co., Ltd.

[0090] Examples of cyanate ester curing agents include bifunctional cyanate resins such as bisphenol A dicyanate, polyphenol cyanate, oligo(3-methylene-1,5-phenylene cyanate), 4,4'-methylenebis(2,6-dimethylphenyl cyanate), 4,4'-ethylidene diphenyl dicyanate, hexafluorobisphenol A dicyanate, 2,2-bis(4-cyanate)phenylpropane, 1,1-bis(4-cyanate phenylmethane), bis(4-cyanate-3,5-dimethylphenyl)methane, 1,3-bis(4-cyanate phenyl-1-(methylethylidene))benzene, bis(4-cyanate phenyl)thioether, and bis(4-cyanate phenyl)ether; polyfunctional cyanate resins derived from phenol novolac and cresol novolac; and prepolymers in which these cyanate resins are partially converted to triazine. Specific examples of cyanate ester-based curing agents include "PT30" and "PT60" (phenol novolac type multifunctional cyanate ester resins), "ULL-950S" (multifunctional cyanate ester resin), "BA230", and "BA230S75" (prepolymers in which part or all of bisphenol A dicyanate has been converted to triazine to form a trimer), all of which are manufactured by Lonza Japan.

[0091] Specific examples of carbodiimide-based curing agents include Carbodilite (registered trademark) V-03 (carbodiimide group equivalent: 216 g / eq.), V-05 (carbodiimide group equivalent: 262 g / eq.), V-07 (carbodiimide group equivalent: 200 g / eq.); V-09 (carbodiimide group equivalent: 200 g / eq.), and Stavaxol (registered trademark) P (carbodiimide group equivalent: 302 g / eq.), all manufactured by Nisshinbo Chemical Inc.

[0092] Specific examples of thiol-based curing agents include trimethylolpropane tris(3-mercaptopropionate), pentaerythritol tetrakis(3-mercaptobutyrate), and tris(3-mercaptopropyl)isocyanurate.

[0093] The active group equivalent of the (D) curing agent is preferably 50 g / eq. to 3000 g / eq., more preferably 100 g / eq. to 1000 g / eq., further preferably 100 g / eq. to 500 g / eq., and particularly preferably 100 g / eq. to 300 g / eq. The active group equivalent is the mass of the curing agent per equivalent of the active group.

[0094] When the number of epoxy groups in the (A) epoxy resin is taken as 1, the number of active groups in the (D) curing agent is preferably 0.1 or more, more preferably 0.2 or more, even more preferably 0.3 or more, and preferably 5.0 or less, more preferably 2.0 or less, and particularly preferably 1.0 or less. The "number of epoxy groups in the (A) epoxy resin" refers to the total value obtained by dividing the mass of the non-volatile components of the (A) epoxy resin present in the resin composition by the epoxy equivalent. The "number of active groups in the (D) curing agent" refers to the total value obtained by dividing the mass of the non-volatile components of the (D) curing agent present in the resin composition by the active group equivalent.

[0095] The amount of the (D) curing agent in the resin composition is preferably 1 mass % or more, more preferably 2 mass % or more, and particularly preferably 4 mass % or more, relative to 100 mass % of the non-volatile components of the resin composition, and is preferably 30 mass % or less, more preferably 20 mass % or less, and particularly preferably 10 mass % or less.

[0096] The amount of the curing agent in the resin composition is preferably 5% by mass or more, more preferably 10% by mass or more, and particularly preferably 15% by mass or more, relative to 100% by mass of the resin component of the resin composition, and is preferably 50% by mass or less, more preferably 40% by mass or less, and particularly preferably 30% by mass or less.

[0097] [6. (E) Curing accelerator] The resin composition according to the present embodiment may further contain a curing accelerator (E) as an optional component in combination with the above-mentioned components (A) to (D). The curing accelerator (E) as the component (E) does not include those corresponding to the above-mentioned components (A) to (D). The curing accelerator (E) functions as a curing catalyst that accelerates the curing of the epoxy resin (A).

[0098] Examples of the (E) curing accelerator include phosphorus-based curing accelerators, urea-based curing accelerators, guanidine-based curing accelerators, imidazole-based curing accelerators, metal-based curing accelerators, and amine-based curing accelerators. Among these, imidazole-based curing accelerators are preferred. The (E) curing accelerators may be used alone or in combination of two or more.

[0099] Examples of the phosphorus-based curing accelerator include aliphatic phosphonium salts such as tetrabutyl phosphonium bromide, tetrabutyl phosphonium chloride, tetrabutyl phosphonium acetate, tetrabutyl phosphonium decanoate, tetrabutyl phosphonium laurate, bis(tetrabutyl phosphonium)pyromellitate, tetrabutyl phosphonium hydrogenhexahydrophthalate, tetrabutyl phosphonium 2,6-bis[(2-hydroxy-5-methylphenyl)methyl]-4-methylphenolate, and di-tert-butyldimethylphosphonium tetraphenylborate; methyl triphenyl phosphonium bromide, ethyl triphenyl phosphonium bromide, propyl triphenyl phosphonium bromide, butyl triphenyl phosphonium bromide, benzyl triphenyl phosphonium chloride, tetraphenyl phosphonium bromide, p-tolyl triphenyl phosphonium tetra-p-tolylborate, tetraphenyl phosphonium bromide, and the like. aromatic phosphonium salts such as tetraphenylborate, tetraphenylphosphonium tetra-p-tolylborate, triphenylethylphosphonium tetraphenylborate, tris(3-methylphenyl)ethylphosphonium tetraphenylborate, tris(2-methoxyphenyl)ethylphosphonium tetraphenylborate, (4-methylphenyl)triphenylphosphonium thiocyanate, tetraphenylphosphonium thiocyanate, and butyltriphenylphosphonium thiocyanate; aromatic phosphine-borane complexes such as triphenylphosphine-triphenylborane; aromatic phosphine-quinone adducts such as triphenylphosphine-p-benzoquinone adduct; aliphatic phosphines such as tributylphosphine, tri-tert-butylphosphine, trioctylphosphine, di-tert-butyl(2-butenyl)phosphine, di-tert-butyl(3-methyl-2-butenyl)phosphine, and tricyclohexylphosphine;Dibutylphenylphosphine, di-tert-butylphenylphosphine, methyldiphenylphosphine, ethyldiphenylphosphine, butyldiphenylphosphine, diphenylcyclohexylphosphine, triphenylphosphine, tri-o-tolylphosphine, tri-m-tolylphosphine, tri-p-tolylphosphine, tris(4-ethylphenyl)phosphine, tris(4-propylphenyl)phosphine, tris(4-isopropylphenyl)phosphine, tris(4-butylphenyl)phosphine, tris(4-tert-butylphenyl)phosphine, tris(2,4-dimethylphenyl)phosphine, tris(2,5-dimethylphenyl)phosphine, tris(2,6-dimethylphenyl)phosphine Examples of aromatic phosphines include tris(3,5-dimethylphenyl)phosphine, tris(2,4,6-trimethylphenyl)phosphine, tris(2,6-dimethyl-4-ethoxyphenyl)phosphine, tris(2-methoxyphenyl)phosphine, tris(4-methoxyphenyl)phosphine, tris(4-ethoxyphenyl)phosphine, tris(4-tert-butoxyphenyl)phosphine, diphenyl-2-pyridylphosphine, 1,2-bis(diphenylphosphino)ethane, 1,3-bis(diphenylphosphino)propane, 1,4-bis(diphenylphosphino)butane, 1,2-bis(diphenylphosphino)acetylene, and 2,2'-bis(diphenylphosphino)diphenyl ether.

[0100] Examples of the urea-based curing accelerator include 1,1-dimethylurea; aliphatic dimethylureas such as 1,1,3-trimethylurea, 3-ethyl-1,1-dimethylurea, 3-cyclohexyl-1,1-dimethylurea, and 3-cyclooctyl-1,1-dimethylurea; 3-phenyl-1,1-dimethylurea, 3-(4-chlorophenyl)-1,1-dimethylurea, 3-(3,4-dichlorophenyl)-1,1-dimethylurea, 3-(3-chloro-4-methylphenyl)-1,1-dimethylurea, 3-(2-methylphenyl)-1,1-dimethylurea, 3-(4-methylphenyl)-1,1-dimethylurea, and 3-(3,4-dimethylphenyl)-1,1-dimethylurea. aromatic dimethylureas such as butylurea, 3-(4-isopropylphenyl)-1,1-dimethylurea, 3-(4-methoxyphenyl)-1,1-dimethylurea, 3-(4-nitrophenyl)-1,1-dimethylurea, 3-[4-(4-methoxyphenoxy)phenyl]-1,1-dimethylurea, 3-[4-(4-chlorophenoxy)phenyl]-1,1-dimethylurea, 3-[3-(trifluoromethyl)phenyl]-1,1-dimethylurea, N,N-(1,4-phenylene)bis(N',N'-dimethylurea), and N,N-(4-methyl-1,3-phenylene)bis(N',N'-dimethylurea) [toluene bisdimethylurea].

