Control method for imprint apparatus, imprint apparatus, and article manufacturing method

Abstract

To provide a technique advantageous for reducing damage to a mold and / or imprint material on a substrate during error recovery indicating that the mold or substrate is detached from its holding unit without separation between the mold and the imprint material on the substrate.SOLUTION: A control method for an imprint apparatus that molds imprint material on a substrate using a mold comprises: a curing step of curing the imprint material in a state where the mold and the imprint material on the substrate are brought into contact with each other; a mold release step of separating the mold from the imprint material cured in the curing step; a detection step of detecting an error indicating detachment of the mold from a mold holding unit or detachment of the substrate from a substrate holding unit; and a recovery step of performing processing to reduce a distance between the mold holding unit and the substrate holding unit to a target distance when such the error is detected in the detection step. In the processing, the target distance is changed according to the contact state between the mold and the imprint material.SELECTED DRAWING: Figure 10

Description

Technical Field

[0001] The present invention relates to a method for controlling an imprint apparatus, an imprint apparatus, and a method for manufacturing an article.

Background Art

[0002] An imprint apparatus that forms an imprint material on a substrate using a mold (mold) having a concavo-convex pattern has attracted attention as one of the mass-production lithography apparatuses for semiconductor devices and the like. The imprint apparatus performs a curing step of curing the imprint material in a state where the mold is in contact with the imprint material on the substrate, and a mold release step of separating the mold from the imprint material cured by the curing step. Thereby, a concavo-convex pattern composed of a cured product of the imprint material can be formed on the substrate.

[0003] In an imprint apparatus, in the mold release step, the mold may not be separated from the imprint material on the substrate, and the mold may be detached from the mold holding part that holds the mold, or the substrate may be detached from the substrate holding part that holds the substrate. Such a phenomenon (error) is sometimes called de-chuck, and may occur when the force required to separate the mold from the cured imprint material on the substrate (mold release force) is greater than the holding force of the mold by the mold holding part or the holding force of the substrate by the substrate holding part. If the imprint sequence is continued despite the occurrence of de-chuck, in some cases, the mold, the substrate, and the imprint apparatus may be damaged. Therefore, in an imprint apparatus, when de-chuck occurs, a process of re-holding the mold or substrate that has been detached from the holding part in the holding part to eliminate the de-chuck may be performed. Patent Documents 1 to 2 describe an imprint apparatus that detects de-chuck and re-holds the mold or substrate that has been detached from the holding part in the holding part. Patent Document 3 also describes abnormality detection when re-holding the mold or substrate in the holding part.

Prior Art Documents

Patent Documents

[0004] [Patent Document 1] Japanese Patent No. 6706983 [Patent Document 2] Japanese Patent No. 7091138 [Patent Document 3] Japanese Unexamined Patent Application Publication No. 2022 - 134513 [Summary of the Invention] [Problems to be Solved by the Invention]

[0005] The elimination of de - chucking is performed by bringing the mold or substrate that has become detached from the holding part closer to the holding part so as to re - hold the mold or substrate. However, de - chucking may occur in a state where the mold and the imprint material on the substrate are about to separate, that is, in a state where the mold and the imprint material on the substrate are partially separated. In this case, depending on the distance for bringing the mold or substrate closer to the holding part to eliminate de - chucking, a part of the mold that has separated from the imprint material on the substrate may come into contact with the imprint material again. As a result, there is a possibility of damaging the uneven pattern of the mold and / or the uneven pattern of the imprint material on the substrate.

[0006] Therefore, an object of the present invention is to provide an advantageous technique for reducing damage to the mold and / or the imprint material on the substrate in the elimination of an error indicating that the mold or substrate has detached from its holding part without the mold and the imprint material on the substrate separating. [Means for Solving the Problems]

[0007] To achieve the above object, a control method for an imprint apparatus according to an aspect of the present invention is a control method for an imprint apparatus having a mold holding part that holds a mold and a substrate holding part that holds a substrate, and that forms an imprint material on the substrate using the mold, the method including: a curing step of curing the imprint material in a state where the mold and the imprint material on the substrate are in contact with each other by narrowing a distance between the mold holding part and the substrate holding part; a mold release step of separating the mold from the imprint material cured in the curing step by widening the distance between the mold holding part and the substrate holding part; a detection step of detecting an error indicating that the mold has detached from the mold holding part or the substrate has detached from the substrate holding part without the mold and the imprint material being separated in the mold release step; and a resolution step of executing a process of narrowing the distance between the mold holding part and the substrate holding part to a target distance in order to resolve the error when the error is detected in the detection step, wherein in the process, the target distance is changed according to a contact state between the mold and the imprint material that did not separate in the mold release step.

[0008] A further object or another aspect of the present invention will be clarified by the preferred embodiments described below with reference to the accompanying drawings.

Effects of the Invention

[0009] According to the present invention, for example, in resolving an error indicating that the mold or the substrate has detached from its holding part without the mold and the imprint material on the substrate being separated, it is possible to provide an advantageous technique for reducing damage to the mold and / or the imprint material on the substrate.

Brief Description of the Drawings

[0010]

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Embodiments for Carrying Out the Invention

[0011] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims. Although a plurality of features are described in the embodiments, not all of these plurality of features are essential to the invention, and the plurality of features may be arbitrarily combined. Further, in the accompanying drawings, the same or similar configurations are denoted by the same reference numerals, and redundant descriptions are omitted.

[0012] In this specification and the accompanying drawings, unless otherwise specified, directions are indicated in an XYZ coordinate system where the direction parallel to the surface of the substrate is the XY plane. The directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are referred to as the X-direction, Y-direction, and Z-direction, respectively, and the rotations around the X-axis, Y-axis, and Z-axis are denoted as θX, θY, and θZ, respectively. Control or drive with respect to the X-axis, Y-axis, and Z-axis means control or drive in the directions parallel to the X-axis, Y-axis, and Z-axis, respectively. Also, control or drive with respect to the θX-axis, θY-axis, and θZ-axis means control or drive related to the rotation around the axis parallel to the X-axis, the rotation around the axis parallel to the Y-axis, and the rotation around the axis parallel to the Z-axis, respectively. Further, the position is information that can be specified based on the coordinates of the X-axis, Y-axis, and Z-axis, and the orientation is information that can be specified by the values of the θX-axis, θY-axis, and θZ-axis.

[0013] An embodiment of the present invention will be described. The imprint apparatus is a lithography apparatus that forms an imprint material (composition) on a substrate using a mold, and can be employed in a lithography process that is a manufacturing process of devices such as semiconductor devices and magnetic storage media. The imprint apparatus performs a process of bringing an uncured imprint material supplied onto the substrate into contact with the mold and applying energy for curing to the imprint material, thereby forming a pattern of a cured product on the substrate in which the pattern of the mold is transferred. Such a process is called an imprint process and is performed for each of a plurality of shot regions (imprint regions) on the substrate. In the present embodiment, an example in which a photocuring method of curing the imprint material on the substrate by irradiating light (ultraviolet light) is adopted will be described.

[0014] As the material of the substrate, for example, glass, ceramics, metal, semiconductor, resin, etc. are used. If necessary, a member made of a material different from the substrate may be provided on the surface of the substrate. The substrate is, for example, a silicon wafer, a compound semiconductor wafer, or quartz glass. As the imprint material supplied onto the substrate, a curable composition (which may also be called an uncured resin) that cures when energy for curing is applied is used. The curable composition is a composition that cures by irradiation with light or by heating. Among these, the photocurable composition that cures by irradiation with light contains at least a polymerizable compound and a photoinitiator, and may further contain a non-polymerizable compound or a solvent as necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, a polymer component, etc. The viscosity of the viscous body (viscosity at 25°C) is, for example, 1 mPa·s or more and 100 mPa·s or less.

[0015] FIG. 1 is a schematic diagram showing a configuration example of the imprint apparatus 1. The imprint apparatus 1 is a processing apparatus used in the manufacturing process of semiconductor devices, which transfers the concavo-convex pattern of the mold 3 (die), which is the original plate, to the substrate 5, which is the substrate to be processed, and is an apparatus that adopts the photocuring method among the imprint technologies. Hereinafter, in the XYZ coordinate system, the direction parallel to the irradiation axis of the light irradiated on the mold 3 is defined as the Z direction, the direction in which the substrate 5 moves in a plane perpendicular to the Z direction is defined as the X direction, and the direction perpendicular to the X direction in the plane is defined as the Y direction for explanation.

[0016] The imprint apparatus 1 may include a lighting unit 2, an imprint head 4, a stage 6, a supply unit 7, a first height measurement unit 8, a second height measurement unit 9, and a control unit 10. The control unit 10 is constituted by a computer (information processing apparatus) having a processor such as a CPU (Central Processing Unit) and a storage unit such as a memory. The control unit 10 is connected to each part of the imprint apparatus 1 by a line and controls each part of the imprint apparatus 1 (controls the imprint process).

