Bonding device

Abstract

To provide a bonding device capable of securing quality of a bonded body by suppressing heat applied to a member constituting the bonded body, according to a manufacture of the bonded body bonded by a bonding material.SOLUTION: A bonding device 100 obtained by bonding a first member 20 to a second member 30 by melting and solidifying a bonding material 40 comprises a cylindrical wall part 113, a base 111 provided with an opening surrounded with the cylindrical wall part 113, and heating means 121 for melting the bonding material 40. The base 111 comprises a window part 117 that inserts the heating means 121 in the cylindrical wall part 113 by determining relative positions of the first member 20 and the second member 30 by storing the first member 20, the second member 30 and the bonding material 40 inside the opening.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to a bonding device.

Background Art

[0002] A technique of bonding two or more members with a bonding material disposed between the members is widely used.

[0003] For example, in the optical unit of Patent Document 1, a bonding material such as solder is disposed between the surface on the tip side of a cylindrical frame member and an optical member, and the bonding material is melted and solidified to fix the frame member and the optical member. Fixing of the frame member and the optical member is disclosed to be performed by placing an optical unit housed in a jig with an annular bonding material and an optical member disposed on the tip surface of the frame member on a conveyor belt of a continuous hydrogen furnace and heating and cooling it.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the bonding of the frame member and the optical member in the optical unit shown in Patent Document 1, the entire jig in which the optical unit is housed is heated. Therefore, heat equal to or higher than the melting point of the bonding member is applied to the frame member and the optical member, and as a result, distortion may occur in the frame member and the optical member. Deformation of the optical member causes changes in the optical characteristics of the optical member. For example, when the optical member is a lens, the focal length of the lens changes, leading to a deterioration in the quality of the bonded body.

[0006] The present invention aims to solve the above problems, and in the production of a joined body joined by a joining material, it provides a joining device capable of ensuring the quality of the joined body by suppressing the heat applied to the members constituting the joined body.

Means for Solving the Problems

[0007] A joining device for melting and solidifying a joining material to join a first member and a second member, comprising a cylindrical wall portion and a base having an opening surrounded by the cylindrical wall portion, and heating means for melting the joining material. The base determines the relative positions of the first member, the second member, and the joining material by accommodating them inside the opening, and the joining device is provided with a window portion through which the heating means is inserted into the cylindrical wall portion. The heating means may be a heating rod. It may be provided with moving means for movably inserting and removing the heating means into and out of the window portion. Further, the heating means may be laser light. Furthermore, the base is a bottomed cylindrical shape, and the second member, the joining material, and the first member are accommodated in this order from the bottom surface, and it may be provided with pressing means for pressing the first member. Also, the base may have a higher thermal conductivity than either the first member or the second member.

Effects of the Invention

[0008] According to the joining device of the present invention, it is possible to suppress the heat applied to the members constituting the joined body, and it is possible to provide a joining device capable of manufacturing the joined body with high quality.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Mode for Carrying Out the Invention

[0010] Hereinafter, the mode for carrying out the present invention will be described with reference to the drawings. In the drawings, in order to make each configuration easy to understand, the actual shape, the actual structure, the scale, the number, etc. in each structure may be made different. FIG. 1 is a diagram showing an example of a bonded body bonded by the bonding device of the present invention. (a) is a plan view of the bonded body, and (b) is a front sectional view taken along the A-A section of (a). The bonded body 10 includes a cylindrical frame body 30, a disk-shaped optical member 20 disposed at one end of the frame body 30, and a bonding material 40 disposed between the frame body 30 and the optical member 20 for bonding the frame body 30 and the optical member 20.

[0011] FIG. 2 is a diagram showing the optical member 20. (a) is a plan view of the optical member 20, and (b) is a front sectional view taken along the A-A section of (a). The optical member 20 is, for example, a disk-shaped member made of a translucent member such as glass or crystal. An annular metal film 21 is formed along the outer edge of the optical member 20 on one main surface of the optical member 20. The metal film 21 is a laminated film of a Ni film as a base layer and an Au film as a surface layer. The metal film 21 is not limited to the laminated film of the Ni film and the Au film, and can be appropriately selected in consideration of the adhesion to the optical member 20 and the bonding material 40. In this embodiment, the outer diameter of the optical member 20 is 6 mm, the height is 1 mm, and the film thickness of the metal film 21 is 1 μm.

