Frame body and vapor deposition mask

Abstract

To provide a frame body for a vapor deposition mask capable of improving an accuracy related to a vapor deposition by preventing a deformation of a holding frame part and a mask body with a reinforced frame part and suppressing a deviation of the mask body from a correct position.SOLUTION: Since a reinforced frame part 5 is arranged for reinforcing a holding frame part 4 holding a connected / integrated mask body 2 to enhance a rigidity of the mask body 2 against stress, a vapor deposition mask 1 can be fixed and installed in a vapor deposition apparatus in a state where a deviation of each part of the mask body 2 from an original position is suppressed, a matching state between a mask and a substrate to be vapor-deposited is secured so as to perform a vapor deposition accurately at a proper position of the substrate to be vapor-deposited.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a frame for a deposition mask, and can be applied to reinforcement of a deposition mask used when forming a light-emitting layer of an organic EL element by a deposition mask method, for example. [Background technology]

[0002] The deposition mask method is often used to form the light-emitting layer of an organic EL (Electroluminescence) element. In this deposition mask method, a deposition mask with holes removed at the locations of the substrate corresponding to the deposition sites is used to deposit organic light-emitting materials at desired locations on a substrate made of a transparent material such as glass.

[0003] In a deposition apparatus for performing deposition, a deposition mask is set in a state where it is correctly aligned with a substrate to be deposited, and deposition is performed. However, since heating is generally performed during deposition to create an environment in the deposition apparatus suitable for deposition, if the deposition mask and the glass substrate are in different thermal deformation states, the relative positional relationship between the deposition mask and the substrate changes, and there is a problem that the required precision of the formed light-emitting layer cannot be satisfied.

[0004] In recent years, a deposition mask has been proposed that employs a mask structure in which a reinforcing frame made of a material having the same thermal expansion coefficient as the substrate to be deposited (e.g., glass) or a material with a low thermal expansion coefficient is attached to the outer edge of a thin mask body. This allows the mask body to change shape in response to the expansion of the frame having the same thermal expansion coefficient as the substrate to be deposited, or to remain unaffected by the frame having a low thermal expansion coefficient, even when a mask body made of a material having a different thermal expansion coefficient from the substrate to be deposited is used. This ensures accurate alignment of the mask body with the substrate to be deposited when the temperature is increased in the deposition apparatus, and enables the formation of a light-emitting layer on the substrate to be deposited with high precision.

[0005] An example of such a conventional deposition mask is disclosed in Japanese Patent Application Laid-Open No. 2005-15908. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2005-15908 A Summary of the Invention [Problem to be solved by the invention]

[0007] Conventional deposition masks have the configurations shown in the above-mentioned patent documents, which can suppress relative deformation between the mask and the substrate due to differences in thermal expansion coefficients and prevent significant deterioration in the positional accuracy of the deposition product.

[0008] However, there is a demand for even higher precision in the market, and it is necessary to further suppress the occurrence of misalignment due to the displacement of the mask. However, in the case of a conventional combination structure of a mask body and a frame, the reinforcing frame must also be thin, so there is a limit to how much strength can be achieved with such a thin frame, and it is not possible to ensure the rigidity of the frame alone to avoid even slight deformation due to the stress on the mask body. For this reason, with the conventional mask structure, it is difficult to keep the displacement of the mask body within the tolerance range that becomes stricter as precision increases, and there is a problem that a decrease in yield due to the positional deviation of the deposition formation is unavoidable.

[0009] The present invention has been disclosed in order to solve the above-mentioned problems, and has an object to provide a frame that makes it difficult for the mask body to deform, suppresses deviation of the mask body from the correct position, and improves the accuracy of deposition, and a deposition mask using the same. [Means for solving the problem]

[0010] The frame disclosed in the present invention is a frame used to reinforce a mask body that constitutes a deposition mask, and has a holding frame portion that is connected and integrated with the mask body, and a reinforcing frame portion that is arranged integrally with the holding frame portion.

[0011] As described above, according to the disclosure of the present invention, a reinforcing frame is provided to reinforce the holding frame that holds the connected and integrated mask body, thereby increasing the rigidity of the mask body against stress. This makes it possible to fix the deposition mask to the deposition apparatus while suppressing deviation of each part of the mask body from its original position. This ensures alignment between the mask and the substrate to be deposited, allowing deposition to be performed with high precision in the appropriate position on the substrate to be deposited. [Brief description of the drawings]

[0012] [Figure 1] 1 is a schematic plan view of a deposition mask according to a first embodiment of the present invention. [Diagram 2] FIG. 1 is an explanatory diagram of a configuration of a main part of a deposition mask according to a first embodiment of the present invention. [Diagram 3] 1 is a schematic cross-sectional view of a main part of a deposition mask according to a first embodiment of the present invention. [Figure 4] FIG. 2 is a plan view of a frame according to the first embodiment of the present invention. [Diagram 5] 3 is a partial enlarged view of a separation processing portion of a frame body according to the first embodiment of the present invention. FIG. [Figure 6] 1A to 1C are diagrams illustrating a primary pattern resist formation process in the manufacture of a deposition mask according to the first embodiment of the present invention. [Figure 7] FIG. 2 is an explanatory view of a primary electrodeposition layer forming step in the manufacture of a deposition mask according to the first embodiment of the present invention. [Figure 8] 4A to 4C are diagrams illustrating a secondary pattern resist formation process in the manufacture of a deposition mask according to the first embodiment of the present invention. [Figure 9] 4A to 4C are diagrams illustrating a metal layer forming step and a separation state of the deposition mask and the matrix in the manufacture of the deposition mask according to the first embodiment of the present invention. [Figure 10] 5A to 5C are explanatory views of a process of placing the deposition mask on a frame of a manufacturing apparatus according to the first embodiment of the present invention. [Figure 11] FIG. 2 is an explanatory view showing a state in which the deposition mask according to the first embodiment of the present invention is fixed to a frame of a manufacturing apparatus. [Figure 12]4 is an explanatory view showing a state in which a reinforcing frame portion is separated from a frame body in the deposition mask according to the first embodiment of the present invention. FIG. [Figure 13] FIG. 4 is a schematic configuration explanatory diagram of another manufacturing apparatus frame on which a deposition mask according to the first embodiment of the present invention is installed. [Figure 14] 5A to 5C are explanatory views of a state in which the deposition mask according to the first embodiment of the present invention is fixed to a frame of another manufacturing apparatus. [Figure 15] FIG. 11 is an explanatory diagram showing a schematic arrangement state of another separation processing portion of the frame body according to the first embodiment of the present invention. [Figure 16] 13A to 13C are explanatory views of a removal processing step for a frame in a manufacturing method for a deposition mask according to a second embodiment of the present invention. [Figure 17] 13A and 13B are explanatory views of a deformed state of a frame when the manufacturing of a deposition mask according to a third embodiment of the present invention is completed. [Figure 18] FIG. 13 is an explanatory view of a state in which a tensile force is applied to a frame in a first stage when the deposition mask according to the third embodiment of the present invention is installed in a manufacturing apparatus. [Figure 19] FIG. 13 is an explanatory view of a state in which a tensile force is applied to a frame in a second stage when the deposition mask according to the third embodiment of the present invention is installed in a manufacturing apparatus. [Figure 20] FIG. 13 is an explanatory view of a state in which a third stage of tensile force is applied to the frame when the deposition mask according to the third embodiment of the present invention is installed in the manufacturing apparatus. [Figure 21] FIG. 13 is an explanatory view of a fourth stage of application of tensile force to the frame when the deposition mask according to the third embodiment of the present invention is installed in the manufacturing apparatus. [Figure 22] FIG. 13 is an explanatory view of a fifth stage of tensile force application to the frame when the deposition mask according to the third embodiment of the present invention is installed in the manufacturing apparatus. [Figure 23] FIG. 13 is an explanatory view of a sixth stage of tensile force application to the frame when the deposition mask according to the third embodiment of the present invention is installed in the manufacturing apparatus. [Figure 24] FIG. 13 is an explanatory view of a seventh stage of application of tensile force to the frame when the deposition mask according to the third embodiment of the present invention is installed in the manufacturing apparatus. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] (First embodiment of the present invention) A frame and a deposition mask according to a first embodiment of the present invention will be described below with reference to Fig. 1 to Fig. 12. In this embodiment, an example in which the frame and the deposition mask are applied to a deposition mask for an organic EL element will be described.

[0014] In each of the figures, the deposition mask 1 according to this embodiment includes a plurality of mask bodies 2 each having a large number of deposition holes 8 formed in a predetermined pattern, and a frame body 3 arranged to surround the outside of the mask body 2.

[0015] The mask body 2 is made of nickel, nickel alloys such as nickel cobalt, or other electrodeposited metals, and is formed into a sheet shape by electroforming, and is configured to have a large number of independent deposition through holes 8 formed in a predetermined pattern to allow the deposition material to pass through.

