On-vehicle battery charger and inverter
The in-vehicle charger and inverter design addresses the challenge of heat dissipation in compact devices by using a heat transfer body with a potting material connection, enabling efficient thermal management without increasing the device's size.
Patent Information
- Application Number
- JP2025036350
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-03-07
- Publication Date
- 2025-05-30
- Estimated Expiration
- 2035-12-10
AI Technical Summary
Existing in-vehicle charger and inverter designs face challenges in heat dissipation while maintaining a compact size, as they rely on heat radiating mechanisms with openings only on one surface, limiting the arrangement of heat-generating electronic components and increasing the device's size.
The design incorporates a heat transfer body with a housing portion that accommodates a reactor component, thermally connected via a potting material. This configuration allows for efficient heat dissipation by connecting the heat-generating electronic component to the heat transfer body and the reactor component to the heat dissipation component, while maintaining a compact form factor.
This solution effectively manages heat dissipation for heat-generating electronic components within the compact design of in-vehicle chargers and inverters, preventing an increase in device size and ensuring efficient thermal management.
Smart Images
Figure 2025083416000001_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to an in-vehicle charger and an inverter.
Background Art
[0002] Conventionally, it is known to store a substrate and electronic components in a substantially rectangular parallelepiped housing formed of a heat dissipation member, and dissipate heat generated from the electronic components through the housing. As a manufacturing method of such a substantially rectangular parallelepiped housing structure, there are two methods: a method of covering a housing with an upper surface and a side surface integrally formed in a box shape and an opening formed in a lower surface from above; and a method of covering a lid member (upper surface) on a housing with a lower surface (bottom surface) and a side surface integrally formed in a box shape and an opening formed in an upper surface.
[0003] When using the method of covering a housing with an upper surface and a side surface integrally formed in a box shape and an opening formed in a lower surface from above, when attaching a substrate or electronic components to the lower surface, since there is no side surface, it is possible to screw the electronic components from the side. However, on the other hand, there are restrictions on the arrangement of terminals (connectors) for electrically connecting the electronic components stored in the housing to the electronic components outside the housing.
[0004] Generally, when providing a connector on the side surface, it is preferable to use the method of covering a lid member (upper surface) on a housing with a lower surface and a side surface integrally formed in a box shape and an opening formed in an upper surface.
[0005] However, in the method of covering a lid member (upper surface) on a housing with a lower surface and a side surface integrally formed in a box shape and an opening formed in an upper surface, since the lower surface and the side surface are integrally formed in a box shape, it is impossible to screw the electronic components from the side, and it is necessary to screw from the opened upper surface.
[0006] As a method of screwing to fix an electronic component from an open top surface, the heat radiating surface of the heat generating electronic component is placed in direct contact with the bottom surface by bending the lead wire of the heat generating electronic component. For example, it is conceivable to screw the elastic member from above so that the elastic member disclosed in Patent Document 1 presses the surface on the opposite side of the heat radiating surface.
Prior Art Documents
Patent Documents
[0007]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0008] However, in the method of arranging the heat generating electronic component on the bottom surface of the above-described heat radiating mechanism, in order to ensure the heat radiating effect, the area of the portion where the heat radiating surface of the heat generating electronic component contacts on the bottom surface of the heat radiating mechanism and the area of the portion where the elastic member is installed are required, and there is a risk that the bottom area will increase, and consequently the entire device will become larger.
[0009] An object of the present invention is to provide an in-vehicle charger and an inverter that can cope with heat dissipation of a heat generating electronic component while suppressing an increase in size when using a heat radiating mechanism integrally formed in a box shape and having an opening provided only on one surface.