[0012] FIG. 3 is a view showing the frame body 30, where (a) is a plan view of the frame body 30 and (b) is a front sectional view taken along the A-A section of (a). The frame body 30 is cylindrical and is made of, for example, a stainless steel member. The frame body 30 has a through hole 31 along the central axis, and a metal film 33 is formed on an annular tip surface 32 which is the tip end portion on at least one end side of the frame body 30. The metal film 33 is a laminated film with a Ni film as the base layer and an Au film as the surface layer. The metal film 33 is not limited to the laminated film of the Ni film and the Au film, and can be appropriately selected in consideration of the adhesion to the optical member 20 and the bonding material 40. In this embodiment, the outer diameter of the frame body 30 is 6 mm, the height is 5 mm, the inner diameter of the through hole 31 is 4 mm, and the laminated film thickness of the metal film 33 is 1 μm.

[0013] FIG. 4 is a view showing the bonding material 40, where (a) is a plan view of the bonding material 40 and (b) is a front sectional view taken along the A-A section of (a). The bonding material 40 is an annular AuSn solder material, and its inner diameter and outer diameter are the same as the inner diameter and outer diameter of the metal film 33 formed on the annular tip surface 32 of the frame body 30 described above, with an inner diameter of 4 mm and an outer diameter of 6 mm. Also, the thickness is 0.2 mm.

[0014] The bonded body 10 is manufactured by disposing the bonding material 40 on the frame body 30, further disposing the optical member 20 on the bonding material 40, and then melting and solidifying the bonding material 40. Hereinafter, the bonding device of the present invention will be described and the manufacturing method of the bonded body 10 will be described.

[0015] (Example 1) FIG. 5 is a front sectional view showing the bonding apparatus 100 according to Embodiment 1 of the present invention, (a) is a plan view, and (b) is a front sectional view taken along the line A-A in (a). Note that FIG. 5 shows a view in which the optical member 20, the frame 30, and the bonding material 40 constituting the bonded body 10 are arranged in the bonding apparatus 100 for easy understanding of the explanation. The bonding apparatus 100 includes a base 111 that positions and supports at least one of the members constituting the bonded body 10, a heating rod 121 as heating means for melting the bonding material 40, an air cylinder 131 as moving means for moving the heating rod 121, and a weight 141 for pressing at least a part of the members constituting the bonded body 10.

[0016] The base 111 is a bottomed cylindrical member made of aluminum nitride and includes a bottom portion 112 and a cylindrical wall portion 113 standing upright upward from the bottom portion 112. The bottom portion 112 is provided with a convex portion 114 protruding upward from the bottom portion 112 in the central portion of the surface where the cylindrical wall portion 113 stands upright. The cylindrical wall portion 113 has one end connected to the bottom portion 112, and the other end not connected to the bottom portion 112 is open, and has a first cylindrical portion 115 located on the bottom portion 112 side and a second cylindrical portion 116 located on the other end side. The first cylindrical portion 115 and the second cylindrical portion 116 have the same outer diameter and their outer circumferences are connected without a step, and the inner diameter of the first cylindrical portion 115 is larger than the inner diameter of the second cylindrical portion 116. The first cylindrical portion 115 has a window portion 117 formed of a through hole that penetrates the inside and outside of the first cylindrical portion 115. Two window portions 117 are provided in the first cylindrical portion 115, and the respective window portions 117 face each other with the central axis of the cylindrical wall portion 113 interposed therebetween.

[0017] Here, the convex portion 114 has an outer diameter of 3.9 mm, which is slightly smaller than the inner diameter of the frame body 30 in the joining body 10, and a protruding height of 2 mm. Further, for the cylindrical wall portion 113, the inner diameter of the first cylindrical portion 115 is 7 mm, and the inner diameter of the second cylindrical portion 116 is 6.1 mm, which is slightly larger than the outer diameter of the optical member 20. The height (axial length) of the first cylindrical portion 115 is 5.5 mm from the location connected to the bottom portion 112, and the height (axial length) of the second cylindrical portion 116 is 1.5 mm. Further, the window portion 117 provided in the first cylindrical portion 115 is disposed at a position 5 mm above (toward the second cylindrical portion 116) in the axial direction from the location where the first cylindrical portion 115 is connected to the bottom portion 112, and its opening diameter is 2 mm, which is larger than the outer diameter of the heating rod 121 described later.

