Manufacturing method for resin molded product

Abstract

To provide a manufacturing method for a resin molded product capable of improving the production efficiency of the resin molded product.SOLUTION: The manufacturing method for a resin molded product for resin-molding an object to be molded uses a mold including a lower mold with a protruding portion designed to fit with the object to be molded and an upper mold having a cavity. The manufacturing method includes a placing step for placing the object to be molded on the lower mold, a first mold clamping step in which the lower mold and the upper mold are moved relative to each other for clamping, thereby fitting the object to be molded and the protruding portion together, a mold opening step in which the upper mold and the lower mold are moved relative to each other to open the mold after the first mold clamping step, a resin material supply step for supplying resin material to a resin accommodating portion formed in the lower mold after the mold opening step, a second mold clamping step for clamping the lower mold and the upper mold by moving them relative to each other, and a step for resin-molding the object to be molded by supplying the resin material supplied to the resin-containing portion to the cavity after the second mold clamping step.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a technique for a method for producing a resin molded product. [Background technology]

[0002] Patent Document 1 discloses a technique in which a lead frame is placed in a lower mold, and then the mold is closed to perform resin molding. The lower mold is formed with uneven portions (e.g., positioning pins) that are fitted with the lead frame. Here, the uneven portions are formed at positions according to the dimensions of the lead frame when it is heated to a predetermined temperature and thermally expanded. For this reason, unless the temperature of the lead frame is sufficiently raised, the lead frame cannot be fitted with the uneven portions, and the lead frame cannot be properly placed in the lower mold.

[0003] Therefore, the technology described in Patent Document 1 employs a configuration in which a pressing mechanism is used to press the lead frame against the lower die. By using the pressing mechanism, the contact area between the lead frame and the lower die is increased, and the lead frame can be sufficiently heated by a heater provided in the lower die. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2001-77135 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the technology described in Patent Document 1, after the lead frame is pressed against the lower die by the pressing mechanism, it takes a certain amount of time for the lead frame to be sufficiently heated, which may reduce the production efficiency of resin molded products.

[0006] The present invention has been made in consideration of the above-mentioned circumstances, and the problem to be solved by the present invention is to provide a manufacturing method for resin molded products that can improve the production efficiency of resin molded products. [Means for solving the problem]

[0007] The problem that the present invention aims to solve is as described above, and in order to solve this problem, the manufacturing method of a resin molded product of the present invention is a manufacturing method of a resin molded product in which an object to be molded is resin molded using a molding die including a lower die having a protrusion formed therein that fits with the object to be molded, and an upper die having a cavity, the manufacturing method including the steps of: placing the object to be molded on the lower die; a first clamping step of moving the lower die and the upper die relative to each other and clamping the die to fit the object to be molded with the protrusion; a die opening step of moving the upper die and the lower die relative to each other to open the die after the first clamping step; a resin material supplying step of supplying a resin material to a resin storage portion formed in the lower die after the die opening step; a second clamping step of moving the lower die and the upper die relative to each other to clamp the die; and a step of resin molding the object to be molded by supplying the resin material supplied to the resin storage portion to the cavity after the second clamping step. Effect of the Invention

[0008] According to the present invention, it is possible to improve the production efficiency of resin molded products. [Brief description of the drawings]

[0009] [Figure 1] 1 is a schematic plan view showing an overall configuration of a resin molding apparatus according to an embodiment; [Diagram 2] FIG. [Diagram 3] FIG. 2 is a schematic front sectional view showing the configuration of a molding die, a transfer mechanism, and a lead frame. [Figure 4] 4 is a flowchart showing a method for manufacturing a resin molded product according to an embodiment. [Diagram 5](a) A diagram showing how the lead frame is carried into the molding die by the loader, (b) A diagram showing how the first mold is clamped. [Figure 6] (a) is a diagram showing a state in which the lead frame is placed on the lower die, and (b) is a diagram showing a state in which the lead frame is pressed down. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] In the following description, the directions indicated by arrows U, D, L, R, F, and B in the figure are defined as upward, downward, leftward, rightward, forward, and backward, respectively.