Means for Solving the Problems
[0010] The in-vehicle charger according to one aspect of the present invention includes a circuit board, a heat-generating electronic component connected to the circuit board, a heat transfer body on which the heat-generating electronic component is disposed, the heat transfer body having a housing portion provided with a space for housing a reactor component, the reactor component being thermally connected to a heat dissipation component, and a potting material being filled between the reactor component and the housing portion, whereby the reactor component and the heat transfer body are thermally connected by the potting material. The heat transfer body has a second surface and a third surface. The heat transfer body is thermally connected to the heat-generating electronic component via the second surface, and the heat transfer body is thermally connected to the reactor component by the potting material via the third surface. The heat-generating electronic component is fixed to the heat transfer body in a state where its longitudinal direction is parallel to a first direction perpendicular to a first surface of the heat dissipation component. A circuit board, a heat-generating electronic component connected to the circuit board, a heat transfer body on which the heat-generating electronic component is disposed, the heat transfer body having a housing portion provided with a space for housing a reactor component, the reactor component being thermally connected to a heat dissipation component, and a potting material being filled between the reactor component and the housing portion, whereby the reactor component and the heat transfer body are thermally connected by the potting material. The heat transfer body has a second surface and a third surface. The heat transfer body is thermally connected to the heat-generating electronic component via the second surface, and the heat transfer body is thermally connected to the reactor component by the potting material via the third surface. A heat dissipation member is disposed between the heat transfer body and the circuit board. A circuit board, a heat-generating electronic component connected to the circuit board, a heat transfer body on which the heat-generating electronic component is disposed, the heat transfer body having a housing portion provided with a space for housing a reactor component, the reactor component being thermally connected to a heat radiating component, and a potting material being filled between the reactor component and the housing portion, whereby the reactor component and the heat transfer body are thermally connected by the potting material, the heat transfer body having a second surface and a third surface, the heat transfer body being thermally connected to the heat-generating electronic component through the second surface, the heat transfer body being thermally connected to the reactor component by the potting material through the third surface, a member having insulation and heat dissipation properties being disposed between the heat transfer body and the circuit board, and a pattern being formed at a location on the circuit board corresponding to the member having insulation and heat dissipation properties.
[0011] An inverter according to one aspect of the present invention includes a circuit board, a heat-generating electronic component connected to the circuit board, a heat transfer body on which the heat-generating electronic component is disposed, the heat transfer body having a housing portion provided with a space for housing a reactor component, the reactor component being thermally connected to a heat radiating component, and a potting material being filled between the reactor component and the housing portion, whereby the reactor component and the heat transfer body are thermally connected by the potting material, the heat transfer body having a second surface and a third surface, the heat transfer body being thermally connected to the heat-generating electronic component through the second surface, the heat transfer body being thermally connected to the reactor component by the potting material through the third surface, and the heat-generating electronic component being fixed to the heat transfer body in a state where its longitudinal direction is parallel to a first direction perpendicular to a first surface of the heat radiating component. A circuit board, a heat-generating electronic component connected to the circuit board, a heat transfer body on which the heat-generating electronic component is disposed, the heat transfer body having a housing portion provided with a space for housing a reactor component, the reactor component being thermally connected to a heat radiating component, and a potting material being filled between the reactor component and the housing portion so that the reactor component and the heat transfer body are thermally connected by the potting material, the heat transfer body having a second surface and a third surface, the heat transfer body being thermally connected to the heat-generating electronic component through the second surface, the heat transfer body being thermally connected to the reactor component by the potting material through the third surface, and the heat-generating electronic component being fixed to the heat transfer body in a state where its longitudinal direction is parallel to a first direction perpendicular to a first surface of the heat radiating component. A circuit board, a heat-generating electronic component connected to the circuit board, a heat transfer body on which the heat-generating electronic component is disposed, the heat transfer body having a housing portion provided with a space for housing a reactor component, the reactor component being thermally connected to a heat radiating component, and a potting material being filled between the reactor component and the housing portion so that the reactor component and the heat transfer body are thermally connected by the potting material, the heat transfer body having a second surface and a third surface, the heat transfer body being thermally connected to the heat-generating electronic component through the second surface, the heat transfer body being thermally connected to the reactor component by the potting material through the third surface, a member having insulation and heat dissipation properties is disposed between the heat transfer body and the circuit board, and a pattern is formed at a location corresponding to the member having insulation and heat dissipation properties on the circuit board.
