Capillary replacement mechanism and wire bonding device

The capillary exchange mechanism addresses the challenge of compacting the capillary exchange function in semiconductor manufacturing by using a modular design that allows for efficient automatic capillary exchange within a compact footprint.

JP2025080866AActive Publication Date: 2025-05-27SHINKAWA CO LTD
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Patent Information

Application Number
JP2023194213
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-11-15
Publication Date
2025-05-27
Estimated Expiration
2043-11-15

AI Technical Summary

Technical Problem

In semiconductor chip manufacturing, there is a challenge in expanding factory floor space, necessitating a compact capillary exchange mechanism that can provide an automatic capillary exchange function without increasing the size of the wire bonding apparatus.

Method used

A capillary exchange mechanism with a housing unit holding multiple replacement capillaries, a supply module for moving capillaries, a replacement module for exchanging capillaries, and a conveyance module for linear movement and rotation, allowing for compact arrangement and efficient automatic capillary exchange.

Benefits of technology

Enables the provision of an automatic capillary exchange function while maintaining a compact size, thereby supporting increased production capacity without the need for larger apparatuses.

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Abstract

To impart a function for automatically replacing a capillary while suppressing increase in a size.SOLUTION: A capillary replacement unit 5 includes: a supply module 54 that moves a replacement capillary 243T from a capillary accommodation part 54a to a capillary supply port 54b along a supply direction SD; an exchange module 53 that executes an operation for extracting the replacement capillary 243T from the capillary supply port 54b by moving the replacement capillary 243T located in the capillary supply port 54b along an axis and an operation for moving the extracted replacement capillary 243T along the axis; and a conveyance module 52 that executes an operation for receiving the replacement capillary 243T moved by the operation for movement by the exchange module 53, and a conveyance operation for linearly moving, by a predetermined distance, and rotating, by a predetermined angle, the received replacement capillary 243T.SELECTED DRAWING: Figure 8
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Description

Technical Field

[0001] The present invention relates to a capillary exchange mechanism and a wire bonding apparatus.

Background Art

[0002] A wire bonding apparatus electrically connects a lead frame to an electrode of a semiconductor chip using a wire. The wire is pressed from a component called a capillary to an electrode of a semiconductor chip or the like, and heat or ultrasonic waves or the like are applied as necessary. As a result, the wire is bonded to an electrode of a semiconductor chip or the like. Such a bonding operation is called bonding.

[0003] When bonding is repeated, it becomes difficult to obtain a desired bonding result due to wear of the tip of the capillary or the like. Therefore, the capillary is exchanged every time it satisfies the exchange conditions set based on the number of bondings or the like.

[0004] Patent Documents 1 to 3 disclose technologies related to wire bonding. Patent Document 1 discloses an apparatus and method capable of continuously performing bonding while exchanging a capillary which is a bonding tool. Patent Document 2 discloses an apparatus and method for accurately detecting the position of a capillary. Patent Document 3 discloses a method for more effectively suppressing wire breakage and wire bending.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0006] In a factory for manufacturing semiconductor chips, a large number of various manufacturing apparatuses are arranged. Since the number of manufacturing apparatuses corresponds to the production quantity in the factory, a number of manufacturing apparatuses corresponding to the production quantity are arranged in the factory. In this case, it is difficult to expand the floor area of the factory, and in order to increase the number of manufacturing apparatuses on a certain fixed floor area, it is desirable to suppress the increase in the size of the manufacturing apparatuses. Suppressing the increase in the size of this manufacturing apparatus is similarly desirable even when adding a function of exchanging a capillary as described in Patent Document 1. That is, in this technical field, a mechanism capable of imparting an automatic capillary exchange function while suppressing an increase in size has been desired.

[0007] The present invention provides a capillary exchange mechanism capable of imparting an automatic capillary exchange function while suppressing an increase in size, and a wire bonding apparatus including the capillary exchange mechanism.

Means for Solving the Problems

[0008] A capillary exchange mechanism according to one embodiment of the present invention includes a housing unit that holds a plurality of replacement capillaries arranged side by side in a supply direction orthogonal to the axis of the replacement capillary, a capillary supply port for taking out the replacement capillary, a supply module that moves the replacement capillary from the housing unit to the capillary supply port along the supply direction, a replacement module that performs an operation of taking out the replacement capillary from the capillary supply port by moving the replacement capillary located at the capillary supply port along the axis, and an operation of moving the taken-out replacement capillary along the axis, and a conveyance module that performs an operation of receiving the replacement capillary moved by the operation of moving the replacement module, and a conveyance operation of linearly moving the received replacement capillary by a predetermined distance and rotating it by a predetermined angle.

[0009] This capillary exchange mechanism can move the replacement capillary in three modes: movement in the supply direction, movement along the axis, and rotational movement by a predetermined angle. As a result, the degree of freedom in arranging the supply module, replacement module, and transfer module for the automatic capillary replacement function is increased. Therefore, since these modules can be arranged so that the area required for arranging the capillary exchange mechanism becomes compact, it is possible to provide an automatic capillary replacement function while suppressing an increase in size.

[0010] In the above capillary exchange mechanism, a first reference line overlapping the axis of the used capillary held by the horn and a second reference line orthogonal to the first reference line are defined, and the transfer module is arranged so as to include the intersection of the first reference line and the second reference line, and the replacement module may be arranged adjacent to the transfer module along the direction of the second reference line. According to this configuration, the replacement module can be arranged next to the transfer module.

[0011] In the above capillary exchange mechanism, a first reference line overlapping the axis of the used capillary held by the horn and a second reference line orthogonal to the first reference line are defined, and the transfer module is arranged so as to include the intersection of the first reference line and the second reference line, and the supply module may be arranged adjacent to the transfer module along the direction of the second reference line. According to this configuration, the supply module can be arranged next to the transfer module.

[0012] In the above capillary exchange mechanism, a first reference line overlapping the axis of the used capillary held by the horn, a second reference line orthogonal to the first reference line, and a third reference line parallel to the first reference line and spaced apart from the first reference line in the direction of the second reference line are defined, and the replacement module is arranged so as to include the intersection of the second reference line and the third reference line, and the supply module may be arranged on the third reference line and adjacent to the replacement module along the direction of the third reference line. According to this configuration, the supply module can be arranged above or below the replacement module.

[0013] In the above-described capillary exchange mechanism, a first reference line overlapping the axis of the used capillary held by the horn, a second reference line orthogonal to the first reference line, and a third reference line parallel to the first reference line and spaced apart from the first reference line in the direction of the second reference line are defined. The transport module is arranged to include the intersection of the first reference line and the second reference line, the replacement module is arranged to include the intersection of the second reference line and the third reference line, and the supply module may be arranged on the third reference line and adjacent to the replacement module along the direction of the third reference line. According to this configuration, the replacement module can be arranged adjacent to the transport module, and the supply module can be arranged above or below the replacement module.

[0014] In the above-described capillary exchange mechanism, a first reference line overlapping the axis of the used capillary held by the horn is defined. The transport module is arranged to overlap the first reference line, and the replacement module may be arranged to overlap the first reference line and adjacent to the transport module along the direction of the first reference line. According to this configuration, the replacement module can be arranged below the transport module.

[0015] In the above-described capillary exchange mechanism, a first reference line overlapping the axis of the used capillary held by the horn and a second reference line orthogonal to the first reference line are defined. The transport module is arranged to overlap the first reference line but not to include the intersection of the first reference line and the second reference line, and the supply module may be arranged to overlap the second reference line. According to this configuration, the supply module can be arranged below the transport module.

[0016] In the above-described capillary exchange mechanism, a first reference line overlapping the axis of the used capillary held by the horn and a second reference line orthogonal to the first reference line are defined, the replacement module is arranged to include the intersection of the first reference line and the second reference line, and the supply module may be arranged to overlap the second reference line. According to this configuration, the supply module can be arranged adjacent to the replacement module.

[0017] In the above-described capillary exchange mechanism, a first reference line overlapping the axis of the used capillary held by the horn and a second reference line orthogonal to the first reference line are defined, the transfer module is arranged to overlap the first reference line but not to include the intersection of the first reference line and the second reference line, the replacement module is arranged to include the intersection of the first reference line and the second reference line, and the supply module may be arranged to overlap the second reference line. According to this configuration, the replacement module can be arranged below the transfer module, and the supply module can be arranged adjacent to the replacement module.

