Multilayered capacitor

Abstract

To provide a multilayered capacitor capable of improving reliability, enhancing connectivity with external electrodes, and reducing the risk of delamination and radiation cracks.SOLUTION: A multilayered capacitor includes: a body that includes dielectric layers stacked in a first direction and a plurality of internal electrodes disposed to face each other with the dielectric layers interposed therebetween; and external electrodes that are disposed at the body and are connected to the internal electrodes. Each of the plurality of internal electrodes includes a capacity portion disposed to overlap the other internal electrode adjacent thereto and a drawing-out portion including a protruding portion extending from the capacity portion to be connected to the external electrodes and protruding from one surface of the body in a second direction perpendicular to the first direction. The drawing-out portion includes a portion with a thickness greater than a thickness of the capacity portion in terms of a thickness along the first direction, and the ratio of the length of the protruding portion to the thickness of the capacity portion in the length along the second direction may be within a range of 0.07 or more and less than 0.1.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present disclosure relates to a multilayer capacitor.

Background Art

[0002] A multilayer capacitor is a chip-shaped capacitor that is mounted on a printed circuit board of various electronic products such as video equipment, computers, smartphones, and mobile phones to charge or discharge electricity.

[0003] Such a multilayer capacitor can be used as a component of various electronic devices due to its advantages of being small in size, having a high capacitance, and being easy to mount. Recently, as the components of electronic devices are miniaturized, the requirements for miniaturization and high capacitance of multilayer capacitors are increasing.

[0004] As the miniaturization and high capacitance progress, the thinning of the internal electrodes is also required. As a result, there is a problem that the thickness of the body at the portion where the internal electrodes are not superimposed decreases, and the reliability decreases.

Summary of the Invention

Problems to be Solved by the Invention

[0005] An object is to provide a multilayer capacitor that can improve reliability, improve connectivity with external electrodes, and reduce the risk of delamination and radiation cracks.

[0006] However, the problems to be solved by the embodiments of the present invention are not limited to the above problems, and can be variously extended within the scope of the technical idea included in the present invention.

Means for Solving the Problems

[0007] A stacked capacitor according to an embodiment includes a body including a dielectric layer stacked in a first direction and a plurality of internal electrodes disposed to face each other with the dielectric layer interposed therebetween, and an external electrode disposed on the body and connected to the internal electrode. Each of the plurality of internal electrodes includes a capacitance portion disposed to overlap with another adjacent internal electrode, and a lead portion extending from the capacitance portion and connected to the external electrode and including a protruding portion protruding from one surface of the body in a second direction perpendicular to the first direction. In a thickness along the first direction, the lead portion includes a portion having a thickness greater than that of the capacitance portion. In a length along the second direction, a ratio of a length of the protruding portion to a thickness of the capacitance portion is within a range of 0.07 or more and less than 0.1.

[0008] In a thickness along the first direction, the lead portion may include a portion where the thickness increases as it goes outside the body along the second direction.

[0009] In a thickness along the first direction, the lead portion may include a portion where the thickness gradually increases as it goes outside the body along the second direction.

[0010] In a thickness along the first direction, the lead portion may include a portion having a constant thickness.

[0011] In a thickness along the first direction, the protruding portion may include a portion having a constant thickness.

[0012] In a thickness along the first direction, the lead portion may include a portion where the thickness increases in both the upper and lower directions along the first direction as it goes outside the body along the second direction.

[0013] In a thickness along the first direction, the lead portion may include a portion where the thickness increases in one direction along the first direction as it goes outside the body along the second direction.

[0014] In the thickness along the first direction, the ratio of the maximum thickness of the lead-out portion to the average thickness of the capacitor portion may be in a range exceeding 1.2 and less than 2.0.

[0015] The protruding portion may be covered by the external electrode.

[0016] The body includes a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface facing each other in the second direction, and a fifth surface and a sixth surface facing each other in a third direction perpendicular to the first direction and the second direction. The external electrode includes a first external electrode and a second external electrode. The plurality of internal electrodes include a first internal electrode and a second internal electrode alternately arranged with the dielectric layer therebetween. The first internal electrode includes a first capacitor portion and a first lead-out portion extending from the first capacitor portion and connected to the first external electrode, the first lead-out portion including a first protruding portion protruding from the third surface of the body. The second internal electrode may include a second capacitor portion overlapping the first capacitor portion in the first direction and a second lead-out portion extending from the second capacitor portion and connected to the second external electrode, the second lead-out portion including a second protruding portion protruding from the fourth surface of the body.