[0016] The mask body 2 includes an internal pattern formation region 2a in which numerous deposition through-holes 8 are provided, and an outer periphery 2b which is integrally joined to the frame 3 via a metal layer 7 formed by electroforming. In the pattern formation region 2a, the numerous deposition through-holes 8 form a deposition pattern 9 for forming a light-emitting layer.

[0017] The thickness of the mask body 2 is preferably in the range of 10 to 100 μm, and is set to 20 μm in this embodiment. Each vapor deposition through-hole 8 has a rectangular shape with a front-to-back length of 70 μm and a left-to-right width of 170 to 200 μm in a plan view, for example, and these vapor deposition through-holes 8 form rows of a plurality of through-hole groups that are linearly arranged in the front-to-back direction, and the rows form a matrix-like vapor deposition pattern 9 in which the rows are arranged in parallel in the left-to-right direction.

[0018] The frame 3 is a frame-shaped rectangular thin plate that is thicker than the mask body 2, and is disposed on the outer periphery of the mask body 2 to reinforce the mask body 2, and is connected and integrated with the mask body 2 via a metal layer 7. In detail, the frame 3 has a holding frame 4 that is connected and integrated with the outer periphery of the mask body 2, and a reinforcing frame 5 that is disposed integrally with the holding frame 4 in a position that continuously surrounds the outside of the holding frame 4.

[0019] The frame 3 is made of a material with a low thermal expansion coefficient, such as Invar, a nickel-iron alloy, or Super Invar, a nickel-iron-cobalt alloy, etc. The frame 3 is connected and integrated with the outer periphery 2b of the pattern formation region 2a of the mask body 2 by a metal layer 7 formed by electroforming so that they are not separated from each other.

[0020] When Invar or Super Invar is used as the material for the frame 3, the extremely small thermal expansion coefficient of the material can satisfactorily suppress dimensional changes in the mask body 2 due to the heat effect during the deposition process. That is, when the mask body 2 is made of, for example, nickel, whose thermal expansion coefficient is larger than that of the general glass substrate (not shown), there is no misalignment between the through-hole positions relative to the substrate when the deposition mask 1 is aligned with the substrate at room temperature and the deposition position of the deposition material during actual deposition due to the difference in thermal expansion coefficient caused by the high temperature during deposition, and the small thermal expansion coefficient of the frame 3 holding the mask body 2 effectively suppresses dimensional changes and shape changes caused by the expansion of the mask body 2 when the temperature rises, and the alignment accuracy at room temperature can be well maintained even when the temperature rises during deposition.

[0021] The frame 3 may be made of a material having a low thermal expansion coefficient similar to that of the glass substrate, such as glass or ceramic. In this case, at least the surface of the material is made conductive.

[0022] As shown in FIG. 4, the frame 3 is formed in a rectangular frame shape made of a thin plate having six openings 3a corresponding to the mask bodies 2, and six mask bodies 2 are held by one frame 3. That is, the frame 3 has six openings 3a aligned on its plate surface, and one mask body 2 is attached to each opening 3a. The width of the wide outer peripheral part of the frame 3 where the reinforcing frame 5 is located is, for example, about 60 mm, of which the width of the holding frame 4 is set to about 10 mm and the width of the reinforcing frame 5 is set to about 50 mm. The thickness of the frame 3 is, for example, about 0.1 to 5.0 mm, and is set to 1.0 mm in this embodiment.

[0023] A separation processed portion 3b having a shape combining a linear continuous groove 3c and a plurality of through holes 3d is provided at the boundary between the holding frame portion 4 and the reinforcing frame portion 5 of the frame body 3. The width of the separation processed portion 3b is set to about 2 mm, for example.

[0024] The separation processed portion 3b is formed by combining a groove 3c that is continuously arranged linearly at the boundary between the holding frame portion 4 and the reinforcing frame portion 5, and a plurality of through holes 3d that are formed in the groove 3c at predetermined intervals in the groove continuing direction. Of these, the through holes 3d are provided with an acute-angled notch portion 3e at the end of the through hole in the direction in which the grooves 3c continue.

[0025] In addition, it is preferable to set the position of the tip (acute corner) of the cutout portion 3e so as to be shifted from the center position in the width direction of the cutting-off processing portion 3b toward the holding frame portion 4 or the reinforcing frame portion 5, and it is even more preferable to shift it toward the holding frame portion 4 on the mask body 2 side.

[0026] The cut-off processed portion 3b can be provided by etching the frame 3, or by removing unnecessary portions by mechanical processing or laser processing. The cut-off processed portion 3b is not limited to a through hole 3d having a cross-sectional shape with a notch 3e, but may be a through hole having a simple rectangular or circular cross section. The cut-off processed portion 3b may be a shape combining a groove 3c and a through hole 3d, or may be a groove in which through holes are not arranged at a predetermined interval and are arranged in a line. In addition, the cut-off processed portion 3b may be a structure in which at least one of the through holes and the recesses is arranged in a regular or irregular line.

[0027] The frame body 3 having the cut-off processing portion 3b already provided thereon is provided in the manufacturing process of the deposition mask 1, and after the formation of the primary electrodeposition layer 15 that becomes the mask body, it is placed on the matrix 10 so as to be positioned around the primary electrodeposition layer 15. Alternatively, the unprocessed frame body 3 can be placed on the matrix 10, and the cut-off processing portion 3b can be provided on the frame body 3 at an intermediate stage in the subsequent manufacturing process.

[0028] The deposition mask 1 is manufactured by providing a primary pattern resist 14 on the surface of a matrix 10 corresponding to non-positioned portions of the primary electrodeposition layer 15, forming the primary electrodeposition layer 15 on the matrix 10 by electroforming of an electrodeposited metal, arranging a frame 3 so as to surround the primary electrodeposition layer 15, forming a secondary pattern resist 18 covering the portion of the primary electrodeposition layer 15 corresponding to the pattern formation region 2a, and then forming a metal layer 7 by electroforming so as to cover the surface of the frame 3 and the surface of the outer periphery 2b of the primary electrodeposition layer 15. The primary electrodeposition layer 15 and the frame 3 are connected together via the metal layer 7 so as not to separate, and then separating the integrated primary electrodeposition layer 15, frame 3 and metal layer 7 from the matrix 10.

[0029] The matrix 10 used in the manufacturing process of the deposition mask 1 according to this embodiment is made of a conductive material such as stainless steel, brass, or steel, and supports the primary electrodeposition layer 15 constituting the mask body 2 and other components until separation in the manufacturing process of the deposition mask, and a primary pattern resist 14, a primary electrodeposition layer 15, a secondary pattern resist 18, and a metal layer 7 are formed on the front surface side at each stage of the manufacturing process of the deposition mask. When forming the primary electrodeposition layer 15 or the metal layer 7, electricity is passed through the matrix 10, and the primary electrodeposition layer 15 or the metal layer 7 is formed by electroforming on the electrically conductive parts of the surface of the matrix 10 that are not covered by the resist.

[0030] The matrix 10 may be made of a material with a low thermal expansion coefficient, such as 42 alloy (42% nickel-iron alloy), Invar (36% nickel-iron alloy), SUS 430, etc. Alternatively, the matrix may be made of an insulating substrate, such as a glass plate or a resin plate, on whose surface a metal film made of a conductive metal, such as chromium or titanium, is formed.

[0031] In the manufacturing process of the deposition mask 1, once the metal layer 7 is formed on the matrix 10 by electroforming (see FIG. 9(B)), the matrix 10 is separated and removed therefrom (see FIG. 9(C)). When the matrix 10 is made of stainless steel, it is preferable to use a method in which it is physically peeled off from the deposition mask side by applying force to remove it, and when the matrix 10 is made of another metal material, it is preferable to use an etching method in which a chemical solution is used to dissolve and remove it. When etching, an etching solution is used that has selective etching properties such that the matrix 10 dissolves but the materials constituting the primary electrodeposition layer 15, the frame 3, and the metal layer 7 are not damaged.

[0032] The primary electrodeposition layer 15 is made of nickel or a nickel alloy such as nickel-cobalt that is suitable for electroforming, and is formed by electroforming in a portion of the matrix 10 where there is no primary pattern resist 14. In the deposition mask 1, the primary electrodeposition layer 15 is formed to constitute the mask body 2 that covers the surface of the deposition substrate except for deposition through-holes 8 that correspond to deposition target portions of the deposition substrate such as a light-emitting layer.

[0033] The primary pattern resist 14 is formed from an insulating material that is resistant to dissolution in the electrolyte used in electroforming the primary electrodeposition layer 15, and is disposed on the mold 10 in correspondence with non-positioned portions of the primary electrodeposition layer 15 that are preset in advance, and is removed after the primary electrodeposition layer 15 is formed (see Figures 6 and 7).