[0018] Another form of the wire bonding apparatus of the present invention includes a horn, a capillary detachably attached to the horn, and a capillary exchange mechanism for exchanging a used capillary for a replacement capillary. The capillary exchange mechanism has a housing portion that holds a plurality of replacement capillaries arranged side by side in a supply direction orthogonal to the axis of the replacement capillary, and a capillary supply port for taking out the replacement capillary, a supply module that moves the replacement capillary from the housing portion to the capillary supply port along the supply direction, a replacement module that performs an operation of taking out the replacement capillary from the capillary supply port by moving the replacement capillary located at the capillary supply port along the axis, and an operation of moving the taken-out replacement capillary along the axis, and a transfer module that performs an operation of receiving the replacement capillary moved by the operation of moving the replacement module, and a transfer operation of linearly moving the received replacement capillary by a predetermined distance and rotating it by a predetermined angle.

[0019] This wire bonding apparatus is provided with the above-described capillary exchange mechanism. Therefore, since it is possible to make the area required for the arrangement of the capillary exchange mechanism compact, it is possible to suppress the increase in size of the wire bonding apparatus due to the addition of the automatic capillary exchange function.

Effect of the Invention

[0020] According to the present invention, it is possible to provide a capillary exchange mechanism and a wire bonding apparatus that can be provided with an automatic capillary exchange function while suppressing an increase in size.

Brief Description of the Drawings

[0021]

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Embodiments for Carrying Out the Invention

[0022] Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same reference numerals are assigned to the same elements, and redundant descriptions are omitted.

[0023] Figure 1 is a perspective view showing a wire bonding apparatus according to an embodiment of the present invention. The wire bonding apparatus 1 includes a wire bonding unit 2, a bonding stage 3, a camera unit 4, a capillary exchange unit 5 (capillary exchange mechanism), and a controller 6.

[0024] The wire bonding unit 2 bonds a bonding wire 12 (see FIG. 4 etc.) to the semiconductor chip 11. The bonding stage 3 sequentially moves a plurality of semiconductor chips 11 to be wire-bonded to the working area of the wire bonding unit 2. The camera unit 4 obtains an imaging image for controlling the operation of the wire bonding unit 2. The capillary exchange unit 5 exchanges a used capillary that needs to be exchanged due to multiple wire bondings for a new replacement capillary. The controller 6 includes various control units that control the operations of each part of the wire bonding apparatus 1 and perform various processes.

[0025] The wire bonding unit 2 includes a main base 21, an XY stage 22 for tools, and a sub-base 23. Further, the wire bonding unit 2 includes a bonding module 24, a Z-axis driving unit 25, a module base 26, a lower wire clamp 27, and an upper wire clamp 28.

[0026] The XY stage 22 for tools is attached to the main base 21. The sub-base 23 is attached to the movable stage of the XY stage 22 for tools. The XY stage 22 for tools moves the sub-base 23 in the X-axis direction and the Y-axis direction. The bonding module 24, the lower wire clamp 27, the upper wire clamp 28, and the camera unit 4 are attached to the sub-base 23. For example, when the sub-base 23 is moved in the X-axis direction by the XY stage 22 for tools, the bonding module 24, the lower wire clamp 27, the upper wire clamp 28, and the camera unit 4 also move in the X-axis direction integrally.

[0027] More specifically, the sub-base 23 includes a sub-base main surface 23a and a sub-base wall surface 23b. The Z-axis driving unit 25 is attached to the sub-base main surface 23a, and the module base 26 is attached to the Z-axis driving unit 25. The bonding module 24 and the lower wire clamp 27 are attached to the module base 26. On the other hand, the upper wire clamp 28 and the camera unit 4 are attached to the sub-base wall surface 23b without passing through intermediate members such as the Z-axis driving unit 25 and the module base 26. According to this configuration, the bonding module 24 and the lower wire clamp 27 reciprocate in the Z-axis direction by the Z-axis driving unit 25. More specifically, the tips of the bonding module 24 and the lower wire clamp 27 can perform a reciprocating arc motion centered on the Z-axis driving unit 25. During this reciprocating arc motion, the relative position of the lower wire clamp 27 with respect to the bonding module 24 is maintained. On the other hand, the upper wire clamp 28 and the camera unit 4 do not reciprocate in the Z-axis direction by the Z-axis driving unit 25.

[0028] In short, the bonding module 24 and the lower wire clamp 27 move in the X-axis direction, Y-axis direction, and Z-axis direction, respectively. In contrast, the upper wire clamp 28 and the camera unit 4 move in the X-axis direction and Y-axis direction. In the example of this embodiment, the upper wire clamp 28 and the camera unit 4 do not move in the Z-axis direction. However, it is also possible to adopt a configuration in which the upper wire clamp 28 and the camera unit 4 are movable in the Z-axis direction.

[0029] <Bonding module 24> The bonding module 24 includes a horn holder 241, a ultrasonic horn 242, and a capillary 243. The proximal end side of the horn holder 241 is attached to the Z-axis drive unit 25. The ultrasonic horn 242 is attached to the distal end side of the horn holder 241. The capillary 243 is detachably attached to the distal end side portion of the ultrasonic horn 242.

[0030] More specifically, as shown in FIG. 2, a capillary attachment hole H1 and a pin insertion hole H2 are formed in the tip portion of the ultrasonic horn 242. The capillary attachment hole H1 and the pin insertion hole H2 penetrate the ultrasonic horn 242 along the Z-axis. In the present embodiment, the capillary attachment hole H1 is provided on the tip side of the ultrasonic horn 242 rather than the pin insertion hole H2. However, the pin insertion hole H2 may be provided on the tip side of the ultrasonic horn 242 rather than the capillary attachment hole H1.

[0031] The capillary attachment hole H1 and the pin insertion hole H2 communicate with each other. In the present embodiment, the capillary attachment hole H1 and the pin insertion hole H2 communicate with each other via a slit S1. The slit S1 penetrates the ultrasonic horn 242 in the Z-axis direction.

[0032] In addition, a slit S2 is formed in the ultrasonic horn 242. The slit S2 communicates with the pin insertion hole H2. The slit S2 is formed on the proximal end side of the ultrasonic horn 242 with respect to the pin insertion hole H2. The slit S2 penetrates the ultrasonic horn 242 in the Z-axis direction. Thus, the capillary attachment hole H1, the slit S1, the pin insertion hole H2, and the slit S2 communicate with each other.

[0033] A capillary 243 is inserted into the capillary attachment hole H1. Here, the ultrasonic horn 242 is formed of an elastically deformable material. As shown in FIG. 3(a), the capillary attachment hole H1 has a size smaller than the outer diameter of the capillary 243 when the capillary 243 is not inserted. The ultrasonic horn 242 can grip the capillary 243 inserted into the capillary attachment hole H1 by elastic force by expanding the capillary attachment hole H1. That is, the capillary 243 is inserted into the capillary attachment hole H1 in a state where the capillary attachment hole H1 is expanded.

[0034] As shown in FIG. 3(a), the pin insertion hole H2 is an elliptical hole. The release pin portion 511 of the release module 51 can be inserted into the pin insertion hole H2. The release pin portion 511 is inserted into the pin insertion hole H2 to release the grip of the capillary 243 by the ultrasonic horn 242. As shown in FIGS. 2 and 3(a), the inner wall surface of the pin insertion hole H2 includes a first surface portion W1 and a second surface portion W2 facing each other. The first surface portion W1 and the second surface portion W2 face each other in the short-axis direction of the elliptical pin insertion hole H2. Note that the slit S1 and the slit S2 face each other in the long-axis direction of the elliptical pin insertion hole H2. In a state where the release pin portion 511 of the release module 51 is not inserted into the pin insertion hole H2, the length of the pin insertion hole H2 in the short-axis direction is shorter than the length L1 of the release pin portion 511 in the first direction (long-axis direction). The capillary attachment hole H1 communicates with an end portion in the long-axis direction of the elliptical pin insertion hole H2 via the slit S1.

[0035] The capillary 243, which is a bonding tool, bonds the bonding wire 12 to the semiconductor chip 11. The capillary 243 has a capillary main body portion 243a and a capillary tapered portion 243b. The capillary main body portion 243a has a cylindrical shape and is gripped at the tip portion of the ultrasonic horn 242. The capillary tapered portion 243b has a conical shape that tapers toward the tip, and the tip of the capillary tapered portion 243b is pressed against pads or the like of the semiconductor chip 11. A capillary through hole 243h is formed in the capillary 243 from the base end surface of the capillary main body portion 243a to the tip end surface of the capillary tapered portion 243b. The bonding wire 12 is inserted through the capillary through hole 243h.

