Multilayer electronic component

Abstract

To improve the moisture resistance reliability by blocking moisture that becomes more permeable when thinning an external electrode layer of a multilayer electronic component.SOLUTION: A multilayer electronic component includes a main body including a dielectric layer and an internal electrode, and an external electrode. The external electrode includes a lower electrode layer 131a containing Cu and glass, an intermediate electrode layer 131b containing Cu and disposed on the lower electrode layer, an upper electrode layer 131c containing Ag and glass and disposed on the intermediate electrode layer, and an alloy layer 131d containing a Cu-Ag alloy and disposed between the intermediate electrode layer and the upper electrode layer. The area fraction of pores P2 in the intermediate electrode layer is smaller than that of pores P1 in the lower electrode layer.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a multilayer electronic component. [Background technology]

[0002] Multi-layered ceramic capacitors (MLCCs), which are one type of multi-layered electronic component, are chip-type capacitors that are mounted on printed circuit boards of various electronic products, such as visual devices such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and serve to charge and discharge electricity. Multi-layered ceramic capacitors can be used as components of various electronic devices due to their advantages of being small in size, high capacity, and easy to mount.

[0003] Recently, in order to miniaturize multilayer ceramic capacitors, external electrodes have been made thinner. However, as the thickness of the external electrodes becomes thinner, a problem occurs in that moisture or plating solution from the outside can easily penetrate into the inside of the main body. External electrodes are generally formed by a dipping method, but the thickness of external electrodes formed by the dipping method is not uniform, and a problem occurs in that moisture or plating solution from the outside can penetrate into the inside of the main body through the thin parts.

[0004] For this reason, there is a need for research into the structure of external electrodes in order to block the moisture penetration path that has become shorter due to the thinning of the external electrodes and prevent deterioration of the moisture resistance reliability of multilayer ceramic capacitors. Summary of the Invention [Problem to be solved by the invention]

[0005] One of several objects of the present invention is to improve the moisture resistance reliability of a multilayer electronic component.

[0006] However, the scope of the present invention is not limited to the above, and can be more easily understood in the course of describing specific embodiments of the present invention. [Means for solving the problem]

[0007] One embodiment of the present invention provides a multilayer electronic component including a main body including dielectric layers and internal electrodes alternately arranged with the dielectric layers, and an external electrode arranged on the outside of the main body, the external electrode including a lower electrode layer including Cu and glass, an intermediate electrode layer arranged on the lower electrode layer and including Cu, and an upper electrode layer arranged on the intermediate electrode layer and including Ag and glass, wherein an area fraction occupied by pores in the intermediate electrode layer is smaller than an area fraction occupied by pores in the lower electrode layer.

[0008] One embodiment of the present invention provides a multilayer electronic component including a main body including dielectric layers and internal electrodes arranged alternately with the dielectric layers, and an external electrode arranged on the outside of the main body, the external electrode including a lower electrode layer including Cu and glass, an intermediate electrode layer arranged on the lower electrode layer and including Cu, and an upper electrode layer arranged on the intermediate electrode layer and including Ag and glass, the intermediate electrode layer being a plating layer or a sputtering layer. Effect of the Invention

[0009] One of the various effects of the present invention is that it is possible to improve the moisture resistance reliability of a multilayer electronic component. [Brief description of the drawings]

[0010] [Figure 1] 1 is a perspective view showing a schematic configuration of a multilayer electronic component according to an embodiment of the present invention; [Diagram 2] FIG. 2 is an exploded perspective view showing a schematic view of the main body of FIG. [Diagram 3] 2 is a cross-sectional view that illustrates a cross section taken along line II' in FIG. 1. [Figure 4] 2 is a cross-sectional view that shows a schematic cross section taken along line II-II' in FIG. 1. [Diagram 5] FIG. 4 is an enlarged view of a K1 region in FIG. [Figure 6] FIG. 4 is a cross-sectional view showing a schematic configuration of a multilayer electronic component according to another embodiment of the present invention, which is a modification of FIG. 3. [Figure 7] FIG. 4 is a cross-sectional view showing a schematic configuration of a multilayer electronic component according to another embodiment of the present invention, which is a modification of FIG. 3. [Figure 8] FIG. 4 is a cross-sectional view showing a schematic configuration of a multilayer electronic component according to another embodiment of the present invention, which is a modification of FIG. 3. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, the embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Therefore, the shape and size of elements in the drawings may be exaggerated for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0012] In order to clearly explain the present invention in the drawings, parts that are not relevant to the explanation are omitted, and the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of explanation, so the present invention is not necessarily limited to those shown in the drawings. Components having the same function within the same concept are described using the same reference numerals. Furthermore, throughout the specification, when a part is said to "include" a certain component, this does not mean that other components are excluded, but that the part may further include other components, unless otherwise specified.

[0013] In the drawings, the first direction can be defined as a thickness T direction, the second direction can be defined as a length L direction, and the third direction can be defined as a width W direction.

[0014] Multilayer Electronic Components FIG. 1 is a perspective view that shows a schematic view of a multilayer electronic component according to one embodiment of the present invention, FIG. 2 is an exploded perspective view that shows a schematic view of a main body of FIG. 1, FIG. 3 is a cross-sectional view that shows a schematic view of a cut section taken along line I-I' in FIG. 1, FIG. 4 is a cross-sectional view that shows a schematic view of a cut section taken along line II-II' in FIG. 1, and FIG. 5 is an enlarged view of area K1 in FIG. 3.

[0015] A multilayer electronic component 100 according to one embodiment of the present invention will be described in detail below with reference to Figures 1 to 5. Also, a multilayer ceramic capacitor will be described as an example of the multilayer electronic component, but the present invention is not limited thereto and can be applied to various multilayer electronic components such as inductors, piezoelectric elements, varistors, thermistors, etc.

[0016] A multilayer electronic component 100 according to one embodiment of the present invention includes a body 110 including a dielectric layer 111 and internal electrodes 121 and 122 , and external electrodes 131 and 132 disposed on the outside of the body 110 .

[0017] Although there is no particular limitation on the specific shape of the body 110, as shown in the drawing, the body 110 may have a hexahedral shape or a shape similar thereto. Due to shrinkage of the ceramic powder contained in the body 110 during the firing process and a polishing process after firing, the body 110 may not have a hexahedral shape with perfectly straight lines, but may have a substantially hexahedral shape.

