Infrared ray photographing device and temperature measurement system

Abstract

To provide an infrared ray photographing device that can be applied to not only a predetermined application but also an application having a higher suitability criterion of an inspection test than the predetermined application without changing configurations.SOLUTION: An infrared ray photographing device includes: a photographing device body section having an infrared ray camera section including a lens for receiving infrared rays; and a metal member that is mounted to an end of the photographing device body section in which a light reception surface of the lens is disposed while an opening in a predetermined size not interfering with an optical path of infrared rays impinging on the lens is formed in a position that opposes the lens. A gap with a specific size is formed between a position on an end face in a side of the lens of the opening of the metal member and a position on a light reception surface of the lens.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to an infrared imaging device and a temperature measurement system.

Background Art

[0002] Conventionally, various technologies related to industrial infrared imaging devices have been proposed (for example, see Patent Document 1). Patent Document 1 discloses a technique for providing an imaging terminal device equipped with an infrared camera to a controller in a detachable manner in order to improve operability.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, conventionally, the conformity standards of inspection tests may differ depending on the use of infrared imaging devices. Therefore, for example, when trying to apply an infrared imaging device that can be used for a predetermined use to another use, if the conformity standard of the inspection test for the other use is higher than that for the predetermined use, there is a possibility of failing the inspection test for the other use. Therefore, there is a demand for the development of an infrared imaging device that can easily cope with such a situation.

[0005] The present invention has been made to meet the above demands, and an object of the present invention is to provide an infrared imaging device and a temperature measurement system that can be applied not only to a predetermined use but also to a use with a higher conformity standard for inspection tests than the predetermined use without changing the configuration.

Means for Solving the Problems

[0006] In order to solve the above problems, the infrared imaging device of the present invention includes a photographing device main body having an infrared camera unit including a lens that receives infrared rays, and is attached to an end of the photographing device main body where the light receiving surface of the lens is disposed, and is disposed at a position facing the lens. A metal member having an opening of a predetermined size that does not obstruct the optical path of the infrared rays incident on the lens is provided. Further, in the infrared imaging device of the present invention, a gap of a specific size is formed between the position of the end face on the lens side of the opening of the metal member and the position of the light receiving surface of the lens.

[0007] Further, in order to solve the above problems, the temperature measurement system of the present invention includes the infrared imaging device of the present invention and an information processing device capable of displaying the temperature of a measurement object obtained based on the imaging result of the infrared imaging device.

Advantages of the Invention

[0008] According to the present invention having the above configuration, it is possible to provide an infrared imaging device and a temperature measurement system that can be applied not only to a predetermined use but also to a use having a higher conformity standard for inspection tests than the predetermined use without changing the configuration.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Embodiments for Carrying Out the Invention

[0010] Next, an infrared imaging device and a temperature measurement system including the same according to an embodiment of the present invention will be specifically described with reference to the drawings.

[0011] [Temperature Measurement System] FIG. 1 is a schematic configuration diagram of a temperature measurement system 1 including an infrared imaging device (infrared thermography) according to an embodiment of the present invention. The temperature measurement system 1 is a temperature measurement system applicable not only to industrial purposes but also to medical purposes, and includes an infrared imaging device 2, an information processing device 3, and a wiring 4 that electrically connects the two devices.

[0012] The infrared imaging device 2 is an imaging device used to detect infrared rays (infrared radiation energy) radiated from an object to be temperature-measured (imaging target) and visualize an image, video, etc. showing the temperature distribution on the object surface based on the detection result. Further, the infrared imaging device 2 of the present embodiment is a portable imaging device that can be held by a user.

[0013] The information processing device 3 has a function of displaying an image, video, etc. showing the temperature distribution on the object surface photographed by the infrared imaging device 2. Note that the information processing device 3 may be, for example, a dedicated terminal device for the temperature measurement system 1, or may be a general-purpose terminal device such as a tablet, a notebook computer, or a smartphone.

[0014] [Infrared Imaging Device] Next, with reference to FIGS. 2 to 5, the configuration of the infrared imaging device 2 of the present embodiment will be described. FIG. 2 is an external perspective view of the infrared imaging device 2, and FIG. 3 is a cross-sectional view of the infrared imaging device 2 as viewed from the a-a direction in FIG. 2. FIG. 4 is an exploded perspective view of the infrared imaging device 2, and in this figure, only the configuration near the lens-side end of the imaging device main body 10 described later is shown. FIGS. 5A to 5C are enlarged configuration views of the vicinity of the lens side (infrared light receiving side) end of the imaging device main body 10 described later. FIG. 5A is an external perspective view of the lens-side end of the imaging device main body 10, FIG. 5B is a side view of the lens-side end of the imaging device main body 10, and FIG. 5C is an internal configuration view of the lens-side end of the imaging device main body 10.

