Multilayer electronic component

Abstract

To achieve the objective of improving the reliability of a multilayer electronic component and preventing the space between a side margin part and a body from becoming larger.SOLUTION: The multilayer electronic component according to an embodiment of the present invention includes: a body including a first surface and a second surface facing a first direction, a third surface and a fourth surface facing a second direction, and a fifth surface and a sixth surface facing a third direction; a side margin part arranged in the fifth surface and in the sixth surface; and an external electrode arranged in the third surface and in the fourth surface. The body includes: an active part including internal electrodes alternately arranged with the dielectric layers in the first direction; an upper cover part arranged in the upper part of the active part in the first direction; and a lower cover part arranged in the lower part of the active part in the first direction. The side margin part may include: an inner margin part covering at least a part of the active part in the fifth surface and in the sixth surface; and an external margin part arranged on the internal margin part to be in contact with the upper cover part and the lower cover part.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one type of multilayer electronic component, is a chip-shaped capacitor that is mounted on a printed circuit board of various electronic products such as video equipment like liquid crystal display (LCD) devices and plasma display panel (PDP) devices, computers, smartphones, and mobile phones, and serves to charge or discharge electricity.

[0003] Such a multilayer ceramic capacitor can be used as a component of various electronic devices due to its advantages of being small in size while ensuring high capacitance and being easy to mount. As various electronic devices such as computers and mobile devices are being miniaturized and have increased output, the requirements for miniaturization and high capacitance of multilayer ceramic capacitors are increasing.

[0004] Also, recently, with the increasing interest in the automotive industry for automotive electrical components, multilayer ceramic capacitors are also being used in automobiles and infotainment systems, and high reliability and high strength characteristics are required.

[0005] For miniaturization and high capacitance of multilayer ceramic capacitors, maximization of the effective electrode area (increasing the effective volume fraction required for capacitance realization) is required.

[0006] In order to realize a small-sized and high-capacity multilayer ceramic capacitor as described above, in manufacturing a multilayer ceramic capacitor, by making the internal electrodes exposed in the width direction of the main body, the area in the width direction of the internal electrodes is maximized with a marginless design. However, a method is applied in which a side margin portion is separately attached to the electrode exposed surface in the width direction of the chip at the firing stage before chip production after such chip production to complete it.

[0007] However, due to foreign matters present on the cut main body surface, plasticity, and / or a difference in shrinkage rate between the main body and the side margin portion at the firing stage, etc., the side margin portion cannot be satisfactorily joined to the main body, and there has been a problem that the space between the side margin portion and the main body widens.

Summary of the Invention

Problems to be Solved by the Invention

[0008] One of various objects of the present invention is to improve the reliability of multilayer electronic components.

[0009] One of various objects of the present invention is to solve the problem that the space between the side margin portion and the main body widens.

[0010] However, the object of the present invention is not limited to the above-described content and can be more easily understood in the process of explaining specific embodiments of the present invention.

Means for Solving the Problems

[0011] A multilayer electronic component according to an embodiment of the present invention includes a plurality of dielectric layers, a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and facing each other in a third direction. The multilayer electronic component also includes a side margin portion disposed on the fifth and sixth surfaces, and external electrodes disposed on the third and fourth surfaces. The main body includes an active portion including internal electrodes alternately disposed with the dielectric layers in the first direction, an upper cover portion disposed above the active portion in the first direction, and a lower cover portion disposed below the active portion in the first direction. The side margin portion may include an inner margin portion covering at least a part of the active portion on the fifth and sixth surfaces and an outer margin portion disposed on the inner margin portion and arranged to be in contact with the upper cover portion and the lower cover portion.

Advantages of the Invention

[0012] One of the various advantages of the present invention is that the reliability of the multilayer electronic component is improved.

[0013] One of the various advantages of the present invention is that the bonding strength between the side margin portion and the main body is improved.

[0014] However, the diverse and significant advantages and effects of the present invention are not limited to the above-described content and can be more easily understood during the process of explaining specific embodiments of the present invention.

Brief Description of the Drawings

[0015]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Mode for Carrying Out the Invention

[0016] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to an ordinary technician. Therefore, the shape and size of elements in the drawings may be enlarged or reduced (or emphasized or simplified) for a clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements.