[0018] The main body 110 may have a first surface and a second surface 1, 2 facing in a first direction, a third surface and a fourth surface 3, 4 connected to the first surface and the second surface 1, 2 and facing in the second direction, and a fifth surface and a sixth surface 5, 6 connected to the first surface to the fourth surface 1, 2, 3, 4 and facing in the third direction.

[0019] The body 110 can include a dielectric layer 111 and internal electrodes 121 and 122 that are alternately arranged with the dielectric layer 111. The plurality of dielectric layers 111 forming the body 110 are in a fired state, and the boundary between adjacent dielectric layers 111 can be integrated so as to be difficult to confirm without using a scanning electron microscope (SEM).

[0020] The dielectric layer 111 can be formed by manufacturing a ceramic slurry containing ceramic powder, an organic solvent, and a binder, applying and drying the slurry on a carrier film to provide a ceramic green sheet, and then firing the ceramic green sheet. The ceramic powder is not particularly limited as long as sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, or a strontium titanate-based material can be used. As an example of the ceramic powder, BaTiO 3 、BaTiO 3 in which Ca (calcium), Zr (zirconium), etc. are partially solid-solved (Ba 1-x Ca x )TiO 3 (0 < x < 1), Ba(Ti 1-y Ca y )O 3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O 3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O 3 (0 < y < 1), etc. can be mentioned. Ethanol or the like can be used as the organic solvent, and polyvinyl butyral or the like can be used as the binder. The organic solvent and the binder can be known substances used in the industry.

[0021] The internal electrodes 121, 122 may include first internal electrodes 121 and second internal electrodes 122 that are alternately arranged in a first direction with the dielectric layer 111 in between. That is, the first internal electrode 121 and the second internal electrode 122, which are a pair of electrodes having different polarities, may be arranged to face each other with the dielectric layer 111 in between. The first internal electrode 121 and the second internal electrode 122 may be electrically isolated from each other by the dielectric layer 111 arranged therebetween.

[0022] The first internal electrode 121 may be spaced apart from the fourth surface 4 and connected to the first external electrode 131 on the third surface 3 side. The second internal electrode 122 may be spaced apart from the third surface 3 and connected to the second external electrode 132 on the fourth surface 4 side.

[0023] The conductive metal contained in the internal electrodes 121, 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and alloys thereof, and more preferably may include Ni, but the present invention is not limited thereto.

[0024] The internal electrodes 121 and 122 can be formed by applying a conductive paste for internal electrodes containing a conductive metal to a predetermined thickness on the ceramic green sheet and firing the same. The method for printing the conductive paste for internal electrodes can be a screen printing method or a gravure printing method, but the present invention is not limited thereto.

[0025] The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121, 122 do not need to be particularly limited. The average thickness td of the dielectric layer 111 and the average thickness of the internal electrodes 121, 122 can be set arbitrarily according to the desired characteristics and applications. However, in order to achieve a small size and high capacity of the multilayer electronic component 100, the average thickness td of the dielectric layer 111 may be 0.4 μm or more and 0.8 μm or less, and the average thickness te of the internal electrodes 121, 122 may be 0.3 μm or more and 0.65 μm or less. In general, the thinner the thickness of the dielectric layer 111 and the internal electrodes 121, 122, the more likely it is that the reliability characteristics of the multilayer electronic component 100, such as the insulation resistance and the breakdown voltage, will decrease. However, since the external electrodes 131, 132 of the multilayer electronic component 100 according to one embodiment of the present invention have a multilayer structure described later, the reliability of the multilayer electronic component 100 can be ensured even if the average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121, 122 satisfy the above-mentioned ranges.

[0026] The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121, 122 refer to the average size of the dielectric layer 111 and the internal electrodes 121, 122 in the first direction, respectively. The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121, 122 can be measured by scanning the cross sections of the body 110 in the first direction and the second direction with a scanning electron microscope (SEM) with a magnification of 10,000. More specifically, the average thickness td of the dielectric layer 111 can be measured by measuring the thickness at a number of points, for example, 30 points that are equally spaced in the second direction, of one dielectric layer 111, and then averaging the thicknesses. In addition, the average thickness te of the internal electrodes 121, 122 can be measured by measuring the thickness at a number of points, for example, 30 points that are equally spaced in the second direction, of one internal electrode 121, 122, and then averaging the thicknesses. The 30 equally spaced points can be specified by the capacitance forming portion Ac. On the other hand, if such average value measurements are performed for 10 dielectric layers 111 and 10 internal electrodes 121, 122, respectively, and then the average values ​​are measured, the average thickness td of the dielectric layers 111 and the average thickness te of the internal electrodes 121, 122 can be further generalized.

[0027] The body 110 may include a capacitance-forming portion Ac that is disposed inside the body 110 and includes first and second internal electrodes 121, 122 that are alternately disposed with a dielectric layer 111 therebetween to form a capacitance, and a first cover portion 112 and a second cover portion 113 that are disposed on both sides of the capacitance-forming portion Ac facing the first direction. The cover portions 112, 113 may essentially serve to prevent damage to the internal electrodes due to physical or chemical stress. The cover portions 112, 113 may have a similar configuration to the dielectric layer 111, except that they do not include internal electrodes. The cover portions 112, 113 may be formed by stacking a predetermined number of ceramic green sheets on which internal electrode patterns are not printed on both sides of the capacitance-forming portion Ac facing the first direction, and then firing the stacked sheets.

[0028] The average thickness tc of the cover parts 112, 113 does not need to be particularly limited. In order to reduce the size and increase the capacity of the multilayer electronic component 100, the average thickness tc of the cover parts 112, 113 may be 30 μm or less, but the present invention is not limited to this. In one embodiment of the present invention, the external electrodes 131, 132 have a multilayer structure described below, so that the reliability of the multilayer electronic component 100 can be ensured even if the average thickness tc of the cover parts 112, 113 is 30 μm or less. Here, the average thickness tc of the cover parts 112, 113 means the average thickness of each of the first cover part 112 and the second cover part 113.

[0029] The average thickness tc of the cover parts 112, 113 may mean the average size in the first direction of the cover parts 112, 113, and may be the average value of the size in the first direction measured at five points equally spaced in the second direction in a cross section in the first and second directions passing through the center of the body 110 in the third direction.