[0101] Examples of the guanidine curing accelerator include dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1-(o-tolyl)guanidine, dimethylguanidine, diphenylguanidine, trimethylguanidine, tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo[4.4.0]dec-5-ene, 7-methyl-1,5,7-triazabicyclo[4.4.0]dec-5-ene, 1-methylbiguanide, 1-ethylbiguanide, 1-n-butylbiguanide, 1-n-octadecylbiguanide, 1,1-dimethylbiguanide, 1,1-diethylbiguanide, 1-cyclohexylbiguanide, 1-allylbiguanide, 1-phenylbiguanide, and 1-(o-tolyl)biguanide.

[0102] Examples of the imidazole-based curing accelerator include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, and 1-benzyl-2-methylimidazole. Phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[2'-methylimidazolyl -(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-undecylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct , 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, 2-phenylimidazoline, and other imidazole compounds and adducts of imidazole compounds and epoxy resins. Commercially available imidazole curing accelerators include, for example, "1B2PZ", "2E4MZ", "2MZA-PW", "2MZ-OK", "2MA-OK", "2MA-OK-PW", "2PHZ", "2PHZ-PW", "Cl1Z", "Cl1Z-CN", "Cl1Z-CNS", and "C11Z-A" manufactured by Shikoku Chemical Industry Co., Ltd.; and "P200-H50" manufactured by Mitsubishi Chemical Corporation.

[0103] Examples of metal-based curing accelerators include organometallic complexes or organometallic salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin. Specific examples of organometallic complexes include organocobalt complexes such as cobalt(II) acetylacetonate and cobalt(III) acetylacetonate, organocopper complexes such as copper(II) acetylacetonate, organozinc complexes such as zinc(II) acetylacetonate, organoiron complexes such as iron(III) acetylacetonate, organonickel complexes such as nickel(II) acetylacetonate, and organomanganese complexes such as manganese(II) acetylacetonate. Examples of organometallic salts include zinc octylate, tin octylate, zinc naphthenate, cobalt naphthenate, tin stearate, and zinc stearate.

[0104] Examples of the amine-based curing accelerator include trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6-tris(dimethylaminomethyl)phenol, 1,8-diazabicyclo(5,4,0)-undecene, etc. Commercially available amine-based curing accelerators may be used, such as "MY-25" manufactured by Ajinomoto Fine-Techno Co., Ltd.

[0105] The amount of the (E) curing accelerator in the resin composition is preferably 0.01 mass% or more, more preferably 0.02 mass% or more, and particularly preferably 0.03 mass% or more, relative to 100 mass% of the non-volatile components of the resin composition, and is preferably 1.0 mass% or less, more preferably 0.5 mass% or less, and particularly preferably 0.1 mass% or less.

[0106] The amount of the (E) curing accelerator in the resin composition is, relative to 100 mass% of the resin components of the resin composition, preferably 0.01 mass% or more, more preferably 0.05 mass% or more, and particularly preferably 0.10 mass% or more, and is preferably 2.0 mass% or less, more preferably 1.0 mass% or less, and particularly preferably 0.5 mass% or less.

[0107] 7. (F) Optional Additives The resin composition according to the present embodiment may further contain an optional additive (F) as an optional non-volatile component in addition to the above-mentioned components (A) to (E). Examples of the optional additive (F) include organometallic compounds such as organocopper compounds, organozinc compounds, and organocobalt compounds; leveling agents such as silicone-based leveling agents and acrylic polymer-based leveling agents; thickeners such as bentone and montmorillonite; defoamers such as silicone-based defoamers, acrylic defoamers, fluorine-based defoamers, and vinyl resin-based defoamers; ultraviolet absorbers such as benzotriazole-based ultraviolet absorbers; adhesion improvers such as urea silane; adhesion imparters such as triazole-based adhesion imparters, tetrazole-based adhesion imparters, and triazine-based adhesion imparters; antioxidants such as hindered phenol-based antioxidants; fluorescent brighteners such as stilbene derivatives; fluorine-based anti-oxidants; and the like. surfactants such as phosphate-based surfactants and silicone-based surfactants; flame retardants such as phosphorus-based flame retardants (e.g., phosphate ester compounds, phosphazene compounds, phosphinic acid compounds, red phosphorus), nitrogen-based flame retardants (e.g., melamine sulfate), halogen-based flame retardants, and inorganic flame retardants (e.g., antimony trioxide); dispersants such as phosphate ester-based dispersants, polyoxyalkylene-based dispersants, acetylene-based dispersants, silicone-based dispersants, anionic dispersants, and cationic dispersants; stabilizers such as borate-based stabilizers, titanate-based stabilizers, aluminate-based stabilizers, zirconate-based stabilizers, isocyanate-based stabilizers, carboxylic acid-based stabilizers, and carboxylic anhydride-based stabilizers. (F) Optional additives may be used alone or in combination of two or more.

[0108] [8. (G) Solvent] The resin composition according to the present embodiment may further contain a (G) solvent as an optional volatile component in addition to the non-volatile components such as the above-mentioned components (A) to (F). As the (G) solvent, an organic solvent is usually used. Examples of the organic solvent include ketone-based solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; ester-based solvents such as methyl acetate, ethyl acetate, butyl acetate, isobutyl acetate, isoamyl acetate, methyl propionate, ethyl propionate, and γ-butyrolactone; ether-based solvents such as tetrahydropyran, tetrahydrofuran, 1,4-dioxane, diethyl ether, diisopropyl ether, dibutyl ether, diphenyl ether, and anisole; alcohol-based solvents such as methanol, ethanol, propanol, butanol, and ethylene glycol; 2-ethoxyethyl acetate, propylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, ethyl diglycol acetate, γ-butyrolactone, and methyl methoxypropionate. Examples of the solvent include ether ester solvents such as ethyl acetate, ester alcohol solvents such as methyl lactate, ethyl lactate, and methyl 2-hydroxyisobutyrate, ether alcohol solvents such as 2-methoxypropanol, 2-methoxyethanol, 2-ethoxyethanol, propylene glycol monomethyl ether, and diethylene glycol monobutyl ether (butylcarbitol), amide solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, and N-methyl-2-pyrrolidone, sulfoxide solvents such as dimethyl sulfoxide, nitrile solvents such as acetonitrile and propionitrile, aliphatic hydrocarbon solvents such as hexane, cyclopentane, cyclohexane, and methylcyclohexane, and aromatic hydrocarbon solvents such as benzene, toluene, xylene, ethylbenzene, and trimethylbenzene. The (G) solvent may be used alone or in combination of two or more.

[0109] The amount of (G) solvent is not particularly limited, but when all components in the resin composition are taken as 100 mass%, it can be, for example, 60 mass% or less, 40 mass% or less, 30 mass% or less, 20 mass% or less, 15 mass% or less, 10 mass% or less, or it can be 0 mass%.

[0110] [9. Method for producing resin composition] The resin composition according to the present embodiment can be produced, for example, by mixing the above-mentioned components. The above-mentioned components may be mixed partially or entirely at the same time, or may be mixed in sequence. In the process of mixing each component, the temperature may be appropriately set, and thus heating and / or cooling may be performed temporarily or throughout. In addition, stirring or shaking may be performed in the process of mixing each component.

[0111] [10. Properties of resin composition and its cured product] According to the resin composition of this embodiment, a cured product capable of suppressing warpage can be obtained. Therefore, when a laminate is obtained by forming a layer of the cured product of the resin composition (hereinafter, sometimes referred to as "cured product layer") on a substrate such as a silicon wafer, the amount of warpage of the laminate can be reduced. For example, when a laminate is manufactured by the method described in the section [Evaluation of Warpage] of the Examples described later and the amount of warpage is measured, the amount of warpage can be reduced to 1.5 mm or less.