[0017] The illumination unit 2 (hardening unit) cures the imprint material 14 on the substrate 5 by irradiating the imprint material 14 on the substrate 5 with light 17 (e.g., ultraviolet rays) through the mold 3 in a state where the mold 3 and the imprint material 14 on the substrate 5 are in contact with each other during the imprint process. The illumination unit 2 may include, for example, a light source and a plurality of optical elements for adjusting the light emitted from the light source to light suitable for the imprint process. In the imprint apparatus 1 shown in FIG. 1, the light 17 emitted from the illumination unit 2 is reflected by a half mirror 18 above the imprint head 4 and irradiated onto the imprint material 14 on the substrate 5 through the mold 3.

[0018] The imprint head 4 is a mechanism for holding and driving the mold 3. The imprint head 4 includes a mold chuck (mold holding unit) that holds the mold 3 conveyed by the mold conveyance unit 11, and a mold driving unit configured to be able to change the position and inclination of the mold 3 held by the mold chuck. The mold driving unit may include, for example, a Z driving mechanism that drives the mold 3 in the Z direction to change the distance between the mold 3 and the substrate 5 so as to bring the mold 3 into contact with the imprint material 14 on the substrate 5 or separate the mold 3 from the cured imprint material 14. Further, the mold driving mechanism may include a tilt driving mechanism for tilting the mold 3.

[0019] The mold 3 held by the imprint head 4 can usually be made of a material that can transmit ultraviolet rays, such as quartz glass. A part of the region (pattern region) in the mold 3 has a mesa portion configured in a mesa shape having a step of about several tens of μm, and the surface on the substrate side of the mesa portion functions as a molding surface that contacts the imprint material 14 on the substrate 5 and molds the imprint material 14. The molding surface of the mold 3 used in the imprint apparatus 1 is configured as a pattern surface on which the uneven pattern to be transferred to the imprint material 14 on the substrate 5 is formed three-dimensionally.

[0020] Above the imprint head 4 (specifically, above the half mirror 18), an alignment measurement unit 13 is provided. The alignment measurement unit 13 has a TTM (Through The Mold) scope and measures the relative positions of the alignment marks provided on the mold 3 and the alignment marks provided on the substrate 5 via the half mirror 18. Thereby, based on the measurement result of the alignment measurement unit 13, that is, the relative positional deviation in the XY direction between the mark on the mold 3 and the mark on the substrate 5, the control unit 10 can perform alignment between the mold 3 (pattern region) and the substrate 5 (shot region). Note that the alignment measurement unit 13 may be understood as detecting the position of the alignment mark on the substrate 5 through the mold 3. Also, hereinafter, the alignment mark may be simply referred to as "mark".

[0021] For example, the alignment measurement unit 13 has an optical system and an imaging element (light receiving element) for imaging the mark on the mold 3 and the mark on the substrate 5, and can measure the relative positional deviation in the XY direction between the mark on the mold 3 and the mark on the substrate 5 based on the image obtained by the imaging element. The optical system may include a light source that emits light for illuminating the mark, a wavelength filter that selects the wavelength of the light emitted from the light source, and an ND filter for adjusting the intensity of the light incident on the imaging element. As the imaging element (image sensor), a CCD image sensor, a CMOS image sensor, or the like can be used.

[0022] Here, the alignment measurement unit 13 measures the marks on the mold 3 and the substrate 5 via the half mirror 18 so as not to obstruct the optical path of the light 17 emitted from the illumination unit 2. Also, by arranging a plurality of alignment measurement units 13 (TTM scopes), it becomes possible to measure a plurality of marks simultaneously, and not only in the XY direction but also the relative positions of the mold 3 (pattern region) and the substrate 5 (shot region) in the rotational direction and magnification direction can be measured. The alignment measurement unit 13 is generally arranged at the four corners of the pattern region of the mold 3. Further, the imprint apparatus 1 may be provided with a mechanism for driving the alignment measurement unit 13 in the XY direction. This is because various cases are assumed for the design coordinates of the marks depending on the design of the pattern formed on the mold 3. When a plurality of alignment measurement units 13 are arranged, it is desirable that each of the alignment measurement units 13 can be independently driven in the XY direction.

[0023] The stage 6 is configured to hold the substrate 5 and be movable in the XY direction on the stage surface plate 15. The stage 6 may include, for example, a substrate chuck (substrate holding unit) that holds the substrate 5 conveyed by the substrate conveyance unit 12 by means of a vacuum suction force or the like, and a substrate drive mechanism configured to be able to change the position and inclination of the substrate 5 held by the substrate chuck. The substrate drive mechanism may include, for example, a drive mechanism for driving the substrate 5 in the XY direction, Z direction, and θZ direction (rotational direction around the Z axis), and a tilt drive mechanism for tilting the substrate 5 in the θX direction and θY direction. In this case, the reference for the position and inclination of the substrate 5 in each direction can be the upper surface of the stage surface plate 15.

[0024] In the imprint apparatus 1 shown in FIG. 1, in the contact step of bringing the mold 3 into contact with the imprint material 14 on the substrate 5 by driving the mold 3 in the Z direction with the imprint head 4, and the mold 3 is separated from the cured imprint material 14. However, not limited thereto, the contact step and the mold release step may be performed, for example, by driving the substrate 5 in the Z direction with the stage 6, or by relatively driving the mold 3 and the substrate 5 in the Z direction with both the imprint head 4 and the stage 6. Further, in the example of the imprint apparatus 1 shown in FIG. 1, the stage base plate 15 is supported by the mount 16 (vibration isolator), and the vibration transmitted from the floor to the stage base plate 15 is reduced by the mount 16.

[0025] The supply unit 7 (dispenser) supplies the imprint material 14 (for example, uncured resin) onto the substrate 5. In the case of the present embodiment, the supply unit 7 supplies the imprint material 14 onto the substrate 5 as a plurality of droplets. As the imprint material 14, an ultraviolet curable resin having the property of being cured by irradiation with ultraviolet rays can be used.

[0026] The first height measurement unit 8 measures the height of the substrate 5 by measuring the height of the surface (upper surface) of the substrate 5. The first height measurement unit 8 includes, for example, a laser interferometer that irradiates the substrate 5 with light (laser light) to detect the distance to the substrate 5, and based on the distance detected by the laser interferometer, the height (position in the Z direction) of the substrate 5 can be measured. In the case of the present embodiment, while moving the substrate 5 in the XY direction by the stage 6 below the first height measurement unit 8, the first measurement unit 8 measures the height of each of a plurality of locations on the substrate 5. Thereby, the control unit 10 can obtain the height and inclination of the substrate 5 based on the measurement results of the first height measurement unit 8 obtained at each of a plurality of locations on the substrate 5.

[0027] The second height measurement unit 9 measures the height of the mold 3 by measuring the height of the surface (lower surface) of the mold 3. The second height measurement unit 9 includes, for example, a laser interferometer that irradiates the mold 3 with light (laser light) to detect the distance to the mold 3, and based on the distance detected by the laser interferometer, the height (position in the Z direction) of the mold 3 can be measured. In the case of the present embodiment, the second height measurement unit 9 is provided on the stage 6, and while moving the second height measurement unit 9 in the XY direction by the stage 6 below the mold 3, the second height measurement unit 9 measures the height of each of a plurality of locations on the mold 3. Thereby, the control unit 10 can obtain the height and inclination of the mold 3 based on the measurement results of the second height measurement unit 9 obtained at each of a plurality of locations on the mold 3.

[0028] Further, the imprint apparatus 1 of the present embodiment is further provided with a detection unit 19 and an observation unit 22.

[0029] The detection unit 19 has an OAS (Off Axis Scope) and detects the mark of the substrate 5 without passing through the mold 3. The detection unit 19 detects the mark of the substrate 5 disposed below the detection unit 19 (that is, within the detection field of view of the detection unit 19) by the stage 6. Therefore, unlike the alignment measurement unit 13 (TTM scope), the detection unit 19 may not be configured to be drivable in the XY direction. Further, since the detection unit 19 has fewer placement restrictions compared to the alignment measurement unit 13 (TTM scope), it is easy to mount an optically highly flexible scope. For example, the detection unit 19 can also increase the field of view or increase the measurement resolution compared to the alignment measurement unit 13. Note that the detection unit 19 may be understood as detecting the position of the mark of the substrate 5.

[0030] The observation unit 22 (state detection unit) observes (detects) the contact state between the mold 3 and the imprint material 14 on the substrate 5. The observation unit 22 of the present embodiment observes the contact state between the mold 3 and the imprint material 14 on the substrate 5 via the half mirror 18 so as not to obstruct the optical path of the light 17 emitted from the illumination unit 2 and the measurement field of view of the alignment measurement unit 13. The observation unit 22 may include, for example, an imaging unit (imaging element) that images the imprint material 14 on the substrate 5 through the mold 3, and an imaging optical system that forms an image of the imprint material 14 on the substrate 5 on the imaging surface of the imaging unit. As the imaging unit, a CCD image sensor, a CMOS image sensor, or the like can be used. Thereby, the control unit 10 can determine (acquire) the contact state between the mold 3 and the imprint material 14 on the substrate based on the image obtained by imaging the imprint material 14 on the substrate 5 by the observation unit 22 (imaging unit).