[0030] The body 110 may include a first margin portion 114 and a second margin portion 115 disposed on both sides of the capacitance forming portion Ac facing the third direction. That is, the margin portions 114 and 115 may refer to regions between both ends of the internal electrodes 121 and 122 and the boundary surface of the body 110 in a cross section obtained by cutting the body 110 in the first and third directions.

[0031] The margin portions 114 and 115 may have a similar configuration to the dielectric layer 111, except that they do not include the internal electrodes 121 and 122. The margin portions 114 and 115 may essentially serve to prevent damage to the internal electrodes 121 and 122 due to physical or chemical stress.

[0032] The margin portions 114, 115 may be formed by applying a conductive paste for internal electrodes to the ceramic green sheets and firing the sheets, except for the portions where the margin portions are to be formed. Alternatively, in order to suppress steps due to the internal electrodes 121, 122, the margin portions 114, 115 may be formed by cutting the laminated internal electrodes 121, 122 so as to be exposed on the fifth and sixth surfaces 5, 6 of the main body, and then laminating a single dielectric layer or two or more dielectric layers on both sides of the capacitance forming portion Ac that face the third direction.

[0033] The average thickness tm of the margin portions 114, 115 does not need to be particularly limited. In order to reduce the size and increase the capacity of the multilayer electronic component 100, the average thickness tm of the margin portions 114, 115 may be 30 μm or less, but the present invention is not limited to this. In one embodiment of the present invention, the external electrodes 131, 132 have a multilayer structure described below, so that the reliability of the multilayer electronic component 100 can be ensured even if the average thickness tm of the margin portions 114, 115 is 30 μm or less. Here, the average thickness tm of the margin portions 114, 115 means the average thickness of each of the first margin portion 114 and the second margin portion 115.

[0034] The average thickness tm of the margin portions 114, 115 may mean the average size in the third direction of the margin portions 114, 115, and may be the average value of the sizes in the third direction measured at five points equally spaced in the first direction in a cross section in the first and third directions passing through the center of the body 110 in the second direction.

[0035] The external electrodes 131, 132 may be disposed on the third and fourth surfaces 3, 4 of the body 110 and may extend onto parts of the first, second, fifth and sixth surfaces 1, 2, 5, 6. The external electrodes 131, 132 may include a first external electrode 131 connected to the first internal electrode 121 and a second external electrode 132 connected to the second internal electrode 122.

[0036] The external electrodes 131, 132 may include lower electrode layers 131a, 132a in contact with the internal electrodes 121, 122, intermediate electrode layers 131b, 132b disposed on the lower electrode layers 131a, 132a, and upper electrode layers 131c, 132c disposed on the intermediate electrode layers 131b, 132b. The first external electrode 131 may include a first lower electrode layer 131a disposed on the third surface 3 and extending over a portion of the first surface and the second surface 1, 2, a first intermediate electrode layer 131b disposed so as to cover the first lower electrode layer 131a, and a first upper electrode layer 131c disposed so as to cover the first intermediate electrode layer 131b. The second external electrode 132 may include a second lower electrode layer 132a arranged on the fourth surface 4 and extending over portions of the first surface and the second surfaces 1, 2, a second intermediate electrode layer 132b arranged to cover the second lower electrode layer 132a, and a second upper electrode layer 132c arranged to cover the second intermediate electrode layer 132b.

[0037] The bottom electrode layers 131a, 132a, the middle electrode layers 131b, 132b and the top electrode layers 131c, 132c may also extend over parts of the fifth and sixth faces 5, 6, respectively.

[0038] The lower electrode layers 131a and 132a may include Cu and glass. In particular, the lower electrode layers 131a and 132a may include Cu as a main component. For example, when a cross section in the first direction and a cross section in the second direction passing through the center in the third direction of the multilayer electronic component 100 are analyzed by a scanning electron microscope (SEM) and an energy dispersive spectroscopy (EDS), the ratio of the area occupied by Cu to the total area of ​​the lower electrode layers 131a and 132a may be 80% or more. For example, in the cross sections in the first direction and the second direction passing through the center in the third direction of the multilayer electronic component 100, the ratio of the area occupied by Cu to the total area of ​​the lower electrode layers 131a and 132a may be greater than the ratio of the area occupied by the remaining elements other than Cu to the total area of ​​the lower electrode layers 131a and 132a. Here, the total area of ​​the lower electrode layers 131a and 132a may refer to the total area occupied by the lower electrode layers 131a and 132a in an image analyzed by SEM-EDS. The image may be an image showing the entire lower electrode layers 131a and 132a, or may be an image showing an enlarged portion of the lower electrode layers 131a and 132a.

[0039] The lower electrode layers 131a, 132a may basically function to connect the internal electrodes 121, 122 to the external electrodes 131, 132. The lower electrode layers 131a, 132a may be formed by dipping the third and fourth surfaces 3, 4 of the body 110 into a conductive paste for the lower electrode layer, which includes Cu powder, glass, a binder, an organic solvent, etc., and then firing the conductive paste for the lower electrode layer.

[0040] The intermediate electrode layers 131b and 132b may include Cu. In particular, the intermediate electrode layers 131b and 132b may include Cu as a main component. For example, the Cu content (at%) of the total content (at%) of elements constituting the intermediate electrode layers 131b and 132b may be 99 at% or more. For example, when a cross section in the first direction and the second direction passing through the center in the third direction of the multilayer electronic component 100 is analyzed by a scanning electron microscope (SEM) and an energy dispersive spectroscopy (EDS), the ratio of the area occupied by Cu to the total area of ​​the intermediate electrode layers 131b and 132b may be 99% or more. Here, the total area of ​​the intermediate electrode layers 131b and 132b may mean the total area occupied by the intermediate electrode layers 131b and 132b in an image analyzed by SEM-EDS. The image may be an image showing the entire intermediate electrode layers 131b and 132b, or may be an enlarged image of a part of the intermediate electrode layers 131b and 132b.

[0041] The intermediate electrode layers 131b and 132b may be formed by electrolytic plating, electroless plating, atomic layer deposition (ALD), chemical vapor deposition (CVD) and / or sputtering. For example, the intermediate electrode layers 131b and 132b may be plating layers. Alternatively, the intermediate electrode layers 131b and 132b may be sputtering layers. Unlike the lower electrode layers 131a and 132a formed by firing a conductive paste, the intermediate electrode layers 131b and 132b are formed by plating or sputtering, so that the intermediate electrode layers 131b and 132b may be denser than the lower electrode layers 131a and 132a. In addition, the outer surfaces of the intermediate electrode layers 131b and 132b may be smoother than the outer surfaces of the lower electrode layers 131a and 132a.

