Power module

Abstract

To provide a power module that can reduce size.SOLUTION: A power module includes a substrate 102 having a first metal surface 1024S, a semiconductor element 104 mounted on the first metal surface and electrically connected to a plurality of pins 106 extending from the first metal surface, and a package body 112 partially surrounding the pins 106 so as to surround the first metal surface and the semiconductor element, with gaps between two adjacent pins and an isolation element disposed in each of the gaps to increase the creepage distance between the two adjacent pins.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to a power module, and more particularly to a power module that can be reduced in size. [Background technology]

[0002] With the development of science and technology, nowadays many power modules have become common and popular products.

[0003] Generally, a power module has multiple pins for signal transmission. However, in order to comply with safety regulations, there is a certain limit to the distance between two adjacent pins, which makes it difficult to reduce the overall size of the power module.

[0004] Therefore, how to design a power module that can reduce the size and comply with safety regulations is currently a problem worth exploring and solving. Summary of the Invention [Problem to be solved by the invention]

[0005] In view of this, the present disclosure provides a power module that solves the above-mentioned problems. [Means for solving the problem]

[0006] The present disclosure provides a power module including a substrate, a semiconductor component, a plurality of pins, and a package body. The substrate has a first metal surface. A semiconductor element is disposed on the first metal surface. A plurality of pins extend from the first metal surface and are configured to be electrically connected to the semiconductor element. The package body is configured to surround the first metal surface and the semiconductor element, and is configured to partially surround each of the pins. A gap is present between two adjacent pins, and an isolation element is disposed in the gap to increase a creepage distance between the two adjacent pins.

[0007] According to some embodiments of the present disclosure, the pins extend along a first axis, and when viewed along the first axis, the pins are arranged in a matrix.

[0008] According to some embodiments of the present disclosure, when viewed along a first axis, these separation elements include a plurality of first separation elements, each of which has a strip-like structure extending along a second axis, the second axis being perpendicular to the first axis.

[0009] According to some embodiments of the present disclosure, when viewed along the first axis, the separation element further includes a plurality of second separation elements, each of which has a strip-like structure extending along a third axis, the third axis being perpendicular to the first axis and the second axis.

[0010] According to some embodiments of the present disclosure, the first isolation elements are connected to the second isolation elements, and the first isolation elements and the second isolation elements are arranged crosswise to each other.

[0011] According to some embodiments of the present disclosure, each of the first and second isolation elements is a convex or concave structure.

[0012] According to some embodiments of the present disclosure, the width of the convex or concave structure is 1 mm or more.

[0013] According to some embodiments of the present disclosure, four third isolation elements are further disposed on the package body, and when viewed along the first axis, the four third isolation elements form a rectangle surrounding the pins, the first isolation elements, and the second isolation elements.

[0014] According to some embodiments of the present disclosure, the first isolation element, the second isolation element, and the third isolation element are made of an elastic material, and the material of the packaging body is different from the material of the first isolation element, the second isolation element, and the third isolation element.

[0015] According to some embodiments of the present disclosure, each of these third isolation elements is a separate convex structure or a separate concave structure, and each of these third isolation elements has a width of 1 mm or more.

[0016] According to some embodiments of the present disclosure, the substrate further has a second metal surface configured to dissipate heat generated by the power module to an external environment, the first metal surface and the second metal surface being located on opposite sides of the substrate, and a portion of the second metal surface being exposed from the package body.

[0017] The present disclosure further provides a power module including a substrate, a semiconductor device, a plurality of pins, a package body, and a first isolation element. The substrate has a first metal surface. The semiconductor device is disposed on the first metal surface. The plurality of pins extend from the first metal surface and are configured to be electrically connected to the semiconductor device. The package body is configured to surround the first metal surface and the semiconductor device, and is configured to partially surround each of the pins. The first isolation element is disposed on the package body and surrounds the pins.

[0018] According to some embodiments of the present disclosure, the pins extend along a first axis, and when viewed along the first axis, the first separation element has two first strip portions and two second strip portions, the two first strip portions extending along the second axis and the two second strip portions extending along a third axis, the first axis, the second axis, and the third axis being perpendicular to each other.

[0019] According to some embodiments of the present disclosure, each of the two first strip portions and the two second strip portions is a convex structure or a concave structure.

