Processing system, processing method, robot system, connection device, and end effector device

Abstract

To provide a processing system capable of making proper a relative position relation between an irradiation device which irradiates an object with processing light and the object.MEANS: A processing system comprises: a movable member which can change a relative position relation with a part of an object; an irradiation device which irradiates the object with processing light; and a connection device which connects the movable member and the irradiation device so that the relative position relation between the movable member and the irradiation device can be changed. The connection device comprises: a drive member which moves at least one of the movable member and irradiation device; and an elastic member which couples the movable member and the irradiation device.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present invention relates to the technical fields of a processing system and a processing method capable of processing an object with processing light, a robot system, an end effector device, and a connecting device for connecting a robot and an end effector.

Background Art

[0002] As a processing system capable of processing an object, Patent Document 1 describes a processing system that irradiates the surface of an object with processing light to form a structure. In this type of processing system, it is required to appropriately adjust the relative positional relationship between the irradiation device that irradiates the object with processing light and the object.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

[0004] According to a first aspect, in a processing system for processing an object with processing light, a movable member whose relative positional relationship with a part of the object can be changed, an irradiation device that irradiates the object with the processing light, and a connecting device that connects the movable member and the irradiation device so that the relative positional relationship between the movable member and the irradiation device can be changed are provided. The connecting device includes a driving member that moves at least one of the movable member and the irradiation device, and an elastic member that couples the movable member and the irradiation device. A processing system is provided.

[0005] According to a second aspect, in a processing system for processing an object with processing light, a movable member whose relative positional relationship with a part of the object can be changed, an irradiation device that irradiates the object with the processing light, a connection device that connects the movable member and the irradiation device so that the relative positional relationship between the movable member and the irradiation device can be changed, and a vibration reduction device that reduces vibration from the movable member toward the irradiation device are provided.

[0006] According to a third aspect, in a processing system for processing an object with processing light, a movable member whose relative positional relationship with a part of the object can be changed, an irradiation device that irradiates the object with the processing light, a connection device that connects the movable member and the irradiation device so that the relative positional relationship between the movable member and the irradiation device can be changed, and a position measurement device that measures the position of the irradiation device with respect to the object or a reference position are provided. The connection device includes a position changing member that changes the position of the irradiation device with respect to the movable member based on the position measurement result by the position measurement device.

[0007] According to a fourth aspect, in a processing method for processing an object with processing light, changing the positional relationship between the position of a movable member and the position of a part of the object, irradiating the object with the processing light using an irradiation device, changing the relative positional relationship between the movable member and the irradiation device, and connecting the movable member and the irradiation device by a connecting portion including a driving member that moves at least one of the movable member and the irradiation device and an elastic member that couples the movable member and the irradiation device are provided.

[0008] According to a fifth aspect, in a processing method for processing an object with processing light, changing the positional relationship between the position of a movable member and the position of a part of the object, irradiating the object with the processing light using an irradiation device, changing the relative positional relationship between the movable member and the irradiation device, and reducing vibration from the movable member toward the irradiation device are provided.

[0009] According to a sixth aspect, in a processing method of processing an object with processing light, changing a positional relationship between a position of a movable member and a position of a part of the object, irradiating the processing light toward the object using an irradiation device, measuring a position of the irradiation device with respect to the object or a reference position, and changing a relative positional relationship between the movable member and the irradiation device based on the measured position of the irradiation device, a processing method is provided.

[0010] According to a seventh aspect, an end effector that acts on an object, a movable member whose relative relationship with a part of the object can be changed, and a connection device that connects the movable member and the end effector so that a relative positional relationship between the movable member and the end effector can be changed are provided. The connection device includes a drive member that moves at least one of the movable member and the end effector, and an elastic member that couples the movable member and the end effector, and a robot system is provided.

[0011] According to an eighth aspect, an end effector that acts on an object, a movable member whose relative relationship with a part of the object can be changed, a connection device that connects the movable member and the end effector so that a relative positional relationship between the movable member and the end effector can be changed, and a vibration reduction device that reduces vibration from the movable member toward the end effector are provided, and a robot system is provided.

[0012] According to a ninth aspect, an end effector that acts on an object, a movable member whose relative relationship with a part of the object can be changed, a connection device that connects the movable member and the end effector so that a relative positional relationship between the movable member and the end effector can be changed, and a position measurement device that measures a position of the end effector with respect to the object or a reference position are provided. The connection device includes a position changing member that changes a position of the end effector with respect to the movable member based on a position measurement result by the position measurement device, and a robot system is provided.

[0013] According to the tenth aspect, there is provided a connecting device that connects an end effector acting on an object and a movable member whose relative relationship with a part of the object can be changed, the connecting device including a driving member that moves at least one of the movable member and the end effector, and an elastic member that couples the movable member and the end effector, and connecting the movable member and the end effector so that the relative positional relationship between the movable member and the end effector can be changed.

[0014] According to the eleventh aspect, there is provided a connecting device that connects an end effector acting on an object and a movable member whose relative relationship with a part of the object can be changed, the connecting device including a vibration reduction device that reduces vibration from the movable member toward the end effector, and connecting the movable member and the end effector so that the relative positional relationship between the movable member and the end effector can be changed.

[0015] According to the twelfth aspect, there is provided a connecting device that connects an end effector acting on an object and a movable member whose relative relationship with a part of the object can be changed, the connecting device including a position changing member that changes the position of the end effector relative to the movable member based on a position measurement result by a position measurement device that measures the position of the connecting device and / or the end effector relative to the object or a reference position.

[0016] According to the thirteenth aspect, there is provided an end effector device including a connecting device that connects an end effector acting on an object and a movable member whose relative relationship with a part of the object can be changed so that the relative positional relationship between the movable member and the end effector can be changed, the connecting device including a driving member that moves at least one of the movable member and the end effector, and an elastic member that couples the movable member and the end effector.

[0017] According to a 14th aspect, there is provided an end effector device including: an end effector that acts on an object; a movable member whose relative relationship with a part of the object is changeable; a connecting device that connects the movable member and the end effector so that a relative positional relationship between the movable member and the end effector becomes changeable; and a vibration reduction device that reduces vibration from the movable member toward the end effector.

[0018] According to a 15th aspect, there is provided an end effector device including: an end effector that acts on an object; a movable member whose relative relationship with a part of the object is changeable; a connecting device that connects the movable member and the end effector so that a relative positional relationship between the movable member and the end effector becomes changeable; and a position measuring device that measures a position of the end effector with respect to the object or a reference position, wherein the connecting device includes a position changing member that changes a position of the end effector with respect to the movable member based on a position measurement result by the position measuring device.

Brief Description of the Drawings

[0019]

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[0020] Hereinafter, embodiments of a processing system, a processing method, a robot system, a connection device, and an end effector device will be described with reference to the drawings. Hereinafter, a processing system SYS that processes a coating film SF formed on the surface of a workpiece S using processing light EL will be used to describe embodiments of the processing system, the processing method, the robot system, the connection device, and the end effector device. However, the present invention is not limited to the embodiments described below.

[0021] Further, in the following description, the positional relationship of various components constituting the processing system SYS will be described using an XYZ orthogonal coordinate system defined by an X-axis, a Y-axis, and a Z-axis that are orthogonal to each other. In the following description, for convenience of explanation, the X-axis direction and the Y-axis direction are each a horizontal direction (that is, a predetermined direction in a horizontal plane), and the Z-axis direction is a vertical direction (that is, a direction orthogonal to the horizontal plane and substantially a vertical direction). Also, the rotational directions (in other words, the inclination directions) around the X-axis, the Y-axis, and the Z-axis are referred to as the θX direction, the θY direction, and the θZ direction, respectively. Here, the Z-axis direction may be the direction of gravity. Also, the XY plane may be the horizontal direction.

[0022] (1) Machining System SYSa of the First Embodiment First, the processing system SYS of the first embodiment (hereinafter, the processing system SYS of the first embodiment is referred to as "processing system SYSa") will be described.

[0023] (1-1) Structure of Machining System SYSa First, with reference to FIG. 1, the structure of the processing system SYSa of the first embodiment will be described. FIG. 1 is a cross-sectional view schematically showing the structure of the processing system SYSa of the first embodiment.

[0024] As shown in FIG. 1, the processing system SYS processes a coating film SF formed (e.g., applied) on the surface of the object S to be processed. The object S to be processed may be, for example, a metal, an alloy (e.g., duralumin, etc.), a resin (e.g., CFRP (Carbon Fiber Reinforced Plastic), etc.), glass, or an object composed of any other arbitrary material. The coating film SF is a film of paint that covers the surface of the object S to be processed. Therefore, the coating film SF may also be referred to as a paint layer. The object S to be processed serves as a base material for the coating film SF. The thickness of the coating film SF is, for example, from several tens of micrometers to several hundreds of micrometers, but may be any other arbitrary size. The paint constituting the coating film SF may include, for example, a resinous paint or other types of paints. The resinous paint may include, for example, at least one of an acrylic paint (e.g., a paint containing acrylic polyol), a polyurethane paint (e.g., a paint containing polyurethane polyol), a polyester paint (e.g., a paint containing polyester polyol), a vinyl paint, a fluorine paint (e.g., a paint containing fluorine polyol), a silicone paint, and an epoxy paint.

[0025] FIG. 1 shows an example in which a processing system SYSa (particularly, a processing apparatus 1 described later included in the processing system SYSa) is disposed on a workpiece S having a surface along a horizontal plane (i.e., the XY plane). However, the processing system SYSa is not necessarily disposed on the workpiece S having a surface along the horizontal plane. For example, as will be described in detail later with reference to FIG. 8 and the like, the processing system SYSa may be disposed on the workpiece S having a surface intersecting the horizontal plane. The processing system SYSa may be disposed so as to be suspended from the workpiece S. In this case, for convenience, the X-axis direction and the Y-axis direction may be defined as directions along the surface of the workpiece S (typically, parallel directions), and the Z-axis direction may be defined as a direction intersecting the surface of the workpiece S (typically, an orthogonal direction).

[0026] The processing system SYSa irradiates the coating film SF with processing light EL in order to process the coating film SF. The processing light EL may be any type of light as long as the coating film SF can be processed by irradiating the coating film SF therewith. As an example, the processing light EL may be laser light. Further, the processing light EL may be light having any wavelength as long as the coating film SF can be processed by irradiating the coating film SF therewith. In the first embodiment, an example in which the processing light EL is invisible light (for example, at least one of infrared light and ultraviolet light, etc.) will be used for the description. That is, in the first embodiment, an example in which the processing light EL is at least one of light having a wavelength included in a wavelength band shorter than the wavelength band of visible light and light having a wavelength included in a wavelength band longer than the wavelength band of visible light will be used for the description. However, the processing light EL may be visible light.

[0027] Here, with reference to FIGS. 2(a) and 2(b), the state of processing the coating film SF using the processing light EL will be described. Each of FIGS. 2(a) and 2(b) is a cross-sectional view schematically showing the state of processing the coating film SF formed on the surface of the workpiece S.

[0028] As shown in FIG. 2(a), the processing system SYSa irradiates the processing light EL onto the target irradiation region EA set on the surface of the coating film SF. Here, the target irradiation region EA is the region where the processing system SYSa is scheduled to irradiate the processing light EL. As shown in FIG. 2(a), when the processing light EL is irradiated onto the target irradiation region EA, a part of the coating film SF overlapping the target irradiation region EA (that is, the coating film located on the -Z side of the target irradiation region EA) evaporates due to the processing light EL. At this time, in the thickness direction of the coating film SF, not all of the coating film SF overlapping the target irradiation region EA evaporates. That is, in the thickness direction of the coating film SF, while a part of the coating film SF overlapping the target irradiation region EA (specifically, the part of the coating film SF relatively close to the target irradiation region EA) evaporates, the other part of the coating film SF overlapping the target irradiation region EA (specifically, the part of the coating film SF relatively far from the target irradiation region EA) does not evaporate. In other words, the coating film SF evaporates only to the extent that the processed object S is not exposed from the coating film SF. For this reason, the characteristics of the processing light EL may be set to desired characteristics that evaporate the coating film SF only to the extent that the processed object S is not exposed from the coating film SF. The characteristics of the processing light EL may be set to desired characteristics that do not affect the processed object S by the irradiation of the processing light EL. The characteristics of the processing light EL may be set to desired characteristics that affect only the coating film SF by the irradiation of the processing light EL. Here, the characteristics of the processing light EL may include at least one of the wavelength of the processing light EL, the energy amount per unit time and / or per unit area transmitted from the processing light EL to the surface of the coating film SF, the intensity distribution of the processing light EL on the surface of the coating film SF, the irradiation time of the processing light EL on the surface of the coating film SF, and the size of the processing light EL on the surface of the coating film SF (as an example, the spot diameter or area).

[0029] At this time, the energy (i.e., intensity) of the processing light EL irradiated on the coating film SF is determined so as not to affect the object to be processed S by the irradiation of the processing light EL. The energy of the processing light EL is determined so that the processing light EL does not penetrate the coating film SF and reach the object to be processed S. In other words, the energy of the processing light EL is determined so as to affect only the coating film SF by the irradiation of the processing light EL.

[0030] As a result, in the portion where the coating film SF has evaporated, the coating film SF is removed. On the other hand, in the portion where the coating film SF has not evaporated, the coating film SF remains as it is. That is, as shown in FIG. 2(b), in the portion irradiated with the processing light EL, the coating film SF is partially removed. As a result, as shown in FIG. 2(b), in the portion irradiated with the processing light EL, the thickness of the coating film SF becomes thinner compared to the portion not irradiated with the processing light EL. In other words, as shown in FIG. 2(b), on the surface of the object to be processed S, there exist a coating film SF that remains relatively thick because it has not been irradiated with the processing light EL and a coating film SF that has become relatively thin because it has been irradiated with the processing light EL. That is, by the irradiation of the processing light EL, the thickness of the coating film SF is at least partially adjusted. By the irradiation of the processing light EL, a part of the coating film SF is removed in the thickness direction (in the example shown in FIG. 2(b), the Z-axis direction). As a result, a recess (in other words, a groove) C corresponding to the portion where the coating film SF is relatively thin is formed on the surface of the coating film SF. Therefore, the "operation of processing the coating film SF" in the first embodiment includes at least one of an operation of adjusting the thickness of the coating film SF, an operation of removing a part of the coating film SF, and an operation of forming a recess C in the coating film SF.

[0031] The coating film SF evaporates by absorbing the processing light EL. That is, when the energy of the processing light EL is transmitted to the coating film SF, the coating film SF is removed, for example, by being photochemically decomposed. Incidentally, when the processing light EL is a laser beam, the phenomenon in which the coating film SF and the like are photochemically decomposed and removed by the energy of the processing light EL being transmitted to the coating film SF is sometimes referred to as laser ablation. Therefore, the coating film SF contains a material capable of absorbing the processing light EL. Specifically, for example, the coating film SF may contain a material having an absorption rate with respect to the processing light EL (for example, when the processing light EL is invisible light, the absorption rate with respect to light in a wavelength band including wavelengths different from those in the visible light wavelength band) of a predetermined first absorption threshold or more. Conversely, light in a wavelength band having an absorption rate by the coating film SF of a predetermined first absorption threshold or more may be used as the processing light EL.

[0032] The material constituting the coating film SF may contain a dye (specifically, for example, at least one of a pigment and a dye). When the coating film SF contains a dye, the dye may be a dye that exhibits a desired color upon irradiation with visible light. As a result, the coating film SF containing such a dye will exhibit the desired color. In this case, the dye has the property that the absorption rate of light in a first wavelength band, which includes wavelengths that are reflected by the coating film SF and recognized by humans as light of the desired color within the wavelength band of visible light so that the coating film SF exhibits the desired color, is different from the absorption rate of light in a second wavelength band different from the first wavelength band of visible light. For example, the dye may have the property that the absorption rate of light in the first wavelength band is smaller than the absorption rate of light in the second wavelength band. For example, the dye may have the property that the absorption rate of light in the first wavelength band is equal to or less than a predetermined second absorption threshold (where the second absorption threshold is smaller than the first absorption threshold), and the absorption rate of light in the second wavelength band is equal to or greater than a predetermined third absorption threshold (where the third absorption threshold is greater than the second absorption threshold). An example of such a dye that can appropriately absorb the processing light EL, which is invisible light, while exhibiting the desired color is, for example, a near-infrared absorbing dye manufactured by Spectrum Infor located in Kyiv, Ukraine (as an example, tetrafluoroborate 4-((E)-2-{(3E)-2-chloro-3-[2-(2,6-diphenyl-4H-thiopyran-4-ylidene)ethylidene]cyclohex-1-en-1-yl}vinyl)-2,6-diphenylthiopyrylium). Incidentally, when the coating film SF is transparent, the coating film SF may not contain a dye.

[0033] When the coating film SF contains a pigment, the pigment may be a pigment that is transparent to visible light. As a result, a coating film SF containing such a pigment becomes a transparent film (so-called clear coat). Here, the "transparent film" may mean a film through which light in at least a part of the wavelength band of visible light can pass. In this case, the pigment may have the property of not absorbing visible light very much (that is, reflecting accordingly) so that the coating film SF becomes transparent. For example, the pigment may have the property that the absorption rate of visible light is smaller than a predetermined fourth absorption threshold. As an example of a pigment that can absorb the processing light EL, which is such invisible light, while being transparent to visible light, for example, there is a near-infrared absorbing pigment manufactured by Spectrum Informatics Co., Ltd. (as an example, 6-chloro-2-[(E)-2-(3-{(E)-2-[6-chloro-1-ethylbenzo[cd]indol-2(1H)-ylidene]ethylidene}-2-phenyl-1-cyclopenten-1-yl)ethenyl]-1-ethylbenzo[cd]indolium tetrafluoroborate).

[0034] Again referring to FIG. 1, in order to process the coating film SF, the processing system SYSa includes a processing device 1 and a control device 2. Further, the processing device 1 includes a light irradiation device 11, a drive system 12, a housing device 13, a support device 14, a drive system 15, an exhaust device 16, a gas supply device 17, and a position measurement device 18.

[0035] The light irradiation device 11 can irradiate the coating film SF with the processing light EL under the control of the control device 2. In order to irradiate the coating film SF with the processing light EL, as shown in FIG. 3(a), which is a cross-sectional view schematically showing the structure of the light irradiation device 11, the light irradiation device 11 includes a light source system 111 that can emit the processing light EL and an optical system 112 that guides the processing light EL emitted from the light source system 111 to the coating film SF.

[0036] The light source system 111 emits, for example, a plurality of processing lights EL simultaneously. However, the light source system 111 may emit a single processing light EL. At this time, the light irradiation device 11 may also emit a single processing light EL. In order to emit a plurality of processing lights EL, as shown in FIG. 3(b), which is a cross-sectional view schematically showing an example of the structure of the light source system 111, the light source system 111 includes a plurality of light sources 1111. The plurality of light sources 1111 are arranged in a row at equal intervals. Each light source 1111 emits pulsed light as the processing light EL. When the emission time width of the pulsed light (hereinafter referred to as "pulse width") becomes shorter, the processing accuracy (for example, the formation accuracy of the riblet structure described later) improves. Therefore, each light source 1111 may emit pulsed light with a relatively short pulse width as the processing light EL. For example, each light source 1111 may emit pulsed light with a pulse width of 1000 nanoseconds or less as the processing light EL. For example, each light source 1111 may emit pulsed light with a pulse width on the order of picoseconds as the processing light EL, or may emit pulsed light with a pulse width on the order of femtoseconds as the processing light EL. Alternatively, as shown in FIG. 3(c), which is a cross-sectional view schematically showing another example of the structure of the light source system 111, the light source system 111 may include a single light source 1111 and a splitter 1112 that branches the light from the single light source 1111 into a plurality of processing lights EL. The plurality of emission ports from which the plurality of processing lights EL branched by the splitter 1112 are respectively emitted are arranged in a row at equal intervals. As an example of the splitter 1112, at least one of an optical fiber coupler, a waveguide type splitter, a lens array, a diffractive optical element, and a spatial light modulator can be mentioned.

[0037] The optical system 112 includes a focus lens 1121, a galvanometer mirror 1122, and an fθ lens 1123. The plurality of processing lights EL are irradiated onto the coating film SF through the focus lens 1121, the galvanometer mirror 1122, and the fθ lens 1123.

[0038] The focus lens 1121 is composed of one or more lenses, and by adjusting the position of at least a part of these lenses along the optical axis direction, it is an optical element for adjusting the convergence position BF of a plurality of processing light beams EL (in other words, the condensing position, or the irradiation position in the optical axis direction, that is, the focal position of the optical system 112). The galvanometer mirror 1122 deflects a plurality of processing light beams EL so that the plurality of processing light beams EL scan the surface of the coating film SF (that is, a plurality of target irradiation regions EA where the plurality of processing light beams EL are respectively irradiated move on the surface of the coating film SF). That is, the galvanometer mirror 1122 can function as an irradiation position changing device that changes the irradiation positions of the plurality of processing light beams EL on the coating film SF with respect to the light irradiation device 11. Incidentally, the plurality of processing light beams ELk emitted by the optical system 112 may be swept across the surface of the coating film SF by the galvanometer mirror 1122. The galvanometer mirror 112 includes an X-scanning mirror 1122X and a Y-scanning mirror 1122Y. The X-scanning mirror 1122X reflects a plurality of processing light beams EL toward the Y-scanning mirror 1122Y. The X-scanning mirror 1122X can swing or rotate in the θY direction (that is, the rotational direction around the Y-axis). Due to the swing or rotation of the X-scanning mirror 1122X, the plurality of processing light beams EL scan the surface of the coating film SF along the X-axis direction. Due to the swing or rotation of the X-scanning mirror 1122X, the plurality of target irradiation regions EA move on the coating film SF along the X-axis direction. The X-scanning mirror 1122X changes the relative positional relationship along the X-axis direction between the plurality of target irradiation regions EA and the coating film SF. The Y-scanning mirror 1122Y reflects a plurality of processing light beams EL toward the fθ lens 1123. The Y-scanning mirror 1122Y can swing or rotate in the θX direction (that is, the rotational direction around the X-axis). Due to the swing or rotation of the Y-scanning mirror 1122Y, the plurality of processing light beams EL scan the surface of the coating film SF along the Y-axis direction. Due to the swing or rotation of the Y-scanning mirror 1122Y, the plurality of target irradiation regions EA move on the coating film SF along the Y-axis direction. The Y-scanning mirror 1122Y changes the relative positional relationship along the Y-axis direction between the plurality of target irradiation regions EA and the coating film SF. The fθ lens 1123 is an optical element for condensing a plurality of processing light beams EL from the galvanometer mirror 1122 onto the coating film SF.

[0039] The fθ lens 1123 is the terminal optical element among the optical elements included in the optical system 112, which is located on the light-emitting side of the optical system 112 (in other words, closest to the coating film SF or located at the end of the optical paths of the plurality of processing lights EL). However, the optical system 112 may include an optical element (such as a cover lens) provided on the light-emitting side of the fθ lens 1123. The fθ lens 1123 may be configured to be detachable from the optical system 112. As a result, after removing the old fθ lens 1123 from the optical system 112, it becomes possible to attach another fθ lens 1123 to the optical system 112. However, when the optical system 112 includes an optical element (such as a cover lens) provided on the emitting side of the fθ lens 1123, the optical element becomes the terminal optical element, and the optical element may be configured to be detachable from the optical system 112.

[0040] The traveling directions of the plurality of processing lights EL from the optical system 112 are, for example, parallel to each other. As a result, in the first embodiment, the coating film SF is simultaneously irradiated with the plurality of processing lights EL whose traveling directions are parallel to each other. That is, a plurality of target irradiation regions EA are simultaneously set on the coating film SF. Therefore, compared with the case where the coating film SF is irradiated with a single processing light EL, the throughput regarding the processing of the coating film SF is improved. Note that the traveling directions of the plurality of processing lights EL from the optical system 112 may not be parallel to each other.

[0041] Furthermore, the light irradiation device 11 may not include the light source system 111. In this case, the light irradiation device 11 may irradiate the coating film SF with a plurality of processing lights EL emitted from the light source system 111 disposed outside the light irradiation device 11, using the optical system 112. Specifically, for example, as shown in FIG. 4, which is a cross-sectional view schematically showing the structure of the light irradiation device 11 that does not include the light source system 111, a plurality of processing lights EL may enter the light irradiation device 11 from the light source system 111 disposed outside the light irradiation device 11 via a light transmission member 113 such as an optical fiber. The light irradiation device 11 may irradiate the coating film SF with the plurality of processing lights EL that have entered the light irradiation device 11 via the transmission member 113, using the optical system 112. Note that FIG. 4 shows an example in which the optical system 112 is housed in the housing 114, but the optical system 112 may not be housed in the housing 114. That is, the light irradiation device 11 may or may not include the housing 114. Further, even when the light irradiation device 11 includes the light source system 111, the optical system 112 may or may not be housed in the housing 114. The light source system 111 may or may not be housed in the housing 114. Here, as the light transmission member 113, a light pipe, a relay optical system including one or more lenses and mirrors, or the like may be used.

[0042] Referring again to FIG. 1, the drive system 12 moves the light irradiation device 11 relative to the coating film SF (that is, relative to the workpiece S having the coating film SF formed on its surface) under the control of the control device 2. That is, the drive system 12 moves the light irradiation device 11 relative to the coating film SF so as to change the relative positional relationship between the light irradiation device 11 and the coating film SF. When the relative positional relationship between the light irradiation device 11 and the coating film SF is changed, the relative positional relationship between the plurality of target irradiation regions EA irradiated with the plurality of processing lights EL and the coating film SF is also changed. Therefore, it can also be said that the drive system 12 moves the light irradiation device 11 relative to the coating film SF so as to change the relative positional relationship between the plurality of target irradiation regions EA and the coating film SF.