Advantages of the Invention
[0012] According to the present invention, when using a heat dissipation mechanism integrally formed in a box shape and provided with an opening only on one surface, it is possible to cope with heat dissipation of heat-generating electronic components while suppressing enlargement.
Brief Description of the Drawings
[0013]
Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6
Mode for Carrying Out the Invention
[0014] (Embodiment) Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0015] First, with reference to FIGS. 1 to 4, a configuration example of the heat dissipation structure 1 of the heat - generating electronic component according to the present embodiment will be described. FIG. 1 is a perspective view showing an example of the heat dissipation structure 1 of the heat - generating electronic component. FIG. 2 is a front view showing an example of the heat dissipation structure 1 of the heat - generating electronic component. FIG. 3 is a side view showing an example of the heat dissipation structure 1 of the heat - generating electronic component. FIG. 4 is a top perspective view showing an example of the heat dissipation structure 1 of the heat - generating electronic component. In FIGS. 1 and 2, the front part of the heat sink 2 is not shown, and in FIG. 3, the side part of the heat sink 2 is not shown. Also, in FIG. 4, the circuit board 9 shown in FIGS. 1 to 3 is not shown.
[0016] The heat dissipation structure 1 of the heat - generating electronic component is used, for example, in a charger, an inverter, etc. mounted on a vehicle. The heat dissipation structure 1 of the heat - generating electronic component includes a heat sink 2, an aluminum block 3, electronic components 5a, 5b, and a circuit board 9.
[0017] The heat sink 2 (an example of a heat dissipation mechanism) is integrally formed in a box shape and has an opening provided only on one surface. F1 is the opening surface (an example of the second surface), and F2 is the bottom surface (an example of the first surface) facing the opening surface F1.
[0018] At the four corners of the bottom surface F2 of the heat sink 2, support columns 2a, 2b, 2c, and 2d are provided along the vertical direction D with respect to the bottom surface F2 (hereinafter simply referred to as the "vertical direction"). Thread holes (not shown) are respectively formed in the support columns 2a to 2d, and a circuit board 9 described later is screwed thereto.
[0019] The aluminum block 3 (an example of a heat transfer body) is a substantially rectangular parallelepiped member made of aluminum. The aluminum block 3 is disposed inside the heat sink 2 such that its longitudinal direction is along the vertical direction D.
[0020] The aluminum block 3 has a substantially rectangular parallelepiped fastening portion 3a at its lower part. This fastening portion 3a is screwed to the bottom surface F2 by screws 4a and 4b (an example of a fixing member). Thereby, the aluminum block 3 is fixed in contact with the bottom surface F2.
[0021] The electronic components 5a and 5b (an example of heat-generating electronic components) are electronic components that self-generate heat when energized, and are, for example, discrete components, FETs (Field Effect Transistors), etc. The electronic components 5a and 5b each have lead wires 6a and 6b.
[0022] The electronic components 5a and 5b are attached to the aluminum block 3 such that their respective heat dissipation surfaces are in contact with the side surfaces of the aluminum block 3. For example, the electronic components 5a and 5b are respectively pressed from the surfaces facing the heat dissipation surfaces by springs 7a and 7b (an example of holding members), and are fixed and held on the side surfaces of the aluminum block 3. The springs 7a and 7b are respectively screwed to the side surfaces of the aluminum block 3 by screws 8a and 8b.
[0023] The electronic components 5a and 5b fixed to the aluminum block 3 are in an upright state along the vertical direction D. Also, the electronic components 5a and 5b fixed to the aluminum block 3 do not contact the heat sink 2.
[0024] The heat generated from the electronic components 5a and 5b fixed to the aluminum block 3 as described above is transferred to the heat sink 2 via the aluminum block 3. Thereby, heat dissipation of the electronic components 5a and 5b is realized.
[0025] In addition, in FIGS. 1 to 4, as an example, two electronic components fixed to the aluminum block 3 are shown, but it may be one, or three or more. Also, a plurality of electronic components may be fixed not only to one surface but also to a plurality of surfaces of the aluminum block 3.