[0017] The first protruding portion may be covered by the first external electrode, and the second protruding portion may be covered by the second external electrode.

[0018] The external electrode may include a conductive layer disposed on the surface of the body and connected to the plurality of internal electrodes, and a plating layer disposed on the conductive layer.

[0019] The protruding portion may have a thickness greater than the thickness of the capacitor portion along the first direction.

[0020] The protruding portion may be the thickest part of each of the plurality of internal electrodes.

[0021] The length of the protruding portion may be in a range of 28 or more and 40 nm or less.

Advantages of the Invention

[0022] According to the multilayer capacitor according to the embodiment, the chip shape can be improved to improve reliability, the connectivity with the external electrode can be improved, delamination can be prevented from occurring, and the risk of the occurrence of radiation cracks can be reduced.

Brief Description of the Drawings

[0023]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Mode for Carrying Out the Invention

[0024] Hereinafter, embodiments of the present invention will be described in detail so that those having ordinary knowledge in the technical field to which the present invention pertains can easily implement it with reference to the attached drawings. In the drawings, parts not related to the description are omitted in order to clearly explain the present invention, and the same reference numerals are given to the same or similar components throughout the specification. Also, in the attached drawings, some components are exaggerated, omitted, or schematically illustrated, and the sizes of the components do not fully reflect the actual sizes.

[0025] The attached drawings are only for facilitating an easy understanding of the embodiments disclosed in this specification, and the technical idea disclosed in this specification is not limited by the attached drawings. It is understood to include all modifications, equivalents, and alternatives included in the spirit and technical scope of the present invention.

[0026] Terms including ordinal numbers such as first, second, etc. can be used to describe various components, but the components are not limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

[0027] Also, when a part such as a layer, film, region, plate, etc. is "on" or "above" another part, this includes not only the case where it is "directly above" the other part, but also the case where there are other parts in between. Conversely, when a part is "directly above" another part, it means that there are no other parts in between. Also, being "on" or "above" a reference part means being located above or below the reference part, and does not necessarily mean being "on" or "above" in the direction opposite to gravity.

[0028] Throughout the specification, terms such as "comprising" or "having" are intended to specify the presence of the features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, and are understood not to preclude in advance the presence or addition possibility of one or more other features, numbers, steps, operations, components, parts, or combinations thereof. Therefore, when a part "comprises" a certain component, this means that it can further include other components rather than excluding other components unless otherwise stated to the contrary.

[0029] Also, throughout the specification, when it is said "on a plane", this means when the target part is viewed from above, and when it is said "in a cross-section", this means when the cross-section obtained by vertically cutting the target part is viewed from the side.

[0030] Throughout the specification, when a part is "coupled" with another part, this includes not only the case where it is "directly or physically coupled", but also the case where it is "indirectly or capacitively coupled" with other elements interposed therebetween.

[0031] Also, throughout the specification, when it is said that "components are connected", this does not only mean that two or more components are directly connected, but also that two or more components are indirectly connected through other components, physically connected, electrically connected, or can be meant to be integral although referred to by different names depending on their positions or functions.

[0032] Hereinafter, in order to clearly explain the embodiments of the present invention, if the directions of the body 110 are defined, x, y, and z shown in the drawings respectively indicate the length direction, width direction, and thickness direction of the body 110. Here, the z-axis direction (thickness direction) may be a direction perpendicular to the wide surface (main surface) of the sheet-shaped component, and as an example, it can be used as the same concept as the stacking direction in which the dielectric layer 111 is stacked. The x-axis direction (length direction) may be a direction extending parallel to the wide surface (main surface) of the sheet-shaped component and substantially perpendicular to the z-axis direction (thickness direction), and as an example, it may be the direction in which the first external electrode 130 and the second external electrode 140 are located on both sides. The y-axis direction (width direction) may be a direction extending parallel to the wide surface (main surface) of the sheet-shaped component and substantially perpendicular to the z-axis direction (thickness direction) and the x-axis direction (length direction), and the length of the sheet-shaped component in the x-axis direction (length direction) may be even larger than the width in the y-axis direction (width direction).

[0033] Therefore, the first direction, which is the direction in which the dielectric layer 111, the first internal electrode 121, and the second internal electrode 122 are stacked, may be the z-axis direction (thickness direction), and the second direction and the third direction, which are perpendicular to the first direction and perpendicular to each other, may be the x-axis direction (length direction) and the y-axis direction (width direction), respectively.