[0011] <Overall configuration of resin molding device 1> First, the configuration of a resin molding apparatus 1 will be described with reference to Fig. 1. The resin molding apparatus 1 resin-seals electronic elements such as semiconductor chips (hereinafter simply referred to as "chips 2a" (see Fig. 2)) to manufacture resin molded products. In particular, this embodiment illustrates a resin molding apparatus 1 that performs resin molding using a transfer molding method. Note that the chips 2a are not shown in any figures other than Fig. 2.

[0012] The resin molding apparatus 1 includes, as its components, a supply module 10, a resin molding module 20, and an unloading module 30. Each component is detachable and replaceable with respect to the other components.

[0013] <Supply Module 10> The supply module 10 supplies the lead frame 2, which is a type of substrate on which the chip 2a is mounted, and the resin tablet T to the resin molding module 20. The lead frame 2 is one embodiment of the molding object according to the present invention. The lead frame 2 according to this embodiment is a relatively thick lead frame 2 (so-called thick lead frame). For example, the lead frame 2 has a thickness of 0.5 mm or more, or 1.0 mm or more. In this embodiment, the lead frame 2 is illustrated as an example of the substrate, but various other substrates (glass epoxy substrate, ceramic substrate, resin substrate, metal substrate, etc.) can be used in addition to the lead frame 2. The supply module 10 mainly includes a frame sending unit 11, a frame supply unit 13, a resin material supply mechanism 14, a loader 17, and a control unit 18.

[0014] The frame sending section 11 sends out the lead frames 2 that are not resin-sealed and that are accommodated in an in-magazine unit (not shown) to the frame supplying section 13. The frame supplying section 13 receives the lead frames 2 from the frame sending section 11, appropriately aligns the received lead frames 2, and passes them to the loader 17.

[0015] The resin material supplying mechanism 14 supplies the resin tablets T to a loader 17, which will be described later. The resin material supplying mechanism 14 can deliver a plurality of resin tablets T to the loader 17 in an aligned state.

[0016] The loader 17 transports the lead frame 2 and the resin tablet T received from the frame supply unit 13 and the resin material supply mechanism 14 to the resin molding module 20. The loader 17 is equipped with a heater plate (not shown) for preheating the lead frame 2. The heater plate is heated by a heating device while the loader 17 is on standby. The heater plate can also heat the lead frame 2 while the loader 17 is transporting the lead frame 2.

[0017] The loader 17 is also provided with a cleaning mechanism 17a for cleaning the molding dies (lower die 110 and upper die 120) which will be described later. As the cleaning mechanism 17a, for example, a dust collection mechanism capable of sucking up dust adhering to the surfaces of the molding dies can be used. The cleaning mechanism 17a is provided, for example, at the front end of the loader 17.

[0018] The control unit 18 controls the operation of each module of the resin molding apparatus 1. The control unit 18 controls the operations of the supply module 10, the resin molding module 20, and the unloading module 30. In addition, the control unit 18 can be used to arbitrarily change (adjust) the operation of each module.

[0019] In this embodiment, an example is shown in which the control unit 18 is provided in the supply module 10, but the control unit 18 can also be provided in other modules. It is also possible to provide a plurality of control units 18. For example, it is also possible to provide a control unit 18 for each module or each device, and to individually control the operations of each module while linking them with each other.

[0020] <Resin molding module 20> The resin molding module 20 resin-seals the chip 2a mounted on the lead frame 2. In this embodiment, two resin molding modules 20 are arranged side by side. The number of resin molding modules 20 may be one, or three or more. By resin-sealing the lead frame 2 in parallel using a plurality of resin molding modules 20, it is possible to improve the manufacturing efficiency of resin molded products. The resin molding module 20 mainly includes a molding mechanism 100.

[0021] The molding mechanism 100 mainly includes a molding die (a lower die 110 and an upper die 120) and a clamping mechanism 140 (see FIG. 2).

[0022] The molding dies (lower die 110 and upper die 120) use molten resin material to resin-encapsulate the chip 2a mounted on the lead frame 2. The molding dies include a pair of upper and lower dies, that is, a lower die 110 and an upper die 120 (see FIG. 2, etc.).

[0023] The mold clamping mechanism 140 (see FIG. 2) clamps or opens the molding dies (lower die 110 and upper die 120) by vertically moving the lower die 110. The specific configuration of the molding mechanism 100 will be described later.