[0026] The circuit board 9 is a printed circuit board on which a pattern is formed or a predetermined semiconductor element (not shown) is mounted. The circuit board 9 is placed on the above-described columns 2a to 2d. Then, the circuit board 9 is screwed to the columns 2a to 2d with screws 10a, 10b, 10c, and 10d. Thereby, the circuit board 9 is fixed to the columns 2a to 2d.
[0027] Also, the circuit board 9 is connected to the lead wires 6a of the electronic component 5a and the lead wires 6b of the electronic component 5b, for example, by soldering.
[0028] The aluminum block 3 and the circuit board 9 are arranged in the order of the aluminum block 3 and the circuit board 9 from the bottom surface F2 along the vertical direction D.
[0029] Also, the aluminum block 3 and the circuit board 9 are adhered and fixed to each other by bonds 11a and 11b (an example of an adhesive member). Thereby, the number of fixing points on the circuit board 9 increases, and breakage of the lead wires 6a and 6b can be prevented. This is particularly effective when the columns 2a to 2d are high and there are many vibrations.
[0030] Also, the bonds 11a and 11b preferably have at least one of insulation and heat dissipation properties. When the bonds 11a and 11b have insulation properties, a pattern can be formed or a semiconductor element can be mounted at positions on the circuit board 9 corresponding to the bonds 11a and 11b. When the bonds 11a and 11b have heat dissipation properties, the heat generated on the circuit board 9 can be transferred to the aluminum block 3 through the bonds 11a and 11b.
[0031] Although not shown in FIGS. 1 to 4, a cover for closing the opening surface F1 may be provided above the circuit board 9.
[0032] As described above, in the heat dissipation structure 1 of the heat-generating electronic component of the present embodiment, since the heat dissipation surfaces of the electronic components 5a and 5b are arranged in contact with the aluminum block 3 arranged in contact with the heat sink 2, compared with the case where the heat dissipation surfaces of the electronic components 5a and 5b are arranged in contact with the bottom surface F2 of the heat sink 2, it is possible to cope with the heat dissipation of the electronic components while suppressing the increase in size.
[0033] The configuration example of the heat dissipation structure 1 of the heat-generating electronic component has been described above.
[0034] Next, a manufacturing method of the heat dissipation structure 1 of the heat-generating electronic component will be described with reference to FIGS. 1 to 4.
[0035] First, using the springs 7a and 7b and the screws 8a and 8b, the electronic components 5a and 5b are fixed and adhered to the aluminum block 3. At this time, the heat dissipation surfaces of the electronic components 5a and 5b are brought into contact with the aluminum block 3. If the electronic components 5a and 5b are of a type that requires insulation, it is preferable to provide a heat dissipation insulating sheet (not shown) between the heat dissipation surfaces of the electronic components 5a and 5b and the aluminum block 3.
[0036] Next, the aluminum block 3 to which the electronic components 5a and 5b are fixed is housed inside the heat sink 2 from the opening surface F1 of the heat sink 2, and the aluminum block 3 is arranged on the bottom surface F2. Then, the fastening portion 3a is screwed to the bottom surface F2 using the screws 4a and 4b.
[0037] Next, the circuit board 9 is accommodated from the opening surface of the heat sink 2 into the interior of the heat sink 2 and arranged on the support columns 2a to 2d. At this time, the lead wires 6a and 6b are soldered to the circuit board 9. Then, the circuit board 9 is screwed to the support columns 2a to 2d using the screws 10a to 10d.
[0038] By the above manufacturing method, the heat dissipation structure 1 of the heat-generating electronic component shown in FIGS. 1 to 4 is manufactured.
[0039] Note that after screwing the circuit board 9, a cover (not shown) for closing the opening surface F1 may be provided above the circuit board 9.
[0040] As described above, the embodiments of the present invention have been described, but the present invention is not limited to the above embodiments and various modifications are possible. Hereinafter, modification examples will be described.
[0041] (Modification Example 1) The heat dissipation structure 1 of the heat-generating electronic component according to this modification example will be described with reference to FIG. 5. FIG. 5 is a top perspective view showing an example of the heat dissipation structure 1 of the heat-generating electronic component according to this modification example. In FIG. 5, the same components as those in FIGS. 1 to 4 are denoted by the same reference numerals and their descriptions are omitted. Also, in FIG. 5, the illustration of the circuit board 9 shown in FIGS. 1 to 3 is omitted.
