Support structure for circuit board group

Abstract

To provide a support structure capable of stabilizing a support state of a circuit board group housed in an electronic device with a simple configuration.SOLUTION: A support structure T for a circuit board group according to the present disclosure includes: a first support member M1 that is disposed along a first circuit board 10 directly below the first circuit board 10 and supports the first circuit board 10 via its own first engagement claws M11; and a second support member M2 that is disposed along a third circuit board 30 directly below the third circuit board 30 and supports the third circuit board 30 via its own second engagement claws M21. The first support member M1 has a plurality of first protrusions M12. The second support member M2 has a plurality of second protrusions M23. A second circuit board 20 is pressed down from below and above by the plurality of first protrusions M12 and the plurality of second protrusions M23, thereby supporting the second circuit board 20 with board surfaces of the first, second, and third circuit boards 10, 20, 30 spaced apart from each other.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to a support structure for a group of circuit boards. [Background technology]

[0002] Electronic devices are known that house multiple circuit boards (hereinafter also referred to as a "circuit board group") within a main body case, connect these circuit boards with electrical connectors, and perform various signal processing to realize various functions (see, for example, Patent Document 1).

[0003] Conventionally, in such electronic devices, the plurality of circuit boards are fixed into a block shape by, for example, fastening with screws, and measures are taken to prevent the electrical connectors from coming loose. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2006-332515 A Summary of the Invention [Problem to be solved by the invention]

[0005] Incidentally, the inventors of the present application are considering constructing a screwless support structure for a group of circuit boards housed in a main body case of an electronic device in order to reduce the number of manufacturing steps for the electronic device and to reduce costs.

[0006] However, if the structure supporting these circuit boards were simply made screw-less, the relative positions of the circuit boards may change due to vibrations received during actual use of the electronic device (for example, vibrations when the electronic device is dropped), resulting in insufficient insulation distances and the risk of crosstalk occurring between the circuit boards. Furthermore, if the relative positions of the circuit boards change, there is a risk of poor connection occurring in the electrical connectors (for example, BtoB electrical connectors) that connect the circuit boards together.

[0007] The present disclosure has been made in consideration of the above-mentioned problems, and aims to provide a support structure for a circuit board group that is simple in configuration and is capable of stabilizing the support state of a circuit board group stored in an electronic device. [Means for solving the problem]

[0008] The present disclosure, which solves the above-mentioned problems, is A support structure for a group of circuit boards housed in an electronic device, comprising: The circuit board group includes: The device is configured to include first, second, and third circuit boards arranged in order from bottom to top with their board surfaces substantially parallel to each other, The support structure includes: a first support member disposed along the first circuit board immediately below the first circuit board and configured to support the first circuit board via a first engagement claw provided therein; a second support member disposed along the third circuit board immediately below the third circuit board and configured to support the third circuit board via a second engagement claw provided in the second support member; The present invention relates to a method for manufacturing a computer-implemented ... the first support member has a plurality of first protrusions extending upward from a main body portion of the first support member toward a lower surface of the second circuit board; the second support member has a plurality of second protrusions extending downward from a main body portion of the second support member toward an upper surface of the second circuit board; The second circuit board is supported in a state in which the board surfaces of the first, second, and third circuit boards are spaced apart from each other by pressing the second circuit board from below and above with the first protruding portions of the first support member and the second protruding portions of the second support member. It is a support structure. Effect of the Invention

[0009] According to the support structure for a circuit board group according to the present disclosure, it is possible to stably support the circuit board group housed in an electronic device with a simple configuration. [Brief description of the drawings]

[0010] [Figure 1] Diagram showing the appearance of the telemeter [Diagram 2] FIG. 2 is a perspective view showing a circuit board group housed in a main body case of the telemeter and a support structure for the circuit board group; [Diagram 3] FIG. 2 is a perspective view showing a circuit board group housed in a main body case of the telemeter and a support structure for the circuit board group; [Figure 4] FIG. 2 is a perspective view showing a circuit board group housed in a main body case of the telemeter and a support structure for the circuit board group; [Diagram 5] FIG. 2 is an exploded perspective view showing the configuration of a support structure for a group of circuit boards housed in a main body case of the telemeter; [Figure 6] FIG. 13 is a diagram illustrating a state in which a first circuit board is supported by a first support member; [Figure 7] FIG. 13 is a diagram showing a state in which a third circuit board is supported by a second support member; [Figure 8] FIG. 11 is a side view showing a state in which a second circuit board is supported between a first support member and a second support member; [Figure 9] FIG. 11 is a side view (enlarged view) showing a state in which a second circuit board is supported between a first support member and a second support member; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In this specification and the drawings, components having substantially the same functions are denoted by the same reference numerals, and redundant description will be omitted.