[0024] <Exit module 30> The unloading module 30 receives and unloads the resin-sealed lead frame 2 from the resin molding module 20. The unloading module 30 mainly includes an unloader 31 and a substrate receiving section 32.

[0025] The unloader 31 holds the resin-sealed lead frame 2 and carries it out to the substrate receiving section 32. The substrate receiving section 32 receives the resin-sealed lead frame 2.

[0026] <Forming mechanism 100> Next, a specific configuration of the forming mechanism 100 will be described with reference to FIGS.

[0027] Fig. 2 is a diagram showing a schematic configuration of the molding mechanism 100. Fig. 3 is a diagram showing a schematic configuration of the molding dies (lower die 110 and upper die 120), transfer mechanism 150, and lead frame 2 extracted from the configuration shown in Fig. 2.

[0028] As shown in FIG. 2, the molding mechanism 100 mainly includes a molding die (a lower die 110 and an upper die 120 ), an upper fixed platen 130 , a clamping mechanism 140 , and a transfer mechanism 150 .

[0029] 2 and 3 forms the lower part of the molding die. The lower die 110 mainly includes a pot 111, a pilot pin 112, a dam portion 113, and a lower die heater 114.

[0030] The pot 111 is a portion that accommodates the resin tablet T. The pot 111 is one embodiment of a resin accommodation portion according to the present invention. The pot 111 is formed so as to penetrate the lower mold 110 from top to bottom. The pot 111 is formed in the center of the lower mold 110 from left to right. A plurality of the pots 111 are formed so as to be lined up front to back (not shown). In this embodiment, the lead frames 2 are arranged on the left and right of the pot 111 of the lower mold 110, which is a so-called two-piece configuration, but the lower mold 110 may be configured so that only one lead frame 2 is arranged, or the lower mold 110 may be configured so that three or more lead frames 2 are arranged.

[0031] The pilot pin 112 shown in FIG. 3 is for aligning the position of the lead frame 2 with respect to the lower die 110. The pilot pin 112 is one embodiment of the protrusion and positioning portion according to the present invention. The pilot pin 112 is formed in a cylindrical shape with its axis oriented in the vertical direction. The pilot pin 112 is formed so as to protrude upward from the upper surface of the lower die 110. The pilot pin 112 is formed at a position corresponding to the through hole 2b formed in the lead frame 2. The height of the upper end of the pilot pin 112 is formed to be higher than the height of the upper end of the dam portion 113 described later. The number of pilot pins 112 is not particularly limited, and any number of pilot pins can be formed.

[0032] The dam portion 113 is for controlling the flow of the resin material (molten resin tablet T) when resin molding is performed on the lead frame 2. The dam portion 113 is one embodiment of the protrusion and resin flow control portion according to the present invention. The dam portion 113 is formed so as to protrude upward from the upper surface of the lower die 110. The position and shape of the dam portion 113 can be determined arbitrarily depending on the shape of the lead frame 2 and the shape of the product (resin molded product), etc.

[0033] The dam portion 113 is formed, for example, at a position corresponding to the gap X between the first portion 2c and the second portion 2d of the lead frame 2. The width of the dam portion 113 (the width in the left-right direction in the illustrated example) is formed to be approximately the same as the width of the gap X. The dam portion 113 may be formed in a tapered shape such that the width in a predetermined direction decreases from the lower end to the upper end so as to make it easier to fit into the gap X. By fitting the dam portion 113 into the gap X, the flow of the resin material attempting to flow through the gap X can be blocked.

[0034] In this way, the flow of the resin material can be controlled by forming the dam portion 113 at an appropriate position. This makes it possible to, for example, prevent the resin material from flowing out of the molding die, or to mold the resin material into a desired shape.

[0035] Here, since the dam portion 113 is fitted into the lead frame 2, it is formed in a position and shape corresponding to the shape of the lead frame 2. More specifically, since the lead frame 2 is heated and thermally expanded during resin molding, the dam portion 113 is formed in a position and shape that allows it to be fitted into the lead frame 2 in a thermally expanded state.