[0042] In this modification example, as shown in FIG. 5, the heat sink 2 is different from FIGS. 1 to 4 in that it includes an aluminum block 30 and an electronic component 32.
[0043] The aluminum block 30 has a fastening portion 30a in the shape of a substantially rectangular parallelepiped at its lower part. In FIG. 5, only the fastening portion 30a between the support columns 2a and 2b is shown, but similarly, there is a fastening portion 30a between the support columns 2d and 2c.
[0044] The fastening portion 30a is screwed to the bottom surface F2 with a screw 31. Thereby, the aluminum block 30 is fixed in contact with the bottom surface F2.
[0045] Further, the aluminum block 30 has a housing portion 30b provided with a substantially rectangular parallelepiped-shaped space. An electronic component 32 (for example, a reactor component. An example of a high-profile component) is housed in the space of the housing portion 30b. The bottom surface of the electronic component 32 is in contact with and fixed to the bottom surface F2 of the heat sink 2. Although not shown, a potting material is filled between the electronic component 32 and the housing portion 30b.
[0046] The electronic component 32 is arranged upright such that the longitudinal direction of the electronic component 32 is along the vertical direction D (see FIGS. 1 to 3) between the bottom surface F2 and the circuit board 9 (see FIGS. 1 to 3). Further, the length of the electronic component 32 in the vertical direction D (the longitudinal length of the electronic component 32) is longer than the length of the electronic components 5a and 5b in the vertical direction D (the longitudinal lengths of the electronic components 5a and 5b).
[0047] Thus, by arranging the electronic component 32 on the bottom surface F2, a space is provided between the circuit board 9 and the bottom surface F2, and the aluminum block 3 can be arranged in that space. Therefore, the heat dissipation structure 1 of the heat-generating electronic component does not increase in size in its height direction (vertical direction D).
[0048] According to this modification, in addition to the effects described in the first embodiment, the fixing (vibration countermeasure) of the electronic component 32 arranged on the bottom surface F2 of the heat sink 2 can also be performed. Further, when the potting material is a heat-dissipating potting material, the fixing (vibration countermeasure) and heat dissipation of the electronic component 32 can also be performed.
[0049] (Modification 2) The heat dissipation structure 1 of the heat-generating electronic component according to this modification will be described with reference to FIG. 6. FIG. 6 is a top perspective view showing an example of the heat dissipation structure 1 of the heat-generating electronic component according to this modification. In FIG. 6, the same components as those in FIGS. 1 to 4 are denoted by the same reference numerals, and the description thereof is omitted. Further, in FIG. 6, the illustration of the circuit board 9 shown in FIGS. 1 to 3 is omitted.
[0050] In this modification, as shown in FIG. 6, the heat sink 2 is different from FIGS. 1 to 4 in that the electronic components 33 and 34 are provided.
[0051] The electronic components 33 and 34 (for example, reactor components, an example of high-profile components) are each fixed in contact with the bottom surface F2 of the heat sink 2.
[0052] The electronic components 33 and 34 are arranged upright between the bottom surface F2 and the circuit board 9 (see FIGS. 1 to 3) such that the longitudinal direction of the electronic components 33 and 34 is along the vertical direction D (see FIGS. 1 to 3). Further, the length of the electronic components 33 and 34 in the vertical direction D (the longitudinal length of the electronic components 33 and 34) is longer than the length of the electronic components 5a and 5b in the vertical direction D (the longitudinal length of the electronic components 5a and 5b).
[0053] Thus, by arranging the electronic components 33 and 34 on the bottom surface F2, a space is provided between the circuit board 9 and the bottom surface F2, and the aluminum block 3 can be arranged in that space. Therefore, the heat dissipation structure 1 of the heat-generating electronic components does not increase in size in its height direction (vertical direction D).
[0054] In this modification, in addition to the effects described in the first embodiment, heat dissipation of the electronic components 33 and 34 arranged on the bottom surface F2 of the heat sink 2 can also be performed.
