Sensor module and electronic apparatus

Abstract

To provide a sensor module that can improve the effectiveness and reliability in increasing the accuracy of detection data.SOLUTION: A sensor module 100 comprises: a substrate 21; a substrate 231 arranged on a side of a second side e2 of the substrate 21; a substrate 232 arranged on a side of the second side e2 of the substrate 21; a flexible substrate 421 electrically connecting the substrate 21 and the substrate 231 to each other; a flexible substrate 422 electrically connecting the substrate 21 and the substrate 232 to each other; a sensor device 12c provided on the substrate 231 and detecting the angular velocity around a Y-axis; and a sensor device 12d provided on the substrate 232 and detecting the angular velocity around the Y-axis.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a sensor module and an electronic device.

Background Art

[0002] A sensor module that attempts to improve the accuracy of X-axis angular velocity data by mounting two X-axis angular velocity sensor devices on the side surface of the same substrate is described in Patent Document 1.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In a sensor module including a plurality of sensor devices with respect to one detection axis, further improvements are desired in the effectiveness and reliability of accuracy improvement.

Means for Solving the Problems

[0005] A sensor module according to an aspect of the present application includes a first substrate, a second substrate disposed on one side of the first substrate, a third substrate disposed on the one side of the first substrate, a first connection portion that electrically connects the first substrate and the second substrate, a second connection portion that electrically connects the first substrate and the third substrate, a first sensor device provided on the second substrate and configured to detect a physical quantity of a first axis, and a second sensor device provided on the third substrate and configured to detect the physical quantity of the first axis.

[0006] An electronic device according to an aspect of the present application includes the sensor module described above.

Brief Description of the Drawings

[0007]

Fig. 1

Fig. 2

Fig. 3

Fig. 4

Fig. 5

Fig. 6

Fig. 7A

Fig. 7B

Fig. 8

Fig. 9

Fig. 10

MODE FOR CARRYING OUT THE INVENTION

[0008] In each drawing, for ease of viewing each component, the scale of the dimensions may be shown differently depending on the component. In each drawing, the X-axis, Y-axis, and Z-axis are orthogonal to each other. In the following description, the “X-axis direction” shall indicate a direction parallel to the X-axis, the “Y-axis direction” shall indicate a direction parallel to the Y-axis, and the “Z-axis direction” shall indicate a direction parallel to the Z-axis. In the following description, the “plus side” shall indicate the tip side in the arrow direction of each axis of XYZ, and the “minus side” shall indicate the end side in the arrow direction. In the following description, “plan view” shall mean viewing from the Z-axis direction with respect to the plane including the X-axis and Y-axis, and “cross-sectional view” shall mean viewing from the X-axis direction or Y-axis direction with respect to the cross-section including the Z-axis.

[0009] In the following description, the description of the upper surface of a certain component shall indicate the surface on the plus side in the Z-axis direction of the component. For example, the "upper surface of the substrate" shall indicate the surface on the plus side in the Z-axis direction of the substrate. In the following description, the description of the lower surface of a certain component shall indicate the surface on the minus side in the Z-axis direction of the component. In the following description, the description of the left side surface of a certain component shall indicate the surface on the minus side in the X-axis direction of the component. In the following description, the description of the right side surface of a certain component shall indicate the surface on the plus side in the X-axis direction of the component.

[0010] 1. Embodiment 1 Figures 1 to 8 show the sensor module 100 according to Embodiment 1. Figure 1 is a perspective view showing a state where the sensor module 100 is fixed to a mounted surface 71 such as an automobile. Figure 2 is a perspective view showing the state of the sensor module 100 in Figure 1 as viewed from the side of the mounted surface 71. Figure 3 is an exploded perspective view of the sensor module 100. Figure 4 is a developed view of the substrate unit 20. Figure 5 is a developed view of the substrate unit 20. Figure 6 is a perspective view of the fixing frame 60. Figure 7A is a cross-sectional view taken along line A-A in Figure 4, showing an example of the sensor device 11b. Figure 7B is a cross-sectional view taken along line A-A in Figure 4, showing another example of the sensor device 11b. Figure 8 is an explanatory view showing the internal configuration of the sensor device.

[0011] In the present embodiment, the sensor module 100 is an inertial measurement unit (IMU) that detects the posture and behavior of a mounted device such as an automobile or a robot. Here, the mounted device can be referred to as a moving body. The behavior can be referred to as inertial momentum.

[0012] As shown in Figure 1, the sensor module 100 has an outer case 50 with a substantially square planar shape and a rectangular parallelepiped three-dimensional shape. The size of the sensor module 100 is, for example, a square side length of about 24 mm and a thickness of about 10 mm.

[0013] Inside the outer case 50, a substrate unit 20 on which a plurality of sensor devices are mounted is housed. The substrate unit 20 will be described later. On the lower surface 58 of the outer case 50, screw holes 52 are formed. By passing screws 70 through these two screw holes 52, the sensor module 100 is fixed to and used on the mounting surface 71 of a mounting device such as an automobile.

[0014] As shown in FIG. 2, an inner case 30 is housed inside the upper surface 57 of the outer case 50. An opening 31 is formed on the upper surface 34 of the inner case 30. Inside the opening 31, a plug-type connector 15 is arranged.

[0015] The connector 15 has a plurality of pins. A socket-type connector (not shown) is connected to the connector 15 from the mounting device. The sensor module 100 is supplied with power from the power circuit of the mounting device via the connector 15 and transmits electrical signals such as detection data to the mounting device.

[0016] 1.1. Configuration of the Sensor Module FIG. 3 is an exploded perspective view of the sensor module 100 shown in FIG. 2. As shown in FIG. 3, the sensor module 100 is composed of an outer case 50 and a sensor unit 10 housed in the outer case 50. The sensor unit 10 is composed of an inner case 30 and a substrate unit 20 housed in the inner case 30.

[0017] The outer case 50 is a pedestal made by cutting aluminum into a box shape. The material is not limited to aluminum, and other metals such as zinc and stainless steel, resins, or composite materials of metal and resin may also be used.

[0018] The outer case 50 is a box shape without a lid, and its inner side 53 is an internal space surrounded by a bottom surface 55 and side walls 54. Inside the inner space of the outer case 50, the sensor unit 10 is housed via a joining member.

[0019] The sensor unit 10 is composed of an inner case 30 and a substrate unit 20. The inner case 30 is a member that holds the substrate unit 20 and has a shape that fits inside the inner side 53 of the outer case 50. In plan view, the inner case 30 is an octagon with the corners of the four vertices of a square chamfered, and an opening 31 which is a through hole and a recess 33 are formed on its upper surface.

[0020] The height of the side wall 32 of the inner case 30 is lower than the height of the side wall 54 of the outer case 50. As shown in FIG. 2, the upper surface 34 of the inner case 30 is lower than the upper surface 57 of the outer case 50. Although not shown, guide pins and support surfaces for positioning the substrate unit 20 are formed inside the inner case 30. The substrate unit 20 is positioned by the guide pins and support surfaces and is fixed inside the inner case 30 by a joining member.