[0031] Here, the observation unit 22 of the present embodiment observes the size of the contact area between the mold 3 and the imprint material 14 on the substrate 5 as the contact state between the mold 3 and the imprint material 14 on the substrate 5. The contact state (size of the contact area) may include, for example, at least one of the area of the contact area (contact area), the radius of the contact area, the diameter of the contact area, the length of the outer periphery of the contact area, and the distance from the edge of the mold 3 (pattern area) to the edge of the contact area. Further, the observation unit 22 may also be called a spread camera and can also be used to observe (image) the state in which the imprint material 14 spreads on the substrate 5 and the state in which the imprint material 14 fills the concave-convex pattern (concave portion) of the mold 3.

[0032] Next, the imprint method performed by the imprint apparatus 1 of the present embodiment will be described. FIG. 2 is a flowchart showing the imprint method. The flowchart of FIG. 2 is a lot process performed on one lot including a plurality of substrates 5 and can be executed by the control unit 10. Note that the imprint method may be understood as a control method of the imprint apparatus 1.

[0033] In step S101, the control unit 10 transports the mold 3 to the imprint head 4 by the mold transfer unit 11 and holds the mold 3 on the imprint head 4. The imprint head 4 holds (chucks) the mold 3 by means of a vacuum (vacuum suction pressure) or the like. Thereby, the mold 3 is mounted on the imprint head 4.

[0034] In step S102, the control unit 10 measures the surface height of the mold 3 by the second height measurement unit 9. The height information of the mold 3 obtained in this step S102 can be used to control the relative driving amount in the Z direction between the mold 3 and the substrate 5 when the mold 3 and the imprint material 14 on the substrate 5 are brought into contact in the imprint process. Further, the control unit 10 can obtain the inclination information of the surface of the mold 3 by measuring the height at a plurality of locations on the surface of the mold 3 by the second height measurement unit 9. The inclination information can be used to adjust the relative inclination between the mold 3 and the substrate 5 so that the surface of the mold 3 and the surface of the substrate 5 are parallel.

[0035] In step S103, the control unit 10 measures the misalignment (mold mounting position misalignment) of the mold 3 with respect to the imprint head 4 by measuring the position of the mark on the mold 3 by the alignment measurement unit 13. For example, the control unit 10 drives the alignment measurement unit 13 in the XY direction so that the mark on the mold 3 enters the field of view of the alignment measurement unit 13 (TTM scope). Then, in this state, the alignment measurement unit 13 measures the position of the mark on the mold 3, and calculates the amount of misalignment from the designed coordinates of the mark as the amount of misalignment of the mold 3 with respect to the imprint head 4. The amount of misalignment obtained in this step S103 can be used as a correction value when driving the stage 6 so that the target shot area of the substrate 5 is disposed below the mold 3.

[0036] In step S104, the control unit 10 conveys the substrate 5 on which imprinting processing will be performed by the substrate conveyance unit 12 onto the stage 6 and holds the substrate 5 on the stage 6. The stage 6 holds (chucks) the substrate 5 by means of a vacuum (vacuum suction pressure) or the like. Thereby, the substrate 5 is mounted on the stage 6.

[0037] In step S105, the control unit 10 measures the surface height of the substrate 5 by the first height measurement unit 8. The height information of the substrate 5 obtained in this step S105 can be used to control the relative driving amount in the Z direction between the mold 3 and the substrate 5 when the mold 3 and the imprint material on the substrate 5 are brought into contact with each other in the imprinting process. Further, the control unit 10 can obtain the inclination information of the surface of the substrate 5 by measuring the height at a plurality of locations on the surface of the substrate 5 by the first height measurement unit 8. The inclination information can be used to adjust the relative inclination between the mold 3 and the substrate 5 so that the surface of the mold 3 and the surface of the substrate 5 are parallel.

[0038] In step S106, the control unit 10 measures the misalignment (substrate mounting position misalignment) of the substrate 5 by detecting the positions of the marks provided in each shot area of the substrate 5 by the detection unit 19. For example, the control unit 10 can calculate the amount of misalignment in the XY direction of each shot area based on the detection result by causing the detection unit 19 to detect the XY direction positions of at least one mark in each shot area of the substrate 5. Further, the control unit 10 can calculate the amount of rotational misalignment (Zθ direction) of each shot area based on the detection result by causing the detection unit 19 to detect the XY direction positions of two or more marks in each shot area of the substrate 5. Furthermore, the control unit 10 can obtain the array information of a plurality of shot areas on the substrate 5 by causing the detection unit 19 to detect the positions of the marks in each shot area of the substrate 5 and performing statistical processing such as function approximation on the detection results. The amount of misalignment obtained in this step S106 can be used as a correction value when driving the stage 6 so that the target shot area of the substrate 5 is disposed below the mold 3.

[0039] In step S107, the control unit 10 executes an imprint process on a shot area (hereinafter sometimes referred to as the target shot area) that is the target of the imprint process among a plurality of shot areas on the substrate 5. Details of this step S107 will be described later.

[0040] In step S108, the control unit 10 determines whether a de-chuck error has been detected in the imprint process of step S107. A de-chuck error means that in the mold release step of the imprint process, the mold 3 and the imprint material 14 on the substrate 5 do not separate, and the mold 3 detaches from the imprint head 4 (mold holding part), or the substrate 5 detaches from the stage 6 (substrate holding part). For example, as shown in FIG. 1, the imprint apparatus 1 is provided with a sensor 24a that detects the holding force (e.g., vacuum suction pressure) of the mold 3 by the imprint head 4, and a sensor 24b that detects the holding force (e.g., vacuum suction pressure) of the substrate 5 by the stage 6. The control unit 10 can detect a de-chuck error indicating the detachment of the mold 3 from the imprint head 4 (mold holding part) or the detachment of the substrate 5 from the stage 6 (substrate holding part) based on the outputs from these sensors 24a to 24b.

[0041] If a de-chuck error is not detected in step S108, the process proceeds to step S109. In step S109, the control unit 10 determines whether the imprint process has been executed on all the shot areas on the substrate 5. If there is a shot area on which the imprint process has not been executed, the process proceeds to step S107, and the imprint process is executed with the shot area as the target shot area. On the other hand, if the imprint process has been executed on all the shot areas, the process proceeds to step S110.

[0042] In step S110, the control unit 10 determines whether imprinting processing has been executed on all the substrates 5. For example, the control unit 10 determines whether imprinting processing has been executed on all the substrates 5 included in one lot. If there is a substrate 5 on which the imprinting processing has not been executed, after the substrate 5 on the stage 6 is carried out by the substrate transfer unit 12, the process proceeds to step S104. On the other hand, when the imprinting processing has been performed on all the substrates 5, the substrate 5 on the stage 6 is carried out by the substrate transfer unit 12 and the process ends. At this time, the mold 3 held by the imprint head 4 may be carried out by the mold transfer unit 11.

[0043] Also, when a de-chuck error is detected in step S108, the process proceeds to step S111. In step S111, the control unit 10 executes a process for eliminating the de-chuck error (hereinafter, may be referred to as a de-chuck elimination process). Details of this step S111 will be described later. Next, in step S112, the control unit 10 determines whether the de-chuck error has been eliminated by the de-chuck elimination process in step S111. If the de-chuck error has been eliminated, the process proceeds to step S109. On the other hand, if the de-chuck error has not been eliminated, the lot process is aborted (stopped). At this time, the control unit 10 may notify the operator of the imprinting apparatus 1 that the lot process has been aborted via the user interface provided in the imprinting apparatus 1.

[0044] [Imprinting Processing] Next, the imprinting process performed in step S107 will be described. FIG. 3 is a flowchart showing the imprinting process performed on one shot area (target shot area). Further, FIG. 4 shows the operation of the imprinting apparatus 1 in each step of the flowchart of FIG. 3.

[0045] In step S201, as shown in FIG. 4(A), the control unit 10 supplies the imprint material 14 onto the target shot area of the substrate 5 by the supply unit 7 (supply process). For example, the control unit 10 causes the supply unit 7 to eject the imprint material 14 as a plurality of droplets while moving the target shot area by the stage 6 below the supply unit 7. Thereby, the imprint material 14 can be supplied as a plurality of droplets onto the target shot area. The arrangement of the plurality of droplets on the target shot area can be determined in advance according to the concavo-convex pattern provided on the mold 3.

[0046] In step S202, as shown in FIG. 4(B), the control unit 10 drives the substrate 5 by the stage 6 so that the target shot area is disposed below the mold 3 (pattern area). Next, in step S203, as shown in FIG. 4(C), the control unit 10 brings the mold 3 into contact with the imprint material 14 on the target shot area (contact process). Specifically, the control unit 10 drives the mold 3 in the -Z direction by the imprint head 4 and narrows the distance between the imprint head 4 and the stage 6, thereby bringing the mold 3 into contact with the imprint material 14 on the target shot area.

[0047] In step S204, with the mold 3 and the imprint material 14 on the target shot area in contact, the control unit 10 aligns the mold 3 (pattern area) and the substrate 5 (target shot area) (alignment process). Specifically, the control unit 10 causes the alignment measurement unit 13 to measure the relative position between the mark 20 of the mold 3 and the mark 21 of the target shot area, and based on the measurement result, aligns the mold 3 and the substrate 5 so that the relative position becomes the target relative position. The alignment can be performed by relatively driving the mold 3 and the substrate 5 by the stage 6 and / or the imprint head 4.