[0034] FIG. 1 is a perspective view schematically showing a multilayer capacitor according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line II-II' of FIG. 1.

[0035] Referring to FIGS. 1 and 2, the multilayer capacitor 100 according to the present embodiment includes a body 110, a first external electrode 130, and a second external electrode 140.

[0036] The body 110 may include a plurality of dielectric layers 111, and a plurality of first internal electrodes 121 and second internal electrodes 122 that are alternately arranged in the z-axis direction with the dielectric layers 111 interposed therebetween.

[0037] The body 110 is formed by firing after laminating a plurality of dielectric layers 111 in the z-axis direction, and the boundary between adjacent dielectric layers 111 of the body 110 may be integrated to such an extent that it is difficult to confirm without using a scanning electron microscope (SEM).

[0038] The body 110 may have a thickness along the z-axis direction, a length along the x-axis direction, and a width along the y-axis direction, which are preset in size, and may have a substantially hexahedral shape. However, the shape, dimensions of the body 110, and the number of stacked dielectric layers 111 are not limited to those shown in the drawings of the present embodiment.

[0039] In the present embodiment, for convenience of explanation, both surfaces of the body 110 facing each other in the z direction are defined as a first surface S1 and a second surface S2, both surfaces facing each other in the x direction and connected to the first surface S1 and the second surface S2 are defined as a third surface S3 and a fourth surface S4, and both surfaces facing each other in the y-axis direction and connected to the first surface S1 and the second surface S2 and connected to the third surface S3 and the fourth surface S4 are defined as a fifth surface S5 and a sixth surface S6. Also, in the present embodiment, the mounting surface of the multilayer capacitor 100 may be the first surface S1 of the body 110.

[0040] The dielectric layer 111 may include a ceramic material having a high dielectric constant, for example, barium titanate (BaTiO 3 )-based or strontium titanate (SrTiO3 ) It can contain ceramic powder and the like, but the present invention is not limited thereto as long as sufficient capacitance can be obtained.

[0041] Further, ceramic additives, organic solvents, plasticizers, binders, dispersants, etc. may be further added to the dielectric layer 111 together with the ceramic powder. As the ceramic additive, for example, transition metal oxides or transition metal carbides, rare earth elements, magnesium (Mg) or aluminum (Al) can be used.

[0042] Such a body 110 can include an active region as a part contributing to the capacitance formation of the capacitor, and an upper cover 112 and a lower cover 113 formed respectively at the upper and lower portions of the active region in the z-axis direction as upper and lower margin portions.

[0043] The upper cover 112 and the lower cover 113 can have the same material and configuration as the dielectric layer 111, except that they do not include internal electrodes.

[0044] Such upper cover 112 and lower cover 113 can be formed by laminating a single dielectric layer or two or more dielectric layers in the z-axis direction on the upper and lower surfaces of the active region respectively, and can basically play a role of preventing damage to the first internal electrode 121 and the second internal electrode 122 due to physical or chemical stress.

[0045] The first internal electrode 121 and the second internal electrode 122 are electrodes to which polarities different from each other are applied, and are alternately arranged along the z-axis direction with the dielectric layer 111 interposed therebetween, and one end is exposed from the third surface S3 and the fourth surface S4 of the body 110 respectively. Also, one end of the first internal electrode 121 and the second internal electrode 122 may protrude from the third surface S3 and the fourth surface S4 of the body 110 respectively.

[0046] The first internal electrode 121 and the second internal electrode 122 can be electrically insulated from each other by the dielectric layer 111 disposed between the first internal electrode 121 and the second internal electrode 122.

[0047] The ends of the first internal electrode 121 and the second internal electrode 122 that are alternately exposed through the third surface S3 and the fourth surface S4 of the body 110 can be respectively connected to the first external electrode 130 and the second external electrode 140 disposed on the third surface S3 and the fourth surface S4 of the body 110 described below, so as to be electrically connected. Therefore, it is possible to improve the bonding force between the internal electrode and the external electrode, reduce contact failure, and prevent a decrease in the capacitance of the multilayer capacitor 100.

[0048] Also, the material for forming the first internal electrode 121 and the second internal electrode 122 is not particularly limited. For example, the first internal electrode 121 and the second internal electrode 122 can be formed using a conductive paste made of one or more substances among noble metal materials such as platinum (Pt), palladium (Pd), palladium-silver (Pd-Ag) alloy, nickel (Ni), and copper (Cu). Here, the printing method of the conductive paste can use a screen printing method, a gravure printing method, etc., and the present invention is not limited thereto.