[0021] 1.2. Configuration of the Substrate Unit FIG. 4 is a plan view of the substrate unit 20 in a deployed state as viewed from the minus side in the Z-axis direction. FIG. 5 is a plan view of the substrate unit 20 in a deployed state as viewed from the plus side in the Z-axis direction. As shown in FIGS. 3 and 6, the substrate unit 20 is used in an assembled state. In this embodiment, the substrate unit 20 is supported by a fixed frame 60 and assembled into a substantially rectangular parallelepiped shape.

[0022] As shown in FIGS. 4 and 5, in this embodiment, the substrate unit 20 includes substrates 21, 221, 222, 231, 232, 241, 242, 251, 252, 261, 262, 27, flexible substrates 411, 412, 421, 422, 431, 432, 441, 442, 451, 452, 46, sensor devices 11a, 11b, 11c, 11d, 12a, 12b, 12c, 12d, 13a, 13b, 13c, 13d, an arithmetic circuit 14, a connector 15, a memory 16, a power supply circuit 17, and a temperature sensor 18.

[0023] The substrates 21, 221, 222, 231, 232, 241, 242, 251, 252, 261, 262, 27 are rigid substrates called rigid boards. Specifically, they are glass epoxy substrates. The substrates 21, 221, 222, 231, 232, 241, 242, 251, 252, 261, 262, 27 may be rigid boards such as composite substrates and ceramic substrates. The substrates 21, 221, 222, 231, 232, 241, 242, 251, 252, 261, 262, 27 may have either a multilayer or a single-layer structure.

[0024] The flexible substrates 411, 412, 421, 422, 431, 432, 441, 442, 451, 452, 46 are softer substrates than the substrates 21, 221, 222, 231, 232, 241, 242, 251, 252, 261, 262, 27. The flexible substrates are disposed between the rigid substrates and electrically connect the rigid substrates. In this embodiment, the flexible substrates are used to suppress the occurrence of mechanical or electrical interference generated between a plurality of sensor devices.

[0025] The flexible substrates 411, 412, 421, 422, 431, 432, 441, 442, 451, 452, 46 may be flexible wiring cables, wiring cords, or wires such as flat cables and flat cords.

[0026] The substrates 21, 221, 222, 231, 232, 241, 242, 251, 252, 261, 262, 27 and the flexible substrates 411, 412, 421, 422, 431, 432, 441, 442, 451, 452, 46 may be rigid-flexible substrates. When a rigid-flexible substrate is adopted, each of the plurality of rigid portions corresponds to the substrates 21, 221, 222, 231, 232, 241, 242, 251, 252, 261, 262, 27 of the present embodiment, and each of the plurality of flexible portions corresponds to the flexible substrates 411, 412, 421, 422, 431, 432, 441, 442, 451, 452, 46 of the present embodiment.

[0027] On the upper surface of the substrate 21, an arithmetic circuit 14, a connector 15, a memory 16, a power supply circuit 17, and a temperature sensor 18 are mounted. Other electronic components are mounted on the upper surface of the substrate 21.

[0028] The arithmetic circuit 14 is a controller that is primary with respect to the sensor devices 11a, 11b, 11c, 11d, 12a, 12b, 12c, 12d, 13a, 13b, 13c, 13d. The arithmetic circuit 14 is an integrated circuit device and can be realized by a processor such as an MPU (Micro Processor Unit) or a CPU (central processing unit).

[0029] The arithmetic circuit 14 receives the detection data output from the sensor devices 11a, 11b, 11c, 11d, 12a, 12b, 12c, 12d, 13a, 13b, 13c, 13d, performs various processes, and transmits the output data to the outside via the connector 15. In the present embodiment, the arithmetic circuit 14 is an example of a processing unit.

[0030] The various processes performed by the arithmetic circuit 14 include: a process of obtaining the average value of the detection data of the angular velocity about the Z-axis from the sensor devices 11a, 11b, 11c, and 11d; a process of obtaining the average value of the detection data of the angular velocity about the Y-axis from the sensor devices 12a, 12b, 12c, and 12d; a process of obtaining the average value of the detection data of the angular velocity about the X-axis from the sensor devices 13a, 13b, 13c, and 13d; a process of performing temperature correction, zero-point correction, etc. on the obtained average values; a sensitivity adjustment process; a filter process; and a process of outputting the processed data from the connector 15, etc.

[0031] The connector 15 is a plug-type connector and includes two rows of connection terminals arranged at equal pitches in the X-axis direction. In the present embodiment, the connector 15 has 20 connection terminals with 10 pins in one row, but the number of terminals may be appropriately changed according to the design specifications.

[0032] The memory 16 stores programs for executing various processes performed by the arithmetic circuit 14, programs for incorporating the processed detection data into packet data, and data necessary for the execution of the programs, for example, table data used for temperature correction processing, etc.

[0033] The power supply circuit 17 is supplied with power from the device to be worn and supplies the necessary power to the sensor devices 11a, 11b, 11c, 11d, 12a, 12b, 12c, 12d, 13a, 13b, 13c, 13d, the arithmetic circuit 14, etc. The temperature sensor 18 outputs temperature information used for temperature correction processing to the arithmetic circuit 14.

[0034] 1.3. Arrangement of the substrate on which the sensor device is mounted 1.3.1. Arrangement of the substrate on which the Y-axis angular velocity sensor is mounted The sensor devices 12a, 12b, 12c, and 12d are Y-axis angular velocity sensors that detect the angular velocity about the Y-axis, respectively.

[0035] The sensor module 100 includes four Y-axis angular velocity sensors composed of sensor devices 12a, 12b, 12c, and 12d, and the sensor devices 12a, 12b, 12c, and 12d are separately mounted on four substrates 221, 222, 231, and 232.

[0036] The substrate 221 and the substrate 222 are arranged side by side along the first side e1 on the first side e1 side of the substrate 21. The substrate 231 and the substrate 232 are arranged side by side along the second side e2 on the second side e2 side opposite to the first side e1.

[0037] In this embodiment, the sensor devices 12a, 12b, 12c, and 12d are vibration gyro sensors that use quartz as a vibrator and detect the angular velocity from the Coriolis force applied to the vibrator. The drive frequencies of the vibrators of the sensor devices 12a, 12b, 12c, and 12d are all the same. The vibrator is not limited to quartz. For example, the vibrator may be a MEMS (Micro Electro Mechanical Systems) vibrator formed using a silicon substrate.

[0038] The sensor module 100 of this embodiment realizes the high-precision of the Y-axis angular velocity data by the arithmetic circuit 14 calculating the average value and the like, which are the statistical quantities of the angular velocity data, based on the Y-axis angular velocity data from the sensor devices 12a, 12b, 12c, and 12d.

[0039] The sensor device 12a is mounted on the substrate 221. The substrate 221 is connected to the first side e1 side of the substrate 21 via the flexible substrate 411. One end of the flexible substrate 411 is connected to the first side e1 of the substrate 21, and the other end is connected to the first side f1 of the substrate 221, electrically connecting the substrate 21 and the substrate 221.

[0040] The sensor device 12b is mounted on the substrate 222. The substrate 222 is connected to the first side e1 side of the substrate 21 via the flexible substrate 412. One end of the flexible substrate 412 is connected to the first side e1 of the substrate 21, and the other end is connected to the first side f2 of the substrate 222, electrically connecting the substrate 21 and the substrate 222.