[0034] This primary pattern resist 14 is disposed on the mold 10 prior to the formation of the primary electrodeposition layer 15. A photosensitive resist, for example, a negative-type photosensitive dry film resist is disposed on the mold 10 to a predetermined thickness, for example, about 20 μm. With a mask film 12 of a predetermined pattern corresponding to the position of the mask body 2 of the deposition mask 1, i.e., the position of the primary electrodeposition layer 15, placed on the mold 10, the resist is hardened by exposure to ultraviolet light, and developed to remove the resist in the non-irradiated areas, and then formed into a shape corresponding to the non-positioned areas of the primary electrodeposition layer 15.

[0035] The secondary pattern resist 18 is formed from an insulating material that is resistant to dissolution in the electrolyte used in electroforming of the metal layer 7, is arranged in correspondence with the predetermined non-placement portions of the metal layer 7, and is removed after the metal layer 7 is formed (see Figures 8 and 9).

[0036] This secondary pattern resist 18 is disposed prior to the formation of the metal layer 7, by disposing a photosensitive resist, for example a negative-type photosensitive dry film resist, on the master 10 and the already disposed primary electrodeposition layer 15 to a predetermined thickness, for example a thickness of about 15 μm, and then, with a mask film 17 of a predetermined pattern corresponding to the metal layer 7 and frame 3 positions of the deposition mask 1 placed thereon, it is hardened by exposure to ultraviolet light, and developed to remove the photosensitive material in the non-irradiated areas, and is formed into a shape corresponding to the non-deposition areas of the metal layer 7 (the pattern formation area 2a of the mask body 2).

[0037] The metal layer 7 is formed by electroforming and is made of nickel, a nickel-cobalt alloy, or the like, and is configured to be formed by electroforming on the exposed portions of the master mold 10, the already arranged primary electrodeposition layer 15, and the frame body 3 where the secondary pattern resist 18 is not provided.

[0038] This metal layer 7 connects the mask body 2 and the frame 3. The metal layer 7 is laminated by electroforming on the upper surface of the mask body 2 corresponding to the outer periphery 2b of the pattern formation region. In detail, the metal layer 7 is formed on the upper surface of the outer periphery 2b of the pattern formation region 2a in the mask body 2, on the upper surface and the side surface of the frame 3 facing the pattern formation region 2a, and in the gap between the mask body 2 and the frame 3, thereby connecting the outer periphery 2b of the pattern formation region 2a and the periphery of the opening of the frame 3 together so that they do not separate.

[0039] The metal layer 7 can be formed on the entire surface (top surface) including both the retaining frame portion 4 and the reinforcing frame portion 5 of the frame body 3. However, since the reinforcing frame portion 5 of the frame body 3 will be separated and removed by subsequent cutting at the separation processing portion 3b, the metal layer 7 may be formed only on the surface of the retaining frame portion 4.

[0040] Next, a manufacturing process of the deposition mask according to this embodiment and a process of installing the deposition mask in a deposition apparatus will be described. In the manufacturing process of the deposition mask, first, a resist layer 11 is provided on the matrix 10 so as to correspond to the deposition through-holes 8 of the mask body 2, i.e., the non-positioned portions of the primary electrodeposition layer 15, which are set in advance on the matrix 10 (see FIG. 6). Specifically, for example, one or several sheets of negative-type photosensitive dry film resist are laminated on the front surface side of the matrix 10 to a predetermined thickness (e.g., about 20 μm) corresponding to the height of the primary electrodeposition layer 15 to be formed, and the resist layer 11 is formed by thermocompression bonding (see FIG. 6(A)).

[0041] Then, a mask film (glass mask) 12 having a predetermined pattern corresponding to the arrangement position of the primary electrodeposition layer 15, such as having light-transmitting holes 12a corresponding to the deposition through-holes 8, is adhered to the surface of the resist layer 11, and then various processes are performed, such as curing by exposure to ultraviolet light (see Figures 6(B) and (C)), development to remove the resist from the masked non-irradiated parts, and drying. In this way, a primary pattern resist 14 corresponding to the non-arrangement parts of the primary electrodeposition layer 15 is formed on the matrix 10 (see Figure 7(A)).

[0042] Incidentally, such primary pattern resist 14 can be formed by a lithography method using a photoresist or the like or by any other method, and the method of formation is not limited to the above.

[0043] The master mold 10 having this primary pattern resist 14 is placed in an electroforming tank prepared under specified conditions, and a primary electrodeposited layer 15 that will become the mask body 2, for example 20 μm thick, is formed by electroforming an electrodeposited metal such as a nickel alloy on the surface of the master mold 10 that is not covered by the primary pattern resist 14 (exposed area) within the thickness of the primary pattern resist 14 (see Figure 7(B)).

[0044] Thereafter, the primary pattern resist 14 is dissolved and removed to obtain a primary electrodeposition layer 15 that will become the mask body 2 having a large number of independent deposition holes 8 forming a predetermined deposition pattern 9 (see FIG. 7(C)).

[0045] After the primary electrodeposition layer 15 is obtained, a resist layer 16 is provided on the entire surface of the matrix 10 including the portion on which the primary electrodeposition layer 15 is to be formed. Specifically, for example, one or several sheets of negative-type photosensitive dry film resist are laminated on the surface side of the matrix 10 to a predetermined thickness (e.g., about 15 μm), and the resist layer 16 is formed by thermocompression bonding (see FIG. 8(A)).

[0046] Then, as shown in Fig. 8(B), a mask film 17 having light-transmitting holes 17a corresponding to the pattern-forming regions 2a of the mask body 2 is adhered to the surface of the resist layer 16, and then a process of curing the resist layer by exposure to ultraviolet light is performed (see Figs. 8(B) and (C)). As a result, the portions corresponding to the pattern-forming regions 2a become exposed resist layer 16a, and the other portions become unexposed resist layer 16b.

[0047] Here, the frame 3, which is provided in advance with a cut-off processed portion 3b, is positioned on the matrix 10 so as to surround the primary electrodeposition layer 15 (see FIG. 8(C)). The frame 3 here can be temporarily fixed onto the matrix 10 by the adhesiveness of the unexposed resist layer 16b so that it does not move easily.

[0048] After the frame 3 is placed, a process is performed to dissolve and remove the unexposed resist layer 16b exposed on the surface, forming a secondary pattern resist 18 that covers the pattern formation region (see FIG. 9(A)). Note that the unexposed resist layer 16b present on the lower side of the frame 3 is not removed because it is not exposed on the surface, and remains on the matrix 10 to continue to play the role of fixing the frame 3.

[0049] Thereafter, a metal layer 7 is formed by electroforming an electrodeposited metal on the upper surface of the primary electrodeposition layer 15 that is not covered with the secondary pattern resist 18 and is exposed on the surface relating to the outer periphery 2b of the pattern formation region 2a, on the surface of the matrix 10 that is exposed between the frame 3 and the primary electrodeposition layer 15, and on the surface of the frame 3 (see FIG. 9(B)). This metal layer 7 can connect the primary electrodeposition layer 15 and the frame 3 together so that they do not separate.

[0050] In this case, the metal layer 7 is formed to have a thickness of 30 μm on the upper surface of the primary electrodeposition layer 15 exposed on the surface relating to the outer peripheral edge 2b of the pattern formation region 2a and on the surface of the matrix 10 exposed on the surface between the primary electrodeposition layer 15 and the frame 3. On the other hand, the thickness of the metal layer 7 on the surface of the frame 3 is 15 μm. This difference in thickness occurs because the metal layer 7 is successively layered from the surface of the matrix 10, and it is not until the metal layer 7 reaches the frame 3 beyond the height dimension of the unexposed resist layer 16b that the frame 3 becomes conductive with the matrix 10 and the formation of the metal layer 7 on the surface of the frame 3 begins.

[0051] When the formation of the metal layer 7 is completed, in the final step, the primary electrodeposition layer 15, the frame 3, and the metal layer 7 are peeled off from the matrix 10 (see FIG. 9(C)). Furthermore, the secondary pattern resist 18 and the unexposed resist layer 16b existing below the frame 3 are removed, thereby completing the manufacture of the deposition mask 1.

[0052] The deposition mask 1 obtained through the above-mentioned manufacturing steps is configured to generate a stress F in the mask body 2 in a direction in which the mask body 2 contracts inward relative to the outer frame 3. In detail, by forming the primary electrodeposition layer 15 by electroforming using a material with a large thermal expansion coefficient relative to the master mold 10, the primary electrodeposition layer 15 is formed on the master mold surface in a state of linear expansion exceeding that of the master mold in an environment at a temperature higher than room temperature during electroforming, and since deformation is restricted on the master mold 10, although the primary electrodeposition layer 15 tries to shrink more than the master mold 10 in an environment at room temperature, no shrinkage actually occurs, and a stress is generated in the primary electrodeposition layer 15 that causes it to shrink inward.