[0048] In step S205, the control unit 10 waits until the filling time for filling the imprint material 14 into the concavo-convex pattern (concave portion) of the mold 3 elapses (filling process). Note that step S205 may be performed in parallel with step S204 (alignment process). For example, during the time until the filling time elapses, the alignment between the mold 3 and the substrate 5 in step S204 may be repeatedly executed. Here, even if the filling time has elapsed in step S205, the alignment between the mold 3 and the substrate 5 may be performed until the relative position measured by the alignment measurement unit 13 falls within the allowable range, and then the process may proceed to step S207. Further, when it is determined based on the image obtained by the observation unit 22 (imaging unit) that the filling of the imprint material 14 into the concavo-convex pattern of the mold 3 is completed, the process may proceed to step S207 even if the filling time has not elapsed in step S205.

[0049] In step S206, as shown in FIG. 4(D), the control unit 10 cures the imprint material 14 in a state where the mold 3 is in contact with the imprint material 14 on the target shot area (curing process). Specifically, the control unit 10 controls the illumination unit 2 to irradiate the imprint material 14 on the target shot area with light 17 (ultraviolet rays), thereby curing the imprint material 14. Next, in step S207, as shown in FIG. 4(E), the control unit 10 separates the mold 3 from the cured imprint material 14 on the target shot area (demolding process). Specifically, the control unit 10 drives the mold 3 in the +Z direction by the imprint head 4 and widens the distance between the imprint head 4 and the stage 6, thereby separating the mold 3 from the cured imprint material 14 on the target shot area.

[0050] [Conventional Example of Chuck Release Processing] In the mold release step of step S207, there may occur a chuck error in which the substrate 5 detaches from the stage 6 (substrate holding part) or the mold 3 detaches from the imprint head 4 (mold holding part) without the mold 3 and the imprint material 14 on the substrate 5 being separated. If the lot process (imprint sequence) is continued in a state where such a chuck error has occurred, in some cases, the mold 3, the substrate 5, or the imprint apparatus 1 may be damaged. For example, FIG. 6(A) shows a state in which the substrate 5 has detached (chucked) from the stage 6. If the lot process is continued in such a state and the stage 6 is moved from below the substrate 5 attached to the mold 3, the substrate 5 may fall off at a location different from that on the stage 6, or the structure arranged on the stage 6 and the substrate 5 may come into contact with each other. That is, the mold 3, the substrate 5, or the structures in the imprint apparatus 1 may be damaged. Further, FIG. 7(A) shows a state in which the mold 3 has detached (chucked) from the imprint head 4. Similarly, even in such a state, if the lot process is continued, the mold 3, the substrate 5, or the structures in the imprint apparatus 1 may be damaged.

[0051] Therefore, in the imprint apparatus 1, detection of a de-chuck error indicating detachment of the substrate 5 from the stage 6 or detachment of the mold 3 from the imprint head 4 is performed, and de-chuck error elimination processing for eliminating the de-chuck error is performed. For example, the imprint apparatus 1 is provided with a sensor 24a for detecting the vacuum suction pressure for the imprint head 4 to hold the mold 3, and a sensor 24b for detecting the vacuum suction pressure for the stage 6 to hold the substrate 5. When the vacuum suction pressure detected by the sensors 24a to 24b during or immediately after the mold release process is within the specified range, the control unit 10 can determine that no de-chuck error has been detected (i.e., it is in a normal state). On the other hand, when the vacuum suction pressure detected by the sensors 24a to 24b during or immediately after the mold release process is outside the specified range (for example, when approaching the atmospheric release pressure value), the control unit 10 can determine that a de-chuck error has been detected (i.e., it is in an abnormal state). In this case, the control unit 10 executes de-chuck error elimination processing for eliminating the de-chuck error.

[0052] Hereinafter, a conventional example of the de-chuck error elimination processing performed in step S111 will be described. FIG. 5 is a flowchart showing a conventional example of the de-chuck error elimination processing. FIGS. 6 to 7 show the operations of the imprint apparatus 1 in each step of the flowchart of FIG. 5. FIG. 6 shows a case where the substrate 5 has detached from the stage 6, and FIG. 7 shows a case where the mold 3 has detached from the imprint head 4.

[0053] In step S301, the control unit 10 determines whether it is in a state where the de-chuck error can be eliminated. For example, the control unit 10 can determine whether it is in a state where the de-chuck error can be eliminated according to whether stage 6 can be arranged at the position of stage 6 in step S107 when the imprint process is performed. In the de-chuck elimination process, in order to narrow the distance between the imprint head 4 and stage 6 by driving the imprint head 4 in the -Z direction, it is necessary that stage 6 is arranged at the same position as the position of stage 6 in the imprint process (specifically, the mold release process). Therefore, when stage 6 has already been arranged at the position of stage 6 in the imprint process, or when stage 6 can be moved to the position of stage 6 in the imprint process, the control unit 10 determines that it is in a state where the de-chuck error can be eliminated. In this case, the process proceeds to step S302. On the other hand, when the control unit 10 cannot move stage 6 to the position of stage 6 in the imprint process due to troubles such as a power failure, it determines that it is not in a state where the de-chuck error can be eliminated. In this case, assuming that the de-chuck elimination process has failed, the de-chuck elimination process is terminated.

[0054] In step S302, as shown in FIG. 6(B) or FIG. 7(B), the control unit 10 performs a distance reduction operation to temporarily narrow the distance between the imprint head 4 (mold holding part) and stage 6 (substrate holding part) by driving the imprint head 4 in the -Z direction. In the conventional example, the control unit 10 performs the distance reduction operation so that the distance between the imprint head 4 and stage 6 (hereinafter, may be referred to as "curing intermediate distance") in the curing process of the imprint process is obtained.

[0055] In step S303, the control unit 10 causes the stage 6 to re-hold the substrate 5 or the imprint head 4 to re-hold the mold 3 by adjusting the holding force (vacuum suction pressure) of the stage 6 or the holding force (vacuum suction pressure) of the imprint head 4. For example, when the substrate 5 has detached from the stage 6, the control unit 10 can adjust the holding force of the stage 6 to be greater than during the imprint process. On the other hand, when the mold 3 has detached from the imprint head 4, the control unit 10 can adjust the holding force of the imprint head 4 to be greater than during the imprint process.

[0056] In step S304, as shown in FIG. 6(C) or FIG. 7(C), the control unit 10 performs a gap widening operation of widening the gap between the imprint head 4 and the stage 6 by driving the imprint head 4 in the +Z direction. Next, in step S305, the control unit 10 determines whether or not the imprint material 14 on the substrate 5 and the mold 3 have separated (i.e., whether or not the mold release has been successful). For example, the control unit 10 can determine whether or not the imprint material 14 on the substrate 5 and the mold 3 have separated based on the outputs of the sensors 24a to 24b. If the imprint material 14 on the substrate 5 and the mold 3 have separated, the mold release cancellation process is terminated assuming that the mold release cancellation process has been successful. On the other hand, if the imprint material 14 on the substrate 5 and the mold 3 have not separated, the process proceeds to step S306.

[0057] In step S306, the control unit 10 determines whether or not the number of times of the mold release cancellation process has reached the upper limit value. If the number of times of the mold release cancellation process has not reached the upper limit value, the process proceeds to step S302 and the mold release cancellation process is executed again. On the other hand, if the number of times of the mold release cancellation process has reached the upper limit value, the mold release cancellation process is terminated assuming that the mold release cancellation process has failed. Note that the upper limit value can be set to any value, but from the viewpoint of throughput, it is preferably set to a value of, for example, 10 times or less.

[0058] Incidentally, the de-chuck error may occur when the mold 3 and the imprint material 14 on the substrate 5 are about to separate, that is, when the mold 3 and the imprint material 14 on the substrate 5 are partially separated. For example, as shown in Fig. 8(A), the de-chuck error may occur when the mold 3 (pattern area) and the imprint material on the substrate 5 are separated at the peripheral edge of the mold 3, but the mold 3 and the imprint material on the substrate 5 are adhered to each other at the central portion of the mold 3. When the de-chuck error elimination process of the conventional example is performed in this state and the distance between the imprint head 4 and the stage 6 is narrowed to the curing intermediate distance, a part of the mold 3 that is separated from each other at the peripheral edge of the mold 3 and the imprint material 14 on the substrate 5 will come into contact again. Since the uneven pattern formed on the imprint material 14 on the substrate 5 is very fine, about several nm to several tens of nm, it is unlikely that the uneven pattern of the mold 3 that has been once separated and the uneven pattern of the imprint material 14 on the substrate 5 will mesh again. For example, if the substrate 5 and / or the mold 3 is slightly distorted, it is unlikely that the uneven pattern of the mold 3 that has been once separated and the uneven pattern of the imprint material 14 on the substrate 5 will mesh again. As a result, the uneven pattern (protrusion) of the mold 3 and the uneven pattern (protrusion) of the imprint material 14 on the substrate 5 come into contact (collide) again, and the uneven pattern of either one or both may be damaged. The damage of the uneven pattern of the expensive mold 3 is more serious.