[0041] The sensor device 12c is mounted on the substrate 231. The substrate 231 is connected to the second side e2 side of the substrate 21 via the flexible substrate 421. One end of the flexible substrate 421 is connected to the first side f3 of the substrate 231, and the other end is connected to the second side e2 of the substrate 21, electrically connecting the substrate 21 and the substrate 231.

[0042] The sensor device 12d is mounted on the substrate 232. The substrate 232 is connected to the second side e2 side of the substrate 21 via the flexible substrate 422. One end of the flexible substrate 422 is connected to the first side f4 of the substrate 232, and the other end is connected to the second side e2 of the substrate 21, electrically connecting the substrate 21 and the substrate 232.

[0043] The substrate 221 and / or the substrate 222 may be arranged on the second side e2 side of the substrate 21. In this case, the flexible substrate 411 and / or the flexible substrate 412 are connected to the second side e2 side of the substrate 21. The substrate 221 and the substrate 222 are arranged side by side along the first side e1 on the first side e1 side of the substrate 21, and may also be arranged side by side when viewed in the Z-axis direction. The number of Y-axis angular velocity sensors is not limited to four. For example, it may be two, three, or five or more.

[0044] Thus, in this embodiment, the sensor devices 12a, 12b, 12c, 12d for detecting the angular velocity about the Y-axis are respectively mounted on different substrates 221, 222, 231, 232 and arranged on the first side e1 side and / or the second side e2 side of the substrate 21. Therefore, even if the sensor devices 12a, 12b, 12c, and 12d of the present embodiment are operated simultaneously, the occurrence of mechanical or electrical interference between the sensor devices can be suppressed. Furthermore, since the sensor module 100 of the present embodiment arranges two or more substrates 221, 222, 231, and 232 on one side of the substrate 21, a plurality of substrates on which sensor devices are mounted can be efficiently arranged in the internal space, thereby suppressing an increase in the size of the sensor module 100. Furthermore, since the sensor module 100 of the present embodiment separately arranges a plurality of substrates on which sensor devices are mounted on the first side e1 side and the second side e2 side of the substrate 21, the plurality of substrates can be arranged in the internal space in a well-balanced manner, thereby further suppressing an increase in the size of the sensor module 100.

[0045] In the present embodiment, the substrate 21 is an example of a first substrate, and the second side e2 of the substrate 21 is an example of one side of the substrate 21. The substrate 231 is an example of a second substrate, and the substrate 232 is an example of a third substrate. The flexible substrate 421 is an example of a first connection portion and a first flexible substrate, and the flexible substrate 422 is an example of a second connection portion and a second flexible substrate. The sensor device 12c is an example of a first sensor device, and the sensor device 12d is an example of a second sensor device. The angular velocity around the Y axis is an example of a physical quantity of a first axis.

[0046] 1.3.2 Arrangement of Substrate Mounted with X-Axis Angular Velocity Sensor The sensor devices 13a, 13b, 13c, and 13d are X-axis angular velocity sensors that respectively detect the angular velocity around the X axis.

[0047] The sensor module 100 includes four X-axis angular velocity sensors composed of the sensor devices 13a, 13b, 13c, and 13d, and the sensor devices 13a, 13b, 13c, and 13d are separately mounted on four substrates 241, 242, 251, and 252.

[0048] The substrate 241 and the substrate 242 are arranged side by side along the third side e3 on the third side e3 side of the substrate 21. The substrate 251 and the substrate 252 are arranged side by side along the fourth side e4 on the fourth side e4 side facing the third side e3.

[0049] In the present embodiment, the sensor devices 13a, 13b, 13c, and 13d are vibration gyro sensors using quartz as a vibrator. In the present embodiment, the drive frequencies of the vibrators of the sensor devices 13a, 13b, 13c, and 13d are all the same.

[0050] The sensor module 100 of the present embodiment realizes high-precision X-axis angular velocity data by the arithmetic circuit 14 calculating the average value and the like, which are statistical amounts of the angular velocity data, based on the X-axis angular velocity data from the sensor devices 13a, 13b, 13c, and 13d.

[0051] The sensor device 13a is mounted on the substrate 241. The substrate 241 is connected to the third side e3 side of the substrate 21 via the flexible substrate 431. One end of the flexible substrate 431 is connected to the third side e3 of the substrate 21, and the other end is connected to the first side g1 of the substrate 241, electrically connecting the substrate 21 and the substrate 241.

[0052] The sensor device 13b is mounted on the substrate 242. The substrate 242 is connected to the third side e3 side of the substrate 21 via the flexible substrate 432. One end of the flexible substrate 432 is connected to the third side e3 of the substrate 21, and the other end is connected to the first side g2 of the substrate 242, electrically connecting the substrate 21 and the substrate 242.

[0053] The sensor device 13c is mounted on the substrate 251. The substrate 251 is connected to the fourth side e4 side of the substrate 21 via the flexible substrate 441. The flexible substrate 441 has one end connected to the fourth side e4 of the substrate 21 and the other end connected to the first side g3 of the substrate 251, electrically connecting the substrate 21 and the substrate 251.

[0054] The sensor device 13d is mounted on the substrate 252. The substrate 252 is connected to the fourth side e4 side of the substrate 21 via the flexible substrate 442. The flexible substrate 442 has one end connected to the fourth side e4 of the substrate 21 and the other end connected to the first side g4 of the substrate 252, electrically connecting the substrate 21 and the substrate 252.

[0055] The substrate 241 and / or the substrate 242 may be arranged on the fourth side e4 side of the substrate 21. In this case, the flexible substrate 431 and / or the flexible substrate 432 are connected to the fourth side e4 side of the substrate 21. The substrate 241 and the substrate 242 are arranged side by side along the third side e3 on the third side e3 side of the substrate 21, and may also be arranged side by side when viewed in the Z-axis direction. The number of X-axis angular velocity sensors is not limited to four. For example, it may be two, three, or five or more.

[0056] Thus, in this embodiment, the sensor devices 13a, 13b, 13c, 13d for detecting the angular velocity about the X-axis are respectively mounted on different substrates 241, 242, 251, 252 and are arranged on the third side e3 side and / or the fourth side e4 side of the substrate 21. Therefore, the sensor module 100 of this embodiment can suppress the occurrence of mechanical or electrical interference generated between the sensor devices even when the sensor devices 13a, 13b, 13c, 13d are operated simultaneously. Furthermore, since the sensor module 100 of this embodiment arranges two or more substrates 241, 242, 251, 252 on one side of the substrate 21, a plurality of substrates on which the sensor devices are mounted can be efficiently arranged in the internal space, thereby suppressing an increase in the size of the sensor module 100. Furthermore, since the sensor module 100 of the present embodiment arranges a plurality of substrates mounted with sensor devices separately on the third side e3 side and the fourth side e4 side of the substrate 21, the plurality of substrates can be arranged in the internal space in a well-balanced manner, thereby further suppressing an increase in the size of the sensor module 100.

[0057] 1.3.3 Arrangement of Substrate Mounted with Z-Axis Angular Velocity Sensor The sensor devices 11a, 11b, 11c, and 11d are Z-axis angular velocity sensors that detect the angular velocity around the Z-axis, respectively. The sensor devices 11a, 11b, 11c, and 11d are mounted on different substrates 21, 261, 262, and 27, respectively.