[0042] The upper electrode layers 131c and 132c may include Ag and glass. In particular, the upper electrode layers 131c and 132c may include Ag as a main component. For example, when a cross section in the first direction and a cross section in the second direction passing through the center in the third direction of the multilayer electronic component 100 are analyzed by a scanning electron microscope (SEM) and an energy dispersive spectroscopy (EDS), the ratio of an area occupied by Ag to a total area of ​​the upper electrode layers 131c and 132c may be 80% or more. For example, in the cross sections in the first direction and the second direction passing through the center in the third direction of the multilayer electronic component 100, the ratio of an area occupied by Ag to a total area of ​​the upper electrode layers 131c and 132c may be greater than the ratio of an area occupied by the remaining elements other than Ag to a total area of ​​the upper electrode layers 131c and 132c. Here, the total area of ​​the upper electrode layers 131c, 132c may refer to the total area occupied by the upper electrode layers 131c, 132c in an image analyzed by SEM-EDS. The image may be an image showing the entire upper electrode layers 131c, 132c, or an image showing an enlarged portion of the upper electrode layers 131c, 132c.

[0043] The method of forming the upper electrode layers 131c, 132c is not particularly limited. For example, the upper electrode layers 131c, 132c can be formed by dipping the main body 110 on which the intermediate electrode layers 131b, 132b are formed into a conductive paste for the upper electrode layer containing Ag powder, glass, binder, organic solvent, etc., and firing the paste. Alternatively, in order to thin the external electrodes 131, 132, the conductive paste for the upper electrode layer is printed on the intermediate electrode layers 131b, 132b by a screen printing method, and then fired, or a conductive sheet containing Ag powder, glass, binder, etc. is attached on the intermediate electrode layers 131b, 132b, and then fired to form the upper electrode layers 131c, 132c. The firing process for forming the upper electrode layers 131c, 132c can be performed at a temperature of 300°C to 800°C, but the present invention is not limited thereto.

[0044] The external electrodes 131 and 132 may include alloy layers 131d and 132d that are disposed between the intermediate electrode layers 131b and 132b and the upper electrode layers 131c and 132c and contain a Cu-Ag alloy. That is, the first external electrode 131 may include a first alloy layer 131d that is disposed between the first intermediate electrode layer 131b and the first upper electrode layer 131c, and the second external electrode 132 may include a second alloy layer 132d that is disposed between the second intermediate electrode layer 132b and the second upper electrode layer 132c. The alloy layers 131d and 132d may be formed by mutual reaction between Cu of the intermediate electrode layers 131b and 132b and Ag of the upper electrode layers 131c and 132c when the upper electrode layers 131c and 132c are formed by firing a conductive paste. The Cu-Ag alloy contained in the alloy layers 131d and 132d may contain oxygen (O). Since the alloy layers 131d and 132d are denser than the lower electrode layers 131a and 132a and the upper electrode layers 131c and 132c, the penetration of moisture and plating solution from the outside into the main body 110 can be effectively prevented.

[0045] Hereinafter, the external electrode 131 will be described in more detail with reference to Fig. 5. Fig. 5 shows an enlarged view of a portion of the first external electrode 131, but the first external electrode 131 and the second external electrode 132 are substantially identical in configuration except that the first external electrode 131 is connected to the first internal electrode 121 and the second external electrode 132 is connected to the second internal electrode 122. Therefore, the following description of Fig. 5 shall be deemed to include all descriptions of the first and second external electrodes.

[0046] 5, the first metal M1 included in the lower electrode layer 131a may contain Cu as a main component but may not contain Ag. That is, when analyzed using energy dispersive spectroscopy (EDS), Cu may be detected in the first metal M1 but Ag may not be detected. The glass G1 included in the lower electrode layers 131a and 132a may contain one or more oxides of Ba, Ca, Zn, Al, B, and Si, but the present invention is not limited thereto.

[0047] The second metal M2 included in the intermediate electrode layer 131b may be substantially composed of Cu and may not include Ag. That is, when analyzed using energy dispersive spectroscopy (EDS), Cu may be detected in the second metal M2, but Ag may not be detected. Also, the intermediate electrode layer 131b may not include glass.

[0048] The third metal M3 included in the upper electrode layer 131c may contain Ag as a main component but may not contain Cu. That is, when analyzed using energy dispersive spectroscopy (EDS), Ag may be detected in the third metal M3 but Cu may not be detected. The glass G3 included in the upper electrode layer 131c may contain one or more oxides of Ba, Ca, Zn, Al, B, and Si, but the present invention is not limited thereto.

[0049] The fourth metal M4 included in the alloy layer 131d may be a Cu-Ag alloy, that is, when analyzed using energy dispersive spectroscopy (EDS), both Cu and Ag may be detected in the fourth metal M4.

[0050] According to an embodiment of the present invention, the area fraction of the pores P2 in the intermediate electrode layer 131b may be smaller than the area fraction of the pores P1 in the lower electrode layer 131a. When the lower electrode layer 131a is formed by firing a conductive paste, the lower electrode layer 131a may include a large number of pores P1 therein. Such pores may serve as paths through which moisture from the outside penetrates into the body 110. Therefore, when the external electrode 131 does not include the intermediate electrode layer 131b, moisture from the outside may easily penetrate into the body 110 through the pores P1 of the lower electrode layer 131a, which may reduce the reliability of the multilayer electronic component.

[0051] However, according to one embodiment of the present invention, the intermediate electrode layer 131b, which is formed using a plating method, a sputtering method, or the like and has a higher density than the lower electrode layer 131a, is disposed on the lower electrode layer 131a, thereby effectively preventing moisture from the outside from penetrating into the main body 110. In one embodiment, the area fraction of the pores P2 in the intermediate electrode layer 131b may be 0.5% or less. When the area fraction of the pores P2 in the intermediate electrode layer 131b is 0.5% or less, the effect of improving the moisture resistance reliability in the present invention may be more significant.