[0059] Generally, the higher the height of the convex portions of the concavo-convex pattern in the imprint material 14 on the mold 3 and the substrate 5, the greater the force (release force) for separating the mold 3 and the imprint material 14 on the substrate 5 in the release process, and the more likely a chuck error occurs. Also, the higher the density of the concavo-convex pattern in the imprint material 14 on the mold 3 and the substrate 5, the greater the release force tends to be, and in this case too, a chuck error is likely to occur. A high density of the concavo-convex pattern means that the convex and concave portions of the concavo-convex pattern are arranged at a fine pitch. Thus, depending on the height and / or density of the concavo-convex pattern, there is a high possibility that the concavo-convex pattern of the mold 3 and / or the concavo-convex pattern of the imprint material on the substrate 5 will be damaged in the chuck error elimination process of the conventional example.

[0060] Also, as shown in FIG. 8(A), in a state where the mold 3 and the imprint material 14 on the substrate 5 are about to separate, it is also possible that the substrate 5 separates from the mold 3 and drops during the chuck error elimination process (for example, step S302). FIG. 8(B) shows this. If it is not detected that the substrate 5 has separated from the mold 3 and dropped, and the chuck error elimination process is advanced to narrow the distance between the imprint head 4 and the stage 6 to the curing intermediate distance, the mold 3 and the imprint material 14 on the substrate 5 will come into contact again. That is, there is a possibility that the concavo-convex pattern of the mold 3 and / or the concavo-convex pattern of the imprint material on the substrate 5 will be damaged.

[0061] Therefore, in the present embodiment, even in a state where the mold 3 and the imprint material on the substrate 5 are about to separate, the chuck error elimination process is controlled so that damage to the concavo-convex pattern of the mold 3 and / or the concavo-convex pattern of the imprint material on the substrate 5 is reduced. Hereinafter, an example of the chuck error elimination process in the present embodiment will be described.

[0062] [Example 1 of Chuck Error Elimination Process] Next, an example 1 of the chuck release process (S111) in the present embodiment will be described. In Example 1, in the chuck release process, the target interval for temporarily narrowing the imprint head 4 and the stage 6 is changed according to the contact state between the mold 3 that was not separated in the mold release process and the imprint material 14 on the substrate 5. Here, the contact state between the mold 3 and the imprint material on the substrate 5 indicates, for example, the size of the contact area between the mold 3 and the imprint material 14 on the substrate 5. The contact state can be defined by at least one of the area (contact area) of the contact region, the radius of the contact region, the diameter of the contact region, the length of the outer periphery of the contact region, and the distance from the edge of the mold 3 (pattern region) to the edge of the contact region. Further, the contact state (size of the contact region) can be determined (detected) based on the image obtained by the observation unit 22 (imaging unit).

[0063] FIG. 9 is a diagram showing the relationship between the contact state (size of the contact region 25) between the mold 3 and the imprint material 14 on the substrate 5 and the image 23 obtained by the observation unit 22.

[0064] FIG. 9(A-1) shows a state where the mold 3 and the imprint material 14 on the substrate 5 are not in contact. The state shown in FIG. 9(A-1) is the state before performing the contact process (S203), or the state where the separation between the mold 3 and the imprint material 14 on the substrate 5 is normally performed in the mold release process (the state where the mold release is successful). The image 23a obtained by the observation unit 22 at this time is shown in FIG. 9(A-2). Usually, it is difficult to determine whether the mold 3 and the imprint material 14 on the substrate 5 are in contact only from this image 23a. Therefore, the determination can be made by comparing with an image in a state where the mold 3 and the imprint material 14 on the substrate 5 are in contact.

[0065] FIG. 9(B-1) shows a state in which a chuck error has occurred where the substrate 5 has detached from the stage 6 without the mold 3 and the imprint material 14 on the substrate 5 being separated during the mold release process. In FIG. 9(B-1), the entire mold 3 (pattern area) is in contact with the imprint material 14 on the substrate 5. The image 23b obtained by the observation unit 22 at this time is shown in FIG. 9(B-2). In the image obtained by the observation unit 22, due to the underlying pattern of the substrate 5, coating film, transmittance, refractive index, etc. of the imprint material 14, the contact area 25 between the mold 3 and the imprint material 14 on the substrate 5 becomes darker or brighter compared to the non-contact area. That is, the image 23b shown in FIG. 9(B-2) becomes darker or brighter compared to the image 23a shown in FIG. 9(A-2). In this Example 1, an example is shown in which in the image obtained by the observation unit 22, the contact area 25 between the mold 3 and the imprint material 14 on the substrate 5 becomes darker compared to the non-contact area.

[0066] FIG. 9(C-1) shows a state in which a chuck error has occurred where the substrate 5 has detached from the stage 6 without the mold 3 and the imprint material 14 on the substrate 5 being separated during the mold release process. In FIG. 9(C-1), the mold 3 and the imprint material 14 on the substrate 5 are about to be separated. That is, at the peripheral edge of the mold 3 (pattern area), the mold 3 and the imprint material on the substrate 5 are separated, but at the central part of the mold 3, the mold 3 and the imprint material on the substrate 5 are stuck together. The image 23c obtained by the observation unit 22 at this time is shown in FIG. 9(C-2). In the image 23c shown in FIG. 9(C-2), the contact area 25 (central part) between the mold 3 and the imprint material 14 on the substrate 5 is darker than the non-contact area (peripheral edge).

[0067] As described above, in the image obtained by the observation unit 22 in the state where a de-chuck error has occurred, a difference in brightness occurs between the contact area 25 and the non-contact area. Therefore, the control unit 10 can determine to what extent the mold 3 and the imprint material 14 on the substrate 5 are about to separate based on the image obtained by the observation unit 22. That is, the control unit 10 can determine (acquire) the contact state between the mold 3 and the imprint material 14 on the substrate 5 based on the image 23 obtained by the observation unit 22.

[0068] The control unit 10 may determine the contact state (the size of the contact area 25) between the mold 3 and the imprint material 14 on the substrate 5 based on the area of the contact area 25 between the mold 3 and the imprint material on the substrate 5. Further, the control unit 10 may determine the contact state based on the ratio of the area of the contact area 25 to the total area of the mold 3 (pattern area). When the ratio is 99% to 100%, the control unit 10 can determine that the entire mold 3 (pattern area) and the imprint material on the substrate 5 are in contact. Furthermore, for example, when the contact area is circular, the control unit 10 may determine the contact state not only based on the area of the contact area 25 but also based on the radius or diameter of the contact area 25 or the length of the outer periphery of the contact area 25. The control unit 10 may determine the contact state based on the distance from the edge of the mold 3 (pattern area) to the edge of the contact area 25.

[0069] Here, in the state shown in FIG. 9(C-1), as described above, when the distance between the imprint head 4 and the stage 6 is narrowed to the curing intermediate distance in the de-chuck elimination process, a part of the mold 3 that is separated from each other and the imprint material on the substrate 5 come into contact again. As a result, the uneven pattern of the mold 3 and / or the uneven pattern of the imprint material 14 on the substrate 5 may be damaged.

[0070] Therefore, in the first embodiment, in the de-chucking elimination process, the target interval for temporarily narrowing the imprint head 4 and the stage is changed according to the contact state between the mold 3 that was not separated in the mold release process and the imprint material 14 on the substrate 5. Specifically, the control unit 10 determines the target interval according to the size of the contact area 25 such that the smaller the contact area 25 between the mold 3 and the imprint material 14 on the substrate 5, the wider the target interval. Then, in the de-chucking elimination process, the control unit 10 drives the imprint head 4 in the -Z direction until the interval between the imprint head 4 and the stage 6 reaches the target interval. Usually, in the state shown in FIG. 9(C-1), the mold release force for separating the mold 3 and the imprint material 14 on the substrate 5 in the de-chucking elimination process can be smaller than that in the state shown in FIG. 9(B-1). Therefore, even if the interval between the imprint head 4 and the stage 6 is not narrowed to the curing intermediate interval in the de-chucking elimination process, the mold release force can be sufficiently obtained by the holding force of the stage 6 or the holding force of the imprint head 4.

[0071] The target interval can be determined to be a value equal to or greater than the curing intermediate interval according to the contact state (the size of the contact area 25) between the mold 3 and the imprint material 14 on the substrate 5. For example, information indicating the relationship between the contact state (the size of the contact area 25) and the target interval may be prepared in advance using experiments, simulations, etc. Thereby, the control unit 10 can determine the target interval from the contact state based on the information.

[0072] Further, the target interval can be determined to be a value greater than or equal to the height of the convex portion of the concavo-convex pattern formed on the imprint material 14 on the substrate 5 through the mold release process (i.e., the height of the convex portion of the concavo-convex pattern of the mold 3) and greater than the curing interval. When the height of the convex portion of the concavo-convex pattern of the mold 3 is 100 nm and the control accuracy of the imprint head 4 in the Z direction is 10 nm, the target interval can be determined to be a value greater than 110 nm with respect to the curing interval. However, this is merely the minimum value, and if the mold release force can be sufficiently obtained by the holding force of the stage 6 or the holding force of the imprint head 4, the target interval may be determined to be a value greater by, for example, about 1 μm with respect to the curing interval.