[0112] According to the resin composition of this embodiment, a cured product having excellent adhesion to a conductor layer can be obtained. Therefore, when a cured product layer of the resin composition is formed so as to contact with the conductor layer, peeling between the conductor layer and the cured product layer can be suppressed. For example, when the copper foil adhesion strength is measured by the method described in the section [Evaluation of copper foil adhesion strength] of the examples described later, a copper foil adhesion strength of preferably 0.53 kgf / cm or more, more preferably 0.57 kgf / cm or more, particularly preferably 0.60 kgf / cm or more can be obtained.

[0113] According to the resin composition of this embodiment, it is usually possible to obtain a cured product having excellent adhesion to silicon. Therefore, when a cured layer of the resin composition is formed so as to contact a member formed of silicon, peeling between the member and the cured layer can be suppressed. For example, when the silicon adhesion strength is measured by the method described in the section [Evaluation of silicon adhesion strength] of the examples described later, it is preferably 550 kgf / cm 2 Above, preferably 570kgf / cm 2 More preferably, 590 kgf / cm 2 The above-mentioned Si adhesion strength can be obtained.

[0114] According to the resin composition of this embodiment, a cured product having a small elastic modulus can usually be obtained. The present inventor believes that the fact that the cured product has such a small elastic modulus is one of the reasons for obtaining the effects of excellent adhesion and suppression of warping as described above. For example, when the tensile modulus of the cured product of the resin composition is measured by the method described in the section [Measurement of Elastic Modulus] of the Examples described later, a tensile modulus of preferably 16 GPa or less, more preferably 15 GPa or less, and particularly preferably 14.5 GPa or less can be obtained. There is no particular limit to the lower limit, but it can be, for example, 5 GPa or more.

[0115] According to the resin composition of this embodiment, it is usually possible to have a low minimum melt viscosity. Therefore, when sealing is performed with the resin composition, the formation of gaps that are not filled with the resin composition can be suppressed. For example, when the minimum melt viscosity of the resin composition is measured by the method described in the section [Melt Viscosity Measurement] of the Examples described later, it is possible to obtain a minimum melt viscosity of preferably 9000 poise or less, more preferably 8000 poise or less, and particularly preferably 7500 poise or less. There is no particular restriction on the lower limit, but it may be preferably 500 poise or more, more preferably 1000 poise or more, and particularly preferably 2000 poise or more.

[0116] Since the resin composition has the above-mentioned characteristics, it can be suitably used as a resin composition for an encapsulation layer, particularly as a resin composition for encapsulating a semiconductor (a resin composition for semiconductor encapsulation), preferably as a resin composition for encapsulating a semiconductor chip (a resin composition for semiconductor chip encapsulation). The resin composition may also be used as a resin composition for an insulating layer other than encapsulation. For example, the resin composition can be suitably used as a resin composition for forming an insulating layer of a semiconductor chip package (a resin composition for an insulating layer of a semiconductor chip package) and a resin composition for forming an insulating layer of a circuit board (including a printed wiring board) (a resin composition for an insulating layer of a circuit board).

[0117] Examples of semiconductor chip packages include FC-CSP, MIS-BGA package, ETS-BGA package, Fan-out type WLP (Wafer Level Package), Fan-in type WLP, Fan-out type PLP (Panel Level Package), and Fan-in type PLP.

[0118] The resin composition may also be used as an underfill material, for example, as a material for MUF (Molding Under Filling) that is used after a semiconductor chip is connected to a substrate.

[0119] Furthermore, the resin composition can be used in a wide range of applications in which resin compositions are used, such as resin sheets, sheet-like laminate materials such as prepregs, solder resists, die bonding materials, hole filling resins, and component embedding resins.

[0120] [11. Resin sheet] A resin sheet according to one embodiment of the present invention has a support and a resin composition layer formed on the support. Since the resin composition layer is a layer formed from a resin composition, it usually contains the above-mentioned resin composition, and preferably contains only the above-mentioned resin composition.

[0121] From the viewpoint of thinning, the thickness of the resin composition layer is preferably 600 μm or less, more preferably 550 μm or less, and even more preferably 500 μm or less, 400 μm or less, 350 μm or less, 300 μm or less, or 200 μm or less. The lower limit of the thickness of the resin composition layer is not particularly limited and can be, for example, 1 μm or more, 5 μm or more, 10 μm or more, etc.

[0122] Examples of the support include films made of plastic materials, metal foils, and release papers, with films made of plastic materials and metal foils being preferred.

[0123] When a film made of a plastic material is used as the support, examples of the plastic material include polyesters such as polyethylene terephthalate (hereinafter sometimes abbreviated as "PET") and polyethylene naphthalate (hereinafter sometimes abbreviated as "PEN"); polycarbonate (hereinafter sometimes abbreviated as "PC"); acrylic polymers such as polymethyl methacrylate (hereinafter sometimes abbreviated as "PMMA"); cyclic polyolefins; triacetyl cellulose (hereinafter sometimes abbreviated as "TAC"); polyether sulfide (hereinafter sometimes abbreviated as "PES"); polyether ketone; polyimide; and the like. Among these, polyethylene terephthalate and polyethylene naphthalate are preferred, and inexpensive polyethylene terephthalate is particularly preferred.

[0124] When a metal foil is used as the support, examples of the metal foil include copper foil and aluminum foil. Among them, copper foil is preferable. As the copper foil, a foil made of a single metal of copper may be used, or a foil made of an alloy of copper and another metal (e.g., tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.) may be used.

[0125] The surface of the support to be bonded to the resin composition layer may be subjected to a matte treatment, a corona treatment, an antistatic treatment or the like.

[0126] In addition, the support may be a support with a release layer having a release layer on the surface to be bonded to the resin composition layer. Examples of the release agent used in the release layer of the support with a release layer include one or more release agents selected from the group consisting of alkyd resins, polyolefin resins, urethane resins, and silicone resins. Examples of commercially available release agents include alkyd resin-based release agents such as "SK-1", "AL-5", and "AL-7" manufactured by Lintec Corporation. Examples of the support with a release layer include "Lumirror T60" manufactured by Toray Industries, Inc.; "Purex" manufactured by Teijin Limited; and "Unipeel" manufactured by Unitika Limited.

[0127] The thickness of the support is preferably in the range of 5 μm to 75 μm, more preferably in the range of 10 μm to 60 μm. When a support with a release layer is used, the total thickness of the support with a release layer is preferably in the above range.

[0128] The resin sheet can be produced, for example, by applying the resin composition onto a support using a coating device such as a die coater. If necessary, the resin composition may be dissolved in a solvent to prepare a resin varnish, and the resin sheet may be produced by applying the resin varnish. By using a solvent, the viscosity can be adjusted to improve the coatability. When the resin varnish is used, the resin varnish is usually dried after application to form a resin composition layer.

[0129] As the solvent, for example, those described as the solvent that the resin composition can contain can be used. The solvent may be used alone or in combination of two or more kinds in any ratio.

[0130] Drying may be performed by a known method such as heating or hot air blowing. Drying conditions are such that the content of the solvent in the resin composition layer is usually 10% by mass or less, preferably 5% by mass or less. Although it varies depending on the boiling point of the solvent, for example, when a resin varnish containing 30% by mass to 60% by mass of an organic solvent is used, the resin composition layer can be formed by drying at 50°C to 150°C for 3 minutes to 10 minutes.

[0131] The resin sheet may include any layer other than the support and the resin composition layer as necessary. For example, in the resin sheet, a protective film similar to that of the support may be provided on the surface of the resin composition layer not bonded to the support (i.e., the surface opposite to the support). The thickness of the protective film is, for example, 1 μm to 40 μm. The protective film can prevent the adhesion of dirt and the like to the surface of the resin composition layer and scratches. When the resin sheet has a protective film, the resin sheet can be used by peeling off the protective film. In addition, the resin sheet can be stored by being wound into a roll.

[0132] The resin sheet can be suitably used to seal a semiconductor chip (semiconductor chip sealing resin sheet). Applicable semiconductor chip packages include, for example, fan-out type WLP, fan-in type WLP, fan-out type PLP, and fan-in type PLP. The resin sheet can also be used to seal a circuit board (circuit board sealing resin sheet).

[0133] The resin sheet can also be suitably used to form an insulating layer in the manufacture of a semiconductor chip package (resin sheet for insulating a semiconductor chip package). For example, the resin sheet can be used to form an insulating layer of a circuit board (resin sheet for insulating a circuit board). Examples of packages using such boards include FC-CSP, MIS-BGA packages, and ETS-BGA packages.

