Semiconductor device and mounting method for semiconductor device

Abstract

To provide a technique of being able to suppress detachment of a semiconductor device from a control board due to vibration or the like at an operation of a system including the control board.SOLUTION: A semiconductor device 50 includes a semiconductor element 1, a sealing resin 3 that includes a first main surface, a second main surface, a first side surface, a second side surface, a third side surface, and a fourth side surface and seals the semiconductor element 1, and a plurality of terminals 4 and 5 electrically connected to the semiconductor element 1, projecting from the first side surface and the second side surface of the sealing resin 3, respectively, and extending to a height position of the second main surface. A heat sink 70 is disposed on the first main surface of the sealing resin 3. On the second main surface of the sealing resin 3, a control board 60 to which the terminals 4 and 5 are electrically connected is disposed. The semiconductor device 50 further includes a pair of bonded parts 8 that project from the third side surface and the fourth side surface of the sealing resin 3, are bonded to the control board 60, and are not electrically connected to the semiconductor element 1.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present disclosure relates to a semiconductor device and a method for mounting the semiconductor device. [Background technology]

[0002] In semiconductor devices for driving small capacity motors for home appliances and industrial use, transfer mold and insertion mounting shapes are generally adopted because of the need to appropriately dissipate the heat generated. However, surface mounting shapes are adopted for small capacity applications such as fan motors (see, for example, Patent Document 1). The terminals of surface mounting semiconductor devices are joined to the board by soldering. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 01-270336 Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, there has been a strong demand for miniaturization and cost reduction of control boards for systems on which motor drive semiconductor devices are mounted, and therefore an increase in output capacity relative to the external size of the semiconductor device is being demanded. For this reason, surface-mount semiconductor devices that have been used only for small capacity applications such as fan motors are being designed to have increased output capacity and to have heat sinks attached to ensure heat dissipation.

[0005] However, when a heat sink was attached to a conventional surface-mounted semiconductor device, there was a problem in that the load of the heat sheet was applied to the terminals due to vibrations during operation of the system equipped with the control board, which made the semiconductor device more likely to peel off from the control board.

[0006] In view of the above, an object of the present disclosure is to provide a technique capable of suppressing detachment of a semiconductor device from a control board due to vibrations or the like during operation of a system including the control board. [Means for solving the problem]

[0007] A semiconductor device according to the present disclosure is a semiconductor device mounted on a control board, the semiconductor device having a semiconductor element, a first main surface, a second main surface opposite to the first main surface, a first side surface connecting the first main surface and the second main surface, a second side surface connecting the first main surface and the second main surface and opposite to the first side surface, a third side surface connecting the first main surface and the second main surface and located between the first side surface and the second side surface, and a fourth side surface connecting the first main surface and the second main surface and opposite to the third side surface, and a sealing resin that seals the semiconductor element; the semiconductor device further comprises a plurality of bonded portions not electrically connected to the semiconductor element, each of which protrudes from the first side surface and the second side surface of the sealing resin and extends to a height position of the second main surface, a heat dissipation member is arranged on the first main surface of the sealing resin, and the control board to which the plurality of terminals are electrically connected is arranged on the second main surface of the sealing resin, the semiconductor device further comprising a plurality of bonded portions not electrically connected to the semiconductor element, each of which protrudes from the third side surface and the fourth side surface of the sealing resin and is bonded to the control board. Effect of the Invention

[0008] According to the present disclosure, since a plurality of joined parts that are not electrically connected to the semiconductor element are joined to the control board in addition to the plurality of terminals, the joining area between the semiconductor device and the control board is increased, and thus it is possible to prevent the semiconductor device from peeling off from the control board due to vibrations during operation of a system including the control board. [Brief description of the drawings]