[0020] According to some embodiments of the present disclosure, the power module further includes a second isolation element disposed on one side of the first isolation element and extending along a second axis.

[0021] According to some embodiments of the present disclosure, the width of the first isolation element and the second isolation element is greater than 1 mm, and the distance between the second isolation element and the first isolation element is greater than 1 mm.

[0022] According to some embodiments of the present disclosure, the power module further includes a third isolation element, the second isolation element being located between the first isolation element and the third isolation element, and the third isolation element extending along the second axis.

[0023] According to some embodiments of the present disclosure, the width of the third isolation element is greater than 1 mm, and the distance between the third isolation element and the second isolation element is greater than 1 mm.

[0024] According to some embodiments of the present disclosure, each of the second and third isolation elements is a convex or concave structure, and the width of the second isolation element is different from the width of the third isolation element.

[0025] According to some embodiments of the present disclosure, the first isolation element, the second isolation element, and the third isolation element are made of a resilient material.

[0026] The present disclosure provides a power module having a substrate, a plurality of pins, and a package body. The substrate is configured to partially surround each of the plurality of pins. A gap is provided between two adjacent pins, and an isolation element is disposed in the gap to increase the creepage distance between the two adjacent pins. The isolation element is a convex or concave structure, and the height and width of the convex or concave structure are 1 mm or more.

[0027] Therefore, based on the design of the present disclosure, the power module can not only comply with safety regulations, but also shorten the distance between two adjacent pins, thereby reducing the overall size of the power module. In addition, the isolation element can be made of elastic material, so that when the power module is connected to an external connector, the protruding isolation element can act as a buffer to prevent the power module from being damaged by excessive impact force.

[0028] Aspects of embodiments of the present disclosure can be clearly understood through the following detailed description and the accompanying drawings, in which, in accordance with standard industry practice, various features are not drawn to scale and are used for illustrative purposes only, and in fact, dimensions of various features may be arbitrarily expanded or reduced to allow for clarity of illustration. [Brief description of the drawings]

[0029] [Figure 1] FIG. 1 is a three-dimensional schematic diagram of a power module 100 according to one embodiment of the present disclosure. [Diagram 2] FIG. 2 is a cross-sectional view of the power module 100 along line AA of FIG. 1 according to one embodiment of the present disclosure. [Diagram 3] FIG. 3 is a simplified top view of a power module 100 according to one embodiment of the present disclosure. [Figure 4] FIG. 4 is a schematic cross-sectional view of the power module 100 along line BB of FIG. 3 according to one embodiment of the present disclosure. [Diagram 5] FIG. 5 is a schematic cross-sectional view of a power module 100 according to another embodiment of the present disclosure. [Figure 6] FIG. 6 is a schematic cross-sectional view of a simplified partial structure of a power module 100A according to another embodiment of the present disclosure. [Figure 7] FIG. 7 is a schematic cross-sectional view of a simplified partial structure of a power module 100A according to another embodiment of the present disclosure. [Figure 8] FIG. 8 is a simplified top view of a power module 100B according to another embodiment of the present disclosure. [Figure 9] FIG. 9 is a schematic cross-sectional view of the power module 100B along line CC of FIG. 8 according to another embodiment of the present disclosure. [Figure 10] FIG. 10 is a schematic cross-sectional view of a power module 100B according to another embodiment of the present disclosure. [Figure 11] FIG. 11 is a simplified top view of a power module 100C according to another embodiment of the present disclosure. [Figure 12] FIG. 12 is a schematic cross-sectional view of a power module 100C taken along line D-D of FIG. 11 according to another embodiment of the present disclosure. [Figure 13] FIG. 13 is a schematic cross-sectional view of a power module 100C according to another embodiment of the present disclosure. [Figure 14] FIG. 14 is a simplified top view of a power module 100D according to another embodiment of the present disclosure. [Figure 15] FIG. 15 is a schematic cross-sectional view of a power module 100D taken along line EE of FIG. 14 according to another embodiment of the present disclosure. [Figure 16] FIG. 16 is a schematic cross-sectional view of a power module 100D according to another embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0030] In order to implement different features of the provided subject matter, several different implementations or examples are disclosed below. To explain the present disclosure, examples of specific elements and their arrangements are described below. For example, a description in this specification that a first feature is formed on a second feature can include an embodiment in which the first feature is in direct contact with the second feature, or can also include an embodiment having other features between the elements of the first feature and the elements of the second feature. In other words, the elements of the first feature may not be in direct contact with the elements of the second feature.

