Detection tape for monitoring systems and connection tape

Abstract

To readily construct a monitoring system for improving the safety of workers when a floor tile in a clean room is removed and a floor surface is opened.SOLUTION: A detection tape used in a monitoring system that monitors the surroundings of a substrate processing device installed in a clean room includes: an insulating base part having insulating adhesive layers on front and rear surfaces; a conductive layer provided on the front surface side of the base part and arranged along a longitudinal direction of the detection tape; an insulating non-adhesive area being in contact with or close to the conductive layer in the longitudinal direction of the detection tape, and an insulating protective layer that covers the conductive layer and the non-adhesive area and is bonded to the base part. The detection tape can be fed out from a rolled condition.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present disclosure relates to a detection tape and a connection tape for a monitoring system.

Background Art

[0002] Patent Document 1 describes a clean room monitoring device for monitoring the interior of a clean room in which a removable floor surface is disposed on the floor portion, the monitoring device including a monitoring camera that images the removable floor surface of a passage through which an operator can pass, a monitoring unit that detects the presence or absence of an opening in the removable floor surface removed from the image signal obtained by the monitoring camera, and when an opening is present, detects the presence or absence of an operator approaching the opening from the image signal of the monitoring camera, and outputs an alarm signal when the operator is detected, and an alarm generating means that receives the alarm signal from the monitoring unit and issues an alarm.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The technology according to the present disclosure easily constructs a monitoring system that improves the safety of an operator when a floor tile in a clean room is removed and the floor surface is opened.

Means for Solving the Problems

[0005] One aspect of the present disclosure is a detection tape used in a monitoring system for monitoring the surroundings of a substrate processing apparatus installed in a clean room, the detection tape including an insulating base portion having insulating adhesive layers on both the front and back surfaces, a conductive layer provided on the surface side of the base portion and arranged along the longitudinal direction of the detection tape, an insulating non-adhesive region arranged along the longitudinal direction of the detection tape in contact with or in proximity to the conductive layer, and an insulating protective layer covering the conductive layer and the non-adhesive region and adhered to the base portion, and the detection tape being unwindable from a rolled state.

Advantages of the Invention

[0006] According to the present disclosure, a monitoring system that improves the safety of workers when floor tiles in a clean room are removed and the floor surface is opened can be easily constructed.

Brief Description of the Drawings

[0007]

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Embodiments for Carrying Out the Invention

[0008] Conventionally, for example, in a semiconductor manufacturing line for manufacturing semiconductor devices, a number of semiconductor manufacturing devices such as substrate processing devices are arranged in a clean room maintained in a clean atmosphere. In such a clean room, floor tiles (sometimes called gratings) having a number of lattice-shaped ventilation parts are arranged on the floor part. Also, pipes, various electrical devices, pumps, chemical liquid tanks, etc. are accommodated in the lower space of the floor tiles. For example, when installing, maintaining, or in case of failure of these pipes, various electrical devices, pumps, etc., since it is necessary for an operator to get down into the lower space of the floor tiles to perform work, the floor tiles are removable.

[0009] In this way, in the clean room, in a state where the floor tiles are removed, an operator can get down into the lower space of the floor tiles to perform work. However, when the floor tiles are removed, there will be openings in the floor surface of the clean room formed by a number of floor tiles, so there is a risk that an operator may fall from this opening into the lower space. Especially for an operator performing other work on the floor tiles, there may be a case where the operator is working without knowing that the opening is formed, and conventionally, attention has been drawn to the operator.

[0010] The technique described in Patent Document 1 detects the presence or absence of an opening where a floor tile has been removed based on a monitoring camera that images the floor tile surface, and when there is an operator, outputs an alarm signal to issue an alarm from an alarm generating means.

[0011] With such technology, the safety of workers has been improved, but the installation of expensive devices such as surveillance cameras is required, and a large number of units are also needed to install them without dead spots, etc., which is costly and time-consuming in terms of installation work itself. Therefore, the present disclosure provides a technology that can easily construct a monitoring system capable of detecting the presence or absence of an opening where such a floor tile has been removed. A monitoring system to which the following embodiments are applied will be described. In this specification and the drawings, elements having substantially the same functional configuration are denoted by the same reference numerals, and redundant descriptions are omitted.

[0012] FIG. 1 shows a state of a monitoring system M that monitors the periphery of a substrate processing apparatus 1 constructed by arranging a detection tape T for the monitoring system according to an embodiment. This substrate processing apparatus 1 is installed in a clean room, and floor tiles F are laid out vertically and horizontally on the floor surface around it. The detection tape T has a flat shape like a flat cable.

[0013] FIG. 2 is an explanatory plan view schematically showing a simplified monitoring system M for easily explaining such a monitoring system. In this example, the detection tape T is arranged across the floor tiles F2 to F4. Each of the floor tiles F2 to F4 has an outer shape of a square with a side length of, for example, 60 cm.