[0009] [Figure 1] 1 is a perspective top view of a semiconductor device according to a first embodiment. [Diagram 2] 1 is a top view of a semiconductor device according to a first embodiment. [Diagram 3]1 is a side view of the semiconductor device according to the first embodiment turned upside down. [Figure 4] 4 is a side view of the semiconductor device according to the first embodiment in a state where it is turned upside down and joined to a control board and a heat sink. FIG. [Diagram 5] 1 is a top view of a copper frame on which a joint portion is formed, the copper frame being included in the semiconductor device according to the first embodiment. [Figure 6] FIG. 11 is a top view of a semiconductor device according to a second embodiment. [Figure 7] 11 is a side view of a state in which the semiconductor device according to the second embodiment is joined to a control board and a heat sink upside down. FIG. [Figure 8] FIG. 11 is a top view of a semiconductor device according to a third embodiment. [Figure 9] FIG. 11 is a side view of a semiconductor device according to a third embodiment turned upside down. [Figure 10] 13 is a side view of a state in which the semiconductor device according to the third embodiment is turned upside down and joined to a control board and a heat sink. FIG. [Figure 11] FIG. 11 is a side view of a semiconductor device according to a fourth embodiment turned upside down. [Figure 12] 13 is a side view of a state in which the semiconductor device according to the fourth embodiment is turned upside down and joined to a control board and a heat sink. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] <Embodiment 1> The first embodiment will be described below with reference to the drawings. Fig. 1 is a perspective top view of a semiconductor device 50 according to the first embodiment. Fig. 2 is a top view of the semiconductor device 50 according to the first embodiment. Fig. 3 is a side view of the semiconductor device 50 according to the first embodiment turned upside down.

[0011] In FIG. 1, the X direction, the Y direction, and the Z direction are mutually orthogonal. The X direction, the Y direction, and the Z direction shown in the following figures are also mutually orthogonal. In the following, the direction including the X direction and the -X direction opposite to the X direction is also referred to as the "X-axis direction". In the following, the direction including the Y direction and the -Y direction opposite to the Y direction is also referred to as the "Y-axis direction". In the following, the direction including the Z direction and the -Z direction opposite to the Z direction is also referred to as the "Z-axis direction".

[0012] As shown in FIG. 1, a semiconductor device 50 includes a plurality of semiconductor elements 1, a sealing resin 3, a plurality of terminals 4, a plurality of terminals 5, a plurality of frames 6, and a plurality (pairs) of bonded portions 8.

[0013] The semiconductor elements 1 are electrically connected to one another and to the terminals 4, 5 by wires 7. The semiconductor elements 1 include six power semiconductor elements 1a, a High Voltage Integrated Circuit (HVIC) 1b, and a Low Voltage Integrated Circuit (LVIC) 1c.

[0014] The six power semiconductor elements 1a are IGBTs (Insulated Gate Bipolar Transistors), MOSFETs (Metal-Oxide-Semiconductor Field Effect Transistors), or diodes. Of the six power semiconductor elements 1a, three high-voltage side power semiconductor elements 1a are mounted on one frame 6, and the remaining three low-voltage side power semiconductor elements 1a are mounted on three frames 6, respectively.

[0015] The HVIC 1b and the LVIC 1c are mounted on one frame 6. The HVIC 1b controls the three power semiconductor elements 1a on the high-voltage side. The LVIC 1c controls the three power semiconductor elements 1a on the low-voltage side.

[0016] The multiple terminals 4 are main terminals and are electrically connected to the six power semiconductor elements 1a. The multiple terminals 5 are control terminals and are electrically connected to the HVIC 1b and the LVIC 1c.

[0017] 1 and 2, the sealing resin 3 seals the semiconductor elements 1, the terminals 4, the terminals 5, the frames 6, and the pair of joined portions 8 so that the terminals 4, the terminals 5, and a portion of the pair of joined portions 8 are exposed. The sealing resin 3 is formed in a rectangular parallelepiped shape and has a first main surface (Z-direction surface), a second main surface (-Z-direction surface) opposite the first main surface (Z-direction surface), a first side surface (X-direction surface) connecting the first main surface (Z-direction surface) and the second main surface (-Z-direction surface), and a second side surface (X-direction surface) connecting the first main surface (Z-direction surface) and the second main surface (-Z-direction surface) and opposite the first side surface (X-direction surface). The first main surface has a first side surface (-X direction surface), a third side surface (Y direction surface) that connects the first main surface (Z direction surface) and the second main surface (-Z direction surface) and is located between the first side surface (X direction surface) and the second side surface (-X direction surface), and a fourth side surface (-Y direction surface) that connects the first main surface (Z direction surface) and the second main surface (-Z direction surface) and faces the third side surface (Y direction surface).

[0018] As shown in FIGS. 1 to 3, the semiconductor device 50 adopts a surface mount type shape. The base end sides of the multiple terminals 4 are sealed in the sealing resin 3. The tip sides of the multiple terminals 4 protrude in the X direction from the first side surface (X direction surface) of the sealing resin 3 and extend to the height position of the second main surface (-Z direction surface). Furthermore, the tip portions of the multiple terminals 4 extend in a direction away from the sealing resin 3 at the height position of the second main surface (-Z direction surface) of the sealing resin 3. Moreover, the portions of the multiple terminals 4 protruding from the sealing resin 3, that is, the base ends of the multiple terminals 4, are located at a height position between the first main surface (X direction surface) and the second main surface (-Z direction surface) of the sealing resin 3.