[0043] The drive system 12 may move the light irradiation device 11 along the surface of the coating film SF. In the example shown in FIG. 1, since the surface of the coating film SF is a plane parallel to at least one of the X-axis and the Y-axis, the drive system 12 may move the light irradiation device 11 along at least one of the X-axis and the Y-axis. As a result, the target irradiation area EA moves along at least one of the X-axis and the Y-axis on the coating film SF. That is, the range in which the light irradiation device 11 can irradiate the processing light EL is changed. The drive system 12 may move the light irradiation device 11 along the thickness direction of the coating film SF (that is, the direction intersecting the surface of the coating film SF). In the example shown in FIG. 1, since the thickness direction of the coating film SF is the direction along the Z-axis, the drive system 12 may move the light irradiation device 11 along the Z-axis direction. In addition to at least one of the X-axis, the Y-axis, and the Z-axis, the drive system 12 may move the light irradiation device 11 along at least one of the rotational directions of the θX direction, the θY direction, and the θZ direction.

[0044] The drive system 12 supports the light irradiation device 11 and moves the supported light irradiation device 11. In this case, the drive system 12 may include, for example, a first support member that supports the light irradiation device 11 and a first movement mechanism that moves the first support member.

[0045] In the first embodiment, the drive system 12 includes a first drive system 121 and a second drive system 122. A second drive system 121 is attached to the first drive system 121. The first drive system 121 supports the second drive system 122. The light irradiation device 11 is attached to the second drive system 122 via an attachment member 19. The second drive system 122 supports the light irradiation device 11 via the attachment member 19. Therefore, the second drive system 122 may function substantially as a connection device that connects the first drive system 121 and the light irradiation device 11. Incidentally, the second drive system 122 may support the light irradiation device 11 without passing through the attachment member 19. For example, the second drive system 122 may support the light irradiation device 11 by supporting the housing 114 shown in FIG. 4.

[0046] The first drive system 121 moves the second drive system 122 relative to the coating film SF under the control of the control device 2. That is, the first drive system 121 functions as a moving device that moves the second drive system 122 relative to the coating film SF. Since the light irradiation device 11 is attached to the second drive system 122, it can be said that the first drive system 121 moves the light irradiation device 11 relative to the coating film SF by moving the second drive system 122. That is, the first drive system 121 moves the light irradiation device 11 together with the second drive system 122. The second drive system 122 moves the second drive system 122 relative to the coating film SF under the control of the control device 2. That is, the second drive system 122 functions as a moving device that moves the light irradiation device 11 relative to the coating film SF.

[0047] Incidentally, since the specific structures of the first drive system 121 and the second drive system 122 will be described in detail later (see FIGS. 5 and 6), detailed description here is omitted.

[0048] The housing device 13 includes a ceiling member 131 and a partition member 132. The ceiling member 131 is arranged on the +Z side of the light irradiation device 11. The ceiling member 131 is a plate-shaped member along the XY plane. The ceiling member 131 supports the drive system 12. Specifically, a first drive system 121 is attached to the ceiling member 131. That is, the ceiling member 131 supports the first drive system 121. Also, as described above, since the second drive system 122 is attached to the first drive system 121, the second drive system 122 is attached to the ceiling member 131 via the first drive system 121. That is, the ceiling member 131 supports the second drive system 122 via the first drive system 121. Also, as described above, since the light irradiation device 11 is attached to the second drive system 122, the light irradiation device 11 is attached to the ceiling member 131 via the first drive system 121 and the second drive system 122. The ceiling member 131 supports the light irradiation device 11 via the first drive system 121 and the second drive system 122. The partition member 132 is arranged at the outer edge (or in the vicinity thereof) of the -Z side surface of the ceiling member 131. The partition member 132 is a cylindrical (for example, cylindrical or rectangular cylindrical) member extending from the ceiling member 131 toward the -Z side. The space surrounded by the ceiling member 131 and the partition member 132 becomes a housing space SP for housing the light irradiation device 11 and the drive system 12. Therefore, the drive system 12 described above moves the light irradiation device 11 within the housing space SP. Further, the housing space SP includes the space between the light irradiation device 11 and the coating film SF (particularly, the space including the optical path of the processing light EL). More specifically, the housing space SP includes the space between the end optical element (for example, the fθ lens 1123) provided in the light irradiation device 11 and the coating film SF (particularly, the space including the optical path of the processing light EL).

[0049] Each of the ceiling member 131 and the partition member 132 is a member capable of shielding the processing light EL. That is, each of the ceiling member 131 and the partition member 132 is opaque to the wavelength of the processing light EL. As a result, the processing light EL propagating in the accommodation space SP does not leak to the outside of the accommodation space SP (that is, outside the accommodation device 13). Incidentally, each of the ceiling member 131 and the partition member 132 may be a member capable of reducing the intensity of the processing light EL. That is, each of the ceiling member 131 and the partition member 132 may be translucent to the wavelength of the processing light EL. Further, each of the ceiling member 131 and the partition member 132 is a member that does not transmit (that is, can shield) unnecessary substances generated by the irradiation of the processing light EL. An example of the unnecessary substance is the vapor of the coating film SF. As a result, the unnecessary substances generated in the accommodation space SP do not leak to the outside of the accommodation space SP (that is, outside the accommodation device 13).

[0050] The end portion of the partition member 132 (specifically, the end portion on the coating film SF side, which is the -Z side end portion in the example shown in FIG. 1) 134 can contact the surface of the coating film SF. When the end portion 134 contacts the coating film SF, the accommodation device 13 (that is, the ceiling member 131 and the partition member 132) cooperates with the coating film SF to maintain the airtightness of the accommodation space SP. When the end portion 134 contacts the coating film SF, it can change its shape according to the shape of the surface of the coating film SF (in particular, the shape of the contact surface (the -Z side surface in the example shown in FIG. 1) of the end portion 134 that contacts the coating film SF among the end portion 134, and the same applies hereinafter). For example, when the end portion 134 contacts the coating film SF having a planar surface shape, the shape of the end portion 134 becomes a planar shape similar to that of the coating film SF. For example, when the end portion 134 contacts the coating film SF having a curved surface shape, the shape of the end portion 134 becomes a curved surface shape similar to that of the coating film SF. As a result, the airtightness of the accommodation space SP is improved as compared with the case where the end portion 134 cannot change its shape according to the shape of the surface of the coating film SF. An example of the end portion 134 capable of changing its shape is the end portion 134 formed of a member having elasticity such as rubber (in other words, a flexible member). Incidentally, as the end portion 134 capable of changing its shape, for example, a bellows-shaped end portion having an elastic structure may be used.

[0051] The end portion 134 may be attachable to the coating film SF while being in contact with the coating film SF. For example, the end portion 134 may be provided with an adsorption mechanism capable of adsorbing to the coating film SF. When the end portion 134 adheres to the coating film SF, the sealing property of the accommodation space SP is further improved as compared with the case where the end portion 134 is not adhered to the coating film SF. However, the end portion 134 may not be attachable to the coating film SF. Even in this case, as long as the end portion 134 is in contact with the coating film SF, the sealing property of the accommodation space SP will still be maintained accordingly.

[0052] The partition member 132 is a member that can be expanded and contracted along the Z-axis direction by a drive system (for example, an actuator) (not shown) that operates under the control of the control device 2. For example, the partition member 132 may be a bellows-shaped member (so-called bellows). In this case, the partition member 132 can be expanded and contracted by the expansion and contraction of the bellows portion. Alternatively, for example, the partition member 132 may be provided with a telescopic pipe in which a plurality of hollow cylindrical members having different diameters are combined. In this case, the partition member 132 can be expanded and contracted by the relative movement of the plurality of cylindrical members. The state of the partition member 132 can be set to at least a first extended state in which the length in the Z-axis direction is relatively long as the partition member 132 extends along the Z-axis direction, and a first contracted state in which the length in the Z-axis direction is relatively short as the partition member 132 contracts along the Z-axis direction.

[0053] When the partition member 132 is in the first extended state, the end portion 134 is in a first contact state in which it can contact the coating film SF. On the other hand, when the partition member 132 is in the first contracted state, the end portion 134 is in a first non-contact state in which it does not contact the coating film SF. That is, when the partition member 132 is in the first contracted state, the end portion 134 is in a first non-contact state in which it is separated from the coating film SF on the +Z side. Note that the configuration for switching the state of the end portion 134 between the first contact state and the first non-contact state is not limited to the configuration of expanding and contracting the partition member 132. For example, by configuring the housing device 13 itself to be movable along the ±Z direction, the state of the end portion 134 may be switched between the first contact state and the first non-contact state.

[0054] The housing device 13 further includes a detection device 135. The detection device 135 detects unnecessary substances (i.e., substances generated by the irradiation of the processing light EL) in the accommodation space SP. The detection result of the detection device 135 is referred to by the control device 2 when changing the state of the partition member 132 from the first extended state to the first contracted state, as will be described in detail later.

[0055] The support device 14 supports the housing device 13. Since the housing device 13 supports the drive system 12 and the light irradiation device 11, the support device 14 substantially supports the drive system 12 and the light irradiation device 11 via the housing device 13. To support the housing device 13, the support device 14 includes a beam member 141 and a plurality of leg members 142. The beam member 141 is disposed on the +Z side of the housing device 13. The beam member 141 is a beam-shaped member extending along the XY plane. The beam member 141 supports the housing device 13 via a support member 143. A plurality of leg members 142 are disposed on the beam member 141. The leg member 142 is a rod-shaped member extending from the beam member 141 toward the -Z side.

[0056] The end portion of the leg member 142 (specifically, the end portion on the coating film SF side, which is the -Z side end portion in the example shown in FIG. 1) 144 can contact the surface of the coating film SF. As a result, the support device 14 is supported by the coating film SF (that is, by the object to be processed S). That is, the support device 14 supports the housing device 13 in a state where the end portion 144 is in contact with the coating film SF (in other words, in a state where the support device 14 is supported by the coating film S). The end portion 144, similar to the end portion 134 of the housing device 13, may be able to change its shape (particularly, the shape of the contact surface (the -Z side surface in the example shown in FIG. 1) of the end portion 144 that contacts the coating film SF, the same hereinafter) according to the shape of the surface of the coating film SF when contacting the coating film SF. The end portion 144 may be attachable to the coating film SF in a state of contacting the coating film SF. For example, the end portion 144 may be provided with an adsorption mechanism capable of adsorbing to the coating film SF. When the end portion 144 adheres to the coating film SF, the stability of the support device 14 is improved compared to the case where the end portion 144 is not adhered to the coating film SF. However, the end portion 144 may not be attachable to the coating film SF.

[0057] The beam member 141 is a member that can be expanded and contracted along at least one of the X-axis and the Y-axis (or along an arbitrary direction along the XY plane) by a drive system 15 that operates under the control of the control device 2. For example, the beam member 141 may include a telescopic pipe in which a plurality of cylindrical members having different diameters are combined. In this case, the beam member 141 can be expanded and contracted by the relative movement of the plurality of cylindrical members.

[0058] The leg member 142 is a member that can be extended and contracted along the Z-axis direction by a drive system 15 that operates under the control of the control device 2. For example, the leg member 142 may include a telescopic pipe in which a plurality of cylindrical members having different diameters are combined. In this case, the leg member 142 can be extended and contracted by the relative movement of the plurality of cylindrical members. The state of the leg member 142 can be set to at least a second extended state in which the length in the Z-axis direction is relatively long as the leg member 142 extends along the Z-axis direction, and a second contracted state in which the length in the Z-axis direction is relatively short as the leg member 142 contracts along the Z-axis direction. When the leg member 142 is in the second extended state, the end portion 144 is in a second contact state where it can contact the coating film SF. On the other hand, when the leg member 142 is in the second contracted state, the end portion 144 is in a second non-contact state where it does not contact the coating film SF. That is, when the leg member 142 is in the second contracted state, the end portion 144 is in a second non-contact state where it is separated from the coating film SF on the +Z side.

[0059] The drive system 15 moves the support device 14 relative to the coating film SF (that is, relative to the workpiece S on which the coating film SF is formed on the surface) under the control of the control device 2. That is, the drive system 15 moves the support device 14 relative to the coating film SF so as to change the relative positional relationship between the support device 14 and the coating film SF. Since the support device 14 supports the housing device 13, the drive system 15 substantially moves the support device 14 to move the housing device 13 relative to the coating film SF. That is, the drive system 15 substantially moves the support device 14 relative to the coating film SF so as to change the relative positional relationship between the housing device 13 and the coating film SF. Further, the housing device 13 supports the light irradiation device 11 via the drive system 12. Therefore, the drive system 15 can substantially move the support device 14 to move the light irradiation device 11 relative to the coating film SF. That is, the drive system 15 can substantially move the support device 14 relative to the coating film SF so as to change the relative positional relationship between the light irradiation device 11 and the coating film SF. In other words, the drive system 15 can substantially move the support device 14 relative to the coating film SF so as to change the relative positional relationship between the plurality of target irradiation regions EA and the coating film SF.

[0060] For moving the support device 14, the drive system 15 expands and contracts the beam member 141 under the control of the control device 2. Further, for moving the support device 14, the drive system 15 expands and contracts a plurality of leg members 142 under the control of the control device 2. Note that the movement mode of the support device 14 by the drive system 15 will be described in detail later with reference to FIGS. 9 to 20.

[0061] The exhaust device 16 is connected to the accommodation space SP via an exhaust pipe 161. The exhaust device 16 can exhaust the gas in the accommodation space SP. In particular, the exhaust device 16 can suck unnecessary substances generated by the irradiation of the processing light EL from the accommodation space SP to the outside of the accommodation space SP by exhausting the gas in the accommodation space SP. In particular, when this unnecessary substance exists on the optical path of the processing light EL, it may affect the irradiation of the processing light EL on the coating film SF. For this reason, the exhaust device 16 particularly sucks unnecessary substances together with the gas in the space including the optical path of the processing light EL between the terminal optical element of the optical system 112 and the coating film SF. The unnecessary substances sucked by the exhaust device 16 from the accommodation space SP are discharged to the outside of the processing device 1 via a filter 162. The filter 162 adsorbs unnecessary substances. Note that the filter 162 may be detachable or replaceable.

[0062] The gas supply device 17 is connected to the accommodation space SP via an intake pipe 171. The gas supply device 17 can supply gas to the accommodation space SP. Examples of the gas supplied to the accommodation space SP include at least one of air, CDA (Clean Dry Air), and an inert gas. As an example of the inert gas, nitrogen gas can be given. In the first embodiment, it is assumed that the gas supply device 17 supplies CDA. For this reason, the accommodation space SP becomes a space purged with CDA. At least a part of the CDA supplied to the accommodation space SP is sucked by the exhaust device 16. The CDA sucked by the exhaust device 16 from the accommodation space SP passes through the filter 162 and is discharged to the outside of the processing system SYSa.

[0063] The gas supply device 17 supplies a gas such as CDA to the optical surface 1124 on the accommodation space SP side of the fθ lens 1123 shown in FIG. 3 (that is, the optical surface on the accommodation space SP side of the final optical element of the optical system 112). Since the optical surface 1124 faces the accommodation space SP, it may be exposed to unnecessary substances generated by the irradiation of the processing light EL. As a result, unnecessary substances may adhere to the optical surface 1124. Further, since the processing light EL passes through the optical surface 1124, the unnecessary substances adhering to the optical surface 1124 may be baked (that is, fixed) by the processing light EL passing through the optical surface 1124. The unnecessary substances adhering to (and further fixed to) the optical surface 1124 may become dirt on the optical surface 1124 and affect the characteristics of the processing light EL. However, when a gas such as CDA is supplied to the optical surface 1124, the contact between the optical surface 1124 and the unnecessary substances is prevented. Therefore, the adhesion of dirt to the optical surface 1124 is prevented. Accordingly, the gas supply device 17 also functions as an adhesion prevention device for preventing the adhesion of dirt to the optical surface 1124. Further, even when dirt adheres (and further fixes) to the optical surface 1124, the dirt may be removed (for example, blown off) by the CDA supplied to the optical surface 1124. Accordingly, the gas supply device 17 can also function as an adhesion prevention device for removing the dirt adhering to the optical surface 1124.

[0064] The position measuring device 18 measures the relative positional relationship between the coating film SF and the light irradiation device 11. That is, the position measuring device 18 measures the relative positional relationship between the object to be processed S and the light irradiation device 11. In the first embodiment, the position measuring device 18 measures the position of the coating film SF with respect to the light irradiation device 11. That is, the position measuring device 18 measures the position of the object to be processed S with respect to the light irradiation device 11.

[0065] In order to measure the position of the coating film SF with respect to the light irradiation device 11 (that is, the position of the object S to be processed, the same applies hereinafter), the position measurement device 18 may measure the coating film SF. That is, the position measurement device 18 may measure the object SF to be processed. In this case, since the position measurement device 18 measures an object including at least one of the coating film SF and the object S to be processed, it may be referred to as an object measurement device.

[0066] The position measurement device 18 may be arranged at a position fixed with respect to the light irradiation device 11 (particularly, the optical system 112). The position measurement device 18 may be arranged at a position where the relative position with respect to the light irradiation device 11 is fixed. The position measurement device 18 may be arranged at a position where the relative position between the light irradiation device 11 and the position measurement device 18 does not change even if the drive system 12 moves the light irradiation device 11. For example, FIG. 1 shows an example in which the position measurement device 18 is attached to an attachment member 19 to which the light irradiation device 11 is attached. However, the position measurement device 18 may be attached to a member different from the attachment member 19. For example, the position measurement device 18 may be attached to the light irradiation device 11. For example, the position measurement device 18 may be attached to the above-described housing 114 (see FIG. 4).

[0067] When the position measurement device 18 is arranged at a position fixed with respect to the light irradiation device 11, the output from the position measurement device 18 (that is, the measurement result of the position measurement device 18) will include information regarding the position of the coating film SF with respect to the light irradiation device 11. Specifically, the measurement result of the position measurement device 18 includes information regarding the position of the coating film SF with respect to the position measurement device 18. That is, the measurement result of the position measurement device 18 includes information regarding the position of the coating film SF in the measurement coordinate system of the position measurement device 18. Here, when the position measurement device 18 is arranged at a position fixed with respect to the light irradiation device 11, the information regarding the position of the coating film SF with respect to the position measurement device 18 substantially includes information regarding the position of the coating film SF with respect to the light irradiation device 11 arranged at a position fixed with respect to the position measurement device 18. Therefore, the control device 2 can appropriately specify the position of the coating film SF with respect to the light irradiation device 11.

[0068] The position measuring device 18 may be any type of measuring device as long as it can measure the coating film SF. For example, the position measuring device 18 may include an imaging device (i.e., a camera) capable of imaging an object such as the coating film SF. The position measuring device 18 may include an irradiating device that irradiates the coating film SF with measuring light that draws a predetermined pattern on the coating film SF, and an imaging device that images the pattern drawn on the coating film SF by the measuring light. Thus, the position measuring device 18 may be a measuring device that measures the coating film SF in a non-contact manner (for example, at least one of a light detection method, a sound wave detection method, and a radio wave detection method, etc.). Note that a plurality of position measuring devices 18 may be provided. In this case, the measurement axes (typically, the optical axes in the case of an optical measurement method such as an imaging method) of the respective position measuring devices 18 may be in an intersecting (or twisted) relationship with each other, or may be parallel (or coaxial) with each other.

[0069] The control device 2 controls the overall operation of the processing system SYSa. In particular, as will be described in detail later, the control device 2 controls the light irradiation device 11, the drive system 12, the housing device 13, and the drive system 15 so that the recess C having a desired shape is formed at a desired position.

[0070] The control device 2 may include, for example, a CPU (Central Processing Unit) (or, in addition to or instead of the CPU, a GPU (Graphics Processing Unit)) and a memory. The control device 2 functions as a device that controls the operation of the processing system SYSa by the CPU executing a computer program. This computer program is a computer program for causing the control device 2 (for example, the CPU) to perform the operations described later that the control device 2 should perform (that is, to execute). That is, this computer program is a computer program for causing the control device 2 to function so as to cause the processing system SYSa to perform the operations described later. The computer program executed by the CPU may be recorded in the memory (that is, the recording medium) provided in the control device 2, or may be recorded in any storage medium (for example, a hard disk or a semiconductor memory) built in the control device 2 or externally attachable to the control device 2. Alternatively, the CPU may download the computer program to be executed from a device external to the control device 2 via a network interface.

[0071] The control device 2 does not necessarily have to be provided inside the processing system SYSa. For example, it may be provided outside the processing system SYSa as a server or the like. In this case, the control device 2 and the processing system SYSa may be connected by a wired and / or wireless network (or a data bus and / or communication line). As the wired network, for example, a network using an interface of a serial bus system represented by at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485, and USB may be used. As the wired network, a network using an interface of a parallel bus system may be used. As the wired network, a network using an interface compliant with Ethernet (registered trademark) represented by at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T may be used. As the wireless network, a network using radio waves may be used. As an example of a network using radio waves, a network compliant with IEEE802.1x (for example, at least one of wireless LAN and Bluetooth (registered trademark)) can be cited. As the wireless network, a network using infrared rays may be used. As the wireless network, a network using optical communication may be used. In this case, the control device 2 and the processing system SYSa may be configured to be able to transmit and receive various kinds of information via the network. Further, the control device 2 may be able to transmit information such as commands and control parameters to the processing system SYSa via the network. The processing system SYSa may include a receiving device that receives information such as commands and control parameters from the control device 2 via the above network. Alternatively, a first control device that performs a part of the processing performed by the control device 2 may be provided inside the processing system SYSa, while a second control device that performs another part of the processing performed by the control device 2 may be provided outside the processing system SYSa.

[0072] As a recording medium for recording a computer program executed by a CPU, at least one of an optical disk such as a CD-ROM, CD-R, CD-RW, flexible disk, MO, DVD-ROM, DVD-RAM, DVD-R, DVD+R, DVD-RW, DVD+RW, and Blu-ray (registered trademark), a magnetic medium such as a magnetic tape, a magneto-optical disk, a semiconductor memory such as a USB memory, and any other medium capable of storing a program may be used. The recording medium may include a device capable of recording a computer program (for example, a general-purpose device or a dedicated device in which a computer program is implemented in a state executable in at least one of the forms of software and firmware). Further, each process and function included in the computer program may be realized by a logical processing block realized in the control device 2 (that is, a computer) by executing the computer program, or may be realized by hardware such as a predetermined gate array (FPGA, ASIC) provided in the control device 2, or may be realized in a form in which a logical processing block and a partial hardware module realizing some elements of the hardware are mixed.

[0073] (1-2) Structure of Drive System 12 Next, the structure of the drive system 12 will be described. As described above, since the drive system 12 includes the first drive system 121 and the second drive system 122, the structure of the first drive system 121 and the structure of the second drive system 122 will be described in order below.

[0074] (1-2-1) Structure of Drive System 121 First, with reference to FIG. 5, the structure of the first drive system 121 will be described. FIG. 5 is a cross-sectional view showing the structure of the first drive system 121.

[0075] As shown in FIG. 5, the first drive system 121 includes a base 1211 and an arm drive system 1212.

[0076] The base 1211 is attached to the ceiling member 131 of the housing device 13. An arm drive system 1212 is attached to the base 1211. The base 1211 supports the arm drive system 1211. The base 1211 is used as a base member for supporting the arm drive system 1211.

[0077] The arm drive system 1212 includes a plurality of arm members 12121. The plurality of arm members 12121 are swingably connected via at least one joint member 12122. Therefore, the arm drive system 1212 is a robot having a so-called vertical articulated structure. The arm drive system 1212 may include a single joint (that is, a drive shaft defined by the joint member 12122). Alternatively, the arm drive system 1212 may include a plurality of joints. FIG. 5 shows an example in which the arm drive system 1212 includes three joints. Two arm members 12121 connected via each joint swing by an actuator 12123 corresponding to each joint. FIG. 5 shows an example in which the arm drive system 1212 includes three actuators 12123 corresponding to the three joints. As a result, at least one arm member 12121 moves. For this reason, at least one arm member 12121 is movable with respect to the coating film SF. That is, at least one arm member 12121 is movable so that the relative positional relationship between at least one arm member 12121 and the coating film SF is changed.

[0078] A second drive system 122 is attached to the arm drive system 1212. Specifically, the second drive system 122 is attached to one arm member 12121 located at the position farthest from the base 1211 among the plurality of arm members 12121. Hereinafter, for convenience of explanation, the one arm member 12121 to which the second drive system 122 is attached is referred to as a tip arm member 12124. The second drive system 122 may be directly attached to the tip arm member 12124, or may be indirectly attached to the tip arm member 12124 via another member (for example, a mounting member 1213 described with reference to FIG. 30 in the sixth embodiment described later).

[0079] When the tip arm member 12124 moves by the actuator 12123 described above, the second drive system 122 attached to the tip arm member 12124 also moves. Therefore, the arm drive system 1212 (that is, the first drive system 121) can move the second drive system 122. Specifically, the arm drive system 1212 can move the second drive system 122 with respect to the coating film SF. The arm drive system 1212 can move the second drive system 122 so that the relative positional relationship between the second drive system 122 and the coating film SF is changed. Further, when the second drive system 122 moves, the light irradiation device 11 attached to the second drive system 122 also moves. Therefore, the arm drive system 1212 (that is, the first drive system 121) can move the light irradiation device 11.