[0012] Hereinafter, a description will be given of an embodiment in which a support structure for a circuit board group according to the present invention (hereinafter referred to as "support structure T for a circuit board group") is applied to a telemeter (hereinafter referred to as "telemeter 1"). However, the support structure T for a circuit board group according to the present invention can also be applied to electronic devices other than telemeters. In particular, the support structure T for a circuit board group according to the present invention is suitable for small portable electronic devices such as mobile phones, digital cameras, or portable medical devices (e.g., Holter recorders).

[0013] Fig. 1 is a diagram showing the external appearance of the telemeter 1. Figs. 2, 3, and 4 are perspective views showing a circuit board group (first, second, and third circuit boards 10, 20, 30) housed in a main body case 100 of the telemeter 1, and a support structure T for the circuit board group. Figs. 2, 3, and 4 show perspective views of the support structure T for the circuit board group viewed from different angles. The main body case 100 is not shown in Figs. 2, 3, and 4.

[0014] Fig. 5 is an exploded perspective view showing each component of the support structure T for the circuit board group housed in the main body case 100 of the telemeter 1. Fig. 6 is a diagram showing a state in which the first circuit board 10 is supported by the first support member M1. Fig. 7 is a diagram showing a state in which the third circuit board 30 is supported by the second support member M2.

[0015] 8 and 9 are side views showing a state in which the second circuit board 20 is supported between the first support member M1 and the second support member M2. Note that Fig. 9 shows an enlarged view of the second circuit board 20 being supported.

[0016] In each figure, a common Cartesian coordinate system (X, Y, Z) is shown to clarify the positional relationship of each component. In the following description, the positive direction of the X axis represents the forward direction of the telemeter 1, the positive direction of the Y axis represents the width direction of the telemeter 1, and the positive direction of the Z axis represents the upward direction of the telemeter 1 (hereinafter abbreviated as "upward direction"). However, these directions do not limit the posture of the telemeter 1 of the present invention when in use.

[0017] The telemeter 1 is, for example, an electronic device that is carried by a user, acquires the user's biological signals (e.g., information related to arterial blood oxygen saturation and heart rate) sensed by an external sensor device (not shown) via a cable, processes the biological signals, and then transmits them via wireless communication to an external monitor device (not shown).

[0018] The telemeter 1 has a circuit board group in the main body case 100. The circuit board group includes first, second and third circuit boards 10, 20, 30 arranged in order from bottom to top with the board surfaces generally parallel to each other (see FIG. 5). That is, the second circuit board 20 is arranged above the first circuit board 10, and the third circuit board 30 is arranged above the second circuit board 20.

[0019] The main body case 100 is, for example, a box having a substantially rectangular parallelepiped shape. The main body case 100 is formed, for example, from an insulating resin material (for example, ABS resin or PBT resin). The main body case 100 is configured, for example, so that the internal space is sealed.

[0020] In this embodiment, the first circuit board 10 is the main board, and various module components are mounted on the first circuit board 10 to constitute a drive circuit for the image display device 40 (e.g., a liquid crystal display) (see FIG. 2) supported by the first support member M1, and a communication circuit for communicating with an external monitor device. In addition, the second circuit board 20 and the third circuit board 30 are mounted with various module components (not shown) for processing biological signals related to SpO2 (blood oxygen saturation: hereinafter referred to as "SpO2"). The first, second and third circuit boards 10, 20 and 30 are typically composed of rigid circuit boards such as printed circuit boards.

[0021] In this embodiment, the circuit board for processing the SpO2-related signal is divided into two boards, the second circuit board 20 and the third circuit board 30. The first reason is to suppress the expansion of the horizontal size of the circuit board for SpO2. The second reason is that in this embodiment, a general-purpose circuit board on which general-purpose signal processing components are mounted is used as the second circuit board 20, and a separate circuit board (i.e., the third circuit board 30) is required for performing signal processing according to the product specifications of each telemeter 1. In other words, in the telemeter 1 according to this embodiment, the circuit board for performing various signal processing is configured with three circuit boards due to the reduction in size of the telemeter 1 body and the necessity of circuit design.