[0019] The base end sides of the multiple terminals 5 are sealed in the sealing resin 3. The tip sides of the multiple terminals 5 protrude in the -X direction from the second side surface (surface in the -X direction) of the sealing resin 3 and extend to the height position of the second main surface (surface in the -Z direction). Furthermore, the tip portions of the multiple terminals 5 extend in a direction away from the sealing resin 3 at the height position of the second main surface (surface in the -Z direction) of the sealing resin 3. Moreover, the portions of the multiple terminals 5 protruding from the sealing resin 3, that is, the base ends of the multiple terminals 5, are located at a height position between the first main surface (surface in the X direction) and the second main surface (surface in the -Z direction) of the sealing resin 3.

[0020] Next, the pair of joined parts 8 will be described. Fig. 4 is a side view of the semiconductor device 50 according to the first embodiment in a state where it is turned upside down and joined to the control board 60 and the heat sink 70. However, in the left-hand view of Fig. 4, the X-axis direction is the horizontal direction so that the joining of the multiple terminals 4, 5 and the control board 60 can be easily seen, and in the right-hand view of Fig. 4, the Y-axis direction is the horizontal direction so that the joining of the pair of joined parts 8 and the control board 60 can be easily seen.

[0021] As shown in FIG. 2 to FIG. 4, the width (length in the X-axis direction) of the pair of joined parts 8 is formed slightly smaller than the length of the sealing resin 3 in the X-axis direction. The pair of joined parts 8 is formed in an L-shape when viewed from the X-axis direction. Specifically, the base end sides of the pair of joined parts 8 extend along the Y-axis direction and are sealed in the sealing resin 3, and the tip sides of the pair of joined parts 8 protrude in the Y-axis direction from the third side surface (surface in the Y-direction) and the fourth side surface (surface in the -Y direction) of the sealing resin 3 and extend to the height position of the second main surface (surface in the -Z direction). In addition, the pair of joined parts 8 are not electrically connected to the semiconductor element 1. The pair of joined parts 8 are not only bonded to the control board 60 to increase the bonding area between the semiconductor device 50 and the control board 60, but also have the function of dissipating heat from the semiconductor element 1.

[0022] Next, as a method for mounting the semiconductor device 50, a method for joining the control board 60 and the heat sink 70 as a heat dissipation member to the semiconductor device 50 will be described.

[0023] As shown in FIG. 4, a heat sink 70 is arranged on a first main surface (surface in the Z direction) of the sealing resin 3 via a thermal dissipation material such as thermal grease or a resin sheet (not shown) as a heat transfer member, and the sealing resin 3 and the heat sink 70 are joined by a bonding material (not shown) or the like.

[0024] A control board 60 to which the multiple terminals 4, 5 are electrically connected is disposed on a second main surface (surface in the -Z direction) of the sealing resin 3, and the tips of the multiple terminals 4, 5 and a pair of joined parts 8 are joined to the control board 60. Specifically, the pair of joined parts 8 are joined to the control board 60 simultaneously with the multiple terminals 4, 5 by soldering through reflow.

[0025] When the control board 60 and the heat sink 70 are joined to the semiconductor device 50, the first main surface (the surface in the Z direction) of the sealing resin 3 is in close contact with the heat sink 70, and the second main surface (the surface in the -Z direction) of the sealing resin 3 is in close contact with the control board 60.

[0026] Next, a description will be given of the material of the pair of joined parts 8. Fig. 5 is a top view of a copper frame 10 on which joined parts 8 are formed that are included in a semiconductor device 50 according to the first embodiment. In Fig. 5, the multiple frames 6 are connected together to simplify the drawing.

[0027] 5, the multiple terminals 4, 5, the multiple frames 6, and the pair of joined parts 8 are manufactured from a single copper frame 10. In other words, the multiple terminals 4, 5 and the pair of joined parts 8 are made of the same material, copper, and have the same thickness.

[0028] By cutting the copper frame 10 with tie bars after molding, the pair of joined parts 8 become parts independent of the multiple terminals 4, 5 and the multiple frames 6. Since copper is a metal with excellent heat dissipation properties, it is acceptable to use a part of the copper frame 10 as the pair of joined parts 8 as is. In addition, by being completely separated from other parts of the copper frame 10, they are also electrically independent, and the potential of the pair of joined parts 8 is in a floating state. Therefore, the pair of joined parts 8 only function for the purpose of joining to the control board 60 and dissipating heat, and even if the pair of joined parts 8 come into contact with the control board 60 and the heat sink 70 during the mounting process of the semiconductor device 50, it does not affect the electrical characteristics of the semiconductor element 1 during operation.