[0134] Furthermore, the resin sheet may be used as a material for the MUF that is used after the semiconductor chip is connected to the substrate.

[0135] The resin sheet can also be used in a wide range of other applications requiring high insulation reliability, for example, the resin sheet can be suitably used to form an insulating layer for a circuit board such as a printed wiring board.

[0136] [12. Circuit board] A circuit board according to one embodiment of the present invention includes a cured product of a resin composition. Usually, the circuit board includes a cured product layer formed of the cured product of the resin composition. Usually, the cured product layer can function as an insulating layer or a sealing layer, and preferably functions as a sealing layer. For example, the circuit board can be manufactured by a manufacturing method including the following steps (1) and (2). (1) A step of forming a resin composition layer on a substrate. (2) A step of curing the resin composition layer to form a cured layer.

[0137] In step (1), a substrate is prepared. Examples of the substrate include glass epoxy substrates, metal substrates (such as stainless steel and cold-rolled steel plate (SPCC)), polyester substrates, polyimide substrates, BT resin substrates, and thermosetting polyphenylene ether substrates. The substrate may have a metal layer such as copper foil on the surface as a part of the substrate. For example, a substrate having a peelable first metal layer and a second metal layer on both surfaces may be used. When such a substrate is used, a conductor layer as a wiring layer that can function as a circuit wiring is usually formed on the surface of the second metal layer opposite to the first metal layer. Examples of materials for the metal layer include copper foil, copper foil with a carrier, and materials for the conductor layer described later, and copper foil is preferred. Examples of substrates having a metal layer include an ultra-thin copper foil with a carrier "Micro Thin" manufactured by Mitsui Mining & Smelting Co., Ltd.

[0138] A conductor layer may be formed on one or both surfaces of the substrate. In the following description, a member including a substrate and a conductor layer formed on the substrate surface may be referred to as a "substrate with wiring layer" as appropriate. Examples of the conductor material included in the conductor layer include materials including one or more metals selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin, and indium. The conductor material may be a single metal or an alloy. Examples of the alloy include alloys of two or more metals selected from the above group (e.g., nickel-chromium alloy, copper-nickel alloy, and copper-titanium alloy). Among them, from the viewpoints of versatility, cost, and ease of patterning in the formation of the conductor layer, chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper as single metals; and alloys of nickel-chromium alloy, copper-nickel alloy, and copper-titanium alloy as alloys; are preferred. Among these, the single metals chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver and copper; and nickel-chromium alloys; are more preferable, and the single metal copper is particularly preferable.

[0139] The conductor layer may be patterned to function as, for example, a wiring layer. In this case, the line (circuit width) / space (width between circuits) ratio of the conductor layer is not particularly limited, but is preferably 20 / 20 μm or less (i.e., pitch is 40 μm or less), more preferably 10 / 10 μm or less, even more preferably 5 / 5 μm or less, even more preferably 1 / 1 μm or less, and particularly preferably 0.5 / 0.5 μm or more. The pitch may be uniform or non-uniform throughout the conductor layer. The minimum pitch of the conductor layer may be, for example, 40 μm or less, 36 μm or less, or 30 μm or less.

[0140] The thickness of the conductor layer depends on the design of the circuit board, but is preferably 3 μm to 35 μm, more preferably 5 μm to 30 μm, further preferably 10 μm to 20 μm, and particularly preferably 15 μm to 20 μm.

[0141] After preparing the substrate, a resin composition layer is formed on the substrate. When a conductor layer is formed on the surface of the substrate, the resin composition layer is preferably formed so that the conductor layer is embedded in the resin composition layer.

[0142] The resin composition layer is formed, for example, by laminating a resin sheet and a substrate. This lamination can be performed, for example, by bonding the resin sheet to the substrate from the support side under heat and pressure, thereby laminating the resin composition layer to the substrate. Examples of a member for heat-pressing the resin sheet to the substrate (hereinafter, sometimes referred to as a "heat-pressing member") include a heated metal plate (such as a SUS plate) or a metal roll (such as a SUS roll). It is preferable to press the heat-pressing member not directly onto the resin sheet, but via an elastic material such as heat-resistant rubber so that the resin sheet can sufficiently follow the surface irregularities of the substrate.

[0143] The lamination of the substrate and the resin sheet may be carried out, for example, by a vacuum lamination method. The lamination conditions may be, for example, as follows. The thermocompression temperature is preferably in the range of 60°C to 160°C, more preferably 80°C to 140°C. The thermocompression pressure is preferably in the range of 0.098 MPa to 1.77 MPa, more preferably 0.29 MPa to 1.47 MPa. The thermocompression time is preferably in the range of 20 seconds to 400 seconds, more preferably 30 seconds to 300 seconds. The lamination is preferably carried out under reduced pressure conditions of a pressure of 13 hPa or less.

[0144] After lamination, the laminated resin sheets may be smoothed under normal pressure (atmospheric pressure), for example, by pressing the support side with a thermocompression member. The pressing conditions for the smoothing treatment may be the same as the thermocompression conditions for the lamination. The lamination and smoothing treatment may be performed successively using a vacuum laminator.

[0145] After forming the resin composition layer on the substrate, the resin composition layer is thermally cured to form a cured layer. The thermal curing conditions for the resin composition layer may vary depending on the type of resin composition, but the curing temperature is usually in the range of 120°C to 240°C (preferably in the range of 150°C to 220°C, more preferably in the range of 170°C to 200°C), and the curing time is in the range of 5 minutes to 120 minutes (preferably in the range of 10 minutes to 100 minutes, more preferably in the range of 15 minutes to 90 minutes).

[0146] Before the resin composition layer is thermally cured, the resin composition layer may be subjected to a preheating treatment at a temperature lower than the curing temperature. For example, prior to thermally curing the resin composition layer, the resin composition layer may be preheated at a temperature of usually 50° C. or more and less than 120° C. (preferably 60° C. or more and 110° C. or less, more preferably 70° C. or more and 100° C. or less) for usually 5 minutes or more (preferably 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes).

[0147] In the manner described above, a circuit board having a cured layer formed of a cured product of the resin composition can be produced. The method for producing a circuit board may further include any optional step. For example, when a circuit board is manufactured using a resin sheet, the manufacturing method of the circuit board may include a step of peeling off the support of the resin sheet. The support may be peeled off before or after the resin composition layer is thermally cured.

[0148] The method for producing a circuit board may include, for example, a step of polishing the surface of the cured layer after forming the cured layer. The polishing method is not particularly limited. Examples of the polishing method include a chemical mechanical polishing method using a chemical mechanical polishing device, a mechanical polishing method using a buff, and a surface grinding method using a rotating grindstone.

[0149] The method for producing a circuit board may include, for example, a step (3) of connecting the conductor layers between layers. An example of a method for connecting the layers between layers is a method of drilling holes in the cured material layer. By drilling holes, holes such as via holes and through holes can be formed in the cured material layer. Examples of a method for forming via holes include laser irradiation, etching, and mechanical drilling. The size and shape of the via holes may be appropriately determined depending on the design of the circuit board. In addition, in the step (3), the interlayer connection may be performed by polishing or grinding the cured material layer.

[0150] After the via holes are formed, it is preferable to carry out a step of removing smears in the via holes. This step is sometimes called a desmear step. For example, when the conductive layer is formed on the cured material layer by a plating step, the via holes may be subjected to a wet desmear treatment. When the conductive layer is formed on the cured material layer by a sputtering step, a dry desmear step such as a plasma treatment step may be carried out. Furthermore, the cured material layer may be subjected to a roughening treatment by the desmear step.

[0151] In addition, before forming a conductor layer on the cured layer, the cured layer may be subjected to a roughening treatment. According to this roughening treatment, the surface of the cured layer including the inside of the via hole is usually roughened. The roughening treatment may be either a dry type or a wet type. An example of the dry type roughening treatment is a plasma treatment. An example of the wet type roughening treatment is a method in which a swelling treatment using a swelling liquid, a roughening treatment using an oxidizing agent, and a neutralization treatment using a neutralizing liquid are performed in this order.

[0152] After the via holes are formed, a conductor layer may be formed on the cured layer. By forming a conductor layer at the position where the via holes are formed, the newly formed conductor layer and the conductor layer on the surface of the substrate are electrically connected to each other, and interlayer connection is performed. Examples of the method for forming the conductor layer include plating, sputtering, and vapor deposition. For example, a conductor layer having a desired wiring pattern may be formed by plating the surface of the cured layer by an appropriate method such as a semi-additive method or a full-additive method. In addition, for example, when the support in the resin sheet is a metal foil, a conductor layer having a desired wiring pattern may be formed by a subtractive method. The material of the conductor layer formed may be a single metal or an alloy. In addition, this conductor layer may have a single layer structure, or may have a multi-layer structure including two or more layers of different types of materials.