[0080] The control device 2 may control the arm drive system 1212 based on the measurement result of the position measurement device 18. Specifically, the control device 2 may acquire information regarding the relative positional relationship between the coating film SF and the light irradiation device 11 based on the measurement result of the position measurement device 18, and control the arm drive system 1212 based on the information regarding the relative positional relationship between the coating film SF and the light irradiation device 11. When the position measurement device 18 includes an imaging device, the control device 2 may control the arm drive system 1212 by using visual servo (visual servo) based on the measurement result of the position measurement device 18 (that is, the image captured by the imaging device). Note that the visual servo may be referred to as a vision servo. Further, the light irradiation device 11 may include an acceleration sensor as a motion measurement sensor for measuring its vibration. In this case, the control device 2 may control the arm drive system 1212 based on the measurement result of the acceleration sensor.

[0081] As an example, for instance, the control device 2 may control the arm drive system 1212 so that the light irradiation device 11 moves relative to the coating film SF. That is, the control device 2 may control the arm drive system 1212 so as to change the relative position between the light irradiation device 11 and the coating film SF. At this time, the control device 2 may control the arm drive system 1212 so as to align the coating film SF and the light irradiation device 11. The control device 2 may control the arm drive system 1212 so as to align the coating film SF and the target irradiation region EA where the processing light EL is irradiated from the light irradiation device 11. As an example, the control device 2 may control the arm drive system 1212 so that the target irradiation region EA is set at a desired position on the coating film SF (that is, the processing light EL is irradiated). The control device 2 may control the arm drive system 1212 so that the target irradiation region EA moves along a desired path on the coating film SF. Incidentally, the control device 2 may control the arm drive system 1212 using the output from an encoder provided at the joint portion of the arm drive system 1212 for detecting the angle between a plurality of arm members 12121.

[0082] Incidentally, the "relative position between the light irradiation device 11 and the coating film SF" in the first embodiment means the relative position between the light irradiation device 11 and the coating film SF in at least one of the X-axis direction, Y-axis direction, Z-axis direction, the rotation around the X-axis (that is, the rotation direction corresponding to the θX direction), the rotation around the Y-axis (that is, the rotation direction corresponding to the θY direction), and the rotation around the Z-axis (that is, the rotation direction corresponding to the θZ direction). That is, the "relative position between the light irradiation device 11 and the coating film SF" in the first embodiment may also include the relative posture between the light irradiation device 11 and the coating film SF.

[0083] When the relative position between the light irradiation device 11 and the coating film SF is changed, the relative position between the target irradiation region EA and the coating film SF is changed. Therefore, in addition to or instead of measuring the relative positional relationship between the light irradiation device 11 and the coating film SF, the position measuring device 18 may measure the relative positional relationship between the coating film SF and the irradiation position of the processing light EL (for example, the irradiation position of the processing light EL on the coating film SF). For example, the position measuring device 18 may measure the irradiation position of the processing light EL with respect to the coating film SF at least in part during the period when the light irradiation device 11 irradiates the coating film SF with the processing light EL. For example, after the light irradiation device 11 finishes irradiating the coating film SF with the processing light EL, the position measuring device 18 may measure the irradiation position of the processing light EL on the coating film SF (that is, the position where the processing light EL was actually irradiated, for example, the position of the portion processed by the processing light EL). For example, after the light irradiation device 11 finishes irradiating the processing light EL to the sensitive member (specifically, a member whose characteristics change by the irradiation of the processing light EL, for example, the sensitive member PE described in the third embodiment below) formed on the coating film SF, the position measuring device 18 may measure the irradiation position of the processing light EL in the sensitive member (that is, the position of the portion of the sensitive member whose characteristics have changed by the irradiation of the processing light EL). Even in this case, the control device 2 may control the arm drive system 1212 so as to align the coating film SF with the light irradiation device 11 (that is, align the coating film SF with the target irradiation region EA) based on the measurement result of the position measuring device 18. Note that the position measuring device 18 may measure the irradiation position of the processing light EL itself. In this case, the position measuring device 18 may measure the light having the wavelength of the processing light EL.

[0084] Furthermore, the first drive system 121 is not limited to a multi-joint robot and may have any structure as long as it can move the second drive system 122 relative to the coating film SF. For example, the first drive system 121 may be an orthogonal multi-axis moving body combining a plurality of linear guides. For example, a first linear guide may be provided along a first direction in a predetermined plane, and a second linear guide may be provided along a second direction (typically orthogonal) intersecting the first direction on a moving body (first moving block) of the first linear guide. In this case, the second drive system may be attached to the moving body (second moving block) of the second linear guide. Also, a third linear guide may be provided along a third direction intersecting the predetermined plane on the moving body (second moving block) of the second linear guide in the above-described orthogonal two-axis moving body. In such an orthogonal three-axis moving body, the second drive system 122 may be attached to the moving body (third moving block) of the third linear guide.

[0085] (1-2-2) Structure of Second Drive System 122 Subsequently, with reference to FIG. 6, the structure of the second drive system 122 will be described. FIG. 6 is a cross-sectional view showing the structure of the second drive system 122.

[0086] As shown in FIG. 6, the second drive system 122 includes a support member 1221, a support member 1222, an air spring 1223, a damper member 1224, and a drive member 1225.

[0087] The support member 1221 is attached to the first drive system 121. Specifically, the support member 1221 is attached to the tip arm member 12124 of the first drive system 121. The support member 1221 is fixed to the tip arm member 12124 such that the attached surface 1221a of the support member 1221 and the attachment surface 12124a formed at the foremost end of the tip arm member 12124 are in contact with each other. Here, the attachment surface 12124a can be regarded as a part that moves with respect to the coating film SF as an object. The support member 1222 is attached to the light irradiation device 11 via the attachment member 19. The support member 1222 is fixed to the attachment member 19 such that the attached surface 1222a of the support member 1222 and the first attachment surface 19a of the attachment member 19 are in contact with each other. Then, the light irradiation device 11 is fixed to the attachment member 19 such that the second attachment surface 19b of the attachment member 19 and the attached surface 11a formed on a part of the outer surface of the light irradiation device 11 are in contact with each other.

[0088] The support member 1221 and the support member 1222 are coupled (in other words, connected or joined) via an air spring 1223, a damper member 1224, and a drive member 1225. Specifically, the air spring 1223, the damper member 1224, and the drive member 1225 are arranged between the second surface (in the example shown in FIG. 6, the -Z side surface) on the side opposite to the first surface (in the example shown in FIG. 6, the +Z side surface) to which the first drive system 121 of the support member 1221 is attached, and the fourth surface (in the example shown in FIG. 6, the +Z side surface) on the side opposite to the third surface (in the example shown in FIG. 6, the -Z side surface) to which the attachment member 19 of the support member 1222 is attached, so as to couple the support member 1221 and the support member 1222. That is, each of the air spring 1223, the damper member 1224, and the drive member 1225 is attached to the support members 1221 and 1222 so as to couple the support member 1221 and the support member 1222. Since the first drive system 121 is attached to the support member 1221 and the light irradiation device 11 is attached to the support member 1222, it can also be said that each of the air spring 1223, the damper member 1224, and the drive member 1225 is attached to the support members 1221 and 1222 so as to couple the first drive system 121 and the light irradiation device 11 substantially.

[0089] The air spring 1223 applies, under the control of the control device 2, an elastic force caused by the pressure of a gas (for example, air) to at least one of the support members 1221 and 1222. The air spring 1223 applies, under the control of the control device 2, an elastic force caused by the pressure of a gas to at least one of the first drive system 121 and the light irradiation device 11 via at least one of the support members 1221 and 1222. In particular, the air spring 1223 may apply an elastic force caused by the pressure of a gas to at least one of the support members 1221 and 1222 along the direction in which the support member 1221 and the support member 1222 are arranged (in the example shown in FIG. 6, it is the Z-axis direction, which is the direction of gravity). That is, the air spring 1223 may apply an elastic force caused by the pressure of a gas to at least one of the first drive system 121 (in particular, the tip arm member 12124) and the light irradiation device 11 via at least one of the support members 1221 and 1222 along the direction in which the first drive system 121 (in particular, the tip arm member 12124) and the light irradiation device 11 are arranged (in the example shown in FIG. 6, it is the Z-axis direction, which is the direction of gravity). Incidentally, the air spring 1223 may be referred to as an elastic member.

[0090] In order to apply an elastic force caused by the pressure of a gas, the air spring 1223 is supplied with gas from the gas supply device 12261 via the pipe 12262 and the valve 12263. The control device 2 controls at least one of the gas supply device 12261 and the valve 12263 based on the measurement result of the pressure gauge 1226 that measures the pressure of the aircraft in the air spring 1223. Incidentally, the gas supply device 12261, the pipe 12262, and the valve 12263 may be omitted. In this case, the air spring 1223 may apply an elastic force caused by the pressure of the internal gas to at least one of the support members 1221 and 1222 regardless of the control of the control device 2.

[0091] The air spring 1223 may support the weight of the support member 1222 under the control of the control device 2 by utilizing the elastic force. Specifically, the air spring 1223 may support the weight of the support member 1222 along the direction in which the support member 1221 and the support member 1222 are arranged by utilizing the elastic force. Since the light irradiation device 11 is attached to the support member 1222, the air spring 1223 may support the weight of the light irradiation device 11 attached to the support member 1222 by utilizing the elastic force. Specifically, the air spring 1223 may support the weight of the light irradiation device 11 along the direction in which the first drive system 121 (particularly, the tip arm member 12124) and the light irradiation device 11 are arranged by utilizing the elastic force. In this case, the air spring 1223 may function as a self-weight canceller that cancels the self-weight of the light irradiation device 11. Note that the air spring 1223 may support the weight of the support member 1222 by utilizing the elastic force regardless of the control of the control device 2.

[0092] The air spring 1223 may reduce the vibration transmitted between the first drive system 121 and the light irradiation device 11 via the second drive system 122 under the control of the control device 2 by using the elastic force. That is, the air spring 1223 may attenuate the vibration transmitted between the first drive system 121 and the light irradiation device 11 via the second drive system 122 by using the elastic force. Specifically, the air spring 1223 may reduce (attenuate) the vibration traveling (i.e., being transmitted) from the first drive system 121 to the light irradiation device 11 via the second drive system 122 by using the elastic force. That is, the air spring 1223 may reduce (attenuate) the vibration traveling from the portion of the first drive system 121 where the second drive system 122 is attached (i.e., the tip arm portion 12124) to the portion of the light irradiation device 11 where the second drive system 122 is attached by using the elastic force. In this case, the control device 2 may control at least one of the gas supply device 12261 and the valve 12263 based on the measurement result of the pressure gauge 1226 so that the vibration transmitted between the first drive system 121 and the light irradiation device 11 via the second drive system 122 is reduced (i.e., attenuated). Incidentally, the air spring 1223 (or the second drive system 122 including the air spring 1223) may be referred to as a vibration reduction device or a vibration attenuation device. Incidentally, the air spring 1223 may reduce the vibration transmitted between the first drive system 121 and the light irradiation device 11 via the second drive system 122 by using the elastic force regardless of the control of the control device 2.

[0093] Reducing the vibration traveling from the first drive system 121 to the light irradiation device 11 may include reducing (i.e., making smaller) the vibration amount of the light irradiation device 11 than the vibration amount (i.e., the amplitude of the vibration) of the first drive system 121. Reducing the vibration traveling from the first drive system 121 to the light irradiation device 11 may include reducing the vibration amount of the portion of the light irradiation device 11 where the second drive system 122 is attached than the vibration amount of the portion of the first drive system 121 where the second drive system 122 is attached (i.e., the tip arm portion 12124). Reducing the vibration traveling from the first drive system 121 to the light irradiation device 11 may include reducing the vibration amount of the support member 1222 to which the light irradiation device 11 is attached than the vibration amount of the support member 1221 to which the first drive system 121 is attached. Incidentally, when the air spring 1223 does not reduce the vibration traveling from the first drive system 121 to the light irradiation device 11, the vibration amount of the first drive system 121 and the vibration amount of the light irradiation device 11 become substantially the same. That is, the vibration amount of the support member 1121 and the vibration amount of the support member 1122 become substantially the same. For this reason, reducing the vibration traveling from the first drive system 121 to the light irradiation device 11 may include reducing the vibration amount of the light irradiation device 11 as compared with the case where the vibration traveling from the first drive system 121 to the light irradiation device 11 is not reduced. Reducing the vibration traveling from the first drive system 121 to the light irradiation device 11 may include reducing the vibration amount of the support member 1122 as compared with the case where the vibration traveling from the first drive system 121 to the light irradiation device 11 is not reduced. Further, the vibration amount referred to here may mean the vibration amount with respect to some object. For example, the vibration amount of the first drive system 121, the vibration amount of the light irradiation device 11, the vibration amount of the support member 1221, and the vibration amount of the support member 1222 may respectively mean the vibration amount of the first drive system 121 with respect to the coating film SF (or the object to be processed SF, the same applies hereinafter), the vibration amount of the light irradiation device 11 with respect to the coating film SF, the vibration amount of the support member 1221 with respect to the coating film SF, and the vibration amount of the support member 1222 with respect to the coating film SF.

[0094] The damper member 1224 applies an elastic force caused by a factor different from the air pressure to at least one of the support members 1221 and 1222. The damper member 1224 applies an elastic force caused by a factor different from the air pressure to at least one of the first drive system 121 and the light irradiation device 11 via at least one of the support members 1221 and 1222. In particular, the damper member 1224 may apply an elastic force to at least one of the support members 1221 and 1222 along the direction in which the support members 1221 and 1222 are arranged (in the example shown in FIG. 6, it is the Z-axis direction, which is the direction of gravity). That is, the damper member 1224 may apply an elastic force to at least one of the first drive system 121 and the light irradiation device 11 via at least one of the support members 1221 and 1222 along the direction in which the first drive system 121 (particularly, the tip arm member 12124) and the light irradiation device 11 are arranged (in the example shown in FIG. 6, it is the Z-axis direction, which is the direction of gravity). Incidentally, the damper member 1224 may be referred to as an elastic member.

[0095] The damper member 1224 may be any member as long as it can apply an elastic force. For example, the damper member 1224 may include a compression coil spring. For example, the damper member 1224 may include a leaf spring.

[0096] The damper member 1224 may support the weight of the support member 1222 by using the elastic force. Specifically, the damper member 1224 may support the weight of the support member 1222 along the direction in which the support members 1221 and 1222 are arranged by using the elastic force. Since the light irradiation device 11 is attached to the support member 1222, the damper member 1224 may support the weight of the light irradiation device 11 attached to the support member 1222 by using the elastic force. Specifically, the damper member 1224 may support the weight of the light irradiation device 11 along the direction in which the first drive system 121 (particularly, the tip arm member 12124) and the light irradiation device 11 are arranged by using the elastic force. In this case, the damper member 1224 may function as a self-weight canceller that cancels the self-weight of the light irradiation device 11.

[0097] The damper member 1224 may reduce the vibration transmitted between the first drive system 121 and the light irradiation device 11 via the second drive system 122 by utilizing the elastic force. That is, the damper member 1224 may attenuate the vibration transmitted between the first drive system 121 and the light irradiation device 11 via the second drive system 122 by utilizing the elastic force. Specifically, the damper member 1224 may reduce (attenuate) the vibration traveling (i.e., being transmitted) from the first drive system 121 to the light irradiation device 11 via the second drive system 122 by utilizing the elastic force. For this reason, the damper member 1224 (or the second drive system 122 including the damper member 1224) may be referred to as a vibration reduction device or a vibration attenuation device.

[0098] The damper member 1224 may convert the vibration of the air spring 1223 into damped vibration by utilizing the elastic force. That is, the damper member 1224 may convert the vibration transmitted between the first drive system 121 and the light irradiation device 11 via the second drive system 122 into damped vibration by utilizing the elastic force.

[0099] The drive member 1225 can generate a driving force under the control of the control device 2. The drive member 1225 can apply the generated driving force to at least one of the support members 1221 and 1222. The drive member 1225 can apply the generated driving force to at least one of the first drive system 121 and the light irradiation device 11 via at least one of the support members 1221 and 1222. As long as the drive member 1225 can generate a driving force, it may have any structure. For example, the drive member 1225 may have a structure capable of generating a driving force electrically. For example, the drive member 1225 may have a structure capable of generating a driving force magnetically. As an example, FIG. 6 shows an example in which the drive member 1225 is a voice coil motor (VCM) capable of generating a driving force electrically. Note that since the voice coil motor is a type of linear motor, the drive member 1225 may be a linear motor different from the voice coil motor. The drive member 1225 may generate a driving force along a linear axis.

[0100] Further, the drive member 1225 may have a structure in which a member attached to the support member 1221 of the drive member 1225 and a member attached to the support member 1222 of the drive member 1225 do not physically contact each other. For example, when the drive member 1225 is a voice coil motor, a member attached to the support member 1221 of the drive member 1225 (for example, a member including either the coil or the magnetic pole) and a member attached to the support member 1222 of the drive member 1225 (for example, a member including the other of the coil and the magnetic pole) do not physically contact each other.

[0101] The drive member 1225 may move at least one of the support members 1221 and 1222 by using a driving force under the control of the control device 2. The drive member 1225 may move at least one of the support members 1221 and 1222 by using a driving force under the control of the control device 2, thereby moving at least one of the first drive system 121 and the light irradiation device 11. In this case, the drive member 1225 may change the relative position between the first drive system 121 and the light irradiation device 11 by moving at least one of the first drive system 121 and the light irradiation device 11 by using a driving force. Note that the "relative position between the first drive system 121 and the light irradiation device 11" in the first embodiment means the relative position between the first drive system 121 and the light irradiation device 11 in at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the rotation around the X-axis, the rotation around the Y-axis, and the rotation around the Z-axis. That is, the "relative position between the first drive system 121 and the light irradiation device 11" in the first embodiment may also include the relative attitude between the first drive system 121 and the light irradiation device 11. In this case, it can be said that the second drive system 122 including the drive member 1225 couples the first drive system 121 and the light irradiation device 11 so that the relative position between the first drive system 121 and the light irradiation device 11 can be changed. That is, it can be said that the above-described air spring 1223 and damper member 1224 (further, the drive member 1225) couple the first drive system 121 and the light irradiation device 11 so that the relative position between the first drive system 121 and the light irradiation device 11 can be changed by the drive member 1225. Note that the drive member 1225 may be referred to as a position changing device.

[0102] The drive member 1225 may change the relative position between the first drive system 121 and the light irradiation device 11 under the control of the control device 2 based on the measurement result of the position measurement device 1227 included in the second drive system 122. The position measurement device 1226 measures the relative position between the first drive system 121 and the light irradiation device 11. For example, the position measurement device 1226 may be an encoder including a detection unit 12261 attached to the support member 1221 and a scale unit 12262 attached to the support member 1222. The measurement result of the position measurement device 1226 includes information regarding the relative position between the support member 1221 and the support member 1222. Since the first drive system 121 is attached to the support member 1221 and the light irradiation device 11 is attached to the support member 1222, the information regarding the relative position between the support member 1221 and the support member 1222 includes the information regarding the relative position between the first drive system 121 and the light irradiation device 11. Therefore, the control device 2 can appropriately specify the relative position between the first drive system 121 and the light irradiation device 11. As a result, the control device 2 can appropriately change the relative position between the first drive system 121 and the light irradiation device 11 based on the measurement result of the position measurement device 1227.

[0103] The drive member 1225 may move the light irradiation device 11 relative to the coating film SF by changing the relative position between the first drive system 121 and the light irradiation device 11 (typically, moving the light irradiation device 11 relative to the first drive system 121) under the control of the control device 2. The drive member 1225 may move the light irradiation device 11 so that the relative positional relationship between the light irradiation device 11 and the coating film SF is changed. In this case, the control device 2 may control the drive member 1225 based on the measurement result of the position measurement device 18 in addition to the measurement result of the position measurement device 1227. Specifically, the control device 2 may acquire information regarding the relative positional relationship between the coating film SF and the light irradiation device 11 based on the measurement result of the position measurement device 18, and control the drive member 1225 based on the information regarding the relative positional relationship between the coating film SF and the light irradiation device 11. For example, the control device 2 may control the drive member 1225 so that the light irradiation device 11 moves relative to the coating film SF. That is, the control device 2 may control the drive member 1225 so as to change the relative position between the light irradiation device 11 and the coating film SF. At this time, the control device 2 may control the drive member 1225 so as to align the coating film SF and the light irradiation device 11. The control device 2 may control the drive member 1225 so as to align the coating film SF and the target irradiation region EA where the processing light EL is irradiated from the light irradiation device 11. As an example, the control device 2 may control the drive member 1225 so that the target irradiation region EA is set at a desired position on the coating film SF (that is, the processing light EL is irradiated). The control device 2 may control the drive member 1225 so that the target irradiation region EA moves along a desired path on the coating film SF.

[0104] Here, as described above, the first drive system 121 can also move the light irradiation device 11 with respect to the coating film SF, similar to the second drive system 122. That is, the processing device 1 can move the light irradiation device 11 using both or either one of the first drive system 121 and the second drive system 122. In this case, the movement mode of the light irradiation device 11 by the first drive system 121 may be different from the movement mode of the light irradiation device 11 by the second drive system 122. For example, the positioning accuracy of the light irradiation device 11 by the first drive system 121 may be lower than the positioning accuracy of the light irradiation device 11 by the second drive system 122. That is, the positioning accuracy of the light irradiation device 11 by the second drive system 122 may be higher than the positioning accuracy of the light irradiation device 11 by the first drive system 121. For example, the movement accuracy of the light irradiation device 11 by the first drive system 121 (that is, the accuracy of changing the relative position between the coating film SF and the light irradiation device 11) may be lower than the movement accuracy of the light irradiation device 11 by the second drive system 122. That is, the movement accuracy of the light irradiation device 11 by the second drive system 122 may be higher than the movement accuracy of the light irradiation device 11 by the first drive system 121. For example, the movement range of the light irradiation device 11 by the first drive system 121 may be larger than the movement range of the light irradiation device 11 by the second drive system 122. That is, the movement range of the light irradiation device 11 by the second drive system 122 may be smaller than the movement range of the light irradiation device 11 by the first drive system 121. For example, the movement amount of the light irradiation device 11 by the first drive system 121 (that is, the amount of change in the relative position between the coating film SF and the light irradiation device 11) may be more than the movement amount of the light irradiation device 11 by the second drive system 122. That is, the movement amount of the light irradiation device 11 by the second drive system 122 may be less than the movement amount of the light irradiation device 11 by the first drive system 121. In this case, the control device 2 may control the first drive system 121 to align the light irradiation device 11 with respect to the coating film SF with a first accuracy, and control the second drive system 122 to align the light irradiation device 11 with respect to the coating film SF with a second accuracy higher than the first accuracy. That is, the control device 2 may control the first drive system 121 to relatively roughly align the light irradiation device 11 with respect to the coating film SF, and control the second drive system 122 to align the light irradiation device 11 with respect to the coating film SF with high accuracy.Furthermore, the positioning accuracy of the light irradiation device 11 by the first drive system 121 can be regarded as substantially equivalent to the positioning accuracy of the tip arm member 12124 by the first drive system 121. The movement accuracy of the light irradiation device 11 by the first drive system 121 can be regarded as substantially equivalent to the movement accuracy of the tip arm member 12124 by the first drive system 121. The movement range of the light irradiation device 11 by the first drive system 121 can be regarded as substantially equivalent to the movement range of the tip arm member 12124 by the first drive system 121. The movement amount of the light irradiation device 11 by the first drive system 121 can be regarded as substantially equivalent to the movement amount of the tip arm member 12124 by the first drive system 121.

[0105] The drive member 1225 may reduce the vibration transmitted between the first drive system 121 and the light irradiation device 11 via the second drive system 122 by changing the relative position between the first drive system 121 and the light irradiation device 11 using a driving force under the control of the control device 2. That is, the drive member 1225 may attenuate the vibration transmitted between the first drive system 121 and the light irradiation device 11 via the second drive system 122 using a driving force. Specifically, the drive member 1225 may reduce (attenuate) the vibration traveling (i.e., being transmitted) from the first drive system 121 to the light irradiation device 11 via the second drive system 122 using a driving force. For this reason, the drive member 1225 (or the second drive system 122 including the drive member 1225) may be referred to as a vibration reduction device or a vibration attenuation device.

[0106] The drive member 1225 may convert the vibration of the air spring 1223 into damped vibration by changing the relative position between the first drive system 121 and the light irradiation device 11 using the driving force. That is, the drive member 1225 may convert the vibration transmitted via the second drive system 122 between the first drive system 121 and the light irradiation device 11 into damped vibration using the driving force. In this case, it can be said that the drive member 1225 reduces the relative displacement amount between the first drive system 121 and the light irradiation device 11 caused by the vibration from the first drive system 121 toward the light irradiation device 11. Specifically, it can be said that the drive member 1225 reduces the relative displacement amount between the portion of the first drive system 121 to which the second drive system 122 is connected (that is, the tip arm portion 12124) and the portion of the light irradiation device 11 to which the second drive system 122 is connected, which is caused by the vibration from the first drive system 121 toward the light irradiation device 11. In addition, when the drive member 1225 can convert the vibration of the air spring 1223 into damped vibration, the second drive system 122 may not include the damper member 1224. However, even when the drive member 1225 cannot convert the vibration of the air spring 1223 into damped vibration, the second drive system 122 may not include the damper member 1224. Also, the number of air springs 1223, the number of damper members 1224, and the number of drive members 1225 do not have to be equal to each other.