[0049] The first internal electrode 121 can include a first capacitance portion 121a and a first lead-out portion 121b. The first capacitance portion 121a is a portion that is spaced apart from the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6 of the body 110, and can be a portion that contributes to forming the capacitance of the capacitor. The first lead-out portion 121b is a portion that extends from the first capacitance portion 121a and is connected to the first external electrode 130. The first lead-out portion 121b extends so as to protrude from the third surface S3 of the body 110 at the first capacitance portion 121a. The first lead-out portion 121b can include a first protruding portion 121b1 that protrudes in the x-axis direction from the third surface S3 of the body 110.

[0050] The second internal electrode 122 can include a second capacitor portion 122a and a second lead portion 122b. The second capacitor portion 122a is a portion that is spaced apart from the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6 of the body 110, and can be a portion that contributes to forming the capacitance of the capacitor. The second lead portion 122b is a portion that extends from the second capacitor portion 122a and is connected to the second external electrode 140. The second lead portion 122b extends so as to protrude from the fourth surface S4 of the body 110 at the second capacitor portion 122a. The second lead portion 122b can include a second protruding portion 122b1 that protrudes in the x-axis direction from the fourth surface S4 of the body 110.

[0051] As described above, by including the first protruding portion 121b1 and the second protruding portion 122b1 where the first internal electrode 121 and the second internal electrode 122 protrude outside the body 110, the contact property with the external electrode can be improved.

[0052] The first lead portion 121b and the second lead portion 122b are arranged so as to be offset from each other in the length direction of the body 110 and are alternately exposed at both ends along the length direction of the body 110.

[0053] With the configuration as described above, when a predetermined voltage is applied to the first external electrode 130 and the second external electrode 140, charges are accumulated between the first internal electrode 121 and the second internal electrode 122.

[0054] Here, the capacitance of the multilayer capacitor 100 becomes proportional to the overlapping area of the first capacitor portion 121a of the first internal electrode 121 and the second capacitor portion 122a of the second internal electrode 122 that overlap each other along the z-axis direction in the active region of the body 110.

[0055] The first external electrode 130 and the second external electrode 140 are provided with voltages of different polarities, are arranged at both ends of the body 110 in the x-axis direction, and are respectively connected to and electrically connected to the exposed portions of the first internal electrode 121 and the second internal electrode 122. For example, the first external electrode 130 is connected to and electrically connected to a plurality of first lead portions 121b, and the second external electrode 140 is connected to and electrically connected to a second lead portion 122b described later.

[0056] The first external electrode 130 is arranged on the surface of the body 110. The first external electrode 130 can include a conductive layer (not shown) connected to a plurality of first internal electrodes 121 and at least one plating layer (not shown) arranged on the conductive layer. The plating layer is arranged to cover the conductive layer. Also, the second external electrode 140 is arranged on the surface of the body 110. The second external electrode 140 can include a conductive layer (not shown) connected to a plurality of second internal electrodes 122 and at least one plating layer (not shown) arranged on the conductive layer. The plating layer is arranged to cover the conductive layer.

[0057] The conductive layer can include a connection portion and a band portion. The connection portion is located on the third surface S3 or the fourth surface S4 of the body 110 and can be a portion connected to the protruding portion of the first internal electrode 121 or the second internal electrode 122. The band portion can include a portion extending from the connection portion to a part of the first surface S1 of the body 110. The band portion may be further extended to a part of the fifth surface S5 and the sixth surface S6 and a part of the second surface S2 of the body 110 for improving the adhesion strength.

[0058] The conductive layer can include at least one of copper (Cu) and silver (Ag), and can further include glass, epoxy, etc. together with this. The conductive layer can be formed by applying a conductive paste containing a metal and firing it.

[0059] The plating layer can be formed to contain nickel (Ni), phosphorus (P), or palladium (Pd). Also, each plating layer can be formed by electroless plating. By forming the plating layer by electroless plating in this way, it is possible to have corrosion resistance superior to that of a film formed by electrolytic plating while having substantially no significant difference in plating properties compared to electrolytic plating, and to make the plating grow substantially uniformly by position to have a uniform plating thickness. Further, when performing electroless plating, only the object to be plated can be plated without any dummy, so that the plating preparation work and the defective sorting work of the object to be plated after plating can be performed more easily.