[0031] Also, repeated symbols or labels may be used in different embodiments, and these repetitions are only for the purpose of simplifying and clarifying the disclosure, and do not imply any particular relationship between the different embodiments and / or structures discussed. Also, forming, connecting, and / or coupling an element of another feature on top of another feature in this disclosure can include embodiments in which the elements of the features therein are formed in direct contact, and can also include embodiments in which an additional element of the feature can be formed interposed within the element of the feature described above such that the elements of the feature described above are not in direct contact. Also, spatially related terms such as, for example, "vertical," "upper," "top," "lower," "bottom," and similar terms (e.g., "downward," "upward," etc.) may be used, and these spatially relative terms are used for the sake of brevity in the description to describe the relationship of one element or feature to another element or feature in the drawings. These spatially relative terms are intended to encompass different orientations of a device including the features.

[0032] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which this disclosure belongs. It will be understood that terms defined in commonly used dictionaries should be interpreted as having a meaning that fits the relevant art and background or context of this disclosure, and should not be interpreted in an idealized or overly formal manner unless otherwise defined.

[0033] Moreover, ordinal numbers such as "first," "second," and the like, as used herein and in the claims, distinguish among claim elements, and do not, by themselves, imply or suggest any preceding ordinal number for the claim elements, nor do they imply any ordering of one claim element relative to another, or any ordering in a method of manufacture. The use of such ordinal numbers is solely to enable a named claim element to be clearly distinguished from other claim elements of the same name.

[0034] Additionally, in some embodiments of the present disclosure, terms related to bonding, coupling, etc., such as "bonded" or "interconnected," can refer to structures that are in direct contact with each other or that are not in direct contact with each other, unless otherwise defined, and can include a relationship in which two structures are movable or in which two structures are fixed.

[0035] As shown in Figures 1 and 2, Figure 1 is a three-dimensional schematic view of a power module 100 according to an embodiment of the present disclosure, and Figure 2 is a cross-sectional view of the power module 100 along line A-A in Figure 1 according to an embodiment of the present disclosure. In this embodiment, the power module 100 includes a substrate 102, at least one semiconductor element 104, a plurality of pins 106, and a package body 112.

[0036] The substrate 102 is, for example, a ceramic substrate, and includes a base material 1020, a conductive layer 1021, and a thermally conductive layer 1022. The conductive layer 1021 and the thermally conductive layer 1022 are disposed on opposite sides of the substrate 1020. The conductive layer 1021 includes a plurality of conductive portions 1024, and the conductive portions 1024 have a first metal surface 1024S.

[0037] The semiconductor element 104 may be a semiconductor chip, such as, but not limited to, a power control chip. The semiconductor element 104 is disposed on the first metal surface 1024S. Further, the plurality of pins 106 are configured to allow the power module 100 to be plugged into an external connector or another electronic device (not shown). The plurality of pins 106 extend from the first metal surface 1024S, and the pins 106 are configured to be electrically connected to the semiconductor element 104.

[0038] Furthermore, the package body 112 is configured to protect the semiconductor element 104 and the substrate 102. The package body 112 is made of an insulating material such as, but not limited to, epoxy resin. The package body 112 is configured to surround the first metal surface 1024S and the semiconductor element 104, and the package body 112 is configured to partially surround these pins 106, respectively. In addition, the comparative tracking index (CTI) of the package body 112 is greater than 400, but is not limited to this. Regarding the CTI value of the package body 112, there are generally two types in the industry: 400-599 and >600, and the larger the value, the closer the distance between the two conductors can be.

[0039] 3 and 4, FIG. 3 is a simplified top view of the power module 100 according to an embodiment of the present disclosure, and FIG. 4 is a schematic cross-sectional view of the power module 100 along line B-B in FIG. 3 according to an embodiment of the present disclosure. As shown in FIG. 3 and 4, these pins 106 extend along a first axis AX1, and when viewed along the first axis AX1 (Z-axis), these pins 106 are arranged in a matrix.

