Circuit board and electronic appliance

Abstract

To reduce the cost by increasing versatility.SOLUTION: A circuit board has a connector, which connects one end of an electronic module, mounted thereon, and includes, on a surface thereof, a ground pad that can fix a first or second supporter to support the other end of the electronic module. The ground pad includes a first region formed of a metal pattern, a second region formed of a metal pattern with a smaller area than the first region, and a deficient region that separates the first region and the second region by not having the metal pattern. The ground pad can selectively fix the first supporter that exists within the first region and the second supporter that exists both in the first region and the second region beyond the deficient region. In the case where the first supporter is fixed in the first region, a rotating direction of the first supporter is positioned in a certain direction.SELECTED DRAWING: Figure 6A

Description

[Technical field]

[0001] The present invention relates to a circuit board and an electronic device equipped with the circuit board. [Background technology]

[0002] 2. Description of the Related Art Electronic devices such as notebook PCs are used by connecting electronic modules such as SSDs to a connector of a circuit board (motherboard) on which a CPU is mounted (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2020-057737 A Summary of the Invention [Problem to be solved by the invention]

[0004] As described in Patent Document 1, typically, one end of an electronic module is connected to a connector mounted on a circuit board, and the other end is fixed to the circuit board with a screw. The screw is tightened into a stud member having a screw hole. The stud member is fixed by soldering to a ground pad formed on the surface of the circuit board.

[0005] The electronic module as described above may be installed by an operator at a factory or may be replaced by the user himself. In this case, the screws may fall into the housing and require time and effort to retrieve, or may be lost.

[0006] Therefore, it is possible to use a support other than a screw as a support for supporting the electronic module. An example of a support other than a screw is a locking part equipped with a cam-shaped member that rotates relative to the stud member. The locking part is used by switching between a locked position in which the other end of the electronic module is pressed, and an unlocked position in which the other end is not pressed. However, such a locking part needs to have its rotation direction (installation posture) controlled to a constant direction when fixed to the ground pad. If the installation posture is not fixed, the locked and unlocked positions will be mixed when supporting the electronic module in a factory, etc., reducing work efficiency.

[0007] On the other hand, depending on the specifications and applications of the electronic device, a normal fixing method using screws may be sufficiently effective. However, if the ground pad provided on the circuit board is a dedicated part that is compatible with only one of the supports, the versatility of the circuit board decreases, and the product costs of the circuit board and the electronic device on which it is mounted increase.

[0008] The present invention has been made in consideration of the problems with the conventional technology described above, and has an object to provide a circuit board that can increase versatility and reduce costs, and an electronic device equipped with the circuit board. [Means for solving the problem]

[0009] A circuit board according to a first aspect of the present invention is a circuit board on which a connector for connecting one end of an electronic module is mounted, and which has a ground pad on its surface to which a first or second support for supporting the other end of the electronic module can be fixed, the ground pad having a first region formed by a metal pattern, a second region formed by a metal pattern having a smaller area than the first region, and a missing region where no metal pattern is provided, separating the first region from the second region, the ground pad being capable of selectively fixing the first support that fits within the first region and the second support that extends beyond the missing region and spans the first region and the second region, and when the first support is fixed to the first region, the rotational direction of the first support is positioned in a fixed direction.

[0010] An electronic device according to a second aspect of the present invention is an electronic device comprising a circuit board to which an electronic module is connected, the circuit board comprising a connector mounted on its surface and connected to one end of the electronic module, a ground pad provided on the surface, and a support fixed to the ground pad and supporting the other end of the electronic module, the ground pad having a first region formed by a metal pattern, a second region formed by a metal pattern having a smaller area than the first region, and a missing region where no metal pattern is provided, separating the first region from the second region, and the support has a shape that fits within the first region and is fixed to the first region with its rotational direction positioned in a fixed direction.