[0060] Hereinafter, with reference to FIGS. 2 and 3, the structures of the first internal electrode 121 and the second internal electrode 122 will be specifically described.

[0061] FIG. 3 is a cross-sectional view showing an enlarged A portion of FIG. 2, and FIG. 4 is a cross-sectional view showing an enlarged B portion of FIG. 2.

[0062] Referring to FIGS. 2 to 4, the first lead-out portion 121b can be arranged at one end of the first capacitor portion 121a. The first lead-out portion 121b can include a portion having a thickness larger than the thickness L1 along the z-axis direction of the first capacitor portion 121a. The thickness L2 along the z-axis direction of the first lead-out portion 121b may be larger than the thickness L1 along the z-axis direction of the first capacitor portion 121a. Also, the second lead-out portion 122b can be arranged at one end of the second capacitor portion 122a. The second lead-out portion 122b can include a portion having a thickness larger than the thickness L1 along the z-axis direction of the second capacitor portion 122a. The thickness L2 along the z-axis direction of the second lead-out portion 122b may be larger than the thickness L1 along the z-axis direction of the second capacitor portion 122a.

[0063] The thickness L1 of the first capacitance portion 121a and the second capacitance portion 122a may be the length of an arbitrary line segment or the arithmetic mean value of the lengths of a plurality of line segments that connect from one point on the lower surface to the upper surface of the first capacitance portion 121a and the second capacitance portion 122a along the z-axis direction in an x-z cross-section passing through the central point in the y-axis direction of the multilayer capacitor 100. The aforementioned plurality of line segments may be five or more line segments arranged at equal intervals. The thickness L1 of the first capacitance portion 121a and the second capacitance portion 122a can be measured using an optical microscope, a scanning electron microscope, or the like.

[0064] The thickness L2 of the first lead portion 121b and the second lead portion 122b may be the length of an arbitrary line segment, the maximum value among the lengths of a plurality of line segments, or the arithmetic mean value of the lengths of a plurality of line segments that connect from one point on the lower surface to the upper surface of the first lead portion 121b and the second lead portion 122b along the z-axis direction in an x-z cross-section passing through the central point in the y-axis direction of the multilayer capacitor 100. The aforementioned plurality of line segments may be five or more line segments arranged at equal intervals. The thickness L2 of the first lead portion 121b and the second lead portion 122b can be measured using an optical microscope, a scanning electron microscope, or the like.

[0065] The first lead portion 121b may include a first protruding portion 121b1 at one end. The ratio of the length L3 along the x-axis direction of the first protruding portion 121b1 to the thickness L1 of the first capacitance portion 121a may be in the range of 0.07 or more and less than 0.1. Also, the second lead portion 122b may include a second protruding portion 122b1 at one end. The ratio of the length L3 along the x-axis direction of the second protruding portion 122b1 to the thickness L1 of the second capacitance portion 122a may be in the range of 0.07 or more and less than 0.1.

[0066] As an example, the ratio of the length L3 along the x-axis direction of the first protruding portion 121b1 to the thickness L1 of the first capacitance portion 121a may be in the range of 0.07 or more and 0.09 or less. Also, the ratio of the length L3 along the x-axis direction of the second protruding portion 122b1 to the thickness L1 of the second capacitance portion 122a may be in the range of 0.07 or more and 0.09 or less.

[0067] The length L3 of the first protrusion 121b1 and the second protrusion 122b1 may be the maximum value, the minimum value, or the arithmetic mean value of the lengths of a plurality of line segments connected from one end to the other end of the first protrusion 121b1 and the second protrusion 122b1 along the x-axis direction in the x-z cross-section passing through the central point in the y-axis direction of the multilayer capacitor 100. The plurality of line segments described above may be five or more line segments arranged at equal intervals. The length L3 of the first protrusion 121b1 and the second protrusion 122b1 can be measured using an optical microscope, a scanning electron microscope, or the like.

[0068]

Table 1

[0069] Referring to Table 1 above, when the ratio of the length L3 of the first protrusion 121b1 to the thickness L1 of the first capacitor portion 121a or the ratio of the length L3 of the second protrusion 122b1 to the thickness L1 of the second capacitor portion 122a is less than 0.07, there may be a high possibility of the occurrence of radial cracks. When the ratio of the length L3 of the first protrusion 121b1 to the thickness L1 of the first capacitor portion 121a or the ratio of the length L3 of the second protrusion 122b1 to the thickness L1 of the second capacitor portion 122a is 0.1 or more, electrode detachment may occur.