[0017] For the sake of clearly explaining the present invention in the drawings, parts not related to the explanation are omitted. The sizes and thicknesses of the illustrated components are arbitrarily shown for convenience of explanation, so the present invention is not necessarily limited by the illustration. Also, components with the same functions within the scope of the same concept can be described using the same reference numerals. Furthermore, throughout the specification, when a part "includes" a certain component, it means that other components can be further included, rather than excluding other components, unless otherwise stated to the contrary.

[0018] In the drawings, the first direction can be defined as the stacking direction or the thickness (T) direction, the second direction as the length (L) direction, and the third direction as the width (W) direction.

[0019] Multilayer electronic component FIG. 1 schematically shows a perspective view of a stacked electronic component according to an embodiment of the present invention. FIG. 2 is a perspective view of the stacked electronic component of FIG. 1 shown excluding the external electrodes. FIG. 3 is a perspective view of the stacked electronic component of FIG. 1 shown excluding the external electrodes and the side margin portion. FIG. 4 is a cross-sectional view taken along the line I-I' of FIG. 1. FIG. 5 is a cross-sectional view taken along the line II-II' of FIG. 1. FIG. 6 is an enlarged view of the K1 region of FIG. 5. FIG. 7 is an enlarged view of the K2 region of FIG. 5.

[0020] Hereinafter, with reference to FIGS. 1 to 7, a stacked electronic component according to an embodiment of the present invention will be described in detail.

[0021] A stacked electronic component 100 according to an embodiment of the present invention includes a plurality of dielectric layers 111, first and second surfaces 1 and 2 facing each other in a first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces 5 and 6 connected to the first to fourth surfaces and facing each other in a third direction. The main body 110 includes an active portion Ac including internal electrodes 121 and 122 alternately arranged with the dielectric layers in the first direction, an upper cover portion 112 disposed above the active portion in the first direction, and a lower cover portion 113 disposed below the active portion in the first direction. The side margin portions include inner margin portions 114a and 115a that cover at least a part of the active portion on the fifth and sixth surfaces, and outer margin portions 114b and 115b that are disposed on the inner margin portions and are arranged to be in contact with the upper cover portion and the lower cover portion.

[0022] In order to realize a small and high-capacity multilayer ceramic capacitor, when manufacturing a multilayer ceramic capacitor, by making the internal electrodes exposed in the width direction of the main body, the area of the internal electrodes in the width direction is maximized by a design without a margin. However, a method has been developed in which a side margin portion is separately attached to the electrode exposed surface in the width direction of the chip at a stage before firing after such chip production to complete.

[0023] However, due to foreign matters present on the cut main body surface, plasticity, and / or a difference in shrinkage rate between the main body and the side margin portion at the firing stage, the side margin portion cannot be satisfactorily joined to the main body, and there may occur a problem that a gap is formed between the side margin portion and the main body.

[0024] According to an embodiment of the present invention, by including inner margin portions 114a and 115a that cover at least a part of the active portion Ac on the fifth and sixth surfaces and outer margin portions 114b and 115b that are disposed on the inner margin portions and are arranged to contact the upper cover portion and the lower cover portion, the bonding force between the side margin portion and the main body can be improved, and it is possible to suppress the widening between the side margin portion and the main body.

[0025] Hereinafter, each configuration of the laminated electronic component 100 according to an embodiment of the present invention will be described in detail.

[0026] The main body 110 has a dielectric layer 111 and internal electrodes 121 and 122 laminated alternately.

[0027] There is no particular limitation on the specific shape of the main body 110, but as shown in the figure, the main body 110 can be formed in a hexahedron shape or a shape similar thereto. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 does not have a perfect straight hexahedron shape, but can have a substantially hexahedron shape.

[0028] The main body 110 can have a first surface 1 and a second surface 2 that face each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and face each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1 and the second surface 2, are connected to the third surface 3 and the fourth surface 4, and face each other in a third direction.

[0029] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundary between adjacent dielectric layers 111 can be integrated so that it is difficult to confirm without using a scanning electron microscope (SEM).