[0011] An electronic device according to a third aspect of the present invention is an electronic device comprising a circuit board to which an electronic module is connected, the circuit board comprising a connector mounted on a surface to which one end of the electronic module is connected, a ground pad provided on the surface, and a support fixed to the ground pad and supporting the other end of the electronic module, the ground pad having a first region formed by a metal pattern, a second region formed by a metal pattern having an area smaller than that of the first region, and a missing region where no metal pattern is provided, separating the first region and the second region, the support having a shape that spans the first region and the second region beyond the missing region, and is fixed to the first region and the second region simultaneously. Effect of the Invention

[0012] According to the above aspects of the present invention, versatility can be increased and costs can be reduced. [Brief description of the drawings]

[0013] [Figure 1] FIG. 1 is a top view of an electronic device according to an embodiment. [Diagram 2]FIG. 2 is a plan view illustrating a schematic internal structure of the housing. [Diagram 3] FIG. 3 is a schematic plan view of the ground pad. [Figure 4] FIG. 4 is a perspective view of the first support. [Diagram 5] FIG. 5 is a perspective view of the second support. [Figure 6A] FIG. 6A is a schematic plan view of a state in which the first support is fixed to a ground pad. [Figure 6B] FIG. 6B is a plan view showing a state in which the support member shown in FIG. 6A is rotated to a lock position. [Figure 7A] FIG. 7A is a schematic plan view of the second support with a stud member fixed to a ground pad. [Figure 7B] FIG. 7B is a plan view showing a state in which a screw is fastened to the stud member shown in FIG. 7A. [Figure 8] FIG. 8 is a schematic plan view of a ground pad according to a first modified example. [Figure 9] FIG. 9 is a schematic plan view of a ground pad according to the second modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of an electronic device and a circuit device according to the present invention will be described in detail with reference to the accompanying drawings.

[0015] 1 is a top view of an electronic device 10 according to an embodiment. As shown in FIG. 1, the electronic device 10 according to this embodiment is a clamshell-type notebook PC. The electronic device 10 has a cover 11 and a housing 12 connected by a hinge 14 so that they can rotate relative to each other. In this embodiment, the electronic device 10 is a notebook PC, but the electronic device may be other than a notebook PC, such as a desktop PC, a tablet PC, a smartphone, or a portable game console.

[0016] The cover 11 has a thin, flat box-shaped housing. The cover 11 is equipped with a display 16. The display 16 is, for example, an organic EL display or a liquid crystal display.

[0017] The housing 12 is a thin, flat box. A keyboard device 18 and a touch pad 19 face the upper surface (surface 12a) of the housing 12. Hereinafter, the housing 12 and each component mounted thereon will be described with reference to the posture of an operator operating the keyboard device 18, with the width direction (left and right) of the housing 12 referred to as the X1 and X2 directions, the depth direction (front and back) of the housing 12 referred to as the Y1 and Y2 directions, and the thickness direction (up and down) of the housing 12 referred to as the Z1 and Z2 directions. The X1 and X2 directions may be collectively referred to as the X direction, and the Y1, Y2 directions and the Z1, Z2 directions may be similarly referred to as the Y direction and the Z direction. These directions are determined for the sake of convenience, and may naturally change depending on the usage state or installation posture of the electronic device 10.

[0018] The housing 12 is formed by stacking a first cover material 20 and a second cover material 21 in the thickness direction and removably connecting them to each other. The first cover material 20 forms, for example, the top surface and four circumferential side surfaces of the housing 12 and has a substantially bathtub shape. The second cover material 21 forms, for example, the bottom surface of the housing 12 and has a substantially flat plate shape. The hinge 14 is installed in a concave hinge arrangement groove 12b formed in the rear edge of the housing 12, and connects the housing 12 and the lid 11.

[0019] Fig. 2 is a plan view that shows a schematic internal structure of the housing 12. Fig. 2 shows the inside of the first cover material 20 as viewed from the bottom side with the second cover material 21 removed.

[0020] 2, a circuit board 24, a cooling module 25, and a battery device 26 are housed inside the housing 12. Inside the housing 12, various electronic components, mechanical components, and the like are also provided.

[0021] The circuit board 24 is a printed circuit board that serves as a motherboard of the electronic device 10. The circuit board 24 is disposed toward the Y2 side of the housing 12 and extends in the X direction. The circuit board 24 is equipped with a CPU (Central Processing Unit) 28 and a pair of connectors 30, 30. The CPU 28 is a processing device that performs calculations related to the main control and processing of the electronic device 10. The connector 30 complies with a predetermined connection standard, which in this embodiment is the M.2 (M.2) standard. Electronic modules 32, 33 are connected to each connector 30. The specific configurations of the circuit board 24, the electronic modules 32, 33, and their peripheral parts will be described later. Various electronic components such as a GPU (Graphics Processing Unit) and memory can also be mounted on the circuit board 24. For example, the Z1 side surface (first surface 24a) of the circuit board 24 serves as a mounting surface for the first cover material 20, and the Z2 side surface (second surface 24b) serves as a mounting surface for the CPU 28 and the connector 30. It goes without saying that the shape, arrangement, and mounted electronic components of the circuit board 24 are not limited to those described above.