[0107] Here, considering that the processing apparatus 1 can move the light irradiation apparatus 11 using both or either one of the first drive system 121 and the second drive system 122 as described above, it can also be said that the processing apparatus 1 can reduce the vibration traveling from the first drive system 121 to the light irradiation apparatus 11 using both or either one of the first drive system 121 and the second drive system 122. In this case, when the movement mode of the light irradiation apparatus 11 by the first drive system 121 is different from the movement mode of the light irradiation apparatus 11 by the second drive system 122 as described above, the control device 2 may determine whether to reduce the vibration using the first drive system 121 and / or whether to reduce the vibration using the second drive system 122 based on the characteristics of the vibration to be reduced. For example, the control device 2 may determine whether to reduce the vibration using the first drive system 121 and / or whether to reduce the vibration using the second drive system 122 based on the frequency of the vibration to be reduced. Specifically, when the vibration to be reduced includes vibration in the first frequency range, the control device 2 may determine that the vibration should be reduced using the first drive system 121. The first frequency range is typically set to a frequency range including vibrations that can be reduced by the first drive system 121. In this case, the control device 2 may control the first drive system 121 so as to reduce at least a part of the vibration traveling from the first drive system 121 to the light irradiation apparatus 11. Further, when the vibration to be reduced includes vibration in a second frequency range different from the first frequency range, the control device 2 may determine that the vibration should be reduced using the second drive system 122. The second frequency range is typically set to a frequency range including vibrations that can be reduced by the second drive system 122. In this case, the control device 2 may control the second drive system 122 so as to reduce at least a part of the vibration traveling from the first drive system 121 to the light irradiation apparatus 11. Incidentally, when the positioning accuracy of the light irradiation apparatus 11 by the first drive system 121 is lower than the positioning accuracy of the light irradiation apparatus 11 by the second drive system 122 as described above, typically, the second frequency range includes frequencies higher than the first frequency range.

[0108] The driving member 1225 may apply a driving force acting along a direction including a component in the direction in which the air spring 1223 and / or the damper member 1224 applies an elastic force. For example, in the example shown in FIG. 6, since the air spring 1223 and / or the damper member 1224 applies an elastic force along the Z-axis direction, the driving member 1225 may apply a driving force acting along a direction including a component in the Z-axis direction. When the driving member 1225 generates a driving force acting along a direction including a component in the direction in which the air spring 1223 and / or the damper member 1224 applies an elastic force, the driving member 1225 can utilize this driving force to convert the vibration of the air spring 1223 into damped vibration. When making the vibration of the air spring 1223 into damped vibration, the driving member 1225 may utilize the driving force to change the resonance frequency of the air spring 1223. Typically, the driving member 1225 may utilize the driving force to increase the resonance frequency of the air spring 1223.

[0109] The driving member 1225 may apply a driving force acting along a direction intersecting the direction in which the air spring 1223 and / or the damper member 1224 applies an elastic force. For example, in the example shown in FIG. 6, since the air spring 1223 and / or the damper member 1224 applies an elastic force along the Z-axis direction, the driving member 1225 may apply a driving force acting along a direction intersecting the Z-axis direction (for example, at least one of the X-axis direction and the Y-axis direction). When the driving member 1225 generates a driving force acting along a direction intersecting the direction in which the air spring 1223 and / or the damper member 1224 applies an elastic force, the driving member 1225 may not perform an operation for making the vibration of the air spring 1223 into damped vibration by utilizing this driving force. Therefore, the load on the driving member 1225 is relatively reduced.

[0110] A device that actively reduces vibration using an elastic member such as an air spring 1223 and a drive member 1225 may be referred to as an active vibration isolation device. Therefore, the second drive system 122 may be referred to as an active vibration isolation device. The active vibration isolation device may be referred to as an Active Vibration Isolation System (AVIS).

[0111] (1-3) Specific Example of Machining Operation by Machining System SYSa (1-3-1) Specific Example of Structure Formed by Machining Operation As described with reference to FIG. 2, in the first embodiment, the processing system SYSa forms a recess C in the coating film SF. The recess C is formed in a portion of the coating film SF that is actually irradiated with the processing light EL. Therefore, if the position on the coating film SF where the processing light EL is actually irradiated (i.e., the position where the target irradiation area EA where the processing light EL is to be irradiated is set) is appropriately set, the recess C can be formed at a desired position on the coating film SF. That is, a structure by the coating film SF can be formed on the object S to be processed.

[0112] Specifically, as described above, the processing system SYSa moves the surface of the coating film SF to the target irradiation area EA using at least one of the galvanometer mirror 1122 and the drive system 12. During the period when the target irradiation area EA moves on the surface of the coating film SF, the processing system SYSa irradiates the processing light EL at the timing when the target irradiation area EA overlaps with the area on the surface of the coating film SF that should actually be irradiated with the processing light EL (i.e., the area to be processed). On the other hand, during the period when the target irradiation area EA moves on the surface of the coating film SF, the processing system SYSa does not irradiate the processing light EL at the timing when the target irradiation area EA does not overlap with the area on the surface of the coating film SF that should actually be irradiated with the processing light EL. That is, during the period when the target irradiation area EA moves on the surface of the coating film SF, the processing system SYSa does not irradiate the processing light EL at the timing when the target irradiation area EA overlaps with the area on the surface of the coating film SF that should not actually be irradiated with the processing light EL (i.e., the area that should not be processed). As a result, on the object S to be processed, a structure formed by the coating film SF according to the pattern (or distribution) of the area on the coating film SF that has actually been irradiated with the processing light EL is formed.

[0113] In the first embodiment, the processing system SYSa forms a riblet structure, which is an example of a structure formed by such a coating film SF, on the object S to be processed under the control of the control device 2. The riblet structure is a structure capable of reducing the resistance of the fluid on the surface of the coating film SF (particularly, frictional resistance and turbulent frictional resistance). The resistance of the surface of the object S to be processed on which the riblet structure is formed to the fluid is smaller than the resistance of the surface of the object S to be processed on which the riblet structure is not formed to the fluid. Therefore, it can also be said that the riblet structure is a structure capable of reducing the resistance of the surface of the object S to be processed to the fluid. Here, the fluid may be any medium (gas, liquid) that flows relatively to the surface of the coating film SF. For example, each of the medium flowing relative to the stationary object SF and the stationary medium distributed around the moving object SF is an example of the fluid.

[0114] An example of a riblet structure is shown in FIGS. 7(a) and 7(b). As shown in FIGS. 7(a) and 7(b), the riblet structure is, for example, a concave structure CP1 formed by continuously forming recesses C along a first direction (in the example shown in FIGS. 7(a) and 7(b), the Y-axis direction), that is, a concave structure CP1 linearly formed so as to extend along the first direction, and is a structure in which a plurality of them are arranged along a second direction (in the example shown in FIGS. 7(a) and 7(b), the X-axis direction) intersecting the first direction. That is, the riblet structure is, for example, a structure in which a plurality of concave structures CP1 extending along the first direction have a periodic direction in the second direction intersecting the first direction. Substantially, there is a convex structure CP2 protruding from the surroundings between two adjacent concave structures CP1. Therefore, it can also be said that the riblet structure is, for example, a structure in which convex structures CP2 linearly extending along a first direction (for example, the Y-axis direction) are arranged in a plurality along a second direction (for example, the X-axis direction) intersecting the first direction. That is, it can also be said that the riblet structure is, for example, a structure in which a plurality of convex structures CP2 extending along the first direction have a periodic direction in the second direction intersecting the first direction. The riblet structure shown in FIGS. 7(a) and 7(b) is a periodic structure. Note that the riblet structure may be an aperiodic structure.

[0115] The interval between two adjacent concave structures CP1 (that is, the arrangement pitch P1 of the concave structures CP1) is, for example, several microns to several hundred microns, but other sizes may also be possible. Further, the depth (that is, the depth in the Z-axis direction) D of each concave structure CP1 is, for example, several microns to several hundred microns, but other sizes may also be possible. The depth D of each concave structure CP1 may be equal to or less than the arrangement pitch P1 of the concave structures CP1. The depth D of each concave structure CP1 may be equal to or less than half of the arrangement pitch P1 of the concave structures CP1. The shape of the cross section including the Z-axis of each concave structure CP1 (specifically, the cross section along the XZ plane) is a bowl-shaped curved shape, but it may be triangular, quadrilateral, or a polygon with five or more sides.

[0116] The distance between two adjacent convex structures CP2 (i.e., the array pitch P2 of the convex structures CP2) is, for example, from several microns to several hundred microns, but may be other sizes. Further, the height (i.e., the height in the Z-axis direction) H of each convex structure CP2 is, for example, from several microns to several hundred microns, but may be other sizes. The height H of each convex structure CP2 may be equal to or less than the array pitch P2 of the convex structures CP2. The height H of each convex structure CP2 may be equal to or less than half of the array pitch P2 of the convex structures CP2. The shape of the cross-section (specifically, the cross-section along the XZ plane) including the Z-axis of each convex structure CP2 is a mountain shape in which the slope is a curve, but may also be a triangle, a quadrilateral, or a polygon with five or more sides.

[0117] Note that the reticle structure itself formed by the processing system SYSa may be an existing reticle structure as described in, for example, Chapter 5 of "Mechanical Engineering Handbook, Basic Volume α4 Fluid Engineering" edited by the Japan Society of Mechanical Engineers. Therefore, a detailed description of the reticle structure itself is omitted.

[0118] As described above, such a riblet structure can reduce the resistance of the fluid to the surface of the workpiece S on which the riblet structure is formed. Therefore, the workpiece S may be an object (e.g., a structure) for which it is desired to reduce the resistance to the fluid. For example, the workpiece S may include an object (i.e., a moving body) that can move at least partially through a fluid (e.g., at least one of a gas and a liquid). Specifically, for example, as shown in FIGS. 8(a) to 8(c), the workpiece S may include the fuselage of the aircraft PL (e.g., at least one of the fuselage PL1, the main wing PL2, the vertical tail PL3, and the horizontal tail PL4). In this case, as shown in FIGS. 8(a) and 8(c), the processing device 1 (or the processing system SYSa, the same in the following paragraphs) may stand independently on the fuselage of the aircraft PL by the support device 14. Alternatively, since the end 144 of the leg member 142 of the support device 14 can be attached to the coating film SF, as shown in FIG. 8(b), the processing device 1 may be attached to the fuselage of the aircraft PL so as to hang (i.e., suspend) from the fuselage of the aircraft PL by the support device 14. Further, since the end 144 of the leg member 142 of the support device 14 can be attached to the coating film SF and the end 134 of the partition member 132 of the housing device 13 can be attached to the coating film SF, the processing device 1 can stand independently on the coating film SF even when the surface of the coating film SF is inclined with respect to the horizontal plane with the upper side facing upward. Furthermore, the processing device 1 can be attached to the coating film SF so as to hang from the coating film SF even when the surface of the coating film SF is inclined with respect to the horizontal plane with the lower side facing downward. In any case, the light irradiation device 11 can move along the surface of the fuselage by the drive system 12 and / or the movement of the support device 14. Therefore, the processing system SYSa can also form a riblet structure by the coating film SF on a workpiece S such as the fuselage of an aircraft (i.e., a workpiece S whose surface is a curved surface, whose surface is inclined with respect to the horizontal plane, or whose surface faces downward).

[0119] In addition, for example, the object S to be processed may include an automobile body or aerodynamic parts. For example, the object S to be processed may include a ship hull. For example, the object S to be processed may include a rocket fuselage. For example, the object S to be processed may include a turbine (for example, at least one of a hydraulic turbine and a wind turbine, and particularly the turbine blade). For example, the object S to be processed may include parts that constitute an object that can move at least partially through a fluid. For example, the object S to be processed may include an object that is at least partially fixed in a flowing fluid. Specifically, for example, the object S to be processed may include a bridge girder installed in a river or the sea. For example, the object S to be processed may include a pipe through which a fluid flows inside. In this case, the inner wall of the pipe can be the surface of the object S to be processed described above.

[0120] Incidentally, an example of the object S to be processed given here is a relatively large object (for example, an object with a size on the order of several meters to several hundred meters). In this case, as shown in FIGS. 8(a) to 8(c), the size of the light irradiation device 11 is smaller than the size of the object S to be processed. However, the object S to be processed may be an object of any size. For example, the object S to be processed may be an object with a size on the order of kilometers, centimeters, millimeters, or micrometers.

[0121] The characteristics of the riblet structure described above may be set to appropriate characteristics such that an appropriate friction reduction effect can be obtained according to what kind of object the object S to be processed is. That is, the characteristics of the riblet structure described above may be optimized such that an appropriate friction reduction effect can be obtained according to what kind of object the object S to be processed is. More specifically, the characteristics of the riblet structure may be set to appropriate characteristics such that an appropriate friction reduction effect can be obtained according to at least one of the type of fluid distributed around the object S to be processed during use (i.e., during operation), the relative velocity of the object S with respect to the fluid, and the shape of the object S. Further, the characteristics of the riblet structure described above may be set to appropriate characteristics such that an appropriate friction reduction effect can be obtained according to what kind of object the object S is and on which part of the object the riblet structure is formed. For example, when the object S to be processed is the fuselage of an aircraft PL, the characteristics of the riblet structure formed on the fuselage PL1 and the characteristics of the riblet structure formed on the main wing PL2 may be different.

[0122] The characteristics of the riblet structure may include the size of the riblet structure. The size of the riblet structure may include at least one of the arrangement pitch P1 of the concave structures CP1, the depth D of each concave structure CP1, the arrangement pitch P2 of the convex structures CP2, the height H of each convex structure CP2, etc. The characteristics of the riblet structure may include the shape of the riblet structure (e.g., the shape of the cross-section including the Z-axis (specifically, the cross-section along the XZ plane)). The characteristics of the riblet structure may include the extending direction of the riblet structure (i.e., the extending direction of the concave structures CP1). The characteristics of the riblet structure may include the formation position of the riblet structure.

[0123] As an example, for instance, when the object S to be processed is the fuselage of an aircraft flying at an altitude of 10 km at a speed of 1000 km / h during cruising, the arrangement pitch P1 of the concave structures CP1 (i.e., the arrangement pitch P2 of the convex structures CP2) may be set to, for example, about 78 micrometers.

[0124] (1-3-2) Flow of Machining Operation Next, with reference to FIGS. 9 to 20, the flow of the processing operation for forming the riblet structure will be described.

[0125] First, as described above, the plurality of processing lights EL are deflected by the galvanometer mirror 1122. In order to form the riblet structure, the galvanometer mirror 1122 irradiates each of the plurality of processing lights EL to the corresponding target irradiation area EA at a desired timing while moving the plurality of target irradiation areas EA along the Y-axis direction on the surface of the coating film SF, and alternately repeats the step operation of moving the plurality of target irradiation areas EA on the surface of the coating film SF by a predetermined amount at least along the X-axis direction. In this case, the Y-axis may be referred to as the scan axis, and the X-axis may be referred to as the step axis.

[0126] Here, there is a limit to the size of the area on the surface of the coating film SF where the plurality of processing lights EL can be scanned by controlling the galvanometer mirror 1122 while keeping the light irradiation device 11 stationary with respect to the coating film SF. Therefore, in the first embodiment, as shown in FIG. 9, the control device 2 sets a plurality of processing shot areas SA on the surface of the coating film SF (particularly, the area of the coating film SF where the riblet structure is to be formed). Each processing shot area SA corresponds to an area on the coating film SF where the plurality of processing lights EL can be scanned by controlling the galvanometer mirror 1122 while keeping the light irradiation device 11 stationary with respect to the coating film SF. The shape of each processing shot area SA is a rectangle, but the shape is arbitrary.

[0127] The control device 2 controls the light irradiation device 11 so as to irradiate a part of a plurality of processing lights EL deflected by the galvanometer mirror 1122 to a part of one processing shot region SA (for example, SA1), thereby forming a re-riblet structure in the one processing shot region SA (SA1). Thereafter, the control device 2 controls at least one of the drive systems 12 and 15 so as to move the light irradiation device 11 with respect to the coating film SF, thereby arranging the light irradiation device 11 at a position where it is possible to irradiate a plurality of processing lights EL to another processing shot region SA (for example, SA2). Thereafter, the control device 2 controls the light irradiation device 11 so as to irradiate a plurality of processing lights EL deflected by the galvanometer mirror 1122 to another processing shot region SA (SA2), thereby forming a re-riblet structure in the other processing shot region SA. The control device 2 repeats all of the following operations for all of the processing shot regions SA1 to SA16, thereby forming a re-riblet structure.

[0128] Hereinafter, the description will continue by taking as an example the operation of forming a re-riblet structure in the processing shot regions SA1 to SA4 shown in FIG. 9. In the following, a case will be described in which two adjacent processing shot regions SA are located in the accommodation space SP along the X-axis direction. However, even when an arbitrary number of processing shot regions SA are located in the accommodation space SP, the same operation is performed without change. Further, the operation of forming the re-riblet structure shown below is merely an example, and the processing system SYS may perform an operation different from the operation shown below to form the re-riblet structure. In short, as long as the processing system SYS can irradiate the processing object S with a plurality of processing lights EL to form a re-riblet structure in the processing object S, it may perform any operation.

[0129] As shown in FIG. 10, first, the control device 2 controls the drive system 15 to move the support device 14 with respect to the coating film SF so that the storage device 13 is arranged at the first storage position where the processing shot regions SA1 and SA2 are located within the storage space SP. That is, the control device 2 moves the storage device 13 supported by the support device 14 so that the processing shot regions SA1 and SA2 are covered by the storage device 13. Further, the control device 2 controls the drive system 12 (that is, the first drive system 121 and / or the second drive system 122) to move the light irradiation device 11 with respect to the coating film SF so that the light irradiation device 11 is arranged at the first irradiation position where a plurality of processing lights EL can be irradiated onto the processing shot region SA1. After the storage device 13 is arranged at the first storage position and the light irradiation device 11 is arranged at the first irradiation position, the partition member 132 is in the first extended state. Therefore, the end portion 134 of the partition member 132 contacts and adheres to the coating film SF. Similarly, the plurality of leg members 142 are in the second extended state. Therefore, the end portions 144 of the plurality of leg members 142 contact and adhere to the coating film SF.

[0130] Thereafter, as shown in FIGS. 11(a) and 11(b), the control device 2 controls the light irradiation device 11 (particularly, the galvano mirror 1122) so that a plurality of processing lights EL scan the processing shot region SA1. Specifically, in order to perform the scanning operation described above, the control device 2 controls the Y scanning mirror 1122Y of the galvano mirror 1122 so that a plurality of processing lights EL scan a certain region within the processing shot region SA1 along the Y-axis direction. While the scanning operation is being performed, the light source system 111 emits a plurality of processing lights EL. Thereafter, in order to perform the step operation described above, the control device 2 rotates at least the X scanning mirror 1122X of the galvano mirror 1122 by a unit step amount. While the step operation is being performed, the light source system 111 does not emit a plurality of processing lights EL. Thereafter, in order to perform the scanning operation described above, the control device 2 controls the Y scanning mirror 1122Y of the galvano mirror 1122 so that a plurality of processing lights EL scan a certain region within the processing shot region SA1 along the Y-axis direction. In this way, the control device 2 alternately repeats the scanning operation and the step operation to control the galvano mirror 1122 so that a plurality of processing lights EL scan the entire processing shot region SA1 (or a partial region of the processing shot region SA1 where the riblet structure is to be formed). Note that a plurality of processing lights EL may be emitted while the step operation is being performed.

[0131] That is, in the first embodiment, as shown in FIG. 12, which is a plan view showing the scanning locus of the processing light EL (i.e., the movement locus of the target irradiation region EA) during the period in which the scanning operation and the step operation are repeated, the processing apparatus 1 sequentially performs a scanning operation on a plurality of scanning regions SCA set in the processing shot region SA. FIG. 12 shows an example in which six scanning regions SCA#1 to SCA#6 are set in the processing shot region SA. Each scanning region SCA is a region scanned by a plurality of processing lights EL irradiated in one scanning operation (i.e., a series of scanning operations not sandwiching the step operation). Each scanning region SCA is a region in which a plurality of target irradiation regions EA move in one scanning operation. In this case, in one scanning operation, the target irradiation region EA moves from the scan start position SC_start to the scan end position SC_end of each scanning region SCA. Such a scanning region SCA typically becomes a region extending along the Y-axis direction (i.e., the scanning direction of the plurality of processing lights EL). The plurality of scanning regions SCA are arranged along the X-axis direction (i.e., the direction intersecting the scanning direction of the plurality of processing lights EL).

[0132] In this case, the processing system SYSa starts the scanning operation from one scanning area SCA located on the far +X side or the far -X side among a plurality of scanning areas SCA set in a certain processing shot area SA. For example, FIG. 12 shows an example where the processing system SYSa starts the scanning operation from the shot area SCA#1 located on the far -X side. In this case, the control device 2 controls the galvano mirror 1122 so that the processing light EL can be irradiated onto the scan start position SC_start#1 of the scan area SCA#1 (for example, the -Y side end or its vicinity within the scan area SCA#1). That is, the control device 2 controls the galvano mirror 1122 so that the target irradiation area EA is set at the scan start position SC_start#1 of the scan area SCA#1. Then, the processing system SYSa performs a scanning operation on the scan area SCA#1. Specifically, the control device 2 controls the galvano mirror 1122 so that a plurality of target irradiation areas EA move from the scan start position SC_start#1 of the scan area SCA#1 toward the scan end position SC_end#1 of the scan area SCA#1 (for example, the +Y side end or its vicinity within the scan area SCA#1). Further, the control device 2 controls the light irradiation device 11 so that each of the plurality of processing lights EL is irradiated onto the corresponding target irradiation area EA at a desired timing. As a result, the scan area SCA#1 is scanned by the plurality of processing lights EL. Note that in FIG. 12, for the sake of simplifying the drawing, the movement trajectory of one target irradiation area EA within each scan area SCA is shown, but actually, a plurality of target irradiation areas EA move within each scan area SCA. That is, in FIG. 12, for the sake of simplifying the drawing, the scanning trajectory of one processing light EL within each scan area SCA is shown, but actually, each scan area SCA is scanned by a plurality of processing lights EL.

[0133] After the scanning operation for the scan area SCA#1 is completed, the processing system SYSa performs a step operation to perform a scanning operation on another scan area SCA different from the scan area SCA#1. Specifically, the control device 2 controls the galvanometer mirror 1122 so that the processing light EL can be irradiated to the scan start position SC_start#2 of the scan area SCA#2 adjacent to the scan area SCA#1 along the X-axis direction (for example, the -Y side end or its vicinity within the scan area SCA#2). That is, the control device 2 controls the galvanometer mirror 1122 so that the target irradiation area EA is set at the scan start position SC_start#2 of the scan area SCA#2. As a result, as shown in FIG. 12, the target irradiation position EA moves along each of the X-axis direction and the Y-axis direction. At this time, the moving amount of the target irradiation position EA in the X-axis direction may be the same as the size of the scan area SCA in the X-axis direction. The moving amount of the target irradiation position EA in the Y-axis direction may be the same as the size of the scan area SCA in the Y-axis direction.

[0134] Thereafter, the processing system SYSa performs a scanning operation on the scan area SCA#2. Specifically, the control device 2 controls the galvanometer mirror 1122 so that a plurality of target irradiation areas EA move from the scan start position SC_start#2 of the scan area SCA#2 to the scan end position SC_end#2 of the scan area SCA#2 (for example, the +Y side end or its vicinity within the scan area SCA#2). Further, the control device 2 controls the light irradiation device 11 so that each of the plurality of processing lights EL is irradiated to the corresponding target irradiation area EA at a desired timing. As a result, the scan area SCA#2 is scanned by the plurality of processing lights EL.

[0135] Thereafter, the same operation is repeated until the scanning operations for the scan areas SCA#3 to SCA#6 are completed.

[0136] In the example shown in FIG. 12, the scanning direction of the processing light EL by the scanning operation is fixed in the +Y axis direction. The moving direction of the target irradiation region EA by the scanning operation is fixed in the +Y axis direction. That is, in the example shown in FIG. 12, the scanning direction of the processing light EL by the scanning operation performed a plurality of times within the processing shot region SA (that is, the moving direction of the target irradiation region EA, the same hereinafter) is the same as each other. The scanning directions of the plurality of processing lights EL that scan the plurality of scan regions SCA are the same as each other. The moving directions of the target irradiation region EA within the plurality of scan regions SCA are the same as each other. Specifically, the scanning direction of the processing light EL by the scanning operation performed on the scan region SCA#1, the scanning direction of the processing light EL by the scanning operation performed on the scan region SCA#2, ···, the scanning direction of the processing light EL by the scanning operation performed on the scan region SCA#6 are the same as each other.

[0137] By repeating such a scanning operation and a step operation, a riblet structure is formed in the processing shot region SA1. Incidentally, as shown in FIGS. 11(a) and 11(b), the width of the region scanned by the processing light EL (that is, the width of the processing shot region SA, particularly the width in the X-axis direction) is larger than the width of the light irradiation device 11 (particularly, the width in the X-axis direction).