[0030] According to an embodiment of the present invention, the raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, a strontium titanate-based material, or the like can be used. The barium titanate-based material can include BaTiO 3 -based ceramic powder. As an example of the ceramic powder, BaTiO 3 , BaTiO 3 in which Ca (calcium), Zr (zirconium), etc. are partially solid-solved (Ba 1-x Ca x )TiO 3 , Ba(Ti 1-y Ca y )O 3 , (Ba 1-x Ca x )(Ti 1-y Zr y )O 3 or Ba(Ti 1-y Zr y )O 3 , etc. can be mentioned.

[0031] The material for forming the dielectric layer 111 can be various ceramic additives, organic solvents, binders, dispersants, etc. added to powders such as barium titanate (BaTiO 3 ) according to the purpose of the present invention.

[0032] The internal electrodes 121 and 122 can be alternately arranged with the dielectric layer 111.

[0033] The internal electrodes 121 and 122 can include the first and second internal electrodes 121 and 122. The first and second internal electrodes 121 and 122 are alternately arranged so as to face each other with the dielectric layer 111 constituting the main body 110 interposed therebetween, and can be respectively exposed on the third and fourth surfaces 3 and 4 of the main body 110.

[0034] In one embodiment, the internal electrodes 121 and 122 include first and second internal electrodes 121 and 122 that are alternately arranged in a first direction with the dielectric layer 111 interposed therebetween. The first internal electrode 121 can be connected to the third, fifth, and sixth surfaces, and the second internal electrode 122 can be connected to the fourth, fifth, and sixth surfaces.

[0035] Referring to FIG. 3, the first internal electrode 121 can be separated from the fourth surface 4 and exposed through the third surface 3, and the second internal electrode 122 can be separated from the third surface 3 and exposed through the fourth surface 4. Further, the first internal electrode 121 can be exposed through the third, fifth, and sixth surfaces 3, 5, and 6, and the second internal electrode 122 can be exposed through the fourth, fifth, and sixth surfaces 4, 5, and 6.

[0036] At this time, the first and second internal electrodes 121 and 122 can be electrically separated from each other by the dielectric layer 111 disposed therebetween.

[0037] The internal electrodes 121 and 122 can include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0038] The average thickness td of the dielectric layer 111 does not need to be particularly limited, but can be, for example, 0.1 μm to 10 μm. The average thickness te of the internal electrodes 121 and 122 does not need to be particularly limited, but can be, for example, 0.4 μm to 2.0 μm. Further, the average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be arbitrarily set according to desired characteristics and applications. For example, in the case of electronic components for small ITs to achieve miniaturization and high capacitance, the average thickness td of the dielectric layer 111 can be 0.5 μm or less, and the average thickness te of the internal electrodes 121 and 122 can be 0.5 μm or less.

[0039] The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 respectively represent the sizes of the dielectric layer 111 and the internal electrodes 121 and 122 in the first direction. The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be measured by scanning the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, for the average thickness td of the dielectric layer 111, the thickness can be measured at a number of points on one dielectric layer 111, for example, 30 equally spaced points in the second direction, and the average value can be measured. Also, for the average thickness te of the internal electrodes 121 and 122, the thickness can be measured at a number of points on one internal electrode 121 or 122, for example, 30 equally spaced points in the second direction, and the average value can be measured. The 30 equally spaced points can be specified in the capacitance forming portion Ac. On the other hand, after performing such average value measurements for 10 dielectric layers 111 and 10 internal electrodes 121 and 122 respectively and then measuring the average values, the average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be further generalized.

[0040] The main body 110 includes an active portion Ac in which a capacitance is formed, which is disposed inside the main body 110 and includes a first internal electrode 121 and a second internal electrode 122 that are disposed to face each other with the dielectric layer 111 interposed therebetween, and cover portions 112 and 113 formed on the upper and lower portions of the active portion Ac in the first direction.

[0041] Also, the active portion Ac is a portion that contributes to the formation of the capacitance of the capacitor, and can be formed by repeatedly laminating a plurality of first and second internal electrodes 121 and 122 with the dielectric layer 111 interposed therebetween.