[0036] <Lower wire clamp and upper wire clamp> The lower wire clamp 27 and the upper wire clamp 28 can mutually switch between a state of gripping the bonding wire 12 and a state of not gripping the bonding wire 12. As described above, the lower wire clamp 27 is movable along the Z-axis direction. Therefore, with respect to the upper wire clamp 28 whose position along the Z-axis direction is fixed, the position of the lower wire clamp 27 can be mutually switched between a position close to the upper wire clamp 28 (proximity position 2N) and a position away from the upper wire clamp 28 (separation position 2F). By switching between this gripping state and release state, and switching between the proximity position 2N and the separation position 2F, the lower wire clamp 27 and the upper wire clamp 28 can perform an operation of drawing the bonding wire 12 into the capillary through hole 243h (drawing-in operation) and an operation of feeding out the bonding wire 12 to the capillary through hole 243h (feeding-out operation).

[0037] [Drawing-in operation] With reference to FIG. 4, the pulling-in operation will be described. First, the lower wire clamp 27 at the proximity position 2N is opened, and the upper wire clamp 28 is closed (FIG. 4(a)). Next, the opened lower wire clamp 27 and the capillary 243 are moved downward toward the separation position 2F (FIG. 4(b)). At this time, since the bonding wire 12 is held by the upper wire clamp 28, it does not move. The downward movement of the capillary 243 relative to the non-moving bonding wire 12 means that, as seen from the bonding wire 12, the bonding wire 12 moves upward relative to the capillary 243. That is, the bonding wire 12 is pulled into the capillary 243. Next, the lower wire clamp 27 at the separation position 2F is closed, and the upper wire clamp 28 is opened (FIG. 4(c)). Next, the closed lower wire clamp 27 and the capillary 243 are moved upward toward the proximity position 2N (FIG. 4(d)). At this time, since the bonding wire 12 is held by the lower wire clamp 27, the bonding wire 12 also moves upward as the lower wire clamp 27 moves. As a result, when comparing the state of FIG. 4(a) with the state of FIG. 4(b), the position of the capillary 243 is the same, but the tip of the bonding wire 12 has moved upward. That is, the bonding wire 12 is pulled into the capillary 243. The operations from FIG. 4(a) to FIG. 4(d) are repeated until a predetermined pulling-in length is reached. The pulling-in length is the distance D1 from the tip of the bonding wire 12 located inside the capillary through-hole 243h to the tip of the capillary 243, as shown in FIG. 4(e).

[0038] [Wire Feeding Operation] With reference to FIG. 5, the feeding operation will be described. First, the lower wire clamp 27 at the proximity position 2N is closed, and the upper wire clamp 28 is opened (FIG. 5(a)). Next, the closed lower wire clamp 27 and the capillary 243 are moved downward toward the separation position 2F (FIG. 5(b)). At this time, since the bonding wire 12 is held by the lower wire clamp 27, the bonding wire 12 also moves as the lower wire clamp 27 moves downward. Next, the lower wire clamp 27 at the separation position 2F is opened, and the upper wire clamp 28 is closed (FIG. 5(c)). Next, the opened lower wire clamp 27 and the capillary 243 are moved upward toward the proximity position 2N (FIG. 5(d)). At this time, the bonding wire 12 is not held by the lower wire clamp 27. As the lower wire clamp 27 moves upward, the bonding wire 12 does not move. The capillary 243 moving upward relative to the non-moving bonding wire 12 means that, as seen from the bonding wire 12, the bonding wire 12 moves downward relative to the capillary 243. That is, the bonding wire 12 is fed into the capillary 243. As a result, comparing the state of FIG. 5(a) with the state of FIG. 5(d), the position of the capillary 243 is the same, but the tip of the bonding wire 12 has moved downward. That is, the bonding wire 12 is fed into the capillary 243. The operations from FIG. 5(a) to FIG. 5(d) are repeated until a predetermined protrusion length D2 is reached. The protrusion length D2 is the distance from the tip of the capillary 243 to the tip of the bonding wire 12, as shown in FIG. 5(e).

[0039] <Camera unit> The camera unit 4 images the semiconductor chip 11. The captured image of the semiconductor chip 11 is used for positioning the capillary 243 when wire bonding is performed on the semiconductor chip 11. Thus, the camera unit 4 functions as a wire bonding camera unit used for performing wire bonding.

[0040] The camera unit 4 is also used for the automatic replacement of the capillary 243 by the capillary replacement unit 5. For example, the camera unit 4 is used for the positioning operation of the release pin portion 511, which will be described later, during the operation of switching the locked state of the ultrasonic horn 242 to the released state. The camera unit 4 is used for the operation of determining whether the state of the bonding wire 12 protruding from the tip of the capillary 243 is in a state where bonding can be resumed.

[0041] The camera unit 4 includes a camera 41 having an imaging element, a camera arm 42 that supports the camera 41, a tool XY stage 22, and a camera control unit 66. The base end portion of the camera arm 42 is attached to the tool XY stage 22. The camera 41 is attached to the tip end portion of the camera arm 42. The camera arm 42 supports the camera 41 at a position above the bonding stage 3.

[0042] The camera unit 4 may acquire the elevation images of each part by combining optical path changing means such as mirrors and prisms. For example, as shown in FIG. 6, the case of imaging the periphery of the tip of the capillary 243 is illustrated. The capillary 243 protrudes from the lower surface side of the ultrasonic horn 242. Therefore, if the camera 41 is directly above the ultrasonic horn 242, the periphery of the tip of the capillary 243 cannot be imaged. Thus, the camera 41 is arranged at a position that does not overlap with the ultrasonic horn 242. As shown in FIG. 6, when the camera 41 and the capillary 243 are viewed from the front, the arrangement in which the axis of the capillary 243 and the optical axis of the camera 41 are offset may be referred to as an offset arrangement. An optical component 43 that changes the direction of light, such as a prism or a mirror, is arranged directly below the camera 41. According to such an optical system, the periphery of the tip of the capillary 243 can be imaged by the camera 41 arranged in an offset arrangement. Note that, if necessary, a light source component 44 such as a laser diode may be arranged. In this case, the capillary 243 is arranged between the optical component 43 and the light source component 44.

[0043] The camera 41 and the camera arm 42 are attached to the XY stage 22 for tools via the sub-base 23. That is, the camera 41 and the camera arm 42 can be translated along the XY plane together with the capillary 243 etc. by being driven by the XY stage 22 for tools. Thus, the XY stage 22 for tools functions as a part of the components of the wire bonding unit 2 and also functions as a part of the components of the camera unit 4. The camera control unit 66 controls various operations of the camera unit 4 and executes various processes. Details of the control performed by the camera control unit 66 will be described later.

[0044] <Capillary exchange unit> The capillary exchange unit 5 recovers the used capillary 243E attached to the ultrasonic horn 242 and mounts a new replacement capillary 243T on the ultrasonic horn 242. That is, the operation of exchanging the capillary 243 includes the operation of recovering the capillary 243 and the operation of mounting the capillary 243. The operation of exchanging the capillary 243 is automatically performed when preset conditions are satisfied. For example, the condition may be the number of bonding operations. That is, every time a predetermined number of bonding operations are performed, the operation of exchanging the capillary 243 may be performed.

[0045] FIG. 7 is a conceptual diagram showing the members constituting the capillary exchange unit 5. The capillary exchange unit 5 includes a release module 51, a transfer module 52, a replacement module 53, and a supply module 54. The release module 51, the transfer module 52, and the replacement module 53 are housed in the exchange unit main body 50 as an integrated device. The exchange unit main body 50 has a module slot 50a into which the supply module 54 is inserted.

[0046] <Release module> The release module 51 includes a release pin portion 511, a release shaft 512, and a release drive portion 513.

[0047] The release module 51 switches (release operation) from the state where the capillary 243 is constrained by the ultrasonic horn 242 to the state where the capillary 243 is released from the ultrasonic horn 242. Further, the release module 51 switches (lock operation) from the state where the capillary 243 is released from the ultrasonic horn 242 to the state where the capillary 243 is constrained by the ultrasonic horn 242.

[0048] When the capillary 243 is in the state of being constrained by the ultrasonic horn 242, the capillary 243 cannot be removed from the ultrasonic horn 242. When the capillary 243 is in the state of being released from the ultrasonic horn 242, the capillary 243 can be removed from the ultrasonic horn 242. Also, when the capillary 243 is in the state of being released from the ultrasonic horn 242, the capillary 243 can be attached to the ultrasonic horn 242.

[0049] [Release operation] Next, the gripping release operation for releasing the gripping of the capillary 243 by the ultrasonic horn 242 will be described. This gripping release operation is performed by the release module 51. As shown in Fig. 3(a), the ultrasonic horn 242 grips the capillary 243 inserted into the capillary mounting hole H1 by an elastic force. When releasing this grip, the release pin portion 511 of the release module 51 is inserted into the pin insertion hole H2 of the ultrasonic horn 242. The insertion operation of the release module 51 into the pin insertion hole H2 is performed by the release drive unit 513.