[0040] Based on these pin 106 arrangements, the power module 100 can be compatible with different types of connectors, and there is no need to design power modules with different pin 106 arrangements for different types of connectors, which can significantly reduce manufacturing costs.

[0041] 3, there is a gap SC between these two adjacent pins 106, and isolation elements are disposed in the gap SC to increase the creepage distance between these two adjacent pins 106. Specifically, when viewed along the first axis AX1, these isolation elements include a plurality of first isolation elements 114, each of which extends along a second axis AX2, which is perpendicular to the first axis AX1.

[0042] For example, the total length CS1 of the arrow in Fig. 4 is the creepage distance between two adjacent pins 106. The total length CS1 is greater than the horizontal distance CS0 (along the third axis AX3) between the two pins 106. If the first isolation element 114 is not placed, the creepage distance will be equal to the horizontal distance CS0, and the creepage distance may be too small to comply with safety regulations. Therefore, by placing the first isolation element 114, it is possible to obtain the advantage of increasing the creepage distance.

[0043] Additionally, when viewed along the first axis AX1, these separation elements may further include a plurality of second separation elements 116, each of which extends along a third axis AX3, the third axis AX3 being perpendicular to the first axis AX1 and the second axis AX2.

[0044] As shown in FIG. 3, the first isolation elements 114 are connected to the second isolation elements 116, and the first isolation elements 114 and the second isolation elements 116 are arranged to cross each other.

[0045] In this embodiment, as shown in FIG. 4, each of the first isolation elements 114 and the second isolation elements 116 is a rectangular convex structure, and the width WT1 of the convex structure is 1 mm or more.

[0046] The first isolation element 114 and the second isolation element 116 are not limited to a convex structure. As shown in Fig. 5, Fig. 5 is a schematic cross-sectional view of a power module 100 according to another embodiment of the present disclosure. In this embodiment, each of the first isolation element 114 and the second isolation element 116 has a concave structure, and the width WT2 of the concave structure is 1 mm or more.

[0047] Also, note that in Fig. 4, the height HT1 of the convex structure is also 1 mm or more. In Fig. 5, the depth HT2 of the concave structure is also 1 mm or more. Based on such a structural design, the creepage distance between two adjacent pins 106 can be effectively increased.

[0048] Also, in this embodiment, the first isolation element 114, the second isolation element 116, and the package body 112 can be integrally molded, but is not limited thereto. In other embodiments, the material of the first isolation element 114 and the second isolation element 116 can be different from the material of the package body 112. For example, the first isolation element 114 and the second isolation element 116 can be made of an elastic material and can be fixedly disposed on the package body 112 using an adhesive or tape, etc. The elastic material can include, but is not limited to, rubber, for example.

[0049] 6 and 7, which are schematic cross-sectional views of simplified partial structures of a power module 100A according to different embodiments of the present disclosure. In FIG. 6, the first isolation element 114 can have a first convex structure 1141 and a second convex structure 1142, the first convex structure 1141 is fixedly disposed on the package body 112, and the second convex structure 1142 is fixedly disposed on the first convex structure 1141.

[0050] The height HX1 of the first convex structure 1141 is 1 mm or more, and the height HX2 of the second convex structure 1142 is 1 mm or more. Similarly, the width WX1 of the first convex structure 1141 is 2 mm or more, and the width WX2 of the second convex structure 1142 is 1 mm or more.

[0051] In FIG. 7, the first isolation element 114 has a first concave structure 1143 and a second concave structure 1144, where the first concave structure 1143 is recessed from the upper surface 112US of the package body 112 along a first axis AX1, and the second concave structure 1144 is recessed from the first concave structure 1143 along the first axis AX1.

[0052] The depth HX3 of the first recessed structure 1143 is 1 mm or more, and the depth HX4 of the second recessed structure 1144 is 1 mm or more. Similarly, the width WX3 of the first recessed structure 1143 is 2 mm or more, and the width WX4 of the second recessed structure 1144 is 1 mm or more.

[0053] 8 and 9, FIG. 8 is a simplified top view of a power module 100B according to another embodiment of the present disclosure, and FIG. 9 is a schematic cross-sectional view of the power module 100B along line C-C in FIG. 8 according to another embodiment of the present disclosure. As shown in FIG. 8 and FIG. 9, four third isolation elements 118 are further disposed on the package body 112 of the power module 100B, and when viewed along the first axis AX1, these four third isolation elements 118 form a rectangle surrounding these pins 106, these first isolation elements 114, and these second isolation elements 116.