[0138] In the process where such scanning operations and step operations are repeated, due to the operation of the galvanometer mirror 1122, positional deviation of the target irradiation area EA may occur. For example, if the galvanometer mirror 1122 continues to operate, the temperature of the galvanometer mirror 1122 may change (typically, increase). When the temperature of the galvanometer mirror 1122 changes, the characteristics of the galvanometer mirror 1122 may change compared to before the temperature change of the galvanometer mirror 1122. As a result, the position of the target irradiation area EA with respect to the galvanometer mirror 1122 may change (that is, positional deviation of the target irradiation area EA may occur). Such positional deviation of the target irradiation area EA may hinder proper processing of the coating film SF. Therefore, the control device 2 may control the drive system 12 to move the light irradiation device 11 with respect to the coating film SF so as to reduce the positional deviation of the target irradiation area EA (that is, to bring the target irradiation area EA closer to its original position). For example, the control device 2 may control the first drive system 121 to move the light irradiation device 11 with respect to the coating film SF so as to reduce the positional deviation of the target irradiation area EA (for example, to reduce the amount of positional deviation). For example, the control device 2 may control the second drive system 122 (particularly, the drive member 1225) to move the light irradiation device 11 with respect to the coating film SF so as to reduce the positional deviation of the target irradiation area EA.

[0139] During the period when the light irradiation device 11 irradiates the processing light EL, the control device 2 controls the drive system 15 so that the plurality of leg members 142 are maintained in the second extended state. As a result, the ends 144 of the plurality of leg members 142 continue to adhere to the coating film SF. As a result, the stability of the support device 14 is improved, and the possibility that the target irradiation area EA of the processing light EL unintentionally shifts on the coating film SF due to the instability of the support device 14 is reduced. However, as long as the support device 14 can stand on its own (or can adhere to the coating film SF so as to hang from the coating film SF) on the coating film SF during at least a part of the period when the light irradiation device 11 irradiates the light EL, a part of the plurality of leg members 142 may be in the second contracted state.

[0140] During the period when the light irradiation device 11 irradiates the processing light EL, the control device 2 controls a drive system (not shown) that expands and contracts the partition member 132 so that the partition member 132 remains in the first extended state. As a result, the end portion 134 of the partition member 132 continues to adhere to the coating film SF. As a result, since the airtightness of the accommodation space SP is maintained, the processing light EL propagating in the accommodation space SP does not leak to the outside of the accommodation space SP (that is, outside the accommodation device 13). Furthermore, unnecessary substances generated in the accommodation space SP do not leak to the outside of the accommodation space SP (that is, outside the accommodation device 13).

[0141] However, there is a possibility that at least a part of the end portion 134 that should be adhering to the coating film SF may separate from the coating film SF due to some factor. In this case, if the light irradiation device 11 continues to irradiate the processing light EL, there is a possibility that at least one of the processing light EL and the unnecessary substances may leak to the outside of the accommodation device 13. Therefore, when the control device 2 detects that at least a part of the end portion 134 has separated from the coating film SF during the period when the light irradiation device 11 irradiates the processing light EL, the control device 2 may control the light irradiation device 11 to stop the irradiation of the processing light EL.

[0142] Thereafter, as shown in FIG. 13, the control device 2 controls the drive system 12 so that the light irradiation device 11 moves from the first irradiation position to the second irradiation position where the light irradiation device 11 can irradiate a plurality of processing lights EL to the processing shot region SA2. During the period when the light irradiation device 11 is moving, the control device 2 controls the light irradiation device 11 so that the light irradiation device 11 does not irradiate the processing light EL.

[0143] Thereafter, as shown in FIGS. 14(a) and 14(b), the control device 2 controls the light irradiation device 11 (particularly, the galvano mirror 1122) such that a plurality of processing lights EL scan the processing shot area SA2. Specifically, the control device 2 alternately repeats the above-described scanning operation and the above-described step operation so that a plurality of processing lights EL scan the entire processing shot area SA2 (or a partial area of the processing shot area SA2 where a riblet structure is to be formed). As a result, a riblet structure is formed in the processing shot area SA2. Note that the plurality of recesses CP1 constituting the riblet structure in the processing shot area SA1 may be formed so as to be continuously connected to each of the plurality of recesses CP1 constituting the riblet structure in the processing shot area SA2 (or another processing shot area SA) adjacent to the processing shot area SA1. Alternatively, the plurality of recesses CP1 constituting the riblet structure in the processing shot area SA1 may be formed so as not to be connected to each of the plurality of recesses CP1 constituting the riblet structure in the processing shot area SA2. For example, the continuous length of one recess CP1 formed as a result of scanning the processing light EL in the processing shot area SA depends on the size of the processing shot area SA (particularly, the size in the Y-axis direction, which is the scanning direction of the processing light EL). Therefore, when the size of the processing shot area SA is such that it can realize a continuous length at which the riblet structure can perform the above-described function, the plurality of recesses CP1 constituting the riblet structure in the processing shot area SA1 may be formed so as not to be connected to each of the plurality of recesses CP1 constituting the riblet structure in the processing shot area SA2. As an example, when the object to be processed S is an aircraft, the continuous length at which the riblet structure can perform the above-described function is approximately several millimeters according to calculations based on the airspeed and the frequency of the turbulent flow phenomenon during the use of the aircraft (typically, during cruising).Therefore, when it is possible to set a processing shot area SA having a size in the Y-axis direction larger than approximately several millimeters on the surface of the coating film SF, the plurality of recesses CP1 constituting the re-let structure within the processing shot area SA1 may be formed so as not to be connected to each of the plurality of recesses CP1 constituting the re-let structure within the processing shot area SA2.

[0144] When the re-let structure is formed in the processing shot area SA2, there is no remaining processing shot area SA in the accommodation space SP where the re-let structure has not yet been formed. Therefore, simply moving the light irradiation device 11 within the accommodation space SP by the drive system 12 cannot cause the light irradiation device 11 to irradiate a plurality of processing lights EL onto the processing shot area SA where the re-let structure has not yet been formed to form the re-let structure. Thus, when there is no remaining processing shot area SA where the re-let structure has not yet been formed in the accommodation space SP, the control device 2 controls the drive system 15 so that a processing shot area SA where the re-let structure has not yet been formed newly positions within the accommodation space SP by moving the support device 14 (that is, by moving the accommodation device 13).

[0145] Specifically, first, as shown in FIG. 15, the control device 2 controls a drive system (not shown) that expands and contracts the partition member 132 so that the state of the partition member 132 switches from the first extended state to the first contracted state. As a result, the end portion 134 of the partition member 132 moves away from the coating film SF. During the period when the support device 14 moves, the control device 2 controls the light irradiation device 11 so that the light irradiation device 11 does not irradiate the processing light EL. Therefore, even if the end portion 134 moves away from the coating film SF, there is no possibility that at least one of the processing light EL and the unwanted substance leaks out of the accommodation device 13.

[0146] However, although the unnecessary substances present in the accommodation space SP are sucked outside the accommodation space SP by the exhaust device 16 described above, due to some factors, not all of the unnecessary substances present in the accommodation space SP are sucked by the exhaust device 16 (that is, unnecessary substances may remain in the accommodation space SP). In this case, when the end portion 134 separates from the coating film SF, the unnecessary substances may leak out of the outside of the accommodating device 13. For this reason, the control device 2 may determine whether to switch the partition member 132 from the first extended state to the first contracted state based on the detection result of the detection device 135 that detects the unnecessary substances in the accommodation space SP. When unnecessary substances remain in the accommodation space SP, the control device 2 may not switch the partition member 132 from the first extended state to the first contracted state. In this case, the unnecessary substances remaining in the accommodation space SP are continuously sucked by the exhaust device 16. On the other hand, when no unnecessary substances remain in the accommodation space SP, the control device 2 may switch the partition member 132 from the first extended state to the first contracted state.

[0147] Furthermore, the control device 2 controls the drive system 15 such that the state of at least a part of the leg members 142 that move with respect to the coating film SF as the support device 14 moves (specifically, as the beam member 141 that has been contracted extends, as will be described later) switches from the second extended state to the second contracted state. The leg members 142 that move with respect to the coating film SF as the contracted beam member 141 extends are typically the leg members 142 located on the front side in the moving direction of the support device 14 (that is, the moving direction of the accommodating device 13) among the plurality of leg members 142. In the example shown in FIG. 15, the support device 14 moves toward the +X side, and the leg members 142 located on the front side in the moving direction of the support device 14 are the leg members 142 located on the +X side. Hereinafter, the leg members 142 located on the front side in the moving direction of the support device 14 are referred to as "front leg members 142". As a result, the end portion 144 of the front leg member 142 separates from the coating film SF.

[0148] Thereafter, as shown in FIG. 16, the control device 2 controls the drive system 15 so that the storage device 13 moves from the first storage position to the second storage position where the processing shot regions SA3 and SA4 are located within the storage space SP. Specifically, the control device 2 controls the drive system 15 so that the beam member 141 extends along the moving direction of the support device 14. As a result, the beam member 141 extends while supporting the storage device 13 (and further while supporting the light irradiation device 11 supported by the storage device 13). Further, in parallel with the movement of the support device 14, the control device 2 controls the drive system 12 so that the light irradiation device 11 moves from the second irradiation position to the third irradiation position where the light irradiation device 11 can irradiate the plurality of processing lights EL onto the processing shot region SA3. Thus, in the first embodiment, the support device 14 can self-run while being supported by the object S to be processed. For this reason, the support device 14 may be referred to as a self-running device.

[0149] During the period when the support device 14 is moving (that is, when the beam member 141 that has been reduced is extending), the control device 2 controls a drive system (not shown) that expands and contracts the partition member 132 so that the partition member 132 remains in the first reduced state. As a result, the movement of the support device 14 (that is, the movement of the storage device 13) is not hindered by the contact between the end portion 134 of the partition member 132 and the coating film SF. Further, the coating film SF is not damaged by the contact between the end portion 134 and the coating film SF during the movement of the support device 14. However, if the movement of the support device 14 is not hindered by the contact between the end portion 134 and the coating film SF, at least a part of the end portion 134 may be in contact with the coating film SF at least in a part of the period when the support device 14 is moving. If the coating film SF is not damaged by the contact between the end portion 134 and the coating film SF during the movement of the support device 14, at least a part of the end portion 134 may be in contact with the coating film SF at least in a part of the period when the support device 14 is moving.

[0150] Furthermore, during the period when the support device 14 is moving, the control device 2 controls the drive system 15 so that the front leg member 142 remains in the second reduced state. As a result, the movement of the support device 14 (i.e., the movement of the housing device 13) is not hindered by the contact between the end portion 144 of the front leg member 142 and the coating film SF. Furthermore, the coating film SF is not damaged by the contact between the end portion 144 and the coating film SF during the movement of the support device 14. However, if the movement of the support device 14 is not hindered by the contact between the end portion 144 and the coating film SF, at least a part of the end portion 144 may be in contact with the coating film SF during at least a part of the period when the support device 14 is moving. If the coating film SF is not damaged by the contact between the end portion 144 and the coating film SF during the movement of the support device 14, at least a part of the end portion 144 may be in contact with the coating film SF during at least a part of the period when the support device 14 is moving.

[0151] Furthermore, during the period when the support device 14 is moving, the control device 2 controls the drive system 15 so that the other leg members 142 other than the front leg member 142 among the plurality of leg members 142 remain in the first extended state. As a result, even if the end portion 144 of the front leg member 142 is separated from the coating film SF, the end portions 144 of the other leg members 142 other than the front leg member 142 are in contact with the coating film SF. Therefore, the support device 14 can stand on its own on the coating film SF (or can adhere to the coating film SF so as to be suspended from the coating film SF) in the same manner as when all the end portions 144 of the plurality of leg members 142 are in contact with the coating film SF.

[0152] Furthermore, during the period when the support device 14 is moving, the control device 2 controls the light irradiation device 11 so that the light irradiation device 11 does not irradiate the processing light EL.

[0153] After the housing device 13 is arranged at the second housing position, as shown in FIG. 17, the control device 2 controls a drive system (not shown) that expands and contracts the partition member 132 so that the partition member 132 switches from the first contracted state to the first extended state. As a result, the end portion 134 of the partition member 132 contacts and adheres to the coating film SF. Further, the control device 2 controls the drive system 15 so that the front leg member 142 switches from the second contracted state to the second extended state. As a result, the end portion 144 of the front leg member 142 contacts and adheres to the coating film SF. Here, the extension operation of the partition member 132 and the extension operation of the front leg member 142 may be performed simultaneously or with a time difference.

[0154] Thereafter, as shown in FIG. 18, the control device 2 controls the drive system 15 so that the state of at least a part of the leg members 142 that move with respect to the coating film SF (specifically, as will be described later, the reduction of the extended beam member 141) among the plurality of leg members 142 switches from the second extended state to the second contracted state. The leg members 142 that move with respect to the coating film SF as the extended beam member 141 contracts are typically the leg members 142 located on the rear side in the moving direction of the support device 14 among the plurality of leg members 142. In the example shown in FIG. 18, the leg members 142 located on the rear side in the moving direction of the support device 14 are the leg members 142 located on the -X side. Hereinafter, the leg members 142 located on the rear side in the moving direction of the support device 14 are referred to as "rear leg members 142". As a result, the end portion 144 of the rear leg member 142 separates from the coating film SF.

[0155] Thereafter, as shown in FIG. 19, the control device 2 controls the drive system 15 so that the beam member 141 that has been extended along the moving direction of the support device 14 contracts.

[0156] After the reduction of the beam member 141 is completed, as shown in FIG. 20, the control device 2 controls the drive system 15 so that the rear leg member 142 switches from the second contracted state to the second extended state. As a result, the end portion 144 of the rear leg member 142 contacts and adheres to the coating film SF.

[0157] Thereafter, the control device 2 controls the light irradiation device 11 so that the plurality of processing lights EL scan the processing shot regions SA3 and SA4, in the same manner as when the plurality of processing lights EL scan the processing shot regions SA1 and SA2. Hereinafter, by repeating the same operation, the plurality of processing lights EL are irradiated onto the surface of the coating film SF (particularly, the region of the coating film SF where the riblet structure is to be formed). As a result, a riblet structure by the coating film SF is formed on the workpiece S.

[0158] (1-4) Technical Effects of Machining System SYSa As described above, the processing system SYSa of the first embodiment can form a riblet structure by the coating film SF on the surface of the workpiece S by irradiating the processing light EL onto the workpiece S (particularly, the coating film SF formed on the surface thereof). Therefore, the processing system SYSa can form the riblet structure relatively easily and in a relatively short time as compared with a processing device that forms the riblet structure by scraping the surface of the workpiece S with a cutting tool such as an end mill.

[0159] Furthermore, the processing system SYSa can simultaneously irradiate a plurality of processing lights EL to simultaneously form a plurality of concave structures CP1. Therefore, the throughput regarding the formation of the riblet structure is improved as compared with a processing device that can form only a single concave structure CP1 at a time by irradiating a single processing light EL.

[0160] Furthermore, the processing system SYSa can deflect the plurality of processing lights EL with the galvano mirror 1122 to scan the coating film SF relatively at high speed. Therefore, the throughput regarding the formation of the riblet structure is improved.

[0161] Furthermore, instead of directly processing the object S to be processed, the processing system SYSa can form a re-let structure on the surface of the object S to be processed by processing the coating film SF formed on the surface of the object S to be processed. Therefore, compared with a processing system that forms a re-let structure by newly adding (for example, attaching) a special material for forming the re-let structure to the surface of the object S to be processed (that is, the surface of the coating film SF), an increase in the weight of the object S to be processed due to the formation of the re-let structure can be avoided.

[0162] Furthermore, since the processing system SYSa does not directly process the object S to be processed, the re-let structure can be relatively easily reformed. Specifically, when reforming the re-let structure, first, the re-let structure formed by the coating film SF is once peeled off, and then a new coating film SF is applied. Thereafter, the processing system SYSa can form a new re-let structure by processing the newly applied coating film SF. Therefore, it is relatively easy to cope with the deterioration (for example, breakage, etc.) of the re-let structure by reforming the re-let structure.

[0163] Furthermore, since the processing system SYSa does not directly process the object S to be processed, a re-let structure can also be formed on the surface of the object S to be processed that is difficult to directly process or on which the re-let structure is not originally formed. That is, if the processing system SYSa processes the coating film SF after the coating film SF is applied to the surface of the object S to be processed, the re-let structure can be relatively easily formed.

[0164] When the coating film SF is to be processed after being applied to the object S to be processed, the operation of processing the object S to be processed may include an operation of applying (i.e., forming) the coating film SF to the object S to be processed and an operation of processing the coating film SF (for example, partially removing the coating film SF). The operation of applying the coating film SF to the object S to be processed may be performed by the processing system SYSa. In this case, the processing system SYSa may include a coating device for applying the coating film SF to the object S to be processed. Alternatively, the operation of applying the coating film SF to the object S to be processed may be performed outside the processing system SYSa. For example, the operation of applying the coating film SF to the object S to be processed may be performed by a coating device outside the processing system SYSa.

[0165] Furthermore, the processing system SYSa can form a re-riblet structure with the coating film SF. The coating film SF usually has relatively high durability against the external environment (for example, at least one of heat, light, and wind, etc.). Therefore, the processing system SYSa can relatively easily form a re-riblet structure with relatively high durability.

[0166] Furthermore, in the first embodiment, the optical path of the processing light EL between the final optical element of the optical system 112 and the coating film SF is included in the accommodation space SP. Therefore, compared with a processing system in which the optical path of the processing light EL is not included in the accommodation space SP (that is, it is open to the open space), it is possible to appropriately prevent the processing light EL irradiated on the coating film SF (or scattered light or reflected light, etc. of the processing light EL from the coating film SF) from propagating (in other words, scattering) to the surroundings of the processing system SYSa. Furthermore, it is possible to appropriately prevent unnecessary substances generated by the irradiation of the processing light EL from propagating (in other words, scattering) to the surroundings of the processing system SYSa.

[0167] Furthermore, in the first embodiment, the light irradiation device 11 is supported by the support device 14 that can move on the coating film SF. Therefore, the processing system SYSa can relatively easily process the coating film SF that spreads over a relatively wide range. That is, the processing system SYSa can form a re-let structure by the coating film SF over a relatively wide range on the surface of the object to be processed S. Furthermore, since the processing system SYSa does not need to move the object to be processed S, a re-let structure can be formed relatively easily even on the surface of a relatively large or heavy object to be processed S.

[0168] Furthermore, the processing system SYSa can use the exhaust device 16 to suck the unnecessary substances generated by the irradiation of the processing light EL to the outside of the accommodation space SP. Therefore, the irradiation of the processing light EL on the coating film SF is hardly hindered by unnecessary substances. Therefore, compared with a processing system that does not include the exhaust device 16 (that is, the irradiation of the processing light EL on the coating film SF may be hindered by unnecessary substances), the irradiation accuracy of the processing light EL is improved. As a result, the formation accuracy of the re-let structure is improved.

[0169] Furthermore, the processing device 1 can use the gas supply device 17 to prevent the adhesion of dirt to the optical surface 1124 (that is, the optical surface on the accommodation space SP side of the final optical element of the optical system 112). Therefore, compared with a processing device that does not include the gas supply device 17, the possibility that the irradiation of the processing light EL on the coating film SF is hindered by the dirt adhering to the optical surface 1124 is reduced. Therefore, the irradiation accuracy of the processing light EL is improved. As a result, the formation accuracy of the re-let structure is improved.

[0170] In addition, in the first embodiment, the processing apparatus 1 can move the light irradiation device 11 with respect to the coating film SF by using the drive system 12 including the first drive system 121 and the second drive system 122. Therefore, the processing apparatus 1 can appropriately move the light irradiation device 11 with respect to the coating film SF. Specifically, if the light irradiation device 11 is moved only by using the first drive system 121 (that is, without using the second drive system 122), it becomes difficult to increase the positioning accuracy of the light irradiation device 11 accordingly. This is because the positioning accuracy of the light irradiation device 11 by the first drive system 121 is the accuracy obtained by integrating the movement accuracies (that is, the swing accuracy or the rotation accuracy) of a plurality of joints of the first drive system 121. However, in the first embodiment, even when the positioning accuracy of the light irradiation device 11 by the first drive system 121 cannot be increased accordingly, the positioning accuracy of the light irradiation device 11 is increased by the second drive system 122 having higher positioning accuracy than the first drive system 121. That is, by using the second drive system 122, the positioning accuracy of the light irradiation device 11 as a whole of the drive system 12 including the first drive system 121 and the second drive system 122 can be made higher than the positioning accuracy of the light irradiation device 11 by the first drive system 121. Therefore, the processing apparatus 1 can appropriately (for example, accurately) move the light irradiation device 11 with respect to the coating film SF as compared with the case where the second drive system 122 is not provided.

[0171] Further, since the drive system 12 includes, in addition to the second drive system 122, the first drive system 121 that can make the movement range of the light irradiation device 11 larger than that of the second drive system 122, there is also an advantage that the movement range of the light irradiation device 11 becomes larger as compared with the drive device of the comparative example including the second drive system 122 without including the first drive system 121.

[0172] That is, in the first embodiment, the processing system SYSa can increase the movement range of the light irradiation device 11 appropriately mainly by using the first drive system 121, and can increase the movement accuracy of the light irradiation device 11 appropriately mainly by using the second drive system 122. That is, the processing system SYSa can achieve both the enlargement of the movement range of the light irradiation device 11 and the improvement of the movement accuracy of the light irradiation device 11.

[0173] In addition, in the first embodiment, the necessity of increasing the positioning accuracy of the light irradiation device 11 by the first drive system 121 is reduced. Therefore, it is not necessary to increase the rigidity of the first drive system 121 (for example, the rigidity of the arm member 12121) in order to increase the positioning accuracy of the light irradiation device 11 by the first drive system 121. As a result, the first drive system 121 can be lightened. Furthermore, with the lightening of the first drive system 121, it is also possible to reduce the size of the actuator 12123 for moving the arm member 12121.

[0174] Also, in the first embodiment, the possibility that vibrations accompanying the movement of the first drive system 121 are transmitted to the light irradiation device 11 can be reduced, or the amount of vibration of the light irradiation device 11 can be made smaller than the amount of vibration accompanying the movement of the first drive system 121. As a result, the settling time of the light irradiation device 11 can be shortened, and the total throughput can be improved. Alternatively, since the deterioration of the positioning accuracy due to the vibration of the light irradiation device 11 can be reduced, the formation accuracy of the reticle structure can be improved.

[0175] And in the first embodiment, since the arm drive system 1212 is controlled based on the measurement result of the position measurement device 18, the positioning accuracy of the light irradiation device 11 can be increased.

[0176] (2) Machining System SYSb of the Second Embodiment Subsequently, with reference to FIG. 21, the processing system SYS of the second embodiment (hereinafter, the processing system SYS of the second embodiment is referred to as "processing system SYSb") will be described. FIG. 21 is a cross-sectional view schematically showing the overall structure of the processing system SYSb of the second embodiment.

[0177] As shown in FIG. 21, the processing system SYSb of the second embodiment is different in that it includes a processing device 1b instead of the processing device 1 as compared with the processing system SYSa of the first embodiment. Other features of the processing system SYSb may be the same as those of the processing system SYSa. The processing device 1b is different in that it includes a position measuring device 18b instead of the position measuring device 18 as compared with the processing device 1. Other features of the processing device 1b may be the same as those of the processing device 1.

[0178] Similar to the position measuring device 18, the position measuring device 18b measures the relative positional relationship between the coating film SF and the light irradiation device 11. The position measuring device 18b measures the position of the light irradiation device 11 with respect to a predetermined reference position as compared with the above-described position measuring device 18. Specifically, the position measuring device 18b measures the position of the light irradiation device 11 in a reference coordinate system in which the reference position is defined. The reference position may be, for example, the origin of the reference coordinate system. As the reference coordinate system, for example, a measurement coordinate system used by the position measuring device 18b to measure the relative positional relationship between the coating film SF and the light irradiation device 11 is used. However, other coordinate systems may be used as the reference coordinate system. If the position of the coating film SF in the reference coordinate system is known, the relative positional relationship between the coating film SF and the light irradiation device 11 can be obtained by measuring the relative positional relationship between the reference position in the reference coordinate system and the light irradiation device 11 by the position measuring device 18b. That is, it can be said that the position measuring device 18b indirectly measures the relative positional relationship between the coating film SF and the light irradiation device 11.

[0179] In order to measure the position of the light irradiation device 11 with respect to the reference position, the position measuring device 18b includes an index member 181b and an index measuring device 182b.

[0180] The index member 181b is a member that serves as an index when measuring the position of the light irradiation device 11 with respect to the reference position. The index member 181b is arranged at a position fixed with respect to the light irradiation device 11 (particularly, the optical system 112). The index member 181b is arranged at a position where its relative position with respect to the light irradiation device 11 is fixed. The index member 181b is arranged at a position where the relative position between the light irradiation device 11 and the index member 181b does not change even if the drive system 12 moves the light irradiation device 11. For example, FIG. 21 shows an example in which the index member 181b is arranged on the mounting member 19 to which the light irradiation device 11 is attached. However, the index member 181b may be attached to a member different from the mounting member 19. For example, the index member 181b may be attached to the light irradiation device 11. For example, the index member 181b may be attached to the above-described housing 114 (see FIG. 4).

[0181] The index measurement device 182b measures the position of the index member 181b. The index measurement device 182b may be any measurement device as long as it can measure the position of the index measurement member 181b. The index measurement device 182b may be arranged at any position as long as it can measure the position of the index measurement member 181b.

[0182] The output from the index measurement device 182b (that is, the measurement result of the index measurement device 182b) will include information regarding the position of the light irradiation device 11 with respect to the reference position. Specifically, the measurement result of the index measurement device 182b includes information regarding the position of the index member 181b with respect to the reference position. That is, the measurement result of the index measurement device 182b includes information regarding the position of the index member 181b in the reference coordinate system. Here, since the index member 181b is arranged at a position fixed with respect to the light irradiation device 11, the information regarding the position of the index member 181b in the reference coordinate system substantially includes information regarding the position of the light irradiation device 11 in the reference coordinate system. Therefore, the control device 2 can appropriately specify the position of the light irradiation device 11 with respect to the reference position.