[0058] In the present embodiment, the sensor devices 11a, 11b, 11c, and 11d are vibrating gyro sensors that use a crystal as a vibrator and detect the angular velocity from the Coriolis force applied to the vibrator. In the present embodiment, the driving frequencies of the vibrators of the sensor devices 11a, 11b, 11c, and 11d are all the same.

[0059] The sensor module 100 of the present embodiment realizes high-precision Z-axis angular velocity data by the arithmetic circuit 14 calculating statistical quantities such as the average value of the angular velocity data based on the Z-axis angular velocity data from the sensor devices 11a, 11b, 11c, and 11d.

[0060] The sensor device 11a is mounted on the substrate 21. The sensor device 11b is mounted on the substrate 27. The substrate 27 is connected to the first side e1 side of the substrate 21 via the flexible substrate 46, the substrate 221, and the flexible substrate 411. One end of the flexible substrate 46 is connected to the second side f7 of the substrate 221, and the other end is connected to the first side h3 of the substrate 27, electrically connecting the substrate 221 and the substrate 27. In other words, the flexible substrate 46 electrically connects the substrate 21 and the substrate 27 via the substrate 221 and the flexible substrate 411.

[0061] The sensor device 11c is mounted on the substrate 261. The substrate 261 is connected to the second side e2 side of the substrate 21 via the flexible substrate 451, the substrate 231, and the flexible substrate 421. One end of the flexible substrate 451 is connected to the second side f5 of the substrate 231, and the other end is connected to the first side h1 of the substrate 261, electrically connecting the substrate 231 and the substrate 261. In other words, the flexible substrate 451 electrically connects the substrate 21 and the substrate 261 via the substrate 231 and the flexible substrate 421.

[0062] The sensor device 11d is mounted on the substrate 262. The substrate 262 is connected to the second side e2 side of the substrate 21 via the flexible substrate 452, the substrate 232, and the flexible substrate 422. One end of the flexible substrate 452 is connected to the second side f6 of the substrate 232, and the other end is connected to the first side h2 of the substrate 262, electrically connecting the substrate 232 and the substrate 262. In other words, the flexible substrate 452 electrically connects the substrate 21 and the substrate 262 via the substrate 232 and the flexible substrate 422.

[0063] The substrate 261 and the substrate 262 are arranged side by side along the second side e2 on the second side e2 side of the substrate 21, and may be arranged side by side when viewed in the Z-axis direction. The substrate 261 and / or the substrate 262 may be arranged on the first side e1 side of the substrate 21. In this case, the flexible substrate 451 is connected to, for example, the second side f7 of the substrate 221, electrically connecting the substrate 221 and the substrate 261, and the flexible substrate 452 is connected to, for example, the second side f7 of the substrate 221, electrically connecting the substrate 221 and the substrate 262. The substrate 261, the substrate 262, and / or the substrate 27 may be arranged on the third side e3 side or the fourth side e4 side of the substrate 21. The number of Z-axis angular velocity sensors is not limited to four. For example, it may be two, three, or five or more.

[0064] Thus, in this embodiment, the sensor devices 11a, 11b, 11c, 11d that detect the angular velocity around the Z axis are mounted on different substrates 21, 261, 262, 27, respectively, and are disposed on the substrate 21, on the first side e1 of the substrate 21, or on the second side e2 of the substrate 21. Therefore, even when the sensor module 100 of this embodiment operates the sensor devices 11a, 11b, 11c, 11d simultaneously, it is possible to suppress the occurrence of mechanical or electrical interference generated between the sensor devices. Furthermore, since the sensor module 100 of this embodiment disposes two or more substrates 261, 262, 27 on one side of the substrate 21, a plurality of substrates on which the sensor devices are mounted can be efficiently arranged in the internal space, thereby suppressing an increase in the size of the sensor module 100. Furthermore, since the sensor module 100 of this embodiment divides and disposes a plurality of substrates on which the sensor devices are mounted on the first side e1 and the second side e2 of the substrate 21, the plurality of substrates can be arranged in the internal space in a well-balanced manner, thereby further suppressing an increase in the size of the sensor module 100.

[0065] In this embodiment, the substrate 261 is an example of the fourth substrate, and the substrate 262 is an example of the fifth substrate. The flexible substrate 451 is an example of the third connection portion and the third flexible substrate, and the flexible substrate 452 is an example of the fourth connection portion and the fourth flexible substrate. The sensor device 11c is an example of the third sensor device, and the sensor device 11d is an example of the fourth sensor device. The angular velocity around the Z axis is an example of the physical quantity of the second axis.

[0066] 1.4. Regarding the fixed frame FIG. 6 is a perspective view of the fixed frame 60, showing the fixed frame 60 with the substrate unit 20 attached. In FIG. 6, the substrate 21 is omitted for the sake of explanation. The fixing frame 60 has an octagonal cylindrical shape in plan view, and openings 68 are provided in portions where the substrates 21, 221, 222, 231, 232, 241, 242, 251, 252, 261, 262, 27 are attached, respectively. The openings 68 function as escape spaces for the sensor devices 11a, 11b, 11c, 11d, 12a, 12b, 12c, 12d, 13a, 13b, 13c, 13d.

[0067] The substrates 21, 221, 222, 231, 232, 241, 242, 251, 252, 261, 262, 27 are attached to the fixing frame 60 such that the sensor devices 11a, 11b, 11c, 11d, 12a, 12b, 12c, 12d, 13a, 13b, 13c, 13d are on the inner side.

[0068] Therefore, since the sensor devices 11a, 11b, 11c, 11d, 12a, 12b, 12c, 12d, 13a, 13b, 13c, 13d do not protrude to the outside, the size of the substrate unit 20 can be reduced, and miniaturization of the sensor module 100 can be realized.

[0069] The fixing frame 60 is formed of, for example, resin. The elastic modulus of the fixing frame 60 is preferably smaller than that of the substrates 21, 221, 222, 231, 232, 241, 242, 251, 252, 261, 262, 27 and larger than that of the flexible substrates 411, 412, 421, 422, 431, 432, 441, 442, 451, 452, 46.

[0070] By making the elastic modulus of the fixing frame 60 smaller than that of the substrates 21, 221, 222, 231, 232, 241, 242, 251, 252, 261, 262, 27, mechanical or electrical interference caused by operating the sensor devices 11a, 11b, 11c, 11d, 12a, 12b, 12c, 12d, 13a, 13b, 13c, 13d simultaneously can be suppressed.

[0071] By making the elastic modulus of the fixed frame 60 larger than that of the flexible substrates 411, 412, 421, 422, 431, 432, 441, 442, 451, 452, 46, the substrates 21, 221, 222, 231, 232, 241, 242, 251, 252, 261, 262, 27 can be fixed at desired positions corresponding to the detection axes of the sensor devices to be mounted, and displacement from the desired positions can be suppressed.

[0072] On the upper surface 61 of the fixed frame 60, a substrate 21 (not shown in the figure) is fixed, and on the lower surface 62, the substrates 261, 262, 27 are fixed. In other words, sensor devices for detecting the angular velocity around the Z-axis are mounted on the substrates 21, 261, 262, 27 respectively, and the substrate 21 and the substrates 261, 262, 27 are arranged to face each other.