[0029] As described above, the semiconductor device 50 according to the first embodiment is a semiconductor device 50 mounted on a control board 60. The semiconductor device 50 includes a semiconductor element 1, a first main surface (surface in the Z direction), a second main surface (surface in the -Z direction) facing the first main surface (surface in the Z direction), a first side surface (surface in the X direction) connecting the first main surface (surface in the Z direction) and the second main surface (surface in the -Z direction), a second side surface (surface in the -X direction) connecting the first main surface (surface in the Z direction) and the second main surface (surface in the -Z direction) and facing the first side surface (surface in the X direction), and a second side surface (surface in the -X direction) connecting the first main surface (surface in the Z direction) and the second main surface (surface in the -Z direction) and facing the first side surface (surface in the X direction). The semiconductor element 1 is electrically connected to the semiconductor element 1 and has a third side surface (Y direction surface) located between the first main surface (Z direction surface) and the second main surface (-Z direction surface), and a fourth side surface (-Y direction surface) that connects the first main surface (Z direction surface) and the second main surface (-Z direction surface) and faces the third side surface (Y direction surface).The semiconductor element 1 is electrically connected to the semiconductor element 1 and has a plurality of terminals 4 and 5 that protrude from the first side surface (X direction surface) and the second side surface (-X direction surface) of the sealing resin 3, respectively, and extend to the height position of the second main surface (-Z direction surface). A heat sink 70 is arranged on a first main surface (surface in the Z direction) of the sealing resin 3, and a control board 60 to which multiple terminals 4, 5 are electrically connected is arranged on a second main surface (surface in the -Z direction) of the sealing resin 3. The semiconductor device 50 further includes a pair of bonded portions 8 that are not electrically connected to the semiconductor element 1, which protrude from a third side surface (surface in the Y direction) and a fourth side surface (surface in the -Y direction) of the sealing resin 3 and are bonded to the control board 60.

[0030] Therefore, a pair of joined portions 8 that are not electrically connected to the semiconductor element 1 are joined to the control board 60 in addition to the multiple terminals 4 and 5, increasing the joining area between the semiconductor device 50 and the control board 60. This makes it possible to prevent the semiconductor device 50 from peeling off from the control board 60 due to vibrations during operation of a system including the control board 60.

[0031] Furthermore, this structure makes it possible to mount the semiconductor device 50 on the heat sink 70 without providing screw holes in the semiconductor device 50 for screwing it to the heat sink 70, as is the case with conventional insert-mount type semiconductor devices, and makes it possible to properly dissipate heat while preventing the semiconductor device 50 from peeling off from the control board 60.

[0032] Moreover, the multiple terminals 4, 5 extend in a direction away from the sealing resin 3 at the height position of the second main surface (the surface in the -Z direction) of the sealing resin 3. This further increases the bonding area between the semiconductor device 50 and the control board 60, thereby further preventing the semiconductor device 50 from peeling off from the control board 60 due to vibrations during operation of a system including the control board 60.

[0033] In addition, although the multiple terminals 4, 5 and the multiple joined parts 8 are made of the same material, the multiple joined parts 8 are electrically floating. Copper is a material with excellent heat dissipation properties, and by using a part of the copper frame 10 as the pair of joined parts 8, a certain degree of heat dissipation is possible from the pair of joined parts 8. In addition, when the copper frame 10 is tie-bar cut, the pair of joined parts 8 is completely separated from the multiple terminals 4, 5 and the multiple frames 6, so that the pair of joined parts 8 can be electrically independent. As a result, the pair of joined parts 8 become components whose only purpose is heat dissipation and joining, and do not affect the electrical characteristics of the semiconductor device 50.

[0034] Further, the portions of the terminals 4 and 5 protruding from the sealing resin 3 are located at a height position between the first main surface (the surface in the Z direction) of the sealing resin 3 and the second main surface (the surface in the -Z direction).

[0035] Therefore, when the semiconductor device 50 is placed on the control board 60 and the heat sink 70 is mounted, the sealing resin 3 acts as a stopper to prevent the heat sink 70 from coming into contact with the terminals 4, 5, thereby preventing the terminals 4, 5 from being deformed by the pressure of the heat sink 70. This allows the original shapes of the terminals 4, 5 to be maintained while maintaining the adhesion of the heat dissipation surfaces (first main surfaces) between the heat sink 70 and the sealing resin 3, thereby enabling appropriate heat dissipation.