[0153] Here, an example of an embodiment in which a conductor layer is formed on a cured material layer will be described in detail. A plating seed layer is formed on the surface of the cured material layer by electroless plating. Then, a mask pattern is formed on the formed plating seed layer, exposing a part of the plating seed layer in accordance with a desired wiring pattern. After forming an electrolytic plating layer on the exposed plating seed layer by electrolytic plating, the mask pattern is removed. Thereafter, unnecessary plating seed layer is removed by a process such as etching, and a conductor layer having a desired wiring pattern can be formed.

[0154] The method for producing a circuit board may include a step (4) of removing the substrate. By removing the substrate, a circuit board having a cured layer and a conductor layer embedded in the cured layer is obtained. This step (4) can be carried out, for example, when a substrate having a peelable metal layer is used.

[0155] [13. Semiconductor chip packages] A semiconductor chip package according to an embodiment of the present invention includes a cured product of a resin composition. Examples of this semiconductor chip package include the following.

[0156] The semiconductor chip package according to the first example includes the above-mentioned circuit board and a semiconductor chip mounted on the circuit board. This semiconductor chip package can be manufactured by bonding the semiconductor chip to the circuit board.

[0157] The bonding conditions between the circuit board and the semiconductor chip may be any conditions that allow conductive connection between the terminal electrodes of the semiconductor chip and the circuit wiring of the circuit board. For example, the conditions used in flip-chip mounting of the semiconductor chip may be used. Also, for example, the semiconductor chip and the circuit board may be bonded via an insulating adhesive.

[0158] An example of a bonding method is a method of bonding a semiconductor chip to a circuit board. The bonding conditions are that the bonding temperature is usually in the range of 120°C to 240°C (preferably in the range of 130°C to 200°C, more preferably in the range of 140°C to 180°C), and the bonding time is usually in the range of 1 second to 60 seconds (preferably in the range of 5 seconds to 30 seconds).

[0159] Another example of the bonding method is a method of bonding a semiconductor chip to a circuit board by reflow. The reflow conditions may be in the range of 120°C to 300°C.

[0160] After the semiconductor chip is bonded to the circuit board, the semiconductor chip may be filled with a molded underfill material, which is preferably the resin composition according to the above embodiment.

[0161] The semiconductor chip package according to the second example includes a semiconductor chip and a cured product of a resin composition that encapsulates the semiconductor chip. In such a semiconductor chip package, the cured product of the resin composition usually functions as an encapsulation layer. Examples of the semiconductor chip package according to the second example include a fan-out type WLP and a fan-out type PLP.

[0162] Fig. 1 is a cross-sectional view showing a fan-out type WLP as an example of a semiconductor chip package according to an embodiment of the present invention. A semiconductor chip package 100 as a fan-out type WLP includes, for example, a semiconductor chip 110, a sealing layer 120 formed to cover the periphery of the semiconductor chip 110, a rewiring formation layer 130 as an insulating layer provided on the surface of the semiconductor chip 110 opposite to the sealing layer 120, a rewiring layer 140 as a conductor layer, a solder resist layer 150, and bumps 160, as shown in Fig. 1.

[0163] The method for manufacturing such a semiconductor chip package includes: (A) a step of laminating a temporary fixing film on a substrate; (B) a step of temporarily fixing a semiconductor chip on a temporary fixing film; (C) forming an encapsulation layer on the semiconductor chip; (D) peeling the substrate and the temporary fixing film from the semiconductor chip; (E) a step of forming a rewiring formation layer on the surface from which the substrate and the temporary fixing film of the semiconductor chip have been peeled off; (F) forming a rewiring layer as a conductor layer on the rewiring formation layer; and (G) forming a solder resist layer on the rewiring layer; The method for manufacturing the semiconductor chip package further comprises: (H) A process of dicing and separating multiple semiconductor chip packages into individual semiconductor chip packages. may also include

[0164] (Process (A)) Step (A) is a step of laminating a temporary fixing film on a substrate. The lamination conditions for the substrate and the temporary fixing film can be the same as the lamination conditions for the substrate and the resin sheet in the method for producing a circuit board.

[0165] Examples of the substrate include silicon wafers; glass wafers; glass substrates; metal substrates such as copper, titanium, stainless steel, and cold-rolled steel (SPCC); substrates such as FR-4 substrates in which glass fibers are impregnated with epoxy resin or the like and then heat-cured; and substrates made of bismaleimide triazine resins such as BT resin.

[0166] The temporary fixing film may be made of any material that can be peeled off from the semiconductor chip and can temporarily fix the semiconductor chip. Commercially available products include "Riva Alpha" manufactured by Nitto Denko Corporation.

[0167] (Process (B)) Step (B) is a step of temporarily fixing the semiconductor chip on the temporary fixing film. The temporary fixing of the semiconductor chip can be performed using, for example, a device such as a flip chip bonder or a die bonder. The layout and number of the semiconductor chips can be appropriately set depending on the shape and size of the temporary fixing film, the number of semiconductor chip packages to be produced, etc. For example, the semiconductor chips may be temporarily fixed by arranging them in a matrix shape of multiple rows and multiple columns.

[0168] (Process (C)) Step (C) is a step of forming an encapsulating layer on a semiconductor chip. The encapsulating layer can be formed by a cured product of the resin composition according to the above-mentioned embodiment. The encapsulating layer is usually formed by a method including a step of forming a resin composition layer on a semiconductor chip and a step of thermally curing the resin composition layer to form a cured product layer as the encapsulating layer. The formation of the resin composition layer on the semiconductor chip can be performed by the same method as the method of forming the resin composition layer on the substrate explained in the above-mentioned method for producing a circuit board, except that a semiconductor chip is used instead of the substrate.

[0169] After forming a resin composition layer on the semiconductor chip, the resin composition layer is thermally cured to obtain an encapsulation layer that covers the semiconductor chip. This encapsulates the semiconductor chip with a cured product of the resin composition. The thermal curing conditions of the resin composition layer may be the same as the thermal curing conditions of the resin composition layer in the manufacturing method of the circuit board. Furthermore, before thermally curing the resin composition layer, a preheating treatment may be performed on the resin composition layer at a temperature lower than the curing temperature. The treatment conditions of this preheating treatment may be the same as the preheating treatment in the manufacturing method of the circuit board.

[0170] (Process (D)) Step (D) is a step of peeling off the substrate and the temporary fixing film from the semiconductor chip. It is desirable to adopt an appropriate peeling method according to the material of the temporary fixing film. For example, the peeling method may be a method of heating, foaming or expanding the temporary fixing film to peel it off. In addition, for example, the peeling method may be a method of irradiating the temporary fixing film with ultraviolet light through the substrate to reduce the adhesive strength of the temporary fixing film to peel it off.

[0171] In the method of peeling off the temporary fixing film by heating, foaming or expanding it, the heating conditions are usually 100° C. to 250° C. for 1 second to 90 seconds or 5 minutes to 15 minutes. In the method of peeling off the temporary fixing film by reducing the adhesive strength of the temporary fixing film by irradiating it with ultraviolet light, the irradiation amount of ultraviolet light is usually 10 mJ / cm 2 ~1000mJ / cm 2 It is.

[0172] When the base material and the temporary fixing film are peeled off from the semiconductor chip as described above, the surface of the encapsulation layer is exposed. The manufacturing method of the semiconductor chip package may include polishing the exposed surface of the encapsulation layer. The polishing can improve the smoothness of the surface of the encapsulation layer. The polishing method can be the same as that described in the manufacturing method of the circuit board.

[0173] (Process (E)) Step (E) is a step of forming a rewiring formation layer as an insulating layer on the surface of the semiconductor chip from which the base material and the temporary fixing film have been peeled off. Usually, this rewiring formation layer is formed on the semiconductor chip and the sealing layer. The rewiring formation layer can be formed, for example, from a photosensitive resin composition or a thermosetting resin composition. After forming the rewiring formation layer, a via hole is usually formed in the rewiring formation layer to connect the semiconductor chip and the rewiring layer to each other.