[0015] In the drawings of FIGS. 2 to 5, the extending direction of the imaging device main body 10 described later is defined as the Y direction. Also, in the drawings of FIGS. 2 to 5, the short side direction of the substantially oval infrared light receiving side end portion (bottom portion 21 described later) of the cover member 20 described later is defined as the X direction, and the long side direction is defined as the Z direction. Further, in the drawings of FIGS. 2 to 5, the X direction, Y direction, and Z direction are orthogonal to each other.

[0016] As shown in FIGS. 2 and 3, the infrared imaging device 2 includes an imaging device main body 10 and a cover member 20 (a metal member). Also, as shown in FIG. 3, the infrared imaging device 2 includes a conductive elastic member 30. As will be described later, in the present embodiment, when the cover member 20 is attached to the imaging device main body 10 to assemble the infrared imaging device 2, the cover member 20 and a grounding portion 13 (described later) inside the imaging device main body 10 are electrically connected via the conductive elastic member 30.

[0017] As shown in FIGS. 3 and 5A to 5C, the imaging device main body 10 includes a housing 11, an infrared camera unit 12 provided inside the housing, and a grounding unit 13 connected to the ground. The infrared camera unit 12 includes a lens 12a capable of receiving infrared rays (infrared light) within a predetermined incident angle range, and an infrared imaging sensor (not shown) that detects the infrared rays received by the lens 12a. Although not shown, the imaging device main body 10 includes an integrated circuit for performing various processes on the detection signals from the infrared camera unit 12 and input / output processes of information to / from the information processing device 3. In this embodiment, an infrared imaging device that can be used for industrial purposes is adopted for the imaging device main body 10.

[0018] As shown in FIG. 5A, the shape of the light-receiving side end face 11a of the housing 11 of the imaging device main body 10 for infrared rays (infrared light) is substantially oval. In the longitudinal direction (Z direction in the figure) of the light-receiving side end face 11a of the housing 11, a circular opening 14 is formed at a position slightly below the center. In this embodiment, the infrared camera unit 12 is disposed inside the housing 11 such that the infrared light-receiving surface of the lens 12a of the infrared camera unit 12 is exposed through the opening 14. Further, in the longitudinal direction (Z direction in the figure) of the light-receiving side end face 11a of the housing 11, a concave portion 15 with a circular opening shape is formed above the opening 14. In this embodiment, as shown in FIG. 3, the grounding unit 13 is provided at the bottom of the concave portion 15.

[0019] The cover member 20 is, for example, a lid-shaped member formed of a metal such as aluminum. As shown in FIG. 4, the cover member 20 includes a substantially oval bottom portion 21, and a side wall portion 22 that continuously extends from the outer peripheral end of the bottom portion 21 in a direction perpendicular to the surface of the bottom portion 21 (Y direction in the figure) with a predetermined length. Note that the opening shape of the side wall portion 22 of the cover member 20 is the same as the shape of the light-receiving side end face 11a of the housing 11, and the opening diameter of the side wall portion 22 is set slightly larger than the size of the light-receiving side end face 11a.

[0020] In the longitudinal direction (Z direction in the figure) of the bottom portion 21 of the cover member 20, a circular opening 23 is formed at a position slightly below the center, as shown in FIGS. 2 to 4. As shown in FIGS. 2 and 3, when the cover member 20 is attached to the imaging device main body portion 10, the opening 23 is formed at a position facing the lens 12a. More specifically, it is formed at a position where the central axis of the opening 23 aligns with the central axis of the opening 14 (lens 12a) of the housing 11. Further, the opening diameter of the opening 23 is set to a size (predetermined size) that does not obstruct the optical path of the infrared rays received by the lens 12a.

[0021] In the infrared imaging device 2 of the present embodiment, as shown in FIG. 3, when the cover member 20 is attached to the imaging device main body portion 10, a gap of a specific size (size d in the figure) is formed between the end face position on the lens 12a side of the opening 23 of the cover member 20 and the light receiving surface of the lens 12a. Hereinafter, this gap is referred to as the "clearance between the cover member 20 and the lens 12a".