[0070] As described above, when the ratio of the length L3 of the first protrusion 121b1 to the thickness L1 of the first capacitor portion 121a or the ratio of the length L3 of the second protrusion 122b1 to the thickness L1 of the second capacitor portion 122a is within the range of 0.07 or more and less than 0.1, the risk of the occurrence of radial cracks can be reduced.

[0071] As an example, the thickness of the first internal electrode 121 and the second internal electrode 122 may be within the range of 360 nm or more and 440 nm or less, and preferably may be 400 nm. Here, the length L3 along the x-axis direction of the first protrusion 121b1 and the second protrusion 122b1 may be within the range of 28 nm or more and 40 nm or less.

[0072] The first lead-out portion 121b and the second lead-out portion 122b can include a portion where the thickness along the z-axis direction increases as they go outside the body 110 along the x-axis direction. Specifically, the first lead-out portion 121b and the second lead-out portion 122b can include a portion where the thickness gradually increases as they go outside the body 110 along the x-axis direction. In other words, the ratios of the change amount in the z-axis direction to the change amount in the x-axis direction of the first and second lead-out portions 121b, 122b may be constant. The first and second lead-out portions 121b, 122b can have a linear shape with a certain inclination. Also, the first lead-out portion 121b and the second lead-out portion 122b can include a portion where the thickness increases in both the upper and lower directions along the z-axis direction as they go outside the body 110 along the x-axis direction.

[0073] The ratio of the maximum thickness along the z-axis direction of the first lead-out portion 121b to the thickness L1 along the z-axis direction of the first capacitance portion 121a may be within a range exceeding 1.2 and less than 2.0. Also, the ratio of the maximum thickness along the z-axis direction of the second lead-out portion 122b to the thickness L1 along the z-axis direction of the second capacitance portion 122a may be within a range exceeding 1.2 and less than 2.0.

[0074] As an example, the ratio of the maximum thickness in the z-axis direction of the first lead-out portion 121b to the thickness L1 in the z-axis direction of the first capacitance portion 121a may be within a range of 1.3 or more and 1.9 or less. Also, the ratio of the maximum thickness along the z-axis direction of the second lead-out portion 122b to the thickness L1 along the z-axis direction of the second capacitance portion 122a may be within a range of 1.3 or more and 1.9 or less.

[0075] When the ratio of the maximum thickness along the z-axis direction of the first lead-out portion 121b to the thickness L1 along the z-axis direction of the first capacitance portion 121a or the ratio of the maximum thickness along the z-axis direction of the second lead-out portion 122b to the thickness L1 along the z-axis direction of the second capacitance portion 122a is 1.2 or less, the high-temperature reliability improvement effect may be small. When the ratio of the maximum thickness along the z-axis direction of the first lead-out portion 121b to the thickness L1 along the z-axis direction of the first capacitance portion 121a or the ratio of the maximum thickness along the z-axis direction of the second lead-out portion 122b to the thickness L1 along the z-axis direction of the second capacitance portion 122a exceeds 2.0, the internal electrodes adjacent vertically may overlap and a short circuit may occur.

[0076] As described above, when the ratio of the maximum thickness along the z-axis direction of the first lead-out portion 121b to the thickness L1 along the z-axis direction of the first capacitance portion 121a or the ratio of the maximum thickness along the z-axis direction of the second lead-out portion 122b to the thickness L1 along the z-axis direction of the second capacitance portion 122a is in the range exceeding 1.2 and less than 2.0, the thickness of the dielectric layer at the edge portions at both ends in the x-axis direction of the body where the first lead-out portion 121b and the second lead-out portion 122b are located can be increased to improve the high-temperature reliability.

[0077] The first protruding portion 121b1 is covered by the first external electrode 130. The second protruding portion 122b1 is covered by the second external electrode 140.

[0078] Hereinafter, with reference to Table 2, the characteristics and reliability measurement results of the multilayer capacitor 100 according to an embodiment will be described. The multilayer capacitor of the embodiment may have a ratio of the thickness of the lead-out portion to the thickness of the capacitance portion of 1.6.

[0079] Hereinafter, in the multilayer capacitor of the comparative example, the protruding portion may include a portion where the thickness decreases along the z-axis direction toward the outer peripheral side of the main body along the x-axis direction. Further, the internal electrode of the multilayer capacitor of the comparative example may not include a portion protruding from one surface of the main body.