[0054] In this embodiment, the four third isolation elements 118 are connected to these first isolation elements 114 and second isolation elements 116, but this is not limited thereto. In another embodiment, the third isolation elements 118 may not be connected to the first isolation elements 114 and second isolation elements 116.

[0055] Also, in this embodiment, the first isolation element 114, the second isolation element 116, and the third isolation element 118 can be made of an elastic material, for example, but not limited to, rubber, that is, the material of the package body 112 is different from the material of the first isolation element 114, the second isolation element 116, and the third isolation element 118. Also, in some embodiments, the first isolation element 114, the second isolation element 116, the third isolation element 118, and the package body 112 can be integrally molded and made of an elastic material.

[0056] 9, each of these third isolation elements 118 is also a rectangular convex structure, and the width WT3 of this convex structure is 1 mm or more. It should be noted that the heights of the third isolation element 118 and the first isolation element 114 may be different. In this embodiment, the height HT3 of the third isolation element 118 is smaller than the height HT1 of the first isolation element 114, but the height HT3 is 1 mm or more.

[0057] Similarly, the third isolation elements 118 are not limited to a convex structure. As shown in FIG. 10, FIG. 10 is a schematic cross-sectional view of a power module 100B according to another embodiment of the present disclosure. In this embodiment, each of the third isolation elements 118 has a concave structure, and each of the third isolation elements 118 has a width WT4 of 1 mm or more. Also, in FIG. 10, the depth HT4 of the third isolation element 118 is smaller than the depth HT2 of the first isolation element 114, but the depth HT4 is 1 mm or more.

[0058] 9, 10, and 2, the thermally conductive layer 1022 of the substrate 102 has a second metal surface 1022S configured to dissipate heat generated by the power module 100B to the external environment. The first metal surface 1024S and the second metal surface 1022S are located on opposite sides of the substrate 102, and a portion of the second metal surface 1022S is exposed from the package body 112 to enhance the heat dissipation effect.

[0059] 11 and 12, FIG. 11 is a simplified top view of a power module 100C according to another embodiment of the present disclosure, and FIG. 12 is a schematic cross-sectional view of the power module 100C along line D-D in FIG. 11 according to another embodiment of the present disclosure. In this embodiment, the power module 100C includes a first isolation element 120 disposed on a package body 112 and surrounding these pins 106.

[0060] 11 and 12, similar to the previous embodiment, these pins 106 extend along a first axis AX1, and when viewed along the first axis AX1, the first isolation element 120 has two first strip portions 121 and two second strip portions 122, the two first strip portions 121 extending along a second axis AX2 and the two second strip portions 122 extending along a third axis AX3, the first axis AX1, the second axis AX2 and the third axis AX3 being perpendicular to each other.

[0061] In this embodiment, as shown in Fig. 12, the two first strip portions 121 and the two second strip portions 122 are integrally molded, and each of the first strip portion 121 and the second strip portion 122 can be a rectangular convex structure. The first strip portion 121 and the second strip portion 122 can be similar to the third isolation element 118 in Fig. 9 and have a height HT3 and a width WT3, both of which are equal to or larger than 1 mm.

[0062] The first strip portion 121 and the second strip portion 122 are not limited to the above-mentioned convex structure. As shown in Fig. 13, Fig. 13 is a schematic cross-sectional view of a power module 100C according to another embodiment of the present disclosure. In this embodiment, each of the two first strip portions 121 and the two second strip portions 122 can be a concave structure, similar to the third isolation element 118 in Fig. 10, and can have a depth HT4 and a width WT4, both of which are 1 mm or more.

[0063] Based on the design of the first strip portion 121 and the second strip portion 122, the creepage distance between the outermost pin 106 and the bottom surface 112BS of the package body 112 can be effectively increased.

[0064] 14 and 15, FIG. 14 is a simplified top view of a power module 100D according to another embodiment of the present disclosure, and FIG. 15 is a schematic cross-sectional view of the power module 100D along line E-E in FIG. 14 according to another embodiment of the present disclosure. Compared with the power module 100C, the power module 100D further includes at least one second isolation element 124 disposed on one side of the first isolation element 120 and extending along a second axis AX2.