[0053] On the other hand, since the frame 3 is disposed in a room temperature environment relative to the matrix 10, and the frame itself is formed of a material with a low thermal expansion coefficient, the primary electrodeposition layer 15 retains an internal stress in a direction of inward contraction even in a state in which the primary electrodeposition layer 15 and the frame 3 are connected by forming the metal layer 7. For this reason, when the integrated primary electrodeposition layer 15 and the frame 3 are separated from the matrix 10, the primary electrodeposition layer 15, i.e., the mask body 2, attempts to contract inward relative to the frame 3, exerting an inward tensile force on the frame 3.

[0054] Next, a process of installing the deposition mask according to this embodiment in a deposition apparatus will be described. As described above, the mask body 2 is formed in a state in which it generates stress in a direction of inward contraction with respect to the frame body 3, and thus a force that tries to deform the frame body 3 is applied from the mask body 2. Here, the frame body 3 has a configuration in which the reinforcing frame part 5 is integrally arranged on the outside of the holding frame part 4, and the reinforcing frame part 5 is structured to reinforce from the outside the holding frame part 4 that holds the mask body 2 inside the frame body 3. This increases the rigidity of the frame body 3 against a force that tries to deform the frame body 3 due to the stress of the mask body 2, and the frame body 3 that receives the force does not deform significantly. And, because the frame body 3 is less likely to deform, the mask body 2 is also less likely to deform.

[0055] The deposition mask 1 formed by combining the mask body 2 and the frame 3 is installed in a deposition apparatus such as a deposition tank for performing deposition so that deposition can be performed. When installing, first, the deposition mask 1 is appropriately positioned and then fixed to a frame 50 provided in the deposition apparatus for supporting the deposition mask (see Figs. 10 and 11). The frame 50 is a frame-shaped member made of a material with a low thermal expansion coefficient such as Invar, and is formed to have a thickness of 10 to 25 mm. This fixing is achieved by integrating the holding frame portion 4 of the frame body 3 of the deposition mask 1 to the frame 50 by welding such as spot welding in a strong manner and in a state capable of withstanding heat during deposition.

[0056] In addition, the fixing of the holding frame portion 4 to the frame 50 by welding can be performed not only to the frame 50 installed inside the deposition apparatus, but also to the frame 50 that has been removed from the deposition apparatus for easier handling if the frame 50 is removable from the deposition apparatus.

[0057] The frame 50 has a significantly higher rigidity than the frame 3 of the deposition mask 1. When the holding frame 4 is fixed to the frame 50, the holding frame 4 is completely integrated with the frame 50 without being displaced or deformed, and the mask body 2 connected to the inside of the holding frame 4 and held therein is not deformed by stress, and can maintain its positional relationship with the frame 50. The frame 50 may be provided with a bar 51 that crosses the middle part of the frame shape (see Figs. 13 and 14). In this case, when the deposition mask 1 is fixed to the frame 50, it is possible to suppress bending of the center part of the deposition mask 1 due to its own weight. The bar 51 may be oriented vertically, horizontally, or diagonally with respect to the frame 50, and may be provided in any manner, such as by combining in a lattice shape. However, since overlapping with the mask body 2 will hinder deposition, the bar 51 is provided so as to overlap with the frame 3. The bar 51 may be formed simultaneously with the frame 50 so as to be integrated with the frame 50 from the beginning, or it may be formed independently of the frame 50 and attached to the frame 50 later so as to be combined with the frame 50. In addition, bar 51 is formed from a material with a low thermal expansion coefficient, such as Invar or ceramic, and has a thickness of 5 to 8 mm. The material of bar 51 may be the same as that of frame 50, or a different material from that of frame 50.

[0058] After the holding frame is fixed to the frame 50, the rigidity of the holding frame 4 of the frame 3 is ensured by the structure of the frame 3 itself, that is, it is no longer necessary to maintain the configuration in which the holding frame 4 is reinforced by the reinforcing frame 5 on the outside. In the deposition process, since it is convenient for the deposition mask 1 to be small, there is no need to leave it for reinforcement purposes, and the reinforcing frame 5 that has become an unnecessary part is cut at the separation processing portion 3b provided at the boundary with the holding frame 4, and separated and removed from the holding frame 4 (see FIG. 12).

[0059] In removing this retaining frame portion 4, a cutting processing portion 3b is provided in advance on the frame body 3, and this is the processing position to be processed when separating the reinforcing frame portion 5 from the retaining frame portion 4. This makes it possible to easily perform the separation process without any difficulty, and to separate the reinforcing frame portion 5 without affecting the shape of the retaining frame portion 4 that remains as the frame body or the state in which the mask body 2 is held by the retaining frame portion 4, allowing for a smooth transition to the deposition process using a deposition apparatus.

[0060] In addition, the cut-off processing portion 3b to be processed is a combination of grooves 3c arranged continuously in a line and through holes 3d drilled at predetermined intervals in the direction in which the grooves 3c continue, and the through holes 3d are structured to have acute-angled notches 3e. Therefore, when the cut-off processing portion 3b is cut to separate the reinforcing frame 5, a cut surface is smoothly generated along the cut-off processing portion 3b starting from the notches 3e, and burrs are unlikely to remain on the holding frame 4 side, which does not adversely affect the various operations associated with the deposition process.

[0061] In this way, the deposition mask of this embodiment is provided with a reinforcing frame portion 5 that reinforces the holding frame portion 4 that holds the mask body 2 inside the frame body 3 from the outside, thereby increasing the rigidity of the frame body 3 against the force applied to the frame body 3 from the mask body 2 based on the stress of the mask body 2. Therefore, the mask body 2 can be fixedly installed in the deposition apparatus while preventing each part of the mask body 2 from shifting from its original position, ensuring an alignment between the mask and the substrate to be deposited, and deposition can be performed with high precision at the appropriate position on the substrate to be deposited.

[0062] In addition, when installing the deposition mask 1, the holding frame 4 of the frame 3 of the deposition mask 1 is fixed to the frame 50 of the deposition apparatus by welding or the like to obtain an installed state in the deposition apparatus, so that the deposition mask 1 can be installed in the deposition apparatus while maintaining a state in which the frame 3 suppresses deformation of the mask body 2, and displacement of the mask body 2 is prevented to ensure an aligned state between the mask and the deposition substrate, thereby improving the deposition accuracy and the yield of the deposition product. In addition, by separating the reinforcing frame 5 from the holding frame 4 after fixing the frame 3 to the deposition apparatus, the reinforcing frame 5 does not hinder the process after fixing the deposition mask 1, and deposition by the deposition apparatus can be carried out without problems.

[0063] In the deposition mask according to the embodiment, the cut-off processed portion 3b of the frame body 3 is shaped as a combination of linearly continuous grooves 3c and a plurality of through holes 3d bored at predetermined intervals in the groove continuous direction, and is configured to have a uniform shape at any location of the boundary between the holding frame portion 4 and the reinforcing frame portion 5. However, without being limited to this, the shape of the cut-off processed portion 3b can be changed for each position on the frame body 3. For example, the frame body 3 can be configured such that the predicted deformation amount of each part of the frame body is calculated in advance assuming a state in which a force based on the above-mentioned stress is applied to the frame body in a shape corresponding to the mask main body 2 which is integrated with the frame body 3 while leaving a stress that tends to shrink inwardly relative to the frame body 3, and the cut-off processed portion 3b is configured to have a shape such that the larger the predicted deformation amount at a predetermined location of the frame body 3 where the cut-off processed portion 3b is provided, the smaller the ratio of the size of the part to be removed as the through hole, recess, or groove that constitutes the cut-off processed portion 3b at this location to the remaining part that is not removed becomes.

[0064] In this case, the cut-off processed portion 3b of the frame body 3 is shaped so that the amount of removal is increased or decreased depending on the deformation possibility of each part of the frame body. In other words, the ratio of the removed part to the remaining part that is not removed in the cut-off processed portion 3b is set to be small in places where the deformation of the frame body 3 due to the force applied to the frame body 3 based on the stress of the mask body 2 is large, while the ratio of the removed part to the remaining part that is not removed is set to be large in places where the deformation of the frame body is small. In this way, the ratio of the removed part such as recesses in the cut-off processed portion 3b is small in places where the deformation of the frame body 3 is expected to be large, thereby ensuring sufficient strength of the frame body 3, while the ratio of the removed part in the cut-off processed portion 3b is large in places where the deformation of the frame body 3 is difficult to predict. This increases the processing efficiency during the cut-off process while ensuring appropriate strength, and enables the reinforcing frame portion 5 to be quickly separated, allowing for a smooth transition to the vapor deposition process.