[0018] The heating rod 121 is a micro heater in which an insulating powder made of MgO and a heating element made of a nichrome wire are sealed in a sheath, and it generates heat by passing an electric current through the nichrome wire. The heating rod 121 is disposed such that its tip faces the window portion 117 provided in the first cylindrical portion 115 of the base 111, and is attached to an air cylinder 131 in which the rod operates by air pressure. By controlling the air cylinder 131, its tip can be inserted into and removed from the window portion 117. Note that the tip diameter of the heating rod 121 is 1 mm.

[0019] The weight 141 is a disk-shaped member, and a concave portion 142 is formed on one main surface. The weight 141 has an outer diameter of 5.8 mm, which is smaller than the inner diameter of the second cylindrical portion 116, and can be inserted into the second cylindrical portion 116.

[0020] To manufacture the joining body 10, first, the frame body 30 is placed inside the base 111. The frame body 30 can be placed on the base 111 by inserting the end face side where the metal film 33 of the frame body 30 is not formed, and fitting the through hole 31 of the frame body 30 onto the convex portion 114 provided on the bottom portion 112 of the base 111. At this time, the relative positioning of the base 111 and the frame body 30 is achieved by the outer peripheral surface of the convex portion 114 and the through hole 31.

[0021] Next, a bonding material 40 is placed on the metal film 33 of the frame body 30 placed on the base 111. Then, an optical member 20 is placed on the bonding material 40. The optical member 20 is placed such that the metal film 21 of the optical member 20 is in contact with the bonding material 40. At this time, the second cylindrical portion 116 is set such that its inner diameter portion (inner peripheral surface) faces a part of the outer diameter portion (outer peripheral surface) of the optical member 20 (in this embodiment, a part on the upper side of the optical member 20). The optical member 20 is positioned by the inner diameter portion of the second cylindrical portion 116, and the relative positioning between the frame body 30 placed on the base 111 and the optical member 20 is also performed. Further, when the optical member 20, the frame body 30, and the bonding material 40 are placed on the base 111, the outer periphery of the bonding material 40 and the outer peripheries of a part of the optical member 20 and the frame body 30 in the vicinity of the bonding material 40 (in this embodiment, the lower side of the optical member 20 and the upper side of the frame body 30) face the inner diameter portion of the base 111 with a gap therebetween.

[0022] Next, a weight 141 is placed on the optical member 20. The weight 141 is placed such that the main surface on which the concave portion 142 is formed is in contact with the optical member 20. The weight 141 is set such that a part of its outer peripheral surface faces the inner diameter portion of the second cylindrical portion 116, similar to the optical member 20, and the weight 141 is positioned with respect to the base 111 by the inner diameter portion of the second cylindrical portion 116.

[0023] Next, energize the heating rod 121 to raise the tip of the heating rod 121 to a predetermined temperature. Here, the predetermined temperature can be appropriately set to a temperature higher than the melting point of the bonding material 40. Then, in that state, operate the air cylinder 131 to insert the tip of the heating rod 121 into the window portion 117 of the base 111. Here, the window portion 117 is set to open at a position corresponding to the bonding material 40 placed inside the base 111, and the insertion of the heating rod 121 into the window portion 117 is performed until the tip of the heating rod 121 contacts the outer peripheral surface of the bonding material 40. Then, when the tip of the heating rod 121 contacts the bonding material 40, operate the air cylinder 131 so that the tip of the heating rod 121 moves away from the bonding material 40, and remove the heating rod 121 from the window portion 117. The heat of the bonding material 40, which the tip of the heating rod 121 has contacted, propagates throughout the entire bonding material 40 starting from the contacted portion, and the whole melts. The melted bonding material 40 spreads and wets the metal film 33 of the frame body 30 and the metal film 21 of the optical member 20, and solidifies over time to bond the frame body 30 and the optical member 20.