[0022] And the size d of the clearance between the cover member 20 and the lens 12a is set to a size such that the static electricity charged on the cover member 20 is not applied (discharged) to the lens 12a. Note that the method for adjusting the size d of the clearance between the cover member 20 and the lens 12a is arbitrary, but in the present embodiment, the size d of the clearance is adjusted by adjusting the thickness of the region of the bottom portion 21 of the cover member 20 that contacts the light receiving side end face 11a of the imaging device main body portion 10 when the cover member 20 is attached to the imaging device main body portion 10.

[0023] That is, in the present embodiment, when the cover member 20 is attached to the imaging device main body portion 10, the opening diameter of the opening 23 of the cover member 20 and the size d of the clearance between the cover member 20 and the lens 12a are optimized so as not to obstruct the optical path of the infrared rays received by the lens 12a and so that the static electricity charged on the cover member 20 is not applied to the lens 12a.

[0024] The conductive elastic member 30 is composed of a metal spring. Note that the conductive elastic member 30 may be composed of, for example, an elastic member formed of a conductive elastic material (such as conductive silicone rubber, etc.).

[0025] The diameter of the conductive elastic member 30 (metal spring) is set to a size smaller than the opening size of the recess 15 provided on the light-receiving side end face 11a of the housing 11. Also, the length of the conductive elastic member 30 in the expansion and contraction direction before expansion and contraction is set to a size longer than the distance between the bottom 21 of the cover member 20 and the grounding portion 13 of the imaging device main body portion 10 when the cover member 20 is attached to the imaging device main body portion 10.

[0026] [Assembly mode of the infrared imaging device 2] When assembling the infrared imaging device 2, first, insert the conductive elastic member 30 into the opening of the recess 15 provided on the light-receiving side end face 11a of the housing 11 (see FIGS. 5A and 5B). At this time, insert the conductive elastic member 30 into the opening of the recess 15 so that the expansion and contraction direction of the conductive elastic member 30 aligns with the extending direction of the recess 15. Next, insert the end portion on the light-receiving side end face 11a side of the housing 11 into the opening of the cover member 20 (side wall portion 22). Then, insert (press-fit) the end portion on the light-receiving side end face 11a side of the housing 11 into the cover member 20 until the bottom surface (bottom portion 21) of the cover member 20 contacts the light-receiving side end face 11a, and attach the cover member 20 to the end portion on the light-receiving side end face 11a side of the housing 11 (see the white arrow in FIG. 4).

[0027] By this fitting (press-fitting), the cover member 20 is fixed to the imaging device main body 10 by the frictional force between the surface of the side wall portion 22 of the cover member 20 on the side of the housing 11 and the surface of the housing 11 that contacts therewith. Further, at the time of this fitting, the conductive elastic member 30 is enclosed between the imaging device main body 10 (grounding portion 13) and the cover member 20 while being contracted in its longitudinal direction. At this time, due to the elastic force of the conductive elastic member 30, one end portion of the conductive elastic member 30 is in close contact with the grounding portion 13 in the imaging device main body 10, and the other end portion of the conductive elastic member 30 is in close contact with a part of the bottom surface of the cover member 20 (see FIG. 3). Thereby, the cover member 20 and the grounding portion 13 in the imaging device main body 10 are electrically connected by the conductive elastic member 30, and the cover member 20 is grounded.

[0028] [Evaluation Test Example] Next, an example of the electrostatic test actually performed on the infrared imaging device 2 of the present embodiment will be described.

[0029] In the electrostatic test, the electrostatic test was performed by variously changing the size d of the clearance between the cover member 20 and the lens 12a in the infrared imaging device 2. Here, although the specific size d of the clearance is not shown, the size d of the clearance was gradually increased in the order of A (mm), B (mm), C (mm), D (mm), and E (mm), and the electrostatic test was performed at each size d. In addition, in response to gradually increasing the size d of the clearance in the order of A (mm), B (mm), C (mm), D (mm), and E (mm), the size of the opening 23 of the cover member 20 was also gradually increased so as not to obstruct the optical path of the infrared rays received by the lens 12a.

[0030] Further, in the evaluation test, for comparison, an electrostatic test was also performed on the infrared imaging device 2 not provided with the cover member 20, that is, only the imaging device main body 10 (comparative example) applicable as an industrial infrared imaging device. Further, here, in each electrostatic test of the industrial standard and the medical standard, it was determined whether or not the infrared imaging device 2 satisfies the applicable conformity criteria.

[0031] FIG. 6 is a diagram showing the evaluation results of the electrostatic test. In the table in the figure, when the conformity criteria for the electrostatic test of each standard were met, it was described as "OK", and when the conformity criteria were not met, it was described as "NG".