[0014] As shown in FIG. 3, the detection tape T has an insulating base portion 10 having insulating adhesive layers on the front and back surfaces, and conductive layers 11 and 12 provided on the surface side of the base portion 10 and arranged in parallel along the longitudinal direction of the detection tape T. As the conductive layers 11 and 12, for example, flat copper foils can be used. Also, in this example, the conductive layers 11 and 12 are provided in parallel with an insulating non-adhesive region 13 interposed therebetween. The non-adhesive region 13 can be realized, for example, by sticking an insulating tape, such as a peelable tape made of synthetic resin, to the central region of the base portion 10 in order to align the thickness and height of the conductive layers 11 and 12.

[0015] On the conductive layers 11 and 12 and the non - adhesive region 13, an insulating protective layer 15 is disposed so as to cover them, and the protective layer 15 is adhered to the base portion 10. However, since the non - adhesive region 13 is located between the conductive layers 11 and 12, the lower surface of the protective layer 15 and the non - adhesive region 13 are not adhered, and this portion is peelable. In this example, the width TW of the detection tape T is set to, for example, 100 mm or less for easy handling. Of course, it is not limited to this. Considering the thickness and flexibility of the protective layer 15, the width C1 of the conductive layer 11, the width C2 of the conductive layer 12, the width N of the non - adhesive region 13, etc., the width TW of the detection tape T can be arbitrarily set, for example, between 30 mm and 100 mm. Of course, the width TW of the detection tape T is not limited to this range.

[0016] Also in this example, the adhesive force of each part is set so that the adhesion on the surface side of the base portion 10 and the lower surface side of the protective layer 15 is stronger than the adhesion on the back surface side of the base portion 10, that is, the adhesion between the base portion 10 and the surface of the floor tile F. Thereby, for example, the base portion 10 of the detection tape T can be peeled from the surface of the floor tile F, but a configuration in which the protective layer 15 and the base portion 10 are not easily peeled is realized. Therefore, it is easy to stick and peel the detection tape T on the surface of the floor tile F, and the workability is good. On the other hand, the protective layer 15 and the base portion 10 are not easily peeled from the base portion 10, and the internal conductive layers 11 and 12 are prevented from being easily exposed.

[0017] Note that the adhesiveness between the protective layer 15 and the base portion 10 depends on the contact area between the lower surface of the protective layer 15 and the regions outside the surface conductive layers 11 and 12 in the base portion 10, that is, the sizes of the widths DN1 and DN2 shown in FIG. 3. Therefore, by adjusting the adhesive force on the surface of the base portion 10, the adhesive force on the lower surface of the protective layer 15, and the sizes of the widths DN1 and DN2 of the regions outside the surface conductive layers 11 and 12 in the base portion 10, an appropriate adhesive force corresponding to the width TW of the detection tape T can be obtained. For example, the adhesive widths DN1 and DN2 between the base portion 10 and the protective layer 15 may be made narrower than the width C1 of the conductive layer 11 and the width C2 of the conductive layer 12, or may be made narrower than the width N of the non-adhesive region 13. Furthermore, the width C1 of the conductive layer 11 and the width C2 of the conductive layer 12 may be set to be the same as the width N of the non-adhesive region 13. Thereby, as will be described with reference to FIGS. 7 and 8 below, it becomes easier to create a gap in the center of the detection tape T. Also, the width C1 of the conductive layer 11 and the width C2 of the conductive layer 12 may be set to have the same width as or a width greater than the width N of the non-adhesive region 13. Thereby, when transmitting and receiving the pulse waves described later, it is possible to suppress noise from being superimposed on the conductive layers 11 and 12.

[0018] Note that the detection tape T shown in FIG. 3 described above has a configuration in which an insulating protective layer 15 is disposed on the conductive layers 11 and 12 and the non-adhesive region 13 so as to cover them, and the protective layer 15 is directly adhered to the base portion 10. However, the present invention is not limited to this, and the detection tape T shown in FIG. 4 can also be proposed. That is, the detection tape T shown in FIG. 4 has a configuration having a double-sided adhesive layer 14 on the lower surface of the protective layer 15. Therefore, the protective layer 15 is adhered to the base portion 10 by this double-sided adhesive layer 14. Also in this case, since the non-adhesive region 13 is located between the conductive layers 11 and 12, the double-sided adhesive layer 14 on the lower surface of the protective layer 15 and the non-adhesive region 13 are not adhered, and this portion is peelable.