[0055] (Modification 3) In the embodiment, the case of performing air cooling using the heat sink 2 has been described as an example, but instead of air cooling, water cooling may be applied.
[0056] (Modification 4) In the embodiment, the case of using screws for fastening the aluminum block 3 to the bottom surface F2, fastening the springs 7a and 7b to the aluminum block 3, and fastening the circuit board 9 to the support columns 2a to 2d has been described as an example, but instead of screws, bonds may be used. Further, in the embodiment, the case of using springs for fixing the electronic components 5a and 5b to the aluminum block 3 has been described as an example, but instead of springs, screws may be used.
[0057] (Modification 5) In addition, although the case where the aluminum block 3 and the circuit board 9 are adhered and fixed to each other by bonds 11a and 11b (an example of an adhesive member) has been described as an example, a heat dissipation member having no adhesiveness such as grease or a gap filler (an example of a heat dissipation member) may be provided between the aluminum block 3 and the circuit board 9. Thereby, the heat generated in the circuit board 9 can be transferred to the aluminum block 3 through grease, a gap filler, or the like. Further, when the grease or the gap filler has insulating properties, a pattern can be formed or a semiconductor element can be mounted at a position on the circuit board 9 corresponding to the grease or the gap filler.
Industrial Applicability
[0058] The present invention is useful for in-vehicle chargers and inverters.
Explanation of Signs
[0059] 1 Heat dissipation structure of heat-generating electronic component 2 Heat sink 2a, 2b, 2c, 2d Support columns 3, 30 Aluminum block 3a, 30a Fastening part 4a, 4b, 8a, 8b, 10a, 10b, 10c, 10d, 31 Screws 5a, 5b Electronic components 6a, 6b Lead wires 7a, 7b Springs 9 Circuit board 30b Accommodating part 32, 33, 34 Electronic components
Claims
1. A circuit board; a heat-generating electronic component connected to the circuit board; a heat transfer body on which the heat-generating electronic component is disposed; The heat transfer body has an accommodating portion provided with a space for accommodating a reactor component, The reactor component is thermally connected to a heat dissipation component, A potting material is filled between the reactor part and the housing part, so that the reactor part and the heat transfer body are thermally connected to each other by the potting material, the heat transfer body has a second surface and a third surface; the heat transfer body is thermally connected to the heat-generating electronic component via the second surface; the heat transfer body is thermally connected to the reactor part by the potting material via the third surface, the heat-generating electronic component is fixed to the heat transfer body with its longitudinal direction parallel to a first direction perpendicular to a first surface of the heat dissipating component; On-board charger.
2. The heat transfer body is The circuit board is fixed to the substrate by an adhesive member. The vehicle-mounted charger according to claim 1 .
3. The adhesive member is At least one of insulating property and heat dissipation property is provided. The vehicle-mounted charger according to claim 2 .
4. A heat dissipation member is disposed between the heat transfer body and the circuit board. The on-board charger according to any one of claims 1 to 3.
5. a member having insulating properties and heat dissipation properties is disposed between the heat transfer body and the circuit board; A pattern is formed on the circuit board at a location corresponding to the member having insulating properties and heat dissipation properties. The vehicle-mounted charger according to any one of claims 1 to 4.
6. The member having insulating properties and heat dissipation properties also has adhesive properties. The vehicle-mounted charger according to claim 5 .
7. The reactor component is a high-profile component, The length of the tall component in the first direction is longer than the length of the heat-generating electronic component in the first direction. The vehicle-mounted charger according to claim 1 .
8. The reactor part is thermally connected to the heat dissipation part by the potting material having heat dissipation properties. The vehicle-mounted charger according to claim 1 .
9. The heat transfer body holds the reactor component by a housing portion having a space for housing the reactor component. The vehicle-mounted charger according to claim 1 .
10. The reactor component is thermally connected to the heat dissipation component via the accommodation portion. The vehicle-mounted charger according to claim 9.