[0080]

Table 2

[0081] Referring to Table 2 above, it can be confirmed that for the multilayer capacitor 100 of the embodiment, the BDV (Breakdown Voltage) increases by about 33% compared to the comparative example, and the high-temperature reliability improves by about 23% and 52% respectively.

[0082] Hereinafter, referring to Table 3, the measurement results of the step between adjacent internal electrodes at both ends of the body 110 in the x-axis direction where the lead portions 121b and 122b of the multilayer capacitor 100 according to an embodiment are located will be described. The angle can mean the angle at which the lead portions 121b and 122b are inclined with respect to a line parallel to the x-axis. The step between the adjacent lead portions 121b and 122b at both ends of the body 110 in the x-axis direction and the inclined angle of the lead portions 121b and 122b can be measured by observing the cross section of the multilayer capacitor using an optical microscope, a scanning electron microscope, or the like.

[0083]

Table 3

[0084] Referring to Table 3 above, it can be confirmed that for the multilayer capacitor 100 of the embodiment, the step and the inclined angle are smaller compared to the comparative example. Therefore, the problem of the decrease in BDV and HALT (Highly Accelerated Life Test) due to cumulative lamination at both ends of the body 110 in the x-axis direction can be improved, and the electrode connectivity with the external electrode can be improved.

[0085] Hereinafter, referring to Table 4, the radiation crack evaluation results of the multilayer capacitor 100 according to an embodiment will be described. The multilayer capacitors of the comparative example and the embodiment may be capacitors in which Cu is dipped and singly applied. The radiation crack can be a crack generated by the force with which the external electrode tries to press into the inside of the body.

[0086]

Table 4

[0087] Table 4 shows the results of two experiments conducted using the same experimental method to confirm reproducibility. The electrodes were fired at 730°C for 70 minutes.

[0088] Referring to Table 4 above, it can be confirmed that the occurrence of radiation cracks in the multilayer capacitor 100 of the embodiment is reduced compared to the comparative example.

[0089] Hereinafter, with reference to FIG. 5, the first lead-out portion 121b and the second lead-out portion 122b of the multilayer capacitor according to the modified example will be described. FIG. 5 is a cross-sectional view showing a part of the multilayer capacitor according to the modified example cut along the line II-II' of FIG. 1.

[0090] The multilayer capacitor according to this modified example is different from the multilayer capacitor according to the above-described embodiment in that the first lead-out portion 121b and the second lead-out portion 122b can include portions having a constant thickness along the z-axis direction. Also, as an example, the first protruding portion 121b1 and the second protruding portion 122b1 can include portions having a constant thickness along the z-axis direction. The portion having a constant thickness may include a portion whose thickness deviates by 1% or less compared to the maximum and minimum thicknesses of that portion.

[0091] Hereinafter, with reference to FIG. 6, the first lead-out portion 121b and the second lead-out portion 122b of the multilayer capacitor according to another modified example will be described. FIG. 6 is a cross-sectional view showing a part of the multilayer capacitor according to another modified example cut along the line II-II' of FIG. 1.

[0092] Unlike the multilayer capacitor according to the aforementioned embodiment, in the multilayer capacitor according to this modification example, the first lead-out portion 121b and the second lead-out portion 122b can include a portion where the thickness increases in one direction along the z-axis direction as it goes outside the body 110 along the x-axis direction. As an example, the first lead-out portion 121b and the second lead-out portion 122b can include a portion where the thickness increases in the upward direction along the z-axis direction as it goes outside the body 110 along the x-axis direction. However, it is not limited to this. As another example, the first lead-out portion 121b and the second lead-out portion 122b can include a portion where the thickness increases in the downward direction along the z-axis direction as it goes outside the body 110 along the x-axis direction.

[0093] Hereinafter, with reference to FIG. 7, the first lead-out portion 121b and the second lead-out portion 122b of the multilayer capacitor according to another modification example will be described. FIG. 7 is a cross-sectional view showing a part of the multilayer capacitor according to another modification example cut along the line II-II' of FIG. 1.

[0094] Unlike the multilayer capacitor according to the aforementioned embodiment, in the multilayer capacitor according to this modification example, the first lead-out portion 121b and the second lead-out portion 122b may not include the first protruding portion 121b1 and the second protruding portion 122b1. In other words, although the first lead-out portion 121b is exposed through the third surface S3 of the body 110, it may not protrude from the third surface S3. Also, although the second lead-out portion 122b is exposed through the fourth surface S4 of the body 110, it may not protrude from the fourth surface S4.