[0052] In one embodiment, the area fraction of the pores P4 in the alloy layer 131d may be smaller than the area fraction of the pores in the upper electrode layer 131c. When the upper electrode layer 131c is formed by firing a conductive paste, the upper electrode layer 131c may contain a large number of pores P3 therein. When the external electrode 131 does not include the intermediate electrode layer 131b, even if a Cu-Ag alloy layer is formed by a reaction between Cu of the lower electrode layer 131a and Ag of the upper electrode layer 131c, the Cu-Ag alloy layer may be formed in a discontinuous form with a large number of pores formed therein by a reaction between the lower electrode layer 131a and the upper electrode layer 131c, each of which contains a large number of pores. In this case, the penetration of moisture from the outside cannot be effectively suppressed.

[0053] In contrast, in an embodiment of the present invention, the alloy layer 131d is formed by a reaction between the intermediate electrode layer 131b, which is denser than the lower electrode layer 131a, and the upper electrode layer 131c, so that the alloy layer 131d may be denser than the upper electrode layer 131c. In one embodiment, the average size of the pores P4 included in the alloy layer 131d may be smaller than the average size of the pores P3 included in the upper electrode layer 131c.

[0054] In addition, since the alloy layer 131d is formed between the intermediate electrode layer 131b, which is denser than the lower electrode layer 131a and has a smooth outer surface, and the upper electrode layer 131c, the alloy layer 131d can be formed in a continuous form at the interface between the intermediate electrode layer 131b and the upper electrode layer 131c. That is, a dense and continuous alloy layer 131d can be formed by the intermediate electrode layer 131b, and such an alloy layer 131d can effectively suppress the penetration of moisture from the outside. In one embodiment, in the cross-sections in the first and second directions passing through the center of the main body 110 in the third direction, the ratio of the length of the region where the alloy layer 131d is disposed to the total length of the interface between the intermediate electrode layer 131b and the upper electrode layer 131c can be 99% or more.

[0055] An example of a method for measuring the area fractions of the pores P1, P2, P3, and P4 included in the lower electrode layer 131a, the intermediate electrode layer 131b, the upper electrode layer 131c, and the alloy layer 131d will be described. First, an image obtained by magnifying the external electrode region in the cross-sections in the first and second directions passing through the center of the main body 110 in the third direction with a scanning electron microscope (SEM) is obtained. The external electrode region can mean the central region in the first direction of the external electrode. Next, the image is analyzed using an image analysis program, for example, an ImageJ program or the like. Since the pores P1, P2, P3, and P4 are displayed in black in the image, the areas of the pores included in each electrode layer can be measured using the image program. Thereby, the area ratio of the pore P1 to the total area of the lower electrode layer 131a, the area ratio of the pore P2 to the total area of the intermediate electrode layer 131b, the area ratio of the pore P3 to the total area of the upper electrode layer 131c, and the area ratio of the pore P4 to the total area of the alloy layer 131d can be measured.

[0056] In one embodiment, in the cross sections in the first and second directions passing through the center in the third direction of the main body 110, when the thickness of the central region in the first direction of the lower electrode layer 131a is t1, the thickness of the central region in the first direction of the intermediate electrode layer 131b is t2, and the thickness of the central region in the first direction of the upper electrode layer 131c is t3, t1>t3>t2 can be satisfied. In addition, in the cross sections in the first and second directions passing through the center in the third direction of the main body 110, when the thickness of the central region in the first direction of the alloy layer 131d is t4, t1>t3>t2>t4 can be satisfied.

[0057] The above t1 to t4 do not need to be particularly limited, but the above t1 may be 5 μm to 25 μm, the above t2 may be 2 μm to 4 μm, the above t3 may be 1 μm to 2 μm, and the above t4 may be less than 1 μm.

[0058] Meanwhile, although not shown, the external electrodes 131, 132 may further include an external plating layer disposed on the upper electrode layer 131c, 132c. The type of the external plating layer is not particularly limited, and may be a plating layer containing Ni, Sn, Pd and / or an alloy containing these, or may be formed of multiple layers. The external plating layer may be, for example, a Ni plating layer or a Sn plating layer, or may be a form in which a Ni plating layer and a Sn plating layer are sequentially formed. The external plating layer may also include multiple Ni plating layers and / or multiple Sn plating layers.

[0059] In the drawings, the multilayer electronic component 100 is shown to have a structure having two external electrodes 131, 132, but this is not limited to this, and the number and shape of the external electrodes 131, 132 can be changed depending on the shape of the internal electrodes 121, 122 or other purposes.

[0060] Fig. 6 is a cross-sectional view that illustrates a multilayer electronic component 200 according to another embodiment of the present invention, which is a modified example of Fig. 3. The multilayer electronic component 200 according to another embodiment of the present invention will be described below with reference to Fig. 6, but descriptions that overlap with those of the multilayer electronic component 100 according to the above-described embodiment of the present invention will be omitted.

[0061] A multilayer electronic component 200 according to an embodiment of the present invention may include a body 110 and first and second external electrodes 231 and 232 .

[0062] The first external electrode 231 is disposed on the third surface 3 and may include a first lower electrode layer 231a extending over a portion of the first surface and the second surfaces 1 and 2, a first intermediate electrode layer 231b disposed so as to cover the first lower electrode layer 231a, and a first upper electrode layer 231c disposed on the first intermediate electrode layer 231b. The second external electrode 232 is disposed on the fourth surface 4 and may include a second lower electrode layer 232a extending over a portion of the first surface and the second surfaces 1 and 2, a second intermediate electrode layer 232b disposed so as to cover the second lower electrode layer 232a, and a second upper electrode layer 232c disposed on the second intermediate electrode layer 232b.

[0063] The first external electrode 231 may include a first alloy layer 231d formed by a reaction between the first intermediate electrode layer 231b and the first upper electrode layer 231c, and the second external electrode 232 may include a second alloy layer 232d formed by a reaction between the second intermediate electrode layer 232b and the second upper electrode layer 232c.

[0064] In the case of a multilayer electronic component 200 according to one embodiment of the present invention, the ends of the first intermediate electrode layer 231b may not be covered by the first upper electrode layer 231c, and the ends of the second intermediate electrode layer 232b may not be covered by the second upper electrode layer 232c.

[0065] In order to thin the external electrodes 231 and 232, when the upper electrode layers 231c and 232c are formed by printing a conductive paste for the upper electrode layer on the intermediate electrode layers 231b and 232b by a screen printing method and then firing the conductive paste, or by attaching a conductive sheet onto the intermediate electrode layers 231b and 232b and then firing the conductive paste, the ends of the intermediate electrode layers 231b and 232b are not covered by the upper electrode layers 231c and 232c. This prevents the alloy layers 231d and 232d from being formed on the ends of the intermediate electrode layers 231b and 232b. In this case, the moisture resistance reliability of the multilayer electronic component 200 is improved through the alloy layers 231d and 232d containing a Cu-Ag alloy, while the external electrodes 231 and 232 are thinned.