[0036] Furthermore, since the pair of joinable portions 8 are joined to the control board 60 simultaneously with the multiple terminals 4, 5 by reflow soldering, the joining area between the semiconductor device 50 and the control board 60 can be increased without changing the mounting method of conventional semiconductor devices as much as possible.

[0037] <Embodiment 2> Next, a semiconductor device 50A according to a second embodiment will be described. Fig. 6 is a top view of the semiconductor device 50A according to the second embodiment. Fig. 7 is a side view of the semiconductor device 50A according to the second embodiment, turned upside down and joined to a control board 60 and a heat sink 70. In the second embodiment, the same components as those described in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

[0038] As shown in FIGS. 6 and 7, in the second embodiment, a semiconductor device 50A includes, instead of the pair of bonded portions 8, a pair of bonded portions 18 having a different shape from the pair of bonded portions 8.

[0039] The width (length in the X-axis direction) of the pair of joined parts 18 is formed slightly smaller than the length of the sealing resin 3 in the X-axis direction. The pair of joined parts 18 are formed in a Z-shape when viewed from the X-axis direction. Specifically, the base end side of the pair of joined parts 18 extends along the Y-axis direction and is sealed in the sealing resin 3, and the tip side of the pair of joined parts 18 protrudes in the Y-axis direction from the third side surface (surface in the Y-axis direction) and the fourth side surface (surface in the -Y direction) of the sealing resin 3, extends to the height position of the second main surface (surface in the -Z direction), and extends in a direction away from the sealing resin 3 at the height position of the second main surface (surface in the -Z direction) of the sealing resin 3. A screw hole 18a is provided in the part of the pair of joined parts 18 that extends in a direction away from the sealing resin 3. In addition, a screw hole (not shown) is also provided in the heat sink 70, and the control board 60, the pair of joined parts 18, and the heat sink 70 are joined by a screw 9. The pair of joined parts 18 are produced from one copper frame 10, similarly to the first embodiment.

[0040] Moreover, the pair of joined parts 18 are not electrically connected to the semiconductor element 1. The pair of joined parts 18 are joined to the control board 60 to increase the joining area between the semiconductor device 50A and the control board 60, and also have the function of dissipating heat from the semiconductor element 1.

[0041] Next, a method for joining the control board 60 and the heat sink 70 to the semiconductor device 50A will be described.

[0042] As shown in FIG. 7, a heat sink 70 is disposed on a first main surface (surface in the Z direction) of the sealing resin 3 via a heat dissipation grease or a resin sheet (not shown) as a heat transfer member.

[0043] A control board 60 to which the multiple terminals 4, 5 are electrically connected is disposed on a second main surface (surface in the -Z direction) of the sealing resin 3, and the tips of the multiple terminals 4, 5 and a pair of joined portions 18 are joined to the control board 60. Specifically, after the multiple terminals 4, 5 are joined to the control board 60 by soldering through reflow, the pair of joined portions 18 are joined to the control board 60 and the heat sink 70 by screwing.

[0044] As described above, in the semiconductor device 50A of embodiment 2, a pair of joinable parts 18 are provided with holes 18a for screwing, and the pair of joinable parts 18 are joined to the control board 60 by screwing them.

[0045] Furthermore, after the multiple terminals 4, 5 are joined to the control board 60 by soldering through reflow, the pair of joined portions 18 are joined to the control board 60 by screwing.

[0046] Therefore, similarly to the first embodiment, it is possible to prevent the semiconductor device 50A from peeling off from the control substrate 60 due to vibrations during operation of a system including the control substrate 60. Also, the semiconductor device 50A and the control substrate 60 can be bonded more firmly than in the first embodiment.

[0047] <Embodiment 3> Next, a semiconductor device 50B according to a third embodiment will be described. Fig. 8 is a top view of the semiconductor device 50B according to the third embodiment. Fig. 9 is a side view of the semiconductor device 50B according to the third embodiment turned upside down. Fig. 10 is a side view of the semiconductor device 50B according to the third embodiment turned upside down and joined to a control board 60 and a heat sink 70. In the third embodiment, the same components as those described in the first and second embodiments are denoted by the same reference numerals, and description thereof will be omitted.

[0048] As shown in FIGS. 8 to 10, in the third embodiment, a semiconductor device 50B includes, instead of the pair of bonded portions 8, a pair of bonded portions 28 having a different shape from the pair of bonded portions 8. As shown in FIG.