[0022] The first, second and third circuit boards 10, 20 and 30 are electrically connected to each other at least between two of the first, second and third circuit boards 10, 20 and 30 through BtoB type electrical connectors (here meaning ST-ST type electrical connectors that electrically connect the board surfaces of the circuit boards in parallel to each other; the same applies below) arranged on the respective board surfaces. In this embodiment, the first circuit board 10 and the third circuit board 30 are electrically connected to each other through a BtoB type first electrical connector C1, and the second circuit board 20 and the third circuit board 30 are electrically connected to each other through a BtoB type second electrical connector C2. More specifically, a first socket 11 mounted on the upper surface of the first circuit board 10 and a first plug 31 mounted on the lower surface of the third circuit board 30 are electrically connected to form a first electrical connector C1, and a second socket 21 mounted on the upper surface of the second circuit board 20 and a second plug 32 mounted on the lower surface of the third circuit board 30 are electrically connected to form a second electrical connector C2 (see FIG. 5).

[0023] In the telemeter 1 according to this embodiment, a measurement signal related to SpO2 is input to the telemeter 1 from an external sensor device (not shown) via an external input terminal 101 (see FIG. 1). The external input terminal 101 is electrically connected to a third electric connector 33 of ST / RA type disposed on the outer edge of the third circuit board 30 (see FIG. 2).

[0024] That is, in the telemeter 1 according to this embodiment, the measurement signal related to SpO2 input to the external input terminal 101 is taken in by the third circuit board 30 and processed by the circuit module mounted on the second circuit board 20 and the third circuit board 30, which are electrically connected to each other via the second electric connector C2. Then, the result of the signal processing (i.e., the measurement result of SpO2) is sent from the third circuit board 30 to the first circuit board 10 via the first electric connector C1. Then, the measurement result of SpO2 is displayed on the image display device 40 supported by the first circuit board 10 by the liquid crystal drive circuit module mounted on the first circuit board 10, and is transmitted to the external monitor device by wireless communication via the communication circuit module mounted on the first circuit board 10. The first circuit board 10 and the image display device 40 are connected using a flexible board.

[0025] Incidentally, a substantially circular first opening 10a is formed in the first circuit board 10 (see FIG. 5). The first opening 10a is formed at a position corresponding to the first protrusion M12 of the first support member M1 disposed directly below the first circuit board 10. The first opening 10a has a larger diameter than the first protrusion M12 (base end) of the first support member M1, and the first protrusion M12 of the first support member M1 is inserted into the first opening 10a.

[0026] Further, the second circuit board 20 is formed with a substantially circular second opening 20a (see FIG. 5). The second opening 20a is formed at a position where the first protrusion M12 of the first support member M1 and the second protrusion M23 of the second support member M2 are arranged to face each other. The second opening 20a has a smaller diameter than the first protrusion M12 (base end) of the first support member M1, a larger diameter than the convex structure (i.e., reduced diameter portion) M12a at the tip end of the first protrusion M12, and a smaller diameter than the second protrusion M23 of the second support member M2 (described later with reference to FIG. 9).

[0027] <Details of the support structure T for the circuit board group> Next, a support structure T for the circuit board group (that is, the first, second and third circuit boards 10, 20, 30) in the telemeter 1 according to this embodiment will be described.

[0028] The circuit board group according to this embodiment (that is, the first, second and third circuit boards 10, 20, 30) is supported and fixed by a first supporting member M1 and a second supporting member M2 without the use of screws.

[0029] Specifically, the support structure T for a circuit board group according to this embodiment is configured by a first support member M1 that is disposed along and directly below the first circuit board 10 and supports the first circuit board 10 via its own first engagement claws M11, and a second support member M2 that is disposed along and directly below the third circuit board 30 and supports the third circuit board 30 via its own second engagement claws M21. Both the first and second support members M1 and M2 are formed of an insulating resin material (e.g., ABS resin, PBT resin, or nylon resin).

[0030] The first support member M1 has, for example, a shape (for example, a plate shape or a frame shape) extending in the XY direction along the board surface of the first circuit board 10. The first support member M1 is disposed so as to surround the first circuit board 10 and has a plurality of first engagement claws M11 extending upward (in the positive Z direction) from a main body portion M10 of the first support member M1, and supports the first circuit board 10 by engaging with the first circuit board 10. The first support member M1 according to this embodiment has first engagement claws M11 on each of a side surface on the positive Y direction side, a side surface on the negative Y direction side, and a side surface on the positive X direction side.