[0019] Also in the detection tape T shown in Fig. 4, the adhesive force of each part is set so that the adhesion on the surface side of the base part 10 and the lower surface side of the double-sided adhesive layer 14 is stronger than the adhesion on the back surface side of the base part 10, that is, the adhesion between the base part 10 and the surface of the floor tile F. Thus, similar to the example described above, the base part 10 of the detection tape T can be peeled off from the surface of the floor tile F, but a configuration can be realized in which the protective layer 15 and the base part 10 are not easily peeled off. Therefore, also in the case of the detection tape T shown in Fig. 4, it is easy to stick and peel off from the surface of the floor tile F, and the workability is good. Also, the protective layer 15 is not easily peeled off from the base part 10, and it is suppressed that the internal conductive layers 11 and 12 are easily exposed.

[0020] Of course, also in this case, the adhesiveness between the protective layer 15 and the base part 10 depends on the contact area between the lower surface of the double-sided adhesive layer 14 on the lower surface of the protective layer 15 and the outer regions of the conductive layers 11 and 12 on the surface of the base part 10, that is, the sizes of the widths DN1 and DN2 shown in Fig. 4. Therefore, by adjusting the adhesive force on the surface of the base part 10, the adhesive force on the lower surface of the double-sided adhesive layer 14, and the sizes of the widths DN1 and DN2 of the outer regions of the conductive layers 11 and 12 on the surface of the base part 10, an appropriate adhesive force corresponding to the width TW of the detection tape T can be obtained. Similar to the above case, the adhesion widths DN1 and DN2 between the base part 10 and the protective layer 15 may be made narrower than the width C1 of the conductive layer 11, the width C2 of the conductive layer 12, or the width N of the non-adhesive region 13. Further, the width C1 of the conductive layer 11 and the width C2 of the conductive layer 12 may be set to be the same as the width N of the non-adhesive region 13.

[0021] As shown in Fig. 5, the detection tape T having such a configuration is wound in a roll shape and can be drawn out in the direction of the arrow in the figure when in use. Then, it can be cut at a desired length, for example, with scissors H or a knife. Therefore, for example, as shown in Fig. 2, in order to arrange the detection tape T across the floor tiles F2 to F4, while attaching one end to the surface of one end of the floor tile F2, draw out the necessary length and cut the detection tape T at the other end portion of the floor tile F4. Therefore, the workability is extremely good. For example, even when arranging the detection tape T across a plurality of floor tiles F, the work can be carried out simply and quickly. In addition, as shown in Fig. 5, for the detection tape T to be able to be drawn out from the wound roll shape, it is sufficient that the lower surface side of the base portion 10 can be peeled off from the surface of the protective layer 15.

[0022] Furthermore, in this example, on the surface side of the protective layer of the detection tape T, as shown in Fig. 5, for example, a logo mark L indicating the name of the manufacturer or administrator of the substrate processing apparatus 1 is displayed at a predetermined interval, for example, at an interval of about 10 cm to 50 cm. By displaying the logo mark L indicating the name of the manufacturer or administrator of the substrate processing apparatus 1 on the surface of the detection tape T in this way, when the detection tape T is arranged across a plurality of floor tiles F, a person entering the clean room will recognize that there is something related to the substrate processing apparatus 1 existing on the floor tile F. Thereby, unauthorized removal of the floor tile F to create an open state or leaving the open state unattended by the administrator is suppressed.

[0023] The detection tape T having the above configuration is attached and arranged across the surfaces of a plurality of floor tiles F as described above. In the example of Fig. 2, it is arranged across the floor tiles F2 to F4. And on one end side of the detection tape T arranged in such a manner, a controller 20 electrically connected to the conductive layers 11 and 12 is provided, and on the other end side of the detection tape T, that is, the terminal end portion, the ends of the conductive layers 11 and 12 are electrically connected to each other. As will be described later, the controller 20 is provided with a transmission unit, a reception unit, a measurement unit, and an alarm unit, and these are controlled by a control unit.

[0024] The operation of electrically connecting the end portions of the conductive layers 11 and 12 is performed, for example, according to the procedure shown in FIGS. 6(a) to 6(d). That is, at the end of the detection tape T already attached to the surface of the floor tile F shown in FIG. 6(a), as shown in FIG. 6(b), only the protective layer 15 at the end is cut, for example, about 3 cm from the end. As described above, since the protective layer 15 adheres to the base portion 10, it is usually a laborious and troublesome task to remove only the base portion 10 at a position 3 cm from the end.

[0025] However, in the detection tape T according to the present disclosure, as described above, the non-adhesive region 13 is located between the conductive layers 11 and 12, and does not adhere to the double-sided adhesive layer 14 on the lower surface of the protective layer 15, and is separable from the double-sided adhesive layer 14 on the lower surface of the protective layer 15 in the non-adhesive region 13. Therefore, from the flat state shown in FIG. 7, if both sides of the protective layer 15 of the detection tape T are pinched with fingers, for example, as shown in FIG. 8, and pushed inward (in the direction of the arrow in the figure), as shown in the figure, the central portion of the detection tape T bulges and a gap is generated. Then, if a thin object such as the tip of a driver 18 as shown in the figure is inserted into this gap to lift the protective layer 15, the gap becomes larger. Next, as shown in FIG. 9, for example, the end of the protective layer 15 is rolled up with fingers. Then, the rolled-up state of the protective layer 15 at the end is maintained. After that, as shown in FIG. 10, the end of the rolled-up protective layer 15 may be cut, for example, at a point about 3 cm in length with scissors H or a knife.