[0065] 15, in the frame 3, in the cut-off processed parts 3b near the middle of the edges along each side of the rectangular mask body 2, which have a relatively low rigidity and are easily affected by the force due to the stress of the mask body 2, the parts removed as through holes, recesses, or grooves are reduced as much as possible, the ratio of the parts not removed is increased, and the reduction in rigidity due to the removed parts is minimized, making it difficult for actual deformation to occur. On the other hand, in the cut-off processed parts 3b near the corners where the frame sides of the frame 3 intersect, which have a high rigidity and are not easily affected by the force due to the stress of the mask body 2, the ratio of the size of the parts removed as through holes, recesses, or grooves to the remaining parts not removed is increased, making it possible to reduce the effort required for the cut-off process.

[0066] In addition, in the manufacturing of the deposition mask according to the embodiment, the metal layer 7 is formed so as to contact the primary electrodeposition layer 15 and the frame body 3, and the primary electrodeposition layer 15 and the frame body 3 are integrated by the metal layer 7. However, the present invention is not limited to this. Before arranging the frame body, the primary electrodeposition layer 15 may be formed so as to cover the frame body arrangement position, and the frame body 3 may be placed on the lower primary electrodeposition layer 15 with an adhesive interposed therebetween, and the primary electrodeposition layer 15 and the frame body 3 may be integrated by adhesion. In this way, the integration of the primary electrodeposition layer, i.e., the mask body 2 and the frame body 3 can be easily performed, and the manufacturing efficiency of the mask can be improved. In addition, by forming the metal layer 7 so as to cover the surface of the mask body 2 and the surface of the frame body 3, the bonding state of the mask body 2 and the frame body 3 can be made more preferable. In particular, by covering the surface (side portion) of the adhesive with the metal layer 7, it is possible to effectively prevent the adhesive from deteriorating due to cleaning treatment or temperature rise, and the bonding state of the mask body 2 and the frame body 3 can be maintained for a long period of time.

[0067] In addition, in the manufacture of the deposition mask according to the above embodiment, after the frame body 3 is placed on the matrix 10, the metal layer 7 is formed on the surface of the frame body 3. However, this is not limited to the above. Before forming the metal layer 7 by electroforming, a resist may be disposed on a part or all of the upper surface of the frame body, so that the metal layer 7 is not formed on the entire upper surface of the frame body, and the metal layer 7 may be provided only on a part of the upper surface of the frame body or omitted except in necessary areas, thereby providing a stress relaxation portion on the surface of the frame body 3.

[0068] In this case, the metal layer 7 on the upper surface of the frame body 3 is not uniformly continuous but is partial and fragmentary, so that even if internal stress is generated in the metal layer, it will act partially and fragmentarily rather than on the entire frame body 3, making the frame body 3 less susceptible to adverse effects such as deformation, and ensuring a flat shape.

[0069] In addition, in the manufacturing of the deposition mask according to the above embodiment, after the primary electrodeposition layer 15 is formed, the metal layer 7 is formed without performing any particular surface treatment on the primary electrodeposition layer. However, the present invention is not limited to this. After the primary electrodeposition layer 15 is formed, and before the resist layer 16 is formed, an activation treatment such as acid immersion or electrolysis may be performed on a predetermined area of ​​the primary electrodeposition layer 15 where the metal layer 7 is to be disposed.

[0070] In this case, the bonding strength between the activated portion of the primary electrodeposition layer 15 and the metal layer 7 thereon can be significantly improved compared to the case where no treatment is performed. Also, instead of the activation treatment, a thin layer of strike nickel, matte nickel, or the like may be formed on a predetermined area of ​​the primary electrodeposition layer 15. This also improves the bonding strength between the thin layer-forming portion of the primary electrodeposition layer 15 and the metal layer 7 thereon.

[0071] In addition, in the manufacture of the deposition mask according to the above embodiment, the overlapping areas of the primary electrodeposition layer 15 or the frame body 3 and the metal layer 7 are configured to simply be in contact with each other through flat surfaces. Alternatively, a number of through holes or recesses may be provided around the entire outer periphery 2b of the pattern formation region 2a in the primary electrodeposition layer 15 (mask body 2), and the metal layer 7 formed on the outer periphery 2b of the primary electrodeposition layer 15 may be configured to fill the through holes or recesses so that the metal layer 7 partially embeds into the outer periphery 2b.

[0072] In this case, the metal layer 7 is present not only on the upper surface of the outer periphery 2b of the pattern formation region 2a but also in each through-hole or recess of the outer periphery 2b of the primary electrodeposition layer 15, thereby increasing the bonding strength between the primary electrodeposition layer 15 and the outer periphery 2b. This makes it possible to more firmly connect and integrate the mask body 2 and the frame 3 via the metal layer 7, reliably preventing the mask body 2 from accidentally falling off or shifting from the frame 3, and improves the deposition accuracy and the reproducibility of the deposition-formed product.

[0073] (Second embodiment of the present invention) In the manufacturing of the deposition mask in the first embodiment, in the step of placing the frame body 3 on the matrix 10, a frame body 3 having a cut-off processed portion 3b provided thereon is used. Alternatively, in a second embodiment, as shown in FIG. 16, after placing the frame body 3 on the matrix 10, the frame body 3 can be provided with a cut-off processed portion 3b as one step in manufacturing the mask.

[0074] In this case, a method of dissolving the frame 3 placed on the matrix 10 by immersing it in an etching solution can be used as a method of providing the separation processing portion 3b by removal processing. In this etching, an etching solution having selective etching properties is used that dissolves the frame 3 but does not damage the material of the parts other than the frame, such as the matrix 10, or a masking material 19 is provided on the parts of the frame 3 other than the specified range to be removed (see FIG. 16(B)).

[0075] Specifically, for example, a photosensitive film resist is disposed by thermocompression bonding or the like so as to cover the areas not to be etched, and this resist is subjected to processes such as disposing a mask on the areas to be removed, curing by exposure to ultraviolet light, and development, thereby hardening and forming a masking material 19. Alternatively, as the masking material, a protective film having resistance to the etching solution may be disposed so as to cover the areas not to be etched.

[0076] After the masking material 19 is formed, the frame body 3 together with the matrix 10 is immersed in an etching solution, and the part of the exposed surface side of the frame body 3 that is not covered with the masking material 19 is dissolved and removed to a predetermined depth by etching (see FIG. 16(C)). The part of the frame body 3 that has been removed by this etching becomes the cut-off processing part 3b, which is thinner than the other parts of the frame body 3 and easier to cut.

[0077] After etching to obtain the cutting portion 3b of the desired depth and shape, the masking material 19 is dissolved and removed with a specified remover, exposing the frame body 3 and the primary electrodeposition layer 15, making it possible to form a metal layer by electroforming. After this, the process of forming a metal layer by electroforming and subsequent steps will proceed as in the first embodiment.

[0078] In addition to providing the cut-off processed portion 3b on the frame body 3 by etching, the frame body 3 placed on the matrix 10 can also be processed by mechanical processing or laser processing to remove unnecessary portions to provide the cut-off processed portion 3b.

[0079] In this manner, in the method for producing a deposition mask according to the present embodiment, the primary electrodeposition layer 15 that becomes the mask body is formed on the matrix 10, the frame 3 is disposed so as to be positioned around the primary electrodeposition layer 15, and the metal layer 7 for connecting the frame 3 and the primary electrodeposition layer 15 is formed in a predetermined range extending from the surface of the frame 3 to the surface of the outer periphery 2b of the primary electrodeposition layer 15. In the process of forming this metal layer 7, the frame 3 is provided with a separation processing portion 3b by a predetermined removal processing. Therefore, in a state in which the primary electrodeposition layer 15, the frame 3, and the metal layer 7 that are peeled off integrally from the matrix 10 form the deposition mask 1, the frame 3 has no separation processing portion 3b. The separation processed portion 3b can be used as a boundary to create an inner region (holding frame portion 4) that holds the mask body 2 together, and an outer region (reinforcing frame portion 5) that reinforces the entire frame body while being detachable when not needed. By making the reinforcing frame portion 5 outer than the separation processed portion 3b of the frame body 3 sufficiently large, the rigidity of the frame body 3 against the stress of the mask body 2 can be increased. The deposition mask 1 can be fixed and installed in the deposition apparatus with the deviation of each part of the mask body from its original position suppressed, ensuring an alignment between the mask and the substrate to be deposited, and deposition can be performed with high precision in the appropriate position on the substrate to be deposited.

[0080] In addition, after the deposition mask 1 is fixed to the deposition apparatus, if it becomes unnecessary to ensure the rigidity of the frame body 3 by the reinforcing frame portion 5 outside the cutting processing portion 3b of the frame body 3, the reinforcing frame portion 5 can be easily separated without difficulty by performing cutting processing at the cutting processing portion 3b, allowing for a smooth transition to the deposition process using the deposition apparatus.In addition, the reinforcing frame portion 5 can be separated without affecting the shape of the holding frame portion 4 that remains as the frame body 3 or the holding state of the mask main body 2 thereby, and the subsequent deposition process can be carried out without any problems.