[0024] Here, as described above, the frame body 30 is positioned by the convex portion 114 of the base 111, and the optical member 20 is positioned by the second cylinder portion 116 in the cylinder wall portion 113 of the base 111. And in this embodiment, in order to melt the bonding material 40 in that state, it is possible to suppress the displacement of the optical member 20 with respect to the frame body 30 that may occur due to the surface tension of the bonding material 40 when the bonding material 40 melts. Further, since the weight 141 is arranged on the optical member 20 to bond the frame body 30 and the optical member 20, the optical member 20 can be bonded flatly to the frame body 30.

[0025] In this embodiment, the tip of the heating rod 121 is brought into contact with the bonding material 40 to melt the bonding material 40, and the heating rod 121 is not brought into contact with the optical member 20 or the frame 30. Therefore, heat is not directly applied to the optical member 20 or the frame 30 from the heating rod 121, and deformation of the optical member 20 or the frame 30 due to heat can be made extremely small, and the influence caused by the heat of the joined body 10 can be suppressed. Note that the heating rod 121 can be separated from the bonding material 40 immediately after contact to further reduce heat conduction to the optical member 20 or the frame 30. This can be achieved by presetting the predetermined temperature at the tip of the heating rod 121 to a temperature at which melting starts immediately when it comes into contact with the bonding material 40.

[0026] In this embodiment, the base 111 is made of aluminum nitride having a high thermal conductivity. By forming the base 111 of a material with a high thermal conductivity, the base 111 can effectively take away the heat received by the optical member 20 or the frame 30 from the heated bonding material 40, and the thermal distortion of the optical member 20 or the frame 30 can be suppressed. Furthermore, the thermal distortion of the base 111 due to heat transfer from each member constituting the heating rod 121 and the joined body 10 can also be suppressed, and the positioning accuracy of the optical member 20 and the frame 30 during melting of the joined body 40 can be improved. When the material of the base 111 is aluminum nitride, the material of the optical member 20 is glass, and the material of the frame 30 is stainless steel, the respective thermal conductivities are typically 180 - 230 W / (m·K), 0.55 - 0.75 W / (m·K), and 16 - 20 W / (m·K).

[0027] (Example 2) Next, another embodiment of the bonding apparatus according to the present invention will be described. FIG. 6 is a front cross-sectional view showing the bonding apparatus 200 according to Example 2 of the present invention, (a) is a plan view, and (b) is a front cross-sectional view taken along the line A-A of (a). FIG. 6 shows a view in which the optical member 20, the frame 30, and the bonding material 40 constituting the bonded body 10 are arranged in the bonding apparatus 200. The bonding apparatus 200 includes a base 210 that positions and supports at least one of the members constituting the bonded body 10, a laser irradiation unit 221 as a heating means for melting the bonding material 40, and a weight 141 for pressing at least a part of the members constituting the bonded body 10. Here, for the sake of clarity of explanation, members having the same configuration as those in the bonding apparatus 100 in Example 1 are denoted by the same reference numerals, and detailed description thereof is omitted here.

[0028] The base 210 is made of aluminum nitride and is composed of a first base 211 and a second base 212. The first base 211 is a bottomed cylindrical member including a bottom portion 2111 and a cylindrical wall portion 2112 standing upward from the bottom portion 2111, and a stepped portion 2113 having a reduced diameter with a predetermined step over the entire outer circumference is provided at the open end of the cylindrical wall portion 2112. The second base 212 is a cylindrical member including a cylindrical wall portion 2122, and a stepped portion 2123 having a reduced diameter with a predetermined step over the entire inner circumference is provided at one end of the cylindrical wall portion 2122. Further, the cylindrical wall portion 2122 has a window portion 2124 formed of a through hole that penetrates the inside and outside of the cylindrical wall portion 2122. Two window portions 2124 are provided in the cylindrical wall portion 2122, and the respective window portions 2124 face each other with the central axis of the cylindrical wall portion 2122 interposed therebetween. A light-transmitting member such as glass may be fitted into the window portion 2124.