[0073] As described above, the target interval can be determined to be a value greater than the curing interval by the control accuracy of the imprint head 4 in the Z direction in addition to the height of the convex portion of the concavo-convex pattern. Thereby, when the substrate 5 separates from the mold 3 and drops during driving the imprint head 4 in the -Z direction and is re-held by the stage 6, it is possible to reduce the damage to the concavo-convex pattern due to the mold 3 and the imprint material 14 on the substrate 5 coming into contact again. On the other hand, when the substrate 5 does not separate from the mold 3 and drop, due to the warpage of the substrate 5, the outer periphery of the substrate 5 and the stage 6 come into contact, so that the warpage of the substrate 5 is corrected to be flat, and the mold 3 and the imprint material 14 on the substrate 5 may come into contact again. Therefore, it is desirable that the target interval is determined in consideration of the warpage amount of the substrate 5.

[0074] The determination of the target interval considering the warpage amount of the substrate 5 may be performed by detecting a change in the holding force (vacuum suction pressure) of the stage 6 by the sensor 24b. For example, when a predetermined change occurs in the holding force of the stage 6 detected by the sensor 24, it may be assumed that the interval between the imprint head 4 and the stage 6 has reached the target interval, and the driving of the imprint head 4 in the -Z direction may be stopped. Further, the driving force of the imprint head 4, that is, the current value to the motor may be detected, and the driving of the imprint head 4 in the -Z direction may be stopped according to the detection result. Alternatively, the driving of the imprint head 4 in the -Z direction may be stopped according to a change in the contact state (size of the contact area 25) in the image obtained by the observation unit 22. Further, information indicating the relationship between the contact state (size of the contact area 25) and the target interval considering the warpage of the substrate 5 may be prepared in advance using experiments, simulations, or the like.

[0075] Hereinafter, Example 1 of the chuck release process performed in step S111 will be described. FIG. 10 is a flowchart showing Example 1 of the chuck release process. Further, FIG. 11 shows the operation of the imprint apparatus 1 in each step of the flowchart of FIG. 10. Hereinafter, an example in which a chuck error occurs due to the detachment of the substrate 5 from the stage 6 will be described, but the same applies when a chuck error occurs due to the detachment of the mold 3 from the imprint head 4.

[0076] In step S401, the control unit 10 determines whether or not it is in a state where the chuck error can be eliminated. Since step S401 is the same process as step S301 in the flowchart of FIG. 5, detailed description thereof will be omitted here. If it is in a state where the chuck error can be eliminated, the process proceeds to step S402. On the other hand, if it is not in a state where the chuck error can be eliminated, it is assumed that the chuck release process has failed, and the chuck release process is terminated.

[0077] In step S402, the control unit 10 determines (acquires) the contact state between the mold 3 and the imprint material 14 on the substrate 5. For example, as shown in FIGS. 11(A-1) to (A-2), the control unit 10 can determine the contact state (the size of the contact area 25) between the mold 3 and the imprint material 14 on the substrate 5 based on the image 23 obtained by the observation unit 22 (imaging unit).

[0078] In step S403, the control unit 10 determines a target interval for temporarily bringing the imprint head 4 and the stage 6 closer according to the contact state (the size of the contact area 25) determined in step S402. For example, the control unit 10 can determine the target interval from the contact state (the size of the contact area 25) determined in step S402 based on the information indicating the relationship between the previously acquired contact state (the size of the contact area 25) and the target interval. When the entire mold 3 (pattern area) and the imprint material 14 on the substrate 5 are in a contact state as shown in FIGS. 9(B-1) to (B-2), the control unit 10 can determine the curing intermediate interval as the target interval. On the other hand, when the mold 3 and the imprint material 14 on the substrate 5 are in a contact state where they are about to separate as shown in FIGS. 9(C-1) to (C-2), the control unit 10 can determine an interval larger than the curing intermediate interval as the target interval. In this case, the control unit 10 may determine the target interval such that the smaller the contact area 25, the wider the target interval.

[0079] In step S404, as shown in FIG. 11(B), the control unit 10 performs an interval reduction operation to temporarily narrow the interval between the imprint head 4 (die holding part) and the stage 6 (substrate holding part) to the target interval by driving the imprint head 4 in the -Z direction. For example, the control unit 10 drives the imprint head 4 in the -Z direction and stops driving the imprint head 4 when the interval between the imprint head 4 (die holding part) and the stage 6 (substrate holding part) reaches the target interval.

[0080] In step S405, the control unit 10 causes the stage 6 to re-hold the substrate 5 by adjusting the holding force (vacuum suction pressure) of the stage 6. In step S406, as shown in FIG. 11(C), the control unit 10 performs a gap expanding operation of expanding the gap between the imprint head 4 and the stage 6 by driving the imprint head 4 in the +Z direction. In step S407, the control unit 10 determines whether or not the imprint material 14 on the substrate 5 and the mold 3 have separated. If the imprint material 14 on the substrate 5 and the mold 3 have separated, it is determined that the de-chucking release process has succeeded, and the de-chucking release process is terminated. On the other hand, if the imprint material 14 on the substrate 5 and the mold 3 have not separated, the process proceeds to step S408. Note that steps S405 to S407 are the same processes as steps S303 to S305 in the flowchart of FIG. 5, and thus detailed description thereof is omitted here.

[0081] In step S408, the control unit 10 determines whether or not the number of times of the de-chucking release process has reached the upper limit value. If the number of times of the de-chucking release process has not reached the upper limit value, the process proceeds to step S402, and the de-chucking release process is executed again. At this time, the target gap with respect to the contact state (the size of the contact area 25) may be narrowed according to the number of times of the de-chucking release process. For example, if the contact state is the same in the n-th de-chucking release process and the (n + 1)-th de-chucking release process, the target gap used in the (n + 1)-th de-chucking release process may be made narrower than the target gap used in the n-th de-chucking release process. On the other hand, if the number of times of the de-chucking release process has reached the upper limit value, it is determined that the de-chucking release process has failed, and the de-chucking release process is terminated.

[0082] As described above, in Example 1, in the chuck release process, the target interval for temporarily narrowing the imprint head 4 and the stage 6 is changed according to the contact state between the mold 3 that was not separated in the mold release process and the imprint material 14 on the substrate 5. Thereby, even when the mold 3 and the imprint material 14 on the substrate 5 are about to separate, it is possible to prevent a part of the mold 3 that is separated from each other and the imprint material 14 on the substrate 5 from coming into contact again in the chuck release process. That is, it is possible to reduce the damage to the concavo-convex pattern of the mold 3 and / or the concavo-convex pattern of the imprint material 14 on the substrate 5.

[0083] [Example 2 of chuck release process] Next, Example 2 of the chuck release process (S111) in the present embodiment will be described. In Example 2, in the chuck release process, the target interval for temporarily narrowing the imprint head 4 and the stage 6 is changed according to the number of times of the chuck release process. Note that Example 2 basically inherits Example 1 and may follow Example 1 except for the matters mentioned below.

[0084] FIG. 12 is a flowchart showing Example 2 of the chuck release process. Hereinafter, an example in which a chuck error occurs due to the detachment of the substrate 5 from the stage 6 will be described, but the same applies when a chuck error occurs due to the detachment of the mold 3 from the imprint head 4.

[0085] In step S501, the control unit 10 determines whether or not it is in a state where the chuck error can be eliminated. Since step S501 is the same process as step S301 in the flowchart of FIG. 5, detailed description thereof will be omitted here. If it is in a state where the chuck error can be eliminated, the process proceeds to step S502. On the other hand, if it is not in a state where the chuck error can be eliminated, it is assumed that the chuck release process has failed, and the chuck release process is terminated.

[0086] In step S502, the control unit 10 determines the number of times of the de-chucking elimination process (i.e., the interval reduction operation). Next, in step S503, the control unit 10 determines the type (operation mode) of the interval reduction operation for temporarily narrowing the interval between the imprint head 4 and the stage 6 according to the number of times of the de-chucking elimination process determined in step S502. In the case of the second embodiment, as the types of the interval reduction operation, the first operation and the second operation are set. The first operation is an interval reduction operation performed from the first time to a predetermined number of times (for example, once). In the first operation, the target interval for bringing the imprint head 4 closer to the stage 6 is set to a first target interval that is larger than the curing intermediate interval. The second operation is an interval reduction operation performed when the de-chucking error is not eliminated even after performing the first operation a predetermined number of times, for example, the interval reduction operation after the second time. In the second operation, the target interval for bringing the imprint head 4 closer to the stage 6 is set to a second target interval that is narrower than the first target interval. The second target interval may be set to a value larger than the curing intermediate interval, or may be set to the same value as the curing intermediate interval.

[0087] Here, the types of the interval reduction operation are not limited to the first operation and the second operation, and more operations may be provided. For example, in addition to the first operation and the second operation, a third operation may be further set as the type of the interval reduction operation. The third operation is an interval reduction operation performed when the de-chucking error is not eliminated even after performing the second operation a predetermined number of times, and the target interval for bringing the imprint head 4 closer to the stage 6 is set to a third target interval that is narrower than the second target interval. The third target interval may be set to a value larger than the curing intermediate interval, or may be set to the same value as the curing intermediate interval. When the third target interval is set to the same value as the curing intermediate interval, the second target interval may be set to a value larger than the curing intermediate interval.