[0036] 2 is for heating the lower die 110 when resin molding is performed. The lower die heater 114 is provided inside the lower die 110.

[0037] 2 and 3 forms the upper part of the molding die. The upper die 120 mainly includes a recess 121, a resin flow path 122, and an upper die heater 123.

[0038] The recess 121 is a portion that forms a cavity, which is a space for resin sealing, between the lead frame 2 and the upper die 120 when the lead frame 2 is placed on the lower die 110 and the lower die 110 and the upper die 120 are closed. The chip 2a fixed to the lead frame 2 is accommodated in the cavity, and the chip 2a is resin-sealed by a resin material supplied to the cavity. The recess 121 is formed by recessing the lower surface of the upper die 120 upward. The recess 121 is formed in a position and shape according to the shape, etc. of the product (resin molded product).

[0039] The resin flow path 122 is a portion that guides the molten resin tablet T (resin material) to the recess 121 (cavity) when the lead frame 2 is placed on the lower die 110 and the lower die 110 and the upper die 120 are closed. The resin flow path 122 is formed by making the lower surface of the upper die 120 recessed upward. The resin flow path 122 is formed so as to connect the pot 111 and the recess 121 (cavity) when the lower die 110 and the upper die 120 are closed.

[0040] 2 is for heating the upper die 120 when resin molding is performed. The upper die heater 123 is provided inside the upper die 120.

[0041] The upper fixed platen 130 supports the upper die 120. The upper fixed platen 130 is fixed at a predetermined position by appropriate members (such as supports). The upper die 120 is fixed to the lower surface of the upper fixed platen 130. This fixes the upper die 120 at the predetermined position so that it cannot move.

[0042] The mold clamping mechanism 140 lifts the lower mold 110 and clamps the lower mold 110 and the upper mold 120 together. The mold clamping mechanism 140 mainly includes a movable platen 141 and a drive mechanism 142.

[0043] The movable platen 141 supports the lower die 110. The movable platen 141 is disposed so as to be movable in the vertical direction. The lower die 110 is fixed to the upper surface of the movable platen 141.

[0044] The driving mechanism 142 moves the lower mold 110 in the up-down direction. The driving mechanism 142 is formed by, for example, a driving source such as a servo motor and an appropriate power transmission mechanism. An upper part of the driving mechanism 142 is connected to the movable platen 141. By driving the driving mechanism 142, the lower mold 110 can be arbitrarily moved (raised and lowered) in the up-down direction via the movable platen 141. For example, the lower mold 110 can be clamped by raising it toward the upper mold 120 using the driving mechanism 142. Also, the lower mold 110 can be opened by lowering it in a direction away from the upper mold 120 using the driving mechanism 142.

[0045] 2 and 3, the transfer mechanism 150 supplies the resin material to the cavity. The transfer mechanism 150 mainly includes a plunger 151 and a transfer driver (not shown).

[0046] The plunger 151 injects and supplies the resin tablet T (resin material) contained in the pot 111 to the cavity. The plunger 151 is disposed in the pot 111 so as to be able to move up and down (raise and lower).

[0047] The transfer drive unit (not shown) is a drive source that moves the plunger 151 in the up and down direction. The transfer drive unit (not shown) can be configured by, for example, a servo motor, an air cylinder, or the like.

[0048] <Outline of Operation of Resin Molding Apparatus 1> Next, an outline of the operation of the resin molding apparatus 1 configured as described above (a method for manufacturing a resin molded product using the resin molding apparatus 1) will be described with reference to FIG. 1 and FIG. 4 to FIG.

[0049] First, the lead frame 2 and the resin tablet T are delivered to the loader 17 (step S11 in FIG. 4). Specifically, in the supply module 10 shown in FIG. 1, the frame sending unit 11 sends out the lead frame 2 accommodated in an in-magazine unit (not shown) to the frame supply unit 13. The frame supply unit 13 appropriately aligns the received lead frame 2 and delivers it to the loader 17.

[0050] Furthermore, the resin material supply mechanism 14 delivers to the loader 17 the number of resin tablets T required for one resin molding in the resin molding module 20.