[0183] As an example of the index member 181b, a marker can be mentioned. The marker may include a marker distinguishable by a physical shape (for example, an engraving, a convex portion, or a concave portion). The marker may include a marker distinguishable by visual features (for example, color, etc.). The marker may include a marker distinguishable by light emitted by the marker itself (for example, an LED (Light Emitting Diode), etc.). In this case, the index measurement device 182b may include an imaging device (for example, a camera) capable of imaging the marker. Alternatively, the index measurement device 182b may include an irradiation device that irradiates the marker with measurement light (or any measurement beam) and a light receiving device that receives the measurement light from the marker.

[0184] As an example of the index member 181b, a transmission device capable of transmitting a signal can be mentioned. As an example of the signal, at least one of a radio wave signal and an optical signal can be mentioned. In this case, the index measurement device 182b may include a receiving device capable of receiving the signal.

[0185] The position measurement device 18b may include a single index member 181b. In this case, based on the measurement result of the index measurement device 182b (that is, information regarding the position of the single index member 181b), the control device 2 can specify the position of the light irradiation device 11 in each of the X-axis direction, Y-axis direction, and Z-axis direction. The position measurement device 18b may include two index members 181b. In this case, based on the measurement result of the index measurement device 182b (that is, information regarding the positions of the two index members 181b), in addition to the position of the light irradiation device 11 in each of the X-axis direction, Y-axis direction, and Z-axis direction, the control device 2 can specify the position of the light irradiation device 11 in the rotational direction corresponding to the θZ direction (that is, the amount of rotation of the light irradiation device 11 around the Z-axis). The position measurement device 18b may include three or more index members 181b. In this case, based on the measurement result of the index measurement device 182b (that is, information regarding the positions of the three or more index members 181b), in addition to the position of the light irradiation device 11 in each of the X-axis direction, Y-axis direction, and Z-axis direction, the control device 2 can specify the positions of the light irradiation device 11 in the respective rotational directions of the θX direction, θY direction, and θZ direction (that is, the amount of rotation of the light irradiation device 11 around each of the X-axis, Y-axis, and Z-axis).

[0186] In addition to or instead of the index member 181b, a reflecting member that reflects the measurement light from the (index) measurement device 182b may be provided. In this case, the reflecting member may be a corner cube reflector or a cat's eye reflector.

[0187] Further, the position measuring device 18b may measure the position in the reference coordinate system of the portion that becomes the feature point on the coating film SF (on the object S to be processed). Here, if the 3D data of the object S to be processed (coating film SF) is used, the coordinates of the feature point in the coordinate system of the 3D data are known. By matching the coordinates of the feature point in the reference coordinate system with the coordinates of the feature point in the coordinate system of the 3D data, the position measuring device 18b can obtain the positional relationship between an arbitrary position of the object S to be processed (coating film SF) and the index member 181b. Incidentally, the feature point of a certain object S to be processed may include a point at a characteristic position among the three-dimensional shapes of the objects indicated by the point cloud data, which is a set of points indicating positions on the surface (coating film SF) of the object S to be processed. As an example of the feature point, at least one of the vertex, corner, boundary, point located on the most +Z side, point located on the most -Z side, point located on the most +X side, point located on the most -X side, point located on the most +Y side, and point located on the most -Y side in the object S to be processed may be cited.

[0188] Incidentally, a plurality of position measuring devices 18b may be provided. In this case, the measurement axes of the respective position measuring devices 18b may intersect each other.

[0189] Further, the position measuring device 18b may measure the position of the light irradiation device 11 in a non-contact manner (for example, at least one of a light detection method, a sound wave detection method, and a radio wave detection method).

[0190] Such a processing system SYSb of the second embodiment can enjoy the same effects as those enjoyed by the processing system SYSa of the first embodiment described above.

[0191] (3) Machining System SYSc of the Third Embodiment Subsequently, with reference to FIG. 22, a processing system SYS of the third embodiment (hereinafter, the processing system SYS of the third embodiment is referred to as "processing system SYSc") will be described. FIG. 22 is a cross-sectional view schematically showing the overall structure of the processing system SYSc of the third embodiment.

[0192] As shown in FIG. 22, the processing system SYSc of the third embodiment is different from the processing system SYSa of the first embodiment in that it includes a processing device 1c instead of the processing device 1. Other features of the processing system SYSc may be the same as other features of the processing system SYSa. The processing device 1c is different from the processing device 1 in that, in addition to the position measuring device 18, it further includes the position measuring device 18b described in the second embodiment. Other features of the processing device 1c may be the same as other features of the processing device 1.

[0193] The control device 2 may control the drive system 12 (that is, the first drive system 121 and the second drive system 122) based on the measurement results of at least one of the position measuring devices 18 and 18b. As a result, the processing system SYSb of the third embodiment can enjoy the same effects as those that can be enjoyed by each of the processing system SYSa of the first embodiment and the processing system SYSb of the second embodiment described above.

[0194] However, when the processing system SYSc includes the position measuring devices 18 and 18b (that is, a plurality of position measuring devices), during the process of performing the processing operation, the relative position between the measurement reference position of the position measuring device 18 and the measurement reference position of the position measuring device 18b may change. Specifically, the relative position between the measurement reference position of the position measuring device 18 and the measurement reference position of the position measuring device 18b may deviate from the original ideal relative position. As a result, when the drive system 12 is controlled based on the measurement results of the position measuring device 18 to form a certain structure on the coating film SF, the structure formed on the coating film SF may not match the structure formed on the coating film SF when the drive system 12 is controlled based on the measurement results of the position measuring device 18b to form the same structure. Therefore, in the third embodiment, the control device 2 may control the drive system 12 based on information regarding the relative position between the measurement reference position of the position measuring device 18 and the measurement reference position of the position measuring device 18b, in addition to the measurement results of at least one of the position measuring devices 18 and 18b.

[0195] Specifically, the control device 2 first acquires information regarding the relative position between the measurement reference position of the position measurement device 18 and the measurement reference position of the position measurement device 18b. To acquire the information regarding the relative position between the measurement reference position of the position measurement device 18 and the measurement reference position of the position measurement device 18b, the control device 2 may control the processing device 1c to perform, for example, test processing (specifically, form a test structure (hereinafter referred to as “test structure”) ST). Specifically, the control device 2 may control the processing device 1c to form the test structure ST by controlling the drive system 12 based on the measurement result of the position measurement device 18 and to form the same test structure ST by controlling the drive system 12 based on the measurement result of the position measurement device 18b. At this time, the control device 2 may control the processing device 1c to form the test structure ST on the actual coating film SF. Alternatively, after a coating for test processing is applied on the coating film SF by a coating device (not shown), the control device 2 may control the processing device 1c to form the test structure ST on the applied coating for test processing. Alternatively, the control device 2 may control the processing device 1c to form the test structure ST on a test object (i.e., an object different from the object SF to be processed) for forming the test structure ST.

[0196] As a result, as shown in FIGS. 23(a) and 23(b), on the coating film SF (or the test film or the test object), there are formed a test structure ST (hereinafter referred to as "test structure ST1") formed when the drive system 12 is controlled based on the measurement result of the position measuring device 18, and a test structure ST (hereinafter referred to as "test structure ST2") formed when the drive system 12 is controlled based on the measurement result of the position measuring device 18b. Note that FIG. 23(a) is a plan view showing the test structure ST1 formed when the drive system 12 is controlled based on the measurement result of the position measuring device 18. FIG. 23(b) is a plan view showing the test structure ST2 formed when the drive system 12 is controlled based on the measurement result of the position measuring device 18b. Note that the test structures ST1 and ST2 shown in FIGS. 23(a) and 23(b) are line-and-space structures extending in a one-dimensional direction, but the test structure is not limited to this. For example, it may be a structure extending in a two-dimensional direction (as an example, one or more cross shapes or box shapes).

[0197] Thereafter, the control device 2 measures the two formed test structures ST1 and ST2 using at least one of the position measuring devices 18 and 18b (for example, an imaging device) or an imaging device (not shown). Thereafter, the control device 2 acquires information regarding the formation positions of the test structures ST1 and ST2 based on the measurement results of at least one of the position measuring devices 18 and 18b. Here, if the relative position between the measurement reference position of the position measuring device 18 and the measurement reference position of the position measuring device 18b has not changed (that is, if the relative position between the measurement reference position of the position measuring device 18 and the measurement reference position of the position measuring device 18b has not deviated from the original ideal relative position), the relative formation position of the test structure ST1 within the region where the test structure ST1 is formed should match the relative formation position of the test structure ST2 within the region where the test structure ST2 is formed. On the other hand, if the relative position between the measurement reference position of the position measuring device 18 and the measurement reference position of the position measuring device 18b has changed (that is, if the relative position between the measurement reference position of the position measuring device 18 and the measurement reference position of the position measuring device 18b has deviated from the original ideal relative position), there is a high possibility that the relative formation position of the test structure ST1 within the region where the test structure ST1 is formed does not match the relative formation position of the test structure ST2 within the region where the test structure ST2 is formed. Incidentally, FIGS. 23(a) and 23(b) show an example where the relative formation position of the test structure ST1 does not match the relative formation position of the test structure ST2 within the region where the test structure ST2 is formed. Therefore, the information regarding the formation positions of the test structures ST1 and ST2 substantially includes information regarding the relative position between the measurement reference position of the position measuring device 18 and the measurement reference position of the position measuring device 18b.

[0198] As a result, the control device 2 can control the drive system 12 so that the influence caused by the change in the relative position between the measurement reference position of the position measurement device 18 and the measurement reference position of the position measurement device 18b is reduced based on the information regarding the formation positions of the test structures ST1 and ST2. For example, the control device 2 may correct at least one of the measurement results of the position measurement devices 18 and 18b so that the influence caused by the change in the relative position between the measurement reference position of the position measurement device 18 and the measurement reference position of the position measurement device 18b is reduced, and control the drive system 12 based on the corrected measurement results. For example, when the control device 2 controls the drive system 12 based on at least one of the measurement results of the position measurement devices 18 and 18b, the movement mode (for example, at least one of the movement direction and the movement amount) of the light irradiation device 11 by the drive system 12 may be controlled so that the influence caused by the change in the relative position between the measurement reference position of the position measurement device 18 and the measurement reference position of the position measurement device 18b is reduced. For example, the control device 2 may control the irradiation position of one or more processing lights EL on the coating film SF (workpiece S) based on at least one of the measurement results of the position measurement devices 18 and 18b to reduce the influence caused by the change in the relative position between the measurement reference position of the position measurement device 18 and the measurement reference position of the position measurement device 18b. At this time, the irradiation position of the processing light EL may be at least one of the position within the surface of the coating film SF (workpiece S) and the position in the direction intersecting the surface. In this case, the processing data (data including the movement path of the irradiation position of the processing light EL, the intensity of the processing light EL, etc.) used by the light irradiation device 11 may be corrected using at least one of the measurement results of the position measurement devices 18 and 18b.

[0199] Alternatively, considering that the test structure ST is formed due to changes in the characteristics of the coating film SF (or a film or object for testing) by the irradiation of the processing light EL, instead of actually forming the test structure ST, the control device 2 may control the processing device 1c to irradiate the processing light EL for forming the test structure ST onto the sensitive member PE whose characteristics are changed by the irradiation of the processing light EL. Specifically, based on the measurement result of the position measurement device 18, the control device 2 irradiates the processing light EL onto the sensitive member PE while controlling the drive system 12 in the same manner as when forming the test structure ST, and based on the measurement result of the position measurement device 18b, controls the processing device 1c to irradiate the processing light EL onto the sensitive member PE while controlling the drive system 12 in the same manner as when forming the same test structure ST. Alternatively, after the sensitive member PE (for example, a sheet-like sensitive member PE) is attached onto the coating film SF by an attachment device (not shown), the control device 2 may control the processing device 1c to irradiate the attached sensitive member PE with the processing light EL. Note that the sensitive member PE does not need to be attached to the coating film SF as long as the positional relationship with the coating film SF does not change between the irradiation of the processing light EL and the measurement of the test structure ST. For example, the sensitive member PE may be placed on the coating film SF.

[0200] As a result, as shown in FIGS. 24(a) and 24(b), a characteristic change pattern PV whose characteristics are changed by the irradiation of the processing light EL is formed on the sensitive member PE. Note that FIG. 24(a) is a plan view showing the characteristic change pattern PV (hereinafter referred to as "characteristic change pattern PV1") formed when the processing light EL is irradiated while controlling the drive system 12 in the same manner as when forming the test structure ST based on the measurement result of the position measurement device 18. FIG. 24(b) is a plan view showing the characteristic change pattern PV (hereinafter referred to as "characteristic change pattern PV2") formed when the processing light EL is irradiated while controlling the drive system 12 in the same manner as when forming the test structure ST based on the measurement result of the position measurement device 18b.

[0201] Thereafter, the control device 2 measures the two formed characteristic change patterns PV1 and PV2 using at least one of the position measuring devices 18 and 18b (for example, the imaging device) or an imaging device (not shown). Thereafter, the control device 2 acquires information regarding the formation positions of the characteristic change patterns PV1 and PV2 based on the measurement result of at least one of the position measuring devices 18 and 18b. Here, if the relative position between the measurement reference position of the position measuring device 18 and the measurement reference position of the position measuring device 18b has not changed, the relative formation position of the characteristic change pattern PV1 within the region where the characteristic change pattern PV1 is formed should match the relative formation position of the characteristic change pattern PV2 within the region where the characteristic change pattern PV2 is formed. On the other hand, if the relative position between the measurement reference position of the position measuring device 18 and the measurement reference position of the position measuring device 18b has changed, it is highly likely that the relative formation position of the characteristic change pattern PV1 within the region where the characteristic change pattern PV1 is formed and the relative formation position of the characteristic change pattern PV2 within the region where the characteristic change pattern PV2 is formed do not match. Incidentally, FIGS. 24(a) and 24(b) show an example where the relative formation position of the characteristic change pattern PV1 and the relative formation position of the test structure ST2 within the region where the characteristic change pattern PV2 is formed match. Therefore, the information regarding the formation positions of the characteristic change patterns PV1 and PV2 substantially includes information regarding the relative position between the measurement reference position of the position measuring device 18 and the measurement reference position of the position measuring device 18b.

[0202] As a result, based on the information regarding the formation positions of the characteristic change patterns PV1 and PV2, the control device 2 can control the drive system 12 so that the influence caused by the change in the relative position between the measurement reference position of the position measuring device 18 and the measurement reference position of the position measuring device 18b is reduced.

[0203] Incidentally, by measuring the line widths of the characteristic change patterns PV1 and PV2, information regarding the irradiation position of the processing light EL in the direction intersecting the surface of the coating film SF (the object S to be processed) can be obtained.

[0204] Also, a plurality of position measuring devices 18 and a plurality of position measuring devices 18b may be provided. In this case, the measurement axes of the respective position measuring devices 18 may be in a relationship of intersecting (or twisting) with each other, or may be parallel (or coaxial) with each other. And the measurement axes of the respective position measuring devices 18b may be in a relationship of intersecting with each other.

[0205] (4) Machining System SYSd of the Fourth Embodiment Subsequently, with reference to FIG. 25, a processing system SYS of the fourth embodiment (hereinafter, the processing system SYS of the fourth embodiment is referred to as "processing system SYSd") will be described. FIG. 25 is a perspective view schematically showing the structure of the processing system SYSd of the fourth embodiment.

[0206] As shown in FIG. 25, the processing system SYSd of the fourth embodiment is different in that it includes a processing device 1d instead of the processing device 1 as compared with the processing system SYSa of the first embodiment. Other features of the processing system SYSd may be the same as other features of the processing system SYSa. The processing device 1d is different in that it includes a support device 14d instead of the support device 14 as compared with the processing device 1. Other features of the processing device 1d may be the same as other features of the processing device 1. Note that in FIG. 25, in order to emphasize the readability of the drawing, the description of some of the components included in the processing system SYSd (for example, the housing device 13, the drive system 15, the exhaust device 16, the gas supply device 17, and the control device 2) is omitted.

[0207] The support device 14d supports the housing device 13, similarly to the support device 14. That is, the support device 14d supports the drive system 12 and the light irradiation device 11 via the housing device 13, similarly to the support device 14. The support device 14d is different from the support device 14 that can travel automatically while being supported by the workpiece SF in that the support device 14d can travel automatically without being supported by the workpiece SF. The support device 14d is different from the support device 14 that can travel automatically while being in contact with the workpiece SF in that the support device 14d can travel automatically without contacting the workpiece SF (that is, without interference). Other features of the support device 14d may be the same as other features of the support device 14.

[0208] In order to travel automatically without interfering with the workpiece S, the support device 14d includes a gantry member 141d and a moving block 142d instead of the beam member 141 and the leg member 142 included in the support device 14.

[0209] The gantry member 141d is a portal-shaped member in which a beam member 1412d having a linear shape is arranged on the upper part of a plurality of leg members 1411d having a linear shape. In the example shown in FIG. 25, the plurality of leg members 1411d are linear members extending in the Z-axis direction, and the beam member 1412d is a linear member extending in the X-axis direction. The gantry member 141d has a size large enough to at least partially surround the workpiece SF without contacting the workpiece S. Specifically, the gantry member 141d may have a size large enough that the plurality of leg members 1411d can sandwich the workpiece S therebetween. The gantry member 141d may have a size large enough that the beam member 1412d can be positioned above the workpiece S. For example, in the example shown in FIG. 25, the gantry member 141d has a size large enough to straddle the fuselage of an aircraft, which is a specific example of the workpiece S.

[0210] The gantry member 141d is capable of self-propelling along a rail (not shown) formed on a support surface (or other surface) on which the object S to be processed is placed. In the example shown in Fig. 25, the gantry member 141d is capable of self-propelling along a rail (not shown) extending in the Y-axis direction. That is, in the example shown in Fig. 25, the gantry member 141d is capable of self-propelling along the Y-axis direction.

[0211] The moving block 142d is attached to the beam member 1412d of the gantry member 141d. The moving block 142d is attached to the beam member 1412d so as to be movable along the beam member 1412d. For example, the moving block 142d may be attached to a rail (not shown) formed on the beam member 1412d so as to be movable along the rail. In the example shown in Fig. 25, since the beam member 1412d is a member extending in the X-axis direction, the moving block 142d is movable along the X-axis direction. The moving block 142d is further movable along a direction intersecting the direction in which the gantry member 141d self-propels and the direction in which the beam member 1412d extends. In the example shown in Fig. 25, the moving block 142d is movable along the Z-axis direction intersecting the Y-axis direction in which the gantry member 141d self-propels and the X-axis direction in which the beam member 1412d extends.

[0212] The drive system 12 and the light irradiation device 11 are attached to the moving block 142d via a housing device 13 (not shown). That is, the moving block 142d supports the drive system 12 and the light irradiation device 11 via a housing device 13 (not shown). Therefore, due to the movement of the gantry member 141d and the moving block 142d, the light irradiation device 11 also moves. Specifically, due to the movement of the gantry member 141d along the Y-axis direction, the light irradiation device 11 moves along the Y-axis direction. Due to the movement of the moving block 142d along each of the X-axis direction and the Z-axis direction, the light irradiation device 11 moves along the X-axis direction and the Z-axis direction.

[0213] Furthermore, the gantry member 141d may include a fixing member that fixes the gantry member 141d to the support surface in order to reduce the displacement of the light irradiation device 11 during processing of the object to be processed S.

[0214] Such a processing system SYSd of the fourth embodiment can enjoy the same effects as those that the processing system SYSa of the first embodiment described above can enjoy.

[0215] Furthermore, the gantry member 141d may be capable of self-running along each of a plurality of different directions. The moving block 142d may be attached to at least one leg member 1411d in addition to or instead of the beam member 1412d. The moving block 142d may be attached to at least one leg member 1411d so as to be movable along at least one leg member 1411d. In addition to or instead of moving along the beam member 1412d, the moving block 142d may move along at least one leg member 1411d. The moving block 142d may be movable along a single direction. The moving block 142d may not be movable.

[0216] The processing system SYSd of the fourth embodiment may further include at least one constituent element peculiar to the processing system SYSb of the second embodiment to the processing system SYSd of the third embodiment described above. The constituent elements peculiar to the processing system SYSb of the second embodiment include the constituent elements related to the position measuring device 18b. The constituent elements peculiar to the processing system SYSc of the third embodiment include the constituent elements related to the position measuring devices 18 and 18b.

[0217] (5) Machining System SYSe of the Fifth Embodiment Next, with reference to FIGS. 26 to 29, a processing system SYS of the fifth embodiment (hereinafter, the processing system SYS of the fifth embodiment is referred to as "processing system SYSe") will be described. FIG. 26 is a perspective view schematically showing the structure of the processing system SYSe of the fifth embodiment. FIG. 27 is a front view schematically showing the structure of the processing system SYSe of the fifth embodiment. FIG. 28 is a side view schematically showing the structure of the processing system SYSe of the fifth embodiment. FIG. 29 is a front view showing an enlarged part of the structure of the processing system SYSe of the fifth embodiment.

[0218] As shown in FIGS. 26 to 29, the processing system SYSe of the fifth embodiment is different from the processing system SYSd of the fourth embodiment in that it includes a processing device 1e instead of the processing device 1. Other features of the processing system SYSe may be the same as other features of the processing system SYSd. The processing device 1e is different from the processing device 1d in that it includes a support device 14e instead of the support device 14d. Other features of the processing device 1e may be the same as other features of the processing device 1d. In FIGS. 26 to 29, in order to emphasize the readability of the drawings, the description of some components included in the processing system SYSe (for example, the housing device 13, the drive system 15, the exhaust device 16, the gas supply device 17, and the control device 2) is omitted.

[0219] The support device 14e supports the housing device 13 in the same manner as the support device 14d. That is, the support device 14e supports the drive system 12 and the light irradiation device 11 via the housing device 13 in the same manner as the support device 14d. The support device 14e is capable of self-running without being supported by the workpiece SF in the same manner as the support device 14d. The support device 14e is different from the support device 14d in that it includes an arch member 141e and a moving block 142e instead of the gantry member 141d and the moving block 142d. Other features of the support device 14e may be the same as other features of the support device 14d.

[0220] The arch member 141e is an arch-shaped member in which a beam member 1412e having a curved shape (for example, an arch shape) is disposed on the upper portions of a plurality of leg members 1411e having a linear shape. In the examples shown in FIGS. 26 to 29, the plurality of leg members 1411e are linear members extending in the Z-axis direction, and the beam member 1412e is a curved member extending along the X-axis direction and having a position in the Z-axis direction (that is, height) that changes according to the position in the X-axis direction. The arch member 141e has a size large enough to at least partially surround the workpiece SF without contacting the workpiece S. Specifically, the arch member 141e may have a size large enough for the plurality of leg members 1411e to sandwich the workpiece S therebetween. The arch member 141e may have a size large enough for the beam member 1412e to be positioned above the workpiece S. For example, in the examples shown in FIGS. 26 to 29, the arch member 141e has a size large enough to straddle the fuselage of an aircraft, which is a specific example of the workpiece S.

[0221] Similar to the gantry member 141d of the fourth embodiment, the arch member 141e is capable of self-propelling along a rail (not shown) formed on a support surface (or other surface) on which the workpiece S is disposed. In the example shown in FIG. 26, the arch member 141e is capable of self-propelling along a rail (not shown) extending in the Y-axis direction, for example. That is, in the example shown in FIG. 26, the arch member 141e is capable of self-propelling along the Y-axis direction. However, the arch member 141e may be capable of self-propelling along each of a plurality of different directions.

[0222] The moving block 142e is attached to the arch member 141e. For example, the moving block 142e may be attached to the beam member 1412e of the arch member 141e. For example, the moving block 142e may be attached to at least one leg member 1411e of the arch member 141e. The moving block 142e is attached to the arch member 141e so as to be movable along the arch member 141e. For example, the moving block 142e may be attached to a rail 143e (see FIG. 29) formed on the arch member 141e so as to be movable along the rail 143e. The rail 143e is formed on the beam member 1412e of the arch member 141e. The rail 143e may be formed on at least one leg member 1411e of the arch member 141e. In the example shown in FIGS. 26 to 29, since the beam member 1412d is a curved member that extends along the X-axis direction and the position in the Z-axis direction (i.e., height) changes according to the position in the X-axis direction, the moving block 142e is movable along the X-axis direction and the Z-axis direction.

[0223] A drive system 12 and a light irradiation device 11 are attached to the moving block 142e via a housing device 13 (not shown). That is, the moving block 142e supports the drive system 12 and the light irradiation device 11 via a housing device 13 (not shown). Therefore, the light irradiation device 11 also moves due to the movement of the arch member 141e and the moving block 14e. Specifically, due to the movement of the arch member 141e along the Y-axis direction, the light irradiation device 11 moves along the Y-axis direction. Due to the movement of the moving block 142e along each of the X-axis direction and the Z-axis direction, the light irradiation device 11 moves along the X-axis direction and the Z-axis direction. Incidentally, in the example shown in FIGS. 26 to 29, the drive system 12 does not include a first drive system 121, but the drive system 12 may include a first drive system 121.

[0224] Such a processing system SYSe of the fifth embodiment can enjoy the same effects as those that the processing system SYSd of the fourth embodiment described above can enjoy.

[0225] Similar to the processing system SYSd of the fourth embodiment, the processing system SYSe of the fifth embodiment may further include configuration requirements specific to at least one of the processing system SYSb of the second embodiment and the processing system SYSc of the third embodiment described above.