[0026] Through the above procedure, from the state of the detection tape T shown in FIG. 6(a), as shown in FIG. 6(b), the protective layer 15 at the end portion is removed, for example, about 3 cm. After that, as shown in FIG. 6(c), the connection tape TE for the end portion may be attached onto the conductive layers 11 and 12 and the non-adhesive region 13 exposed at the end of the detection tape T.

[0027] As shown in Fig. 6(c) (in Fig. 6(c), the connection tape TE is depicted as seen from the back side), an adhesive layer 21 is provided on the lower surface of the insulating protective layer 15, and a conductive layer 22 is provided on the lower surface of this adhesive layer 21 in a region narrower than the adhesive layer 21. The conductive layer 22 has a width and length for electrically connecting the two conductive layers 11 and 12 at the terminal end of the detection tape T. By attaching such a connection tape TE onto the conductive layers 11 and 12 and the non-adhesive region 13 exposed at the terminal end of the detection tape T, the conductive layers 11 and 12 are electrically connected at the terminal end. Fig. 6(d) shows the state of the connection tape TE attached to the end of the detection tape T.

[0028] As shown in Fig. 2, a controller 20 electrically connected to the conductive layers 11 and 12 is provided on the start end side of the detection tape T. However, when connecting the conductive layers 11 and 12 of the detection tape T to the controller 20, for example, a connection tape TS serving as a start tape as shown in Fig. 11 is used. Fig. 11 is a perspective view of the connection tape TS seen from the back side, and conductive layers 31 and 32 electrically connected to the conductive layers 11 and 12 of the detection tape T are provided on the adhesive layer on the lower surface of the insulating protective layer 30. The conductive layers 31 and 32 are constituted by, for example, copper foil, similar to the conductive layers 11 and 12.

[0029] Then, by soldering, for example, the lead portions 34 and 35 of the cable 33 connected to the controller 20 and the conductive layers 31 and 32, it is possible to electrically connect the conductive layers 11 and 12 of the detection tape T to the controller 20. For example, an insulating protective tape 36 may be attached to the connection portion between the lead portions 34 and 35 and the conductive layers 31 and 32.

[0030] In the monitoring system M configured by arranging the detection tape T having the above configuration, as shown in FIG. 12, a pulse wave is transmitted from the transmitter 20a provided in the controller 20 to the conductive layer 11, and the pulse wave reaches the receiver 20b provided in the controller 20 from the end portion of the detection tape T via the conductive layer 12. Therefore, in this example, the conductive layer 11 in the detection tape T disposed on the floor tile F constitutes a transmission path, and the conductive layer 12 constitutes a reception path.

[0031] The controller 20 is provided with a measurement unit 20c that measures the pulse wave returning from the conductive layer 12 as a reception path, and based on the measurement result from this measurement unit 20c, a predetermined alarm or alarm signal is issued from the alarm unit 20d.

[0032] In this example, the oscillation frequency of the pulse wave is set to 1 kHz, and as shown in FIG. 13, the period t of the pulse wave is 1000 μS. Also, the voltage value e is set to 3V. And the current value is set to 0.62 mA. The pulse wave from the reception path is measured by the measurement unit 20c, but at the measurement position Z, as shown in FIG. 13, the voltage value at the position of 1 / 4 wavelength is measured. And if the voltage value when a predetermined threshold value, for example, the delay time is 80 μS, falls below 1 / 2 of the rated value, that is, 1.5V, a predetermined alarm or alarm signal is issued from the alarm unit 20d as indicating abnormality. Of course, when the signal itself cannot be received by the receiver 20b, an alarm or alarm signal is also issued. The transmitter 20a, the receiver 20b, the measurement unit 20c, and the alarm unit 20d provided in the controller 20 are controlled by a control unit 20e provided in the controller 20.

[0033] In the monitoring system M disclosed this time, since the voltage value at the measurement position Z when the detection tape T is cut is measured, even if noise voltage is picked up at the time of cutting the detection tape T, since the threshold value is set to 1.5V which is half of the voltage value e, appropriate monitoring can be performed. More specifically, for example, when the total length of the detection tape T arranged in the monitoring system M is 60m, it was confirmed that the voltage of the return pulse measured in the reception path is about 2.8V and has not decreased much. Therefore, when setting the threshold value, starting from about 1.5V which is around the middle of the 3V voltage at the time of oscillation, it becomes weaker against noise as it becomes lower than that, and conversely, it becomes weaker against the decrease in the return voltage as it becomes higher. Therefore, by setting the threshold value shown in this example to 1.5V, it is strong against noise and can also cope with voltage drop. Therefore, the influence of noise can be suppressed and the cutting of the detection tape T can be suitably detected. Of course, it can also be judged as abnormal when the return voltage itself is not detected. Furthermore, even when the conductive layers 11 and 12 are exposed during inappropriate use, or when the connecting portion between the conductive layers 11 and 12 is about to peel off, it can be detected as abnormal.