[0051] Next, the loader 17 is caused to enter the molding die (step S12 in FIG. 4). Specifically, after receiving the lead frame 2 and the resin tablet T, the loader 17 moves to the resin molding module 20 while preheating the lead frame 2. Then, as shown in FIG. 5(a), the loader 17 moves from the rear to the molding die of the molding mechanism 100. After that, the loader 17 places the lead frame 2 on the upper surface of the lower die 110 (step S13 in FIG. 4). At this time, as shown in FIG. 6(a), the upper end of the pilot pin 112 is inserted into the through hole 2b of the lead frame 2, so that the lead frame 2 can be positioned relative to the lower die 110. At this time, the loader 17 does not supply the resin tablet T to the pot 111 of the lower die 110, but keeps holding the resin tablet T.

[0052] 6(a), it is assumed that the temperature of the lead frame 2 has not yet risen to the temperature required for resin molding when the loader 17 places the lead frame 2 on the lower die 110. Therefore, the lead frame 2 has not thermally expanded sufficiently, and the position and dimensions of the gap X in the lead frame 2 do not correspond to the position and dimensions of the dam portion 113. Therefore, the dam portion 113 does not completely enter (fit into) the gap X, and a gap is formed between the lead frame 2 and the upper surface of the lower die 110.

[0053] After placing lead frame 2 on lower die 110, loader 17 temporarily retreats from the molding die (step S14 in FIG. 4).

[0054] Next, the molding die is clamped by the clamping mechanism 140 (first clamping, step S15 in FIG. 4). Specifically, the clamping mechanism 140 is driven to raise the lower die 110 toward the upper die 120. The clamping force at this time is set to be smaller than the clamping force when performing the second clamping (step S20) described below. When the lower die 110 approaches the upper die 120, the lead frame 2 is sandwiched between the lower die 110 and the upper die 120, as shown in FIG. 5(b).

[0055] 6(b), the lead frame 2 placed on the lower die 110 is pressed downward by the upper die 120. As the lead frame 2 is pressed down, it is fitted into the dam portion 113 while moving slightly in position and / or deforming depending on the position or shape of the dam portion 113. In this way, the lead frame 2 is set in a state where it contacts the upper surface of the lower die 110. Note that this mold clamping in step S15 may be referred to as "first mold clamping" hereinafter.

[0056] Next, the molding dies are opened by the mold clamping mechanism 140 (step S16 in FIG. 4). Specifically, the mold clamping mechanism 140 is driven to lower the lower die 110 so as to separate from the upper die 120.

[0057] Next, the loader 17 is caused to enter the mold again (step S17 in FIG. 4). At this time, the surfaces of the mold (the upper surface of the lower mold 110 and the lower surface of the upper mold 120) may be cleaned (dust collected) by the cleaning mechanism 17a provided on the loader 17. This can improve the quality of the resin molded product. After the loader 17 is caused to enter the mold, the resin tablet T held by the loader 17 is stored (set) in the pot 111 of the lower mold 110 (step S18 in FIG. 4). This supplies the resin tablet T to the mold.

[0058] After storing the resin tablet T in the pot 111, the loader 17 retreats rearward from the mold (step S19 in FIG. 4).

[0059] Next, the mold clamping mechanism 140 clamps the mold again (step S20 in FIG. 4). In this step S20, the mold clamping may be referred to as "second mold clamping" hereinafter.

[0060] Next, the transfer mechanism 150 injects the resin material into the cavity (step S21 in FIG. 4). Specifically, the resin tablet T stored in the pot 111 is heated and melted by heaters (lower mold heater 114 and upper mold heater 123) provided in the mold. The transfer mechanism 150 can inject the melted resin tablet T (resin material) into the cavity by raising the plunger 151.

[0061] After the resin material is injected by the transfer mechanism 150, by waiting until a predetermined time elapses, the resin material can be cured to resin-seal the chip 2a of the lead frame 2.

[0062] Next, the mold clamping mechanism 140 opens the mold (step S22 in FIG. 4). Thereby, the resin-sealed lead frame 2 can be demolded. Then, the lead frame 2 is carried out of the mold (step S23 in FIG. 4). Specifically, the unloader 31 shown in FIG. 1 carries the lead frame 2 out of the mold and accommodates it in the substrate accommodating portion 32 of the carry-out module 30. In this way, the resin-sealed lead frame 2 (resin molded product) is manufactured.