[0049] The width (length in the X-axis direction) of the pair of joined parts 28 is smaller than that of the pair of joined parts 8, 18 in the first and second embodiments. The pair of joined parts 28 is formed in an L-shape when viewed from the X-axis direction. Specifically, the base end side of the pair of joined parts 28 extends along the Y-axis direction and is sealed in the sealing resin 3, and the tip side of the pair of joined parts 28 protrudes in the Y-axis direction from the third side surface (Y-direction surface) and the fourth side surface (-Y-direction surface) of the sealing resin 3 and extends to the height position of the second main surface (-Z-direction surface). The tip of the pair of joined parts 28 is provided with a pin that is inserted into a hole (not shown) provided in the control board 60. In other words, the tip of the pair of joined parts 28 is formed in a pin shape. Here, the tip of the pair of joined parts 28 corresponds to a pin.

[0050] Moreover, the pair of joined parts 28 are not electrically connected to the semiconductor element 1. The pair of joined parts 28 are joined to the control board 60 to increase the joining area between the semiconductor device 50B and the control board 60, and also have the function of dissipating heat from the semiconductor element 1.

[0051] Next, a method for joining the control board 60 and the heat sink 70 to the semiconductor device 50B will be described.

[0052] As shown in FIG. 10, a heat sink 70 is arranged on a first main surface (surface in the Z direction) of the sealing resin 3 via a thermal dissipation material such as thermal grease or a resin sheet (not shown) as a heat transfer member, and the sealing resin 3 and the heat sink 70 are joined by a bonding material (not shown) or the like.

[0053] A control board 60 to which the terminals 4, 5 are electrically connected is disposed on the second main surface (surface in the -Z direction) of the sealing resin 3, and the tips of the terminals 4, 5 and the pair of joined parts 18 are joined to the control board 60. Specifically, after the terminals 4, 5 are joined to the control board 60 by soldering through reflow, the pair of joined parts 28 are joined to the control board 60 by inserting pins into holes (not shown) provided in the control board 60 and then bending the control board 60 in the Y-axis direction, for example. Alternatively, the pair of joined parts 28 may be joined to the control board 60 by soldering to a ground terminal (not shown) on the control board 60 after inserting pins into holes provided in the control board 60.

[0054] As described above, in the semiconductor device 50B according to the third embodiment, a pin to be inserted into a hole provided in the control board 60 is provided at the tip of the pair of joined portions 28.

[0055] In addition, after the multiple terminals 4, 5 are joined to the control board 60 by reflow soldering, the pair of joined portions 28 are joined to the control board 60 by inserting a pin into a hole provided in the control board 60 and then bending the pin, or by soldering to a ground terminal on the control board 60.

[0056] Therefore, similarly to the first embodiment, it is possible to prevent the semiconductor device 50B from peeling off from the control substrate 60 due to vibrations during operation of a system including the control substrate 60. Also, the semiconductor device 50B and the control substrate 60 can be bonded more firmly than in the first embodiment.

[0057] <Fourth embodiment> Next, a semiconductor device 50C according to a fourth embodiment will be described. Fig. 11 is a side view of the semiconductor device 50C according to the fourth embodiment turned upside down. Fig. 12 is a side view of the semiconductor device 50C according to the fourth embodiment turned upside down and joined to a control board 60 and a heat sink 70. In the fourth embodiment, the same components as those described in the first to third embodiments are denoted by the same reference numerals, and description thereof will be omitted.

[0058] As shown in FIG. 11 and FIG. 12, in the fourth embodiment, the semiconductor device 50C includes a pair of joined parts 28 instead of the pair of joined parts 8. A pair of engagement parts 28a that engage with holes (not shown) provided in the control board 60 is provided on the pins of the pair of joined parts 28, i.e., the tip parts of the pair of joined parts 28. The pair of engagement parts 28a extend in a direction approaching the sealing resin 3 at the height position of the second main surface (surface in the -Z direction) of the sealing resin 3. In order to improve the ease of mounting the semiconductor device 50C compared to the third embodiment, the pair of joined parts 28 including the pair of engagement parts 28a are made of a material that has excellent heat dissipation properties and is elastically deformable, rather than copper. This allows the semiconductor device 50C to be joined to the control board 60 by fitting the pair of engagement parts 28a into the holes of the control board 60 with a single touch.

[0059] Next, a method for joining the control board 60 and the heat sink 70 to the semiconductor device 50C will be described.