[0034] As can also be seen from FIG. 12, the conductive layer 11 constituting the transmission path and the conductive layer 12 constituting the reception path are arranged in parallel in the detection tape T. However, if a pulse wave of an extremely high frequency, for example, flows through the conductive layers 11 and 12, accurate measurement may not be possible due to capacitive coupling. To prevent this, for example, the distance d (width of the non-adhesive region 13) between the conductive layer 11 and the conductive layer 12 may be increased. However, if this is done, the width of the detection tape T will increase, and problems will arise in terms of handling and practicality.

[0035] On the other hand, in a clean room, there are many electromechanical devices using commercial frequency power of 50Hz or 60Hz, for example, and conductive paths and parts through which current of the commercial frequency flows. And generally, the floor tile F is made of a conductive material. Therefore, the pulse wave transmitted from the transmission unit 20a needs to be set to a high frequency that is not affected by such commercial frequencies and can be clearly distinguished from commercial frequencies.

[0036] From such a perspective, in the example of the present disclosure, the oscillation frequency of the pulse wave is set to 1 kHz. Also, the width of the detection tape T is 40 mm, and the widths of the conductive layers 11 and 12 and the distance d (width of the non-adhesive region 13) between the conductive layer 11 and the conductive layer 12 are each set to 8 mm. Of course, it is not limited to this, and according to the distance d between the conductive layer 11 and the conductive layer 12, a pulse wave having an oscillation frequency that does not propagate across the conductive layer 11 and the conductive layer 12 may be used.

[0037] The current value of the pulse wave is set to 0.62 mA for the following reasons. That is, as will be described later, when it is necessary to lift and open the floor tile F due to work, it is necessary to cut the detection tape T arranged across a plurality of floor tiles F with pliers, a cutter, or the like. At that time, there is a risk that current may flow through the body of the operator through the pliers or cutter held in the hand of the operator. In such a case, if the current value is large (for example, 5 mA or more), the body of the operator may be at risk. Therefore, the current value of the pulse wave is set to 1 mA or less, which is generally considered safe for the human body in terms of safety.

[0038] In the monitoring system M configured as described above, as shown in FIG. 14, in one detection tape T arranged across the floor tiles F2 to F4, a logo mark L indicating the name of the manufacturer or administrator of the substrate processing apparatus 1 is displayed on the surface of the detection tape T as shown in the figure. Therefore, as described above, a person who enters the clean room is suppressed from arbitrarily removing the floor tile F to create an open state or leaving the open state unattended.

[0039] By the way, since one detection tape T is attached across the floor tiles F2 to F4, when the operator P works in the space on the lower surface of the floor tile F, for example, on the lower surface side of the floor tile F3, as shown in FIG. 15, first, it is necessary to cut the detection tape T at both end portions of the floor tile F3 using pliers or a cutter. And then, as shown in FIG. 16, the floor tile F3 must be lifted.

[0040] As described above, in the monitoring system M, as shown in FIG. 12, a pulse wave is transmitted from the transmitter 20a of the controller 20 to the conductive layer 11 in the detection tape T, and the pulse wave returns to the receiver 20b of the controller 20 via the conductive layer 12. Since the measurement unit 20c of the controller 20 monitors the returning pulse wave, an alarm is issued when the detection tape T is cut at both ends of the floor tile F3. Therefore, not only the worker P but also other workers in the vicinity can recognize that an opening has occurred in the floor tile F, improving the safety of the workers.

[0041] In addition, to construct such a monitoring system M, as described above, it is only necessary to attach the detection tape T across a plurality of floor tiles F. Moreover, since the detection tape T is wound in a roll as shown in FIG. 5, it can be easily unwound. Furthermore, since the back surface of the base portion on the lower surface of the detection tape T is adhesive, it is only necessary to attach the unwound detection tape T directly to the surface of the floor tile F. Then, at the end portion of the floor tile F to be installed, it is only necessary to cut the detection tape T. After that, it is only necessary to attach the connection tape TE for the end portion shown in FIG. 6 described above to the cut portion. Therefore, the monitoring system M can be easily constructed.

[0042] By the way, as shown in FIGS. 15 and 16, once the detection tape T is cut, both the transmission path and the reception path are cut and the pulse wave cannot flow. Therefore, after a predetermined operation in the space on the lower surface side of the floor tile F is completed, it is necessary to return the removed floor tile F3 and electrically reconnect the transmission path and the reception path again. In this case, simply installing the floor tile F3 back in its original position cannot satisfactorily connect the conductive layers 11 and 12 at the cut ends of the cut detection tape T.