[0226] (6) Machining System SYSf of the Sixth Embodiment Subsequently, the processing system SYS of the sixth embodiment (hereinafter, the processing system SYS of the sixth embodiment is referred to as "processing system SYSf") will be described. The processing system SYSf of the sixth embodiment is different from the processing system SYSa of the first embodiment in that it includes a processing device 1f instead of the processing device 1. Other features of the processing system SYSf may be the same as other features of the processing system SYSa. The processing device 1f is different from the processing device 1 in that it includes a drive system 12f instead of the drive system 12. Other features of the processing device 1f may be the same as other features of the processing device 1. Therefore, hereinafter, the drive system 12f of the sixth embodiment will be described with reference to FIGS. 30 and 31. Each of FIGS. 30 and 31 is a cross-sectional view showing the structure of the drive system 12f of the sixth embodiment.

[0227] As shown in FIGS. 30 and 31, the drive system 12f is different from the drive system 12 in that it includes a plurality of second drive systems 122. FIG. 30 shows an example in which the drive system 12f includes two second drive systems 122, but the drive system 12f may include three or more second drive systems 122. Other features of the drive system 12f may be the same as other features of the drive system 12. Note that FIG. 30 shows an example in which the second drive system 122 is attached to the tip arm member 12124 of the first drive system 121 via the attachment member 1213. However, as described above, the second drive system 122 may be directly attached to the tip arm member 12124.

[0228] The plurality of second drive systems 122 may be arranged such that the direction of the elastic force applied by the air spring 1223 of one of the plurality of second drive systems 122 is different from the direction of the elastic force applied by the air spring 1223 of another second drive system 122 among the plurality of second drive systems 122. For example, in the examples shown in FIGS. 30 and 31, the air spring 1223#1 of the second drive system 122#1 is arranged to apply an elastic force along the X-axis direction, and the air spring 1223#2 of the second drive system 122#2 is arranged to apply an elastic force along the Z-axis direction. In this case, at least one air spring 1223 among the plurality of second drive systems 122 may be arranged to apply an elastic force along a direction including a component in the gravitational direction. In the examples shown in FIGS. 30 and 31, the air spring 1223#2 of the second drive system 122#2 is arranged to apply an elastic force along the Z-axis direction, which is a direction including a component in the gravitational direction.

[0229] However, as shown in FIGS. 32 and 33, depending on the movement mode of the light irradiation device 11 by the drive system 12, the posture of the light irradiation device 11 may change within the coordinate system composed of the X-axis, Y-axis, and Z-axis (that is, at least one of the rotation amounts around the X-axis, Y-axis, and Z-axis) may change. Note that FIG. 32 is a front view showing the light irradiation device 11 whose posture has changed so as to irradiate the processing light EL obliquely upward from obliquely below the aircraft which is the object S to be processed, and FIG. 33 is a cross-sectional view showing a plurality of second drive systems 122 connecting the light irradiation device 11 shown in FIG. 32 and the first drive system 121. As a result, as shown in FIGS. 32 and 33, within the coordinate system composed of the X-axis, Y-axis, and Z-axis, the direction of the elastic force applied by the air spring 1223 may change. In the sixth embodiment, the plurality of second drive systems 122 may be arranged such that even when the posture of the light irradiation device 11 changes, the direction of the elastic force applied by the air spring 1223 of one second drive system 122 is different from the direction of the elastic force applied by the air spring 1223 of the other second drive systems 122. For example, the plurality of second drive systems 122 may be arranged such that the direction in which one second drive system 122 connects the light irradiation device 11 and the first drive system 121 is different from the direction in which the other second drive systems 122 connect the light irradiation device 11 and the first drive system 121. Further, the air spring 1223 of each second drive system 122 may apply an elastic force along the direction in which each second drive system 122 connects the light irradiation device 11 and the first drive system 121. In this case, even when the posture of the light irradiation device 11 changes, the direction of the elastic force applied by the air spring 1223 of one second drive system 122 is different from the direction of the elastic force applied by the air spring 1223 of the other second drive systems 122. For example, in the example shown in FIGS. 32 and 33, the air spring 1223#1 of the second drive system 122#1 applies an elastic force along the direction in which the second drive system 122#1 connects the light irradiation device 11 (particularly, the housing 114) and the first drive system 121 (particularly, the attachment member 1213) (for example, the direction A1 from the lower left to the upper right in FIG. 33), and the air spring 1223#2 of the second drive system 122#2 applies an elastic force along the direction in which the second drive system 122#2 connects the light irradiation device 11 and the first drive system 121 (for example, the direction A2 from the upper left to the lower right in FIG. 33).

[0230] The plurality of second drive systems 122 may be arranged such that the direction of the elastic force applied by the damper member 1224 of one of the plurality of second drive systems 122 is different from the direction of the elastic force applied by the damper member 1224 of another second drive system 122 among the plurality of second drive systems 122. For example, in the examples shown in FIGS. 30 and 31, the damper member 1224#1 of the second drive system 122#1 is arranged to apply an elastic force along the X-axis direction, and the damper member 1224#2 of the second drive system 122#2 is arranged to apply an elastic force along the Z-axis direction. In this case, at least one damper member 1224 among the plurality of second drive systems 122 may be arranged to apply an elastic force along a direction including a component in the gravitational direction. In the examples shown in FIGS. 30 and 31, the damper member 1224#2 of the second drive system 122#2 is arranged to apply an elastic force along the Z-axis direction, which is a direction including a component in the gravitational direction.

[0231] However, as shown in FIGS. 32 and 33, for the same reason as the case where the direction of the elastic force applied by the air spring 1223 changes, within the coordinate system composed of the X-axis, Y-axis, and Z-axis, the direction of the elastic force applied by the damper member 1224 may change. In the sixth embodiment, even when the posture of the light irradiation device 11 changes, the plurality of second drive systems 122 may be arranged such that the direction of the elastic force applied by the damper member 1224 of one second drive system 122 is different from the direction of the elastic force applied by the damper member 1224 of another second drive system 122. For example, the direction in which one second drive system 122 connects the light irradiation device 11 and the first drive system 121 may be different from the direction in which another second drive system 122 connects the light irradiation device 11 and the first drive system 121. Further, the damper member 1224 of each second drive system 122 may apply an elastic force along the direction in which each second drive system 122 connects the light irradiation device 11 and the first drive system 121. In this case, even when the posture of the light irradiation device 11 changes, the direction of the elastic force applied by the damper member 1224 of one second drive system 122 will be different from the direction of the elastic force applied by the damper member 1224 of another second drive system 122. For example, in the example shown in FIGS. 32 and 33, the damper member 1224#1 of the second drive system 122#1 applies an elastic force along the direction in which the second drive system 122#1 connects the light irradiation device 11 and the first drive system 121 (for example, the direction A1 from the lower left to the upper right in FIG. 33), and the damper member 1224#2 of the second drive system 122#2 applies an elastic force along the direction in which the second drive system 122#2 connects the light irradiation device 11 and the first drive system 121 (for example, the direction A2 from the upper left to the lower right in FIG. 33).

[0232] The plurality of second drive systems 122 may be arranged such that the direction of the driving force applied by the driving member 1225 of one of the plurality of second drive systems 122 is different from the direction of the driving force applied by the driving member 1225 of another second drive system 122 among the plurality of second drive systems 122. For example, in the examples shown in FIGS. 30 and 31, the driving member 1225#1 of the second drive system 122#1 is arranged to apply a driving force along a direction intersecting the X-axis (for example, at least one of the Y-axis direction and the Z-axis direction), and the driving member 1225#2 of the second drive system 122#2 is arranged to apply a driving force along a direction intersecting the Z-axis (for example, at least one of the X-axis direction and the Y-axis direction). In this case, at least one driving member 1225 among the plurality of second drive systems 122 may be arranged to apply a driving force along a direction including a direction component intersecting the gravity direction. In the examples shown in FIGS. 30 and 31, the driving member 1225#2 of the second drive system 122#2 is arranged to apply an elastic force along at least one of the X-axis direction and the Y-axis direction, which is a direction including a direction component intersecting the gravity direction.

[0233] However, as shown in FIGS. 32 and 33, for the same reason as when the direction of the elastic force applied by the air spring 1223 changes, the direction of the driving force applied by the driving member 1225 may change within the coordinate system composed of the X-axis, Y-axis, and Z-axis. In the sixth embodiment, even when the posture of the light irradiation device 11 changes, among the plurality of second drive systems 122, the direction of the driving force applied by the driving member 1225 of one second drive system 122 may be different from the direction of the driving force applied by the driving member 1225 of another second drive system 122. For example, the direction in which one second drive system 122 connects the light irradiation device 11 and the first drive system 121 may be different from the direction in which another second drive system 122 connects the light irradiation device 11 and the first drive system 121. Further, the driving member 1225 of each second drive system 122 may apply a driving force along a direction intersecting with the direction in which each second drive system 122 connects the light irradiation device 11 and the first drive system 121. In this case, even when the posture of the light irradiation device 11 changes, the direction of the driving force applied by the driving member 1225 of one second drive system 122 will be different from the direction of the driving force applied by the driving member 1225 of another second drive system 122. For example, in the examples shown in FIGS. 32 and 33, the driving member 1225#1 of the second drive system 122#1 applies a driving force along a direction intersecting with the direction in which the second drive system 122#1 connects the light irradiation device 11 and the first drive system 121 (for example, the direction A2 from the upper left to the lower right in FIG. 33), and the driving member 1225#2 of the second drive system 122#2 applies a driving force along a direction intersecting with the direction in which the second drive system 122#2 connects the light irradiation device 11 and the first drive system 121 (for example, the direction A1 from the lower left to the upper right in FIG. 33).

[0234] Also, in the examples shown in FIGS. 30 and 31, the number of air springs 1223, the number of damper members 1224, and the number of driving members 1225 do not have to be equal to each other. For example, the number of air springs 1223 may be less than the number of driving members 1225.

[0235] Such a processing system SYSf of the sixth embodiment can enjoy the same effects as those that the processing system SYSa of the first embodiment described above can enjoy. In addition, since the processing system SYSf includes a plurality of second drive systems 122, the degree of freedom in the posture of the light irradiation device 11 is improved as compared with the processing system SYSa including a single second drive system 122. For example, in the processing system SYSf, the light irradiation device 11 can move not only to a first posture in which the processing light EL is irradiated downward from above the object S to be processed, but also to a second posture in which the processing light EL is irradiated obliquely downward from obliquely above the object S to be processed, a third posture in which the processing light EL is irradiated laterally from the side of the object S to be processed, a fourth posture in which the processing light EL is irradiated obliquely upward from obliquely below the object S to be processed, and a fifth posture in which the processing light EL is irradiated upward from below the object S to be processed. Therefore, the processing system SYSf can appropriately form a structure on the coating film SF of the object S to be processed having a complex shape.

[0236] Furthermore, in the sixth embodiment, the connection point between the first drive system 121 and the light irradiation device 11 by the second drive system 122 may be located between the first surface of the light irradiation device 11 and the second surface facing the opposite side of the first surface of the light irradiation device 11. For example, as shown in FIG. 30, when the light irradiation device 11 includes the housing 114, the connection point CP between the first drive system 121 and the light irradiation device 11 by the second drive system 122 may be located between the first surface of the housing 114 (for example, the surface 1141 facing the opposite side of the object S to be processed by the housing 114) and the second surface of the housing 114 (for example, the surface 1142 facing the object S side of the housing 114). When the connection point CP is arranged between the first surface and the second surface of the light irradiation device 11 (for example, between the surface 1141 and the surface 1142 of the housing 114) in this way, the positioning accuracy of the light irradiation device 11 is improved as compared with the case where the connection point CP is not arranged between the first surface and the second surface of the light irradiation device 11 (for example, between the surface 1141 and the surface 1142 of the housing 114). In this case, the connection point CP between the first drive system 121 and the light irradiation device 11 by the second drive system 122 may be located at the center of gravity position GP (see FIG. 30) of the light irradiation device 11. When the connection point CP is located at the center of gravity position GP, the positioning accuracy of the light irradiation device 11 is improved as compared with the case where the connection point CP is not located at the center of gravity position GP. Note that not only in the sixth embodiment, but also in at least one of the first to fifth embodiments, the connection point CP may be arranged between the first surface and the second surface of the light irradiation device 11 (for example, between the surface 1141 and the surface 1142 of the housing 114). In at least one of the first to fifth embodiments, the connection point CP may be arranged at the center of gravity position GP.

[0237] The processing system SYSf of the sixth embodiment may further include at least one specific component requirement unique to the processing system SYSb of the second embodiment to the processing system SYSe of the fifth embodiment described above. The specific component requirements unique to the processing system SYSd of the fourth embodiment include the component requirements related to the support device 14d. The specific component requirements unique to the processing system SYSe of the fifth embodiment include the component requirements related to the support device 14e.

[0238] (7) Machining System SYSg of the Seventh Embodiment Next, referring to FIG. 34, the processing system SYS of the seventh embodiment (hereinafter, the processing system SYS of the seventh embodiment is referred to as "processing system SYSg") will be described. FIG. 34 is a cross-sectional view schematically showing the structure of the processing system SYSg of the seventh embodiment.

[0239] As shown in FIG. 34, the processing system SYSg of the seventh embodiment is different from the processing system SYSa of the first embodiment in that it includes a processing device 1g instead of the processing device 1. Other features of the processing system SYSg may be the same as other features of the processing system SYSa. The processing device 1g is different from the processing device 1 in that it includes a support device 14g instead of the support device 14. Other features of the processing device 1g may be the same as other features of the processing device 1. In FIG. 34, for the sake of clarity of the drawing, the description of some of the components included in the processing system SYSg (for example, the housing device 13, the drive system 15, the exhaust device 16, the gas supply device 17, and the control device 2) is omitted.

[0240] The support device 14g supports the housing device 13 in the same manner as the support device 14. That is, the support device 14g supports the drive system 12 and the light irradiation device 11 via the housing device 13 in the same manner as the support device 14. The support device 14g is different from the support device 14 that may not be flyable in that it can fly to a position away from the object to be processed SF. An example of the flyable support device 14g is a flying object such as an aircraft. The flying object may be remotely controllable, may be controllable by a pilot on board the flying object, or may be capable of autonomous flight. Examples of the flying object include at least one of an aircraft, a drone (see FIG. 34), a helicopter, a balloon, and an airship.

[0241] Such a processing system SYSg of the seventh embodiment can enjoy the same effects as the effects that the above-described processing system SYSa of the first embodiment can enjoy.

[0242] Furthermore, the processing system SYSg of the seventh embodiment may further include at least one constituent element peculiar to the processing system SYSb of the second embodiment described above and the processing system SYSf of the sixth embodiment. The constituent elements peculiar to the processing system SYSf of the sixth embodiment include the constituent elements related to the drive system 12f.

[0243] (8) Other Modification Examples In the above description, the drive system 12 includes the first drive system 121 and the second drive system 122. However, the drive system 12 may not include the first drive system 121. In this case, the second drive system 122 may be attached to the housing device 13 without passing through the first drive system 121. The second drive system 122 may be attached to the support device 14 (or the support devices 14d, 14e, or 14g) without passing through the first drive system 121.

[0244] In the above description, the processing system SYS deflects the processing light EL with the galvanometer mirror 1122 in order to scan the surface of the coating film SF with a plurality of processing lights EL. However, in addition to or instead of deflecting the processing light EL with the galvanometer mirror 1122, the processing apparatus 1 may scan the surface of the coating film SF with a plurality of processing lights EL by relatively moving the light irradiation device 11 with respect to the coating film SF. That is, the control device 2 may control the drive system 12 to relatively move the light irradiation device 11 with respect to the coating film SF so that the processing light EL scans the surface of the coating film SF.

[0245] One of the purposes of the drive system 12 to relatively move the light irradiation device 11 with respect to the coating film SF is to scan the surface of the coating film SF with the processing light EL as described above. Therefore, if the scanning of the coating film SF by the processing light EL can be realized without moving the light irradiation device 11, the light irradiation device 11 does not have to move. That is, the processing system SYS may not include the drive system 12.

[0246] One of the purposes of moving the drive system 12 to move the light irradiation device 11 relative to the coating film SF is to sequentially scan a plurality of processing shot areas SA with the processing light EL without moving the housing device 13 and the support device 14 when a plurality of processing shot areas SA are accommodated in the accommodation space SP of the housing device 13. For this reason, when a single processing shot area SA is accommodated in the accommodation space SP, the light irradiation device 11 may not need to move. That is, the processing device 1 may not include the drive system 12.

[0247] In the above description, the processing device 1 includes the housing device 13, the support device 14, the drive system 15, the exhaust device 16, and the gas supply device 17. However, as long as the processing device 1 can process the object to be processed S, it may not include at least one of the housing device 13, the support device 14, the drive system 15, the exhaust device 16, and the gas supply device 17. As long as the processing device 1 can process the object to be processed S, it may not include at least a part of the housing device 13, the support device 14, the drive system 15, the exhaust device 16, and the gas supply device 17. When the processing device 1 does not include the housing device 13, the drive system 12 may be attached to the support device 14. Further, the structures of the above-described housing device 13, support device 14, drive system 15, exhaust device 16, and gas supply device 17 are merely examples, and the processing device 1 may include at least one of the housing device 13, support device 14, drive system 15, exhaust device 16, and gas supply device 17 having a structure different from the above-described structure.

[0248] In the above description, the processing system SYS forms a riblet structure by the coating film SF on the surface of the object S to be processed. However, the processing system SYS may form an arbitrary structure by the coating film SF having an arbitrary shape on the surface of the object S to be processed. Even in this case, if the control device 2 controls the light irradiation device 11 or the like so that the processing light EL scans the surface of the coating film SF along the scanning trajectory corresponding to the structure to be formed, an arbitrary structure having an arbitrary shape can be formed. As an example of an arbitrary structure, there is a fine texture structure (typically an uneven structure) on the order of micro to nanometers formed regularly or irregularly. Such a fine texture structure may include at least one of a shark skin structure and a dimple structure having a function of reducing resistance by a fluid (gas and / or liquid). The fine texture structure may include a lotus leaf surface structure having at least one of a liquid repellent function and a self-cleaning function (for example, having a lotus effect). The fine texture structure may include at least one of a fine protrusion structure having a liquid transport function (see U.S. Patent Publication No. 2017 / 0044002), an uneven structure having a lyophilic function, an uneven structure having an antifouling function, a moth-eye structure having at least one of a reflectance reduction function and a liquid repellent function, an uneven structure that exhibits a structural color by enhancing only light of a specific wavelength by interference, a pillar array structure having an adhesion function using van der Waals force, an uneven structure having an aerodynamic noise reduction function, and a honeycomb structure having a droplet collection function, etc.

[0249] In the above description, the processing system SYS removes the coating film SF by evaporating the coating film SF by irradiating the processing light EL. However, in addition to or instead of evaporating the coating film SF by irradiating the processing light EL, the processing system SYS may remove the coating film SF by changing the properties of the coating film SF by irradiating the processing light EL. For example, the processing system SYS may melt the coating film SF by irradiating the processing light EL and remove the melted coating film SF to remove the coating film SF. For example, the processing system SYS may make the coating film SF brittle by irradiating the processing light EL and peel off the brittle coating film SF to remove the coating film SF. In the above description, the processing system SYS performs ablation processing on the coating film SF formed on the surface of the object to be processed S. However, the processing system SYS may remove a part of the coating film SF formed on the surface of the object to be processed S by thermal processing.

[0250] In the above description, the processing system SYS forms the concave portion C (or the concave structure CP1, or any structure such as the riblet structure by the concave structure CP1) by removing the coating film SF. That is, the processing system SYS processes the coating film SF so as to partially thin the coating film SF. However, in addition to or instead of partially thinning the coating film SF, the processing system SYS may process the coating film SF so as to partially thicken the coating film SF. That is, in addition to or instead of forming the concave portion C by removing the coating film SF, the processing system SYS may form a convex portion (or the convex structure CP2 or any structure by the convex structure CP2) by adding the coating film SF. For example, the processing system SYS irradiates the first portion of the coating film SF with the processing light EL to remove the first portion of the coating film SF, and then fixes the removed coating film SF to the second portion of the coating film SF, so that the coating film SF in the second portion may be relatively thickened (that is, a convex portion may be formed in the second portion).

[0251] In the above description, the processing system SYS processes the coating film SF formed on the surface of the object S to be processed. However, the processing system SYS may process any coating other than the coating film SF formed on the surface of the object S to be processed. Alternatively, the processing system SYS may process a structure in which a plurality of layers are laminated. Specifically, the processing system SYS may process at least one layer (typically, at least one layer including the outermost surface layer) among the plurality of layers constituting the structure. The processing system SYS may process at least one layer among the plurality of layers constituting the structure to form a structure by the layer. In this case, at least one layer to be processed corresponds to the coating film SF described above, and other layers other than the at least one layer correspond to the object S to be processed. Alternatively, the processing system SYS may process the object S itself. That is, the processing system SYS may process the object S to be processed on which no coating film SF or any coating is formed on the surface.

[0252] In the above description, the processing system SYS forms a riblet structure on the object S to be processed to reduce the resistance of the fluid on the surface of the object S to be processed. However, the processing system SYS may form other structures different from the riblet structure for reducing the resistance of the fluid on the surface on the object S to be processed. For example, the processing system SYS may form a riblet structure on the object S to be processed to reduce the noise generated when the fluid and the surface of the object S move relatively. For example, the processing system SYS may form a structure that generates vortices with respect to the flow of the fluid on the surface of the object S to be processed. For example, the processing system SYS may form a structure for imparting hydrophobicity to the surface of the object S to be processed.

[0253] In the above description, a processing system SYS for processing an object with processing light EL has been described. That is, in the above description, an example in which the second drive system 122 connects the irradiation device 11 and the first drive system 121 has been described. However, in addition to or instead of the light irradiation device 11 in the processing system SYS, an end effector that acts on the object may be used. For example, the second drive system 122 may connect the end effector and the first drive system 121. Here, the end effector may be a part that has a function of directly acting on a work target (for example, an object). Further, the end effector may be a part that obtains properties of the work target (for example, an object). Here, the properties of the object (for example, the work target) may include at least one of the shape of the object, the position of the object, the position of the feature points of the object, the posture of the object, the surface properties of the object (for example, at least one of reflectance, spectral reflectance, surface roughness, and color, etc.), and at least one of the hardness of the object, etc. Note that the light irradiation device 11 and the position measurement device 18 in the above description can be regarded as a kind of end effector.

[0254] As an example of a device including such an end effector, there is a first device including an end effector, a first drive system 121 as a movable member whose relative positional relationship with a part of the object can be changed, and a second drive system 122 as a connecting device that connects the first drive system 121 and the end effector so that the relative positional relationship between the first drive system 121 and the end effector can be changed. The first device may be referred to as a robot system. Further, as an example of a device including an end effector, a second device including an end effector and a second drive system 122 may be configured. The second device may be referred to as an end effector device. Note that the device may be configured by the second drive system 122 as a connecting device that connects the first drive system 121 and the end effector.

[0255] An end effector Efa, which is an example of an end effector, is shown in Fig. 35. As shown in Fig. 35, the end effector Efa includes an attached portion Ef1 attached to a connecting device (e.g., the second drive system 122), and a plurality of finger modules attached to a plurality of mounting surfaces (three mounting surfaces in the example shown in Fig. 35) inclined with respect to the axis of the attached portion Ef1 (typically, the axis connecting the attached portion Ef1 and the connecting device). Each finger module includes a first link module Ef21 rotatable around the first joint axis of the attached portion Ef1, a first drive module Ef31 provided on the first link module Ef21 and rotationally driving the first link module Ef21 around the first joint axis, a second link module Ef22 provided on the first link module Ef21 and rotatable around a second joint axis orthogonal to the first joint axis, a second drive module Ef32 rotationally driving the second link module Ef22 around the second joint axis, a third link module Ef23 provided on the second link module Ef22 rotatably around a third joint axis, and a third drive unit Ef33 rotationally driving the third link module Ef23 around the third joint axis. Here, the end effector Efa may be referred to as a hand. Also, a part of the third link module Ef23 (typically, the tip portion) may be regarded as a gripping portion for gripping an object and may be referred to as the fingertip of the hand.

[0256] In addition, a position measuring device 18 may be attached to the attached portion Ef1. At this time, the measurement axis of the position measuring device may be in a direction along the axis of the attached portion Ef1, a direction parallel to the axis of the attached portion Ef1, or a direction inclined with respect to the axis of the attached portion Ef1. The position measuring device 18 may measure at least one of at least a part of an object and at least a part of the end effector Efa (typically, the gripping portion or the fingertip). Also, a part of the position measuring device 18b (typically, the indicator member 181b) may be attached to the attached portion Ef1.

[0257] Furthermore, the end effector is not limited to the end effector Efa as a hand capable of gripping the object shown in FIG. 35 and the position measuring device. For example, the end effector may include at least one of a suction holding device Efb that sucks and holds an object as shown in FIG. 36(a), a spray painting device Efc shown in FIG. 36(b), a roller painting device Efd shown in FIG. 36(c), a machining head device Efe equipped with a cutting tool such as a drill shown in FIG. 36(d), and a welding gun device Eff shown in FIG. 36(e). For example, the end effector may include at least one of an injector that injects molten metal, molten resin, particles for blasting, etc., a manipulator, and an air blow.

[0258] When the end effector requires power, the connection device may perform non-contact power supply to the end effector. Also, the output from the end effector may be output to the outside (typically, the control device 2) by a non-contact method such as wireless or optical transmission.