[0031] Moreover, the first support member M1 has a plurality of first protrusions M12 extending upward (in the positive Z direction) from a main body portion M10 of the first support member M1, and the plurality of first protrusions M12 are arranged in a state of abutting (i.e., being pressed against) the lower surface of the second circuit board 20. The first support member M1 according to this embodiment has two first protrusions M12 that are substantially cylindrical in shape and have a convex structure (i.e., a reduced diameter portion) M12a (see FIG. 9) at their tips.

[0032] The first engagement claw M11 and the first protrusion M12 are integrally formed with the main body M10 of the first support member M1.

[0033] Moreover, the first support member M1 supports an image display device 40 (in this embodiment, a liquid crystal display) on a surface opposite to a surface supporting the first circuit board 10 (see FIGS. 4 and 6). The first support member M1 has, for example, a substantially rectangular fitting groove M1a on a surface opposite to a surface supporting the first circuit board 10 (i.e., a surface on the negative Z direction side), and supports the image display device 40 by fitting the image display device 40 into the fitting groove M1a.

[0034] The image display device 40 is supported by the first support member M1 so that the monitor faces downward (i.e., in the negative Z direction) inside the main body case 100 of the telemeter 1. The bottom side of the main body case 100 is formed of a transparent member (e.g., polycarbonate or glass), and the monitor of the image display device 40 can be viewed from the outside through the transparent member on the bottom surface of the main body case 100.

[0035] The second support member M2 has, for example, a shape (for example, a plate shape or a frame shape) extending in the XY direction along the board surface of the third circuit board 30. The second support member M2 is disposed so as to surround the third circuit board 30 and has a plurality of second engagement claws M21 extending upward (in the positive Z direction) from a main body portion M20 of the second support member M2, and these multiple second engagement claws M21 engage with the third circuit board 30 to support the third circuit board 30. The second support member M2 according to this embodiment has two second engagement claws M21 on a side surface on the positive Y direction side and three second engagement claws M21 on a side surface on the negative Y direction side.

[0036] The second support member M2 is disposed so as to surround at least a portion of the first circuit board 10, and has a plurality of third engagement claws M22 that extend downward (in the negative Z direction) from a main body portion M20 of the second support member M2 and engage with the first circuit board 10. The second support member M2 according to this embodiment has two third engagement claws M22 on a side surface on the positive X direction side, and one third engagement claw M22 on a side surface on the positive Y direction side. The third engagement claw M22 extends from the main body portion M20 of the second support member M2 to the lower surface side of the first circuit board 10, and engages with the first circuit board 10 at a position on the lower surface side of the first circuit board 10.

[0037] In the support structure T for a circuit board group according to this embodiment, the multiple third engagement claws M22 engage with the first circuit board 10 to restrict horizontal positional deviation between the first support member M1 and the second support member M2. That is, by providing the third engagement claws M22, the restriction of horizontal positional deviation between the first, second and third circuit boards 10, 20 and 30 is strengthened. In addition, the multiple third engagement claws M22 engage with the first circuit board 10 to fix the first support member M1 and the second support member M2.

[0038] Moreover, the second support member M2 has a plurality of second protrusions M23 extending downward from the main body M20 of the second support member M2, and is disposed in a state in which the plurality of second protrusions M23 are in contact with (i.e., pressed against) the upper surface of the second circuit board 20. The second support member M2 according to this embodiment has a substantially cylindrical shape and has two second protrusions M23 each having a recessed structure (i.e., a recessed portion) M23a (see FIG. 9) at its tip.

[0039] The second engagement claw M21, the third engagement claw M22 and the second protrusion M23 are integrally formed with the main body M20 of the second support member M2.

[0040] Next, the supporting state of second circuit board 20 in support structure T for a circuit board group according to this embodiment will be described in detail with reference to FIGS.

[0041] The second circuit board 20 is configured to be sandwiched between the first support member M1 and the second support member M2. Specifically, the second circuit board 20 is supported by being pressed from below and above by a plurality (here, two) of first protrusions M12 of the first support member M1 and a plurality (here, two) of second protrusions M23 of the second support member M2.