[0022] The cooling module 25 can absorb heat generated by the CPU 28 and expel it to the outside of the housing 12. The cooling module 25 includes a heat pipe 34, a pair of heat sinks 35, 35, and a pair of fans 36, 36. The cooling module 25 can transport heat from the CPU 28 to each heat sink 35 via the heat pipe 34, and promote heat dissipation from each heat sink 35 by blowing air from each fan 36.

[0023] The battery device 26 is a rechargeable battery that serves as a power source for the electronic device 10. The battery device 26 is disposed toward the Y1 side of the circuit board 24, and extends in the X direction.

[0024] Next, a specific example of the configuration of the circuit board 24 and the electronic modules 32, 33, and a support structure for the electronic modules 32, 33 relative to the circuit board 24 will be described.

[0025] First, the circuit board 24 is a printed circuit board having a predetermined conductive pattern formed on the second surface 24b of an insulating plate material. The circuit board 24 may have a configuration in which the conductive pattern is formed on both surfaces 24a, 24b.

[0026] As shown in FIG. 2, the circuit board 24 includes a connector 30, a pair of ground pads 40, 40, and a pair of supports 42, 43.

[0027] The connector 30 is mounted on the second surface 24b. The mounting type of the connector 30 is not limited, but for example, a drop-in mounting type (Pcie Gen3: PCI Express 3.0) or an on-board mounting type (Pcie Gen4: PCI Express 4.0) can be used.

[0028] FIG. 3 is a schematic plan view of the ground pad 40. As shown in FIG.

[0029] The ground pad 40 is a portion to which the supports 42 and 43 are fixed by soldering (see FIG. 2). As shown in FIG. 3, the ground pad 40 has a first region 40a, a second region 40b, and a missing region 40c. The first and second regions 40a and 40b are formed of a metal pattern. The metal pattern is, for example, copper foil printed by silk screen printing. The missing region 40c separates the regions 40a and 40b by not providing a metal pattern. Therefore, the supports 42 and 43 are not soldered to the missing region 40c itself.

[0030] The ground pad 40 is formed into a circular shape as a whole by combining the regions 40a to 40c. The circle is not limited to a perfect circle, but includes a slightly distorted circle, an ellipse, etc. The missing region 40c is formed in a band shape that passes through a position off the center O of the circle that constitutes the ground pad 40.

[0031] The first region 40a is formed of a metal pattern having a larger area than the second region 40b. The first region 40a has a shape obtained by cutting a part of a circle, for example, a substantially D-shape. In other words, the first region 40a has a straight cut line 40a1 at the boundary with the missing region 40c.

[0032] The second region 40b is formed of a metal pattern having a smaller area than the first region 40a. The second region 40b is a cut-off portion of a circle, and has a shape that can be called a dish shape or a crescent shape with one side formed by a straight line. In other words, the second region 40b has a straight cut line 40b1 at the boundary with the missing region 40c on the opposite side to the arc that forms the outline of the entire ground pad 40.

[0033] The missing area 40c is a strip-shaped linear portion having a predetermined width. The missing area 40c is a blank portion that is not soldered when the first support 42 is soldered to the first area 40a and prevents the first support 42 from moving toward the second area 40b. The width of the missing area 40c, that is, the width of the gap G between the areas 40a and 40b, is preferably set to a distance such that the first support 42 cannot move beyond the missing area 40c toward the second area 40b when the first support 42 is soldered, as described below. For example, when the diameter of the circle constituting the ground pad 40 is 10 mm, the width of the gap G can be set to about 0.5 to 1.0 mm.

[0034] Fig. 4 is a perspective view of the first support 42. As shown in Fig. 2 and Fig. 4, the first support 42 has a stud member 44 and a support member 45. The first support 42 is a locking component that can be switched between a locked position (closed position) in which the electronic module 32 can be supported and an unlocked position (open position) by inverting the cam-shaped support member 45, for example, 180 degrees.

[0035] The stud member 44 is a metal part having a flange 44a and a shaft 44b. The flange 44a is a metal disk shaped like a part of a circle cut at a cutting surface 44a1. The outer shape of the flange 44a is approximately similar to the outer shape of the first region 40a, and is the same as or slightly smaller than the outer shape of the first region 40a. In other words, the flange 44a is a substantially D-shaped disk similar to the outline of the first region 40a, and is shaped to fit within the first region 40a. The shaft 44b is formed integrally with the flange 44a, and is a cylinder standing in the Z direction from the center of the flange 44a.