[0042] The upper cover portion 112 and the lower cover portion 113 can be formed by laminating a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the active portion Ac respectively, and can basically play a role in preventing damage to the internal electrodes due to physical or chemical stress.

[0043] The upper cover portion 112 and the lower cover portion 113 do not include internal electrodes and can include the same material as the dielectric layer 111.

[0044] That is, the upper cover portion 112 and the lower cover portion 113 can include a ceramic material, for example, a barium titanate (BaTiO 3 )-based ceramic material.

[0045] On the other hand, the thickness of the cover portions 112 and 113 does not need to be particularly limited. However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the thickness tc of the cover portions 112 and 113 can be 30 μm or less.

[0046] The average thickness tc of the cover portions 112 and 113 can mean the size in the first direction, and can be a value obtained by averaging the sizes in the first direction of the cover portions 112 and 113 measured at five equally spaced points above or below the capacitance forming portion Ac.

[0047] Also, side margin portions 114 and 115 can be arranged on the side surfaces of the active portion Ac.

[0048] The side margin portions 114 and 115 can include a first side margin portion 114 arranged on the fifth surface 5 of the main body 110 and a second side margin portion 115 arranged on the fifth surface 5. That is, the margin portions 114 and 115 can be arranged on both end surfaces in the third direction of the main body 110.

[0049] The side margin portions 114 and 115 can basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0050] The side margin portions 114 and 115 can include inner margin portions 114a and 115a that cover at least a part of the active portion Ac on the fifth and sixth surfaces, and outer margin portions 114b and 115b that are disposed on the inner margin portions and are arranged to be in contact with the upper cover portion and the lower cover portion. Thereby, the bonding force between the side margin portions 114 and 115 and the main body 110 can be improved, and it is possible to suppress the widening between the side margin portions 114 and 115 and the main body 110.

[0051] The fifth and sixth surfaces of the main body 110 include the active portion Ac and the cover portions 112 and 113. Since the active portion Ac includes not only the dielectric layer 111 but also the internal electrodes 121 and 122, when forming the side margin portion by attaching only one type of sheet as in the prior art, it was difficult to simultaneously improve the bonding force between the side margin portion and the active portion Ac and the cover portions 112 and 113. On the other hand, in the present invention, the inner margin portions 114a and 115a serve to increase the bonding force between the side margin portions 114 and 115 and the active portion Ac, and the outer margin portions 114b and 115b can serve to increase the bonding force between the side margin portions 114 and 115 and the cover portions 112 and 113. Therefore, the bonding force between the side margin portions 114 and 115 and the active portion Ac and the cover portions 112 and 113 can be simultaneously improved.

[0052] In one embodiment, the outer margin portions 114b and 115b can be arranged to cover the upper and lower ends of the inner margin portions 114a and 115a in the first direction. Thereby, the region of the outer margin portions 114b and 115b that covers the upper and lower ends of the inner margin portions 114a and 115a in the first direction can have a step.

[0053] In one embodiment, the inner margin portions 114a and 115a can be arranged to entirely cover the active portion Ac on the fifth and sixth surfaces. Thereby, the contact area between the inner margin portions 114a and 115a and the active portion can be increased, and the bonding force between the side margin portions 114 and 115 and the main body 110 can be further improved.

[0054] However, it is not necessary to limit that the inner margin portions 114a and 115a only cover the active portion Ac. In one embodiment, the upper ends of the inner margin portions 114a and 115a in the first direction may be in contact with the upper cover portion 112 on the fifth and sixth surfaces, and the lower ends of the inner margin portions 114a and 115a in the first direction may be in contact with the lower cover portion 113 on the fifth and sixth surfaces.

[0055] In one embodiment, the regions of the outer margin portions 114b and 115b that cover the upper and lower ends of the inner margin portions 114a and 115a in the first direction may have a step. This is because, since the outer margin portions 114b and 115b have a form of covering the inner margin portions 114a and 115a, in the regions where the inner margin portions 114a and 115a are not arranged, the width of the side margin portion in the third direction is reduced accordingly.

[0056] In one embodiment, the outer margin portions 114b and 115b may be arranged to cover all of the inner margin portions 114a and 115a. That is, the outer margin portions 114b and 115b may cover not only both ends of the inner margin portions 114a and 115a in the first direction but also both ends of the inner margin portions 114a and 115a in the second direction, and may be arranged in a form of covering all of the inner margin portions 114a and 115a.