[0066] Fig. 7 is a cross-sectional view that illustrates a multilayer electronic component 300 according to another embodiment of the present invention, which is a modified example of Fig. 3. The multilayer electronic component 300 according to another embodiment of the present invention will be described below with reference to Fig. 7, but descriptions that overlap with those of the multilayer electronic component 100 according to the above-described embodiment of the present invention will be omitted.

[0067] A multilayer electronic component 300 according to an embodiment of the present invention may include a body 110 and first and second external electrodes 331 and 332 .

[0068] The first external electrode 331 is disposed on the third surface 3 and may include a first lower electrode layer 331a extending over a portion of the first surface and the second surfaces 1 and 2, a first intermediate electrode layer 331b disposed so as to cover the first lower electrode layer 331a, and a first upper electrode layer 331c disposed on the first intermediate electrode layer 331b. The second external electrode 332 is disposed on the fourth surface 4 and may include a second lower electrode layer 332a extending over a portion of the first surface and the second surfaces 1 and 2, a second intermediate electrode layer 332b disposed so as to cover the second lower electrode layer 332a, and a second upper electrode layer 332c disposed on the second intermediate electrode layer 332b.

[0069] The first external electrode 331 may include a first alloy layer 331d formed by a reaction between the first intermediate electrode layer 331b and the first upper electrode layer 331c, and the second external electrode 332 may include a second alloy layer 332d formed by a reaction between the second intermediate electrode layer 332b and the second upper electrode layer 332c.

[0070] In the case of a laminated electronic component 300 according to one embodiment of the present invention, the first intermediate electrode layer 331b can include a first region R1 on the third surface 3 that is not covered by the first upper electrode layer 331c, and the second intermediate electrode layer 332b can include a second region R2 on the fourth surface 4 that is not covered by the second upper electrode layer 332c.

[0071] As a result, the first alloy layer 331d is not formed on the first region R1, and the second alloy layer 332d is not formed on the second region R2. In this case, the moisture resistance reliability of the multilayer electronic component 300 is improved through the alloy layers 331d, 332d containing a Cu-Ag alloy, while the intermediate electrode layers 331b, 332b can be in direct contact with the outer plating layers through the first region R1 and the second region R2, thereby improving the electrical characteristics of the multilayer electronic component 300.

[0072] Fig. 8 is a cross-sectional view that roughly illustrates a multilayer electronic component 400 according to another embodiment of the present invention, which is a modification of Fig. 3. Hereinafter, the multilayer electronic component 400 according to another embodiment of the present invention will be described with reference to Fig. 8, but descriptions that overlap with those of the multilayer electronic component 100 according to the above-described embodiment of the present invention will be omitted.

[0073] A multilayer electronic component 400 according to an embodiment of the present invention may include a body 110 and first and second external electrodes 431 and 432 .

[0074] The main body 110 may include a 1-3 corner C1-3 connecting the first surface and the third surface, a 1-4 corner C1-4 connecting the first surface and the fourth surface, a 2-3 corner C2-3 connecting the second surface and the third surface, and a 2-4 corner C2-4 connecting the second surface and the fourth surface. The main body 110 may also include a 1-5 corner connecting the first surface and the fifth surface, a 1-6 corner connecting the first surface and the sixth surface, a 2-5 corner connecting the second surface and the fifth surface, and a 2-6 corner connecting the second surface and the sixth surface. The corners may have a rounded shape by performing a separate process to round the corners connecting the respective surfaces of the main body 110. The first surface to the sixth surface of the main body 110 may be generally flat surfaces, and non-flat areas may be regarded as corners.

[0075] The first external electrode 431 may include a first lower electrode layer 431a disposed on the third surface 3 and disposed between an extension line E1 of the first surface and an extension line E2 of the second surface, a first intermediate electrode layer 431b disposed so as to cover the first lower electrode layer 431a, and a first upper electrode layer 431c disposed on the first intermediate electrode layer 431b and extending onto parts of the first surface and the second surfaces 1 and 2. The second external electrode 432 may include a second lower electrode layer 432a disposed on the fourth surface 4 and disposed between an extension line E1 of the first surface and an extension line E2 of the second surface, a second intermediate electrode layer 432b disposed so as to cover the second lower electrode layer 432a, and a second upper electrode layer 432c disposed on the second intermediate electrode layer 432b and extending onto parts of the first surface and the second surfaces 1 and 2. The upper electrode layers 431c and 432c may also be disposed so as to extend onto parts of the fifth surface and the sixth surfaces 5 and 6.

[0076] The first external electrode 431 may include a first alloy layer 431d formed by a reaction between the first intermediate electrode layer 431b and the first upper electrode layer 431c, and the second external electrode 432 may include a second alloy layer 432d formed by a reaction between the second intermediate electrode layer 432b and the second upper electrode layer 432c. The moisture resistance reliability of the laminated electronic component 400 can be improved through the alloy layers 331d, 332d including a Cu-Ag alloy.

[0077] Meanwhile, the extension of each surface may mean a line extending based on a flat portion of each surface. Since the first lower electrode layer 431a is disposed between the extension E1 of the first surface and the extension E2 of the second surface, the end of the first lower electrode layer 431a may be disposed on the 1-3 corner C1-3 and the 2-3 corner C2-3, but the present invention is not limited thereto. Since the second lower electrode layer 432a is disposed between the extension E1 of the first surface and the extension E2 of the second surface, the end of the second lower electrode layer 432a may be disposed on the 1-4 corner C1-4 and the 2-4 corner C2-4, but the present invention is not limited thereto.

[0078] The lower electrode layers 431a, 432a of the multilayer electronic component 400 according to one embodiment of the present invention differ from the lower electrode layers 131a, 132a of the multilayer electronic component 100 described above in that they can be formed by attaching conductive sheets containing Cu powder, glass, a binder, etc. to the third and fourth surfaces 3, 4 of the body 110 and then firing the sheets.

[0079] The present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the scope of the accompanying claims. Therefore, various substitutions, modifications and changes can be made by a person having ordinary knowledge in the art without departing from the technical idea of ​​the present invention described in the claims, and these also belong to the scope of the present invention.