11. A circuit board; a heat-generating electronic component connected to the circuit board; a heat transfer body on which the heat-generating electronic component is disposed; The heat transfer body has an accommodating portion provided with a space for accommodating a reactor component, The reactor component is thermally connected to a heat dissipation component, A potting material is filled between the reactor part and the housing part, so that the reactor part and the heat transfer body are thermally connected to each other by the potting material, the heat transfer body has a second surface and a third surface; the heat transfer body is thermally connected to the heat-generating electronic component via the second surface; the heat transfer body is thermally connected to the reactor part by the potting material via the third surface, A heat dissipation member is disposed between the heat transfer body and the circuit board. On-board charger.
12. a member having insulating properties and heat dissipation properties is disposed between the heat transfer body and the circuit board; A pattern is formed on the circuit board at a location corresponding to the member having insulating properties and heat dissipation properties. The vehicle charger according to claim 11.
13. The member having insulating properties and heat dissipation properties also has adhesive properties. The vehicle-mounted charger according to claim 12.
14. A circuit board; a heat-generating electronic component connected to the circuit board; a heat transfer body on which the heat-generating electronic component is disposed; The heat transfer body has an accommodating portion provided with a space for accommodating a reactor component, The reactor component is thermally connected to a heat dissipation component, A potting material is filled between the reactor part and the housing part, so that the reactor part and the heat transfer body are thermally connected to each other by the potting material, the heat transfer body has a second surface and a third surface; the heat transfer body is thermally connected to the heat-generating electronic component via the second surface; the heat transfer body is thermally connected to the reactor part by the potting material via the third surface, a member having insulating properties and heat dissipation properties is disposed between the heat transfer body and the circuit board; A pattern is formed on the circuit board at a location corresponding to the member having insulating properties and heat dissipation properties. On-board charger.
15. The member having insulating properties and heat dissipation properties also has adhesive properties. The vehicle charger according to claim 14.
16. A circuit board; a heat-generating electronic component connected to the circuit board; a heat transfer body on which the heat-generating electronic component is disposed; The heat transfer body has an accommodating portion provided with a space for accommodating a reactor component, The reactor component is thermally connected to a heat dissipation component, A potting material is filled between the reactor part and the housing part, so that the reactor part and the heat transfer body are thermally connected to each other by the potting material, the heat transfer body has a second surface and a third surface; the heat transfer body is thermally connected to the heat-generating electronic component via the second surface; the heat transfer body is thermally connected to the reactor part by the potting material via the third surface, the heat-generating electronic component is fixed to the heat transfer body with its longitudinal direction parallel to a first direction perpendicular to a first surface of the heat dissipating component; Inverter.
17. A circuit board; a heat-generating electronic component connected to the circuit board; a heat transfer body on which the heat-generating electronic component is disposed; The heat transfer body has an accommodating portion provided with a space for accommodating a reactor component, The reactor component is thermally connected to a heat dissipation component, A potting material is filled between the reactor part and the housing part, so that the reactor part and the heat transfer body are thermally connected to each other by the potting material, the heat transfer body has a second surface and a third surface; the heat transfer body is thermally connected to the heat-generating electronic component via the second surface; the heat transfer body is thermally connected to the reactor part by the potting material via the third surface, the heat-generating electronic component is fixed to the heat transfer body with its longitudinal direction parallel to a first direction perpendicular to a first surface of the heat dissipating component; Inverter.
18. A circuit board; a heat-generating electronic component connected to the circuit board; a heat transfer body on which the heat-generating electronic component is disposed; The heat transfer body has an accommodating portion provided with a space for accommodating a reactor component, The reactor component is thermally connected to a heat dissipation component, A potting material is filled between the reactor part and the housing part, so that the reactor part and the heat transfer body are thermally connected to each other by the potting material, the heat transfer body has a second surface and a third surface; the heat transfer body is thermally connected to the heat-generating electronic component via the second surface; the heat transfer body is thermally connected to the reactor part by the potting material via the third surface, a member having insulating properties and heat dissipation properties is disposed between the heat transfer body and the circuit board; A pattern is formed on the circuit board at a location corresponding to the member having insulating properties and heat dissipation properties. Inverter.
Citation Information
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