[0057] Referring to FIG. 7, the upper ends of the outer margin portions 114b and 115b in the first direction may be arranged on the same plane as the second surface, and the lower ends of the outer margin portions in the first direction may be arranged on the same plane as the first surface.

[0058] However, when considering manufacturing errors and the like of the side margin portion, it is not necessarily required to have such a form.

[0059] For example, according to another embodiment of the present invention, as shown in FIG. 8, the upper ends of the outer margin portions 114b' and 115b' in the first direction are arranged below the second surface in the first direction, and the lower ends of the outer margin portions 114b' and 115b' in the first direction can be arranged above the first surface in the first direction. At this time, the upper ends of the outer margin portions 114b' and 115b' in the first direction are in contact with the upper cover portion 112 on the third and fourth surfaces, and the lower ends of the outer margin portions 114b' and 115b' in the first direction can be in contact with the lower cover portion 113 on the third and fourth surfaces.

[0060] Further, according to still another embodiment of the present invention, as shown in FIG. 9, the upper ends of the outer margin portions 114b'' and 115b'' in the first direction are arranged above the second surface in the first direction, and the lower ends of the outer margin portions 114b'' and 115b'' in the first direction can be arranged below the first surface in the first direction. At this time, at least a part of the outer margin portions 114b'' and 115b'' can be arranged on the first and second surfaces.

[0061] In one embodiment, the average width Tma of the inner margin portions 114a and 115a in the third direction can be 0.5 μm or more and 5 μm or less. When Tma is less than 0.5 μm, it is difficult to stably form the inner margin portions 114a and 115a. When it exceeds 5 μm, the step formed by the inner margin portions 114a and 115a becomes large, and there is a possibility that the outer margin portions 114b and 115b cannot be well joined.

[0062] In one embodiment, the average width Tmb of the outer margin portions 114b and 115b in the third direction can be 15 μm or more and 40 μm or less. When Tmb is less than 15 μm, the capacity per unit volume may decrease, or the reliability may decrease due to external impact, moisture penetration, etc. When it exceeds 40 μm, there is a possibility that the capacity per unit volume may decrease.

[0063] In one embodiment, when the average width in the third direction of the inner margin portions 114a and 115a is Tma and the average width in the third direction of the outer margin portions 114b and 115b is Tmb, Tmb / Tma can be 3 or more and 80 or less. Thereby, the effect of further improving the reliability while improving the bonding force between the side margin portions 114 and 115 and the main body 110 can be achieved.

[0064] In one embodiment, when the width in the third direction at the center in the first direction of the side margin portions 114 and 115 is Tm1 and the width in the third direction at the upper end in the first direction of the side margin portions 114 and 115 is Tm2, Tm1 - Tm2 can be 0.5 μm or more and 5 μm or less. This is because the inner margin portions 114a and 115a are not arranged at the upper end in the first direction of the side margin portions 114 and 115, so the width can be reduced by the width of the inner margin portions 114a and 115a.

[0065] On the other hand, the widths in the third direction of the side margin portions 114 and 115 in the region where the inner margin portions 114a and 115a are arranged can be substantially the same, and the deviation of the width can be within 5%. Referring to FIG. 5 for a more detailed description, the widths in the third direction of the side margin portions 114 and 115 measured by the innermost internal electrodes 121 and 122 can be substantially the same as the widths in the third direction at the center in the first direction of the side margin portions 114 and 115, and the deviation of the width can be within 5%.

[0066] The above Tma, Tmb, Tm1, and Tm2 can be measured in the cross-sections in the first and third directions cut at the center in the second direction of the main body 110, and Tma and Tmb can be the average values of the values measured at five equally spaced points on the side surfaces of the capacitance forming portions Ac of the side margin portions 114 and 115.

[0067] In one embodiment, the inner margin portions 114a and 115a can have a composition different from that of the outer margin portions 114b and 115b. When the inner margin portions 114a and 115a and the outer margin portions 114b and 115b have the same composition, it may be difficult to simultaneously improve the bonding strength between the side margin portion and the active portion Ac and the cover portions 112 and 113.