[0073] On the side surface 63 of the fixed frame 60, the substrates 221 and 222 are fixed, and on the side surface 64, the substrates 231 and 232 are fixed. In other words, sensor devices for detecting the angular velocity around the Y-axis are mounted on the substrates 221, 222, 231, 232 respectively, and the substrates 221, 222, 231, 232 are arranged on the opposing side surfaces 63 and 64.

[0074] On the side surface 65 of the fixed frame 60, the substrates 241 and 242 are fixed, and on the side surface 66, the substrates 251 and 252 are fixed. In other words, sensor devices for detecting the angular velocity around the X-axis are mounted on the substrates 241, 242, 251, 252 respectively, and the substrates 241, 242, 251, 252 are arranged on the opposing side surfaces 65 and 66.

[0075] In this embodiment, the substrate unit 20 is fixed to the fixed frame 60 during assembly, but the substrate unit 20 is not limited to the form using the fixed frame 60. For example, the substrate unit 20 may be directly fixed to the inner case 30 without using the fixed frame 60.

[0076] 1.5. Regarding the sensor device 1.5.1. Packaging Figures 7A and 7B are cross-sectional views for explaining the packaging of the sensor device 11b. In the present embodiment, the sensor device 11b in FIG. 7A is a physical quantity sensor that detects an angular velocity having the Z-axis as a detection axis. The sensor device 11b in FIG. 7B is a composite physical quantity sensor that detects an angular velocity having the Z-axis as a detection axis and an acceleration having the Z-axis as a detection axis.

[0077] As shown in FIGS. 7A and 7B, the sensor device 11b includes a package 7, a sensor element 3 and a circuit element 4 housed in the package 7, or sensor elements 3a, 3b and a circuit element 4. Although not shown, the sensor devices 11a, 11c, 11d, 12a, 12b, 12c, 12d, 13a, 13b, 13c, 13d also have the same configuration as the sensor device 11b.

[0078] The package 7 includes a base 5 having a recess opening on the upper surface, and a lid 6 joined to the upper surface of the base 5 via a joining member so as to close the opening of the recess. An internal space S is formed inside the package 7 by the recess.

[0079] The package 7 is, for example, a ceramic package. The base 5 is made of ceramics such as alumina, and the lid 6 is made of ceramics such as alumina or a metal material such as kovar.

[0080] The sensor device 11b in FIG. 7A houses the sensor element 3 and the circuit element 4 in the internal space S. The sensor element 3 is an angular velocity sensor that detects an angular velocity around the Z-axis, and includes a vibrator 1 and a support substrate 2. The vibrator 1 is a crystal oscillator. The circuit element 4 includes a detection circuit and the like described later.

[0081] The internal space S is airtight and is in a reduced pressure state, preferably a state closer to a vacuum state. Thereby, the vibration characteristics of the vibrator 1 are improved. However, the atmosphere of the internal space S is not particularly limited.

[0082] In the internal space S, the vibrator 1, the support substrate 2, and the circuit element 4 are arranged so as to overlap each other in a plan view. The planar area expansion of the package 7 in the direction along the X-axis and / or the Y-axis can be suppressed, and miniaturization can be achieved.

[0083] A plurality of internal terminals 8a, 8b are provided in the recess of the base 5, and a plurality of external terminals 8c are provided on the lower surface of the base 5. These internal terminals 8a, 8b and external terminals 8c are electrically connected to wirings (not shown) formed in the base 5 and the substrate 27. The internal terminal 8a is electrically connected to the sensor element 3 via a conductive bonding member, and the internal terminal 8b is electrically connected to the circuit element 4 via a bonding wire 9.

[0084] The sensor device 11b in FIG. 7B houses the sensor elements 3a, 3b and the circuit element 4 in the internal space S. The sensor element 3a is an angular velocity sensor that detects the angular velocity around the Z-axis. Similar to the sensor element 3, it includes a vibrator that bends and vibrates, and detects the angular velocity using the Coriolis force.

[0085] The sensor element 3b is an acceleration sensor that detects the acceleration in the Z-axis direction. The sensor element 3b includes a crystal oscillator and detects the acceleration using the change in the oscillation frequency of the crystal oscillator. The sensor element 3b may be configured to include a silicon MEMS having comb-shaped fixed electrodes and movable electrodes and detect the acceleration using the change in the capacitance formed therebetween.

[0086] In the form shown in FIG. 7B, the sensor device 11b includes an angular velocity sensor that detects the angular velocity around the Z-axis and an acceleration sensor that detects the acceleration in the Z-axis direction, but the sensor device 11b is not limited to this configuration. For example, the sensor device 11b may include, in addition to the sensor elements 3a, 3b, an angular velocity sensor element that detects the angular velocity around the X-axis and / or an angular velocity sensor element that detects the angular velocity around the Y-axis. For example, in addition to the sensor elements 3a and 3b, the sensor device 11b may include an acceleration sensor element that detects acceleration in the X-axis direction and / or an acceleration sensor element that detects acceleration in the Y-axis direction. For example, the sensor element 3a may be a three-axis angular velocity sensor that detects angular velocity around each of the X, Y, and Z axes. For example, the sensor element 3b may be a three-axis acceleration sensor that detects acceleration in each of the X, Y, and Z axis directions. For example, the sensor element 3b may be an angular velocity sensor that detects angular velocity around the Y-axis and / or the X-axis, or a three-axis angular velocity sensor that detects angular velocity around each of the X, Y, and Z axes. For example, the sensor element 3a may be a three-axis angular velocity sensor that detects angular velocity around each of the X, Y, and Z axes, and the sensor element 3b may be a three-axis acceleration sensor that detects acceleration in each of the X, Y, and Z axis directions. In other words, the sensor device 11b may be a three-axis angular velocity sensor, a three-axis acceleration sensor, or a 6DoF (Six degrees of freedom) sensor.

[0087] When a ceramic package is used for the package 7, the package 7 can be regarded as a rigid substrate. In this case, the sensor elements 3, 3a, and 3b can be regarded as the sensor device 11b. When a ceramic package is used for the package 7, the package 7 may be configured to be directly mounted on the flexible substrate 46 without passing through the substrate 27.

[0088] 1.5.2. Configuration of Sensor Element and Circuit Element FIG. 8 shows a detailed configuration example of the sensor element 3 and the circuit element 4 of the sensor device 11b shown in FIG. 7A. The sensor devices 11a, 11c, 11d, 12a, 12b, 12c, 12d, 13a, 13b, 13c, and 13d also have a similar configuration.

[0089] The sensor device 11b includes a sensor element 3 and a circuit element 4. The sensor element 3 includes the vibrator 1, and the circuit element 4 includes the drive circuit 81 and the detection circuit 82.

[0090] The drive circuit 81 can include an amplifier circuit that inputs the feedback signal DG from the vibrator 1 and performs signal amplification, an AGC (Automatic Gain Control) circuit that performs automatic gain control, an output circuit that outputs the drive signal DS to the vibrator 1, and the like. The AGC circuit automatically adjusts the gain variably so that the amplitude of the feedback signal DG from the vibrator 1 becomes constant. The output circuit outputs, for example, a rectangular-wave drive signal DS to the vibrator 1.