[0080] In addition, the expression "one embodiment" does not mean the same embodiment, but is provided to emphasize and describe each unique feature that is different from the others. However, the above-mentioned one embodiment does not exclude being realized in combination with the features of another embodiment. For example, even if a matter described in a specific embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment, unless there is a description that is opposite or contradictory to the matter in the other embodiment.

[0081] Furthermore, expressions such as "first, second" are used to distinguish one component from another, and do not limit the order and / or importance of the components. In some cases, the first component may be named the second component, and similarly the second component may be named the first component, within the scope of the rights. [Explanation of symbols]

[0082] 100, 200, 300, 400: Multilayer electronic components 110: Main unit 111: Dielectric layer 112, 113: Cover part 114, 115: Margin 121, 122: Internal electrode 131, 132, 231, 232, 331, 332, 431, 432: External electrode 131a, 132a, 231a, 232a, 331a, 332a, 431a, 432a: lower electrode layer 131b, 132b, 231b, 232b, 331b, 332b, 431b, 432b: Intermediate electrode layer 131c, 132c, 231c, 232c, 331c, 332c, 431c, 432c: Upper electrode layer 131d, 132d, 231d, 232d, 331d, 332d, 431d, 432d: Alloy layer

Claims

1. a body including dielectric layers and internal electrodes interleaved with the dielectric layers; an external electrode disposed on the exterior of the body; the external electrodes include a lower electrode layer including Cu and glass, an intermediate electrode layer disposed on the lower electrode layer and including Cu, and an upper electrode layer disposed on the intermediate electrode layer and including Ag and glass; a surface area ratio of the pores in the intermediate electrode layer being smaller than a surface area ratio of the pores in the lower electrode layer;

2. 2. The multilayer electronic component according to claim 1, wherein an area ratio of pores in said intermediate electrode layer is 0.5% or less.

3. 2. The multilayer electronic component according to claim 1, wherein the external electrodes are disposed between the intermediate electrode layer and the upper electrode layer and include an alloy layer containing a Cu--Ag alloy.

4. 4. The multilayer electronic component according to claim 3, wherein an area percentage of the pores in said alloy layer is smaller than an area percentage of the pores in said upper electrode layer.

5. The multilayer electronic component according to claim 3 , wherein an average size of pores contained in the alloy layer is smaller than an average size of pores contained in the upper electrode layer.

6. 2. The laminated electronic component according to claim 1, wherein the intermediate electrode layer does not contain glass.

7. the lower electrode layer contains Cu as a main component, the intermediate electrode layer contains Cu as a main component, 2. The multilayer electronic component according to claim 1, wherein the upper electrode layer contains Ag as a main component.

8. 8. The multilayer electronic component according to claim 7, wherein the content (at %) of Cu in the total content (at %) of elements constituting said intermediate electrode layer is 99 at % or more.

9. 2. The multilayer electronic component according to claim 1, wherein the intermediate electrode layer is a plating layer.

10. the main body includes a first surface and a second surface facing in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface and the fourth surface and facing in a third direction, the external electrodes are disposed on the third surface and the fourth surface, 2. The multilayer electronic component according to claim 1, wherein, in a cross section in the first and second directions passing through a center in the third direction of the main body, t1 is a thickness in the first direction of the central region of the lower electrode layer, t2 is a thickness in the first direction of the central region of the intermediate electrode layer, and t3 is a thickness in the first direction of the central region of the upper electrode layer, such that t1 > t3 > t2 is satisfied.

11. the external electrode is disposed between the intermediate electrode layer and the upper electrode layer, and includes an alloy layer including a Cu-Ag alloy; 11. The multilayer electronic component according to claim 10, wherein, in a cross section in the first and second directions passing through the center of the main body in the third direction, t1 > t3 > t2 > t4 is satisfied, where t4 is a thickness of a central region of the alloy layer in the first direction.

12. the main body includes a first surface and a second surface facing in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface and the fourth surface and facing in a third direction, The external electrodes include first and second external electrodes, the first external electrode is disposed on the third surface and includes a first lower electrode layer extending over a portion of the first surface and a portion of the second surface, a first intermediate electrode layer disposed to cover the first lower electrode layer, and a first upper electrode layer disposed to cover the first intermediate electrode layer; 2. The multilayer electronic component according to claim 1, wherein the second external electrode is disposed on the fourth surface and includes a second lower electrode layer extending over a portion of the first surface and the second surface, a second intermediate electrode layer disposed so as to cover the second lower electrode layer, and a second upper electrode layer disposed so as to cover the second intermediate electrode layer.

13. the main body includes a first surface and a second surface facing in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface and the fourth surface and facing in a third direction, The external electrodes include first and second external electrodes, the first external electrode is disposed on the third surface and includes a first lower electrode layer extending over a portion of the first surface and a portion of the second surface, a first intermediate electrode layer disposed to cover the first lower electrode layer, and a first upper electrode layer disposed on the first intermediate electrode layer; the second external electrode is disposed on the fourth surface, and includes a second lower electrode layer extending over a portion of the first surface and a portion of the second surface, a second intermediate electrode layer disposed to cover the second lower electrode layer, and a second upper electrode layer disposed on the second intermediate electrode layer; 2. The multilayer electronic component according to claim 1, wherein an end of said first intermediate electrode layer is not covered by said first upper electrode layer, and an end of said second intermediate electrode layer is not covered by said second upper electrode layer.

14. the main body includes a first surface and a second surface facing in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface and the fourth surface and facing in a third direction, The external electrodes include first and second external electrodes, the first external electrode is disposed on the third surface and includes a first lower electrode layer extending over a portion of the first surface and a portion of the second surface, a first intermediate electrode layer disposed to cover the first lower electrode layer, and a first upper electrode layer disposed on the first intermediate electrode layer; the second external electrode is disposed on the fourth surface, and includes a second lower electrode layer extending over a portion of the first surface and a portion of the second surface, a second intermediate electrode layer disposed to cover the second lower electrode layer, and a second upper electrode layer disposed on the second intermediate electrode layer; the first intermediate electrode layer includes a region on the third surface that is not covered by the first upper electrode layer, 2. The multilayer electronic component according to claim 1, wherein the second intermediate electrode layer includes an area on the fourth surface that is not covered by the second upper electrode layer.