[0042] This configuration fixes the vertical positional relationship between the first, second and third circuit boards 10, 20, 30. That is, the first, second and third circuit boards 10, 20, 30 are supported within the telemeter 1 with their respective board surfaces spaced apart by a predetermined distance.

[0043] In addition, in the support structure T for the circuit board group of this embodiment, in order to strengthen regulation of horizontal positional deviation of the first, second and third circuit boards 10, 20, 30, an interlocking structure is utilized between the convex structure M12a formed at the tip of the first protrusion M12 and the concave structure M23a formed at the tip of the second protrusion M23 (see Figure 9).

[0044] Specifically, the multiple first protrusions M12 and the multiple second protrusions M23 are arranged, for example, at positions facing each other. At least one pair of the multiple first protrusions M12 and the multiple second protrusions M23 facing each other are arranged to sandwich the second opening 20a formed in the second circuit board 20 therebetween, and are fitted and fixed by a convex structure M12a formed in the first protrusion M12 and a concave structure M23a formed in the second protrusion M23.

[0045] As described above, the first protrusion M12 has a tapered portion at its tip, which is smaller in diameter than the base end, and this tapered portion forms a convex structure M12a at the tip of the first protrusion M12. The second protrusion M23 has a groove at its tip, which forms a concave structure M23a at the tip of the second protrusion M23 that fits with the convex structure M12a. Inside the second opening 20a formed in the second circuit board 20, the convex structure M12a formed at the tip of the first protrusion M12 and the concave structure M23a formed at the tip of the second protrusion M23 are in a fitted state.

[0046] As described above, the second opening 20a has a diameter smaller than that of the base end of the first protrusion M12 of the first support member M1, and a diameter larger than that of the convex portion (i.e., the reduced diameter portion) M12a at the tip end of the first protrusion M12. The second opening 20a also has a diameter smaller than that of the second protrusion M23 of the second support member M2. Therefore, in a state where the convex structure (i.e., the reduced diameter portion) M12a of the first protrusion M12 of the first support member M1 disposed directly below the first circuit board 10 is inserted into the second opening 20a, the first protrusion M12 of the first support member M1 (i.e., the base end of the first protrusion M12) and the second protrusion M23 of the second support member M2 are in contact with each other at the periphery of the second opening 20a.

[0047] This configuration strengthens the regulation of horizontal positional deviation between the first support member M1 and the second support member M2.

[0048] In the telemeter 1 according to this embodiment, the circuit board group thus blocked (i.e., the first, second or third circuit board 10, 20, 30) is supported in the main body case 100 without screws. Specifically, the third ST / RA type electric connector 33 disposed on the outer edge of the third circuit board 30 is pin-connected to the external input terminal 101, whereby the third circuit board 30 (i.e., the circuit board group) is fixed to the main body case 100 (see FIG. 2).

[0049] <Manufacturing process of support structure T for circuit board group> Here, an outline of a manufacturing process for the support structure T for a group of circuit boards will be described. Note that this manufacturing process is carried out, for example, by an automated assembly machine (not shown).

[0050] First, the automated assembly device horizontally moves the image display device 40 so that the first support member M1 and the image display device 40 face each other, and aligns the image display device 40 with respect to the first support member M1. Then, the automated assembly device moves the image display device 40 upward, and fits the image display device 40 into the fitting groove M1a formed in the lower surface of the first support member M1.

[0051] Next, the automated assembly device horizontally moves the first circuit board 10 so that the first support member M1 and the first circuit board 10 face each other, and aligns the first circuit board 10 with respect to the first support member M1. Then, the automated assembly device moves the first circuit board 10 downward, and inserts the first protrusion M12 of the first support member M1 into the first opening 10a formed in the first circuit board 10. Then, the automated assembly device moves the first circuit board 10 further downward, and engages the first circuit board 10 with a plurality of first engagement claws M11 extending upward (in the positive Z direction) from the main body portion M10 of the first support member M1, thereby fixing the first support member M1 and the first circuit board 10 together.

[0052] Next, the automated assembly device forms the second support member M2 and the third circuit board 30 into a block.

[0053] Here, the automated assembly device horizontally moves the third circuit board 30 so that the second support member M2 and the third circuit board 30 face each other, and aligns the third circuit board 30 with respect to the second support member M2, in the same manner as described above. Then, the automated assembly device moves the third circuit board 30 upward, and engages the third circuit board 30 with the multiple second engagement claws M21 of the second support member M2, thereby fixing the second support member M2 and the third circuit board 30 together.