[0050] As shown in Fig. 3(b), with the release pin portion 511 inserted into the pin insertion hole H2, the release pin portion 511 is rotated 90 degrees around the Z axis. As a result, the first surface portion W1 and the second surface portion W2 are pressed by both end portions (both end portions in the longitudinal direction of the elliptical shape) of the release pin portion 511 in the first direction. When the first surface portion W1 and the second surface portion W2 are pressed by the release pin portion 511, the ultrasonic horn 242 elastically deforms. As a result, the distance between the first surface portion W1 and the second surface portion W2 of the pin insertion hole H2 becomes wider. The rotation operation of the release module 51 is performed by the release drive unit 513.

[0051] Here, the pin insertion hole H2 and the capillary attachment hole H1 communicate with each other via the slit S1. Therefore, as the distance between the first surface portion W1 and the second surface portion W2 is expanded by the release pin portion 511, the capillary attachment hole H1 is also expanded. When the capillary attachment hole H1 is expanded, the gripping of the capillary 243 by the ultrasonic horn 242 is released. That is, the gripping release operation is an operation of rotating the release module 51 with the release pin portion 511 inserted into the pin insertion hole H2. And the gripping release operation is an operation of pressing the first surface portion W1 and the second surface portion W2 by both end portions in the first direction (both end portions in the longitudinal direction of the elliptical shape) of the release pin portion 511, thereby expanding the distance between the first surface portion W1 and the second surface portion W2 and expanding the capillary attachment hole H1. Thus, the release module 51 expands the pin insertion hole H2 and expands the capillary attachment hole H1, and releases the gripping of the capillary 243 by the ultrasonic horn 242.

[0052] As shown in FIG. 3(b), with the capillary attachment hole H1 expanded by the release module 51, the capillary 243 is removed from the ultrasonic horn 242, and a new capillary 243 is inserted into the capillary attachment hole H1. This replacement of the capillary 243 is performed by the capillary replacement unit 5. Then, as shown in FIG. 3(c), the release pin portion 511 is rotated 90 degrees around the Z axis, and the pressing of the first surface portion W1 and the second surface portion W2 by the release pin portion 511 is released. That is, the gripping release operation is released. As a result, the pin insertion hole H2 and the capillary attachment hole H1 attempt to return to the original shape shown in FIG. 3(a). Due to the elastic force attempting to return to the original shape, the capillary 243 inserted into the capillary attachment hole H1 is gripped by the inner wall surface of the capillary attachment hole H1.

[0053] Thereafter, as shown in FIG. 3(d), the release pin portion 511 is withdrawn from the pin insertion hole H2. Thus, with the ultrasonic horn 242, the release module 51 can be used to grip and release the gripping of the capillary 243 by the ultrasonic horn 242.

[0054] <Transfer module> Refer to FIG. 7 again. The transfer module 52 includes a transfer carriage 521, a transfer linear shaft 522, and a transfer drive unit 523. The transfer module 52 further includes a transfer rotary rack 524 and a transfer rotary pinion 525.

[0055] The transfer module 52 extracts the used capillary 243E from the ultrasonic horn 242 at the replacement position 52S. Further, the transfer module 52 transports the extracted used capillary 243E from the replacement position 52S to the waste.

[0056] The transfer module 52 receives the replacement capillary 243T from the replacement module 53 at the replacement position 52E. The transfer module 52 transports the replacement capillary 243T from the replacement position 52E to the replacement position 52S. The transfer module 52 inserts the replacement capillary 243T into the ultrasonic horn 242 at the replacement position 52S.

[0057] Thus, the movement of the transfer carriage 521 includes a linear movement between the replacement position 52S and the replacement position 52E and a rotational movement that changes the posture of the used capillary 243E. In this embodiment, all periods of the rotational movement overlap with some periods of the linear movement. In other words, the period of the linear movement includes a period of only linear movement and a period in which the linear movement and the rotational movement are parallel.

[0058] The transfer module 52 having the above-described configuration can execute a first transfer operation and a second transfer operation described below.

[0059] [First transfer operation] Here, the case of transporting the used capillary 243E from the replacement position 52S to the replacement position 52E is referred to as the first transfer operation. In the first transfer operation, first, a linear movement downward is started, and only the linear movement is executed until the transfer carriage 521 reaches the transfer rotary rack 524.

[0060] The linear movement is executed by the conveyance linear movement shaft 522 and the conveyance drive unit 523. The conveyance carriage 521 and the conveyance linear movement shaft 522 constitute a so-called feed screw mechanism. When the conveyance drive unit 523 rotates the conveyance linear movement shaft 522, the conveyance carriage 521 installed on the conveyance linear movement shaft 522, which is a screw shaft, moves linearly. The moving direction of the conveyance carriage 521 is determined by the rotational direction of the conveyance linear movement shaft 522. Note that, instead of a feed screw, a mechanism such as a ball screw may be adopted.

[0061] And after the conveyance carriage 521 reaches the conveyance rotation rack 524, the linear movement and the rotational movement in the clockwise direction are executed in parallel.

[0062] More specifically, a conveyance rotation rack 524 is provided on the lower end side of the conveyance linear movement shaft 522. As shown in FIG. 9(a), when the conveyance carriage 521 at the replacement position 52S approaches the lower end side of the conveyance linear movement shaft 522, a conveyance rotation pinion 525 provided on the conveyance carriage 521 meshes with the conveyance rotation rack 524 as shown in FIG. 9(b). As a result, as the conveyance carriage 521 moves, the conveyance carriage 521 rotates in a predetermined direction (see FIG. 9(c)). For example, as shown in FIG. 9(d), the conveyance carriage 521 rotates 90 degrees in the clockwise direction. As a result, the posture (replacement posture) of the used capillary 243E that has moved to the replacement position 52E is different from the posture (exchange posture) of the used capillary 243E at the exchange position 52S. Here, the posture of the used capillary 243E may be defined as the angle of the axis AE of the used capillary 243E with respect to the Z-axis direction. For example, the posture of the used capillary 243E at the exchange position 52S has an angle of 0 degrees with respect to the Z-axis direction. For example, the posture of the used capillary 243E at the replacement position 52E has an angle of 90 degrees with respect to the Z-axis direction.

[0063] In addition, if a direction definition is added to the axis AE of the used capillary 243E, the posture of the used capillary 243E can be defined in more detail. For example, the direction from the proximal end to the distal end of the used capillary 243E is defined as positive. Also in this case, the posture of the used capillary 243E at the replacement position 52S has an angle of 0 degrees with respect to the Z-axis direction. For example, when the distal end of the used capillary 243E is on the upper side and the proximal end is on the lower side due to the rotation of the transfer carriage 521, it can be said that the posture of the used capillary 243E at the replacement position 52S has an angle of 180 degrees with respect to the Z-axis direction.

[0064] [Second Transfer Operation] Next, the case of transporting the replacement capillary 243T from the replacement position 52E to the replacement position 52S is referred to as the second transfer operation. As shown in FIGS. 10(a) and 10(b), in the second transfer operation, a linear movement upward is started, and at the same time, a rotational movement counterclockwise is executed in parallel. During the period when the transfer carriage 521 is engaged with the transfer rotation rack 524, the linear movement and the rotational movement are parallel. Then, as shown in FIGS. 10(c) and 10(d), after the transfer carriage 521 is disengaged from the transfer rotation rack 524, only the linear movement upward is executed.

[0065] [Replacement Module] The replacement module 53 includes a replacement table 531, a replacement drive unit 532, a replacement linear motion shaft 533, a replacement shaft 534, a replacement operating piece 535, and a replacement fixing piece 536.

[0066] [Withdrawal Operation] The replacement module 53 pulls out the used capillary 243E conveyed to the replacement position 52E from the conveyance carriage 521. More specifically, due to the operations of the replacement drive unit 532 and the replacement linear motion shaft 533, the replacement table 531 and the replacement operation piece 535 move away from the replacement fixing piece 536 integrally (see Fig. 11(b)). Since the replacement operation piece 535 is caught by the capillary taper portion 243b of the capillary 243, when the replacement operation piece 535 moves in the direction away from the replacement fixing piece 536, the capillary 243 also moves in the direction away from the replacement fixing piece 536 along with the movement of the replacement operation piece 535. As a result, the capillary 243 is pulled out from the conveyance carriage 521.

[0067] [Replacement operation] Furthermore, the replacement module 53 inserts the replacement capillary 243T into the conveyance carriage 521 from which the used capillary 243E has been pulled out. More specifically, due to the operations of the replacement drive unit 532 and the replacement linear motion shaft 533, the replacement table 531 and the replacement operation piece 535 move closer to the replacement fixing piece 536 integrally. The operation of the replacement table 531 and the replacement operation piece 535 moving closer to the replacement fixing piece 536 includes several steps described below.