[0081] (Third embodiment of the present invention) In the first embodiment, the deposition mask 1 is installed in the deposition apparatus by fixing the deposition mask 1 to the frame 50 of the deposition apparatus as it is after the manufacturing of the deposition mask is completed. Alternatively, as a third embodiment, as shown in FIGS. 17 to 24 , the deposition mask 1 may be installed in the deposition apparatus after applying a tensile force to each outer periphery of the frame 3 of the deposition mask 1 to keep the displacement of the frame 3 and the mask body 2 within an allowable range.

[0082] In the deposition mask 1 in a completed manufacturing state before being installed in a deposition apparatus, as in the first embodiment, the mask body 2 is formed in a state in which a stress in a direction of contracting inward with respect to the frame body 3 is generated, and a force that tries to deform the frame body 3 is applied from the mask body 2. Here, the frame body 3 has a configuration in which a reinforcing frame part 5 is integrally arranged on the outside of the holding frame part 4, and the reinforcing frame part 5 is structured to reinforce from the outside the holding frame part 4 that holds the mask body 2 on the inside of the frame body 3. As a result, the rigidity of the frame body 3 against the force that tries to deform the frame body 3 due to the stress of the mask body 2 is increased, and the frame body 3 that receives the force does not deform significantly. And, since the frame body 3 is less likely to deform, the mask body 2 is also less likely to deform.

[0083] However, since the frame body 3 needs to be formed thin as part of the deposition mask 1, it cannot be made too thick, and there is also a certain restriction on the size of the reinforcing frame portion 5 due to the handling considerations when fixing it to the frame 50. Therefore, there is a limit to how much the rigidity of the frame body 3 can be strengthened, and deformation of the frame body 3 cannot be completely suppressed.

[0084] For this reason, if the force applied from the mask body 2 is large, a part of the frame 3 may deform slightly inward, allowing the mask body 2 integrated with the frame 3 to deform and shrink, resulting in the slight deformation of the mask body 2 being unable to be suppressed. In this case, if the dimensional accuracy conditions of the deposition product are strict and the tolerance for the positional deviation of the mask body 2 is small, a displacement exceeding the tolerance may occur at a specified location of the mask body 2, which may lead to a decrease in the yield of the deposition product.

[0085] In response to this, in installing the deposition mask 1 in the deposition apparatus, a process is adopted in which a force opposing the force that tries to deform the frame body 3 based on the stress of the mask body 2 is applied to the frame body 3 to keep the displacement of the frame body 3 within an allowable range, and while maintaining the state in which the displacement of the frame body 3 is kept within the allowable range, the holding frame part 4 of the frame body 3 is fixed to the frame 50. This suppresses deformation of the frame body 3, and at the same time, suppresses deviation of the mask body 2 from the correct position that would accompany deformation of the frame body 3.

[0086] In the specific installation process, first, the displacement of the frame body 3 and the mask body 2 constituting the deposition mask 1 from their original states is measured, and a series of steps is repeated until the displacement is within the allowable range at all positions of the frame body 3 and the mask body 2 by applying a tensile force from the outside to a predetermined portion of the outer periphery of the frame body 3 that is outside the position where the large displacement has occurred. Then, while maintaining the state of the frame body 3 and the mask body 2 where the displacement is within the allowable range due to the application of the tensile force, the holding frame part 4 of the frame body 3 is fixed to the frame 50. After that, the tensile force applied to the frame body 3 is released. Note that the position where the tensile force is applied on the outer periphery of the frame body is the position excluding the outer periphery of the frame body that is outside (on the extension line) of the lattice-shaped part inside the frame body. This is because the portion of the outer periphery of the frame that is outside the lattice portion inside the frame has high rigidity due to its connection with the lattice portion, making deformation due to stress in the mask body unlikely to occur in the first place, and even if deformation does occur, applying a tensile force from the outside is unlikely to cause an opposite deformation that would offset the deformation.

[0087] In detail, in a first step, displacements in two directions parallel to each side of the rectangular frame are measured at each position of the frame 3 and the mask body 2 of the deposition mask 1. Then, in a second step, when the inward displacement at a predetermined location does not fall within a preset allowable range, a predetermined outward tensile force parallel to the direction of the maximum displacement is applied to the outer periphery of the frame 3 that is outside the location where the maximum displacement occurs, as a force of such magnitude that the displacement at the location falls within the allowable range.

[0088] Next, in the third step, the displacements in the two directions at each position of the frame and the mask body are measured again while the tensile force is being applied. After this measurement, in the fourth step, if a new location is generated where the inward displacement is not within the allowable range, a predetermined outward tensile force parallel to the direction of the new maximum displacement is further applied to the outer periphery of the frame that is outside the new maximum displacement location while maintaining the state where the tensile force is being applied, with a magnitude such that the displacement of the new location falls within the allowable range.

[0089] In addition, as a fifth step, if it is measured that the outward displacement at any point inside the outer periphery of the frame body to which a tensile force has already been applied does not fall within a preset tolerance range due to the subsequent application of another tensile force, an adjustment is made to reduce the tensile force applied to the outer periphery of the frame body outside of that point so that the displacement at that point falls within the tolerance range.

[0090] The third to fifth steps are then repeated until the measured displacements at the respective positions of the frame 3 and the mask body 2 fall within the allowable range.

[0091] To explain using a specific example, in the deposition mask after completion of manufacturing, the maximum displacement at position A on the mask body 2 is -6.1 μm in the vertical direction (y-axis direction) of the frame 3, that is, a displacement of 6.1 μm inwardly into the frame (see FIG. 17). Since this displacement does not fall within the allowable range (within ±1 μm), a tensile force of 40 N is applied to the outer periphery (center of the upper side and center of the lower side) of the frame 3 that is outside the y-axis direction of position A where the maximum displacement occurred, in each direction outwardly of the frame in the y-axis direction parallel to the direction of the maximum displacement (see FIG. 18).

[0092] However, when the displacement of each position on the frame and mask body is measured after this tensile force of 40 N has been applied, the maximum displacement of -3.0 μm in the y-axis direction of the frame 3 is still confirmed at position A on the mask body 2 (see Figure 18). Since this displacement does not fall within the allowable range, a tensile force of 80 N is applied to two locations on the outer periphery of the frame 3 (center of the upper side and center of the lower side) that are outside position A in the y-axis direction, in the same manner as above, in each direction outward from the frame in the y-axis direction, so that the displacement at position A falls within the allowable range (see Figure 19).

[0093] After applying this tensile force of 80N in the y-axis direction, the displacement at each position of the frame was measured, and a maximum displacement of -2.4μm in the lateral direction (x-axis direction) of the frame 3, i.e., a displacement of 2.4μm inward into the frame, was confirmed at position B on the mask body 2 (see Figure 19). Since this displacement does not fall within the allowable range, a tensile force of 40N was applied to each of four positions on the outer periphery of the frame 3 (two positions near the center of the left side and two positions near the center of the right side) that are outside the x-axis direction of position B where the maximum displacement occurred, in each direction outward from the frame in the x-axis direction parallel to the direction of the maximum displacement, as a force of a magnitude such that the displacement at position B falls within the allowable range (see Figure 20).

[0094] After applying this tensile force of 40 N in the x-axis direction, the displacement of each position on the frame and mask body was measured, and a new maximum displacement of -1.5 μm in the y-axis direction of frame 3, i.e., a displacement of 1.5 μm inside the frame, was confirmed at position C on the mask body 2 (see Figure 20). Since this displacement does not fall within the allowable range, a tensile force of 20 N was applied to four locations on the outer periphery of frame 3 (two locations a little away from the center of the upper side and two locations a little away from the center of the lower side) that are outside the y-axis direction of position C where the maximum displacement occurred, in each direction toward the outside of the frame in the y-axis direction parallel to the direction of the maximum displacement, as a force of a magnitude such that the displacement at position C falls within the allowable range (see Figure 21).

[0095] After applying a tensile force of 20 N in the y-axis direction, the displacement of each position on the frame and mask body was measured. A new maximum displacement of +1.1 μm in the y-axis direction of the frame 3, i.e., a displacement of 1.1 μm outward from the frame, was confirmed at position D on the mask body 2 (see Figure 21). Since this displacement does not fall within the allowable range, while maintaining the previous tensile force (40 N) in the x-axis direction, the tensile force (80 N) previously applied in each direction outward from the frame in the y-axis direction at two locations on the outer periphery of frame 3 (the center of the top edge and the center of the bottom edge) that are outside the y-axis direction of position D where the maximum displacement occurred is reduced to 60 N, and the tensile force (20 N) previously applied in each direction outward from the frame in the y-axis direction at a total of four locations on the outer periphery of frame 3 (two locations slightly away from the center of the top edge and two locations slightly away from the center of the bottom edge) is increased to 30 N (see Figure 22), so that the displacement at position D falls within the allowable range.