[0036] The support member (lock member) 45 is a metal part having a rotating shaft portion 45a and a lock portion 45b. The rotating shaft portion 45a is a cylindrical body that is inserted relative to the shaft 44b so as to be rotatable relative to the shaft 44b. The lock portion 45b is fixed to the Z2 side end surface of the rotating shaft portion 45a and is rotatable around the axis of the shaft 44b together with the rotating shaft portion 45a. The lock portion 45b has a shape, for example, of two large and small semicircular metal plates combined together. More specifically, the lock portion 45b has a substantially cam shape or a substantially mushroom shape in a plan view. The small diameter portion of the lock portion 45b is fixed to the shaft 44b, and an operation hole 45b1 is formed at the center thereof. The operation hole 45b1 is a cross hole into which a tool such as a Phillips screwdriver is fitted to rotate the lock portion 45b. The large diameter portion of the lock portion 45b is formed integrally with the small diameter portion and is rotatable around the axis of the shaft 44b.

[0037] The height of the shaft 44b in the Z direction, that is, the distance from the Z2 side surface of the flange 44a to the Z1 side surface of the locking portion 45b, is greater than the plate thickness of the electronic module 32. This allows the first support 42 to be switched between a locked position (see FIGS. 2 and 6B) in which the other end 32a2 of the electronic module 32 described below is pressed and supported from the Z2 side by the large diameter portion of the locking portion 45b, and an unlocked position (see FIGS. 4 and 6A) in which the other end 32a2 is released without being pressed.

[0038] Fig. 5 is a perspective view of the second support 43. As shown in Fig. 2 and Fig. 5, the second support 43 has a stud member 46 and a screw 47. The second support 43 is a component that supports the electronic module 33 by fastening the screw 47 to the stud member 46.

[0039] The stud member 46 is a metal part having a flange 46a and a cylindrical body 46b. The flange 46a is a metal disk. The outer shape of the flange 46a is a circle that is approximately similar to the overall outer shape of the ground pad 40 including the regions 40a to 40c, and is the same as or slightly smaller than the overall outer shape of the ground pad 40. In other words, the flange 46a is a disk with an outline similar to the overall outline of the ground pad 40, and is shaped to fit within the overall outline of the ground pad 40. The cylindrical body 46b is formed integrally with the flange 46a, and is a cylinder that stands up from the center of the flange 46a in the Z direction. The cylindrical body 46b is provided with a screw hole 46b1 with a female thread formed on the inner circumferential surface.

[0040] The screw 47 is a metal screw having a head 47a having an outer shape substantially the same as that of the flange 46a, and a threaded portion 47b that can be screwed into the screw hole 46b1. An operation hole 47a1 is formed in the center of the head 47a. The operation hole 47a1 is a cross recess into which a tool such as a Phillips screwdriver is fitted to rotate the screw.

[0041] The height of the cylinder 46b in the Z direction, that is, the distance from the Z2 side surface of the flange 46a to the Z1 side surface of the head 47a of the screw 47 fastened to the screw hole 46b1, is greater than the plate thickness of the electronic module 33. This allows the second support 43 to support the other end 33a2 of the electronic module 33 (described later) by pressing it from the Z2 side with the screw 47 (see FIGS. 2 and 7B).

[0042] Next, the electronic modules 32 and 33 are card-type module components that can be connected to the connector 30 that complies with the M.2 standard as described above.

[0043] The electronic module 32 is, for example, a storage device. The electronic module 32 of this embodiment is an SSD (Solid State Drive). As shown in FIG. 2, the electronic module 32 has a module substrate 32a, a terminal 32b formed on one end 32a1 of the module substrate 32a, and a semiconductor chip 32c mounted on the module substrate 32a. With the terminal 32b connected to the connector 30, the other end 32a2 of the module substrate 32a of the electronic module 32 is pressed in the Z direction by the first support 42. This allows the electronic module 32 to be attached to the circuit board 24. A semicircular notch 32d in which the rotation shaft portion 45a of the first support 42 can be disposed is formed at the center of the other end 32a2 in the longitudinal direction (see FIG. 4).