[0095] According to the multilayer capacitors according to the aforementioned embodiments and modification examples, the chip shape can be improved to enhance reliability, the bending of the lead-out portion of the internal electrode can be prevented to improve the connectivity with the external electrode, and the occurrence of delamination can be prevented. Also, by forming the internal electrode to protrude from the body, the contact property with the external electrode can be improved, the diffusion distance until a crack occurs can be increased, and the risk of the occurrence of a radiative crack can be reduced.

[0096] Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and it can be variously modified and implemented within the scope of the claims, the description of the invention, and the accompanying drawings, and it is natural that this also belongs to the scope of the present invention.

Explanation of Reference Numerals

[0097] 100: Multilayer capacitor 110: Body 121: First internal electrode 121a: First capacitance portion 121b: First lead-out portion 121b1: First protruding portion 122: Second internal electrode 122a: Second capacitance portion 122b: Second lead-out portion 122b1: Second protruding portion 130: First external electrode 140: Second external electrode

Claims

1. a body including a dielectric layer stacked in a first direction and a plurality of internal electrodes arranged to face each other with the dielectric layer therebetween; and an outer electrode disposed on the body and connected to the inner electrode; Each of the plurality of internal electrodes is a capacitance portion disposed to overlap with another of the internal electrodes adjacent thereto; and a lead portion extending from the capacitance portion to be connected to the external electrode, the lead portion including a protrusion protruding from one surface of the body in a second direction perpendicular to the first direction, In the thickness along the first direction, the lead-out portion includes a portion having a thickness greater than a thickness of the capacitance portion, a ratio of a length of the protrusion to a thickness of the capacitance portion in the second direction is within a range of 0.07 or more and less than 0.

1.

2. 2. The multilayer capacitor of claim 1, wherein the lead-out portion has a thickness in the first direction that increases toward an outer side of the body in the second direction.

3. 3. The multilayer capacitor of claim 2, wherein the lead-out portion has a thickness in the first direction that gradually increases toward an outer side of the body in the second direction.

4. The multilayer capacitor according to claim 2 , wherein the lead portion includes a portion having a constant thickness in the first direction.

5. The multilayer capacitor according to claim 4 , wherein the protrusion includes a portion having a constant thickness in the first direction.

6. 2. The multilayer capacitor of claim 1, wherein the thickness of the lead-out portion in the first direction increases in both upper and lower directions along the first direction as the lead-out portion approaches an outer side of the body along the second direction.

7. 2. The multilayer capacitor of claim 1, wherein the lead-out portion includes a portion whose thickness in the first direction increases in one direction along the first direction as it goes toward an outer side of the body in the second direction.

8. 2 . The multilayer capacitor of claim 1 , wherein a ratio of a maximum thickness of the lead portion to an average thickness of the capacitance portion in the first direction is in a range of more than 1.2 and less than 2.

0.

9. The multilayer capacitor according to claim 1 , wherein the protrusion is covered by the external electrode.

10. The body includes: a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface facing each other in the second direction, and a fifth surface and a sixth surface facing each other in a third direction perpendicular to the first direction and the second direction, The external electrodes include a first external electrode and a second external electrode, The plurality of internal electrodes include first internal electrodes and second internal electrodes that are alternately arranged with the dielectric layer therebetween, The first internal electrode is a first capacitance portion; and a first lead portion extending from the first capacitance portion and connected to the first external electrode, the first lead portion including a first protrusion protruding from the third surface of the body; The second internal electrode is 2. The multilayer capacitor of claim 1, comprising: a second capacitance portion overlapping the first capacitance portion in the first direction; and a second lead portion extending from the second capacitance portion, connected to the second external electrode, and including a second protrusion protruding from the fourth surface of the body.

11. the first protrusion is covered by the first external electrode; The multilayer capacitor according to claim 10 , wherein the second protrusion is covered by the second external electrode.

12. The external electrode is a conductive layer disposed on a surface of the body and connected to the plurality of internal electrodes; and The stacked capacitor of claim 1 further comprising a plating layer disposed on the conductive layer.

13. The multilayer capacitor according to claim 1 , wherein the protrusion has a thickness in the first direction that is greater than a thickness of the capacitance portion.

14. 2. The multilayer capacitor according to claim 1, wherein the protruding portion is the thickest portion of each of the plurality of internal electrodes.

15. 2. The multilayer capacitor according to claim 1, wherein the length of the protrusion is within a range of 28 nm to 40 nm.

Images