[0174] (Process (F)) Step (F) is a step of forming a rewiring layer as a conductor layer on the rewiring formation layer. The method of forming the rewiring layer on the rewiring formation layer may be the same as the method of forming a conductor layer on the cured layer in the method of manufacturing a circuit board. Steps (E) and (F) may be repeated to alternately stack the rewiring layers and the rewiring formation layers (build up).

[0175] (Process (G)) Step (G) is a step of forming a solder resist layer on the rewiring layer. The material of the solder resist layer can be any material having insulating properties. Among them, photosensitive resin compositions and thermosetting resin compositions are preferred from the viewpoint of ease of manufacturing the semiconductor chip package.

[0176] In step (G), bumping processing may be performed to form bumps, if necessary. The bumping processing can be performed by a method such as solder balls or solder plating. In addition, the formation of via holes in the bumping processing can be performed in the same manner as in step (E).

[0177] (Process (H)) The method for manufacturing a semiconductor chip package may include a step (H) in addition to the steps (A) to (G). The step (H) is a step of dicing a plurality of semiconductor chip packages into individual semiconductor chip packages to separate them. The method for dicing the semiconductor chip packages into individual semiconductor chip packages is not particularly limited.

[0178] A third example of a semiconductor chip package is a semiconductor chip package 100, an example of which is shown in FIG. 1, in which the rewiring formation layer 130 or the solder resist layer 150 is formed from a cured product of the resin composition according to the above-mentioned embodiment.

[0179] [14. Semiconductor Devices] A semiconductor device according to an embodiment of the present invention includes the above-mentioned circuit board or semiconductor chip package. Examples of the semiconductor device include various semiconductor devices used in electrical products (e.g., computers, mobile phones, smartphones, tablet devices, wearable devices, digital cameras, medical devices, televisions, etc.) and vehicles (e.g., motorcycles, automobiles, trains, ships, aircraft, etc.). EXAMPLES

[0180] The present invention will be specifically described below with reference to examples. However, the present invention is not limited to the examples shown below. In the following description, "parts" and "%" representing amounts mean "parts by mass" and "% by mass", respectively, unless otherwise specified. Furthermore, the temperature and pressure conditions were room temperature (25°C) and atmospheric pressure (1 atm), unless otherwise specified.

[0181] [Explanation of inorganic filler] The inorganic fillers used in the following Examples and Comparative Examples are as follows. Inorganic filler 1: Spherical silica particles (average particle size 1 μm, specific surface area 4.5 m) surface-treated with an aminosilane coupling agent ("KBM573" manufactured by Shin-Etsu Chemical Co., Ltd.) 2 / g). Inorganic filler 2: Spherical alumina particles (average particle size 1.5 μm, specific surface area 1.6 m) surface-treated with an aminosilane coupling agent ("KBM573" manufactured by Shin-Etsu Chemical Co., Ltd.) 2 / g).

[0182] [Production Example 1. Production of Elastomer 1] In a reaction vessel, 69 g of bifunctional hydroxyl-terminated polybutadiene (number average molecular weight = 5047 (GPC method), hydroxyl group equivalent = 1800 g / eq., solid content 100 mass%, "G-3000" manufactured by Nippon Soda Co., Ltd.), 40 g of aromatic hydrocarbon mixed solvent ("IPZOL 150" manufactured by Idemitsu Petrochemical Co., Ltd.), and 0.005 g of dibutyltin laurate were mixed and dissolved uniformly. When the mixture became uniform, the temperature was raised to 50°C, and 8 g of isophorone diisocyanate (IPDI, isocyanate group equivalent = 113 g / eq, manufactured by Evonik Degussa Japan Co., Ltd.) was added with further stirring, and the reaction was carried out for about 3 hours. The reaction mixture was then cooled to room temperature, and 23 g of cresol novolak resin (DIC "KA-1160", hydroxyl equivalent = 117 g / eq.) and 60 g of ethyl diglycol acetate (Daicel) were added thereto, and the mixture was heated to 80°C with stirring and reacted for about 4 hours. -1 The disappearance of the NCO peak was confirmed. The disappearance of the NCO peak was regarded as the end point of the reaction, and the reaction mixture was cooled to room temperature and filtered through a 100 mesh filter cloth to obtain an elastomer 1 (non-volatile content 50% by mass) having a polybutadiene structure and a phenolic hydroxyl group. The number average molecular weight was 5,500.

[0183] [Production Example 2. Production of Elastomer 2] In a reaction vessel, 50 g of bifunctional hydroxyl-terminated polybutadiene (number average molecular weight = 5047 (GPC method), hydroxyl equivalent = 1800 g / eq., solid content 100 mass%: "G-3000" manufactured by Nippon Soda Co., Ltd.), 23.5 g of aromatic hydrocarbon mixed solvent ("IPZOL 150" manufactured by Idemitsu Petrochemical Co., Ltd.), and 0.005 g of dibutyltin laurate were mixed and dissolved uniformly. When the mixture became uniform, the temperature was raised to 50°C, and 4.8 g of toluene-2,4-diisocyanate (isocyanate equivalent = 87.08 g / eq.) was added while further stirring, and the reaction was carried out for about 3 hours. Next, the reaction mixture was cooled to room temperature, and 8.96 g of benzophenonetetracarboxylic dianhydride (acid anhydride equivalent = 161.1 g / eq.), 0.07 g of triethylenediamine, and 40.4 g of ethyl diglycol acetate (manufactured by Daicel Corporation) were added thereto, and the mixture was heated to 130°C with stirring and reacted for about 4 hours. -1 The disappearance of the NCO peak was confirmed. The disappearance of the NCO peak was regarded as the end point of the reaction, and the reaction mixture was cooled to room temperature and filtered through a 100 mesh filter cloth to obtain an elastomer 2 (non-volatile content 50 mass%) having an imide structure, a urethane structure, and a polybutadiene structure. The number average molecular weight was 13,700.

[0184] [Production Example 3. Production of Elastomer 3] In a reaction vessel, 80 g of polycarbonate diol (number average molecular weight: about 1,000, hydroxyl equivalent: 500 g / eq., non-volatile content: 100%, "C-1015N" manufactured by Kuraray Co., Ltd.) and 0.01 g of dibutyltin dilaurate were uniformly dissolved in 37.6 g of diethylene glycol monoethyl ether acetate ("Ethyl diglycol acetate" manufactured by Daicel Corporation). The mixture was then heated to 50°C, and 27.8 g of toluene-2,4-diisocyanate (isocyanate equivalent: 87.08) was added while stirring, and the reaction was carried out for about 3 hours. After cooling the reaction mixture to room temperature, 14.3 g of benzophenonetetracarboxylic dianhydride (acid anhydride equivalent: 161.1 g / eq.), 0.12 g of triethylenediamine, and 84.0 g of diethylene glycol monoethyl ether acetate (Daicel Corporation's "Ethyl Diglycol Acetate") were added thereto, and the mixture was heated to 130°C with stirring and reacted for about 4 hours. -1 The disappearance of the NCO peak was confirmed. The disappearance of the NCO peak was regarded as the end point of the reaction, and the reaction mixture was cooled to room temperature and filtered through a 100 mesh filter cloth to obtain an elastomer 3 (non-volatile content 50% by mass) having an imide structure, a urethane structure, and a polycarbonate structure. The number average molecular weight was 8,500.

[0185] [Example 1] Two parts of a liquid chelate-type epoxy resin (ADEKA Corporation's "EP-49-10P," epoxy equivalent 240 g / eq., chelate modification amount (phosphate modification amount) 1.0 mass%), four parts of a liquid epoxy resin (Nippon Steel Sumikin Chemical Co., Ltd.'s "ZX1059," a 1:1 mixture (mass ratio) of bisphenol A type epoxy resin and bisphenol F type epoxy resin, epoxy equivalent: 169 g / eq.), and three parts of a bixylenol type epoxy resin (Mitsubishi Chemical Corporation's "YX4000H," epoxy equivalent 185 g / eq.) were dissolved in 10 parts of MEK by heating with stirring. After cooling to room temperature, 16 parts of elastomer 1 (non-volatile content 50% by mass), 10 parts of a phenol-based curing agent having a triazine skeleton and a novolac structure (DIC Corporation's "LA-3018-50P", active group equivalent of approximately 151 g / eq., 2-methoxypropanol solution with a solid content of 50%), 1 part of an imidazole-based curing accelerator (Shikoku Chemical Industry Co., Ltd.'s "1B2PZ", 1-benzyl-2-phenylimidazole, MEK solution with a solid content of 5% by mass), 75 parts of inorganic filler 1, and 10 parts of MEK were mixed and uniformly dispersed using a high-speed rotating mixer, and then filtered with a cartridge filter (ROKITECHNO Corporation's "SHP020") to produce a resin varnish.