[0044] The electronic module 33 is, for example, a communication module. The electronic module 33 of this embodiment is compatible with WWAN (Wireless Wide Area Network). The communication standard compatible with the electronic module 33 may be, for example, WLAN (Wireless Local Area Network) or the like. As shown in FIG. 2, the electronic module 33 has a module board 33a, a terminal 33b formed on one end 33a1 of the module board 33a, and a semiconductor chip 33c mounted on the module board 33a. With the terminal 33b connected to the connector 30, the other end 33a2 of the module board 33a of the electronic module 33 is pressed in the Z direction by the second support 43. This allows the electronic module 33 to be attached to the circuit board 24. A semicircular notch 33d is formed at the center of the other end 33a2 in the longitudinal direction, in which the cylindrical body 46b of the second support 43 can be placed. To the other end 33a2 of the electronic module 33, a cable 49 is connected from an antenna element 48 provided at various locations on the housing 12 and the cover 11 as appropriate.

[0045] Next, a method for fixing the supports 42, 43 to the ground pad 40 and a method for supporting the electronic modules 32, 33 by the supports 42, 43 will be described.

[0046] Fig. 6A is a schematic plan view showing a state in which the first support 42 is fixed to the ground pad 40. Fig. 6B is a plan view showing a state in which the support member 45 shown in Fig. 6A is rotated to a locked position.

[0047] 6A, the first support 42 is fixed to the first region 40a of the ground pad 40. The bottom surface (Z1 side surface) of the flange 44a of the first support 42 can be fixed to the first region 40a by reflow soldering. The fixing of the first support 42 can be performed simultaneously with the process of mounting the connector 30 and other mounted components to the circuit board 24 by reflow soldering, for example.

[0048] It is preferable that the first support 42 is fixed to the ground pad 40 in a rotated position (see FIG. 6A) in which the support member 45 (lock portion 45b) is in the unlocked position. When the support member 45 is in the unlocked position, the electronic module 32 can be easily attached to the first support 42 fixed to the ground pad 40. On the other hand, when the support member 45 is in the locked position, the worker must first operate the support member 45 to the unlocked position before attaching the electronic module 32, which reduces work efficiency.

[0049] Here, when the flange 44a is fixed to the first region 40a by reflow soldering, the flange 44a tends to rotate on the first region 40a due to the surface tension of the heated and melted solder. Therefore, if the first region 40a and the flange 44a are circular, the support member 45 (lock portion 45b) may be in the locked position when the solder solidifies.

[0050] In this respect, the ground pad 40 of this embodiment has a first region 40a that is substantially D-shaped in plan view, that is, rotationally asymmetric. The flange 44a has a shape that fits into the first region 40a. The planar shape of the flange 44a is substantially D-shaped corresponding to the first region 40a, that is, rotationally asymmetric. Therefore, in the circuit board 24 of this embodiment, when the flange 44a is fixed to the first region 40a by reflow soldering, the flange 44a that receives the surface tension of the heated and melted solder is positioned in a certain rotational direction shown in FIG. 6A on the first region 40a. Specifically, the cut surface 44a1 is arranged along the cut line 40a1. As a result, the first support 42 can be fixed to the ground pad 40 in a state where the rotational direction is controlled so that the lock portion 45b is always in the unlocked position shown in FIG. 6A.

[0051] Therefore, when mounting the electronic module 32 on the circuit board 24 of this embodiment, after the terminal 32b is connected to the connector 30, the other end 32a2 can be smoothly placed right next to the first support 42 in the unlocked position. Then, the support member 45 is rotated to the locked position (see the arrow in FIG. 6B). This allows the circuit board 24 to easily support the electronic module 32 using the first support 42, resulting in high work efficiency.

[0052] Fig. 7A is a schematic plan view of the stud member 46 of the second support 43 fixed to the ground pad 40. Fig. 7B is a plan view showing the state in which a screw 47 is fastened to the stud member 46 shown in Fig. 7A.

[0053] 7A, the second support 43 is disposed so as to straddle the areas 40a to 40c of the ground pad 40, and is fixed simultaneously with the areas 40a and 40b. The bottom surface (Z1 side surface) of the flange 46a of the second support 43 can be fixed to the areas 40a and 40b by reflow soldering. The fixing of the second support 43 can be performed simultaneously with the process of mounting the first support 42, the connector 30, etc. on the circuit board 24 by reflow soldering, for example.