[0096] After increasing or decreasing the tensile force applied in the y-axis direction in this way, the displacement of each position on the frame and mask body was measured, and a new maximum displacement of -1.1 μm in the x-axis direction of frame 3, i.e., a displacement of 1.1 μm inward into the frame, was confirmed at position E on the mask body 2 (see Figure 22). Since this displacement was not within the allowable range, a tensile force of 20 N was applied to four locations on the outer periphery of frame 3 (two locations a little away from the center of the left side and two locations a little away from the center of the right side) that were outside the x-axis direction of position E where the maximum displacement occurred, in each direction toward the outside of the frame in the x-axis direction parallel to the direction of the maximum displacement (see Figure 23).

[0097] After applying this tensile force of 20N in the x-axis direction, the displacement of each position on the frame and mask body was measured, and a new maximum displacement of -1.2μm in the y-axis direction of the frame 3, i.e., a displacement of 1.2μm inward into the frame, was confirmed at position F on the mask body 2 (see Figure 23). Since this displacement does not fall within the allowable range, the tensile force (30N) previously applied in each direction outward from the frame in the y-axis direction was reduced to 20N (see Figure 24) at four locations on the outer periphery of the frame 3 that are outside the y-axis direction of position F where the maximum displacement occurred (two locations a little away from the center of the upper side and two locations a little away from the center of the lower side), while maintaining the previous state of application of the tensile force (80N) in the y-axis direction and the tensile forces (40N, 20N) in the x-axis direction, so that the displacement at position F falls within the allowable range.

[0098] After adjusting the tensile force applied in the y-axis direction in this way, the displacement of each position of the frame and mask body was measured, and the maximum displacement of the frame 3 and mask body 2 was confirmed to be -0.8 μm in the x-axis direction at position G, i.e., a displacement of 0.8 μm inwardly into the frame (see FIG. 24). Since this displacement falls within the allowable range, the repeated process of measurement, application of tensile force, and adjustment is completed.

[0099] When the displacement falls within the allowable range by repeating the above steps, the holding frame 4 of the frame 3 of the deposition mask 1 is fixed to a frame 50 located inside or outside the deposition apparatus while a tensile force is applied to the frame 3. After the holding frame 4 is fixed to the frame 50 and the mask body 2 together with the frame 3 are held in an appropriate position without shifting, the application of the tensile force to the frame 3 is released, and the reinforcing frame 5 of the frame 3 is cut at the separation processing portion 3b provided at the boundary with the holding frame 4, and separated and removed from the holding frame 4, as in the first embodiment. In this state when the frame 50 is inside the deposition apparatus, or when the frame 50 is outside the deposition apparatus, the installation process of the deposition mask 1 is completed by installing the frame 50 and the deposition mask 1 in the deposition apparatus.

[0100] In this manner, in the deposition mask installation method according to the present embodiment, a step of applying an external tensile force to a predetermined position of the frame body 3 in the deposition mask 1, where the deformation may be largely caused by the stress of the mask body 2, to bring the displacement within an allowable range is repeated until the deformation is within the allowable range at all positions of the frame body 3, and the frame body 3 is left in the state in which the deformation is within the allowable range and the holding frame part 4 of the frame body 3 is fixed to the frame 50. After the deposition mask 1 is installed in the deposition apparatus, the tensile force applied to the frame body 3 is released. This fixes the frame body 3 to the frame 50 while reliably preventing the displacement of the mask body 2 from the correct position, which is accompanied by deformation of the frame body 3, in the deposition mask 1, by a method of suppressing the deformation of the frame body 3 together with the application of an external force, and thereby ensures an appropriate installation state of the deposition mask 1 in the deposition apparatus, thereby further improving the accuracy of deposition.

[0101] Possible forms of the deposition mask according to the present disclosure will now be described. The deposition mask disclosed in the present invention includes a mask body having a large number of independent deposition through-holes arranged in a predetermined pattern, and a frame body disposed integrally with the mask body, the frame body having a holding frame portion connected and integrated with the mask body, and a reinforcing frame portion disposed integrally with the holding frame portion.

[0102] Thus, according to the disclosure of the present invention, a reinforcing frame portion is provided to reinforce the holding frame portion that holds the mask body in the frame, and the rigidity of the frame portion against stress from the mask body is increased, thereby enabling the mask body to be fixedly installed in the deposition apparatus while suppressing deviation of each part of the mask body from its original position, ensuring alignment between the mask and the substrate to be deposited, and enabling deposition to be performed with high precision in the appropriate position on the substrate to be deposited.

[0103] Furthermore, in the deposition mask disclosed herein, if necessary, a separation processing portion is provided at the boundary portion between the retaining frame portion and the reinforcing frame portion of the frame body, in which at least one of through holes or recesses is arranged in a regular or irregular line, or grooves are arranged in a continuous line.

[0104] As described above, according to the disclosure of the present invention, by providing a separation processing portion at the boundary between the retaining frame portion and the reinforcing frame portion of the frame body, and making it the processing target position when separating the reinforcing frame portion from the retaining frame portion, when it is no longer necessary to ensure the rigidity of the frame body by the reinforcing frame portion, such as after positioning and fixing the frame body holding frame portion and the mask body to the deposition apparatus, the reinforcing frame portion can be separated easily and naturally from the holding frame portion, allowing for a smooth transition to the deposition process using the deposition apparatus, and the reinforcing frame portion can be separated without affecting the shape of the holding frame portion that remains as the frame body or the reinforcement state of the mask body by the holding frame portion, allowing the subsequent deposition process to proceed without any problems.

[0105] Furthermore, in the deposition mask disclosed herein, as necessary, the mask body is integrated with a retaining frame portion of the frame body while leaving a stress tending to shrink inwardly relative to the frame body, and the predicted deformation amount of each portion of the frame body is calculated in advance assuming a state in which a force based on the stress is applied to the frame body, and the cutting-off processing portion is set to a shape such that the larger the predicted deformation amount at the location where the cutting-off processing portion of the frame body is to be provided, the smaller the ratio of the size of the portion to be removed as the through hole, recess, or groove at that location to the remaining portion that is not removed becomes.

[0106] Thus, according to the disclosure of the present invention, the frame body is one in which the predicted amount of deformation of each part of the frame body due to a force based on the stress of the mask body has been estimated in advance, and the removed portion in the cutting-off processed portion of this frame body is set so that the ratio of the removed portion to the unremoved remainder is reduced in locations where the predicted amount of deformation of the frame body due to the stress of the mask body is large, while the ratio of the removed portion to the unremoved remainder is set so that the ratio of the removed portion to the unremoved remainder is increased in locations where the predicted amount of deformation of the frame body due to the stress of the mask body is small, and the cutting-off processed portion is shaped to have an increased or decreased removed portion adjusted according to the deformability of each part of the frame body. Thus, in locations where the frame body is expected to deform significantly due to the stress of the mask body, the ratio of the removed portion of the cut-off processed portion, such as recesses, is reduced to ensure sufficient strength of the frame body, while in locations of the frame body where the stress of the mask body is less likely to be applied, the ratio of the removed portion of the cut-off processed portion is increased, thereby ensuring appropriate strength and improving the processing efficiency during the reinforcing frame portion cutting-off process, and enabling the reinforcing frame portion to be quickly separated, allowing a smooth transition to the vapor deposition process.

[0107] Furthermore, in the deposition mask disclosed in the present invention, as necessary, the separation processing portion has a combined shape of a groove that is continuously arranged in a line at the boundary between the holding frame portion and the reinforcing frame portion, and a plurality of through holes that are drilled in the groove at predetermined intervals in the groove continuing direction, and the through holes are provided with acute-angled notches at the ends in the direction in which the grooves continue in the through holes.

[0108] Thus, according to the disclosure of the present invention, the separation processing portion of the frame body has a combined structure of a groove and a through hole, and the through hole is partially extended in the continuous direction of the groove to create an acute-angled notch. Therefore, when the separation processing portion is cut to separate the reinforcing frame portion of the frame body, a cut surface is smoothly generated starting from the notch along the separation processing portion, making it less likely that burrs or the like will remain on the holding frame portion and not adversely affecting the various operations associated with the vapor deposition process.

[0109] The deposition mask installation method according to the present disclosure is a deposition mask installation method for installing a deposition mask at a preset position in a deposition apparatus, the deposition mask being manufactured by arranging a frame body surrounding the outside of a plurality of mask bodies, each of which has a large number of independent deposition through-holes provided in a predetermined pattern, the frame body having a holding frame portion connectable integrally with an outer periphery of the mask body and a reinforcing frame portion disposed integrally with the holding frame portion in an arrangement that continuously surrounds the outside of the holding frame, the holding frame portion of the frame body of the deposition mask being fixed integrally to a frame for supporting the deposition mask in the deposition apparatus, and the reinforcing frame portion being cut off and removed from the holding frame portion of the frame body in a state where the frame body is fixed to the frame.