[0043] In such a case, first, as shown in Fig. 17, the ends of the cut detection tape T are processed in accordance with the method shown in Figs. 7 to 10 described above. Only the protective layer 15 at each end is removed by about 3 cm, for example, to expose the conductive layers 11 and 12. The dashed-dotted line in the figure indicates the butting end face of the floor tile F.

[0044] Next, the ends of the cut detection tape T are electrically connected using a connection tape TB for reconnection having the structure shown in Fig. 18. This connection tape TB has an adhesive layer 42 provided on the lower surface of an insulating protective layer 41. On the lower surface of the adhesive layer 42, conductive layers 44 and 45 are provided in parallel with a non-adhesive region 43 interposed therebetween in a region narrower than the adhesive layer 42. And there is an adjustment layer 46 for height adjustment between the conductive layers 44 and 45 and the adhesive layer 42. For example, copper foil is used for the conductive layers 44 and 45. The length of the connection tape TB is longer than the opposing distance Y of the portion where the protective layer 15 is removed in the detection tape T attached on the floor tile F, and the length of the conductive layers 44 and 45 in the extending direction is the same as the distance Y.

[0045] As can be seen from Fig. 18, it is necessary to ensure electrical connection between the conductive layers 11 and 12 at the exposed ends of the detection tape T with the protective layer 15 removed at the ends and the conductive layers 44 and 45 located on the lower surface of the connection tape TB. However, the length of the connection tape TB is longer than the opposing distance Y of the portion where the protective layer 15 is removed. Therefore, even if the connection tape TB is attached to the portion where the conductive layers 12 and 13 are exposed, there is a possibility that the conductive layers 11 and 12 of the detection tape T and the conductive layers 44 and 45 of the connection tape TB may not be electrically connected.

[0046] Therefore, the connection tape TB has an adjustment layer 46 for height adjustment between the conductive layers 44 and 45 and the adhesive layer 42. Thus, when the connection tape TB is attached to the portion where the conductive layers 12 and 13 are exposed, as shown in FIG. 19, the height of the protective layer 15 on the upper surface of the detection tape T can be made to match the combined thickness of the conductive layers 44 and 45 and the adjustment layer 46, and the conductive layers 11 and 12 and the conductive layers 44 and 45 of the connection tape TB are surely electrically connected.

[0047] When the connection tape TB is attached in this way to the exposed portions of the conductive layers 11 and 12 on the detection tape T, as also shown in FIG. 20, the end portion of the protective layer 41 of the connection tape TB becomes higher than the protective layer 15 on the upper surface of the detection tape T, and a step is formed as shown in the drawing. However, even if such a step occurs, since the detection tape T and the connection tape TB themselves are flat in the first place, and the connection tape TB is attached on the protective layer 15 of the detection tape T by the adhesive layer 42 on the lower surface of the protective layer 41, considering that people usually only walk on the floor tile F, there is no problem caused by such a height step.

[0048] The above-described adjustment layer 46 may also be provided in the connection tape TE dedicated to the terminal portion already described with reference to FIG. 6 and the angled connection tape TC that changes the direction by 90 degrees in plan view described later.

[0049] By the way, depending on the installation location of the monitoring system M, it may be necessary to bend the detection tape T at a right angle in the extending direction of the detection tape T on the floor tile F and arrange the detection tape T. FIG. 20 shows the corresponding situation in such a case. FIG. 21(a) shows a state in which the protective layers 15 at the ends of two detection tapes T1 and T2 arranged to extend in mutually perpendicular directions on the floor tile F are removed by a predetermined length, for example, about 3 cm from the ends. As shown in the drawing, the conductive layers 11 and 12 at the ends of the detection tapes T1 and T2 are exposed. In order to remove the protective layers 15 at the ends of the two detection tapes T1 and T2 by a predetermined length in this way, it may be performed following the method shown in FIGS. 7 to 10 above.

[0050] When electrically connecting the conductive layers 11 and 12 at the so-called corner portion of the detection tape T that is bent at a right angle and arranged in this way, the connection tape TC shown in Fig. 21(b) is used. Fig. 21(b) is a view of the connection tape TC seen from the back side, and Fig. 21(c) is a cross-sectional view of the side surface of the connection tape TC.

[0051] As can be seen from these figures, in the connection tape TC, an adhesive layer 42 is provided on the lower surface of an insulating protective layer 41, and on the lower surface of this adhesive layer 42, two conductive layers 44 and 45 are provided in parallel with a non-adhesive region 43 interposed therebetween in a region narrower than the adhesive layer 42. For example, copper foil is used for the conductive layers 44 and 45. The conductive layers 44 and 45 are provided on an insulating base portion 47 having adhesiveness on the front and back surfaces. And the conductive layers 44 and 45 are in an angular shape that changes the direction by 90 degrees in plan view.