[0054] Here, when the flange 46a of the second support 43 is fixed to the ground pad 40 by reflow soldering, the flange 46a tends to rotate on the regions 40a-40c due to the surface tension of the heated and melted solder. However, the second support 43 is structured to support the electronic module 33 using the screw 47. Therefore, the rotational orientation of the stud member 46 on the ground pad 40 does not matter, and there is no need to control it in a fixed direction when fixing.

[0055] The ground pad 40 of this embodiment has an overall outer shape, including the regions 40a-40c, that is the same as or slightly larger than the flange 46a, and is circular in plan view. On the other hand, the flange 46a has a shape that fits within the regions 40a-40c, and is circular in plan view. Therefore, in the circuit board 24 of this embodiment, when the flange 46a is fixed across the regions 40a-40c by reflow soldering, the flange 46a rotates on the regions 40a-40c due to the surface tension of the heated and melted solder, but can be reliably fixed to the ground pad 40.

[0056] Therefore, when mounting the electronic module 33 on the circuit board 24 of this embodiment, after the terminal 33b is connected to the connector 30, the other end 33a2 can be smoothly placed right next to the stud member 46 fixed to the ground pad 40. Then, the screw 47 is screwed into the screw hole 46b1 (see FIG. 7B). This allows the circuit board 24 to easily support the electronic module 33 using the second support 43, resulting in high work efficiency.

[0057] As described above, the circuit board 24 of the present embodiment includes a ground pad 40 on its surface (second surface 24b) to which the supports 42 or 43 for supporting the other ends 32a2, 33a2 of the electronic modules 32, 33 can be fixed. The ground pad 40 has a first region 40a formed of a metal pattern, a second region 40b formed of a metal pattern having a smaller area than the first region 40a, and a missing region 40c that separates the regions 40a, 40b by not providing a metal pattern. The ground pad 40 can selectively fix the first support 42 that fits in the first region 40a and the second support 43 that extends beyond the missing region 40c and spans the regions 40a, 40b. When the first support 42 is fixed to the first region 40a, the ground pad 40 is positioned such that the rotation direction of the first support 42 is in a fixed direction.

[0058] Therefore, in the circuit board 24 of this embodiment, when the first support 42, which is a locking component that can switch between supporting and not supporting the electronic module 32 by rotating the support member 45, is fixed to the ground pad 40, it is sufficient to use only the first region 40a. This allows the first support 42 to be fixed to the ground pad 40 while always controlling the rotation direction. As a result, the efficiency of the installation and removal work of the electronic module 32 using the first support 42 is improved. When the second support 43 that supports the electronic module 33 is fixed to the ground pad 40 with the screw 47, the circuit board 24 uses the regions 40a and 40b at the same time. This allows the circuit board 24 to reliably fix the stud member 46 of the second support 43, which does not require control of the rotation direction, to the ground pad 40. As a result, the circuit board 24 can also support the electronic module 33 using the second support 43.

[0059] In this way, the ground pad 40 has the regions 40a to 40c, and thus the supports 42, 43 having different support structures for the electronic module can be selectively fixed. As a result, the circuit board 24 can be used in either case of using one or both of the supports 42, 43, and therefore high versatility can be obtained, and the product cost can be reduced. Therefore, the electronic device 10 having such a circuit board 24 can flexibly select the supports 42, 43 according to the specifications and applications by mounting the circuit board 24 having the same ground pad 40.

[0060] It is preferable that the first region 40a has a rotationally asymmetric shape. In this case, by making the flange 44a of the first support 42 have a similar shape, the rotational direction of the first support 42 can be easily positioned in a fixed direction during soldering, even with a simple configuration.

[0061] 2 shows an example of a configuration in which electronic module 32, which is a storage device (SSD), is supported by a first support 42, and electronic module 33, which is a communication module, is supported by a second support 43. However, a configuration in which electronic module 32 is supported by a second support 43, and electronic module 33 is supported by a first support 42, may also be used. In the circuit board 24, only the first support 42 may be fixed to all the ground pads 40, or only the second support 43 may be fixed to all the ground pads 40.

[0062] The shape of the ground pad is not limited to the above, and various shapes are possible as long as two or more types of supports can be selectively fixed thereto.

[0063] Fig. 8 is a schematic plan view of the ground pad 50 shown in the first modified example. In Fig. 8, the same reference symbols as those shown in Fig. 1 to Fig. 7B indicate the same or similar configurations, and therefore have the same or similar functions and effects, and detailed descriptions thereof will be omitted, and the same applies to Fig. 9.