[0029] The first base 211 and the second base 212 are configured such that the stepped portion 2113 of the first base 211 and the stepped portion 2123 of the second base 212 are fitted together. Here, the inner diameter of the cylindrical wall portion 2112 of the first base 211 and the inner diameter of the stepped portion 2123 in the cylindrical wall portion 2122 of the second base 212 are 6.1 mm, which is slightly larger than the outer diameters of the optical member 20 and the frame 30. Further, the height (axial length) of the cylindrical wall portion 2112 of the first base 211 is 2.5 mm from the location where it is connected to the bottom portion 2111. Also, in a state where the stepped portion 2113 of the first base 211 and the stepped portion 2123 of the second base 212 are fitted together, the lower end of the stepped portion 2123 of the cylindrical wall portion 2122 of the second base 212 is located at a height of 5.5 mm from the location where the bottom portion 2111 and the cylindrical wall portion 2112 of the first base 211 are connected, and the upper end is located at a height of 7 mm. Further, the window portion 2124 provided in the cylindrical wall portion 2122 is arranged at a position 5 mm above in the axial direction from the location where the cylindrical wall portion 2112 of the first base 211 is connected to the bottom portion 2111 in a state where the stepped portion 2113 of the first base 211 and the stepped portion 2123 of the second base 212 are fitted together, and its opening diameter is 2 mm, which is larger than the laser diameter emitted from the laser irradiation portion 221 described later.

[0030] The laser irradiation portion 221 can be constituted by, for example, a YAG laser or a semiconductor laser that can focus on a minute point. The laser irradiation portion 221 is arranged such that a laser emission port can allow laser light to pass through the window portion 2124 provided in the base 211.

[0031] In the manufacturing of the joined body 10 in the joining apparatus 200 of this embodiment, first, the frame 30 is placed on the base 210 in a state where the first base 211 and the second base 212 are pre-fitted together. The placement of the frame 30 on the base 210 is performed by inserting the end face side where the metal film 33 of the frame 30 is not formed. At this time, the position of the frame 30 is positioned by the inner diameter portion of the cylindrical wall portion 2112 in the first base 211.

[0032] Next, a bonding material 40 is placed on the metal film 33 of the frame body 30 placed on the base 211. Next, the optical member 20 is placed on the bonding material 40. The optical member 20 is placed such that the metal film 21 of the optical member 20 is in contact with the bonding material 40. At this time, for the optical member 20, a part of its outer diameter portion (outer peripheral surface) (in this embodiment, an upper part of the optical member 20) is positioned with respect to the base 210 by the inner diameter portion of the step portion 2123 in the cylindrical wall portion 2122 of the second base 212, and is also positioned with respect to the frame body 30 placed on the base 210. When the optical member 20, the frame body 30, and the bonding material 40 are placed on the base 210, the outer periphery of the bonding material 40 and the outer peripheries of a part of the optical member 20 and the frame body 30 in the vicinity of the bonding material 40 (in this embodiment, the lower side of the optical member 20 and the upper side of the frame body 30) face the inner diameter portion of the base 210, more specifically, the inner diameter portion of the cylindrical wall portion 2122 of the second base 212 with a gap therebetween.

[0033] Next, a weight 141 is placed on the optical member 20. The weight 141 is placed such that the main surface on which the concave portion 142 is formed is in contact with the optical member 20. Similar to the optical member 20, for the weight 141, a part of its outer peripheral surface is positioned with respect to the base 210 by the inner diameter portion of the step portion 2123 in the cylindrical wall portion 2122 of the second base 212.

[0034] Next, the bonding material 40 is melted by irradiating laser light 222 from the laser irradiation unit 221. The laser light 222 emitted from the laser irradiation unit 221 passes through the window portion 2124 of the base 210 and is irradiated onto the bonding material 40. For the bonding material 40 irradiated with the laser light 222, heat propagates throughout the bonding material 40 starting from the irradiated site, and the whole is melted. The melted bonding material 40 spreads and wets the metal film 33 of the frame body 30 and the metal film 21 of the optical member 20, and solidifies over time to bond the frame body 30 and the optical member 20.