[0068] The inner margin portions 114a and 115a can use a composition identical or similar to the composition for forming the dielectric layer of the active portion Ac in order to ensure the bonding strength with the active portion Ac. Also, the binder content contained in the material for forming the inner margin portions 114a and 115a can be made higher than the binder content contained in the material for forming the outer margin portions 114b and 115b.

[0069] The outer margin portions 114b and 115b can use the same composition as the dielectric sheet for forming the cover portions 112 and 113. Also, since the outer margin portions 114b and 115b are exposed to the outside, they can contain additives for preventing external impact and moisture penetration.

[0070] In one embodiment, the porosity of the inner margin portions 114a and 115a can be higher than the porosity of the outer margin portions 114b and 115b. When the binder content contained in the material for forming the inner margin portions 114a and 115a is made higher than the binder content contained in the material for forming the outer margin portions 114b and 115b to ensure the bonding strength with the active portion Ac, the binder is removed in the firing and sintering processes, and pores can be formed at the locations where the binder was present. As a result, the porosity of the inner margin portions 114a and 115a can be higher than the porosity of the outer margin portions 114b and 115b.

[0071] On the other hand, the method for forming the side margin portions 114 and 115 does not need to be particularly limited.

[0072] Referring to FIG. 10 as a preferred example, before sintering, the main body 10 can be attached to the upper plate 60 at a distance from each other, and the sheets 14b for forming the outer margin portions 114b, 115b and the sheets 14a for forming the inner margin portions 114a, 115a can be arranged on the lower plate 50. The upper plate 60 can include upper support bases 61, 62 and an adhesive member 63, and the lower plate 50 can include a lower support base 51 and an elastic member 52. The fifth or sixth surface of the main body 10 before sintering can be attached to the adhesive member 63. At this time, the sheets 14a for forming the inner margin portions 114a, 115a can be arranged separately on the sheets 14b for forming the outer margin portions 114b, 115b so as to be joined only to the capacitance forming portion of the main body 10 before sintering, and can be manufactured to have the same size as the capacitance forming portion of the surface of the main body 10 before sintering to which it is attached.

[0073] After that, when pressurized as shown in FIG. 11, the sheets 14a for forming the inner margin portions 114a, 115a are attached to the capacitance forming portion by the pressure, and a part of the sheets 14b for forming the outer margin portions 114b, 115b can be cut. After that, after performing the same process on the surface of the main body 10 before sintering attached to the adhesive member 63, the main body 110 and the side margin portions 114, 115 can be formed through a sintering process.

[0074] However, it is not limited to this, and it can also be manufactured by a method of forming the inner margin portions 114a, 115a by applying a material for forming the inner margin portions 114a, 115a to the capacitance forming portion of the main body 10 before sintering.

[0075] The external electrodes 131, 132 can be arranged on the third surface 3 and the fourth surface 4 of the main body 110.

[0076] The external electrodes 131, 132 can be arranged on the third and fourth surfaces 3, 4 of the main body 110 respectively, and can include first and second external electrodes 131, 132 respectively connected to the first and second internal electrodes 121, 122.

[0077] Referring to FIG. 1, the external electrodes 131 and 132 can be arranged to cover both end faces in the second direction of the side margin portions 114 and 115.

[0078] In this embodiment, the structure in which the multilayer electronic component 100 has two external electrodes 131 and 132 is described. However, the number, shape, etc. of the external electrodes 131 and 132 can be changed according to the form of the internal electrodes 121 and 122 and other purposes.

[0079] In one embodiment, the external electrodes 131 and 132 include a first external electrode 131 disposed on the third surface of the main body 110 and a second external electrode 132 disposed on the fourth surface of the main body 110. The first external electrode 131 can cover one end in the second direction of the side margin portions 114 and 115, and the second external electrode 132 can cover the other end in the second direction of the side margin portions 114 and 115.

[0080] In one embodiment, the internal electrodes 121 and 122 include a first internal electrode 121 in contact with the first external electrode 131 and a second internal electrode 122 in contact with the second external electrode 132. Both end portions in the third direction of the first and second internal electrodes 121 and 122 can be in contact with the side margin portions 114 and 115.