[0032] In the infrared imaging device (imaging device main body 10) of the comparative example, as shown in FIG. 6, although the conformity criteria for the industrial standard electrostatic test were met ( "OK" in the figure), when the medical standard electrostatic test was performed, it malfunctioned and the conformity criteria for the medical standard were not met ( "NG" in the figure).

[0033] On the other hand, in the infrared imaging device 2 of the present embodiment, when the size d of the clearance between the cover member 20 and the lens 12a was set to the minimum A (mm), as shown in FIG. 6, the conformity criteria for the industrial standard were met, but the conformity criteria for the medical standard were not met. However, when the size d of the clearance between the cover member 20 and the lens 12a was set to B (mm) to E (mm), which is larger than A (mm), as shown in the evaluation results of FIG. 6, not only the conformity criteria for the industrial standard but also the conformity criteria for the medical standard were met.

[0034] From the evaluation results shown in FIG. 6, it was found that if the size d of the clearance between the cover member 20 and the lens 12a is too narrow, the influence of static electricity on the lens 12a cannot be prevented. This is presumably because when the size d of the clearance is too narrow, static electricity is applied from the cover member 20 to the lens 12a. On the other hand, it was found that if the size d of the clearance between the cover member 20 and the lens 12a is widened to a certain extent, the influence of static electricity on the lens 12a can be prevented and the electrostatic resistance can be improved.

[0035] Also, in the example shown in FIG. 6, any of the infrared imaging devices 2 in which the size d of the clearance between the cover member 20 and the lens 12a is from B (mm) to E (mm) can be adopted as a practical product. However, in the example shown in FIG. 6, in order to surely prevent the application of static electricity from the cover member 20 to the lens 12a, the infrared imaging device 2 in which the size d of the gap (clearance) is C (mm) which is slightly wider than B (mm) was adopted as a practical product.

[0036] [Various Effects] In the infrared imaging device 2 having the above configuration, on the light receiving side end face 11a side of the infrared ray (infrared light) of the imaging device main body 10, a metal cover member 20 in which an opening 23 is formed so that the infrared light receiving surface of the lens 12a is exposed is provided (see FIG. 2). Then, without obstructing the optical path of the infrared rays received by the lens 12a and so that the static electricity charged on the cover member 20 is not applied to the lens 12a, the opening diameter of the opening 23 of the cover member 20 and the size d of the clearance between the cover member 20 and the lens 12a are optimized. That is, in the infrared imaging device 2 of the present embodiment, the optical path of the lens 12a is not blocked, the influence of static electricity on the lens 12a can be prevented, and a thermal image of the measurement object can be accurately obtained. Therefore, the infrared imaging device 2 of the present embodiment can be applied not only to industrial use but also to applications such as medical use where the conformity standard is higher than the industrial standard without changing the configuration. This is also clear from the evaluation results of the static electricity test described in FIG. 6 above.

[0037] Also, in the infrared imaging device 2 having the above configuration, when the cover member 20 is attached to the imaging device main body 10, the cover member 20 that is charged with static electricity is electrically connected to the grounding portion 13 via the conductive elastic member 30. Therefore, in the infrared imaging device 2 of the present embodiment, the static electricity charged on the cover member 20 can be discharged to the ground via the grounding portion 13, so that electromagnetic radiation does not occur from the cover member 20 charged with static electricity. That is, in the infrared imaging device 2 of the present embodiment, it is possible to prevent the cover member 20 from acting as an antenna for electromagnetic radiation.

[0038] In addition, the configuration of the infrared imaging device 2 of the present embodiment is such that only the cover member 20 is attached to the imaging device main body 10, and the conductive elastic member 30 is also enclosed between the cover member 20 and the imaging device main body 10. Therefore, in the present embodiment, the above-described various effects can be obtained without impairing the portability of the infrared imaging device 2.

[0039] Furthermore, in the present embodiment, with the conductive elastic member 30 inserted into the recess 15 provided on the light-receiving side end face 11a of the housing 11, the infrared imaging device 2 can be assembled simply by attaching the cover member 20 to the light-receiving side end face 11a side of the housing 11. Therefore, in the present embodiment, when assembling the infrared imaging device 2, for example, there is no need to separately perform operations such as electrically connecting the cover member 20 and the grounding portion 13, and the assembly becomes easier.

[0040] Also, in the infrared imaging device 2 of the present embodiment, an elastic member (conductive elastic member 30) is used as a conductive member for electrically connecting between the cover member 20 and the grounding portion 13. By providing the conductive member with elasticity, slight dimensional variations of the housing 11 of the imaging device main body 10 can be absorbed during the assembly of the infrared imaging device 2, so that the design efficiency and workability during assembly can be improved. Furthermore, when the conductive elastic member 30 is configured as a metal spring as in the present embodiment, in addition to elasticity, it also has a high conductivity, so the effect of discharging static electricity to the ground is further improved, and the electrostatic resistance of the infrared imaging device 2 can be further improved.