[0060] As shown in FIG. 12, a heat sink 70 is arranged on a first main surface (surface in the Z direction) of the sealing resin 3 via a thermal dissipation material such as thermal grease or a resin sheet (not shown) as a heat transfer member, and the sealing resin 3 and the heat sink 70 are joined by a bonding material (not shown) or the like.

[0061] A control board 60 to which the multiple terminals 4, 5 are electrically connected is disposed on the second main surface (the surface in the -Z direction) of the sealing resin 3, and the tips of the multiple terminals 4, 5 and the pair of joined portions 28 are joined to the control board 60. Specifically, after the multiple terminals 4, 5 are joined to the control board 60 by soldering through reflow, the pair of joined portions 28 are joined to the control board 60 by inserting pins into holes provided in the control board 60 and engaging the engaging portions 28a.

[0062] As described above, in the semiconductor device 50C according to the fourth embodiment, the pin is provided with the engagement portion 28a that engages with the hole provided in the control board 60.

[0063] In addition, after the multiple terminals 4, 5 are joined to the control board 60 by reflow soldering, the pair of joined portions 28 are joined to the control board 60 by inserting a pin into a hole provided in the control board 60 and engaging the engaging portion 28a.

[0064] As in the first embodiment, it is possible to prevent the semiconductor device 50C from peeling off from the control board 60 due to vibrations during operation of a system including the control board 60. Furthermore, since the semiconductor device 50C and the control board 60 can be joined by fitting the pair of engagement portions 28a into the holes of the control board 60 with a single touch, it is possible to simplify the mounting of the semiconductor device 50C compared to the third embodiment.

[0065] <Modifications of the First to Fourth Embodiments> In embodiments 1 to 4, the bonded portions 8, 18, 28 are not limited to a pair, and multiple pairs of bonded portions 8, 18, 28 may protrude from the third side surface (Y-direction surface) and fourth side surface (-Y-direction surface) of the sealing resin 3.

[0066] It should be noted that the embodiments can be freely combined, and each embodiment can be modified or omitted as appropriate.

[0067] Various aspects of the present disclosure are summarized below as appendices.

[0068] (Appendix 1) A semiconductor device mounted on a control board, A semiconductor element; a sealing resin having a first main surface, a second main surface opposite to the first main surface, a first side surface connecting the first main surface and the second main surface, a second side surface connecting the first main surface and the second main surface and opposite to the first side surface, a third side surface connecting the first main surface and the second main surface and located between the first side surface and the second side surface, and a fourth side surface connecting the first main surface and the second main surface and opposite to the third side surface, and sealing the semiconductor element; a plurality of terminals electrically connected to the semiconductor element, each protruding from the first side surface and the second side surface of the sealing resin and extending to a height position of the second main surface; a heat dissipation member is disposed on the first main surface of the sealing resin, the control board to which the terminals are electrically connected is disposed on the second main surface of the sealing resin; The semiconductor device further includes a plurality of bonded portions that are not electrically connected to the semiconductor element and that protrude from the third side and the fourth side of the sealing resin and are bonded to the control board.

[0069] (Appendix 2) 2. The semiconductor device according to claim 1, wherein the terminals extend in a direction away from the sealing resin at a height position of the second main surface of the sealing resin.

[0070] (Appendix 3) The plurality of joined portions are provided with holes for screw fastening, 3. The semiconductor device according to claim 1, wherein the control board and the joined portions are joined by screwing the control board to each other.

[0071] (Appendix 4) 4. The semiconductor device according to claim 1, wherein the plurality of bonded portions extend to a height position of the second main surface of the sealing resin.

[0072] (Appendix 5) 3. The semiconductor device according to claim 1, wherein a pin is provided at each of the tips of the plurality of joined portions to be inserted into a hole provided in the control board.

[0073] (Appendix 6) The semiconductor device according to claim 5, wherein the pin is provided with an engagement portion that engages with a hole provided in the control board.

[0074] (Appendix 7) 6. The semiconductor device according to claim 1, wherein the terminals and the joined portions are made of the same material, but the joined portions are electrically floating.

[0075] (Appendix 8) 8. The semiconductor device according to claim 1, wherein the portions of the terminals protruding from the sealing resin are located at a height position between the first main surface and the second main surface of the sealing resin.

[0076] (Appendix 9) A method for mounting the semiconductor device according to claim 1 on the control board, comprising the steps of: A method for mounting a semiconductor device, wherein the plurality of joint portions are joined to the control board simultaneously with the plurality of terminals by soldering through reflow.