[0065] As shown in FIG. 14, the width WT5 of the first isolation element 120 and the width WT6 of the second isolation element 124 are greater than 1 mm, and as shown in FIG. 15, the distance DS1 between the second isolation element 124 and the first isolation element 120 is greater than 1 mm.

[0066] In this embodiment, the power module 100D may further include at least one third isolation element 126, where the second isolation element 124 is located between the first isolation element 120 and the third isolation element 126, and the third isolation element 126 extends along the second axis AX2.

[0067] In this embodiment, the width WT7 of the third isolation element 126 is greater than 1 mm, and the distance DS2 between the third isolation element 126 and the second isolation element 124 is greater than 1 mm. In this embodiment, the distance DS2 may be equal to the distance DS1, but is not limited thereto. In another embodiment, the distance DS2 may be greater than the distance DS1.

[0068] 15, each of the second isolation element 124 and the third isolation element 126 can be a convex structure, and a width WT6 of the second isolation element 124 is different from a width WT7 of the third isolation element 126. For example, the width WT7 of the third isolation element 126 is greater than the width WT6 of the second isolation element 124.

[0069] Similarly, the second isolation element 124 and the third isolation element 126 are not limited to a convex structure. As shown in Fig. 16, Fig. 16 is a schematic cross-sectional view of a power module 100D according to another embodiment of the present disclosure. In this embodiment, each of the second isolation element 124 and the third isolation element 126 is a concave structure.

[0070] Based on the designs of the above-mentioned first isolation element 120, second isolation element 124, and third isolation element 126, the creepage distance between the outermost pin 106 and the bottom surface of the package body 112 can be effectively increased.

[0071] Similar to the previous embodiment, when the first isolation element 120, the second isolation element 124, and the third isolation element 126 have a convex structure, they are made of elastic materials. Therefore, when the power module 100D is connected to an external connector, the buffer function is effectively achieved, and the power module can be prevented from being damaged by excessive impact force.

[0072] In summary, the present disclosure provides a power module 100 having a substrate 102, a plurality of pins 106, and a package body 112. There is a gap SC between two adjacent pins of the plurality of pins 106, and at least one isolation element is disposed in the gap SC to increase the creepage distance between the two adjacent pins 106. The isolation element is a convex or concave structure, and the height and width of the convex or concave structure are 1 mm or more.

[0073] Therefore, based on the design of the present disclosure, the power module 100 can not only comply with safety regulations, but also shorten the distance between two adjacent pins 106, thereby reducing the overall size of the power module 100. In addition, the isolation element can be made of elastic material, so that when the power module 100 is connected to an external connector, the protruding isolation element can act as a buffer to prevent the power module 100 from being damaged by excessive impact force.

[0074] Although some embodiments of the present disclosure and their advantages have been described in detail, it should be understood that various changes, substitutions, and alterations can be made herein without departing from the spirit and scope of the present disclosure, as defined by the appended claims. For example, it will be readily understood by those skilled in the art that many of the features, functions, processes, and materials described herein can be modified without departing from the scope of the present disclosure. In addition, the scope of protection of the present disclosure is not limited to the processes, machines, manufactures, compositions of matter, apparatuses, methods, and steps in the specific embodiments described herein. Anyone with ordinary skill in the art can understand from the contents of the present disclosure the processes, machines, manufactures, compositions of matter, apparatuses, methods, and steps that are currently or will be developed in the future, as long as they perform substantially the same function or achieve substantially the same result as the embodiments described herein. Therefore, the scope of protection of the present invention includes the processes, machines, manufactures, compositions of matter, apparatuses, methods, and steps described above. [Explanation of symbols]

[0075] 100, 100A, 100B, 100C, 100D Power Module 102 Substrate 1020 Base material 1021 Conductive layer 1022 Thermally conductive layer 1022S 2nd metal surface 1024 Conductive part 1024S 1st metal surface 104 Semiconductor parts 106 pins 112 Package 112BS bottom 112US top surface 114 First separation element 1141 First convex structure 1142 Second convex structure 1143 1st concave structure 1144 Second concave structure 116 Second separation element 118 Third separation element 120 First separation element 121 First Strip Section 122 Second Strip Section 124 Second separation element 126 Third Isolation Element AX1 1st axis AX2 2nd axis AX3 3rd axis CS0 horizontal distance CS1 full length DS1 distance DS2 distance HT1 Height HT2 Depth HT3 Height HT4 Depth HX1 Height HX2 Height HX3 Depth HX4 Depth SC gap WT1~WT7 width WX1~WX4 width XX axis YY axis ZZ axis Line A-A Line B-B Line C-C Line D-D Line E-E