15. the main body includes a first surface and a second surface facing in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface and the fourth surface and facing in a third direction, The external electrodes include first and second external electrodes, the first external electrode includes a first lower electrode layer disposed on the third surface and disposed between an extension line of the first surface and an extension line of the second surface, a first intermediate electrode layer disposed so as to cover the first lower electrode layer, and a first upper electrode layer disposed on the first intermediate electrode layer and extending over a portion of the first surface and the second surface, 2. The multilayer electronic component according to claim 1, wherein the second external electrode includes a second lower electrode layer disposed on the fourth surface and between an extension of the first surface and an extension of the second surface, a second intermediate electrode layer disposed so as to cover the second lower electrode layer, and a second upper electrode layer disposed on the second intermediate electrode layer and extending over a portion of the first surface and the second surface.

16. a body including dielectric layers and internal electrodes interleaved with the dielectric layers; an external electrode disposed on the exterior of the body; the external electrodes include a lower electrode layer including Cu and glass, an intermediate electrode layer disposed on the lower electrode layer and including Cu, and an upper electrode layer disposed on the intermediate electrode layer and including Ag and glass; The intermediate electrode layer is a plating layer or a sputtering layer.

17. 17. The multilayer electronic component according to claim 16, wherein an area ratio of pores in said intermediate electrode layer is 0.5% or less.

18. 17. The multilayer electronic component according to claim 16, wherein the external electrodes are disposed between the intermediate electrode layer and the upper electrode layer and include an alloy layer containing a Cu-Ag alloy.

19. 20. The multilayer electronic component according to claim 18, wherein an area fraction of pores in said alloy layer is smaller than an area fraction of pores in said upper electrode layer.

20. The multilayer electronic component according to claim 18 , wherein an average size of pores contained in the alloy layer is smaller than an average size of pores contained in the upper electrode layer.

21. 17. The laminated electronic component of claim 16, wherein the intermediate electrode layer does not include glass.

22. the lower electrode layer contains Cu as a main component, the intermediate electrode layer contains Cu as a main component, 17. The multilayer electronic component according to claim 16, wherein the upper electrode layer contains Ag as a main component.

23. 23. The multilayer electronic component according to claim 22, wherein the content (at %) of Cu in the total content (at %) of elements constituting said intermediate electrode layer is 99 at % or more.

24. the main body includes a first surface and a second surface facing in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface and the fourth surface and facing in a third direction, the external electrodes are disposed on the third surface and the fourth surface, 17. The multilayer electronic component according to claim 16, wherein in a cross section in the first and second directions passing through a center in the third direction of the main body, t1 is a thickness in the first direction of the central region of the lower electrode layer, t2 is a thickness in the first direction of the central region of the intermediate electrode layer, and t3 is a thickness in the first direction of the central region of the upper electrode layer, such that t1 > t3 > t2 is satisfied.

25. the external electrode is disposed between the intermediate electrode layer and the upper electrode layer, and includes an alloy layer including a Cu-Ag alloy; 25. The multilayer electronic component according to claim 24, wherein, in a cross section in the first and second directions passing through the center of the main body in the third direction, t1 > t3 > t2 > t4 is satisfied, where t4 is a thickness of a central region in the first direction of the alloy layer.

26. the main body includes a first surface and a second surface facing in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface and the fourth surface and facing in a third direction, The external electrodes include first and second external electrodes, the first external electrode includes a first lower electrode layer disposed on the third surface and extending over a portion of the first surface and a portion of the second surface, a first intermediate electrode layer disposed to cover the first lower electrode layer, and a first upper electrode layer disposed to cover the first intermediate electrode layer, 17. The multilayer electronic component according to claim 16, wherein the second external electrode includes a second lower electrode layer disposed on a fourth surface and extending over a portion of the first surface and the second surface, a second intermediate electrode layer disposed so as to cover the second lower electrode layer, and a second upper electrode layer disposed so as to cover the second intermediate electrode layer.

27. the main body includes a first surface and a second surface facing in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface and the fourth surface and facing in a third direction, The external electrodes include first and second external electrodes, the first external electrode is disposed on the third surface and includes a first lower electrode layer extending over a portion of the first surface and a portion of the second surface, a first intermediate electrode layer disposed to cover the first lower electrode layer, and a first upper electrode layer disposed on the first intermediate electrode layer; the second external electrode is disposed on the fourth surface, and includes a second lower electrode layer extending over a portion of the first surface and a portion of the second surface, a second intermediate electrode layer disposed to cover the second lower electrode layer, and a second upper electrode layer disposed on the second intermediate electrode layer; 17. The multilayer electronic component according to claim 16, wherein an end of the first intermediate electrode layer is not covered by the first upper electrode layer, and an end of the second intermediate electrode layer is not covered by the second upper electrode layer.

28. the main body includes a first surface and a second surface facing in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface and the fourth surface and facing in a third direction, The external electrodes include first and second external electrodes, the first external electrode is disposed on the third surface and includes a first lower electrode layer extending over a portion of the first surface and a portion of the second surface, a first intermediate electrode layer disposed to cover the first lower electrode layer, and a first upper electrode layer disposed on the first intermediate electrode layer; the second external electrode includes a second lower electrode layer disposed on the fourth surface and extending over a portion of the first surface and the second surface, a second intermediate electrode layer disposed so as to cover the second lower electrode layer, and a second upper electrode layer disposed on the second intermediate electrode layer, the first intermediate electrode layer includes a region on the third surface that is not covered by the first upper electrode layer, 17. The multilayer electronic component according to claim 16, wherein the second intermediate electrode layer includes an area on the fourth surface that is not covered by the second upper electrode layer.

29. the main body includes a first surface and a second surface facing in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface and the fourth surface and facing in a third direction, The external electrodes include first and second external electrodes, the first external electrode includes a first lower electrode layer disposed on the third surface and disposed between an extension line of the first surface and an extension line of the second surface, a first intermediate electrode layer disposed so as to cover the first lower electrode layer, and a first upper electrode layer disposed on the first intermediate electrode layer and extending over a portion of the first surface and the second surface, 17. The multilayer electronic component according to claim 16, wherein the second external electrode includes a second lower electrode layer disposed on the fourth surface and between an extension of the first surface and an extension of the second surface, a second intermediate electrode layer disposed so as to cover the second lower electrode layer, and a second upper electrode layer disposed on the second intermediate electrode layer and extending over a portion of the first surface and the second surface.

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