[0063] As described above, in the present embodiment, since the lead frame 2 can be fitted into the dam portion 113 by the first mold clamping (step S15), the lead frame 2 can be set on the lower mold 110 even if the lead frame 2 is not sufficiently heated. Therefore, the time required for preheating the lead frame 2 can be shortened, and the production efficiency of the resin molded product can be improved.

[0064] Furthermore, since the lead frame 2 can be set in the lower die 110 using the die clamping mechanism 140, there is no need to provide a separate mechanism for pressing down the lead frame 2, which allows costs to be reduced.

[0065] Although an embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and appropriate modifications are possible within the scope of the technical idea of ​​the invention described in the claims.

[0066] For example, in the above embodiment, an example was shown in which a relatively thick lead frame 2 is used, but the thickness of the lead frame 2 is not particularly limited.

[0067] The lead frame 2 can also be formed by fixing a plurality of laminated plate-like members (frames) to each other. When the lead frame 2 has a laminated structure in this way, it is expected that it will take a longer time to set the lead frame 2 in the molding die because it will be difficult to sufficiently heat the lead frame 2 by preheating, and the temperature difference between the top and bottom will become larger and it will take a longer time to heat the entire lead frame to the same temperature. However, according to the manufacturing method for a resin molded product of this embodiment, the lead frame 2 can be properly set in the lower die 110 in a short time by the first die clamping (step S15).

[0068] In the above embodiment, a dust collection mechanism is given as a specific example of cleaning mechanism 17a, but cleaning mechanism 17a is not limited to this and may have any configuration. For example, cleaning mechanism 17a may be formed of a brush or the like that removes dust adhering to the casting mold.

[0069] Although not specifically described in the above embodiment, resin molding may be performed with a release film provided on the surface of the molding die (for example, the lower surface of upper die 120).

[0070] In the above embodiment, the mold is configured from the lower mold 110 and the upper mold 120, but it is also possible to use a mold including, for example, an intermediate mold.

[0071] In the above embodiment, the dam portion 113 is fitted into the lead frame 2 by the first mold clamping, but for example, the pilot pin 112 can be fitted into the lead frame 2 by the first mold clamping. In addition, it is also possible to fit the lead frame 2 into other protrusions formed on the lower mold 110, not limited to the dam portion 113 and the pilot pin 112.

[0072] In the above embodiment, the mold clamping mechanism 140 is exemplified as performing mold clamping by moving (raising) the lower mold 110, but the present invention is not limited to this, and any configuration may be used as long as the mold clamping is performed by relatively moving the lower mold 110 and the upper mold 120. For example, it is also possible to perform mold clamping by moving (lowering) the upper mold 120, or to move both the lower mold 110 and the upper mold 120 to perform mold clamping.

[0073] In addition, in the above embodiment, the mold clamping force when performing the first mold clamping is set to be smaller than the mold clamping force when performing the second mold clamping, but the mold clamping force when performing the first mold clamping may be equal to the mold clamping force when performing the second mold clamping.

[0074] <Additional Notes> A method for producing a resin molded product according to a first aspect of the present disclosure includes: A method for manufacturing a resin molded product, in which a molding object (lead frame 2) is resin-molded using a molding die including a lower die 110 having a protruding portion (dam portion 113) that fits with the molding object, and an upper die 120 having a cavity (recess 121), a placing step (step S13) of placing the molding object on the lower mold 110; a first clamping step (step S15) of clamping the lower die 110 and the upper die 120 by moving them relative to each other to fit the molding object and the protruding portion together; After the first clamping step, a mold opening step (step S16) of relatively moving the upper mold 120 and the lower mold 110 to open the mold; After the mold opening step, a resin material supply step (step S18) of supplying a resin material (resin tablet T) to a resin accommodation part (pot 111) formed in the lower mold 110; A second clamping step (step S20) of relatively moving the lower mold 110 and the upper mold 120 to clamp the mold; After the second clamping step, a step (step S21) of resin-molding the object to be molded by supplying the resin material supplied to the resin accommodation part to the cavity; It includes. According to the method for manufacturing a resin molded product of the first aspect of the present disclosure, the production efficiency of the resin molded product can be improved. Specifically, even if the lead frame 2 is not sufficiently heated, the lead frame 2 can be set in the lower mold 110. For this reason, the preheating time of the lead frame 2 can be shortened, and the cycle time of resin molding can be shortened.