[0088] In step S504, the control unit 10 performs a distance reduction operation of temporarily narrowing the distance between the imprint head 4 (mold holding unit) and the stage 6 (substrate holding unit) to the target distance by driving the imprint head 4 in the -Z direction. The distance reduction operation in this step S504 is performed according to the type (operation mode) of the distance reduction operation determined in step S503. For example, in the case of the first distance reduction operation, the first operation using the first target distance is performed. Also, in the case of the second and subsequent distance reduction operations, the second operation using the second target distance is performed. Further, when the second operation is performed a predetermined number of times, the third operation using the third target distance is performed as a subsequent distance reduction operation.

[0089] In step S505, the control unit 10 causes the stage 6 to re-hold the substrate 5 by adjusting the holding force (vacuum suction pressure) of the stage 6. In step S506, the control unit 10 performs a distance expansion operation of widening the distance between the imprint head 4 and the stage 6 by driving the imprint head 4 in the +Z direction. In step S507, the control unit 10 determines whether or not the imprint material 14 on the substrate 5 and the mold 3 have separated. If the imprint material 14 on the substrate 5 and the mold 3 have separated, it is considered that the de-chucking release process has been successful, and the de-chucking release process is terminated. On the other hand, if the imprint material 14 on the substrate 5 and the mold 3 have not separated, the process proceeds to step S508. Note that steps S505 to S507 are the same processes as steps S303 to S305 in the flowchart of FIG. 5, and thus detailed description thereof is omitted here.

[0090] In step S508, the control unit 10 determines whether or not the number of times of the de-chucking release process has reached the upper limit value. If the number of times of the de-chucking release process has not reached the upper limit value, the process proceeds to step S502, and the de-chucking release process is repeatedly executed. Here, in this step S508, the control unit 10 may determine whether or not the number of times of the de-chucking release process using the second operation as the distance reduction operation (that is, the number of times of the second operation) has reached the upper limit value.

[0091] Thus, in a state where the mold 3 and the imprint material 14 on the substrate 5 are about to separate, by performing the first operation as the interval reduction operation, it is possible to prevent a part of the mold 3 that is separated from the imprint material 14 on the substrate 5 from coming into contact again. That is, it is possible to prevent the uneven pattern of the mold 3 and / or the imprint material 14 on the substrate 5 from being damaged. Also, in this state, if the first operation is performed, there is a possibility that the mold 3 and the imprint material 14 on the substrate 5 will separate and the de-chucking error will be resolved. Even when the mold 3 and the imprint material 14 on the substrate 5 separate during the de-chucking resolution process and the substrate 5 drops, if the first operation is being performed, it is possible to prevent the mold 3 and the imprint material 14 on the substrate 5 from coming into contact again. That is, it is possible to prevent the uneven pattern of the mold 3 and / or the imprint material 14 on the substrate 5 from being damaged. On the other hand, when the de-chucking error is not resolved by the first operation, since it is highly likely that the entire mold 3 (pattern area) and the imprint material 14 on the substrate 5 are in contact, the second operation is performed as the interval reduction operation. When the entire mold 3 (pattern area) and the imprint material 14 on the substrate 5 are in contact, there is no part in the mold 3 (pattern area) that is separated from the imprint material 14 on the substrate 5. Therefore, even if the second operation is performed, re-contact between a part of the mold 3 that is separated from the imprint material 14 on the substrate 5 will not occur, and the uneven pattern of the mold 3 and / or the imprint material on the substrate 5 will not be damaged.

[0092] As described above, in the second embodiment, the target interval for temporarily narrowing the imprint head 4 and the stage 6 in the de-chucking resolution process is changed according to the number of times of the de-chucking resolution process. Thereby, similar to the first embodiment described above, in a state where the mold 3 and the imprint material 14 on the substrate 5 are about to separate, it is possible to prevent a part of the mold 3 that is separated from the imprint material 14 on the substrate 5 from coming into contact again during the de-chucking resolution process. That is, it is possible to reduce the damage to the uneven pattern of the mold 3 and / or the uneven pattern of the imprint material on the substrate 5.

[0093] Also, according to the second embodiment, it is possible to perform the de-chucking cancellation process while reducing the damage to the uneven pattern of the mold 3 and / or the uneven pattern of the imprint material on the substrate 5 without using the image obtained by the observation unit 22. The advantage of this is that advanced processing such as image processing is not required because the image obtained by the observation unit 22 is not used.

[0094] <Embodiment of article manufacturing method> The article manufacturing method according to the embodiment of the present invention is suitable for manufacturing articles such as microdevices such as semiconductor devices and elements having a fine structure. The article manufacturing method of the present embodiment includes a forming step of forming a pattern on a substrate using the above-described imprint apparatus, a processing step of processing the substrate on which the pattern is formed in the forming step, and a manufacturing step of manufacturing an article from the substrate processed in the processing step. The imprint apparatus used in the forming step is controlled by the above-described control method. Further, the article manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The article manufacturing method of the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

[0095] The pattern of the cured product formed using the above-described imprint apparatus is used permanently for at least a part of various articles or temporarily when manufacturing various articles. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, or a mold or the like. Examples of the electric circuit element include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the mold include an imprint mold and the like.

[0096] The pattern of the cured material is used as it is as at least a part of the constituent members of the above article, or is temporarily used as a resist mask. After etching, ion implantation, etc. are performed in the substrate processing step, the resist mask is removed.

[0097] Next, a specific manufacturing method of the article will be described. As shown in Fig. 13(a), a substrate 1z such as a silicon wafer on which a material to be processed 2z such as an insulator is formed on the surface is prepared, and then an imprint material 3z is applied to the surface of the material to be processed 2z by an inkjet method or the like. Here, a state where a plurality of droplet-shaped imprint materials 3z are applied on the substrate is shown.

[0098] As shown in Fig. 13(b), an imprint mold 4z is opposed with the side on which the concavo-convex pattern is formed facing the imprint material 3z on the substrate. As shown in Fig. 13(c), the substrate 1z on which the imprint material 3z is applied and the mold 4z are brought into contact with each other and pressure is applied. The imprint material 3z is filled in the gap between the mold 4z and the material to be processed 2z. When light is irradiated through the mold 4z as energy for curing in this state, the imprint material 3z is cured.

[0099] As shown in Fig. 13(d), after the imprint material 3z is cured and the mold 4z and the substrate 1z are separated, a pattern of the cured product of the imprint material 3z is formed on the substrate 1z. The pattern of this cured product has a shape in which the concave portion of the mold corresponds to the convex portion of the cured product and the convex portion of the mold corresponds to the concave portion of the cured product. That is, the concavo-convex pattern of the mold 4z is transferred to the imprint material 3z.

[0100] As shown in Fig. 13(e), when etching is performed using the pattern of the cured product as an etching-resistant mask, the portion of the surface of the material to be processed 2z where no cured product remains or remains thinly is removed to form a groove 5z. As shown in Fig. 13(f), when the pattern of the cured product is removed, an article having a groove 5z formed on the surface of the material to be processed 2z can be obtained. Here, the pattern of the cured product is removed, but it may not be removed after processing and may be used as a constituent member of the article, for example, a film for interlayer insulation included in a semiconductor element or the like.