[0186] [Example 2] The amount of chelate type epoxy resin (ADEKA Corporation "EP-49-10P", epoxy equivalent 240 g / eq.) was changed to 1.5 parts, and the amount of elastomer 1 (non-volatile content 50 mass%) was changed to 18 parts. A resin varnish was produced in the same manner as in Example 1 except for the above.

[0187] [Example 3] The amount of chelate type epoxy resin (ADEKA Corporation "EP-49-10P", epoxy equivalent 240 g / eq.) was changed to 0.7 parts, and the amount of elastomer 1 (non-volatile content 50 mass%) was changed to 19 parts. A resin varnish was produced in the same manner as in Example 1 except for the above.

[0188] [Example 4] The amount of chelate type epoxy resin (ADEKA Corporation "EP-49-10P", epoxy equivalent 240 g / eq.) was changed to 3 parts, and the amount of elastomer 1 (non-volatile content 50 mass%) was changed to 14 parts. A resin varnish was produced in the same manner as in Example 1 except for the above.

[0189] [Example 5] The amount of chelate type epoxy resin (ADEKA Corporation "EP-49-10P", epoxy equivalent 240 g / eq.) was changed to 4 parts, and the amount of elastomer 1 (non-volatile content 50 mass%) was changed to 12 parts. Apart from the above, the same procedure as in Example 1 was followed to produce a resin varnish.

[0190] [Example 6] The chelate type epoxy resin (ADEKA Corporation "EP-49-10P", epoxy equivalent 240 g / eq.) was changed to a liquid chelate modified epoxy resin (ADEKA Corporation "EP-49-10P2", epoxy equivalent 300 g / eq., chelate modification amount (phosphoric acid modification amount) 1.5 mass%). A resin varnish was produced in the same manner as in Example 1, except for the above points.

[0191] [Example 7] The chelate type epoxy resin (ADEKA Corp. "EP-49-10P", epoxy equivalent 240 g / eq.) was changed to a liquid chelate type epoxy resin (ADEKA Corp. "EP-49-23", epoxy equivalent 175 g / eq.). A resin varnish was produced in the same manner as in Example 1, except for the above.

[0192] [Example 8] A resin varnish was produced in the same manner as in Example 1 except that 75 parts of the inorganic filler 2 was used instead of 75 parts of the inorganic filler 1.

[0193] [Example 9] A resin varnish was produced in the same manner as in Example 1, except that 16 parts of Elastomer 2 (non-volatile content 50% by mass) was used instead of 16 parts of Elastomer 1 (non-volatile content 50% by mass).

[0194] [Example 10] A resin varnish was produced in the same manner as in Example 1, except that 16 parts of Elastomer 3 (non-volatile content 50% by mass) was used instead of 16 parts of Elastomer 1 (non-volatile content 50% by mass).

[0195] [Example 11] A resin varnish was produced in the same manner as in Example 1, except that 8 parts of a hydroxyl-containing acrylic polymer ("ARUFON UH-2000" manufactured by Toagosei Co., Ltd., weight average molecular weight 11,000) was used instead of 16 parts of elastomer 1 (non-volatile content 50% by mass).

[0196] [Example 12] A resin varnish was produced in the same manner as in Example 1, except that 7.5 parts of a phenol novolac resin ("TD-2090-60M" manufactured by DIC Corporation, hydroxyl group equivalent of approximately 105 g / eq., MEK solution of 60% solids) was used instead of 10 parts of a phenol-based curing agent having a triazine skeleton and a novolac structure ("LA-3018-50P" manufactured by DIC Corporation, active group equivalent of approximately 151 g / eq., 2-methoxypropanol solution of 50% solids).

[0197] [Example 13] A resin varnish was produced in the same manner as in Example 1, except that 10 parts of a naphthalene-based phenolic resin ("SN485" manufactured by Nippon Steel Chemical & Material Co., Ltd., hydroxyl group equivalent 215 g / eq., MEK solution with solid content of 60 mass%) was used instead of 10 parts of a phenolic curing agent having a triazine skeleton and a novolak structure ("LA-3018-50P" manufactured by DIC Corporation, active group equivalent weight 151 g / eq., 2-methoxypropanol solution with solid content of 50%).

[0198] [Example 14] A resin varnish was produced in the same manner as in Example 1, except that 10 parts of an active ester compound ("HPC-8000-65T" manufactured by DIC Corporation, active group equivalent of approximately 223 g / eq., solid content of 65% by mass in toluene solution) was used instead of 10 parts of a phenolic curing agent having a triazine skeleton and a novolak structure ("LA-3018-50P" manufactured by DIC Corporation, active group equivalent of approximately 151 g / eq., solid content of 50% in 2-methoxypropanol solution).

[0199] [Comparative Example 1] A resin varnish was produced in the same manner as in Example 1, except that a chelate-type epoxy resin (ADEKA Corporation, "EP-49-10P", epoxy equivalent 240 g / eq.) was not used.

[0200] [Comparative Example 2] No chelate type epoxy resin (ADEKA Corporation's "EP-49-10P", epoxy equivalent: 240 g / eq.) was used. In addition, the amount of liquid epoxy resin (Nippon Steel Sumikin Chemical Co., Ltd.'s "ZX1059", a 1:1 mixture (mass ratio) of bisphenol A type epoxy resin and bisphenol F type epoxy resin, epoxy equivalent: 169 g / eq.) was changed to 6 parts. Apart from the above, the resin varnish was produced in the same manner as in Example 1.

[0201] [Comparative Example 3] No chelate type epoxy resin (ADEKA Corporation's "EP-49-10P", epoxy equivalent 240 g / eq.) was used. Also, the amount of inorganic filler 1 was changed to 82 parts. Furthermore, the amount of phenolic curing agent having a triazine skeleton and a novolac structure (DIC Corporation's "LA-3018-50P", active group equivalent approximately 151 g / eq., 2-methoxypropanol solution with 50% solids) was changed to 18 parts. Apart from the above, a resin varnish was prepared in the same manner as in Example 1.

[0202] [Comparative Example 4] Chelate type epoxy resin (ADEKA Corporation "EP-49-10P", epoxy equivalent: 240 g / eq.) was not used. In addition, the amount of liquid epoxy resin (Nippon Steel Sumikin Chemical Co., Ltd. "ZX1059", 1:1 mixture (mass ratio) of bisphenol A type epoxy resin and bisphenol F type epoxy resin, epoxy equivalent: 169 g / eq.) was changed to 6 parts. Furthermore, 0.3 parts of triazine functional group-containing silane coupling agent (Shikoku Kasei Corporation "VD-5", 2,4-diamino-6-triethoxysilane triazine) was added to the resin varnish as an adhesion imparting agent. A resin varnish was produced in the same manner as in Example 1 except for the above items.

[0203] [Manufacturing of resin sheets] A polyethylene terephthalate film ("Lumirror R80" manufactured by Toray Industries, Inc., thickness 38 μm, softening point 130° C.) that had been subjected to a release treatment with an alkyd resin-based release agent ("AL-5" manufactured by Lintec Corporation) was prepared as a support. The resin varnishes manufactured in the examples and comparative examples were applied onto this support using a die coater so that the thickness of the resin composition layer after drying was 50 μm, and the resulting film was dried at 85° C. to 100° C. for 4 minutes to obtain a resin sheet.

[0204] [Evaluation of copper foil adhesion strength] <Preparation of copper clad laminate> A glass cloth-based epoxy resin double-sided copper-clad laminate with copper foil on the surface (copper foil thickness 18μm, substrate thickness 0.8mm, Panasonic "R-1766") was prepared. Both sides were roughened by etching using a microetching agent (Mec "CZ8101") so that the copper etching depth was 2μm. The copper-clad laminate obtained in this way is sometimes called a "roughened copper-clad laminate".

[0205] <Lamination of resin sheets> The resin sheets produced in the examples and comparative examples were laminated on one side of the roughened copper-clad laminate using a batch-type vacuum pressure laminator (a two-stage build-up laminator "CVP700" manufactured by Nikko Materials Co., Ltd.) so that the resin composition layer was bonded to the roughened copper-clad laminate. The lamination was performed by reducing the pressure for 30 seconds to 13 hPa or less, and then pressing for 30 seconds at 100°C and a pressure of 0.74 MPa.