[0259] (9) Supplementary Note Regarding the embodiments described above, the following additional remarks are disclosed. [Supplementary Note 1] An active vibration isolation device, An irradiation device that is attached to the active vibration isolation device and irradiates the object with processing light for processing the object, A control device that controls the active vibration isolation device to change the relative position between the object and the irradiation device A processing system comprising. [Supplementary Note 2] The control device controls the active vibration isolation device to change the relative position between the object and the irradiation device so as to align the object with the irradiation area of the processing light. The processing system according to Supplementary Note 1. [Supplementary Note 3] The control device controls the active vibration isolation device to change the relative position between the object and the irradiation device so that the processing light is irradiated at a desired position of the object. The processing system according to Supplementary Note 1 or 2. [Appendix 4] The control device controls the active vibration isolation device to change the relative position between the object and the irradiation device so that the amount of vibration of the irradiation device with respect to the object is smaller than that when the active vibration isolation device is not controlled. The processing system according to any one of Appendices 1 to 3. [Appendix 5] The irradiation device is attached to another member via the active vibration isolation device, The control device controls the active vibration isolation device to change the relative position between the object and the irradiation device so that the amount of vibration of the irradiation device with respect to the object is smaller than the amount of vibration of the other member with respect to the object. The processing system according to any one of Appendices 1 to 4. [Appendix 6] The processing system further includes a moving device that moves the active vibration isolation device. The processing system according to any one of Appendices 1 to 5. [Appendix 7] The moving device moves the irradiation device together with the active vibration isolation device. The processing system according to Appendix 6. [Appendix 8] The active vibration isolation device is attached to the moving device. The processing system according to Appendix 6 or 7. [Appendix 9] The irradiation device is attached to the moving device via the active vibration isolation device. The processing system according to any one of Appendices 6 to 8. [Appendix 10] The moving device includes a plurality of arm members and a joint member that swingably connects the plurality of arm members. The processing system according to any one of Appendices 6 to 9. [Appendix 11] The moving device includes a self-propelled device that can self-propel without interfering with the object. The processing system according to any one of Appendices 6 to 10. [Appendix 12] The moving device includes a self-propelled device that can self-propel while being supported by the object. The processing system according to any one of Appendices 6 to 11. [Appendix 13] The moving device includes a flying device that can fly to a position away from the object. The processing system according to any one of Appendices 6 to 12. [Appendix 14] The control device controls the moving device to change the relative position between the object and the irradiation device. The processing system according to any one of Appendices 6 to 13. [Appendix 15] The control device controls the moving device to change the relative position between the object and the irradiation device so as to align the object with the irradiation area of the processing light. The processing system according to Appendix 14. [Appendix 16] The control device controls the moving device to change the relative position between the object and the irradiation device so that the processing light is irradiated at a desired position of the object. The processing system according to Appendix 14 or 15. [Appendix 17] The amount of change in the relative position between the object and the irradiation device by the active vibration isolation device is less than the amount of change in the relative position between the object and the irradiation device by the moving device. The processing system according to any one of Appendices 14 to 16. [Appendix 18] The change accuracy of the relative position between the object and the irradiation device by the active vibration isolation device is higher than the change accuracy of the relative position between the object and the irradiation device by the moving device. The processing system according to any one of Appendices 14 to 17. [Appendix 19] The control device controls at least one of the active vibration isolation device and the moving device to change the relative position between the object and the irradiation device so that the amount of vibration of the irradiation device with respect to the object is smaller than when the control device does not control the active vibration isolation device and the moving device. The processing system according to any one of Supplementary Notes 14 to 18. [Supplementary Note 20] The control device controls at least one of the active vibration isolation device and the moving device so that the vibration amount of the irradiation device with respect to the object becomes small based on the frequency of the vibration of the irradiation device with respect to the object. The processing system according to Supplementary Note 19. [Supplementary Note 21] When the frequency is included in the first frequency range, the control device controls the moving device so that the vibration amount of the irradiation device with respect to the object becomes small. When the frequency is included in a second frequency range higher than the first frequency range, the control device controls the active vibration isolation device so that the vibration amount of the irradiation device with respect to the object becomes small. The processing system according to Supplementary Note 20. [Supplementary Note 22] The irradiation device is attached to another member via the active vibration isolation device. The active vibration isolation device includes a position changing device that changes the relative position between the another member and the irradiation device, and a vibration damping device that damps vibration transmitted between the another member and the irradiation device. The processing system according to any one of Supplementary Notes 1 to 21. [Supplementary Note 23] The control device changes the relative position between the object and the irradiation device by changing the relative position between the another member and the irradiation device using the position changing device. The processing system according to Supplementary Note 22. [Supplementary Note 24] The position changing device changes the relative position between the another member and the irradiation device by an electric force. The vibration damping device damps vibration transmitted between the another member and the irradiation device by air pressure. The processing system according to Supplementary Note 22 or 23. [Supplementary Note 25] The processing system further includes a position measuring device that measures the relative position between the object and the irradiation device. The processing system according to any one of Appendices 1 to 24. [Appendix 26] The control device controls the active vibration isolation device based on the measurement result of the position measurement device. The processing system according to Appendix 25. [Appendix 27] Comprising a plurality of the position measurement devices, The control device controls the active vibration isolation device based on information regarding the relative position between the measurement reference position of the first position measurement device among the plurality of position measurement devices and the measurement reference position of the second position measurement device among the plurality of position measurement devices, and the measurement results of the first and second position measurement devices. The processing system according to Appendix 25 or 26. [Appendix 28] The position measurement device includes an index member whose relative position with respect to the irradiation device is fixed, and an index measurement device that measures the position of the index member. The processing system according to any one of Appendices 25 to 27. [Appendix 29] The index member includes a marker, The index measurement device includes at least one of an imaging device capable of imaging the marker and a light receiving device capable of receiving light from the marker. The processing system according to Appendix 28. [Appendix 30] The index member includes a transmitting device capable of transmitting a signal, The index measurement device includes a receiving device capable of receiving the signal. The processing system according to Appendix 28 or 29. [Appendix 31] The position measurement device includes an object measurement device that measures the object. The processing system according to any one of Appendices 25 to 30. [Appendix 32] Irradiating the object with processing light for processing the object from an irradiation device attached to an active vibration isolation device; Changing the relative position between the object and the irradiation device using the active vibration isolation device; And a processing method including the above. [Appendix 33] A robotic system comprising: a passive vibration isolation device; an end effector attached to the passive vibration isolation device and acting on an object; and a control device configured to control the passive vibration isolation device to change a relative position between the object and the end effector. [Appendix A1] In a processing system for processing an object with processing light, a movable member whose relative positional relationship with a part of the object is changeable; an irradiation device configured to irradiate the object with the processing light; and a connection device configured to connect the movable member and the irradiation device such that a relative positional relationship between the movable member and the irradiation device is changeable. The connection device includes: a driving member configured to move at least one of the movable member and the irradiation device; and an elastic member configured to couple the movable member and the irradiation device. [Appendix A2] The driving member applies a driving force along a first direction to at least one of the movable member and the irradiation device, and the elastic member applies an elastic force along a second direction intersecting the first direction to at least one of the movable member and the irradiation device. The processing system according to Appendix A1. [Appendix A3] The elastic member supports a weight of the irradiation device. The processing system according to Appendix A2. [Appendix A4] The elastic member supports the weight in the second direction. The processing system according to Appendix A3. [Appendix A5] The driving member applies a driving force along a first direction to at least one of the movable member and the irradiation device, The elastic member applies an elastic force to at least one of the movable member and the irradiation device along a second direction having a component along the first direction. The processing system according to any one of Appendices A1 to A4. [Appendix A6] The drive member applies the driving force so as to change the resonance frequency of the elastic member. The processing system according to Appendix A5. [Appendix A7] The elastic member couples the movable member and the irradiation device so that at least one of the position and the orientation of the irradiation device with respect to the movable member can be changed. The processing system according to any one of Appendices A1 to A4. [Appendix A8] The connection device includes a first elastic member that applies an elastic force along a first direction including a component in the gravitational direction to at least one of the movable member and the irradiation device, and a second elastic member that applies an elastic force along a second direction different from the first direction to at least one of the movable member and the irradiation device. The processing system according to any one of Appendices A1 to A7. [Appendix A9] The connection member includes a first elastic member that applies an elastic force along a first direction including a component in the gravitational direction to at least one of the movable member and the irradiation device, and a second elastic member that applies an elastic force along a second direction different from the first direction to at least one of the movable member and the irradiation device. The processing system according to any one of Appendices A1 to A7. [Appendix A10] The connection device includes a first drive member that applies a driving force along a third direction to at least one of the movable member and the irradiation device, and a second drive member that applies a driving force along a fourth direction different from the third direction to at least one of the movable member and the irradiation device. The processing system according to Appendix A8 or A9. [Appendix A11] The connecting device connects a first part of the movable member, the relative positional relationship of which with respect to a part of the object can be changed, and a second part that is part of the irradiation device. The processing system according to any one of Appendices A1 to A10. [Appendix A12] The processing system further includes a control device that controls the drive member such that the amount of vibration of the irradiation device is smaller than the amount of vibration of the first part. The processing system according to Appendix A11. [Appendix A13] The processing system further includes a moving device that moves the position of the first part of the movable member relative to the part of the object. The processing system according to Appendix A11 or A12. [Appendix A14] The positioning accuracy of the second part by the drive member is higher than the positioning accuracy of the first part by the moving device. The processing system according to Appendix A13. [Appendix A15] The moving range of the first part by the moving device is larger than the moving range of the second part by the drive member. The processing system according to Appendix A13 or A14. [Appendix A16] The processing system includes a position measuring device that measures the relative positional relationship between the object and the irradiation device, and the drive member is controlled using the output from the position measuring device. The processing system according to any one of Appendices A1 to A15, comprising the above. [Appendix A17] The processing system includes a position measuring device that measures the relative positional relationship between the object and the irradiation device, and the moving device is controlled using the output from the position measuring device. The processing system according to any one of Appendices A13 to A15, comprising the above. [Appendix A18] The position measuring device measures the position of the object with respect to the irradiation device. The processing system according to Appendix A16 or A17. [Appendix A19] The position measuring device measures the position of the irradiation device with respect to a reference position The processing system according to any one of Appendices A16 to A18 [Appendix A20] The range in which the processing light can be irradiated by the irradiation device is changed by the movement of the irradiation device The processing system according to any one of Appendices A1 to A19 [Appendix A21] The connecting device connects a first part of the movable member, the relative positional relationship of which with a part of the object can be changed, and a second part which is a part of the irradiation device The elastic member reduces vibrations from the first part towards the second part The drive member reduces the relative displacement between the first part and the second part due to the vibrations from the first part towards the second part The processing system according to any one of Appendices A1 to A20 [Appendix A22] The irradiation device includes an irradiation position changing device that changes the irradiation position of the processing light on the object with respect to the irradiation device The processing system according to any one of Appendices A1 to A21 [Appendix A23] The drive member reduces the positional deviation of the irradiation position caused by the operation of the irradiation position changing device The processing system according to Appendix A22 [Appendix A24] A plurality of position measuring devices Based on information regarding the relative position between the measurement reference position of a first position measuring device among the plurality of position measuring devices and the measurement reference position of a second position measuring device among the plurality of position measuring devices, and the measurement results of the first and second position measuring devices, a control device that controls the drive member The processing system according to any one of Appendices A1 to A23, comprising the above [Appendix A25] The position measuring device includes an index member whose relative position with respect to the irradiation device is fixed, and an index measuring device that measures the position of the index member. The processing system according to any one of Appendices A16 to A19 and A24. [Appendix A26] The index member includes a marker. The index measuring device includes at least one of an imaging device capable of imaging the marker and a light receiving device capable of receiving light from the marker. The processing system according to Appendix A25. [Appendix A27] The index member includes a transmitting device capable of transmitting a signal. The index measuring device includes a receiving device capable of receiving the signal. The processing system according to Appendix A25 or A26. [Appendix A28] The position measuring device includes an object measuring device that measures the object. The processing system according to any one of Appendices A16 to A19 and A24 to A27. [Appendix A29] In a processing system for processing an object with processing light, a movable member whose relative positional relationship with a part of the object can be changed, an irradiation device that irradiates the processing light toward the object, a connecting device that connects the movable member and the irradiation device so that the relative positional relationship between the movable member and the irradiation device can be changed, a vibration reduction device that reduces vibration from the movable member toward the irradiation device A processing system comprising: [Appendix A30] The vibration reduction device includes a drive member that moves at least one of the movable member and the irradiation device, and an elastic member that couples the movable member and the irradiation device. The processing system according to Appendix A29. [Appendix A31] The vibration reduction device includes a control device that controls the drive member so that the amount of vibration of the irradiation device is smaller than the amount of vibration of the movable member. The processing system according to Addendum A30. [Addendum A32] The processing system further includes a position measurement device that measures the relative positional relationship between the object and the irradiation device. The control device controls the drive member using the output from the position measurement device. The processing system according to Addendum A31. [Addendum A33] The position measurement device measures the position of the irradiation device with respect to the object. The processing system according to Addendum A32. [Addendum A34] The position measurement device measures the position of the irradiation device with respect to a reference position. The processing system according to Addendum A32 or A33. [Addendum A35] The irradiation device includes an irradiation position changing device that changes the irradiation position of the processing light on the object with respect to the irradiation device. The processing system according to any one of Addenda A29 to A34. [Addendum A36] The vibration reduction device reduces the positional deviation of the irradiation device caused by the operation of the irradiation position changing device. The processing system according to Addendum A35. [Addendum A37] The processing system further includes a position measurement device that measures the relative positional relationship between the object and the irradiation position. The processing system according to Addenda A22, A23, A35, or A36. [Addendum A38] The position measurement device measures the irradiation position with respect to the object. The processing system according to Addendum A37. [Addendum A39] The processing light is irradiated from the irradiation device onto a sensitive member whose characteristics change due to the irradiation of the processing light, and the position measurement device measures the site where the characteristics have changed in the sensitive member. The processing system described in Supplementary Note A38. [Supplementary Note A40] A plurality of position measuring devices, Based on information regarding the relative position between the measurement reference position of the first position measuring device among the plurality of position measuring devices and the measurement reference position of the second position measuring device among the plurality of position measuring devices, and the measurement results of the first and second position measuring devices, a control device for controlling the vibration reduction device The processing system according to any one of Supplementary Notes A29 to A39, comprising the above. [Supplementary Note A41] The position measuring device includes an index member whose relative position with respect to the irradiation device is fixed, and an index measuring device for measuring the position of the index member The processing system according to any one of Supplementary Notes A32 to A34 and A40. [Supplementary Note A42] The index member includes a marker, The index measuring device includes at least one of an imaging device capable of imaging the marker and a light receiving device capable of receiving light from the marker The processing system described in Supplementary Note A41. [Supplementary Note A43] The index member includes a transmitting device capable of transmitting a signal, The index measuring device includes a receiving device capable of receiving the signal The processing system described in Supplementary Note A41 or A42. [Supplementary Note A44] The position measuring device includes an object measuring device for measuring the object The processing system according to any one of Supplementary Notes A32 to A34 and A40 to A43. [Supplementary Note A45] In a processing system for processing an object with processing light, A movable member whose relative positional relationship with a part of the object can be changed, An irradiation device for irradiating the processing light toward the object, A connecting device for connecting the movable member and the irradiation device so that the relative positional relationship between the movable member and the irradiation device can be changed, A position measuring device that measures the position of the irradiation device with respect to the object or the reference position and includes The connection device includes a position changing member that changes the position of the irradiation device with respect to the movable member based on the position measurement result by the position measuring device Processing system [Appendix A46] The connection device includes an elastic member that couples the movable member and the irradiation device The processing system according to Appendix A45 [Appendix A47] The movable member includes a plurality of arm members and a joint member that swingably connects the plurality of arm members The processing system according to any one of Appendices A1 to A46 [Appendix A48] The movable member includes a self-propelled device that can self-propel without interfering with the object The processing system according to any one of Appendices A1 to A47 [Appendix A49] The movable member includes a self-propelled device that can self-propel while being supported by the object The processing system according to any one of Appendices A1 to A48 [Appendix A50] The movable member includes a flying device that can fly to a position away from the object The processing system according to any one of Appendices A1 to A49 [Appendix A51] The moving device includes a self-propelled device that can self-propel without interfering with the object The processing system according to any one of Appendices A13 to A15 and A17 [Appendix A52] The moving device includes a self-propelled device that can self-propel while being supported by the object The processing system according to any one of Appendices A13 to A15, A17, and A51 [Appendix A53] The moving device includes a flying device that can fly to a position away from the object The processing system according to any one of Appendices A13 to A15, A17, and A51 to A52. [Appendix A54] The irradiation device includes a housing having a first surface directed toward a first side and a second surface directed toward a second side opposite to the first side. The connection location between the movable member and the irradiation device by the connection member is located between the first surface and the second surface. The processing system according to any one of Appendices A1 to A53. [Appendix A55] The connection location is located at the center of gravity of the irradiation device. The processing system according to Appendix A54. [Appendix A56] In a processing method of processing an object with processing light, changing the positional relationship between the position of the movable member and the position of a part of the object; irradiating the object with the processing light using an irradiation device; changing the relative positional relationship between the movable member and the irradiation device; connecting the movable member and the irradiation device by a connection portion including a drive member that moves at least one of the movable member and the irradiation device and an elastic member that couples the movable member and the irradiation device; A processing method including the above. [Appendix A57] In a processing method of processing an object with processing light, changing the positional relationship between the position of the movable member and the position of a part of the object; irradiating the object with the processing light using an irradiation device; changing the relative positional relationship between the movable member and the irradiation device; reducing vibration from the movable member toward the irradiation device; A processing method including the above. [Appendix A58] In a processing method of processing an object with processing light, changing the positional relationship between the position of the movable member and the position of a part of the object; Irradiating the object with the processing light using the irradiation device; Measuring the position of the irradiation device with respect to the object or a reference position; Changing the relative positional relationship between the movable member and the irradiation device based on the measured position of the irradiation device; A processing method including the above steps. [Appendix A59] An end effector acting on an object, A movable member whose relative relationship with a part of the object can be changed, A connecting device that connects the movable member and the end effector so that the relative positional relationship between the movable member and the end effector can be changed; A robot system comprising the above components. The connecting device includes a driving member that moves at least one of the movable member and the end effector, and an elastic member that couples the movable member and the end effector. A robot system. [Appendix A60] An end effector acting on an object, A movable member whose relative relationship with a part of the object can be changed, A connecting device that connects the movable member and the end effector so that the relative positional relationship between the movable member and the end effector can be changed, A vibration reduction device that reduces vibration from the movable member to the end effector; A robot system comprising the above components. [Appendix A61] An end effector acting on an object, A movable member whose relative relationship with a part of the object can be changed, A connecting device that connects the movable member and the end effector so that the relative positional relationship between the movable member and the end effector can be changed, A position measuring device that measures the position of the end effector with respect to the object or a reference position; A robot system comprising the above components. The connection device includes a position changing member that changes the position of the end effector with respect to the movable member based on the position measurement result by the position measuring device. Robot system. [Appendix A62] The movable member includes a plurality of arm members and a joint member that swingably connects the plurality of arm members. The robot system according to any one of Appendices A59 to A61. [Appendix A63] The movable member includes a self-propelling device that can self-propel without interfering with the object. The robot system according to any one of Appendices A59 to A62. [Appendix A64] The movable member includes a self-propelling device that can self-propel while being supported by the object. The robot system according to any one of Appendices A59 to A63. [Appendix A65] The movable member includes a flying device that can fly from a position away from the object. The robot system according to any one of Appendices A59 to A64. [Appendix A66] In a connection device that connects an end effector that acts on an object and a movable member whose relative relationship with a part of the object can be changed, It includes a driving member that moves at least one of the movable member and the end effector, and an elastic member that couples the movable member and the end effector. Connecting the movable member and the end effector so that the relative positional relationship between the movable member and the end effector can be changed. Connection device. [Appendix A67] In a connection device that connects an end effector that acts on an object and a movable member whose relative relationship with a part of the object can be changed, It includes a vibration reduction device that reduces vibration from the movable member toward the end effector. Connecting the movable member and the end effector so that the relative positional relationship between the movable member and the end effector can be changed Connecting device. [Appendix A68] In a connecting device that connects an end effector that acts on an object and a movable member whose relative relationship with a part of the object can be changed A position changing member that changes the position of the end effector with respect to the movable member based on the position measurement result by a position measuring device that measures the position of the connecting device and / or the end effector with respect to the object or a reference position is provided Connecting device. [Appendix A69] An end effector that acts on an object A connecting device that connects the movable member and the end effector so that the relative positional relationship between the movable member whose relative relationship with a part of the object can be changed and the end effector can be changed is provided The connecting device includes a driving member that moves at least one of the movable member and the end effector, and an elastic member that couples the movable member and the end effector End effector device. [Appendix A70] An end effector that acts on an object A connecting device that connects the movable member and the end effector so that the relative positional relationship between the movable member whose relative relationship with a part of the object can be changed and the end effector can be changed A vibration reduction device that reduces vibration from the movable member toward the end effector End effector device provided with. [Appendix A71] An end effector that acts on an object A connecting device that connects the movable member and the end effector so that the relative positional relationship between the movable member whose relative relationship with a part of the object can be changed and the end effector can be changed A position measuring device that measures the position of the end effector with respect to the object or the reference position and the connecting device includes a position changing member that changes the position of the end effector with respect to the movable member based on the position measurement result by the position measuring device End effector device.

[0260] The requirements of each of the above embodiments can be combined as appropriate. Some of the requirements of each of the above embodiments may not be used. The requirements of each of the above embodiments can be replaced with the requirements of other embodiments as appropriate. Also, to the extent permitted by law, all the published gazettes and the disclosures of U.S. patents regarding the devices and the like cited in each of the above embodiments are incorporated by reference to form part of the description herein.

[0261] Further, the present invention can be appropriately modified within a range not contrary to the gist or idea of the invention that can be read from the claims and the entire specification, and a processing system, a processing method, a robot system, a connecting device, and an end effector device involving such modifications are also included in the technical idea of the present invention.

Explanation of Reference Numerals

[0262] 1 Processing device 11 Light irradiation device 111 Light source system 1111 Light source 112 Optical system 114 Housing 1122 Galvano mirror 12 Drive system 121 First drive system 1212 Arm drive system 12121 Arm member 12122 Joint member 12123 Actuator 12124 Tip arm member 122 Second drive system 1223 Air spring 1224 Damper member 1225 Drive member 14, 14d, 14e, 14g support device 18, 18b position measurement device 181b indicator member 182b indicator measurement device 19 mounting member 2 control device C recess CP1 concave structure CP2 convex structure EA target irradiation area EL processing light S workpiece SF coating film PE sensitive member SYS processing system SA processing shot area Efa~Eff end effector

Claims

1. A processing system for performing processing relating to an object. A processing device for performing the processing; a first drive unit capable of changing a relative positional relationship between the processing device and a part of the object; a first position measuring device that measures the position of the processing device; a second position measurement device that measures the position of the object; Control device and Equipped with The control device generates control information for controlling the first driving device based on the measurement result of the first position measurement device and the measurement result of the second position measurement device. Processing system.

2. The control device obtains information regarding a relative positional relationship between the processing device and the object based on the measurement result. The processing system of claim 1 .

3. The control device obtaining information about a position of the processing device in a first coordinate system based on the measurement result by the first position measurement device; Obtaining information about the relative position of the processing device and the object in the first coordinate system based on the information about the position. The processing system of claim 2 .

4. The first coordinate system is a coordinate system used to measure a relative positional relationship between the processing device and the object, and the position of the object in the first coordinate system is known. The processing system of claim 3 .

5. The processing device moves to approach the object based on the control information. A processing system according to any one of claims 1 to 4.

6. The control information is first control information, After the processing device performs processing based on the first control information, At least one of the first position measurement device and the second position measurement device measures a result of processing by the processing device based on the first control information; generating second control information different from the first control information for controlling a position of the first driving device based on the result; A processing system according to any one of claims 1 to 5.

7. The second position measuring device is disposed in at least a part of the processing device.

6. The processing system according to claim 4 or 5.

8. Further comprising a second drive device different from the first drive device; The second driving device is provided between the first driving device and the processing device, and is drivable in a direction different from a direction in which the first driving device and the processing device are connected. A processing system according to any one of claims 1 to 7.

9. Generate control information for controlling the second driving device based on the measurement result of the first position measuring device and the measurement result of the second position measuring device. The processing system of claim 8 .

10. Further comprising a third drive device different from the first drive device; The third drive unit is movable relative to the object while supporting the first drive unit. A processing system according to any one of claims 1 to 9.

11. Based on the measurement result of the first position measurement device and the measurement result of the second position measurement device, control information for controlling the third drive device is generated. The processing system of claim 10.

12. The first drive device includes a manipulator. A processing system according to any one of claims 1 to 11.

13. The first position measurement device is capable of irradiating a measurement light onto an index member and receiving the measurement light from the index member, The indicator member is disposed on at least a portion of the processing device. A processing system according to any one of claims 1 to 12.

14. The second position measuring device is capable of imaging the object, A relative positional relationship with the processing device is measured based on the imaging result. A processing system according to any one of claims 1 to 13.

15. The processing device includes an acceleration sensor, The control device generates the control information based on at least one measurement result of the acceleration, the first position measurement device, and the second position measurement device. A processing system according to any one of claims 1 to 14.

16. A method for performing processing on an object. Measuring the position of the processing device; Measuring a position of the object; and moving the processing device so that a relative positional relationship between the processing device and a part of the object is changed based on a result of measuring the position of the processing device and a result of measuring the position of the object. Processing methods.

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