[0035] In this embodiment, the bonding material 40 is melted by the laser beam 222 irradiated from the laser irradiation unit 221, and the optical member 20 and the frame 30 are not irradiated with the laser beam 222. Therefore, since heat is not directly applied to the optical member 20 and the frame 30, deformation due to heat of the optical member 20 and the frame 30 is very small, and the influence caused by the heat of the joined body 10 can be suppressed. The irradiation of the laser beam 222 in the laser irradiation unit 221 is preferably performed in a short time within a range where the entire bonding material 40 is appropriately melted. For this purpose, the setting of the laser output may be adjusted as appropriate.

[0036] Also, in this embodiment, similar to Embodiment 1, the base 210 is made of aluminum nitride having a high conductivity. By forming the base 210 of a material having a high thermal conductivity, it is possible to suppress the thermal distortion of the optical member 20, the frame 30, and the base 210, and improve the thermal influence of the joined body 10 and the positioning accuracy of the optical member 20 and the frame 30 when the bonding material 40 is melted.

[0037] Also, in this embodiment, the base 210 is composed of a first base 211 and a second base 212. By configuring the base 210 with a plurality of members in this way, the shapes of the first base 211 and the second base 212 can be simplified, and there is an advantage that the base 210 can be easily manufactured with high accuracy.

[0038] As described above, the bonding apparatus of the present invention has been explained based on the embodiments. However, the scope of the present invention is not limited to the above-described embodiments and can be arbitrarily changed within the scope of the technical idea of the present invention. For example, although an example in which the bases 111 and 210 are made of aluminum nitride has been shown, it is not limited to aluminum nitride and may be made of other materials. In that case, as the material constituting the bases 111 and 210, it is preferable to select a material having a higher thermal conductivity than each member (optical member 20, frame body 30) bonded by the bonding material 40. Further, in the second embodiment, although the base 210 is constituted by a plurality of members, the first base 211 and the second base 212, when the base is constituted by a plurality of members, the materials constituting the respective members are not the same and may be constituted by different materials. Further, in the first embodiment, as the bonding apparatus 100, an example including the base 111 and the heating rod 121 as the heating means of the bonding material 40 has been shown. However, for example, it may be a bonding apparatus including the base 111 and the laser irradiation unit 221 shown in the second embodiment, or may be a bonding apparatus including the base 210 shown in the second embodiment and the heating rod 121 shown in the first embodiment. Further, although an example in which two window portions 117 and 2124 are arranged on the bases 111 and 210 has been shown, it is not limited to two, and one or more than two may be provided. Furthermore, the bonding material 40 is not limited to an AuSn solder material, and an AuGe solder material or the like may be used.

Explanation of Reference Numerals

[0039] 10 Bonded body 20 Optical member 21 Metal film 30 Frame body 31 Through hole 32 Annular tip surface 33 Metal film 40 Bonding material 100 Bonding apparatus 111 Base 112 Bottom portion 113 Cylindrical wall portion 114 Protrusion 115 First cylindrical portion 116 Second cylindrical portion 117 Window portion 121 Heating rod 131 Air cylinder 141 Hammer 142 Concave part 200 Joining device 210 Base 211 First base 2111 Bottom part 2112 Cylindrical wall part 2113 Step part 212 Second base 2122 Cylindrical wall part 2123 Step part 2124 Window part 221 Laser irradiation part 222 Laser beam

Claims

1. A bonding device that melts and solidifies a bonding material to bond a first member and a second member, comprising: a cylindrical wall portion and a base having an opening surrounded by the cylindrical wall portion; heating means for melting the bonding material; the base determines the relative positions of the first member and the second member by accommodating the first member, the second member, and the bonding material inside the opening; a bonding device characterized in that the cylindrical wall portion is provided with a window portion through which the heating means is inserted.

2. The bonding device according to claim 1, characterized in that the heating means is a heating rod.

3. The bonding device according to claim 1 or 2, characterized in that it is provided with moving means for movably inserting and removing the heating means into and out of the window portion.

4. The bonding device according to claim 1, characterized in that the heating means is a laser beam.

5. The base is a bottomed cylindrical shape, and the second member, the bonding material, and the first member are accommodated in this order from the bottom surface; The bonding device according to claim 1, characterized in that it is provided with pressing means for pressing the first member.

6. The bonding device according to claim 1, characterized in that the base has a higher thermal conductivity than either the first member or the second member.

Images