[0064] In the ground pad 50 shown in Fig. 8, the combined shape of the regions 40a to 40c is a polygon (hexagon in Fig. 8) as a whole. In the ground pad 50, the missing region 40c is also formed in a band shape passing through a position off center O of the polygon constituting the ground pad 50. Therefore, the ground pad 50 can selectively fix a first support 42 having a flange 44a shaped to correspond to the first region 40a and a second support 43 having a flange 46a shaped to extend beyond the missing region 40c and straddle the regions 40a and 40b.

[0065] Fig. 9 is a schematic plan view of a ground pad 52 shown in a second modified example. The ground pad 52 shown in Fig. 9 is the same as the ground pad 40 shown in Fig. 3 in that the combined shape of the regions 40a to 40c is a circle as a whole. The ground pad 52 differs from the ground pad 52 in that the missing region 40c is not linear but is in the shape of a curved band. As shown in Fig. 9, the missing region 40c is not limited to being linear, and may be curved or bent as long as it separates the regions 40a and 40b.

[0066] It should be noted that the present invention is not limited to the above-described embodiment, and can of course be freely modified without departing from the spirit and scope of the present invention. [Explanation of symbols]

[0067] 10 Electronic equipment 12. Chassis 24 Circuit Board 30 Connectors 32,33 Electronic Module 40,50,52 Ground Pad 40a First Area 40b Second Area 40c Missing area 42 First Support 43 Second Support 44,46 Stud member 45 Support member 47 Screw

Claims

1. A circuit board on which a connector for connecting one end of an electronic module is mounted, a ground pad on a surface to which a first or second support for supporting the other end of the electronic module can be fixed; The ground pad is a first region formed of a metal pattern; a second region formed of a metal pattern having an area smaller than that of the first region; a missing region in which no metal pattern is provided, thereby separating the first region and the second region; having The ground pad is capable of selectively fixing the first support that fits in the first region and the second support that extends beyond the missing region and spans the first region and the second region, and when the first support is fixed in the first region, the rotation direction of the first support is positioned in a fixed direction. A circuit board comprising:

2. 2. The circuit board according to claim 1, The first region has a rotationally asymmetric shape. A circuit board comprising:

3. 3. The circuit board according to claim 1, The ground pad is formed such that a shape obtained by combining the first region, the missing region, and the second region is a circle or a polygon as a whole, The defective region is formed in a band shape passing through a position off the center of the circle or polygon. A circuit board comprising:

4. An electronic device including a circuit board to which an electronic module is connected, The circuit board includes: a surface-mounted connector to which one end of the electronic module is connected; A ground pad provided on the surface; a support fixed to the ground pad and supporting the other end of the electronic module; Equipped with The ground pad is a first region formed of a metal pattern; a second region formed of a metal pattern having an area smaller than that of the first region; a missing region in which no metal pattern is provided, thereby separating the first region and the second region; having The support has a shape that fits into the first region, and is fixed to the first region with its rotation direction positioned in a fixed direction.

1. An electronic device comprising:

5. 5. The electronic device according to claim 4, The support includes: a stud member having a flange fixed to the ground pad and a shaft extending from a surface of the flange; a support member supported so as to be rotatable relative to the shaft and capable of supporting the other end of the electronic module; having The support member is switchable between a locked position in which the other end is supported and an unlocked position in which the other end is not supported by rotating the support member relative to the shaft.

1. An electronic device comprising:

6. An electronic device including a circuit board to which an electronic module is connected, The circuit board includes: a surface-mounted connector to which one end of the electronic module is connected; A ground pad provided on the surface; a support fixed to the ground pad and supporting the other end of the electronic module; Equipped with The ground pad is a first region formed of a metal pattern; a second region formed of a metal pattern having an area smaller than that of the first region; a missing region in which no metal pattern is provided, thereby separating the first region and the second region; having The support has a shape that extends beyond the defective region and spans the first region and the second region, and is fixed to the first region and the second region simultaneously.

1. An electronic device comprising:

7. 7. The electronic device according to claim 6, The support includes: a stud member having a flange fixed to the ground pad and a cylindrical body having a screw hole formed therein and standing up from the flange; a screw capable of supporting the other end of the electronic module by being screwed into the screw hole; have 1. An electronic device comprising:

8. The electronic device according to any one of claims 4 to 7, The first region has a rotationally asymmetric shape.

1. An electronic device comprising:

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