[0068] As a first step (see Fig. 12(a)), as the replacement table 531 moves, the upright portion 531a of the replacement table 531 approaches the replacement fixing piece 536 while pressing the base end surface of the replacement capillary 243T located at the capillary supply port 54b. As a result, the replacement capillary 243T drops from the capillary supply port 54b onto the replacement table 531 (see Fig. 12(b)). As a second step, as the replacement table 531 moves, the replacement operation piece 535 contacts the replacement fixing piece 536 (see Fig. 12(c)). As a third step, as the replacement table 531 moves, the replacement table 531 approaches the replacement fixing piece 536 further. In this third step, since the replacement operation piece 535 is in contact with the replacement fixing piece 536, the replacement operation piece 535 does not move. Therefore, in the third step, the replacement table 531 carrying the replacement capillary 243T approaches the replacement operation piece 535 that contacts the replacement fixing piece 536. In other words, in the third step, the distance from the replacement table 531 carrying the replacement capillary 243T to the replacement operation piece 535 that contacts the replacement fixing piece 536 gradually becomes shorter. As a fourth step (see Fig. 12(d)), as the replacement table 531 moves, the capillary taper portion 243b of the replacement capillary 243T on the replacement table 531 passes through the replacement operation piece 535 and the replacement fixing piece 536 and is inserted into the transfer carriage 521.

[0069] <Supply module> The supply module 54 has a capillary storage portion 54a and a capillary supply port 54b.

[0070] The supply module 54 can be removed from the module slot 50a as necessary. The supply module 54 stores a plurality of replacement capillaries 243T in the capillary storage portion 54a. The supply module 54 supplies the replacement capillaries 243T to the replacement module 53 one by one from the capillary supply port 54b according to the operation of the replacement module 53.

[0071] Next, with reference to FIG. 8, the positional relationship among the above-described conveyance module 52, replacement module 53, and supply module 54 will be described. According to the positional relationship of each module described below, the area required for the operation until the replacement capillary 243T is inserted into the ultrasonic horn 242 can be made compact.

[0072] To describe the positional relationship of each module, a first reference line B1, a second reference line B2, and a third reference line B3 are defined. These reference lines are based on the axis AE of the used capillary 243E attached to the ultrasonic horn 242. The first reference line B1 is defined as overlapping the axis AE of the used capillary 243E. The second reference line B2 is defined as being orthogonal to the first reference line B1. Then, the first reference line B1 and the second reference line B2 define a first intersection point C1, which is the point where the first reference line B1 and the second reference line B2 intersect each other. Further, the third reference line B3 is defined as being parallel to the first reference line B1 and separated from the first reference line B1 in the direction of the second reference line B2. Then, the second reference line B2 and the third reference line B3 define a second intersection point C2, which is the point where the second reference line B2 and the third reference line B3 intersect each other.

[0073] First, the conveyance module 52 is arranged to overlap the first reference line B1. Also, the conveyance module 52 is arranged to include the first intersection point C1. Here, "including the first intersection point C1" means that, as shown in FIG. 8, when the conveyance module 52 is viewed from the front, the first intersection point C1 is located within the area of the conveyance module 52. For example, the first intersection point C1 may be located at the above-described replacement position 52E. Further, the first intersection point C1 may be located at the rotation center of the capillary catcher 52F of the conveyance carriage 521 located at the replacement position 52E. Then, for example, the first reference line B1 may overlap the central axis of the cylindrical capillary catcher 52F.

[0074] Next, the replacement module 53 is arranged to overlap with the second reference line B2. The replacement module 53 is arranged to be adjacent to the transfer module 52 along the direction of the second reference line B2. That is, when the replacement module 53 is viewed from the front, the second reference line B2 is located within the area of the replacement module 53. The second reference line B2 may coincide with the axis defining the direction in which the used capillary 234E is pulled out from the capillary catcher 52F of the transfer carriage 521. In other words, the second reference line B2 may coincide with the axis defining the direction in which the replacement capillary 243T is inserted into the capillary catcher 52F of the transfer carriage 521. Also, the replacement module 53 is arranged to include the second intersection point C2. What is meant by "including the second intersection point C2" is the same as that described in the description of "including the first intersection point C1".

[0075] The supply module 54 is arranged to be adjacent to the transfer module 52 along the direction of the second reference line B2. Also, the supply module 54 is arranged to overlap with the third reference line B3. More precisely, the supply module 54 is inserted into the module slot 50a of the replacement unit main body 50 as described above. Therefore, a configuration in which a part of the supply module 54 is integrated with the replacement module 53 is also included in the configuration in which the supply module 54 is adjacent to the transfer module 52. Since the replacement module 53 is arranged at the second intersection point C2 on the third reference line B3, a configuration for passing the replacement capillary 243T from the supply module 54 to the replacement module 53 is arranged on the third reference line B3. This configuration for passing the replacement capillary 243T from the supply module 54 to the replacement module 53 is the capillary supply port 54b described above.

[0076] According to the transfer module 52, the replacement module 53, and the supply module 54 arranged as described above, the replacement capillary 243T is inserted into the ultrasonic horn 242 through the following movement.

[0077] The replacement capillary 243T is held in the capillary housing portion 54a of the supply module 54. A plurality of replacement capillaries 243T are arranged in the supply direction SD orthogonal to the axis AT of the replacement capillary 243T in the capillary housing portion 54a. This supply direction SD is the direction facing the replacement module 53 along the third reference line B3. The plurality of replacement capillaries 243T in the capillary housing portion 54a move from the capillary housing portion 54a to the capillary supply port 54b along the supply direction SD each time the replacement capillary 243T is taken out from the capillary supply port 54b. That is, the replacement capillary 243T undergoes a movement along the third reference line B3 when moving from the capillary housing portion 54a to the capillary supply port 54b.

[0078] The replacement module 53 takes out the replacement capillary 243T located at the capillary supply port 54b. Specifically, the replacement module 53 moves the replacement capillary 243T located at the capillary supply port 54b along the axis AT of the replacement capillary 243T. The capillary supply port 54b includes a protrusion 54b1 that prevents the replacement capillary 243T from falling and a gap 54b2 for dropping the replacement capillary 243T. The replacement capillary 243T located at the capillary supply port 54b is caught by the protrusion 54b1. When the replacement module 53 moves the replacement capillary 243T in the insertion direction (see Fig. 12(b)), the replacement capillary 243T moves from the protrusion 54b1 to the gap 54b2. As a result, the replacement capillary 243T drops from the gap 54b2 and is placed on the replacement table 531 of the replacement module 53.

[0079] That is, the replacement capillary 243T undergoes a movement along the third reference line B3 and a movement along the second reference line B2 when moving from the supply module 54 to the replacement module 53. The details of the movement from the supply module 54 to the replacement module 53 have also been described in the [Replacement Operation] based on Figs. 12(a), 12(b), 12(c), and 12(d).

[0080] The transfer module 52 performs an operation of receiving the replacement capillary 243T, and a transfer operation of linearly moving the received replacement capillary 243T by a predetermined distance and rotating it by a predetermined angle. The receiving operation (see S308: FIG. 19(d)) is that the replacement capillary 243T is inserted into the transfer carriage 521 waiting at the replacement position 52E. That is, the receiving operation is an active operation of moving the replacement table 531 as seen from the replacement module 53. On the other hand, the receiving operation is a passive operation of waiting for the transfer carriage 521 at the replacement position 52E as seen from the transfer module 52. Note that the receiving operation may be understood to mean an operation of moving the transfer carriage 521 to the replacement position 52E.

[0081] On the other hand, the transfer operation (see S309: FIG. 20(a)) is an active operation of the transfer module 52. The transfer operation described here means the above-mentioned [Second Transfer Operation]. Therefore, detailed description is omitted.

[0082] <Controller> The controller 6 controls the operations of the wire bonding unit 2 and the capillary exchange unit 5. The controller 6 is a computer having a processor that executes various programs and a memory that stores programs and a desired database. The controller 6 receives information provided from various sensors provided in the wire bonding apparatus 1. Then, the controller 6 outputs a control signal for controlling the operations of the wire bonding unit 2 and the capillary exchange unit 5 using the received information.

[0083] By executing the capillary exchange program, the controller 6 performs the functions of several functional components shown in FIG. 13. Specifically, the controller 6 includes a bonding control unit 61, a clamper control unit 62, a release control unit 63, a conveyance control unit 64, and a replacement control unit 65. The bonding control unit 61 outputs a control signal G61a to the Z-axis drive unit 25 and a control signal G61b to the XY stage 22 for the tool. The clamper control unit 62 outputs a control signal G62a to the lower wire clamper 27 and a control signal G62b to the upper wire clamper 28. The release control unit 63 outputs a control signal G63 to the release drive unit 513 of the capillary exchange unit 5. The conveyance control unit 64 outputs a control signal G64 to the conveyance drive unit 523 of the capillary exchange unit 5. The replacement control unit 65 outputs a control signal G65 to the replacement drive unit 532 of the capillary exchange unit 5.