[0075] In the method for manufacturing a resin molded product of the second aspect according to the first aspect, The protruding part is It includes at least one of a positioning part (pilot pin 112) for positioning the object to be molded with respect to the lower mold 110 or a resin flow control part (dam part 113) for controlling the flow of the resin material. According to the method for manufacturing a resin molded product of the second aspect of the present disclosure, the lead frame 2, the dam part 113, and the pilot pin 112 can be properly fitted together.

[0076] In the method for manufacturing a resin molded product of the third aspect according to the first or second aspect, The clamping force in the first clamping step is lower than the clamping force in the second clamping step. According to the method for manufacturing a resin molded product of the third aspect of the present disclosure, by fitting the lead frame 2 to the dam part 113 of the lower mold 110 with a relatively low clamping force, the power of the mold clamping mechanism 140 can be reduced.

[0077] In the method for producing a resin molded product according to any one of the first to third aspects, In the resin material supplying step, the molding die is cleaned. According to the method for producing a resin molded product according to the fourth aspect of the present disclosure, it is possible to improve the quality of the resin molded product. In addition, by cleaning the molding die in conjunction with the supply of the resin material, cleaning can be performed efficiently.

[0078] In the method for producing a resin molded product according to a fifth aspect of the present invention, The molding object is a lead frame 2. According to the method for producing a resin molded product according to the fifth aspect of the present disclosure, it is possible to improve the production efficiency when the lead frame 2 is resin molded.

[0079] In a method for producing a resin molded product according to a sixth aspect of the present invention, The lead frame 2 has a thickness of 0.5 mm or more. According to the method for producing a resin molded product according to the sixth aspect of the present disclosure, the lead frame 2, which is relatively thick and difficult to sufficiently heat by preheating, can be appropriately set in the lower die 110.

[0080] In the method for producing a resin molded product according to the seventh aspect of the fifth or sixth aspect, The lead frame 2 is formed by stacking a plurality of frames. According to the method for producing a resin molded product according to the seventh aspect of the present disclosure, the lead frame 2, which is made up of a plurality of laminated frames and is difficult to sufficiently heat by preheating, can be appropriately set in the lower die 110. [Explanation of symbols]

[0081] 1 Resin molding equipment 2 Lead Frame 110 Lower mold 111 Pot 112 Pilot pin 113 Dam Department 120 Upper mold 122 Recess 113 Dam Department

Claims

1. A method for manufacturing a resin molded product, comprising the steps of: molding an object to be molded with resin using a molding die including a lower die having a protrusion that is fitted with the object to be molded; and an upper die having a cavity, a placing step of placing the molding object on the lower mold; a first mold clamping step of clamping the lower mold and the upper mold by moving them relative to each other to fit the molding object and the protruding portion together; a mold opening step of moving the upper mold and the lower mold relatively to each other to open the mold after the first mold clamping step; a resin material supplying step of supplying a resin material to a resin containing portion formed in the lower mold after the mold opening step; a second clamping step of clamping the lower mold and the upper mold by moving them relative to each other; a step of resin molding the molding object by supplying the resin material supplied to the resin accommodation portion to the cavity after the second mold clamping step; Including, A method for manufacturing a resin molded product.

2. The protrusion is At least one of a positioning unit that positions the molding object relative to the lower mold and a resin flow control unit that controls the flow of the resin material, A method for producing the resin molded product according to claim 1.

3. The clamping force in the first clamping step is lower than the clamping force in the second clamping step. A method for producing the resin molded product according to claim 1 or 2.

4. In the resin material supplying step, the molding die is cleaned. A method for producing a resin molded product according to any one of claims 1 to 3.

5. The molding object is a lead frame and has a thickness of 0.5 mm or more. A method for producing a resin molded product according to any one of claims 1 to 4.

6. The lead frame is formed by stacking a plurality of frames. A method for producing the resin molded product according to claim 5.

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