[0091] The detection circuit 82 can include an amplifier circuit, a synchronous detection circuit, an A / D conversion circuit, etc. The amplifier circuit inputs the detection signals S1, S2 from the vibrator 1 and performs charge-voltage conversion and signal amplification of the differential detection signals S1, S2. The synchronous detection circuit performs synchronous detection for extracting a desired wave using the synchronous signal from the drive circuit 81. The A / D conversion circuit converts the analog detection signals S1, S2 after synchronous detection into digital detection data D1 and outputs it to the arithmetic circuit 14.

[0092] The arithmetic circuit 14 performs various processes such as temperature correction, zero-point correction, sensitivity adjustment, and filter processing on the detection data D1, and outputs the processed detection data D2 to the outside via the connector 15.

[0093] In the present embodiment, the vibrator 1 is a vibrator having a double-T structure. As the vibrator 1, a tuning fork type or H type vibrator may be used. The vibrator 1 has drive arms 98a, 98b, 98c, 98d, detection arms 99a, 99b, a base 91, and connecting arms 92a, 92b.

[0094] The base 91 has a rectangular shape, and detection arm 99a, detection arm 99b, connecting arm 92a, and connecting arm 92b are provided on each side of the base 91. Drive arms 98a and 98b are provided at the tip of the connecting arm 92a. At the tip of the connecting arm 92b, a drive arm 98c and a drive arm 98d are provided.

[0095] At the tips of the drive arms 98a, 98b, 98c, 98d and the detection arms 99a, 99b, weight portions for frequency adjustment are provided. Assuming that the Z-axis direction is the thickness direction of the vibrator 1, the vibrator 1 detects the angular velocity around the Z-axis.

[0096] Drive electrodes 93 are formed on the upper and lower surfaces of the drive arms 98a, 98b. Drive electrodes 94 are formed on the right and left side surfaces of the drive arms 98a, 98b. Drive electrodes 94 are formed on the upper and lower surfaces of the drive arms 98c, 98d. Drive electrodes 93 are formed on the right and left side surfaces of the drive arms 98c, 98d.

[0097] The drive electrodes 93, 94 are electrically connected to the drive circuit 81. The drive circuit 81 supplies a drive signal DS to the drive electrode 93 and receives a feedback signal DG from the drive electrode 94.

[0098] Detection electrodes 95 are formed on the upper and lower surfaces of the detection arm 99a. Ground electrodes 97 are formed on the right and left side surfaces of the detection arm 99a. Detection electrodes 96 are formed on the upper and lower surfaces of the detection arm 99b. Ground electrodes 97 are formed on the right and left side surfaces of the detection arm 99b. The detection electrodes 95, 96 are electrically connected to the detection circuit 82. The detection circuit 82 receives detection signals S1, S2 from the detection electrodes 95, 96.

[0099] 1.5.3. Operation of the Sensor Element and Circuit Element The sensor element 3 and the circuit element 4 operate as follows. When a drive signal DS is applied from the drive circuit 81 to the drive electrodes 93, the drive arms 98a, 98b, 98c, and 98d perform bending vibrations as shown by the arrow C1 due to the inverse piezoelectric effect. Specifically, the tips of the drive arm 98a and the drive arm 98c approach and separate from each other repeatedly, and the tips of the drive arm 98b and the drive arm 98d also approach and separate from each other repeatedly.

[0100] In other words, the drive arms 98a, 98b, 98c, and 98d repeat the vibration postures shown by the solid arrow C1 and the dotted arrow C1 at a predetermined frequency. The predetermined frequency is, for example, 49.6 kHz.

[0101] In the present embodiment, the frequency of the bending vibration of the drive arms 98a, 98b, 98c, and 98d is an example of the drive frequency of the sensor device 11b. Since the frequency of the bending vibration of the drive arms 98a, 98b, 98c, and 98d correlates with the frequency of the drive signal DS, the drive frequency of the sensor device 11b may be defined by the frequency of the drive signal DS.

[0102] The bending vibration of the drive arm 98a and the drive arm 98b and the bending vibration of the drive arm 98c and the drive arm 98d are vibrations that are line-symmetric with respect to the X axis passing through the center-of-gravity position of the base 91. Therefore, due to the bending vibration of the drive arms 98a, 98b, 98c, and 98d, the base 91, the connecting arm 92a, the connecting arm 92b, the detection arm 99a, and the detection arm 99b hardly vibrate.

[0103] In this state, when an angular velocity with the Z axis as the rotation axis is applied to the vibrator 1, the drive arms 98a, 98b, 98c, and 98d vibrate as shown by the arrow C2 due to the Coriolis force. In other words, the Coriolis force in the direction of the arrow C2 that is orthogonal to the direction of the arrow C1 and the direction of the Z axis acts on the drive arms 98a, 98b, 98c, and 98d, thereby generating a vibration component in the direction of the arrow C2.

[0104] The vibration of this arrow C2 is transmitted to the base 91 via the connecting arm 92a and the connecting arm 92b, whereby the detection arm 99a and the detection arm 99b bend and vibrate in the direction of the arrow C3. The charge signals generated by the piezoelectric effect due to the bending vibration of the detection arms 99a and 99b are input to the detection circuit 82 as detection signals S1 and S2, and the angular velocity about the Z axis is detected.

[0105] In the above-described embodiment, although the number of sensor devices for each of the X, Y, and Z axes has been described with an example of four, the number of sensor devices for each of the X, Y, and Z axes may be two, three, or a plurality of five or more. When the number of sensor devices for each of the X, Y, and Z axes is two, for example, the substrates 231, 232, 251, 252, 261, and 27 may not be provided. When the number of sensor devices for each of the X, Y, and Z axes is three, for example, the substrates 222, 252, and 27 may not be provided. When the number of sensor devices for each of the X, Y, and Z axes is five, the number of substrates for each axis may be increased by α.

[0106] In the above-described embodiment, although the number of sensor devices for each of the X, Y, and Z axes has been described with an example of the same number for each axis, the number of sensor devices may be different for each axis. For example, the number of sensor devices for the X axis may be three, the number of sensor devices for the Y axis may be two, and the number of sensor devices for the Z axis may be four.

[0107] In the above-described embodiment, although a plurality of examples of sensor devices for each of the X, Y, and Z axes have been described, the number of sensor devices may be plural only for a specific axis. For example, the number of sensor devices for the X axis may be one, the number of sensor devices for the Y axis may be one, and the number of sensor devices for the Z axis may be four.

[0108] As described above, the sensor module 100 of the present embodiment has the following effects. The sensor module 100 of this embodiment includes a substrate 21 as a first substrate, a substrate 231 as a second substrate disposed on the second side e2 side of the substrate 21, a substrate 232 as a third substrate disposed on the second side e2 side of the substrate 21, a flexible substrate 421 as a first connection portion for electrically connecting the substrate 21 and the substrate 231, a flexible substrate 422 as a second connection portion for electrically connecting the substrate 21 and the substrate 232, a sensor device 12c as a first sensor device provided on the substrate 231 for detecting an angular velocity around the Y-axis as a physical quantity of a first axis, and a sensor device 12d as a second sensor device provided on the substrate 232 for detecting an angular velocity around the Y-axis.

[0109] In this way, the sensor module 100 of this embodiment arranges the substrates 231 and 232 each provided with a sensor device for detecting an angular velocity around the Y-axis on the second side e2 side of the substrate 21 via the flexible substrate 421 or the flexible substrate 422.