[0084] As functional components, the controller 6 includes a camera control unit 66 and a detection sensor control unit 67. The camera control unit 66 processes the planar image and the elevation image acquired by the camera 41. As a result, the positions of each part in the XYZ directions are detected.

[0085] The detection sensor control unit 67 receives detection data from a plurality of detection sensors 50S provided in the capillary exchange unit 5. For example, the detection sensor 50S confirms that the used capillary 243E and the replacement capillary 243T that are sequentially conveyed inside the capillary exchange unit 5 are present at predetermined positions. After the controller 6 confirms that the used capillary 243E and the replacement capillary 243T are present at the predetermined positions, it proceeds to the next operation.

[0086] <Method for Exchanging Capillary> The method for replacing the capillary described below is executed by the functional components of the controller 6 shown in FIG. 13. In the following description, the manner in which the controller 6 replaces the capillary will be described in detail. The flowchart of FIG. 14 shows the main steps of the method for replacing the capillary. The three main steps constituting the method for replacing the capillary are illustrated in detail in FIGS. 15, 17, and 21, respectively.

[0087] <Preparation for Capillary Replacement> First, the controller 6 determines whether the conditions for capillary replacement are satisfied (S1). When the controller 6 determines that the conditions for capillary replacement are not satisfied (S1: NO), it resumes bonding without replacing the in-use capillary 243 (S5). When the controller 6 determines that the conditions for capillary replacement are satisfied (S1: YES), it proceeds to the operation of replacing the used capillary 243E (S2, S3, S4).

[0088] The controller 6 performs the preparation for capillary replacement (S2). More specifically, as shown in FIG. 15, first, the controller 6 ends the bonding (S21). The controller 6 outputs a control signal D61a for stopping the arc reciprocating motion of the bonding module 24 to the Z-axis drive unit 25.

[0089] Next, the controller 6 forms a straight tail (S22). The straight tail is a part of the bonding wire 12 protruding from the tip of the capillary 243 and having no ball 122 (see FIG. 5(d)) formed at its tip. When the ball 122 is formed, the tip of the bonding wire 12 cannot be drawn into the capillary through-hole 243h, but with the straight tail, the tip of the bonding wire 12 can be drawn into the capillary through-hole 243h. That is, forming a straight tail means removing the ball 122, and the operation of removing the ball 122 is called a so-called discard bond operation.

[0090] First, the controller 6 moves the capillary 243 over the discard bond stage 15 (FIG. 16(a), S221). Next, the controller 6 opens the upper wire clamp 28 and lowers the capillary 243 together with the opened lower wire clamp 27. As a result, the ball 122 is bonded to the discard bond stage 15. Next, the controller 6 closes the upper wire clamp 28 and raises the capillary 243 together with the opened lower wire clamp 27. Next, the controller 6 opens the upper wire clamp 28 and closes the lower wire clamp 27. Then, the controller 6 raises the capillary 243 together with the closed lower wire clamp 27. As a result, the bonding wire 12 is cut at a location where the strength is relatively reduced. For example, due to the bonding, the strength of the neck connecting the ball 122 and the bonding wire 12 is likely to decrease, so the bonding wire 12 is cut at this location.

[0091] Then, the controller 6 draws the tip of the bonding wire 12 into the used capillary 243E (S23). This step S23 is the aforementioned [drawing-in operation] described with reference to FIG. 4.

[0092] <Capillary replacement: S3> First, as shown in FIG. 17, the controller 6 advances the sub-base 23 toward the capillary replacement unit 5 (S301, see FIGS. 16(b) and 18(a)). According to this operation, the capillary 243 moves from above the discard bond stage 15 onto the capillary replacement unit 5. Next, the controller 6 lowers the ultrasonic horn 242 to insert the used capillary 243E into the capillary guide portion 55 (S302, see FIG. 18(b)).

[0093] Next, the controller 6 inserts the release pin portion 511 into the pin insertion hole H2 (see S303 and FIG. 18(c)). In this operation, only the release pin portion 511 is inserted into the pin insertion hole H2, and the release operation by rotating the release pin portion 511 is not executed. Therefore, in this operation, the capillary 243 is in a state of being constrained by the ultrasonic horn 242. Next, the controller 6 moves the transfer carriage 521 upward (see S304 and FIG. 18(d)). As a result, the capillary 243 is inserted into the transfer carriage 521. When the capillary 243 is inserted, the transfer carriage 521 holds the capillary 243. Next, the controller 6 rotates the release pin portion 511 clockwise (see S305 and FIG. 19(a)). This step S305 is the aforementioned [Release Operation] described with reference to FIG. 3. As a result, the capillary 243 is released from the state of being constrained by the ultrasonic horn 242 (release state).

[0094] Next, the controller 6 moves the transfer carriage 521 from the replacement position 52S to the replacement position 52E (see S306 and FIG. 19(b)). This step S306 is the aforementioned [First Transfer Operation] described with reference to FIG. 9. As a result of this step S306, the used capillary 243E moves from the replacement position 52S to the replacement position 52E, and the posture of the used capillary 243E becomes the replacement posture with an angle of 0 degrees with respect to the Z-axis and the replacement posture with an angle of 90 degrees with respect to the Z-axis.

[0095] Next, the controller 6 moves the replacement table 531 in the pulling-out direction (see S307 and FIG. 19(c)). This step S307 is the aforementioned [Pulling-Out Operation] described with reference to FIG. 11. Next, the controller 6 moves the replacement table 531 in the insertion direction (see S308 and FIG. 19(d)). This step S308 is the aforementioned [Replacement Operation] described with reference to FIG. 12. As a result of these pulling-out operation (S307) and replacement operation (S308), the used capillary 243E held by the transfer carriage 521 at the second position is replaced with the replacement capillary 243T.

[0096] Next, the controller 6 moves the transport carriage 521 from the replacement position 52E to the exchange position 52S (see S309, Fig. 20(a)). This step S309 is the aforementioned [Second Transport Operation] described with reference to Fig. 10. As a result of this step S309, the replacement capillary 243T moves from the replacement position 52E to the exchange position 52S, and the posture of the replacement capillary 243T changes from the replacement posture with an angle of 90 degrees with respect to the Z-axis to the exchange posture with an angle of 0 degrees with respect to the Z-axis. The ascending replacement capillary 243T is guided by the capillary guide portion 55 into the capillary through-hole 243h of the ultrasonic horn 242. Since the used capillary 243E is being pulled out from the ultrasonic horn 242 with the used capillary 243E in contact with the capillary guide portion 55, it can be said that the position of the used capillary 243E is stored by the capillary guide portion 55. Therefore, the replacement capillary 243T guided by the capillary guide portion 55 that stores the position of the used capillary 243E can be accurately inserted into the position of the used capillary 243E. Similarly, when pulling out the used capillary 243E, the bonding wire 12 is not affected at all. Therefore, the tip of the bonding wire 12 is guided into the capillary through-hole 243h of the replacement capillary 243T inserted to be in the same position as the used capillary 243E.

[0097] Next, the controller 6 rotates the release pin portion 511 in the reverse direction (see S310, Fig. 20(b)). By this reverse rotation, the ultrasonic horn 242 switches from the release state to the locked state. As a result, the replacement capillary 243T is fixed to the ultrasonic horn 242. Next, the controller 6 lowers the transport carriage 521 to a predetermined position (see S311, Fig. 20(c)). Then, the release pin portion 511 is pulled out from the pin insertion hole H2 (see S312, Fig. 20(c)). Next, the controller 6 raises the ultrasonic horn 242 to pull out the replacement capillary 243T from the capillary guide portion 55 (see S313, Fig. 20(d)). Then, the controller 6 retracts the sub-base 23 (see S314, Fig. 16(c)).

[0098] <Bonding Preparation: S4> Then, the controller 6 executes the bonding preparation shown in FIG. 21 (S4). As conditions for resuming bonding, a first condition and a second condition may be set. The first condition is the protruding length D2 of the bonding wire 12 protruding from the tip of the capillary 243. The second condition is the shape of the ball 122 formed at the tip of the bonding wire 12. In step S4, a bonding wire 12 that satisfies the first condition and the second condition is formed. The controller 6 first makes the state satisfy the first condition, and then makes the state satisfy the second condition after the first condition is satisfied.