[0206] <Copper foil surface treatment> Copper foil (electrolytic copper foil "3EC-III" manufactured by Mitsui Mining & Smelting Co., Ltd., thickness 35 μm) was immersed in a microetching agent ("MEC Etch Bond CZ-8100" manufactured by MEC Corporation) to roughen the shiny surface of the copper foil (etching by 1 μm).

[0207] <Copper foil lamination and curing> The support of the resin sheet laminated on the roughened copper-clad laminate was peeled off to expose the resin composition layer. The resin composition layer and the copper foil were laminated on the resin composition layer so that the roughened glossy surface was bonded to the resin composition layer. The lamination was performed by reducing the pressure for 30 seconds to 13 hPa or less, and then pressing at 100 ° C. and a pressure of 0.74 MPa for 30 seconds. The resin composition layer was then smoothed by heat pressing at atmospheric pressure, 100 ° C., and a pressure of 0.5 MPa for 60 seconds. Furthermore, the resin composition was cured under the curing conditions of 100 ° C. for 30 minutes, followed by 190 ° C. for 90 minutes, to obtain a sample having a layer structure of "roughened copper-clad laminate / cured layer of resin composition / copper foil".

[0208] <Measurement and evaluation of copper foil peel strength> A cut was made in the copper foil, surrounding an area 10 mm wide and 100 mm long. One end of this area was peeled off and held with a gripper (Autocom type testing machine "AC-50C-SL" manufactured by TSE Corporation), and the load (kgf / cm) was measured when 20 mm was peeled off vertically at a speed of 50 mm / min at room temperature, and the peel strength was calculated as the copper foil adhesion strength.

[0209] [Evaluation of Si adhesion strength] <Lamination onto silicon wafer and curing> The resin sheets produced in the examples and comparative examples were laminated on one side of a 12-inch silicon wafer (775 μm thick) using a batch-type vacuum pressure laminator (Nikko Materials' two-stage build-up laminator "CVP700"). The lamination was performed by reducing the pressure for 30 seconds to 13 hPa or less, and then pressing at 100°C and a pressure of 0.74 MPa for 30 seconds. After lamination, the support of the resin sheet was peeled off. The resin composition was cured under curing conditions of 100°C for 30 minutes, followed by 190°C for 90 minutes, to obtain a laminate having a layer structure of "silicon wafer / cured layer of resin composition".

[0210] <Preparation of test specimen> The obtained laminate was cut into 1 cm squares and placed on a ceramic backing plate with an epoxy adhesive (11.4 cm square, P / N 901450) such that the cured layer faced upward. Further, stud pins (rivet-shaped fixtures; 2.7 mm in diameter on the adhesive surface; P / N 901106) were fixed to the cured layer with an epoxy adhesive and heated at 150 °C for 1 hour to bond the stud pins to the cured layer.

[0211] <Stud pull test> Using a Stud pull tester (manufactured by ROMULUS, Quad Group Inc.), the stud pins were pulled at a speed of 2 kgf / sec in a direction perpendicular to the main surface of the cured layer, and the load value (kgf / cm 2 ) at the time when the cured layer peeled off was measured as the Si adhesion strength.

[0212] [Warp evaluation] The resin sheets produced in the examples and comparative examples were laminated on the entire one side of a 12-inch silicon wafer (thickness 775 μm) using a batch-type vacuum pressure laminator (Nikko Materials Co., Ltd.'s two-stage build-up laminator "CVP700") so that the resin composition layer and the silicon wafer were joined. The support of the resin sheet was peeled off to expose the resin composition layer, and another resin sheet was laminated on the surface of the resin composition layer in the same manner, and the support was peeled off. By the above lamination, two layers of resin composition layers (total thickness 100 μm) were formed on one side of the 12-inch silicon wafer. The lamination was carried out under the same conditions as in the above [Si adhesion strength evaluation].

[0213] The laminate was heated in an oven at 100 °C for 30 minutes, and then continuously at 190 °C for 90 minutes to cure the resin composition layer, obtaining a laminate having a layer structure of "silicon wafer / resin composition cured layer". The end of the obtained laminate was pressed against a horizontal table. The distance between the end of the wafer on the side opposite to the pressed end and the table was measured as the amount of warp. Then, the warp was evaluated according to the following criteria. Warp evaluation criteria: "○": The amount of warp is 0 mm or more and 1.5 mm (1500 μm) or less. "×": The amount of warp is greater than 1.5 mm.

[0214] [Measurement of elastic modulus] The resin sheets produced in the examples and comparative examples were thermally cured at 190°C for 90 minutes, and the support was peeled off to obtain a sheet-like cured product. A tensile test of the cured product was carried out using a Tensilon universal testing machine (manufactured by A&D Co., Ltd.) in accordance with the Japanese Industrial Standards (JIS K7127), and the elastic modulus (tensile elastic modulus) of the cured product at room temperature was measured.

[0215] [Melt viscosity measurement] The support was peeled off from the resin sheet produced in the examples and comparative examples to obtain a resin composition layer. The resin composition layer was compressed with a mold to produce a measurement pellet (diameter 18 mm, 1.0 g to 1.1 g). The measurement pellet was then subjected to measurement of the minimum melt viscosity using a dynamic viscoelasticity measuring device (manufactured by UBM, "Rheosol-G3000"). Specifically, the dynamic viscoelasticity of 1 g of the measurement pellet was measured by heating the pellet in a temperature range from a starting temperature of 60°C to 200°C using a parallel plate with a diameter of 18 mm, and the minimum value was obtained. The measurement conditions were a temperature rise rate of 5°C / min, a measurement temperature interval of 2.5°C, a vibration frequency of 1 Hz, and a strain of 5 deg.

[0216] [result] The results of the above-mentioned Examples and Comparative Examples are shown in the following table. In the table, the meanings of the abbreviations are as follows: (B) Content rate: (B) Content rate of inorganic filler. Active group ratio: (A) the number of epoxy groups in the epoxy resin is taken as 1, and (D) the number of active groups in the curing agent.

[0217] [Table 1]

[0218] [Table 2] [Explanation of symbols]

[0219] 100 Semiconductor chip package 110 Semiconductor Chip 120 Sealing layer 130 Rewiring formation layer 140 Redistribution layer 150 Solder resist layer 160 Bump

Claims

1. (A) an epoxy resin, (B) an inorganic filler, and (C) an elastomer; (A) the epoxy resin comprises (A-1) an epoxy resin containing an epoxy group and a structure capable of forming a chelate; The amount of the (A) component is 10% by mass or more and 50% by mass or less, based on 100% by mass of the resin component of the resin composition; The amount of the (B) component is 60% by mass or more and 95% by mass or less, based on 100% by mass of the non-volatile components of the resin composition; The amount of the (C) component is 1% by mass or more and 20% by mass or less based on 100% by mass of the non-volatile components of the resin composition, (C) A resin composition, wherein the elastomer is selected from the group consisting of a resin containing a polybutadiene structure and a resin containing an imide structure, a urethane structure and a polycarbonate structure in the molecule.

2. The resin composition according to claim 1, wherein the amount of chelate modification of the component (A-1) is 0.3% by mass to 10% by mass.

3. The resin composition according to claim 1 or 2, wherein the ratio W(A-1) / W(C) of the mass W(A-1) of the component (A-1) to the mass W(C) of the component (C) is 0.01 to 1.

0.

4. The resin composition according to any one of claims 1 to 3, wherein the amount of the component (A-1) is 0.1 mass% or more and 40 mass% or less, based on 100 mass% of the resin components of the resin composition.

5. The resin composition according to any one of claims 1 to 4, wherein the component (C) has a number average molecular weight of 1,000 or more.

6. The resin composition according to any one of claims 1 to 5, further comprising (D) a curing agent.

7. The resin composition according to any one of claims 1 to 6, further comprising (E) a curing accelerator.

8. The resin composition according to any one of claims 1 to 7, which is for use in a sealing layer.

9. The resin composition according to any one of claims 1 to 8, having a minimum melt viscosity of 9000 poise or less.

10. A cured product of the resin composition according to any one of claims 1 to 9.

11. A resin sheet comprising a support and a resin composition layer comprising the resin composition according to any one of claims 1 to 9 formed on the support.

12. A circuit board comprising a cured product of the resin composition according to any one of claims 1 to 9.

13. A semiconductor chip package comprising a cured product of the resin composition according to any one of claims 1 to 9.

14. A semiconductor device comprising the circuit board according to claim 12 or the semiconductor chip package according to claim 13.

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