[0110] Therefore, even if the sensor module 100 of this embodiment operates the sensor device 12c and the sensor device 12d for detecting an angular velocity around the Y-axis simultaneously, it can suppress mechanical or electrical interference generated between the sensor devices. Thus, the sensor module 100 of this embodiment can improve the effectiveness and reliability of high-precision detection data.

[0111] Furthermore, even if the number of substrates on which the sensor module 100 of this embodiment is mounted increases, the sensor module 100 can neatly arrange the substrates on the second side e2 side of the substrate 21, and can suppress an increase in the size of the sensor module 100. Therefore, the sensor module 100 of this embodiment has a configuration suitable for miniaturization.

[0112] In the sensor module 100 of the present embodiment, the first connection portion includes a flexible substrate 421 as a first flexible substrate having one end connected to the substrate 231 as a second substrate and the other end connected to the second side e2 of the substrate 21 as a first substrate, and the second connection portion includes a flexible substrate 422 as a second flexible substrate having one end connected to the substrate 232 as a third substrate and the other end connected to the second side e2 of the substrate 21.

[0113] The flexible substrates 421 and 422 are flexible substrates. Therefore, in the sensor module 100 of the present embodiment, even when the sensor devices 12c and 12d are operated simultaneously, it is possible to suppress mechanical or electrical interference from occurring between the sensor device 12c and the sensor device 12d.

[0114] The sensor module 100 of the present embodiment includes a substrate 261 as a fourth substrate facing the substrate 21 as a first substrate and a substrate 262 as a fifth substrate facing the substrate 21, a flexible substrate 451 as a third connection portion for electrically connecting the substrate 261 and the substrate 231 as a second substrate, a flexible substrate 452 as a fourth connection portion for electrically connecting the substrate 262 and the substrate 232 as a third substrate, a sensor device 11c as a third sensor device provided on the substrate 261 for detecting an angular velocity around the Z-axis as a physical quantity of the second axis, and a sensor device 11d as a fourth sensor device provided on the substrate 262 for detecting an angular velocity around the Z-axis.

[0115] In this way, in the sensor module 100 of the present embodiment, the sensor devices 11c and 11d for detecting the angular velocity around the Z-axis are respectively arranged on the substrates 261 and 262 facing the substrate 21, the substrate 261 is connected to the substrate 231 via the flexible substrate 451, and the substrate 262 is connected to the substrate 232 via the flexible substrate 452.

[0116] Therefore, even if the sensor module 100 of the present embodiment operates the sensor devices 11c and 11d for detecting the angular velocity about the Z-axis simultaneously in addition to the sensor devices 12c and 12d for detecting the angular velocity about the Y-axis, mechanical or electrical interference occurring between the sensor devices can be suppressed. Thus, the sensor module 100 of the present embodiment can improve the effectiveness and reliability of the detection data in terms of high precision.

[0117] In the sensor module 100 of the present embodiment, the first connection portion is composed of a flexible substrate 421 as a first flexible substrate having one end connected to the substrate 231 as a second substrate and the other end connected to the second side e2 as one side of the substrate 21 as a first substrate. The second connection portion is composed of a flexible substrate 422 as a second flexible substrate having one end connected to the substrate 232 as a third substrate and the other end connected to the second side e2 of the substrate 21. The third connection portion is composed of a flexible substrate 451 as a third flexible substrate having one end connected to the substrate 231 and the other end connected to the substrate 261 as a fourth substrate. The fourth connection portion is composed of a flexible substrate 452 as a fourth flexible substrate having one end connected to the substrate 232 and the other end connected to the substrate 262.

[0118] The flexible substrates 421, 422, 451, and 452 are flexible substrates. Therefore, even if the sensor module 100 of the present embodiment operates the sensor devices 12c, 12d, 11c, and 11d simultaneously, mechanical or electrical interference occurring between the sensor devices 12c, 12d, 11c, and 11d can be suppressed.

[0119] In the sensor module 100 of the present embodiment, the drive frequency of the sensor device 12c as a first sensor device and the drive frequency of the sensor device 12d as a second sensor device are the same.

[0120] Mechanical or electrical interference caused by simultaneously driving the sensor device 12c and the sensor device 12d becomes particularly prominent when the driving frequencies of the sensor device 12c and the sensor device 12d are the same. Therefore, the sensor module 100 of the present embodiment has a configuration that is particularly suitable when using sensor devices 12c and 12d with the same driving frequency, and can suppress the occurrence of mechanical or electrical interference between the sensor device 12c and the sensor device 12d.

[0121] Furthermore, since the sensor module 100 of the present embodiment can use sensor devices 12c and 12d with the same driving frequency, there is no need to prepare those with different driving frequencies. Therefore, the sensor module 100 of the present embodiment can reduce the costs required to prepare sensor devices 12c and 12d with different driving frequencies, such as costs in manufacturing, ordering, inventory, or assembly, etc., and can improve the industrial utility value.

[0122] In the sensor module 100 of the present embodiment, it includes an arithmetic circuit 14 as a processing unit that is provided on the substrate 21 and processes detection data D1 as a detection signal of the sensor device 12c as the first sensor device and detection data D1 as a detection signal of the sensor device 12d as the second sensor device.

[0123] The detection data D1 of the sensor device 12c and the detection data D1 of the sensor device 12d are respectively processed by the arithmetic circuit 14 provided on the substrate 21, and the processed detection data D2 can be obtained. Since the interference between the sensor device 12c and the sensor device 12d is suppressed in the sensor module 100 of the present embodiment, the effectiveness of high-precision is ensured, and high-precision and highly reliable detection data D2 can be obtained.

[0124] The sensor module 100 of the present embodiment is provided on a substrate 21 as a first substrate, and includes a connector 15 electrically connected to an arithmetic circuit 14 as a processing unit. Therefore, based on the configuration that ensures the effectiveness of high-precision, the sensor module 100 of the present embodiment can output highly accurate and reliable detection data D2 to the outside through the connector 15.

[0125] The sensor module 100 of the present embodiment includes a fixing frame 60 as a fixing part for fixing the substrate 21 as a first substrate, the substrate 231 as a second substrate, and the substrate 232 as a third substrate. The substrate 21, the substrate 231, and the substrate 232 are respectively fixed to the fixing frame 60. Therefore, the sensor module 100 of the present embodiment can easily and surely fix the substrate 21, the substrate 231, and the substrate 232. Thus, the sensor module 100 of the present embodiment can improve the effectiveness and reliability of high-precision detection data.

[0126] The sensor module 100 of the present embodiment includes an inner case 30 and / or an outer case 50 as a case for housing the substrate 21 as a first substrate, the substrate 231 as a second substrate, the substrate 232 as a third substrate, a flexible substrate 421 as a first connection part, and a flexible substrate 422 as a second connection part. Therefore, since the sensor module 100 of the present embodiment is housed in the inner case 30 and / or the outer case 50, it can block the influence from the outside and improve the effectiveness and reliability of high-precision detection data.

[0127] 2. Embodiment 2 In Embodiment 2, an electronic device including the sensor module 100 will be described. Hereinafter, as examples of electronic devices, examples of portable devices such as smartphones and examples of moving bodies such as automobiles will be described.

[0128] 2.1. Outline of Portable Devices FIG. 9 is a perspective view of a mobile device as an electronic device according to Embodiment 2, and is a diagram showing the configuration of a smartphone 110 as an example of a mobile device.