[0099] First, the controller 6 executes a feeding operation (S41). This step S41 is the aforementioned [feeding operation] described with reference to FIG. 5. Next, the controller 6 executes protruding length measurement (S42). This protruding length measurement may use an image captured using the camera 41 and the optical component 43 as shown in FIG. 5. The controller 6 obtains the protruding length D2 by analyzing the image.

[0100] Next, the controller 6 determines whether the protruding length D2 of the wire is longer than the lower limit value (S43). When the controller 6 determines that the protruding length D2 is not longer than the lower limit value (S43: NO), that is, when the protruding length D2 is shorter than the lower limit value, the controller 6 executes a feeding operation (S44). Then, the controller 6 executes protruding length measurement again (S42). On the other hand, when the controller 6 determines that the protruding length D2 is longer than the lower limit value (S43: YES), the controller 6 determines whether the protruding length D2 of the bonding wire 12 is shorter than the upper limit value (S45).

[0101] When the controller 6 determines that the protrusion length D2 is not shorter than the upper limit value (S45: NO), that is, when the protrusion length D2 is longer than the upper limit value, it executes the retraction operation (S46). Then, the controller 6 measures the protrusion length again (S42). When the controller 6 determines that the protrusion length D2 is shorter than the upper limit value (S45: YES), it completes the preparation for bonding.

[0102] That is, by the controller 6 executing steps S42 to S46, the protrusion length D2 within the range not less than the lower limit value and not more than the upper limit value can be obtained.

[0103] Next, the controller 6 forms a ball 122 at the tip of the bonding wire 12 (S47). The controller 6 moves the tip of the bonding wire 12 to the discharge region of the discharge device. Then, the controller 6 operates the discharge device to form a ball 122 at the tip of the bonding wire 12. Next, the controller 6 determines whether the shape of the ball 122 satisfies a predetermined condition (S48). This determination may also use the image captured using the camera 41 and the optical component 43. The controller 6 obtains information regarding the shape of the ball 122 by analyzing the image.

[0104] When the controller 6 determines that the shape of the ball 122 does not satisfy the condition (S48: NO), it forms the ball 122 again. Specifically, the controller 6 removes the ball 122 that did not satisfy the condition by discard bonding (S49). Then, the controller 6 forms the ball 122 again by the discharge device. On the other hand, when the controller 6 determines that the shape of the ball 122 satisfies the condition (S48: YES), the preparation for resuming bonding is complete. Then, the controller 6 resumes bonding (S5).

[0105] <Advantages and effects> The wire bonding apparatus 1 includes an ultrasonic horn 242, a capillary 243 detachably attached to the ultrasonic horn 242, and a capillary exchange unit 5 that exchanges a used capillary 243E for a replacement capillary 243T. The capillary exchange unit 5 has a capillary storage section 54a that stores a plurality of replacement capillaries 243T arranged side by side in a supply direction SD orthogonal to the axis AT of the replacement capillary 243T, and a capillary supply port 54b for taking out the replacement capillary 243T. The supply module 54 moves the replacement capillary 243T from the capillary storage section 54a to the capillary supply port 54b along the supply direction SD. The replacement module 53 executes an operation of taking out the replacement capillary 243T from the capillary supply port 54b by moving the replacement capillary 243T located at the capillary supply port 54b along the axis AT, and an operation of moving the taken-out replacement capillary 243T along the axis AT. The transfer module 52 executes an operation of receiving the replacement capillary 243T moved by the operation of the replacement module 53 and a transfer operation of linearly moving the received replacement capillary 243T by a predetermined distance and rotating it by a predetermined angle.

[0106] The wire bonding apparatus 1 and the capillary exchange unit 5 can move the replacement capillary 243T in three modes: movement in the supply direction SD, movement along the axes AT and AE, and rotation by a predetermined angle. As a result, the degree of freedom in arranging the supply module 54, the replacement module 53, and the transfer module 52 for the automatic capillary exchange function is increased. Therefore, since these modules can be arranged so that the area required for arranging the capillary exchange unit 5 becomes compact, the automatic capillary exchange function can be provided while suppressing an increase in size.

[0107] In the capillary exchange unit 5, a first reference line B1 overlapping the axis AE of the used capillary 243E held by the ultrasonic horn 242 and a second reference line B2 orthogonal to the first reference line B1 are defined. The transport module 52 is arranged to include the first intersection point C1 of the first reference line B1 and the second reference line B2. The replacement module 53 is arranged to be adjacent to the transport module 52 along the direction of the second reference line B2. According to this configuration, the replacement module 53 can be arranged adjacent to the transport module 52.

[0108] In the capillary exchange unit 5, a first reference line B1 overlapping the axis AE of the used capillary 243E held by the ultrasonic horn 242 and a second reference line B2 orthogonal to the first reference line B1 are defined. The transport module 52 is arranged to include the first intersection point C1 of the first reference line B1 and the second reference line B2. The supply module 54 is arranged to be adjacent to the transport module 52 along the direction of the second reference line B2. According to this configuration, the supply module 54 can be arranged adjacent to the transport module 52.

[0109] In the capillary exchange unit 5, a first reference line B1 overlapping the axis AE of the used capillary 243E held by the ultrasonic horn 242, a second reference line B2 orthogonal to the first reference line B1, and a third reference line B3 parallel to the first reference line B1 and spaced apart from the first reference line B1 in the direction of the second reference line B2 are defined. The replacement module 53 is arranged to include the intersection point of the second reference line B2 and the third reference line B3. The supply module 54 is arranged on the third reference line B3 and adjacent to the replacement module 53 along the direction of the third reference line B3. According to this configuration, the supply module 54 can be arranged above the replacement module 53.

[0110] In the capillary exchange unit 5, a first reference line B1 overlapping the axis AE of the used capillary 243E held by the ultrasonic horn 242, a second reference line B2 orthogonal to the first reference line B1, and a third reference line B3 parallel to the first reference line B1 and spaced apart from the first reference line B1 in the direction of the second reference line B2 are defined. The transfer module 52 is arranged to include the intersection of the first reference line B1 and the second reference line B2. The replacement module 53 is arranged to include the intersection of the second reference line B2 and the third reference line B3. The supply module 54 is arranged on the third reference line B3 and adjacent to the replacement module 53 along the direction of the third reference line B3. According to this configuration, the replacement module 53 can be arranged adjacent to the transfer module 52, and the supply module 54 can be arranged above the replacement module 53.

[0111] <Modification Example> As described above, examples of the capillary exchange mechanism and the wire bonding apparatus according to the present invention have been described. However, the capillary exchange mechanism and the wire bonding apparatus are not limited to the above-described embodiment. For example, the positional relationship among the transfer module 52, the replacement module 53, and the supply module 54 is not limited to the example shown in FIG. 8. As another example of the positional relationship among the transfer module 52, the replacement module 53, and the supply module 54, Modification Example 1 and Modification Example 2 will be described.

[0112] <Modification Example 1> The positional relationship among the transfer module 52, the replacement module 53, and the supply module 54 in the capillary exchange unit 5A of Modification Example 1 is schematically shown in FIG. 22. As shown in FIG. 22, the transfer module 52, the replacement module 53, and the supply module 54 of the capillary exchange unit 5A of Modification Example 1 can also be defined by the first reference line B1, the second reference line B2, and the first intersection C1. The definitions of the first reference line B1, the second reference line B2, and the first intersection C1 are the same as the definitions described in the embodiment.

[0113] First, the transport module 52 of Modification 1 is arranged to overlap with the first reference line B1, similar to the embodiment. On the other hand, the transport module 52 of Modification 1 is arranged not to include the first intersection point C1, different from the embodiment.

[0114] Next, the replacement module 53 of Modification 1 is arranged to overlap with the first reference line B1, different from the embodiment. Further, the replacement module 53 is arranged to be adjacent to the transport module 52 along the direction of the first reference line B1. Further, the replacement module 53 is arranged to include the first intersection point C1, different from the embodiment. For example, it can be said that the replacement module 53 of Modification 1 is arranged below the transport module 52.

[0115] Then, the supply module 54 of Modification 1 is arranged to overlap with the second reference line B2. The replacement capillary 243T held by the supply module 54 of Modification 1 has its axis AT parallel to the first reference line B1. In FIG. 22, the supply module 54A1 is arranged on the right side of the replacement module 53 in the drawing. The supply module 54A2 may be arranged on the left side of the replacement module 53 in the drawing.