[0081] On the other hand, the external electrodes 131 and 132 can be formed using any material as long as it has electrical conductivity such as metal. A specific material can be determined in consideration of electrical characteristics, structural stability, etc., and it can further have a multilayer structure.

[0082] For example, the external electrodes 131 and 132 can include electrode layers 131a and 132a disposed on the main body 110 and plating layers 131b and 132b formed on the electrode layers 131a and 132a.

[0083] More specific examples of the electrode layers 131a and 132a are that the electrode layers 131a and 132a can be fired electrodes including conductive metal and glass, or resin-based electrodes including conductive metal and resin.

[0084] In addition, the electrode layers 131a and 132a can be in a form in which a fired electrode and a resin-based electrode are sequentially formed on the main body. Further, the electrode layers 131a and 132a can be formed by a method of transferring a sheet containing a conductive metal onto the main body, or can be formed by a method of transferring a sheet containing a conductive metal onto the fired electrode.

[0085] As the conductive metal contained in the electrode layers 131a and 132a, a material having excellent electrical conductivity can be used, but it is not particularly limited. For example, the conductive metal can be one or more of nickel (Ni), copper (Cu), and alloys thereof.

[0086] The plating layers 131b and 132b serve to improve the mounting characteristics. The types of the plating layers 131b and 132b are not particularly limited, and can be plating layers containing one or more of Ni, Sn, Pd, and alloys thereof, and can be formed of a plurality of layers.

[0087] More specific examples of the plating layers 131b and 132b are as follows. The plating layers 131b and 132b can be Ni plating layers or Sn plating layers, and can be in a form in which a Ni plating layer and an Sn plating layer are sequentially formed on the electrode layers 131a and 132a, or can be in a form in which an Sn plating layer, a Ni plating layer, and an Sn plating layer are sequentially formed. Further, the plating layers 131b and 132b can also include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0088] The size of the multilayer electronic component 100 does not need to be particularly limited.

[0089] However, in order to simultaneously achieve miniaturization and high capacity, the thicknesses of the dielectric layer and the internal electrodes need to be reduced and the number of laminations needs to be increased. Therefore, in the multilayer electronic component 100 having a size of 1005 (length × width, 1.0 mm × 0.5 mm) or less, the effect of improving the reliability according to the present invention can be more remarkable.

[0090] Considering manufacturing errors, the size of the external electrodes, etc., when the length of the multilayer electronic component 100 is 1.1 mm or less and the width is 0.55 mm or less, the effects of improving the reliability and the capacitance per unit volume according to the present invention can be made more remarkable. Here, the length of the multilayer electronic component 100 means the maximum size in the second direction of the multilayer electronic component 100, and the width of the multilayer electronic component 100 can mean the maximum size in the third direction of the multilayer electronic component 100.

[0091] As described above, the embodiments of the present invention have been described in detail. However, the present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, within the scope not departing from the technical idea of the present invention described in the claims, various forms of substitution, modification, and change are possible by those having ordinary knowledge in the art, and it can be said that these also belong to the scope of the present invention.

[0092] In addition, the expression "one embodiment" used in the present disclosure does not mean the same embodiment, but is provided to emphasize and explain each different unique feature. However, the above-presented one embodiment does not exclude being implemented in combination with the features of another one embodiment. For example, even if a matter described in a specific one embodiment is not described in another one embodiment, it can be understood as an explanation related to another one embodiment as long as there is no explanation contrary to or conflicting with that matter in another one embodiment.

[0093] The terms used in the present disclosure are merely used to explain one embodiment and are not intended to limit the present disclosure. At this time, the singular expression includes the plural expression unless it clearly means something different in the context.