[0054] Next, the automated assembly device horizontally moves the block of second support member M2 and third circuit board 30 to align the block of second support member M2 and third circuit board 30 with the block of first support member M1 and first circuit board 10. At this time, the automated assembly device holds second circuit board 20 so that second circuit board 20 is interposed between the block of first support member M1 and first circuit board 10 and the block of second support member M2 and third circuit board 30.

[0055] Next, the automated assembly device moves the block of the first support member M1 and the first circuit board 10 upward toward the bottom surface of the second circuit board 20, and moves the block of the second support member M2 and the third circuit board 30 downward toward the top surface of the second circuit board 20. Then, the automated assembly device moves the block of the first support member M1 and the first circuit board 10 upward and moves the block of the second support member M2 and the third circuit board 30 downward until the second circuit board 20 is pressed down from below and above by the multiple first protrusions M12 of the first support member M1 and the multiple second protrusions M23 of the second support member M2.

[0056] As a result, the convex structure M12a formed at the tip of the first protrusion M12 and the concave structure M23a formed at the tip of the second protrusion M23 are fitted together inside the second opening 20a formed in the second circuit board 20. As a result, the multiple third engagement claws M22 of the second support member M2 are engaged with the first circuit board 10.

[0057] By such a manufacturing process, a support structure T for the group of circuit boards (that is, first circuit board 10, second circuit board 20, and third circuit board 30) is formed.

[0058] Furthermore, the group of circuit boards (i.e., first circuit board 10, second circuit board 20, and third circuit board 30) blocked by such a manufacturing process is stored within main body case 101 without screws, with ST / RA type third electrical connector 33 arranged on the outer edge of third circuit board 30 connected to external input terminal 101 supported and fixed to main body case 101.

[0059] <Effects> As described above, the support structure T for a circuit board group according to this embodiment is a first support member M1 that is disposed directly below and along the first circuit board 10 and supports the first circuit board 10 via a first engagement claw M11 that the first support member M1 has; a second support member M2 that is disposed along the third circuit board 30 immediately below the third circuit board 30 and supports the third circuit board 30 via a second engagement claw M21 that the second support member M2 has; The present invention relates to a method for manufacturing a computer-implemented ... The first support member M1 has a plurality of first protrusions M12 extending upward from a main body M10 of the first support member M1 toward the lower surface of the second circuit board 20, The second support member M2 has a plurality of second protrusions M23 extending downward from a main body M20 of the second support member M2 toward the upper surface of the second circuit board 20, The second circuit board 20 is pressed from below and above by the multiple first protrusions M12 of the first support member M1 and the multiple second protrusions M23 of the second support member M2, thereby supporting the second circuit board 20 with the board surfaces of the first, second and third circuit boards 10, 20, 30 spaced apart from each other.

[0060] Therefore, the support structure T for a circuit board group according to this embodiment can support three circuit boards (first, second or third circuit boards 10, 20, 30) without screws with the board surfaces spaced apart from each other by a predetermined distance. This makes it possible to reliably ensure the spatial insulation distance between the wiring or circuit module arranged on one circuit board and the wiring or circuit module arranged on another circuit board, and also suppress crosstalk.

[0061] This also makes it possible to construct such a support structure without using screws, thereby reducing the number of steps required in manufacturing the product.

[0062] This also makes it possible to prevent connection failures from occurring in the BtoB type electrical connectors (here, the first electrical connector C1 and the second electrical connector C2).

[0063] Furthermore, in the support structure T for a circuit board group in this embodiment, the support structure T is formed using the first support member M1 that supports the image display device 40, so it can also be said that it is possible to construct a screwless support structure T for a circuit board group by simply providing an additional second support member M2.

[0064] In the support structure T for the circuit board group according to this embodiment, the first protrusions M12 and the second protrusions M23 are disposed at positions facing each other. The second circuit board 20 has at least one second opening 20a at a position where the first protrusions M12 and the second protrusions M23 abut against its own board surface, and at least one pair of the first protrusions M12 and the second protrusions M23 facing each other are disposed to sandwich at least one second opening 20a therebetween, and a convex structure M12a formed at one end and a concave structure M23a formed at the other end are fitted and fixed.