[0116] In the capillary replacement unit 5A of Modification 1, the movement of the replacement capillary 243T is different from that in the embodiment in the transport module 52. In the embodiment, the posture of the replacement capillary 243T received by the transport module 52 from the replacement module 53 was such that the axis AT of the replacement capillary 243T was 90 degrees with respect to the first reference line B1 (Z-axis). On the other hand, in Modification 1, the posture of the replacement capillary 243T received by the transport module 52 from the replacement module 53 is such that the axis AT of the replacement capillary 243T is 180 degrees with respect to the first reference line B1 (Z-axis). That the axis AT of the replacement capillary 243T is 180 degrees with respect to the first reference line B1 (Z-axis) means that the axis AT of the replacement capillary 243T overlaps (is parallel to) the first reference line B1, but the direction of the replacement capillary 243T is reversed. The tip of the capillary 233E held by the ultrasonic horn 242 was downward. In contrast, in Modification 1, the tip of the replacement capillary 243T received by the transport module 52 from the replacement module 53 is upward.

[0117] Also with the capillary replacement unit 5A of Modification 1, similar to the capillary replacement unit 5 of the embodiment, the area required for the operation until the replacement capillary 243T is inserted into the ultrasonic horn 242 can be made compact.

[0118] In the capillary replacement unit 5A, a first reference line B1 overlapping the axis AE of the used capillary 243E held by the ultrasonic horn 242 is defined. The transport module 52 is arranged to overlap the first reference line B1. The replacement module 53 is arranged to overlap the first reference line B1 and to be adjacent to the transport module 52 along the direction of the first reference line B1. According to this configuration, the replacement module 53 can be arranged below the transport module 52.

[0119] In the capillary exchange unit 5A, a first reference line B1 overlapping the axis AE of the used capillary 243E held by the ultrasonic horn 242 and a second reference line B2 orthogonal to the first reference line B1 are defined. The transfer module 52 is arranged to overlap the first reference line B1 but not to include the first intersection point C1 between the first reference line B1 and the second reference line B2. The supply module 54 is arranged to overlap the second reference line B2. According to this configuration, the supply module 54 can be arranged below the transfer module 52.

[0120] In the capillary exchange unit 5A, a first reference line B1 overlapping the axis AE of the used capillary 243E held by the ultrasonic horn 242 and a second reference line B2 orthogonal to the first reference line B1 are defined. The replacement module 53 is arranged to include the first intersection point C1 of the first reference line B1 and the second reference line B2. The supply module 54 is arranged to overlap the second reference line B2. According to this configuration, the supply module 54 can be arranged adjacent to the replacement module 53.

[0121] In the capillary exchange unit 5A, a first reference line B1 overlapping the axis AE of the used capillary 243E held by the ultrasonic horn 242 and a second reference line B2 orthogonal to the first reference line B1 are defined. The transfer module 52 is arranged to overlap the first reference line B1 but not to include the first intersection point C1 between the first reference line B1 and the second reference line B2. The replacement module 53 is arranged to include the second intersection point C2 of the first reference line B1 and the second reference line B2. The supply module 54 is arranged to overlap the second reference line B2. According to this configuration, the replacement module 53 can be arranged below the transfer module 52 and the supply module 54 can be arranged adjacent to the replacement module 53.

[0122] <Modification 2> In the capillary replacement unit 5 of the embodiment, a transfer module 52, a replacement module 53, and a supply module 54 were arranged on a so-called YZ plane. Similar to the capillary replacement unit 5B of Modification 2 shown in FIG. 23, the transfer module 52, the replacement module 53, and the supply module 54 may be arranged on a so-called XZ plane. Even with such a configuration, similar to the capillary replacement unit 5 of the embodiment, the area required for the operation until the replacement capillary 243T is inserted into the ultrasonic horn 242 can be made compact. Further, the capillary replacement unit 5B of Modification 2 has a plurality (four in the example shown in FIG. 23) of replacement modules 53 and supply modules 54. The same type of replacement capillary 243T may be held in each of the four supply modules 54. In this case, the number of times of replacing the empty supply module 54 with a new supply module 54 filled with the replacement capillary 243T can be reduced. Further, different types of replacement capillaries 243T may be held in each of the four supply modules 54. The bonding mode required for the wire bonding apparatus may be different for each semiconductor chip 11. Also, even in the same semiconductor chip 11, the bonding mode may be different for each location. When different types of replacement capillaries 243T are held in the four supply modules 54, the appropriate replacement capillary 243T can be inserted into the ultrasonic horn 242 according to the required bonding mode.

Explanation of Signs

[0123] 1... Wire bonding apparatus, 5... Capillary replacement unit (capillary replacement mechanism), 41... Camera, 52... Transfer module, 52S... Replacement position, 52E... Removal position, 53... Replacement module, 122... Ball, 242... Ultrasonic horn (horn), 243... Capillary, 243E... Used capillary, 243h... Capillary through hole, 243T... Replacement capillary, AE, AT... Axis.

Claims

1. A housing portion that houses a plurality of replacement capillaries arranged in a supply direction orthogonal to the axis of the replacement capillary, and a capillary supply port for taking out the replacement capillary, and a supply module that moves the replacement capillary from the housing portion to the capillary supply port along the supply direction. A replacement module that executes an operation of taking out the replacement capillary from the capillary supply port by moving the replacement capillary located at the capillary supply port along the axis, and an operation of moving the taken-out replacement capillary along the axis. A transfer module that executes an operation of receiving the replacement capillary moved by the moving operation of the replacement module, and a transfer operation of linearly moving the received replacement capillary by a predetermined distance and rotating it by a predetermined angle. A capillary exchange mechanism comprising:

2. A first reference line overlapping the axis of the used capillary held by the horn and a second reference line orthogonal to the first reference line are defined. The transfer module is arranged to include the intersection of the first reference line and the second reference line. The replacement module is arranged adjacent to the transfer module along the direction of the second reference line. The capillary exchange mechanism according to claim 1.

3. A first reference line overlapping the axis of the used capillary held by the horn and a second reference line orthogonal to the first reference line are defined. The transfer module is arranged to include the intersection of the first reference line and the second reference line. The supply module is arranged adjacent to the transfer module along the direction of the second reference line. The capillary exchange mechanism according to claim 1.

4. A first reference line overlapping the axis of the used capillary held by the horn, a second reference line orthogonal to the first reference line, and a third reference line parallel to the first reference line and spaced apart from the first reference line in the direction of the second reference line are defined. The replacement module is arranged to include the intersection of the second reference line and the third reference line. The supply module is arranged on the third reference line and adjacent to the replacement module along the direction of the third reference line. The capillary exchange mechanism according to claim 1.

5. A first reference line overlapping the axis of the used capillary held by the horn, a second reference line orthogonal to the first reference line, and a third reference line parallel to the first reference line and spaced apart from the first reference line in the direction of the second reference line are defined. The transport module is arranged to include the intersection of the first reference line and the second reference line. The replacement module is arranged to include the intersection of the second reference line and the third reference line. The supply module is arranged on the third reference line and adjacent to the replacement module along the direction of the third reference line. The capillary exchange mechanism according to claim 1.

6. A first reference line overlapping the axis of the used capillary held by the horn is defined. The transport module is arranged to overlap the first reference line. The replacement module is arranged to overlap the first reference line and adjacent to the transport module along the direction of the first reference line. The capillary exchange mechanism according to claim 1.

7. A first reference line overlapping the axis of the used capillary held by the horn and a second reference line orthogonal to the first reference line are defined. The transport module is arranged to overlap the first reference line but not to include the intersection of the first reference line and the second reference line. The supply module is arranged to overlap the second reference line. The capillary exchange mechanism according to claim 1.

8. A first reference line overlapping the axis of the used capillary held by the horn and a second reference line orthogonal to the first reference line are defined. The replacement module is arranged to include the intersection of the first reference line and the second reference line. The supply module is arranged to overlap the second reference line. The capillary exchange mechanism according to claim 1.

9. A first reference line overlapping the axis of the used capillary held by the horn and a second reference line orthogonal to the first reference line are defined. The transport module is arranged to overlap the first reference line but not to include the intersection of the first reference line and the second reference line. The replacement module is arranged to include the intersection of the first reference line and the second reference line. The supply module is arranged to overlap the second reference line. The capillary exchange mechanism according to claim 1.

10. The horn, A capillary detachably attached to the horn, A capillary exchange mechanism for exchanging the used capillary with a replacement capillary, and The capillary exchange mechanism includes A storage unit that stores a plurality of the replacement capillaries arranged side by side in a supply direction orthogonal to the axis of the replacement capillary, and a capillary supply port for taking out the replacement capillary, and a supply module that moves the replacement capillary from the storage unit to the capillary supply port along the supply direction, A replacement module that performs an operation of taking out the replacement capillary from the capillary supply port by moving the replacement capillary located at the capillary supply port along the axis, and an operation of moving the taken-out replacement capillary along the axis, A wire bonding apparatus having a transfer module that performs an operation of receiving the replacement capillary moved by the moving operation of the replacement module, and a transfer operation of linearly moving the received replacement capillary by a predetermined distance and rotating it by a predetermined angle.

Citation Information

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