[0041] [Various Modification Examples] In the examples of the above-described embodiments, the configuration of the device has been described in detail and specifically for the purpose of clearly explaining the present invention, and it is not necessarily limited to having all the configurations described. Also, the present invention can take various other modification examples without departing from the gist of the present invention described in the claims. For example, the following modification examples are conceivable.

[0042] In the infrared imaging device 2 of the above-described embodiment, an example in which the cover member 20 is attached to the housing 11 of the imaging device main body 10 by press-fitting (inserting) the light-receiving side end face 11a of the housing 11 of the imaging device main body 10 into the lid-shaped cover member 20 has been described. However, the present invention is not limited to this. For example, a configuration may be adopted in which fitting components are provided on each of the surface of the cover member 20 on the side of the housing 11 and the light-receiving side end face 11a of the housing 11, and the cover member 20 is attached to the light-receiving side end face 11a of the housing 11 by fitting the surface of the cover member 20 on the side of the housing 11 and the light-receiving side end face 11a of the housing 11. In this case, for example, it is not necessary to provide the side wall portion 22 of the cover member 20.

[0043] Further, in the infrared imaging device 2 of the above-described embodiment, a configuration example in which the conductive elastic member 30 electrically connects the ground portion 13 of the imaging device main body 10 and the cover member 20 has been described in order to prevent the cover member 20 from acting as an antenna for electromagnetic radiation. However, the configuration for achieving this purpose is not limited to this.

[0044] For example, when the cover member 20 is attached to the imaging device main body 10, a ground portion may be provided in a partial region of the housing 11 of the imaging device main body 10 that contacts the cover member 20. Further, for example, the cover member 20 and the ground portion 13 may be electrically connected using wiring or the like. However, in this configuration, since it is necessary to separately perform an operation for electrically connecting the cover member 20 and the ground portion 13 when assembling the infrared imaging device 2, the configuration of the above-described embodiment is more advantageous from the viewpoints of ease of assembly and cost. Furthermore, for example, the cover member 20 may be electrically connected to a ground portion outside the infrared imaging device 2 using wiring or the like. However, in this configuration, the configuration of the above-described embodiment is more advantageous from the viewpoint of the portability of the infrared imaging device 2.

Explanation of Reference Numerals

[0045] 1... Temperature measurement system, 2... Infrared imaging device, 3... Information processing device, 10... Imaging device main body, 11... Housing, 12... Infrared camera unit, 12a... Lens, 13... Grounding part, 20... Cover member, 23... Opening, 30... Conductive elastic member

Claims

1. A photographing apparatus main body having an infrared camera unit including a lens for receiving infrared rays, a metal member attached to an end of the photographing apparatus main body where the light receiving surface of the lens is disposed, and having an opening of a predetermined size formed at a position facing the lens and not obstructing the optical path of the infrared rays incident on the lens, a gap of a specific size is formed between the position of the lens-side end surface of the opening of the metal member and the position of the light receiving surface of the lens An infrared photographing apparatus characterized by the above.

2. Further comprising a conductive elastic member, the photographing apparatus main body has a grounding portion connected to the ground, the conductive elastic member is disposed between the grounding portion of the photographing apparatus main body and the metal member, in a state where the metal member is attached to the photographing apparatus main body, the metal member is electrically connected to the grounding portion via the conductive elastic member The infrared photographing apparatus according to claim 1, characterized by the above.

3. The conductive elastic member is a metal spring The infrared photographing apparatus according to claim 2, characterized by the above.

4. The specific size of the gap is set to a size at which no static electricity is applied from the metal member to the lens The infrared photographing apparatus according to any one of claims 1 to 3, characterized by the above.

5. An infrared photographing apparatus, an information processing apparatus capable of displaying the temperature of a measurement object obtained based on the photographing result by the infrared photographing apparatus, comprising: the infrared photographing apparatus, a photographing apparatus main body having an infrared camera unit including a lens for receiving infrared rays, a metal member attached to an end of the photographing apparatus main body where the light receiving surface of the lens is disposed, and having an opening of a predetermined size formed at a position facing the lens and not obstructing the optical path of the infrared rays incident on the lens, a gap of a specific size is formed between the position of the lens-side end surface of the opening of the metal member and the position of the light receiving surface of the lens A temperature measurement system characterized by the above.

Images