[0129] The smartphone 110 is equipped with a sensor module 100. The output data of the sensor module 100 is received by the control unit 111. The control unit 111 recognizes the posture and behavior of the smartphone 110 from the received detection signal, and can change the display image displayed on the display unit, sound a warning sound or an effect sound, or drive a vibration motor to vibrate the main body.

[0130] The sensor module 100 may be mounted on other mobile devices other than the smartphone 110. For example, the sensor module 100 may be mounted on mobile devices such as smartwatches, portable activity meters, HMDs (Head Mounted Displays), mobile PCs (Personal Computers), tablet PCs, cameras, and PDAs (Personal Digital Assistants). Thereby, the mobile device can recognize the posture and behavior of the mobile device based on the output data of the sensor module 100, change the display image, sound a warning sound or an effect sound, drive a vibration motor to vibrate the main body, and so on.

[0131] Thus, in this embodiment, mobile devices such as the smartphone 110 are equipped with the sensor module 100. Therefore, according to this embodiment, the reliability of the mobile device provided with the sensor module 100 can be improved.

[0132] 2.2. Overview of the Moving Body FIG. 10 is a perspective view of a moving body as an electronic device according to Embodiment 2, and is a diagram showing the configuration of an automobile 130 as an example of a moving body.

[0133] The automobile 130 is equipped with a sensor module 100. The sensor module 100 detects the attitude of the vehicle body 131 and transmits output data to the vehicle body attitude control device 132. The output data includes an angular velocity signal and an acceleration signal. When the vehicle body attitude control device 132 that controls the attitude of the vehicle body 131 receives the output data of the sensor module 100, it detects the attitude of the vehicle body 131 based on the signal, and controls the hardness and softness of the suspension or controls the brakes of the individual wheels 133 according to the detection result.

[0134] The output data of the sensor module 100 may also be utilized in other ECUs (Electronic Control Units) such as keyless entry, immobilizer, car navigation system, car air conditioner, anti-lock brake system (ABS), airbag, TPMS (Tire Pressure Monitoring System), engine control, control devices for inertial navigation for autonomous driving, and battery monitors for hybrid vehicles and electric vehicles.

[0135] The sensor module 100 may be mounted on other moving bodies other than the automobile 130. Other moving bodies are, for example, bipedal robots, trains, radio-controlled airplanes, radio-controlled helicopters, drones, agricultural machines, and construction machines. The moving body equipped with the sensor module 100 can utilize the output data of the sensor module 100 for attitude control and position measurement of the moving body.

[0136] Thus, in this embodiment, a moving body such as the automobile 130 is equipped with the sensor module 100. Therefore, according to this embodiment, the reliability of the moving body equipped with the sensor module 100 can be improved.

[0137] As described above, the preferred embodiments have been described, but the present invention is not limited to the above-described embodiments. The configuration of each part of the present invention can be replaced with any configuration that exhibits the same functions as those of the above-described embodiments, and any configuration can be added.

Explanation of Reference Numerals

[0138] 1... Vibrator, 2... Support substrate, 3, 3a, 3b... Sensor element, 4... Circuit element, 5... Base, 6... Lid, 7... Package, 8a, 8b... Inner terminal, 8c... Outer terminal, 9... Bonding wire, 10... Sensor unit, 11a, 11b, 11c, 11d, 12a, 12b, 12c, 12d, 13a, 13b, 13c, 13d... Sensor device, 14... Arithmetic circuit, 15... Connector, 16... Memory, 17... Power supply circuit, 18... Temperature sensor, 20... Substrate unit, 21, 221, 222, 231, 232, 241, 242, 251, 252, 261, 262, 27... Substrate, 30... Inner case, 31... Opening, 32... Side wall, 33... Recess, 34... Upper surface, 411, 412, 421, 422, 431, 432, 441, 442, 451, 452, 46... Flexible substrate, 50... Outer case, 52... Screw hole, 53... Inner side, 54... Side wall, 55... Bottom surface, 57... Upper surface, 58... Lower surface, 60... Fixed frame, 61... Upper surface, 62... Lower surface, 63, 64, 65, 66... Side surfaces, 68... Opening, 70... Screw, 71... Mounting surface, 81... Drive circuit, 82... Detection circuit, 91... Base portion, 92a, 92b... Connecting arm, 93, 94... Drive electrode, 95, 96... Detection electrode, 97... Ground electrode, 98a, 98b, 98c, 98d... Drive arm, 99a, 99b... Detection arm, 100... Sensor module, 110... Smartphone, 111... Control unit, 130... Automobile, 131... Vehicle body, 132... Vehicle body attitude control device, 133... Wheel, C1, C2, C3... Arrow, D1, D2... Detection data, S1, S2... Detection signal, DS... Drive signal, DG... Feedback signal, h1, h2, h3, g1, g2, g3, g4, f1, f2, f3, f4... First side, f5, f6, f7... Second side, e1... First side, e2... Second side, e3... Third side, e4... Fourth side.

Claims

1. A first substrate, a second substrate disposed on one side of the first substrate, a third substrate disposed on the one side of the first substrate, a first connection portion for electrically connecting the first substrate and the second substrate, a second connection portion for electrically connecting the first substrate and the third substrate, a first sensor device provided on the second substrate for detecting a physical quantity of a first axis, a second sensor device provided on the third substrate for detecting the physical quantity of the first axis, and a sensor module.

2. The first connection portion is composed of a first flexible substrate having one end connected to the second substrate and the other end connected to the one side of the first substrate, The second connection portion is composed of a second flexible substrate having one end connected to the third substrate and the other end connected to the one side of the first substrate, The sensor module according to Claim 1.

3. a fourth substrate facing the first substrate, a fifth substrate facing the first substrate, and a third connection portion for electrically connecting the fourth substrate and the second substrate, a fourth connection portion for electrically connecting the fifth substrate and the third substrate, a third sensor device provided on the fourth substrate for detecting a physical quantity of a second axis, a fourth sensor device provided on the fifth substrate for detecting the physical quantity of the second axis, and The sensor module according to Claim 1.

4. The first connection portion is composed of a first flexible substrate having one end connected to the second substrate and the other end connected to the one side of the first substrate, The second connection portion is composed of a second flexible substrate having one end connected to the third substrate and the other end connected to the one side of the first substrate, The third connection portion is composed of a third flexible substrate having one end connected to the second substrate and the other end connected to the fourth substrate, The fourth connection portion is composed of a fourth flexible substrate having one end connected to the third substrate and the other end connected to the fifth substrate, The sensor module according to Claim 3.

5. The driving frequency of the first sensor device and the driving frequency of the second sensor device are the same, The sensor module according to Claim 1.

6. a processing portion provided on the first substrate for processing a detection signal of the first sensor device and a detection signal of the second sensor device, and The sensor module according to Claim 1.

7. a connector provided on the first substrate and electrically connected to the processing portion, The sensor module according to claim 6.

8. A fixing part for fixing the first substrate, the second substrate, and the third substrate. The sensor module according to claim 1.

9. A case for housing the first substrate, the second substrate, the third substrate, the first connection part, and the second connection part. The sensor module according to claim 1.

10. An electronic device including the sensor module according to any one of claims 1 to 9.

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