[0077] (Appendix 10) A method for mounting the semiconductor device according to claim 3 on the control board, comprising the steps of: A method for mounting a semiconductor device, comprising the steps of: joining the plurality of terminals to the control board by soldering through reflow; and then joining the plurality of joined portions to the control board by screwing.

[0078] (Appendix 11) A method for mounting the semiconductor device according to claim 5 on the control board, comprising the steps of: A method for mounting a semiconductor device, in which a plurality of the terminals are joined to the control board by reflow soldering, and then a plurality of the joined portions are joined to the control board by inserting the pins into the holes provided in the control board and then bending the pins, or by soldering to a ground terminal on the control board.

[0079] (Appendix 12) A method for mounting the semiconductor device according to claim 6 on the control board, comprising the steps of: A method for mounting a semiconductor device, in which a plurality of the terminals are joined to the control board by reflow soldering, and then a plurality of the joined portions are joined to the control board by inserting the pins into the holes provided in the control board and engaging the engaging portions. [Explanation of symbols]

[0080] 1 semiconductor element, 3 sealing resin, 4, 5 terminals, 8 bonded portion, 18 bonded portion, 18a hole, 28 bonded portion, 28a engagement portion, 50, 50A, 50B, 50C semiconductor device, 60 control board, 70 heat sink.

Claims

1. A semiconductor device mounted on a control board, A semiconductor element; a sealing resin having a first main surface, a second main surface opposite to the first main surface, a first side surface connecting the first main surface and the second main surface, a second side surface connecting the first main surface and the second main surface and opposite to the first side surface, a third side surface connecting the first main surface and the second main surface and located between the first side surface and the second side surface, and a fourth side surface connecting the first main surface and the second main surface and opposite to the third side surface, and sealing the semiconductor element; a plurality of terminals electrically connected to the semiconductor element, each protruding from the first side surface and the second side surface of the sealing resin and extending to a height position of the second main surface; a heat dissipation member is disposed on the first main surface of the sealing resin; the control board to which the plurality of terminals are electrically connected is disposed on the second main surface of the sealing resin; The semiconductor device further includes a plurality of bonded portions that are not electrically connected to the semiconductor element and that protrude from the third side surface and the fourth side surface of the sealing resin and are bonded to the control board.

2. The semiconductor device according to claim 1 , wherein the terminals extend in a direction away from the sealing resin at a height position of the second main surface of the sealing resin.

3. The plurality of joined portions are provided with holes for screw fastening, The semiconductor device according to claim 1 , wherein the control board and the plurality of joined portions are joined to each other by screwing the plurality of joined portions to the control board.

4. The semiconductor device according to claim 1 , wherein the plurality of bonded portions extend to a height position of the second main surface of the sealing resin.

5. The semiconductor device according to claim 1 , wherein a pin is provided at each of the tip ends of the plurality of joined portions to be inserted into a hole provided in the control board.

6. 6. The semiconductor device according to claim 5, wherein said pin is provided with an engagement portion that engages with a hole provided in said control board.

7. 2. The semiconductor device according to claim 1, wherein the plurality of terminals and the plurality of joined portions are made of the same material, but the plurality of joined portions are electrically floating.

8. The semiconductor device according to claim 1 , wherein the portions of the terminals protruding from the sealing resin are located at a height position between the first main surface and the second main surface of the sealing resin.

9. A method for mounting the semiconductor device according to claim 1 on the control board, comprising the steps of: A method for mounting a semiconductor device, wherein the plurality of joint portions are joined to the control board simultaneously with the plurality of terminals by soldering through reflow.

10. A method for mounting the semiconductor device according to claim 3 on the control board, comprising the steps of: A method for mounting a semiconductor device, comprising the steps of: joining the plurality of terminals to the control board by soldering through reflow; and then joining the plurality of joined portions to the control board by screwing.

11. A method for mounting the semiconductor device according to claim 5 on the control board, comprising the steps of: A method for mounting a semiconductor device, in which a plurality of the terminals are joined to the control board by reflow soldering, and then a plurality of the joined portions are joined to the control board by inserting the pins into the holes provided in the control board and then bending the pins, or by soldering to a ground terminal on the control board.

12. A method for mounting the semiconductor device according to claim 6 on the control board, comprising the steps of: A method for mounting a semiconductor device, in which a plurality of the terminals are joined to the control board by reflow soldering, and then a plurality of the joined portions are joined to the control board by inserting the pins into the holes provided in the control board and engaging the engaging portions.

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