[0101] <Summary of Embodiments> The disclosure of this specification includes at least the following imprint apparatus control method, imprint apparatus, and article manufacturing method. (Item 1) A control method for an imprint apparatus having a mold holding part that holds a mold and a substrate holding part that holds a substrate, and molding an imprint material on the substrate using the mold, a curing step of curing the imprint material in a state where the mold and the imprint material on the substrate are brought into contact by narrowing the distance between the mold holding part and the substrate holding part; a mold release step of separating the mold from the imprint material cured in the curing step by widening the distance between the mold holding part and the substrate holding part; a detection step of detecting an error indicating that the mold has detached from the mold holding part or the substrate has detached from the substrate holding part without the mold and the imprint material being separated in the mold release step; a resolution step of executing a process of narrowing the distance between the mold holding part and the substrate holding part to a target distance in order to resolve the error when the error is detected in the detection step; including in the process, the target distance is changed according to the contact state between the mold and the imprint material that did not separate in the mold release step, and the control method is characterized by this. (Item 2) The contact state indicates the size of the contact area between the mold and the imprint material, in the process, the target distance is changed according to the contact state such that the smaller the contact area, the wider the target distance, and the control method according to Item 1 is characterized by this. (Item 3) in the process, the contact state is determined based on an image obtained by an imaging unit that images the imprint material on the substrate through the mold, and the target distance is determined according to the contact state, and the control method according to Item 1 or 2 is characterized by this. (Item 4) When the contact state is a state where the mold and the imprint material are partially separated, the target interval is set to a value larger than the height of the convex portion of the pattern formed on the imprint material through the mold release process. The control method according to any one of Items 1 to 3, characterized in that. (Item 5) A control method for an imprint apparatus having a mold holding portion for holding a mold and a substrate holding portion for holding a substrate, and molding an imprint material on the substrate using the mold, A curing step of curing the imprint material in a state where the mold and the imprint material on the substrate are brought into contact by narrowing the interval between the mold holding portion and the substrate holding portion, A mold release step of separating the mold from the imprint material cured in the curing step by widening the interval between the mold holding portion and the substrate holding portion, A detection step of detecting an error indicating that the mold and the imprint material are not separated in the mold release step, but the mold is detached from the mold holding portion or the substrate is detached from the substrate holding portion, When the error is detected in the detection step, a resolution step of executing a process for resolving the error, Including, In the process, a first operation of temporarily narrowing the interval between the mold holding portion and the substrate holding portion to a first target interval is executed. When the error is not resolved by the first operation, a second operation of temporarily narrowing the interval between the mold holding portion and the substrate holding portion to a second target interval is executed. The second target interval is narrower than the first target interval. A control method characterized by this. (Item 6) In the process, when the error is not resolved by a predetermined number of the first operations, the second operation is executed. The control method according to Item 5, characterized in that. (Item 7) In the process, the second operation is repeatedly executed until the error is resolved or the number of times of the second operation reaches the upper limit value. The control method according to Item 5 or 6, characterized in that. (Item 8) In the elimination step, when the error is not eliminated by the second operation, a third operation is executed to temporarily narrow the distance between the mold holding part and the substrate holding part to a third target distance. The third target distance is narrower than the second target distance, and the control method according to item 5 or 6 is characterized in that. (Item 9) The first target distance is set to a value larger than the height of the convex portion of the pattern formed on the imprint material through the mold release step, and the control method according to any one of items 5 to 8 is characterized in that. (Item 10) An imprint apparatus for molding an imprint material on a substrate using a mold, A mold holding part for holding the mold, A substrate holding part for holding the substrate, A curing step of curing the imprint material in a state where the mold and the imprint material on the substrate are in contact by narrowing the distance between the mold holding part and the substrate holding part, and a mold release step of separating the mold from the imprint material cured in the curing step by widening the distance between the mold holding part and the substrate holding part, and a control part for controlling the above, Comprising, When the control part detects an error indicating that the mold has detached from the mold holding part or the substrate has detached from the substrate holding part without the mold and the imprint material being separated in the mold release step, the control part executes a process of narrowing the distance between the mold holding part and the substrate holding part to a target distance in order to eliminate the error. In the process, the control part changes the target distance according to the contact state between the mold and the imprint material that did not separate in the mold release step, and the imprint apparatus is characterized in that. (Item 11) An imprint apparatus for molding an imprint material on a substrate using a mold, A mold holding part for holding the mold, A substrate holding part for holding the substrate, A curing step of curing the imprint material in a state where the mold and the imprint material on the substrate are in contact with each other by narrowing the distance between the mold holding part and the substrate holding part; a mold release step of separating the mold from the imprint material cured in the curing step by widening the distance between the mold holding part and the substrate holding part; and a control unit that controls the above, comprising When the control unit detects an error indicating that the mold and the imprint material have not separated in the mold release step and the mold has detached from the mold holding part or the substrate has detached from the substrate holding part, the control unit executes a process for eliminating the error. In the process, the control unit executes a first operation of temporarily narrowing the distance between the mold holding part and the substrate holding part to a first target distance. When the error is not eliminated by the first operation, the control unit executes a second operation of temporarily narrowing the distance between the mold holding part and the substrate holding part to a second target distance. The imprint apparatus is characterized in that the second target distance is narrower than the first target distance. (Item 12) A forming step of forming a pattern on a substrate using an imprint apparatus; A processing step of processing the substrate on which the pattern has been formed in the forming step; A manufacturing step of manufacturing an article from the substrate processed in the processing step; including The imprint apparatus is controlled by the control method according to any one of Items 1 to 9. The article manufacturing method is characterized by this.

[0102] The invention is not limited to the above embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, claims are attached to disclose the scope of the invention.

Explanation of Signs

[0103] 1: Imprinting device, 2: Lighting unit, 3: Mold, 4: Imprint head (mold holding unit), 5: Substrate, 6: Stage (substrate holding unit), 10: Control unit, 22: Observation unit (imaging unit)

Claims

1. A control method for an imprint apparatus having a mold holding part for holding a mold and a substrate holding part for holding a substrate, and molding an imprint material on the substrate using the mold, comprising: a curing step of curing the imprint material in a state where the mold and the imprint material on the substrate are brought into contact with each other by narrowing the distance between the mold holding part and the substrate holding part; a mold release step of separating the mold from the imprint material cured in the curing step by widening the distance between the mold holding part and the substrate holding part; a detection step of detecting an error indicating that the mold has been detached from the mold holding part or the substrate has been detached from the substrate holding part without the mold and the imprint material being separated in the mold release step; a resolution step of executing a process of narrowing the distance between the mold holding part and the substrate holding part to a target distance in order to resolve the error when the error is detected in the detection step; wherein, in the process, the target distance is changed according to the contact state between the mold and the imprint material that did not separate in the mold release step. A control method characterized by this.

2. The contact state indicates the size of the contact area between the mold and the imprint material, wherein, in the process, the target distance is changed according to the contact state such that the smaller the contact area, the wider the target distance. The control method according to claim 1, characterized by this.

3. In the process, the contact state is determined based on an image obtained by an imaging unit that images the imprint material on the substrate through the mold, and the target distance is determined according to the contact state. The control method according to claim 1, characterized by this.

4. When the contact state is a state where the mold and the imprint material are partially separated, the target distance is set to a value larger than the height of the convex portion of the pattern formed on the imprint material after the mold release step. The control method according to claim 1, characterized by this.

5. A control method for an imprint apparatus having a mold holding part for holding a mold and a substrate holding part for holding a substrate, and molding an imprint material on the substrate using the mold, comprising: a curing step of curing the imprint material in a state where the mold and the imprint material on the substrate are brought into contact with each other by narrowing the distance between the mold holding part and the substrate holding part; A mold release step of separating the mold from the imprint material cured in the curing step by widening the distance between the mold holding part and the substrate holding part; A detection step of detecting an error indicating that the mold and the imprint material are not separated in the mold release step, and the mold is detached from the mold holding part or the substrate is detached from the substrate holding part; A resolution step of executing a process for resolving the error when the error is detected in the detection step; comprising; In the process, a first operation of temporarily narrowing the distance between the mold holding part and the substrate holding part to a first target distance is executed. When the error is not resolved by the first operation, a second operation of temporarily narrowing the distance between the mold holding part and the substrate holding part to a second target distance is executed. The second target distance is narrower than the first target distance. A control method characterized by this. **Claim 6** In the process, when the error is not resolved by a predetermined number of the first operations, the second operation is executed. The control method according to claim 5, characterized by this. **Claim 7** In the process, the second operation is repeatedly executed until the error is resolved or the number of times of the second operation reaches an upper limit value. The control method according to claim 5, characterized by this. **Claim 8** In the resolution step, when the error is not resolved by the second operation, a third operation of temporarily narrowing the distance between the mold holding part and the substrate holding part to a third target distance is executed. The third target distance is narrower than the second target distance. The control method according to claim 5, characterized by this. **Claim 9** The first target distance is set to a value larger than the height of the convex portion of the pattern formed on the imprint material through the mold release step. The control method according to claim 5, characterized by this. **Claim 10** An imprint apparatus for molding an imprint material on a substrate using a mold, a mold holding part for holding the mold; a substrate holding part for holding the substrate; A control unit that controls a curing step of curing the imprint material in a state where the mold and the imprint material on the substrate are in contact with each other by narrowing the distance between the mold holding part and the substrate holding part, and a mold release step of separating the mold from the imprint material cured in the curing step by widening the distance between the mold holding part and the substrate holding part; comprising. When the control unit detects an error indicating that the mold has detached from the mold holding unit or the substrate has detached from the substrate holding unit without the mold and the imprint material being separated in the mold release step, the control unit executes a process of narrowing the distance between the mold holding unit and the substrate holding unit to a target distance in order to eliminate the error. In the process, the control unit changes the target distance according to the contact state between the mold and the imprint material that did not separate in the mold release step. An imprint apparatus characterized by this. [

11. ] An imprint apparatus for forming an imprint material on a substrate using a mold, a mold holding unit for holding the mold, a substrate holding unit for holding the substrate, a curing step of curing the imprint material in a state where the mold and the imprint material on the substrate are brought into contact by narrowing the distance between the mold holding unit and the substrate holding unit; and a mold release step of separating the mold from the imprint material cured in the curing step by widening the distance between the mold holding unit and the substrate holding unit, and a control unit for controlling the steps. comprising When the control unit detects an error indicating that the mold has detached from the mold holding unit or the substrate has detached from the substrate holding unit without the mold and the imprint material being separated in the mold release step, the control unit executes a process for eliminating the error. In the process, the control unit executes a first operation of temporarily narrowing the distance between the mold holding unit and the substrate holding unit to a first target distance. When the error is not eliminated by the first operation, the control unit executes a second operation of temporarily narrowing the distance between the mold holding unit and the substrate holding unit to a second target distance. The second target distance is narrower than the first target distance. An imprint apparatus characterized by this. [

12. ] A forming step of forming a pattern on a substrate using an imprint apparatus, a processing step of processing the substrate on which the pattern has been formed in the forming step, a manufacturing step of manufacturing an article from the substrate processed in the processing step, including The imprint apparatus is controlled by the control method according to any one of claims 1 to 9. An article manufacturing method characterized by this.

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