[0065] This makes it possible to regulate the positional deviation of the first, second and third circuit boards 10, 20, 30 in the horizontal direction.

[0066] In addition, in the support structure T for a circuit board group in this embodiment, the horizontal positional relationship between the first support member M1 and the second support member M2 is regulated by a third engagement claw M22 that is provided on the second support member M2 and engages with the first circuit board 10.

[0067] This makes it possible to restrict horizontal positional deviation of the first, second and third circuit boards 10, 20 and 30. In addition, the first support member M1 and the second support member M2 are fixed together by the multiple third engagement claws M22 engaging with the first circuit board 10, and the supported state of the blocked circuit board group (i.e., the first circuit board 10, the second circuit board 20 and the third circuit board 30) is stabilized.

[0068] Furthermore, in order to strengthen regulation of horizontal positional deviation between the first, second and third circuit boards 10, 20, 30, a fourth engagement claw that engages with the second circuit board 20 (i.e., a fourth engagement claw extending upward from the main body portion M10 of the first support member M1) may be provided on the first support member M1 in place of or in addition to the third engagement claw M22 provided on the second support member M2.

[0069] Although the specific examples of the present invention have been described in detail above, these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples exemplified above. [Industrial Applicability]

[0070] According to the support structure for a circuit board group according to the present disclosure, it is possible to stably support the circuit board group housed in an electronic device with a simple configuration. [Explanation of symbols]

[0071] T Support structure for circuit boards 1 Telemeter 10 1st circuit board 10a 1st opening 21 First socket (first electrical connector) 20 2nd circuit board 20a 2nd opening 21 Second socket (second electrical connector) 30 Third circuit board 31 First plug (first electrical connector) 32 Second plug (second electrical connector) 33 3rd Electrical Connector 40 Image display device 100 Main unit case 101 External input terminal C1 First electrical connector C2 Second Electrical Connector M1 First support member M1a fitting groove M10 Main body of first support member M11 1st engagement claw M12 1st protrusion M12a convex structure M2 2nd support member M20 Main body of second support member M21 Second engagement claw M22 3rd engagement claw M23 2nd protrusion M23a concave structure

Claims

1. A support structure for a group of circuit boards housed in an electronic device, comprising: The circuit board group includes: The device is configured to include first, second, and third circuit boards arranged in order from bottom to top with their board surfaces substantially parallel to each other, The support structure includes: a first support member disposed along the first circuit board immediately below the first circuit board and configured to support the first circuit board via a first engagement claw provided on the first support member; a second support member disposed along the third circuit board immediately below the third circuit board and configured to support the third circuit board via a second engagement claw provided on the second support member; The present invention relates to a method for manufacturing a computer-implemented ... the first support member has a plurality of first protrusions extending upward from a main body portion of the first support member toward a lower surface of the second circuit board, the second support member has a plurality of second protrusions extending downward from a main body portion of the second support member toward an upper surface of the second circuit board, The second circuit board is supported in a state in which the board surfaces of the first, second, and third circuit boards are spaced apart from each other by pressing the second circuit board from below and above with the first protruding portions of the first support member and the second protruding portions of the second support member. Support structure.

2. At least two of the first, second and third circuit boards are electrically connected to each other through BtoB type electrical connectors arranged on the respective board surfaces. The support structure of claim 1 .

3. A horizontal positional relationship between the first support member and the second support member is regulated by a third engagement claw provided on the second support member and engaging with the first circuit board, or a fourth engagement claw provided on the first support member and engaging with the third circuit board. The support structure of claim 1 .

4. The first support member supports an image display device on a surface opposite to a surface supporting the first circuit board. The support structure of claim 1 .

5. The first and second support members are made of an insulating resin material. The support structure of claim 1 .

6. The first protrusions and the second protrusions are disposed at positions opposite to each other. The support structure of claim 1 .

7. the second circuit board has at least one opening at a position where the first protrusions and the second protrusions contact a board surface of the second circuit board; At least one pair of the first protrusions and the second protrusions facing each other are arranged to sandwich the at least one opening therebetween, and are fixed by fitting a convex structure formed at one end and a concave structure formed at the other end. The support structure of claim 6.

8. The first, second and third circuit boards are fixed in position relative to one another without screws. The support structure of claim 1 .

9. The electronic device is a telemeter. The support structure of claim 1 .

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