[0110] According to the disclosure of the present invention, a deposition mask having a frame body and a plurality of mask bodies connected thereto, the frame body being made stronger and less likely to deform by a reinforcing frame part disposed outside the holding frame part, is fixed to the frame of a deposition apparatus, and the deposition mask can be installed in the deposition apparatus while maintaining a state in which the frame body suppresses deformation of the mask body, preventing displacement of the mask body and ensuring an alignment state between the mask and the deposition substrate, thereby improving the deposition accuracy and the yield of deposition products. Also, by detaching the reinforcing frame part from the holding frame part after fixing the frame body to the deposition apparatus, the reinforcing frame part does not impede the process subsequent to fixing and supporting the deposition mask, and deposition by the deposition apparatus can be carried out without problems.

[0111] In addition, the deposition mask installation method according to the disclosure of the present invention includes a first step of measuring, in a completed state of the deposition mask, displacements in two directions parallel to each side of the rectangular frame body at each position of the frame body and the mask body; a second step of applying, when the inward displacement of a predetermined position does not fall within a preset allowable range, a predetermined outward tensile force parallel to the direction of the maximum displacement to the outer periphery of the frame body that is outside the position where the maximum displacement has occurred, with the magnitude of the force causing the displacement of the position to fall within the allowable range; a third step of measuring the displacements in the two directions at each position of the frame body and the mask body again in a state where the tensile force has been applied; and, when a new position where the inward displacement does not fall within the allowable range is generated after the measurement, applying a predetermined outward tensile force parallel to the direction of the maximum displacement to the outer periphery of the frame body that is outside the position where the maximum displacement has occurred, with the magnitude of the force causing the displacement of the new position to fall within the allowable range, while maintaining the state where the tensile force is applied. and a fifth step of, when a state is measured in which the outward displacement at any location inside the outer periphery of the frame to which a tensile force has already been applied does not fall within a preset allowable range due to the subsequent application of another tensile force, adjusting the tensile force applied to the outer periphery of the frame outside the location to be smaller so that the displacement at the location falls within the allowable range. The third to fifth steps are repeated until the measured displacements at each position on the frame and the mask body fall within the allowable range, and the holding frame portion of the frame of the deposition mask whose displacement falls within the allowable range is fixed to the frame while the tensile force is still being applied to the frame, and the application of the tensile force to the frame is released after the fixing.

[0112] As described above, according to the disclosure of the present invention, a process of applying an external tensile force to a predetermined portion of the frame body where significant deformation may occur due to stress of the mask body, and bringing the displacement within an allowable range is repeated until the displacement falls within the allowable range at both positions of the frame body and the mask body, and the holding frame portion of the frame body is fixed to the frame while leaving the frame body and mask body in the state where the displacement falls within the allowable range, and the deposition mask is placed in the deposition apparatus, and then the tensile force applied to the frame body is released. This makes it possible to reliably prevent the mask body from shifting from the correct position, which would otherwise be caused by deformation of the frame body, in the deposition mask by a method of suppressing deformation of the frame body by application of an external force, while fixing the frame body to the frame, and ensure the appropriate installation of the deposition mask in the deposition apparatus, thereby further improving the accuracy of deposition.

[0113] In addition, a method for manufacturing a deposition mask according to the disclosure of the present invention includes a plurality of metal mask bodies each having a large number of deposition through holes, and a metal frame body arranged to surround the outside of the mask bodies, the method including a first electroforming step of forming primary electrodeposition layers corresponding to the mask bodies by metal electroforming at a plurality of predetermined positions on a matrix, a frame body disposing step of disposing the frame body on the matrix while aligning the primary electrodeposition layers so as to be positioned within a plurality of openings previously provided in the frame body, and a predetermined removal process for the frame body. a frame processing step of providing the frame with cutting processing portions so that at least either the through holes or the recesses are arranged in a regular or irregular line shape, or the grooves are arranged in a continuous line shape; a second electroforming step of forming a metal layer by electroforming in a predetermined range spanning from the surface of a part or the entirety of the frame to the outer peripheral surface of the primary electrodeposition layer, and connecting the frame and the primary electrodeposition layer together via the metal layer so that they are not separated; and a peeling step of peeling off the integrated primary electrodeposition layer, frame and metal layer from the mother mold.

[0114] According to the disclosure of the present invention, a primary electrodeposition layer to be the mask body is formed on a matrix, a frame is arranged so as to be positioned around this primary electrodeposition layer, and a metal layer for connecting the frame and the primary electrodeposition layer is formed in a predetermined range from the surface of the frame to the outer peripheral surface of the primary electrodeposition layer. In this process, a cutting section is provided on the frame by a predetermined removal process. In a state in which the primary electrodeposition layer, the frame and the metal layer are peeled off together from the matrix to obtain a deposition mask, an inner region for holding the mask body integrally and an outer region for reinforcing the entire frame can be set on the frame with the cutting section as a boundary. If the region outside the cutting section of the frame is made sufficiently large, the rigidity of the frame against the force applied from the mask body to the frame based on the stress of the mask body can be increased. The deposition mask can be fixed and installed in a deposition apparatus with the deviation of each part of the mask body from its original position suppressed, and the alignment between the mask and the substrate to be deposited can be ensured. Thus, deposition can be performed with high precision at an appropriate position on the substrate to be deposited. In addition, after the deposition mask is fixed to the deposition apparatus, if it is no longer necessary to ensure the rigidity of the frame body by the area outside the cutting processing section of the frame body, the outer area of ​​the frame body can be easily and effortlessly separated by performing cutting processing at the cutting processing section, allowing for a smooth transition to the deposition process using the deposition apparatus.In addition, the outer area can be separated without affecting the shape of the inner area portion that remains as the frame body and the resulting holding state of the mask body, allowing the subsequent deposition process to be carried out without any problems. [Explanation of symbols]

[0115] 1. Deposition mask 2 Mask body 2a Pattern formation area 2b Outer edge 3 Frame 3a aperture 3b Cutting section 3c groove 3d through hole 3e Notch 4 Holding frame 5 Reinforcement frame 7 metal layer 8 Vapor deposition hole 9. Deposition Pattern 10. Matrices 11 Resist layer 12 Masking film 13 Thin section 14 Primary pattern resist 15 Primary electrodeposition layer 16 Resist layer 17 Masking film 18 Secondary Pattern Resist 19 Masking material 50 frames 51 Bar

Claims

1. A frame used to reinforce a mask body constituting a deposition mask, A holding frame portion that is integrally connected to the mask body; The holding frame portion and the reinforcing frame portion are disposed integrally therewith. Characteristic frame body.

2. In the frame body according to claim 1 , A separation processing portion is provided at the boundary between the holding frame portion and the reinforcing frame portion. Characteristic frame body.

3. In the frame body according to claim 2, The separation processing portion has a through hole, The through hole is provided with a notch. Characteristic frame body.

4. In the frame body according to claim 3, The position of the tip of the notch is shifted toward the holding frame portion or the reinforcing frame portion. Characteristic frame body.

5. In the frame body according to claim 3, The tip position of the notch is shifted toward the holding frame. Characteristic frame body.

6. In the frame body according to claim 2, The cutting-off processed portion is formed such that the grooves are arranged linearly and continuously. Characteristic frame body.

7. 7. The frame according to claim 3, Among the predicted deformation amounts calculated in advance for each portion of the frame body on the assumption that a force based on a stress that causes the cut-off processed portion to remain in the mask body is applied, the larger the predicted deformation amount at the portion where the cut-off processed portion is provided, the smaller the ratio of the size of the portion removed as the through hole or the groove at the portion to the remaining portion that is not removed is set to a shape. Characteristic frame body.

8. 7. The frame according to claim 3, The cut-off processed portion is shaped to increase or decrease the portion to be removed as the through hole or the groove in accordance with the deformation possibility of each portion of the frame body, the predicted deformation amount of which is calculated in advance on the assumption that a force based on the stress remaining in the mask body is applied. Characteristic frame body.

9. In the frame body according to claim 8, The ratio of the removed portion to the remaining portion that is not removed is set to be small in a portion where the amount of deformation due to a force applied based on the stress of the mask body becomes large, and the ratio of the removed portion to the remaining portion that is not removed is set to be large in a portion where the amount of deformation becomes small. Characteristic frame body.

10. 10. The frame according to claim 1, A thin plate having a thickness greater than that of the mask body is formed into a frame shape. Characteristic frame body.

11. 11. The frame according to claim 1, The holding frame is fixed to a frame provided for supporting the deposition mask. Characteristic frame body.

12. In the frame body according to claim 11, The frame has a bar disposed across the frame. Characteristic frame body.

13. In the frame body according to claim 12, The bar is provided so as to overlap the holding frame portion. Characteristic frame body.

14. 14. The frame according to claim 1, The reinforcing frame can be separated and removed from the holding frame. Characteristic frame body.

15. A mask having a frame according to any one of claims 1 to 14 and a mask body having a large number of vapor deposition through-holes formed in a predetermined pattern. A deposition mask having the following characteristics.

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