Claims

1. a substrate having a first metal surface; a semiconductor element disposed on the first metal surface; a plurality of pins extending from the first metal surface and configured to be electrically connected to the semiconductor device; and a package body configured to surround the first metal surface and the semiconductor element and to partially surround each of the pins; A power module having a gap between two adjacent pins, and an isolation element for increasing the creepage distance between the two adjacent pins is disposed in the gap.

2. The power module according to claim 1 , wherein the pins extend along a first axis, and when viewed along the first axis, the pins are arranged in a matrix.

3. 3. The power module of claim 2, wherein when viewed along the first axis, the isolation element includes a plurality of first isolation elements, each of which extends in a strip shape along a second axis, the second axis being perpendicular to the first axis.

4. 4. The power module of claim 3, wherein when viewed along the first axis, the isolation element further includes a plurality of second isolation elements, each of which extends in a strip shape along a third axis, the third axis being perpendicular to the first axis and the second axis.

5. The power module according to claim 4 , wherein the first isolation element is connected to the second isolation element, and the first isolation element and the second isolation element are disposed to cross each other.

6. The power module according to claim 5 , wherein each of the first isolation element and the second isolation element has a convex structure or a concave structure.

7. The power module according to claim 6 , wherein the width of the convex structure or the concave structure is 1 mm or more.

8. 5. The power module of claim 4, further comprising four third isolation elements arranged on the package body, the four third isolation elements forming a rectangle surrounding the pin, the first isolation element, and the second isolation element when viewed along the first axis.

9. 9. The power module of claim 8, wherein the first isolation element, the second isolation element, and the third isolation element are made of an elastic material, and the material of the packaging body is different from the material of the first isolation element, the second isolation element, and the third isolation element.

10. The power module according to claim 8 , wherein a width or height of the third isolation element is different from a width or height of the first isolation element or the second isolation element.

11. 2. The power module of claim 1, wherein the substrate further has a second metal surface configured to dissipate heat generated by the power module to an external environment, the first metal surface and the second metal surface being located on opposite sides of the substrate, and a portion of the second metal surface being exposed from the package body.

12. a substrate having a first metal surface; a semiconductor element disposed on the first metal surface; a plurality of pins extending from the first metal surface and configured to be electrically connected to the semiconductor device; a package body configured to surround the first metal surface and the semiconductor element and to partially surround each of the pins; and A power module including a first isolation element disposed on the package body and surrounding the pin.

13. 13. The power module of claim 12, wherein the pin extends along a first axis, and when viewed along the first axis, the first isolation element has two first strip portions and two second strip portions, the two first strip portions extending along a second axis and the two second strip portions extending along a third axis, the first axis, the second axis, and the third axis being perpendicular to each other.

14. The power module according to claim 13 , wherein each of the two first strip portions and the two second strip portions has a convex structure or a concave structure.

15. 14. The power module of claim 13, further comprising a second isolation element disposed on one side of the first isolation element, the second isolation element extending along the second axis.

16. 16. The power module of claim 15, wherein a width of the first isolation element and the second isolation element is greater than 1 mm, and a distance between the second isolation element and the first isolation element is greater than 1 mm.

17. 17. The power module of claim 16, further comprising a third isolation element, the second isolation element being located between the first isolation element and the third isolation element, the third isolation element extending along the second axis.

18. 20. The power module of claim 17, wherein a width of the third isolation element is greater than 1 mm and a distance between the third isolation element and the second isolation element is greater than 1 mm.

19. The power module according to claim 17 , wherein each of the second isolation element and the third isolation element has a convex structure or a concave structure, and a width of the second isolation element is different from a width of the third isolation element.

20. 20. The power module of claim 17, wherein the first isolation element, the second isolation element, and the third isolation element are made of a resilient material.

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