[0052] By attaching the connection tape TC having such a configuration to the corner portion of the detection tape T on the floor tile F where the conductive layers 11 and 12 are exposed, as shown in Fig. 22, the conductive layers 44 and 45 of the connection tape TC and the exposed conductive layers 11 and 12 at the respective ends of the detection tapes T1 and T2 can be electrically connected. Therefore, the workability is extremely good. Since the insulating base portion 47 is located at the corner portion of the lower surface of the connection tape TC, the conductive layers 44 and 45 do not come into direct contact with the floor tile F.

[0053] In the example described above, in addition to the detection tape T that can be wound in a basic roll shape, for example, a connection tape TS that serves as a start tape used for connecting to the controller 20, a connection tape TB used for reconnection, a connection tape TE dedicated to the terminal portion, and a connection tape TC used when changing the direction by 90 degrees in plan view are prepared. Therefore, there is flexibility in installing the monitoring system, and it is possible to construct a suitable monitoring system according to the devices installed in the clean room and their installation status.

[0054] In the above example, a pulse wave was passed through the detection tape T, and the presence or absence of an opening caused by the removal of the floor tile F was detected by comparing the voltage value of the pulse wave measured in the receiving path with a preset threshold value and by the presence or absence of the pulse wave. Instead of this, the impedance of the conductive layers 11 and 12 may be constantly monitored, and when the impedance changes significantly beyond the set threshold value, it may be determined that the floor tile F has been removed and an opening has occurred.

[0055] More specifically, in order to detect an abnormality based on a change in impedance, after setting the detection tape T, for example, the variable resistor of the bridge circuit in the controller 20 is adjusted to be in an equilibrium state according to the impedance of the line so that the bridge circuit is balanced (calibration). When the conductive layers 11 and 12 of the detection tape T are in an open state and the balance of the circuit is disrupted, the abnormality may be detected.

[0056] All of the embodiments disclosed above are illustrative in all respects and not restrictive. The above embodiments may be omitted, substituted, or changed in various forms without departing from the scope and gist of the appended claims.

[0057] Note that the following configurations belong to the technical scope of the present disclosure. Also, configurations in which the matters described in the following (1) to (13) are combined within a non - contradictory range also belong to the technical scope of the present disclosure. (1) A detection tape used in a monitoring system for monitoring the periphery of a substrate processing apparatus installed in a clean room, an insulating base portion having insulating adhesive layers on the front and back surfaces, a conductive layer provided on the surface side of the base portion and arranged along the longitudinal direction of the detection tape, an insulating non - adhesive region arranged along the longitudinal direction of the detection tape in contact with or close to the conductive layer, and an insulating protective layer covering the conductive layer and the non - adhesive region and adhered to the base portion, wherein the detection tape is unwoundable from a wound - up roll state, the detection tape for a monitoring system. (2) The adhesion between the base portion and the protective layer is achieved by an insulating double-sided adhesive member disposed on the lower surface side of the protective layer. The detection tape for a monitoring system according to (1). (3) The adhesion between the front surface side of the base portion and the lower surface side of the protective layer is stronger than the adhesion on the back surface side of the base portion. The detection tape for a monitoring system according to (2). (4) The adhesion width between the base portion and the protective layer is narrower than the width of the conductive layer. The detection tape for a monitoring system according to (1). (5) The adhesion width between the base portion and the protective layer is narrower than the width of the non-adhesive region. The detection tape for a monitoring system according to (1). (6) The width of the conductive layer is the same as or greater than the width of the non-adhesive region. The detection tape for a monitoring system according to (1). (7) The width of the detection tape is 100 mm or less. The detection tape for a monitoring system according to claim 1. (8) Two conductive layers are provided in parallel with each other across the non-adhesive region. The detection tape for a monitoring system according to any one of (1) to (7). (9) A connecting tape for electrically connecting the opposing ends of the detection tape for a monitoring system according to any one of (1) to (7) above, wherein an adhesive layer is provided on the lower surface of an insulating protective layer, a conductive layer is provided in a region narrower than the adhesive layer on the lower surface of the adhesive layer, and an adjustment layer for height adjustment is provided between the conductive layer and the adhesive layer. The connecting tape. (10) A connecting tape for electrically connecting the opposing ends of the detection tape for a monitoring system according to (8) above, wherein an adhesive layer is provided on the lower surface of an insulating protective layer, two conductive layers are provided in parallel with each other across the non-adhesive region in a region narrower than the adhesive layer on the lower surface of the adhesive layer, and an adjustment layer for height adjustment is provided between the conductive layer and the adhesive layer. The connecting tape. (11) A connecting tape for electrically connecting the corner portion of the detection tape for the monitoring system according to any one of (1) to (7) above, an adhesive layer is provided on the lower surface of the insulating protective layer, a conductive layer is provided on the lower surface of the adhesive layer in a region narrower than the adhesive layer, the conductive layer is in an angular shape that changes direction by 90 degrees in plan view, the connecting tape. (12) A connecting tape for electrically connecting the corner portion of the detection tape for the monitoring system according to (8) above, an adhesive layer is provided on the lower surface of the insulating protective layer, two conductive layers are provided in parallel on the lower surface of the adhesive layer in a region narrower than the adhesive layer, the conductive layer is in an angular shape that changes direction by 90 degrees in plan view, the connecting tape. (13) A connecting tape for electrically connecting the conductive layers at the end portion of the detection tape for the monitoring system according to (8) above, an adhesive layer is provided on the lower surface of the insulating protective layer, a conductive layer is provided on the lower surface of the adhesive layer in a region narrower than the adhesive layer, the conductive layer has a conductive portion for connecting the two conductive layers at the end of the detection tape.