Explanation of Reference Numerals

[0094] 100 Multilayer electronic component 110 Body 111 Dielectric layer 112, 113 Cover portions 114 and 115 side margin parts 114a and 115a inner margin parts 114b and 115b outer margin parts 121 and 122 internal electrodes 131 and 132 external electrodes 131a and 132a electrode layers 131b and 132b plating layers

Claims

1. a body including a plurality of dielectric layers, the body including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in the third direction; Side margin portions disposed on the fifth and sixth surfaces; external electrodes disposed on the third and fourth surfaces; the body includes an active portion including internal electrodes alternately disposed in the first direction with the dielectric layers, an upper cover portion disposed on an upper portion of the active portion in the first direction, and a lower cover portion disposed on a lower portion of the active portion in the first direction, the side margin portion includes an inner margin portion covering at least a portion of the active portion on the fifth and sixth surfaces, and an outer margin portion arranged on the inner margin portion and arranged so as to contact the upper cover portion and the lower cover portion.

2. The multilayer electronic component according to claim 1 , wherein the outer margin portion is disposed so as to cover an upper end and a lower end in the first direction of the inner margin portion.

3. 2. The multilayer electronic component according to claim 1, wherein the inner margin portion is disposed so as to entirely cover the active portion on the fifth and sixth faces.

4. 2. The multilayer electronic component according to claim 1, wherein an upper end of the inner margin portion in the first direction contacts the upper cover portion at the fifth and sixth faces, and a lower end of the inner margin portion in the first direction contacts the lower cover portion at the fifth and sixth faces.

5. The multilayer electronic component according to claim 1 , wherein the outer margin portion has a step in a region covering an upper end and a lower end in the first direction of the inner margin portion.

6. The multilayer electronic component according to claim 1 , wherein the outer margin portion is disposed so as to entirely cover the inner margin portion.

7. 2. The multilayer electronic component according to claim 1, wherein an upper end of the outer margin portion in the first direction is disposed on the same plane as the second surface, and a lower end of the outer margin portion in the first direction is disposed on the same plane as the first surface.

8. 2. The multilayer electronic component according to claim 1, wherein an upper end of the outer margin portion in the first direction is disposed lower in the first direction than the second surface, and a lower end of the outer margin portion in the first direction is disposed higher in the first direction than the first surface.

9. 2. The multilayer electronic component according to claim 1, wherein an upper end of the outer margin portion in the first direction contacts the upper cover portion at the fifth and sixth faces, and a lower end of the outer margin portion in the first direction contacts the lower cover portion at the fifth and sixth faces.

10. 2. The multilayer electronic component according to claim 1, wherein an upper end of the outer margin portion in the first direction is disposed above the second surface in the first direction, and a lower end of the outer margin portion in the first direction is disposed below the first surface in the first direction.

11. The multilayer electronic component according to claim 1 , wherein at least a portion of the outer margin portion is disposed on the first and second faces.

12. 2. The multilayer electronic component according to claim 1, wherein an average width of the inner margin portion in the third direction is not less than 0.5 μm and not more than 5 μm.

13. 2. The multilayer electronic component according to claim 1, wherein an average width of the outer margin portion in the third direction is 15 μm or more and 40 μm or less.

14. 2. The multilayer electronic component according to claim 1, wherein Tmb / Tma is 3 or more and 80 or less, where Tma is an average width in the third direction of the inner margin portion and Tmb is an average width in the third direction of the outer margin portion.

15. 2. The multilayer electronic component according to claim 1, wherein an average width in the third direction at a center in the first direction of the side margin portion is Tm1, and an average width in the third direction at an upper end of the side margin portion in the first direction is Tm2, ​​Tm1-Tm2 is 0.5 μm or more and 5 μm or less.

16. The multilayer electronic component according to claim 1 , wherein the inner margin portion has a different composition than the outer margin portion.

17. The multilayer electronic component according to claim 1 , wherein the porosity of the inner margin portion is higher than the porosity of the outer margin portion.

18. 2. The multilayer electronic component according to claim 1, wherein the internal electrodes include first and second internal electrodes alternately arranged in a first direction with the dielectric layer interposed therebetween, the first internal electrodes being connected to the third, fifth, and sixth surfaces, and the second internal electrodes being connected to the fourth, fifth, and sixth surfaces.

19. the external electrodes include a first external electrode disposed on the third surface and a second external electrode disposed on the fourth surface; The multilayer electronic component according to claim 1 , wherein the first external electrode covers one end of the side margin portion in the second direction, and the second external electrode covers the other end of the side margin portion in the second direction.

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