Explanation of symbols

[0058] 1 Substrate processing apparatus 10 Base portion 11, 12 Conductive layer 13 Non - adhesive region 14 Double - sided adhesive layer 15 Protective layer 20 Controller F Floor tile T Detection tape TB, TC, TE, TS Connecting tape

Claims

1. A detection tape used in a monitoring system for monitoring the surroundings of a substrate processing apparatus installed in a clean room, an insulating base portion having insulating adhesive layers on both the front and back surfaces, a conductive layer provided on the surface side of the base portion and arranged along the longitudinal direction of the detection tape, an insulating non-adhesive region arranged along the longitudinal direction of the detection tape in contact with or close to the conductive layer, and having an insulating protective layer covering the conductive layer and the non-adhesive region and adhered to the base portion, wherein the detection tape is unwoundable from a wound state in a roll shape, the detection tape for a monitoring system.

2. The adhesion between the base portion and the protective layer is performed by an insulating double-sided adhesive member disposed on the lower surface side of the protective layer, the detection tape for a monitoring system according to Claim 1.

3. The adhesion between the surface side of the base portion and the lower surface side of the protective layer is stronger than the adhesion on the back surface side of the base portion, the detection tape for a monitoring system according to Claim 2.

4. The adhesion width between the base portion and the protective layer is narrower than the width of the conductive layer, the detection tape for a monitoring system according to Claim 1.

5. The adhesion width between the base portion and the protective layer is narrower than the width of the non-adhesive region, the detection tape for a monitoring system according to Claim 1.

6. The width of the conductive layer is the same as or greater than the width of the non-adhesive region, the detection tape for a monitoring system according to Claim 1.

7. The width of the detection tape is 100 mm or less, the detection tape for a monitoring system according to Claim 1.

8. Two conductive layers are provided in parallel with each other with the non-adhesive region therebetween, the detection tape for a monitoring system according to any one of Claims 1 to 7.

9. A connecting tape for electrically connecting opposite ends of the detection tape for a monitoring system according to any one of Claims 1 to 7, wherein an adhesive layer is provided on the lower surface of an insulating protective layer, a conductive layer is provided on the lower surface of the adhesive layer in a region narrower than the adhesive layer, and a connecting tape having an adjustment layer for height adjustment between the conductive layer and the adhesive layer.

10. A connecting tape for electrically connecting opposite ends of the detection tape for a monitoring system according to Claim 8, wherein an adhesive layer is provided on the lower surface of an insulating protective layer, and two conductive layers are provided in parallel with each other with a non-adhesive region therebetween in a region narrower than the adhesive layer on the lower surface of the adhesive layer. A connecting tape having an adjustment layer for height adjustment between the conductive layer and the adhesive layer.

11. A connecting tape for electrically connecting the corner portions of the detection tape for a monitoring system according to any one of Claims 1 to 7, wherein an adhesive layer is provided on the lower surface of the insulating protective layer, wherein a conductive layer is provided in a region narrower than the adhesive layer on the lower surface of the adhesive layer, wherein the conductive layer is in an angular shape that changes direction by 90 degrees in plan view.

12. A connecting tape for electrically connecting the corner portions of the detection tape for a monitoring system according to Claim 8, wherein an adhesive layer is provided on the lower surface of the insulating protective layer, wherein two conductive layers are provided in parallel in a region narrower than the adhesive layer on the lower surface of the adhesive layer, wherein the conductive layer is in an angular shape that changes direction by 90 degrees in plan view.

13. A connecting tape for electrically connecting the conductive layers at the end portions of the detection tape for a monitoring system according to Claim 8, wherein an adhesive layer is provided on the lower surface of the insulating protective layer, wherein a conductive layer is provided in a region narrower than the adhesive layer on the lower surface of the adhesive layer, wherein the conductive layer has a conductive portion for connecting the two conductive layers at the end of the detection tape.

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